RF tag and method for manufacturing RF tag

Abstract

To provide an RF tag and a method for manufacturing the RF tag.SOLUTION: An RF tag 10 includes an inlay 12 consisting of a substrate on which an antenna and an IC chip connected to the antenna are arranged, a resin layer 20 formed by potting on the inlay 12, and a seal 22 adhered onto the resin layer 20. In the RF tag 10, by forming the resin layer 20 by potting, the thickness of the resin layer 20 can be easily changed according to communication accuracy and applications.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an RF tag including an inlay, a resin layer, and a seal, and a method for manufacturing the RF tag. [Background technology]

[0002] In general, RF tags with built-in IC chips that store and enable reading and writing of specific information related to any object are widely used. These RF tags are also called RFID (Radio Frequency Identification) tags, IC tags, non-contact tags, etc.

[0003] This RF tag is composed of an IC chip that has identification information such as an ID number built into the integrated circuit, and an inlay that is an integral part of an antenna that is connected to the IC chip. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2012-104985 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, when this type of RF tag is attached to the surface of a metal object, the electromagnetic waves used for communication are reflected and absorbed by the metal surface to which the tag is attached, which may result in inaccurate communication.

[0006] The present invention has been made in consideration of the above problems, and aims to provide an RF tag and a method for manufacturing an RF tag that are capable of accurate communication even when attached to a metal surface and operated. [Means for solving the problem]

[0007] The RF tag according to the present invention comprises an inlay composed of a substrate on which an antenna and an IC chip connected to the antenna are arranged, a resin layer formed by potting on the inlay, and a seal adhered on the resin layer.

[0008] In the RF tag, the resin layer is characterized by containing a polyisocyanate and a polyether polyol.

[0009] The manufacturing method of the RF tag according to the present invention comprises a step of forming a resin layer by potting on an inlay composed of a substrate on which an antenna and an IC chip connected to the antenna are arranged, and a step of adhering a seal on the resin layer.

[0010] In the manufacturing method of the RF tag, the resin layer is characterized by containing a polyisocyanate and a polyether polyol.

Effect of the Invention

[0011] According to the RF tag and the manufacturing method of the RF tag of the present invention, by forming the resin layer by potting, the thickness of the resin layer can be easily changed according to communication accuracy and applications.

Brief Description of the Drawings

[0012] [Figure 1] It is an explanatory view of an RF tag according to an embodiment of the present invention. [Diagram 2] It is a cross-sectional view taken along line II-II in FIG. 1 of the RF tag according to the present embodiment. [Diagram 3] FIG. 3 is an explanatory view of the steps of a manufacturing method of an RF tag 10 according to an embodiment of the present invention.

Mode for Carrying Out the Invention

[0013] <Configuration of RF Tag 10> Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an explanatory view of an RF tag 10 according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1.

[0014] The RF tag 10 includes an inlay 12, a resin layer 20, and a seal 22. The inlay 12 has a substrate 14, an antenna 16, and an IC chip 18. The substrate 14 is made of a synthetic resin film such as polyethylene terephthalate (PET) or polypropylene (PP), for example. The antenna 16 is a linear antenna formed on the substrate 14 with a metal foil such as aluminum foil. Predetermined information is stored in the IC chip 18. The antenna 16 and the IC chip 18 are electrically connected and arranged on the substrate 14.

[0015] The resin layer 20 is made of resin. As the resin, for example, a urethane resin containing polyisocyanate and polyether polyol can be used. The thickness of the resin layer 20 is, for example, 1.8 mm to 2.2 mm. The seal 22 is composed of an adhesive layer 24 and a release layer 26. As the adhesive layer 24, for example, an acrylic or rubber-based adhesive can be used. Also, as the release layer 26, for example, a synthetic resin film coated with a release agent such as a silicone-based release agent or paper coated with a release agent can be used.

[0016] @ <Manufacturing method of RF tag 10> Next, the manufacturing method of the RF tag 10 will be described with reference to FIG. 3. FIG. 3 is an explanatory view of the steps of the manufacturing method of the RF tag 10 according to an embodiment of the present invention.

[0017] First, the inlay 12 is placed (step S1). Next, resin is dropped onto the inlay 12 (step S2).

[0018] The resin dropped onto the inlay 12 is cured to form the resin layer 20 (step S3). The amount of resin dropped and the curing time vary depending on the thickness of the resin layer 20. These steps S2 and S3 are generally performed by a method called potting.

[0019] A seal 22 is adhered onto the cured resin layer 20 (step S4).

[0020] When using the RF tag 10 manufactured by the above-mentioned process, the release layer 26 of the sticker 22 is peeled off and the adhesive layer 24 is affixed to a desired object, whereby the RF tag 10 can be used.

[0021] The RF tag 10 comprises an inlay 12 consisting of a substrate 14 on which an antenna 16 and an IC chip 18 connected to the antenna 16 are arranged, a resin layer 20 formed on the inlay 12 by potting processing, and a seal 22 adhered onto the resin layer 20.

[0022] Generally, when an RF tag is attached to a metal surface and operated, a certain distance or more is required between the RF tag and the metal surface in order to communicate accurately. In the RF tag 10, the resin layer 20 is formed by potting, so that the thickness of the resin layer 20 can be easily changed according to the communication accuracy and application.

[0023] The resin layer 20 contains polyisocyanate and polyether polyol.

[0024] (Example) For the product related to the RF tag 10, the resin layer 20 was made of urethane resin with a ratio of polyisocyanate and polyether polyol of 1:1. The thickness of the resin layer 20 was 2 mm. Furthermore, the time required for the urethane resin to harden was 12 hours.

[0025] Heat resistance tests at 100 degrees and 140 degrees were conducted on products related to RF tag 10. With a general RF tag, the characteristics of the received signal deteriorate in an environment of 85 degrees or higher, but with products related to RF tag 10, the characteristics of the received signal did not deteriorate.

[0026] A load test was conducted on the product related to the RF tag 10, applying a maximum load of 1007 N. No degradation in the characteristics of the received signal was observed even after the load test for the RF tag 10.

[0027] It should be noted that the present invention is not limited to the above-described embodiment, and various configurations can be adopted without departing from the gist of the present invention. [Explanation of symbols]

[0028] 10. RF tag 12…Inlay 14...Substrate 16…Antenna 18...IC chip 20…Resin layer 22...Seal 24…adhesive layer 26…Peeling layer

Claims

1. an inlay including a substrate on which an antenna and an IC chip connected to the antenna are disposed; A resin layer formed on the inlay by potting; A seal adhered onto the resin layer; An RF tag comprising:

2. The RF tag according to claim 1, The RF tag, wherein the resin layer contains polyisocyanate and polyether polyol.

3. forming a resin layer by potting on an inlay made of a substrate on which an antenna and an IC chip connected to the antenna are arranged; A step of adhering a seal onto the resin layer; A method for manufacturing an RF tag, comprising:

4. The method for producing an RF tag according to claim 3, The method for producing an RF tag, wherein the resin layer contains polyisocyanate and polyether polyol.

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