Component mounting device, data creation device, and component mounting method

Abstract

To provide a component mounting device capable of suppressing a reduction in tact time required to mount a component.SOLUTION: A component mounting device 100 comprises: a first mounting stage 22; a second mounting stage 23; a first head unit 4a for mounting a component E to a substrate P at the first mounting stage 22; a second head unit 4b for mounting the component E containing a back height component EA to which the first head unit 4a cannot be mounted to the substrate P at the second mounting stage 23 because a thickness of the component E is large; a back height component EA that is mounted to the substrate P at the second mounting stage 23 at a fixing position of the substrate P at each of the first and second mounting stages 23 being at a normal fix position PA; and a control part 8 that sets the fixing position of the substrate P at the first mounting stage 22 to an interference avoidance position PB changed from the normal fixing position PA so as to prevent occurrence of an interference in the case where the interference with the first head unit 4a occurs.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a component mounting apparatus, a data creation apparatus, and a component mounting method, and more particularly to a component mounting apparatus, a data creation apparatus, and a component mounting method for mounting components on a board. [Background technology]

[0002] 2. Description of the Related Art Conventionally, component mounting devices for mounting components on a board have been known (see, for example, Patent Document 1).

[0003] The above-mentioned Patent Document 1 discloses a surface mounter (component mounting device) that mounts components on a printed circuit board. In this surface mounter, the printed circuit board is transported on a conveyor and stopped at a predetermined mounting work position. In this surface mounter, a single head unit picks up components from a component supply unit and mounts the picked up components on the printed circuit board stopped at the predetermined mounting work position. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2005-217009 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the component mounting device described in Patent Document 1, components are mounted using a single head unit, so the tact time required for mounting components is relatively long. For this reason, it is desirable to shorten the tact time required for mounting components.

[0006] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide a component mounting device, a data creation device, and a component mounting method that are capable of suppressing the shortening of the takt time required for mounting components. [Means for solving the problem]

[0007] A component mounting device according to a first aspect of the present invention comprises a first mounting stage where the work of mounting components on a substrate is performed, a second mounting stage arranged downstream of the first mounting stage in a substrate transport direction and where the work of mounting components on the substrate is performed, a first head unit which mounts components on the substrate at the first mounting stage, a second head unit which mounts components on the substrate at the second mounting stage including tall components which the first head unit cannot mount due to their large thickness, and a control unit which, when the fixing position of the substrate at each of the first and second mounting stages is at a normal fixing position and interference occurs between the tall components mounted on the substrate at the second mounting stage and the first head unit, sets the fixing position of the substrate at at least one of the first and second mounting stages to an interference avoidance position changed from the normal fixing position so as to prevent interference.

[0008] A component mounting device according to a first aspect of the present invention is provided with a first mounting stage, a second mounting stage, a first head unit, and a second head unit. This makes it possible to efficiently mount components on a board using the two mounting stages, the first and second mounting stages, and the two head units, the first and second head units, thereby shortening the tact time required to mount components on a board compared to when a single head unit is used to mount components on a board.

[0009] Here, when mounting components on a board using both the first and second mounting stages, the timings at which components are started to be mounted on the board are different for each of the first and second mounting stages, so that the first head unit may approach the tall component after the tall component is mounted on the board by the second head unit. In this case, there is a risk of interference between the tall component and the first head unit. For this reason, when there is a risk of interference between the tall component and the first head unit, a configuration in which components are mounted on a board using only one of the first and second mounting stages is also conceivable in order to avoid interference between the tall component and the first head unit. However, when components are mounted on a board using only one of the first and second mounting stages, the tact time required for mounting the components is longer than when components are mounted on a board using both the first and second mounting stages. In response to this, as described above, when the fixing positions of the substrate on each of the first and second mounting stages are at the normal fixing positions and interference occurs between the first head unit and a tall component mounted on the substrate on the second mounting stage, a control unit is provided that sets the fixing position of the substrate on at least one of the first and second mounting stages to an interference avoidance position changed from the normal fixing position so as to prevent interference. As a result, even if interference occurs between the tall component and the first head unit at the normal fixing position, interference between the tall component and the first head unit is avoided by the interference avoidance position, and components can be mounted on the substrate using both the first and second mounting stages. As a result, the tact time required for mounting components can be effectively shortened.

[0010] In the component mounting device according to the first aspect, the control unit preferably sets the fixing position of the substrate on at least one of the first and second mounting stages to an interference avoidance position changed from the normal fixing position so that the tall component is not positioned within the movement range of the first head unit. With this configuration, the tall component is not positioned within the movement range of the first head unit, so that interference between the tall component and the first head unit can be reliably avoided.

[0011] In this case, preferably, the control unit sets the fixing position of the substrate on at least one of the first and second mounting stages to an interference avoidance position changed from the normal fixing position by at least the distance from the end of the movement range of the first head unit to the tall component so that the tall component is not located within the movement range of the first head unit. With this configuration, it is possible to easily set the interference avoidance position so that the tall component is not located within the movement range of the first head unit, and therefore it is possible to easily and reliably avoid interference between the tall component and the first head unit.

[0012] In the above-mentioned configuration in which the tall components are not positioned within the moving range of the first head unit, preferably, when an area of ​​the board where the first head unit cannot mount components occurs due to changing the fixing position of the board on the first mounting stage from the normal fixing position to the interference avoidance position so that the tall components are not positioned within the moving range of the first head unit, the control unit mounts components in the area of ​​the board where interference occurs at the normal fixing position at the interference avoidance position, and mounts components in the remaining area of ​​the board at the normal fixing position. With this configuration, components are mounted in the area of ​​the board where interference occurs at the normal fixing position at the interference avoidance position, so that interference between the tall components and the first head unit can be avoided. Furthermore, since components are mounted in the remaining area of ​​the board at the normal fixing position, even if the first head unit cannot mount all of the components only at the interference avoidance position, all of the components can be mounted by the first head unit. As a result, components can be mounted on the board using both the first and second mounting stages. As a result, even if the first head unit cannot mount all of the components using the interference avoidance position alone, it is possible to mount the components on the board using both the first and second mounting stages while avoiding interference between tall components and the first head unit.

[0013] In the component mounting device according to the first aspect, preferably, the device further includes an imaging unit provided in the first head unit and imaging a correction mark for position correction, and the control unit checks the mounting state of the tall component at a timing of a first predetermined time before the normal timing of the correction operation for imaging the correction mark by the imaging unit, and adjusts the timing of the correction operation based on the confirmed mounting state of the tall component so that interference between the tall component and the first head unit does not occur during the correction operation. With this configuration, the timing of the correction operation can be appropriately adjusted, thereby avoiding interference between the tall component and the first head unit during the correction operation.

[0014] In this case, preferably, when the control unit determines based on the confirmed mounting state of the tall components that the tall components will be mounted on the board at the second mounting stage by the normal timing for executing the correction operation, the control unit determines whether the board will be unloaded from the second mounting stage between the timing for mounting the tall components on the board and the timing after the second predetermined time, and when the control unit determines that the board will be unloaded from the second mounting stage by the timing after the second predetermined time, the control unit adjusts the timing for executing the correction operation so that the correction operation is executed after the board is unloaded from the second mounting stage, and when the control unit determines that the board will not be unloaded from the second mounting stage by the timing after the second predetermined time, the control unit adjusts the timing for executing the correction operation so that the correction operation is executed before the tall components are mounted on the board. With this configuration, when the board is unloaded from the second mounting stage by the timing after the second predetermined time (i.e., when the board on which the tall components are mounted is unloaded immediately after the mounting of the tall components), the correction operation can be executed after the board is unloaded from the second mounting stage. Furthermore, if the board is not removed from the second mounting stage by the timing after the second predetermined time (i.e., if the board on which the tall components are mounted is not removed immediately after the tall components are mounted), the correction operation can be performed before the tall components are mounted on the board. As a result, the timing at which the correction operation is performed can be effectively adjusted, and therefore interference between the tall components and the first head unit during the correction operation can be effectively avoided.

[0015] In the configuration for adjusting the timing at which the correction operation is performed, preferably, when the control unit determines, based on the confirmed mounting state of the tall component, that the tall component will not be mounted on the board in the second mounting stage by the normal timing at which the correction operation is performed, the timing at which the correction operation is performed is set to the normal timing. With this configuration, if the tall component will not be mounted on the board in the second mounting stage by the time the correction operation is performed (i.e., even if the correction operation is performed at the normal timing, interference between the tall component and the first head unit does not occur during the correction operation), the correction operation can be performed as usual. As a result, it is possible to avoid the tact time required for mounting components from being extended due to the adjustment of the timing of the correction operation.

[0016] In the above-mentioned configuration for adjusting the timing at which the correction operation is performed, preferably, when the control unit determines that the tall components have been mounted on the board at the second mounting stage based on the confirmed mounting state of the tall components, the control unit adjusts the timing at which the correction operation is performed so that the correction operation is performed after the board is unloaded from the second mounting stage. With this configuration, even if the tall components have been mounted on the board, interference between the tall components and the first head unit during the correction operation can be reliably avoided.

[0017] In the component mounting device according to the first aspect, preferably, the device further includes an imaging unit provided in the first head unit and imaging a correction mark for position correction, and the control unit mounts components on the board by both the first and second head units using only one of the first and second mounting stages when producing a board on which a correction operation for imaging the correction mark is performed by the imaging unit, and mounts components on the board by the first head unit using the first mounting stage and mounts components on the board by the second head unit using the second mounting stage when producing a board on which a correction operation for imaging the correction mark is not performed. With this configuration, when producing a board on which a correction operation for imaging the correction mark is performed by the imaging unit, components are mounted on the board by both the first and second head units using only one of the first and second mounting stages, so that interference between tall components and the first head unit can be avoided during the correction operation. Furthermore, in the case of producing a board on which no correction operation is performed, components are mounted on the board by the first head unit using the first mounting stage, and components are mounted on the board by the second head unit using the second mounting stage, so the tact time required to mount components can be shortened compared to mounting components on the board by both the first and second head units using only one of the first and second mounting stages. As a result, it is possible to shorten the tact time required to mount components while avoiding interference between tall components and the first head unit during the correction operation.

[0018] A data creation device according to a second aspect of the present invention includes a data creation control unit that creates component mounting data for a component mounting device that includes a first mounting stage where the work of mounting components on a board is performed, a second mounting stage that is arranged downstream of the first mounting stage in the board transport direction and where the work of mounting components on the board is performed, a first head unit that mounts components on the board at the first mounting stage, and a second head unit that mounts components including tall components that cannot be mounted by the first head unit because of their large thickness, on the board at the second mounting stage.When the fixing position of the board at each of the first and second mounting stages is in a normal fixing position and interference occurs between the tall components mounted on the board at the second mounting stage and the first head unit, the data creation control unit changes the fixing position of the board at least one of the first and second mounting stages from the normal fixing position to an interference avoidance position so as to prevent interference, and creates the component mounting data.

[0019] A data creation device according to a second aspect of the present invention includes a data creation control unit that creates component mounting data for a component mounting device that includes a first mounting stage, a second mounting stage, a first head unit, and a second head unit. This makes it possible to efficiently mount components on a board using two mounting stages, the first and second mounting stages, and two head units, the first and second head units, and therefore provides a data creation device that can reduce the tact time required to mount components compared to mounting components on a board using a single head unit.

[0020] Furthermore, the data creation control unit is configured to create component mounting data by changing the fixing position of the substrate on at least one of the first and second mounting stages from the normal fixing position to an interference avoidance position so as to prevent interference when interference between a tall component mounted on the substrate on the second mounting stage and the first head unit occurs when the fixing position of the substrate on each of the first and second mounting stages is the normal fixing position. This makes it possible to mount components on the substrate using both the first and second mounting stages while avoiding interference between the tall component and the first head unit due to the interference avoidance position, even if interference between the tall component and the first head unit occurs at the normal fixing position. As a result, the tact time required for mounting components can be effectively shortened.

[0021] A component mounting method according to a third aspect of the present invention comprises a step of mounting components on a substrate in a component mounting device comprising: a first mounting stage where the work of mounting components on a substrate is performed; a second mounting stage arranged downstream of the first mounting stage in a substrate transport direction and where the work of mounting components on the substrate is performed; a first head unit which mounts components on the substrate at the first mounting stage; and a second head unit which mounts components including tall components which the first head unit cannot mount due to their large thickness on the substrate at the second mounting stage. The step of mounting components on the substrate includes a step of setting the fixing position of the substrate on at least one of the first and second mounting stages to an interference avoidance position changed from the normal fixing position so as to prevent interference when interference occurs between the tall components mounted on the substrate at the second mounting stage and the first head unit when the fixing position of the substrate on each of the first and second mounting stages is at a normal fixing position.

[0022] A component mounting method according to a third aspect of the present invention includes a step of mounting components on a board in a component mounting apparatus including a first mounting stage, a second mounting stage, a first head unit, and a second head unit. This allows components to be mounted on the board efficiently using the two mounting stages, the first and second mounting stages, and the two head units, the first and second head units, and therefore provides a component mounting method that can shorten the tact time required to mount components compared to mounting components on a board using a single head unit.

[0023] The step of mounting components on the board is configured to include a step of setting the fixing position of the board on at least one of the first and second mounting stages to an interference avoidance position changed from the normal fixing position so as to prevent interference when interference occurs between the tall components mounted on the board on the second mounting stage and the first head unit when the fixing position of the board on each of the first and second mounting stages is the normal fixing position. This makes it possible to mount components on the board using both the first and second mounting stages while avoiding interference between the tall components and the first head unit due to the interference avoidance position, even if interference occurs between the tall components and the first head unit at the normal fixing position. As a result, the tact time required for mounting components can be effectively shortened. Effect of the Invention

[0024] According to the present invention, as described above, it is possible to reduce the tact time required for mounting components. [Brief description of the drawings]

[0025] [Figure 1] 1 is a block diagram showing a component mounting system according to a first embodiment. [Diagram 2] FIG. 1 is a schematic plan view showing a component mounting apparatus according to a first embodiment. [Diagram 3] FIG. 2 is a block diagram showing a control configuration of the component mounting apparatus according to the first embodiment. [Figure 4] FIG. 2 is a schematic side view showing first and second head units of the component mounting apparatus of the first embodiment. [Diagram 5] 5A and 5B are schematic diagrams for explaining interference between a tall component and a first head unit of the component mounting device of the first embodiment. [Figure 6] FIG. 2 is a schematic diagram (1) for explaining a change of a fixing position of a board of the component mounting apparatus of the first embodiment. [Figure 7] FIG. 13 is a schematic diagram (2) for explaining a change of the fixing position of the board of the component mounting device of the first embodiment. [Figure 8] 5 is a flowchart for explaining a control process related to changing a fixing position of a substrate in the first embodiment. [Figure 9] 6A to 6C are schematic diagrams for explaining interference between a tall component and a first head unit during a correction operation of the component mounting device of the first embodiment. [Figure 10] 5A to 5C are schematic diagrams for explaining adjustment of the timing of the correction operation of the component mounting device of the first embodiment. [Figure 11] 6 is a flowchart for explaining a control process related to adjustment of the timing of a correction operation in the first embodiment. [Figure 12] FIG. 11 is a block diagram showing a component mounting system according to a second embodiment. [Figure 13] 13A and 13B are schematic diagrams for explaining a change in mounting format in accordance with a correction operation of the component mounting device of the second embodiment. [Figure 14] 13 is a flowchart for explaining a control process related to a change in mounting format in accordance with a correction operation according to the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0026] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

[0027] [First embodiment] The configuration of a component mounting system 300 including a component mounting apparatus 100 and a data creation apparatus 200 according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 11. FIG.

[0028] (Component mounting system configuration) The component mounting system 300 is a system that mounts components E (electronic components) such as ICs, transistors, capacitors, and resistors on a board P such as a printed circuit board, to produce the board P on which the components E are mounted.

[0029] As shown in FIG. 1, a component mounting system 300 includes a component mounting apparatus 100 and a data creation apparatus 200.

[0030] The component mounting apparatus 100 is an apparatus that mounts a component E on a substrate P. In the following description, the substrate transport direction is defined as the X direction, the direction perpendicular to the X direction in a horizontal plane is defined as the Y direction, and the up-down direction perpendicular to the X direction and Y direction is defined as the Z direction.

[0031] The component mounting apparatus 100 includes a base 1, a board transport unit 2, a component supply unit 3, a first head unit 4a, a second head unit 4b, a head horizontal movement mechanism unit 5, a component imaging unit 6, a board imaging unit 7, a control unit 8, and a storage unit 9. The board imaging unit 7 is an example of the "imaging unit" in the claims.

[0032] The base 1 is a base on which each component is arranged in the component mounting apparatus 100. A board transport unit 2, a rail unit 52, and a component imaging unit 6 are provided on the base 1. In addition, a control unit 8 is provided within the base 1.

[0033] The board transport section 2 is configured to load the board P, transport it in the X direction, and unload the board P. The board transport section 2 includes an input conveyor 21, a first mounting stage 22, a second mounting stage 23, and an output conveyor 24. The input conveyor 21, the first mounting stage 22, the second mounting stage 23, and the output conveyor 24 each have a pair of conveyor sections and a transport motor that drives the pair of conveyor sections. The board transport section 2 is configured to drive each conveyor section with each transport motor, thereby transporting the board P in the X direction while supporting both ends of the board P in the width direction (Y direction) from below (Z2 direction side).

[0034] The carry-in conveyor 21 carries in the board P from outside the component mounting apparatus 100 , and delivers the carried-in board P to the first mounting stage 22 .

[0035] The first mounting stage 22 is disposed downstream in the X direction (X2 direction side) of the carry-in conveyor 21. The first mounting stage 22 receives the board P from the carry-in conveyor 21, and passes the received board P to the second mounting stage 23. Also, at the first mounting stage 22, an operation of mounting components E on the board P is performed. At this time, at the first mounting stage 22, an operation of mounting components E on the board P is performed with the board P positioned and fixed at a fixed position.

[0036] The second mounting stage 23 is disposed downstream in the X direction (X2 direction side) of the first mounting stage 22. The second mounting stage 23 receives the board P from the first mounting stage 22 and transfers the received board P to the carry-out conveyor 24. In addition, in the second mounting stage 23, an operation of mounting the component E on the board P is performed. At this time, in the second mounting stage 23, an operation of mounting the component E on the board P is performed in a state in which the board P is positioned and fixed at a fixed position. For example, in the second mounting stage 23, an operation of mounting the component E on a part of the board P that was not mounted on the first mounting stage 22 is performed. In addition, the second mounting stage 23 is configured to be movable in the Y direction by a movement mechanism such as a ball screw mechanism. In the second mounting stage 23, for example, an operation of mounting the component E on the board P is performed at a position moved in the Y1 direction. Furthermore, at second mounting stage 23, at a position to which it has been moved in the Y2 direction, an operation of receiving board P from first mounting stage 22 and an operation of transferring board P to unloading conveyor 24 are performed.

[0037] The unloading conveyor 24 is disposed downstream in the X direction (X2 direction side) of the second mounting stage 23. The unloading conveyor 24 receives the board P from the second mounting stage 23, and unloads the received board P to the outside of the component mounting apparatus 100.

[0038] The component mounting apparatus 100 does not include a stopper that abuts against the substrate P to stop the substrate P at a fixed position, and is configured to be able to stop the substrate P at any fixed position. Specifically, the position of the substrate P is acquired based on the output of the encoders provided on the respective transport motors of the carry-in conveyor 21, the first mounting stage 22, the second mounting stage 23, and the carry-out conveyor 24, thereby making it possible to stop the substrate P at any fixed position.

[0039] The component supply unit 3 is configured to supply components E to be mounted on the board P. The component supply units 3 are arranged on both sides in the Y direction (Y1 and Y2 direction sides) of the board transport unit 2. The component supply unit 3 is configured with multiple tape feeders 31. The tape feeders 31 supply the components E by intermittently feeding a component supply tape holding the components E at predetermined distance intervals.

[0040] The first head unit 4a and the second head unit 4b are head units for mounting components. The first head unit 4a and the second head unit 4b mount the components E on the substrate P at the first mounting stage 22 and the second mounting stage 23. For example, the component mounting device 100 can perform the following: the first head unit 4a mounts the components E on the substrate P at the first mounting stage 22, and the second head unit 4b mounts the components E on the substrate P at the second mounting stage 23 (hereinafter, this may be referred to as "two-stage mounting"). Also, for example, the component mounting device 100 can perform the following: both the first head unit 4a and the second head unit 4b mount the components E on the substrate P at only one of the first mounting stage 22 and the second mounting stage 23 (hereinafter, this may be referred to as "one-stage mounting").

[0041] The first head unit 4a is provided on the Y2 direction side with respect to the second head unit 4b. The second head unit 4b is provided on the Y1 direction side with respect to the first head unit 4a. The first head unit 4a and the second head unit 4b are provided to face each other in the Y direction. The first head unit 4a (second head unit 4b) includes a plurality of heads (mounting heads) 41. A nozzle 41a (see FIG. 4) for holding (sucking) the component E is attached to the tip of the head 41. The head 41 is configured to be able to hold (suck) the component E to the nozzle 41a by negative pressure from a negative pressure supply unit (not shown).

[0042] Furthermore, the first head unit 4a and the second head unit 4b each include a Z-axis motor 42 that moves the head 41 in the Z direction, and an R-axis motor 43 that rotates the head 41 about a rotation axis extending in the Z direction. The head 41 is configured to be movable in the Z direction by the Z-axis motor 42 between a lowered position for holding the component E or for mounting the held component E, and an elevated position for transporting the held component E to the board P. The head 41 is also configured to be rotated by the R-axis motor 43 while holding the component E, thereby allowing the orientation of the held component E to be adjusted.

[0043] As shown in FIG. 4, the second head unit 4b is configured to be able to mount on the substrate P components E including tall components EA that cannot be mounted by the first head unit 4a due to their large thickness. The tall components EA are components having a height H1 greater than the height H2 of the components E that have the maximum height among the components E that can be mounted by the first head unit 4a. The first head unit 4a and the second head unit 4b are of different types. The first head unit 4a is compatible with small components E that cannot be mounted by the second head unit 4b. The second head unit 4b is compatible with large components E (tall components EA) that cannot be mounted by the first head unit 4a. Note that both the first head unit 4a and the second head unit 4b are compatible with components E that are larger than the small components E that cannot be mounted by the second head unit 4b and smaller than the large components E that cannot be mounted by the first head unit 4a.

[0044] As shown in FIG. 2 and FIG. 3, the head horizontal movement mechanism 5 is configured to move the first head unit 4a and the second head unit 4b in the horizontal direction (X direction and Y direction). The head horizontal movement mechanism 5 includes a support portion 51a that supports the first head unit 4a so as to be movable in the X direction, a support portion 51b that supports the second head unit 4b so as to be movable in the X direction, and a rail portion 52 that supports the support portions 51a and 51b so as to be movable in the Y direction. The support portion 51a supports the first head unit 4a from the side so that the first head unit 4a is disposed on the Y1 direction side. The support portion 51b supports the second head unit 4b from the side so that the second head unit 4b is disposed on the Y2 direction side. The support portion 51a (51b) is configured to move the first head unit 4a (second head unit 4b) in the X direction by a movement mechanism such as a ball screw shaft mechanism. The rail portion 52 supports both ends of the support portion 51a (51b) in the X direction so as to be movable in the Y direction. The rail portion 52 is configured to move the support portion 51a (51b) in the Y direction by a movement mechanism such as a ball screw shaft mechanism.

[0045] The first head unit 4a and the second head unit 4b are configured to be movable independently of each other in the horizontal direction on the base 1 by the supports 51a and 51b and the rail portion 52 of the head horizontal movement mechanism 5. This allows the first head unit 4a and the second head unit 4b to move above the component supply unit 3 and hold (suck) the components E supplied from the component supply unit 3. In addition, the first head unit 4a and the second head unit 4b can move above the substrate P and mount the held (sucked) components E on the substrate P.

[0046] The component imaging unit 6 is a camera for component recognition. The component imaging unit 6 captures an image of the component E held (sucked) by the nozzle 41a of the head 41 while the head 41 of the first head unit 4a (second head unit 4b) is transporting the component E to the board P. The component imaging unit 6 is fixed on the upper surface of the base 1, and captures an image of the component E held (sucked) by the nozzle 41a of the head 41 from the lower side (Z2 direction side) of the component E. Based on the image of the component E captured by the component imaging unit 6, the control unit 8 acquires (recognizes) the holding state of the component E (rotational attitude and holding position relative to the head 41).

[0047] The board imaging unit 7 is a camera for board recognition. Before the head 41 of the first head unit 4a (second head unit 4b) starts mounting the components E on the board P, the board imaging unit 7 captures an image of a position recognition mark (fiducial mark) attached to the upper surface of the board P. The position recognition mark is a mark for recognizing the position of the board P. Based on the image of the position recognition mark captured by the board imaging unit 7, the control unit 8 acquires (recognizes) the accurate position and posture of the fixed board P. The board imaging unit 7 is provided in the first head unit 4a (second head unit 4b) and moves together with the first head unit 4a (second head unit 4b).

[0048] The control unit 8 includes a processor such as a CPU (Central Processing Unit), and is a control circuit that controls each unit of the component mounting apparatus 100. The control unit 8 is configured to control the board transport unit 2, the component supply unit 3, the head horizontal movement mechanism unit 5, etc., in accordance with component mounting data DA, which will be described later, to perform control to mount components E on the board P by the first head unit 4a and the second head unit 4b.

[0049] The storage unit 9 includes a non-volatile recording medium such as a hard disk drive, and is configured to be able to store information. The storage unit 9 stores information such as component mounting data DA acquired from the data generating device 200.

[0050] The data creation device 200 is configured by, for example, a personal computer. As shown in FIG. 1, the data creation device 200 includes a control unit 201 and a storage unit 202. The control unit 201 is a control circuit including a processor such as a CPU (Central Processing Unit) and controlling each unit of the data creation device 200. The control unit 201 creates component mounting data DA for the component mounting device 100. The control unit 201 creates the component mounting data DA including information indicating whether the mounting is one-stage or two-stage mounting, information indicating the fixing position of the board P, and information indicating the mounting sequence of the components E. The storage unit 202 includes a non-volatile recording medium such as a hard disk drive and is configured to be able to store information. The storage unit 202 stores information such as the created component mounting data DA. The control unit 201 is an example of a "data creation control unit" in the claims.

[0051] Furthermore, the component mounting device 100 and the data creating device 200 are connected to each other so that they can communicate with each other. The component mounting data DA created by the data creating device 200 is acquired by the component mounting device 100 before starting production of the board P.

[0052] (Interference between the tall parts and the first head unit) With reference to FIG. 5, interference between the tall part EA and the first head unit 4a will be described.

[0053] As shown in FIG. 5, when mounting the component E on the board P using both the first mounting stage 22 and the second mounting stage 23 (when performing two-stage mounting), the timings at which the component E starts mounting are different for each of the first mounting stage 22 and the second mounting stage 23. Therefore, after the second head unit 4b mounts the tall component EA on the board P, the first head unit 4a may approach the tall component EA. In this case, there is a risk of interference between the tall component EA and the first head unit 4a. In order to avoid interference between the tall component EA and the first head unit 4a, a configuration in which the component E is mounted on the board P using only one of the first mounting stage 22 and the second mounting stage 23 is also conceivable. In this case, by mounting the tall component EA last, it is possible to avoid interference between the tall component EA and the first head unit 4a. However, in a configuration in which component E is mounted on substrate P using only one of the first mounting stage 22 and the second mounting stage 23, the tact time required to mount component E is longer than in a configuration in which component E is mounted on substrate P using both the first mounting stage 22 and the second mounting stage 23.

[0054] 6, in the first embodiment, when the fixing position of the substrate P on each of the first mounting stage 22 and the second mounting stage 23 is the normal fixing position PA and interference occurs between the tall component EA mounted on the substrate P on the second mounting stage 23 and the first head unit 4a, the control unit 8 sets the fixing position of the substrate P on the first mounting stage 22 to an interference avoidance position PB changed from the normal fixing position PA so as to prevent interference. Note that the normal fixing position PA is, for example, a fixing position that provides the shortest takt time required to mount the component E.

[0055] Specifically, the control unit 8 sets the fixing position of the board P on the first mounting stage 22 to an interference avoidance position PB changed from the normal fixing position PA so that the tall component EA is not located within the moving range RA of the first head unit 4a. The moving range RA is a range in which the first head unit 4a moves when mounting the component E on the board P on the first mounting stage 22. The moving range RA is calculated based on the mounting coordinates of the board P. The control unit 8 sets the fixing position of the board P on the first mounting stage 22 to an interference avoidance position PB changed from the normal fixing position PA by at least the distance D from the end of the moving range RA of the first head unit 4a to the tall component EA so that the tall component EA is not located within the moving range RA of the first head unit 4a. Specifically, the control unit 8 sets the fixing position of the board P on the first mounting stage 22 to an interference avoidance position PB changed from the normal fixing position PA to the upstream side in the X direction (X1 direction side) by the distance D plus the margin value α.

[0056] In this embodiment, as shown in FIG. 7, when an area AR1 of the board P where the component E cannot be mounted by the first head unit 4a occurs due to changing the fixing position of the board P on the first mounting stage 22 from the normal fixing position PA to the interference avoidance position PB so that the tall component EA is not located within the moving range RA of the first head unit 4a, the control unit 8 mounts the component E in the area AR2 of the board P where interference occurs at the normal fixing position PA at the interference avoidance position PB, and mounts the component E in the remaining area AR3 of the board P at the normal fixing position PA. That is, the control unit 8 mounts the component E in the area AR2 of the board P by the first head unit 4a at the interference avoidance position PB. Then, when mounting of the component E in the area AR2 of the board P by the first head unit 4a at the interference avoidance position PB is completed, the control unit 8 causes the first mounting stage 22 to transport the board P from the interference avoidance position PB to the normal fixing position PA. Then, the control unit 8 mounts the components E in the remaining area AR3 of the board P by the first head unit 4a at the normal fixed position PA.

[0057] Furthermore, component mounting data DA in which the fixing positions of the board P have been changed as described above is created by the control unit 201 of the data creating device 200. The component mounting device 100 operates as described above based on the created component mounting data DA.

[0058] That is, in this embodiment, when the fixed position of the substrate P on each of the first mounting stage 22 and the second mounting stage 23 is the normal fixed position PA and interference occurs between the first head unit 4a and a tall component EA mounted on the substrate P on the second mounting stage 23, the control unit 201 changes the fixed position of the substrate P on the first mounting stage 22 from the normal fixed position PA to the interference avoidance position PB so as to prevent interference, and creates the component mounting data DA. The control unit 201 changes the fixed position of the substrate P on the first mounting stage 22 from the normal fixed position PA to the interference avoidance position PB so that the tall component EA is not positioned within the movement range RA of the first head unit 4a, and creates the component mounting data DA.

[0059] The control unit 201 changes the fixing position of the board P on the first mounting stage 22 from the normal fixing position PA to the interference avoidance position PB by at least the distance D from the end of the movement range RA of the first head unit 4a to the tall component EA so that the tall component EA is not positioned within the movement range RA of the first head unit 4a, and creates the component mounting data DA. Specifically, the control unit 201 changes the fixing position of the board P on the first mounting stage 22 from the normal fixing position PA to the interference avoidance position PB on the upstream side in the X direction (X1 direction side) by a distance obtained by adding a margin value α to the distance D, and creates the component mounting data DA. The distance D is the distance in the X direction between the downstream side (X2 direction side) end of the movement range RA in the X direction and the upstream side (X1 direction side) end of the tall component EA in the X direction.

[0060] In addition, when an area AR1 of the substrate P on which the first head unit 4a cannot mount a component E occurs due to changing the fixing position of the substrate P on the first mounting stage 22 from the normal fixing position PA to the interference avoidance position PB so that a tall component EA is no longer located within the movement range RA of the first head unit 4a, the control unit 201 creates component mounting data DA so that the component E is mounted in the area AR2 of the substrate P where interference would occur at the normal fixing position PA at the interference avoidance position PB, and the component E is mounted in the remaining area AR3 of the substrate P at the normal fixing position PA.

[0061] (Control process for changing the fixed position of the board) With reference to FIG. 8, a control process relating to changing the fixing position of the substrate P in the data creation device 200 of this embodiment will be described based on a flowchart.

[0062] As shown in Fig. 8, in step S1, the control unit 201 determines whether interference occurs between the tall component EA and the first head unit 4a when the fixing position of the substrate P on each of the first mounting stage 22 and the second mounting stage 23 is the normal fixing position PA. Specifically, the control unit 201 determines whether interference occurs between the tall component EA and the first head unit 4a based on whether the tall component EA is located within the movement range RA of the first head unit 4a. If the control unit 201 determines that the tall component EA is not located within the movement range RA of the first head unit 4a, it determines that interference does not occur between the tall component EA and the first head unit 4a. In this case, the process proceeds to step S2.

[0063] Then, in step S2, the control unit 201 creates component mounting data DA so that two-stage mounting of the component E onto the board P is performed in which the fixing positions of the board P on both the first mounting stage 22 and the second mounting stage 23 are the normal fixing position PA. Then, the control process ends. In this case, in the component mounting apparatus 100, the control unit 8 performs two-stage mounting of the component E onto the board P in which the fixing positions of the board P on both the first mounting stage 22 and the second mounting stage 23 are the normal fixing position PA, based on the component mounting data DA.

[0064] Furthermore, in step S1, if the tall part EA is located within the movement range RA of the first head unit 4a, the control unit 201 determines that interference will occur between the tall part EA and the first head unit 4a. In this case, the process proceeds to step S3.

[0065] Then, in step S3, the control unit 201 determines whether or not there is a fixing position of the substrate P where no interference occurs between the tall part EA and the first head unit 4a. That is, the control unit 201 determines whether or not there is an interference avoidance position PB. For example, the control unit 201 determines whether or not there is an interference avoidance position PB based on whether or not the distance D is equal to or less than a threshold value. If the distance D is greater than the threshold value, the control unit 201 determines that there is no interference avoidance position PB. In this case, the process proceeds to step S4.

[0066] Then, in step S4, the control unit 201 creates component mounting data DA so that one-stage mounting of the component E on the board P is performed so that the tall component EA is mounted last. Then, the control process ends. In this case, in the component mounting apparatus 100, the control unit 8 performs one-stage mounting of the component E on the board P based on the component mounting data DA so that the tall component EA is mounted last.

[0067] Also, in step S3, if the distance D is equal to or less than the threshold value, the control unit 201 determines that the interference avoidance position PB is present. In this case, the process proceeds to step S5.

[0068] Then, in step S5, the control unit 201 determines whether or not an area AR1 of the substrate P on which the first head unit 4a cannot mount components E occurs due to changing the fixing position of the substrate P on the first mounting stage 22 from the normal fixing position PA to the interference avoidance position PB. If the control unit 201 determines that an area AR1 does not occur, the process proceeds to step S6.

[0069] Then, in step S6, the control unit 201 creates component mounting data DA so that two-stage mounting of the component E onto the board P is performed where the fixing position of the board P on the first mounting stage 22 is the interference avoidance position PB and the fixing position of the board P on the second mounting stage 23 is the normal fixing position PA. Then, the control process ends. In this case, in the component mounting apparatus 100, the control unit 8 performs two-stage mounting of the component E onto the board P where the fixing position of the board P on the first mounting stage 22 is the interference avoidance position PB and the fixing position of the board P on the second mounting stage 23 is the normal fixing position PA based on the component mounting data DA (see FIG. 6).

[0070] Moreover, in step S5, if the control unit 201 determines that an area AR1 occurs, the process proceeds to step S7.

[0071] Then, in step S7, the control unit 201 creates component mounting data DA so that two-stage mounting of the component E onto the board P is performed where the fixing position of the board P on the first mounting stage 22 is the interference avoidance position PB and the normal fixing position PA, and the fixing position of the board P on the second mounting stage 23 is the normal fixing position PA. Then, the control process ends. In this case, in the component mounting apparatus 100, the control unit 8 performs two-stage mounting of the component E onto the board P based on the component mounting data DA, where the fixing position of the board P on the first mounting stage 22 is the interference avoidance position PB and the normal fixing position PA, and the fixing position of the board P on the second mounting stage 23 is the normal fixing position PA (see FIG. 7).

[0072] (Interference between tall parts and first head unit during correction operation) With reference to FIG. 9, interference between the tall part EA and the first head unit 4a during the correction operation will be described.

[0073] 9, in the component mounting apparatus 100, a correction operation is performed in which the substrate imaging unit 7 captures an image of a correction mark MA for position correction. The correction mark MA is a mark for correcting a position error caused by thermal expansion. A plurality of correction marks MA are provided on the base 1.

[0074] In component mounting apparatus 100, as production of substrate P progresses, a temperature rise occurs in head horizontal movement mechanism 5, and thermal expansion occurs in head horizontal movement mechanism 5 in response to the temperature rise. When thermal expansion occurs, a deviation occurs between the actual position and the position in the data, so a correction operation is performed at predetermined time intervals by board imaging unit 7 to image correction marks MA for position correction. Based on the image capture result of correction marks MA by board imaging unit 7 in the correction operation, control unit 8 obtains a correction amount for correcting position error due to thermal expansion, and corrects position error due to thermal expansion.

[0075] Here, when performing a correction operation to image the correction mark MA for position correction by the substrate imaging section 7 of the first head unit 4a, the first head unit 4a may pass above (in the Z1 direction) the substrate P on the second mounting stage 23. In this case, there is a risk of interference between the tall part EA and the first head unit 4a.

[0076] Therefore, in this embodiment, as shown in FIG. 10, the control unit 8 checks the mounting state of the tall component EA at a timing of a first predetermined time before the normal timing at which the correction operation of imaging the correction mark MA is executed by the board imaging unit 7, and adjusts the timing at which the correction operation is executed based on the confirmed mounting state of the tall component EA so that interference between the tall component EA and the first head unit 4a does not occur during the correction operation.

[0077] Specifically, when the control unit 8 determines based on the confirmed mounting state of the tall component EA that the tall component EA will not be mounted on the board P on the second mounting stage 23 by the normal timing for executing the correction operation, the control unit 8 sets the timing for executing the correction operation to the normal timing. In this case, the control unit 8 executes the correction operation by the board imaging unit 7 at the predetermined normal timing.

[0078] Furthermore, when the control unit 8 determines, based on the confirmed mounting state of the tall component EA, that the tall component EA will be mounted on the board P on the second mounting stage 23 by the normal timing for executing the correction operation, it determines whether or not the board P will be carried out from the second mounting stage 23 during the period from the timing at which the tall component EA is mounted on the board P to the timing after a second predetermined time has elapsed. That is, the control unit 8 determines whether or not the board P will be carried out from the second mounting stage 23 immediately after mounting the tall component EA.

[0079] Furthermore, when the control unit 8 determines that the board P will be unloaded from the second mounting stage 23 by the timing after the second predetermined time (when the control unit 8 determines that the board P will be unloaded from the second mounting stage 23 immediately after mounting the tall components EA), the control unit 8 adjusts the timing at which the correction operation is performed so that the correction operation is performed after the board P is unloaded from the second mounting stage 23. In this case, the control unit 8 stops the operation of the first head unit 4a until the board P is unloaded from the second mounting stage 23, and performs the correction operation by the board imaging unit 7 at a timing adjusted to be later than the normal timing after the board P is unloaded from the second mounting stage 23.

[0080] Furthermore, when the control unit 8 determines that the board P will not be carried out from the second mounting stage 23 by the timing after the second predetermined time (when the control unit 8 determines that the board P will not be carried out from the second mounting stage 23 immediately after mounting the tall component EA), the control unit 8 adjusts the timing at which the correction operation is performed so that the correction operation is performed before the tall component EA is mounted on the board P. In this case, the control unit 8 stops the operation of the second head unit 4b immediately before mounting the tall component EA on the board P, and executes the correction operation by the board imaging unit 7 at a timing adjusted to be earlier than the normal timing.

[0081] Furthermore, when the control unit 8 determines that the tall component EA has been mounted on the board P at the second mounting stage 23 based on the confirmed mounting state of the tall component EA, it adjusts the timing of execution of the correction operation so that the correction operation is executed after the board P is unloaded from the second mounting stage 23. In this case, the control unit 8 stops the operation of the first head unit 4a until the board P is unloaded from the second mounting stage 23, and executes the correction operation by the board imaging unit 7 at a timing adjusted to be later than the normal timing after the board P is unloaded from the second mounting stage 23.

[0082] (Control process for adjusting timing of correction operation) With reference to FIG. 11, a control process relating to adjustment of the timing of the correction operation in the component mounting apparatus 100 of this embodiment will be described based on a flowchart.

[0083] 11, in step S11, the control unit 8 judges whether or not it is the first predetermined time before the correction operation. If the control unit 8 judges that it is not the first predetermined time before the correction operation, the control process ends. If the control unit 8 judges that it is the first predetermined time before the correction operation, the process proceeds to step S12.

[0084] Then, in step S12, the control unit 8 determines whether or not the tall component EA has been mounted on the board P on the second mounting stage 23. If the control unit 8 determines that the tall component EA has been mounted, the process proceeds to step S13.

[0085] Then, in step S13, the control unit 8 stops the operation of the first head unit 4a until the substrate P is carried out from the second mounting stage 23, and executes a correction operation by the substrate imaging unit 7 at a timing adjusted to be later than the normal timing after the substrate P is carried out from the second mounting stage 23. Then, the control process ends.

[0086] Moreover, in step S12, if the control unit 8 determines that the tall component EA has not been mounted, the process proceeds to step S14.

[0087] Then, in step S14, the control unit 8 determines whether or not the tall component EA will be mounted on the board P at the second mounting stage 23 by the normal timing for executing the correction operation. If the control unit 8 determines that the tall component EA will not be mounted on the board P, the process proceeds to step S15.

[0088] Then, in step S15, the control unit 8 executes a correction operation by the board imaging unit 7 at normal timing, and the control process is then terminated.

[0089] Moreover, in step S14, if the control unit 8 determines that a tall component EA is to be mounted on the board P, the process proceeds to step S16.

[0090] Then, in step S16, the control unit 8 determines whether or not the board P will be carried out from the second mounting stage 23 immediately after mounting the tall component EA. Specifically, the control unit 8 determines whether or not the board P will be carried out from the second mounting stage 23 during the period from when the tall component EA is mounted on the board P to the time a second predetermined time has elapsed. If the control unit 8 determines that the board P will be carried out from the second mounting stage 23 by the time the second predetermined time has elapsed, the process proceeds to step S17.

[0091] Then, in step S17, the control unit 8 stops the operation of the first head unit 4a until the substrate P is carried out from the second mounting stage 23, and executes a correction operation by the substrate imaging unit 7 at a timing adjusted to be later than the normal timing after the substrate P is carried out from the second mounting stage 23. Then, the control process ends.

[0092] Furthermore, in step S16, if the control unit 8 determines that the substrate P will not be carried out from the second mounting stage 23 by the time the second predetermined time has elapsed, the process proceeds to step S18.

[0093] Then, in step S18, the control unit 8 stops the operation of the second head unit 4b immediately before mounting the tall component EA on the board P, and executes a correction operation by the board imaging unit 7 at a timing adjusted to be earlier than the normal timing. Then, the control process ends.

[0094] (Effects of the first embodiment) In the first embodiment, the following effects can be obtained.

[0095] In the first embodiment, as described above, the first mounting stage 22, the second mounting stage 23, the first head unit 4a, and the second head unit 4b are provided. This makes it possible to efficiently mount the components E on the substrate P using the two mounting stages, the first mounting stage 22 and the second mounting stage 23, and the two head units, the first head unit 4a and the second head unit 4b, and therefore makes it possible to shorten the tact time required to mount the components E compared to the case of mounting the components E on the substrate P using a single head unit.

[0096] Here, when mounting the component E on the board P using both the first mounting stage 22 and the second mounting stage 23, the timings at which the mounting of the component E starts are different for each of the first mounting stage 22 and the second mounting stage 23, so that the first head unit 4a may approach the tall component EA after the tall component EA is mounted on the board P by the second head unit 4b. In this case, there is a risk of interference between the tall component EA and the first head unit 4a. For this reason, when there is a risk of interference between the tall component EA and the first head unit 4a, a configuration in which the component E is mounted on the board P using only one of the first mounting stage 22 and the second mounting stage 23 is also conceivable in order to avoid interference between the tall component EA and the first head unit 4a. However, in the case of a configuration in which the component E is mounted on the board P using only one of the first mounting stage 22 and the second mounting stage 23, the tact time required to mount the component E is longer than in the case of mounting the component E on the board P using both the first mounting stage 22 and the second mounting stage 23. In response to this, as described above, when the fixing position of the board P on each of the first mounting stage 22 and the second mounting stage 23 is the normal fixing position PA, and interference occurs between the tall component EA mounted on the board P on the second mounting stage 23 and the first head unit 4a, a control unit 8 is provided that sets the fixing position of the board P on the first mounting stage 22 to an interference avoidance position PB changed from the normal fixing position PA so as to prevent interference. As a result, even if interference occurs between the tall component EA and the first head unit 4a at the normal fixing position PA, interference between the tall component EA and the first head unit 4a is avoided by the interference avoidance position PB, and the component E can be mounted on the board P using both the first mounting stage 22 and the second mounting stage 23. As a result, the tact time required for mounting the component E can be effectively shortened.

[0097] Furthermore, in the first embodiment, as described above, the control unit 8 sets the fixing position of the substrate P on the first mounting stage 22 to an interference avoidance position PB, which is changed from the normal fixing position PA, so that the tall component EA is not positioned within the movement range RA of the first head unit 4a. This ensures that the tall component EA is not positioned within the movement range RA of the first head unit 4a, thereby reliably preventing interference between the tall component EA and the first head unit 4a.

[0098] Furthermore, in the first embodiment, as described above, the control unit 8 sets the fixing position of the substrate P on the first mounting stage 22 to an interference avoidance position PB changed from the normal fixing position PA by at least the distance D from the end of the movement range RA of the first head unit 4a to the tall component EA so that the tall component EA is not positioned within the movement range RA of the first head unit 4a. This makes it possible to easily set the interference avoidance position PB so that the tall component EA is not positioned within the movement range RA of the first head unit 4a, and therefore makes it possible to easily and reliably avoid interference between the tall component EA and the first head unit 4a.

[0099] In the first embodiment, as described above, when an area AR1 of the substrate P where the component E cannot be mounted by the first head unit 4a occurs due to changing the fixing position of the substrate P on the first mounting stage 22 from the normal fixing position PA to the interference avoidance position PB so that the tall component EA is not located within the moving range RA of the first head unit 4a, the control unit 8 mounts the component E in the area AR2 of the substrate P where interference occurs at the normal fixing position PA at the interference avoidance position PB, and mounts the component E in the remaining area AR3 of the substrate P at the normal fixing position PA. As a result, the component E is mounted in the area of ​​the substrate P where interference occurs at the normal fixing position PA at the interference avoidance position PB, so that interference between the tall component EA and the first head unit 4a can be avoided. In addition, since the component E is mounted in the remaining area of ​​the substrate P at the normal fixing position PA, even when the first head unit 4a cannot mount all of the components E at the interference avoidance position PB alone, the first head unit 4a can mount all of the components E. As a result, the components E can be mounted on the board P using both the first mounting stage 22 and the second mounting stage 23. As a result, even if the first head unit 4a cannot perform all of the mounting of the components E at the interference avoidance position PB alone, the components E can be mounted on the board P using both the first mounting stage 22 and the second mounting stage 23 while avoiding interference between the tall components EA and the first head unit 4a.

[0100] In the first embodiment, as described above, the first head unit 4a is further provided with a board imaging unit 7 that is provided in the first head unit 4a and captures a correction mark MA for position correction, and the control unit 8 checks the mounting state of the tall component EA at a timing of a first predetermined time before the normal timing of performing a correction operation to capture an image of the correction mark MA by the board imaging unit 7, and adjusts the timing of performing the correction operation based on the confirmed mounting state of the tall component EA so that interference between the tall component EA and the first head unit 4a does not occur during the correction operation. This makes it possible to appropriately adjust the timing of performing the correction operation, thereby making it possible to avoid interference between the tall component EA and the first head unit 4a during the correction operation.

[0101] Furthermore, in the first embodiment, as described above, if the control unit 8 determines, based on the confirmed mounting state of the tall component EA, that the tall component EA will be mounted on the board P on the second mounting stage 23 by the normal timing for executing the correction operation, it determines whether the board P will be removed from the second mounting stage 23 between the timing for mounting the tall component EA on the board P and the timing after the second specified time, and if it determines that the board P will be removed from the second mounting stage 23 by the timing after the second specified time, it adjusts the timing for executing the correction operation so that the correction operation is executed after the board P is removed from the second mounting stage 23, and if it determines that the board P will not be removed from the second mounting stage 23 by the timing after the second specified time, it adjusts the timing for executing the correction operation so that the correction operation is executed before the tall component EA is mounted on the board P. As a result, if the board P is unloaded from the second mounting stage 23 by the timing after the second predetermined time (i.e., if the board P on which the tall component EA is mounted is unloaded immediately after the tall component EA is mounted), the correction operation can be executed after the board P is unloaded from the second mounting stage 23. Also, if the board P is not unloaded from the second mounting stage 23 by the timing after the second predetermined time (i.e., if the board P on which the tall component EA is mounted is not unloaded immediately after the tall component EA is mounted), the correction operation can be executed before the tall component EA is mounted on the board P. As a result, the timing at which the correction operation is executed can be effectively adjusted, and therefore, interference between the tall component EA and the first head unit 4a during the correction operation can be effectively avoided.

[0102] Furthermore, in the first embodiment, as described above, when the control unit 8 determines based on the confirmed mounting state of the tall component EA that the tall component EA will not be mounted on the board P on the second mounting stage 23 by the normal timing for executing the correction operation, the control unit 8 sets the timing for executing the correction operation to the normal timing. This allows the correction operation to be executed normally if the tall component EA will not be mounted on the board P on the second mounting stage 23 by the time the correction operation is executed (i.e., even if the correction operation is executed at the normal timing, interference between the tall component EA and the first head unit 4a does not occur during the correction operation). As a result, it is possible to avoid the tact time required for mounting the component E from being extended due to adjustment of the timing of the correction operation.

[0103] Furthermore, in the first embodiment, as described above, when the control unit 8 determines that the tall component EA has been mounted on the board P at the second mounting stage 23 based on the confirmed mounting state of the tall component EA, the control unit 8 adjusts the timing of execution of the correction operation so that the correction operation is executed after the board P is unloaded from the second mounting stage 23. This makes it possible to reliably prevent interference between the tall component EA and the first head unit 4a during the correction operation, even when the tall component EA has been mounted on the board P.

[0104] [Second embodiment] Next, a second embodiment will be described with reference to Fig. 12 to Fig. 14. In this second embodiment, an example of a configuration that avoids interference between a tall part and a first head unit during a correction operation, which is different from the first embodiment, will be described. Note that the same configurations as those in the first embodiment are shown with the same reference numerals in the drawings, and the description thereof will be omitted.

[0105] (Component mounting system configuration) 12, a component mounting system 500 according to the second embodiment includes a component mounting apparatus 400 and a data creation apparatus 200. The component mounting apparatus 400 also includes a base 1, a board transport unit 2, a component supply unit 3, a first head unit 4a, a second head unit 4b, a head horizontal movement mechanism unit 5, a component imaging unit 6, a board imaging unit 7, a control unit 408, and a storage unit 9.

[0106] Similarly, in the case where the fixed position of the substrate P on each of the first mounting stage 22 and the second mounting stage 23 is the normal fixed position PA and interference occurs between the first head unit 4a and the tall component EA mounted on the substrate P on the second mounting stage 23, the control unit 408 of the second embodiment sets the fixed position of the substrate P on the first mounting stage 22 to an interference avoidance position PB changed from the normal fixed position PA so as to prevent interference. Note that the configuration relating to setting the fixed position PA of the substrate is similar to that of the control unit 8 of the first embodiment, and therefore a detailed description thereof will be omitted.

[0107] In addition, in the second embodiment, as shown in FIG. 13, when producing a substrate P in which a correction operation of imaging the correction mark MA by the substrate imaging unit 7 is performed, the control unit 408 mounts the component E on the substrate P by both the first head unit 4a and the second head unit 4b using only one of the first mounting stage 22 and the second mounting stage 23 (one-stage mounting), and when producing a substrate P in which a correction operation is not performed, the control unit 408 mounts the component E on the substrate P by the first head unit 4a using the first mounting stage 22, and also mounts the component E on the substrate P by the second head unit 4b using the second mounting stage 23 (two-stage mounting).

[0108] Specifically, the control unit 408 judges, for each production quantity of the boards P, whether or not the production is for a board P for which a correction operation of imaging the correction marks MA by the board imaging unit 7 is executed. If the control unit 408 judges that the production is for a board P for which a correction operation of imaging the correction marks MA by the board imaging unit 7 is executed, it performs one-stage mounting of the components E on the board P such that the tall components EA are mounted last. On the other hand, if the control unit 408 judges that the production is for a board P for which a correction operation is not executed, it performs two-stage mounting of the components E on the board P.

[0109] For example, if the production of the first board P is a board P on which a correction operation is performed, one-stage mounting of components E on the board P is performed for the first board P, such that the mounting order of tall components EA is last. Also, for example, if the production of the second board P is a board P on which a correction operation is not performed, two-stage mounting of components E on the board P is performed for the second board P. In this way, the presence or absence of a correction operation is determined for each number of boards P produced, and one-stage or two-stage mounting is performed depending on the presence or absence of the correction operation.

[0110] (Control process for adjusting timing of correction operation) With reference to FIG. 14, a control process relating to adjustment of the timing of the correction operation in the component mounting apparatus 100 of this embodiment will be described based on a flowchart.

[0111] 14, in step S21, control unit 408 determines whether or not a correction operation will be performed during production of the target substrate P. For example, control unit 408 compares the production timing of the target substrate P with the timing of the correction operation to determine whether or not a correction operation will be performed during production of the target substrate P. If control unit 408 determines that a correction operation will be performed during production of the target substrate P, the process proceeds to step S22.

[0112] Then, in step S22, the control unit 408 determines to perform one-stage mounting on the target substrate P. In this case, the control unit 408 performs one-stage mounting on the target substrate P.

[0113] Moreover, in step S21, if the control unit 408 determines that no corrective operation is being performed during production of the target substrate P, the process proceeds to step S23.

[0114] Then, in step S23, the control unit 408 determines to perform two-stage mounting on the target substrate P. In this case, the control unit 408 performs two-stage mounting on the target substrate P.

[0115] Other configurations of the second embodiment are similar to those of the first embodiment.

[0116] (Effects of the second embodiment) In the second embodiment, the following effects can be obtained.

[0117] In the second embodiment, as described above, the first head unit 4a is provided with a board imaging unit 7 that captures a correction mark MA for position correction, and the control unit 8 mounts the component E on the board P by both the first head unit 4a and the second head unit 4b using only one of the first mounting stage 22 and the second mounting stage 23 when producing a board P in which a correction operation for capturing an image of the correction mark MA is performed by the board imaging unit 7, and mounts the component E on the board P by the first head unit 4a using the first mounting stage 22, and mounts the component E on the board P by the second head unit 4b using the second mounting stage 23 when producing a board P in which a correction operation for capturing an image of the correction mark MA is performed by the board imaging unit 7. This makes it possible to avoid interference between the tall component EA and the first head unit 4a during the correction operation. Furthermore, in the case of production of a board P on which a correction operation is not performed, the components E are mounted on the board P by the first head unit 4a using the first mounting stage 22, and the components E are mounted on the board P by the second head unit 4b using the second mounting stage 23, so that the tact time required to mount the components E can be shortened compared to the case where the components E are mounted on the board P by both the first head unit 4a and the second head unit 4b using only one of the first mounting stage 22 and the second mounting stage 23. As a result, the tact time required to mount the components E can be shortened while avoiding interference between the tall components EA and the first head unit 4a during the correction operation.

[0118] Other effects of the second embodiment are similar to those of the first embodiment.

[0119] [Variations] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is indicated by the claims, not by the description of the embodiments above, and further includes all modifications (variations) within the meaning and scope of the claims.

[0120] For example, in the above first and second embodiments, the control unit of the data creation device creates the component mounting data, but the present invention is not limited to this. In the present invention, the control unit of the component mounting device may create the component mounting data.

[0121] In the above first and second embodiments, the fixing position of the substrate on the first mounting stage is changed from the normal fixing position to the interference avoidance position so that interference between the tall component and the first head unit does not occur, but the present invention is not limited to this. In the present invention, the fixing position of the substrate on the second mounting stage may be changed from the normal fixing position to the interference avoidance position so that interference between the tall component and the first head unit does not occur. In this case, the fixing position of the substrate on the second mounting stage may be changed from the normal fixing position to the interference avoidance position downstream in the substrate transport direction. Also, the fixing positions of the substrate on both the first and second mounting stages may be changed from the normal fixing position to the interference avoidance position.

[0122] In the above first and second embodiments, the imaging unit that captures the correction mark is a board imaging unit, but the present invention is not limited to this. In the present invention, the imaging unit that captures the correction mark may be an imaging unit other than the board imaging unit.

[0123] In the above first and second embodiments, an example has been shown in which the second mounting stage is movable in the Y direction, but the present invention is not limited to this. In the present invention, the second mounting stage does not have to be movable in the Y direction. In the present invention, the first mounting stage may be movable in the Y direction.

[0124] In the above first embodiment, for convenience of explanation, the processing operation of the control unit is explained using a flow-driven flowchart in which the processing is performed in order according to a processing flow, but the present invention is not limited to this. In the present invention, the processing operation of the control unit may be performed by event-driven processing in which processing is performed on an event-by-event basis. In this case, the processing may be performed completely event-driven, or may be performed in a combination of event-driven and flow-driven. [Explanation of symbols]

[0125] 4a First head unit 4b 2nd head unit 7. Substrate imaging section (imaging section) 22 First Implementation Stage 23 Second Implementation Stage 8, 408 Control section 100, 400 Component mounting equipment 200 Data Creation Device 201 Control section (data creation control section) AR1, AR2, AR3 area D Distance DA Component assembly data E Parts EA Tall Parts P board PA Normal fixed position PB Interference avoidance position RA Movement Range

Claims

1. a first mounting stage where an operation of mounting components on a board is performed; a second mounting stage that is disposed downstream of the first mounting stage in a transport direction of the board and in which an operation of mounting the components on the board is performed; a first head unit that mounts the components on the substrate at the first mounting stage; a second head unit that mounts the components, including tall components, on the substrate at the second mounting stage, the tall components being too thick for the first head unit to mount thereon; a control unit that, when interference occurs between the first head unit and the tall component mounted on the substrate at the second mounting stage when the fixing position of the substrate at each of the first and second mounting stages is at a normal fixing position, sets the fixing position of the substrate at at least one of the first and second mounting stages to an interference avoidance position that is changed from the normal fixing position so as to prevent the interference from occurring.

2. 2. The component mounting device according to claim 1, wherein the control unit sets a fixing position of the substrate on at least one of the first and second mounting stages to the interference avoidance position changed from the normal fixing position so that the tall component is not positioned within a movement range of the first head unit.

3. 3. The component mounting device of claim 2, wherein the control unit sets the fixing position of the substrate on at least one of the first and second mounting stages to the interference avoidance position changed from the normal fixing position by at least the distance from the end of the movement range of the first head unit to the tall component so that the tall component is not located within the movement range of the first head unit.

4. 3. The component mounting device of claim 2, wherein when an area of ​​the substrate on which the first head unit cannot mount the component is generated due to changing the fixing position of the substrate on the first mounting stage from the normal fixing position to the interference avoidance position so that the tall component is no longer located within the movement range of the first head unit, the control unit mounts the component in the area of ​​the substrate on which the interference would occur at the normal fixing position at the interference avoidance position, and mounts the component in the remaining area of ​​the substrate at the normal fixing position.

5. an imaging unit provided in the first head unit and configured to image a correction mark for position correction; 2. The component mounting device of claim 1, wherein the control unit checks the mounting state of the tall component at a timing of a first predetermined time before a normal timing at which a correction operation to image the correction mark is executed by the imaging unit, and adjusts the timing at which the correction operation is executed based on the confirmed mounting state of the tall component so that interference between the tall component and the first head unit does not occur during the correction operation.

6. The control unit is when it is determined based on the confirmed mounting state of the tall component that the tall component will be mounted on the board at the second mounting stage by the normal timing for executing the correction operation, it is determined whether the board will be removed from the second mounting stage during the period from the timing when the tall component is mounted on the board to a timing after a second predetermined time has elapsed; adjusting a timing for executing the correction operation so that the correction operation is executed after the substrate is unloaded from the second mounting stage when it is determined that the substrate will be unloaded from the second mounting stage by the timing after the second predetermined time; 6. The component mounting device of claim 5, further comprising: an adjusting unit that adjusts a timing for performing the correction operation so that the correction operation is performed before the tall component is mounted on the substrate when it is determined that the substrate will not be removed from the second mounting stage by the timing after the second specified time.

7. 6. The component mounting device of claim 5, wherein when the control unit determines, based on the confirmed mounting state of the tall component, that the tall component will not be mounted on the board in the second mounting stage by the normal timing for executing the correction operation, the timing for executing the correction operation is the normal timing.

8. 6. The component mounting device of claim 5, wherein when the control unit determines that the tall component has been mounted on the board at the second mounting stage based on the confirmed mounting state of the tall component, the control unit adjusts the timing at which the correction operation is performed so that the correction operation is performed after the board is removed from the second mounting stage.

9. an imaging unit provided in the first head unit and configured to image a correction mark for position correction; 2. The component mounting device of claim 1, wherein the control unit mounts the component on the substrate by both the first and second head units using only one of the first and second mounting stages when producing the substrate in which a correction operation of imaging the correction mark by the imaging unit is performed, and when producing the substrate in which the correction operation is not performed, mounts the component on the substrate by the first head unit using the first mounting stage, and also mounts the component on the substrate by the second head unit using the second mounting stage.

10. a data creation control unit that creates component mounting data for a component mounting device that includes a first mounting stage where an operation of mounting components on a board is performed, a second mounting stage that is disposed downstream of the first mounting stage in a transport direction of the board and where an operation of mounting the components on the board is performed, a first head unit that mounts the components on the board at the first mounting stage, and a second head unit that mounts the components on the board at the second mounting stage, the second head unit including tall components that cannot be mounted by the first head unit due to their large thickness, The data creation control unit creates the component mounting data by changing the fixing position of the substrate on at least one of the first and second mounting stages from the normal fixing position to an interference avoidance position so as to prevent interference when interference occurs between the first head unit and the tall component mounted on the substrate on the second mounting stage when the fixing position of the substrate on each of the first and second mounting stages is at a normal fixing position, in order to prevent the interference from occurring.

11. a step of mounting the components on the substrate in a component mounting device including a first mounting stage where an operation of mounting components on a substrate is performed, a second mounting stage that is disposed downstream of the first mounting stage in a substrate transport direction and where an operation of mounting the components on the substrate is performed, a first head unit that mounts the components on the substrate at the first mounting stage, and a second head unit that mounts the components, including tall components that cannot be mounted by the first head unit due to their large thickness, on the substrate at the second mounting stage, A component mounting method, wherein the step of mounting the component on the substrate includes, when interference occurs between the tall component mounted on the substrate at the second mounting stage and the first head unit when the fixing position of the substrate on each of the first and second mounting stages is a normal fixing position, setting the fixing position of the substrate on at least one of the first and second mounting stages to an interference avoidance position changed from the normal fixing position so as to prevent the interference from occurring.

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