Sensor module

Abstract

To stabilize posture further when adsorbing by a suction nozzle of a chip mounter while securing flow communication of air in a sensor module capable of implementing surface on a circuit board.SOLUTION: A sensor module 1A comprises a substrate 10, a sensor chip 20 which is installed on a surface 11 of the substrate 10, an external terminal 13 which is formed on a reverse face 12 of the substrate 10 and a case 40 which covers the sensor chip 20 fixed on the substrate 10. A top plate part 41 of the case 40 includes a central region 41A without through holes 43 and a through hole formation region 41B which is formed with a plurality of through holes 43 provided in position enclosing circumference of the central region 41A. Thus, since the through holes 43 are not provided on the central region 41A of the top plate part 41, it is made possible to stabilize posture when implementing a surface on a circuit board by adsorbing the central region 41A by a suction nozzle of a chip mounter.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a sensor module, and more particularly to a sensor module for detecting a predetermined gas component or the like contained in a measurement atmosphere. [Background technology]

[0002] A known gas sensor for detecting a specific gas component is the gas sensor described in Patent Document 1. The gas sensor described in Patent Document 1 includes a substrate having a cavity, a gas detection element housed in the cavity, and a protective cap covering the cavity. The protective cap is provided with a plurality of vent holes through which an external gas to be measured is introduced into the cavity.

[0003] In the gas sensor described in Patent Document 1, a flat portion without any ventilation holes is provided on the ceiling of the protective cap, and the gas sensor can be surface-mounted on a circuit board by sucking this flat portion with a suction nozzle of a chip mounter. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 4280705 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the gas sensor described in Patent Document 1, the flat surface of the protective cap is offset from the center position, which causes a problem that the posture of the gas sensor becomes unstable when it is picked up by the suction nozzle of a chip mounter. This problem occurs not only in gas sensors, but also in all sensor modules that can be surface-mounted on a circuit board, such as sensor modules that detect air vibrations, pressure, or temperature, that is, microphones, pressure sensors, temperature sensors, etc.

[0006] Therefore, an object of the present invention is to provide a sensor module that can be surface-mounted on a circuit board that can have a more stable posture when it is picked up by a suction nozzle of a chip mounter while ensuring air circulation. [Means for solving the problem]

[0007] The sensor module according to the present invention comprises a substrate having a front and back surface, a sensor element mounted on the front surface of the substrate, an external terminal formed on the back surface of the substrate, and a case fixed to the substrate and covering the sensor element, the case having a top plate portion having a plurality of through holes, the top plate portion having a central region where no through holes exist, and a through hole forming region provided at a position surrounding the central region and having a plurality of through holes formed therein.

[0008] According to the present invention, since no through hole is provided in the central region of the top plate, by adsorbing the central region with the suction nozzle of the chip mounter, it is possible to stabilize the posture when surface mounting on the circuit board.

[0009] In the present invention, the outer shape of the top plate portion may be rectangular. This makes it possible to maximize the volume of the space surrounded by the case. In this case, the through hole formation region may include a clearance region where no through hole exists, and the clearance region may be located near a corner of the top plate portion or near the approximate center of a side. This prevents the through hole from being blocked by the jig when it is necessary to hold the top plate portion with a jig in the inspection process.

[0010] The sensor module according to the present invention may further include a filter that overlaps the multiple through holes. This makes it possible to prevent foreign matter from entering the space surrounded by the case. In this case, the filter may selectively cover the through hole forming area so as to overlap the multiple through holes without covering the central area. This makes it possible to prevent contact between the filter and the suction nozzle of the chip mounter when suctioning with the nozzle.

[0011] The filter may be a single member having a continuous shape. This simplifies the process of attaching the filter and increases the adhesive strength between the filter and the top plate. In this case, the top plate may have an attachment area covered with the filter and a non-attachment area not covered with the filter, the attachment area overlaps with the through-hole formation area, and the non-attachment area may include a central area, an outer area located outside the through-hole formation area, and a cut area that overlaps with the through-hole formation area and connects the central area and the outer area. This makes it possible to remove the unnecessary part attached to the outer area and the unnecessary part attached to the central area in one step in the step of peeling off the unnecessary part of the filter sheet after attaching the filter sheet to the top plate. Effect of the Invention

[0012] In this way, according to the present invention, it is possible to more stabilize the attitude of the sensor module when it is sucked by the suction nozzle of the chip mounter while ensuring air circulation. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 is a schematic perspective view showing the appearance of a sensor module 1A according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is a schematic exploded perspective view of the sensor module 1A. [Diagram 3] FIG. 3 is a schematic plan view of the sensor module 1A as viewed from the rear surface side. [Figure 4]FIG. 4 is a schematic plan view for explaining the shape of the top plate portion 41 in more detail. [Diagram 5] FIG. 5 is a schematic perspective view for explaining a method for transporting the sensor module 1A. [Figure 6] FIG. 6 is a schematic perspective view for explaining a method for inspecting the sensor module 1A. [Figure 7] FIG. 7 is a schematic perspective view showing the appearance of a sensor module 1B according to the second embodiment of the present invention. [Figure 8] FIG. 8 is a schematic perspective view showing the appearance of a sensor module 1C according to the third embodiment of the present invention. [Figure 9] FIG. 9 is a schematic perspective view showing the appearance of a sensor module 1D according to the fourth embodiment of the present invention. [Figure 10] FIG. 10 is a schematic perspective view showing the appearance of a sensor module 2A according to the fifth embodiment of the present invention. [Figure 11] FIG. 11 is a schematic perspective view showing the appearance of a sensor module 2B according to the sixth embodiment of the present invention. [Figure 12] FIG. 12 is a schematic perspective view showing the appearance of a sensor module 2C according to the seventh embodiment of the present invention. [Figure 13] FIG. 13 is a schematic perspective view showing the appearance of a sensor module 2D according to the eighth embodiment of the present invention. [Figure 14] FIG. 14 is a schematic perspective view showing the appearance of a sensor module 3A according to the ninth embodiment of the present invention. [Figure 15] FIG. 15 is a schematic perspective view showing the appearance of a sensor module 3B according to the tenth embodiment of the present invention. [Figure 16] FIG. 16 is a schematic plan view showing the appearance of a sensor module 3C according to the eleventh embodiment of the present invention. [Figure 17] FIG. 17 is a schematic plan view showing the appearance of a sensor module 3D according to the twelfth embodiment of the present invention. [Figure 18] FIG. 18 is a schematic plan view showing the appearance of a sensor module 3E according to the thirteenth embodiment of the present invention. [Figure 19] FIG. 19 is a schematic plan view showing the appearance of a sensor module 4A according to the fourteenth embodiment of the present invention. [Figure 20] FIG. 20 is a schematic perspective view for explaining a part of the manufacturing process of the sensor module 4A according to the fourteenth embodiment. [Figure 21] FIG. 21 is a schematic perspective view for explaining a part of the manufacturing process of the sensor module 4A according to the fourteenth embodiment. [Figure 22] FIG. 22 is a schematic diagram for explaining an example in which the edge portion of the filter 65 is chamfered. [Figure 23] FIG. 23 is a schematic diagram for explaining an example in which the width of the cutting region 41D is shaped to become wider from the central region 41A toward the outer regions 41C. [Figure 24] FIG. 24 is a schematic plan view showing the appearance of a sensor module 4B according to the fifteenth embodiment of the present invention. [Diagram 25] FIG. 25 is a schematic diagram for explaining an example in which the edge portion of the filter 65 is chamfered. [Figure 26] FIG. 26 is a schematic diagram for explaining an example in which the width of the cutting region 41D is shaped to become wider from the central region 41A toward the outer regions 41C. [Figure 27] FIG. 27 is a schematic plan view showing the appearance of a sensor module 4C according to the sixteenth embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0015] <First embodiment> Fig. 1 is a schematic perspective view showing the appearance of a sensor module 1A according to a first embodiment of the present invention, and Fig. 2 is a schematic exploded perspective view of the sensor module 1A.

[0016] 1 and 2, a sensor module 1A according to the first embodiment includes a substrate 10, a sensor chip 20 and a control IC 30 mounted on a front surface 11 of the substrate 10, and a case 40 fixed to the substrate 10 and covering the sensor chip 20 and the control IC 30. As shown in Fig. 3, a plurality of external terminals 13 are provided on a rear surface 12 of the substrate 10. The front surface 11 and the rear surface 12 of the substrate 10 form an xy plane.

[0017] The sensor chip 20 includes, for example, a sensor element that measures the concentration of a predetermined gas component (such as CO2) contained in the measurement atmosphere. However, the sensor chip 20 is not necessarily a gas sensor, and may be a sensor that detects air vibration, pressure, temperature, humidity, etc. in the measurement atmosphere, that is, a microphone, a pressure sensor, a temperature sensor, a humidity sensor, etc. In addition, in the example shown in Fig. 2, two sensor chips 20 are mounted on the substrate 10, but the number of sensor chips 20 mounted on the substrate 10 is not particularly limited.

[0018] The control IC 30 is connected to the sensor chip 20, and a control circuit that calculates a measurement value based on the output of the sensor chip 20 is integrated in the control IC 30. Although not particularly limited, a semiconductor IC in a bare chip state can be used as the control IC 30. The control IC 30 is connected to the external terminal 13. A part of the external terminal 13 may be directly connected to the sensor chip 20. In addition, it is not essential that the sensor chip 20 and the control IC 30 are separate chips, and an IC in which a sensor element and a control circuit are integrated into a single chip may be used.

[0019] The case 40 is made of a material having sufficient strength, such as metal or resin, and includes a top plate portion 41 facing the surface 11 of the substrate 10, and a side plate portion 42 connected to the top plate portion 41 and surrounding the sensor chip 20 and the control IC 30 in a plan view (as viewed from the z direction). The top plate portion 41 is parallel to the surface 11 of the substrate 10 and constitutes an xy plane. The side plate portion 42 is perpendicular to the surface 11 of the substrate 10 and constitutes an xz plane or a yz plane. The top plate portion 41 is provided with a plurality of through holes 43. The through holes 43 are provided to ensure the flow of air from the outside to the inside of the case 40. For example, when the sensor chip 20 is a gas sensor, the gas component to be measured enters the inside of the case 40 through the through holes 43, and the concentration thereof is measured by the sensor chip 20. In this embodiment, the planar shape of the through holes 43 is circular, and thus the reduction in strength of the top plate portion 41 due to the through holes 43 is minimized.

[0020] FIG. 4 is a schematic plan view for explaining the shape of the top plate portion 41 in more detail.

[0021] As shown in FIG. 4, the planar shape of the top plate portion 41 is rectangular, and includes a central region 41A without through holes 43, a through hole forming region 41B surrounding the periphery of the central region 41A, and an outer region 41C located outside the through hole forming region 41B. All the through holes 43 are formed in the through hole forming region 41B, and no through holes 43 are provided in the central region 41A or the outer region 41C. A part of the through holes 43 may overlap with the sensor chip 20 or the control IC 30 when viewed from the z direction. The center position of the central region 41A coincides with the center position of the top plate portion 41. The through hole forming region 41B is ring-shaped, and includes a straight portion 41B1 in which three through holes 43 are arranged in the x direction or the y direction, and a corner portion 41B2 connecting the two straight portions. In this embodiment, the corner portion 41B2 is located near a corner of the top plate portion 41, and constitutes a clearance region in which no through holes 43 exist.

[0022] FIG. 5 is a schematic perspective view for explaining a method for transporting the sensor module 1A according to the present embodiment.

[0023] 5, when the sensor module 1A is transported, the central region 41A of the top plate portion 41 is sucked by the suction nozzle 50 of the chip mounter. As described above, the central region 41A of the top plate portion 41 does not have a through hole 43, so that the sensor module 1A can be reliably sucked by the suction nozzle 50. Moreover, the central region 41A of the top plate portion 41 is not unevenly distributed in plan view, so that the posture of the sensor module 1A in the state where it is sucked by the suction nozzle 50 can be more stable. This makes it possible to stably perform the operation of surface mounting the sensor module 1A on a circuit board (not shown).

[0024] FIG. 6 is a schematic perspective view for explaining a method of inspecting the sensor module 1A according to the present embodiment.

[0025] 6, in the inspection process of the sensor module 1A according to this embodiment, a probe (not shown) is brought into contact with the external terminal 13 on the rear surface 12 while the top plate 41 of the case 40 is held down by a plurality of jigs 51-54. In this state, the measurement target gas in the atmosphere is set to a known concentration, and it is determined whether the measurement value output from the external terminal 13 indicates a correct value, thereby allowing the sensor module 1A to be selected.

[0026] Here, the jigs 51-54 are arranged so as to cover the corners of the top plate 41 and their vicinity. The corners of the top plate 41 and their vicinity have relatively high strength against a force from the z direction, and therefore deformation or damage of the sensor module 1A during the inspection process can be prevented. The jigs 51-54 are arranged so as to cover a part of the through-hole formation region 41B, but are arranged so as to overlap with the clearance region so that the through-hole 43 is not blocked by the jigs 51-54. This makes it possible to perform the inspection under the same conditions as during actual use.

[0027] <Second embodiment> FIG. 7 is a schematic perspective view showing the appearance of a sensor module 1B according to the second embodiment of the present invention.

[0028] The sensor module 1B shown in FIG. 7 differs from the sensor module 1A according to the first embodiment in that the through-hole 43 has a vertically or horizontally elongated shape. Since the other basic configurations are the same as those of the sensor module 1A according to the first embodiment, the same elements are given the same reference numerals and the duplicated description is omitted. The through-hole 43 in this embodiment has a shape in which three through-holes 43 arranged in the x direction or y direction shown in FIG. 4 are connected. By using the through-hole 43 having such a shape, it is possible to further promote the flow of air from the outside to the inside of the case 40 while ensuring the areas of the central region 41A and the outer region 41C.

[0029] <Third embodiment> FIG. 8 is a schematic perspective view showing the appearance of a sensor module 1C according to the third embodiment of the present invention.

[0030] The sensor module 1C shown in FIG. 8 is different from the sensor module 1A according to the first embodiment in that three through holes 43 are arranged in an L-shape at a corner 41B2 of the through hole forming region 41B. Since the other basic configurations are the same as those of the sensor module 1A according to the first embodiment, the same elements are given the same reference numerals and the duplicated description is omitted. In this embodiment, the approximate center of the straight line portion 41B1 constitutes the clearance region. The approximate center of the straight line portion 41B1 is located near the approximate center of the side of the top plate portion 41. As exemplified in this embodiment, it is not essential to provide the clearance region at the corner 41B2. Even in this case, it is possible to perform the inspection without blocking the through holes 43 by pressing the clearance region with jigs 51 to 54 in the inspection process.

[0031] <Fourth embodiment> FIG. 9 is a schematic perspective view showing the appearance of a sensor module 1D according to the fourth embodiment of the present invention.

[0032] The sensor module 1D shown in Fig. 9 differs from the sensor module 1C according to the third embodiment in that each through hole 43 has an L-shape. Since the other basic configurations are the same as those of the sensor module 1C according to the third embodiment, the same elements are given the same reference numerals and duplicated explanations are omitted. By using the through holes 43 having such a shape, it is possible to further promote the flow of air from the outside to the inside of the case 40.

[0033] <Fifth to Eighth Embodiments> 10 to 13 are schematic perspective views showing the external appearances of sensor modules 2A to 2D according to the fifth to eighth embodiments of the present invention, respectively.

[0034] 10 to 13 differ from the sensor modules 1A to 1D according to the first to fourth embodiments, respectively, in that filters 61 to 64 are attached at positions overlapping with the through-hole 43. Since the other basic configurations are the same as those of the sensor modules 1A to 1D according to the first to fourth embodiments, respectively, the same elements are denoted by the same reference numerals and redundant explanations will be omitted.

[0035] The filters 61-64 are members for preventing the intrusion of dust, dirt, and other gas components that deteriorate the sensor element, and are attached along straight line portions 41B1 of the through-hole forming region 41B in the sensor modules 2A and 2B shown in Figures 10 and 11, and are attached along corner portions 41B2 of the through-hole forming region 41B in the sensor modules 2C and 2D shown in Figures 12 and 13. By using the filters 61-64 that selectively cover the through-hole forming region 41B without covering the central region 41A in this way, the suction nozzle 50 of the chip mounter does not come into contact with the filters 61-64, making it possible to prevent damage to the filters 61-64 during the mounting process.

[0036] The method of attaching the filters 61-64 can be a method of attaching a filter sheet having cuts that allow the filters 61-64 to be separated to the top plate portion 41, and peeling off unnecessary portions of the filter sheet so that the filters 61-64 remain on the top plate portion 41. This can reduce the number of steps compared to attaching the filters 61-64 individually.

[0037] <Ninth and Tenth Embodiments> 14 and 15 are schematic perspective views showing the external appearance of sensor modules 3A and 3B according to the ninth and tenth embodiments of the present invention, respectively.

[0038] 14 and 15 differ from the sensor modules 2A and 2B according to the fifth and sixth embodiments, respectively, in that a single ring-shaped filter 65 is used. Since the other basic configurations are the same as those of the sensor modules 2A and 2B according to the fifth and sixth embodiments, respectively, the same elements are given the same reference numerals and redundant explanations will be omitted.

[0039] As exemplified in the ninth and tenth embodiments, the filter attached to the top plate portion 41 may be a single member having a continuous shape. In this case, the adhesion area is enlarged, so that the adhesion strength between the top plate portion 41 and the filter can be increased. In order to further increase the adhesion strength of the filter, the filter may be attached to the entire inner surface of the top plate portion 41 (the surface facing the surface 11 of the substrate 10). In addition, the outer and inner shapes of the filter 65 are not rectangular, but are octagonal so that the filter 65 is sufficiently distant from the corners of the top plate portion 41. This makes it possible to prevent contact between the jigs 51 to 54 and the filter 65 in the inspection process shown in FIG. 6.

[0040] One method for attaching filter 65 is to attach a filter sheet with cuts to top plate portion 41, and then peel off the unnecessary portions located in central region 41A and outer region 41C so that filter 65 remains on top plate portion 41.

[0041] <Eleventh embodiment> FIG. 16 is a schematic plan view showing the appearance of a sensor module 3C according to the eleventh embodiment of the present invention.

[0042] The sensor module 3C shown in FIG. 16 differs from the sensor module 3A according to the ninth embodiment in that the inner shape of the filter 65 is a rectangle and the outer shape is a hexagon. Since the other basic configurations are the same as those of the sensor module 3A according to the ninth embodiment, the same elements are given the same reference numerals and the duplicated description is omitted. As shown in FIG. 16, the filter 65 has a two-fold symmetric shape in which the vicinity of two diagonally positioned corners of the top plate part 41 is cut out. When using a filter 65 having such a shape, if two diagonally positioned jigs 52, 53 are used in the inspection process shown in FIG. 6, it is possible to prevent the jigs 52, 53 from contacting the filter 65. In this way, it is not necessary for the filter 65 to be offset in all of the vicinity of the four corners of the top plate part 41, and it is acceptable for the vicinity of the two diagonally positioned corners to be offset.

[0043] <Twelfth embodiment> FIG. 17 is a schematic plan view showing the appearance of a sensor module 3D according to the twelfth embodiment of the present invention.

[0044] 17 differs from the sensor module 3C according to the eleventh embodiment in that the filter 65 has a rectangular outer shape and a four-fold symmetric shape with the top panel 41 cut out near the approximate center of the side. Since the other basic configurations are the same as those of the sensor module 3C according to the eleventh embodiment, the same reference numerals are used for the same elements and redundant explanations are omitted. When inspecting the sensor module 3D according to the twelfth embodiment, by pressing the cutout portions of the filter 65 with the jigs 51 to 54, it is possible to perform the inspection without blocking the through-hole 43 and without the filter 65 coming into contact with the jigs 51 to 54.

[0045] <Thirteenth embodiment> FIG. 18 is a schematic plan view showing the appearance of a sensor module 3E according to the thirteenth embodiment of the present invention.

[0046] The sensor module 3E shown in FIG. 18 differs from the sensor modules 3A to 3D according to the ninth to twelfth embodiments in that the top plate portion 41 of the case 40 is circular and the filter 65 has a three-fold symmetric shape. Since the other basic configurations are the same as those of the sensor modules 3A to 3D according to the ninth to twelfth embodiments, the same elements are given the same reference numerals and the duplicated description is omitted. The filter 65 is provided with three notches. When inspecting the sensor module 3E, the sensor module 3E is fixed by pressing the three notches provided in the filter 65 with three jigs. As exemplified in this embodiment, in the present invention, the top plate portion 41 of the case 40 does not need to be rectangular, and the mechanical strength can be further increased by using a case 40 having a circular top plate portion 41.

[0047] <Fourteenth embodiment> FIG. 19 is a schematic plan view showing the appearance of a sensor module 4A according to the fourteenth embodiment of the present invention.

[0048] The sensor module 4A shown in FIG. 19 is different from the sensor module 3A according to the ninth embodiment in that the filter 65 is provided with a cut portion 65a. Since the other basic configurations are the same as those of the sensor module 3A according to the ninth embodiment, the same elements are given the same reference numerals and the overlapping description is omitted. In this embodiment, the cut portion 65a is provided at a corner 41B2 of the through-hole forming region 41B. Here, if the region of the top plate portion 41 covered by the filter 65 is defined as the "attachment region", most of the attachment region overlaps with the through-hole forming region 41B. In contrast, if the region of the top plate portion 41 not covered by the filter 65 is defined as the "non-attachment region", the non-attachment region is composed of the central region 41A, the outer region 41C, and the cut region 41D that overlaps with the through-hole forming region 41B and connects the central region 41A and the outer region 41C.

[0049] 20 and 21 are schematic perspective views for explaining a part of the manufacturing process of the sensor module 4A according to the fourteenth embodiment.

[0050] 20, an aggregate substrate 10A on which a large number of sensor chips 20 and control ICs 30 are mounted is prepared, and cases 40 are fixed to the portions that will become the individual sensor modules 4A. In this state, a large-area filter sheet 66 is attached to the multiple cases 40. The filter sheet 66 has cuts that allow the individual filters 65 to be separated.

[0051] Next, as shown in FIG. 21, unnecessary portions of the filter sheet 66 are peeled off so that individual filters 65 remain in the case 40. When peeling off the unnecessary portions of the filter sheet 66, the filter 65 is separated from the unnecessary portions 66A, 66C, and 66D by lifting the filter sheet 66 from the cutting region 41D side. That is, peeling is performed by lifting the point 66P shown in FIG. 20 and FIG. 21. As a result, the unnecessary portion 66C covering the outer region 41C, the unnecessary portion 66D covering the cutting region 41D, and the unnecessary portion 66A covering the central region 41A are peeled off in this order, so that all of the unnecessary portions 66A, 66C, and 66D can be removed in one peeling process. Thereafter, the aggregate substrate 10A is cut and divided into a plurality of sensor modules 1A.

[0052] In this way, according to the sensor module 4A of the fourteenth embodiment, it is possible to simplify the peeling process of the filter sheet 66. In order to prevent the filter 65 from peeling off in the peeling process of the filter sheet 66, it is preferable to chamfer the edge portion of the filter 65 located at the boundary between the outer region 41C and the cutting region 41D as shown in FIG. 22. In the example shown in FIG. 22(a), the edge portion of the filter 65 is chamfered linearly, in the example shown in FIG. 22(b), the edge portion of the filter 65 is chamfered in an arc, and in the example shown in FIG. 22(c), the edge portion of the filter 65 is chamfered linearly and the resulting corner is chamfered in an arc. The dashed line in FIG. 22 indicates the chamfered portion.

[0053] In order to easily remove the unnecessary portion 66D, it is preferable that the width of the cutting region 41D is made wider from the central region 41A toward the outer region 41C as shown in Fig. 23. In the example shown in Fig. 23(a), the width of the cutting region 41D is made wider continuously from the central region 41A toward the outer region 41C, and in the example shown in Fig. 23(b), the edge portion of the filter 65 is largely chamfered in an arc shape, so that the width of the cutting region 41D is locally expanded near the outer region 41C. The dashed line in Fig. 23 indicates the position of the cutting region 41D before the expansion.

[0054] <Fifteenth embodiment> FIG. 24 is a schematic plan view showing the appearance of a sensor module 4B according to the fifteenth embodiment of the present invention.

[0055] The sensor module 4B shown in Fig. 24 differs from the sensor module 4A according to the fourteenth embodiment in that the cut portion 65a of the filter 65 is provided in the straight portion 41B1 of the through-hole formation region 41B. Since the other basic configurations are the same as those of the sensor module 4A according to the fourteenth embodiment, the same elements are given the same reference numerals and duplicated explanations are omitted. As exemplified in this embodiment, it is not essential to provide the cut portion 65a of the filter 65 in the corner portion 41B2.

[0056] In order to prevent the filter 65 from peeling off during the peeling process of the filter sheet 66, it is preferable to chamfer the edge portion of the filter 65 located at the boundary between the outer region 41C and the cutting region 41D as shown in Fig. 25. In the example shown in Fig. 25(a), the edge portion of the filter 65 is chamfered linearly, in the example shown in Fig. 25(b), the edge portion of the filter 65 is chamfered in an arc, and in the example shown in Fig. 25(c), the edge portion of the filter 65 is chamfered linearly and the resulting corner is chamfered in an arc. The dashed line in Fig. 25 indicates the chamfered portion.

[0057] In order to easily remove the unnecessary portion 66D, it is preferable that the width of the cutting region 41D is made wider from the central region 41A toward the outer region 41C as shown in Fig. 26. In the example shown in Fig. 26(a), the width of the cutting region 41D is made wider continuously from the central region 41A toward the outer region 41C, and in the example shown in Fig. 26(b), the edge portion of the filter 65 is largely chamfered in an arc shape, so that the width of the cutting region 41D is locally expanded near the outer region 41C. The dashed line in Fig. 26 indicates the position of the cutting region 41D before it is expanded.

[0058] <Sixteenth embodiment> FIG. 27 is a schematic plan view showing the appearance of a sensor module 4C according to the sixteenth embodiment of the present invention.

[0059] 27 differs from sensor module 4B according to the fifteenth embodiment in that the top panel 41 of case 40 is circular. Since the other basic configurations are the same as those of sensor module 4B according to the fifteenth embodiment, the same reference numerals are used for the same elements and redundant explanations are omitted. As illustrated in this embodiment, in the present invention, it is not necessary for the top panel 41 of case 40 to be rectangular, and by using a case 40 having a circular top panel 41, it is possible to further increase the mechanical strength.

[0060] Although a preferred embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications are possible without departing from the spirit of the present invention, and it goes without saying that these modifications are also included within the scope of the present invention. [Explanation of symbols]

[0061] 1A~1D, 2A~2D, 3A~3E, 4A~4C Sensor Module 10 Substrate 10A assembly board 11 Surface of the board 12 Back side of board 13 External terminal 20 Sensor chip 30 Control IC 40 cases 41 Top plate 41A Central area 41B Through-hole formation area 41B1 Straight section 41B2 Corner 41C Outer area 41D cutting area 42 Side plate part 43 Through hole 50 Suction nozzle 51~54 Jig 61~65 Filter 65a cutting section 66 Filter Sheet 66A,66C,66D Unnecessary parts 66P points

Claims

1. A substrate; a sensor chip mounted on a surface of the substrate and a control IC connected to the sensor chip; a case fixed to the substrate and covering the sensor chip and the control IC; The case has a top plate portion provided with a plurality of through holes, A portion of the plurality of through holes overlaps with the sensor chip. Sensor module.

2. Another part of the plurality of through holes overlaps with the control IC. The sensor module according to claim 1 .

3. Further comprising a filter overlapping the plurality of through holes. The sensor module according to claim 1 or 2.

Images