Delamination method for laminates

Abstract

To provide a delamination method for laminates, which enables efficient separation of each resin from a resin laminate without the need for large-scale equipment.SOLUTION: The present invention provides a delamination method for laminates, which delaminates resin layers from a resin laminate composed of a plurality of stacked resin layers. The method includes the steps of: forming a through-hole in the resin laminate; and immersing the resin laminate with the formed through-hole into a delamination solution.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to a method for peeling off a laminate. [Background technology]

[0002] 2. Description of the Related Art Conventionally, a method has been known in which a laminated film laminated with an adhesive is immersed in a stripping solution to separate each layer (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6777263 Summary of the Invention [Problem to be solved by the invention]

[0004] In the method of isolating the monolayer film from the laminate film, a large-scale facility is required for stirring or ultrasonically vibrating the laminate film when the laminate film is immersed in the peeling solution, and it takes a certain amount of time from immersing the laminate film in the peeling solution until each monolayer film is isolated.

[0005] An object of the present invention is to provide a method for peeling a laminate, which can efficiently separate each resin layer from a resin laminate having a plurality of resin layers stacked therein, without requiring large-scale equipment. [Means for solving the problem]

[0006] A method for peeling a laminate according to one embodiment of the present invention is a method for peeling a resin layer from a resin laminate comprising a plurality of resin layers stacked together, the method comprising the steps of forming a through hole in the resin laminate and immersing the resin laminate with the through hole formed in it in a peeling liquid. Effect of the Invention

[0007] According to one aspect of the present invention, it is possible to efficiently separate each resin layer from a resin laminate in which a plurality of resin layers are laminated, without requiring large-scale equipment. [Brief description of the drawings]

[0008] [Figure 1] FIG. [Diagram 2] 2 is a cross-sectional view taken along line AA in FIG. 1. [Diagram 3] FIG. 2 is a cross-sectional view of FIG. [Figure 4] FIG. 2 is a diagram showing a state in which the resin laminate is immersed in a stripping liquid. [Diagram 5] FIG. 2 is a diagram showing a state in which each resin layer has been peeled off from the resin laminate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] An embodiment of the present invention (hereinafter, referred to as an embodiment) will be described in detail with reference to the drawings. In each drawing, common parts may be given the same reference numerals and explanations may be omitted. In each drawing, the scale of each member may differ from the actual scale.

[0010] The method for peeling a laminate according to the present embodiment is a method for peeling a resin layer from a resin laminate. A resin laminate is a laminate in which a plurality of resin layers are laminated. "Peeling a resin layer" refers to naturally peeling each resin layer from the resin laminate without applying a physical external force to the resin laminate.

[0011] There is no particular limitation on the shape of the resin laminate 100. The shape of the resin laminate 100 may be, for example, a regular shape in a planar view, such as a triangle, a rectangle, a polygon, or a circle, or may be an irregular shape in a planar view.

[0012] The size (area) of the resin laminate 100 is not particularly limited, but is preferably 0.1 cm 2 More than 20cm 2 More preferably, 0.15 cm or less. 2 More than 15cm 2Less than 0.2 cm, more preferably 2 More than 10cm 2 The following is the result.

[0013] The resin constituting each resin layer of the resin laminate may be one type of resin or multiple types of resins.

[0014] In this embodiment, the resin laminate 100 is composed of a first resin layer 10, a second resin layer 30, and a third resin layer 60 (FIGS. 1 and 2).

[0015] There is no particular limitation on the components of the resins constituting the first resin layer 10, the second resin layer 30, and the third resin layer 60. Examples of the resin components include polyethylene (PE), polyethylene terephthalate (PET), polyamide (PA), and the like.

[0016] The first resin layer 10, the second resin layer 30, and the third resin layer 60 may be configured as a composite material in which different types of resins are used for some or all of the resin layers. For example, the first resin layer 10 may be configured as a polyethylene (PE) resin, the second resin layer 30 may be configured as a polyethylene terephthalate (PET) resin, and the third resin layer 60 may be configured as a polyamide (PA) resin.

[0017] The first resin layer 10, the second resin layer 30, and the third resin layer 60 may be mono-material in which the same type of resin is used for all the resin layers. For example, the first resin layer 10, the second resin layer 30, and the third resin layer 60 may all be made of polyethylene (PE) resin.

[0018] Furthermore, when the first resin layer 10, the second resin layer 30, and the third resin layer 60 are all made of the same type of resin, the same type of resin may have different physical properties for each resin layer. For example, the first resin layer 10 may be made of a linear low-density polyethylene (LLDPE) resin, the second resin layer 30 may be made of a medium-density polyethylene (MDPE) resin, and the third resin layer 60 may be made of a high-density polyethylene (HDPE) resin.

[0019] The thickness of each of the first resin layer 10, the second resin layer 30, and the third resin layer 60 is not particularly limited. For example, the thickness of the first resin layer 10 is 60 to 100 μm, preferably 70 to 90 μm, and more preferably 75 to 85 μm. The thickness of the second resin layer 30 is 5 to 45 μm, preferably 15 to 35 μm, and more preferably 20 to 30 μm. The thickness of the third resin layer 60 is 5 to 45 μm, preferably 15 to 35 μm, and more preferably 20 to 30 μm.

[0020] In the resin laminate 100, a first adhesive layer 20 is formed between the first resin layer 10 and the second resin layer 30, and the first resin layer 10 and the second resin layer 30 are bonded via the first adhesive layer 20. In addition, a second adhesive layer 40 is formed between the second resin layer 30 and the third resin layer 60, and the second resin layer 30 and the third resin layer 60 are bonded via the second adhesive layer 40.

[0021] There is no particular limitation on the type of adhesive constituting the first adhesive layer 20 and the second adhesive layer 40. Examples of the types of adhesive include a two-component curing urethane adhesive, a polyester urethane adhesive, a polyether urethane adhesive, an acrylic adhesive, a polyester adhesive, a polyamide adhesive, and an epoxy adhesive. Molten resins such as polyethylene can also be used as the adhesive.

[0022] The mode of forming the adhesive layer is not particularly limited, and the adhesive layer can be formed by, for example, a sandwich lamination method, a dry lamination method, or the like.

[0023] The resin laminate 100 may further include a printed layer, a barrier layer, an anchor coat layer, a functional layer, a surface coat layer, and the like.

[0024] In the resin laminate 100, for example, the printed layer 50 is formed by printing and applying an ink material to the surface of the third resin layer 60 on the second resin layer 30 side. This makes the printed layer visible from the third resin layer 60 side of the resin laminate 100 (FIG. 2). The printed layer can contain one or more types of ordinary ink vehicles as the main component.

[0025] The printing layer may further contain one or more additives, such as a plasticizer, a stabilizer, an antioxidant, a light stabilizer, an ultraviolet absorber, a curing agent, a crosslinking agent, a lubricant, an antistatic agent, a filler, etc. The printing layer may be formed from an ink composition prepared by adding a colorant, such as a dye or pigment, and thoroughly kneading with a solvent, a diluent, etc.

[0026] Furthermore, the ink composition can be used to form desired printed patterns consisting of letters, figures, symbols, designs, etc., by using printing methods such as gravure printing, offset printing, letterpress printing, screen printing, transfer printing, and flexographic printing.

[0027] In addition, the barrier layer (not shown) can be formed, for example, by laminating a metal foil on the surface of the second resin layer 30 facing the third resin layer 60, or by forming the second resin layer 30 into a vapor-deposited film in which a metal or metal oxide is vapor-deposited.

[0028] As the vapor-deposited film, a polyethylene terephthalate film having a vapor-deposited layer of a metal such as aluminum or an inorganic vapor-deposited layer such as alumina or silica, or a polypropylene film having a vapor-deposited layer of a metal such as aluminum or an inorganic vapor-deposited layer such as alumina or silica can be used.

[0029] The metal foil may be an aluminum foil or the like, and the thickness of the foil may be from 5 μm to 20 μm.

[0030] The method for peeling off a laminate according to this embodiment includes a through-hole forming step and an immersion step.

[0031] In the through hole forming step, a through hole H is formed in the resin laminate 100. The manner in which the through hole H is formed is not particularly limited, and for example, the through hole H is formed in the resin laminate 100 by piercing a metal needle in the thickness direction of the resin laminate 100.

[0032] There is no particular limitation on the shape of the through-hole H. The shape of the through-hole H is, for example, a circle, an ellipse, a triangle, a rectangle, a polygon having pentagons or more sides, etc., and is preferably a circle.

[0033] When the through hole H has a circular shape, the diameter of the through hole is preferably 100 μm or more and 500 μm or less, more preferably 110 μm or more and 490 μm or less, and further preferably 120 μm or more and 480 μm or less.

[0034] The density of the through holes H is not particularly limited, but is preferably 1 hole / cm 2 More preferably, 2 particles / cm 2 More preferably, 3 pieces / cm 2 The upper limit of the density of the through holes H is not particularly limited, but the practical upper limit is 300 holes / cm. 2 ≦200 / cm 2 Less than 100 / cm, more preferably 2 The following is the result.

[0035] When three or more through holes H are formed in the resin laminate 100, the arrangement of the through holes H is not particularly limited. For example, 25 through holes H may be arranged at equal intervals (regularly) in the vertical and horizontal directions of the resin laminate 100 (FIG. 1). Also, 25 through holes H may be arranged randomly (irregularly) in the resin laminate 100 (not shown). Note that, from the viewpoint of allowing a stripping solution described below to uniformly penetrate between each layer of the resin laminate 100 through the through holes H, it is preferable to arrange the through holes H regularly.

[0036] In the immersion step, the resin laminate 100 having the through holes H formed therein is immersed in a stripping liquid. The manner in which the resin laminate 100 is immersed in the stripping liquid is not particularly limited. In this embodiment, for example, the resin laminate 100 is immersed in a stripping liquid 80 contained in an immersion bath 70 (FIG. 4).

[0037] The components of the stripping solution are not particularly limited, and examples thereof include an inorganic solvent, an inorganic solution, an organic solvent, an organic solution, a mixture of an inorganic compound and an organic solvent, a mixture of an inorganic compound and an organic solution, a mixture of an inorganic solvent and an organic solvent, a mixture of an inorganic solvent and an organic solution, a mixture of an inorganic solution and an organic solvent, a mixture of an inorganic solution and an organic solution, etc. Among these, a mixture of an inorganic compound and an organic solvent and a mixture of an inorganic compound and an organic solution are preferred.

[0038] The mixture of an inorganic compound and an organic solvent is, for example, a mixture of an alkaline inorganic compound and an alcohol, preferably a mixture of potassium hydroxide and methanol, or a mixture of sodium hydroxide and methanol.

[0039] The mixture of an inorganic compound and an organic solution is, for example, a mixture of an alkaline inorganic compound and an alcohol solution, preferably a mixture of potassium hydroxide, methanol, and N-methyl-2-pyrrolidone (NMP). From the viewpoint of reducing the toxicity of the stripping solution, a stripping solution that does not contain NMP (such as a mixture of potassium hydroxide and methanol, or a mixture of sodium hydroxide and methanol) is preferable.

[0040] The temperature of the stripping solution is not particularly limited, and is, for example, room temperature or higher, preferably 30° C. or higher and 90° C. or lower, and more preferably 40° C. or higher and 80° C. or lower.

[0041] In the immersion step, a physical treatment such as stirring the stripping solution or applying ultrasonic vibration to the stripping solution may be added as desired.

[0042] As described above, the laminate peeling method of this embodiment includes the through hole forming step and the immersion step, and when the resin laminate 100 in which the through hole H is formed is immersed in the stripping liquid 80, the first resin layer 10, the second resin layer 30, and the third resin layer 60 are peeled off from the resin laminate 100 (FIGS. 4 and 5). Therefore, according to the laminate peeling method of this embodiment, each resin can be separated (isolated) from the resin laminate without using large-scale equipment (stirring, ultrasonic vibration, etc.).

[0043] Furthermore, in the laminate peeling method of the present embodiment, since through holes H are formed in the resin laminate 100 immersed in the stripping liquid 80, the stripping liquid 80 can easily penetrate between the resin layers of the resin laminate 100 through the through holes H. This makes it possible to shorten the time from when the resin laminate is immersed in the stripping liquid until the resin layers are peeled off. Therefore, according to the laminate peeling method of the present embodiment, it is possible to efficiently separate (isolate) each resin from the resin laminate.

[0044] Furthermore, in the laminate peeling method of the present embodiment, as described above, the peeling liquid 80 easily penetrates between the resin layers of the resin laminate 100 through the through holes H, so that even if the bonds between the resin layers are strong, each resin layer can be isolated. Therefore, regardless of whether the resin laminate is a composite material or a mono-material, each resin can be separated (isolated) from the resin laminate.

[0045] Furthermore, according to the laminate peeling method of the present embodiment, as described above, each resin can be isolated from the resin laminate 100, making it easy to separate the resins. This makes it possible to reuse each resin constituting the resin laminate 100.

[0046] In the method for peeling off a laminate according to the present embodiment, as described above, the density of the through holes H is 1 hole / cm 2This increases the amount of the stripping liquid 80 that permeates between the resin layers of the resin laminate 100 through the through holes H. This further shortens the time from when the resin laminate is immersed in the stripping liquid until the resin layers are peeled off, allowing each resin to be separated (isolated) from the resin laminate more efficiently.

[0047] In the laminate peeling method of the present embodiment, as described above, by setting the hole diameter of the through hole H to 100 μm or more and 500 μm or less, the stripping liquid 80 can easily enter the through hole H by capillary action. Therefore, the amount of the stripping liquid 80 that permeates between the resin layers of the resin laminate 100 is further increased, and the stripping liquid 80 can more easily permeate between the resin layers of the resin laminate 100. This enables more efficient separation (isolation) of each resin from the resin laminate.

[0048] In the laminate peeling method of the present embodiment, as described above, when the area of ​​the resin laminate 100 is 0.1 cm 2 More than 20cm 2 If the thickness is less than this, the operation of forming through holes in the resin laminate in the through hole forming step becomes easy, the operation of immersing the resin laminate in the stripping solution becomes easy in the immersion step, and further, separation (isolation) of each resin peeled (separated) from the resin laminate in the immersion step becomes easy.

[0049] In the method for peeling off the laminate of this embodiment, as described above, the peeling liquid 80 is a mixed liquid of an alkaline inorganic compound and an alcohol, so that even if layers other than resin, such as an adhesive layer or a metal deposition layer, exist between the resin layers constituting the resin laminate, these layers other than resin are easily dissolved. Therefore, the bond between the resin layers due to adhesion can be easily dissolved, and each resin can be easily separated (isolated) from the resin laminate.

[0050] In addition, since the stripping solution is a mixture of an alkaline inorganic compound and an alcohol, even if a colored layer containing ink or pigment, such as a printed layer, is present between the resin layers that make up the resin laminate, the colored layer is easily dissolved. This makes it possible to remove (deink) the ink or pigment from the attached layer when each resin layer is peeled off from the resin laminate, and therefore each resin can be cleanly (recyclably) separated (isolated) from the resin laminate.

[0051] In the method for peeling off a laminate according to the present embodiment, as described above, the temperature of the stripping solution is 40° C. or more and 80° C. or less, thereby increasing the rate at which layers other than the resin present between the resin layers constituting the resin laminate (adhesive layer, metal deposition layer, colored layer, etc.) are dissolved. This makes it possible to further shorten the time from when the resin laminate is immersed in the stripping solution until each resin layer is peeled off, thereby enabling more efficient separation (isolation) of each resin from the resin laminate.

[0052] In the laminate peeling method of the present embodiment, as described above, each resin can be separated (isolated) from the resin laminate without using stirring, ultrasonic vibration, or the like. However, by adding a physical treatment such as stirring or ultrasonic vibration, it is expected that the time from immersing the resin laminate in the peeling solution to peeling of each resin layer can be further shortened. EXAMPLES

[0053] The present invention will now be described in more detail with reference to examples. The examples and comparative examples were evaluated by the following tests.

[0054] [Resin laminate (test specimen)] Laminate CM (composite material) and laminate MM (three-layer mono-material) were prepared as test specimens. Laminate CM is a three-layer composite material with a 15μm (polyamide (PA) resin layer / printed layer), a 2μm adhesive layer, a 12μm (aluminum vapor deposition layer / polyethylene terephthalate (PET) resin layer), a 2μm adhesive layer, and a 100μm linear low-density polyethylene (LLDPE) resin layer. The adhesive is a hardened urethane. Laminate MM is a three-layer mono-material with a 25μm high-density polyethylene (HDPE) resin layer, a 2μm adhesive layer, a 25μm linear low-density polyethylene (LLDPE) resin layer, a 2μm adhesive layer, and an 80μm linear low-density polyethylene (LLDPE) resin layer. Through holes were formed in both laminate CM and laminate MM.

[0055] [Stripper] Solution 1, Solution 2, and Solution 3 were prepared as stripping solutions for immersing the test specimens. Solution 1 is a mixture of potassium hydroxide (KOH) and methanol (MeOH). Solution 2 is a mixture of sodium hydroxide (NaOH) and methanol (MeOH). Solution 3 is a mixture of potassium hydroxide (KOH), methanol (MeOH), methanol, and N-methyl-2-pyrrolidone (NMP).

[0056] [Immersion test] The resin laminate (test specimen) was immersed in the stripping solution, and it was confirmed whether each resin layer naturally peeled off without using tweezers etc. The peeling was evaluated according to the following criteria. A: Separated into three layers within 120 minutes B: Within 120 minutes, one layer dissolved and two layers separated. C: The layers could not be separated within 120 minutes.

[0057] Examples and comparative examples are listed below.

[0058] [Example 1] Resin laminate (test specimen) size 10mm x 10mm, hole density 25 / cm 2The laminate CM having a pore size of 130 μm was immersed in a stripping solution, Solution 1, at 60° C., and the strippability was evaluated based on the time it took for each resin layer to peel off. The conditions and results of Example 1 are shown in Table 1.

[0059] [Example 2] Pore ​​density 25 / cm 2 9 pieces / cm 2 Except for the above change, the evaluation was performed under the same conditions as in Example 1. The conditions and results of Example 2 are shown in Table 1.

[0060] [Example 3] Pore ​​density 25 / cm 2 5pcs / cm 2 Except for the above change, the evaluation was performed under the same conditions as in Example 1. The conditions and results of Example 3 are shown in Table 1.

[0061] [Example 4] Pore ​​density 25 / cm 2 49 pieces / cm 2 Except for the above change, the evaluation was performed under the same conditions as in Example 1. The conditions and results of Example 4 are shown in Table 1.

[0062] [Example 5] Pore ​​density 25 / cm 2 81 pieces / cm 2 Except for the above change, the evaluation was performed under the same conditions as in Example 1. The conditions and results of Example 5 are shown in Table 1.

[0063] [Example 6] Except for changing the size from 10 mm×10 mm to 30 mm×30 mm, the evaluation was performed under the same conditions as in Example 1. The conditions and results of Example 6 are shown in Table 1.

[0064] [Example 7] The size was changed from 10mm x 10mm to 5mm x 5mm, and the hole density was 25 pcs / cm 2 4 pieces / cm 2 Except for the above change, the evaluation was performed under the same conditions as in Example 1. The conditions and results of Example 7 are shown in Table 1.

[0065] [Example 8] Pore ​​density 25 / cm2 20 pieces / cm 2 Except for changing the above, the evaluation was performed under the same conditions as in Example 7. The conditions and results of Example 8 are shown in Table 1.

[0066] [Example 9] Pore ​​density 25 / cm 2 36 pieces / cm 2 Except for changing the above, the evaluation was performed under the same conditions as in Example 7. The conditions and results of Example 8 are shown in Table 1.

[0067] [Example 10] Except for changing the stripping solution from solution 1 to solution 2, the evaluation was performed under the same conditions as in Example 1. The conditions and results of Example 10 are shown in Table 1.

[0068] [Example 11] Except for changing the size from 10 mm×10 mm to 30 mm×30 mm, the evaluation was performed under the same conditions as in Example 10. The conditions and results of Example 11 are shown in Table 1.

[0069] [Example 12] Except for changing the pore size from 130 μm to 470 μm, the evaluation was performed under the same conditions as in Example 1. The conditions and results of Example 12 are shown in Table 1.

[0070] [Example 13] The evaluation was performed under the same conditions as in Example 1, except that the stripping solution was changed from Solution 1 to Solution 3. The conditions and results of Example 13 are shown in Table 1.

[0071] [Example 14] Except for changing the laminate CM to MM as the resin laminate (test specimen), the evaluation was performed under the same conditions as in Example 1. The conditions and results of Example 14 are shown in Table 2.

[0072] [Example 15] Except for changing the laminate CM to MM as the resin laminate (test specimen), the evaluation was performed under the same conditions as in Example 7. The conditions and results of Example 15 are shown in Table 2.

[0073] [Example 16] Except for changing the laminate CM to the laminate MM as the resin laminate (test specimen), the evaluation was performed under the same conditions as in Example 9. The conditions and results of Example 16 are shown in Table 2.

[0074] [Example 17] Except for changing the stripping solution from solution 1 to solution 2, the evaluation was performed under the same conditions as in Example 15. The conditions and results of Example 17 are shown in Table 2.

[0075] [Comparative Example 1] Except for the fact that no through holes were formed in the resin laminate (test specimen), the evaluation was performed under the same conditions as in Example 1. The conditions and results of Comparative Example 1 are shown in Table 1.

[0076] [Comparative Example 2] Except for not forming through holes in the resin laminate (test specimen), the evaluation was performed under the same conditions as in Example 7. The conditions and results of Comparative Example 2 are shown in Table 1.

[0077] [Comparative Example 3] Except for the fact that no through holes were formed in the resin laminate (test specimen), the evaluation was performed under the same conditions as in Example 14. The conditions and results of Comparative Example 3 are shown in Table 2.

[0078] [Table 1]

[0079] [Table 2]

[0080] From Tables 1 and 2, it can be seen that when a resin laminate (test specimen) having through holes formed therein was immersed in a stripping solution, each resin layer could be separated (isolated) from the resin laminate within 120 minutes in all cases (Examples 1 to 14).

[0081] Furthermore, it was found that even in the case of a mono-material, which tends to be relatively more difficult to peel off than a composite material, each resin layer can be separated (isolated) from the resin laminate in the same manner as in the case of a composite material (Examples 14 to 17).

[0082] On the other hand, when a resin laminate (test specimen) in which no through holes were formed was immersed in the stripping solution, each resin could not be separated (isolated) from the resin laminate even after 120 minutes had passed (Comparative Examples 1 to 3).

[0083] The above disclosed embodiments include, for example, the following aspects. (Appendix 1) A method for peeling a resin layer from a resin laminate having a plurality of resin layers laminated thereon, comprising the steps of: forming a through hole in the resin laminate; and immersing the resin laminate having the through holes formed therein in a stripping liquid. A method for peeling off a laminate. (Appendix 2) The density of the through holes is 1 / cm 2 That's all. A method for peeling off the laminate described in Appendix 1. (Appendix 3) The through hole has a diameter of 100 μm or more and 500 μm or less. A method for peeling off the laminate described in appendix 1 or 2. (Appendix 4) The area of ​​the resin laminate is 0.1 cm 2 More than 20cm 2 Below is the A method for peeling off a laminate according to any one of claims 1 to 3. (Appendix 5) The stripping solution is a mixture of an alkaline inorganic compound and an alcohol. A method for peeling off a laminate described in any one of Appendix 1 to 4. (Appendix 6) The temperature of the stripping solution is 40° C. or higher and 80° C. or lower. 6. A laminate according to any one of claims 1 to 5.

[0084] Although an embodiment of the present invention has been described above, the present invention is not limited to a specific embodiment, and various modifications and changes are possible within the scope of the invention described in the claims. [Explanation of symbols]

[0085] 100 Resin laminate H through hole 10 First resin layer 20 First adhesive layer 30 Second resin layer 40 Second adhesive layer 50 printing layers 60 Third resin layer 70 Immersion bath 80 Stripping solution

Claims

1. A method for peeling a resin layer from a resin laminate having a plurality of resin layers laminated thereon, comprising the steps of: forming a through hole in the resin laminate; and immersing the resin laminate having the through holes formed therein in a stripping liquid. A method for peeling off a laminate.

2. The density of the through holes is 1 / cm ２ That's all. The method for peeling the laminate according to claim 1 .

3. The diameter of the through holes is 100 μm or more and 500 μm or less. The method for peeling the laminate according to claim 1 .

4. The area of ​​the resin laminate is 0.1 cm ２ 20cm or more ２ Below is the The method for peeling the laminate according to claim 1 .

5. The stripping solution is a mixture of an alkaline inorganic compound and an alcohol. The method for peeling the laminate according to claim 1 .

6. The temperature of the stripping solution is 40° C. or higher and 80° C. or lower. The method for peeling off the laminate according to any one of claims 1 to 5.

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