Manufacturing method of structure and manufacturing method of electronic component device

Abstract

To provide a method for manufacturing a structure in which warping of a support member caused by volumetric shrinkage of a thermosetting resin is suppressed, and a method for manufacturing an electronic component device.SOLUTION: A method for manufacturing a structure having a support member and a cured product of a thermosetting resin composition disposed on one surface of the support member, includes disposing a thermosetting resin composition on each of both surfaces of the support member, curing the thermosetting resin composition, and removing the cured product of the thermosetting resin composition disposed on one surface of the support member.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present disclosure relates to a method for manufacturing a structure and a method for manufacturing an electronic component device. [Background technology]

[0002] As a manufacturing technique for electronic component devices, a technique called wafer level packaging has been attracting attention in recent years (see, for example, Patent Document 1). In wafer level packaging, packaging is performed in the wafer state and then the wafer is cut, rather than packaging the wafer after cutting the wafer into the size of individual electronic component devices. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-17717 A Summary of the Invention [Problem to be solved by the invention]

[0004] In a manufacturing method of an electronic component device, electronic components arranged on a support member such as a silicon substrate are generally sealed with a sealing material containing a thermosetting resin. Specifically, the thermosetting resin contained in the sealing material is heated and cured to form a sealing portion around the electronic components arranged on the support member. At this time, the volume of the sealing portion made of the cured product of the sealing material shrinks compared to the sealing material before heating due to the curing reaction of the thermosetting resin and cooling from the heated state. Such volumetric shrinkage of the sealing material may cause warping of the support member. The larger the area of ​​the support member is during the sealing process, such as in wafer level packaging, the more likely it is that the support member will warp due to the volumetric shrinkage of the sealing portion. If the support member is warped, there is a risk that the accuracy of subsequent processes, such as cutting the wafer, will decrease.

[0005] In view of the above circumstances, an object of one embodiment of the present disclosure is to provide a method for manufacturing a structure and a method for manufacturing an electronic component device in which warping of a support member caused by volumetric shrinkage of a thermosetting resin is suppressed. [Means for solving the problem]

[0006] Specific means for solving the above problems include the following aspects. <1> A method for producing a structure having a support member and a cured product of a thermosetting resin composition disposed on one surface of the support member, comprising: disposing a thermosetting resin composition on each of both sides of the support member; curing the thermosetting resin composition; and removing the cured product of the thermosetting resin composition disposed on one surface of the support member. <2> The volume shrinkage rate of the thermosetting resin composition disposed on one surface of the support member after curing is 80% to 120% of the volume shrinkage rate of the thermosetting resin composition disposed on the other surface of the support member after curing. <1> A method for producing the structure described in claim 1. <3> The thermosetting resin composition disposed on each surface of the support member is in the form of a layer. <1> or <2> A method for producing the structure described in claim 1. <4> The area of ​​the region on one surface of the support member where the thermosetting resin composition is disposed is 80% to 120% of the area of ​​the region on the other surface of the support member where the thermosetting resin composition is disposed. <1> ~ <3> 13. A method for producing the structure according to any one of claims 1 to 12. <5> The method further includes cutting the support member after or before removing the cured product of the thermosetting resin composition. <1> ~ <4> 13. A method for producing the structure according to any one of claims 1 to 12. <6> A method for manufacturing an electronic component device having a support member, an electronic component disposed on one surface of the support member, and a cured product of a thermosetting resin composition disposed around the electronic component, the method comprising the steps of: Placing a thermosetting resin composition on a surface of the support member on which the electronic components are arranged and on a surface opposite to the surface on which the electronic components are arranged; curing the thermosetting resin composition; and removing the cured product of the thermosetting resin composition disposed on the surface of the support member opposite to the surface on which the electronic component is disposed. <7> The volume shrinkage rate after curing of the thermosetting resin composition arranged on the surface of the support member on which the electronic components are arranged is 80% to 120% of the volume shrinkage rate after curing of the thermosetting resin composition arranged on the surface opposite to the surface of the support member on which the electronic components are arranged. <6> A method for manufacturing the electronic component device according to claim 1. <8> The thermosetting resin composition disposed on each surface of the support member is in the form of a layer. <6> or <7> A method for manufacturing the electronic component device according to claim 1. <9> The area of ​​the region where the thermosetting resin composition is disposed on the surface of the support member on which the electronic components are disposed is 80% to 120% of the area of ​​the region where the thermosetting resin composition is disposed on the surface of the support member opposite to the surface on which the electronic components are disposed. <6> ~ <8> 13. A method for manufacturing an electronic component device according to claim 12. <10> The thermosetting resin composition disposed around the electronic component is an encapsulant. <6> ~ <9> 13. A method for manufacturing an electronic component device according to claim 12. <11> The thermosetting resin composition disposed on the surface opposite to the surface on which the electronic components are disposed is an encapsulant. <10> A method for manufacturing the electronic component device according to claim 1. <12> The method further includes cutting the support member after or before removing the cured product of the thermosetting resin composition. <6> ~ <11> 13. A method for manufacturing an electronic component device according to claim 12. Effect of the Invention

[0007] According to an embodiment of the present disclosure, there is provided a method for manufacturing a structure and a method for manufacturing an electronic component device in which warping of a support member caused by volumetric shrinkage of a thermosetting resin is suppressed. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] In the present disclosure, the term "step" includes not only a step that is independent of other steps, but also a step that cannot be clearly distinguished from other steps as long as the purpose of the step is achieved. In the present disclosure, a numerical range indicated using "~" includes the numerical values ​​before and after "~" as the minimum and maximum values, respectively. In the numerical ranges described in the present disclosure in stages, the upper or lower limit value described in one numerical range may be replaced with the upper or lower limit value of another numerical range described in stages. In addition, in the numerical ranges described in the present disclosure, the upper or lower limit value of the numerical range may be replaced with a value shown in the examples. In the present disclosure, each component may contain multiple types of the corresponding substance. When multiple substances corresponding to each component are present in the composition, the content or amount of each component means the total content or amount of the multiple substances present in the composition, unless otherwise specified. In the present disclosure, the particles corresponding to each component may include multiple types. When multiple types of particles corresponding to each component are present in the composition, the particle size of each component means the value for a mixture of the multiple types of particles present in the composition, unless otherwise specified.

[0009] <Method of manufacturing the structure> One embodiment of the present disclosure comprises: A method for producing a structure having a support member and a cured product of a thermosetting resin composition disposed on one surface of the support member, comprising: disposing a thermosetting resin composition on each of both sides of the support member; curing the thermosetting resin composition; and removing the cured product of the thermosetting resin composition disposed on one surface of the support member.

[0010] In the method of the present embodiment, the thermosetting resin composition is placed on both sides of a support member, and the thermosetting resin is cured. Therefore, when the thermosetting resin contained in the thermosetting resin composition is cured, volume shrinkage occurs on both sides of the support member. As a result, the support member is less likely to warp toward one of the sides compared to when the thermosetting resin composition is placed on only one of the sides of the support member and cured. Therefore, a structure in which the warping of the support member is suppressed can be obtained. Furthermore, in the method of the present embodiment, warping of the support member can be suppressed by a technique of disposing the thermosetting resin composition on both sides of the support member, rather than adjusting the components and amounts of the components contained in the thermosetting resin composition. Therefore, even if a thermosetting resin composition has a large volume shrinkage and is likely to cause warping of the support member, it can be used to manufacture a structure in which warping of the support member is suppressed.

[0011] In the method of the present embodiment, the method of disposing the thermosetting resin composition on both sides of the support member is not particularly limited. For example, it can be selected from known methods such as compression molding, injection molding, coating, etc. The thermosetting resin composition previously molded into a sheet may be attached to the support member directly or via a release layer. The thermosetting resin composition may be disposed on each side of the support member simultaneously or sequentially.

[0012] From the viewpoint of suppressing warping of the supporting member, it is preferable that the volumetric shrinkage rate after curing of the thermosetting resin composition arranged on one side of the supporting member is 80% to 120% of the volumetric shrinkage rate after curing of the thermosetting resin composition arranged on the other side of the supporting member, more preferably 90% to 110%, even more preferably 95% to 105%, and particularly preferably 100% (i.e., the volumetric shrinkage rate after curing of the thermosetting resin composition arranged on one side is equal to the volumetric shrinkage rate after curing of the thermosetting resin composition arranged on the other side).

[0013] In the present disclosure, the volume shrinkage rate of a thermosetting resin composition is measured by the following method. (1) Using a mold having dimensions of 127 mm length × 6.4 mm height × 12.7 mm width when measured at room temperature (25°C), a test piece made of a cured product of the thermosetting resin composition is prepared by transfer molding. (2) Immediately after preparation, the test piece is removed from the mold and cooled to room temperature (25°C). The dimensions of the test piece are then measured with a vernier caliper. The measurements are performed on two test pieces (test piece 1 and test piece 2) prepared under the same conditions. (3) The volumetric shrinkage rate (%) is calculated from the dimensions of the test piece measured at room temperature and the dimensions of the mold measured at room temperature using the following formula, where D1 is the lengthwise dimension (mm) of the mold used to mold test piece 1, d1 is the lengthwise dimension (mm) of test piece 1, D2 is the lengthwise dimension (mm) of the mold used to mold test piece 2, and d2 is the lengthwise dimension (mm) of test piece 2.

[0014]

number

[0015] From the viewpoint of suppressing warping of the support member, the thermosetting resin composition arranged on each side of the support member is preferably in a layered form. When the thermosetting resin composition arranged on each side of the support is in a layered form, the thickness of one layer is preferably 80% to 120% of the thickness of the other layer, more preferably 90% to 110%, even more preferably 95% to 105%, and particularly preferably 100% (i.e., the thickness of one layer is equal to the thickness of the other layer). When the thickness of the layered thermosetting resin composition is not constant, it is preferable that the maximum value of the thickness satisfies the above condition.

[0016] From the viewpoint of suppressing warping of the supporting member, the area of ​​the region where the thermosetting resin composition is disposed on one surface of the supporting member is preferably 80% to 120% of the area of ​​the region where the thermosetting resin composition is disposed on the other surface of the supporting member, more preferably 90% to 110%, even more preferably 95% to 105%, and particularly preferably 100% (i.e., the area of ​​the region where the thermosetting resin composition is disposed on one surface is equal to the area of ​​the region where the thermosetting resin composition is disposed on the other surface).

[0017] The method for curing the thermosetting resin composition disposed on both sides of the support member is not particularly limited, and can be selected depending on the type of thermosetting resin, etc. For example, the thermosetting resin composition can be cured by heating to a temperature at which a curing reaction of the thermoplastic resin contained in the thermosetting resin composition occurs.

[0018] The method for removing the cured product of the thermosetting resin composition arranged on one surface of the support member is not particularly limited. For example, a method for removing the cured product of the thermosetting resin composition using a grinder or the like, a method for removing the cured product of the thermosetting resin composition using a chemical or the like, a method for peeling off a release layer arranged between the cured product of the thermosetting resin composition and the support member from the support member, and the like can be mentioned.

[0019] The method of the present embodiment may include steps other than the steps described above, as necessary. For example, the method may include cutting the support member after or before removing the cured product of the thermosetting resin composition arranged on one surface of the support member. From the viewpoint of work efficiency, etc., it is preferable to cut the support member after removing the cured product of the thermosetting resin composition arranged on one surface of the support member. The method for cutting the support member is not particularly limited. For example, a dicing saw used for cutting a wafer in the manufacturing process of electronic component devices may be used.

[0020] (Thermosetting resin composition) The thermosetting resin composition used in the above method is a composition containing at least a thermosetting resin. The thermosetting resin composition may contain only a thermosetting resin, or may contain a thermosetting resin and other components. The type of thermosetting resin is not particularly limited and can be selected depending on the application of the structure. For example, the thermosetting resin may be selected from epoxy resins, phenolic resins, urea resins, melamine resins, unsaturated polyester resins, urethane resins, silicone resins, and maleimide resins. In an embodiment, the thermosetting resin may be an epoxy resin.

[0021] The thermosetting resin contained in the thermosetting resin composition arranged on one side of the support member and the thermosetting resin contained in the thermosetting resin composition arranged on the other side of the support member may be the same type or different types. From the viewpoint of suppressing warping of the support member, it is preferable that the thermosetting resin contained in the thermosetting resin composition arranged on one side of the support member and the thermosetting resin contained in the thermosetting resin composition arranged on the other side of the support member are the same type.

[0022] The thermosetting resin composition may contain components other than the thermosetting resin. Examples of components other than the thermosetting resin include a filler, a curing agent, a curing accelerator, a coupling agent, an ion exchanger, a release agent, a flame retardant, and a colorant.

[0023] (Support member) The type of support member used in the above method is not particularly limited and can be selected according to the application of the structure. The support member may be, for example, an inorganic material such as silicon, metal, or carbon, an organic material such as resin, or a composite of an inorganic material and an organic material. In one embodiment, the support member may be a wafer, which in this disclosure refers to a disk-shaped object used as a material for electronic device manufacturing.

[0024] In the method of the present disclosure, even if the area of ​​the support member is large, warping due to the volumetric shrinkage of the thermosetting resin composition is effectively suppressed. Therefore, the area of ​​the support member used in the method of the present embodiment is 25 cm 2 More than 100cm 2 or more, or 300cm 2 The area of ​​the support member may be 3000 cm or more. 2 Below, 2000cm 2 or less than 1000cm 2 It may be the following.

[0025] In the method of the present disclosure, even if the thickness of the support member is thin, warpage caused by the volumetric shrinkage of the thermosetting resin composition is effectively suppressed. Therefore, the thickness of the support member used in the method of the present embodiment may be 5000 μm or less, 3000 μm or less, or 1000 μm or less. The thickness of the support member may be 10 μm or more, 50 μm or more, or 100 μm or more.

[0026] Materials other than the support member and the thermosetting resin composition may be used to manufacture the structure. For example, when the structure is used as an electronic component device, electronic components may be used. A structure including electronic components can be obtained, for example, by placing electronic components on one side of a support member, placing a thermosetting resin composition on both sides of the support member, curing the thermosetting resin composition, and then removing the cured thermosetting resin composition that was placed on the side of the support member on which the electronic components are not placed.

[0027] The use of the structure manufactured by the method of the present disclosure is not particularly limited. For example, a structure including electronic components may be used as an electronic component device.

[0028] <Electronic component device manufacturing method> One embodiment of the present disclosure comprises: A method for manufacturing an electronic component device having a support member, an electronic component disposed on one surface of the support member, and a cured product of a thermosetting resin composition disposed around the electronic component, the method comprising the steps of: Placing a thermosetting resin composition on a surface of the support member on which the electronic components are arranged and on a surface opposite to the surface on which the electronic components are arranged; curing the thermosetting resin composition; and removing the cured product of the thermosetting resin composition disposed on the surface of the support member opposite to the surface on which the electronic components are disposed.

[0029] In the method of the present embodiment, the thermosetting resin composition is placed on both sides of a support member, and the thermosetting resin is cured. Therefore, when the thermosetting resin contained in the thermosetting resin composition is cured, volume shrinkage occurs on both sides of the support member. As a result, the support member is less likely to warp toward one of the sides compared to when the thermosetting resin composition is placed on only one of the sides of the support member and cured. Therefore, an electronic component device in which warping of the support member is suppressed can be obtained. Furthermore, in the method of the present embodiment, warping of the support member can be suppressed by a technique of disposing the thermosetting resin composition on both sides of the support member, rather than adjusting the components and amounts of the components contained in the thermosetting resin composition. Therefore, for example, even a thermosetting resin composition that has a large volume shrinkage and is likely to cause warping of the support member can be used to manufacture an electronic component device in which warping of the support member is suppressed.

[0030] In the method of the present embodiment, the method of disposing the thermosetting resin composition on both sides of the support member is not particularly limited. For example, it can be selected from known methods such as compression molding, injection molding, coating, etc. The thermosetting resin composition previously molded into a sheet may be attached to the support member directly or via a release layer. The thermosetting resin composition may be disposed on each side of the support member simultaneously or sequentially.

[0031] From the viewpoint of suppressing warping of the supporting member, it is preferable that the volumetric shrinkage rate after curing of the thermosetting resin composition arranged on the surface of the supporting member on which the electronic components are arranged is 80% to 120% of the volumetric shrinkage rate after curing of the thermosetting resin composition arranged on the surface opposite to the surface of the supporting member on which the electronic components are arranged, more preferably 90% to 110%, even more preferably 95% to 105%, and particularly preferably 100% (i.e., the volumetric shrinkage rate after curing of the thermosetting resin composition arranged on the surface of the supporting member on which the electronic components are arranged is equal to the volumetric shrinkage rate after curing of the thermosetting resin composition arranged on the surface opposite to the surface of the supporting member on which the electronic components are arranged).

[0032] From the viewpoint of suppressing warping of the support member, the thermosetting resin composition arranged on each surface of the support member is preferably in a layer form. When the thermosetting resin composition arranged on each surface of the support is in a layer form, the thickness of the layer arranged on the surface of the support member on which the electronic components are arranged is preferably 80% to 120% of the thickness of the layer arranged on the surface opposite to the surface on which the electronic components are arranged, more preferably 90% to 110%, even more preferably 95% to 105%, and particularly preferably 100% (i.e., the thickness of the layer arranged on the surface of the support member on which the electronic components are arranged is equal to the thickness of the layer arranged on the surface opposite to the surface on which the electronic components are arranged). When the thickness of the layered thermosetting resin composition is not constant, it is preferable that the maximum value of the thickness satisfies the above condition.

[0033] From the viewpoint of suppressing warping of the supporting member, it is preferable that the area of ​​the region where the thermosetting resin composition is disposed on the surface of the supporting member on which the electronic components are arranged is 80% to 120% of the area of ​​the region where the thermosetting resin composition is disposed on the surface of the supporting member opposite to the surface on which the electronic components are arranged, more preferably 90% to 110%, even more preferably 95% to 105%, and particularly preferably 100% (i.e., the area of ​​the region where the thermosetting resin composition is disposed on the surface of the supporting member on which the electronic components are arranged is equal to the area of ​​the region where the thermosetting resin composition is disposed on the surface of the supporting member opposite to the surface on which the electronic components are arranged).

[0034] The method for curing the thermosetting resin composition disposed on both sides of the support member is not particularly limited, and can be selected depending on the type of thermosetting resin, etc. For example, the thermosetting resin composition can be cured by heating to a temperature at which a curing reaction of the thermoplastic resin contained in the thermosetting resin composition occurs.

[0035] The method for removing the cured product of the thermosetting resin composition arranged on the surface of the support member opposite to the surface on which the electronic components are arranged is not particularly limited. For example, a method for removing the cured product of the thermosetting resin composition using a grinder or the like, a method for removing the cured product of the thermosetting resin composition using a chemical or the like, a method for peeling off a release layer arranged between the cured product of the thermosetting resin composition and the support member from the support member, and the like can be mentioned.

[0036] The method of the present embodiment may include steps other than the steps described above, as necessary. For example, the method may include cutting the support member after or before removing the cured product of the thermosetting resin composition arranged on the surface of the support member opposite to the surface on which the electronic components are arranged. From the viewpoint of work efficiency, etc., it is preferable to cut the support member after removing the cured product of the thermosetting resin composition arranged on the surface of the support member opposite to the surface on which the electronic components are arranged. The method for cutting the support member is not particularly limited. For example, a dicing saw used for cutting a wafer in the manufacturing process of electronic component devices may be used.

[0037] For details and preferred ranges of the thermosetting resin composition and the support member used in the method of this embodiment, reference can be made to the details and preferred ranges of the thermosetting resin composition and the support member used in the method for producing a structure described above.

[0038] The thermosetting resin composition used in the method of the present embodiment may be a sealant. The sealant is disposed around an electronic component (including between the electronic component and a support member) to protect the electronic component. The sealant may be solid or liquid at room temperature (25°C). The sealing material may include a material that contains at least an epoxy resin and a curing agent as resin components, and an inorganic filler such as silica or alumina. The content of the resin component in the sealing material may be, for example, 10 vol % to 70 vol %, 15 vol % to 60 vol %, or 20 vol % to 50 vol % of the entire sealing material. The content of the inorganic filler in the sealing material may be, for example, 30 volume % to 90 volume %, 40 volume % to 85 volume %, or 50 volume % to 80 volume % of the entire sealing material. The encapsulant may further include a curing accelerator, a coupling agent, an ion exchanger, a release agent, a flame retardant, a colorant such as carbon black, and the like.

Claims

1. A method for producing a structure having a support member and a cured product of a thermosetting resin composition disposed on one surface of the support member, comprising: disposing a thermosetting resin composition on each of both sides of the support member; curing the thermosetting resin composition; and removing the cured product of the thermosetting resin composition disposed on one surface of the support member.

2. The method for producing a structure according to claim 1, wherein a volume shrinkage rate after curing of the thermosetting resin composition arranged on one surface of the support member is 80% to 120% of a volume shrinkage rate after curing of the thermosetting resin composition arranged on the other surface of the support member.

3. The method for producing a structure according to claim 1 , wherein the thermosetting resin composition disposed on each surface of the support member is in the form of a layer.

4. 2. The method for producing a structure according to claim 1, wherein an area of ​​a region on one surface of the support member where the thermosetting resin composition is disposed is 80% to 120% of an area of ​​a region on the other surface of the support member where the thermosetting resin composition is disposed.

5. The method for producing the structure according to any one of claims 1 to 4, further comprising cutting the support member after or before removing the cured product of the thermosetting resin composition.

6. A method for manufacturing an electronic component device having a support member, an electronic component disposed on one surface of the support member, and a cured product of a thermosetting resin composition disposed around the electronic component, the method comprising the steps of: Placing a thermosetting resin composition on a surface of the support member on which the electronic components are arranged and on a surface opposite to the surface on which the electronic components are arranged; curing the thermosetting resin composition; and removing the cured product of the thermosetting resin composition disposed on the surface of the support member opposite to the surface on which the electronic component is disposed.

7. The method for manufacturing an electronic component device according to claim 6, wherein a volumetric shrinkage rate after curing of the thermosetting resin composition arranged on the surface of the support member on which the electronic components are arranged is 80% to 120% of a volumetric shrinkage rate after curing of the thermosetting resin composition arranged on the surface of the support member opposite to the surface on which the electronic components are arranged.

8. The method for manufacturing an electronic component device according to claim 6, wherein the thermosetting resin composition disposed on each surface of the support member is in the form of a layer.

9. The method for manufacturing an electronic component device according to claim 6, wherein an area of ​​a region in which the thermosetting resin composition is disposed on the surface of the support member on which the electronic components are disposed is 80% to 120% of an area of ​​a region in which the thermosetting resin composition is disposed on the surface of the support member opposite to the surface on which the electronic components are disposed.

10. The method for manufacturing an electronic component device according to claim 6 , wherein the thermosetting resin composition disposed around the electronic component is a sealing material.

11. The method for manufacturing an electronic component device according to claim 10 , wherein the thermosetting resin composition placed on the surface opposite to the surface on which the electronic components are placed is a sealant.

12. The method for manufacturing an electronic component device according to any one of claims 6 to 11, further comprising cutting the support member after or before removing the cured product of the thermosetting resin composition.

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