Glue supply device for gypsum board, manufacturing apparatus of gypsum board, and manufacturing method of gypsum board

Abstract

To provide a glue supply device for gypsum boards capable of stably supplying an appropriate amount of glue to board base paper of gypsum boards.SOLUTION: Provided is a glue supply device for a gypsum board which supplies glue to board base paper of the gypsum board includes: a tank 22 that stores the glue; supply ports 23A, 23B disposed on an end part side of the board base paper of the gypsum board and supplying the glue; and pumps 24A, 24B disposed between the tank and the supply ports in a supply route of the glue, where the pumps are positive displacement pumps.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a gypsum board glue supplying device, a gypsum board manufacturing device, and a gypsum board manufacturing method. [Background technology]

[0002] Patent Document 1 discloses a gypsum board having a configuration in which a gypsum core board is disposed between a lower surface sheet and an upper surface sheet. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 5-148001 Summary of the Invention [Problem to be solved by the invention]

[0004] Gypsum board is manufactured by supplying gypsum slurry between two sheets of board base paper, also called surface sheets, and molding the board.

[0005] In the process of manufacturing gypsum boards, two sheets of board base paper are glued together by applying glue to the overlapping areas. The two glued sheets of board base paper serve to support the gypsum slurry, since they hold the shape of the vicinity of the ends of the gypsum board after the gypsum slurry is shaped until the gypsum slurry is sufficiently hardened.

[0006] Conventionally, the supply speed of glue supplied and applied to the board base paper has been controlled by, for example, manually adjusting the opening of the valve of the glue supply line. This has led to problems such as differences in the opening of the valve of the glue supply line depending on the operator, resulting in variations in the amount of glue supplied. Also, when the amount of glue to be supplied is small, it is difficult to adjust the opening of the valve.

[0007] If the amount of glue supplied to the board base paper is insufficient, problems such as a decrease in adhesive strength between the two board base papers occur. If the adhesive strength between the two board base papers is insufficient, the board base paper will not be able to adequately support the gypsum slurry after the supplied gypsum slurry is formed until it hardens, which will cause defective products such as the shape of the edges of the obtained gypsum board not meeting standards.

[0008] In addition, if too much glue is supplied to the board base paper, the glue consumption increases, which causes a problem of rising gypsum board manufacturing costs. Furthermore, if too much glue is supplied to the board base paper, the glue may overflow from the board base paper, adhere to the molding machine, etc., and solidify together with the paper powder. If the solidified material adhered to the molding machine, etc., comes into contact with the surface of the gypsum board being manufactured, it will cause a dent in the gypsum board, which will cause defective products.

[0009] In view of the problems with the above-mentioned conventional technology, an object of one aspect of the present invention is to provide a glue supplying device for gypsum boards that can stably supply an appropriate amount of glue to board base paper. [Means for solving the problem]

[0010] In order to solve the above problems, according to one aspect of the present invention, there is provided a gypsum board glue supplying device for supplying glue to a board base paper of a gypsum board, A tank portion for storing the glue; A supply port is provided on an end side of the board base paper of the gypsum board and supplies the glue; A pump unit is disposed on the glue supply path between the tank unit and the supply port, The pump unit is a positive displacement pump. Effect of the Invention

[0011] According to one aspect of the present invention, it is possible to provide a gypsum board glue supplying device that can stably supply an appropriate amount of glue to board base paper. [Brief description of the drawings]

[0012] [Figure 1A] FIG. 1A is an explanatory diagram of the adhesive portion of the board base paper. [Figure 1B] FIG. 1B is an explanatory diagram of the adhesive portion of the board base paper. [Figure 1C] FIG. 1C is an explanatory diagram of the adhesive portion of the board base paper. [Diagram 2] FIG. 2 is an explanatory diagram of a gypsum board glue supplying device in an embodiment of the present invention. [Diagram 3] FIG. 3 is a side view of the vicinity of a supply port of the plaster board glue supplying device of FIG. [Figure 4A] FIG. 4A is an explanatory diagram of an extension member. [Figure 4B] FIG. 4B is an explanatory diagram of the spreading member. [Figure 4C] FIG. 4C is an explanatory diagram of the spreading member. [Figure 4D] FIG. 4D is an explanatory diagram of the spreading member. [Diagram 5] FIG. 5 is an explanatory diagram of a gypsum board manufacturing apparatus according to an embodiment of the present invention. [Figure 6] FIG. 6 is an explanatory diagram of a gluing defect inspection device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, the form for carrying out the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiment, and various modifications and substitutions can be made to the following embodiment without departing from the scope of the present invention. [Glue supply device for gypsum board] (1) Regarding the adhesive joints of gypsum board base paper Before describing the gypsum board glue supplying device of this embodiment, the adhesive portion of the board base paper will be described with reference to Figs. 1A to 1C.

[0014] 1A to 1C are diagrams that diagrammatically show a cross section near an end portion in the width direction of a gypsum board.

[0015] 1A has a gypsum core 110 made of a hardened gypsum slurry, a first board base paper 111, and a second board base paper 112. The gypsum board 11 has a form in which the gypsum core 110 is covered with the first board base paper 111 and the second board base paper 112.

[0016] The end 11A of the gypsum board 11 has a square edge, and the edge angle α is set to a substantially right angle. The first board base paper 111 is folded at corners 111A and 111B to form the end 11A of the gypsum board 11. Glue is applied or adhered to the end region of the surface of the second board base paper 112 facing the first board base paper 111, and the second board base paper 112 is placed on the upper surface of the end of the first board base paper 111 to form an adhesive portion 113.

[0017] 1B also has a gypsum core 120 made of a hardened gypsum slurry, a first board base paper 121, and a second board base paper 122. The gypsum board 12 has a form in which the gypsum core 120 is covered with the first board base paper 121 and the second board base paper 122.

[0018] The end 12A of the gypsum board 12 has a bevel edge. The first board base paper 121 is folded at corners 121A, 121B, and 121C to form the end 12A of the gypsum board 12. Glue is applied or adhered to the end region of the surface of the second board base paper 122 facing the first board base paper 121, and the second board base paper 122 is placed on the upper surface of the end of the first board base paper 121 to form an adhesive portion 123.

[0019] 1C also has a gypsum core 130 made of a hardened gypsum slurry, a first board base paper 131, and a second board base paper 132. The gypsum board 13 has a form in which the gypsum core 130 is covered with the first board base paper 131 and the second board base paper 132.

[0020] The gypsum board 13 has a tapered edge at the end 13A. The first board base paper 131 is folded at corners 131A, 131B, and 131C to form the end 13A of the gypsum board 13. Glue is applied or adhered to the end region of the surface of the second board base paper 132 facing the first board base paper 131, and the second board base paper 132 is placed on the upper surface of the end of the first board base paper 131 to form an adhesive portion 133.

[0021] The gypsum board glue supplying device of this embodiment is a device that supplies glue to an end area of ​​the surface of the second board paper facing the first board paper in order to form an adhesive portion between the first board paper and the second board paper. For example, like a gypsum board manufacturing device described later, the device can be installed on a gypsum board manufacturing line when manufacturing gypsum boards. (2) Gypsum board glue supply device An example of the configuration of the gypsum board glue supplying device of this embodiment will be described.

[0022] The gypsum board glue supplying device of this embodiment (hereinafter also referred to as the "glue supplying device") is a gypsum board glue supplying device that supplies glue to the board base paper of a gypsum board, and has a tank section, a supply port, and a pump section, which are described below.

[0023] The tank portion is a member for storing glue.

[0024] The supply port is installed on the end side of the board base paper of the gypsum board, and can supply glue.

[0025] The pump unit is disposed on the glue supply path between the tank unit and the supply port. The pump unit may be a positive displacement pump.

[0026] An example of the configuration of the glue supplying device of this embodiment will be described with reference to Figs. 2 to 4D.

[0027] FIG. 2 is a schematic diagram showing the glue supplying device 20 of this embodiment when supplying glue to end regions 211A, 211B on the widthwise ends 21A, 21B sides of a board base paper 21 being transported along block arrow A.

[0028] FIG. 3 is a side view of the periphery of the supply port 23B of the glue supply device 20 shown in FIG.

[0029] 4A to 4D are explanatory diagrams of the configuration when the spreading member is a spatula.

[0030] As shown in FIG. 2, when manufacturing a gypsum board, it is common to apply glue to end regions 211A, 211B at both ends of board base paper 21. For this reason, as shown in FIG. 2, the glue supplying device 20 of this embodiment preferably has two supply ports 23A, 23B for supplying glue in accordance with the number of end regions 211A, 211B to be applied. It is also preferable to have two pump units in accordance with the supply ports 23A, 23B. However, this is not limited to the above embodiment, and the glue supplying device of this embodiment may have, for example, one supply port and one pump unit. In this case, multiple glue supplying devices can be used in accordance with the number of end regions to which glue is applied.

[0031] Hereinafter, the members of the glue supplying device of this embodiment will be described using the glue supplying device 20 shown in FIG. 2 as an example. (2-1) Tank section The tank section 22 is a tank for storing glue to be supplied to the board base paper 21. There are no particular limitations on the shape, etc. of the tank section as long as it can store glue. There are also no particular limitations on the number of tank sections that the glue supplying device 20 has, and there may be, for example, one or more tank sections.

[0032] Even if the glue supplying device of this embodiment has multiple supply ports and pump units as described above, it may have only one tank unit 22 and a pipe for supplying glue from the tank unit 22 to the supply port may be branched, as shown in Fig. 2. The glue supplying device 20 of this embodiment may also have multiple tank units 22, for example, two tank units 22, in accordance with the supply ports and pump units.

[0033] The tank section 22 may function as a temporary buffer tank, i.e., an auxiliary tank. When the tank section 22 is a buffer tank, one or more main tank sections 28 may be provided upstream of the tank section 22 in the glue supply path, and the main tank section 28 and the tank section 22 may be connected by the third pipe 253. In addition, a pump for transporting glue from the main tank section 28 to the tank section 22 may be provided on the glue supply path of the third pipe 253 as necessary. The type of pump is not particularly limited as long as the pump can transport glue to the tank section 22. In addition, when a plurality of main tank sections 28 are provided, a valve for switching the main tank section 28 connected to the tank section 22 may be provided between the main tank section 28 and the tank section 22.

[0034] It is also possible to eliminate the main tank section 28 and use only the tank section 22 as the tank for storing glue. (2-2) Supply port The supply port is installed on the end side of the board base paper of the gypsum board, and can supply glue. The number of supply ports of the glue supply device of this embodiment is not particularly limited, and may be one or more. For example, as shown in FIG. 2, the number of supply ports may be two in accordance with the number of end areas to be coated.

[0035] 2, when the glue supplying device 20 of this embodiment has two supply ports, the supply ports 23A and 23B can be arranged, for example, on both end sides of the board base paper 21 of the gypsum board, i.e., on the end 21A and 21B sides, respectively. The supply ports 23A and 23B can supply glue to the end regions 211A and 211B.

[0036] The supply ports 23A, 23B can be constituted by, for example, end portions of second pipes 252A, 252B connected to the pump portions 24A, 24B described below, opposite the end portions connected to the pump portions 24A, 24B.

[0037] The supply ports 23A, 23B can be installed to face the end regions 211A, 211B of the board base paper 21, for example, as shown in Fig. 3. The end regions 211A, 211B refer to regions within a predetermined distance from the ends 21A, 21B of the board base paper 21 in the width direction, respectively.

[0038] The size of the end regions 211A, 211B is not particularly limited because it is selected depending on the width of overlap with other board base papers to be bonded, etc. The shape of the supply ports 23A, 23B is not particularly limited, and may be circular as shown in Fig. 3, or may be elliptical, polygonal, or other shapes to match the shape of the end regions 211A, 211B.

[0039] The pump sections 24A, 24B and the supply ports 23A, 23B can be connected by the second pipes 252A, 252B. As described above, the supply ports 23A, 23B may be constituted by the second pipes 252A, 252B.

[0040] At least the inner circumferential surfaces of the second pipes 252A and 252B are preferably made of silicone resin.More preferably, the second pipes 252A and 252B are made of silicone resin hoses.

[0041] When the glue supply device is used for a long period of time, the glue may solidify and form lumps, resulting in residue. If such residue forms inside the pipes, it may interfere with the supply of glue, or the residue may be discharged as lumps onto the board base paper, causing defective products. In response to this, by making the inner circumferential surface of the second pipes 252A and 252B out of silicone resin, even if the glue partially solidifies, it can be discharged before it grows into a large lump. This makes it possible to prevent the glue supply from being hindered, or the residue from being discharged as lumps onto the board base paper.

[0042] For the same reasons, it is preferable that at least the inner surface of the pipes that connect components such as the first pipe 251 and the third pipe 253, which come into contact with the glue, is made of silicone resin, and it is more preferable that the pipes be made of silicone resin hoses. (2-3) Pump section The pump units 24A and 24B can be disposed on the glue supply path between the tank unit 22 and the supply ports 23A and 23B, and are provided for each of the supply ports 23A and 23B. When two pump units and two supply ports are provided as shown in Fig. 2, two pump units 24A and 24B can be disposed in parallel on the glue supply path between the tank unit 22 and each of the supply ports 23A and 23B.

[0043] In addition, in the case of the glue supply device 20 shown in FIG. 2, the glue supply path between the tank portion 22 and each of the supply ports 23A, 23B is composed of a first pipe 251 and second pipes 252A, 252B.

[0044] The pump sections 24A and 24B may be positive displacement pumps.

[0045] A positive displacement pump is a pump that changes the volume of a liquid material such as glue that is in a fixed spatial volume by reciprocating or rotating motion, imparting energy to the liquid material, and transports it.

[0046] A positive displacement pump can supply a fixed amount of liquid material such as glue at a constant speed. Positive displacement pumps can be broadly divided into rotary positive displacement pumps and reciprocating positive displacement pumps, and the supply amount can be easily and precisely controlled by controlling the conditions of the rotary motion or reciprocating motion.

[0047] Therefore, by supplying glue from the tank 22 to the supply ports 23A and 23B using the pump section, which is a volumetric pump, a stable supply of an appropriate amount of glue to the board base paper can be achieved. As a result, the board base papers can be stably bonded together, and the end shape of the gypsum board can be made into the desired shape. In addition, during the manufacture of gypsum boards, the occurrence of defective products in which the shape of the end of the gypsum board does not meet the standard can be suppressed. Furthermore, adhesion of solidified glue to the molding machine due to glue overflowing from the board base paper can be suppressed, and the occurrence of dents on the surface of the gypsum board due to such solidified glue can be suppressed. This increases the yield of gypsum boards.

[0048] When adjusting the amount of glue supplied by adjusting the valve opening as in the conventional method, for example, when the amount of glue supplied is small, it is difficult to adjust the valve opening so that the amount of glue supplied can be stabilized and an appropriate amount can be supplied. Furthermore, the flow rate can be unstable due to the above-mentioned solidified glue clumps getting caught in the valve. However, with a positive displacement pump, the supply amount can be precisely controlled even when the flow rate is small. Therefore, with the glue supply device 20 of this embodiment, even when the amount of glue supplied from the supply ports 23A and 23B is small, the supply amount can be stabilized. Furthermore, even when the above-mentioned solidified glue clumps occur, the supply amount can be stabilized more than in the case of adjusting the supply amount of glue by adjusting the valve opening, which is the conventional technology.

[0049] Positive displacement pumps can be broadly classified into rotary positive displacement pumps (rotary pumps) and reciprocating positive displacement pumps (reciprocating pumps). Rotary positive displacement pumps are positive displacement pumps that suck and discharge liquid materials by the rotational motion of rotating parts, and examples thereof include gear pumps, vane pumps, and screw pumps. Reciprocating positive displacement pumps are positive displacement pumps that suck and discharge liquid materials by the reciprocating motion of parts, and examples thereof include piston pumps, plunger pumps, and diaphragm pumps. The positive displacement pumps used in the pump sections 24A and 24B of the glue supply device 20 of this embodiment may be either rotary positive displacement pumps or reciprocating positive displacement pumps, but rotary positive displacement pumps are preferred. The viscosity of glue may change depending on temperature, etc., but by using rotary positive displacement pumps in the pump sections 24A and 24B, the variation in the flow rate of glue due to the change in viscosity of glue can be particularly suppressed. Furthermore, the glue may harden and adhere to the inner surfaces of the pump sections 24A and 24B, causing residue, but the rotary positive displacement pump is able to prevent such residue from occurring and ensure a stable supply of glue.

[0050] The positive displacement pumps used in the pump sections 24A and 24B are preferably screw pumps. A screw pump is a type of pump that uses a screw-type rotor to transport an object, and is also called a screw pump.

[0051] In a screw pump, a screw-shaped rotor rotates inside the stator, forming a series of independent sealed spaces called cavities in the gap between the rotor and the stator. As the rotor rotates inside the stator, the cavities move toward the discharge side while generating a strong suction force, allowing the glue to be transported.

[0052] According to such a screw pump, non-pulsating, constant-volume transport can be realized, so that the supply amount of glue can be controlled particularly precisely, and thus it can be preferably used as a positive displacement pump as described above.

[0053] Among the screw pumps, a single-shaft screw pump is particularly preferably used. As a single-shaft screw pump, for example, a single-shaft eccentric screw pump (also called a Moano Pump (registered trademark)) is known and can be preferably used.

[0054] Pump section 24A and pump section 24B may be different types of pumps, but since it is preferable to supply glue to each end region of board base paper 21 at the same supply speed, it is preferable that pump section 24A and pump section 24B are the same type of pump.

[0055] The pump units 24A and 24B can be connected to the tank unit 22 by first pipes 251A and 251B. In Fig. 2, the first pipe 251 branches into the first pipes 251A and 251B, but a first pipe may be provided for each of the pump units 24A and 24B and directly connected to the tank unit 22. Note that arranging the pump units 24A and 24B in parallel means, in the example of Fig. 2, arranging the pump unit 24A on the path of the first pipe 251A and the second pipe 252A, and arranging the pump unit 24B on the path of the first pipe 251B and the second pipe 252B.

[0056] The glue supplying device of the present embodiment may further include any optional members. (2-4) Control section The glue supplying device 20 may further include a control unit 26 .

[0057] The control unit 26 can control the operation of the pump units 24A and 24B. More specifically, the control unit 26 can control the supply speed of glue from the tank unit 22 to the supply ports 23A and 23B by the pump units 24A and 24B. The supply speed of glue means the amount of glue supplied per unit time.

[0058] The control unit 26 can control the supply speed of the glue according to the transport speed of the board base paper 21 to which the glue is supplied. The transport speed of the board base paper 21 is selected according to the manufacturing conditions of the gypsum board that uses the board base paper, and can be said to constitute the manufacturing conditions of the gypsum board. Therefore, the control unit 26 can control the supply speed of glue from the tank unit 22 to the supply ports 23A, 23B by the pump units 24A, 24B according to the manufacturing conditions of the gypsum board manufactured by, for example, a gypsum board manufacturing device to which the glue supplying device 20 is attached.

[0059] By controlling the supply speed of glue from tank 22 to supply ports 23A, 23B by pumps 24A, 24B with control unit 26 in accordance with the manufacturing conditions of the gypsum board to be manufactured, glue can be supplied onto the board base paper under optimal conditions in accordance with the manufacturing conditions of the gypsum board to be manufactured. Also, compared to manually adjusting the opening of the glue valve to control the amount of glue supplied to the board base paper, the glue supply speed can be switched to the optimal conditions in a short time when, for example, the manufacturing conditions of the gypsum board to be manufactured are changed.

[0060] Therefore, when changing the type of gypsum board to be manufactured, the time required to switch manufacturing conditions can be shortened, and the occurrence of products that do not meet standards during the switching of manufacturing conditions can be suppressed.

[0061] The control unit 26 may include a CPU which is an arithmetic processing unit for performing calculations necessary for control, a RAM or ROM which is a main memory device, an auxiliary memory device, an input / output interface, a display device which is an output device, etc. The CPU, main memory device, auxiliary memory device, input / output interface, and output device of the control unit 26 may be connected to each other via a bus. All of the above members of the control unit 26 do not need to be housed in the same housing, and for example, the auxiliary memory device and the display device may be provided externally. The auxiliary memory device is a storage device such as an SSD or HDD.

[0062] CPU is an abbreviation for Central Processing Unit, RAM is an abbreviation for Random Access Memory, ROM is an abbreviation for Read Only Memory, SSD is an abbreviation for Solid State Drive, and HDD is an abbreviation for Hard Disk Drive.

[0063] The input / output interface may be, for example, a wired or wireless interface for exchanging control variables, data on the operation status, and the like with the pump units 24A and 24B. If necessary, the controller 26 may be configured to be able to exchange data with the tank unit 22, and to acquire data on the amount of glue remaining in the tank unit 22, the temperature, and the like. In this case, the controller 26 may also use data from the tank unit 22 when determining the control conditions.

[0064] Examples of the input / output interface include user interfaces such as a touch panel, keyboard, and operation buttons for selecting control conditions.

[0065] The control unit 26 can be configured with a personal computer (PC) or the like. Therefore, the above-mentioned units of the control unit 26 may be realized by software and hardware working together in an information processing device such as a personal computer, in which a CPU executes a program stored in advance.

[0066] 2 shows an example in which pump units 24A and 24B are controlled by one control unit 26, but the present invention is not limited to this embodiment, and a control unit may be provided for each of pump units 24A and 24B. When a plurality of control units are provided, the control units may be configured to exchange control data between them as necessary.

[0067] When the pump units 24A, 24B are rotary positive displacement pumps among the positive displacement pumps, the control unit 26 can control the rotation speed of the pumps. By using rotary positive displacement pumps as the pump units 24A, 24B and controlling the rotation speed of the pumps, the supply speed of glue supplied from the pump units 24A, 24B to the board base paper 21 via the supply ports 23A, 23B can be easily controlled to a desired value. (2-5) Storage section The glue supplying device 20 may have a memory unit 27 .

[0068] The memory unit 27 can store glue supply conditions, specifically, glue supply conditions corresponding to a plurality of manufacturing conditions for gypsum boards. In this case, the control unit 26 can select and acquire the glue supply conditions stored in the memory unit 27 according to the manufacturing conditions of the gypsum board to be manufactured, and control the glue supply speed from the tank unit 22 to the supply ports 23A and 23B by the pump units 24A and 24B.

[0069] The glue supply conditions corresponding to a number of gypsum board manufacturing conditions are prepared in advance as a recipe and stored in the memory unit 27. The glue supply speed is controlled according to the recipe and the gypsum board manufacturing conditions, so that an optimal amount of glue can be supplied onto the board base paper. Also, unlike when the glue supply amount is manually controlled by the valve opening, this eliminates variation in control conditions due to the operator, and enables the manufacture of gypsum boards of particularly stable quality.

[0070] The storage unit 27 can be configured with a storage device such as an SSD or HDD, and when the control unit 26 is configured with a personal computer, the storage unit 27 can also be configured with an auxiliary storage device of the personal computer. (2-6) Spreading member The glue supplying device 20 may further include spreading members 29A, 29B that spread the glue on the board base paper 21. The spreading members refer to members that spread and expand the glue supplied onto the board base paper 21 over the board base paper 21, as described above.

[0071] As shown in Fig. 3, the spreading member 29B can spread the glue 32 supplied from the supply port 23B onto the edge region 211B of the board base paper 21 over a predetermined range of the edge region 211B while suppressing the variation in thickness. Although Fig. 3 shows only the spreading member 29B side, the spreading member 29A side can be configured in the same way.

[0072] The spreading members 29A and 29B may be any member capable of spreading the glue, such as a spatula, roller, or brush, with a spatula being particularly preferred.

[0073] When spatulas are used as the spreading members 29A and 29B, the spreading members 29A and 29B can be formed in a plate shape, for example, as the spreading member 29B shown in Fig. 4A. Note that Fig. 4A is a view of the spreading member 29B when viewed along the arrow C in Fig. 3. The same applies to Figs. 4B to 4D below. However, if the spreading members 29A and 29B are simply in a plate shape and the distance between them and the board base paper 21 is short, the glue may become thin in the area where the spreading members 29A and 29B have passed, and the glue may become thick in the area 293 (see Fig. 2) adjacent to the area where the spreading members 29A and 29B have passed.

[0074] Therefore, when a spatula is used as the spreading member 29A, 29B, it is preferable that a notch 292A is provided at the end 291 of the spatula, which is the spreading member, facing the board base paper, as in the spreading member 29B shown in FIG. 4B. By providing the notch 292A, the thickness of the glue can be made thicker at the notch 292A portion. Therefore, it is possible to prevent the thickness of the glue from becoming thin in the entire area through which the spreading members 29A, 29B have passed, and it is possible to suppress the thickness of the glue from varying greatly in the end areas 211A, 211B of the board base paper 21. The shape, size, and number of the notch 292A are not particularly limited, and can be selected according to the thickness of the glue required for the end areas 211A, 211B, the type of glue used, and the like. For example, the shape of the notch can be one or more shapes selected from shapes such as a polygon, a semicircle, and a semiellipse. As shown in FIG. 4B, the notch 292A may be a slit in a rectangular shape. As shown in FIG. 4C, the cutout 292B may be semi-elliptical, or as shown in FIG. 4D, the cutout 292C may be triangular. The cutouts on one spatula do not need to be the same in shape or size, and may have cutouts of different shapes and sizes. In FIG. 4A to FIG. 4D, one spreading member 29B is shown as an example, but the other spreading member 29A can be configured in the same way. However, the spreading member 29A and the spreading member 29B of the glue supplying device 20 may have the same or different configurations of the cutouts, etc.

[0075] When installing the spreading members 29A, 29B, it is preferable to provide a support member, such as a roller 31, on the opposite side of the board base paper 21 to the part where the spreading members 29A, 29B are provided, as shown in Figure 3.

[0076] The rollers 31 are provided to support, that is, bear, the load of the spreading members 29A, 29B and the board base paper 21. The spreading members 29A, 29B are supported by the rollers 31 via the board base paper 21.

[0077] For this reason, by providing the rollers 31, it is possible to prevent the force applied by the spreading members 29A, 29B from escaping when the spreading members 29A, 29B press and spread the glue against the board base paper 21. Also, by providing the rollers 31, it is possible to prevent the board base paper 21 from being damaged, etc., when the spreading members 29A, 29B press and spread the glue against the board base paper. [Gypsum board manufacturing equipment] Next, a configuration example of the gypsum board manufacturing apparatus of this embodiment will be described.

[0078] The gypsum board manufacturing apparatus of this embodiment can include the above-mentioned gypsum board glue supplying apparatus.

[0079] The gypsum board manufacturing apparatus of this embodiment can have various means necessary for manufacturing a gypsum board in addition to the above-mentioned glue supplying device.

[0080] A configuration example of a gypsum board manufacturing apparatus 50 of this embodiment will be described with reference to Fig. 5. In addition to the above-mentioned glue supplying device 20, the gypsum board manufacturing apparatus 50 has a mixer 52 which is a mixing means for mixing raw materials, and a molding machine 58 which molds the gypsum slurry prepared by the mixer 52. The configuration example of the apparatus will be specifically described below. (1) Mixer Mixer 52 can be disposed at a predetermined position related to the conveying line for first board base paper 511, second board base paper 512, etc., for example, above or beside the conveying line. Then, in the single mixer 52, calcined gypsum, which is a raw material for the gypsum slurry, and water, and optionally further various additives, can be mixed to prepare the gypsum slurry.

[0081] Here, calcined gypsum is also known as calcium sulfate 1 / 2 hydrate, and is an inorganic composition with hydraulic properties. As the calcined gypsum, β-type calcined gypsum or α-type calcined gypsum alone, or a mixture of the two can be used. β-type calcined gypsum is obtained by calcining in the air either natural gypsum, by-product gypsum, flue gas desulfurization gypsum, recycled gypsum such as waste gypsum board, or a mixture of any of these. α-type calcined gypsum is obtained by calcining in water (including steam) either natural gypsum, by-product gypsum, flue gas desulfurization gypsum, recycled gypsum such as waste gypsum board, or a mixture of any of these.

[0082] When manufacturing a gypsum board, the calcined gypsum used as a raw material preferably contains β-type calcined gypsum, and the main component of the calcined gypsum used as a raw material for the gypsum board is more preferably β-type calcined gypsum. Note that the main component of the calcined gypsum used as a raw material for the gypsum board is β-type calcined gypsum, which means that the calcined gypsum used as a raw material for the gypsum board is β-type calcined gypsum by mass ratio of more than 50%. When manufacturing a gypsum board, the calcined gypsum used as a raw material may be composed of only β-type calcined gypsum.

[0083] To produce α-type calcined gypsum, it is necessary to pressurize and calcinate dihydrate gypsum such as natural gypsum in water or steam using an autoclave. On the other hand, β-type calcined gypsum can be produced by calcining dihydrate gypsum such as natural gypsum in the atmosphere at normal pressure, and β-type calcined gypsum can be produced more productively than α-type calcined gypsum.

[0084] Examples of additives include one or more selected from adhesion improvers such as starch and polyvinyl alcohol that improve the adhesion between the gypsum hardened body (hardened gypsum slurry) and the base paper for the board, inorganic fibers such as glass fiber, lightweight aggregates, fire-resistant materials such as vermiculite, setting retarders, setting accelerators, water reducing agents, foaming agents such as sodium alkyl sulfate, alkyl ether sulfates, sodium alkylbenzene sulfonates, and polyoxyethylene alkyl sulfates, bubble size adjusters such as sulfosuccinate-type surfactants, water repellents such as silicone and paraffin, organic carboxylic acids, and organic carboxylates.

[0085] The calcined gypsum and some of the additives, for example, solid additives, may be mixed and stirred in advance to form a gypsum composition as a mixture, which may then be supplied to the mixer 52.

[0086] Also, foam can be added to one or more selected from gypsum slurry collection ports 521, 522, and 523, and the amount of foam added can be adjusted to produce a gypsum slurry of any density. For example, high-density first gypsum slurry 53 can be prepared by adding no foam or a small amount of foam to collection ports 521 and 522. Then, low-density second gypsum slurry 54 can be prepared by adding more foam to collection port 523 than to the first gypsum slurry.

[0087] The obtained first gypsum slurry 53 is supplied through delivery pipes 551, 552 onto first board base paper 511 and second board base paper 512 upstream of roller coater 56 in the conveying direction of the board base paper.

[0088] High-density first gypsum slurry 53 supplied onto first board base paper 511 and second board base paper 512 each reach the spreading section of roller coater 56, and is spread in the spreading section. Roller coater 56 can have application roller 561, receiving roller 562, and lees removal roller 563. Then, when each board base paper passes between application roller 561 and receiving roller 562, first gypsum slurry 53 can be spread onto the board base paper.

[0089] In this way, a thin layer of the first gypsum slurry 53 is formed on the first board base paper 511. After that, the first board base paper 511 is folded and both side edge portions thereof extend upward and then extend inward. A thin layer of the first gypsum slurry 53 is also formed on the second board base paper 512, but unlike the first board base paper 511, the second board base paper 512 is not folded. Note that the first gypsum slurry 53 is not limited to being applied to both the first board base paper 511 and the second board base paper 512. For example, the first gypsum slurry 53 may be applied to only one of the first board base paper 511 or the second board base paper 512. The first gypsum slurry 53 may also be disposed only on the side end portions, which are the ends in the width direction of the first board base paper 511.

[0090] The first board base paper 511 is conveyed as is, and the second board base paper 512 is turned by a turning roller 57 in the direction of the conveying line of the first board base paper 511 . (2) Glue supply device Glue can be supplied and applied to the edge area of ​​the second board base paper 512 by the glue supplying device 20 described above.

[0091] A liquid adhesive is preferably used as the above-mentioned glue, and a starch-based adhesive, a natural rubber latex adhesive, or a synthetic adhesive is more preferable, and an aqueous emulsion adhesive is even more preferable. Note that a liquid adhesive means an adhesive that is liquid at the temperature of use, for example, room temperature (27°C).

[0092] The location where the glue supplying device 20 is installed is not particularly limited, but it can be installed, for example, before the gypsum slurry is supplied to the second board base paper 512.

[0093] The glue supply device 20 has already been described, so a detailed description will be omitted. If the glue supply device has spreading members 29A and 29B, it is preferable to also install the spreading members 29A and 29B and the roller 31 described above for supporting the load of the board base paper 21, as shown in FIG. (3) Molding machine First board base paper 511 and second board base paper 512 being transported inside gypsum board manufacturing apparatus 50 reach forming machine 58. Here, second gypsum slurry 54 is supplied from mixer 52 through pipe 553 between the thin layer of first gypsum slurry 53 formed on first board base paper 511 and second board base paper 512. Therefore, a continuous laminate can be formed between first board base paper 511 and second board base paper 512, in which a layer formed by first gypsum slurry 53, a layer formed by second gypsum slurry 54, and a layer formed by first gypsum slurry 53 are laminated.

[0094] Note that the present invention is not limited to a configuration in which a high-density first gypsum slurry and a low-density second gypsum slurry are used, and for example, a configuration in which a gypsum slurry of one type of density is produced and supplied onto a base paper for a board may also be used.

[0095] Specifically, for example, a gypsum slurry having a predetermined density is supplied and piled up on the first board base paper 511 that is continuously conveyed. Then, each end region, which is the end in the width direction of the first board base paper 511, is folded along a predetermined score line and extends upward and then inward, so that the piled layer of the gypsum slurry can be partially rolled up. After this, the second board base paper 512 that is conveyed at the same speed can be laid on the piled layer of the gypsum slurry that is partially rolled up by the first board base paper 511. Next, the gypsum board is molded by passing it through a molding machine that determines the thickness and width of the gypsum board. The gypsum board can also be molded by the above procedure. In this case, a layer of gypsum slurry with a certain density is formed between the first board base paper and the second board base paper.

[0096] In this manner, in the molding machine 58 of the gypsum board manufacturing apparatus 50, a molding step of molding the gypsum slurry can be carried out, and thus the gypsum slurry molded body 59 can be manufactured.

[0097] The gypsum board manufacturing apparatus of this embodiment may further include any optional members as necessary. (4) Dryer, cutting device In the gypsum board manufacturing apparatus of this embodiment, a dryer, a cutting device, and the like can be provided, for example, downstream of the forming machine 58, as necessary.

[0098] The dryer can reduce excess moisture in the gypsum slurry molded body.

[0099] One or more cutting devices can be provided as necessary. For example, a first cutting device (rough cutting device) can be provided to roughly cut the manufactured gypsum board for the purpose of placing it in a dryer. Also, a second cutting device can be provided to cut the board to the size of the final product. (5) Inspection equipment The gypsum board manufacturing apparatus of this embodiment may also include various inspection devices. For example, it may include a gluing defect inspection device 60 that inspects whether or not there is a gluing defect in the adhesive joint described above.

[0100] When a gluing defect occurs at the bonded portion between the first board base paper and the second board base paper, the bonded portion has a tendency to bulge. The gluing defect inspection device 60 utilizes this tendency.

[0101] 6, the gluing defect inspection device 60 has a light-emitting unit 61 that irradiates a laser light 611 along the width direction of the gypsum slurry molded body 59, a light-receiving unit 62 that receives light from the light-emitting unit 61, and a judgment unit 63. The light-emitting unit 61 is disposed on the side of a first end 591 which is an end in the width direction of the gypsum slurry molded body 59. The light-receiving unit 62 is disposed on the side of a second end 592 which is the opposite side to the first end 591, among the ends in the width direction of the gypsum slurry molded body 59.

[0102] Of the laser light 611 irradiated from the light-emitting unit 61, a portion of the light 611A is blocked by the gypsum slurry molded body 59, and the light does not reach the light-receiving unit 62. Of the laser light 611 irradiated from the light-emitting unit 61, the remaining portion of the light 611B reaches the light-receiving unit 62 and is detected.

[0103] The determination unit 63 can determine whether or not there is a gluing defect based on the height of the area of ​​the laser light 611 emitted by the light emitter 61 that is blocked by the gypsum slurry molding 59 and cannot be received by the light receiver 62.

[0104] When the judgment unit 63 detects a gluing defect, the part where the gluing defect is detected can be identified by applying a mark or the like, and the product can be rejected as a defective product after being cut by a cutting device, for example.

[0105] Furthermore, it is also possible to set the controller 26 (see FIG. 2) to issue a command to increase the glue supply speed when a gluing defect occurs.

[0106] The inspection device is not limited to the above-mentioned gluing defect inspection device, and the gypsum board manufacturing apparatus 50 can also have, for example, a size / weight inspection device that inspects whether the size, weight, etc. of the manufactured gypsum board are within standards.

[0107] According to the gypsum board manufacturing apparatus of this embodiment, since the above-mentioned glue supplying device is used, an appropriate amount of glue can be stably supplied to the second board base paper. Therefore, it is possible to prevent gluing defects from occurring in the adhesive portion between the first board base paper and the second board base paper. As a result, the end shape in the width direction of the gypsum board can be made into a predetermined shape, and the occurrence of defective products that do not meet the standards can be prevented. [Manufacturing method of gypsum board] The method for manufacturing a gypsum board of this embodiment can include a glue supplying step of supplying glue to the board base paper by the above-mentioned gypsum board glue supplying device.

[0108] The method for manufacturing a gypsum board according to the present embodiment can include, for example, the following steps.

[0109] A gypsum slurry preparation process in which calcined gypsum, which is a raw material for the gypsum slurry, and water, and optionally various additives are mixed together to prepare a gypsum slurry.

[0110] A glue supplying process in which glue is supplied onto the board base paper using a gypsum board glue supplying device.

[0111] A forming process in which gypsum slurry is supplied between two sheets of board base paper and formed into a board shape.

[0112] A hardening step for hardening the plate-shaped molded body obtained in the molding step.

[0113] Each step will be described. (Gypsum slurry preparation process) In the gypsum slurry preparation step, the above-mentioned calcined gypsum, water, and, in some cases, various additives and foam are further mixed together to prepare a gypsum slurry.

[0114] For example, as explained in the gypsum board manufacturing apparatus, these raw material components can be mixed and kneaded by a mixer or the like to prepare a gypsum slurry. Note that the raw materials for the gypsum slurry have already been explained, so the explanation will be omitted here. (Glue supply process) In the glue supplying step, the glue can be supplied and applied to the end area of ​​the board base paper, specifically the second board base paper, by a gypsum board glue supplying device. The glue supplying device and the like have already been described, so a description thereof will be omitted here. (molding process) In the forming process, the gypsum slurry obtained in the gypsum slurry preparation process is supplied between two sheets of base paper for board and formed into a board shape.

[0115] For example, as described above in the gypsum board manufacturing apparatus, in the gypsum slurry forming step, a high-density first gypsum slurry 53 and a low-density second gypsum slurry 54 are formed in advance. Then, in the forming step, a continuous laminate can be formed in which a layer of the high-density first gypsum slurry 53, a layer of the low-density second gypsum slurry 54, and a layer of the high-density first gypsum slurry 53 are laminated in that order between the first board base paper 511 and the second board base paper 512. Next, the gypsum board is passed through a forming machine 58 that determines the thickness of the gypsum board, and formed into a plate shape to form a gypsum slurry formed body.

[0116] However, the present invention is not limited to the above embodiment, and in the molding step, a gypsum slurry having a desired density can be supplied between the board base papers and molded into a plate shape by a molding machine. (hardening process) After the molding step, a hardening step can be carried out. The hardening step is a step of hardening the gypsum slurry molded body obtained in the molding step.

[0117] The hardening process can be carried out by the hydration reaction of the calcined gypsum (hemihydrate gypsum) in the gypsum slurry, which generates needle-shaped crystals of dihydrate gypsum and coagulates and solidifies. Therefore, the calcined gypsum added to the gypsum slurry reacts with water in the molded body formed in the molding process, and the hydration reaction of the calcined gypsum progresses, thereby carrying out the hardening process.

[0118] The method for producing a gypsum board may further include any steps. Specifically, the method may include, for example, the following steps.

[0119] A first cutting step of cutting the gypsum slurry molded body. A drying process for drying the cut gypsum slurry molded bodies. The second cutting process involves cutting the gypsum board.

[0120] This is an inspection process to check for any defects in the glue in the adhesive joints of the base paper for boards. (1st cutting process) In the first cutting step, the gypsum slurry molded body can be cut. After the gypsum slurry molded body is formed in the molding step, the gypsum slurry gradually hardens. For this reason, the first cutting step can be performed, for example, during the hardening step or after the hardening step is completed. However, it is preferable to perform the first cutting step after the hardening step has progressed to an extent that the gypsum slurry molded body can be cut.

[0121] The first cutting step can be called a rough cutting step, in which the gypsum slurry molded body can be cut into a desired size depending on, for example, the size of a dryer used in a drying step described later. (drying process) In the drying process, excess moisture contained in the gypsum slurry molded body can be dried. Note that a molded body that has completed the hardening process can be supplied to the drying process. The drying process can be carried out by forcibly drying the molded body using a dryer.

[0122] The method of forcibly drying the molded bodies using a dryer is not particularly limited, but for example, a dryer can be provided on the conveying path of the molded bodies, and the molded bodies can be continuously dried by passing through the dryer. Alternatively, the molded bodies can be conveyed into the dryer and dried in batches. (2nd cutting process) For example, there may be a second cutting step for cutting the gypsum board.

[0123] The second cutting step can be carried out, for example, after the drying step, and can cut the product to the desired size. (Inspection process) In the inspection process, for example, it is possible to check whether there are any gluing defects in the adhesive joints of the board base paper.

[0124] Specifically, for example, the adhesive defect inspection device already described is used to inspect whether there is any adhesive defect in the adhesive joint, and any part where an adhesive defect is detected is marked or the like so that it can be identified. For example, after cutting in the second cutting process, the part can be rejected as a defective product.

[0125] Furthermore, it is also possible to set the controller 26 to issue a command to increase the glue supply speed when a gluing defect occurs.

[0126] The inspection process is not limited to inspecting for defective gluing, but can also inspect whether the size and weight of the manufactured gypsum board are within standards, for example.

[0127] The timing of performing the inspection process is not particularly limited and can be selected depending on the contents of the inspection, etc.

[0128] According to the method for manufacturing gypsum board of this embodiment, the above-mentioned glue supplying device is used in the glue supplying step, so that an appropriate amount of glue can be stably supplied to the second board base paper. This makes it possible to prevent gluing defects from occurring in the adhesive joint between the first board base paper and the second board base paper. As a result, the end shape in the width direction of the gypsum board can be made into a predetermined shape, and the occurrence of defective products that do not meet standards can be prevented. EXAMPLES

[0129] The present invention will be described below with reference to specific examples, but is not limited to these examples. [Example 1] A gypsum board was manufactured using the gypsum board manufacturing apparatus 50 shown in FIG.

[0130] 5, gypsum board manufacturing apparatus 50 has mixer 52, which is a mixing means for mixing raw materials, and a molding machine 58 for molding gypsum slurry prepared by mixer 52. A glue supplying device 20 is installed on the transport path of second board base paper 512, upstream in the transport direction of second board base paper from a point where first gypsum slurry 53 is supplied to second board base paper 512. A gluing defect inspection device 60 is installed downstream of the molding machine 58 in the transport path of gypsum slurry molded body 59.

[0131] 2, the glue supplying device 20 has a tank section 22 for storing glue, two supply ports 23A and 23B that are installed on both ends of the board base paper of the gypsum board and supply glue, and two pump sections 24A and 24B that are arranged between the tank section 22 and each of the supply ports 23A and 23B. The same rotary positive displacement pump is used for the pump sections 24A and 24B.

[0132] The glue supplying device 20 further includes a control unit 26 and a storage unit 27. The glue supplying conditions stored in the storage unit 27 are selected according to the manufacturing conditions of the gypsum board manufactured by the gypsum board manufacturing apparatus 50, and the control unit 26 controls the rotation speed of the rotary positive displacement pump based on the selected supplying conditions. The control unit 26 controls the supplying speed of glue from the tank unit 22 to the supply ports 23A and 23B by the pump units 24A and 24B.

[0133] 2 and 3, spreading members 29A and 29B, which are spatulas, are provided near the supply ports 23A and 23B, so that the supplied glue can be spread in the edge region of the second board base paper. A roller 31, which is a support member, is provided on the opposite side of the board base paper 21 to the spreading members 29A and 29B, as shown in Fig. 3. The spatula, which is a spreading member, has a plurality of rectangular cutouts 292A at an end 291 on the side facing the board base paper, as shown in Fig. 4B.

[0134] The second pipes 252A and 252B are both made of silicone resin hoses.

[0135] A gypsum board was manufactured using the gypsum board manufacturing apparatus having the above configuration. The percentage of time during which the manufactured gypsum board was detected as defective by the defective gluing inspection device 60 from the time the manufactured gypsum board first arrived at the defective gluing inspection device 60 until the time the manufactured gypsum board finally passed through the defective gluing inspection device 60 was calculated as the defective rate, which was 0.0005%. [Comparative Example 1] The glue supplying device 20 used was a device having the same configuration as in Example 1, except that it did not have the control unit 26 and the memory unit 27, and the pump units 24A and 24B were replaced by valves whose openings were manually adjusted.

[0136] Except for the above, gypsum boards were manufactured using the same gypsum board manufacturing apparatus as in Example 1. The percentage of time during which glue defects were detected by the glue defect inspection device 60 from the time when the manufactured gypsum board first arrived at the glue defect inspection device 60 until the time when the manufactured gypsum board finally passed through the glue defect inspection device 60 was calculated as the defect rate, which was 0.05%.

[0137] Although the gypsum board glue supplying device, the gypsum board manufacturing device, and the gypsum board manufacturing method have been described above in terms of the embodiments, the present invention is not limited to the above embodiments, etc. Various modifications and changes are possible within the scope of the gist of the present invention described in the claims.

[0138] This application claims priority based on Japanese Patent Application No. 2021-010483, filed with the Japan Patent Office on January 26, 2021, and the entire contents of Japanese Patent Application No. 2021-010483 are incorporated by reference into this international application. [Explanation of symbols]

[0139] 11, 12, 13 Gypsum board 110, 120, 130 Gypsum core 111, 121, 131, 511 First board base paper 112, 122, 132, 512 Base paper for second board 113, 123, 133 Adhesive part 11A, 12A, 13A ends α Edge angle 111A, 111B, 121A~121C, 131A~131C Corner 20. Glue supply device for gypsum board 21 Board base paper 21A, 21B end 211A, 211B end area 22 Tank section 23A, 23B supply port 24A, 24B pump section 251, 251A, 251B 1st piping 252A, 252B 2nd piping 253 Third Pipe 26 Control Unit 27 Memory section 28 Main Tank Section 29A, 29B Spread members 291 End 292A~292C Cutout 293 Adjacent Areas 31 Roller 32 Glue 50 Gypsum board manufacturing equipment 52 Mixer 521, 522, 523 preparative port 53 First gypsum slurry 54 Second gypsum slurry 551, 552 Delivery pipe 553 Pipeline 56 Roller Coater 561 Application Roller 562 Receiving Roller 563 lees removal roller 57 Turning Roller 58 Molding machine 59 Gypsum slurry compact 591 First end 592 Second end 60 Gluing defect inspection device 61 Light emitting part 611 Laser Light 611A Some light 611B Remaining Light 62 Light receiving part 63 Judgment section

Claims

1. A gypsum board glue supplying device that supplies glue to the board base paper of a gypsum board, A tank portion for storing the glue; A supply port is provided on an end side of the board base paper of the gypsum board and supplies the glue; A pump unit is disposed on the glue supply path between the tank unit and the supply port, The gypsum board glue supplying device, wherein the pump section is a positive displacement pump.

2. The supply ports are disposed on both end sides of the board base paper of the gypsum board, The gypsum board glue supplying device according to claim 1 , wherein the pump units are arranged in parallel on the glue supply path between the tank unit and each of the supply ports.

3. A control unit is provided. The gypsum board glue supply device according to claim 1 or claim 2, wherein the control unit controls a supply speed of the glue from the tank unit to the supply port by the pump unit in accordance with manufacturing conditions of the gypsum board to be manufactured.

4. A storage unit is provided, The memory unit stores the glue supply conditions, The control unit selects the glue supply conditions stored in the memory unit according to the manufacturing conditions of the gypsum board to be manufactured, and controls the supply speed of the glue from the tank unit to the supply port by the pump unit.

5. The pump unit is a rotary positive displacement pump, The gypsum board glue supplying device according to claim 3 or 4, wherein the control unit controls the rotation speed of the pump unit.

6. The gypsum board glue supplying device according to any one of claims 1 to 5, further comprising a spreading member for spreading the glue on the board base paper.

7. The spreading member is a spatula, 7. The gypsum board glue supplying device according to claim 6, wherein a notch is provided at an end of the spatula on a side facing the board base paper.

8. A gypsum board manufacturing apparatus comprising the gypsum board glue supplying device according to any one of claims 1 to 7.

9. A method for manufacturing a gypsum board, comprising a glue supplying step of supplying the glue to the board base paper by the gypsum board glue supplying device according to any one of claims 1 to 7.

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