Printed circuit board
JP2025027423A5Pending Publication Date: 2026-06-16SAMSUNG ELECTRO MECHANICS CO LTD
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- SAMSUNG ELECTRO MECHANICS CO LTD
- Filing Date
- 2024-04-02
- Publication Date
- 2026-06-16
AI Technical Summary
Benefits of technology
【0008】 本発明の様々な効果のうち一効果として、厚いコア層を含む場合にも、受動素子などのチップを容易に埋め込むことができるプリント回路基板を提供することができる。
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Abstract
To provide a printed circuit board that can easily embed chips such as passive elements even when containing a thick core layer.SOLUTION: The present invention relates to a printed circuit board including: a first insulating layer having a penetration part; a chip laminate having a first chip with a back side opposite the front side where connection pads are located and a second chip attached to the back surface of the first chip and having a different thickness from the above first chip, and at least partially located in the penetration part; and a second insulating layer covering at least a portion of each of the first insulating layer and the chip laminate and filling at least a portion of the penetration part.SELECTED DRAWING: Figure 3
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