Relay movable spring capable of reducing temperature rise, and relay

Abstract

To provide a relay with multiple contact structures for reducing the temperature rise.SOLUTION: A relay movable spring capable of reducing temperature rise comprises movable contacts, a movable spring plate, and a movable spring lead-out plate. The movable spring plate has opposite first and second ends. The first end is connected to the movable spring lead-out plate; the movable spring plate comprises at least two current-carrying conductors; at least two movable contacts are provided, which are fixed to the at least two current-carrying conductors respectively, and which are close to the second end of the movable spring plate, so that the movable spring plate forms at least two parallel connection structures; and a connecting sheet is also mounted on the movable spring plate, the connecting sheet connecting to the at least two movable contacts.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to the field of relay technology, and more particularly to a movable spring of a relay and a relay. [Background technology]

[0002] A relay is an electronic control device that has a control system (also called input circuit) and a controlled system (also called output circuit), and is generally applied in automatic control circuits. A relay is actually an automatic switch that controls a large current with a small current, and thus plays the role of automatic adjustment, safety protection, conversion circuit, etc. in the circuit. A relay belongs to elements that are sensitive to heat, and when the allowable temperature is exceeded, the deterioration of the plastic and insulating materials inside the relay will accelerate, the contacts will be oxidized and corroded, making it difficult to extinguish the arc, the technical parameters of the electrical element will be attenuated, and the reliability will be reduced, among other adverse effects.

[0003] The movable spring in a relay is a component that is prone to temperature rise, and most movable springs are composed of a movable contact, a movable spring plate, and a movable spring lead plate, the movable contact is fixed to one end of the movable spring plate, and the other end of the movable spring plate is fixed to the movable spring lead plate. During the operation of the relay, the end of the movable spring plate to which the movable contact is fixed swings around the other end of the movable spring plate (the end fixed to the movable spring lead plate), and the movable spring plate is both an operating member and a current carrier, so the movable spring plate is the component in the movable spring that is most prone to temperature rise. In the prior art, the product is generally made to meet the temperature requirements by adjusting the rated current within an appropriate range. With the expansion of the application range of relays, the relay is also developed in the direction of high load and miniaturization, and the improvement of the rated current inevitably increases the temperature of the movable spring plate, and how to effectively reduce the temperature rise of the movable spring plate has become an issue that needs to be resolved as soon as possible. Summary of the Invention

[0004] The object of the present invention is to solve the shortcomings of the prior art and provide a movable spring for a relay capable of reducing temperature rise, by improving the structure, reducing the effect of temperature rise caused by an increase in rated current, meeting the requirements for temperature rise, and eliminating such disadvantages as accelerated deterioration of plastic and insulating materials inside the relay, oxidation and corrosion of contacts making arc extinguishing difficult, degradation of technical parameters of electrical elements, and reduced reliability caused by the temperature rise of the relay exceeding the requirements. The technical solution used by the present invention to solve the technical problem is as follows: A movable spring of a relay capable of reducing temperature rise, comprising a movable contact, a movable spring plate and a movable spring lead plate, the movable spring plate has a first end and a second end opposite to each other, the first end is connected to the movable spring lead plate, the movable spring plate comprises at least two current carrier conductors, the movable contacts are at least two, and are respectively fixed to the at least two current carrier conductors and adjacent to the second end of the movable spring plate, whereby the movable spring plate forms at least two parallel connection structures, a connecting sheet is further attached to the movable spring plate, and the connecting sheet is connected to the at least two movable contacts.

[0005] According to one embodiment of the present invention, at least one linear slit extends along a direction from the second end towards the first end of the movable spring plate, said at least one linear slit dividing the movable spring plate into said at least two current carrying conductors.

[0006] According to an embodiment of the present invention, at least one of the at least two current carrier conductors of the movable spring plate has a large width dimension.

[0007] According to an embodiment of the present invention, at least one of the at least two movable contacts has a large thickness dimension.

[0008] According to one embodiment of the present invention, the movable contact having the larger thickness dimension is fixed to the current-carrying conductor having the larger width dimension.

[0009] According to one embodiment of the present invention, the movable spring plate includes a plurality of stacked sub-spring plates.

[0010] According to one embodiment of the present invention, the intermediate portion of the movable spring plate is provided with a U-shaped bend.

[0011] According to one embodiment of the present invention, the movable spring plate includes a first sub-spring plate, a second sub-spring plate, a third sub-spring plate and a fourth sub-spring plate stacked in sequence, the first sub-spring plate, the second sub-spring plate, the third sub-spring plate and the fourth sub-spring plate are each provided with two straight slits, thereby forming three current-carrying conductors, the movable contacts are two or three, and are respectively fixed to corresponding current-carrying conductors, so that the movable spring plate forms a three-parallel connection structure, the current-carrying conductors of the first sub-spring plate, the second sub-spring plate and the third sub-spring plate are each provided with a U-shaped bend, and the current-carrying conductor of the fourth sub-spring plate is not provided with a U-shaped bend.

[0012] According to one embodiment of the present invention, the current carrying conductor of the fourth sub-spring plate is provided with an arc-shaped slit, the arc-shaped slit being located on one side of the movable contact away from the movable spring draw plate, thereby allowing the end of the current carrying conductor of the fourth sub-spring plate away from the movable spring draw plate to elastically swing.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0014] In the present invention, the movable spring plate includes at least two current carrier conductors, and the movable contacts are at least two and are respectively fixed to the corresponding current carrier conductors, so that the movable spring plate forms at least two parallel connection structures, and can reduce the current passing through each current carrier conductor, thereby reducing the temperature rise. In addition, the movable spring plate further has a stripe-shaped connection sheet attached to the surface that matches the fixed contacts of the relay, and the stripe-shaped connection sheet is connected to each movable contact, which can ensure that the contact gaps are consistent when the movable contacts and the fixed contacts are separated, and reduce the problem of the contact gaps not being consistent caused by the distortion of the push part when it is pushed. Furthermore, in the movable spring plate of the present invention, the width dimension of at least one of the at least two current carrier conductors is designed to be relatively large, the thickness dimension of at least one of the at least two movable contacts is designed to be relatively large, and the movable contact with the larger thickness dimension is fixed to the current carrier conductor with the larger width dimension. Such a structure of the present invention can maintain the total resistance of the movable spring plate in a small contact resistance state, thereby reducing the temperature rise.

[0015] The movable spring of the relay capable of reducing temperature rise of the present invention has an improved structure, which reduces the effect of the temperature rise of the movable spring plate caused by an increase in the rated current when the rated current is increased, and eliminates problems such as accelerating the deterioration of the plastic and insulating materials inside the relay due to the relay temperature rise exceeding the requirements, oxidizing and corroding the contacts and making it difficult to extinguish the arc, deteriorating the technical parameters of the electrical elements, and reducing reliability. According to another aspect of the present invention, a relay includes a movable spring of the temperature rise reducing relay of the present invention.

[0016] According to another aspect of the present invention, a relay having a multiple contact structure includes a base, a magnetic path structure, and at least two contact structures, the magnetic path structure includes an armature, and each of the contact structures includes a movable spring. Wherein, the base is provided with at least two grooves, the number of which is equal to the number of the contact structures. The at least two grooves are respectively installed on opposite sides of the base, and the at least two grooves are alternately arranged in a row. The at least two contact structures are respectively mounted in the at least two grooves. The magnetic path structure is mounted in the base, and is associated with the movable springs of the at least two contact structures, respectively, so that when the magnetic path structure operates, it drives the operation of the corresponding movable spring.

[0017] According to one embodiment of the present invention, the magnetic path structure and one of the at least two contact structures are mounted in the same groove, a through hole is provided between two adjacent grooves, and the armature is connected to the movable spring through the through hole.

[0018] According to one embodiment of the present invention, a baffle is further provided in the groove in which the magnetic path structure and the contact structure are mounted to achieve separation between strong and weak currents, and the baffle is located between the contact structure and the magnetic path structure.

[0019] According to one embodiment of the present invention, there are two contact structures, and one of the contact structures attached to the same groove as the magnetic path structure is attached to the groove at a position closer to the other contact structure than the magnetic path structure.

[0020] According to one embodiment of the present invention, the armature further includes a push portion, the armature is H-shaped, and both ends of the armature are connected to the push portion and are connected to the movable spring via the push portion.

[0021] According to one embodiment of the present invention, the movable spring includes a movable contact, a movable spring plate and a movable spring pull-out plate, the movable spring plate has opposite first and second ends, the first end is connected to the movable spring pull-out plate, the movable spring plate includes at least two current carrier conductors, the movable contacts are at least two and are respectively fixed to the at least two current carrier conductors and adjacent to the second end of the movable spring plate, whereby the movable spring plate forms at least two parallel connection structures.

[0022] According to one embodiment of the present invention, at least one linear slit extends along a direction from the second end towards the first end of the movable spring plate, said at least one linear slit dividing the movable spring plate into said at least two current carrying conductors.

[0023] According to an embodiment of the present invention, at least one of the at least two current carrier conductors of the movable spring plate has a large width dimension.

[0024] According to an embodiment of the present invention, at least one of the at least two movable contacts has a large thickness dimension.

[0025] According to one embodiment of the present invention, the movable contact having the larger thickness dimension is fixed to the current-carrying conductor having the larger width dimension.

[0026] According to an embodiment of the present invention, a connecting sheet is further attached to the movable spring plate, and the connecting sheet is connected to the at least two movable contacts.

[0027] According to one embodiment of the present invention, the movable spring plate includes a plurality of stacked sub-spring plates.

[0028] According to one embodiment of the present invention, the intermediate portion of the movable spring plate is provided with a U-shaped bend.

[0029] According to one embodiment of the present invention, the movable spring plate includes a first sub-spring plate, a second sub-spring plate, a third sub-spring plate and a fourth sub-spring plate stacked in sequence, the first sub-spring plate, the second sub-spring plate, the third sub-spring plate and the fourth sub-spring plate are each provided with two straight slits, thereby forming three current-carrying conductors; the movable contacts are two or three, and are respectively fixed to the current-carrying conductor of the first sub-spring plate, so that the movable spring plate forms three parallel connection structures; the current-carrying conductors of the first sub-spring plate, the second sub-spring plate and the third sub-spring plate are each provided with a bent portion, and the current-carrying conductor of the fourth sub-spring plate is not provided with a bent portion.

[0030] According to one embodiment of the present invention, the current carrying conductor of the fourth sub-spring plate is provided with an arc-shaped slit, the arc-shaped slit being located on one side of the movable contact away from the movable spring draw plate, thereby allowing the end of the current carrying conductor of the fourth sub-spring plate away from the movable spring draw plate to elastically swing. Compared with the prior art, the beneficial effects of the relay with the multi-contact structure of the present invention are as follows:

[0031] In the present invention, the base is provided with at least two grooves, the number of which is equal to the number of the contact structures, and the at least two grooves are provided on opposite sides of the base, respectively, and are alternately arranged in a row. Each contact structure is mounted in a corresponding groove. The magnetic path structure is mounted in the base, and is associated with a movable spring in each contact structure, respectively. This structure of the present invention provides spatial separation between each contact structure, and when the rated current is increased, it can reduce the effect of temperature rise caused by the increase in rated current, meet the temperature rise requirements, and eliminate the adverse effects such as accelerating the deterioration of plastic and insulating materials inside the relay, oxidation and corrosion of the contacts making it difficult to extinguish arcs, attenuation of the technical parameters of the electrical elements, and reduced reliability.

[0032] In addition, the movable spring plate in the present invention is divided into at least two current-carrying conductors by a slit, and one movable contact is fixed to each current-carrying conductor, so that the movable spring plate forms at least two parallel connection structures. Such a structure of the present invention can reduce the current passing through each current-carrying conductor by designing the contact structure into a multi-set parallel connection structure of contacts, thereby reducing the temperature rise.

[0033] Furthermore, the width dimension of one of the current carrier conductors of the movable spring plate is designed to be larger than the width dimension of the other current carrier conductor, and the thickness dimension of one of the movable contacts is designed to be larger than the thickness dimension of the other movable contact, and the movable contact with the relatively larger thickness dimension is fixed to the current carrier conductor with the relatively larger width dimension. Such a structure of the present invention can maintain the total resistance of the movable spring plate in a small contact resistance state, thereby reducing the temperature rise.

[0034] In addition, a connecting sheet is further attached to the surface of the movable spring plate facing the fixed contact, and the connecting sheet is connected between each of the movable contacts. This structure of the present invention can ensure that the contact gaps are consistent when separated, and reduces the difference in the contact gaps caused by distortion during the pushing process of the push part.

[0035] According to another aspect of the present invention, a movable spring of a relay capable of reducing temperature rise includes a movable contact, a movable spring plate, and a movable spring extension plate, one end of the movable spring plate is connected to the movable spring extension plate, the movable spring plate includes at least two current carrier conductors, the movable contacts are at least two and are fixed to the at least two current carrier conductors respectively, and a connecting sheet is further attached to the movable spring plate, and the connecting sheet is connected to the at least two movable contacts.

[0036] According to one embodiment of the present invention, at least one straight slit extends along a direction from one end of the movable spring plate to one end connected to the movable spring pull-out plate, dividing the movable spring plate into at least two current-carrying conductors, so that the movable spring plate forms at least two parallel connection structures.

[0037] According to an embodiment of the present invention, at least one of the at least two current carrier conductors of the movable spring plate has a large width dimension.

[0038] According to an embodiment of the present invention, at least one of the at least two movable contacts has a large thickness dimension.

[0039] According to one embodiment of the present invention, the movable contact having the larger thickness dimension is fixed to the current-carrying conductor having the larger width dimension.

[0040] According to one embodiment of the present invention, the movable spring plate includes a plurality of stacked sub-spring plates.

[0041] According to one embodiment of the present invention, the intermediate portion of the movable spring plate is provided with a U-shaped bend.

[0042] According to one embodiment of the present invention, the movable spring plate includes a first sub-spring plate, a second sub-spring plate, a third sub-spring plate and a fourth sub-spring plate stacked in sequence, the first sub-spring plate, the second sub-spring plate, the third sub-spring plate and the fourth sub-spring plate are each provided with two straight slits, thereby forming three current-carrying conductors; the movable contacts are two or three, and are respectively fixed to the current-carrying conductor of the first sub-spring plate, so that the movable spring plate forms three parallel connection structures; the current-carrying conductors of the first sub-spring plate, the second sub-spring plate and the third sub-spring plate are each provided with a bent portion, and the current-carrying conductor of the fourth sub-spring plate is not provided with a bent portion.

[0043] According to one embodiment of the present invention, the current carrying conductor of the fourth sub-spring plate is provided with an arc-shaped slit, the arc-shaped slit being located on one side of the movable contact away from the movable spring draw plate, thereby allowing the end of the current carrying conductor of the fourth sub-spring plate away from the movable spring draw plate to elastically swing.

[0044] Compared with the prior art, the beneficial effects of the movable spring of the relay capable of reducing temperature rise of the present invention are as follows:

[0045] The movable spring plate in the present invention includes at least two current carrier conductors, and the movable contacts are at least two and are respectively fixed to the corresponding current carrier conductors, so that the movable spring plate can form at least two parallel connection structures to reduce the current passing through each current carrier conductor, thereby reducing the temperature rise.

[0046] Furthermore, a striped connecting sheet is further attached to the surface of the movable spring plate for engaging with the fixed contacts of the relay, and the striped connecting sheet is connected to each movable contact, which can ensure that the gaps between the movable contacts and the fixed contacts are consistent when separated, thereby reducing the difference in contact gaps caused by distortion during the pushing process of the push part. Furthermore, in the movable spring plate of the present invention, the width dimension of at least one of the at least two current carrier conductors is designed to be relatively large, and the thickness dimension of at least one of the at least two movable contacts is designed to be relatively large. Such a structure of the present invention can keep the total resistance of the movable spring plate always in a small contact resistance state, thereby reducing the temperature rise.

[0047] The present invention will be described in more detail below with reference to the accompanying drawings and examples, however the relay having a multi-contact structure of the present invention is not limited to the examples. [Brief description of the drawings]

[0048] The above and other features and advantages of the present invention will become more apparent from the following detailed description of illustrative embodiments thereof, taken in conjunction with the accompanying drawings. [Figure 1] FIG. 1 is a schematic diagram showing an assembly structure of an embodiment of a movable spring of a relay capable of reducing a temperature rise according to the present invention. [Diagram 2] FIG. 2 is an exploded schematic diagram of a three-dimensional structure of one embodiment of a movable spring of a relay capable of reducing a temperature rise according to the present invention. [Diagram 3] FIG. 3 is an exploded schematic diagram of one embodiment of a relay of the present invention. [Figure 4] FIG. 4 is an exploded schematic diagram (180 degrees flipped) of one embodiment of a relay of the present invention. [Diagram 5] FIG. 5 is a schematic diagram of the three-dimensional structure of a base of a relay according to an embodiment of the present invention. [Figure 6] FIG. 6 is a schematic diagram (180 degrees inverted) of the three-dimensional structure of the base of an embodiment of a relay of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0049] Exemplary embodiments are described more fully below with reference to the accompanying drawings. However, exemplary embodiments may be implemented in many forms and should not be construed as being limited to the embodiments described herein. Although relative terms such as "above" and "below" are used herein to describe the relative relationship of one component of an icon to another, it should be understood that these terms are used herein merely for convenience, e.g., according to the orientation of the examples shown in the figures. It can be understood that if the icon device is inverted so that it is upside down, the component described as "above" becomes the component that is "below". Other relative terms, such as "top", "bottom", etc., have similar meanings. When a structure is "above" another structure, it can mean that the structure is integrally formed with the other structure, that the structure is "directly" mounted on the other structure, or that the structure is "indirectly" mounted on the other structure via another structure.

[0050] The terms "a," "an," "e" and "said" are used to indicate the presence of one or more elements / components / etc., the terms "comprising" and "having" are used to indicate an open-ended inclusive meaning and mean that additional elements / components / etc. may be present in addition to the recited elements / components / etc., and terms such as "first," "second," etc. are used merely as designations and are not quantitative limitations on their subject matter.

[0051] The relay with multiple contact structures of the present invention includes a base, a magnetic path structure, and at least two contact structures. The base is provided with at least two grooves, the number of which is the same as the number of the contact structures. The at least two grooves are respectively installed on opposite sides of the base, and the at least two grooves are alternately arranged in a row. The at least two contact structures are respectively mounted in the at least two grooves. The magnetic path structure is mounted on the base, and is associated with the movable springs of the at least two contact structures, respectively, so that the magnetic path structure drives the operation of the corresponding movable springs when it operates. The following description will be given taking a relay with two contact structures as an example.

[0052] 1 and 2 , the movable spring of the relay capable of reducing temperature rise of the present invention includes a movable contact 51, a movable spring plate 52, and a movable spring lead-out plate 53. The movable spring plate 52 has a first end and a second end opposite to each other, and the first end is connected to the movable spring lead-out plate 53, and the other second end of the movable spring plate 52 is fixedly connected to the movable contact 51.

[0053] The movable spring plate has at least one linear slit extending in a direction from the second end toward the first end connected to the movable spring pull-out plate, thereby dividing the movable spring plate into at least two current-carrying conductors. The movable contacts are at least two and are fixed to corresponding current-carrying conductors, respectively, thereby dividing the movable spring plate into two parallel-connected structures. At least one of the at least two current-carrying conductors has a large width dimension, and at least one of the at least two movable contacts has a large thickness dimension, and the movable contact with the relatively large thickness dimension is fixed to the current-carrying conductor with the relatively large width dimension.

[0054] 1, the movable spring plate 52 is provided with two slits 521 extending in a direction from the second end toward the first end connected to the movable spring pull-out plate 53, thereby dividing the movable spring plate 52 into three current-carrying conductors 522. The movable contacts are three in number and fixed to the corresponding current-carrying conductors 522, respectively, thereby dividing the movable spring plate 52 into three parallel-connected structures.

[0055] In one embodiment, the width dimension of one of the three current carrier conductors of the movable spring plate 52 is designed to be larger than the width dimensions of the other two current carrier conductors 522. The thickness dimension of one of the three movable contacts 51 is designed to be larger than the thickness dimensions of the other two movable contacts, and the movable contact with the relatively larger thickness dimension is fixed to the current carrier conductor with the relatively larger width dimension.

[0056] In one embodiment, the movable spring plate 52 further has a connecting sheet 54 attached to the surface facing the fixed contact, and the connecting sheet 54 is connected between each of the movable contacts 51. Such a structure ensures contact of multiple sets of contacts, and when the movable contacts and the fixed contacts are separated, the connecting sheet 54 connects each of the movable contacts together, and ensures that the gaps between the movable contacts and the fixed contacts are kept consistent when the movable contacts are operated together, and the single-path contacts do not interfere with each other when closed.

[0057] In one embodiment, the movable spring plate 52 is constructed by stacking four sub-spring plates.

[0058] In one embodiment, the intermediate portion of the movable spring plate 52 further includes a U-shaped bend 56 .

[0059] In one embodiment, the movable spring plate 52 includes a first sub-spring plate 551, a second sub-spring plate 552, a third sub-spring plate 553 and a fourth sub-spring plate 554, which are stacked in sequence. Here, the first sub-spring plate 551, the second sub-spring plate 552, the third sub-spring plate 553 and the fourth sub-spring plate 554 are respectively provided with two straight slits 521, so that each sub-spring plate forms three current-carrying conductors, and the movable contacts 51 are three and are respectively fixed to the corresponding current-carrying conductors, so that the movable spring plate 52 forms three parallel-connected structures. The current-carrying conductors of the first sub-spring plate 551, the second sub-spring plate 552 and the third sub-spring plate 553 are respectively provided with U-shaped bends 56, and the current-carrying conductor of the fourth sub-spring plate 554 is not provided with U-shaped bends.

[0060] The current carrier conductor of the fourth sub-spring plate 554 is provided with an arc-shaped slit 541, which is located on one side of the movable contact 51 away from the movable spring lead plate 53, thereby allowing the end of the current carrier conductor of the fourth sub-spring plate 554 away from the movable spring lead plate 53 to elastically swing.

[0061] The present invention designs the movable spring plate 52 into a multiple-set parallel connection structure of contacts, thereby reducing the current passing through each current-carrier conductor, and thus reducing the temperature rise. A striped connecting sheet 54 is connected between each movable contact 51, which can ensure that the contact gaps are consistent when the movable contact and the fixed contact are separated, and reduces the problem of contact gap mismatch caused by distortion during the pushing process of the push part.

[0062] In the movable spring of the relay capable of reducing temperature rise of the present invention, at least one of the at least two current-carrying conductors 522 of the movable spring plate 52 is designed to have a relatively large width dimension, and at least one of the at least two movable contacts 51 is designed to have a relatively large thickness dimension. In this structure of the present invention, by designing the width dimension of the at least one current-carrying conductor 522 to be relatively large and the thickness dimension of the at least one movable contact 51 to be relatively large, the total resistance of the movable spring plate 52 can be maintained in a low contact resistance state, thereby reducing temperature rise.

[0063] In the prior art relay, one magnetic path mechanism is used to simultaneously operate two contact structures in conjunction with each other, and the magnetic path mechanism and the two contact structures are mounted in grooves on the same side of the base, and baffles are provided between the magnetic path mechanism and the contact structure and between the two contact structures. However, since the magnetic path mechanism and the two contact structures are located on the same side of the base, when the relay is operated, the electronic components generate heat due to the passage of current, and thus the temperature rise caused by the magnetic path mechanism and the two contact structures is superimposed on the same side of the base. In the prior art, the product generally meets the temperature rise requirements by adjusting the rated current within an appropriate range. As the application range of the relay expands, the relay also develops in the direction of high load and miniaturization, and the improvement of the rated current inevitably causes a temperature rise inside the relay. Therefore, how to reduce the temperature rise when the volume of the entire relay does not change is an issue that needs to be solved as soon as possible.

[0064] The present invention further provides a relay with a multi-contact structure, and by improving the structure, the effect of temperature rise caused by an increase in rated current can be reduced, the temperature rise requirements can be met, and the problems such as accelerating the deterioration of plastic and insulating materials inside the relay caused by the relay temperature rise exceeding the requirements, oxidation and corrosion of the contacts making it difficult to extinguish the arc, degradation of the technical parameters of the electrical elements, and reduced reliability can be eliminated.

[0065] As shown in Figs. 3 to 6, the present invention relates to a relay structure having two contact structures, and the relay includes a base 1, a magnetic path structure 2, a first contact structure 3, and a second contact structure 4. The base 1 has two opposing sides, for example, a front side and a back side. A first groove 11 is provided on the front side of the base 1, a second groove 12 is provided on the back side of the base 1, and a through hole 13 is provided between the first groove 11 and the second groove 12. The first groove 11 and the second groove 12 are alternately arranged in a row, that is, the projections of the first groove 11 and the second groove 12 onto one side of the base 1, for example, the front side, are arranged in a row and do not overlap each other. In some other embodiments, for example, when a plurality of first grooves 11 and a plurality of second grooves 12 are provided, one second groove 12 is interposed between two adjacent first grooves 11, and one first groove 11 is interposed between two adjacent second grooves 12. The second contact structure 4 is mounted in the second groove 12.

[0066] The first contact structure 3 is mounted in the first groove 11. The magnetic path structure 2 is mounted in the first groove 11. In some other embodiments, the magnetic path structure 2 may be mounted at other positions on the base 1. The armature in the magnetic path structure is connected to the movable spring 31 in the first contact structure 3. The armature in the magnetic path structure 2 is connected to the movable spring 41 in the second contact structure 4 through the through hole 13. When the magnetic path structure 2 operates, it can drive the operation of the movable spring 41 in the two contact structures. In the present invention, the two contact structures are mounted at different spatial positions on the base 1 to realize mutual isolation and reduce the temperature rise caused by the increase in rated current.

[0067] In one embodiment, the armature in the magnetic path structure 2 is H-shaped, and both ends of the armature 2 are connected to one push part respectively, and are connected to the movable springs in the two contact structures through the corresponding push parts. The through hole 13 is provided at the end position of one end of the armature.

[0068] In one embodiment, as shown in Figures 3 and 4, the first contact structure 3 includes a movable spring 31 and a fixed spring 32. The second contact structure 4 includes a movable spring 41 and a fixed spring 42. The movable springs 31 and 41 in the two contact members respectively include a movable contact, a movable spring plate and a movable spring lead plate. Take the movable spring 31 as an example, the movable spring 31 includes a movable contact 51, a movable spring plate 52 and a movable spring lead plate 53. The movable spring plate 52 has a first end and a second end opposite to each other, the first end is connected to the movable spring lead plate 53, and the second end of the movable spring plate 52 is fixedly connected to the movable contact 51. The fixed springs 32 and 42 in the two contact structures respectively include a fixed contact and a fixed spring lead plate. Take the fixed spring 32 as an example, the fixed spring 32 includes a fixed contact 61 and a fixed spring lead plate 62.

[0069] The movable spring 31 and the fixed spring 32 are respectively inserted into one side of the base 1 in the first groove 11, with the movable contact 51 and the fixed contact 61 corresponding to each other (i.e., aligned with each other), and the movable spring pull-out plate 53 of the movable spring 31 and the fixed spring pull-out plate 62 of the fixed spring 32 each extend outside the base 1. The movable spring 41 and the fixed spring 42 are respectively inserted into the other side of the base 1 in the second groove 12, with the movable contact and the fixed contact similarly corresponding to each other, and the pull-out plates of the movable spring 41 and the fixed spring 42 each extend outside the base 1.

[0070] In one embodiment, as shown in Figures 3 and 5, a baffle 14 is further provided in the first groove 11 to realize separation between strong and weak currents, the baffle 14 is spaced between the first contact structure 3 and the magnetic path structure 2, and the mounting position of the first contact structure 3 in the first groove 11 is close to the second contact structure 4 relative to the magnetic path structure 2.

[0071] 2 and 3, taking the movable spring 31 as an example, the movable spring plate 52 is provided with two slits 521 extending in the direction from the second end to the first end connected to the movable spring pull-out plate 53, thereby dividing the movable spring plate 52 into three current-carrying conductors 522. There are three movable contacts, which are respectively fixed to the corresponding current-carrying conductors 522, thereby dividing the movable spring plate 52 into three parallel-connected structures.

[0072] In one embodiment, the width dimension of one of the three current carrier conductors of the movable spring plate 52 is designed to be larger than the width dimensions of the other two current carrier conductors 522 .

[0073] In one embodiment, the thickness dimension of one of the three movable contacts 51 is designed to be larger than the thickness dimensions of the other two movable contacts.

[0074] In one embodiment, a movable contact having a relatively large thickness dimension is fixed to a current carrying conductor having a relatively large width dimension.

[0075] In one embodiment, the movable spring plate 52 further has a connecting sheet 54 attached to the surface facing the fixed contact, and the connecting sheet 54 is connected between each of the movable contacts 51. Such a structure ensures contact of multiple sets of contacts, and when the movable contacts and the fixed contacts are separated, the connecting sheet 54 connects each of the movable contacts together, and ensures that the gaps between the movable contacts and the fixed contacts are kept consistent when the movable contacts are operated together, and the single-path contacts do not interfere with each other when closed.

[0076] In one embodiment, the movable spring plate 52 is constructed by stacking four sub-spring plates.

[0077] In one embodiment, the intermediate portion of the movable spring plate 52 further includes a U-shaped bend 56 .

[0078] In one embodiment, the movable spring plate 52 includes a first sub-spring plate 551, a second sub-spring plate 552, a third sub-spring plate 553 and a fourth sub-spring plate 554, which are stacked in sequence. Here, the first sub-spring plate 551, the second sub-spring plate 552, the third sub-spring plate 553 and the fourth sub-spring plate 554 are respectively provided with two straight slits 521, so that each sub-spring plate forms three current-carrying conductors, and the movable contacts 51 are three and are respectively fixed to the corresponding current-carrying conductors, so that the movable spring plate 52 forms three parallel connection structures. The current-carrying conductors of the first sub-spring plate 551, the second sub-spring plate 552 and the third sub-spring plate 553 are respectively provided with U-shaped bends 56, and the current-carrying conductor of the fourth sub-spring plate 554 is not provided with U-shaped bends.

[0079] The current carrier conductor of the fourth sub-spring plate 554 is provided with an arc-shaped slit 541, which is located on one side of the movable contact 51 away from the movable spring lead plate 53, thereby allowing the end of the current carrier conductor of the fourth sub-spring plate 554 away from the movable spring lead plate 53 to elastically swing.

[0080] In the relay with multiple contact structures of the present invention, a first groove 11 and a second groove 12 are provided on a base 1, and the first grooves 11 and the second grooves 12 are alternately distributed on two opposing sides of the base and arranged in a row. The first contact structure 3 and the magnetic path structure 2 of the two contact structures are both mounted in the first groove 11, the armature of the magnetic path structure 2 is connected to the movable spring of one of the contact structures 3, the second contact structure 4 of the two contact structures is mounted in the second groove 12, a through hole 13 is provided between the first groove 11 and the second groove 12, and the armature of the magnetic path structure 2 passes through the through hole 13 and is connected to the movable spring of the other contact structure 4. Such a structure of the present invention spatially separates the two contact structures, and when the rated current is increased, the effect of temperature rise caused by the increase in rated current is reduced, the temperature rise requirements are met, and it is possible to eliminate such disadvantages as accelerating the deterioration of plastic and insulating materials inside the relay due to the relay temperature rise exceeding the requirements, causing the contacts to oxidize and corrode, making it difficult to extinguish the arc, the degradation of the technical parameters of the electrical elements, and reduced reliability.

[0081] The relay with multiple contact structure of the present invention has at least one slit 521 extending through the movable spring plate 52, thereby dividing the movable spring plate 52 into at least two current-carrying conductors 522. There are at least two movable contacts 51, which are fixed to corresponding current-carrying conductors 522, respectively, thereby dividing the movable spring plate into at least two parallel-connected structures. Such a structure of the present invention can reduce the current flowing through each current-carrying conductor by designing the contact structure into a plurality of sets of parallel-connected contact structures, thereby reducing the temperature rise.

[0082] In the relay having the multiple contact structure of the present invention, the width dimension of one of the current-carrier conductors 522 of the movable spring plate 52 is designed to be larger than the width dimensions of the other current-carrier conductors, and the thickness dimension of one of the movable contacts 51 is designed to be larger than the thickness dimensions of the other movable contacts, and the movable contact with the larger thickness is fixed to the current-carrier conductor with the larger width. Such a structure of the present invention can always maintain the total resistance of the movable spring plate in a small contact resistance state, thereby reducing the temperature rise.

[0083] In the relay having the multiple contact structure of the present invention, a connecting sheet 54 is further attached to the surface of the movable spring plate 52 facing the fixed contact, and the connecting sheet 54 is connected between each of the movable contacts 51. Such a structure of the present invention can ensure that the contact gaps are consistent when separated, and reduces the variation of the contact gap difference caused by the push of the push part being not horizontal. When the relay with multiple contact structures has three contact structures, the base is provided with three grooves, the three grooves are alternately distributed along opposite faces (i.e., the front and back) of the base, and the three grooves are located in the same row on the base, the first contact structure of the three contact structures is mounted in the first groove on the front surface of the base, the second contact structure is mounted in one groove on the back surface of the base, and the third contact structure is mounted in the second groove on the front surface of the base, for two adjacently mounted contact structures, for example, the first contact structure and the second contact structure are respectively located on the back surface of the base and are spaced apart, for two spaced apart contact structures, for example, the first contact structure and the third contact structure are spaced apart by one groove on the back surface of the base between the first groove and the second groove on the front surface of the base, and therefore the first contact structure and the third contact structure are also spaced apart.

[0084] When the relay has four contact structures, the base is provided with four grooves, the four grooves are alternately distributed along opposite faces (i.e., the front and back faces) of the base, and the four grooves are located in the same row on the base, with the first contact structure of the four contact structures being mounted in the first groove on the front face of the base, the second contact structure being mounted in the first groove on the back face of the base, the third contact structure being mounted in the second groove on the front face of the base, and the fourth contact structure being mounted in the second groove on the back face of the base. As described above, the two adjacently mounted contact structures and the two spaced apart contact structures are both spaced apart.

[0085] If the relay has five or more contact structures, the same applies.

[0086] It should be noted that the present invention is not limited in its application to the detailed structure and arrangement of the components described herein. The present invention may have other embodiments and may be implemented and carried out in various ways. The foregoing variations and modifications are intended to be within the scope of the present invention. It should be understood that the present invention as disclosed and defined herein may be in alternative combinations of two or more individual features described or illustrated in this specification and / or the drawings. All of these different combinations constitute multiple alternative aspects of the present invention. The embodiments described herein represent the best mode known for carrying out the invention and enable those skilled in the art to utilize the invention.

Claims

1. A relay having a multiple contact structure, comprising a base, a magnetic path structure, and at least two contact structures, The base is provided with at least two grooves, the number of which is the same as the number of the contact structures, and the at least two grooves are alternately arranged on opposite sides of the base, with each groove located in the same row on the base, and each contact structure is mounted in a corresponding groove, and the magnetic path structures are mounted in the base and are associated with the movable springs of each contact structure, respectively, so that the magnetic path structures drive the corresponding movable springs when they are operated, and the mounting positions of each contact structure are spatially separated, thereby reducing the temperature rise caused by an increase in rated current. A relay having a multiple contact structure.

2. The magnetic path structure and one of the at least two contact structures are attached to the same groove, and an armature in the magnetic path structure is connected to a movable spring in one of the contact structures to operate the corresponding movable spring when the magnetic path structure operates, and a through hole is provided between adjacent grooves in each of the grooves, and the armature in the magnetic path structure passes through the corresponding through hole and is connected to the movable spring in the contact structure in the corresponding groove to operate the corresponding movable spring when the magnetic path structure operates.

2. A relay having a multiple contact structure according to claim 1.

3. In the groove in which the magnetic path structure and one contact structure are mounted, a baffle is further provided to separate strong and weak currents, and the baffle is located between the one contact structure and the magnetic path structure.

3. A relay having a multiple contact structure according to claim 2.

4. The contact structure is two in number, and the attachment position of one of the contact structures in the groove is closer to the other contact structure than the magnetic path structure.

4. A relay having a multiple contact structure according to claim 3.

5. The armature in the magnetic path structure is H-shaped, both ends of the armature are connected to the push parts, and are connected to the movable springs in the corresponding contact structures via the corresponding push parts, and the through holes are provided at positions corresponding to the armature. A relay having a multiple contact structure according to any one of claims 1 to 4.

6. The movable spring in the at least two contact structures includes a movable contact, a movable spring plate and a movable spring lead plate, one end of the movable spring plate is connected to the movable spring lead plate, the other end of the movable spring plate fixes the movable contact, the other end of the movable spring plate has at least one straight slit extending from the end to the one end in the direction of the connection point with the movable spring lead plate, dividing the movable spring plate into at least two current carrier conductors, the movable contacts are at least two, and are respectively fixed to corresponding current carrier conductors, so that the movable spring plate forms at least two parallel connection structures.

2. A relay having a multiple contact structure according to claim 1.

7. At least one of the at least two current carrier conductors of the movable spring plate has a large width dimension.

7. A relay having a multiple contact structure according to claim 6.

8. At least one of the at least two movable contacts has a larger thickness dimension.

8. A relay having a multiple contact structure according to claim 7.

9. The movable contact having a larger thickness dimension is fixed to the current-carrying conductor having a larger width dimension.

9. A relay having a multiple contact structure according to claim 8.

10. A connection sheet is further attached to the surface of the movable spring plate facing the fixed contacts, and the connection sheet is connected between the movable contacts.

7. A relay having a multiple contact structure according to claim 6.

11. The movable spring plate is formed by stacking a plurality of spring plates. A relay having a multiple contact structure according to any one of claims 6 to 10.

12. The movable spring plate has a U-shaped bent portion at its middle portion.

12. A relay having a multiple contact structure as claimed in claim 11.

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