Small capacitor with internal lead

Abstract

To provide a small capacitor with internal leads that does not require a rubber plug and a plastic plate, and can significantly reduce the height of the capacitor.SOLUTION: A small capacitor with internal leads according to the present invention includes a carrier, a capacitor body, two conductive members, and two leads. The capacitor body is placed on the carrier and includes a capacitor unit and a package structure. The package structure covers the capacitor unit. The conductive members pass through the carrier. The leads pass through the package structure, and the capacitor units are respectively connected to the conductive members through the leads.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to capacitors, and more particularly to miniature capacitors having internal leads. [Background technology]

[0002] Capacitors are common passive components that are widely applied in various circuits to provide different functions. Traditional capacitor package structures mainly include metal shell package structure and epoxy resin injection package structure.

[0003] The metal shell package structure includes a cylindrical metal shell, a capacitor unit (element), two guide pins, and a rubber plug. The capacitor unit is connected to the guide pins, and the guide pins pass through the rubber plug. The cylindrical metal shell is combined with the rubber plug, and the capacitor unit is placed between the cylindrical metal shell and the rubber plug. The rubber plug can provide a sealing effect, but it increases the thickness of the capacitor. In addition, the guide pins are exposed from the cylindrical metal shell, and a plastic plate is required to isolate the guide pins from the cylindrical metal shell, and the above structure increases the thickness of the capacitor. Therefore, the capacitor cannot meet the requirement of miniaturization. In addition, when the capacitor is used as a surface adhesive member, the guide pins need to be flattened and bent, which will damage the structure of the capacitor and reduce the reliability of the capacitor.

[0004] Although the epoxy resin injection package structure can reduce the height of the capacitor, the guide pins are still exposed on the surface of the capacitor, which still cannot meet the demand for miniaturization. Similarly, if the capacitor is used as a surface adhesive member, the guide pins need to be flattened and bent, which will damage the structure of the capacitor and reduce the reliability of the capacitor. Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention provides a miniature capacitor with built-in leads that eliminates the need for rubber plugs and plastic plates and allows for a significant reduction in capacitor height. [Means for solving the problem]

[0006] According to one embodiment of the present invention, there is provided a miniature capacitor with built-in leads, including a carrier, a capacitor body, two conductive members, and two leads. The capacitor body is placed on the carrier and includes a capacitor unit and a packaging structure. The packaging structure covers the capacitor unit. The conductive members pass through the carrier. The leads pass through the packaging structure, and the capacitor units are respectively connected to the conductive members through the leads.

[0007] In one embodiment, each conductive member includes a first conductive pad, at least one via, and a second conductive pad, the first conductive pad being disposed on an upper surface of the carrier, the second conductive pad being disposed on a lower surface of the carrier, and the first conductive pad being connected to the second conductive pad through the at least one via.

[0008] In one embodiment, the leads are covered with a capacitor unit, a packaging structure and a carrier.

[0009] In one embodiment, each lead is L-shaped.

[0010] In one embodiment, each lead includes a bendable section, a weld section, and a conductor section, the bendable section being connected to the conductor section via the weld section, and the conductor section being electrically coupled to a corresponding conductive member.

[0011] In one embodiment, the weld portion includes a connection region and / or a weld region, the connection region being connected to the weld region and the conductor portion being welded to the weld region.

[0012] In one embodiment, the bendable section, the weld section and the conductor section are flattened.

[0013] In one embodiment, the thickness of the welds and conductors is greater than the thickness of the bendable section.

[0014] In one embodiment, the package structure is made of an insulating material.

[0015] In one embodiment, the carrier is a printed circuit board or flexible circuit board or other similar member. Effect of the Invention

[0016] As can be seen from the above, the structure of the capacitor is an integration of the carrier and the leads, and the above integration structure does not require the rubber plug and the plastic plate, and can greatly reduce the height of the capacitor, so that the size of the capacitor can be greatly reduced to meet the demand for miniaturization. [Brief description of the drawings]

[0017] [Figure 1] FIG. 1 is a perspective view of a miniaturized capacitor with internal leads according to one embodiment of the present invention. [Diagram 2] FIG. 1 is a first cross-sectional view of a miniaturized capacitor with built-in leads in accordance with one embodiment of the present invention. [Diagram 3] FIG. 2 is a perspective view of the leads of a miniaturized capacitor having internal leads in accordance with one embodiment of the present invention. [Figure 4] FIG. 2 is a second cross-sectional view of a miniaturized capacitor with internal leads in accordance with one embodiment of the present invention. [Diagram 5] FIG. 1 is a perspective view of a miniaturized capacitor with internal leads in accordance with another embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Hereinafter, an embodiment of a miniature capacitor with built-in leads of the present invention will be described with reference to the associated drawings, and the size and ratio of each component in the drawings may be exaggerated or reduced for clarity and convenience of the description of the drawings. In the following description and / or claims, when a component is described as "connected" or "coupled" to another component, it may be directly connected or coupled to the other component, or an intervening component may be present. When a component is described as being "directly connected" or "directly coupled" to another component, no intervening component is present, and other terms used to describe the relationship between components or layers should be interpreted similarly. For ease of understanding, the same components in the following embodiments will be described with the same reference numerals.

[0019] 1 and 2 are a perspective view and a first cross-sectional view of a small capacitor with built-in leads according to one embodiment of the present invention. As shown in the figures, capacitor 1 includes a carrier 11, a capacitor body 12, two conductive members 13, and two leads 14. The structural design of capacitor 1 can be applied to film capacitors, aluminum solid wound capacitors, aluminum solid laminate capacitors, tantalum capacitors, etc.

[0020] The capacitor body 12 is mounted on a carrier 11. The capacitor body 12 includes a capacitor unit (element) 121 and a package structure 122. The package structure 122 covers the capacitor unit 121. In one embodiment, the package structure 122 may be made of an insulating material, such as an insulating adhesive. In one embodiment, the carrier 11 may be a printed circuit board or other similar member. In another embodiment, the carrier 11 may be a flexible circuit board or other similar member.

[0021] These conductive members 13 pass through the carrier 11. Each conductive member 13 includes a first conductive pad 131, a number of vias 132 (the conductive member 13 in this embodiment has three vias 132, but is not limited thereto), and a second conductive pad 133. The first conductive pad 131 is disposed on the upper surface of the carrier 11, and the second conductive pad 133 is disposed on the lower surface of the carrier 11. The first conductive pad 132 is connected to the second conductive pad 133 through these vias 132. In another embodiment, the structure of the conductive member 13 can also be changed according to actual needs. In an embodiment, the material of the conductive member 13 can be copper, tin, iron, aluminum, or various other metallic or non-metallic conductive materials.

[0022] The leads 14 pass through the package structure 122, and each lead 14 may be L-shaped. One lead 14 may be located on one side of another lead 14, i.e., the leads 14 may be arranged side by side. In this way, the capacitor units 121 are connected via the leads 14 and the conductive members 13, respectively. In one embodiment, the material of the leads 14 may be copper, tin, iron, or various other conductive materials.

[0023] From the above, it can be seen that these leads 14 are installed in the package structure 122 and are located among the capacitor unit 121, the package structure 122 and the carrier 11. In this way, these leads 14 are covered by the capacitor unit 121, the package structure 122 and the carrier 11, and are not exposed on the surface of the capacitor 1. With the above structure, the capacitor 1 can effectively integrate the carrier 11 and the multiple built-in leads 14, so that the rubber plug and the plastic skin can be omitted. In this way, the overall structure of the capacitor 1 is simplified, and the height of the capacitor 1 is greatly reduced. Therefore, the size of the capacitor 1 can be greatly reduced to meet the requirement of miniaturization.

[0024] In addition, the leads 14 of the capacitor 1 are built-in type and are not exposed on the surface of the capacitor 1. In addition, the capacitor 1 has a plurality of conductive members 13 installed on the bottom of the carrier 11. With the above structure, the capacitor 1 can be directly electrically connected to other members through the conductive members 13. Therefore, when the capacitor 1 is used as a surface-adhesive member, it is not necessary to flatten and bend the leads 14 of the capacitor 1, and damage to the structure of the capacitor 1 can be avoided. Therefore, the capacitor 1 can achieve higher structural stability, and the reliability of the capacitor 1 can be effectively improved.

[0025] Of course, this embodiment is for illustrative purposes only, and does not limit the scope of the present invention, and any equivalent modifications or variations based on the small capacitor with built-in leads of this embodiment should still fall within the scope of protection of the present invention.

[0026] 3 and 4 are a perspective view and a second cross-sectional view of a miniature capacitor with built-in leads according to an embodiment of the present invention. FIG. 3 shows the structure of lead 14 before being coupled to capacitor unit 121. As shown in FIG. 3, lead 14 includes bendable portion 141, welded portion 142, and conductor portion 143. Bendable portion 141, welded portion 142, and conductor portion 143 are flat, and the materials of bendable portion 141, welded portion 142, and conductor portion 143 may be the same or different. Bendable portion 141 is connected to conductor portion 143 via welded portion 142, and conductor portion 143 may be welded to welded portion 142. In this embodiment, the thickness of welded portion 142 and conductor portion 143 is greater than the thickness of bendable portion 141. In another embodiment, the thickness of welded portion 142 and conductor portion 143 may be equal to or less than the thickness of bendable portion 141.

[0027] Of course, this embodiment is for illustrative purposes only, and does not limit the scope of the present invention, and any equivalent modifications or variations based on the small capacitor with built-in leads of this embodiment should still fall within the scope of protection of the present invention.

[0028] 4 shows the structure after the lead 14 and the capacitor unit 121 are combined. As shown in FIG. 4, the capacitor 1 and the lead 14 are L-shaped (only one of the leads 14 is shown in the figure). As described above, the lead 14 includes a bendable portion 141, a welding portion 142, and a conductor portion 143, but as shown in FIG. 4, the bendable portion 141 is bent at a certain angle. The welding portion 142 includes a connection region 1421 or a welding region 1422, so that the conductor portion 143 can be welded to the welding region 1422 of the welding portion 142.

[0029] The capacitor unit 121 is connected to the corresponding conductive member 13 via the lead 14. Here, the conductor portion 143 of the lead 14 is electrically coupled to the corresponding conductive member 13. For example, the conductor portion 143 can be welded to the conductive member 13 to electrically couple the conductor portion 143 and the conductive member 13. As another example, the conductor portion 143 can be adhered to the conductive member 13 via a conductive adhesive to electrically couple the conductor portion 143 and the conductive member 13. As described above, the conductor portion 143 is flat, which increases the contact area with the conductive member 13 (first conductive pad 131) and achieves better electrical connection.

[0030] As can be seen from the above, lead 14 has bendable portion 141, and making lead 14 L-shaped allows for the formation of a bridge structure that makes effective use of space. With the above structure, capacitor unit 121 and conductive member 13 are electrically connected, and the overall height of capacitor 1 can be kept as low as possible.

[0031] In addition, a person skilled in the art should understand that the guide pins of the conventional capacitor include part A, part B and CP line. Part B needs to be inserted into the corresponding hole of the rubber plug, so it needs to be thick and cylindrical so that it can be tightly fitted into the hole of the rubber plug. The above structure cannot reduce the overall size of the conventional capacitor. In addition, the guide pins are exposed from the cylindrical metal shell, and a plastic plate is further required to isolate these guide pins from the cylindrical metal shell, and the above structure also increases the thickness of the capacitor s. In addition, when the conventional capacitor is used as a surface adhesive member, these guide pins need to be flattened and bent, which will damage the structure of the capacitor and reduce the reliability of the capacitor.

[0032] In contrast, the leads 14 of this embodiment are flat, which can reduce the overall size of the capacitor 1. The leads 14 have bendable portions 141, and are L-shaped to form a bridge structure that can effectively utilize space, thereby reducing the overall height of the capacitor 1. This allows the size of the capacitor 1 to be reduced, meeting the demand for miniaturization, allowing for wider applications, and providing greater flexibility in use.

[0033] In addition, the leads 14 of the capacitor 1 are not exposed on the surface of the capacitor 1. When the capacitor 1 is used as a surface-adhesive member, the capacitor 1 can be directly electrically connected to other members via the conductive member 13, and there is no need to bend the leads 14 flat. The above structure can avoid damaging the structure of the capacitor 1. Therefore, the capacitor 1 can achieve higher structural stability, and the reliability of the capacitor 1 can be effectively improved.

[0034] Of course, this embodiment is for illustrative purposes only, and does not limit the scope of the present invention, and any equivalent modifications or variations based on the small capacitor with built-in leads of this embodiment should still fall within the scope of protection of the present invention.

[0035] 5 is a cross-sectional view of a miniature capacitor with built-in leads according to another embodiment of the present invention. As shown in the figure, the capacitor 1 includes a carrier 11, a capacitor body 12, two conductive members 13, and two leads 14.

[0036] Since each of the above members is similar to the above embodiment, detailed description will not be repeated here. The difference from the above embodiment is that the leads 14 of this embodiment are arranged in a straight line, not in parallel. Also, the leads 14 are metal wires such as copper, iron, and aluminum (which may have a circular or elliptical cross section). The leads 14 may also adopt the structure of the above embodiment, that is, the leads 14 are flat and may include a bendable portion 141, a welded portion 142, and a conductive portion 143 (which may have a rectangular cross section).

[0037] Of course, this embodiment is for illustrative purposes only, and does not limit the scope of the present invention, and any equivalent modifications or variations based on the small capacitor with built-in leads of this embodiment should still fall within the scope of protection of the present invention.

[0038] In summary, according to an embodiment of the present invention, a capacitor has a carrier, a capacitor body, two conductive members and two leads. The capacitor body is disposed on the carrier and includes a capacitor unit and a packaging structure. The packaging structure covers the capacitor unit. The conductive members pass through the carrier. The leads pass through the packaging structure, and the capacitor unit is respectively connected to the conductive members through the leads. As can be seen from the above, the structure of the capacitor integrates the carrier and the built-in leads, and the above integrated structure does not require a rubber plug and a plastic plate, and can greatly reduce the height of the capacitor. Therefore, the size of the capacitor can be greatly reduced to meet the demand for miniaturization.

[0039] In addition, according to an embodiment of the present invention, the capacitor has multiple built-in leads, each lead is L-shaped, and the capacitor units are respectively connected to the conductive members through the leads. In this way, the space occupied by the capacitor leads can be minimized, and the size of the capacitor can be further reduced to meet the demand for miniaturization. Therefore, the capacitor can be applied in a wider range and used more flexibly.

[0040] In addition, according to an embodiment of the present invention, the capacitor adopts built-in leads and has a number of conductive members installed at the bottom of the carrier. Therefore, the leads of the capacitor are not exposed on the surface of the capacitor. With the above structure, the capacitor can be directly electrically connected to other members through the conductive members, so there is no need to flatten and bend the leads of the capacitor. With the above structure, the structure of the capacitor can be avoided from being damaged. Therefore, the capacitor can achieve higher structural stability and effectively improve the reliability of the capacitor.

[0041] Moreover, according to the embodiment of the present invention, the capacitor is designed simply, so that the desired effect can be achieved without significantly increasing the cost, and therefore the capacitor can achieve higher practicality and better meet the needs of practical applications.

[0042] As can be seen from the above, the present invention does indeed break through the conventional technology and achieves the desired effect, and is not obvious to those skilled in the art. It is believed that its progress and practicality clearly meet the requirements of the patent claims. Therefore, we have filed a patent application in accordance with the law, and we request your approval of this patent application in order to promote our invention.

[0043] The above is merely illustrative and not limiting. Any other equivalent modifications or variations that do not depart from the spirit and scope of the present invention are intended to be included within the scope of the following claims. [Explanation of symbols]

[0044] 1 Capacitor 11 Career 12 Capacitor body 121 Capacitor Unit 122 Package Structure 13 Conductive materials 131 First conductive pad 132 Beer 133 Second conductive pad 14 Lead 141 Bendable part 142 Welding 1421 Connection Area 1422 Welding Area 143 Conductor section

Claims

1. Career and a capacitor body disposed on the carrier, the capacitor body including a capacitor unit and a packaging structure, the packaging structure including a capacitor body covering the capacitor unit; Two conductive members passing through the carrier; two leads passing through said package structure; Including, The capacitor unit is a miniature capacitor having built-in leads that are each electrically connected to the conductive members via the leads.

2. 2. A compact capacitor with built-in leads as described in claim 1, wherein the conductive member includes a first conductive pad, at least one via and a second conductive pad, the first conductive pad being located on an upper surface of the carrier, the second conductive pad being located on a lower surface of the carrier, and the first conductive pad being connected to the second conductive pad through the at least one via.

3. 2. The miniature capacitor with built-in leads as claimed in claim 1, wherein the leads are covered by the capacitor unit, the package structure and the carrier.

4. 2. The miniature capacitor with internal leads of claim 1, wherein each of said leads is L-shaped.

5. 2. The miniature capacitor with built-in leads of claim 1, wherein each of the leads includes a bendable portion, a weld portion, and a conductor portion, the bendable portion being connected to the conductor portion via the weld portion, and the conductor portion being electrically coupled to a corresponding conductive member.

6. 6. The miniature capacitor with built-in leads of claim 5, wherein the welded portion includes a connection region and / or a welding region, the connection region being connected to the welding region and the conductive wire portion being welded to the welding region.

7. 6. The compact capacitor with built-in leads according to claim 5, wherein the bendable portion, the welded portion and the conductive wire portion are flat.

8. 8. The miniature capacitor with built-in leads according to claim 7, wherein the thickness of the welded portion and the conductive wire portion is greater than the thickness of the bendable portion.

9. 2. The miniature capacitor with internal leads of claim 1, wherein the package structure is made of insulating material.

10. 2. The miniature capacitor with internal leads of claim 1, wherein the carrier is a printed circuit board or a flexible circuit board.

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