Manifold

Abstract

To provide a manifold having a plurality of flow channels and hard to cause a brazing failure.SOLUTION: A manifold 100 brazed to a support plate 20 includes a flow passage housing 10 in which a plurality of flow channels L through which fluid flows are formed and which has a plurality of ribs 31 each partitioning the plurality of flow channels L. In a portion other than the plurality of flow channels L, air escape structure for letting air out is formed.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a manifold. [Background technology]

[0002] A system for thermal management of a vehicle's air conditioning system and the like is known (see, for example, Patent Document 1). Patent Document 1 discloses a thermal management system including a compressor that compresses low-temperature refrigerant vapor in a subsystem into high-temperature refrigerant vapor.

[0003] In the thermal management system disclosed in Patent Document 1, for example, if a high-temperature flow path through which high-temperature refrigerant vapor compressed by a compressor flows and a low-temperature flow path through which low-temperature refrigerant vapor flows are arranged close to each other, there is a risk of heat exchange occurring between the high-temperature refrigerant and the low-temperature refrigerant. In order to address this issue, a manifold in which multiple flow paths are formed may be provided in the thermal management system. The manifold is fixed, for example, by brazing to a support plate of the thermal management system. Here, "brazing" refers to melting an alloy (brazing material) with a lower melting point than the members (base materials) to be joined and using it as a kind of adhesive to join multiple members without melting the base materials themselves. In this type of "brazing", the joining surfaces are formed in a shape that is exposed to the outside air, and the brazing is performed in a deoxidized atmosphere, since the adhesiveness decreases when an oxide film is formed on the surfaces of the members to be joined.

[0004] However, when brazing components that may have residual oxygen on the inside of the joining surface, the residual oxygen inside the joining surface may act on the joining surface, in which case an oxide film is formed on the surface, reducing brazing properties. Therefore, the technology described in Patent Document 2 shows a method of filling the inside of the components to be joined with nitrogen gas or inert gas, and then brazing the components to be joined to the components to be joined. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2011-255879 A [Patent Document 2] Japanese Patent Application Publication No. 10-277730 Summary of the Invention [Problem to be solved by the invention]

[0006] However, in the case where a plurality of flow paths needs to be formed in a manifold as in the thermal management system disclosed in Patent Document 1, when the plurality of flow paths are arranged compactly so that the length of each flow path is short, an air pocket that is not exposed to the outside air may be formed in the manifold. It is difficult to fill such an air pocket with nitrogen gas or the like as in the technology described in Patent Document 2. For this reason, when brazing the manifold, if an oxide film is formed on the surface of the members to be joined due to oxygen remaining in the air pocket, brazing failure occurs in the manifold. Therefore, in a manifold in which a plurality of flow paths are formed, there is room for improvement in brazing and fixing to the members to be joined.

[0007] Therefore, there is a need for a manifold that has a plurality of flow paths and is less susceptible to brazing defects. [Means for solving the problem]

[0008] A manifold according to the present invention is characterized in that it is a manifold brazed to a support plate, has a plurality of flow paths formed therein through which fluid flows, and is provided with a flow path housing having a plurality of ribs which separate each of the plurality of flow paths, and has an air vent structure formed in an area other than the plurality of flow paths which allows air to escape.

[0009] According to this configuration, the manifold has an air vent structure formed in a portion other than the multiple flow paths, so the manifold can be configured to be less likely to form air pockets while maintaining the functionality of the multiple flow paths. This makes it easier to fill the manifold with nitrogen gas or the like when brazing it to the support plate, and inhibits the formation of an oxide film due to air present in the air pockets, thereby preventing brazing defects. As a result, the manifold can be stably fixed to the support plate by brazing it to the support plate. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a diagram showing a refrigerant circuit according to an embodiment. [Diagram 2] 5A and 5B are schematic diagrams illustrating a flow path housing and a plate member according to the embodiment. [Diagram 3] 5A and 5B are diagrams illustrating a configuration of a flow path housing according to the embodiment. [Figure 4] FIG. 4 is a diagram showing the configuration of the back surface side of the manifold according to the embodiment. [Diagram 5] FIG. 13 is a diagram showing the configuration of the rear surface side of a manifold of a comparative example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A manifold according to an embodiment of the present invention will now be described with reference to the drawings. However, the present invention is not limited to the following embodiments, and various modifications are possible without departing from the spirit of the present invention.

[0012] [Refrigerant circuit] First, a refrigerant circuit C mounted on a vehicle such as an electric vehicle, a hybrid vehicle, or a fuel cell vehicle will be described with reference to Fig. 1. The refrigerant circuit C is configured with a refrigerant flow path L through which a refrigerant F1 (an example of a fluid) for heating and cooling that adjusts the temperature inside the vehicle flows. The refrigerant F1 is, for example, a hydrofluorocarbon (HFC) or a hydrofluoroolefin (HFO). The refrigerant flow path L is configured with a manifold 100 (see Figs. 2 and 3) mounted on the vehicle.

[0013] 1, the refrigerant circuit C includes a compressor 1, a cabin condenser 2 (a heating condenser), a water-cooled condenser 3 (a condenser), an evaporator 4, a battery cooler 5 (an example of an evaporator), an accumulator 6, and a valve V. The compressor 1, the cabin condenser 2, the water-cooled condenser 3, the evaporator 4, the battery cooler 5, the accumulator 6, and the valve V are connected via a refrigerant flow path L.

[0014] The valve V includes an on-off valve V1 (an example of a switching valve) provided between the water-cooled condenser 3 and the accumulator 6. The valve V further includes a first expansion valve VE1 provided between the cabin condenser 2 and the water-cooled condenser 3, and a second expansion valve VE2 provided between the water-cooled condenser 3 and the evaporator 4.

[0015] The on-off valve V1 controls (passes or blocks) the flow of the refrigerant F1 between the water-cooled condenser 3 and the accumulator 6. When the on-off valve V1 is open, the refrigerant F1 flows in the following order: compressor 1, cabin condenser 2, first expansion valve VE1, water-cooled condenser 3, on-off valve V1, accumulator 6, and compressor 1. Hereinafter, the refrigerant circuit C consisting of the compressor 1, cabin condenser 2, water-cooled condenser 3, on-off valve V1, and accumulator 6 will be referred to as the "main circuit Cm."

[0016] The first expansion valve VE1 and the second expansion valve VE2 expand the refrigerant F1 to adjust the pressure of the refrigerant F1. When the second expansion valve VE2 is opened, the refrigerant F1 flows through the second expansion valve VE2 and the evaporator 4 in this order, and then flows into the main circuit Cm between the on-off valve V1 and the accumulator 6. Hereinafter, the refrigerant circuit C that branches off from the main circuit Cm and includes the second expansion valve VE2 and the evaporator 4 is referred to as the "first branch circuit Cb1." For example, when the temperature inside the vehicle cabin is increased (when the vehicle cabin is heated), the on-off valve V1 is opened and the second expansion valve VE2 is closed. On the other hand, when the temperature inside the vehicle cabin is decreased (when the vehicle cabin is cooled), the on-off valve V1 is closed and the second expansion valve VE2 is opened.

[0017] The battery cooler 5 includes an expansion valve, and the expansion valve of the battery cooler 5 is opened when adjusting the temperature of the battery. When the expansion valve of the battery cooler 5 is opened, the refrigerant F1 flows through the battery cooler 5 and then flows into the main circuit Cm between the on-off valve V1 and the accumulator 6. Hereinafter, the refrigerant circuit C that branches off from the main circuit Cm and in which the battery cooler 5 is provided is referred to as the "second branch circuit Cb2."

[0018] The compressor 1 compresses the refrigerant F1 to make the refrigerant F1 into a high-pressure gas. Hereinafter, the temperature of the refrigerant F1 compressed by the compressor 1 is referred to as a first heat medium temperature. The first heat medium temperature is, for example, 80 degrees to 90 degrees.

[0019] The refrigerant F1 compressed by the compressor 1 is sent to the cabin condenser 2, where it exchanges heat with the air in the vehicle cabin during heating operation (the temperature is reduced by removing heat), and is then sent to the water-cooled condenser 3 via the first expansion valve VE1. In the water-cooled condenser 3, a first heat medium F2 circulating in a circuit (for example, a cooling circuit for cooling electronic circuits mounted on a vehicle) separate from the refrigerant circuit C flows. The first heat medium F2 is a refrigerant such as cooling water such as long-life coolant (LLC), insulating oil such as paraffin, hydrofluorocarbon (HFC), hydrofluoroolefin (HFO), etc. The refrigerant F1 sent to the water-cooled condenser 3 exchanges heat with the first heat medium F2 flowing through the water-cooled condenser 3 (the temperature is reduced by removing heat). Hereinafter, the temperature of the refrigerant F1 after being cooled by the water-cooled condenser 3 is referred to as the second heat medium temperature. The second heat medium temperature is, for example, 60 degrees to 85 degrees, and the refrigerant F1 after being cooled by the water-cooled condenser 3 is a high-pressure liquid.

[0020] The refrigerant F1 sent to the second expansion valve VE2 is expanded into a mixed liquid and gas state (atomized) and sent to the evaporator 4. Hereinafter, the temperature of the refrigerant F1 after being expanded by the second expansion valve VE2 is referred to as the third heat medium temperature. The third heat medium temperature is, for example, 15°C to 25°C. In the evaporator 4, the refrigerant F1 exchanges heat with air introduced from the outside (removes heat and increases temperature) and is vaporized.

[0021] The refrigerant F1 sent to the battery cooler 5 is expanded by the expansion valve of the battery cooler 5. In the battery cooler 5, a second heat medium F3 circulating in a circuit (for example, a cooling circuit for cooling a battery mounted on a vehicle) other than the refrigerant circuit C flows. The second heat medium F3 is a refrigerant such as cooling water such as long-life coolant (LLC), insulating oil such as paraffin, hydrofluorocarbon (HFC), hydrofluoroolefin (HFO), etc. The refrigerant F1 sent to the battery cooler 5 exchanges heat (takes heat and increases temperature) with the second heat medium F3 flowing through the battery cooler 5 and evaporates. Hereinafter, the temperature of the refrigerant F1 after heat exchange in the evaporator 4 or the battery cooler 5 is referred to as a fourth heat medium temperature. The fourth heat medium temperature is, for example, 15 degrees to 25 degrees.

[0022] The refrigerant F1 after heat exchange in the evaporator 4 is sent to the accumulator 6, where the liquid contained in the refrigerant F1 is separated. The refrigerant F1 from which the liquid has been separated returns to the compressor 1. In addition, the refrigerant F1 after heat exchange in the battery cooler 5 is also sent to the accumulator 6, where the liquid contained in the refrigerant F1 is separated. The refrigerant F1 from which the liquid has been separated returns to the compressor 1.

[0023] As described above, the temperature of the refrigerant F1 flowing through the refrigerant flow path L in the refrigerant circuit C changes. In detail, the temperature of the refrigerant F1 flowing from the compressor 1 to the water-cooled condenser 3 (first heat medium temperature) is the highest, the temperature of the refrigerant F1 flowing from the water-cooled condenser 3 to the second expansion valve VE2 and / or the battery cooler 5 (second heat medium temperature) is the next highest, and the temperature of the refrigerant F1 flowing from the second expansion valve VE2 to the evaporator 4 (third heat medium temperature) and the temperature of the refrigerant F1 flowing from the evaporator 4 and / or the battery cooler 5 to the accumulator 6 (fourth heat medium temperature) are the lowest. For this reason, hereinafter, the first heat medium temperature is referred to as "high temperature", the second heat medium temperature is referred to as "medium temperature", and the third heat medium temperature and the fourth heat medium temperature are referred to as "low temperature".

[0024] [Manifold configuration] Next, the configuration of the manifold 100 in which the refrigerant flow path L described with reference to Fig. 1 is formed will be described with reference to Fig. 2 and Fig. 3. Fig. 2 and Fig. 3 are diagrams showing the configuration of the manifold 100. Note that Fig. 3 is a diagram showing the flow path housing 10 as viewed from the opposite side to the plate member 20, and shows a cross section with a surface wall provided on the opposite side of the flow path housing 10 to the plate member 20 removed.

[0025] 2 and 3, the manifold 100 includes a flow path housing 10, and ribs 31 (described later) are brazed to a plate member 20 (an example of a support plate). In this embodiment, the plate member 20 has a rectangular shape in a plan view (see FIG. 3), and each of the flow path housing 10 and the plate member 20 is made of a metal (including an alloy) containing aluminum.

[0026] [Configuration of flow path housing] The flow path housing 10 is separated into two parts. Hereinafter, one of the two flow path housings 10 will be referred to as the "first housing 11" and the other will be referred to as the "second housing 12". The first housing 11 and the second housing 12 are spaced apart and joined to the plate member 20. Each of the first housing 11 and the second housing 12 is joined to the plate member 20 by, for example, brazing, bolts, or the like.

[0027] By joining the flow path housing 10 to the plate member 20, the refrigerant flow path L described with reference to Fig. 1 is formed between the flow path housing 10 and the plate member 20 (see Fig. 3). In addition, a part of the heat medium flow path R is also formed in the flow path housing 10 near the water-cooled condenser 3. In the heat medium flow path R, a first heat medium F2 (see Fig. 1) that is to exchange heat with the refrigerant F1 in the water-cooled condenser 3 flows.

[0028] [Configuration of Coolant Flow Path] As shown in FIG. 3, the refrigerant flow path L (an example of "multiple flow paths") includes a high-temperature flow path LH, a medium-temperature flow path LM, and a low-temperature flow path LL. The high-temperature flow path LH is a flow path through which the refrigerant F1 at a first heat medium temperature (high temperature) flows from the compressor 1 to the water-cooled condenser 3. The medium-temperature flow path LM is a flow path through which the refrigerant F1 at a second heat medium temperature (medium temperature) flows from the water-cooled condenser 3 to the second expansion valve VE2 and / or the battery cooler 5. The low-temperature flow path LL is a flow path through which the refrigerant F1 at a third heat medium temperature (low temperature) flows from the second expansion valve VE2 to the evaporator 4, and the refrigerant F1 at a fourth heat medium temperature (low temperature) flows from the evaporator 4 and / or the battery cooler 5 to the accumulator 6. The low-temperature flow path LL includes a first low-temperature flow path LL1 and a second low-temperature flow path LL2. The first low-temperature flow path LL1 is a flow path through which the refrigerant F1 flows from the second expansion valve VE2 to the evaporator 4. The second low-temperature flow path LL2 is a flow path through which the refrigerant F1 flows from the evaporator 4 and / or the battery cooler 5 to the accumulator 6.

[0029] The compressor 1, the cabin condenser 2, the water-cooled condenser 3, the evaporator 4, the battery cooler 5, the accumulator 6, and the valve V (the on-off valve V1, the first expansion valve VE1, and the second expansion valve VE2) are provided outside the flow path housing 10. Therefore, the flow path housing 10 has an inlet and an outlet through which the refrigerant F1 flows between the compressor 1, the cabin condenser 2, the water-cooled condenser 3, the evaporator 4, the battery cooler 5, the accumulator 6, and the valve V.

[0030] Hereinafter, the inlets through which the refrigerant F1 flows from each of the compressor 1, the cabin condenser 2, the water-cooled condenser 3, the evaporator 4, and the battery cooler 5 into the flow path housing 10 are referred to as the "first inlet Pa1," the "second inlet Pa2," the "third inlet Pa3," the "fourth inlet Pa4," and the "fifth inlet Pa5," respectively (see FIG. 3). In addition, the inlets through which the refrigerant F1 flows into the flow path housing 10 from each of the on-off valve V1, the first expansion valve VE1, and the second expansion valve VE2 are referred to as the "sixth inlet Pa6," the "seventh inlet Pa7," and the "eighth inlet Pa8," respectively (see FIG. 3). In addition, the outlets through which the refrigerant F1 flows out of the flow path housing 10 toward each of the on-off valve V1, the first expansion valve VE1, and the second expansion valve VE2 are referred to as the "sixth outlet Pb6," the "seventh outlet Pb7," and the "eighth outlet Pb8," respectively (see FIG. 3).

[0031] The refrigerant flow path L through which the refrigerant F1 flows from the accumulator 6 to the compressor 1 is provided outside the flow path housing 10. For this reason, the flow path housing 10 does not have an inlet through which the refrigerant F1 flows from the accumulator 6 into the flow path housing 10 and an outlet through which the refrigerant F1 flows from the flow path housing 10 to the compressor 1.

[0032] In the following, for convenience of explanation, as shown in FIG. 3, the direction toward the second inlet Pa2 as viewed from the center O of the plate member 20 is referred to as the "X1 direction", the opposite direction is referred to as the "X2 direction", and the direction along the X1 and X2 directions is referred to as the "X direction". Also, the direction toward the fourth inlet Pa4 as viewed from the center O of the plate member 20 is referred to as the "Y1 direction", the opposite direction is referred to as the "Y2 direction", and the direction along the Y1 and Y2 directions is referred to as the "Y direction". The X direction and the Y direction are perpendicular to each other. Also, the center O of the plate member 20 is the intersection of the diagonals of the plate member 20.

[0033] [Configuration of the first housing] Next, the configuration of the first housing 11 will be described with reference to FIG.

[0034] [Flow path of the first housing] 3, a high temperature flow path LH and a second low temperature flow path LL2 are provided (formed) in the first housing 11. The high temperature flow path LH includes a first high temperature flow path LH1 through which the refrigerant F1 flows from the compressor 1 to the cabin condenser 2, and a second high temperature flow path LH2 through which the refrigerant F1 flows from the cabin condenser 2 to the water-cooled condenser 3 via the first expansion valve VE1.

[0035] The first high-temperature flow passage LH1 extends in an L shape from a first inlet Pa1 provided at the end of the first housing 11 in the X1 direction to a first outlet Pb1 provided at the end of the first housing 11 in the Y1 direction.

[0036] The second high-temperature flow passage LH2 has a base end at a second inlet Pa2 provided at the end of the first housing 11 in the Y1 direction, and extends to a second outlet Pb2 provided at the end in the X2 direction. More specifically, the second high-temperature flow passage LH2 includes a first high-temperature extension LHa extending from the second inlet Pa2 to the seventh outlet Pb7 along the Y direction, a second high-temperature extension LHb extending from the seventh inlet Pa7 to the Y1 direction and the X2 direction, and a third high-temperature extension LHc extending from the end of the second high-temperature extension LHb to the second outlet Pb2 along the X direction. The first high-temperature extension LHa extends to a position in the Y2 direction as viewed from the second low-temperature flow passage LL2. That is, the second high-temperature extension LHb and the third high-temperature extension LHc are located in the Y2 direction as viewed from the second low-temperature flow passage LL2.

[0037] The second low-temperature flow passage LL2 extends in a T-shape from a fourth inlet Pa4 provided at an end of the first housing 11 in the X2 direction and the Y1 direction to a fifth inlet Pb5 and a sixth inlet Pa6. The fifth inlet Pa5 and the fifth outlet Pb5 are provided at an end of the first housing 11 in the Y1 direction. The fourth inlet Pa4, the fifth inlet Pa5, and the fifth outlet Pb5 are provided in this order along the X1 direction.

[0038] [Air vent structure of the first housing] Fig. 4 shows a manifold 100 of the embodiment. Fig. 5 shows a manifold 200 of a comparative example. The air vent structure of the first housing 11 shown in Fig. 4 will be described with reference to the first housing 111 of the manifold 200 of the comparative example shown in Fig. 5.

[0039] As shown in Figs. 4 and 5, the first housing 11 (111) has a plurality of ribs 31 provided on a surface facing the plate member 20. In the first housing 11 (111), the plurality of ribs 31 are provided so as to surround the refrigerant flow passage L. In the first housing 111 (Fig. 5), a plurality of surfaces 61 to 68 are provided in a region surrounded by the plurality of ribs 31. The surface 61 is provided at an end (the end on the X1 side and the Y1 side) adjacent to the first high-temperature flow passage LH1. The surfaces 62 to 65 are provided at a region adjacent to the second low-temperature flow passage LL2 or the second high-temperature flow passage LH2 near the center of the first housing 11. The surfaces 66 to 68 are provided at a region adjacent to the second high-temperature extension portion LHb of the second high-temperature flow passage LH2 near the X2 direction of the first housing 11. Furthermore, a through hole 81 is formed in a region between the first high temperature flow path LH1 and the second low temperature flow path LL2, and a through hole 82 is formed in a region between the second low temperature flow path LL2 and the surface portion 66. In this case, in the first housing 111 (FIG. 5), air pockets are likely to occur in regions where the surfaces 61-65 and the surfaces 66-68 are close to each other.

[0040] Therefore, in the first housing 11 shown in FIG. 4, a through hole 41 is formed in a portion corresponding to the surface portion 61 (FIG. 5). In addition, in the first housing 11, in a portion corresponding to the surfaces 62 to 64, the rib 31 interposed between the surfaces 62, 63, and 64 is removed to form one surface portion 52 (an example of a communication passage). As a result, the surface portion 52 communicates with the through hole 42 formed between the first high-temperature flow passage LH1 and the second low-temperature flow passage LL2. In addition, in the manifold 100 in this embodiment, the surface portion 52 divides the first high-temperature flow passage LH1 and the second low-temperature flow passage LL2, which are two adjacent flow passages through which fluids of different temperatures flow.

[0041] In addition, in the first housing 11, the rib 31 on the Y2 side is removed at a portion corresponding to the surface portion 65 to form a surface portion 53 (an example of a communication passage) that communicates with the outside. In this embodiment, in order to reduce the weight of the first housing 11, the rib 31 is not provided on the Y1 side of the through hole 42.

[0042] In the first housing 11, a through hole 43 is formed in a portion of a portion corresponding to the surface portion 66 (FIG. 5), and the remaining portion becomes the surface portion 54 (an example of a communication passage). In the portion corresponding to the surface portion 67 (FIG. 5), a through hole 44 is formed in a portion, and the remaining portion becomes the surface portion 55 (an example of a communication passage). As a result, in the first housing 11, the surface portion 54 communicates with the through hole 43, and the surface portion 55 communicates with the through hole 44. In addition, the rib 32 disposed between the surface portion 54 and the surface portion 55 has a notch 56 formed in the middle portion, and the surface portion 54 and the surface portion 55 are continuous through the notch 56. In addition, the rib 33 is provided on the Y1 side with respect to the surface portion 55 and extends in the X direction, and the rib 33 has a gap G (notch 56) between the rib 33 and the rib 32. As a result, the surface portion 55 communicates with the outside through the gap G. Furthermore, in first housing 11, a through hole 45 is formed in a portion corresponding to surface portion 68 (FIG. 5).

[0043] In this embodiment, the through hole 43 is formed in a part of the portion corresponding to the surface portion 66 (FIG. 5), and the remaining portion becomes the surface portion 54 (an example of a communication passage). The through hole 44 is formed in a part of the portion corresponding to the surface portion 67 (FIG. 5), and the remaining portion becomes the surface portion 55 (an example of a communication passage). In addition, the rib 32 arranged between the surface portion 54 and the surface portion 55 has a notch 56 formed in the middle, the surface portion 54 and the surface portion 55 are continuous through the notch 56, and the rib 33 has a gap G (notch 56) between the rib 32. Originally, the rib 31 connected to the notch 56 may be removed and all of the rib 33 may be a through hole, but in this embodiment, a support bracket (not shown) for the on-off valve V1 is attached as shown in FIG. 3, and the periphery of the notch 56 is required to have the strength to support the weight of the on-off valve V1, so the notch 56 is adopted.

[0044] [Configuration of the second housing] Next, the configuration of the second housing 12 will be described with reference to FIG.

[0045] [Flow path of second housing] 3, a medium temperature flow passage LM and a first low temperature flow passage LL1 are provided in the second housing 12. The medium temperature flow passage LM has a third inlet Pa3 provided at the end of the second housing 12 in the X1 direction and the Y2 direction as a base end, and extends through a sixth outlet Pb6 to an eighth outlet Pb8 and a fourth outlet Pb4 provided at the end of the second housing 12 in the Y1 direction.

[0046] The first low-temperature flow passage LL1 has the eighth inlet Pa8 as a base end and extends along the Y direction to a third outlet Pb3 provided at the Y1-direction end of the second housing 12. The third outlet Pb3 is located in the X2 direction as viewed from the fourth outlet Pb4.

[0047] [Air vent structure of second housing] The air vent structure of the second housing 12 of the manifold 100 shown in FIG. 4 will also be described with reference to the second housing 112 of the manifold 200 of the comparative example shown in FIG.

[0048] As shown in FIG. 4 and FIG. 5, the second housing 12 (112) has a plurality of ribs 31 provided on a surface facing the plate member 20. In the second housing 12 (112), the plurality of ribs 31 are provided so as to surround the refrigerant flow passage L. In the second housing 112 (FIG. 5), a plurality of surface portions 69 to 73 are provided in a portion surrounded by the plurality of ribs 31. The surface portion 69 is provided at an end portion (the end portions on the X1 side and the Y1 side) adjacent to the medium temperature flow passage LM. The surface portion 70 is provided in a portion between the medium temperature flow passage LM and the first low temperature flow passage LL1. The surface portions 71 to 73 are provided in a dispersed manner in a portion on the Y2 side of the first low temperature flow passage LL1 and on the X2 side of the medium temperature flow passage LM. In addition, a through hole 83 is formed in a portion between the medium temperature flow passage LM and the first low temperature flow passage LL1. In addition, a through hole 84 is formed from the X2 side of the medium temperature flow passage LM to the Y2 side of the first low temperature flow passage LL1. In this case, air pockets are likely to occur on the surfaces 69, 70, 72, and 73 of the second housing 112 (FIG. 5).

[0049] Therefore, in the second housing 12 shown in FIG. 4, a through hole 46 is formed in a portion of the surface portion 69 (FIG. 5). In the second housing 12, in a portion corresponding to the surfaces 70 and 71, the rib 31 interposed between the surface portion 70 and the surface portion 71 is removed to form one surface portion 57 (an example of a communication passage). In addition, in the second housing 12, in a portion corresponding to the through hole 84 and the surface portion 72 and the surface portion 73, the rib 31 interposed between the through hole 84 and the surface portion 72 and the surface portion 73 is removed to form one through hole 48. As a result, in the second housing 12, the surface portion 57 communicates with the through hole 47 and the through hole 48 formed between the medium temperature flow passage LM and the first low temperature flow passage LL1. In addition, in the manifold 100 in this embodiment, the surface portion 57 divides the medium temperature flow passage LM and the first low temperature flow passage LL1, which are two adjacent flow passages through which fluids of different temperatures flow, respectively. In this embodiment, in order to reduce the weight of the second housing 12, the rib 31 is not provided on the Y1 side of the through hole 47.

[0050] [Plate configuration] Next, the configuration of the plate member 20 will be described with reference to Fig. 2. As shown in Fig. 2, the plate member 20 has a flat opposing surface 21 (main surface) that faces the flow path housing 10, a groove portion 22 that is recessed in a direction away from the flow path housing 10 with respect to the opposing surface 21, and a heat insulating material 23 disposed in the groove portion 22.

[0051] The opposing surface 21 of the plate member 20 includes a portion where the first housing 11 and the second housing 12 are separated in the X direction, i.e., a non-opposing region 21R that does not face either the first housing 11 or the second housing 12. The groove portion 22 is provided in the non-opposing region 21R. As described above, the heat insulating material 23 is disposed in the groove portion 22. This suppresses heat conduction through the plate member 20. The heat insulating material 23 is made of a resin or the like having a lower thermal conductivity than the plate member 20.

[0052] According to the manifold 100 of this embodiment, the first housing 11, in which the high-temperature flow path LH through which the high-temperature refrigerant F1 flows, and the second housing 12, in which the medium-temperature flow path LM through which the medium-temperature refrigerant F1, which is lower in temperature than the high-temperature refrigerant F1, flows, are formed, are separated (separated) and joined to the plate member 20. That is, since the first housing 11 and the second housing 12 are not integral and are separated from each other, air with low thermal conductivity is interposed between the first housing 11 and the second housing 12. Therefore, heat exchange between refrigerants F1 of different temperatures can be suppressed.

[0053] Furthermore, according to this embodiment, the refrigerant F1 flowing from the compressor 1 to the water-cooled condenser 3 flows through the high temperature flow path LH, and the refrigerant F1 flowing from the water-cooled condenser 3 to the evaporator 4 and / or battery cooler 5, which has a lower temperature than the refrigerant F1 in the high temperature flow path LH, flows through the medium temperature flow path LM. This makes it possible to suppress heat exchange between the refrigerant F1 flowing from the compressor 1 to the water-cooled condenser 3 and the refrigerant F1 flowing from the water-cooled condenser 3 to the evaporator 4 and / or battery cooler 5.

[0054] Furthermore, according to this embodiment, a groove 22 is formed in the plate member 20 between the first housing 11 and the second housing 12, and a heat insulating material 23 is disposed in the groove 22. Therefore, it is possible to suppress heat conduction between the first housing 11 and the second housing 12 via the plate member 20.

[0055] [Another embodiment] The present invention may be configured as follows other than the above-described embodiment (common numbers and symbols as in the embodiment are used to designate components having the same functions as in the embodiment).

[0056] (1) The shapes and positions of the refrigerant flow paths L (high temperature flow path LH, medium temperature flow path LM, and low temperature flow path LL) described in the above embodiment are just examples, and the refrigerant flow paths L are not limited to the shapes and positions described in the above embodiment.

[0057] (2) The flow passage housing 10 may be configured as an integrated unit in which the first housing 11 and the second housing 12 are connected to each other.

[0058] (3) In the present embodiment, the plate member 20 has the groove portion 22 and the insulating material 23 disposed in the groove portion 22. However, the plate member 20 may omit the groove portion 22 and the insulating material 23. In this case, it is preferable to select a material with low thermal conductivity as the material for the plate member 20.

[0059] (4) In the present embodiment, the refrigerant circuit C (second branch circuit Cb2) is provided with the battery cooler 5. However, the refrigerant circuit C may be provided with a chiller instead of the battery cooler 5. When the refrigerant circuit C is provided with a chiller instead of the battery cooler 5, the refrigerant circuit C further includes an expansion valve as a valve V between the water-cooled condenser 3 and the chiller.

[0060] (5) In this embodiment, the refrigerant F1 has been described as an example of a cooling fluid. However, the present invention may also use a fluid other than the refrigerant F1, such as cooling water such as long-life coolant (LLC), or insulating oil such as paraffin.

[0061] (6) In the present embodiment, the plate member 20 is rectangular. However, the shape of the plate member 20 is not limited to a rectangular shape and can be changed as appropriate.

[0062] [Summary of the above embodiment] The above-described embodiment will now be outlined.

[0063] (1) The manifold (100) is brazed to a support plate (20), and is provided with a flow path housing (10) having a plurality of flow paths (L) through which a fluid flows and a plurality of ribs (31) that separate the plurality of flow paths (L), and an air vent structure that allows air to escape is formed in areas other than the plurality of flow paths (L).

[0064] According to this configuration, the manifold (100) has an air vent structure formed in a portion other than the multiple flow paths (L), so that the manifold (100) can be configured to be less likely to form air pockets inside while maintaining the functionality of the multiple flow paths (L). This makes it easier to fill the manifold (100) with nitrogen gas or the like when brazing it to the support plate (20), and inhibits the formation of an oxide film due to air present in the air pockets, thereby preventing brazing defects. As a result, the manifold (100) can be stably fixed to the support plate (20) by brazing it to the support plate (20).

[0065] (2) In the manifold 100, the air vent structure preferably includes through holes (41-48) formed in the flow path housing (10) and communicating passages (52-57) formed between a pair of opposing ribs (31).

[0066] According to this configuration, the air vent structure formed in the manifold (100) includes the through holes (41-48) and the communicating passages (52-57), and therefore the air vent structure can be easily formed in the manifold (100).

[0067] (3) In the manifold 100, a switching valve (V1) capable of switching the flow path (L) is fixed to the flow path housing (10), and it is preferable that the air vent structure includes a notch (56) provided in a rib (31) supporting the switching valve (V1).

[0068] According to this configuration, the air vent structure formed in the manifold (100) includes the notch (56) provided in the rib (31) supporting the switching valve (V1). This allows the manifold (100) to form the air vent structure using the notch (56) provided in the rib (31) while maintaining the strength provided by the rib (31). As a result, the manifold (100) can stably support the switching valve (V1) and can be stably fixed to the support plate (20).

[0069] (4) In the manifold (100), it is preferable that the communicating passages (52, 57) separate two adjacent flow passages (L) through which fluids of different temperatures flow.

[0070] According to this configuration, two adjacent flow paths (L) through which fluids of different temperatures flow are separated by the communication paths (52, 57), so that heat conduction from one flow path (L) to the other flow path (L) in the two adjacent flow paths (L) can be suppressed. As a result, the manifold (100) can maintain the temperature of each of the fluids in the two flow paths (L) even when fluids of different temperatures flow in each of the two adjacent flow paths (L). As a result, the manifold (100) can use the fluids flowing in the multiple flow paths (L) at an appropriate temperature. [Industrial Applicability]

[0071] The present invention can be used in a manifold. [Explanation of symbols]

[0072] 10: flow path housing, 20: plate member (support plate), 31: rib, 41 to 48: through holes, 52, 53, 54, 55, 57: communication passages, 56: notch, 100: manifold, L: refrigerant flow path (multiple flow paths), V1: on-off valve (switching valve), G: gap (notch)

Claims

1. A manifold brazed to a support plate, a flow path housing having a plurality of flow paths through which a fluid flows and a plurality of ribs that divide the plurality of flow paths, The manifold has an air vent structure that allows air to escape formed in a portion other than the plurality of flow paths.

2. The manifold according to claim 1 , wherein the air vent structure includes a through hole formed in the flow passage housing and a communication passage formed between a pair of opposing ribs.

3. A switching valve capable of switching the flow path is fixed to the flow path housing, 3. The manifold according to claim 1, wherein the air vent structure includes a notch provided in the rib supporting the switching valve.

4. 3. The manifold according to claim 2, wherein the communication passage separates two adjacent flow passages through which the fluids having different temperatures flow.

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