Molding system, molding method, computer program, recording medium, and control device

Abstract

To provide a molding system that can form an appropriate molded object.SOLUTION: A molding system is provided with: a molding apparatus that performs a molding process for forming a molded object by supplying molding materials to an irradiation area of an energy beam from a supply system while irradiating a target object with the energy beam from an irradiation system; and a change apparatus that is configured to change a relative position between the energy beam and the target object, wherein the molding system differentiates a condition of the molding process that is performed at a first area of the target object and a condition of the molding process that is performed at a second area of the target object.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to the technical fields of, for example, a modeling system, a modeling method, a computer program, a recording medium, and a control device that form a modeled object. [Background technology]

[0002] Patent Document 1 describes a modeling device that melts a powdered material with an energy beam and then resolidifies the molten material to form a model. With such a modeling device, a technical challenge is to form an appropriate model. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] US Patent Application Publication No. 2017 / 014909 Summary of the Invention

[0004] According to a first aspect, a modeling system is provided which includes a modeling device that performs a modeling process to form a model by irradiating an object with an energy beam using an irradiation system while supplying the modeling material to an irradiation area of ​​the energy beam using a supply system, and a change device that can change the relative position between the energy beam and the object, and which differentiates the conditions of the modeling process performed on a first area of ​​the object from the conditions of the modeling process performed on a second area of ​​the object.

[0005] According to a second aspect, a modeling system is provided that includes a modeling device that performs a modeling process to form a model by irradiating an energy beam onto an object using an irradiation system while supplying the modeling material to an irradiation area of ​​the energy beam using a supply system, and a change device that can change the relative position of the energy beam and the object, and that differentiates the conditions of the modeling process performed on a first area of ​​the object in which the irradiation area is set multiple times from the conditions of the modeling process performed on a second area of ​​the object in which the irradiation area is set fewer times than the number of times it is set in the first area.

[0006] According to a third aspect, a modeling system is provided which includes a modeling device that performs a modeling process by growing a modeling object in a direction that changes the relative position between the energy beam and the object by irradiating an energy beam onto the object using an irradiation system while supplying the modeling material to the irradiation area of ​​the energy beam using a supply system, and a change device that can change the relative position between the energy beam and the object, and when the relative positional relationship between the energy beam and the object when performing the modeling process at a second timing becomes the relative positional relationship between the energy beam and the object that performed the modeling process at a first timing, the conditions of the modeling process at the second timing are changed from the conditions of the modeling process at the first timing.

[0007] According to a fourth aspect, a modeling system is provided which comprises a modeling device that performs a modeling process in which an irradiation system irradiates an energy beam onto an object via an optical system, while a supply system supplies the modeling material to the irradiation area of ​​the energy beam, thereby forming a layered structure in which multiple layered structures are stacked, and a change device that can change the relative position between the energy beam and the object, and the focal depth of the optical system is greater than the thickness of one layer and less than the thickness of two layers of the layered structure.

[0008] According to a fifth aspect, there is provided a modeling system comprising: a modeling device that performs a modeling process to form a model by irradiating an energy beam onto an irradiation area on an object using an irradiation system while supplying the modeling material to the irradiation area using a supply system; and a change device capable of changing the relative position between the energy beam and the object, wherein after a first period in which the relative position between the irradiation area of ​​the energy beam and the object is set in a first direction, the relative position between the irradiation area of ​​the energy beam and the object is changed in a second direction intersecting the first direction, and then, in a second period, the relative position between the irradiation area of ​​the energy beam and the object is changed in a direction parallel to the first direction, and the modeling process is performed during at least a part of at least one of the first period and the second period.

[0009] According to a sixth aspect, there is provided a modeling method including performing a modeling process to form a model by irradiating an object with an energy beam while supplying a modeling material to an area irradiated by the energy beam, changing the relative position of the energy beam irradiated area and the object, and differentiating conditions for the modeling process performed on a first area of ​​the object from conditions for the modeling process performed on a second area of ​​the object.

[0010] According to a seventh aspect, there is provided a modeling method including performing a modeling process to form a model by irradiating an energy beam onto an object while supplying a modeling material to an irradiation area of ​​the energy beam, changing a relative position between the irradiation area of ​​the energy beam and the object, and differentiating conditions of the modeling process performed on a first area of ​​the object in which the irradiation area is set multiple times from conditions of the modeling process performed on a second area of ​​the object in which the irradiation area is set a number of times less than the number of times the irradiation area is set in the first area.

[0011] According to an eighth aspect, there is provided a modeling method including: performing a modeling process to form a modeled object by irradiating an energy beam onto an object while supplying a modeling material to an irradiation area of ​​the energy beam; changing a relative position between the irradiation area of ​​the energy beam and the object; and, when the relative positional relationship between the energy beam used to perform the modeling process at a first timing and the object when performing the modeling process at a second timing becomes the relative positional relationship between the energy beam and the object when performing the modeling process at a second timing, making the conditions of the modeling process at the second timing different from the conditions of the modeling process at the first timing.

[0012] According to a ninth aspect, there is provided a modeling method including the steps of irradiating an object with an energy beam, supplying a modeling material to the object, and performing a modeling process to form a layered structure in which multiple layered structures are stacked by irradiating the object with the energy beam while supplying the modeling material to an irradiation area of ​​the energy beam, wherein irradiating the energy beam includes irradiating the energy beam through an optical system having a focal depth greater than the thickness of one layer and smaller than the thickness of two layers of the layered structure.

[0013] According to a tenth aspect, there is provided a computer program for causing a computer to execute the above-mentioned modeling method.

[0014] According to an eleventh aspect, there is provided a recording medium having the above-mentioned or below-mentioned computer program recorded thereon.

[0015] According to a twelfth aspect, there is provided a computer program to be executed by a computer that controls a modeling system that includes a modeling device that performs a modeling process to form a model by irradiating an energy beam onto an object using an irradiation system while supplying the modeling material to an irradiation area of ​​the energy beam using a supply system, and a change device that can change the relative position between the energy beam and the object, the computer program causing the computer to execute a process to differenciate the conditions of the modeling process performed on a first area of ​​the object from the conditions of the modeling process performed on a second area of ​​the object.

[0016] According to a 13th aspect, there is provided a computer program to be executed by a computer that controls a modeling system including a modeling device that performs a modeling process to form a model by irradiating an energy beam onto an object using an irradiation system while supplying the modeling material to an irradiation area of ​​the energy beam using a supply system, and a change device that can change the relative position between the energy beam and the object, and the computer program causes the computer to execute a process to differ between the conditions of the modeling process performed on a first area of ​​the object in which the irradiation area is set multiple times and the conditions of the modeling process performed on a second area of ​​the object in which the irradiation area is set fewer times than the number of times it is set in the first area.

[0017] According to a 14th aspect, there is provided a computer program to be executed by a computer that controls a modeling system including a modeling device that performs a modeling process by growing a modeling object in a direction that changes the relative position between the energy beam and the object by irradiating an energy beam onto the object using an irradiation system while supplying the modeling material to an irradiation area of ​​the energy beam using a supply system, and a change device that can change the relative position between the energy beam and the object.The computer program causes the computer to execute a process of changing the conditions of the modeling process at the second timing from the conditions of the modeling process at the first timing when the relative positional relationship between the energy beam and the object that performed the modeling process at a first timing becomes the relative positional relationship between the energy beam and the object when performing the modeling process at a second timing.

[0018] According to a 15th aspect, there is provided a computer program to be executed by a computer that controls a modeling system including a modeling device that performs a modeling process to form a layered structure in which multiple layered structures are stacked by irradiating an energy beam onto an object via an optical system using an irradiation system while supplying the modeling material to the irradiation area of ​​the energy beam using a supply system, and a change device that can change the relative position between the energy beam and the object, the computer program causing the computer to execute a process of setting the magnitude of the focal depth of the optical system to be greater than the thickness of one layer and less than the thickness of two layers of the layered structure.

[0019] According to a 16th aspect, there is provided a computer program to be executed by a computer that controls a modeling system including a modeling device that performs a modeling process to form a model by irradiating an irradiation area on an object with an energy beam by an irradiation system while supplying the modeling material to the irradiation area by a supply system, and a change device that can change the relative position between the energy beam and the object, the computer program causing the computer to execute a process of, after a first period in which the relative position between the irradiation area of ​​the energy beam and the object is set in a first direction, changing the relative position between the irradiation area of ​​the energy beam and the object in a second direction intersecting the first direction, and then changing the relative position between the irradiation area of ​​the energy beam and the object in a second period in a direction parallel to the first direction, and performing the modeling process for at least a part of at least one of the first period and the second period.

[0020] According to the 17th aspect, there is provided a modeling system comprising: a modeling device that performs a modeling process to form a model by irradiating an energy beam onto an object using an irradiation system while supplying the modeling material to an irradiation area of ​​the energy beam using a supply system; a change device that can change the relative position between the energy beam and the object; and a receiving device that receives a control signal to control the modeling device and the change device so as to make different the conditions of the modeling process performed on a first area of ​​the object and the conditions of the modeling process performed on a second area of ​​the object.

[0021] According to the 18th aspect, there is provided a modeling system comprising: a modeling device that performs a modeling process to form a model by irradiating an energy beam onto an object using an irradiation system while supplying the modeling material to an irradiation area of ​​the energy beam using a supply system; a change device that can change the relative position of the energy beam and the object; and a receiving device that receives a control signal to control the modeling device and the change device so as to differ between conditions of the modeling process performed on a first area of ​​the object in which the irradiation area is set multiple times and conditions of the modeling process performed on a second area of ​​the object in which the irradiation area is set fewer times than the number of times it is set in the first area.

[0022] According to the 19th aspect, there is provided a modeling system comprising: a modeling device that performs a modeling process by irradiating an energy beam onto an object using an irradiation system while supplying the modeling material to an irradiation area of ​​the energy beam using a supply system, thereby growing a modeling object in a direction that changes the relative position of the energy beam and the object; a change device that can change the relative position of the energy beam and the object; and a receiving device that receives a control signal to control the modeling device and the change device so that when the relative positional relationship between the energy beam and the object that performed the modeling process at a first timing becomes the relative positional relationship between the energy beam and the object when performing the modeling process at a second timing, the conditions of the modeling process at the second timing are changed from the conditions of the modeling process at the first timing.

[0023] According to the 20th aspect, a modeling system is provided which includes a modeling device that performs a modeling process to form a layered structure in which multiple layered structures are stacked by irradiating an energy beam onto an object via an optical system using an irradiation system while supplying the modeling material to the irradiation area of ​​the energy beam using a supply system, a change device that can change the relative position between the energy beam and the object, and a receiving device that receives a control signal to control the modeling device and the change device so that the focal depth of the optical system is greater than the thickness of one layer and less than the thickness of two layers of the layered structure.

[0024] According to a 21st aspect, there is provided a modeling system comprising: a modeling device that performs a modeling process to form a model by irradiating an energy beam onto an irradiation area on an object using an irradiation system while supplying the modeling material to the irradiation area using a supply system; a change device capable of changing the relative position of the energy beam and the object; and a receiving device that receives a control signal to control the modeling device and the change device so that after a first period in which the relative position of the irradiation area of ​​the energy beam and the object is set in a first direction, the relative position of the irradiation area of ​​the energy beam and the object is changed in a second direction intersecting the first direction, and then the relative position of the irradiation area of ​​the energy beam and the object is changed in a direction parallel to the first direction during a second period, and the modeling process is performed for at least a part of at least one of the first period and the second period.

[0025] According to the 22nd aspect, there is provided a control device for controlling a modeling system that includes a modeling device that performs a modeling process to form a model by irradiating an energy beam onto an object using an irradiation system while supplying the modeling material to an irradiation area of ​​the energy beam using a supply system, and a change device that can change the relative position between the energy beam and the object, and that performs processing to make the conditions of the modeling process performed on a first area of ​​the object different from the conditions of the modeling process performed on a second area of ​​the object.

[0026] According to the 23rd aspect, there is provided a control device for controlling a modeling system which includes a modeling device that performs a modeling process to form a model by irradiating an energy beam onto an object using an irradiation system while supplying the modeling material to an irradiation area of ​​the energy beam using a supply system, and a change device that can change the relative position of the energy beam and the object, and which performs processing to make different the conditions of the modeling process performed on a first area of ​​the object in which the irradiation area is set multiple times from the conditions of the modeling process performed on a second area of ​​the object in which the irradiation area is set fewer times than the number of times it is set in the first area.

[0027] According to the 24th aspect, there is provided a control device for controlling a modeling system which includes a modeling device that performs a modeling process by growing a modeling object in a direction that changes the relative position between the energy beam and the object by irradiating an energy beam onto the object using an irradiation system while supplying the modeling material to the irradiation area of ​​the energy beam using a supply system, and a change device that can change the relative position between the energy beam and the object, and which performs a process to change the conditions of the modeling process at the second timing from the conditions of the modeling process at the first timing when the relative positional relationship between the energy beam and the object that performed the modeling process at a first timing becomes the relative positional relationship between the energy beam and the object when performing the modeling process at a second timing.

[0028] According to the 25th aspect, there is provided a control device for controlling a modeling system that includes a modeling device that performs a modeling process to form a layered structure in which multiple layered structures are stacked by irradiating an energy beam onto an object via an optical system using an irradiation system while supplying the modeling material to the irradiation area of ​​the energy beam using a supply system, and a change device that can change the relative position between the energy beam and the object, and that performs a process to change the focal depth of the optical system to be greater than the thickness of one layer and less than the thickness of two layers of the layered structure.

[0029] According to the 26th aspect, there is provided a control device for controlling a modeling system that includes a modeling device that performs a modeling process to form a model by irradiating an energy beam onto an irradiation area on an object using an irradiation system while supplying the modeling material to the irradiation area using a supply system, and a change device that can change the relative position of the energy beam and the object, wherein after a first period in which the relative position between the irradiation area of ​​the energy beam and the object is set in a first direction, the relative position between the irradiation area of ​​the energy beam and the object is changed in a second direction intersecting the first direction, and then, in a second period, the relative position between the irradiation area of ​​the energy beam and the object is changed in a direction parallel to the first direction, and the modeling process is performed for at least a part of at least one of the first period and the second period.

[0030] The functions and other advantages of the present invention will become apparent from the following detailed description of the preferred embodiments. [Brief description of the drawings]

[0031] [Figure 1] FIG. 1 is a cross-sectional view showing a structure of a modeling system according to the present embodiment. [Diagram 2] Each of Fig. 2(a) to Fig. 2(c) is a cross-sectional view showing a state in which light is irradiated and modeling material is supplied to a certain area on a workpiece. [Diagram 3] Each of FIG. 3(a) and FIG. 3(b) is a plan view showing the movement trajectory of the irradiation area on the printing surface. [Figure 4] Each of Figures 4(a) to 4(c) is a cross-sectional view showing a process for forming a three-dimensional structure. [Diagram 5] Figure 5(a) is a plan view showing the movement paths of the irradiation areas on the printing surface, Figure 5(b) is a cross-sectional view showing an object formed in a region where the movement paths of the irradiation areas intersect and an object formed in a region where the movement paths of the irradiation areas do not intersect, and Figure 5(c) is a plan view showing an object formed in a region where the movement paths of the irradiation areas intersect and an object formed in a region where the movement paths of the irradiation areas do not intersect. [Figure 6]Each of Figs. 6(a) to 6(c) is a graph showing the supply rate of the modeling material controlled so as to suppress the variation in height of the modeled object. [Figure 7] FIG. 7 is a graph showing the relationship between the supply rate of the modeling material and the supply amount of the modeling material from the material nozzle. [Figure 8] Figure 8(a) is a cross-sectional view showing the supply state of the modeling material when the gas ejection device is ejecting an inert gas, and Figure 8(b) is a cross-sectional view showing the supply state of the modeling material when the gas ejection device is not ejecting an inert gas. [Figure 9] FIG. 9(a) is a cross-sectional view showing the supply of the modeling material when the shielding member is in a non-shielding state, and FIG. 9(b) is a cross-sectional view showing the supply of the modeling material when the shielding member is in a shielding state. [Figure 10] FIG. 10(a) is a cross-sectional view showing the supply state of modeling material when the material nozzle is in a supply state, and FIG. 10(b) is a cross-sectional view showing the supply state of modeling material when the material nozzle is in a non-supply state. [Figure 11] Each of Figs. 11(a) to 11(c) is a graph showing a heat transfer rate controlled to suppress variation in height of an object. [Figure 12] FIG. 12 is a graph showing the relationship between heat transfer rate and light intensity on the illuminated area. [Figure 13] FIG. 13(a) is a cross-sectional view showing the light irradiation mode when the light-shielding member is in a light-shielding state, and FIG. 13(b) is a cross-sectional view showing the light irradiation mode when the light-shielding member is in a non-light-shielding state. [Figure 14] FIG. 14(a) is a cross-sectional view showing the light irradiation pattern when the focus position is set on the printing surface, and FIG. 14(b) is a cross-sectional view showing the light irradiation pattern when the focus position is set at a position away from the printing surface. [Figure 15] Each of Fig. 15(a) and Fig. 15(b) is a graph showing the moving speed of the irradiation area controlled so as to suppress the variation in height of the object. [Figure 16]FIG. 16(a) is a plan view showing the movement path of the irradiation area on the modeling surface, and FIG. 16(b) is a graph showing the relationship between the movement speed of the irradiation area and the height of the model. [Figure 17] FIG. 17 is a graph showing the supply rate of the modeling material controlled based on the moving speed of the irradiation area so as to suppress the variation in height of the modeled object. [Figure 18] FIG. 18 is a graph showing the relationship between the moving speed of the irradiation area, the supply rate of the modeling material, and the height of the model. [Figure 19] FIG. 19 is a graph showing the heat transfer rate controlled based on the moving speed of the irradiation region so as to suppress the variation in height of the model. [Figure 20] FIG. 20 is a graph showing the relationship between the moving speed of the irradiation area, the heat transfer rate, and the height of the model. [Figure 21] Figure 21(a) is an oblique view showing an example of the locations of areas in an existing structure where heat is relatively difficult to diffuse and areas where heat is relatively easy to diffuse, and Figure 21(b) is a cross-sectional view showing a structure formed in an area where heat is relatively difficult to diffuse and a structure formed in an area where heat is relatively easy to diffuse. [Figure 22] FIG. 22 is a graph showing the supply rate of the modeling material controlled based on the degree of thermal diffusion so as to suppress variation in the height of the modeled object. [Diagram 23] FIG. 23 is a graph showing a heat transfer rate controlled based on the degree of thermal diffusion so as to suppress variation in height of the model. [Figure 24] FIG. 24 is a graph showing the moving speed of the irradiation area controlled based on the degree of heat diffusion so as to suppress the variation in height of the model. [Diagram 25] Figure 25(a) is an oblique view showing an example of the positions of an area where light EL is irradiated relatively frequently and an area where light EL is irradiated relatively infrequently, and Figure 25(b) is a cross-sectional view showing a structure formed in an area where light EL is irradiated relatively frequently and a structure formed in an area where light EL is irradiated relatively infrequently. [Figure 26]FIG. 26 is a graph showing the supply rate of the modeling material controlled based on the frequency of light irradiation so as to suppress variation in the height of the modeled object. [Figure 27] FIG. 27 is a graph showing the heat transfer rate controlled based on the frequency of light irradiation so as to suppress variation in the height of the object. [Figure 28] FIG. 28 is a graph showing the moving speed of the irradiation area controlled based on the frequency of light irradiation so as to suppress the variation in height of the model. [Figure 29] FIG. 29 is a plan view and a cross-sectional view showing a mark formed on the modeling surface. [Diagram 30] 30(a) and 30(b) are each a plan view showing the movement trajectory of the irradiation region on the printing surface when the mark shown in FIG. 29 is formed. [Diagram 31] Each of Figures 31(a) to 31(d) is a plan view showing a mark whose size has been controlled by a size control operation. [Diagram 32] FIG. 32 is a graph showing the relationship between heat transfer rate and mark size. [Diagram 33] FIG. 33 is a graph showing the relationship between the moving speed of the irradiation area and the size of the mark. [Diagram 34] FIG. 34 is a graph showing the relationship between the size of the irradiation area and the size of the mark. [Diagram 35] Each of Figures 35(a) and 35(b) is a plan view showing the relationship between the size of a mark and the number of linear structures that make up the mark, and each of Figures 35(c) to 35(d) is a plan view showing the relationship between the size of a mark and the length of the linear structures that make up the mark. [Diagram 36] Each of Figures 36(a) to 36(d) is a plan view showing a mark whose height has been controlled by a height control operation. [Figure 37] FIG. 37 is a graph showing the relationship between the supply rate and the mark height. [Figure 38] FIG. 38 is a graph showing the relationship between heat transfer rate and mark height. [Figure 39] FIG. 39 is a graph showing the relationship between the moving speed of the irradiation area and the height of the mark. [Diagram 40] Each of Figures 40(a) and 40(b) is a cross-sectional view showing the relationship between the height of a mark and the number of structural layers that constitute the mark. [Diagram 41] Each of Figures 41(a) to 41(c) is a cross-sectional view showing a mark whose surface shape has been controlled by a shape control operation. [Diagram 42] Each of Figures 42(a) to 42(c) is a cross-sectional view showing a mark whose coupling surface shape has been controlled by a shape control operation. [Diagram 43] FIG. 43(a) is a plan view and a cross-sectional view showing a mark to be pressed onto an object as a seal, and FIG. 43(b) is a plan view showing an impression transferred onto the object onto which the mark has been pressed. [Diagram 44] Each of Figures 44(a) to 44(c) is a cross-sectional view showing a mark in which the shape of a coupling surface is controlled so as to have a complementary relationship with a target surface of an object. [Diagram 45] Figure 45(a) is a graph showing an example of a control mode of the characteristics of a specific gas during a period when multiple marks are formed, Figure 45(b) is a plan view showing multiple marks formed when the characteristics of a specific gas are controlled in the control mode shown in Figure 45(a), Figure 45(c) is a graph showing an example of a control mode of the characteristics of a specific gas during a period when a single mark is formed, and Figure 45(d) is a plan view showing a mark formed when the characteristics of a specific gas are controlled in the control mode shown in Figure 45(c). [Figure 46] Each of Figures 46(a) to 46(c) is a cross-sectional view showing the state of the surface to be polished during the polishing operation. [Figure 47] FIG. 47(a) is a plan view showing the movement path of the irradiation area while a modeling operation is being performed, and FIG. 47(b) is a plan view showing the movement path of the irradiation area while a polishing operation is being performed. [Figure 48]FIG. 48(a) is a plan view showing the movement path of the irradiation area while a modeling operation is being performed, and FIG. 48(b) is a plan view showing the movement path of the irradiation area while a polishing operation is being performed. [Figure 49] FIG. 49 is a cross-sectional view showing a focal depth of an irradiation optical system included in a modeling system of a first modified example. [Figure 50] Figure 50(a) is a cross-sectional view showing a structural layer formed by the molding system of the first modified example when an irradiation area is set in a certain area portion on the molding surface, and Figure 50(b) is a cross-sectional view showing a structural layer formed by the molding system of the first modified example when an irradiation area is again set in the same area portion as the area portion shown in Figure 50(a). [Figure 51] Each of Figures 51(a) and 51(b) is a cross-sectional view showing the positional relationship between the modeling surface and the range of the focal depth of the irradiation optical system. [Figure 52] FIG. 52 is a cross-sectional view showing a structure of a modeling system according to a second modified example. [Figure 53] FIG. 53(a) is a cross-sectional view showing a structure of an irradiation optical system included in a modeling system of a third modified example, and FIG. 53(b) is a perspective view showing a structure of an optical system included in the irradiation optical system of the third modified example. [Figure 54] FIG. 54 is a cross-sectional view showing a structure of a molding device included in a molding system of a fourth modified example. [Figure 55] FIG. 55 is a cross-sectional view showing a structure of a molding device included in a molding system of a fifth modified example. [Figure 56] FIG. 56 is a cross-sectional view showing the configuration of a model formed by the sixth modified example. [Figure 57] FIG. 57 is a cross-sectional view showing the configuration of a model formed by the seventh modified example. [Figure 58] FIG. 58 is a cross-sectional view showing the operation of the eighth modified example. [Figure 59] FIG. 59 is a cross-sectional view showing an example of a supply amount change device used in the eighth modified example. [Figure 60] FIG. 60 is a cross-sectional view showing an example of a supply amount change device used in the eighth modified example. [Figure 61] Figure 61(a) is a plan view showing the movement trajectory of the irradiation area on the printing surface, and Figure 61(b) is a cross-sectional view showing a part of a molded object formed when the irradiation area moves along the movement trajectory shown in Figure 61(a). [Figure 62] Figure 62(a) is a plan view showing the movement trajectory of the irradiation area on the printing surface, and Figure 62(b) is a cross-sectional view showing a portion of the object formed when the irradiation area moves along the movement trajectory shown in Figure 62(a). DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0032] Hereinafter, embodiments of a processing device, a processing method, a marking method, a modeling system, a modeling method, a computer program, a recording medium, and a control device will be described with reference to the drawings. Hereinafter, embodiments of a processing device, a processing method, a marking method, a modeling system, a modeling method, a computer program, a recording medium, and a control device will be described using a modeling system 1 that can execute processing for forming a three-dimensional structure ST by performing additional processing using a modeling material M by laser metal deposition (LMD). Laser metal deposition (LMD) may also be called direct metal deposition, direct energy deposition, laser cladding, laser engineered net shaping, direct light fabrication, laser consolidation, shape deposition manufacturing, wire-feed laser deposition, gas through wire, laser powder fusion, laser metal forming, selective laser powder remelting, laser direct casting, laser powder deposition, laser additive manufacturing, and laser rapid forming.

[0033] In the following description, the positional relationship of various components constituting the modeling system 1 will be described using an XYZ Cartesian coordinate system defined by mutually orthogonal X-axis, Y-axis, and Z-axis. For convenience of explanation, the X-axis direction and the Y-axis direction are each assumed to be horizontal (i.e., a predetermined direction in a horizontal plane), and the Z-axis direction is assumed to be vertical (i.e., a direction perpendicular to the horizontal plane, essentially an up-down direction). The rotation directions (in other words, tilt directions) around the X-axis, Y-axis, and Z-axis are respectively referred to as the θX direction, the θY direction, and the θZ direction. Here, the Z-axis direction may be the direction of gravity. The XY plane may be the horizontal direction.

[0034] (1) Structure of Modeling System 1 First, the overall structure of a modeling system 1 of this embodiment will be described with reference to Fig. 1. Fig. 1 is a cross-sectional view showing an example of the structure of the modeling system 1 of this embodiment.

[0035] The modeling system 1 can form a three-dimensional structure ST (i.e., a three-dimensional object having a size in any three-dimensional direction, a solid object). The modeling system 1 can form the three-dimensional structure ST on a workpiece W that serves as a base (i.e., a base material) for forming the three-dimensional structure ST. The modeling system 1 can form the three-dimensional structure ST by performing additional processing on the workpiece W. When the workpiece W is a stage 43 described later, the modeling system 1 can form the three-dimensional structure ST on the stage 43. When the workpiece W is an existing structure held by the stage 43, the modeling system 1 can form the three-dimensional structure ST on the existing structure. In this case, the modeling system 1 may form the three-dimensional structure ST integrated with the existing structure. The operation of forming the three-dimensional structure ST integrated with the existing structure is equivalent to the operation of adding a new structure to the existing structure. Alternatively, the modeling system 1 may form a three-dimensional structure ST that can be separated from the existing structure. 1 shows an example in which the workpiece W is an existing structure held by the stage 43. In the following, the explanation will be given using an example in which the workpiece W is an existing structure held by the stage 43.

[0036] As described above, the modeling system 1 can form a three-dimensional structure ST by the laser deposition welding method. In other words, the modeling system 1 can be said to be a 3D printer that forms an object using additive manufacturing technology. The additive manufacturing technology is also called rapid prototyping, rapid manufacturing, or additive manufacturing.

[0037] In order to form a three-dimensional structure ST, the modeling system 1 includes a material supplying device 3, a modeling device 4, a light source 5, a gas supplying device 6, and a control device 7, as shown in FIG. 1. The material supplying device 3, the modeling device 4, the light source 5, the gas supplying device 6, and the control device 7 are housed in a housing C. In the example shown in FIG. 1, the modeling device 4 is housed in an upper space UC of the housing C, and the material supplying device 3, the light source 5, the gas supplying device 6, and the control device 7 are housed in a lower space LC of the housing C located below the upper space UC. However, the respective positions of the material supplying device 3, the modeling device 4, the light source 5, the gas supplying device 6, and the control device 7 in the housing C are not limited to the positions shown in FIG. 1.

[0038] The material supplying device 3 supplies the modeling material M to the modeling device 4. The material supplying device 3 supplies a desired amount of the modeling material M according to a required amount so that the modeling device 4 is supplied with the amount of the modeling material M required per unit time for the modeling device 4 to form a three-dimensional structure ST.

[0039] The modeling material M is a material that can be melted by irradiation with light EL of a predetermined intensity or higher. For example, at least one of a metallic material and a resinous material can be used as the modeling material M. However, other materials other than the metallic material and the resinous material may be used as the modeling material M. The modeling material M is a powder or granular material. In other words, the modeling material M is a powder or granular material. However, the modeling material M does not have to be a powder or granular material, and for example, a wire-shaped modeling material or a gas-shaped modeling material may be used.

[0040] The modeling device 4 processes the modeling material M supplied from the material supply device 3 to form a three-dimensional structure ST. In order to process the modeling material M, the modeling device 4 includes a modeling head 41, a drive system 42, and a stage 43. Furthermore, the modeling head 41 includes an irradiation optical system 411 and a material nozzle (i.e., a supply system that supplies the modeling material M) 412. The modeling head 41, the drive system 42, and the stage 43 are housed in a chamber 44.

[0041] The irradiation optical system 411 is an optical system (for example, a light collecting optical system) for emitting the light EL from the emission unit 413. Specifically, the irradiation optical system 411 is optically connected to the light source 5 that emits the light EL via an optical transmission member (not shown), such as an optical fiber or a light pipe. The irradiation optical system 411 emits the light EL propagated from the light source 5 via the optical transmission member. The irradiation optical system 411 irradiates the light EL downward (i.e., the -Z side) from the irradiation optical system 411. The stage 43 is disposed below the irradiation optical system 411. When the workpiece W is mounted on the stage 43, the irradiation optical system 411 irradiates the light EL toward the workpiece W. Specifically, the irradiation optical system 411 can irradiate the light EL to an irradiation area EA that is set on the workpiece W as an area to be irradiated with the light EL (typically, condensed). Furthermore, the state of the irradiation optical system 411 can be switched between a state in which the light EL is irradiated to the irradiation area EA and a state in which the light EL is not irradiated to the irradiation area EA under the control of the control device 7. The direction of the light EL emitted from the irradiation optical system 411 is not limited to directly below (that is, coinciding with the -Z axis direction), but may be, for example, a direction inclined at a predetermined angle with respect to the Z axis.

[0042] The material nozzle 412 has a supply outlet 414 that supplies the modeling material M. The material nozzle 412 supplies (specifically, jets, ejects, or sprays) the modeling material M from the supply outlet 414. The material nozzle 412 is physically connected to the material supply device 3, which is a supply source of the modeling material M, via a pipe or the like (not shown). The material nozzle 412 supplies the modeling material M supplied from the material supply device 3 via the pipe. The material nozzle 412 may pressure-feed the modeling material M supplied from the material supply device 3 via the pipe. That is, the modeling material M from the material supply device 3 may be mixed with a conveying gas (e.g., an inert gas such as nitrogen or argon) and pressure-feed it to the material nozzle 412 via the pipe. Note that, although the material nozzle 412 is depicted in FIG. 1 as being tubular, the shape of the material nozzle 412 is not limited to this shape. The material nozzle 412 supplies the modeling material M from the material nozzle 412 downward (i.e., toward the -Z side). The stage 43 is disposed below the material nozzle 412. When a workpiece W is mounted on the stage 43, the material nozzle 412 supplies the modeling material M toward the workpiece W. The traveling direction of the modeling material M supplied from the material nozzle 412 is inclined at a predetermined angle (as an example, an acute angle) with respect to the Z-axis direction, but may be on the -Z side (i.e., directly below).

[0043] In this embodiment, the material nozzle 412 is aligned with respect to the irradiation optical system 411 so as to supply the modeling material M toward the irradiation area EA to which the irradiation optical system 411 irradiates the light EL. In other words, the material nozzle 412 and the irradiation optical system 411 are aligned so that the supply area MA, which is set on the workpiece W as the area to which the material nozzle 412 supplies the modeling material M, coincides with (or at least partially overlaps with) the irradiation area EA. Note that the material nozzle 412 may be aligned so as to supply the modeling material M to a molten pool MP formed by the light EL emitted from the irradiation optical system 411.

[0044] The drive system 42 moves the object-forming head 41. The drive system 42 moves the object-forming head 41 along at least one of the X-axis, the Y-axis, and the Z-axis. When the object-forming head 41 moves along at least one of the X-axis and the Y-axis, the irradiation area EA moves on the workpiece W along at least one of the X-axis and the Y-axis. Furthermore, the drive system 42 may move the object-forming head 41 along at least one of the θX direction, the θY direction, and the θZ direction in addition to at least one of the X-axis, the Y-axis, and the Z-axis. The drive system 42 includes, for example, a motor. The drive system 42 may move the irradiation optical system 411 and the material nozzle 412 separately. Specifically, for example, the drive system 42 may be capable of adjusting at least one of the position of the ejection unit 413, the orientation of the ejection unit 413, the position of the supply outlet 414, and the orientation of the supply outlet 414. In this case, it is possible to separately control an irradiation area EA where the irradiation optical system 411 irradiates the light EL and a supply area MA where the material nozzle 412 supplies the modeling material M. Note that the drive system 42 may be configured to rotate the modeling head 41 along a rotation axis around the X-axis and a rotation axis around the Y-axis.

[0045] The stage 43 can hold the workpiece W. Furthermore, the stage 43 can release the held workpiece W. The above-mentioned irradiation optical system 411 irradiates light EL during at least a portion of the period during which the stage 43 holds the workpiece W. Furthermore, the above-mentioned material nozzle 412 supplies the modeling material M during at least a portion of the period during which the stage 43 holds the workpiece W. Note that a portion of the modeling material M supplied by the material nozzle 412 may be scattered or spilled from the surface of the workpiece W to the outside of the workpiece W (for example, to the periphery of the stage 43). For this reason, the modeling system 1 may be provided with a recovery device around the stage 43 that recovers the scattered or spilled modeling material M. Note that the stage 43 may be provided with a mechanical chuck, a vacuum suction chuck, or the like to hold the workpiece W.

[0046] The light source 5 emits, for example, at least one of infrared light, visible light, and ultraviolet light as the light EL. However, other types of light may be used as the light EL. The light EL is laser light. In this case, the light source 5 may include a laser light source (for example, a semiconductor laser such as a laser diode (LD: Laser Diode). Examples of the laser light source include a fiber laser and a CO 2 It may be a laser, a YAG laser, an excimer laser, etc. However, the light EL does not have to be a laser beam, and the light source 5 may include any light source (for example, at least one of an LED (Light Emitting Diode) and a discharge lamp).

[0047] The gas supply device 6 is a supply source of a purge gas. The purge gas includes an inert gas. Examples of the inert gas include nitrogen gas and argon gas. The gas supply device 6 supplies the purge gas into the chamber 44 of the molding device 4. As a result, the internal space of the chamber 44 becomes a space purged by the purge gas. The gas supply device 6 may be a cylinder storing an inert gas such as nitrogen gas or argon gas, or, when the inert gas is nitrogen gas, may be a nitrogen gas generator that generates nitrogen gas using the air as a raw material.

[0048] The control device 7 controls the operation of the molding system 1. The control device 7 may include, for example, a central processing unit (CPU), a graphics processing unit (GPU), and a memory. The control device 7 functions as a device that controls the operation of the molding system 1 by the CPU executing a computer program. This computer program is a computer program for making the control device 7 (for example, the CPU) perform (i.e., execute) the operation to be performed by the control device 7, which will be described later. In other words, this computer program is a computer program for making the control device 7 function so as to make the molding system 1 perform the operation to be described later. The computer program executed by the CPU may be recorded in a memory (i.e., a recording medium) provided in the control device 7, or may be recorded in any storage medium (for example, a hard disk or a semiconductor memory) built into the control device 7 or externally attachable to the control device 7. Alternatively, the CPU may download the computer program to be executed from a device outside the control device 7 via a network interface. In addition, the control device 7 may not be disposed inside the molding system 1, and may be disposed, for example, as a server or the like outside the molding system 1. In this case, the control device 7 and the molding system 1 may be connected by a communication line or a network, such as wired or wireless. When the control device 7 is physically connected by wire, the connection may be, for example, a serial connection such as IEEE1394, RS-232x, RS-422, RS-423, RS-485, or USB, a parallel connection, or an electrical connection via a network such as 10BASE-T, 100BASE-TX, or 1000BASE-T. When the control device 7 is connected by wireless, radio waves such as IEEE802.1x or OFDM wireless LAN, or Bluetooth (registered trademark), infrared, or optical communication may be used. In this case, the control device 7 and the molding system 1 may be configured to be able to transmit and receive various information via a communication line or a network. The control device 7 may also be able to transmit information such as commands and control parameters to the molding system 1 via the above-mentioned communication line or network.The molding system 1 may include a receiving device that receives information such as commands and control parameters from the control device 7 via the communication line or network. The recording medium for recording the computer program executed by the CPU may include magnetic media such as CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, Blu-ray (registered trademark), magnetic disks and magnetic tapes, optical disks, magneto-optical disks, semiconductor memories such as USB memory, and other media capable of storing programs. The programs may be distributed by downloading through a network line such as the Internet, in addition to those stored in the recording medium. The recording medium may also include devices capable of recording programs, such as general-purpose or dedicated devices in which the programs are implemented in an executable state in the form of software or firmware. Furthermore, each process or function included in the program may be executed by program software executable by a computer, or the processes of each part may be realized by hardware such as a predetermined gate array (FPGA, ASIC), or a form in which the program software and a partial hardware module that realizes some elements of the hardware are mixed. Particularly, in this embodiment, the control device 7 controls the emission mode of the light EL by the irradiation optical system 411. The emission mode includes, for example, at least one of the intensity of the light EL and the emission timing of the light EL. When the light EL is a pulsed light, the emission mode may include, for example, at least one of the length of the emission time of the pulsed light and the ratio of the emission time of the pulsed light to the extinction time (so-called duty ratio). Furthermore, the control device 7 controls the movement mode of the modeling head 41 by the drive system 42. The movement mode includes, for example, at least one of the movement amount, the movement speed, the movement direction, and the movement timing. Furthermore, the control device 7 controls the supply mode of the modeling material M by the material nozzle 412. The supply mode includes, for example, at least one of the supply amount (particularly, the supply amount per unit time) and the supply timing. Note that the control device 7 does not have to be provided inside the modeling system 1, and may be provided, for example, as a server or the like outside the modeling system 1.

[0049] (2) Modeling operation by modeling system 1 Next, a modeling operation (i.e., an operation for forming a three-dimensional structure ST) by the modeling system 1 will be described. As described above, the modeling system 1 forms the three-dimensional structure ST by a laser build-up welding method. For this reason, the modeling system 1 may form the three-dimensional structure ST by performing an existing modeling operation that complies with the laser build-up welding method. An example of a modeling operation for forming a three-dimensional structure ST by the laser build-up welding method will be briefly described below.

[0050] The modeling system 1 forms a three-dimensional structure ST on a workpiece W based on three-dimensional model data (for example, CAD (Computer Aided Design) data) of the three-dimensional structure ST to be formed. As the three-dimensional model data, measurement data of a three-dimensional object measured by a measuring device 45 provided in the modeling system 1, a three-dimensional shape measuring machine provided separately from the modeling system 1, for example, a contact-type three-dimensional coordinate measuring machine having a probe that is movable relative to the workpiece W and can contact the workpiece W, or a non-contact-type three-dimensional measuring machine (for example, a pattern projection type three-dimensional measuring machine, a light section type three-dimensional measuring machine, a time-of-flight type three-dimensional measuring machine, a moire topography type three-dimensional measuring machine, a holographic interferometry type three-dimensional measuring machine, a CT (Computed Tomography) type three-dimensional measuring machine, an MRI (Magnetic Resonance Imaging) type three-dimensional measuring machine, etc. may be used. Note that as the three-dimensional model data, for example, STL (Stereo Lithography) format, VRML (Virtual Reality Modeling Language) format, AMF (Additive Manufacturing File Format), IGES (Initial Graphics Exchange Specification) format, VDA-FS (Association of German Automotive Manufactures-Surfaces) format, etc. may be used. The modeling system 1 can use a 3D image format such as a Hewlett-Packard Graphics Language (HP / GL) format, a bitmap format, etc. In order to form the three-dimensional structure ST, the modeling system 1 sequentially forms, for example, a plurality of layered partial structures (hereinafter referred to as "structural layers") SL arranged along the Z-axis direction. For example, the modeling system 1 sequentially forms a plurality of structural layers SL obtained by slicing the three-dimensional structure ST along the Z-axis direction, one by one. As a result, the three-dimensional structure ST is formed as a laminated structure in which a plurality of structural layers SL are stacked. The flow of operations for forming the three-dimensional structure ST by sequentially forming a plurality of structural layers SL one by one will be described below.

[0051] First, the operation of forming each structure layer SL will be described. Under the control of the control device 7, the modeling system 1 sets an irradiation area EA in a desired area on the modeling surface CS corresponding to the surface of the workpiece W or the surface of the already formed structure layer SL, and irradiates the irradiation area EA with light EL from the irradiation optical system 411. The area on the modeling surface CS occupied by the light EL irradiated from the irradiation optical system 411 may be referred to as the irradiation area EA. In this embodiment, the focus position (i.e., the light collection position) of the light EL coincides with the modeling surface CS. As a result, as shown in FIG. 2(a), a molten pool (i.e., a pool of metal melted by the light EL) MP is formed in a desired area on the modeling surface CS by the light EL emitted from the irradiation optical system 411. Furthermore, under the control of the control device 7, the modeling system 1 sets a supply area MA in a desired area on the modeling surface CS, and supplies modeling material M to the supply area MA from the material nozzle 412. Here, since the irradiation area EA and the supply area MA coincide as described above, the supply area MA is set in the area where the molten pool MP is formed. For this reason, as shown in FIG. 2(b), the modeling system 1 supplies the modeling material M to the molten pool MP from the material nozzle 412. As a result, the modeling material M supplied to the molten pool MP melts. When the light EL is no longer irradiated onto the molten pool MP as the modeling head 41 moves, the molten modeling material M in the molten pool MP cools and solidifies again (i.e., solidifies). As a result, as shown in FIG. 2(c), the re-solidified modeling material M is deposited on the modeling surface CS. In other words, a model is formed by the deposit of the re-solidified modeling material M.

[0052] A series of modeling processes including the formation of a molten pool MP by the light irradiation EL, the supply of the modeling material M to the molten pool MP, the melting of the supplied modeling material M, and the re-solidification of the molten modeling material M are repeated while moving the modeling head 41 relative to the modeling surface CS along the XY plane. In other words, when the modeling head 41 moves relative to the modeling surface CS, the irradiation area EA also moves relative to the modeling surface CS. Therefore, a series of modeling processes are repeated while moving the irradiation area EA relative to the modeling surface CS along the XY plane (i.e., within a two-dimensional plane). At this time, the light EL is selectively irradiated to the irradiation area EA set in the area on the modeling surface CS where a model is desired to be formed, while the light EL is not selectively irradiated to the irradiation area EA set in the area on the modeling surface CS where a model is not desired to be formed (it can also be said that the irradiation area EA is not set in the area where a model is not desired to be formed). That is, the modeling system 1 irradiates the modeling surface CS with the light EL at a timing corresponding to the distribution pattern of the area where the model is to be formed (i.e., the pattern of the structure layer SL) while moving the irradiation area EA along a predetermined movement trajectory on the modeling surface CS. As a result, the molten pool MP also moves on the modeling surface CS along a movement trajectory corresponding to the movement trajectory of the irradiation area EA. Specifically, the molten pool MP is formed sequentially in the area on the modeling surface CS that is irradiated with the light EL among the areas along the movement trajectory of the irradiation area EA. Furthermore, since the irradiation area EA and the supply area MA coincide with each other as described above, the supply area MA also moves on the modeling surface CS along a movement trajectory corresponding to the movement trajectory of the irradiation area EA. As a result, a structure layer SL corresponding to an assembly of models made of the solidified modeling material M is formed on the modeling surface CS. That is, a structure layer SL corresponding to an assembly of models formed on the modeling surface CS in a pattern corresponding to the movement trajectory of the molten pool MP (i.e., a structure layer SL having a shape corresponding to the movement trajectory of the molten pool MP in a plan view) is formed. When the irradiation area EA is set in an area where it is not desired to form a model, the supply of the modeling material M may be stopped while the light EL is irradiated onto the irradiation area EA.In addition, when the irradiation area EA is set in an area where it is not desired to form a molded object, the molding material M may be supplied to the irradiation area EL and light EL of an intensity that will not form a molten pool MP may be irradiated onto the irradiation area EL.

[0053] During a layer formation period in which one structure layer SL on the printing surface CS is formed, the irradiation area EA may move along a first movement trajectory in which the movement of the irradiation area EA along the Y-axis direction and the movement of the irradiation area EA along the X-axis direction are repeated, as shown in FIG. 3(a). In the example shown in FIG. 3(a), the irradiation area EA moves along a movement trajectory in which the movement of the irradiation area EA to the +Y side, the movement of the irradiation area EA to the +X side, the movement of the irradiation area EA to the -Y side, and the movement of the irradiation area EA to the +X side are repeated. In this case, the printing system 1 irradiates the light EL at the timing when the irradiation area EA is set to an area on the printing surface CS where a model is to be formed. In particular, in the example shown in FIG. 3(a), the movement amount of the irradiation area EA along the Y-axis direction (particularly, the movement amount of one movement until the movement direction of the irradiation area EA switches to the X-axis direction) is greater than the movement amount of the irradiation area EA along the X-axis direction. In this case, the modeling system 1 irradiates the light EL during the period when the irradiation area EA moves along the Y axis (or whichever of the X and Y axes has a larger movement amount per movement of the irradiation area EA), and does not irradiate the light EL during the period when the irradiation area EA moves along the X axis (or whichever of the X and Y axes has a smaller movement amount per movement of the irradiation area EA). Note that the movement trajectory shown in FIG. 3(a) can be said to be a movement trajectory corresponding to a so-called raster scan. In this case, although there is a possibility that the movement trajectory of the irradiation area EA will intersect on the modeling surface CS, it is highly unlikely that the movement trajectory of the irradiation area EA will intersect.

[0054] Alternatively, during the layer formation period, the irradiation area EA may move along a second movement trajectory along the pattern of the structure layer SL, as shown in FIG. 3(b). In this case, the modeling system 1 also irradiates the light EL at the timing when the irradiation area EA is set in the area on the modeling surface CS where the object is to be formed. However, since the irradiation area EA moves along the second movement trajectory along the pattern of the structure layer SL, it can be said that the irradiation area EA substantially overlaps with the area on the modeling surface CS where the object is to be formed. Therefore, the modeling system 1 may continue to irradiate the light EL during the period when the irradiation area EA is moving. In this case, the molten pool MP also moves along the second movement trajectory along the pattern of the structure layer SL. As a result, a modeling process is performed in which the object grows in the direction in which the irradiation area EA moves relative to the structure layer SL. It can be said that the movement trajectory shown in FIG. 3(b) corresponds to the so-called vector scan. In this case, the control device 7 may set the movement trajectory of the irradiation area EA so that it does not intersect on the printing surface CS (in particular, the movement trajectory of the molten pool MP does not intersect on the printing surface CS). However, depending on the distribution pattern on the printing surface CS of the area where a molded object is to be formed, there is a possibility that the movement trajectory of the irradiation area EA (in particular, the movement trajectory of the molten pool MP) may intersect on the printing surface CS.

[0055] In the above description, the irradiation area EA is moved relative to the printing surface CS by moving the printing head 41 (i.e., the light EL) relative to the printing surface CS, but it is also possible to move the printing surface CS, or to move both the printing head 41 (i.e., the light EL) and the printing surface CS.

[0056] The modeling system 1 repeatedly performs an operation for forming such a structure layer SL based on the three-dimensional model data under the control of the control device 7. Specifically, first, the three-dimensional model data is sliced ​​at a layer pitch to create slice data. Note that the slice data may be partially modified according to the characteristics of the modeling system 1. The modeling system 1 performs an operation for forming the first structure layer SL#1 on the modeling surface CS corresponding to the surface of the workpiece W based on the three-dimensional model data corresponding to the structure layer SL#1, i.e., the slice data corresponding to the structure layer SL#1. As a result, the structure layer SL#1 is formed on the modeling surface CS as shown in FIG. 4(a). After that, the modeling system 1 sets the surface (i.e., the upper surface) of the structure layer SL#1 as a new modeling surface CS, and then forms the second structure layer SL#2 on the new modeling surface CS. To form the structure layer SL#2, the control device 7 first controls the drive system 42 so that the modeling head 41 moves along the Z axis. Specifically, the control device 7 controls the drive system 42 to move the modeling head 41 toward the +Z side so that the irradiation area EA and the supply area MA are set on the surface of the structure layer SL#1 (i.e., the new modeling surface CS). As a result, the focus position of the light EL coincides with the new modeling surface CS. Thereafter, under the control of the control device 7, the modeling system 1 forms the structure layer SL#2 on the structure layer SL#1 based on the slice data corresponding to the structure layer SL#2, in the same operation as that for forming the structure layer SL#1. As a result, as shown in FIG. 4(b), the structure layer SL#2 is formed. Thereafter, the same operation is repeated until all the structure layers SL constituting the three-dimensional structure ST to be formed on the workpiece W are formed. As a result, as shown in FIG. 4(c), the three-dimensional structure ST is formed by a stacked structure in which a plurality of structure layers SL are stacked.

[0057] (3) Variation suppression operation Next, a variation suppression control operation for suppressing the variation in the characteristics of the object formed by the modeling operation (i.e., the object constituting each structure layer SL) will be described. In this embodiment, the modeling system 1 performs at least one of a first variation suppression operation, a second variation suppression operation, a third variation suppression operation, and a fourth variation suppression operation. Therefore, the first variation suppression operation to the fourth variation suppression operation will be described in order below.

[0058] In the following description, the height of the object from the printing surface CS (i.e., the size in the Z-axis direction or the size in the Z-axis direction, essentially the thickness of the object) is used as the characteristic of the object. In other words, the following description describes a variation suppression operation for suppressing variation in the height of the object. However, any characteristic other than the height of the object may be used as the characteristic of the object. For example, in addition to or instead of the height of the object from the printing surface CS, the size of the object along the printing surface CS (i.e., the size in at least one of the X-axis direction and the Y-axis direction, e.g., the width) may be used as the characteristic of the object.

[0059] (3-1) First variation suppression operation First, the first variation suppression operation will be described. The first variation suppression operation corresponds to an operation for suppressing the variation in the height of a modeled object when the irradiation area EA is set twice or more in the same area on the modeling surface CS during a layer formation period in which any one structure layer SL is formed on the modeling surface CS. The first variation suppression operation may be an operation for suppressing the variation in the height (the size in the direction intersecting with the surface on which the structure layer SL is located) of any one structure layer SL at each position in the surface on which the structure layer SL is located.

[0060] Specifically, as shown in Fig. 5(a), during the layer formation period in which one structural layer SL on the shaping surface CS is formed, the irradiation region EA moves on the shaping surface CS along a movement locus corresponding to the pattern of the structural layer SL on the shaping surface CS. Here, depending on the pattern of the structural layer SL, there is a possibility that the movement loci of the irradiation region EA on the shaping surface CS may intersect. In the example shown in Fig. 5(a), the movement loci of the irradiation region EA intersect in the region WA1 on the shaping surface CS. In the region WA1 on the shaping surface CS where the movement loci of the irradiation region EA intersect, the irradiation region EA is set two or more times. On the other hand, in the region WA2 on the shaping surface CS that overlaps with the movement locus of the irradiation region EA but where the movement loci of the irradiation region EA do not intersect, the irradiation region EA is set only once. That is, the shaping surface CS includes the region WA1 where the irradiation region EA is set two or more times during the layer formation period and the region WA2 where the irradiation region EA is set only once during the layer formation period. Note that the region WA1 can be a region where the irradiation region EA is set M times (M is an integer of 2 or more) during the layer formation period, and the region WA2 can be a region where the irradiation region EA is set N times (N is an integer of 1 or more and satisfies the relationship N < M) during the layer formation period. In other words, the number of shaping processes for the region WA1 is different from the number of shaping processes for the region WA2. Specifically, the number of shaping processes for the region WA1 is more than the number of shaping processes for the region WA2. Further in other words, the number of shaping processes for the region WA2 is less than the number of shaping processes for the region WA1.

[0061] In the region WA1, a series of molding processes including the formation of the molten pool MP by the above-mentioned light irradiation EL, the supply of the molding material M to the molten pool MP, the melting of the supplied molding material M, and the re-solidification of the molten molding material M may be performed two or more times at different timings when the region WA1 coincides with at least a part of the irradiation region EA. In other words, in the region WA1, the movement trajectory of the molten pool MP on the printing surface CS may cross. On the other hand, in the region WA2, a series of molding processes is not performed two or more times. In the region WA2, a series of molding processes is performed at most once at a timing when the region WA2 coincides with at least a part of the irradiation region EA. In other words, in the region WA2, the movement trajectory of the molten pool MP on the printing surface CS does not cross. Note that, during the layer formation period in which one structure layer SL is formed, at least a part of the molten pool MP formed for the second or subsequent molding processes may be formed in the object formed in the region WA1 by the first molding process. In other words, at least a portion of the molten pool MP formed for the second or subsequent molding process may be formed of the molding material M.

[0062] When a series of modeling processes is performed twice or more in the region WA1 while a series of modeling processes is performed only once in the region WA2, in other words, when the number of times of modeling processes in the region WA1 and the region WA2 are different, the following technical problem occurs. Specifically, there is a possibility that a larger amount of modeling material M is supplied, melted, and resolidified in the region WA1 compared to the region WA2. For this reason, when a series of modeling processes is performed without distinguishing between the region WA1 and the region WA2 under a situation in which objects of the same height should be formed in the regions WA1 and WA2, the height of the object formed in the region WA1 and the height of the object formed in the region WA2 may not match. Typically, as shown in FIG. 5(b), the height h1 of the object formed in the region WA1 may be higher than the height h2 of the object formed in the region WA2 by the amount of the number of times the series of modeling processes is performed. In other words, when the irradiation region EA is set twice or more in a certain region on the printing surface CS during the layer formation period, the height of the object may vary. In the following, for ease of explanation, the object formed in the area WA1 will be referred to as the "object S1," and the object formed in the area WA2 will be referred to as the "object S2."

[0063] Therefore, in this embodiment, the control device 7 (in other words, the modeling system 1 under the control of the control device 7) performs a first variation suppression operation to suppress the variation between the height h1 of the model S1 and the height h2 of the model S2. Note that in this embodiment, the operation of "suppressing the variation between the height of one model and the height of another model" includes an operation of making the difference between the height of the one model and the height of the other model smaller (i.e., reducing the difference) compared to when the variation suppression operation is not performed. The operation of "suppressing the variation between the height of the one model and the height of the other model" includes an operation of making the height of the one model and the height of the other model coincident (i.e., making them the same).

[0064] As shown in FIG. 5(c), in a situation where objects of the same size should be formed in the areas WA1 and WA2, the size of the object formed in the area WA1 (here, the size in the X-axis direction, which is essentially the width) w1 may be larger than the size of the object formed in the area WA2. In other words, when the irradiation area EA is set in a certain area on the printing surface CS two or more times during the layer formation period, the size of the object may vary. For this reason, as described above, the size of the object (particularly, the size along the XY plane) may be a characteristic of the object whose variation should be suppressed by the first variation suppression operation. In this case, the first variation suppression operation may be an operation for suppressing the variation in size in the direction along the surface for each position in the surface on which the structure layer SL is located in any one structure layer SL. Conversely, any characteristic that satisfies the condition that if a series of forming processes is performed without distinguishing between areas WA1 and WA2 under a situation in which objects with the same characteristics should be formed in areas WA1 and WA2, the characteristics of the object formed in area WA1 and the characteristics of the object formed in area WA2 may not match, may be used as the characteristic of the object whose variation should be suppressed by the first variation suppression operation. The same applies to the second to fourth variation suppression operations described below.

[0065] The control device 7 may perform a first variation suppression operation to suppress variation in the height of the modeled object by controlling (e.g., adjusting, changing or setting, the same below) the supply amount of the modeling material M supplied to the supply area MA (i.e., the irradiation area EA or the molten pool MP) per unit time. Hereinafter, for convenience of explanation, the supply amount of the modeling material M supplied to the supply area MA per unit time is referred to as the "supply rate". Note that weight or volume may be used as the unit of the supply amount of the modeling material M. In addition to or instead of controlling the supply rate, the control device 7 may perform a first variation suppression operation to suppress variation in the height of the modeled object by controlling the amount of heat transferred from the light EL to the modeling surface CS per unit time via the irradiation area EA (i.e., the supply area MA). Hereinafter, for convenience of explanation, the amount of heat transferred from the light EL to the modeling surface CS per unit time via the irradiation area EA is referred to as the "heat transfer rate". In addition to or instead of controlling at least one of the supply rate and the heat transfer rate, the control device 7 may perform a first variation suppression operation to suppress variation in the height of the object by controlling the relative moving speed of the irradiation area EA (i.e., the supply area MA or the molten pool MP) with respect to the printing surface CS. Below, the first variation suppression operation for controlling the supply rate, the first variation suppression operation for controlling the heat transfer rate, and the first variation suppression operation for controlling the moving speed of the irradiation area EA will be described in order.

[0066] (3-1-1) First variation suppression operation for controlling the supply rate of the modeling material M First, with reference to Fig. 6(a) to Fig. 6(c), a first variation suppression operation for controlling the supply rate of the modeling material M will be described. For the sake of simplicity, each of Fig. 6(a) to Fig. 6(c) shows a method for controlling the supply rate of the modeling material M in a case where the irradiation area EA is set twice in the area WA1 during the layer formation period.

[0067] Each of Fig. 6(a) to Fig. 6(c) is a graph in which the horizontal axis indicates time and the vertical axis indicates the supply rate of the modeling material M. Since the irradiation area EA moves on the printing surface CS over time, the horizontal axis of Fig. 6(a) to Fig. 6(c) essentially corresponds to the position where the irradiation area EA is set on the printing surface. In other words, each of Fig. 6(a) to Fig. 6(c) shows the supply rate of the modeling material M to a certain area on the printing surface CS during the period when the irradiation area EA is set in that area.

[0068] As shown in Fig. 6(a), the control device 7 may control the supply rate so that (i) the supply rate for the region WA1 during the period when the irradiation region EA is set for the first time in the region WA1 is the same as the supply rate for the region WA2, and (ii) the supply rate for the region WA1 during the period when the irradiation region EA is set for the second time in the region WA1 is zero. In other words, the control device 7 may control the supply rate so that (i) the supply rate for the region WA1 where the irradiation region EA is set for the first time is the same as the supply rate for the region WA2, and (ii) the supply rate for the region WA1 where the irradiation region EA is set again is zero. The control device 7 may control the supply rate so that the supply rate for the region WA1 where the irradiation region EA is set again is lower than the supply rate for the region WA1 where the irradiation region EA is set for the first time.

[0069] Alternatively, the control device 7 may control the supply rate so that (i) the supply rate for the region WA1 during the period when the irradiation region EA is set in the region WA1 for the second time is the same as the supply rate for the region WA2, and (ii) the supply rate for the region WA1 during the period when the irradiation region EA is set in the region WA1 for the first time is zero. That is, the control device 7 may control the supply rate so that (i) the supply rate for the region WA1 where the irradiation region EA is set at a certain timing is the same as the supply rate for the region WA2, and (ii) the supply rate for the region WA1 where the irradiation region EA is set at other timing is zero. Similarly, when the irradiation region EA is set in the region WA1 two or more times during the layer formation period, the control device 7 may control the supply rate so that (i) the supply rate for the region WA1 where the irradiation region EA is set at a certain timing is the same as the supply rate for the region WA2, and (ii) the supply rate for the region WA1 where the irradiation region EA is set at other timing is zero. Furthermore, the control device 7 may control the supply rate so that the supply rate for the area WA1 in which the irradiation area EA is set at a certain timing is the same as the supply rate for the area WA2, and the supply rate for the area WA1 in which the irradiation area EA is set at other timings is lower than the supply rate for the area WA2.

[0070] As a result of controlling the supply rate in this manner, the total amount of the modeling material M supplied to the region WA1 during the layer formation period becomes the same as the total amount of the modeling material M supplied to the region WA2 during the layer formation period. More specifically, the total amount of the modeling material M supplied to the region WA1 of a certain size during the layer formation period becomes the same as the total amount of the modeling material M supplied to the region WA2 of the same size during the layer formation period. In other words, the value obtained by dividing the total amount of the modeling material M supplied to the region WA1 during the layer formation period by the area of ​​the region WA1 (i.e., the supply amount of the modeling material M per unit area) becomes the same as the value obtained by dividing the total amount of the modeling material M supplied to the region WA2 during the layer formation period by the area of ​​the region WA2. Therefore, the same amount of the modeling material M per unit area is supplied, melted, and resolidified in the regions WA1 and WA2. As a result, the variation between the height h1 of the modeled object S1 formed in the region WA1 and the height h2 of the modeled object S2 formed in the region WA2 is suppressed. That is, the difference between the height h1 of the model S1 and the height h2 of the model S2 is smaller than when the supply rate of the modeling material M is not controlled. Typically, the height h1 of the model S1 and the height h2 of the model S2 are the same. As a result, the formation accuracy of the three-dimensional structure ST, which is an assembly of models, is improved. If the relationship between the supply rate and the total amount of the modeling material M supplied to each area WA1, WA2 during the layer formation period is nonlinear, the supply rate can be controlled taking this nonlinear relationship into consideration. If the relationship between the supply rate and the heights h1, h2 of the models is nonlinear, the supply rate can be controlled taking this nonlinear relationship into consideration.

[0071] Alternatively, as shown in Fig. 6(b) and Fig. 6(c), the control device 7 may control the supply rate so that the modeling material M is supplied to the region WA1 every time the irradiation region EA is set in the region WA1 (i.e., the supply rate to the region WA1 does not become zero). In this case, the control device 7 controls the supply rate so that both the supply rate to the region WA1 during the period when the irradiation region EA is set in the region WA1 for the first time and the supply rate to the region WA1 during the period when the irradiation region EA is set in the region WA1 for the second time are smaller than the supply rate to the region WA2. Note that, as shown in Fig. 6(b), the control device 7 may control the supply rate so that the supply rate to the region WA1 during the period when the irradiation region EA is set in the region WA1 for the first time is different from the supply rate to the region WA1 during the period when the irradiation region EA is set in the region WA1 for the second time. Alternatively, the control device 7 may control the supply rate so that the supply rate to the region WA1 during the period when the irradiation region EA is set in the region WA1 for the first time is the same as the supply rate to the region WA1 during the period when the irradiation region EA is set in the region WA1 for the second time, as shown in Fig. 6(c). When the supply rate is controlled as shown in Fig. 6(b) or 6(c), the difference between the total amount of the modeling material M supplied to the region WA1 during the layer formation period and the total amount of the modeling material M supplied to the region WA2 during the layer formation period becomes smaller than when the supply rate to the region WA1 and the supply rate to the region WA2 are always the same. As a result, the variation between the height h1 of the modeled object S1 formed in the region WA1 and the height h2 of the modeled object S2 formed in the region WA2 is suppressed.

[0072] When the control device 7 controls the supply rate so that the modeling material M is supplied to the region WA1 every time the irradiation region EA is set in the region WA1, the control device 7 may control the supply rate to the region WA1 during the period in which the irradiation region EA is set for the first time in the region WA1 and the supply rate to the region WA1 during the period in which the irradiation region EA is set for the second time in the region WA1 so that the total amount of the modeling material M supplied to the region WA1 during the layer formation period is the same as the total amount of the modeling material M supplied to the region WA2 during the layer formation period. As a result, similar to the case in which the supply rate is controlled as shown in FIG. 6(b), the total amount of the modeling material M supplied to the region WA1 during the layer formation period is the same as the total amount of the modeling material M supplied to the region WA2 during the layer formation period. The variation between the height h1 of the modeled object S1 formed in the region WA1 and the height h2 of the modeled object S2 formed in the region WA2 is more appropriately suppressed. Note that, when the relationship between the supply rate and the total amount of the modeling material M supplied to each region WA1 and WA2 during the layer formation period is nonlinear, the supply rate may be controlled taking this nonlinear relationship into consideration. Furthermore, if the relationship between the supply rate and the heights h1 and h2 of the model is nonlinear, the supply rate may be controlled taking this nonlinear relationship into consideration.

[0073] In addition, even when the irradiation area EA is set in the area WA1 two or more times during the layer formation period, the control device 7 may control the supply rate so that the supply rate to the area WA1 during each period in which the irradiation area EA is set in the area WA1 is smaller than the supply rate to the area WA2. Furthermore, the control device 7 may control the supply rate to the area WA1 during each period in which the irradiation area EA is set in the area WA1 so that the total amount of the modeling material M supplied to the area WA1 during the layer formation period is the same as the total amount of the modeling material M supplied to the area WA2 during the layer formation period. In addition, the supply rate may be controlled so that the total amount of the modeling material M supplied to the area WA1 during the layer formation period is different from the total amount of the modeling material M supplied to the area WA2 during the layer formation period.

[0074] Next, a specific method for controlling the supply rate of the modeling material M will be described with reference to FIGS.

[0075] In order to control the supply rate, the control device 7 may control the supply amount (i.e., the injection amount) of the modeling material M from the material nozzle 412 per unit time. Specifically, as shown in FIG. 7, the supply rate increases as the supply amount of the modeling material M from the material nozzle 412 per unit time increases. For this reason, the control device 7 can control the supply rate by controlling the supply amount of the modeling material M from the material nozzle 412 per unit time. In order to control the supply amount of the modeling material M from the material nozzle 412 per unit time, the control device 7 may control the material supply device 3 to control the supply amount of the modeling material M from the material supply device 3 to the material nozzle 412 per unit time. Alternatively, in order to control the supply amount of the modeling material M from the material nozzle 412 per unit time, the control device 7 may control the material nozzle 412. For example, if the material nozzle 412 is equipped with a valve arranged in the supply path of the modeling material M within the material nozzle 412, the control device 7 may control the valve to control the amount of modeling material M supplied per unit time from the material nozzle 412.

[0076] As shown in Fig. 8(a) and Fig. 8(b), in order to control the supply rate, the control device 7 may control a gas jetting device 461 provided in the modeling device 4 to blow off at least a part of the modeling material M supplied from the material nozzle 412 before it reaches the supply area MA (i.e., the irradiation area EA or the molten pool MP). Specifically, the gas jetting device 461 jets an inert gas toward at least a part of the supply path of the modeling material M between the material nozzle 412 and the supply area MA. The gas jetting device 461 may jet the inert gas along a direction intersecting the direction of the supply path of the modeling material M between the material nozzle 412 and the supply area MA. The inert gas jetted by the gas jetting device 461 is supplied to the gas jetting device 461 from the gas supply device 6, for example. When the gas ejection device 461 ejects an inert gas, as shown in FIG. 8(a), at least a part of the modeling material M supplied from the material nozzle 412 is blown away from the supply area MA before reaching the supply area MA. That is, at least a part of the modeling material M supplied from the material nozzle 412 does not reach the supply area MA. On the other hand, when the gas ejection device 461 does not eject an inert gas, as shown in FIG. 8(b), the modeling material M supplied from the material nozzle 412 is not blown away from the supply area MA. That is, the modeling material M supplied from the material nozzle 412 reaches the supply area MA. As a result, when the gas ejection device 461 ejects an inert gas, the supply amount of the modeling material M per unit time to the supply area MA is smaller than when the gas ejection device 461 does not eject an inert gas. That is, when the gas ejection device 461 ejects an inert gas, the supply rate is smaller than when the gas ejection device 461 does not eject an inert gas. Therefore, the control device 7 can control the supply rate by controlling the gas ejection device 461.

[0077] As shown in FIGS. 9(a) and 9(b), the control device 7 may control a shielding member 462 disposed in the modeling device 4 so as to be insertable into and detachable from the supply path of the modeling material M between the material nozzle 412 and the supply area MA in order to control the supply rate. Specifically, the shielding member 462 is movable relative to the supply path of the modeling material M by a drive system (e.g., an actuator, etc.) not shown. The shielding member 462 may be movable along a direction intersecting the direction of the supply path of the modeling material M between the material nozzle 412 and the supply area MA. As the shielding member 462 moves, the state of the shielding member 462 can be switched between a non-shielding state (see FIG. 9(a)) in which the shielding member 462 does not shield the supply path of the modeling material M, and a shielding state (see FIG. 9(b)) in which the shielding member 462 shields the supply path of the modeling material M. When the shielding member 462 is in the non-shielding state, as shown in FIG. 9(a), the modeling material M supplied from the material nozzle 412 reaches the supply area MA without being blocked by the shielding member 462. On the other hand, when the shielding member 462 is in the shielding state, as shown in FIG. 9(b), at least a part of the modeling material M supplied from the material nozzle 412 is blocked by the shielding member 462 before reaching the supply area MA. In other words, at least a part of the modeling material M supplied from the material nozzle 412 does not reach the supply area MA. As a result, when the shielding member 462 is in the shielding state, the supply amount of the modeling material M per unit time to the supply area MA is smaller than when the shielding member 462 is in the non-shielding state. In other words, when the shielding member 462 is in the shielding state, the supply rate is smaller than when the shielding member 462 is in the non-shielding state. For this reason, the control device 7 can control the supply rate of the modeling material M by controlling the shielding member 462. The state of the shielding member 462 may be a semi-shielding state in which the shielding member 462 blocks a part of the supply path of the modeling material M. The state of the shielding member 462 may be controlled so that the modeling material M is intermittently supplied to one supply area MA. In this case, the ratio (duty ratio) between the non-shielding state and the shielding state may be controlled to control the supply amount of the modeling material M per unit time to the one supply area MA. In this case, the time of each of the non-shielding state and the shielding state may be shorter than the unit time.

[0078] In addition, it can be said that both the gas ejection device 461 and the shielding member 462 are supply amount change devices for suppressing at least a part of the modeling material M supplied from the material nozzle 412 from reaching the supply area MA. For this reason, when the modeling apparatus 4 is equipped with an arbitrary supply amount change device other than the gas ejection device 461 and the shielding member 462, the control device 7 may control the arbitrary supply amount change device in order to control the supply rate of the modeling material M. In addition, the arbitrary supply amount change device may be provided in at least one of the material supply device 3 and the supply path from the material supply device 3 to the supply outlet 414 of the material nozzle 412. As such a supply amount change device, for example, a valve capable of changing the passing flow rate may be used. In addition, such a valve capable of changing the passing flow rate may be provided in at least one of the material supply device 3 and the supply path. As such a valve, for example, a butterfly valve, a gate valve, a globe valve, a ball valve, etc. may be used.

[0079] In order to control the supply rate, the control device 7 may control the supply direction (i.e., the injection direction) of the modeling material M from the material nozzle 412. Specifically, as shown in FIG. 10(a) and FIG. 10(b), the control device 7 may control the supply direction of the modeling material M from the material nozzle 412 by controlling the orientation of the material nozzle 412 with respect to the modeling surface CS. The orientation of the material nozzle 412 can be controlled by moving the material nozzle 412 using the drive system 42. However, in this case, the drive system 42 moves the irradiation optical system 411 and the material nozzle 412 separately. With the control of the orientation of the material nozzle 412, the state of the material nozzle 412 can be switched between a supply state (see FIG. 10(a)) in which the modeling material M can be supplied toward the supply area MA (i.e., the irradiation area EA or the molten pool MP) and a non-supply state (see FIG. 10(b)) in which the modeling material M cannot be supplied toward the supply area MA (i.e., the irradiation area EA or the molten pool MP). When the material nozzle 412 is in a supply state, as shown in FIG. 10(a), the modeling material M supplied from the material nozzle 412 reaches the supply area MA. On the other hand, when the material nozzle 412 is in a non-supply state, as shown in FIG. 10(b), the modeling material M supplied from the material nozzle 412 does not reach the supply area MA. Therefore, the longer the period during which the material nozzle 412 is in a non-supply state, the smaller the amount of modeling material M supplied per unit time to the supply area MA becomes. In other words, the longer the period during which the material nozzle 412 is in a non-supply state, the smaller the supply rate of the modeling material M becomes. For this reason, the control device 7 can control the supply rate of the modeling material M by controlling the supply direction of the modeling material M. The state of the material nozzle 412 may be a half-supply state in which the modeling material M can be supplied toward a part of the supply area MA (i.e., the irradiation area EA or the molten pool MP). In this case, the supply rate of the modeling material M may be controlled by changing the area of ​​the part to which the modeling material is supplied from the material nozzle 412.

[0080] (3-1-2) First variation suppression operation to control heat transfer rate Next, the first variation suppression operation for controlling the heat transfer rate will be described with reference to Fig. 11(a) to Fig. 11(c). For the sake of simplicity, each of Fig. 11(a) to Fig. 11(c) shows a method for controlling the supply rate of the modeling material M when the irradiation area EA is set twice in the area WA1 during the layer formation period.

[0081] 11(a) to 11(c) are graphs in which the horizontal axis indicates time and the vertical axis indicates the heat transfer rate. Since the irradiation area EA moves on the printing surface CS with the passage of time, the horizontal axes of Fig. 11(a) to 11(c) correspond to the position where the irradiation area EA is set on the printing surface CS, similar to the horizontal axes of Fig. 6(a) to 6(c) described above.

[0082] As shown in FIG. 11(a), the control device 7 may control the heat transfer rate so that (i) the heat transfer rate for the area WA1 during the period when the irradiation area EA is set for the first time in the area WA1 is the same as the heat transfer rate for the area WA2, and (ii) the heat transfer rate for the area WA1 during the period when the irradiation area EA is set for the second time in the area WA1 is zero. In other words, the control device 7 may control the heat transfer rate so that (i) the heat transfer rate for the area WA1 where the irradiation area EA is set for the first time is the same as the heat transfer rate for the area WA2, and (ii) the heat transfer rate for the area WA1 where the irradiation area EA is set again is zero. Note that the state where the heat transfer rate is zero is equivalent to the state where the light EL is not irradiated. Therefore, it can be said that the control device 7 controls the modeling device 4 so that (i) the area WA1 where the irradiation area EA is set for the first time is irradiated with the light EL in the same way as the area WA2, and (ii) the area WA1 where the irradiation area EA is set again is not irradiated with the light EL. The control device 7 may control the heat transfer rate so that the heat transfer rate for the area WA1 where the irradiation area is set the second time is lower than the heat transfer rate for the area WA1 where the irradiation area is set the first time. The control device 7 may also control the intensity or energy amount per unit time of the light EL for the area WA1 where the irradiation area is set the second time to be lower than the intensity or energy amount per unit time of the light EL for the area WA1 where the irradiation area is set the first time.

[0083] Alternatively, the control device 7 may control the heat transfer rate so that (i) the heat transfer rate for the region WA1 during the period when the irradiation region EA is set in the region WA1 for the second time is the same as the heat transfer rate for the region WA2, and (ii) the heat transfer rate for the region WA1 during the period when the irradiation region EA is set in the region WA1 for the first time is zero. That is, the control device 7 may control the heat transfer rate so that (i) the heat transfer rate for the region WA1 where the irradiation region EA is set at a certain timing is the same as the heat transfer rate for the region WA2, and (ii) the heat transfer rate for the region WA1 where the irradiation region EA is set at other timing is zero. Similarly, when the irradiation region EA is set in the region WA1 two or more times during the layer formation period, the control device 7 may control the heat transfer rate so that (i) the heat transfer rate for the region WA1 where the irradiation region EA is set at a certain timing is the same as the heat transfer rate for the region WA2, and (ii) the heat transfer rate for the region WA1 where the irradiation region EA is set at other timing is zero. The control device 7 may control the heat transfer rate so that the heat transfer rate for the area WA1 where the irradiation area is set the first time is lower than the heat transfer rate for the area WA1 where the irradiation area is set the second time. The control device 7 may also control the intensity or energy amount per unit time of the light EL for the area WA1 where the irradiation area is set the first time is lower than the intensity or energy amount per unit time of the light EL for the area WA1 where the irradiation area is set the second time. The control device 7 may also control the heat transfer rate so that the heat transfer rate for the area WA1 where the irradiation area EA is set at a certain timing is the same as the heat transfer rate for the area WA2, and the heat transfer rate for the area WA1 where the irradiation area EA is set at other timings is lower than the heat transfer rate for the area WA2.

[0084] As a result of controlling the heat transfer rate in this way, the total amount of heat transferred from the light EL to the region WA1 during the layer formation period is the same as the total amount of heat transferred from the light EL to the region WA2 during the layer formation period. More specifically, the total amount of heat transferred from the light EL to the region WA1 of a certain size during the layer formation period is the same as the total amount of heat transferred from the light EL to the region WA2 of the same size during the layer formation period. In other words, the value obtained by dividing the total amount of heat transferred from the light EL to the region WA1 during the layer formation period by the area of ​​the region WA1 (i.e., the amount of heat transferred from the light EL per unit area) is the same as the value obtained by dividing the total amount of heat transferred from the light EL to the region WA2 during the layer formation period by the area of ​​the region WA2. Therefore, the same amount of modeling material M per unit area is supplied, melted, and resolidified in the regions WA1 and WA2. This is because, as the amount of heat transferred from the light EL increases, the amount of the modeling material M that may be melted increases. Since the total amount of heat transferred from the light EL to the area WA1 is the same as the total amount of heat transferred from the light EL to the area WA2, the melting amount of the modeling material M in the area WA1 (specifically, the melting amount per unit area, the same applies below) is relatively likely to be the same as the melting amount of the modeling material M in the area WA2. As a result, as in the case where the supply rate is controlled as described above, the variation between the height h1 of the modeled object S1 formed in the area WA1 and the height h2 of the modeled object S2 formed in the area WA2 is suppressed. As a result, the formation accuracy of the three-dimensional structure ST, which is an assembly of modeled objects, is improved. If the relationship between the heat transfer rate and the heights h1 and h2 of the modeled objects is nonlinear, the heat transfer rate may be controlled taking this nonlinear relationship into consideration.

[0085] Furthermore, when the heat transfer rate is controlled, a molten pool MP of the same size as that of the area WA2 is formed in the area WA1. This is because, although the greater the amount of heat transferred from the light EL, the larger the molten pool MP that may be formed, the greater the possibility that the size of the molten pool MP formed in the area WA1 will be the same as that of the area WA2 because the total amount of heat transferred from the light EL to the area WA1 is the same as the total amount of heat transferred from the light EL to the area WA2. As a result, as in the case where the supply rate is controlled as described above, the variation between the height h1 of the model S1 formed in the area WA1 and the height h2 of the model S2 formed in the area WA2 is suppressed. This is because, as the molten pool MP becomes larger, the width (size in the direction along the modeling surface CS) of the modeling material M that is melted and then resolidified in the molten pool MP may become larger. For this reason, if the same amount of the modeling material M is supplied to the relatively large molten pool MP and the relatively small molten pool MP, a relatively low model may be formed in the portion where the relatively large molten pool MP is formed due to its relatively large width, while a relatively high model may be formed in the portion where the relatively small molten pool MP is formed due to its relatively small width. However, in this embodiment, the size of the molten pool MP formed in the region WA1 is the same as the size of the molten pool MP formed in the region WA2, so that the variation between the height h1 of the model S1 formed in the region WA1 and the height h2 of the model S2 formed in the region WA2 is suppressed. As a result, the formation accuracy of the three-dimensional structure ST, which is an assembly of models, is improved.

[0086] Alternatively, as shown in Fig. 11(b) and Fig. 11(c), the control device 7 may control the heat transfer rate so that the light EL is irradiated to the area WA1 every time the irradiation area EA is set in the area WA1 (i.e., the heat transfer rate for the area WA1 does not become zero). In this case, the control device 7 controls the supply rate of the modeling material M so that both the heat transfer rate for the area WA1 during the period when the irradiation area EA is set in the area WA1 for the first time and the heat transfer rate for the area WA1 during the period when the irradiation area EA is set in the area WA1 for the second time are smaller than the heat transfer rate for the area WA2. Note that the control device 7 may control the heat transfer rate so that the heat transfer rate for the area WA1 during the period when the irradiation area EA is set in the area WA1 for the first time is different from the heat transfer rate for the area WA1 during the period when the irradiation area EA is set in the area WA1 for the second time, as shown in Fig. 11(b). Alternatively, the control device 7 may control the heat transfer rate so that the heat transfer rate for the region WA1 during the period when the irradiation region EA is set in the region WA1 for the first time is the same as the heat transfer rate for the region WA1 during the period when the irradiation region EA is set in the region WA1 for the second time, as shown in FIG. 11(c). When the heat transfer rate is controlled as shown in FIG. 11(b) or FIG. 11(c), the difference between the total amount of heat transferred to the region WA1 during the layer formation period and the total amount of heat transferred to the region WA2 during the layer formation period is smaller than when the heat transfer rate for the region WA1 and the heat transfer rate for the region WA2 are always the same. As a result, the variation between the height h1 of the object S1 formed in the region WA1 and the height h2 of the object S2 formed in the region WA2 is suppressed. When the relationship between the heat transfer rate and the heights h1 and h2 of the objects is nonlinear, the heat transfer rate may be controlled taking this nonlinear relationship into consideration.

[0087] When the control device 7 controls the heat transfer rate so that the light EL is irradiated to the region WA1 every time the irradiation region EA is set in the region WA1, the control device 7 may control the heat transfer rate for the region WA1 during the period when the irradiation region EA is set for the first time in the region WA1 and the heat transfer rate for the region WA1 during the period when the irradiation region EA is set for the second time in the region WA1 so that the total amount of heat transferred to the region WA1 during the layer formation period is equal to the total amount of heat transferred to the region WA2 during the layer formation period. As a result, the total amount of heat transferred to the region WA1 during the layer formation period is equal to the total amount of heat transferred to the region WA2 during the layer formation period, as in the case where the heat transfer rate is controlled as shown in FIG. 11(a). As a result, the variation between the height h1 of the object S1 formed in the region WA1 and the height h2 of the object S2 formed in the region WA2 is more appropriately suppressed.

[0088] In addition, even when the irradiation area EA is set in the area WA1 two or more times during the layer formation period, the control device 7 may control the heat transfer rate so that the heat transfer rate for the area WA1 during each period in which the irradiation area EA is set in the area WA1 is smaller than the heat transfer rate for the area WA2. Furthermore, the control device 7 may control the heat transfer rate for the area WA1 during each period in which the irradiation area EA is set in the area WA1 so that the total amount of heat transferred to the area WA1 during the layer formation period is the same as the total amount of heat transferred to the area WA2 during the layer formation period.

[0089] Next, a specific method for controlling the heat transfer rate will be described with reference to FIGS.

[0090] The control device 7 may control the intensity or energy amount per unit area of ​​the light EL on the irradiation area EA in order to control the heat transfer rate. Specifically, as shown in Fig. 12, the greater the intensity or energy amount per unit area of ​​the light EL on the irradiation area EA, the greater the heat transfer rate. Therefore, the control device 7 can control the heat transfer rate by controlling the intensity or energy amount per unit area of ​​the light EL on the irradiation area EA.

[0091] In order to control the intensity per unit area of ​​the light EL on the irradiation area EA, the control device 7 may control the light source 5. For example, the control device 7 may control the intensity of the light EL emitted by the light source 5. When the light EL is pulsed light, the longer the emission time of the pulsed light (in other words, the shorter the extinction time of the pulsed light), the higher the intensity per unit area of ​​the light EL on the irradiation area EA. For this reason, when the light EL is pulsed light, the control device 7 may control, for example, the duty ratio of the light EL emitted by the light source 5.

[0092] In order to control the intensity or amount of energy per unit area of ​​the light EL on the irradiation area EA, the control device 7 may control the irradiation optical system 411. For example, the control device 7 may control the intensity or amount of energy of the light EL emitted by the irradiation optical system 411. In this case, the irradiation optical system 411 may include an optical member for adjusting the intensity or amount of energy of the light EL within the irradiation optical system 411.

[0093] In order to control the intensity or energy amount per unit area of ​​the light EL on the irradiation area EA, the control device 7 may control a light blocking member 471 arranged in the modeling device 4 so as to be insertable into and detachable from the optical path of the light EL between the irradiation optical system 411 and the irradiation area EA, as shown in Fig. 13(a) and Fig. 13(b). Specifically, the light blocking member 471 is movable with respect to the optical path of the light EL by a drive system (e.g., an actuator, etc.) not shown. With the movement of the light blocking member 471, the state of the light blocking member 471 can be switched between a light blocking state (see Fig. 13(a)) in which the light path of the light EL is blocked and a non-light blocking state (see Fig. 13(b)) in which the light path of the light EL is not blocked. When the light blocking member 471 is in the light blocking state, the light EL emitted from the irradiation optical system 411 is blocked by the light blocking member 471, as shown in Fig. 13(a). When the light blocking member 471 is formed of a material that the light EL cannot transmit, the light EL does not reach the irradiation area EA. When the light shielding member 471 is formed from a material through which a part of the light EL can pass, a part of the light EL does not reach the irradiation area EA. That is, the light EL whose intensity is attenuated by the light shielding member 471 is irradiated to the irradiation area EA. On the other hand, when the light shielding member 471 is in a non-light shielding state, as shown in FIG. 13(b), the light EL emitted from the irradiation optical system 411 reaches the irradiation area EA without being shielded by the light shielding member 471. As a result, when the light shielding member 471 is in a light shielding state, the intensity per unit area of ​​the light EL on the irradiation area EA becomes smaller compared to when the light shielding member 471 is in a non-light shielding state. The light shielding member 471 may be controlled by the control device 7 to be in a semi-light shielding state in which a part of the light EL emitted from the irradiation optical system 411 is shielded. The control device 7 may control the ratio between the period during which the light shielding member 471 is in a light shielding state and the period during which the light shielding member 471 is in a non-light shielding state. The longer the period during which the light blocking member 471 is in the light blocking state (in other words, the shorter the period during which the light blocking member 471 is in the light non-blocking state), the smaller the intensity per unit area of ​​the light EL on the irradiation area EA. The light blocking member 471 may be provided inside the irradiation optical system 411, or may be provided on the optical path between the light source 5 and the irradiation optical system 411.

[0094] The control device 7 may control the focus position of the light EL (in other words, the defocus amount) in order to control the heat transfer rate. Specifically, the farther the focus position is from the printing surface CS (i.e., the greater the defocus amount), the smaller the intensity or energy amount of the light EL per unit area on the irradiation area EA set on the printing surface CS becomes. Therefore, the farther the focus position is from the printing surface CS (i.e., the greater the defocus amount), the smaller the heat transfer rate becomes. For this reason, the control device 7 can control the heat transfer rate by controlling the focus position. In order to control the focus position, the control device 7 may control the condensing optical element 472 provided in the irradiation optical system 411, as shown in FIG. 14(a) and FIG. 14(b). Note that FIG. 14(a) shows a state in which the intensity or energy amount of the light EL per unit area on the irradiation area EA is relatively large because the focus position is set on the printing surface CS. On the other hand, FIG. 14(b) shows a state in which the intensity or energy amount per unit area of ​​the light EL on the irradiation area EA is relatively small because the focus position is set at a position away from the printing surface CS. Alternatively, in order to control the focus position, the control device 7 may control the drive system 42. Specifically, the control device 7 may control the relative position between the printing surface CS and the focus position by moving the printing head 41 (particularly, the irradiation optical system 411) along the Z axis relative to the printing surface CS. As will be described later, in the case where the printing device 4 includes a drive system for moving the stage 43, the control device 7 may control the relative position between the printing surface CS and the focus position by moving the stage 43 (i.e., the printing surface CS) along the Z axis relative to the printing head 41. Note that the relative position between the printing surface CS and the focus position may be controlled by moving a part of the optical members constituting the irradiation optical system 411.

[0095] The control device 7 may control the intensity distribution or energy amount distribution of the light EL in the irradiation area EA in order to control the heat transfer rate. The above-mentioned control of the intensity or energy amount per unit area of ​​the light EL in the irradiation area EA and the control of the focus position are specific examples of the control of the intensity distribution of the light EL in the irradiation area EA. In order to control the intensity distribution of the light EL in the irradiation area EA, the control device 7 may control an optical member for adjusting the intensity distribution provided in the irradiation optical system 411. As the optical member for adjusting the intensity distribution, at least one of a filter having a required concentration distribution in a plane intersecting the optical path of the light EL, an aspheric optical member (for example, a refractive optical member or a reflective optical member) having a required surface shape in a plane intersecting the optical path of the light EL, a diffractive optical element, a spatial light modulator, and the like can be used.

[0096] The control device 7 may control at least one of the size, shape, and position of the irradiation area EA on the printing surface CS in order to control the heat transfer rate. When at least one of the size, shape, and position of the irradiation area EA on the printing surface CS changes, the intensity distribution or energy distribution of the light EL on the printing surface CS changes. Therefore, the control device 7 can control the heat transfer rate by controlling at least one of the size, shape, and position of the irradiation area EA on the printing surface CS.

[0097] The control device 7 may control any characteristic of the light EL that is correlated with the intensity of the light EL in order to control the heat transfer rate. The control device 7 may control any characteristic of the light EL that is correlated with the heat transfer rate in order to control the heat transfer rate. An example of such an arbitrary characteristic of the light EL is at least one of the size, shape, and position of the irradiation area EA on the printing surface CS. This is because when at least one of the size, shape, and position of the irradiation area EA on the printing surface CS changes, the intensity distribution of the light EL on the printing surface CS changes. Another example of the arbitrary characteristic may be the wavelength of the light EL toward the printing surface CS. When the wavelength of the light EL is different, the light absorption rate in the printing material M changes, so that the heat transfer rate, which is the amount of heat transferred from the light EL to the printing surface CS per unit time, changes. As described above, in the second and subsequent printing processes, it is possible that a molten pool is formed in the model of the printing material M. In that case, the light EL absorption rate of the printing surface CS and the printing material M may differ. For example, when the material forming the printing surface CS is different from the printing material M, the absorptance of the light EL may be different between the printing surface CS and the printing material M. In such a case, the heat transfer rate may be controlled by taking into consideration the absorptance of the light EL of the portion irradiated with the light EL.

[0098] (3-1-3) First variation suppression operation for controlling the moving speed of the irradiation area EA Next, the first variation suppression operation for controlling the moving speed of the irradiation area EA will be described with reference to Fig. 15(a) and Fig. 15(b). For the sake of simplicity, Fig. 15(a) and Fig. 15(b) each show a method for controlling the moving speed of the irradiation area EA when the irradiation area EA is set twice in the area WA1 during the layer formation period.

[0099] 15(a) and 15(b) are graphs in which the horizontal axis indicates time and the vertical axis indicates the moving speed of the irradiation area EA. Since the irradiation area EA moves on the printing surface CS with the passage of time, the horizontal axes of Fig. 15(a) and Fig. 15(b) correspond to the position where the irradiation area EA is set on the printing surface CS, similar to the horizontal axes of Fig. 6(a) to Fig. 6(c) described above.

[0100] As shown in Fig. 15(a) to Fig. 15(b), the control device 7 controls the moving speed of the irradiation area EA so that both the moving speed of the irradiation area EA during the period when the irradiation area EA is set in the area WA1 for the first time and the moving speed of the irradiation area EA during the period when the irradiation area EA is set in the area WA1 for the second time are faster than the moving speed of the irradiation area EA during the period when the irradiation area EA is set in the area WA2. Note that, as shown in Fig. 15(a), the control device 7 may control the moving speed of the irradiation area EA so that the moving speed of the irradiation area EA during the period when the irradiation area EA is set in the area WA1 for the first time is different from the moving speed of the irradiation area EA during the period when the irradiation area EA is set in the area WA1 for the second time. Alternatively, as shown in Fig. 15(b), the control device 7 may control the moving speed of the irradiation area EA so that the moving speed of the irradiation area EA during the period when the irradiation area EA is set in the area WA1 for the first time is the same as the moving speed of the irradiation area EA during the period when the irradiation area EA is set in the area WA1 for the second time.

[0101] Here, the faster the moving speed of the irradiation area EA, the shorter the time that the irradiation area EA is set in a certain area on the printing surface CS. The shorter the time that the irradiation area EA is set in a certain area on the printing surface CS, the less the amount of heat transferred from the light EL to that area. The less the amount of heat transferred from the light EL to a certain area on the printing surface CS, the less the amount of melted modeling material M in that area. Furthermore, the faster the moving speed of the irradiation area EA, the faster the moving speed of the supply area MA, which is set at the same position as the irradiation area EA. The faster the moving speed of the supply area MA, the shorter the time that the supply area MA is set in a certain area on the printing surface CS. The shorter the time that the supply area MA is set in a certain area on the printing surface CS, the less the amount of modeling material light EL supplied to that area. The less the amount of modeling material EL supplied to a certain area on the printing surface CS, the less the amount of melted modeling material M in that area. Therefore, when the moving speed of the irradiation area EA is controlled as shown in FIG. 15(a) or 15(b), the difference between the total amount of the molten modeling material M in the area WA1 during the layer formation period and the total amount of the molten modeling material M in the area WA2 during the layer formation period becomes smaller than when the moving speed of the irradiation area EA is always constant. More specifically, the difference between the total amount of the molten modeling material M in the area WA1 of a certain size during the layer formation period and the total amount of the molten modeling material M in the area WA2 of the same size during the layer formation period becomes smaller. In other words, the difference between the value obtained by dividing the total amount of the molten modeling material M in the area WA1 during the layer formation period by the area of ​​the area WA1 (i.e., the melted amount of the molten modeling material M per unit area) and the value obtained by dividing the total amount of the molten modeling material M in the area WA2 during the layer formation period by the area of ​​the area WA2 becomes smaller. As a result, the variation between the height h1 of the modeled object S1 formed in the area WA1 and the height h2 of the modeled object S2 formed in the area WA2 is suppressed.

[0102] The control device 7 may control the moving speed of the irradiation area EA so that the total amount of the modeling material M melted in the area WA1 during the layer formation period is equal to the total amount of the modeling material M melted in the area WA2 during the layer formation period. For example, when a series of modeling processes are performed N times due to the irradiation area EA being set N times (where N is an integer equal to or greater than 2) in the area WA1, the control device 7 may control the moving speed of the irradiation area EA so that the moving speed of the irradiation area EA during each period in which the irradiation area EA is set in the area WA1 is N times the moving speed of the irradiation area EA during the period in which the irradiation area EA is set in the area WA2. Alternatively, for example, when a series of modeling processes are performed N times due to the irradiation area EA being set N times in the area WA1, the control device 7 may control the moving speed of the irradiation area EA so that the average moving speed of the irradiation area EA during each period in which the irradiation area EA is set in the area WA1 is equal to the moving speed of the irradiation area EA during the period in which the irradiation area EA is set in the area WA2. As a result, the variation between the height h1 of the object S1 formed in the area WA1 and the height h2 of the object S2 formed in the area WA2 is more appropriately suppressed. When the relationship between the moving speed of the irradiation area EA and the heights h1 and h2 of the objects is nonlinear, the moving speed can be controlled taking this nonlinear relationship into consideration.

[0103] The control device 7 may control the drive system 42 to control the moving speed of the irradiation area EA. That is, the control device 7 may control the moving speed of the projection head 41 (particularly, the moving speed in the direction along the XY plane) to control the relative moving speed of the irradiation area EA with respect to the printing surface CS. As described later, in the case where the printing device 4 includes a drive system for moving the stage 43, the control device 7 may control the moving speed of the projection area EA with respect to the printing surface CS by controlling the moving speed of the stage 43 (particularly, the moving speed in the direction along the XY plane). As described later, in the case where the irradiation optical system 411 includes an optical member (e.g., a galvano scanner, etc.) capable of deflecting the light EL, the control device 7 may control the moving speed of the projection area EA with respect to the printing surface CS by controlling the optical member capable of deflecting the light EL.

[0104] (3-2) Second variation suppression operation Next, the second variation suppression operation will be described. The second variation suppression operation corresponds to an operation for suppressing variation in the height of a molded object, etc., when an area with different characteristics (hereinafter referred to as "thermal characteristics") for heat transmitted from the light EL exists on the printing surface CS. In particular, the second variation suppression operation corresponds to an operation for suppressing variation in the height of a molded object when an area with different thermal characteristics exists on the printing surface CS due to differences in the relative moving speed of the irradiation area EA (i.e., the supply area MA or the molten pool MP) with respect to the printing surface CS.

[0105] Specifically, as shown in FIG. 16(a), during the layer formation period in which one structure layer SL on the printing surface CS is formed, the irradiation area EA moves on the printing surface CS along a movement trajectory corresponding to the pattern of the structure layer SL on the printing surface CS, as described above. Here, the irradiation area EA does not always move at a constant moving speed along the movement trajectory. In other words, the moving speed of the irradiation area EA may change during the layer formation period. For example, as shown in FIG. 16(a), the moving direction of the irradiation area EA may change at a certain point P3 on the printing surface CS. In this case, as shown in FIG. 16(b), the moving speed of the irradiation area EA, which was constant at the beginning, gradually decreases as the irradiation area EA approaches the point P3. After that, the moving speed of the irradiation area EA becomes minimum (for example, becomes zero) when the irradiation area EA reaches the point P3. After that, the moving speed of the irradiation area EA gradually increases as the irradiation area EA moves away from the point P3. After that, after the moving speed of the irradiation area EA increases to a certain extent, the irradiation area EA moves at a constant moving speed.

[0106] When the moving speed of the irradiation area EA changes in this way, the time during which the irradiation area EA is set in a certain area on the printing surface CS also changes. When the time during which the irradiation area EA is set in a certain area on the printing surface CS changes, the amount of heat transferred from the light EL to that area also changes. For this reason, when the moving speed of the irradiation area EA changes, an area with different thermal characteristics regarding the amount of heat transferred from the light EL will exist on the printing surface CS. More specifically, the slower the moving speed of the irradiation area EA, the longer the time during which the irradiation area EA is set in a certain area on the printing surface CS. The longer the time during which the irradiation area EA is set in a certain area on the printing surface CS, the greater the amount of heat transferred from the light EL to that area.

[0107] When the amount of heat transferred from the light EL to a certain area on the printing surface CS changes, the amount of melted modeling material M in that area may change. When the amount of melted modeling material M in a certain area on the printing surface CS changes, the height (or any characteristic such as size) of the modeled object formed from the melted modeling material M in that area may also change. More specifically, the greater the amount of heat transferred from the light EL to a certain area on the printing surface CS, the greater the amount of melted modeling material M in that area. The greater the amount of melted modeling material M in a certain area on the printing surface CS, the higher the modeled object formed from the melted modeling material M in that area may become. For this reason, if a series of printing processes is performed without considering changes in the moving speed of the irradiation area EA under a situation in which a modeled object of a certain height should be formed on the printing surface CS, there is a possibility that a modeled object of different heights will be formed depending on the moving speed of the irradiation area EA, as shown in the lower part of FIG. 16(b). More specifically, the slower the moving speed of the irradiation area EA moving in a certain area on the printing surface CS, the higher the object formed in that area may become.

[0108] As an example, when the moving speed of the irradiation area EA changes, it can be said that there are an area WA3 where the irradiation area EA moves at a first moving speed and an area WA4 where the irradiation area EA moves at a second moving speed slower than the first moving speed on the printing surface CS, as shown in Fig. 16(a) and Fig. 16(b). In this case, if a series of printing processes are performed without distinguishing between the areas WA3 and WA4 under a situation where objects of the same height should be formed in the areas WA3 and WA4, the height of the object formed in the area WA3 may not match the height of the object formed in the area WA4, as shown in the lower part of Fig. 16(b). Typically, as shown in Fig. 16(b), the height of the object formed in the area WA3 may be higher than the height of the object formed in the area WA4 by the amount of heat transferred from the light EL being larger.

[0109] Therefore, in this embodiment, the control device 7 (in other words, the modeling system 1 under the control of the control device 7) performs a second variation suppression operation to suppress variation in height of the object formed in the area with different thermal characteristics due to difference in the moving speed of the irradiation area EA. For example, the control device 7 performs the second variation suppression operation to suppress variation between the height of the object formed in the area WA3 and the height of the object formed in the area WA4.

[0110] The control device 7 may perform a second variation suppression operation to suppress the variation in height of the modeled object by controlling the supply rate of the modeling material M. Specifically, as shown in FIG. 17, the control device 7 may control the supply rate so that the supply rate decreases as the moving speed of the irradiation area EA decreases. In other words, the control device 7 may control the supply rate so that the supply rate to a certain area on the modeling surface CS decreases as the moving speed of the irradiation area EA moving through that area decreases. As a result, in a situation where the modeled object formed in the area where the irradiation area EA moves at a relatively slow moving speed becomes relatively high, the supply amount of the modeling material M to that area decreases. When the supply amount of the modeling material M decreases, the melting amount of the modeling material M also decreases. Therefore, the modeled object formed in the area where the irradiation area EA moves at a relatively slow moving speed is suppressed from becoming relatively high. As a result, the variation in height of the modeled object formed in the area with different thermal properties due to the difference in the moving speed of the irradiation area EA is suppressed. When the relationship between the moving speed and the height of the model is nonlinear, the supply rate can be controlled taking this nonlinear relationship into consideration.

[0111] As an example, when the moving speed of the irradiation area EA changes as shown in the first graph of FIG. 18 (the same as the upper graph of FIG. 16(b)), the control device 7 may control the supply rate so that the supply rate changes as shown in the second graph of FIG. 18. That is, the control device 7 may control the supply rate so that the supply rate for the area WA3 where the irradiation area EA moves at a relatively fast first moving speed is higher than the supply rate for the area WA4 where the irradiation area EA moves at a relatively slow second moving speed. As a result, as shown in the third graph of FIG. 18, a structure of a constant height can be formed in an area having different thermal characteristics due to a difference in the moving speed of the irradiation area EA. That is, the variation between the height of the object formed in the area WA3 and the height of the object formed in the area WA4 is suppressed. In FIG. 18, a supply rate that is kept constant regardless of the moving speed of the irradiation area EA and a structure formed in that case are shown by a dashed line as a comparative example.

[0112] In addition to or instead of controlling the supply rate, the control device 7 may perform a second variation suppression operation of suppressing variation in height of the model by controlling the heat transfer rate. Specifically, as shown in FIG. 19, the control device 7 may control the heat transfer rate so that the slower the moving speed of the irradiation area EA, the smaller the heat transfer rate becomes. In other words, the control device 7 may control the heat transfer rate so that the slower the moving speed of the irradiation area EA moving through a certain area on the modeling surface CS, the smaller the heat transfer rate becomes for that area. As a result, in a situation where the model formed in the area where the irradiation area EA moves at a relatively slow moving speed becomes relatively high, the amount of heat transferred from the light EL to that area becomes smaller. When the amount of transferred heat becomes smaller, the amount of melting of the modeling material M also becomes smaller. Therefore, the model formed in the area where the irradiation area EA moves at a relatively slow moving speed is suppressed from becoming relatively high. As a result, the variation in height of the model formed in the area with different thermal characteristics due to the difference in the moving speed of the irradiation area EA is suppressed. When the relationship between the moving speed and the height of the object is nonlinear, the heat transfer rate can be controlled taking this nonlinear relationship into consideration.

[0113] As an example, when the moving speed of the irradiation area EA changes as shown in the first graph of FIG. 20 (the same as the upper graph of FIG. 16(b)), the control device 7 may control the heat transfer rate so that the heat transfer rate changes as shown in the second graph of FIG. 20. That is, the control device 7 may control the heat transfer rate so that the heat transfer rate for the area WA3 where the irradiation area EA moves at a relatively fast first moving speed is higher than the heat transfer rate for the area WA4 where the irradiation area EA moves at a relatively slow second moving speed. As a result, as shown in the third graph of FIG. 20, a structure of a constant height can be formed in an area having different thermal characteristics due to a difference in the moving speed of the irradiation area EA. That is, the variation between the height of the object formed in the area WA3 and the height of the object formed in the area WA4 is suppressed. In FIG. 20, the heat transfer rate maintained constant regardless of the moving speed of the irradiation area EA and the object formed in that case are shown by a dashed line as a comparative example.

[0114] In addition, the specific method for controlling the supply rate and the heat transfer rate in the second variation suppression operation may be the same as the specific method for controlling the supply rate and the heat transfer rate in the first variation suppression operation described above, and therefore the description of the specific method for controlling the supply rate and the heat transfer rate will be omitted.

[0115] As described above, one of the causes of the variation in height of the object to be suppressed in the second variation suppression operation is a change in the relative moving speed of the irradiation area EA (i.e., the supply area MA) with respect to the printing surface CS. In this case, if the desired structure layer SL (and further, the three-dimensional structure ST) can be formed even if the moving speed of the irradiation area EA is controlled and changed from the original moving speed, the control device 7 may perform the second variation suppression operation to suppress the variation in height of the object by controlling the moving speed of the irradiation area EA. In this case, the cause of the variation in height of the object (i.e., the technical problem of the variation in height of the object) itself is eliminated by controlling the moving speed of the irradiation area EA. For this reason, the second variation suppression operation of controlling the moving speed of the irradiation area EA can be said to be an operation for eliminating the cause of the variation in height of the object. On the other hand, depending on the pattern of the movement trajectory of the irradiation area EA, it may be impossible to control the movement speed of the irradiation area EA and change it from the original movement speed. In this case, the control device 7 does not need to control the movement speed of the irradiation area EA in order to perform the second variation suppression operation for suppressing the variation in the height of the object. Note that, if the relationship between the movement speed and the height of the object is nonlinear, the movement speed may be controlled taking this nonlinear relationship into consideration.

[0116] (3-3) Third variation suppression operation Next, the third variation suppression operation will be described. The third variation suppression operation corresponds to an operation for suppressing the variation in the height of a model, etc., when an area with different thermal properties exists on the modeling surface CS, similar to the second variation suppression operation. However, the third variation suppression operation corresponds to an operation for suppressing the variation in the height of a model, when an area with different thermal properties exists on the modeling surface CS due to the difference in the degree of thermal diffusion in an existing structure (e.g., at least one of the workpiece W and the already formed structure layer SL) of which at least a part of the surface is set on the modeling surface CS.

[0117] Specifically, as described above, when a three-dimensional structure ST is formed, the light EL is irradiated onto the printing surface CS. Heat is transferred from the light EL to the printing surface CS. This heat is also transferred (essentially diffused) to the inside of the existing structure via the printing surface CS. Here, depending on the characteristics of the existing structure (e.g., at least one of the structure, material, and shape), the degree of heat diffusion (i.e., an index showing the ease or difficulty of diffusion) in the existing structure is not necessarily uniform. In other words, there is a possibility that there are areas on the printing surface CS with different thermal characteristics related to the degree of diffusion of heat transferred from the light EL. For example, there is a possibility that there are areas on the printing surface CS where the heat transferred from the light EL is relatively difficult to diffuse, and areas where the heat transferred from the light EL is relatively easy to diffuse.

[0118] For example, as shown in FIG. 21(a), the existing structure has a surface SF2 on which the printing surface CS is not set, in addition to a surface SF1 on which the printing surface CS is set. In this case, the degree of diffusion of heat transferred to a certain area on the printing surface CS can be estimated according to the degree of proximity between a certain area on the printing surface CS and the surface SF2. Specifically, as shown in FIG. 21(a), an area WA5 on the printing surface CS is closer to the surface SF2 than an area WA6 on the printing surface CS. Therefore, the diffusion path of the heat transferred to the area WA5 (i.e., the diffusion path inside the existing structure) is smaller or fewer than the diffusion path of the heat transferred to the area WA6. Therefore, the shorter the distance between a certain area on the printing surface CS and the surface SF2 on which the printing surface CS is not set, the more difficult it is for the heat transferred to the area to be diffused. Furthermore, in the example shown in Figure 21(a), it can also be said that there is an area WA5 on the printing surface CS where the heat transmitted from the light EL is relatively difficult to diffuse, and an area WA6 where the heat transmitted from the light EL is relatively easy to diffuse.

[0119] In the region WA5 where heat is relatively difficult to diffuse, heat accumulates for a relatively long time compared to the region WA6 where heat is relatively easy to diffuse. As a result, in the region WA5, the molding material M may melt more than in the region WA6 because heat accumulates for a relatively long time. For this reason, if a series of molding processes is performed without considering the difference in the degree of heat diffusion under a situation where a molded object of a certain height should be formed on the printing surface CS, molded objects of different heights may be formed according to the difference in the degree of heat diffusion. More specifically, the more difficult it is to diffuse heat transferred to a certain region on the printing surface CS, the higher the molded object formed in that region may be. For example, if a series of molding processes is performed without distinguishing between the region WA5 and the region WA6 under a situation where molded objects of the same height should be formed in the regions WA5 and WA6, the height h5 of the molded object S5 formed in the region WA5 may not match the height h6 of the molded object S6 formed in the region WA6, as shown in FIG. 21(b).

[0120] Therefore, in this embodiment, the control device 7 (in other words, the modeling system 1 under the control of the control device 7) performs a third variation suppression operation to suppress variation in height of the object formed in the area having different thermal characteristics due to the difference in the degree of thermal diffusion. For example, the control device 7 performs the third variation suppression operation to suppress variation between the height of the object formed in the area WA5 and the height of the object formed in the area WA6.

[0121] The control device 7 may perform a third variation suppression operation to suppress variation in height of the modeled object by controlling the supply rate of the modeling material M. Specifically, as shown in FIG. 22, the control device 7 may control the supply rate so that the supply rate decreases as the heat becomes more difficult to diffuse. In other words, the control device 7 may control the supply rate so that the supply rate to a certain area on the modeling surface CS becomes smaller as the heat transferred to the area becomes more difficult to diffuse. As a result, in a situation where the modeled object formed in the area where the heat is relatively difficult to diffuse becomes relatively tall, the supply amount of the modeling material M to the area becomes smaller. When the supply amount of the modeling material M decreases, the melting amount of the modeling material M also decreases. Therefore, the modeled object formed in the area where the heat is relatively difficult to diffuse is suppressed from becoming relatively tall. As a result, the variation in height of the modeled object formed in the area with different thermal characteristics due to the difference in the degree of heat diffusion is suppressed. If the relationship between the degree of heat diffusion and the height of the model is nonlinear, the supply rate may be controlled taking this nonlinear relationship into consideration.

[0122] In addition to or instead of controlling the supply rate, the control device 7 may perform a third variation suppression operation of suppressing variation in height of the modeled object by controlling the heat transfer rate. Specifically, as shown in FIG. 23, the control device 7 may control the heat transfer rate so that the heat transfer rate decreases as the heat becomes more difficult to diffuse. In other words, the control device 7 may control the heat transfer rate so that the heat transfer rate to a certain area on the modeling surface CS becomes smaller as the heat transferred to that area becomes more difficult to diffuse. As a result, in a situation where the modeled object formed in the area where heat is relatively difficult to diffuse becomes relatively tall, the amount of heat transferred to that area decreases. When the amount of transferred heat decreases, the amount of melting of the modeling material M also decreases. Therefore, the modeled object formed in the area where heat is relatively difficult to diffuse is prevented from becoming relatively tall. As a result, the variation in height of the modeled object formed in the area with different thermal characteristics due to the difference in the degree of heat diffusion is suppressed. When the relationship between the degree of thermal diffusion and the height of the model is nonlinear, the heat transfer rate can be controlled taking this nonlinear relationship into consideration.

[0123] In addition to or instead of controlling at least one of the supply rate and the heat transfer rate, the control device 7 may perform a third variation suppression operation to suppress variation in height of the model by controlling the relative moving speed of the irradiation area EA with respect to the printing surface CS. Specifically, as shown in FIG. 24, the control device 7 may control the moving speed of the irradiation area EA so that the more difficult it is for heat to diffuse, the faster the moving speed of the irradiation area EA becomes. In other words, the control device 7 may control the moving speed of the irradiation area EA so that the more difficult it is for heat transferred to a certain area on the printing surface CS to diffuse, the faster the moving speed of the irradiation area EA becomes when the irradiation area EA is set in that area. As already described above, the faster the moving speed of the irradiation area EA when the irradiation area EA is set in a certain area on the printing surface CS, the smaller the supply amount of the modeling material M to that area and the amount of heat transferred from the light EL to that area become. Therefore, when the movement speed of the irradiation area EA is controlled as shown in Fig. 24, in a situation where the object formed in an area where heat is relatively difficult to diffuse becomes relatively tall, the amount of the modeling material M supplied to that area and the amount of heat transferred to that area are reduced. This prevents the object formed in the area where heat is relatively difficult to diffuse from becoming relatively tall. As a result, the variation in height of the object formed in the area with different thermal properties due to the difference in the degree of heat diffusion is suppressed. Note that, when the relationship between the degree of heat diffusion and the height of the object is nonlinear, the movement measure can be controlled taking this nonlinear relationship into consideration.

[0124] In addition, the specific method for controlling the supply rate, the heat transfer rate, and the moving speed of the irradiation area EA in the third variation suppression operation may be the same as the specific method for controlling the supply rate, the heat transfer rate, and the moving speed of the irradiation area EA in the first variation suppression operation described above. Therefore, the description of the specific method for controlling the supply rate, the heat transfer rate, and the moving speed of the irradiation area EA will be omitted.

[0125] In the description of the third variation suppression operation, the thermal characteristic over time has been taken as an example of the thermal characteristic, but other characteristics related to heat may also be used.

[0126] (3-4) Fourth variation suppression operation Next, the fourth variation suppression operation will be described. The fourth variation suppression operation corresponds to an operation for suppressing the variation in the height of the model when an area with different thermal properties exists on the modeling surface CS, similar to the second variation suppression operation. However, the fourth variation suppression operation corresponds to an operation for suppressing the variation in the height of the model when an area with different thermal properties exists on the modeling surface CS due to the difference in the frequency of irradiation of the light EL.

[0127] Specifically, when each structural layer SL constituting the three-dimensional structure ST is formed, the irradiation area EA moves on the printing surface CS, and the light EL is irradiated at the timing when the irradiation area EA is set on the area on the printing surface CS where the object is to be formed, as described above. Here, depending on at least one of the pattern of the movement trajectory of the irradiation area EA and the pattern of the structural layer SL (i.e., the distribution pattern of the area on the printing surface CS where the object is to be formed), there may be areas on the printing surface CS where the light EL is irradiated with different frequencies. For example, as shown in FIG. 25(a), there may be an area WA7 on the printing surface CS where the light EL is irradiated relatively frequently and an area WA8 on the printing surface CS where the light EL is irradiated relatively infrequently.

[0128] The frequency with which a certain area on the printing surface CS is irradiated with light EL increases as the time between when a part of the certain area is irradiated with light EL and when another part of the certain area is irradiated with light EL decreases. The frequency with which a certain area on the printing surface CS is irradiated with light EL increases as the number of times the certain area is irradiated with light EL per unit time increases. The frequency with which a certain area on the printing surface CS is irradiated with light EL increases as the number of times the certain area is irradiated with light EL per unit area increases.

[0129] In the region WA7 where the light EL is irradiated relatively frequently, the region WA7 is more likely to be heated by the heat from the light newly irradiated to the region WA7 before the region WA7 heated by the heat transferred from the light EL is cooled, compared to the region WA8 where the light EL is irradiated relatively infrequently. In other words, in the region WA7 where the light EL is irradiated relatively frequently, the heat from the light EL is less likely to be dissipated than in the region WA8 where the light EL is irradiated relatively infrequently. In other words, in the region WA7 where the light EL is irradiated relatively frequently, the heat from the light EL is accumulated for a relatively long time compared to the region WA8 where the light EL is irradiated relatively infrequently. As a result, in the region WA7, there is a possibility that more of the modeling material M will melt than in the region WA8, since the heat is accumulated for a relatively long time. For this reason, if a series of modeling processes are performed without considering the difference in the frequency of irradiation of the light EL under a situation where a modeled object of a certain height should be formed on the modeling surface CS, there is a possibility that a modeled object of different heights will be formed depending on the difference in the frequency of irradiation of the light EL. More specifically, the higher the frequency with which a certain region on the printing surface CS is irradiated with the light EL, the higher the height of the object formed in that region. As an example, if a series of printing processes is performed without distinguishing between the regions WA7 and WA8 in a situation in which objects of the same height should be formed in the regions WA7 and WA8, the height h7 of the object S7 formed in the region WA7 may not match the height h8 of the object S8 formed in the region WA8, as shown in Fig. 25(b).

[0130] Therefore, in this embodiment, the control device 7 (in other words, the modeling system 1 under the control of the control device 7) performs a fourth variation suppression operation to suppress variation in the height of the object formed in the area with different thermal characteristics due to difference in the frequency of irradiation with the light EL. For example, the control device 7 performs the fourth variation suppression operation to suppress variation between the height of the object formed in the area WA7 and the height of the object formed in the area WA8.

[0131] The control device 7 may perform a fourth variation suppression operation of suppressing the variation in height of the modeled object by controlling the supply rate of the modeling material M. Specifically, as shown in FIG. 26, the control device 7 may control the supply rate so that the supply rate decreases as the frequency of irradiation of the light EL increases. In other words, the control device 7 may control the supply rate so that the supply rate to a certain area on the modeling surface CS decreases as the frequency of irradiation of the light EL increases. As a result, under a situation in which the modeled object formed in the area where the light EL is irradiated more frequently is relatively high, the supply amount of the modeling material M to the area decreases. When the supply amount of the modeling material M decreases, the melting amount of the modeling material M also decreases. Therefore, the modeled object formed in the area where the light EL is irradiated more frequently is suppressed from becoming relatively high. As a result, the variation in height of the modeled object formed in the area where the thermal characteristics are different due to the difference in the frequency of irradiation of the light EL is suppressed. When the relationship between the frequency at which the light EL is emitted and the height of the model is nonlinear, the supply rate may be controlled taking into consideration the nonlinear relationship.

[0132] In addition to or instead of controlling the supply rate, the control device 7 may perform a fourth variation suppression operation of suppressing variation in height of the modeled object by controlling the heat transfer rate. Specifically, as shown in FIG. 27, the control device 7 may control the heat transfer rate so that the heat transfer rate decreases as the frequency of irradiation of the light EL increases. In other words, the control device 7 may control the heat transfer rate so that the heat transfer rate for a certain area on the modeling surface CS decreases as the frequency of irradiation of the light EL increases. As a result, in a situation where the modeled object formed in the area where the light EL is irradiated more frequently is relatively high, the amount of heat transferred to the area decreases. When the amount of heat transferred decreases, the amount of melting of the modeling material M also decreases. Therefore, the modeled object formed in the area where the light EL is irradiated more frequently is suppressed from becoming relatively high. As a result, the variation in height of the modeled object formed in the area with different thermal characteristics due to the difference in the frequency of irradiation of the light EL is suppressed. When the relationship between the frequency of irradiation of the light EL and the height of the model is nonlinear, the heat transfer rate may be controlled taking into account the nonlinear relationship.

[0133] In addition to or instead of controlling at least one of the supply rate and the heat transfer rate, the control device 7 may perform a fourth variation suppression operation to suppress variation in height of the model by controlling the relative moving speed of the irradiation area EA with respect to the printing surface CS. Specifically, as shown in FIG. 28, the control device 7 may control the moving speed of the irradiation area EA so that the moving speed of the irradiation area EA becomes faster as the frequency of irradiation of the light EL increases. In other words, the control device 7 may control the moving speed of the irradiation area EA so that the moving speed of the irradiation area EA becomes faster when the irradiation area EA is set in a certain area on the printing surface CS as the frequency of irradiation of the light EL increases. As already described above, the faster the moving speed of the irradiation area EA when the irradiation area EA is set in a certain area on the printing surface CS, the smaller the supply amount of the modeling material M to the certain area and the amount of heat transferred from the light EL to the certain area become. Therefore, when the moving speed of the irradiation area EA is controlled as shown in Fig. 28, in a situation where the object formed in the area where the light EL is irradiated frequently is relatively high, the amount of the modeling material M supplied to the area and the amount of heat transferred to the area are reduced. Therefore, the object formed in the area where the light EL is irradiated frequently is prevented from becoming relatively high. As a result, the variation in height of the object formed in the area with different thermal properties due to the difference in the frequency of irradiation of the light EL is suppressed. Note that, when the relationship between the frequency of irradiation of the light EL and the height of the object is nonlinear, the moving speed may be controlled taking into account the nonlinear relationship.

[0134] In addition, the specific method for controlling the supply rate, the heat transfer rate, and the moving speed of the irradiation area EA in the fourth variation suppression operation may be the same as the specific method for controlling the supply rate, the heat transfer rate, and the moving speed of the irradiation area EA in the first variation suppression operation described above. Therefore, the description of the specific method for controlling the supply rate, the heat transfer rate, and the moving speed of the irradiation area EA will be omitted.

[0135] In the description of the fourth variation suppression operation, the thermal characteristic over time has been taken as an example of the thermal characteristic, but other characteristics related to heat may also be used.

[0136] (3-5) Modification of Variation Suppression Operation In the above description, the control device 7 controls at least one of the supply rate of the modeling material M, the heat transfer rate, and the moving speed of the irradiation area EA relative to the modeling surface CS in order to suppress the variation in the height (or any characteristic such as size) of the modeled object formed in different regions on the modeling surface CS. However, in other words, the control device 7 can control the characteristics of the modeled object (and further the structure layer SL and the three-dimensional structure ST) formed on the modeling surface CS by controlling at least one of the supply rate, the heat transfer rate, and the moving speed of the irradiation area EA relative to the modeling surface CS. For this reason, the control device 7 may control at least one of the supply rate, the heat transfer rate, and the moving speed of the irradiation area EA relative to the modeling surface CS so that the characteristics of the modeled object (and further the structure layer SL and the three-dimensional structure ST) formed on the modeling surface CS become desired characteristics. In other words, the control device 7 may control at least one of the supply rate, the heat transfer rate, and the moving speed of the irradiation area EA relative to the modeling surface CS for a purpose other than the purpose of suppressing the variation in characteristics. For example, the control device 7 may control at least one of the supply rate, the heat transfer rate, and the movement speed of the irradiation area EA relative to the printing surface CS in order to control the characteristics (e.g., at least one of the height and size) of the mark formed in the marking operation described below.

[0137] In the above description, as examples of the causes of the existence of multiple regions with different thermal properties on the printing surface CS, the difference in the relative moving speed of the irradiation area EA with respect to the printing surface CS, the difference in the degree of thermal diffusion in an existing structure whose surface is at least partially set on the printing surface CS, and the difference in the frequency of irradiation with the light EL are described. However, there is a possibility that the existence of a region with different thermal properties on the printing surface CS may be caused by other reasons. Even in this case, if a series of printing processes are performed without considering the difference in thermal properties under a situation where objects with the same properties should be formed in the regions with different thermal properties, objects with varying properties may be formed. For this reason, the control device 7 may perform a variation suppression operation to suppress the variation in the height of objects formed in the regions with different thermal properties due to other causes different from the above-mentioned causes. In addition, as an example of the existence of multiple regions with different thermal properties on the printing surface CS, there is a case where the type or density of the material differs from place to place on the printing surface CS.

[0138] (4) Marking operation Next, a marking operation for forming the mark SM on the printing surface CS using the above-mentioned printing operation will be described.

[0139] (4-1) Overview of marking operation The marking operation is an operation for forming objects distributed in a predetermined distribution pattern on the printing surface CS using the above-mentioned printing operation, and forming a mark SM consisting of an aggregate of the objects on the printing surface CS.

[0140] The mark SM may include a mark related to a symbol having a predetermined meaning on a plane along the printing surface CS. The symbol may include at least one of a symbol representing an arbitrary letter, a symbol representing an arbitrary number, a symbol representing an arbitrary figure, a symbol representing an arbitrary mark, and a symbol having some other meaning. For example, Fig. 29 shows an example in which a mark SM1 related to a symbol representing the alphabet N, a mark SM2 related to a symbol representing an exclamation mark, and a mark SM3 related to a symbol representing a circular figure are formed on the printing surface CS.

[0141] As shown in the lower part of FIG. 29, the mark SM is a structure protruding in a convex shape from the printing surface CS. The mark SM may be a structure including a single structural layer SL. That is, the mark SM may be composed of a single structural layer SL. In this case, the height of the mark SM (that is, the length from the printing surface CS to the upper surface (that is, the surface on the +Z side) of the mark SM, the same below) is the same as the height of the structural layer SL. Alternatively, the mark SM may be a structure including multiple stacked structural layers SL. That is, the mark SM may be composed of multiple stacked structural layers SL. In this case, the height of the mark SM is the same as the height of the multiple stacked structural layers SL. Therefore, the height of the mark SM typically increases as the number of structural layers SL constituting the mark SM increases.

[0142] However, the maximum height of the mark SM does not exceed the minimum size of the mark SM in the direction along the printing surface CS. In other words, the height of the tallest part of the mark SM does not exceed the size of the thinnest part of the mark SM. For example, in the example shown in FIG. 29, the maximum height hm1 of the mark SM1 does not exceed the minimum size wm1 of the mark SM1 in the direction along the printing surface CS. The maximum height hm2 of the mark SM2 does not exceed the minimum size wm2 of the mark SM2 in the direction along the printing surface CS. However, a mark SM whose maximum height exceeds the minimum size of the mark SM in the direction along the printing surface CS may be formed.

[0143] In order to form such a mark SM, the control device 7 first acquires coordinate data related to the mark SM to be formed on the printing surface CS. The coordinate data is data indicating the positions on the printing surface CS where the marks SM are distributed (i.e., the positions where the mark formation regions where the objects constituting the marks SM are to be formed are distributed). Since the printing surface CS is a plane, the coordinate data corresponds to data corresponding to (or associated with) the positions on a two-dimensional coordinate system where the marks SM are distributed. An example of such coordinate data is at least one of font data (e.g., bitmap font data, etc.) and image data (e.g., bitmap image data, etc.). The control device 7 may acquire the coordinate data from another device that provides the coordinate data. Alternatively, the control device 7 may generate the coordinate data by itself. In this case, the control device 7 first acquires symbol information indicating a symbol corresponding to the mark SM to be formed on the printing surface CS. For example, the control device 7 acquires, as symbol information, information related to the operation content of the user that designates the symbol from an input device that the user can operate to input the symbol to be formed on the printing surface CS. The control device 7 then converts the acquired symbol information into coordinate data. For example, the control device 7 converts the symbol indicated by the symbol information into a symbol pattern on a two-dimensional plane, and identifies the coordinates on the two-dimensional plane of the area in which the symbol pattern is distributed. As a result, the control device 7 can obtain coordinate data indicating the identified coordinates.

[0144] After acquiring the coordinate data, the control device 7 performs a modeling operation based on the coordinate data to form a mark SM. Specifically, the control device 7 forms at least one structure layer SL based on the coordinate data to form a mark SM composed of the structure layer SL. When forming each structure layer SL, the control device 7 may control the modeling device 4 to irradiate the light EL at a timing when the mark formation area indicated by the coordinate data and the irradiation area EA overlap while moving the irradiation area EA relative to the modeling surface CS so as to repeat the movement of the irradiation area EA along the Y-axis direction and the movement of the irradiation area EA along the X-axis direction, as shown in FIG. 30(a). In other words, the irradiation area EA may be moved so as to raster scan on the modeling surface CS. Alternatively, the control device 7 may control the modeling device 4 to irradiate the light EL while moving the irradiation area EA along the distribution pattern of the mark formation area indicated by the coordinate data, as shown in FIG. 30(b). In other words, the irradiation area EA may be moved so as to vector scan on the modeling surface CS. In either case, a structure layer SL having a pattern corresponding to the marks SM (that is, a pattern corresponding to the movement trajectory of the molten pool MP) is formed on the printing surface CS.

[0145] The control device 7 may perform the above-mentioned variation suppression operation during at least a part of the period during which the marking operation is performed. That is, the control device 7 may perform the above-mentioned variation suppression operation during at least a part of the period during which the marking operation is performed to suppress variation in the characteristics (for example, at least one of the height and the size) of the marks SM formed by the marking operation. For example, when the irradiation area EA is set twice or more in the same area on the printing surface CS during at least a part of the period during which the marks SM are formed, the control device 7 may perform the above-mentioned first variation suppression operation. For example, when an area having different thermal characteristics exists on the printing surface CS due to a difference in the relative moving speed of the irradiation area EA with respect to the printing surface CS during at least a part of the period during which the marks SM are formed, the control device 7 may perform the above-mentioned second variation suppression operation. For example, when an area having different thermal characteristics exists on the printing surface CS due to a difference in the degree of thermal diffusion in an existing structure, at least a part of whose surface is set on the printing surface CS, during at least a part of the period during which the marks SM are formed, the control device 7 may perform the above-mentioned third variation suppression operation. For example, if, during at least a portion of the period during which the mark SM is formed, there is an area on the printing surface CS with different thermal characteristics due to differences in the frequency with which light EL is irradiated, the control device 7 may perform the fourth variation suppression operation described above.

[0146] (4-2) Characteristics control operation for controlling the characteristics of the Mark SM Next, a property control operation for controlling the properties of the mark SM formed by the marking operation will be described. In this embodiment, as an example of the property control operation, the modeling system 1 performs at least one of a size control operation for controlling the size of the mark SM, a height control operation for controlling the height of the mark SM, a shape control operation for controlling the shape of the surface of the mark SM (particularly, the upper surface of the convex structure constituting the mark SM), and a color tone control operation for controlling the color tone of the mark SM. Therefore, the size control operation, height control operation, shape control operation, and color tone control operation will be described in order below. Note that the modeling system 1 may also perform property control operations for controlling other properties of the mark SM.

[0147] (4-2-1) Size control operation First, the size control operation will be described. The size control operation is a characteristic control operation for controlling the size of the mark SM (particularly, the size in at least one of the X-axis direction and the Y-axis direction, for example, the width). The size of the mark SM may be the size in the in-plane direction of the printing surface CS. The printing system 1 can form a mark SM of a desired size by performing the size control operation under the control of the control device 7. Furthermore, the printing system 1 can form a plurality of marks SM each showing the same symbol but different sizes by performing the size control operation under the control of the control device 7. Furthermore, the printing system 1 can form the mark SM while changing the size of the mark SM during the formation of the mark SM by performing the size control operation under the control of the control device 7.

[0148] For example, Fig. 31(a) to Fig. 31(d) each show a mark SM11 related to a linear figure and a mark SM12 related to a circular figure formed on the printing surface CS. In the example shown in Fig. 31(a), the control device 7 performs a size control operation so that the size of the mark SM11 (specifically, the size in the Y-axis direction, i.e., width) becomes a desired first size wm11 and the size of the mark SM12 becomes a desired second size wm12. In the example shown in Fig. 31(b), the control device 7 performs a size control operation so that the size of the mark SM11 becomes a desired third size wm13 smaller than the first size wm11 and the size of the mark SM12 becomes a desired fourth size wm14 larger than the second size wm12. 31(a) and 31(b), the control device 7 performs a size control operation so that the size of one portion of the mark SM11 and the size of another portion of the mark SM11 different from the one portion are the same (i.e., the size is not changed during the formation of the mark SM11). In the example shown in FIG. 31(c), the control device 7 performs a size control operation so that the size of the mark SM11 changes continuously (here, increases) from the first size wm11 to the fifth size wm15, which is larger than the first size wm11, along the longitudinal direction of the mark SM11 (i.e., the X-axis direction). In the example shown in FIG. 31(d), the control device 7 performs a size control operation so that the size of the mark SM11 changes stepwise or discretely (here, increases) from the first size wm11 to the fifth size wm15 along the longitudinal direction of the mark SM11. Furthermore, in the examples shown in Figures 31(c) and 31(d), it can also be said that the control device 7 performs a size control operation so that the size of one portion of the mark SM11 is different from the size of another portion of the mark SM11 that is different from the one portion (i.e., so as to change the size of the mark SM11 during its formation).

[0149] The control device 7 may control the size of the mark SM by controlling the heat transfer rate. Specifically, the higher the heat transfer rate for a certain area of ​​the printing surface CS, the larger the amount of heat transferred from the light EL to that area. The larger the amount of heat transferred to a certain area of ​​the printing surface CS, the larger the size of the molten pool MP formed in that area. The larger the size of the molten pool MP in a certain area of ​​the printing surface CS, the larger the size of the model formed in that area. The larger the size of the model formed in a certain area of ​​the printing surface CS, the larger the size of the mark SM made of the model. That is, as shown in FIG. 32, the higher the heat transfer rate, the larger the size of the mark SM. Therefore, the control device 7 can control the size of the mark SM by controlling the heat transfer rate. Note that a specific method for controlling the heat transfer rate in the characteristic control operation including the size control operation may be the same as the specific method for controlling the heat transfer rate in the above-mentioned variation suppression operation. Therefore, in the description of the characteristic control operation, a description of a specific method for controlling the heat transfer rate is omitted. When the relationship between the heat transfer rate and the size of the mark SM is nonlinear, the heat transfer rate may be controlled taking this nonlinear relationship into consideration.

[0150] The control device 7 may control the size of the mark SM by controlling the relative moving speed of the irradiation area EA with respect to the printing surface CS. Specifically, the slower the moving speed of the irradiation area EA in a certain area of ​​the printing surface CS, the longer the time that the irradiation area EA is set in a certain area of ​​the printing surface CS. The longer the time that the irradiation area EA is set in a certain area of ​​the printing surface CS, the greater the amount of heat transferred from the light EL to that area. The greater the amount of heat transferred to a certain area of ​​the printing surface CS, the larger the size of the shaped object (and further the size of the mark SM) formed in that area. That is, as shown in FIG. 33, the slower the moving speed of the irradiation area EA, the larger the size of the mark SM. Therefore, the control device 7 can control the size of the mark SM by controlling the moving speed of the irradiation area EA. Note that a specific method for controlling the moving speed of the irradiation area EA in the characteristic control operation including the size control operation may be the same as a specific method for controlling the moving speed of the irradiation area EA in the above-mentioned variation suppression operation. Therefore, in the description of the characteristic control operation, a description of a specific method for controlling the moving speed of the irradiation area EA is omitted. Incidentally, when the relationship between the moving speed and the size of the mark SM is non-linear, the moving speed may be controlled taking this non-linear relationship into consideration.

[0151] The control device 7 may control the size of the mark SM by controlling the size of the irradiation area EA. Specifically, the larger the size of the irradiation area EA set in a certain area on the printing surface CS, the larger the size of the area where the light EL is actually irradiated in that area. The larger the size of the area where the light EL is actually irradiated in a certain area on the printing surface CS, the larger the size of the molten pool MP formed in that area. The larger the size of the molten pool MP in a certain area on the printing surface CS, the larger the size of the shaped object (and further, the size of the mark SM) formed in that area. That is, as shown in FIG. 34, the larger the size of the irradiation area EA, the larger the size of the mark SM. Therefore, the control device 7 can control the size of the mark SM by controlling the size of the irradiation area EA. In addition, when the relationship between the size of the irradiation area EA and the size of the mark SM is nonlinear, the size of the irradiation area EA may be controlled taking this nonlinear relationship into consideration.

[0152] In order to control the size of the irradiation area EA, the control device 7 may control the irradiation optical system 411. For example, the control device 7 may control the size of the irradiation area EA by controlling an optical member included in the irradiation optical system 411 in order to control the size of the irradiation area EA. Examples of such optical members include at least one of a focusing optical element, a diaphragm member capable of changing at least one of the shape and size of an opening through which the light EL can pass, and a light shaping member capable of variably setting an area through which the light EL can pass and an area that can block the light EL within a plane intersecting the optical axis of the irradiation optical system 411 (i.e., a plane intersecting the propagation direction of the light EL). Alternatively, since the size of the irradiation area EA may also change when the relative position of the printing surface CS with respect to the irradiation optical system 411 (particularly, the relative position in the Z-axis direction) changes, the control device 7 may control the size of the irradiation area EA by controlling the drive system 42 to control the relative position of the printing surface CS with respect to the irradiation optical system 411.

[0153] As shown in FIGS. 35(a) to 35(b), a certain mark SM may be composed of a plurality of linear structures LP. Such a mark SM composed of a plurality of linear structures LP may be formed, for example, as shown in FIGS. 5(a) and 30(a), when the operation of irradiating the light EL while moving the irradiation region EA along the Y-axis direction and the operation of moving the irradiation region EA along the X-axis direction without irradiating the light EL are repeated. Specifically, when a plurality of linear structures LP formed to extend in the Y-axis direction by irradiating the light EL while moving the irradiation region EA along the Y-axis direction are formed without gaps or with gaps along the X-axis direction, a mark SM corresponding to the aggregate of the plurality of linear structures LP can be formed.

[0154] When the mark SM is thus composed of a plurality of linear structures LP, the control device 7 may control the size of the mark SM (particularly, the size along the direction in which the plurality of linear structures LP are arranged) by controlling the number of the plurality of linear structures LP constituting the mark SM. Specifically, as shown in FIGS. 35(a) and 35(b), the smaller the number of the plurality of linear structures LP constituting the mark SM, the smaller the size of the mark SM. FIGS. 35(a) and 35(b) show an example in which the size wm17 of the mark SM composed of N2 (where N2 < N1) linear structures LP is smaller than the size wm16 of the mark SM composed of N1 linear structures LP.

[0155] When the mark SM is composed of a plurality of linear structures LP in this way, the control device 7 may control the size of the mark SM (particularly, the size along the longitudinal direction or the extending direction of the plurality of linear structures LP) by controlling the lengths of the plurality of linear structures LP that constitute the mark SM. Specifically, as shown in FIGS. 35(c) and 35(d), the smaller the lengths of the plurality of linear structures LP that constitute the mark SM, the smaller the size of the mark SM. FIGS. 35(c) and 35(d) show an example in which the size wm19 of the mark SM composed of relatively short linear structures LP (specifically, having a length of wm19 (where wm19 < wm18)) is smaller than the size wm18 of the mark SM composed of relatively long linear structures LP (specifically, having a length of wm18).

[0156] In addition, the control device 7 may perform control by combining at least two of control of the supply rate of the modeling material M, control of the heat transfer rate, control of the moving speed, and control of the number of linear structures.

[0157] (4-2-2) Height control operation Subsequently, the height control operation will be described. The height control operation is a characteristic control operation for controlling the height of the mark SM. The modeling system 1 can form a mark SM with a desired height by performing the characteristic control operation under the control of the control device 7. Furthermore, the modeling system 1 can form a plurality of mark SMs with different heights while showing the same symbol by performing the height control operation under the control of the control device 7. Furthermore, the modeling system 1 can form the mark SM while changing the height of the mark SM during the formation of the mark SM by performing the height control operation under the control of the control device 7.

[0158] For example, Fig. 36(a) to Fig. 36(d) each show a mark SM related to a linear figure formed on the printing surface CS. In the example shown in Fig. 36(a), the control device 7 performs a height control operation so that the height of the mark SM becomes a desired first height hm21. In the example shown in Fig. 36(b), the control device 7 performs a height control operation so that the height of the mark SM becomes a desired second height hm22 higher than the first height hm21. It can be said that in the examples shown in Figs. 36(a) and 36(b), the control device 7 performs a height control operation so that the height of one part of the mark SM and the height of another part of the mark SM different from the one part are the same (i.e., the height is not changed during the formation of the mark SM). In the example shown in Fig. 36(c), the control device 7 performs a height control operation so that the height of the mark SM changes continuously (here, becomes higher) from the first height hm21 to a third height hm23 higher than the first height hm21 along the longitudinal direction of the mark SM (i.e., the X-axis direction). In the example shown in FIG. 36(d), the control device 7 performs a height control operation so that the height of the mark SM changes stepwise or discretely from the first height hm21 to the third height hm23 (here, the height increases) along the longitudinal direction of the mark SM. In particular, in the example shown in FIG. 36(c) and FIG. 36(d), the control device 7 performs a height control operation so that the heights of the parts (i.e., the height along the Z-axis direction intersecting the Y-axis direction) of the mark SM extending in the Y-axis direction formed by moving the irradiation area EA (i.e., the molten pool MP) along the Y-axis direction on the printing surface CS differ depending on the position of each part along the Y-axis direction. Note that, in the example shown in FIG. 36(c) and FIG. 36(d), the control device 7 can be said to perform a height control operation so that the height of one part of the mark SM and the height of another part of the mark SM different from the one part are different (i.e., the height is changed during the formation of the mark SM). Note that the control device 7 may perform a height control operation so that the height of the mark SM changes continuously along the longitudinal direction of the mark SM.

[0159] The control device 7 may control the height of the mark SM by controlling the supply rate of the modeling material M. Specifically, the higher the supply rate for a certain area of ​​the modeling surface CS, the greater the supply amount of the modeling material M for that area. The greater the supply amount of the modeling material M for a certain area of ​​the modeling surface CS, the greater the amount of melted modeling material M in that area. The greater the amount of melted modeling material M in a certain area of ​​the modeling surface CS, the higher the object formed in that area. The higher the object formed in a certain area of ​​the modeling surface CS, the higher the mark SM composed of the object. That is, as shown in FIG. 37, the higher the supply rate, the higher the mark SM. Therefore, the control device 7 can control the height of the mark SM by controlling the supply rate. Note that a specific method for controlling the supply rate in the characteristic control operation including the height control operation may be the same as a specific method for controlling the supply rate in the above-mentioned variation suppression operation. Therefore, in the description of the characteristic control operation, a specific method for controlling the supply rate will be omitted. If the relationship between the supply rate and the height of the mark SM is nonlinear, the supply rate may be controlled taking this nonlinear relationship into consideration.

[0160] The control device 7 may control the height of the mark SM by controlling the heat transfer rate. Specifically, the higher the heat transfer rate for a certain area of ​​the printing surface CS, the greater the amount of heat transferred from the light EL to that area. The greater the amount of heat transferred to a certain area of ​​the printing surface CS, the greater the amount of melted printing material M in that area. The greater the amount of melted printing material M in a certain area on the printing surface CS, the higher the object (and further the mark SM) formed in that area. In other words, as shown in FIG. 38, the higher the heat transfer rate, the higher the mark SM. Therefore, the control device 7 can control the height of the mark SM by controlling the heat transfer rate. Note that, if the relationship between the heat transfer rate and the height of the mark SM is nonlinear, the heat transfer rate may be controlled taking this nonlinear relationship into consideration.

[0161] The control device 7 may control the height of the mark SM by controlling the relative moving speed of the irradiation area EA with respect to the printing surface CS. Specifically, as described above, the slower the moving speed of the irradiation area EA in a certain area of ​​the printing surface CS, the greater the amount of heat transferred from the light EL to that area. The greater the amount of heat transferred to a certain area on the printing surface CS, the higher the object (and further the mark SM) formed in that area. In other words, as shown in FIG. 39, the slower the moving speed of the irradiation area EA, the higher the mark SM. Therefore, the control device 7 can control the height of the mark SM by controlling the moving speed of the irradiation area EA. Note that, if the relationship between the moving speed and the height of the mark SM is nonlinear, the moving speed may be controlled taking this nonlinear relationship into consideration.

[0162] As described above, the mark SM may be a structure including a plurality of stacked structural layers SL. In this case, the control device 7 may control the height of the mark SM by controlling the number of structural layers SL constituting the mark SM (i.e., the number of stacked structural layers SL). Specifically, as shown in Fig. 40(a) and Fig. 40(b), the fewer the number of structural layers SL constituting the mark SM, the lower the mark SM becomes. Fig. 40(a) and Fig. 40(b) show an example in which the height wm25 of the mark SM composed of L2 (where L2>L1) structural layers SL is higher than the height hm24 of the mark SM composed of L1 structural layers SL.

[0163] The control device 7 may perform a combination of at least two of the control of the supply rate of the modeling material M, the control of the heat transfer rate, the control of the moving speed, and the control of the number of layers.

[0164] (4-2-3) Shape control operation Next, the shape control operation will be described. The shape control operation is a characteristic control operation for controlling the shape of the surface of the mark SM (particularly, the upper surface of the convex structure constituting the mark SM). The modeling system 1 can form the mark SM having a desired surface shape by performing the shape control operation under the control of the control device 7. For example, as shown in FIG. 41(a), the control device 7 may perform the shape control operation so as to form the mark SM whose surface includes a plane (particularly, a plane parallel to the modeling surface CS). For example, as shown in FIG. 41(b), the control device 7 may perform the shape control operation so as to form the mark SM whose surface includes a curved surface. For example, as shown in FIG. 41(c), the control device 7 may perform the shape control operation so as to form the mark SM whose surface includes a plane inclined with respect to the modeling surface CS.

[0165] The control device 7 may control the shape of the surface of the mark SM by controlling the size of the object constituting the mark SM by performing an operation similar to the size control operation described above. The control device 7 may control the shape of the surface of the mark SM by controlling the height of the object constituting the mark SM by performing an operation similar to the height control operation described above. The control device 7 may form the mark SM having a surface shape of a desired shape by performing an operation similar to a normal modeling operation for forming a three-dimensional structure ST of a desired shape.

[0166] The modeling system 1 may control, under the control of the control device 7, at least one of the shape of the surface of the mark SM and the height of the mark SM to control the shape of a virtual connection surface VS connecting the surfaces of the marks SM formed on the modeling surface CS (particularly, the shape of a cross section including the Z-axis, which is the stacking direction of the structure layer SL). The modeling system 1 may perform at least one of a shape control operation and a height control operation under the control of the control device 7 to form a plurality of marks SM whose connection surface VS has a desired shape. For example, as shown in FIG. 42(a), the control device 7 may perform a shape control operation so that the connection surface VS forms a mark SM including a plane (particularly, a plane parallel to the modeling surface CS). For example, as shown in FIG. 42(b), the control device 7 may perform at least one of a shape control operation and a height control operation so that the connection surface VS forms a mark SM including a curved surface. For example, as shown in FIG. 42(c), the control device 7 may perform at least one of a shape control operation and a height control operation so that the connection surface VS forms a mark SM including a plane inclined with respect to the modeling surface CS.

[0167] As described above, the mark SM is a convex structure protruding from the printing surface CS. In this case, the mark SM can be used as a seal for transferring an imprint corresponding to the pattern of the mark SM to the target TG by pressing the surface of the mark SM against the target TG. For example, FIG. 43(a) shows an example in which a mark SM having a pattern in which the letters N and C are inverted is formed on the printing surface CS corresponding to the surface of the workpiece W. After coating the surface of such a mark SM with paint, when the surface of the mark SM is pressed against the target surface TGS of the target TG, an imprint including the letters N and C is transferred to the target surface TGS as shown in FIG. 43(b).

[0168] In this manner, when the mark SM is pressed against the object, the control device 7 may perform a shape control operation to control the shape of the coupling surface VS based on the characteristics of the object TG. Specifically, the control device 7 may perform a shape control operation to control the shape of the coupling surface VS based on the shape of the object surface TGS on which the mark SM is pressed (specifically, the shape of a cross section including an axis intersecting the object surface TGS) of the surface of the object TG. In this case, the control device 7 may control the shape of the coupling surface VS so that the shape of the coupling surface VS and the shape of the object surface TGS are in a complementary relationship. For example, as shown in FIG. 44(a), when the object surface TGS is a flat surface, the control device 7 may perform a shape control operation to form a mark SM in which the coupling surface VS is a flat surface having a complementary relationship with the object surface TGS. For example, as shown in FIG. 44(b), when the object surface TGS is a concave curved surface, the control device 7 may perform a shape control operation to form a mark SM in which the coupling surface VS is a convex curved surface having a complementary relationship with the object surface TGS. For example, as shown in FIG. 44(c), the control device 7 may perform a shape control operation to form a mark SM in which the connecting surface VS is a concave plane having a complementary relationship with the target surface TGS when the target surface TGS is a convex plane. When the shape control operation is performed in this manner, the surface of the mark SM can be appropriately pressed against the target surface TGS of the object TG, compared to when the shape control operation is not performed. Specifically, when the surface of the mark SM is pressed against the target surface TGS, a gap is unlikely to be formed between the surface of the mark SM and the target surface TGS. As a result, regardless of the shape of the target surface TGS, an imprint according to the pattern of the mark MS can be appropriately transferred to the target surface TGS.

[0169] When controlling the shape of the coupling surface VS based on the characteristics of the target TG, the control device 7 may acquire characteristic information regarding the characteristics of the target TG and control the shape of the coupling surface VS based on the acquired characteristic information. The control device 7 may acquire the measurement results of a measuring device that measures the characteristics of the target TG as the characteristic information. In this case, the measuring device may be included in the modeling system 1, or may be prepared separately from the modeling system 1. Alternatively, the control device 7 may acquire the characteristic information from another device that holds the characteristic information.

[0170] In the above description, the characteristic of the object TG is the shape of the object surface TGS, but the characteristic of the object TG may be the hardness, elasticity, or the like of the object TG.

[0171] (4-2-4) Color Tone Control Operation Next, the color tone control operation will be described. The color tone control operation is a characteristic control operation for controlling the color tone of the mark SM (particularly the color tone of the surface of the mark SM). The modeling system 1 can form a mark SM of a desired color tone by performing the color tone control operation under the control of the control device 7. Furthermore, the modeling system 1 can form a plurality of marks SM each showing the same symbol but with different color tones by performing the color tone control operation under the control of the control device 7. Furthermore, the modeling system 1 can form the mark SM while changing the color tone of the mark SM during the formation of the mark SM by performing the color tone control operation under the control of the control device 7.

[0172] The control device 7 may control the color tone of the mark SM by controlling the characteristics of the specific gas in the internal space of the chamber 44. In particular, the control device 7 may control the color tone of the mark SM by controlling the characteristics of the specific gas in the space surrounding the molten pool MP located in the internal space of the chamber 44. In this case, the control device 7 may control the characteristics of the specific gas so that the characteristics of the specific gas become desired characteristics that enable the color tone of the mark SM to be set to a desired tone. The specific gas includes a predetermined gas that affects the color tone of the mark SM. An example of such a specific gas is oxygen gas.

[0173] The characteristic of the specific gas may include the concentration of the specific gas (i.e., the concentration of the specific gas in the internal space of the chamber 44 (particularly, the space around the molten pool MP in the internal space)). When the specific gas is included in the purge gas (i.e., the gas supply device 6 supplies a purge gas containing the specific gas), the control device 7 may control the concentration of the specific gas in the purge gas (i.e., the content of the specific gas in the purge gas) to control the concentration of the specific gas in the internal space of the chamber 44. When the specific gas is not included in the purge gas (i.e., the gas supply device 6 supplies the specific gas through a supply path different from that of the purge gas, or a device different from the gas supply device 6 supplies the specific gas), the control device 7 may control the concentration of the specific gas in the internal space of the chamber 44 by controlling the flow rate of at least one of the purge gas and the specific gas supplied to the internal space of the chamber 44. Instead of controlling the concentration of the specific gas in the entire internal space of the chamber 44, the concentration of the specific gas may be controlled only in the space around the molten pool MP.

[0174] The control device 7 may control the characteristics of the specific gas so that the characteristics of the specific gas during the period when the first mark SM21 is formed are different from the characteristics of the specific gas during the period when the second mark SM22 different from the first mark SM21 is formed, as shown in FIG. 45(a). In this case, the color tone of the first mark SM21 is different from the color tone of the second mark SM22, as shown in FIG. 45(b). The control device 7 may control the characteristics of the specific gas so that the characteristics of the specific gas during the period when the first portion SM21-1 of the first mark SM21 is formed are different from the characteristics of the specific gas during the period when the second portion SM21-2 different from the first portion SM21-1 of the first mark SM21 is formed, as shown in FIG. 45(c). In this case, the color tone of the first portion SM21-1 of the first mark SM21 is different from the color tone of the second portion SM21-2 of the first mark SM21, as shown in FIG. 45(d).

[0175] (4-2-5) Modification of characteristic control operation In the above description, the control device 7 performs the property control operation to control the property of the mark SM formed by the marking operation. However, the control device 7 may perform the property control operation described above to control at least one property of the modeling object, the structure layer SL, and the three-dimensional structure ST formed by the modeling operation, not limited to the mark SM. That is, the control device 7 may perform the size control operation described above to control the size of at least one of the modeling object, the structure layer SL, and the three-dimensional structure ST. The control device 7 may perform the height control operation described above to control the height of at least one of the modeling object, the structure layer SL, and the three-dimensional structure ST. The control device 7 may perform the shape control operation described above to control the shape of at least one of the modeling object, the structure layer SL, and the three-dimensional structure ST. The control device 7 may perform the color control operation described above to control the color tone of at least one of the modeling object, the structure layer SL, and the three-dimensional structure ST.

[0176] (5) Processing operation (polishing operation) The modeling system 1 may perform a processing operation to process at least a part of the surface of at least one of the three-dimensional structure ST and the mark SM. The mark SM formed by the marking operation is a specific example of the three-dimensional structure ST formed by the modeling operation. Therefore, in the explanation of the processing operation, the three-dimensional structure ST means at least one of the three-dimensional structure ST and the mark SM.

[0177] In this embodiment, the modeling system 1 may perform a polishing operation as an example of a processing operation to polish at least a portion of the surface of the three-dimensional structure ST (particularly, the upper surface of the structural layer SL that is the top layer constituting the three-dimensional structure ST). The polishing operation will be described below. For ease of explanation, the surface polished by the polishing operation will be referred to as the polishing target surface PS. The modeling system 1 may perform a polishing operation to polish at least a portion of the side surface of one or more structural layers SL of the three-dimensional structure (the surface facing in a direction intersecting the direction in which the structural layers SL are stacked).

[0178] In this embodiment, the "polishing operation of polishing the surface PS to be polished" includes "an operation of smoothing the surface PS to be polished, increasing the flatness of the surface PS to be polished (i.e., making it flat), and / or reducing the surface roughness of the surface PS to be polished (i.e., making it smaller) compared to before the polishing operation." When the surface PS to be polished is polished, the color tone of the surface PS to be polished may change compared to before the polishing operation. Therefore, the "polishing operation of polishing the surface PS to be polished" may include "an operation of changing the color tone of the surface PS to be polished compared to before the polishing operation." When the surface PS to be polished is polished, at least one of the reflectance (e.g., reflectance for any light) and the diffusivity (e.g., diffusivity for any light) of the surface PS to be polished may change compared to before the polishing operation. Therefore, the "polishing operation of polishing the surface PS to be polished" may include "an operation of changing at least one of the reflectance and the diffusivity of the surface PS to be polished compared to before the polishing operation."

[0179] Such a polishing target surface PS may be a relatively rough surface (i.e., a surface on which projections and recesses are formed) that can be smoothed (or made flat or have finer surface roughness) by polishing with a polishing operation. For example, as described above, in this embodiment, a powdered or granular modeling material M is melted and then re-solidified to form a three-dimensional structure ST. For this reason, at least a part of the surface of the three-dimensional structure ST may have unmelted modeling material M attached thereto. In this case, the surface to which the unmelted modeling material M is attached may be a relatively rough surface that can be smoothed by a polishing operation. Furthermore, at least a part of the surface of the three-dimensional structure ST may have unsolidified modeling material M attached thereto in an unintended shape. In this case, the surface to which the unsolidified modeling material M is attached may be a relatively rough surface that can be smoothed by a polishing operation. For example, as described above, in this embodiment, during the period in which each structure layer SL is formed, the modeling head 41 moves along at least one of the X-axis and the Y-axis (i.e., along the XY plane). In this case, depending on the relative movement of the modeling head 41 with respect to the modeling surface CS, regular or irregular irregularities may appear on at least a part of the surface of the structure layer SL (and thus the surface of the three-dimensional structure layer ST) along the XY plane, depending on the movement pattern (typically, the movement pitch) of the modeling head 41. In this case, the surface on which the regular or irregular irregularities appear may be a relatively rough surface that can be smoothed by a polishing operation.

[0180] In order to polish such a surface PS to be polished, the modeling system 1 irradiates the surface PS to be polished with light EL under the control of the control device 7. That is, in this embodiment, the surface PS to be polished is polished with light EL. Specifically, as shown in FIG. 46(a), the control device 7 sets an irradiation area EA in a certain area on the surface PS to be polished, and irradiates the irradiation area EA from the irradiation optical system 411 with light EL. Note that FIG. 46(a) shows an example in which the surface PS to be polished is a surface on which regular or irregular irregularities to be polished by the polishing operation appear. At this time, the control device 7 moves the modeling head 41 as necessary to set the irradiation area EA in a desired area on the surface PS to be polished. When the irradiation area EA is irradiated with light EL, the modeling material M in the area where the irradiation area EA is set of the surface PS to be polished is melted again by the light EL, as shown in FIG. 46(b). When the modeling material M that has solidified to form unevenness melts, the surface (i.e., the interface) of the molten modeling material M approaches a flat surface or becomes flat due to at least one of the weight and surface tension of the molten modeling material M. In other words, the smoothness of the surface (i.e., the interface) of the molten modeling material M is improved. Thereafter, when the light EL is no longer irradiated onto the molten modeling material M as the modeling head 41 moves, the molten modeling material M is cooled and solidifies again (i.e., solidifies). As a result, as shown in FIG. 46(c), the re-solidified modeling material M having a smooth surface (or improved flatness and / or finer surface roughness) constitutes the surface of the three-dimensional structure ST. In this way, the polishing target surface PS is polished by the polishing operation.

[0181] The control device 7 repeatedly performs a series of polishing processes, including melting the modeling material M by the light irradiation EL and re-solidifying the molten modeling material M, while moving the modeling head 41 relative to the three-dimensional structure ST. That is, the control device 7 repeatedly performs a series of polishing processes while moving the irradiation area EA relative to the polishing target surface PS. Specifically, for example, the control device 7 may repeatedly perform a series of polishing processes while repeating the movement of the irradiation area EA along the Y-axis direction and the movement of the irradiation area EA along the X-axis direction. That is, the control device 7 may repeatedly perform a series of polishing processes while moving the irradiation area EA along a movement trajectory corresponding to the scanning in the raster scan described with reference to FIG. 3(a). In this case, the control device 7 polishes the polishing target surface PS by irradiating the light EL during a period in which the irradiation area EA is moving along one of the X-axis and Y-axis, which has a larger movement amount per movement, and does not irradiate the light EL during a period in which the irradiation area EA is moving along the other of the X-axis and Y-axis, which has a smaller movement amount per movement. However, the control device 7 may repeatedly perform a series of polishing processes while moving the irradiation area EA along a movement trajectory corresponding to the vector scan described with reference to FIG. 3(b).

[0182] In both the modeling operation (or the marking operation) and the polishing operation, when the irradiation area EA moves along a movement trajectory corresponding to the scanning in the raster scan, the control device 7 may move the irradiation area EA so that the movement direction of the irradiation area EA during the period when the light EL is irradiated in the modeling operation intersects (i.e., is different from) the movement direction of the irradiation area EA during the period when the light EL is irradiated in the polishing operation. Specifically, as shown in Fig. 47(a) and Fig. 47(b), when the movement direction of the irradiation area EA during the period when the light EL is irradiated in the modeling operation is the Y-axis direction, the control device 7 may set the movement direction of the irradiation area EA during the polishing operation so that the movement direction of the irradiation area EA during the period when the light EL is irradiated in the polishing operation is the X-axis direction. Alternatively, when the movement direction of the irradiation area EA during the period when the light EL is irradiated in the modeling operation is the X-axis direction, the movement direction of the irradiation area EA during the polishing operation may be set so that the movement direction of the irradiation area EA during the period when the light EL is irradiated in the polishing operation is the Y-axis direction. As a result, the modeling system 1 can appropriately polish the polishing target surface PS, which has irregularities caused by the movement pattern (typically, the movement pitch) of the modeling head 41 during the modeling operation, so as to smooth out the irregularities (particularly, to remove the irregularities from the polishing target surface PS). Note that the movement direction of the irradiation area EA during the period when the light EL is irradiated in the modeling operation and the movement direction of the irradiation area EA during the period when the light EL is irradiated in the polishing operation do not have to be perpendicular to each other.

[0183] Alternatively, in the case where the irradiation area EA moves along a movement trajectory corresponding to the scanning in the raster scan in both the modeling operation (or the marking operation) and the polishing operation, the control device 7 may move the irradiation area EA so that the movement direction of the irradiation area EA during the period when the light EL is irradiated in the modeling operation and the movement direction of the irradiation area EA during the period when the light EL is irradiated in the polishing operation are aligned (i.e., the same). Even in this case, the polishing target surface PS can be polished. However, in this case, the control device 7 may move the irradiation area EA so that the movement amount (i.e., the movement pitch) of the irradiation area EA in one operation during the period when the light EL is not irradiated in the modeling operation is different from the movement amount of the irradiation area EA in one operation during the period when the light EL is not irradiated in the polishing operation. In particular, the control device 7 may move the irradiation area EA so that the movement amount of the irradiation area EA in one operation during the period when the light EL is not irradiated in the polishing operation is smaller than the movement amount of the irradiation area EA in one operation during the period when the light EL is not irradiated in the modeling operation. For example, specifically, as shown in Fig. 48(a) and Fig. 48(b), when the movement amount of the irradiation area EA during the period when the light EL is not irradiated in the modeling operation is a first movement amount P1, the control device 7 may move the irradiation area EA so that the movement amount of the irradiation area EA during the period when the light EL is not irradiated in the polishing operation is a second movement amount P2 smaller than the first movement amount P1. As a result, the modeling system 1 can appropriately polish the polishing target surface PS on which unevenness caused by the movement pattern of the modeling head 41 exists during the modeling operation so as to smooth the unevenness. Note that the movement pitch of the irradiation area EA during the period when the light EL is not irradiated in the polishing operation may be larger or smaller than the movement pitch of the irradiation area EA during the period when the light EL is not irradiated in the modeling operation.

[0184] The control device 7 may control the size of the irradiation area EA so that the size of the irradiation area EA during the period when the light EL is irradiated in the modeling operation is different from the size of the irradiation area EA during the period when the light EL is irradiated in the polishing operation. For example, the control device 7 may control the size of the irradiation area EA so that the size of the irradiation area EA during the period when the light EL is irradiated in the modeling operation is larger than the size of the irradiation area EA during the period when the light EL is irradiated in the polishing operation. For example, the control device 7 may control the size of the irradiation area EA so that the size of the irradiation area EA during the period when the light EL is irradiated in the modeling operation is smaller than the size of the irradiation area EA during the polishing operation. Even in this case, the modeling system 1 can appropriately polish the polishing target surface PS, which has unevenness caused by the movement pattern of the modeling head 41 during the modeling operation, so as to smooth the unevenness. Note that a specific method for controlling the size of the irradiation area EA may be the same as a specific method for controlling the size of the irradiation area EA in the size control operation described above.

[0185] (6) Variations (6-1) First Modification First, a first modified example of the modeling system 1 will be described. In the above description, the control device 7 performs a first variation suppression operation in order to suppress the variation between the height h1 of the model S1 formed in the area WA1 where the irradiation area EA is set two or more times during the layer formation period, and the height h2 of the model S2 formed in the area WA2 where the irradiation area EA is set once during the layer formation period. On the other hand, the modeling system 1a in the first modified example can suppress the variation between the height h1 of the model S1 and the height h2 of the model S2 without performing the first variation suppression operation.

[0186] Specifically, the modeling system 1a differs from the modeling system 1 in that the modeling system 1a includes a modeling apparatus 4a instead of the modeling apparatus 4. The modeling apparatus 4a differs from the modeling apparatus 4 in that the modeling apparatus 4a includes an irradiation optical system 411a, which is a focusing optical system, instead of the irradiation optical system 411. The irradiation optical system 411a differs from the irradiation optical system 411 in that the optical characteristics are set (in other words, designed or adjusted) in advance so as to suppress the variation between the height h1 of the modeled object S1 and the height h2 of the modeled object S2. Other configuration elements of the modeling system 1a may be the same as those of the modeling system 1.

[0187] The optical characteristics of the irradiation optical system 411a are set in advance so as to suppress the variation between the height h1 of the object S1 and the height h2 of the object S2. In this embodiment, the focal depth is used as the optical characteristic of the irradiation optical system 411a. Therefore, the focal depth of the irradiation optical system 411a is set in advance so as to suppress the variation between the height h1 of the object S1 and the height h2 of the object S2. The focal depth is correlated with the numerical aperture (NA), which is another example of the optical characteristic of the irradiation optical system 411a. Therefore, it can be said that the numerical aperture of the irradiation optical system 411a is set in advance so as to suppress the variation between the height h1 of the object S1 and the height h2 of the object S2. Note that the focal depth in this description may refer to a range in the optical axis direction (light traveling direction) where the intensity or energy amount per unit area of ​​the light EL is greater than the intensity that can melt the modeling material M.

[0188] The focal depth of the irradiation optical system 411a is set based on the design height (i.e., thickness) h0 of the structure layer SL formed by the modeling system 1a. Specifically, the focal depth of the irradiation optical system 411a is set so as to satisfy a first condition that the magnitude of the focal depth (in other words, the width along the Z axis) is less than twice the design height h0 of the structure layer SL, as shown in Fig. 49. In other words, the focal depth of the irradiation optical system 411a is set so as to satisfy a first condition that two or more stacked structure layers SL cannot be located within the focal depth range at the same time (i.e., a part of two or more stacked structure layers SL falls outside the focal depth range).

[0189] In the case where such a condition is satisfied, a situation is assumed where the irradiation area EA is set twice in the area WA1. In this case, when the first irradiation area EA is set in the area WA1, as shown in FIG. 50(a), a model SOa whose height ha is equal to the height h0 is formed in the area WA1. Thereafter, when the second irradiation area EA is set in the area WA1, a new model SOb may be formed on the model SOa already formed in the area WA1. However, since the size of the focal depth is less than twice the height h0, as shown in FIG. 50(b), even if a new model SOb is formed, its height hb will be smaller than the height h0. This is because the modeling material M does not melt in the area outside the range of the focal depth due to insufficient intensity of the light EL. On the other hand, when the first condition is not satisfied, when the second irradiation area EA is set in the area WA1, a model SOb whose height hb is equal to the height h0 may be formed on the model SOa. Therefore, when the first condition is satisfied, the variation between the height h1 of the object S1 formed in the area WA1 (= the sum of the height ha of the object SOa and the height hb of the object SOb) and the height h2 of the object S2 formed in the area WA2 (= the height ha of the object SOa) is suppressed compared to when the first condition is not satisfied. In other words, the modeling system 1a can appropriately suppress the variation between the height h1 of the object S1 and the height h2 of the object S2 without controlling at least one of the supply rate of the modeling material M, the heat transfer rate of the heat transferred from the light EL, and the movement speed of the irradiation area EA as described above.

[0190] The object is formed on the printing surface CS. Furthermore, since the printing material M melts within the range of the focal depth of the irradiation optical system 411a, the object is formed within the range of the focal depth. Therefore, as shown in Fig. 51(a) and Fig. 51(b), the object is formed between the printing surface CS and the boundary UB of the range of the focal depth on the object surface side of the irradiation optical system 411a (the +Z side, the upper side in the example shown in Fig. 51(a) and Fig. 51(b)). Then, in order to form an object having the same height h0 as the design height h0 of the structure layer SL on the printing surface CS, the irradiation optical system 413 may be aligned with the printing surface CS so that the distance between the printing surface CS and the boundary UB is equal to or greater than the height h0, as shown in Fig. 51(a) and Fig. 51(b). Fig. 51(a) shows an example in which the distance between the printing surface CS and the boundary UB is equal to the height h0. In this case, an object having a height h0 is formed on the printing surface CS. On the other hand, Fig. 51(b) shows an example in which the distance between the printing surface CS and the boundary UB is greater than the height h0. In this case, a model with a height of at least h0 is formed on the printing surface CS. As shown in Fig. 51(a), the state in which the distance between the printing surface CS and the boundary UB is equal to the height h0 is equivalent to the state in which the focus position of the light EL is set on the printing surface CS. Similarly, as shown in Fig. 51(b), the state in which the distance between the printing surface CS and the boundary UB is greater than the height h0 is equivalent to the state in which the focus position of the light EL is set at a position shifted toward the object surface of the irradiation optical system 411a from the printing surface CS.

[0191] However, if the focal depth of the irradiation optical system 411a is less than the design height h0 of the structure layer SL, the distance between the printing surface CS and the boundary UB cannot be made equal to or greater than the height h0. As a result, a modeled object having a height of h0 cannot be formed on the printing surface CS. For this reason, the focal depth of the irradiation optical system 411a may be set so as to also satisfy the second condition that the focal depth is equal to or greater than the design height h0 of the structure layer SL.

[0192] In the first modified example, the modeling system 1a may also perform the first variation suppression operation.

[0193] (6-2) Second Modification Next, a second modified example of the modeling system 1 will be described with reference to FIG. The modeling system 1b in the second modified example is different from the modeling system 1 in that it includes a modeling device 4b instead of the modeling device 4. The modeling device 4b is different from the modeling device 4 in that it includes a drive system 45b. Other configuration elements of the modeling system 1a may be the same as those of the modeling system 1.

[0194] The driving system 45b moves the stage 43. The driving system 45b moves the stage 43 along at least one of the X-axis, the Y-axis, and the Z-axis. The driving system 45b may move the stage 43 along at least one of the θX-direction, the θY-direction, and the θZ-direction in addition to at least one of the X-axis, the Y-axis, and the Z-axis. The driving system 45b includes, for example, a motor. When the stage 43 moves, the workpiece W (and further the structure layer SL on the workpiece W) held by the stage 43 moves relative to the modeling head 41. That is, the modeling surface CS, which is at least a part of the surface of the workpiece W or the structure layer SL, moves relative to the irradiation area EA where the light EL is irradiated from the modeling head 41 (that is, the supply area MA where the modeling material M is supplied from the modeling head 41). Therefore, in the second modified example, the control device 7 can control the relative moving speed of the irradiation area EA with respect to the modeling surface CS by controlling the driving system 45b in addition to or instead of the driving system 42.

[0195] (6-3) Third Modification Next, a third modified example of the modeling system 1 will be described with reference to Fig. 53(a) and Fig. 53(b). The modeling system 1c in the third modified example differs from the modeling system 1 in that it includes a modeling device 4c instead of the modeling device 4. The modeling device 4c differs from the modeling device 4 in that it includes an irradiation optical system 411c instead of the irradiation optical system 411. The irradiation optical system 411c differs from the irradiation optical system 411 in that it includes an optical system 491c capable of deflecting the light EL, as shown in Fig. 53(a). The other components of the modeling system 1a may be the same as those of the modeling system 1.

[0196] 53(b), the optical system 491c includes a focus lens 4911c, a galvanometer mirror 4912c, and an fθ lens 4913c. The light EL is irradiated onto the printing surface CS (and further onto the polishing target surface PS, if necessary) via the focus lens 4911c, the galvanometer mirror 4912c, and the fθ lens 4913c.

[0197] The focus lens 4911c is an optical element that is composed of one or more lenses and adjusts the position of at least some of the lenses along the optical axis direction to adjust the condensing position of the light EL (i.e., the focal position of the optical system 491c). The galvanometer mirror 4912c deflects the light EL so that the light EL scans the printing surface CS (i.e., the irradiation area EA moves on the printing surface CS). The galvanometer mirror 4912c includes an X-scanning mirror 4912X and a Y-scanning mirror 4912Y. The X-scanning mirror 4912X reflects the light EL toward the Y-scanning mirror 4912Y. The X-scanning mirror 4912X can swing or rotate in the θY direction (i.e., the rotation direction around the Y axis). The light EL scans the printing surface CS along the X-axis direction by the swing or rotation of the X-scanning mirror 4912X. The irradiation area EA moves on the printing surface CS along the X-axis direction by the swing or rotation of the X-scanning mirror 4912X. The Y scanning mirror 4912Y reflects the light EL toward the fθ lens 4913c. The Y scanning mirror 4912Y can swing or rotate in the θX direction (i.e., the rotation direction around the X axis). The swing or rotation of the Y scanning mirror 4912Y causes the light EL to scan the printing surface CS along the Y-axis direction. The swing or rotation of the Y scanning mirror 4912Y causes the irradiation area EA to move along the Y-axis direction on the printing surface CS. The fθ lens 4913c is an optical element for focusing the light EL from the galvanometer mirror 4912c on the printing surface CS.

[0198] Therefore, in the third modified example, the control device 7 can control the relative moving speed of the irradiation area EA with respect to the printing surface CS by controlling the optical system 491c (particularly, the galvanometer mirror 4912c) in addition to or instead of the drive system 42.

[0199] In addition, in the third modified example, the material nozzle 412 supplying the building material M may be movable along at least one of the X-axis, Y-axis, and Z-axis so as to supply the building material M to the molten pool MP formed by the irradiation area EA on the building surface CS depending on the position of the irradiation area EA on the building surface CS.

[0200] (6-4) Fourth Modification Next, a fourth modified example of the modeling system 1 will be described. In the above description, the modeling head 41 included in the modeling system 1 emits both the light EL used in the modeling operation and the light EL used in the polishing operation. In other words, the optical path of the light EL in the irradiation optical system 411 during the modeling operation is the same as the optical path of the light EL in the irradiation optical system 411 during the polishing operation. On the other hand, the modeling system 1d of the fourth modified example includes a polishing head 41d that emits the light EL used in the polishing operation, separate from the modeling head 41 that emits the light EL used in the modeling operation.

[0201] Specifically, the modeling system 1d differs from the modeling system 1 in that it includes a modeling device 4d instead of the modeling device 4. The modeling device 4d differs from the modeling device 4 in that it includes a polishing head 41d and a drive system 42d. Other components of the modeling system 1d may be the same as those of the modeling system 1. For this reason, hereinafter, the modeling device 4d of the fourth modified example will be further described with reference to FIG. 54. Note that the same components as those of the modeling system 1 will be denoted by the same reference symbols and detailed descriptions thereof will be omitted.

[0202] 54, the object-forming apparatus 4d includes a polishing head 41d and a driving system 42d, in addition to the object-forming head 41, the driving system 42, and the stage 43. The polishing head 41d includes an irradiation optical system 411d.

[0203] The irradiation optical system 411d is an optical system (for example, a light collecting optical system) for emitting the light ELd from the emission unit 413d. Specifically, the irradiation optical system 411d is optically connected to the light source 5 that emits the light EL via an optical transmission member (not shown), such as an optical fiber or a light pipe. The irradiation optical system 411d emits the light EL propagated from the light source 5 via the optical transmission member as the light ELd. That is, the light EL emitted by the light source 5 is branched into two light beams EL by an optical branching device disposed between the light source 5 and the modeling device 4d or within the modeling device 4d, and one of the light beams EL propagates to the modeling head 41 and the other light beam EL propagates to the polishing head 41d. The irradiation optical system 411d irradiates the light ELd downward (i.e., toward the -Z side) from the irradiation optical system 411d. The stage 43 is disposed below the irradiation optical system 411d. When the three-dimensional structure ST is mounted on the stage 43, the irradiation optical system 411d irradiates the light ELd toward the three-dimensional structure ST. Specifically, the irradiation optical system 411d irradiates the light ELd to a circular (or any other shape) irradiation area EAd that is set on the polishing target surface PS as an area to be irradiated with the light ELd. The irradiation area EAd is set at a position different from the irradiation area EA to which the light EL from the modeling head 41 is irradiated, but may be set at the same position. The irradiation area EAd does not overlap with the irradiation area EA, but may overlap at least partially. Furthermore, the state of the irradiation optical system 411d is switchable between a state in which the light ELd is irradiated to the irradiation area EAd and a state in which the light ELd is not irradiated to the irradiation area EAd under the control of the control device 7.

[0204] The drive system 42d moves the polishing head 41d. Specifically, the drive system 42d moves the polishing head 41d along each of the X-axis, Y-axis, and Z-axis. The structure of the drive system 42d may be the same as the structure of the drive system 42. Therefore, a detailed description of the structure of the drive system 42d will be omitted.

[0205] Since the polishing head 41d is prepared separately from the object-forming head 41, the polishing head 41d irradiates the light ELd from a direction different from that of the object-forming head 41. That is, the light ELd is irradiated to the polishing target surface PS by propagating through an optical path different from that of the light EL. Therefore, the polishing head 41d can irradiate the light ELd during at least a part of the period during which the object-forming head 41 irradiates the light EL. That is, the object-forming system 1d can perform the object-forming operation and the polishing operation in parallel. In other words, the object-forming system 1d can make the time period (or period) in which the object-forming operation is performed and the time period (or period) in which the polishing operation is performed overlap at least partially, or can make the timing of the object-forming operation and the timing of the polishing operation overlap at least partially. Specifically, the modeling system 1d can polish the polishing target surface PS, which is at least a part of the surface of another part of the three-dimensional structure ST already formed in another area on the modeling surface CS, by irradiating the light ELd to the polishing target surface PS during at least a part of the period during which the modeling head 41 forms a part of the three-dimensional structure ST by irradiating one area on the modeling surface CS with the light ELd. As a result, the throughput for forming and polishing the three-dimensional structure ST is improved. In other words, the modeling system 1d of the fourth modification example can improve the throughput for forming the polished three-dimensional structure ST while enjoying the same effects as those that can be enjoyed by the modeling system 1 described above.

[0206] However, even if the modeling device 4d includes the polishing head 41d separate from the modeling head 41, the modeling system 1d may perform the polishing operation after the three-dimensional structure ST is formed by the modeling operation. Even in this case, the modeling system 1d of the fourth modified example can still obtain the same effects as those that the modeling system 1 described above can obtain.

[0207] In addition, in FIG. 54, the light EL emitted by the common light source 5 is propagated to the model-forming head 41 and the polishing head 41d. However, the model-forming system 1d may include a light source 5d that emits light ELd used in the polishing operation, separate from the light source 5 that emits the light EL used in the modeling operation. The light source 5d may emit light ELd with the same characteristics (e.g., intensity, wavelength, polarization, etc.) as the light EL emitted by the light source 5d. The light source 5d may emit light ELd with different characteristics (e.g., intensity, wavelength, polarization, etc.) from the light EL emitted by the light source 5. The light source 5d may emit a different type of energy beam from the light EL emitted by the light source 5.

[0208] (6-5) Fifth Modification Next, a fifth modified example of the modeling system 1 will be described. In the above description, the modeling system 1 includes a single modeling head 41. On the other hand, the modeling system 1e of the fifth modified example includes a plurality of modeling heads 41. Specifically, the modeling system 1e differs from the modeling system 1 in that the modeling system 1e includes a modeling device 4e instead of the modeling device 4. The modeling device 4e differs from the modeling device 4 in that the modeling system 1e includes a plurality of modeling heads 41. Other components of the modeling system 1e may be the same as those of the modeling system 1. For this reason, hereinafter, the modeling device 4e of the fifth modified example will be further described with reference to FIG. 55. Note that the same components as those of the modeling system 1 will be denoted by the same reference symbols and detailed descriptions thereof will be omitted.

[0209] As shown in Fig. 55, the object-forming device 4e includes a plurality of object-forming heads 41. The plurality of object-forming heads 41 are attached to a support frame 48e so as to be aligned linearly along either the X-axis or the Y-axis (the Y-axis in the example shown in Fig. 55). The drive system 42 moves the support frame 48e along at least one of the X-axis, the Y-axis, and the Z-axis. In other words, the drive system 42 moves the plurality of object-forming heads 41 together along at least one of the X-axis, the Y-axis, and the Z-axis.

[0210] According to the modeling system 1e of the fifth modified example, the modeling surface CS can be simultaneously irradiated with a plurality of light beams EL to form a three-dimensional structure ST. As a result, the throughput for forming the three-dimensional structure ST is improved. In other words, the modeling system 1e of the fifth modified example can improve the throughput for forming the three-dimensional structure ST while enjoying the same effects as those that can be enjoyed by the modeling system 1 described above.

[0211] The object-forming heads 41 do not have to be attached to the support frame 48e. In this case, the object-forming device 4e may include a plurality of drive systems 42 for moving the object-forming heads 41, respectively.

[0212] (6-6) Sixth Modification In the above description, when the height of the object from the printing surface CS is varied depending on the position of the object, the printing surface CS is a flat surface. However, the printing surface CS itself is not limited to a flat surface. In other words, the printing surface CS itself may have a different height (position in the Z-axis direction) depending on the position on the printing surface CS. For example, as shown in FIG. 56(a), the printing surface CS may be a curved surface. In this case, the height may be different depending on the position in the X-axis direction and the Y-axis direction of the object so that the upper surface of the structure layer SL#1 formed on the upper part of the curved printing surface CS is aligned with the XY plane, in other words, so that the height in the Z-axis direction of the upper surface of the structure layer SL#1 is constant regardless of the position in the X-axis direction and the Y-axis direction of the structure layer SL#1. As shown in FIG. 56(b), the printing surface CS may be uneven. In this case, the upper surface of the structure layer SL#1 printed on the uneven printing surface CS may be aligned along the XY plane. In other words, the height of the upper surface of the structure layer SL#1 in the Z-axis direction may be constant regardless of the position of the structure layer SL#1 in the X-axis direction and the Y-axis direction. As shown in FIG. 56(c), the printing surface CS may be the upper surface of the structure layer SL#1. In either case, the upper surface of the modeled object SL#1 (and further, the structure layer SL#2) may be flattened regardless of the surface shape of the printing surface CS. In this case, the upper surface of the structure layer SL#1 (and further, the structure layer SL#2) may be a predetermined curved surface.

[0213] (6-7) Seventh Modification In the above description, the height of the object from the printing surface CS is varied depending on the position of the object. However, the height of the object from the printing surface CS does not have to vary depending on the position of the object (it may be constant). For example, as shown in FIG. 57, a structural layer SL#2 having a height different from the height (size in the Z-axis direction (stacking direction)) of an already-formed structural layer SL#1 may be formed on the structural layer SL#1. In this case, it is possible to increase the accuracy of the height in the stacking direction (Z-axis direction) of the three-dimensional structure ST that is finally formed.

[0214] (6-8) Eighth Modification The supplying material nozzle 412 that supplies the modeling material M may continue to supply the modeling material M during a period (hereinafter referred to as a first period) from a state in which the supply area MA is located at a position outside the workpiece W to a state in which the supply area MA is located at a modeling start position SP on the workpiece W, and ultimately on the modeling surface CS. If it takes a long time from the time when the supply of the modeling material M from the material nozzle 412 starts to the time when the supply amount per unit time is stabilized, the supply amount per unit time at the modeling start position SP can be stabilized.

[0215] At this time, the modeling material MA may collide with the modeling surface CS from the material nozzle 412, damaging the modeling surface CS. In this case, as shown in FIG. 58(a), the gas ejection device 461 described in FIG. 8 may be provided. Then, in the first period, gas may be ejected from the gas ejection device 461 in a direction crossing the supply path of the modeling material M, so that the modeling material M that would otherwise be directed from the material nozzle 412 to the supply area MA may be directed toward the outside of the workpiece W and, ultimately, the modeling surface CS. Then, as shown in FIG. 58(b), in a period after the supply area MA by the material nozzle 412 is positioned at the modeling start position SP (hereinafter, referred to as a second period), the gas ejection operation of the gas ejection device 461 may be stopped, and the supply of the modeling material M from the material nozzle 412 to the supply area MA may be started. Here, the irradiation of the light EL to the irradiation area EA by the irradiation optical system 411 may be started from the point in time when the supply area MA by the material nozzle 412 is positioned at the modeling start position SP.

[0216] The supply amount of the modeling material M per unit time in the first period can be made smaller than the supply amount of the modeling material M per unit time in the second period in which the model is being formed. In the above description, the gas ejection device 461 is used to direct the modeling material M, which would otherwise be directed from the material nozzle 412 to the supply area MA, toward the outside of the workpiece W and the modeling surface CS. However, the shielding member 462 described with reference to FIG. 9 may be used, and the supply direction (spray direction) of the supply nozzle 412 described with reference to FIG. 10 may be changed. In addition, when the modeling apparatus 4 is equipped with an arbitrary supply amount change device other than the gas ejection device 461 and the shielding member 462, the control device 7 may control the arbitrary supply amount change device to control the supply rate of the modeling material M. In addition, the arbitrary supply amount change device may be a supply amount change device 3a provided in the material supply device 3 as shown in FIG. 59, or may be a supply amount adjustment device 481 provided in a supply path from the material supply device 3 to the supply outlet 414 of the material nozzle 412 as shown in FIG. 60. For example, a valve capable of changing the passing flow rate may be used as such supply amount change devices 3a and 481. The supply amount change devices 3a and 481 shown in Fig. 59 and Fig. 60, respectively, can be used as any supply amount change device different from the gas ejection device 461 and the shielding member 462 described with reference to Fig. 8 and Fig. 9.

[0217] (6-9) 9th Variation In the example described with reference to FIG. 30, when focusing on one movement of the irradiation area EA along the Y-axis direction (that is, the movement until the movement direction changes, that is, the movement along one scanning line in the raster scan), the light EL is irradiated at the timing when the mark formation area and the irradiation area EA overlap during the movement of the irradiation area EA along the Y-axis direction, and the height of the object formed by that one movement (furthermore, the irradiation of the light EL multiple times performed during that one movement) is the same. However, when the light EL is irradiated multiple times during the movement of the irradiation area EA in a predetermined direction (for example, a direction in the printing surface CS such as the Y-axis direction or the X-axis direction) to form multiple objects arranged in a predetermined direction, the heights of those objects (heights from the printing surface CS in the Z-axis direction) may be different from each other. For example, in FIG. 61(a), at least one of the supply rate of the printing material M, the heat transfer rate, and the moving speed of the irradiation area EA may be different for the area WA9 and the area WA10 arranged along the same scanning line of the raster scan. This operation makes it possible to form objects having different heights from the printing surface CS in the Z-axis direction, as shown in FIG. 61(b), for example.

[0218] In the above example, the heights of the multiple objects formed by one movement of the irradiation area EA (i.e., movement along one scanning line in the raster scan) are changed from one another, but the heights (heights from the printing surface CS in the Z-axis direction) of the multiple objects formed by movement of the irradiation area EA along different scanning lines (and further, supply of the printing material M during the movement) in the raster scan in which the irradiation area EA is moved along multiple scanning lines may be changed. For example, as shown in Fig. 62(a), at least one of the supply rate of the printing material M, the heat transfer rate, and the moving speed of the irradiation area EA may be made different for the areas WA9 and WA11 arranged on different scanning lines. By this operation, it is possible to form objects having different heights from the printing surface CS in the Z-axis direction, as shown in Fig. 62(b), for example.

[0219] In the ninth modified example, the marking operation on the printing surface CS has been taken as an example, but this ninth modified example can also be applied to cases where the printing surface CS itself is the surface of an object produced by layered manufacturing.

[0220] (6-10) Other variations In the above description, the modeling apparatus 4 melts the modeling material M by irradiating the modeling material M with light EL. However, the modeling apparatus 4 may irradiate the modeling material M with an arbitrary energy beam to form a molten pool MP and melt the modeling material M in the molten pool MP. In this case, the modeling apparatus 4 may include a beam irradiation device capable of irradiating an arbitrary energy beam in addition to or instead of the irradiation optical system 411. The arbitrary energy beam includes, but is not limited to, a charged particle beam such as an electron beam or an ion beam, or an electromagnetic wave.

[0221] In the above description, the modeling system 1 can form the three-dimensional structure ST by the laser build-up welding method. However, the modeling system 1 may form the three-dimensional structure ST from the modeling material M by other methods capable of forming the three-dimensional structure ST by irradiating the modeling material M with light EL (or any laser beam). Examples of other methods include powder bed fusion such as selective laser sintering (SLS), binder jetting, or laser metal fusion (LMF).

[0222] At least a part of the components of each of the above-mentioned embodiments can be appropriately combined with at least a part of other components of each of the above-mentioned embodiments. Some of the components of each of the above-mentioned embodiments may not be used. In addition, to the extent permitted by law, the disclosures of all publications and U.S. patents cited in each of the above-mentioned embodiments are incorporated by reference into the present description.

[0223] The present invention is not limited to the above-described embodiments, but can be modified as appropriate within the scope that does not contradict the gist or idea of ​​the invention that can be read from the claims and the entire specification, and processing devices, processing methods, marking methods, modeling systems, modeling methods, computer programs, recording media, and control devices that involve such modifications are also included in the technical scope of the present invention. [Explanation of symbols]

[0224] 1 Modeling system 3 Material supply device 4 Modeling equipment 41 Sculpted Head 411 Irradiation optical system 412 Material nozzle 42 Drive system 43 Stages 5 light source Double work M Build material SL structure layer CS printing surface EA irradiation area MA supply area MP molten pool

Claims

1. a modeling apparatus that performs a modeling process to form a model by irradiating an object with an energy beam by an irradiation system and supplying the modeling material to an irradiation area of ​​the energy beam by a supply system; A change device capable of changing the relative position between the energy beam and the object; Equipped with A condition of the forming process performed on a first region of the object is made different from a condition of the forming process performed on a second region of the object. Molding system.

2. By varying the conditions, a difference between a characteristic of the object formed in the first region and a characteristic of the object formed in the second region is reduced. The molding system of claim 1 .

3. In the first region, the modeling process is performed a plurality of times in a state in which the first region coincides with at least a part of the irradiation region, In the second region, the modeling process is performed a number of times less than the number of times the modeling process is performed in the first region, in a state in which the second region coincides with at least a part of the irradiation region. The molding system according to claim 1 or 2.

4. The illumination area is set a plurality of times in the first area, The number of times that the illumination area is set in the second area is smaller than the number of times that the illumination area is set in the first area. The molding system according to claim 1 .

5. a control device that performs control to make different conditions for the forming process performed on a first region of the object and conditions for the forming process performed on a second region of the object. The molding system according to any one of claims 1 to 4.

6. a modeling apparatus that performs a modeling process to form a model by irradiating an object with an energy beam by an irradiation system and supplying the modeling material to an irradiation area of ​​the energy beam by a supply system; A change device capable of changing the relative position between the energy beam and the object; Equipped with A condition of the modeling process performed on a first region of the object in which the irradiation region is set a plurality of times is made different from a condition of the modeling process performed on a second region of the object in which the irradiation region is set a smaller number of times than the number of times the irradiation region is set on the first region. Molding system.

7. A condition of the formation process performed on the first region at a first timing is the same as a condition of the formation process performed on the first region at a second timing different from the first timing, and a condition of the formation process performed on the first region at each of the first and second timings is different from a condition of the formation process performed on the second region. The molding system according to any one of claims 3 to 6.

8. The conditions of the modeling process include a supply amount of the modeling material to the irradiation area. The molding system according to any one of claims 1 to 7.

9. The supply amount when the modeling process is performed on the first region is smaller than the supply amount when the modeling process is performed on the second region. The molding system of claim 8 .

10. The sum of the supply amounts when the printing area is set in the first area a plurality of times is equal to the supply amount when the printing area is set in the second area. The molding system according to claim 8 or 9.

11. The conditions of the modeling process include an amount of heat transferred from the energy beam to a region of the object where the irradiation region is set. The molding system according to any one of claims 1 to 10.

12. The amount of transmission when the printing region is set in the first region is smaller than the amount of transmission when the printing region is set in the second region. The molding system of claim 11 .

13. The sum of the transmission amounts when the printing region is set in the first region a plurality of times is equal to the transmission amount when the printing region is set in the second region. The molding system according to claim 11 or 12.

14. The conditions of the modeling process include a relative moving speed between the irradiation area and the object. The molding system according to any one of claims 1 to 13.

15. The moving speed when performing the modeling process on the first region is faster than the moving speed when performing the modeling process on the second region. The molding system of claim 14.

16. A condition of the formation process performed on the first region at a first timing is different from a condition of the formation process performed on the first region at a second timing different from the first timing. The molding system according to any one of claims 3 to 6.

17. A condition of the formation process performed on the first region at the first timing is the same as a condition of the formation process performed on the second region, and the formation process is not performed on the first region at the second timing. The molding system of claim 16.

18. The conditions of the modeling process include a supply amount of the modeling material to the irradiation area.

18. The molding system according to claim 16 or 17.

19. The supply amount when the modeling process is performed on the first region at the second timing is less than the supply amount when the modeling process is performed on the first region at the first timing. The molding system of claim 18.

20. The supply amount when the modeling process is performed on the first region at the first timing is the same as the supply amount when the modeling process is performed on the second region, and the supply amount when the modeling process is performed on the first region at the second timing is zero.

20. The molding system according to claim 18 or 19.

21. The sum of the supply amounts when the irradiation area is set in the first area a plurality of times is equal to the supply amount when the modeling process is performed in the second area.

21. The molding system of any one of claims 18 to 20.

22. The conditions of the modeling process include an amount of heat transferred from the energy beam to a region of the object where the irradiation region is set.

22. The molding system of claims 16 to 21.

23. The transmission amount when the modeling process is performed on the first region at the second timing is smaller than the transmission amount when the modeling process is performed on the first region at the first timing.

23. The molding system of claim 22.

24. The transmission amount when the modeling process is performed on the first region at the first timing is the same as the transmission amount when the modeling process is performed on the second region, and the transmission amount when the modeling process is performed on the first region at the second timing is zero.

24. The molding system according to claim 22 or 23.

25. The sum of the transmission amounts when the irradiation area is set in the first area a plurality of times is the same as the transmission amount when the modeling process is performed in the second area.

25. The molding system of any one of claims 22 to 24.

26. The conditions of the modeling process include a relative moving speed between the irradiation area and the object.

26. The molding system of any one of claims 16 to 25.

27. The moving speed when the modeling process is performed on the first region at the second timing is different from the moving speed when the modeling process is performed on the first region at the first timing.

27. The molding system of claim 26.

28. performing the modeling process while moving the irradiation area along a predetermined surface of the object, thereby forming a layered structure that is an assembly of the objects on the surface; the first region includes a region in which the irradiation region is set a plurality of times during a first period in which the layer structure is formed, The second region includes a region in which the number of times the illumination region is set during the first period is less than the number of times the illumination region is set in the first region during the first period.

28. The molding system of any one of claims 1 to 27.

29. After the layer structure is formed, the modeling process is performed while moving the irradiation area along a surface of the layer structure, thereby forming a layered structure in which a plurality of the layer structures are stacked; the first region includes a region in which the irradiation region is set a plurality of times during a second period in which one of the plurality of layered structures is formed, The second region includes a region in which the number of times the illumination region is set during the second period is less than the number of times the illumination region is set in the first region during the second period.

30. The molding system of claim 28.

30. The first region has a different heat transfer characteristic from the energy beam than the second region has a different heat transfer characteristic from the energy beam.

30. The molding system of any one of claims 1 to 29.

31. The rate of heat transfer from the energy beam in the first region is greater than the rate of heat transfer from the energy beam in the second region. The molding system of claim 30.

32. The diffusion characteristics of the heat transferred from the energy beam to the first region are different from the diffusion characteristics of the heat transferred from the energy beam to the second region.

32. The molding system of any one of claims 1 to 31.

33. Heat transferred from the energy beam to the first region is less likely to diffuse than heat transferred from the energy beam to the second region.

32. The molding system of claim 31.

34. the illumination area is at least a portion of a surface of the object, The first region includes a region closer to another surface of the object on which the illumination region is not set than the second region.

34. The molding system of any one of claims 1 to 33.

35. A control device is provided that performs control to make different conditions for the modeling process performed on a first region of the object in which the irradiation region is set a plurality of times from conditions for the modeling process performed on a second region of the object in which the irradiation region is set a smaller number of times than the number of times the irradiation region is set on the first region.

35. The molding system of any one of claims 1 to 34.

36. a modeling apparatus that performs modeling processing by growing a model in a direction in which a relative position between the energy beam and the object is changed by supplying the modeling material to an irradiation area of ​​the energy beam using a supply system while irradiating the object with an energy beam using an irradiation system; A change device capable of changing the relative position between the energy beam and the object; Equipped with When a relative positional relationship between the energy beam and the object when performing the modeling process at a second timing becomes the same as a relative positional relationship between the energy beam and the object when performing the modeling process at a first timing, a condition of the modeling process at the second timing is changed from a condition of the modeling process at the first timing. Molding system.

37. The conditions of the modeling process include a supply amount of the modeling material to the irradiation area.

37. The molding system of any one of claims 1 to 36.

38. The conditions of the modeling process include an amount of heat transferred from the energy beam to a region of the object where the irradiation region is set.

38. The molding system of any one of claims 1 to 37.

39. The conditions of the modeling process include a relative moving speed of the irradiation region with respect to the object.

39. The molding system of any one of claims 1 to 38.

40. The supply system is controlled to control the supply amount.

38. The molding system of any one of claims 8 to 10, 18 to 21 and 37.

41. The supply amount is controlled by controlling the amount of the modeling material supplied by the supply system.

41. The molding system of claim 40.

42. The supply amount of the modeling material is controlled by controlling a supply direction of the modeling material from the supply system.

42. The molding system of claim 40 or 41.

43. The supply system includes a supply nozzle that supplies the modeling material in a desired direction; The supply direction is controlled by controlling the orientation of the supply nozzle.

43. The molding system of claim 42.

44. a supply suppression device that suppresses at least a portion of the modeling material supplied from the supply system from reaching the modeling region, 44. The molding system of any one of claims 1 to 43.

45. The supply suppression device includes at least one of a first device that blows gas onto at least a portion of the modeling material supplied from the supply system to blow it away, and a second device that is removably arranged between the supply system and the irradiation area and includes a shielding member that blocks the modeling material.

45. The molding system of claim 44.

46. Controlling the amount of transmission by controlling a characteristic of the energy beam 39. The molding system of any one of claims 11 to 13, 22 to 25 and 38.

47. The conditions of the fabrication process include the characteristics of the energy beam.

47. The molding system of any one of claims 1 to 46.

48. The characteristics of the energy beam include at least one of the intensity or energy amount per unit area of ​​the energy beam, the focus position of the energy beam, the defocus amount of the energy beam, and the intensity distribution of the energy beam.

48. The molding system of claim 46 or 47.

49. The illumination system illuminates the energy beam from an energy beam source; Controlling the energy beam source to control a characteristic of the energy beam 49. The molding system of any one of claims 46 to 48.

50. The irradiation system irradiates the energy beam through an optical system, Controlling the optical system to control the characteristics of the energy beam 50. The molding system of any one of claims 46 to 49.

51. The optical system includes at least one of a focusing optical element that focuses the energy beam, and a blocking element that is disposed in an optical path of the energy beam so as to be able to at least partially block the energy beam.

51. The molding system of claim 50.

52. The movement mode of the irradiation system is controlled to control the characteristics of the energy beam.

52. The molding system of any one of claims 46 to 51.

53. The characteristics of the object include a height from a surface of the object and a size of the object in a direction along the surface of the object.

53. The molding system of any one of claims 2 to 52.

54. The height from the surface of the object in the first region is greater than the height from the surface of the object in the second region.

54. The molding system of claim 53.

55. A size of the object in the first region in a direction along the surface of the object is smaller than a size of the object in the second region in a direction along the surface of the object.

55. The molding system of claim 53 or 54.

56. The illumination system emits the energy beam through an optical system; forming a layered structure by stacking a plurality of layered structures that are an assembly of the shaped objects; The focal depth of the optical system is greater than the thickness of one layer of the layered structure and smaller than the thickness of two layers.

56. The molding system of any one of claims 1 to 55.

57. The second region is the same region as the first region.

57. The molding system of any one of claims 1 to 56.

58. The second region is different from the first region.

57. The molding system of any one of claims 1 to 56.

59. When a relative positional relationship between the energy beam and the object when performing the modeling process at the second timing becomes the same as a relative positional relationship between the energy beam and the object when performing the modeling process at the first timing, a control is performed to change a condition of the modeling process at the second timing from a condition of the modeling process at the first timing.

59. The molding system according to any one of claims 36 to 58.

60. a modeling apparatus that performs a modeling process to form a layered structure in which a plurality of layer structures are stacked by irradiating an object with an energy beam via an optical system and supplying the modeling material to an irradiation area of ​​the energy beam by a supply system; A change device capable of changing the relative position between the energy beam and the object; Equipped with The focal depth of the optical system is equal to or greater than the thickness of one layer of the layered structure and smaller than the thickness of two layers. Molding system.

61. The focus position of the energy beam is set on the surface of the object or on the object plane side of the optical system relative to the surface of the object.

61. The molding system of any one of claims 58 to 60.

62. The smaller the focal depth, the closer the focus position is to the object plane side.

59. The molding system of claim 58.

63. The distance between the boundary surface of the range of the depth of focus on the object surface side of the optical system and the surface of the object is equal to or greater than the thickness of one layer of the layered structure.

60. The molding system of any one of claims 58 to 59.

64. The range of the depth of focus is larger than the thickness of one layer of the layered structure, and the position of the boundary of the range of the depth of focus in a direction intersecting the object is set within the range of another layer in which the one layer is stacked.

64. The molding system of claim 63.

65. After a first period in which the relative position between the irradiation area of ​​the energy beam and the object is changed in a first direction, the relative position between the irradiation area of ​​the energy beam and the object is changed in a second direction intersecting the first direction, and then, in a second period, the relative position between the irradiation area of ​​the energy beam and the object is changed in a direction parallel to the first direction, and the modeling process is performed in at least a part of at least one of the first period and the second period.

65. The molding system of any one of claims 1 to 64.

66. a modeling apparatus that performs a modeling process to form a model by irradiating an irradiation area on an object with an energy beam using an irradiation system while supplying the modeling material to the irradiation area using a supply system; A change device capable of changing a relative position between the energy beam and the object; Equipped with After a first period in which the relative position between the irradiation area of ​​the energy beam and the object is set in a first direction, the relative position between the irradiation area of ​​the energy beam and the object is changed in a second direction intersecting the first direction, and then, in a second period, the relative position between the irradiation area of ​​the energy beam and the object is changed in a direction parallel to the first direction, and the modeling process is performed in at least a part of at least one of the first period and the second period. Molding system.

67. A direction of relative movement between the irradiation area and the object in the first period is opposite to a direction of relative movement between the irradiation area and the object in the second period.

67. The molding system of claim 65 or 66.

68. A relative moving distance between the irradiation area and the object during the first period is substantially the same as a relative moving distance between the irradiation area and the object during the second period.

68. The molding system of any one of claims 65 to 67.

69. Controlling the modifying device so that the irradiation area of ​​the energy beam is raster scanned on the building surface of the object.

69. The molding system of any one of claims 65 to 68.

70. a control device for changing the relative position between the irradiation area of ​​the energy beam and the object in a second direction intersecting the first direction after a first period in which the relative position between the irradiation area of ​​the energy beam and the object is set in a first direction, and then changing the relative position between the irradiation area of ​​the energy beam and the object in a direction parallel to the first direction in a second period, and performing the modeling process in at least a part of at least one of the first period and the second period; 70. The molding system according to any one of claims 66 to 69.

71. performing a modeling process for forming a model by irradiating an energy beam onto an object and supplying a modeling material to an area irradiated with the energy beam; changing a relative position between an irradiation area of ​​the energy beam and the object; making conditions of the forming process performed on a first region of the object different from conditions of the forming process performed on a second region of the object; A molding method comprising:

72. performing a modeling process for forming a model by irradiating an energy beam onto an object and supplying a modeling material to an area irradiated with the energy beam; changing a relative position between an irradiation area of ​​the energy beam and the object; A condition of the modeling process performed on a first region of the object in which the irradiation region is set a plurality of times is different from a condition of the modeling process performed on a second region of the object in which the irradiation region is set a smaller number of times than the number of times the irradiation region is set on the first region. A molding method comprising:

73. By varying the conditions, a difference between a characteristic of the object formed in the first region and a characteristic of the object formed in the second region is reduced.

73. The method of claim 71 or 72, comprising:

74. performing a modeling process for forming a model by irradiating an energy beam onto an object and supplying a modeling material to an area irradiated with the energy beam; changing a relative position between an irradiation area of ​​the energy beam and the object; changing a condition of the formation process at the second timing from a condition of the formation process at the first timing when a relative positional relationship between the energy beam and the object when performing the formation process at a second timing becomes the same as a relative positional relationship between the energy beam and the object when performing the formation process at a first timing; A molding method comprising:

75. Irradiating an object with an energy beam; providing a build material to the object; performing a modeling process for forming a layered structure in which a plurality of layer structures are stacked by irradiating the object with the energy beam and supplying the modeling material to an area irradiated with the energy beam; Including, The method of irradiating the energy beam includes irradiating the energy beam through an optical system having a focal depth greater than the thickness of one layer and less than the thickness of two layers of the layered structure.

76. A computer program causing a computer to execute the modeling method according to any one of claims 71 to 75.

77. A computer program to be executed by a computer that controls a modeling system including: a modeling device that performs a modeling process to form a model by irradiating an object with an energy beam by an irradiation system while supplying the modeling material to an irradiation area of ​​the energy beam by a supply system; and a change device that can change a relative position between the energy beam and the object, A computer program that causes a computer to execute a process of differentiating conditions of the forming process performed on a first region of the object from conditions of the forming process performed on a second region of the object.

78. A computer program to be executed by a computer that controls a modeling system including: a modeling device that performs a modeling process to form a model by irradiating an object with an energy beam by an irradiation system while supplying the modeling material to an irradiation area of ​​the energy beam by a supply system; and a change device that can change a relative position between the energy beam and the object, A computer program that causes a computer to execute a process of differentiating conditions of the modeling process performed on a first region of the object, in which the irradiation region is set multiple times, from conditions of the modeling process performed on a second region of the object, in which the irradiation region is set a number of times less than the number of times the irradiation region is set on the first region.

79. A computer program to be executed by a computer that controls a modeling system including a modeling device that performs modeling processing by growing a model in a direction in which a relative position between the energy beam and the object is changed by irradiating an object with an energy beam by an irradiation system and supplying the modeling material to an irradiation area of ​​the energy beam by a supply system, and a change device that is capable of changing the relative position between the energy beam and the object, A computer program that causes a computer to execute a process of changing the conditions of the modeling process at the second timing from the conditions of the modeling process at the first timing when the relative positional relationship between the energy beam and the object when performing the modeling process at the second timing becomes the same as the relative positional relationship between the energy beam and the object when performing the modeling process at the first timing.

80. A computer program to be executed by a computer that controls a modeling system including a modeling device that performs a modeling process to form a layered structure in which a plurality of layered structures are stacked by irradiating an object with an energy beam via an optical system using an irradiation system and supplying the modeling material to an irradiation area of ​​the energy beam using a supply system, and a change device that can change a relative position between the energy beam and the object, A computer program that causes a computer to execute a process for making the focal depth of the optical system greater than the thickness of one layer of the layered structure and smaller than the thickness of two layers.

81. A computer program to be executed by a computer that controls a modeling system including: a modeling device that performs a modeling process to form a model by irradiating an irradiation area on an object with an energy beam by an irradiation system while supplying the modeling material to the irradiation area by a supply system; and a change device that can change a relative position between the energy beam and the object, A computer program that causes a computer to execute a process of changing the relative position between the energy beam irradiation area and the object in a second direction intersecting the first direction after a first period in which the relative position between the energy beam irradiation area and the object is set in a first direction, and then changing the relative position between the energy beam irradiation area and the object in a direction parallel to the first direction in a second period, and performing the modeling process in at least a part of at least one of the first period and the second period.

82. A recording medium having the computer program according to any one of claims 76 to 81 recorded thereon.

83. a modeling apparatus that performs a modeling process to form a model by irradiating an object with an energy beam by an irradiation system and supplying the modeling material to an irradiation area of ​​the energy beam by a supply system; A change device capable of changing a relative position between the energy beam and the object; a receiving device that receives a control signal to control the modeling device and the change device so as to make conditions of the modeling process performed on a first region of the object different from conditions of the modeling process performed on a second region of the object; A molding system comprising:

84. a modeling apparatus that performs a modeling process to form a model by irradiating an object with an energy beam by an irradiation system and supplying the modeling material to an irradiation area of ​​the energy beam by a supply system; A change device capable of changing a relative position between the energy beam and the object; a receiving device that receives a control signal for controlling the modeling device and the change device so as to make different conditions for the modeling process performed on a first region of the object in which the irradiation region is set a plurality of times from conditions for the modeling process performed on a second region of the object in which the irradiation region is set a number of times less than the number of times the irradiation region is set on the first region; A molding system comprising:

85. a modeling apparatus that performs modeling processing by growing a model in a direction in which a relative position between the energy beam and the object is changed by supplying the modeling material to an irradiation area of ​​the energy beam using a supply system while irradiating the object with an energy beam using an irradiation system; A change device capable of changing a relative position between the energy beam and the object; a receiving device that receives a control signal to control the modeling device and the change device so as to change conditions of the modeling process at the second timing to conditions of the modeling process at the first timing when a relative positional relationship between the energy beam and the object when performing the modeling process at a second timing becomes the same as a relative positional relationship between the energy beam and the object when performing the modeling process at a first timing; A molding system comprising:

86. a modeling apparatus that performs a modeling process to form a layered structure in which a plurality of layer structures are stacked by irradiating an object with an energy beam via an optical system using an irradiation system and supplying the modeling material to an irradiation area of ​​the energy beam using a supply system; A change device capable of changing a relative position between the energy beam and the object; a receiving device that receives a control signal for controlling the modeling device and the changing device so that the focal depth of the optical system is greater than a thickness of one layer of the layered structure and smaller than a thickness of two layers; A molding system comprising:

87. a modeling apparatus that performs a modeling process to form a model by irradiating an irradiation area on an object with an energy beam using an irradiation system while supplying the modeling material to the irradiation area using a supply system; A change device capable of changing a relative position between the energy beam and the object; a receiving device that receives a control signal for controlling the modeling device and the changing device so that, after a first period in which a relative position between the irradiation area of ​​the energy beam and the object is set in a first direction, the relative position between the irradiation area of ​​the energy beam and the object is changed in a second direction intersecting the first direction, and then, in a second period, the relative position between the irradiation area of ​​the energy beam and the object is changed in a direction parallel to the first direction, and the modeling process is performed in at least a part of at least one of the first period and the second period; A molding system comprising:

88. A control device for controlling a modeling system including: a modeling device that performs a modeling process to form a model by irradiating an object with an energy beam by an irradiation system while supplying the modeling material to an irradiation area of ​​the energy beam by a supply system; and a change device that can change a relative position between the energy beam and the object, a control device that performs processing to make different conditions for the forming process performed on a first region of the object and conditions for the forming process performed on a second region of the object.

89. A control device for controlling a modeling system including: a modeling device that performs a modeling process to form a model by irradiating an object with an energy beam by an irradiation system while supplying the modeling material to an irradiation area of ​​the energy beam by a supply system; and a change device that can change a relative position between the energy beam and the object, A control device that performs processing to make different the conditions of the molding process performed on a first region of the object, in which the irradiation region is set multiple times, and the conditions of the molding process performed on a second region of the object, in which the irradiation region is set a number of times less than the number of times the irradiation region is set on the first region.

90. A control device for controlling a modeling system including a modeling device that performs a modeling process by growing a model in a direction in which a relative position between the energy beam and the object is changed by irradiating an object with an energy beam by an irradiation system and supplying the modeling material to an irradiation area of ​​the energy beam by a supply system, and a change device that is capable of changing the relative position between the energy beam and the object, A control device that performs a process of changing the conditions of the molding process at the second timing from the conditions of the molding process at the first timing when the relative positional relationship between the energy beam and the object when performing the molding process at a second timing becomes the same as the relative positional relationship between the energy beam and the object when performing the molding process at a first timing.

91. A control device for controlling a modeling system including: a modeling device that performs a modeling process to form a layered structure in which a plurality of layered structures are stacked by irradiating an object with an energy beam via an optical system using an irradiation system and supplying the modeling material to an irradiation area of ​​the energy beam using a supply system; and a change device that can change a relative position between the energy beam and the object, A control device that performs processing to set the focal depth of the optical system to be greater than the thickness of one layer of the layered structure and smaller than the thickness of two layers.

92. A control device for controlling a modeling system including: a modeling device that performs a modeling process to form a model by irradiating an irradiation area on an object with an energy beam by an irradiation system while supplying the modeling material to the irradiation area by a supply system; and a change device that can change a relative position between the energy beam and the object, A control device that, after a first period in which the relative position between the energy beam irradiation area and the object is set in a first direction, changes the relative position between the energy beam irradiation area and the object in a second direction intersecting the first direction, and then, in a second period, changes the relative position between the energy beam irradiation area and the object in a direction parallel to the first direction, and performs the modeling process for at least a part of at least one of the first period and the second period.

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