Changeover device
Patent Information
- Application Number
- JP2023126378
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-08-02
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2043-08-02
AI Technical Summary
【0010】 本開示によれば、切替装置を用いて熱媒体の流通経路を効率的に切り替えることができる。
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Figure 2025022111000001_ABST
Abstract
Description
[Technical field]
[0001] The present disclosure relates to a switching device. [Background technology]
[0002] JP 2021-154767 A (Patent Document 1) discloses a thermal management system provided with a switching valve that switches the flow path of a heat transfer medium. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] JP 2021-154767 A Summary of the Invention [Problem to be solved by the invention]
[0004] In the above Patent Document 1, the flow path of the heat medium is switched by the switching valve as described above. There is a demand for a switching device that can efficiently switch the flow path of the heat medium (heat medium).
[0005] The present disclosure has been made to solve the above-mentioned problems, and has an object to provide a switching device capable of efficiently switching the flow path of a heat medium. [Means for solving the problem]
[0006] A switching device according to a first aspect of the present disclosure is provided in a thermal management circuit through which a heat medium flows, and includes a valve body unit and a plurality of flow pipes connected to the valve body unit. The valve body unit includes a disk-shaped first valve body, a disk-shaped second valve body that is provided rotatably around a rotation center line relative to the first valve body and disposed on one side of the first valve body in an axial direction along which the rotation center line extends, and a disk-shaped third valve body that is provided to be sandwiched between the first valve body and the second valve body in the axial direction and rotatable around the rotation center line relative to the first valve body. The first valve body includes an outer peripheral wall that extends annularly around the rotation center line, an inner peripheral wall that extends annularly around the rotation center line and is formed on the rotation center line side of the outer peripheral wall, and ten partition walls that are provided to partition a space between the inner peripheral wall and the outer peripheral wall in a circumferential direction around the rotation center line. The first valve body is provided with ten first grooves formed by the ten partition walls between the outer peripheral wall and the inner peripheral wall. Each of the ten first grooves has a first opening that opens toward the second valve body and a second opening formed in the outer circumferential wall. Some of the ten first grooves allow the heat medium to flow into the first valve body through the multiple flow pipes, and some of the remaining ten first grooves allow the heat medium to flow out of the first valve body through the multiple flow pipes. The second valve body is provided with a plurality of sector-shaped second grooves that are formed to extend circumferentially around the rotation center line and open toward the first valve body. The third valve body is provided with a plurality of through holes that penetrate the third valve body in the axial direction and are arranged circumferentially around the rotation center line. The second valve body and the third valve body each rotate relative to the first valve body, thereby switching the overlapping state in the axial direction between the first opening of each of the ten first grooves, the multiple second grooves, and the multiple through holes.
[0007] In the switching device according to the first aspect of the present disclosure, as described above, the overlapping state in the axial direction between the first openings of the ten first grooves, the second grooves, and the through holes is switched. This makes it possible to easily switch the heat medium flow path by simply switching the overlapping state. As a result, the heat medium flow path can be efficiently switched.
[0008] A switching device according to a second aspect of the present disclosure is provided in a thermal management circuit through which a heat medium flows, and includes a valve body unit and a plurality of flow pipes connected to the valve body unit. The valve body unit includes a cylindrical inner periphery side unit in which a disk-shaped first part and a disk-shaped second part are stacked and integrally formed, and an annular outer periphery side unit that is provided rotatably relative to the inner periphery side unit around a rotation center line and is arranged to surround the inner periphery side unit from the outer periphery side. The inner periphery side unit includes a first outer periphery side wall that extends annularly around the rotation center line. When the direction in which the rotation center line extends is the axial direction, the inner periphery side unit is formed with two first inner periphery side grooves that connect two first inner periphery side openings formed in the first outer periphery wall at an axial position corresponding to the first part, and two second inner periphery side grooves that connect two second inner periphery side openings formed in the first outer periphery wall at an axial position corresponding to the second part. The two first inner circumferential openings are spaced apart from each other in the circumferential direction around the rotation center line, and the two second inner circumferential openings are spaced apart from each other in the circumferential direction. The outer circumferential unit includes a second outer circumferential wall extending annularly around the rotation center line, an inner circumferential wall extending annularly around the rotation center line and provided closer to the rotation center line than the second outer circumferential wall, and a plurality of partition walls that partition a space between the second outer circumferential wall and the inner circumferential wall in the circumferential direction. Eight outer circumferential grooves formed by the plurality of partition walls are provided between the second outer circumferential wall and the inner circumferential wall. Ten first outer circumferential openings are formed in the inner circumferential wall and arranged in a line in the circumferential direction. Each of the eight outer circumferential grooves is connected to a second outer circumferential opening formed in the second outer circumferential wall. Some of the eight outer circumferential grooves allow the heat medium to flow into the outer circumferential unit through a plurality of circulation pipes, and the remaining part of the eight outer circumferential grooves allow the heat medium to flow out of the outer circumferential unit through a plurality of circulation pipes. By rotating the outer periphery side unit relative to the inner periphery side unit, the radial overlap state between each of the ten first outer periphery side openings of the outer periphery side unit and each of the two first inner periphery side openings and two second inner periphery side openings is switched.
[0009] In the switching device according to the second aspect of the present disclosure, as described above, the radial overlap state between each of the ten first outer circumferential openings of the outer circumferential unit and each of the two first inner circumferential openings and the two second inner circumferential openings is switched. This makes it possible to easily switch the heat medium flow path by simply switching the overlap state. As a result, it is possible to efficiently switch the heat medium flow path. Effect of the Invention
[0010] According to the present disclosure, the flow path of the heat medium can be efficiently switched by using the switching device. [Brief description of the drawings]
[0011] [Figure 1] 1 is a diagram showing a configuration of a thermal management system according to a first embodiment. [Diagram 2] FIG. 2 is an exploded perspective view showing the configuration of the ten-way valve according to the first embodiment. [Diagram 3] FIG. 2 is a diagram showing a circuit pattern A of the thermal management circuit according to the first embodiment. [Figure 4] FIG. 4 is a diagram showing a circuit pattern B of the thermal management circuit according to the first embodiment. [Diagram 5] FIG. 4 shows a circuit pattern C of the thermal management circuit according to the first embodiment. [Figure 6] FIG. 2 is a diagram showing a circuit pattern D of the thermal management circuit according to the first embodiment. [Figure 7] FIG. 2 shows a circuit pattern E of the thermal management circuit according to the first embodiment. [Figure 8] FIG. 2 is a diagram showing a circuit pattern F of the thermal management circuit according to the first embodiment. [Figure 9] FIG. 2 is a diagram showing a circuit pattern G of the thermal management circuit according to the first embodiment. [Figure 10] FIG. 2 is a diagram showing a circuit pattern H of the thermal management circuit according to the first embodiment. [Figure 11] FIG. 11 is a diagram showing a configuration of a thermal management circuit according to a second embodiment. [Figure 12]FIG. 11 is a perspective view showing the configuration of an inner periphery side unit of the ten-way valve according to the second embodiment. [Figure 13] 11 is a perspective view showing a cross section at a position in the Z direction corresponding to an upper portion of the ten-way valve according to the second embodiment. FIG. [Figure 14] 11 is a perspective view showing a cross section at a Z-direction position between an upper portion and a lower portion of a ten-way valve according to a second embodiment. FIG. [Figure 15] 11 is a perspective view showing a cross section at a position in the Z direction corresponding to a lower portion of the ten-way valve according to the second embodiment. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0012] The thermal management system according to the present disclosure will be described below. The thermal management system is mounted, for example, on an electric vehicle (not shown). The electric vehicle on which the thermal management system is mounted is preferably a vehicle equipped with a battery for driving, such as an electric vehicle (BEV: Battery Electric Vehicle), a hybrid vehicle (HEV: Hybrid Electric Vehicle), a plug-in hybrid vehicle (PHEV: Plug-in Hybrid Electric Vehicle), and a fuel cell electric vehicle (FCEV: Fuel Cell Electric Vehicle). However, the use of the thermal management system according to the present disclosure is not limited to vehicles.
[0013] [First embodiment] <Overall composition> 1 is a diagram showing an example of an overall configuration of a thermal management system 1 according to a first embodiment of the present disclosure. The thermal management system 1 includes a thermal management circuit 100, an electronic control unit (ECU) 500, and an HMI (Human Machine Interface) 600.
[0014] The thermal management circuit 100 is configured to allow a heat medium to flow therethrough. The thermal management circuit 100 includes, for example, a high-temperature circuit 110, a radiator 120, a unit circuit 130, a condenser 140, a refrigeration cycle 150, a chiller 160, a battery circuit 170, and a switching device 250. The switching device 250 includes a ten-way valve 200. The ten-way valve 200 is an example of a "valve body unit" of the present disclosure.
[0015] The high temperature circuit 110 includes, for example, a water pump (W / P) 111 , an electric heater 112 , a three-way valve 113 , a heater core 114 , and a reservoir tank (R / T) 115 .
[0016] The radiator 120 includes a high temperature (HT) radiator 121 and a low temperature (LT) radiator 122. In the low temperature radiator 122, heat is exchanged between the heat medium and outside air.
[0017] The unit circuit 130 includes, for example, a water pump 131, a smart power unit (SPU) 132, a power control unit (PCU) 133, an oil cooler (O / C) 134, a step-up / step-down converter 135, and a reservoir tank 136.
[0018] The condenser 140 is connected to both the high temperature circuit 110 and the refrigeration cycle 150. The refrigeration cycle 150 includes, for example, a compressor 151, an expansion valve 152, an evaporator 153, an evaporative pressure regulator (EPR) 154, and an expansion valve 155.
[0019] The chiller 160 is connected to both the refrigeration cycle 150 and the flow path 161a. In the chiller 160, heat is exchanged between the heat medium flowing through the flow path 161a and the medium circulating through the refrigeration cycle 150. The flow path 161a connects a port P1 (described later) of the ten-way valve 200 and a port P2 (described later) of the ten-way valve 200. A water pump (W / P) 161 is provided in the flow path 161a.
[0020] The battery circuit 170 includes, for example, an electric heater 171 and a battery 172. The electric heater 171 increases the temperature of the heat medium of the battery circuit 170.
[0021] The ECU 500 controls the thermal management circuit 100. The ECU 500 includes a processor 501, a memory 502, a storage 503, and an interface 504.
[0022] The ECU 500 generates a control command based on sensor values acquired from various sensors included in the thermal management circuit 100, a user operation accepted by the HMI 600, and the like, and outputs the generated control command to the thermal management circuit 100. As a result, for example, the states of the three-way valve 113 and the ten-way valve 200 are switched.
[0023] The HMI 600 is a display with a touch panel, an operation panel, a console, etc. The HMI 600 accepts a user operation for controlling the thermal management system 1. The HMI 600 outputs a signal indicating the user operation to the ECU 500.
[0024] The ten-way valve 200 is provided with ten ports P1 to P10. The port P1 is an inlet port into which the heat medium flows from the chiller 160 (flow path 161a). The port P2 is an outlet port from which the heat medium flows out toward the chiller 160 (flow path 161a). The port P3 is an inlet port into which the heat medium flows from the unit circuit 130 (PCU 133, etc.). The port P4 is an outlet port from which the heat medium flows out toward the unit circuit 130 (PCU 133, etc.). The port P5 is an inlet port into which the heat medium flows from the battery circuit 170. The port P6 is an outlet port from which the heat medium flows out toward the battery circuit 170. The port P7 is an inlet port into which the heat medium flowed out from the port P6 flows in through the bypass path 251. The port P8 is an inlet port into which the heat medium flows in from the low-temperature radiator 122. The port P9 is an outlet port from which the heat medium flows out toward the low-temperature radiator 122. The port P10 is an outlet port for causing the heat medium to flow out to a bypass path 252 through which the heat medium flows toward the port P8.
[0025] The circulation pipes connected to the ports P1 to P10 are an example of the "circulation pipe" in the present disclosure. The circulation pipes include a flow path of the battery circuit 170, a flow path of the unit circuit 130, a flow path connecting the ten-way valve 200 and the radiator 120, a flow path 161a, a bypass path 251, and a bypass path 252.
[0026] The ECU 500 controls the state of the ten-way valve 200. This switches the flow path of the heat medium in the ten-way valve 200. As a result, the flow path of the heat medium in the thermal management circuit 100 is switched.
[0027] FIG. 2 is an exploded perspective view showing the configuration of the ten-way valve 200. The ten-way valve 200 includes a disk-shaped upper body 210, a disk-shaped drive plate 220, and a disk-shaped lower body 230. The upper body 210, the drive plate 220, and the lower body 230 are arranged (stacked) in this order from the Z1 side. That is, the drive plate 220 is sandwiched between the upper body 210 and the lower body 230 in the Z direction. The Z direction is the direction in which the rotation center line α extends. The Z direction is an example of the "axial direction" in the present disclosure. The upper body 210 and the drive plate 220 are examples of the "second valve body" and the "third valve body" in the present disclosure, respectively. The lower body 230 is an example of the "first valve body" in the present disclosure.
[0028] Lower body 230 is fixed and does not rotate. Upper body 210 and driving plate 220 rotate integrally on the Z1 side of lower body 230 around rotation center line α. This causes a change in the relative positions (rotation angles in the circumferential direction) of lower body 230, upper body 210, and driving plate 220. Note that upper body 210 and driving plate 220 may be fixed, and lower body 230 may rotate.
[0029] The upper body 210 has a circular ring shape. The upper body 210 is provided with grooves 211 to 214. Each of the grooves 211 to 214 is formed in a sector shape so as to extend circumferentially around the rotation center line α. Each of the grooves 211 to 214 is open on the lower body 230 side (Z2 side). Each of the grooves 211 to 214 is an example of a "second groove" in the present disclosure.
[0030] The grooves 211 and 212 are arranged side by side in the circumferential direction in an outer circumferential region of the upper body 210. Specifically, each of the grooves 211 and 212 has a sector shape with a central angle of approximately 112.5 degrees.
[0031] Groove portion 213 and groove portion 214 are arranged to face each other in a region of upper body 210 that is more inner than groove portions 211 and 212. Groove portion 213 and groove portion 214 each have a sector shape with a central angle of approximately 112.5 degrees.
[0032] Drive plate 220 is provided with through holes 221 to 228. Each of through holes 221 to 228 is formed to penetrate drive plate 220 in the Z direction. Each of through holes 221 to 228 is formed in a fan shape so as to extend circumferentially around rotation center line α. Through holes 221 to 228 are provided at positions shifted from one another in the circumferential direction so as not to overlap one another in the radial direction.
[0033] Through holes 221 to 224 are arranged side by side in the circumferential direction in an outer circumferential region of drive plate 220. Each of through holes 221 and 222 is provided at a position overlapping groove portion 211 of upper body 210. Each of through holes 223 and 224 is provided at a position overlapping groove portion 212 of upper body 210 when viewed along the Z direction.
[0034] Through holes 225 to 228 are arranged side by side in the circumferential direction in a region of drive plate 220 that is more inner than through holes 221 to 224. Each of through holes 225 and 226 is provided at a position overlapping with groove portion 213 of upper body 210 when viewed in the Z direction. Each of through holes 227 and 228 is provided at a position overlapping with groove portion 214 of upper body 210 when viewed in the Z direction.
[0035] The lower body 230 includes an outer peripheral wall 231, an inner peripheral wall 232, and ten partition walls 233. The outer peripheral wall 231 is provided so as to extend in an annular shape about the rotation center line α. The inner peripheral wall 232 extends in an annular shape about the rotation center line α and is formed closer to the rotation center line α than the outer peripheral wall 231.
[0036] The ten partition walls 233 include eight partition walls 233a and two partition walls 233b. Each of the eight partition walls 233a is formed to extend in the radial direction and is provided to connect the inner circumferential wall 232 and the outer circumferential wall 231. The eight partition walls 233a are arranged side by side at equal intervals in the circumferential direction around the rotation center line α.
[0037] Each of the two partition walls 233b is provided so as to connect the partition wall 233a and the outer peripheral wall 231. Each of the two partition walls 233b is formed in an L shape when viewed from the Z1 side.
[0038] The lower body 230 is provided with ten grooves 234 formed by ten partition walls 233 between the outer circumferential wall 231 and the inner circumferential wall 232. The ten grooves 234 include six grooves 234a, two grooves 234b, and two grooves 234c. The grooves 234 (234a to 234c) are an example of a "first groove" in the present disclosure.
[0039] The groove portion 234a is a sector-shaped space formed by the outer peripheral wall 231, the inner peripheral wall 232, and two partition walls 233a. The groove portion 234b is a space formed by the outer peripheral wall 231, the inner peripheral wall 232, two partition walls 233a, and partition wall 233b. The groove portion 234c is a sector-shaped space formed by the outer peripheral wall 231, one partition wall 233a, and partition wall 233b.
[0040] The groove portion 234a has an opening 234d that opens to the upper body 210 side (Z1 side) and an opening 234e formed in the outer peripheral wall 231. The groove portion 234b has an opening 234f that opens to the upper body 210 side and an opening 234g that is formed in the outer peripheral wall 231. The groove portion 234c has an opening 234h that opens to the upper body 210 side and an opening 234i that is formed in the outer peripheral wall 231. Each of the openings 234d, 234f, and 234h is an example of a "first opening" in the present disclosure. Each of the openings 234e, 234g, and 234i is an example of a "second opening" in the present disclosure.
[0041] The openings 234e, 234g, and 234i are arranged in the outer circumferential wall 231 in a line in the circumferential direction.
[0042] The openings 234e of the six grooves 234a correspond to (are connected to) the ports P1 to P4, P6, and P8, respectively. The openings 234g of the two grooves 234b correspond to (are connected to) the ports P5 and P9, respectively. The openings 234i of the two grooves 234c correspond to (are connected to) the ports P7 and P10, respectively.
[0043] 3 to 10 show circuit patterns A to H that can be formed by ten-way valve 200 for heat management circuit 100. In Fig. 3 to 10, white circles overlapping grooves 211 to 214 indicate the positions of through holes 221 to 228 of drive plate 220. For simplification, reference numerals for through holes 221 to 228 have been omitted in Fig. 3 to 10.
[0044] In the first embodiment, the ten-way valve 200 is configured such that, by rotating each of the drive plate 220 and the upper body 210, the overlap state in the Z direction (overlapping state when viewed along the Z direction) of each of the openings (234d, 234f, 234h) of the ten groove portions 234 (see FIG. 2) of the lower body 230, the groove portions 211 to 214 of the upper body 210, and the through holes 221 to 228 of the drive plate 220 can be switched.
[0045] 3, in pattern A, groove 211 of upper body 210, through hole 221 and through hole 222 of drive plate 220, and groove 234a (P1) and groove 234b (P9) of lower body 230 overlap in the Z direction. This allows port P1 to communicate with port P9.
[0046] In pattern A, groove 212 of upper body 210, through hole 223 and through hole 224 of drive plate 220, and groove 234a (P4) and groove 234a (P8) of lower body 230 overlap in the Z direction. This allows port P4 to communicate with port P8.
[0047] In pattern A, groove 213 of upper body 210, through hole 225 and through hole 226 of drive plate 220, and groove 234b (P5) and groove 234a (P2) of lower body 230 overlap in the Z direction. This allows port P2 and port P5 to communicate with each other.
[0048] In pattern A, groove 214 of upper body 210, through holes 227 and 228 of drive plate 220, and groove 234a (P6) and groove 234a (P3) of lower body 230 overlap in the Z direction. This allows port P3 and port P6 to communicate with each other.
[0049] In the circuit pattern A, a closed circuit is formed in which the heat medium flows in the order of PCU 133, battery 172, chiller 160, and low-temperature radiator 122. In the circuit pattern A, the PCU 133 and the battery 172 can be cooled by the low-temperature radiator 122 and chiller 160. In addition, heat pump heating is possible using the heat of the PCU 133 and the battery 172.
[0050] 4, in pattern B, groove 211 of upper body 210, through hole 221 and through hole 222 of drive plate 220, and groove 234a (P1) and groove 234c (P10) of lower body 230 overlap in the Z direction. This allows port P1 to communicate with port P10.
[0051] In pattern B, groove 212 of upper body 210, through holes 223 and 224 of drive plate 220, and groove 234a (P4) and groove 234a (P8) of lower body 230 overlap in the Z direction. This allows port P4 to communicate with port P8.
[0052] In pattern B, groove 213 of upper body 210, through hole 225 and through hole 226 of drive plate 220, and groove 234b (P5) and groove 234a (P2) of lower body 230 overlap in the Z direction. This allows port P2 and port P5 to communicate with each other.
[0053] In pattern B, groove 214 of upper body 210, through hole 227 and through hole 228 of drive plate 220, and groove 234a (P6) and groove 234a (P3) of lower body 230 overlap in the Z direction. This allows port P3 and port P6 to communicate with each other.
[0054] In the circuit pattern B, a first closed circuit is formed in which the heat medium flows through the PCU 133, the battery 172, and the chiller 160 in this order, and a second closed circuit is formed in which the low-temperature radiator 122 is independent (separated). In the circuit pattern B, the battery 172 can be heated and heated by the heat of the PCU 133, and heat pump heating is possible by the heat of the PCU 133 and the battery 172. In addition, heat radiation from the low-temperature radiator 122 is suppressed.
[0055] 5, in pattern C, groove 211 of upper body 210, through hole 221 and through hole 222 of drive plate 220, and groove 234a (P2) and groove 234a (P8) of lower body 230 overlap in the Z direction. This allows port P2 to communicate with port P8.
[0056] In pattern C, groove 212 of upper body 210, through hole 223 and through hole 224 of drive plate 220, and groove 234a (P6) and groove 234a (P3) of lower body 230 overlap in the Z direction. This allows port P3 and port P6 to communicate with each other.
[0057] In pattern C, groove 213 of upper body 210, through hole 225 and through hole 226 of drive plate 220, and groove 234a (P1) and groove 234b (P9) of lower body 230 overlap in the Z direction. This allows port P1 and port P9 to communicate with each other.
[0058] In pattern C, groove 214 of upper body 210, through hole 227 and through hole 228 of drive plate 220, and groove 234b (P5) and groove 234a (P4) of lower body 230 overlap in the Z direction. This allows port P4 and port P5 to communicate with each other.
[0059] In the circuit pattern C, a first closed circuit is formed in which the heat medium flows through the PCU 133 and the battery 172, and a second closed circuit is formed in which the heat medium flows through the low-temperature radiator 122 and the chiller 160. In the circuit pattern C, the temperature of the battery 172 can be increased by the heat of the PCU 133, and heat pump heating using outside air is also possible.
[0060] 6, in pattern D, groove 211 of upper body 210, through hole 221 and through hole 222 of drive plate 220, and groove 234a (P3) and groove 234b (P9) of lower body 230 overlap in the Z direction. This allows port P3 to communicate with port P9.
[0061] In pattern D, groove 212 of upper body 210, through hole 223 and through hole 224 of drive plate 220, and groove 234a (P4) and groove 234b (P5) of lower body 230 overlap in the Z direction. This allows port P4 and port P5 to communicate with each other.
[0062] In pattern D, groove 213 of upper body 210, through hole 225 and through hole 226 of drive plate 220, and groove 234a (P8) and groove 234a (P2) of lower body 230 overlap in the Z direction. This allows port P2 to communicate with port P8.
[0063] In pattern D, groove 214 of upper body 210, through hole 227 and through hole 228 of drive plate 220, and groove 234a (P6) and groove 234a (P1) of lower body 230 overlap in the Z direction. This allows port P1 and port P6 to communicate with each other.
[0064] In the circuit pattern D, a closed circuit is formed in which the heat medium flows in the order of the PCU 133, the low-temperature radiator 122, the chiller 160, and the battery 172. The circuit pattern D is different from the circuit pattern A in the order in which the heat medium flows.
[0065] 7, in pattern E, groove 211 of upper body 210, through hole 221 and through hole 222 of drive plate 220, and groove 234a (P3) and groove 234c (P10) of lower body 230 overlap in the Z direction. This allows port P3 to communicate with port P10.
[0066] In pattern E, groove 212 of upper body 210, through hole 223 and through hole 224 of drive plate 220, and groove 234a (P4) and groove 234c (P7) of lower body 230 overlap in the Z direction. This allows port P4 and port P7 to communicate with each other.
[0067] In pattern E, groove 213 of upper body 210, through hole 225 and through hole 226 of drive plate 220, and groove 234a (P2) and groove 234a (P8) of lower body 230 overlap in the Z direction. This allows port P2 to communicate with port P8.
[0068] In pattern E, groove 214 of upper body 210, through hole 227 and through hole 228 of drive plate 220, and groove 234a (P6) and groove 234a (P1) of lower body 230 overlap in the Z direction. This allows port P1 and port P6 to communicate with each other.
[0069] In the circuit pattern E, a first closed circuit is formed in which the heat medium flows through the PCU 133, the bypass path 252, the chiller 160, and the bypass path 251 in this order, and the low-temperature radiator 122 and the battery 172 are each independent (separated). In the circuit pattern E, the PCU 133 can be cooled, and the waste heat of the PCU 133 can be used for heat pump heating.
[0070] 8, in pattern F, groove 211 of upper body 210, through hole 221 and through hole 222 of drive plate 220, and groove 234a (P4) and groove 234a (P8) of lower body 230 overlap in the Z direction. This allows port P4 to communicate with port P8.
[0071] In pattern F, groove 212 of upper body 210, through hole 223 and through hole 224 of drive plate 220, and groove 234a (P6) and groove 234a (P1) of lower body 230 overlap in the Z direction. This allows port P1 and port P6 to communicate with each other.
[0072] In pattern F, groove 213 of upper body 210, through hole 225 and through hole 226 of drive plate 220, and groove 234a (P3) and groove 234b (P9) of lower body 230 overlap in the Z direction. This allows port P3 and port P9 to communicate with each other.
[0073] In pattern F, groove 214 of upper body 210, through hole 227 and through hole 228 of drive plate 220, and groove 234b (P5) and groove 234a (P2) of lower body 230 overlap in the Z direction. This allows port P2 and port P5 to communicate with each other.
[0074] In the circuit pattern F, a first closed circuit is formed in which a heat medium flows through the PCU 133 and the low-temperature radiator 122, and a second closed circuit is formed in which a heat medium flows through the battery 172 and the chiller 160. In the circuit pattern F, the PCU 133 can be cooled by the low-temperature radiator 122, and the battery 172 can be cooled by the chiller 160.
[0075] 9, in pattern G, groove 211 of upper body 210, through hole 221 and through hole 222 of drive plate 220, and groove 234a (P6) and groove 234a (P3) of lower body 230 overlap in the Z direction. This allows port P3 and port P6 to communicate with each other.
[0076] In pattern G, groove 212 of upper body 210, through hole 223 and through hole 224 of drive plate 220, and groove 234c (P7) and groove 234a (P2) of lower body 230 overlap in the Z direction. This allows port P2 and port P7 to communicate with each other.
[0077] In pattern G, groove 213 of upper body 210, through hole 225 and through hole 226 of drive plate 220, and groove 234a (P4) and groove 234a (P8) of lower body 230 overlap in the Z direction. This allows port P4 and port P8 to communicate with each other.
[0078] In pattern G, groove 214 of upper body 210, through hole 227 and through hole 228 of drive plate 220, and groove 234a (P1) and groove 234b (P9) of lower body 230 overlap in the Z direction. This allows port P1 to communicate with port P9.
[0079] In the circuit pattern G, a first closed circuit is formed in which the heat medium flows through the PCU 133, the bypass path 251, the chiller 160, and the low-temperature radiator 122 in this order, and the battery 172 is independent (separated). In the circuit pattern G, heating is possible using the heat of the PCU 133, and excess heat can be dissipated from the low-temperature radiator 122. In addition, a decrease in the temperature of the battery 172 is suppressed.
[0080] 10, in pattern H, groove 211 of upper body 210, through hole 221 and through hole 222 of drive plate 220, and groove 234c (P7) and groove 234a (P4) of lower body 230 overlap in the Z direction. This allows port P4 to communicate with port P7.
[0081] In pattern H, groove 212 of upper body 210, through hole 223 and through hole 224 of drive plate 220, and groove 234a (P1) and groove 234c (P10) of lower body 230 overlap in the Z direction. This allows port P1 to communicate with port P10.
[0082] In pattern H, groove 213 of upper body 210, through hole 225 and through hole 226 of drive plate 220, and groove 234a (P6) and groove 234a (P3) of lower body 230 overlap in the Z direction. This allows port P3 and port P6 to communicate with each other.
[0083] In pattern H, groove 214 of upper body 210, through hole 227 and through hole 228 of drive plate 220, and groove 234a (P2) and groove 234a (P8) of lower body 230 overlap in the Z direction. This allows port P2 and port P8 to communicate with each other.
[0084] In the circuit pattern H, a first closed circuit in which the heat medium flows through the PCU 133 and the bypass path 251 and a second closed circuit in which the heat medium flows through the chiller 160 and the bypass path 252 are formed, and the low-temperature radiator 122 and the battery 172 are each independent (separated). In the circuit pattern H, it is possible to store heat from the PCU 133. Also, heat pump heating using the waste heat of the PCU 133 is possible.
[0085] As described above, in the first embodiment, the ten-way valve 200 can switch the state of the heat management circuit 100 to any one of the circuit patterns AH.
[0086] [Second embodiment] The second embodiment uses a ten-way valve 400, unlike the first embodiment in which the ten-way valve 200 is used. The same components as those in the first embodiment are denoted by the same reference numerals as those in the first embodiment, and the description thereof will not be repeated.
[0087] 11 is a schematic diagram showing a thermal management circuit 300 in the second embodiment. The thermal management circuit 300 differs from the thermal management circuit 100 in the first embodiment in that a switching device 450 (ten-way valve 400) is provided instead of the switching device 250 (ten-way valve 200) in the first embodiment. The ten-way valve 400 is an example of the "valve body unit" of the present disclosure.
[0088] To the ten-way valve 400, the battery circuit 170, the unit circuit 130, a flow path 161a connected to the chiller 160, and a flow path connected to the low-temperature radiator 122 are connected.
[0089] The ten-way valve 400 includes an inner periphery side unit 410 and an outer periphery side unit 420. The outer periphery side unit 420 is disposed so as to surround the inner periphery side unit 410 from the outer periphery side. In other words, the outer periphery side unit 420 is formed in an annular shape.
[0090] The inner circumference side unit 410 rotates about a rotation center line β (see FIG. 12). The outer circumference side unit 420 is fixed and does not rotate. That is, the inner circumference side unit 410 rotates relative to the outer circumference side unit 420.
[0091] The inner periphery side unit 410 includes an outer periphery wall 411 that extends in an annular shape centered on a rotation center line β (see FIG. 12). The inner periphery side unit 410 also includes a groove portion 412, a groove portion 413, a groove portion 414, and a groove portion 415. Each of the groove portions 412 to 415 is formed so as to penetrate the inner periphery side unit 410. As will be described in detail later, the groove portions 412 and 413, and the groove portions 414 and 415 are disposed at different positions in the Z direction. The outer periphery wall 411 is an example of a "first outer periphery wall" of the present disclosure. Each of the groove portions 412 and 413 is an example of a "first inner periphery side groove portion" of the present disclosure. Each of the groove portions 414 and 415 is an example of a "second inner periphery side groove portion" of the present disclosure.
[0092] Each of grooves 412 to 415 is formed so as to extend in an arc shape when viewed from the Z1 side. Groove 412 and groove 413 are disposed opposite each other so as to form a V shape. Groove 414 and groove 415 are disposed opposite each other so as to form a V shape. The V shape formed by groove 412 and groove 413 is formed at a position where the V shape formed by groove 414 and groove 415 is inverted by 180 degrees.
[0093] The grooves 412 and 414 are provided so as to intersect with each other when viewed from the Z1 side. The grooves 413 and 415 are provided so as to intersect with each other when viewed from the Z1 side.
[0094] 12 is a perspective view of the inner circumference side unit 410. The inner circumference side unit 410 is integrally formed by stacking a disc-shaped upper portion 416 and a disc-shaped lower portion 417. The inner circumference side unit 410 has a cylindrical shape. The upper portion 416 is disposed on the Z1 side of the lower portion 417. The upper portion 416 and the lower portion 417 are examples of the "first portion" and the "second portion" of the present disclosure, respectively.
[0095] In the outer peripheral wall 411, openings 412a and 412b are formed at a Z direction position (hereinafter, position PU) corresponding to the upper stage portion 416. The groove portion 412 connects the openings 412a and 412b. In the outer peripheral wall 411, openings 413a and 413b are formed at position PU. The groove portion 413 connects the openings 413a and 413b. Each of the openings 412a, 412b, 413a, and 413b is an example of a "first inner peripheral opening" in this disclosure.
[0096] In the outer peripheral wall 411, openings 414a and 414b are formed at a Z direction position (hereinafter, position PL) corresponding to the lower portion 417. The groove portion 414 connects the openings 414a and 414b. In the outer peripheral wall 411, openings 415a and 415b are formed at position PL. The groove portion 415 connects the openings 415a and 415b. Each of the openings 414a, 414b, 415a, and 415b is an example of a "second inner peripheral opening" in this disclosure.
[0097] The openings of the grooves 412 to 415 are spaced apart from one another in the circumferential direction of the inner circumferential side unit 410.
[0098] 13 is a cross-sectional view of the ten-way valve 400 at a position PU of the inner unit 410. The outer unit 420 includes an outer wall 421, an inner wall 422, and a plurality of partition walls 423. The outer wall 421 is an example of a "second outer wall" in the present disclosure.
[0099] Each of the outer peripheral wall 421 and the inner peripheral wall 422 extends in an annular shape centered on the rotation center line β. The inner peripheral wall 422 is provided on the rotation center line β side of the outer peripheral wall 421.
[0100] The partition walls 423 circumferentially divide the space between the outer peripheral wall 421 and the inner peripheral wall 422. This divides the space into eight grooves S1 to S8. Each of the grooves S1 to S8 is an example of the "outer peripheral groove" of the present disclosure.
[0101] The partition wall 423 includes a partition wall 423a that is formed to extend in the radial direction and connects the outer peripheral wall 421 and the inner peripheral wall 422. The partition wall 423b also connects parts of the inner peripheral wall 422 that are provided at different positions in the circumferential direction. At the position PU, the groove portion S1 and the groove portion S2 are partitioned in the circumferential direction by the partition wall 423b. The other adjacent groove portions are partitioned in the circumferential direction by the partition wall 423a. The partition wall 423b has a U-shape when viewed from the Z1 side.
[0102] Openings 424a to 424h (see FIGS. 13 to 15) are formed in grooves S1 to S8, respectively. Openings 424a to 424h are in communication with ports P11 to P18, respectively, of ten-way valve 400. Each of openings 424a to 424h is an example of a "second outer periphery side opening" in this disclosure.
[0103] The port P11 is an outlet port through which the heat medium flows out toward the battery circuit 170. The port P12 is an inlet port through which the heat medium flows in from the battery circuit 170. The port P13 is an outlet port through which the heat medium flows out toward the unit circuit 130 (such as the PCU 133). The port P14 is an inlet port through which the heat medium flows in from the unit circuit 130 (such as the PCU 133). The port P15 is an inlet port through which the heat medium flows in from the low-temperature radiator 122. The port P16 is an outlet port through which the heat medium flows out toward the low-temperature radiator 122. The port P17 is an outlet port through which the heat medium flows out toward the chiller 160 (flow path 161a). The port P18 is an inlet port through which the heat medium flows in from the chiller 160 (flow path 161a).
[0104] Ten openings arranged in a line in the circumferential direction are formed in the inner circumferential wall 422 of the outer circumferential side unit 420. Specifically, openings 425a, 425b, 425c, 425d, 425e, 425f, 425g, 425h, 425i, and 425j are formed in the inner circumferential wall 422. Each of openings 425a to 425j is an example of a "first outer circumferential side opening" in the present disclosure.
[0105] At position PU, the circumferential width (not numbered) of each of openings 425a, 425d, 425e, 425h, 425i, and 425j is approximately twice the circumferential width (not numbered) of each of openings 425b, 425c, 425f, and 425g.
[0106] First, the openings 425a to 425j at the position PU will be described with reference to Fig. 13. The openings 425a to 425j are respectively connected to groove S1, groove S2, groove S1, groove S8, groove S7, groove S6, groove S5, groove S5, groove S4, and groove S3. That is, each of groove S1 and groove S5 is connected to two openings.
[0107] 14 is a cross-sectional view of the ten-way valve 400 at a Z-direction position (position PM) between the upper portion 416 and the lower portion 417. As shown in FIG. 14, the outer periphery side unit 420 includes a partition portion 426a and a partition portion 426b. The partition portion 426a extends perpendicular to the Z direction so as to separate the groove portion S1 and the groove portion S2 in the Z direction. The partition portion 426a is disposed at a circumferential position where the opening 425c in FIG. 13 is provided. The partition portion 426b extends perpendicular to the Z direction so as to separate the groove portion S5 and the groove portion S6 in the Z direction. The partition portion 426b is disposed at a circumferential position where the opening 425g in FIG. 13 is provided.
[0108] 15 is a cross-sectional view of the ten-way valve 400 at position PL. At position PL, eight openings arranged in a line in the circumferential direction are formed in the inner circumferential wall 422 of the outer circumferential side unit 420. Specifically, the inner circumferential wall 422 is formed with openings 425a, 425b, 425d, 425e, 425g, 425h, 425i, and 425j.
[0109] At position PL, the widths (not indicated) in the circumferential direction of each of the openings 425a, 425b, 425d, 425e, 425g, 425h, 425i, and 425j are approximately equal to one another.
[0110] 13, since each of the openings 425a and 425c communicates with the groove portion S1, the heat medium that flows into the groove portion S1 from the opening 425a at the position PL (see FIG. 15) flows out of the groove portion S1 through the opening 425c at the position PU. Therefore, the heat medium flows through the groove portion S1 and moves from the opening 425a to the opening 425c, thereby bypassing the battery 172.
[0111] 13, since opening 425g and opening 425h are each in communication with groove S5, the heat medium that flows into groove S5 from opening 425g at position PU, for example, flows out of groove S5 through opening 425h at position PU. Therefore, the heat medium flows through groove S5 and moves from opening 425g to opening 425h, thereby bypassing low-temperature radiator 122.
[0112] In the second embodiment, the inner periphery side unit 410 rotates to switch the radial overlap state between each of the ten openings (425a to 425j) of the outer periphery side unit 420 and the openings (412a, 412b, 413a, 413b, 414a, 414b, 415a, 415b) of the inner periphery side unit 410. As a result, circuit patterns A to H are formed in the heat management circuit 300, similar to the first embodiment.
[0113] The other configurations are the same as those in the first embodiment, so that the description will not be repeated.
[0114] In the above embodiment, an example has been described in which the thermal management circuit is provided with the high temperature circuit 110, but the present disclosure is not limited to this. The thermal management circuit does not necessarily have to be provided with the high temperature circuit 110.
[0115] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present disclosure is defined by the claims, not by the description of the embodiments described above, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]
[0116] 100, 300 heat management circuit, 200, 400 ten-way valve (valve body unit), 210 upper body (second valve body), 211, 212, 213, 214 groove portion (second groove portion), 220 drive plate (third valve body), 221, 222, 223, 224, 225, 226, 227, 228 through hole, 230 lower body (first valve body), 231 outer peripheral wall, 232 inner peripheral wall, 233 partition wall, 234, 234a, 234b, 234c groove portion (first groove portion), 234d, 234f, 234h opening (first opening), 234e, 234g, 234i opening (second opening), 250, 450 switching device, 410 inner peripheral unit, 411 Outer peripheral wall (first outer peripheral wall), 412, 413 groove portion (first inner peripheral groove portion), 412a, 412b, 413a, 413b opening (first inner peripheral opening), 414, 415 groove portion (second inner peripheral groove portion), 414a, 414b, 415a, 415b opening (second inner peripheral opening), 416 upper stage portion (first portion), 417 lower stage portion (second portion), 420 outer peripheral side unit, 421 outer peripheral wall (second outer peripheral wall), 422 inner peripheral wall, 423, 423a, 423b partition wall, 424a, 424b, 424c, 424d, 424e, 424f, 424g, 424h Opening (second outer opening), 425a, 425b, 425c, 425d, 425e, 425f, 425g, 425h, 425i, 425j Opening (first outer opening), S1, S2, S3, S4, S5, S6, S7, S8 Groove (outer groove), Z direction (axial direction), α, β center line of rotation.
Claims
1. A switching device provided in a thermal management circuit through which a heat medium flows, A valve body unit; a plurality of flow pipes connected to the valve body unit; The valve body unit includes: A disk-shaped first valve body; a disk-shaped second valve body that is rotatable about a rotation center line relative to the first valve body and is disposed on one side of the first valve body in an axial direction along which the rotation center line extends; a disk-shaped third valve body that is disposed so as to be sandwiched between the first valve body and the second valve body in the axial direction and is rotatable around the rotation center line relative to the first valve body, The first valve body is An outer peripheral wall extending annularly about the rotation center line; an inner circumferential wall extending annularly about the rotation center line and formed closer to the rotation center line than the outer circumferential wall; ten partition walls provided to partition a space between the inner peripheral wall and the outer peripheral wall in a circumferential direction around the rotation center line, The first valve body is provided with ten first groove portions formed by the ten partition walls between the outer circumferential wall and the inner circumferential wall, Each of the ten first groove portions has a first opening that is open to the second valve body side and a second opening that is formed in the outer circumferential wall, The second openings, which are a part of the ten first groove portions, allow the heat medium to flow into the first valve body through the plurality of circulation pipes, and the second openings, which are a part of the remaining ten first groove portions, allow the heat medium to flow out of the first valve body through the plurality of circulation pipes, The second valve body is provided with a plurality of fan-shaped second groove portions that are formed to extend circumferentially around the rotation center line and open toward the first valve body side, The third valve body is provided with a plurality of through holes that penetrate the third valve body in the axial direction and are arranged circumferentially around the rotation center line, a switching device in which an overlapping state in the axial direction between the first openings of each of the ten first groove portions, the plurality of second groove portions, and the plurality of through holes is switched by rotating each of the second valve body and the third valve body relative to the first valve body.
2. A switching device provided in a thermal management circuit through which a heat medium flows, A valve body unit; a plurality of flow pipes connected to the valve body unit; The valve body unit includes: a cylindrical inner circumferential unit formed integrally by stacking a disk-shaped first portion and a disk-shaped second portion; an annular outer circumferential side unit that is provided to be rotatable relative to the inner circumferential side unit about a rotation center line and that is disposed so as to surround the inner circumferential side unit from an outer circumferential side, the inner peripheral side unit includes a first outer peripheral wall extending annularly about the rotation center line, When a direction in which the rotation center line extends is defined as an axial direction, the inner unit is formed with two first inner grooves connecting two first inner openings formed in the first outer peripheral wall at an axial position corresponding to the first portion, and two second inner grooves connecting two second inner openings formed in the first outer peripheral wall at an axial position corresponding to the second portion, the two first inner circumference side openings are spaced apart from each other in a circumferential direction about the rotation center line, the two second inner circumferential openings are spaced apart from each other in the circumferential direction, The outer periphery side unit is a second outer peripheral wall extending annularly about the rotation center line; an inner circumferential wall extending annularly about the rotation center line and being provided closer to the rotation center line than the second outer circumferential wall; a plurality of partition walls that partition a space between the second outer peripheral wall and the inner peripheral wall in the circumferential direction, Between the second outer peripheral wall and the inner peripheral wall, eight outer peripheral groove portions formed by the plurality of partition walls are provided, The inner circumferential wall is formed with ten first outer circumferential openings arranged in a line in the circumferential direction, Each of the eight outer circumferential grooves is in communication with a second outer circumferential opening formed in the second outer circumferential wall, a part of the eight outer periphery side grooves allows the heat medium to flow into the outer periphery side unit through the plurality of circulation pipes, and a remaining part of the eight outer periphery side grooves allows the heat medium to flow out of the outer periphery side unit through the plurality of circulation pipes; A switching device in which the radial overlap state of each of the ten first outer-side openings of the outer-side unit and each of the two first inner-side openings and the two second inner-side openings is switched by rotating the outer-side unit relative to the inner-side unit.
Citation Information
Patent Citations
Automobile thermal management module integrated multi-way valve and fluid loop
CN216200823U
Rotary Disc Valve
US20230193906A1
Thermal management system for electric car
JP2021154767A