Coil component

Abstract

To improve the product reliability of a coil component by enhancing the bondability of an external electrode.SOLUTION: A coil component in one aspect of the present invention includes a main body containing a magnetic material, a coil disposed in the main body, and an external electrode coupled to the coil and including a first layer containing at least one of Pd and Cr, a second layer disposed on the first layer and containing Ni, and a third layer disposed on the second layer and containing a conductive material and resin. A coil component in another aspect of the present invention includes a main body containing a magnetic material, a coil disposed in the main body, and an external electrode disposed on a side surface of the main body and including an insulating layer including an opening part, a metal layer disposed in the opening part and coupled to both end parts of the coil, and a conductive resin layer disposed on the metal layer. The metal layer contains Ni.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a coil component. [Background technology]

[0002] An inductor, which is a type of coil electronic component, is a typical passive element that forms an electronic circuit together with a resistor and a capacitor to remove noise. It is used in combination with a capacitor to configure a resonant circuit, a filter circuit, etc. that amplifies signals in a specific frequency band by utilizing its electromagnetic properties.

[0003] In recent years, with the rapid and global spread of electric vehicles in the automotive market, the demand for highly efficient inductors for electrical equipment is rapidly increasing. The most basic requirement for electronic components is reliability. When actually used, electrical components are inevitably exposed to higher stress and vibration than existing IT products. In other words, electrical components must meet reliability standards at higher temperatures and for longer periods of time than general household components. Therefore, ensuring high reliability for electrical components has emerged as an important issue, and the reliability of the joint parts that connect the coil and electrodes is particularly important. Summary of the Invention [Problem to be solved by the invention]

[0004] One of the problems to be solved by the present invention is to improve the product reliability of coil components by strengthening the bondability of external electrodes. [Means for solving the problem]

[0005] A coil component according to one embodiment of the present invention includes an external electrode including a body including a magnetic material, a coil disposed within the body, a first layer connected to the coil and including at least one of Pd and Cr, a second layer disposed on the first layer and including Ni, and a third layer disposed on the second layer and including a conductive material and a resin.

[0006] A coil component according to another embodiment of the present invention includes a body including a magnetic material, a coil disposed within the body, an insulating layer disposed on a side of the body and including an opening, a metal layer disposed in the opening and connected to both ends of the coil, and an external electrode including a conductive resin layer disposed on the metal layer, wherein the metal layer includes Ni.

[0007] A coil device according to another example of the present invention includes a body including a magnetic material, a coil disposed within the body, a metal layer disposed on at least one of a first surface and a second surface facing a first direction of the body and connected to both ends of the coil, and an external electrode including a conductive resin layer disposed on the metal layer, wherein the metal layer includes Ni, and the metal layer extends to at least one of a fifth surface and a sixth surface facing a third direction of the body. Effect of the Invention

[0008] One of the various effects of the present invention is that it can solve the problem that the Sn component of the external electrodes deteriorates the bond between the external electrodes and the internal coil. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic perspective view of a coil component according to a first embodiment of the present invention. [Diagram 2] 2 is a cross-sectional view taken along line II' in FIG. 1. [Diagram 3] 4 is a cross-sectional view of a coil component according to a second embodiment of the present invention, corresponding to FIG. 2. FIG. [Figure 4] 10 is a cross-sectional view of a coil component according to a third embodiment of the present invention, corresponding to FIG. 2. [Diagram 5] FIG. 11 is a cross-sectional view showing a structure of an external electrode of a conventional coil component as a comparative example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The terms used in this application are merely used to describe certain embodiments and are not intended to limit the present invention. A singular expression includes a plural expression unless the context clearly indicates otherwise. In this application, the terms "include" or "have" specify the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, and should be understood not to preclude the presence or additional possibility of one or more other features, numbers, steps, operations, components, parts, or combinations thereof. And, in the entire specification, "on" means to be located above or below the target part, and does not necessarily mean to be located on the upper side based on the direction of gravity.

[0011] Furthermore, the term "bonding" does not only refer to cases where the components are in direct physical contact with each other in the contact relationship between the components, but is used as a concept that also encompasses cases where another structure is interposed between the components and the components are in contact with that other structure.

[0012] The size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, and the present invention is not necessarily limited by the drawings.

[0013] In the drawings, the X direction may be defined as a first direction or length direction, the Y direction may be defined as a second direction or width direction, and the Z direction may be defined as a third direction or thickness direction.

[0014] Hereinafter, coil devices according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same or corresponding components are designated by the same reference numbers, and duplicated description thereof will be omitted.

[0015] Various kinds of electronic components are used in electronic devices, and various kinds of coil components can be appropriately used between such electronic components for the purpose of removing noise, etc.

[0016] That is, in electronic devices, coil components can be used as power inductors, high frequency inductors, general beads, high frequency beads (GHz beads), common mode filters, and the like.

[0017] (First embodiment) FIG. 1 is a schematic perspective view of a coil component according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line II' in FIG.

[0018] 1 and 2, a coil device 1000 according to a first embodiment of the present invention includes a body 100, a coil 300, and external electrodes 410, 420, and may further include a support member 200.

[0019] The main body 100 forms the exterior of the coil device 1000 according to this embodiment, and has a support member 200 and a coil 300 embedded therein.

[0020] The body 100 may be formed in a generally hexahedral shape.

[0021] 1 and 2, the main body 100 includes a first surface 101 and a second surface 102 facing in a first direction (X direction), a third surface 103 and a fourth surface 104 facing in a second direction (Y direction), and a fifth surface 105 and a sixth surface 106 facing in a third direction (Z direction). The third to sixth surfaces 103, 104, 105, and 106 correspond to a plurality of side surfaces connecting the first surface 101 and the second surface 102. The main body 100 may include a magnetic material and an insulating resin. Specifically, the main body 100 may be formed by laminating one or more magnetic composite sheets including an insulating resin and a magnetic material dispersed in the insulating resin. However, the main body 100 may have a structure other than the structure in which the magnetic material is dispersed in the insulating resin. For example, the main body 100 may be made of a magnetic material such as ferrite.

[0022] The magnetic material may be a magnetic powder, for example a ferrite or metallic magnetic powder.

[0023] The ferrite powder may be, for example, at least one of spinel-type ferrites such as Mg-Zn-, Mn-Zn-, Mn-Mg-, Cu-Zn-, Mg-Mn-Sr-, and Ni-Zn-based ferrites, hexagonal-type ferrites such as Ba-Zn-, Ba-Mg-, Ba-Ni-, Ba-Co-, and Ba-Ni-Co-based ferrites, garnet-type ferrites such as Y-based ferrites, and Li-based ferrites.

[0024] The metal magnetic powder may include at least one selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu) and nickel (Ni). For example, the metal magnetic powder may be at least one of pure iron powder, Fe-Si alloy powder, Fe-Si-Al alloy powder, Fe-Ni alloy powder, Fe-Ni-Mo alloy powder, Fe-Ni-Mo-Cu alloy powder, Fe-Co alloy powder, Fe-Ni-Co alloy powder, Fe-Cr alloy powder, Fe-Cr-Si alloy powder, Fe-Si-Cu-Nb alloy powder, Fe-Ni-Cr alloy powder and Fe-Cr-Al alloy powder.

[0025] The metal magnetic powder can be amorphous or crystalline. For example, the metal magnetic powder can be Fe-Si-B-Cr amorphous alloy powder, but is not necessarily limited thereto.

[0026] The ferrite and metal magnetic powder may each have an average diameter of about 0.1 μm to 30 μm, but is not limited thereto.

[0027] The main body 100 may include two or more types of magnetic powder dispersed in an insulating resin. Here, different types of magnetic powder means that the magnetic powder dispersed in the insulating resin is distinguished from one another by any one of average diameter, composition, crystallinity, and shape. For example, the main body 100 may include two or more magnetic powders having different average diameters.

[0028] The insulating resin may include, but is not limited to, epoxy, polyimide, liquid crystal polymer, and the like, either alone or in combination.

[0029] The main body 100 includes a core 110 through which a coil 300, which will be described later, penetrates. The core 110 may be formed by filling a through hole of the coil 300 with a magnetic composite sheet, but is not limited thereto.

[0030] The coil device 1000 according to the first embodiment of the present invention may further include a support member 200.

[0031] The support member 200 is embedded in the main body 100. The support member 200 is configured to support a coil 300, which will be described later. The support member 200 may be formed of an insulating material including a thermosetting insulating resin such as an epoxy resin, a thermoplastic insulating resin such as a polyimide, or a photosensitive insulating resin, or may be formed of an insulating material in which such an insulating resin is impregnated with a reinforcing material such as glass fiber or an inorganic filler. For example, the support member 200 may be formed of an insulating material such as a prepreg, an Ajinomoto Build-up Film (ABF), FR-4, a Bismaleimide Triazine (BT) film, a Photo Imagable Dielectric (PID) film, etc., but is not limited thereto.

[0032] As the inorganic filler, at least one selected from the group consisting of silica (SiO2), alumina (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, mud, mica powder, aluminum hydroxide (AlOH3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3) can be used.

[0033] When the support member 200 is made of an insulating material containing a reinforcing material, the support member 200 can provide better rigidity. When the support member 200 is made of an insulating material containing no glass fiber, the support member 200 is advantageous in reducing the overall thickness of the coil 300. When the support member 200 is made of an insulating material containing a photosensitive insulating resin, the number of processes for forming the coil 300 is reduced, which is advantageous in reducing production costs, and fine vias can be formed.

[0034] The coil 300 may be embedded in the body 100, and may be disposed on at least one surface of the support member 200. The coil 300 exhibits characteristics of a coil component. For example, when the coil component 1000 of the present embodiment is used as a power inductor, the coil 300 may play a role in stabilizing the power supply of an electronic device by storing an electric field in a magnetic field and maintaining an output voltage.

[0035] The coil 300 includes coil patterns 310, 320 and vias. Specifically, based on the direction of FIG. 1, the first coil pattern 310 and an end 311 of the first coil pattern are disposed on one surface (lower surface) of the support member 200, and the second coil pattern 320 and an end 321 of the second coil pattern are disposed on the other surface (upper surface) of the support member 200. The vias penetrate the support member 200 and contact the first coil pattern 310 and the second coil pattern 320, respectively. In this way, the coil 300 can function as a single coil having one or more turns formed around the core 110 as a whole.

[0036] Each of the first coil pattern 310 and the second coil pattern 320 may have a planar spiral shape with at least one turn formed around the core 110. For example, the first coil pattern 310 may form at least one turn around the core 110 on the lower surface of the support member 200.

[0037] At least one of the vias and the coil patterns 310, 320 may include one or more conductive layers. For example, when the second coil pattern 320, the end 321 of the second coil pattern 320, and the vias are formed on the other side of the support member 200 by plating, the second coil pattern 320, the end 321 of the second coil pattern, and the vias may each include a seed layer such as an electroless plating layer and an electrolytic plating layer. Here, the electrolytic plating layer may have a single layer structure or a multilayer structure. The multilayer electrolytic plating layer may be formed in a conformal film structure in which one electrolytic plating layer is covered by another electrolytic plating layer, or may be formed in a shape in which one electrolytic plating layer is laminated only on one side of one electrolytic plating layer. The seed layer of the second coil pattern 320, the seed layer of the end 321 of the second coil pattern, and the seed layer of the vias may be formed integrally and no boundary may be formed between them, but is not limited thereto. The electrolytic plating layer of the second coil pattern 320, the electrolytic plating layer of the end 321 of the second coil pattern, and the electrolytic plating layer of the via may be integrally formed, with no boundaries formed between them, but is not limited to this.

[0038] As another example, when the first coil pattern 310 and its end 311 disposed on the lower surface of the support member 200 and the second coil pattern 320 and its end 321 disposed on the upper surface of the support member 200 are formed separately from each other and then collectively laminated on the support member 200 to form the coil 300, the via may include a high melting point metal layer and a low melting point metal layer having a melting point lower than that of the high melting point metal layer. Here, the low melting point metal layer may be formed of solder containing lead (Pb) and / or tin (Sn). At least a portion of the low melting point metal layer is melted by the pressure and temperature during the collectively lamination, and for example, an intermetallic compound layer (IMC layer) may be formed at the boundary between the low melting point metal layer and the second coil pattern 320.

[0039] 1, the coil patterns 310, 320 and their ends 311, 321 may be formed to protrude from the lower surface and the upper surface of the support member 200, respectively. As another example, the first coil pattern 310 and its end 311 may be formed to protrude from the lower surface of the support member 200, and the second coil pattern 320 and its end 321 may be embedded in the upper surface of the support member 200, and the upper surfaces of the second coil pattern 320 and its end 321 may be exposed on the upper surface of the support member 200. In this case, a recess is formed on the upper surface of the second coil pattern 320 and / or the end 321 of the second coil pattern 320, and the upper surfaces of the second coil pattern 320 and / or the end 321 of the second coil pattern and the upper surface of the support member 200 may not be located on the same plane. As another example, the second coil pattern 320 and its end 321 may be formed to protrude from the upper surface of the support member 200, and the first coil pattern 310 and its end 311 may be embedded in the lower surface of the support member 200, such that the lower surfaces of the first coil pattern 310 and its end 311 are exposed on the lower surface of the support member 200. In this case, a recess may be formed in the lower surface of the first coil pattern 310 and / or the end 311 of the first coil pattern, and the lower surfaces of the first coil pattern 310 and / or the end 311 of the first coil pattern and the lower surface of the support member 200 may not be located on the same plane.

[0040] Each of the via and coil patterns 310, 320 may be formed from a conductive material such as, but not limited to, copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof.

[0041] The coil device according to the first embodiment of the present invention includes external electrodes 410, 420 connected to the coil 300. The external electrodes 410, 420 are disposed on the surface of the body 100 and connected to both ends of the coil 300. In this embodiment, both ends 311, 321 of the coil 300 extend to the first surface 101 and the second surface 102 of the body 100, respectively. Thus, the first external electrode 410 may be disposed on the first surface 101 of the body and may be in contact with and connected to the end 311 of the first coil pattern extending to the first surface 101 of the body 100, and the second external electrode 420 may be disposed on the second surface 102 and may be in contact with and connected to the end 321 of the second coil pattern extending to the second surface 102 of the body.

[0042] The external electrodes 410, 420 are formed in a multi-layer structure. Specifically, the external electrodes 410, 420 may include a first layer 411, 421 connected to the coil 300 and including at least one of Pd (palladium) and Cr (chromium), a second layer 412, 422 disposed on the first layer, and a third layer 413, 423 disposed on the second layer and including a conductive material and a resin.

[0043] The description of the first external electrode 410 can be applied to the second external electrode 420 as it is, and therefore, hereinafter, the description of the first external electrode will replace the description of the second external electrode.

[0044] 2, the first external electrode 410 includes a first layer 411 connected to an end portion 311 of the first coil pattern. The first layer 411 includes at least one of Pd (palladium) and Cr (chromium).

[0045] The first layer 411 may cover the first surface 101 of the body 100. As described above, since the end 311 of the first coil pattern extends to the first surface 101 of the body, the first layer 411 may be disposed on the first surface 101 of the body 100 and connected to the end 311 of the first coil pattern.

[0046] The first layer 411 is connected to the end 311 of the first coil pattern and can play a role in improving the contact force between the coil pattern 310 and the second layer 412 described below. Specifically, the first layer 411 can expand the end 311 of the first coil pattern and expand the contact area with the second layer 412. In other words, if the contact area where the end of the coil pattern comes into contact with the external electrode is small, poor contact between the coil and the external electrode may occur and the contact resistance may increase. In order to eliminate such a problem, the contact area between the end of the coil pattern and the external electrode is increased.

[0047] Furthermore, by making the first layer 411 from a material different from the material that constitutes the coil 300, it is possible to prevent Sn (tin) from diffusing into the second layer 412 described below.

[0048] The second layer 412 is disposed on the first layer 411 and contains Ni (nickel). The second layer 412 can play a role in preventing Sn (tin) present in layers outer than the second layer from diffusing into the inside of the coil component. Specifically, it can prevent Sn (tin) in solder applied when mounting the coil component on a substrate or Sn (tin) in a fourth layer 414 of the external electrode, which will be described later, from diffusing toward the coil.

[0049] Fig. 5 is a cross-sectional view showing the structure of an external electrode of a conventional coil component as a comparative example. In the conventional coil component of Fig. 5, the external electrode is composed of multi-layer structures 43, 44, and 45. Specifically, the multi-layer structures 43, 44, and 45 can include a third layer 413, a fourth layer 414, and a fifth layer 415 of the present invention, which will be described below. That is, unlike the embodiment according to the present invention, the first and second layers are not introduced.

[0050] When a coil component such as that in the comparative example is exposed to high temperatures (approximately 150°C or higher) or to harsh environments with high temperatures and high humidity, the diffusion of Sn (tin) contained within the coil component or external materials (e.g., solder) becomes active. When the diffusion of Sn (tin) accelerates, Sn (tin) penetrates into the internal coil, which results in the deterioration of the coil component. Specifically, Sn (tin) can penetrate into the inside of the component and react with Cu (copper) to form an intermetallic compound (IMC), which can reduce the bonding strength of the external electrode interface and reduce the reliability of the coil component.

[0051] The first layer 411 and the second layer 412 according to the embodiment of the present invention may function to prevent Sn (tin) from diffusing to the internal coil. The first layer 411 and the second layer 412 are materials that can stably react with Sn (tin) to form an intermetallic compound (IMC). In particular, the second layer 412 may include Ni (nickel) and may include a precious metal with low reactivity. For example, the reaction rate of Ni / Sn-based intermetallic compounds (IMC) is significantly slower than that of Cu-Sn, and may function to prevent diffusion.

[0052] The third layer 413 is disposed on the second layer 412 and may include a conductive material and a resin. Specifically, the second layer 412 may be a layer including a resin and metal particles dispersed in the resin. The metal particles may be one or more selected from the group consisting of copper (Cu), nickel (Ni), silver (Ag), cobalt (Co), palladium (Pd), and platinum (Pt) particles, or may be alloy particles including these. The resin may be epoxy, polyimide, or the like. The third layer 413 is a layer including a resin and metal particles dispersed in the resin, and may be an Ag-epoxy resin layer. In this case, one or more of the Sn (tin) component entering from the outside, the Ni (nickel) component of the second layer 412, the Ag (silver) component in the third layer 413, and the Cu (copper) component of the coil 300 form an intermetallic compound (IMC), thereby effectively preventing Sn (tin) from entering the boundary surface of the internal coil and deteriorating the coil component. The third layer 413 may extend onto the third insulating layer 630 as described below, and may also be disposed on the fifth surface 105 and the sixth surface 106 of the body.

[0053] The external electrode 410 may further include a fourth layer 414 disposed on the third layer 413 and a fifth layer 415 disposed on the fourth layer 414. The fourth layer 414 may function to improve the conductivity of the first external electrode together with the third layer 413. The fifth layer 415 may function to improve the bonding with solder when mounting the coil component on a substrate. The fourth layer may include Ni (nickel) and the fifth layer may include Sn (tin), but are not necessarily limited thereto.

[0054] As described above, since the external electrodes 410, 420 include a multi-layer structure of the first to fifth layers 411, 412, 413, 414, and 415, deterioration of reliability due to diffusion of Sn (tin) in a high-temperature load environment can be effectively prevented.

[0055] When the thickness of the second layer 412 is T1 and the thickness of the fourth layer 414 is T2, 0.5T2≦T1 can be satisfied. Specifically, in the case of coil components for electrical equipment, higher reliability is required than in coil components for general household use. For example, operational reliability is required for about twice the usage time of coil components for general household use. Therefore, compared with coil components for general household use, the coil component according to the present invention is characterized by the introduction of the second layer 412, and can prevent the diffusion of Sn (tin) present in layers outside the second layer into the inside of the coil component. In addition, considering the amount of Sn (tin) in the fifth layer 415 and outside the component that disappears by reacting with Ni (nickel) in the fourth layer 414, when the thickness of the second layer 412 is formed to be half the thickness of the fourth layer 414, it is sufficient to prevent the diffusion of Sn (tin) remaining after the reaction with Ni (nickel) in the fourth layer 414.

[0056] The thicknesses of the second layer 412 and the fourth layer 414 can be measured by the following method. First, the coil component is polished in the second direction (Y direction) to a depth of about 1 / 2 to prepare a sample with an exposed cross section. Next, when the collected cross-sectional sample is observed with an optical microscope or the like, the cross-sectional structure of the second layer 412 and the fourth layer 414 as shown in FIG. 2 can be confirmed, and the length of the second layer 412 and the fourth layer 414 along the first direction (X direction) can be measured to measure the thickness of the second layer 412 and the fourth layer 414.

[0057] The coil component according to the first embodiment of the present invention may further include an insulating film IF. The insulating film IF may be formed on the support member 200 and the coil 300. The insulating film IF is for insulating the coil 300 from the main body 100 and may include a known insulating material such as parylene. The insulating material included in the insulating film IF may be any material and is not particularly limited. The insulating film IF may be formed by a method such as vapor phase deposition, but is not limited thereto, and may be formed by laminating insulating films on both sides of the support member 200. In the former case, the insulating film IF may be formed in the form of a conformal film along the surfaces of the support member 200 and the coil 300. Meanwhile, since the insulating film IF is an optional configuration in the present invention, if the main body 100 can secure sufficient insulation resistance at the operating voltage and operating current of the coil component 1000 according to the present embodiment, the insulating film IF may be omitted.

[0058] The coil component according to the first embodiment of the present invention may further include a third insulating layer 630 disposed on the fifth surface 105 and the sixth surface 106 facing the third direction (Z direction) of the main body. The third insulating layer 630 is disposed on the fifth surface 105 and the sixth surface 106 of the main body and between the first and second external electrodes 410, 420, and may function to electrically protect the coil component, reduce leakage current, and prevent plating bleeding when the external electrodes are formed.

[0059] The third layer 413 may extend onto the fifth surface 105 and the sixth surface 106 of the body, and may also be disposed on the third insulating layer 630. That is, the third insulating layer 630 may be in direct contact with the third layer 413, and at this time, the bonding strength between the third insulating layer 630 and the third layer 413 may be further ensured by epoxy bonding.

[0060] The third insulating layer 630 is made of a thermoplastic resin such as polystyrene, vinyl acetate, polyester, polyethylene, polypropylene, polyamide, rubber, or acrylic; a thermosetting resin such as phenol, epoxy, urethane, melamine, or alkyd; a photosensitive resin; parylene; or SiO x or SiN x may include.

[0061] Second embodiment FIG. 3 is a cross-sectional view of a coil component according to a second embodiment of the present invention, which corresponds to FIG.

[0062] Compared to the first embodiment, the coil device according to the second embodiment may omit the first layers 411 and 421 of the external electrodes, and may further include insulating layers 610 and 620 disposed on the side surfaces of the main body and including openings.

[0063] The first and second insulating layers 610 and 620 are respectively disposed on side surfaces of the main body 100. Specifically, the first and second insulating layers 610 and 620 are respectively disposed on a first surface 101 and a second surface 102 facing each other in a first direction (X direction) of the main body.

[0064] The first and second insulating layers 610, 620 include an opening O. The opening O of the first and second insulating layers 610, 620 can expose both ends of the coil 300. Referring to Fig. 3, the first and second insulating layers 610, 620 are disposed on the first surface 101 and the second surface 102, and expose both ends 311, 321 of the coil through the opening O.

[0065] The first and second insulating layers 610 and 620 are made of a thermoplastic resin such as polystyrene, vinyl acetate, polyester, polyethylene, polypropylene, polyamide, rubber, or acrylic; a thermosetting resin such as phenol, epoxy, urethane, melamine, or alkyd; a photosensitive resin; parylene; or SiO x or SiN x may include.

[0066] The first and second insulating layers 610 and 620 may be formed by applying a liquid insulating resin to the surface of the body 100, applying an insulating paste to the surface of the body 100, laminating an insulating film on the surface of the body 100, or forming an insulating resin on the surface of the body 100 by vapor deposition. In the case of the insulating film, a dry film (DF) containing a photosensitive insulating resin, an Ajinomoto Build-up Film (ABF) not containing a photosensitive insulating resin, a polyimide film, etc. may be used.

[0067] Metal layers 412 and 422 may be disposed in the opening O. The metal layers 412 and 422 may be disposed in the opening and connected to both ends 311 and 321 of the coil. That is, the metal layers 412 and 422 may be connected to both ends 311 and 321 of the coil through the opening.

[0068] The metal layers 412, 422 may cover the first and second insulating layers 610, 620. Specifically, referring to Figure 3, a portion of the metal layers 412, 422 fills the openings O of the first and second insulating layers 610, 620, and the remainder is disposed on and covers the first and second insulating layers 610, 620.

[0069] In the case of the coil component according to the second embodiment, in order to prevent Sn (tin) in the solder or Sn (tin) in the fourth layer 414 of the external electrode from diffusing into the inside of the coil component, first and second insulating layers 610, 620 are arranged on the side surfaces of the main body instead of the first layer 411. Specifically, the first and second insulating layers 610, 620 cover the side surfaces of the main body 100 except for both ends 311, 321 of the coil, thereby efficiently blocking the path of Sn (tin) diffusing from the outside. In addition, by connecting both ends 311, 321 of the coil to the second layers 412, 422 of the external electrodes through the openings O, the connection reliability of the external electrodes can be ensured.

[0070] Here, the metal layers 412 and 422 may have the same configuration as the second layers 412 and 422 described in the first embodiment. The second layers have been described in detail in the first embodiment, so the detailed description will be omitted.

[0071] Conductive resin layers 413 and 423 may be disposed on the metal layers 412 and 422. Here, the conductive resin layers 413 and 423 may have the same configuration as the third layers 413 and 423 described in the first embodiment. The third layers have been described in detail in the first embodiment, so detailed description thereof will be omitted.

[0072] The remaining configuration of the second embodiment overlaps with that of the first embodiment, and detailed description thereof will be omitted.

[0073] Third embodiment FIG. 4 is a cross-sectional view of a coil component according to a third embodiment of the present invention, which corresponds to FIG.

[0074] In the coil device according to the third embodiment, compared to the first embodiment, the first layers 411 and 421 of the external electrodes may be omitted. Also, the metal layers 412 and 422 disposed on the side surfaces of the main body extend to at least one of the fifth and sixth surfaces of the main body facing the third direction.

[0075] The metal layers 412, 422 may not only be disposed on the first surface 101 and the second surface 102 of the body, but may also extend to at least one of the fifth surface 105 and the sixth surface 106 of the body.

[0076] In general, external electrodes are formed on the sides of the body as well as the top and bottom. Also, when mounting components, solder (Sn) can be placed not only on the sides of the body but also near the mounting surface. Therefore, the tin (Sn) component on the top and bottom sides of the body can diffuse into the coil components, accelerating the deterioration of the coil components.

[0077] Therefore, in comparison with the above-mentioned embodiments, the coil component according to the third embodiment has metal layers 412, 422 arranged to extend onto the upper and lower surfaces of the main body, and can efficiently block the intrusion of Sn (tin).

[0078] Here, the metal layers 412 and 422 may have the same configuration as the second layers 412 and 422 described in the first embodiment. The second layers have been described in detail in the first embodiment, so the detailed description will be omitted.

[0079] Conductive resin layers 413 and 423 may be disposed on the metal layers 412 and 422. The conductive resin layers 413 and 423 may be disposed to extend along the metal layers 412 and 422 to at least one of the fifth surface 105 and the sixth surface 106 of the body 100.

[0080] Here, the conductive resin layers 413 and 423 may have the same configuration as the third layers 413 and 423 described in the first embodiment. The third layers have been described in detail in the first embodiment, so detailed description will be omitted.

[0081] The remaining configuration of the third embodiment overlaps with that of the first embodiment, and detailed description thereof will be omitted.

[0082] Although one embodiment of the present invention has been described above, a person having ordinary knowledge in the art may modify and change the present invention in various ways by adding, changing or deleting components within the scope of the concept of the present invention described in the claims, and this may also be said to be within the scope of the rights of the present invention. [Explanation of symbols]

[0083] 1000 Coil Parts 100 Body 200 Support member 300 coils 310, 320 First and second coil patterns 410, 420 First and second external electrodes 610, 620, 630 Insulation layer

Claims

1. a body including a magnetic material; a coil disposed within the body; a coil component comprising: an external electrode including a first layer connected to the coil and including at least one of Pd and Cr, a second layer disposed on the first layer and including Ni, and a third layer disposed on the second layer and including a conductive material and a resin.

2. The coil component according to claim 1 , wherein the third layer is a resin layer containing one or more selected from the group consisting of Ag, Ni, Cu, Co, Pd, and Pt.

3. the external electrode further includes a fourth layer disposed on the third layer; The coil component according to claim 1 , wherein the fourth layer includes Ni.

4. The thickness of the second layer is T １ , the thickness of the fourth layer is T ２ When this is done, 0.5T ２ ≦T １ The coil component according to claim 3 , which satisfies the above.

5. the external electrode further includes a fifth layer disposed on the fourth layer; The coil component according to claim 3 , wherein the fifth layer contains Sn.

6. The coil component according to claim 1 , wherein the first layer covers a first surface and a second surface of the main body that face each other in a first direction.

7. The coil component according to claim 1 , further comprising an insulating layer disposed on a fifth surface and a sixth surface of the body that face each other in the third direction.

8. The coil component according to claim 7 , wherein a third layer of the external electrode extends onto a fifth surface and a sixth surface of the body and is also disposed on the insulating layer.

9. a support member disposed within the body; The coil component according to claim 1 , wherein the coil is disposed on at least one surface of the support member.

10. a body including a magnetic material; a coil disposed within the body; an insulating layer disposed on a side of the body and including an opening; a metal layer disposed in the opening and connected to both ends of the coil; and an external electrode including a conductive resin layer disposed on the metal layer, The coil component, wherein the metal layer contains Ni.

11. The coil component according to claim 10 , wherein the insulating layer exposes both ends of the coil.

12. The coil component according to claim 10 , wherein the metal layers of the external electrodes are connected to both ends of the coil through the openings.

13. The coil component according to claim 10 , wherein the metal layer of the external electrode covers the insulating layer.

14. The coil component according to claim 10 , wherein the external electrodes further include a Ni layer disposed on the conductive resin layer and a Sn layer disposed on the Ni layer.

15. a body including a magnetic material; a coil disposed within the body; an external electrode including a metal layer disposed on at least one of a first surface and a second surface facing a first direction of the body and connected to both ends of the coil; and a conductive resin layer disposed on the metal layer, the metal layer comprises Ni; The metal layer extends to at least one of a fifth surface and a sixth surface of the body, the fifth surface and the sixth surface being opposed to each other in the third direction.

16. The coil component according to claim 15 , wherein the conductive resin layer extends along the metal layer to at least one of a fifth surface and a sixth surface of the body facing each other in the third direction.

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