Resin-sealed mold and molding object

Abstract

To provide a resin-sealed mold and a molding object capable of suppressing a surface intended to become an exposed surface from being covered with a flash burr.SOLUTION: A resin-sealed mold for conducting resin-sealing a molding object in a manner to form an exposed surface where a part of a resin of a molding object is not covered and exposed includes a mold cavity formation part for forming a mold cavity where a molding object is arranged and a resin flows into. The mold cavity formation part has a contact surface to be in contact with an exposed surface of a molding object in the mold cavity and the contact surface includes a first region and a second region surrounded by the first region and formed in a manner to have a surface roughness different from that of the first region.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The disclosed embodiments relate to a resin-sealing mold and a molded article. [Background technology]

[0002] Conventionally, there has been known a resin sealing die for sealing a molded article with resin. For example, there has been known a resin sealing die for producing a molded article by sealing a molded article with resin so as to form an exposed surface where a part of the molded article is exposed and not covered with resin.

[0003] In this type of resin-sealing mold, during resin sealing, resin may get into the gap between the surface of the molded product that is to be the exposed surface and the mold, and this resin may adhere to the surface of the molded product that is to be the exposed surface, causing a thin burr to adhere to the surface. Such a burr may be called a flash burr.

[0004] Patent Document 1 discloses a technique for suppressing flash burrs by forming a recess surrounded by a protruding wall on the workpiece and forming a protrusion facing the recess on the workpiece on a resin sealing die. With this technique, resin that has infiltrated between the surface of the workpiece and the die during resin sealing is blocked by the gap formed between the protrusion and the recess, forming the part of the workpiece facing the protrusion on the die as an exposed surface. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2018-56310 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, the technology described in Patent Document 1 requires the formation of a recess in the molded workpiece whose outer periphery is surrounded by a protruding wall, and it is difficult to suppress flash burrs in molded works that do not have protruding walls, for example.

[0007] One aspect of the embodiment has been made in consideration of the above, and aims to provide a resin sealing mold and a molded product that can prevent a surface that is to be an exposed surface from being covered with flash burrs. [Means for solving the problem]

[0008] A resin sealing mold according to one aspect of the embodiment is a resin sealing mold that seals a molded product with resin so as to form an exposed surface where a part of the molded product is exposed and not covered by resin, and has a cavity forming part that forms a cavity in which the molded product is placed and the resin flows in. The cavity forming part has an abutment surface that abuts against the exposed surface of the molded product within the cavity, and the abutment surface has a first region and a second region that is surrounded by the first region and is formed with a surface roughness different from that of the first region. Effect of the Invention

[0009] According to one aspect of the embodiment, it is possible to prevent a surface to be an exposed surface from being covered with flash burrs. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a perspective view showing an example of the configuration of a resin sealing apparatus according to the first embodiment. [Diagram 2] FIG. 2 is a plan view showing an example of the configuration of the workpiece according to the first embodiment. [Diagram 3] FIG. 3 is a cross-sectional view taken along line III-III shown in FIG. [Figure 4] FIG. 4 is a cross-sectional view showing an example of a configuration of a part of a resin sealing die of the resin sealing apparatus according to the first embodiment. [Diagram 5] FIG. 5 is a plan view showing an example of a lower die chest in the resin-sealing mold according to the first embodiment. [Figure 6] FIG. 6 is a perspective view showing an example of a fitting block of a lower die chess in the resin-sealing mold according to the first embodiment. [Figure 7] FIG. 7 is a diagram (part 1) showing an example of a resin sealing process using the resin sealing die according to the first embodiment. [Figure 8] FIG. 8 is a diagram (part 2) showing an example of a resin sealing process using the resin sealing die according to the first embodiment. [Figure 9] FIG. 9 is a diagram (part 3) showing one example of a resin sealing process using the resin sealing die according to the first embodiment. [Figure 10] FIG. 10 is a diagram (part 4) showing an example of a resin sealing process using the resin sealing die according to the first embodiment. [Figure 11] FIG. 11 is a diagram (part 5) showing an example of a resin sealing process using the resin sealing die according to the first embodiment. [Figure 12] FIG. 12 is a plan view showing an example of a molded product produced in a resin sealing step using the resin sealing mold according to the first embodiment. [Figure 13] FIG. 13 is an enlarged view of the region X shown in FIG. [Figure 14] FIG. 14 is a plan view showing another example of the fitting block of the lower die chess in the resin-sealing mold according to the first embodiment. [Figure 15] FIG. 15 is a bottom view showing an example of a molding workpiece according to the second embodiment. [Figure 16] FIG. 16 is a cross-sectional view showing an example of a resin-sealed mold according to the second embodiment. [Figure 17] FIG. 17 is a bottom view showing another example of the bottom surface of the member in the molding workpiece according to the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, embodiments of a resin-sealing die and a molded article disclosed in the present application will be described in detail with reference to the accompanying drawings. Note that the present invention is not limited to the embodiments described below.

[0012] <1. First embodiment> <1.1. Structure of resin-sealed mold> 1, the resin sealing apparatus 100 according to the first embodiment includes a resin sealing mold 1, a plurality of dies 4, a fixed platen 5, a movable platen 6, and a transfer unit 7. In order to facilitate understanding of the positional relationship, each axis of an XYZ coordinate system including an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other is shown in several drawings including FIG. 1, and the Z-axis is the up-down direction.

[0013] The multiple divers 4 extend parallel to each other in the vertical direction and are supported on a base (not shown). The fixed platen 5 is fixed to the upper end of each diver 4, and the movable platen 6 is attached to each diver 4 so as to be movable in the vertical direction (Z-axis direction).

[0014] The resin sealing mold 1 includes an upper mold 2 and a lower mold 3. The upper mold 2 is attached to a fixed platen 5, and the lower mold 3 is attached to a movable platen 6. The movable platen 6 is driven by a driving mechanism (not shown) to move in the vertical direction. The upper mold 2 includes an upper chess piece 10 and an upper die set 20 that supports the upper chess piece 10. The lower mold 3 includes a lower chess piece 30 and a lower die set 40 that supports the lower chess piece 30.

[0015] In the resin sealing apparatus 100, the movable platen 6 moves upward, causing the lower mold 3 to come into contact with the upper mold 2, and clamping the upper mold 2 and the lower mold 3. In the example shown in Fig. 1, the resin sealing apparatus 100 is configured so that the lower mold 3 moves upward (positive direction of the Z axis), but it may also be configured so that the upper mold 2 moves downward (negative direction of the Z axis), or so that the lower mold 3 moves upward and the upper mold 2 moves downward.

[0016] In the resin sealing apparatus 100, an upper mold 2 and a lower mold 3 come into contact with each other and are clamped together to form a cull, a runner, and a cavity 50 (see FIG. 8) in the space between the upper mold 2 and the lower mold 3, and the molded product 60 is resin sealed within the cavity 50 (see FIG. 8).

[0017] 2 and 3, the molding target 60 includes a plurality of members 61 to 66. The member 61 is, for example, a die pad, the members 62 and 63 are, for example, leads, the members 64 and 65 are, for example, electronic components (for example, semiconductor chips), and the member 66 is, for example, a bonding wire.

[0018] The members 61, 62, 63, etc. are formed by a lead frame, but are not limited to this example. Furthermore, the members 61 to 66, etc. in the molding work 60 are not limited to the above-mentioned example, and the configuration of the molding work 60 is also not limited to the above-mentioned example.

[0019] The resin sealing die 1 of the resin sealing apparatus 100 performs resin sealing on the molded product 60 so as to form an exposed surface where a part of the molded product 60 is not covered with resin and is exposed, thereby producing a molded product, which will be described later. In the molded product 60 shown in Fig. 3, an exposed surface, which will be described later, is formed on a bottom surface 611 of a member 61 during resin sealing by the resin sealing die 1. The bottom surface 611 of the member 61 is a flat surface, but is not limited to such an example.

[0020] 1 is configured to resin-seal one molded article 60, but is not limited to this example and may be configured to resin-seal a plurality of molded articles 60 at the same time. Below, the configuration of the resin sealing die 1 of the resin sealing apparatus 100 and each of the resin sealing steps for resin-sealing the molded article 60 with the resin sealing die 1 of the resin sealing apparatus 100 will be described in detail in order.

[0021] <1.2. Configuration of resin sealing mold 1> 4, in the resin sealing mold 1 of the resin sealing apparatus 100, before clamping, an upper mold 2 including an upper die chest 10 and a lower mold 3 including a lower die chest 30 are positioned apart from each other in the mold clamping direction (Z-axis direction). In the resin sealing process of the molded product 60, the lower mold 3 is moved in a direction toward the upper mold 2 (positive direction of the Z-axis) and comes into contact with the upper mold 2 for mold clamping.

[0022] The upper die chess 10 includes a cavity forming portion 11 that forms a cavity 50 (see FIG. 8), a runner forming portion (not shown) that forms a runner (not shown), and a cull forming portion (not shown) that forms a cull (not shown). Each of the cavity 50 (see FIG. 8), the cull (not shown), and the runner (not shown) is a space that is formed by clamping the upper die 2 and the lower die 3 together.

[0023] The lower die chess 30 includes a cavity forming portion 31 that forms a cavity 50 (see FIG. 8), a runner forming portion (not shown) that forms a runner (not shown), and a cull forming portion (not shown) that forms a cull (not shown).

[0024] 4 and 5, the lower die chess set 30 includes a main body block 32 and a fitting block 33. The main body block 32 includes a cavity forming portion 311, a runner forming portion (not shown) that forms a runner (not shown), a cull forming portion (not shown) that forms a cull (not shown), etc. The fitting block 33 includes a cavity forming portion 312.

[0025] An insertion hole 321 is formed in the main body block 32, and the insertion block 33 is inserted into the insertion hole 321. In Fig. 4, the insertion block 33 is inserted into the insertion hole 321 of the main body block 32, and the cavity forming portion 311 and the cavity forming portion 312 form the cavity forming portion 31.

[0026] 6, the cavity forming portion 312 of the fitting block 33 has a first region 3121 and a second region 3122 surrounded by the first region 3121 and formed with a surface roughness different from that of the first region 3121. The cavity forming portion 312 is an example of a contact surface that contacts the bottom surface 611 of the member 61 in the molded product 60. The cavity forming portion 312 shown in FIG. 6 is a flat surface, but is not limited to such an example and may be any surface that contacts the bottom surface 611 of the member 61 over its entirety, for example.

[0027] The second region 3122 is a polygonal or circular region, and the first region 3121 is an annular region surrounding the second region 3122, but is not limited to such an example. The surface roughness of the first region 3121 is coarser than the surface roughness of the second region 3122, but may be finer than the surface roughness of the second region 3122.

[0028] <1.3. Resin sealing process by resin sealing apparatus 100> When the resin sealing mold 1 is in the state shown in Fig. 7, a transfer device (not shown) places a molded article 60 between the upper mold 2 and the lower mold 3. In the example shown in Fig. 7, the molded article 60 is between the upper mold 2 and the lower mold 3, and is placed on the lower mold chest 30 of the lower mold 3.

[0029] Thereafter, the movable platen 6 (see FIG. 1) moves upward (positive direction of the Z axis), which causes the lower die 3 to move upward (positive direction of the Z axis) toward the upper die 2. When the lower die 3 moves upward (positive direction of the Z axis), the upper die 2 and the lower die 3 are clamped together, and the molded product 60 is sandwiched between the upper die chest 10 of the upper die 2 and the lower die chest 30 of the lower die 3, as shown in FIG.

[0030] A cavity 50 is formed by clamping the upper mold 2 and the lower mold 3 together, and a molded article 60 is placed in the cavity 50. At this time, a bottom surface 611 of a member 61 in the molded article 60 (FIG. 3) comes into contact with a cavity forming portion 312 of the fitting block 33.

[0031] Thereafter, the resin tablet put into the pot 8 (see FIG. 1) melts, and as shown in FIG. 9, the molten resin 9 fills the cavity 50 via a cull and a runner (not shown).

[0032] Thereafter, in the resin sealing apparatus 100, the movable platen 6 (see FIG. 1) moves downward (Z-axis negative direction), thereby moving the lower mold 3 downward (Z-axis negative direction), as shown in FIG. 10. This releases the clamping between the upper mold 2 and the lower mold 3. Then, as shown in FIG. 11, the molded product 70 is removed from the resin sealing mold 1 by a conveying device (not shown).

[0033] <1.4. Molded product 70> As shown in FIGS. 12 and 13, a molded product 70 produced by the resin sealing apparatus 100 has an exposed surface 71 that is not covered with the resin 9 and is exposed.

[0034] As described above, in the resin sealing process of the resin sealing apparatus 100, the bottom surface 611 of the member 61 in the molded product 60 (FIG. 3) comes into contact over its entirety with the cavity forming portion 312 of the fitting block 33. As described above, the cavity forming portion 312 has a first region 3121 and a second region 3122 surrounded by the first region 3121 and formed with a surface roughness different from that of the first region 3121.

[0035] In the resin sealing process of the resin sealing apparatus 100, the resin 9 penetrates between the bottom surface 611 of the member 61 and the cavity forming portion 312. If the surface roughness of the cavity forming portion 312 is constant, the resin 9 penetrates deeply between the bottom surface 611 of the member 61 and the cavity forming portion 312, and there is a risk that the resin 9 will adhere to the bottom surface 611 of the member 61 as flash burrs over a wide area.

[0036] On the other hand, as described above, the cavity forming portion 312 in the resin sealing mold 1 according to the first embodiment has the first region 3121 and the second region 3122 which have different surface roughnesses. Due to the difference in surface roughness between the first region 3121 and the second region 3122, the movement of the resin 9 that has entered between the bottom surface 611 of the member 61 and the cavity forming portion 312 from above the first region 3121 to above the second region 3122 is suppressed as shown in FIG. 13, compared to the case where the surface roughness of the first region 3121 and the second region 3122 are the same.

[0037] 12 and 13, the bottom surface 611 of the member 61 of the molded product 60 is divided into a first region 6111 abutting on the first region 3121 and a second region 6112 abutting on the second region 3122. Due to the difference in surface roughness between the first region 3121 and the second region 3122, the movement of the resin 9 that has entered between the bottom surface 611 of the member 61 and the cavity forming portion 312 from above the first region 6111 to above the second region 6112 is suppressed, compared to the case where the surface roughness of the first region 3121 and the second region 3122 are the same.

[0038] Therefore, although a small amount of resin 9 may penetrate onto the second region 6112 and form flash burrs 91 from above the first region 6111 to a portion of the second region 6112, most of the second region 6112 is not covered with flash burrs 91 and is formed as an exposed surface 71.

[0039] Moreover, since the first region 3121 is formed in an annular shape, it is possible to appropriately suppress the intrusion of the resin 9 onto the second region 3122. Moreover, even if the surface roughness of the first region 3121 is coarser than that of the second region 3122, but is finer than that of the second region 3122, the movement of the resin 9 that has infiltrated between the bottom surface 611 of the member 61 and the cavity forming portion 312 from above the first region 3121 to above the second region 3122 is suppressed.

[0040] In the above example, the cavity forming portion 312 of the fitting block 33 has two types of regions with different surface roughnesses, but may have three or more types of regions with different surface roughnesses. For example, as shown in Fig. 14, the cavity forming portion 312 may have a third region 3123 surrounded by a first region 3121 in a region facing the bottom surface 611 of the member 61 and formed with a surface roughness different from that of the first region 3121.

[0041] This further suppresses the movement of the resin 9 that has entered between the bottom surface 611 of the member 61 and the cavity forming portion 312 from above the third region 3123 to above the first region 3121. The third region 3123 has a surface roughness different from that of the first region 3121, and for example, has the same surface roughness as that of the second region 3122, but is not limited to such an example.

[0042] Also, in the above-mentioned example, by dividing the lower die chess 30 into the main body block 32 and the fitting block 33, the fitting block 33 can be easily replaced. Therefore, in the resin sealing mold 1 according to the first embodiment, even if the workpiece 60, the material of the resin 9, or the pressure for filling the resin 9 is different, it is possible to prevent the surface intended as the exposed surface 71 from being covered with flash burrs 91 simply by replacing each of the multiple regions including the first region 3121 and the second region 3122 with the fitting block 33 having an appropriate surface roughness.

[0043] In addition, the lower die chest 30 of the resin-sealed mold 1 in the first embodiment is configured to have a main body block 32 and an insert block 33, but the main body block 32 and the insert block 33 may be configured as an integrated unit without being separated.

[0044] In the above-mentioned example, the bottom surface 611 of the member 61 of the workpiece 60 does not face the cavity forming portion 311 of the main body block 32, but the present invention is not limited to such an example. For example, the area of ​​the cavity forming portion 312 of the fitting block 33 may be reduced, and the lower die chess 30 may be formed so that the peripheral region (e.g., the first region 3121) of the bottom surface 611 of the member 61 faces the cavity forming portion 311 of the main body block 32.

[0045] Then, by making the surface roughness of at least a part of the cavity forming portion 311 (for example, the region facing the bottom surface 611 of the member 61) different from that of the cavity forming portion 312, it is possible to prevent the surface to be the exposed surface 71 from being covered by the flash burrs 91. In this case, the cavity forming portions 311, 312 are an example of abutment surfaces that abut against the bottom surface 611 of the member 61 of the workpiece 60. Note that at least one of the cavity forming portion 311 and the cavity forming portion 312 may have an area with a different surface roughness.

[0046] Furthermore, by making the surface roughness of the second region 3122 finer than that of the first region 3121, the occurrence of scratches on the exposed surface 71 can be suppressed, and sintering of the exposed surface 71 of the molded product 70 can be performed more appropriately.

[0047] <2. Second embodiment> While the surface roughness of the bottom surface 611 of the member 61 in the molding workpiece 60 shown in Fig. 3 is uniform, the bottom surface 611A of the member 61A in the molding workpiece 60A according to the second embodiment has a first region 6111A and a second region 6112A having different surface roughnesses as shown in Fig. 15. The second region 6112A is surrounded by the first region 6111A and is formed with a surface roughness different from that of the first region 6111A.

[0048] The second region 6112A is a polygonal or circular region, and the first region 6111A is an annular region surrounding the second region 6112A, but is not limited to such an example. Also, the surface roughness of the first region 6111A is coarser than that of the second region 6112A, but may be finer than that of the second region 6112A.

[0049] 16, the resin sealing die 1A of the resin sealing apparatus 100A according to the second embodiment is different from the resin sealing die 1 of the resin sealing apparatus 100 in that it has a lower die chess 30A instead of the lower die chess 30. The lower die chess 30A is different from the lower die chess 30 in that it has a cavity forming portion 31A having an abutment surface that abuts against the bottom surface 611A of the member 61A and has a uniform surface roughness.

[0050] When the molded product 60A is resin-sealed by the resin sealing process using the resin sealing apparatus 100A, the difference in surface roughness between the first region 6111A and the second region 6112A suppresses the movement of the resin 9 that has penetrated between the bottom surface 611A of the member 61A and the cavity forming portion 31A from the first region 6111A to the second region 6112A.

[0051] Therefore, although a small amount of resin 9 may penetrate onto the second region 6112A and cause flash burrs from the first region 6111A to a portion of the second region 6112A, most of the second region 6112A is not covered with flash burrs and is formed as the exposed surface 71A.

[0052] Moreover, since the first region 6111A is formed in an annular shape, it is possible to appropriately suppress the intrusion of the resin 9 onto the second region 6112A. Moreover, even if the surface roughness of the first region 6111A is coarser than that of the second region 6112A, but is finer than that of the second region 6112A, the movement of the resin 9 that has infiltrated between the bottom surface 611A of the member 61A and the cavity forming portion 31A from above the first region 6111A to above the second region 6112A is suppressed.

[0053] In the above example, the bottom surface 611A of the member 61A has two types of regions with different surface roughnesses, but may have three or more types of regions with different surface roughnesses. For example, the bottom surface 611A of the member 61A may have a third region 6113A surrounding the first region 6111A in a region facing the cavity forming portion 31A, as shown in FIG.

[0054] This further suppresses the movement of the resin 9 that has entered between the bottom surface 611A of the member 61A and the cavity forming portion 31A from the third region 6113A to the first region 6111A. The third region 6113A and the first region 6111A have a surface roughness different from each other, and for example, has the same surface roughness as the second region 6112A, but is not limited to such an example.

[0055] Furthermore, by making the surface roughness of the first region 6111A and the surface roughness of the second region 6112A different, most of the bottom surface 611A of the member 61A is formed as the exposed surface 71A without being covered with flash burrs, so that the abutment surface of the cavity forming portion 31A can be given a uniform and fine surface roughness, which prevents scratches and the like from occurring on the exposed surface 71A and allows sintering of the exposed surface 71A of the molded product 70 to be performed more appropriately.

[0056] In the second embodiment, the lower chess piece 30 may be used instead of the lower chess piece 30A. In this case, the first region 6111A abuts against the first region 3121 (see FIG. 6), and the second region 6112A abuts against the second region 3122 (see FIG. 6), but is not limited to such an example.

[0057] As described above, the resin-sealing mold 1 according to the first embodiment is a resin-sealing mold that seals the workpiece 60 with resin so as to form an exposed surface 71 in which a part of the workpiece 60 is exposed without being covered with the resin 9, and has a cavity-forming portion 31 that forms a cavity 50 in which the workpiece 60 is placed and into which the resin flows. The cavity-forming portion 31 has an abutment surface that abuts against the exposed surface 71 of the workpiece 60 in the cavity 50. The cavity-forming portion 312 is an example of an abutment surface. The abutment surface has a first region 3121 and a second region 3122 that is surrounded by the first region 3121 and has a surface roughness different from that of the first region 3121. This makes it possible for the resin-sealing mold 1 to prevent the surface to be the exposed surface 71 from being covered with flash burrs 91.

[0058] Moreover, the surface roughness of the first region 3121 is rougher than that of the second region 3122. This makes it possible for the resin sealing mold 1 to prevent the surface to be the exposed surface from being covered with flash burrs 91. Furthermore, by making the surface roughness of the second region 3122 finer than that of the first region 3121, it is possible to prevent scratches and the like from occurring on the exposed surface 71, and sintering of the exposed surface 71 of the molded product 70 can be more appropriately performed.

[0059] Moreover, the second region 3122 is a polygonal or circular region, and the first region 3121 is an annular region surrounding the second region 3122. This allows the resin sealing mold 1 to appropriately suppress the intrusion of the resin 9 into the second region 3122.

[0060] In addition, the contact surface has a third region 3123 which surrounds the first region 3121 and is formed with a surface roughness different from that of the first region 3121. This makes it possible for the resin-sealing mold 1 to further suppress the intrusion of the resin 9 into the second region 3122.

[0061] Moreover, the molded product 60A according to the second embodiment is a molded product that is resin-sealed by the resin-sealing mold 1A so as to form an exposed surface 71A that is partially exposed and not covered by the resin 9, and has a second region 6112A that is surrounded by a first region 6111A that becomes the exposed surface 71A and that is formed with a surface roughness different from that of the first region 6111A. This makes it possible to prevent the surface of the molded product 60A that is to become the exposed surface 71A from being covered with flash burrs.

[0062] Moreover, the second region 6112A is a polygonal or circular region, and the first region 6111A is an annular region surrounding the second region 6112A. This allows the workpiece 60A to appropriately suppress the intrusion of the resin 9 onto the second region 6112A.

[0063] Furthermore, molding workpiece 60A has third region 6113A surrounding first region 6111A and formed with a surface roughness different from that of first region 6111A. This makes it possible for molding workpiece 60A to further suppress intrusion of resin 9 onto second region 6112A.

[0064] Further advantages and modifications may readily occur to those skilled in the art. Thus, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and equivalents thereof. [Explanation of symbols]

[0065] 1,1A resin sealing mold 2 Upper mold 3 Lower mold 9. Resin 11, 31, 31A, 311, 312 Cavity forming part 50 Cavity 60,60A Molded product 70 Molded products 71,71A Exposed surface 100,100A resin sealing machine 611,611A Bottom 3121,6111,6111A First Area 3122,6112,6112A Second Area 3123,6113A Third Region

Claims

1. A resin sealing die for sealing a molded product with resin so as to form an exposed surface where a part of the molded product is exposed without being covered with resin, a cavity forming portion that forms a cavity into which the molded product is placed and into which the resin flows; The cavity forming portion is a contact surface that contacts the exposed surface of the workpiece in the cavity; The contact surface is A first region; and a second region surrounded by the first region and formed with a surface roughness different from that of the first region; A resin-sealing mold comprising:

2. The surface roughness of the first region is The surface roughness of the second region is greater than that of the first region.

2. The resin sealing mold according to claim 1.

3. The second region is A polygonal or circular area, The first region includes: An annular region surrounding the second region.

3. The resin sealing mold according to claim 2.

4. The contact surface is a third region surrounding the first region and formed with a surface roughness different from that of the first region; 4. The resin-sealing mold according to claim 1, wherein the resin-sealing mold is a mold for sealing a semiconductor device.

5. A molded product to be resin-sealed by a resin-sealing die so as to form an exposed surface that is not covered with resin, The second region is surrounded by a first region that is the exposed surface and has a surface roughness different from that of the first region. The molded article is characterized by the above.

6. The second region is A polygonal or circular area, The first region includes: An annular region surrounding the second region.

6. The molded article according to claim 5.

7. a third region surrounding the first region and formed with a surface roughness different from that of the first region; 7. The molded article according to claim 5 or 6.

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