Multilayer electronic component

Abstract

To provide a multilayer ceramic capacitor (MLCC) to improve capacitance per unit volume without deteriorating reliability.SOLUTION: An MLCC includes: a body including a dielectric layer 111, and a first internal electrode layer 120a and a second internal electrode layer 120b alternately disposed in a first direction with the dielectric layer interposed therebetween; a first external electrode disposed on one surface of two surfaces of the body opposing each other in a second direction perpendicular to the first direction; and a second external electrode disposed on the other surface of the two surfaces of the body opposing each other. The first internal electrode layer includes a first internal electrode 121 connected to the first external electrode, and disposed to be spaced apart from each other in a third direction perpendicular to the first direction and the second direction, and the second internal electrode layer includes a second internal electrode 122 connected to the second external electrode and disposed to be spaced apart from each other in the third direction. When a shortest distance between the first internal electrode and a second internal electrode closest to the first internal electrode is defined as a, and a maximum size of the first internal electrode in the first direction is defined as te, 0.01≤(a / te)≤1.37 is satisfied.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multi-layered ceramic capacitors (MLCCs), which are one type of multi-layered electronic component, are chip-type capacitors that are mounted on printed circuit boards of various electronic products such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, mobile phones, and infotainment systems, and serve to charge and discharge electricity.

[0003] As electronic products become smaller, slimmer, and more multifunctional, there is a demand for smaller chip components, and the packaging of electronic components is becoming more highly integrated. In response to this trend, the space between the mounted electronic components is being minimized.

[0004] For an MLCC to have high capacitance, it may be necessary to use a material with a high dielectric constant as the material for the dielectric layer or to design the dielectric layer to have a reduced thickness. However, MLCCs have many other characteristics to satisfy simultaneously, such as temperature characteristics, voltage characteristics, and moisture resistance reliability in addition to capacitance, and there is a limit to how much the dielectric layer can be reduced in thickness.

[0005] Therefore, there is a need for structural improvements in MLCCs that can increase the capacitance per unit volume without reducing reliability. Summary of the Invention [Problem to be solved by the invention]

[0006] One of the various objects of the present invention is to improve the capacitance per unit volume of a multilayer electronic component.

[0007] One of the various objects of the present invention is to increase the capacitance per unit volume of a multilayer electronic component without decreasing reliability.

[0008] However, the object of the present invention is not limited to the above-mentioned contents, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0009] According to an embodiment of the present invention, there is provided a multilayer electronic component comprising: a body including a dielectric layer, first internal electrode layers and second internal electrode layers alternately arranged in a first direction with the dielectric layer sandwiched therebetween; a first external electrode arranged on one surface of the body facing a second direction perpendicular to the first direction; and a second external electrode arranged on the other surface of the body facing the second direction, wherein the first internal electrode layer includes first internal electrodes connected to the first external electrodes and spaced apart from each other in a third direction perpendicular to the first direction and the second direction; and the second internal electrode layer includes second internal electrodes connected to the second external electrodes and spaced apart from each other in the third direction, where a is a shortest distance between the first internal electrode and a second internal electrode closest to the first internal electrode, and te is a maximum size of the first internal electrode in the first direction, and 0.01≦(a / te)≦1.37 is satisfied. Effect of the Invention

[0010] One of the many advantages of the present invention is that it improves the integration of the electric field, thereby increasing capacitance per unit volume.

[0011] One of the various advantages of the present invention is that the capacitance per unit volume is improved without reducing reliability in an internal electrode structure for improving the density of the electric field.

[0012] However, the various and beneficial advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief description of the drawings]

[0013] [Figure 1] 1 is a perspective view showing a schematic configuration of a multilayer electronic component according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a perspective view showing a main body according to an embodiment; [Diagram 3] 11A and 11B are cross-sectional views showing cross sections in the first and third directions of a multilayer electronic component according to a comparative example, the multilayer electronic component being polished up to the center in the second direction. [Figure 4] 2 is a cross-sectional view taken along the line II' of FIG. [Diagram 5] FIG. 5 is an enlarged view of region P in FIG. [Figure 6] FIG. 4 is a plan view showing an internal electrode layer according to an embodiment. [Figure 7] 4A to 4C are cross-sectional views showing first and third cross sections of a capacitance forming portion according to an embodiment of the present invention. [Figure 8] FIG. 1A is a schematic diagram showing the direction of the electric field flux between internal electrodes in a multilayer electronic component according to a comparative example, and FIG. 1B is a schematic diagram showing the direction of the electric field flux between internal electrodes in a multilayer electronic component according to an embodiment. [Figure 9] FIG. 1A is a schematic diagram showing the number of electric field fluxes between internal electrodes of a multilayer electronic component according to a comparative example, and FIG. 1B is a schematic diagram showing the number of electric field fluxes between internal electrodes in a multilayer electronic component according to an embodiment. [Figure 10] 10 is a schematic diagram showing a difference in integration density depending on the radius of the internal electrodes and the distance between the internal electrodes in the comparative example and the example. FIG. [Figure 11] 11 is a graph showing a volume reduction trend of a multilayer electronic component by integrating the calculation results in FIG. 10 . [Figure 12] 4 is a perspective view showing a part of a process of laminating internal electrode layers and dielectric layers according to an embodiment; FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, the embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to ordinary skilled artisans. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0015] In order to clearly explain the present invention in the drawings, parts that are not relevant to the explanation are omitted, and the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited to those shown in the drawings. Also, components having the same function within the same concept will be described using the same reference numerals. Furthermore, throughout the specification, when a part "includes" a certain component, this does not mean that other components are excluded, but that the part may further include other components, unless otherwise specified to the contrary.

[0016] 1 is a perspective view showing a multilayer electronic component according to an embodiment of the present invention, FIG. 2 is a perspective view showing a main body according to an embodiment, FIG. 3 is a cross-sectional view showing a first direction and a third direction cross-section of a multilayer electronic component according to a comparative example, polished to the center in the second direction, FIG. 4 is a cross-sectional view taken along line I-I' in FIG. 1, FIG. 5 is an enlarged view of region P in FIG. 4, FIG. 6 is a plan view showing an internal electrode layer according to an embodiment, FIG. 7 is a cross-sectional view showing a first direction and a third direction cross-section of a capacitance forming portion according to an embodiment, FIG. 8(a) is a schematic diagram showing the direction of an electric field flux between internal electrodes in a multilayer electronic component according to a comparative example, and FIG. 8(b) is a schematic diagram showing a first direction cross-section of a capacitance forming portion according to an embodiment, 9(a) is a schematic diagram showing the direction of the electric field flux between the internal electrodes in a multilayer electronic component according to an embodiment, FIG. 9(b) is a schematic diagram showing the number of electric field fluxes between the internal electrodes in a multilayer electronic component according to a comparative example, FIG. 10 is a schematic diagram showing the difference in integration density due to the radius of the internal electrodes and the spacing between the internal electrodes in the comparative example and the embodiment, FIG. 11 is a graph showing the volume reduction trend of the multilayer electronic component by combining the calculation results of FIG. 10, and FIG. 12 is a perspective view showing a part of the process of stacking internal electrodes and dielectric layers according to one embodiment.

[0017] In the drawings, a first direction may be defined as a direction in which first and second internal electrodes are alternately arranged with a dielectric layer therebetween or a thickness T direction, and among second and third directions perpendicular to the first direction, the second direction may be defined as a length L direction and the third direction may be defined as a width W direction.

[0018] Hereinafter, a multilayer electronic component according to an embodiment of the present invention and various examples thereof will be described in detail with reference to FIGS.

[0019] A multilayer electronic component 100 according to an embodiment of the present invention includes a body 110 including a dielectric layer 111, first internal electrode layers 120a and second internal electrode layers 120b alternately arranged in a first direction with the dielectric layer sandwiched therebetween, a first external electrode 130 arranged on one surface of the body facing a second direction perpendicular to the first direction, and a second external electrode 140 arranged on the other surface of the body facing the second direction, the first internal electrode layer including a first internal electrode 121 connected to the first external electrode and spaced apart from each other in a third direction perpendicular to the first and second directions, and the second internal electrode layer including a second internal electrode 122 connected to the second external electrode and spaced apart from each other in the third direction, where 0.01≦(a / te)≦1.37 is satisfied, where a is the shortest distance between the first internal electrode and a second internal electrode closest to the first internal electrode, and te is the maximum size of the first internal electrode in the first direction.

[0020] 4, the body 110 includes a dielectric layer 111 and first and second internal electrode layers 120a and 120b alternately arranged in a first direction with the dielectric layer 111 interposed therebetween.

[0021] Although there is no particular limitation on the specific shape of the body 110, the body 110 may have a hexahedral shape or a shape similar thereto, as shown in Fig. 2. Due to shrinkage of the ceramic powder contained in the body 110 during the firing process, the body 110 may have a substantially hexahedral shape, although not a hexahedral shape with perfectly straight lines.

[0022] The main body 110 may have first and second surfaces 1, 2 facing each other in a first direction, third and fourth surfaces 3, 4 connected to the first and second surfaces 1, 2 and facing each other in the second direction, and fifth and sixth surfaces 5, 6 connected to the first and second surfaces 1, 2, connected to the third and fourth surfaces 3, 4, and facing each other in the third direction.

[0023] The plurality of dielectric layers 111 forming the body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0024] The raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate-based materials, lead composite perovskite-based materials, or strontium titanate-based materials can be used. The barium titanate-based material can include BaTiO3-based ceramic powder. Examples of the ceramic powder include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti1 - y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc. Thus, the dielectric layer 111 can contain Ba and Ti, and additionally can further contain Ca and Zr, but is not limited thereto.

[0025] Also, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to the raw material for forming the dielectric layer 111, such as powder of barium titanate (BaTiO3), according to the purpose of the present invention.

[0026] The first internal electrode layer 120a and the second internal electrode layer 120b are alternately arranged with the dielectric layer 111 in between, and thus can play a role in forming a capacitance together with the dielectric layer 111. The capacitance of the multilayer electronic component 100 can vary depending on a region where an electric field is formed between the first internal electrode 121 included in the first internal electrode layer 120a and the second internal electrode 122 included in the second internal electrode layer 120b. In the present invention, the region where an electric field is formed between the first internal electrode 121 included in the first internal electrode layer 120a and the second internal electrode 122 included in the second internal electrode layer 120b is defined as a capacitance forming portion Ac.

[0027] In one embodiment, cover portions 112 and 113 may be disposed on one surface and the other surface in the first direction of the capacitance forming portion Ac.

[0028] The cover parts 112 and 113 may be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming part Ac, respectively, and may basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0029] The cover portions 112, 113 do not include internal electrodes and may include the same material as the dielectric layer 111. That is, the cover portions 112, 113 may include a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material.

[0030] On the other hand, there is no need to particularly limit the average thickness of the covers 112 and 113. However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the average thickness tc of the covers 112 and 113 can be 15 μm or less.

[0031] The average thickness of the cover parts 112, 113 may mean the size in the first direction, and may be the average value of the size in the first direction of the cover parts 112, 113 measured at five equally spaced points on the upper or lower part of the capacitance forming part Ac.

[0032] Referring to FIG. 2, in one embodiment, margin portions 114 and 115 may be disposed on one and other surfaces of the capacitance forming portion Ac in the third direction.

[0033] The margins 114 and 115 may refer to regions between both ends of the first and second internal electrodes 121 and 122 and the boundary surface of the body 110, as shown in FIG.

[0034] The margins 114 and 115 essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0035] The margin portions 114 and 115 may be formed by applying a conductive paste to the ceramic green sheet except for the areas where the margin portions are to be formed, to form internal electrodes.

[0036] In addition, in order to suppress steps caused by the internal electrodes 121, 122, after lamination, the internal electrodes can be cut so as to be exposed on the fifth and sixth faces 5, 6 of the main body, and then a single dielectric layer or two or more dielectric layers can be laminated in the third direction (width direction) on both side faces of the capacitance forming portion Ac to form margin portions 114, 115.

[0037] On the other hand, there is no need to particularly limit the width of the marginal portions 114, 115. However, in order to more easily achieve a smaller size and higher capacity of the multilayer electronic component, the average width of the marginal portions 114, 115 can be 15 μm or less.

[0038] The average width of the margin portions 114, 115 may mean the average size of the margin portions 114, 115 in the third direction, and may be the average value of the sizes of the margin portions 114, 115 in the third direction measured at five equally spaced points on the side of the capacitance forming portion Ac.

[0039] The internal electrodes 121, 122 may be alternately arranged in a first direction with the dielectric layer 111 interposed therebetween, and may also be alternately arranged in a third direction. The internal electrodes 121, 122 may be divided into a first internal electrode 121 connected to the first external electrode 130 and a second internal electrode connected to the second external electrode 140. In this case, the first internal electrode 121 may be spaced apart from the second external electrode 140, and the second internal electrode 122 may be spaced apart from the first external electrode 121. Thus, different voltages may be applied to the first internal electrode 121 and the second internal electrode 122, respectively.

[0040] 6, in an embodiment of the present invention, the first internal electrodes 121 may be arranged to be spaced apart from each other in a third direction perpendicular to the first and second directions, and the second internal electrodes 122 may be arranged to be spaced apart from each other in the third direction. Thus, the first internal electrode layer 120a may have a plurality of first internal electrodes 121 arranged in the third direction, and the second internal electrode layer 120b may have a plurality of second internal electrodes 122 arranged in the third direction. Meanwhile, the first internal electrode layer 120a and the second internal electrode layer 120b may be arranged alternately with the dielectric layer 111 interposed therebetween, and thus a plurality of first internal electrodes 121 may be arranged in the first direction, and the second internal electrodes 122 may be arranged in the first direction. As a result, the capacitance per unit volume of the multilayer electronic component 100 may be improved.

[0041] Meanwhile, in Fig. 4, the first internal electrode 121 and the second internal electrode 122 are respectively illustrated as being arranged in 6 layers in the first direction and 12 layers in the third direction, but the lamination degree of the internal electrodes is not limited thereto. As shown in Fig. 7, the first internal electrode 121 and the second internal electrode 122 may be respectively arranged in 6 layers in the first direction and 12 layers or more in the third direction, and preferably, the first internal electrode 121 and the second internal electrode 122 may be respectively arranged in 25 layers or more in the first direction or the third direction. That is, the lamination degree of the first internal electrode 121 and the second internal electrode 122 may be 25 layers or more in the first direction or the third direction.

[0042] Meanwhile, the dielectric layer 111 may fill all of the spaces between the first internal electrodes 121, the spaces between the second internal electrodes 122, and the spaces between the first internal electrode layer 120a and the second internal electrode layer 120b. Thus, the first and second internal electrodes 121 and 122 may be electrically insulated from each other.

[0043] There is no particular limitation on the material forming the internal electrodes 121 and 122, and any material having excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0044] The internal electrodes 121 and 122 may be formed by printing a conductive paste for internal electrodes, which includes at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, on the ceramic green sheet. The method for printing the conductive paste for internal electrodes may be a screen printing method or a gravure printing method, but the present invention is not limited thereto.

[0045] The external electrodes 130, 140 are disposed on the body 110. The external electrodes 130, 140 may be disposed on one surface of the body 110 facing each other in the second direction. Specifically, the external electrodes 130, 140 may include a first external electrode 130 in contact with the third surface 3 of the body 110 and a second external electrode 140 in contact with the fourth surface 4. The first external electrode 130 may be connected to the first internal electrode 121, and the second external electrode 140 may be connected to the second external electrode.

[0046] In this embodiment, the multilayer electronic component 100 has a structure having two external electrodes 130, 140, but the number and shapes of the external electrodes 130, 140 can be changed depending on the shape of the internal electrodes 121, 122 and other purposes.

[0047] Meanwhile, the external electrodes 130 and 140 may be formed using any material having electrical conductivity, such as a metal, and the specific material may be determined in consideration of electrical characteristics, structural stability, etc., and may further have a multi-layer structure.

[0048] For example, the external electrodes 130, 140 may include an electrode layer disposed on the body 110 and a plating layer disposed on the electrode layer.

[0049] As a more specific example for the electrode layer, the electrode layer may be a fired electrode containing a conductive metal and glass, or a resin-based electrode containing a conductive metal and resin.

[0050] The electrode layer may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body, and may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto the fired electrode.

[0051] The conductive metal contained in the electrode layer may be a material having excellent electrical conductivity, but is not particularly limited thereto. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu) and alloys thereof, and preferably copper (Cu) for improving adhesion to the main body.

[0052] The plating layer serves to improve mounting characteristics. The type of plating layer is not particularly limited, and may be a plating layer containing at least one of nickel (Ni), tin (Sn), palladium (Pd), and alloys thereof, and may be formed of a plurality of layers.

[0053] As a more specific example of the plating layer, the plating layer may be a Ni plating layer or a Sn plating layer, a Ni plating layer and a Sn plating layer may be sequentially formed on the electrode layer, or a Sn plating layer, a Ni plating layer and a Sn plating layer may be sequentially formed. Also, the plating layer may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0054] Hereinafter, the correlations between various parameters for ensuring the capacitance per unit volume and / or reliability of the multilayer electronic component 100 according to one embodiment or various examples of the present invention will be described in detail.

[0055] 5, a may indicate the shortest distance between the first internal electrode 121 and the second internal electrode 122 that is closest to the first internal electrode 121. The above a is not limited to mean the distance in the first to third directions, but may mean the length of a line segment having the shortest distance among line segments connecting an arbitrary outermost point of the first internal electrode 121 and an arbitrary outermost point of the second internal electrode 122 in the adjacent first internal electrode 121 and second internal electrode 122, and may be measured using a scanning electron microscope (SEM) or an optical microscope (OM) in a cross section in the first and third directions polished to the center in the second direction of the multilayer electronic component 100, but is not limited thereto.

[0056] The above a can be further generalized by taking the average value of values ​​measured in a central region of a capacitance forming part adjusted so that 10 or more layers of the first internal electrode are visible in the first direction in a cross section in the first and third directions polished to the center in the second direction of the multilayer electronic component 100. That is, a can be the average value of the shortest distance between the first internal electrode 121 and the second internal electrode 122 closest to the first internal electrode 121.

[0057] 5, s1 may represent the distance in the third direction between the first internal electrodes 121, s2 may represent the distance in the third direction between the second internal electrodes 122, and s3 may represent the distance in the third direction between the first internal electrodes 121 and the second internal electrodes 122. In this case, s1 may represent the distance in the third direction between adjacent first internal electrodes 121, s2 may represent the distance in the third direction between adjacent second internal electrodes 122, and s3 may represent the distance in the third direction between any first internal electrode 121 and any second internal electrode 122 adjacent to the first internal electrode 121, but is not limited thereto. s1, s2, and s3 may be measured using a scanning electron microscope (SEM) or an optical microscope (OM) in a cross section in the first direction and the third direction polished to the center in the second direction of the multilayer electronic component 100, but is not limited thereto.

[0058] The above s1, s2, and s3 can be further generalized by taking the average values ​​of values ​​measured in a central region of a capacitance forming portion adjusted so that 10 or more layers of the first internal electrodes are visible in the first direction in a cross section in the first and third directions polished to the center in the second direction of the multilayer electronic component 100. That is, s1 can mean the average spacing in the third direction between the first internal electrodes 121, s2 can mean the average spacing in the third direction between the second internal electrodes 122, and s3 can mean the average spacing in the third direction between the first internal electrodes 121 and the second internal electrodes 122.

[0059] Referring to FIG. 5, td may refer to the distance in the first direction between a first internal electrode 121 and a second internal electrode 122 that is closest to the first internal electrode in the first direction.

[0060] The first direction distance td between the first internal electrode 121 and the second internal electrode 122 closest to the first internal electrode in the first direction may refer to the first direction distance of a line segment connecting one end in the first direction of the first internal electrode 121 and one end in the first direction of the second internal electrode 122 facing the one end in the first direction of the first internal electrode 121 in a cross section in the first and third directions polished to the center of the multilayer electronic component 100 in the second direction, and may be measured using a scanning electron microscope (SEM) or an optical microscope (OM), but is not limited thereto.

[0061] The td can be further generalized by taking an average value of values ​​measured for 10 or more internal electrodes in a central region of a capacitance forming portion adjusted so that the first and second internal electrodes appear as 10 or more layers in the first direction in a cross section in the first and third directions polished to the center in the second direction of the multilayer electronic component 100. That is, td can be the average distance in the first direction between the first internal electrode 121 and the second internal electrode 122 that is closest to the first internal electrode in the first direction.

[0062] 5, te may represent the maximum magnitude in the first direction of the first internal electrode 121, and we may represent the maximum magnitude in the third direction of the first internal electrode 122. In this specification, the maximum magnitude in the first direction te and the maximum magnitude in the third direction we are described with reference to the first internal electrode 121, but the description thereof may also be applied to the second internal electrode 122.

[0063] Since the thickness and width of the first internal electrode 121 may vary from position to position depending on the specific shape of the first internal electrode 121, in the present invention, values ​​corresponding to the thickness and width of the first internal electrode 121 are set as the maximum size te in the first direction and the maximum size we in the third direction of the first internal electrode 121, respectively. Specifically, in a cross section in the first direction and the third direction polished to the center of the multilayer electronic component 100 in the second direction, the first direction size of a line segment connecting the highest point and the lowest point in the first direction in any one of the first internal electrodes included in the capacitance forming portion may be set as the maximum size te in the first direction of the first internal electrode 121, and the third direction size of a line segment connecting the outermost points (maximum point in the + direction, maximum point in the - direction) in the third direction in any one of the first internal electrodes may be set as the maximum size we in the third direction of the first internal electrode 121. Such a measurement may be similarly applied to the second internal electrode 122, and may be measured using a scanning electron microscope (SEM) or an optical microscope (OM), but is not limited thereto.

[0064] The above te and we can be further generalized by taking the average values ​​of measurements of 10 or more internal electrodes in a central region of a capacitance forming part adjusted so that the first and second internal electrodes appear as 10 or more layers in the first direction in cross sections in the first and third directions polished to the center in the second direction of the multilayer electronic component 100. That is, te can mean the average value of the maximum magnitude of the first internal electrodes in the first direction, and we can mean the average value of the maximum magnitude of the first internal electrodes in the third direction.

[0065] FIG. 8(a) is a schematic diagram showing the direction of the electric field flux between internal electrodes in a multilayer electronic component according to a comparative example, and FIG. 8(b) is a schematic diagram showing the direction of the electric field flux between internal electrodes in a multilayer electronic component according to an embodiment.

[0066] When an electric field is applied to the dielectric between the internal electrodes, it expands in the direction parallel to the electric field and contracts in the direction perpendicular to the field. At this time, excessive expansion is induced, destroying the brittle layer in the W-margin area, which is the electrostrictive breakdown phenomenon.

[0067] FIG. 8(a) shows a comparative example having a conventional internal electrode, and FIG. 8(b) shows a comparative example having an internal electrode structure according to an embodiment of the present invention. All expansion / contraction behaviors when an electric field is formed between two electrodes are indicated by thin and thick arrows. The forces expanding in the 1st, 2nd, 3rd, and 4th directions are respectively called F1, F2, F3, and F4, and the magnitude of the force at this time is F. The forces contracting in the 5th, 6th, 7th, 8th, and 9th directions can be respectively defined as F5, F6, F7, F8, and F9. Assuming that the displacement in the contraction direction is about 30% compared to the expansion direction, the magnitude of the force in the contraction direction can be assumed to be 0.3F. At this time, when the expansion / contraction force of the combined electric distortion is calculated, in the comparative example, the force in the x-axis direction is offset, and the force in the y-axis direction is increased by about F (F9 y In the example, F1, F2, F3, and F4 are 0.7F, and when these are separated into components in the y-axis direction, the force is about 0.5F (F 1' y )=0.5 F. Therefore, in the case of the comparative example, it can be predicted that the electrostrictive expansion / contraction force acting is about twice as large as that in the example.

[0068] Therefore, in the case of one embodiment of the present invention, in a body 110 including first internal electrode layers 120a and second internal electrode layers 120b arranged alternately with a dielectric layer 111 sandwiched therebetween, the first internal electrode layer includes first internal electrodes 121 connected to the first external electrodes and arranged spaced apart from each other in a third direction perpendicular to the first and second directions, and the second internal electrode layer includes second internal electrodes 122 connected to the second external electrodes and arranged spaced apart from each other in the third direction, electrostrictive expansion / contraction can be offset, thereby reducing defects in multilayer electronic components due to electrostrictive breakdown more than in the case of having internal electrodes with a general structure as in the comparative example.

[0069] FIG. 9(a) is a schematic diagram showing the number of electric field fluxes between internal electrodes of a multilayer electronic component according to a comparative example, and FIG. 9(b) is a schematic diagram showing the number of electric field fluxes between internal electrodes in a multilayer electronic component according to an embodiment.

[0070] Assuming that the shapes of the internal electrodes in the first and third direction cross sections are circular, that the electric field strength E shown in the drawings is the same, and that three layers are treated as one unit and increased by one in the width direction, the number of all electric field fluxes is calculated, and in the case of Fig. 9(a) the number of electric field fluxes is 2n, and in the case of Fig. 9(b) the number of electric field fluxes is equivalent to 2n-2. That is, in the case of the comparative example such as the conventional structure and the example such as the structure of one embodiment of the present invention, the number of electric field fluxes is only 2, and it cannot be said that there is a meaningful difference. Therefore, in a body 110 including first internal electrode layers 120a and second internal electrode layers 120b arranged alternately with a dielectric layer 111 in between as in one embodiment of the present invention, the first internal electrode layer includes a first internal electrode 121 connected to the first external electrode and arranged spaced apart from each other in a third direction perpendicular to the first direction and the second direction, and the second internal electrode layer includes a second internal electrode 122 connected to the second external electrode and arranged spaced apart from each other in the third direction, it is possible to mitigate defects in multilayer electronic components due to electrostrictive breakdown, but the number of electric field fluxes themselves may not be significantly different from the conventional case.

[0071] FIG. 10 is a schematic diagram showing the difference in integration density depending on the radius of the internal electrodes and the distance between the internal electrodes in the comparative example and the example.

[0072] In one embodiment of the present invention, 0.01≦(a / te)≦1.37 may be satisfied, and more preferably 0.01≦(a / te)≦1.10 may be satisfied. As a result, even when the main body 110 includes the first internal electrode layer 120a and the second internal electrode layer 120b alternately arranged with the dielectric layer 111 sandwiched therebetween, the first internal electrode layer includes the first internal electrode 121 connected to the first external electrode and arranged at a distance from each other in a third direction perpendicular to the first direction and the second direction, and the second internal electrode layer includes the second internal electrode 122 connected to the second external electrode and arranged at a distance from each other in the third direction, it is possible to reduce defects of the multilayer electronic component due to electrostrictive breakdown and improve the electrostatic capacitance per unit volume.

[0073] FIG. 10 specifically shows the internal electrode shape assumed to be circular in the first and third cross sections in the case of a conventional internal electrode structure and the case of an internal electrode structure according to one embodiment of the present invention, with the radius of the internal electrode being indicated as r and the distance between the internal electrodes being indicated as a.

[0074] 10, for the convenience of calculation, the cross-sectional shape of the internal electrode is assumed to be a circle (with a radius of r), and the relationship between r and te is 2r=te. In this case, the calculated length in the W direction in the comparative example is 6r, and the calculated length in the T direction is 6r+2a, while the calculated length in the W direction in the example is 4r+a, and the calculated length in the T direction is The image is JPEG2025026795000002.jpg527.

[0075] Fig. 11 specifically shows the results of calculating the ratio by adjusting the interval a, assuming the radius r of the internal electrode to be 1. The dashed and dotted line indicates the ratio in the W direction, the dotted line indicates the ratio in the T direction, and the solid line indicates the product of the W ratio and the T ratio, which corresponds to the area ratio of the WT surface. The comparative example is indicated by W and T, and the example is indicated by W' and T'.

[0076] Referring to FIG. 11, it can be seen that when a is 2.74 or less, the area of ​​the embodiment is smaller than that of the comparative example. When this is converted into a ratio with te corresponding to 2r, it can be confirmed that when the value of (a / te) is 1.37 or less, the area is smaller than that of the conventional case with the same number of layers. Therefore, in one embodiment of the present invention, by adjusting (a / te) to satisfy (a / te)≦1.37, the capacitance per unit volume of the multilayer electronic component can be improved, and more preferably, by adjusting (a / te) to satisfy (a / te)≦1.10, the capacitance per unit volume of the multilayer electronic component can be further improved by having an area ratio of 92.15% or less compared to the comparative example. Meanwhile, the lower limit of (a / te) is not particularly limited, but it may be preferable that it is 0.01 or more for electrical insulation between the internal electrodes.

[0077] In one embodiment, 0.9≦s1 / s2≦1.1 can be satisfied, which can further improve the effect of canceling out electrostrictive contraction / expansion, and further reduce damage to the multilayer electronic component 100 due to electrostrictive contraction / expansion.

[0078] In an embodiment, the first internal electrode 121 and the second internal electrode 122 may not overlap in the first direction. An example of a structure in which the first internal electrode 121 and the second internal electrode 122 do not overlap in the first direction includes, but is not limited to, a structure in which the first internal electrode 121 and the second internal electrode 122 are spaced apart in the third direction.

[0079] As described above, it can be advantageous for the capacitance per unit volume of the stacked electronic component 100 that the first internal electrode 121 and the second internal electrode 122 have a structure that does not overlap in the first direction. However, if the separation distance in the third direction between the first internal electrode 121 and the second internal electrode 122 is too large, as a result, the number of internal electrodes that can be arranged per unit volume decreases, and thus the capacitance per unit volume of the stacked electronic component 100 may be lower than that of a conventional stacked electronic component with a general structure. Therefore, in one embodiment, 0 < s3 ≤ 0.2s1 and 0 < s3 ≤ 0.2s2 can be satisfied.

[0080] On the other hand, the upper limit value of the maximum size td in the first direction of the first internal electrode 121 is not particularly limited. However, for miniaturization and high capacitance of the stacked electronic component 100, it can be 5 μm or less. The lower limit value of the maximum size td in the first direction of the first internal electrode 121 is not particularly limited either, but the maximum size td in the first direction of the first internal electrode 121 can be 0.05 μm or more in order to ensure the overlapping area between the internal electrodes. From the same perspective, in one embodiment, the maximum size we in the third direction of the first internal electrode 121 can be 0.05 μm or more and 5 μm or less.

[0081] In one embodiment, te ≤ td can be satisfied. When the maximum size te of the first internal electrode 121 is larger than the interval td in the first direction between the first internal electrode and the second internal electrode that is most adjacent to the first internal electrode in the first direction, a fringing effect is likely to occur in the internal electrode. Such a fringing effect may cause interference with the electric field generated between the first internal electrode 121 and the second internal electrode 122 in the capacitance forming portion, resulting in a decrease in the capacitance per unit volume of the stacked electronic component 100. Therefore, in one embodiment, by adjusting the maximum size te of the first internal electrode 121 to be the same as or smaller than the interval td in the first direction between the first internal electrode and the second internal electrode that is most adjacent to the first internal electrode in the first direction, the capacitance per unit volume of the stacked electronic component 100 can be further improved.

[0082] In one embodiment, a≧td can be satisfied. If the shortest distance a between the first internal electrode 121 and the second internal electrode 122 closest to the first internal electrode 121 is smaller than the first direction interval td between the first internal electrode and the second internal electrode closest to the first internal electrode in the first direction, a failure may occur between the first internal electrode 121 and the second internal electrode 122 closest to the first internal electrode 121. Therefore, in one embodiment, by adjusting so as to satisfy a≧td, it is possible to improve the capacitance per unit volume of the multilayer electronic component 100 and at the same time improve the withstand voltage characteristics.

[0083] In one embodiment, 0.5≦te / we≦1.5 can be satisfied, and more preferably 0.9≦te / we≦1.1 can be satisfied. This makes it possible to further improve the capacitance per unit volume of the multilayer electronic component 100 by controlling the shapes of the first and second internal electrodes 121, 122 and efficiently arranging them in the capacitance forming portion.

[0084] Meanwhile, in the drawings of the present invention, the shapes of the internal electrodes 121, 122 in the first and third cross sections are expressed as a rectangular or regular rectangular shape, but the present invention is not limited thereto. That is, the shapes of the internal electrodes 121, 122 in the first and third cross sections are not particularly limited, and may be various shapes such as a polygon, a regular polygon, a circle, an ellipse, etc.

[0085] Referring to FIG. 12, in one embodiment, the dielectric layer 111 and the internal electrode layers 120a, 120b of the present invention can be formed through lamination. Specifically, the conductive patterns 221 for forming the first internal electrode are formed on the dielectric ceramic green sheet 211 at intervals in the third direction, and the conductive patterns 222 for forming the second internal electrode are formed on the dielectric ceramic green sheet 211 at intervals in the third direction and repeatedly laminated, and then can be formed through a crimping and firing process. The conductive patterns 221 for forming the first and second internal electrodes can be formed through printing, but are not limited thereto, and can be formed by attaching a one-dimensional conductive material continuous in the second direction to the dielectric ceramic green sheet 211.

[0086] The size of the multilayer electronic component 100 does not particularly need to be limited. However, in order to simultaneously achieve miniaturization and high capacitance, the thicknesses of the dielectric layer and the internal electrodes are made thinner and the number of laminations is increased. However, in the multilayer electronic component 100 having a size of 0201 (length × width, 0.2 mm × 0.1 mm) or less, there is a risk that it is difficult to ensure moisture resistance reliability.

[0087] Therefore, considering manufacturing errors, the size of the external electrodes, etc., when the length of the multilayer electronic component 100 is 0.22 mm or less and the width is 0.11 mm or less, the effect of improving the reliability according to the present invention can become more remarkable. Here, the length of the multilayer electronic component 100 can mean the maximum size l in the second direction of the multilayer electronic component 100, the width of the multilayer electronic component 100 can mean the maximum size w in the third direction of the multilayer electronic component 100, and the thickness of the multilayer electronic component 100 can mean the maximum size t in the first direction of the multilayer electronic component 100.

[0088] In one embodiment, t < l can be satisfied. Thereby, the step due to excessive lamination of the internal electrode layers 120a, 120b can be alleviated.

[0089] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments and the accompanying drawings, but is limited by the scope of the accompanying claims. Therefore, various substitutions, modifications and changes can be made by a person having ordinary skill in the art within the scope of the technical ideas of the present invention described in the claims, and these also belong to the scope of the present invention.

[0090] In addition, the expression "one embodiment" used in the present invention does not mean the same embodiment, but is provided to emphasize and describe each unique feature that is different from the others. However, the above-mentioned one embodiment does not exclude being realized in combination with the features of another embodiment. For example, even if a matter described in a particular embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description in the other embodiment that is opposite or contradictory to the matter.

[0091] The terms used in the present invention are merely used to describe one embodiment and are not intended to limit the present invention. In this case, a singular expression includes a plural expression unless the context clearly indicates otherwise. [Explanation of symbols]

[0092] 100: Multilayer electronic components 110: Main unit 111: Dielectric layer 120a, 120b: Internal electrode layer 121, 122: Internal electrode 112, 113: Cover part 114, 115: Margin 130, 140: External electrode 211: Dielectric ceramic green sheet 221, 222: Conductive patterns for forming internal electrodes

Claims

1. a main body including a dielectric layer, and first and second internal electrode layers alternately disposed in a first direction with the dielectric layer interposed therebetween; a first external electrode disposed on a surface of the body facing the first direction in a second direction perpendicular to the first direction; a second external electrode disposed on another surface of the body facing the second direction, the first internal electrode layer includes first internal electrodes connected to the first external electrodes and spaced apart from each other in a third direction perpendicular to the first direction and the second direction, and the second internal electrode layer includes second internal electrodes connected to the second external electrodes and spaced apart from each other in the third direction, a / te)≦1.37。 A multilayer electronic component, wherein a is a shortest distance between the first internal electrode and a second internal electrode closest to the first internal electrode, and te is a maximum size of the first internal electrode in the first direction.

2. 2. The multilayer electronic component according to claim 1, wherein 0.01≦(a / te)≦1.10 is satisfied.

3. The multilayer electronic component according to claim 1 , wherein the first internal electrodes and the second internal electrodes do not overlap in the first direction.

4. The multilayer electronic component according to claim 1 , wherein the first internal electrodes and the second internal electrodes are spaced apart from each other in the third direction.

5. When the interval between the first internal electrodes in the third direction is s1 and the interval between the second internal electrodes in the third direction is s2, 2. The multilayer electronic component according to claim 1, wherein 0.9≦s1 / s2≦1.1 is satisfied.

6. When the interval between the first internal electrodes in the third direction is s1, the interval between the second internal electrodes in the third direction is s2, and the interval between the first internal electrode and the second internal electrode in the third direction is s3, 2. The multilayer electronic component according to claim 1, wherein 0<s3≦0.2s1 and 0<s3≦0.2s2 are satisfied.

7. When the maximum size of the first internal electrode in the third direction is we, 2. The multilayer electronic component according to claim 1, wherein the we is equal to or greater than 0.05 μm and equal to or less than 5 μm.

8. 2. The multilayer electronic component according to claim 1, wherein the te is equal to or greater than 0.05 μm and equal to or less than 5 μm.

9. When a distance in a first direction between the first internal electrode and a second internal electrode that is closest to the first internal electrode in the first direction is td, The multilayer electronic component according to claim 1 , wherein te≦td is satisfied.

10. When a distance in a first direction between the first internal electrode and a second internal electrode that is closest to the first internal electrode in the first direction is td, The multilayer electronic component according to claim 1 , wherein a≧td is satisfied.

11. When the maximum size of the first and second internal electrodes in the third direction is we, 2. The multilayer electronic component according to claim 1, wherein 0.5≦te / we≦1.5 is satisfied.

12. When the maximum size of the multilayer electronic component in the first direction is t and the maximum size of the multilayer electronic component in the second direction is 1, The multilayer electronic component according to claim 1 , wherein t<l is satisfied.

13. 2. The multilayer electronic component according to claim 1, wherein the dielectric layer contains Ba and Ti.

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