Heat dissipation structure and electronic apparatus

Abstract

To provide heat dissipation structure which can apply one radiation plate to electronic modules of various thicknesses.SOLUTION: An approximately center part of a marginal part forming one end of a rectangle is fixed to a substrate 26 with a screw 44. Heat dissipation structure 40 has a radiation plate 42 of thermally conductive material which is thermally connected to a storage device 36. The storage device 36 has a module board 36a, and a memory chip 36d mounted on the module board 36a. The radiation plate 42 has a main heat dissipation part 42a which is thermally connected to the memory chip 36d, a first fixing part 42c which is co-fastened with the screw 44, a relay part 42d which protrudes from the first fixing part 42c to the opposite side of the storage device 36, and two first arm parts 42e which branch from the relay part 42d into two parts and return, and are connected with the main heat dissipation part 42a through both sides of the first fixing unit 42c.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present invention relates to a heat dissipation structure for an electronic module and an electronic device including the electronic module. [Background technology]

[0002] Electronic devices such as notebook PCs use electronic modules such as SSDs connected to a connector on a board (motherboard) on which a CPU is mounted. For example, one end of the electronic module is connected to a connector mounted on the board, and the other end is fixed to the board with screws (see Cited Document 1). Such electronic modules can be replaced by removing the screws. The electronic module is configured such that semiconductor chips such as memory are mounted on the top surface of the module board. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-057737 A Summary of the Invention [Problem to be solved by the invention]

[0004] Since the semiconductor chip of the electronic module generates heat, it is desirable to provide a heat sink in contact with the semiconductor chip to ensure stable operation. The fixing screws of the electronic module can be used to fix the heat sink.

[0005] On the other hand, electronic modules may have different thicknesses of module substrates and semiconductor chips depending on their specifications. If a heat sink is designed to fit a thin electronic module, it may not be possible to replace it with a thick electronic module, or excessive pressure may be applied to the semiconductor chip. Conversely, if a heat sink is designed to fit a thick electronic module, a gap will be created between the heat sink and the semiconductor chip when the thin electronic module is replaced. In addition, it is not rational to prepare a large number of heat sinks with individual specifications that are compatible with electronic modules of various thicknesses.

[0006] The present invention has been made in consideration of the above problems, and has an object to provide a heat dissipation structure and electronic device in which a single heat sink can be applied to electronic modules of various thicknesses. [Means for solving the problem]

[0007] In order to solve the above-mentioned problems and achieve the object, a heat dissipation structure according to a first embodiment of the present invention is a heat dissipation structure for an electronic module in which approximately the center of an edge forming one end of a rectangle is fixed to a substrate by a screw, and has a heat dissipation plate made of a thermally conductive material that is thermally connected to the electronic module, the electronic module having a module substrate and a plurality of semiconductor chips mounted on the module substrate, and the heat dissipation plate has a main heat dissipation section that is thermally connected to the semiconductor chips, a fixing section that is fastened together with the screw, a relay section that protrudes from the fixing section to the side opposite the electronic module, and two arm sections that branch off from the relay section, fold back toward the electronic module, pass on both sides of the fixing section and are connected to the main heat dissipation section.

[0008] In addition, an electronic device according to a second aspect of the present invention is an electronic device comprising an electronic module in which approximately the center of an edge forming one end of a rectangle is fixed to a substrate by a screw, and has a heat sink made of a thermally conductive material that is thermally connected to the electronic module, the electronic module having a module substrate and a plurality of semiconductor chips mounted on the module substrate, and the heat sink has a main heat dissipation section that is thermally connected to the semiconductor chips, a fixing section that is fastened together with the screw, a relay section that protrudes from the fixing section to the side opposite the electronic module, and two arm sections that branch into two from the relay section, fold back toward the electronic module, pass on both sides of the fixing section and are connected to the main heat dissipation section. Effect of the Invention

[0009] According to the above aspect of the present invention, one heat sink can be applied to electronic modules of various thicknesses. [Brief description of the drawings]

[0010] [Figure 1] 1 is a diagram showing an electronic device according to an embodiment as viewed from above; [Diagram 2] FIG. 2 is a bottom view illustrating a schematic internal structure of the housing. [Diagram 3] FIG. 2 is an exploded perspective view of a heat dissipation structure in the electronic device. [Figure 4] FIG. 2 is a perspective view of a heat sink in the heat dissipation structure. [Diagram 5] FIG. 13 is a plan view showing a state in which a removal tab is provided at the left end of the heat sink. [Figure 6] FIG. 2 is a plan view showing a state in which a flexible insulating sheet is provided on a first arm portion of a heat sink. [Figure 7] FIG. 4 is an enlarged perspective view of the left end portion of the heat dissipation structure. [Figure 8] 1 is a schematic cross-sectional view of a case where a heat dissipation structure is applied to a thin storage device. [Figure 9] 11 is a schematic cross-sectional view of a case where a heat dissipation structure is applied to a thick storage device. [Figure 10]11 is an enlarged perspective view of the left end portion of the heat dissipation structure when the heat sink is removed. FIG. [Figure 11] FIG. 13 is a plan view of a heat dissipation structure according to a modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of a heat dissipation structure and an electronic device according to the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to these preferred embodiments.

[0012] Fig. 1 is a top view of an electronic device 10 according to an embodiment. As shown in Fig. 1, the electronic device 10 includes a housing 12, a display housing 14, and a hinge 16. The electronic device 10 according to this embodiment is a clamshell notebook PC in which the housing 12 and the display housing 14 are connected by the hinge 16 so as to be relatively rotatable. The present invention can be applied to various information devices other than notebook PCs, such as desktop PCs, tablet PCs, mobile phones, smartphones, portable game consoles, and electronic organizers.

[0013] Hereinafter, the housing 12 and each element mounted thereon will be described based on the direction as seen by a user using the electronic device 10 shown in FIG. 1, with the front side being referred to as the front, the back side being referred to as the rear, the width direction being the left and right, and the thickness direction being the top and bottom.

[0014] First, the overall configuration of the electronic device 10 will be described. As shown in Fig. 1, the housing 12 is a flat box-shaped housing. The housing 12 is composed of an upper cover material 12A and a lower cover material 12B. The upper cover material 12A forms the upper surface and four peripheral side surfaces of the housing 12. The lower cover material 12B is a cover plate that closes the opening on the lower surface side of the upper cover material 12A, and forms the lower surface of the housing 12. A keyboard 18 and a touch pad 19 are provided on the upper surface of the housing 12.

[0015] The display housing 14 is a flat box-shaped housing that is thinner than the housing 12. A display 20 is provided on the front surface of the display housing 14. The display 20 is, for example, a liquid crystal display. A hinge 16 connects the rear edge of the housing 12 and the bottom edge of the display housing 14. A pair of hinges 16 are provided, for example, on the left and right sides.

[0016] Next, a specific example of the internal structure of the housing 12 will be described. Fig. 2 is a bottom view showing a schematic diagram of the internal structure of the housing 12. As shown in Fig. 2, various electronic components and mechanical components such as a board 26, a battery device 23, and an antenna element 24 are housed inside the housing 12.

[0017] The battery device 23 is a secondary battery that serves as a power source for the electronic device 10. The battery device 23 is connected to a board 26 and supplies power to the board 26. The antenna element 24 is connected to a communication module (electronic module) (not shown) and performs wireless transmission and reception. Reference numeral 25 in Fig. 2 denotes a notched portion formed in the rear end surface of the housing 12, where the hinge 16 is disposed.

[0018] The board 26 is a motherboard of the electronic device 10. The board 26 is, for example, large enough to occupy approximately half of the rear area inside the housing 12. Various electronic components such as a CPU 32, a connector 33, and a power connector 35 are mounted on the board 26. The board 26 is also provided with a boss 34. The board 26 has the CPU 32, the connector 33, and the like mounted on a first surface 26a. The back surface of the first surface 26a of the board 26 is screwed to the lower surface of the upper cover material 12A and the lower surface of the keyboard 18, and is thereby fixed to the housing 12. The board 26 has mounting holes 26c formed in various places.

[0019] The CPU (Central Processing Unit) 32 is a main processing unit of the electronic device 10. The CPU 32 has a die 32a and a package substrate 32b. The CPU 32 occupies a large space on the first surface 26a of the substrate 26. A storage device (electronic module) 36 is connected to the connector 33. The battery device 23 is connected to the power connector 35.

[0020] Next, a heat dissipation structure 40 according to an embodiment of the present invention will be described. The heat dissipation structure 40 dissipates heat from the storage device 36 using a heat sink 42. Fig. 3 is an exploded perspective view of the heat dissipation structure 40 in the electronic device 10. In order to facilitate understanding, in the description of the heat dissipation structure 40, the side of the lower cover material 12B is referred to as the top and the side of the upper cover material 12A is referred to as the bottom, opposite to the housing 12.

[0021] As shown in Fig. 3, the connector 33 is mounted on the first surface 26a of the substrate 26. The connector 33 is flat and longer in the front-to-rear direction than in the left-to-right direction based on the mounting orientation in this embodiment. Of course, the mounting orientation of the connector 33 is not limited to this. The connector 33 has a slot 33a formed on the left side. The connector 33 is a type of card edge socket, and is compatible with, for example, the M.2 (M.2) standard.

[0022] Two bosses 34 are provided in the range shown in Fig. 3. One of them (also called first boss 34A) is adapted for fixing a storage device 36 with standardized dimensions, and is located slightly away to the right of the connector 33. The other boss 34 (also called second boss 34B) is located slightly forward of the connector 33. The boss 34 is a stepped cylinder consisting of a base 34a and a protruding portion 34b. A female screw is formed in the hollow portion of the protruding portion 34b.

[0023] The storage device 36 is a card-type electronic module that is generally rectangular and slightly elongated in the left-right direction, such as an SSD (Solid State Drive). The storage device 36 is based on a module board 36a, and a semicircular notch 36b into which the protrusion 34b of the first boss 34A fits is provided at the approximate center of the edge that forms one end (the left end in this case), and a connection terminal 36c that is inserted into and connected to the slot 33a of the connector 33 is provided at the other end (the right end in this case).

[0024] One or more memory chips 36d, control chips 36e, and other electric elements 36f are mounted on the module substrate 36a. The memory chips 36d and control chips 36e are semiconductor chips. The electric elements 36f are resistors, capacitors, etc. The semiconductor chips are basically surface-mounted on the upper surface 36aa facing the opposite side to the substrate 26. When there is only one memory chip 36d, it is mounted near one end of the module substrate 36a where the notch 36b is located, and when there are multiple memory chips 36d, they are arranged and mounted from one end to the other end. In contrast, the control chip 36e is mounted at a position closer to the other end of the module substrate 36a where the connection terminals 36c are located.

[0025] The memory device 36 is inserted at a slight angle by inserting the connection terminal 36c into the slot 33a, and then aligned horizontally with the board 26, with the peripheral portion of the notch 36b placed on the base 34a of the first boss 34A, and then fixed in place by tightening the screw 44 together with the left end of the heat sink 42, as described below.

[0026] 4 is a perspective view of the heat sink 42 in the heat dissipation structure 40. The heat sink 42 is obtained by subjecting a thermally conductive material such as a copper plate or a stainless steel plate to sheet metal processing such as bending and pressing. The heat sink 42 is based on a main heat dissipation section 42a that covers almost the entire surface of the storage device 36. The main heat dissipation section 42a is substantially rectangular and slightly elongated in the left-right direction to correspond to the storage device 36. The heat sink 42 has bent sections 42b that protrude slightly downward from the front, rear and right edges, providing it with appropriate strength.

[0027] A description will now be given of the left end portion of the heat sink 42. The left end portion of the heat sink 42 is provided with a first fixed portion 42c, a relay portion 42d, two thin first arm portions 42e, and a rectangular protruding portion 42f.

[0028] The first fixing portion 42c is a portion that fixes the left end of the heat sink 42 to the boss 34 of the substrate 26 with a screw 44 (see FIG. 3), and has a screw insertion hole 42ca formed in the center. The relay portion 42d protrudes slightly to the left (opposite the module substrate 36a) from the first fixing portion 42c. The first fixing portion 42c is located slightly lower than the relay portion 42d by a small step portion 42cb.

[0029] The first arm portion 42e is provided in two such that it branches into two from the relay portion 42d toward the front and rear, turns back to the right, passes through both sides of the first fixed portion 42c, and is connected to the front and rear ends of the main heat dissipation portion 42a. Each of the first arm portions 42e is crank-shaped with three right-angled portions so as to form a certain gap with the first fixed portion 42c and the rectangular protruding portion 42f, but may have other shapes. The right-angled portions forming the crank shape of the first arm portion 42e may be somewhat acute or obtuse.

[0030] The rectangular protruding portion 42f is a portion that protrudes so as to cover a portion (e.g., approximately half of the left side) of the memory chip 36d (see FIG. 7) that is closest to the left end of the storage device 36 near the left end. The connection portions 42ea of ​​the two first arm portions 42e with the main heat dissipation portion 42a are separated from each other by forming slits 42g between the rectangular protruding portion 42f and the rectangular protruding portion 42f. The gap between the rectangular protruding portion 42f and the first fixed portion 42c, and the gap between the first arm portion 42e and the first fixed portion 42c are also approximately the same width as the slits 42g. The portion of the first arm portion 42e that extends from the end of the connection portion 42ea toward the first fixed portion 42c is defined as an arm intermediate portion 42eb.

[0031] The first arm portion 42e can be elastically tilted with the base of the connection portion 42ea as a reference. The relay portion 42d can be elastically tilted with the connection portion with the first arm portion 42e as a reference, and the first fixing portion 42c can move up and down. Even if the connection portion 42ea is tilted, it is located at a position where it does not interfere with the memory chip 36d (see FIG. 7).

[0032] The right end of the heat sink 42 will be described. Near the right end of the heat sink 42, a slit 42h is formed from the front end to the rear. The slit 42h is slightly wider than the slit 42g, and the innermost part is hook-shaped and protrudes slightly to the left. The length of the slit 42h in this embodiment is about 2 / 3 of the front-to-rear width of the heat sink 42. The part to the right of the slit 42h extends forward to form a second arm portion 42i. The tip of the second arm portion 42i is the second fixing portion 42j. The second fixing portion 42j is a portion that fixes the right end of the heat sink 42 to the second boss 34B of the board 26 with a screw 44 (see FIG. 3), and a screw insertion hole 42ia is formed in the center. The second fixing portion 42j is slightly lower than the other parts of the second arm portion 42i by a small step portion 42jb. The length of the second arm portion 42i in this embodiment is about the same as the front-to-rear width of the heat sink 42. The width of second arm portion 42i in this embodiment is approximately the same as the width of connector 33, and is approximately twice that of first arm portion 42e. Second arm portion 42i covers almost the entire surface of connector 33, but is raised by the thickness of memory chip 36d and thermal pad 48, which will be described next, and does not abut against connector 33. Therefore, second arm portion 42i can be elastically tilted, and second fixing portion 42j can move up and down.

[0033] A thermal pad 48 is attached to the rear surface of the main heat dissipation section 42a facing the storage device 36. The thermal pad 48 is a type of TIM (Thermal Interface Material) and can efficiently transfer heat from the semiconductor chip to the main heat dissipation section 42a. The thermal pad 48 has a thickness that allows it to be appropriately compressed and abutted against the semiconductor chip of the storage device 36. The thermal pad 48 has a sufficient area that allows it to abut against one or more of the multiple semiconductor chips that generate a large amount of heat. The thermal pad 48 is made of, for example, a silicone material and has elasticity and some adhesiveness.

[0034] The heat sink 42 is fastened together with the left end of the storage device 36 by screwing a screw 44 through the screw insertion hole 42ca into the first boss 34A at the left end, and is fixed to the board 26 by screwing another screw 44 through the screw insertion hole 42ja into the second boss 34B at the right end. When the heat sink 42 is fixed in this manner, the main heat dissipation section 42a is thermally connected to the memory chip 36d and the control chip 36e of the storage device 36 via the thermal pad 48, and can receive and dissipate heat from them. In this embodiment, a similar thermal pad 48 is also provided between the module board 36a and the board 26 (see FIG. 3).

[0035] FIG. 5 is a plan view showing a state where a removal tab 50 is provided at the left end of the heat sink 42. The removal tab 50 is a flexible and insulating sheet-like member that protrudes from the rectangular protruding portion 42f (i.e., the portion adjacent to the first fixing portion 42c) at the left end of the main heat sink 42a and is fastened together with the first fixing portion 42c by a screw 44. The removal tab 50 is made of, for example, a resin sheet. The removal tab 50 is T-shaped and has a fixing piece 50a that has the same width as the rectangular protruding portion 42f and is fixed to the rectangular protruding portion 42f, and a knob piece 50b that protrudes to the left. A horizontally long hole 50c is formed in the knob piece 50b so that the screw 44 can be inserted therethrough. The knob piece 50b protrudes leftward from the relay portion 42d, which is the leftmost end of the heat sink 42. The fixing piece 50a has an appropriately wide area and is securely fixed to the rectangular protruding portion 42f. The means for fastening the removal tab 50 and the insulating sheet 52 to the heat sink 52 described below is adhesive or bonding.

[0036] 6 is a plan view showing a state where a flexible insulating sheet 52 is provided on the first arm portion 42e of the heat sink 42. There are two insulating sheets 52, which are attached to the lower surfaces (the sides facing the substrate 26) of the two first arm portions 42e. The insulating sheet 52 is composed of a first portion 52a along the connection portion 42ea, a second portion 52b along the arm intermediate portion 42eb, and a third portion 52c provided from the connection portion 42ea to the rectangular protruding portion 42f. A notch 52d is formed between the second portion 52b and the third portion 52c, so as not to prevent the rectangular protruding portion 42f and the arm intermediate portion 42eb from being displaced relative to each other. Although the insulating sheet 52 is flexible, the third portion 52c may be slightly loosened so as not to prevent the connection portion 42ea and the rectangular protruding portion 42f from being displaced relative to each other. For simplicity's sake, the removal tab 50 and the insulating sheet 52 are shown separately in FIGS. 5 and 6, but the actual heat sink 42 is provided with both.

[0037] Fig. 7 is an enlarged perspective view of the right end of the heat dissipation structure 40. In Fig. 7, the removal tab 50 is shown by virtual lines and the thermal pad 48 is omitted for ease of understanding. Fig. 8 is a schematic cross-sectional view of the heat dissipation structure 40 applied to a thin storage device 36. Fig. 9 is a schematic cross-sectional view of the heat dissipation structure 40 applied to a thick storage device 36. The second arm portion 42i extends forward, but Figs. 8 and 9 show it as extending to the right.

[0038] The thickness of the storage device 36 may vary depending on the memory chip 36d, the control chip 36e, and the module board 36a. In the heat dissipation structure 40, the inclination angle of the first arm portion 42e and the second arm portion 42i changes elastically according to the thickness of the storage device 36 to absorb the difference in thickness, and the main heat dissipation portion 42a can be appropriately thermally connected to the memory chip 36d and the control chip 36e without creating a gap. In addition, since the first arm portion 42e and the second arm portion 42i are elastically inclined, excessive tension is not generated, no load is applied to the memory chip 36d and the control chip 36e, and the life of the arm portion itself is not reduced. In addition, in the heat dissipation structure 40, even if a user or an operator replaces the storage device 36 with one of a different thickness, the semiconductor chip and the heat sink 42 can be appropriately thermally connected without creating a gap between them.

[0039] In the storage device 36, the memory chips 36d are usually arranged from the left end close to the first boss 34A and the notch 36b to the right side where the connector 33 and the connection terminal 36c are located. When the difference in thickness of the storage device 36 is largely due to the difference in thickness of the memory chips 36d caused by the difference in memory capacity, the heat dissipation structure 40 has a relay portion 42d protruding leftward from the first fixing portion 42c at the left end, and two first arm portions 42e branching from the relay portion 42d and folding back in a side view to connect to the main heat dissipation portion 42a. This ensures sufficient length and elastic deformation margin, and the folded back structure absorbs the excess length to easily absorb the thickness difference of the storage device 36. In addition, the first arm portion 42e has a crank shape via the arm intermediate portion 42eb in a plan view, so that the right angle portion is somewhat elastically deformed to change the angle, thereby absorbing the excess length. In this way, in the electronic device 10 and the heat dissipation structure 40, one heat dissipation plate 42 can be applied to storage devices 36 of various thicknesses.

[0040] In addition, the rectangular protrusion 42f covers the portion of the memory chip 36d closest to the left end close to the left end, and the connection portion 42ea of ​​the two first arm portions 42e is separated from the rectangular protrusion 42f by forming a slit 42g between them, so that the rectangular protrusion 42f effectively applies a moderate pressing force to this memory chip 36d in particular, improving thermal conductivity. The left end of the heat sink 42 is fastened together with the notch 36b to the first boss 34A by the screw 44, which is reasonable. The left portion of the heat dissipation structure 40 has a front-to-back symmetrical structure with the first fixing portion 42c as a reference, so that the heat sink 42 abuts against the storage device 36 in a balanced manner in the front-to-back direction. Since the relay portion 42d is raised by the step portion 42cb with respect to the first fixing portion 42c, when the storage device 36 is thin, the inclination of the first arm portion 42e becomes gentler, and the heat sink 42f can be applied to a storage device 36 that is correspondingly thick.

[0041] 7, a small electric element 36f may be mounted on the left end portion of the module board 36a, or a wiring pattern may be provided. These are covered by the connection portion 42ea of ​​the first arm portion 42e and the arm intermediate portion 42eb. Although the first arm portion 42e is thin, an insulating sheet 52 is attached to the underside of the connection portion 42ea of ​​the first arm portion 42e, so that electrical contact with the electric element 36f and the wiring pattern is prevented even if the first arm portion 42e is displaced downward due to an unexpected event such as an excessive external force or vibration.

[0042] The heat sink 42 is fixed to the first boss 34A via the removal tab 50 in addition to the first fixing portion 42c. Therefore, even if a user or worker tries to lift the rectangular protruding portion 42f by mistake without removing the screws 44 when removing the heat sink 42, the rectangular protruding portion 42f cannot be lifted because it is fixed to the first boss 34A by the removal tab 50. This prevents the thin first arm portion 42e from being damaged by applying excessive force.

[0043] 10 is an enlarged perspective view of the left end of the heat dissipation structure 40 when removing the heat dissipation plate 42. To remove the heat dissipation plate 42, the screw 44 is removed from the second boss 34B, and then the screw 44 is removed from the first boss 34A. This makes it possible to lift the knob piece 50b of the removal tab 50. The user or worker then lifts the knob piece 50b to remove the heat dissipation plate 42.

[0044] At this time, if the first fixed portion 42c or the relay portion 42d were to be lifted up, there is a concern that excessive force would be applied to the thin first arm portion 42e, causing damage, because the main heat dissipation portion 42a is somewhat adhered to the semiconductor chip via the thermal pad 48. In contrast, in the heat dissipation structure 40, the knob piece 50b is located above the first fixed portion 42c and the relay portion 42d, and further protrudes to the left of the relay portion 42d, so that the user or worker will inevitably lift the knob piece 50b, which makes it possible to prevent damage to the first arm portion 42e.

[0045] The heat sink 42 can be removed individually by removing the screws 44 and lifting it up. At this time, the insertion state can be confirmed because the connection terminals 36c of the storage device 36 remain inserted into the slots 33a of the connector 33. Since the heat sink 42 is fixed to the bosses 34, no mechanical load is applied to the storage device 36.

[0046] 11 is a plan view of a heat dissipation structure 40A according to a modified example. In the heat dissipation structure 40A, components similar to those in the heat dissipation structure 40 described above are given the same reference numerals, and detailed description is omitted. The storage device 36 to which the heat dissipation structure 40A is applied is longer in the horizontal direction than the above, and has a larger number of memory chips 36d. The main heat dissipation section 42a in the heat dissipation structure 40A has a horizontally elongated shape according to the storage device 36. The heat dissipation structure 40A does not have the rectangular protrusion 42f or slit 42g as described above, and the second arm section 42i protrudes to the right, unlike the above case. These may be determined according to the specifications and layout conditions.

[0047] In the above embodiment, the folded-back structure of the first arm portion 42e from the first fixed portion 42c via the relay portion 42d may be provided not only on the left side of the heat dissipation structure 40, 40A but also on both the left and right sides depending on the layout conditions, etc. The heat dissipation plate 42 may be provided with a positioning piece for the storage device 36, etc. If the storage device 36 has some positioning means, the connection destination of the connection terminal 36c may be a cable instead of the mounted connector 33.

[0048] The heat sink 42 in the heat dissipation structures 40, 40A is applied to the storage device 36, but may also be applied to, for example, a communication module corresponding to the antenna element 24. The main heat dissipation portion 42a of the heat sink 42 is not limited to being plate-shaped and may be, for example, a type having multiple protruding cooling fins, but a type consisting of a single plate as in this embodiment is inexpensive. The electronic module that the heat dissipation structures 40, 40A dissipate heat from is not necessarily limited to a replaceable one, and can be shared even when, for example, different types of non-replaceable storage devices 36 are mounted in the electronic device 10 for each model.

[0049] The present invention is not limited to the above-described embodiment, and can of course be freely modified without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0050] 10 Electronic equipment 12. Chassis 26 Substrate 33 Connector 34, 34A, 34B Boss 36 Memory devices (electronic modules) 36a Module Board 36b Notch 36d Memory chip 36es control chip 36f Electrical elements 40,40A heat dissipation structure 42 Heat sink 42a Main heat dissipation section 42c 1st fixed part 42d Relay section 42e First arm 42ea Connection 42eb Arm middle part 42f Rectangular protrusion 42g, 42h slit 42i 2nd arm part 42j 2nd fixed part 44 Screws 48 Thermal Pad 50 Removal tab 52 Insulating sheet

Claims

1. A heat dissipation structure for an electronic module in which an approximately central portion of an edge portion forming one end of a rectangle is fixed to a substrate by a screw, a heat sink made of a thermally conductive material thermally connected to the electronic module; the electronic module includes a module substrate and a plurality of semiconductor chips mounted on the module substrate; The heat sink is a main heat dissipation portion thermally connected to the semiconductor chip; A fixing portion that is fastened together with the screw; a relay portion protruding from the fixing portion to a side opposite to the electronic module; two arm portions that branch off from the relay portion, turn back toward the electronic module, pass through both sides of the fixing portion, and are connected to the main heat dissipation portion; have A heat dissipation structure characterized by:

2. The heat dissipation structure according to claim 1 , A sheet-like removal tab is provided that projects from a portion of the main heat dissipation portion adjacent to the fixed portion and is fastened together with the fixed portion by the screw. A heat dissipation structure characterized by:

3. The heat dissipation structure according to claim 1 , The arm portion is provided with an insulating sheet on the side facing the substrate. A heat dissipation structure characterized by:

4. The heat dissipation structure according to claim 1 , the main heat dissipation portion forms a rectangular protruding portion that covers a portion of the semiconductor chip that is closest to the one end, The connection portions of the two arms to the main heat dissipation portion are spaced apart from each other by forming slits between the two arms and the rectangular protrusion. A heat dissipation structure characterized by:

5. The heat dissipation structure according to claim 1 , The two arms are crank-shaped. A heat dissipation structure characterized by:

6. An electronic device including an electronic module in which an approximate center portion of an edge portion forming one end of a rectangle is fixed to a substrate by a screw, a heat sink made of a thermally conductive material thermally connected to the electronic module; the electronic module includes a module substrate and a plurality of semiconductor chips mounted on the module substrate; The heat sink is a main heat dissipation portion thermally connected to the semiconductor chip; A fixing portion that is fastened together with the screw; a relay portion protruding from the fixing portion to a side opposite to the electronic module; two arm portions that branch off from the relay portion, turn back toward the electronic module, pass through both sides of the fixing portion, and are connected to the main heat dissipation portion; have 1. An electronic device comprising:

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