Temperature measuring device

Abstract

To enhance measurement accuracy of a device that is disposed on a reference surface covering a heat source to measure a temperature of the heat source.SOLUTION: A temperature measuring device 10 is disposed on a reference surface S covering a heat source H. A first temperature sensor 11 detects a first temperature at a first position P1 that is a first distance from the reference surface S in a first direction D1. A second temperature sensor 12 detects a second temperature at a second position P2 that is a second distance longer than the first distance from the reference surface S in the first direction D1. A temperature identification portion identifies a temperature of the heat source H on the basis of the first temperature and the second temperature. Each of the first temperature sensor 11 and the second temperature sensor 12 includes a plurality of temperature detecting elements that is arrayed in a second direction D2 intersecting with the first direction D1 and is thermally coupled to each other.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to an apparatus for placing on a reference surface over a heat source to measure the temperature of the heat source. [Background technology]

[0002] Patent Document 1 discloses a temperature measuring device that can be worn on the wrist of a subject. The device includes a sensor that detects the subject's body temperature by contacting the subject's body surface, which is an example of a reference surface. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2009-240511 A Summary of the Invention [Problem to be solved by the invention]

[0004] There is a need to improve the measurement accuracy of a device that is placed on a reference surface over a heat source to measure the temperature of the heat source. [Means for solving the problem]

[0005] One example embodiment provided by the present disclosure includes a temperature measurement device disposed on a reference surface over a heat source, the temperature measurement device comprising: a first temperature sensor for detecting a first temperature at a first position a first distance away from the reference surface in a first direction; a second temperature sensor detecting a second temperature at a second position a second distance away from the reference surface in the first direction that is longer than the first distance; a temperature specifying unit that specifies a temperature of the heat source based on the first temperature and the second temperature; Equipped with Each of the first temperature sensor and the second temperature sensor includes a plurality of temperature detection elements arranged and thermally coupled along a second direction intersecting the first direction.

[0006] According to the above-mentioned configuration, since the multiple temperature detection elements arranged along the second direction are thermally coupled to each other, each of the first temperature sensor and the second temperature sensor can function as a pseudo single temperature detection element having a longer temperature-sensitive area in the second direction. Therefore, the requirement for the positioning accuracy of the temperature measurement device in the second direction relative to the heat source can be relaxed. In other words, the decrease in the measurement accuracy of the temperature of the heat source due to the change in the relative position of the temperature measurement device and the heat source in the second direction can be suppressed. As a result, the measurement accuracy of the temperature measurement device that is placed on a reference surface covering the heat source and measures the temperature of the heat source can be improved.

[0007] One example embodiment provided by the present disclosure includes a temperature measurement device disposed on a reference surface over a heat source, the temperature measurement device comprising: a first temperature sensor for detecting a first temperature at a first position a first distance away from the reference surface in a first direction; a second temperature sensor detecting a second temperature at a second position a second distance away from the reference surface in the first direction that is longer than the first distance; a heat insulating layer including a portion disposed between the first temperature sensor and the second temperature sensor in the first direction; a temperature specifying unit that specifies a temperature of the heat source based on the first temperature and the second temperature; It is equipped with:

[0008] According to the above-mentioned configuration, it is possible to suppress mutual influence between the first temperature detected by the first temperature sensor and the second temperature detected by the second temperature sensor due to the first temperature sensor and the second temperature sensor being thermally coupled to each other, thereby improving the measurement accuracy of the temperature measuring device that is disposed on a reference surface covering a heat source and measures the temperature of the heat source based on the first temperature and the second temperature. [Brief description of the drawings]

[0009] [Figure 1] 2 illustrates an example of a functional configuration of a temperature measuring device according to an embodiment. [Diagram 2] 1 illustrates an example of the appearance of a temperature measuring device disposed on a reference surface as viewed from a normal direction of the reference surface. [Diagram 3] 3 illustrates a cross-sectional configuration of a temperature measuring device as viewed in the direction of the arrows along line III-III in FIG. 2. [Figure 4] 4 illustrates an example of a circuit configuration of the first temperature sensor of FIG. 3. [Diagram 5] 4 illustrates another example of the circuit configuration of the first temperature sensor in FIG. 3. [Figure 6] 13 illustrates an external view of a temperature measuring device according to another embodiment. [Figure 7] 13 illustrates a cross-sectional configuration of a temperature measuring device according to another embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The embodiments will be described in detail with reference to the accompanying drawings. In each drawing, the scale is appropriately changed so that each element to be described can be recognized.

[0011] 1 illustrates an example of a functional configuration of a temperature measuring device 10 according to an embodiment. The temperature measuring device 10 includes a first temperature sensor 11 and a second temperature sensor 12.

[0012] Fig. 2 illustrates an external view of the temperature measuring device 10 disposed on a reference plane S covering a heat source H, as viewed from the normal direction of the reference plane S. Fig. 3 illustrates a cross-sectional configuration of the temperature measuring device 10 as viewed from the direction of the arrow along line III-III in Fig. 2.

[0013] The first temperature sensor 11 is configured to detect a first temperature T1 at a first position P1 that is a first distance away in a first direction D1 from a reference plane S. The first temperature sensor 11 includes a plurality of first thermistors 111 (three in this example) arranged along a second direction D2 that intersects with the first direction D1. The first thermistors 111 are an example of a temperature detection element.

[0014] The first temperature sensor 11 includes a first circuit board 112. A plurality of first thermistors 111 are mounted on the first circuit board 112.

[0015] The second temperature sensor 12 is configured to detect a second temperature T2 at a second position P2 that is a second distance longer than the first distance in the first direction D1 from the reference plane S. The second temperature sensor 12 includes a plurality of second thermistors 121 (three in this example) arranged along the second direction D2. The second thermistors 121 are an example of a temperature detection element.

[0016] The second temperature sensor 12 includes a second circuit board 122. A plurality of second thermistors 121 are mounted on the second circuit board 122.

[0017] 4 illustrates an example of a circuit configuration of the first temperature sensor 11. The ground side terminals of the multiple first thermistors 111 are electrically connected to each other by a conductive pattern 112a formed on the first circuit board 112. As a result, the multiple first thermistors 111 are thermally coupled.

[0018] The expression "thermally coupled" used in this specification means a state in which the temperature is uniform among the multiple temperature detection elements arranged along the second direction D2. This state can also be achieved by using a thermally conductive sheet or thermally conductive grease in addition to the conductive pattern 112a. The thermally coupled state can be achieved by forming these elements from a material whose thermal conductivity is not less than 1 [W / m·K]. However, since the thermal resistance of an element involved in heat conduction depends not only on the thermal conductivity but also on the dimensions (thickness and cross-sectional area) of the element, it is not essential to satisfy the thermal conductivity value depending on the dimensions.

[0019] In addition, the power supply side terminals of the multiple first thermistors 111 are electrically connected to each other by the conductive pattern 112b formed on the first circuit board 112. That is, the multiple first thermistors 111 are electrically connected in parallel. In addition, the above-mentioned thermal coupling state is further enhanced.

[0020] Each first thermistor 111 has its own electrical resistance that changes depending on the temperature. By electrically connecting the multiple first thermistors 111 in parallel, the first temperature T1 is reflected in a combined resistance value of the multiple first thermistors 111. The first temperature sensor 11 includes a terminal 114. A voltage value observed at the terminal 114 corresponds to the combined resistance value. A first detection signal corresponding to the combined resistance value is output from the first temperature sensor 11.

[0021] Although not shown in the figure, the second temperature sensor 12 also has the same circuit configuration. Therefore, by electrically connecting the multiple second thermistors 121 in parallel, the second temperature T2 is reflected in the combined resistance value of the multiple second thermistors 121. A second detection signal corresponding to the combined resistance value is output from the second temperature sensor 12.

[0022] 1, the temperature measuring device 10 includes a temperature specifying unit 13. The temperature specifying unit 13 is configured to specify a temperature Ts of the reference surface S and a temperature Th of the heat source H based on a first temperature T1 detected by the first temperature sensor 11 and a second temperature T2 detected by the second temperature sensor 12.

[0023] Specifically, the temperature identifying unit 13 includes an input interface 131. The input interface 131 is configured as a hardware interface that receives the first detection signal S1 output from the first temperature sensor 11 and the second detection signal S2 output from the second temperature sensor 12.

[0024] Each of the first detection signal S1 and the second detection signal S2 may be an analog signal or a digital signal depending on the specifications of the first temperature sensor 11 and the second temperature sensor 12. When each of the first detection signal S1 and the second detection signal S2 is an analog signal, the input interface 131 includes an appropriate conversion circuit including an A / D converter.

[0025] The temperature determination unit 13 includes a processor 132. The processor 132 is configured to determine the temperature Ts of the reference surface S and the temperature Th of the heat source H based on the first detection signal S1 and the second detection signal S2.

[0026] The temperature Ts of the reference surface S is determined based on the first detection signal S1. The combined resistance value of the multiple first thermistors 111 corresponding to the first detection signal S1 is ideally 1 / N of the total resistance value of the N first thermistors 111 (N=3 in this example). The processor 132 calculates the first temperature T1 by multiplying the combined resistance value by N and substituting it into the Steinhart-Hart equation, Beta equation, or the like. The temperature Ts of the reference surface S can be given by the following equation, for example. Ts = T1 … (1)

[0027] The temperature Th of the heat source H is identified based on the first detection signal S1 and the second detection signal S2. The combined resistance value of the multiple second thermistors 121 corresponding to the second detection signal S2 is ideally 1 / N of the total resistance value of the N second thermistors 121 (N=3 in this example). The processor 132 calculates the second temperature T2 by multiplying the combined resistance value by N and substituting it into the Steinhart-Hart equation, the Beta equation, or the like. The temperature Th of the heat source H can be given by the following equation, for example. Th = T1 + β(T1 - T2) … (2) β is a proportionality constant determined by various conditions such as the characteristics of the thermistor and the distance from the reference surface S to the second position P2.

[0028] The temperature specifying unit 13 includes an output interface 133. The processor 132 is configured to output data corresponding to at least the temperature Th from the output interface 133, out of the specified temperature Ts of the reference surface S and the temperature Th of the heat source H. The output interface 133 is configured as a hardware interface capable of outputting the data.

[0029] The data can be displayed by a display device, transmitted by a data transmission device, printed by a printing device, stored in a storage device, etc. The data can be in the form of analog data or digital data depending on the specifications of the output destination device. When the data is in the form of analog data, the output interface 133 includes an appropriate conversion circuit including a D / A converter.

[0030] In the configuration according to this embodiment, the first thermistors 111 arranged along the second direction D2 are thermally coupled, so that the first temperature sensor 11 can function as a pseudo single thermistor having a longer temperature-sensitive area in the second direction D2. Similarly, the second thermistors 121 arranged along the second direction D2 are thermally coupled, so that the second temperature sensor 12 can function as a pseudo single thermistor having a longer temperature-sensitive area in the second direction D2.

[0031] This alleviates the requirement for positioning accuracy in the second direction D2 of the temperature measuring device 10 relative to the heat source H. In other words, it is possible to suppress a decrease in the measurement accuracy of the temperature Th of the heat source H that is caused by a change in the relative position in the second direction D2 between the temperature measuring device 10 and the heat source H. As a result, it is possible to improve the measurement accuracy of the temperature measuring device 10 that is disposed on the reference plane S covering the heat source H and measures the temperature of the heat source H.

[0032] In addition, in this embodiment, since the multiple first thermistors 111 are electrically connected in parallel, if it is assumed that the error of each first thermistor 111 is normally distributed, the standard deviation of the N first thermistors 111 included in the first temperature sensor 11 can be reduced to √N times, rather than N times. Similarly, since the multiple second thermistors 121 are electrically connected in parallel, if it is assumed that the error of each second thermistor 121 is normally distributed, the standard deviation of the N second thermistors 121 included in the second temperature sensor 12 can be reduced to √N times, rather than N times. As a result, the measurement accuracy of the temperature measuring device 10 can be further improved.

[0033] 5, the first thermistors 111 do not necessarily need to be electrically connected in parallel. In this example, the voltage value observed at the terminal 114a corresponds to the resistance value of the first thermistor 111a. Similarly, the voltage value observed at the terminal 114b corresponds to the resistance value of the first thermistor 111b, and the voltage value observed at the terminal 114c corresponds to the resistance value of the first thermistor 111c. A first detection signal S1 corresponding to each resistance value is output from the first temperature sensor 11.

[0034] Although not shown, the second temperature sensor 12 may have the same circuit configuration. Therefore, a second detection signal S2 corresponding to the resistance value of each second thermistor 121 is output from the second temperature sensor 12.

[0035] The processor 132 of the temperature identifying unit 13 identifies a first temperature T1 by calculating an average value of the resistance values ​​of the first thermistors 111 indicated by the first detection signal S1, and identifies a second temperature T2 by calculating an average value of the resistance values ​​of the second thermistors 121 indicated by the second detection signal S2. Based on the first temperature T1 and second temperature T2 identified in this way, the temperature Ts of the reference surface S and the temperature Th of the heat source H can be calculated by the method described above.

[0036] The multiple first thermistors 111 illustrated in FIG. 5 may be replaced with temperature detection ICs. In this case, the terminals 114a to 114c may be terminals that output signals corresponding to temperatures detected individually by the temperature detection ICs. This explanation may be similarly applied to the multiple second thermistors 121. The temperature detection IC is an example of a temperature detection element. In this example, the processor 132 of the temperature identifying unit 13 may identify the first temperature T1 and the second temperature T2 by calculating the average value of the temperatures detected by the temperature detection ICs, and may calculate the temperature Ts of the reference surface S and the temperature Th of the heat source H based on these.

[0037] 2, the heat source H may have an elongated shape in the third direction D3. In this case, the temperature measuring device 10 has a configuration in which it is disposed on the reference plane S such that the second direction D2 intersects with the third direction D3 when viewed from the normal direction of the reference plane S. As a result, as illustrated in FIG 3, the width dimension Ws of each of the first temperature sensor 11 and the second temperature sensor 12 in the second direction D2 is larger than the width dimension Wh of the heat source H in the second direction D2.

[0038] In this case, the aforementioned effect that the requirement for accuracy in positioning the temperature measuring device 10 relative to the heat source H in the second direction D2 can be relaxed becomes more pronounced.

[0039] An example of a heat source H having such a shape is a blood vessel of a living body. In this case, the body surface of the living body can be the reference plane S. For example, the temperature measuring device 10 can be fixed to a person's wrist with a belt or the like so that the second direction D2 intersects with the radial artery or ulnar artery of the wrist. In this case, the temperature Ts identified by the temperature identifying unit 13 corresponds to the body surface temperature at the wrist, and the temperature Th corresponds to the deep body temperature at the wrist. That is, according to the temperature measuring device 10 of this embodiment, it is possible to improve the measurement accuracy of the body surface temperature and deep body temperature of the subject.

[0040] The processor 132 having the above-mentioned functions can be realized by a dedicated integrated circuit such as a microcontroller, an ASIC, an FPGA, etc. A computer program for executing the above-mentioned processes is pre-installed in a storage element included in the dedicated integrated circuit.

[0041] The temperature measuring device 10 may be a part of a device capable of measuring other parameters. For example, the temperature measuring device 10 may be a part of a device capable of acquiring biological parameters of a subject to be subjected to measurement of surface and deep body temperatures. In this case, the processor 132 having the above-mentioned functions may be realized by a general-purpose microprocessor operating in cooperation with a general-purpose memory. Examples of the general-purpose microprocessor include a CPU, an MPU, and a GPU. Examples of the general-purpose memory include a ROM and a RAM. In this case, the ROM may store the above-mentioned computer program. The general-purpose microprocessor specifies at least a part of the program stored on the ROM, expands it on the RAM, and cooperates with the RAM to execute the above-mentioned processing. The computer program may be pre-installed in the general-purpose memory, or may be downloaded from an external server device via a communication network and then installed in the general-purpose memory.

[0042] As illustrated in FIG. 3, the temperature measuring device 10 includes a thermal insulation layer 15. The thermal insulation layer 15 includes a portion located between the first temperature sensor 11 and the second temperature sensor 12 in the first direction D1. The thermal insulation layer 15 is formed of a material that can thermally insulate the first temperature sensor 11 and the second temperature sensor 12. The thermal insulation can be achieved, for example, by a material having a thermal conductivity of less than 1 [W / m·K]. However, since the thermal resistance of the thermal insulation layer 15 depends not only on the thermal conductivity but also on the dimensions (thickness and cross-sectional area), it is not essential to satisfy the thermal conductivity value depending on the dimensions.

[0043] According to this configuration, it is possible to suppress mutual influence between the first temperature T1 detected by the first temperature sensor 11 and the second temperature T2 detected by the second temperature sensor 12 due to the first temperature sensor 11 and the second temperature sensor 12 being thermally coupled to each other. As a result, it is possible to improve the measurement accuracy of the first temperature T1 and the second temperature T2, and it is possible to further improve the measurement accuracy of the temperature Th of the heat source H specified based on the first temperature T1 and the second temperature T2.

[0044] The temperature measuring device 10 includes a first thermally conductive layer 161. The first thermally conductive layer 161 includes a portion disposed between the reference surface S and the first temperature sensor 11 in the first direction D1. The first thermally conductive layer 161 has a lower thermal resistance value than the heat insulating layer 15.

[0045] With this configuration, heat transfer from the reference surface S to the first temperature sensor 11 through the first thermally conductive layer 161 can be promoted, thereby improving the measurement accuracy of the temperature Ts of the reference surface S based on the first temperature T1.

[0046] The temperature measuring device 10 includes a second thermally conductive layer 162. The second thermally conductive layer 162 includes a portion that is disposed at a position farther from the reference plane S than the second temperature sensor 12 in the first direction D1. The second thermally conductive layer 162 has a surface that is in contact with the outside air. The second thermally conductive layer 162 has a lower thermal resistance value than the first thermally conductive layer 161.

[0047] The thermal resistance of each of the heat insulating layer 15, the first thermally conductive layer 161, and the second thermally conductive layer 162 depends on the thermal conductivity of the material forming each layer and the dimensions of each layer. The material and the dimensions can be appropriately determined so that the thermal resistance of each layer as a whole satisfies the above-mentioned relationship. In the example shown in FIG. 3, the dimensions of the second thermally conductive layer 162 are larger than the dimensions of the first thermally conductive layer 161. Therefore, when the first thermally conductive layer 161 and the second thermally conductive layer 162 are formed of materials having the same thermal conductivity, the thermal resistance of the second thermally conductive layer 162 is smaller than the thermal resistance of the first thermally conductive layer 161.

[0048] According to such a configuration, it is possible to promote the exhaust of heat from the second thermally conductive layer 162 to the outside air, and therefore the influence of the accumulated heat on the measurement of the second temperature T2 by the second temperature sensor 12 can be suppressed.

[0049] The temperature measuring device 10 includes a frame 17. The frame 17 is disposed so as to surround the first temperature sensor 11 and the second temperature sensor 12 when viewed in the first direction D1. The frame 17 has a higher thermal resistance than the insulating layer 15.

[0050] With this configuration, the influence of heat transfer to the first temperature sensor 11 and the second temperature sensor 12 along a direction intersecting the first direction D1 on the measurement of the first temperature T1 and the second temperature T2 can be suppressed, thereby further improving the measurement accuracy of the temperature Th of the heat source H based on the first temperature T1 and the second temperature T2.

[0051] The various configurations described above are merely examples for facilitating understanding of the present disclosure. Each configuration example can be appropriately modified or combined with each other within the scope of the spirit of the present disclosure.

[0052] Equation (2) for estimating the temperature Th of the heat source H can be modified as appropriate. For example, the following equation can be obtained by setting β in equation (2) as a linear function of Th, i.e., β=γTh+δ, and rearranging with respect to Th. Th=[T1+δ(T1-T2)] / [1-γ(T1-T2)] …(3)

[0053] The number of the multiple first thermistors 111 included in the first temperature sensor 11 and the number of the multiple second thermistors 121 included in the second temperature sensor 12 may be two, or four or more. The number of the multiple temperature detection elements included in the first temperature sensor 11 and the number of the multiple temperature detection elements included in the second temperature sensor 12 may be different.

[0054] As illustrated in Fig. 6, the second thermistors 121 may be two-dimensionally arranged along not only the second direction D2 but also the third direction D3. When the circuit configuration described with reference to Fig. 4 is adopted, the processor 132 of the temperature identifying unit 13 identifies the second temperature T2 based on the combined resistance value of the first thermistors 121 arranged two-dimensionally. When the circuit configuration described with reference to Fig. 5 is adopted, the processor 132 identifies the second temperature T2 based on the average value of the resistance values ​​of the thermistors or temperature detection ICs arranged two-dimensionally. Although not shown, the first temperature T1 is identified by the first temperature sensor 11 in a similar manner.

[0055] The advantageous configurations of the insulating layer 15, the first thermally conductive layer 161, the second thermally conductive layer 162, and the frame 17 described with reference to Figure 3 are also applicable to a configuration in which the first temperature sensor 11 and the second temperature sensor 12 each include a single temperature detection element as illustrated in Figure 7.

[0056] Each of the configurations listed below also constitutes part of this disclosure. Item 1: A temperature measuring device disposed on a reference surface overlying a heat source, a first temperature sensor for detecting a first temperature at a first position a first distance away from the reference surface in a first direction; a second temperature sensor detecting a second temperature at a second position a second distance away from the reference surface in the first direction that is longer than the first distance; a temperature specifying unit that specifies a temperature of the heat source based on the first temperature and the second temperature; Equipped with Each of the first temperature sensor and the second temperature sensor includes a plurality of temperature detection elements arranged along a second direction intersecting the first direction and thermally coupled to each other. Temperature measuring device. Item 2: The plurality of temperature detection elements are electrically connected in parallel. Item 1. The temperature measuring device according to item 1. Item 3: a thermal insulation layer including a portion located between the first temperature sensor and the second temperature sensor in the first direction, 3. The temperature measuring device according to item 1 or 2. Item 4: a first thermally conductive layer including a portion disposed between the reference surface and the first temperature sensor in the first direction and having a thermal resistance value lower than that of the insulating layer; Item 3. A temperature measuring device according to item 3. Item 5: a second thermally conductive layer including a portion disposed at a position farther from the reference surface than the second temperature sensor in the first direction and having a thermal resistance value lower than that of the first thermally conductive layer; Item 4. A temperature measuring device according to item 4. Item 6: a frame body that is disposed so as to surround the first temperature sensor and the second temperature sensor when viewed from a direction along the first direction and has a thermal resistance value higher than that of the insulating layer; 6. A temperature measuring device according to any one of items 3 to 5. Item 7: The heat source has an elongated shape in a third direction intersecting the first direction and the second direction. 7. A temperature measuring device according to any one of items 1 to 6. Item 8: the reference surface is a body surface of a living body, The heat source is a blood vessel of the living body. Item 7. A temperature measuring device according to item 7. Item 9: A temperature measuring device disposed on a reference surface overlying a heat source, a first temperature sensor for detecting a first temperature at a first position a first distance away from the reference surface in a first direction; a second temperature sensor detecting a second temperature at a second position a second distance away from the reference surface in the first direction that is longer than the first distance; a heat insulating layer including a portion disposed between the first temperature sensor and the second temperature sensor in the first direction; a temperature specifying unit that specifies a temperature of the heat source based on the first temperature and the second temperature; Equipped with Temperature measuring device. Item 10: a first thermally conductive layer including a portion disposed between the reference surface and the first temperature sensor in the first direction and having a thermal resistance value lower than that of the insulating layer; Item 9. The temperature measuring device according to item 9. Item 11: a second thermally conductive layer including a portion disposed at a position farther from the reference surface than the second temperature sensor in the first direction and having a thermal resistance value lower than that of the insulating layer; Item 11. The temperature measuring device according to item 10. Item 12: The second thermally conductive layer has a lower thermal resistance than the first thermally conductive layer. Item 12. The temperature measuring device according to item 11. Item 13: a frame body that is disposed so as to surround the first temperature sensor and the second temperature sensor when viewed from a direction along the first direction and has a thermal resistance value higher than that of the insulating layer; 13. A temperature measuring device according to any one of items 9 to 12. Item 14: the reference surface is a body surface of a living body, The heat source is a blood vessel of the living body. 14. A temperature measuring device according to any one of items 9 to 13. [Explanation of symbols]

[0057] 10: temperature measuring device, 11: first temperature sensor, 111: first thermistor, 12: second temperature sensor, 121: second thermistor, 13: temperature determining portion, 15: heat insulating layer, 161: first thermally conductive layer, 162: second thermally conductive layer, 17: frame, D1: first direction, D2: second direction, D3: third direction, H: heat source, P1: first position, P2: second position, S: reference surface, T1: first temperature, T2: second temperature, Th: temperature of heat source

Claims

1. A temperature measuring device disposed on a reference surface overlying a heat source, a first temperature sensor for detecting a first temperature at a first position a first distance away from the reference surface in a first direction; a second temperature sensor detecting a second temperature at a second position a second distance away from the reference surface in the first direction that is longer than the first distance; a temperature specifying unit that specifies a temperature of the heat source based on the first temperature and the second temperature; Equipped with Each of the first temperature sensor and the second temperature sensor includes a plurality of temperature detection elements arranged along a second direction intersecting the first direction and thermally coupled to each other. Temperature measuring device.

2. The plurality of temperature detection elements are electrically connected in parallel.

2. The temperature measuring device of claim 1.

3. a thermal insulation layer including a portion located between the first temperature sensor and the second temperature sensor in the first direction, 2. The temperature measuring device of claim 1.

4. a first thermally conductive layer including a portion disposed between the reference surface and the first temperature sensor in the first direction and having a thermal resistance value lower than that of the insulating layer; 4. The temperature measuring device according to claim 3.

5. a second thermally conductive layer including a portion disposed at a position farther from the reference surface than the second temperature sensor in the first direction and having a thermal resistance value lower than that of the first thermally conductive layer; 5. The temperature measuring device according to claim 4.

6. a frame body that is disposed so as to surround the first temperature sensor and the second temperature sensor when viewed from a direction along the first direction and has a thermal resistance value higher than that of the insulating layer; 4. The temperature measuring device according to claim 3.

7. The heat source has an elongated shape in a third direction intersecting the first direction and the second direction.

2. The temperature measuring device of claim 1.

8. the reference surface is a body surface of a living body, The heat source is a blood vessel of the living body.

8. The temperature measuring device according to claim 7.

9. A temperature measuring device disposed on a reference surface overlying a heat source, a first temperature sensor for detecting a first temperature at a first position a first distance away from the reference surface in a first direction; a second temperature sensor detecting a second temperature at a second position a second distance away from the reference surface in the first direction that is longer than the first distance; a heat insulating layer including a portion disposed between the first temperature sensor and the second temperature sensor in the first direction; a temperature specifying unit that specifies a temperature of the heat source based on the first temperature and the second temperature; A temperature measuring device comprising:

10. a first thermally conductive layer including a portion disposed between the reference surface and the first temperature sensor in the first direction and having a thermal resistance value lower than that of the insulating layer; 10. The temperature measuring device of claim 9.

11. a second thermally conductive layer including a portion disposed at a position farther from the reference surface than the second temperature sensor in the first direction and having a thermal resistance value lower than that of the insulating layer; 11. The temperature measuring device of claim 10.

12. The second thermally conductive layer has a lower thermal resistance than the first thermally conductive layer.

12. The temperature measuring device of claim 11.

13. a frame body that is disposed so as to surround the first temperature sensor and the second temperature sensor when viewed from a direction along the first direction and has a thermal resistance value higher than that of the insulating layer; 10. The temperature measuring device of claim 9.

14. the reference surface is a body surface of a living body, The heat source is a blood vessel of the living body.

10. The temperature measuring device of claim 9.

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