Method of parallelly assembling discrete components on substrate
JP2025020296A5Active Publication Date: 2025-11-26キューリック·アンド·ソファ·ネザーランズ·ベーフェー
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Patent Information
- Application Number
- JP2024192893
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2017-06-12
- Filing Date
- 2024-11-01
- Publication Date
- 2025-11-26
- Estimated Expiration
- 2038-04-25
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Abstract
To assemble discrete components on a substrate.SOLUTION: A method for transferring a plurality of discrete components from a first substrate to a second substrate, includes a step of illuminating a plurality of regions on a top surface of a dynamic release layer adhering the plurality of discrete components to the first substrate, each of the irradiated regions being aligned with a corresponding one of the discrete components. The illuminating induces plastic deformation in each of the irradiated regions of the dynamic release layer. The plastic deformation causes at least a part of the discrete components to be concurrently released from the first substrate.SELECTED DRAWING: Figure 2B
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