Quality control system, program, quality control method, and manufacturing method of semiconductor device

Abstract

To provide a quality control system capable of computing viscosity of a solution of an insulation resin capable of suppressing generation of voids inside the insulation resin, taking a defect shape in a substrate into account.SOLUTION: A quality control system 100 which controls quality of a step of applying a solution of an insulation resin onto a substrate, comprises: a model storage section 103 for storing a determination expression indicating a relation between a defect shape in the substrate and viscosity of the solution of the insulation resin capable of suppressing generation of voids inside the insulation resin; and an applicable viscosity calculation section 102 for computing a viscosity range of the solution of the insulation resin capable of suppressing the generation of the voids on the basis of the defect shape and the determination expression.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a quality control system, a program, a quality control method, and a manufacturing method of a semiconductor device. [Background technology]

[0002] 2. Description of the Related Art Semiconductor devices are used as devices for controlling electric power in various fields, such as electric vehicles, railways, and renewable energy power generation systems.

[0003] One of the causes of failure of a semiconductor device is a discharge failure that occurs from an end of a wiring layer bonded onto an insulating substrate of the semiconductor device.

[0004] As a technique for preventing discharge failures in semiconductor devices, for example, Patent Document 1 describes a technique for suppressing discharge by applying an insulating resin solution to the ends of a wiring layer (electrode) bonded to an insulating substrate and then hardening the solution.

[0005] Furthermore, although it is not a technology for preventing discharge failures in semiconductor devices, the abstract of Patent Document 2, for example, describes a technology relating to a coating film formation method, which includes the following: a method for intermittently forming a coating film, in which application of a coating liquid is temporarily stopped to form an edge of the coating film that is formed with a length X meters (m) that is assumed to be the length of a portion that will become streaky or faded at least in one of two ways; a distance L meters (m) from a discharge port that discharges the coating liquid onto the substrate to the substrate; a speed V meters per second (m / s) at which the coating liquid is discharged from the discharge port; and a viscosity M Pascal seconds (N / m 2 The present invention describes a technique for adjusting at least one of the distance L, the velocity V, the viscosity M, and the surface tension S of the coating liquid based on a predetermined relational expression using the distance L, the velocity V, the viscosity M, and the surface tension S of the coating liquid in Newtons per meter (N / m). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2018-6569 A [Patent Document 2] JP 2015-166060 A Summary of the Invention [Problem to be solved by the invention]

[0007] However, Patent Documents 1 and 2 do not take into consideration the case where defects exist on the surface of the substrate onto which the insulating resin solution is applied.

[0008] The substrate of the semiconductor device has an insulating substrate, a wiring layer, and a brazing material that bonds the insulating substrate and the wiring layer. The substrate of the semiconductor device may have defects on its surface, and in particular, defects caused by cracks are likely to occur on the surface of the brazing material. When a defect exists on the surface of the substrate to which the insulating resin solution is applied, there is a problem that the insulating resin solution does not penetrate into the defect on the surface of the substrate and air remains, depending on the combination of the defect shape and the viscosity of the insulating resin solution, and the remaining air may generate voids (air bubbles) inside the insulating resin. When voids occur inside the insulating resin, the insulation property decreases, and discharge failures may not be prevented. Since discharge failure products are selected in an inspection process, the generation of voids inside the insulating resin may cause a decrease in yield.

[0009] Furthermore, in semiconductor devices, the shape of defects varies from substrate to substrate or from manufacturing lot to manufacturing lot, and therefore there is a problem that the occurrence of voids may not be prevented when the shape of the defects varies by simply adjusting the viscosity of the insulating resin solution in advance.

[0010] The problem that the present invention aims to solve is to provide a quality control system, a program, a quality control method, and a method for manufacturing a semiconductor device that can calculate the viscosity of an insulating resin solution that can suppress the occurrence of voids inside the insulating resin, taking into account the defect shape in a substrate. [Means for solving the problem]

[0011] In order to solve the above-mentioned problems, the quality control system of the present invention is a quality control system that controls the quality of a process of applying an insulating resin solution onto a substrate, and is characterized in having a model storage unit that stores a judgment equation indicating the relationship between a defect shape in the substrate and the viscosity of the insulating resin solution that can suppress the occurrence of voids inside the insulating resin, and a coatable viscosity calculation unit that calculates the viscosity range of the insulating resin solution that can suppress the occurrence of voids based on the defect shape and the judgment equation.

[0012] The program of the present invention is characterized in that it causes a calculation processing system to function as the model storage unit and the applyable viscosity calculation unit of the above-mentioned quality control system.

[0013] In addition, the quality control method of the present invention is a quality control method for controlling the quality of a process of applying an insulating resin solution onto a substrate, and is characterized in that the viscosity range of the insulating resin solution capable of suppressing the occurrence of voids is calculated based on a judgment equation indicating the relationship between a defect shape in the substrate and the viscosity of the insulating resin solution capable of suppressing the occurrence of voids inside the insulating resin, and the defect shape.

[0014] In addition, the manufacturing method of a semiconductor device of the present invention is characterized in that the substrate has an insulating substrate, a wiring layer, and a brazing material that joins the insulating substrate and the wiring layer, and a solution of the insulating resin having a viscosity within the viscosity range calculated by the above-mentioned quality control method is applied onto the substrate. Effect of the Invention

[0015] According to the present invention, the viscosity of an insulating resin solution capable of suppressing the generation of voids inside the insulating resin can be calculated taking into account the shape of defects in a substrate. [Brief description of the drawings]

[0016] [Figure 1] 1 is a schematic diagram showing a cross section of a semiconductor device in Example 1. FIG. [Diagram 2]4 is a schematic diagram showing a state in which voids are generated in the insulating resin of the semiconductor device in Example 1. FIG. [Diagram 3] 4 is a graph illustrating the relationship between the viscosity of an insulating resin solution and the shape of a defect in Example 1. [Figure 4] 1 is a functional block diagram illustrating an example of a configuration of a quality control system according to a first embodiment. [Diagram 5] 2 is an example of a flowchart of a quality control method in the first embodiment. [Figure 6] FIG. 11 is a functional block diagram illustrating an example of the configuration of a quality control system according to a second embodiment. [Figure 7] 13 is an example of a flowchart of a quality control method in Example 2. [Figure 8] FIG. 11 is a functional block diagram illustrating an example of the configuration of a quality control system according to a third embodiment. [Figure 9] 13 is an example of a flowchart of a quality control method in Example 3. [Figure 10] FIG. 13 is a functional block diagram illustrating an example of the configuration of a quality control system according to a fourth embodiment. [Figure 11] 13 is an example of a flowchart of a quality control method in Example 4. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each drawing and each embodiment, the same or similar components are designated by the same reference numerals, and duplicated explanations will be omitted. EXAMPLES

[0018] FIG. 1 is a schematic diagram showing a cross section of a semiconductor device 1 in the first embodiment.

[0019] The semiconductor device 1 is equipped with a semiconductor element 2 such as an IGBT (Insulated Gate Bipolar Transistor) or a diode. The back surface of the semiconductor element 2 is bonded to the front surface of a wiring layer 4 made of, for example, copper, by solder 3. The semiconductor element 2 has a bonding wire 11 connected to its front surface, and is electrically connected to other wiring layers 4 and the like via the bonding wire 11. The back surface of the wiring layer 4 is bonded to the front surface of an insulating substrate 7 made of, for example, ceramic, by a brazing material 6 mainly made of, for example, silver. The back surface of the insulating substrate 7 is bonded to the front surface of a metal layer 9 by a brazing material 8. The back surface of the metal layer 9 is bonded to the front surface of a heat dissipating base plate 12 by solder 10. A case 14 and a lid 16 are bonded and fixed to the heat dissipating base plate 12 by an adhesive 13 so as to cover the semiconductor element 2, the wiring layer 4, the insulating substrate 7, and the metal layer 9. Gaps between the heat dissipating base plate 12, the case 14, and the lid 16, and between the semiconductor element 2, the wiring layer 4, the insulating substrate 7, and the metal layer 9 are filled with soft resin 15 such as silicone gel to insulate the inside of the semiconductor device 1. In addition, at the end of the wiring layer 4 where the electric field is particularly likely to concentrate, insulating resin 5 is disposed to strengthen the insulation. Note that, although an example in which the insulating resin 5 is disposed on the brazing material 6 has been shown here, the present invention is not limited to this, and the insulating resin 5 may be disposed on both the insulating substrate 7 and the brazing material 6. In addition, the insulating resin 5 may be disposed on the wiring layer 4 as well.

[0020] An example of an assembly process for the semiconductor device 1 will be described. Note that the process of manufacturing the substrate, i.e., the bonding of the wiring layer 4 and the metal layer 9 to the insulating substrate 7 with the brazing material 6 and the brazing material 8, is assumed to be performed before the assembly process. The assembly process includes a process of bonding the semiconductor element 2 to the wiring layer 4 with the solder 3, a process of applying an insulating resin 5 to the end of the wiring layer 4 on the substrate, a process of bonding the metal layer 9 of the substrate to which the semiconductor element 2 is bonded, to the heat dissipating base plate 12 with the solder 10, a process of bonding the case 14, a process of filling with the soft resin 15, a process of bonding the lid 16, and the like.

[0021] In the process of applying the insulating resin 5 to the end of the wiring layer 4 on the substrate, a solution of the insulating resin 5 is applied to the end of the wiring layer 4 on the substrate and heated to harden the insulating resin 5. After the semiconductor device 1 is completed, a discharge inspection may be performed before shipping. When a voltage is applied to the semiconductor device 1, the heat dissipating base plate 12 is at ground potential, and an electric field is generated in the direction shown by the arrow in FIG. 1. At this time, for example, if a void 17 exists in the insulating resin 5, partial discharge may occur.

[0022] FIG. 2 is a schematic diagram showing a state in which voids are generated in the insulating resin of the semiconductor device in Example 1. As shown in FIG.

[0023] 2, when defects 20 exist on the surface of the brazing material 6, voids 17 may occur in the insulating resin 5. Note that, although an example is described here in which defects 20 exist on the surface of the brazing material 6 where defects 20 are particularly likely to occur, the principle is the same even when defects 20 exist on the surface of the insulating substrate 7 or the surface of the wiring layer 4.

[0024] The mechanism by which voids occur due to defects 20 will be explained. If the penetration of the insulating resin 5 solution into the defect 20 is insufficient and air 21 remains, this air 21 and the solvent contained in the insulating resin 5 solution may expand during heat curing, causing voids 17 to occur. On the other hand, if the penetration of the insulating resin 5 solution into the defect 20 is sufficient, the air 21 will not remain and voids 17 will not occur. The occurrence of voids 17 is related to the penetration of the insulating resin 5 solution into the defect 20.

[0025] The Lucas-Washburn equation (LW equation) describing the permeability of the solution of insulating resin 5 into defect 20 is shown in equation (1).

[0026]

number

[0027] Here, h is the permeability (penetration depth), R is the capillary radius, γ is the surface tension, θ is the contact angle, η is the viscosity, and t is the penetration time.

[0028] Equation (1) is transformed by moving the variables related to the defect shape to the left side and the rest to the right side, and all variables on the right side except for the viscosity η are set as constants a, as shown in equation (2).

[0029]

number

[0030] Here, the defect shape h 2 For example, / R can be measured using a white light interference microscope, and the viscosity η of the solution can be measured using a rotational viscometer. Equation (2) expresses the defect shape h 2 Indicates / R.

[0031] In Example 1, the diameter of the opening of the defect 20 is R, and the depth of the defect 20 is h. For example, R can be the average value of the minor axis and the major axis when the opening of the defect 20 is approximated as an ellipse, and h can be the distance from the opening of the defect 20 to the deepest point.

[0032] 3 is a graph illustrating the relationship between the viscosity of the insulating resin solution and the defect shape in Example 1. In FIG. 3, the horizontal axis x represents the viscosity η of the insulating resin solution 5, and the vertical axis y represents the defect shape h 2 / R.

[0033] The judgment curve 31 shows the formula (2). The judgment curve 31 is a function of the viscosity η on the horizontal axis, and the defect shape h that allows the solution to penetrate at that viscosity. 2 / R is the maximum value of the inverse proportional curve. 2 In the region where / R>a·1 / η, i.e., the region above the judgment curve 31, the penetration depth at that viscosity does not reach the depth of the defect 20, and a void 17 may occur. 2 In the region where / R≦a·1 / η, that is, the region below the judgment curve 31, the penetration depth at that viscosity exceeds the depth of the defect 20, and the occurrence of the void 17 can be suppressed.

[0034] Using FIG. 3, we experimentally confirmed that formula (2) holds. An example of a method for determining the constant a is explained. In order to determine the value of the constant a, four types of defect shapes h 2 The presence or absence of voids 17 was evaluated for a total of 20 combinations of solutions of insulating resin 5 with 5 different viscosities η and 1 / R. The presence or absence of voids was evaluated based on whether partial discharge occurred when a voltage was applied to the wiring layer 4 and metal layer 9 of the insulating substrate 7. The results of this evaluation are plotted against the viscosity η on the horizontal axis and the defect shape h 2 The constant a in equation (2) that fits the boundary between the presence and absence of voids was determined by curve fitting. The least squares method, for example, can be used for curve fitting.

[0035] FIG. 4 is a functional block diagram of an example of a configuration of the quality control system according to the first embodiment.

[0036] The quality control system 100 of this embodiment controls the quality of a process of applying a solution of insulating resin 5 onto a substrate. Note that, in this embodiment, an example is described assuming that the substrate is a substrate of a semiconductor device having an insulating substrate 7, a wiring layer 4, and a brazing material 6 that bonds the insulating substrate 7 and the wiring layer 4, but the present invention is not limited to this and can be applied to substrates used for purposes other than semiconductor devices.

[0037] The quality control system 100 of this embodiment has, as its functional blocks, a defect shape calculation unit 101, a applyable viscosity calculation unit 102, a model storage unit 103, and an output unit 104. Each functional block of the quality control system 100 can be realized by executing a program on a calculation processing system including, for example, a calculation processing device such as a CPU (Central Processing Unit), a memory, an auxiliary storage device, an input / output interface, etc. In other words, by executing this program on the calculation processing system, it is possible to cause the calculation processing system to function as each functional block of the quality control system 100.

[0038] The defect shape calculation unit 101 calculates the defect shape based on defect information on the substrate. Information on the defect on the substrate, such as the diameter R of the opening of the defect 20 and the depth h of the defect 20, is input to the defect shape calculation unit 101. The defect information on the substrate may include other information such as the position of the defect 20. The defect shape is calculated based on, for example, h 2 / R can be used. The defect shape calculation unit 101 outputs the calculated defect shape. Note that, when the defect shape in the substrate can be directly input to the quality control system 100, the defect shape calculation unit 101 may be omitted. Also, the applyable viscosity calculation unit 102 may also function as the defect shape calculation unit 101.

[0039] The model storage unit 103 stores a judgment formula that indicates the relationship between the defect shape in the substrate and the viscosity η of the solution of the insulating resin 5 that can suppress the generation of voids 17 inside the insulating resin 5. The judgment formula is expressed, for example, by equation (2). The constant a in the judgment formula is obtained in advance by performing an experiment or the like. One or more judgment formulas are stored in advance in the model storage unit 103.

[0040] The applicable viscosity calculation unit 102 calculates the viscosity range of the solution of the insulating resin 5 that can suppress the generation of the voids 17 based on the defect shape and the judgment formula. Specifically, the applicable viscosity calculation unit 102 calculates the viscosity range of the solution of the insulating resin 5 that can suppress the generation of the voids 17 based on the defect shape input from the defect shape calculation unit 101 and the judgment formula read from the model storage unit 103. 2 The range of viscosity η that satisfies the condition that the viscosity η is equal to or less than the judgment curve 31 shown in Fig. 3 when the magnitude of / R is obtained. For example, in Fig. 3, when the size of the defect shape is y1, the range of viscosity that is equal to or less than x1 is the viscosity range that can suppress the occurrence of void 17. The applyable viscosity calculation unit 102 outputs the calculation result of the viscosity range.

[0041] The output unit 104 outputs the calculation result of the viscosity range to at least one of the display device 200 and the manufacturing device 300 that applies the solution of the insulating resin 5 onto the substrate.

[0042] The output unit 104 displays the calculation result of the viscosity range on, for example, the display device 200. For example, the display device 200 displays information such as "Applicable viscosity: x1 (mPa·s) or less" on its screen.

[0043] The manufacturing apparatus 300 can manufacture the semiconductor device 1 while suppressing the occurrence of voids 17 by applying a solution of insulating resin 5 having a viscosity within the viscosity range calculated by the applyable viscosity calculation unit 102 onto the substrate of the semiconductor device 1.

[0044] FIG. 5 is an example of a flowchart of the quality control method in the first embodiment.

[0045] First, defect information of the substrate is obtained (S51). Then, the defect shape calculation unit 101 converts the defect information into a defect shape (S52). Then, the applyable viscosity calculation unit 102 obtains a judgment formula from the model storage unit 103 (S53). Then, the applyable viscosity calculation unit 102 calculates a viscosity range (S54). Then, the output unit 104 outputs the calculation result of the viscosity range to the display device 200 and the manufacturing apparatus 300 (S55).

[0046] According to this embodiment, the viscosity of the solution of insulating resin 5 that can suppress the generation of voids 17 inside insulating resin 5 can be calculated taking into account the shape of defects in the substrate. EXAMPLES

[0047] FIG. 6 is a functional block diagram of an example of a configuration of a quality control system according to the second embodiment.

[0048] Example 2 is an example in which the surface treatment conditions of the substrate are also taken into consideration.

[0049] The model storage unit 103 of this embodiment stores a judgment formula created for each substrate surface processing condition. The substrate surface processing condition is, for example, a plasma cleaning condition for the substrate surface. The plasma cleaning condition is, for example, a plasma output. If the substrate surface processing condition differs, the constant a in the judgment formula differs. Therefore, the constant a is calculated for each substrate surface processing condition, and the substrate surface processing condition and the judgment formula at that time are stored in the model storage unit 103 in association with each other.

[0050] The applyable viscosity calculation unit 102 in this embodiment obtains a corresponding judgment formula from the model storage unit 103 based on the surface treatment conditions of the substrate, and calculates the viscosity range in the same manner as in Example 1 based on the obtained judgment formula and the defect shape.

[0051] Fig. 7 is an example of a flowchart of the quality control method in Example 2. In the flowchart of this example, S52 is changed to S71 and S53 is changed to S73 in the flowchart shown in Fig. 5.

[0052] First, defect information of the substrate and surface treatment conditions of the substrate are obtained (S71). Then, the defect shape calculation unit 101 converts the defect information into a defect shape (S52). Then, the applyable viscosity calculation unit 102 obtains a judgment formula corresponding to the surface treatment conditions from the model storage unit 103 (S73). Then, the applyable viscosity calculation unit 102 calculates a viscosity range (S54). Then, the output unit 104 outputs the calculation result of the viscosity range to the display device 200 and the manufacturing apparatus 300 (S55).

[0053] According to this embodiment, the viscosity of the solution of insulating resin 5 capable of suppressing the generation of voids 17 inside insulating resin 5 can be calculated taking into account the defect shape in the substrate and the surface treatment conditions of the substrate. EXAMPLES

[0054] FIG. 8 is a functional block diagram of an example of a configuration of a quality control system according to the third embodiment. As shown in FIG.

[0055] The third embodiment is an embodiment in which consideration is given to whether the production apparatus 300 is capable of coating at a viscosity calculated from the viscosity range.

[0056] The quality control system 100 of this embodiment has, as functional blocks, a coating-capable equipment determination unit 105 and an equipment information storage unit 106 in addition to the configuration of the first embodiment. The functional blocks added in this embodiment can also be realized by executing a program on a calculation processing system. Note that, although an example in which the functions of this embodiment are added to the first embodiment will be described here, the present invention is not limited to this, and the functions of this embodiment may be added to the second embodiment.

[0057] The equipment information storage unit 106 stores equipment information including information on the applicable viscosity range for each manufacturing equipment 300 that applies the solution of the insulating resin 5 on the substrate. For example, the equipment information can be a table having an equipment name column that describes the name of the available manufacturing equipment 300 and an applicable viscosity range column that describes the applicable viscosity range of the manufacturing equipment 300. The equipment name column describes the equipment name such as equipment A, equipment B, etc., and the applicable viscosity range of equipment A, the applicable viscosity range of equipment B, etc., are described in association with the equipment name column. The number of available manufacturing equipment 300 may be one or more. The equipment information is stored in advance in the equipment information storage unit 106.

[0058] Based on the calculation result of the viscosity range and the equipment information, the coatable equipment determination unit 105 determines whether there is a manufacturing equipment 300 capable of applying a solution of insulating resin 5 in the viscosity range of the calculation result. Specifically, the coatable equipment determination unit 105 obtains the above-mentioned table as equipment information from the equipment information storage unit 106, compares the calculation result of the viscosity range with each coatable viscosity range, and determines whether there is an overlapping range. Here, if there is an overlapping range, it is determined that the manufacturing equipment 300 is coatable. Also, if there is no overlapping range, it is determined that there is no coatable manufacturing equipment 300.

[0059] When there is no coating-capable manufacturing apparatus 300, the coatable-equipment determination unit 105 outputs information instructing removal of the substrate (substrate removal instruction). When there is a coating-capable manufacturing apparatus 300, the coatable-equipment determination unit 105 outputs information identifying the coating-capable manufacturing apparatus 300. For example, the identifying information may be the name of the equipment, such as equipment A. When there are multiple coating-capable manufacturing apparatuses 300, it is desirable to output the names of multiple equipment. Information on the corresponding coatable viscosity range may also be output together.

[0060] The output unit 104 in this embodiment outputs one or more of the calculation results of the viscosity range, information instructing removal of the substrate, and information identifying a manufacturing apparatus 300 capable of application to at least one of the display device 200 and the manufacturing apparatus 300 that applies a solution of insulating resin 5 onto the substrate.

[0061] The output unit 104, for example, causes the display device 200 to display information specifying the manufacturing apparatus 300 capable of coating together with the calculation result of the viscosity range. For example, the display device 200 displays information such as "Coatable viscosity: x1 (mPa s) or less, coatable equipment: equipment A (coatable viscosity range x2A to x3A)" on the screen. In addition, the manufacturing apparatus 300 performs coating using the coating-capable manufacturing apparatus 300.

[0062] Furthermore, the output unit 104, for example, causes the display device 200 to display information instructing the removal of the substrate. At this time, the calculation result of the viscosity range may also be displayed together. For example, the screen of the display device 200 displays information such as "Applicable viscosity: x1 (mPa s) or less, Applicable equipment: None, Please remove the substrate." Furthermore, the manufacturing apparatus 300 removes the substrate.

[0063] Fig. 9 is an example of a flowchart of the quality control method in Example 3. In the flowchart of this example, S55 in the flowchart shown in Fig. 5 is changed to S95 to S98. Here, S95 to S98 will be described.

[0064] After S94, the coatable equipment determination unit 105 acquires equipment information (S95). Thereafter, the coatable equipment determination unit 105 determines whether there is a manufacturing equipment 300 that can coat the viscosity range of the calculation result (S96). If the result of the determination in S96 is yes, the calculation result of the viscosity range and the manufacturing equipment 300 that can coat the material are output to the display device 200 and the manufacturing equipment 300. If the result of the determination in S96 is no, an instruction to remove the substrate is output to the display device 200 and the manufacturing equipment 300 (S98).

[0065] According to this embodiment, the viscosity of the solution of insulating resin 5 capable of suppressing the occurrence of voids 17 inside insulating resin 5 can be calculated taking into account the defect shape in the substrate, and it is possible to determine whether manufacturing equipment 300 is capable of coating with the calculated viscosity within the viscosity range, and if coating is possible, information identifying that manufacturing equipment 300 is output, and if coating is not possible, an instruction to remove the substrate can be output. EXAMPLES

[0066] FIG. 10 is a functional block diagram of an example of a configuration of a quality control system according to the fourth embodiment. As shown in FIG.

[0067] Example 4 is an example in which Example 2 and Example 3 are combined to propose surface treatment conditions in a situation in which a substrate removal instruction is output.

[0068] The quality control system 100 of this embodiment has, as functional blocks, in addition to the configuration of the second embodiment, a coatable equipment determination unit 105 of the third embodiment and an equipment information storage unit 106, and further has a surface treatment condition calculation unit 107. The functional blocks added in this embodiment can also be realized by executing a program on the calculation processing system.

[0069] When information instructing removal of the substrate is output from the coatable equipment determination unit 105, the surface treatment condition calculation unit 107 outputs surface treatment conditions that include a viscosity capable of suppressing the occurrence of voids 17 within the coatable viscosity range of the equipment information, even if the substrate has a defect of this defect shape, based on the defect shape, the equipment information, and a determination equation created for each surface treatment condition of the substrate. Note that if there is no surface treatment condition that satisfies the condition, null can be output to indicate that there is no such condition.

[0070] Specifically, when a substrate removal instruction is input from the coatable equipment determination unit 105, the surface treatment condition calculation unit 107 acquires the defect shape from the defect shape calculation unit 101, acquires a table of equipment information from the equipment information storage unit 106, and acquires a judgment formula created for each substrate surface treatment condition from the model storage unit 103. Here, if the defect shape is not affected by the surface treatment conditions or is barely affected by them, it is possible to propose appropriate surface treatment conditions using the information acquired earlier. Note that even if the actual defect shape changes due to the influence of the surface treatment conditions, it can be handled in the same way as if the defect shape was not affected by the surface treatment conditions if the defect shape before the surface treatment is used.

[0071] As a specific process in the surface treatment condition calculation unit 107, for example, a first viscosity range capable of suppressing the occurrence of the void 17 is calculated by performing a calculation similar to that in the coatable viscosity calculation unit 102 based on the first judgment formula corresponding to the first surface treatment condition and the defect shape, and a judgment similar to that in the coatable equipment judgment unit 105 is performed based on the first viscosity range and the equipment information to judge whether there is a manufacturing equipment 300 capable of coating. If it is judged that there is, the first surface treatment condition is added to the output list, and if it is judged that there is not, the first surface treatment condition is discarded. By performing this process for all judgment formulas, it is possible to find a surface treatment condition in which there is a viscosity capable of suppressing the occurrence of the void 17 within the coatable viscosity range of the equipment information even if the substrate has a defect of this defect shape. If it is judged that there is none, null is output.

[0072] When a substrate removal instruction is output from the coating-available equipment determination unit 105, the output unit 104 of this embodiment outputs the surface treatment conditions output from the surface treatment condition calculation unit 107 to at least one of the display device 200 and the manufacturing equipment 300 that performs the surface treatment of the substrate. In this case, the output unit 104, for example, causes the display device 200 to display a display proposing the surface treatment conditions. For example, the display device 200 displays information such as "Coating-available equipment: None, Please change the surface treatment conditions: Surface treatment condition A, Surface treatment condition B, Surface treatment condition C" on the screen of the display device 200. In addition, the manufacturing equipment 300 changes the surface treatment conditions. When the surface treatment conditions are changed, the quality control system 100 may calculate the viscosity range using the changed surface treatment conditions. The output unit 104 may also output a substrate removal instruction together with the surface treatment conditions.

[0073] In addition, when a substrate removal instruction is output from the coating possible equipment determination unit 105 and the surface treatment conditions output from the surface treatment condition calculation unit 107 are null, that is, when there are no surface treatment conditions that satisfy the conditions, the output unit 104 outputs the substrate removal instruction to at least one of the display device 200 and the manufacturing equipment 300.

[0074] Fig. 11 is an example of a flowchart of the quality control method in Example 4. In Fig. 11, S71, S52, S73, and S54 are the same as Fig. 7 in Example 2. Also, in Fig. 11, S95, S96, S97, and S98 are the same as Fig. 9 in Example 3. In this example, S118 and S119 are added.

[0075] If the result of the determination in S96 is no, the surface treatment condition calculation unit 107 finds surface treatment conditions that satisfy the condition that a viscosity capable of suppressing the occurrence of voids 17 exists within the coatable viscosity range of the equipment information even if the substrate has a defect of this defect shape, and the output unit 104 determines whether such surface treatment conditions exist (S118). If the result of the determination in S118 is yes, the surface treatment conditions are output to the display device 200 and the manufacturing equipment 300 (S119). If the result of the determination in S118 is no, a substrate removal instruction is output to the display device 200 and the manufacturing equipment 300 (S98).

[0076] According to this embodiment, the viscosity of the solution of insulating resin 5 capable of suppressing the occurrence of voids 17 inside the insulating resin 5 can be calculated taking into consideration the defect shape in the substrate and the surface treatment conditions of the substrate, and it is possible to determine whether the manufacturing equipment 300 is capable of coating with the calculated viscosity within the viscosity range, and if coating is possible, information identifying the manufacturing equipment 300 is output, and if coating is not possible, surface treatment conditions that will enable coating or an instruction to remove the substrate can be output.

[0077] The technical idea of ​​the present invention has been described above using the quality control of semiconductor devices as an example, but the present invention is not limited to the above-mentioned embodiment and includes various modified examples. For example, the above-mentioned embodiment has been described in detail to easily explain the present invention, and is not necessarily limited to including all the configurations described. In addition, it is possible to replace a part of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment. In addition, for a part of the configuration of each embodiment, any addition, deletion, or replacement of other configurations can be applied alone or in combination. Furthermore, it goes without saying that the components (including element steps, etc.) are not necessarily essential, except when specifically stated or when it is considered to be clearly essential in principle. In addition, the number of elements (including the number, numerical value, amount, range, etc.) is not limited to a specific number, except when specifically stated or when it is clearly limited to a specific number in principle, and may be more than or less than a specific number.

[0078] In addition, the above-mentioned configurations, functions, processing units, processing means, etc. may be realized in part or in whole by hardware, for example, by designing them as integrated circuits. In addition, the above-mentioned configurations and functions, etc. may be realized in software by a processor interpreting and executing a program that realizes each function. Information such as the program, table, file, etc. that realizes each function can be stored in a memory, a recording device such as a hard disk or SSD (Solid State Drive), or a recording medium such as an IC card, SD card, or DVD.

[0079] In addition, the control lines and information lines shown are those that are considered necessary for the explanation, and not all control lines and information lines in the product are necessarily shown. In reality, it can be considered that almost all components are connected to each other. [Explanation of symbols]

[0080] 1 Semiconductor device 2. Semiconductor elements 3. Solder 4 wiring layers 5. Insulating resin 6 Brazing material 7 Insulating Substrate 8 Brazing material 9 metal layer 10 Solder 11 Bonding wire 12 Heat dissipation base plate 13. Glue 14 cases 15 Soft resin 16 Lid 17. Void 20 Defects 21 Air 31 Judgment curve 100 Quality Control System 101 Defect shape calculation unit 102 Applicable viscosity calculation unit 103 Model Storage Unit 104 Output section 105 Coating Applicable Equipment Judgment Section 106 Facility Information Storage Unit 107 Surface treatment condition calculation section 200 Display device 300 Manufacturing equipment

Claims

1. A quality control system for controlling the quality of a process of applying an insulating resin solution onto a substrate, comprising: a model storage unit that stores a judgment formula that indicates a relationship between a defect shape in the substrate and a viscosity of the insulating resin solution that can suppress the generation of voids inside the insulating resin; and a coatable viscosity calculation unit that calculates a viscosity range of the insulating resin solution that can suppress the occurrence of the voids based on the defect shape and the judgment formula.

2. In claim 1, A quality control system comprising: a defect shape calculation unit that calculates the defect shape based on defect information on the substrate.

3. In claim 1, A quality control system comprising an output section that outputs the calculation results of the viscosity range to at least one of a display device and a manufacturing device that applies the insulating resin solution onto the substrate.

4. In claim 1, the model storage unit stores the judgment formula created for each surface treatment condition of the substrate; The applyable viscosity calculation unit obtains the corresponding judgment formula from the model storage unit based on the surface treatment conditions of the substrate, and calculates the viscosity range based on the obtained judgment formula and the defect shape.

5. In claim 1, an equipment information storage unit that stores equipment information including information on a coatable viscosity range for each manufacturing device that coats the insulating resin solution on the substrate; and a coatable equipment determination unit that determines whether there is a manufacturing equipment capable of coating the insulating resin solution in the viscosity range of the calculation result based on the viscosity range calculation result and the equipment information, and outputs information instructing the removal of the substrate if there is no manufacturing equipment capable of coating.

6. In claim 5, The quality control system is characterized in that the coating-capable equipment determination unit outputs information identifying the coating-capable manufacturing equipment when the coating-capable manufacturing equipment is present.

7. In claim 5, A surface treatment condition calculation unit is provided, the model storage unit stores the judgment formula created for each surface treatment condition of the substrate; the applyable viscosity calculation unit acquires the corresponding judgment formula based on a surface treatment condition of the substrate from the model storage unit, and calculates the viscosity range based on the acquired judgment formula and the defect shape; The quality control system is characterized in that, when information instructing removal of the substrate is output from the coatable equipment determination unit, the surface treatment condition calculation unit outputs the surface treatment conditions under which a viscosity exists within the coatable viscosity range that can suppress the occurrence of the voids even if the substrate has a defect of the defect shape, based on the defect shape, the equipment information, and the determination formula created for each surface treatment condition of the substrate.

8. A program for causing a calculation processing system to function as the model storage unit and the applyable viscosity calculation unit of the quality control system according to claim 1.

9. 1. A quality control method for controlling the quality of a process of applying an insulating resin solution onto a substrate, comprising the steps of: A quality control method comprising: calculating a viscosity range of the insulating resin solution capable of suppressing the occurrence of voids based on a judgment equation indicating the relationship between a defect shape in the substrate and the viscosity of the insulating resin solution capable of suppressing the occurrence of voids inside the insulating resin, and the defect shape.

10. the substrate includes an insulating substrate, a wiring layer, and a brazing material that bonds the insulating substrate and the wiring layer; 10. A method for manufacturing a semiconductor device, comprising the steps of: applying, onto the substrate, a solution of the insulating resin having a viscosity within the viscosity range calculated by the quality control method according to claim 9.

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