IC chip arrangement method, and program

Abstract

To provide an IC chip loading device and method that, when loading an IC chip on an antenna in an inlay manufacturing process, improve the accuracy of the loading position of the IC chip.SOLUTION: An IC chip loading device conveys an antenna AN for an inlay, and loads an IC chip at a predetermined reference position of the antenna. A rotary mounter 3 comprises: nozzles that each adsorb the IC chip C when located at a first position PA, and arrange the IC chip at the reference position of the antenna when located at a second position PK; nozzle attachment parts (rotary heads 30) to each of which the nozzle is attached; an image acquisition unit (imaging apparatus CA3) that acquires images of the IC chips adsorbed on the nozzles; and a correction amount determination unit that determines, on the basis of the acquired images, as a correction amount of the IC chips adsorbed on the nozzles, a first correction amount that is a correction amount of an angle around an axis of the nozzle, a second correction amount that is a correction amount of the position in a conveyance direction D1 of the antenna, and a third correction amount that is a correction amount of the position in a width direction of the antenna.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present invention relates to an IC chip mounting device and an IC chip mounting method. [Background technology]

[0002] With the spread of RFID tags, the number of antennas and IC chips electrically connected to the antennas has increased. The production of sheet inlays with a base is expanding. An antenna formed on a substrate that serves as a reference for mounting an IC chip A step of placing the supplied IC chip with respect to the predetermined reference position on the substrate is provided. In order to mount the IC chip accurately with respect to the reference position of the antenna, It is known to perform correction (for example, Patent Document 1). In Patent Document 1, a synchronous roller that adsorbs and holds an IC chip is placed in front of a film substrate. A mounting device is described that has a stage that can be moved back and forth. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2008-123406 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, the mounting device described in the above-mentioned Patent Document 1 has a synchronous roller that is The antenna is only moved forward, backward, left and right (i.e., on the X and Y axes). However, there is a limit to how precisely positioning can be performed. Therefore, one aspect of the present invention is to mount an IC chip on the antenna during the inlay manufacturing process. The purpose of this invention is to improve the accuracy of the mounting position of an IC chip when mounting it. [Means for solving the problem]

[0005] One aspect of the present invention is to convey an antenna for an inlay and position the antenna at a predetermined reference position. an IC chip mounting device for mounting an IC chip on a device, the device being configured to mount an IC chip on a device when the device is in a first position; C chip is attracted, and when it is in the second position, the IC chip is placed in front of the antenna. A nozzle configured to be positioned at the reference position, and a nozzle mounted on the nozzle a nozzle mounting portion; a first rotating portion for rotating the nozzle around an axis; a second rotation unit that rotates the nozzle attachment unit so as to move the nozzle attachment unit from a first position to the second position; a moving mechanism for moving the nozzle; and a moving mechanism for moving the nozzle between the first position and the second position. and acquiring an image of the IC chip attracted to the nozzle when the IC chip is in a predetermined position. and based on the image acquired by the image acquisition unit, As a correction amount of the nozzle, a first correction amount which is a correction amount of the angle around the axis of the nozzle, and a second correction amount which is a correction amount of the position of the tenna in the conveying direction, and a first correction amount which is a correction amount of the position of the tenna in the width direction. and a correction amount determination unit that determines a third correction amount, and the first rotation unit determines the first correction amount. The second rotation unit rotates the nozzle around the axis based on the second correction amount. The nozzle attachment portion is rotated at the adjusted angular velocity, and the moving mechanism is adjusted to the third correction amount. Based on the above, the nozzle is moved in a width direction perpendicular to the conveying direction of the antenna. It is a device equipped with a Effect of the Invention

[0006] According to one aspect of the present invention, an IC chip is mounted on the antenna during the inlay manufacturing process. When the IC chip is mounted, the accuracy of the mounting position can be improved. [Brief description of the drawings]

[0007] [Figure 1] 1A and 1B are a plan view and a partially enlarged view of an antenna according to an embodiment of the present invention, respectively, before and after mounting an IC chip thereon. [Diagram 2] FIG. 2 is a diagram showing an antenna sheet and a roll body around which the antenna sheet is wound. [Diagram 3] 4A to 4C are diagrams showing a portion of the IC chip mounting device according to the embodiment corresponding to an IC chip placement step. [Figure 4] FIG. 2 shows a chip-containing tape and its enlarged cross section. [Diagram 5] FIG. 2 is a side view of a rotary mounter in the IC chip mounting device of the embodiment. [Figure 6] 3A and 3B are a plan view and a side view of a nozzle unit mounted on a rotary mounter. [Figure 7] 1 is a diagram for explaining the relationship between a rotary mounter and an antenna sheet. FIG. [Figure 8] 11 is a perspective view showing a state in which the chip-including tape is separated by a separation roller. FIG. [Figure 9] 13A to 13C are diagrams illustrating the operation of supplying IC chips from the chip-containing tape to the nozzle unit. [Figure 10] FIG. 4 is a front view showing a width direction moving mechanism of the rotary mounter. [Figure 11] FIG. 2 is a functional block diagram of a control unit that controls the rotary mounter. [Figure 12] FIG. 2 is a diagram showing an example of an image captured by an imaging device. [Figure 13] 1A to 1C are diagrams illustrating an example of an IC chip sucked onto a nozzle before and after rotation of the nozzle. [Figure 14] 5A to 5C are diagrams showing a portion of the IC chip mounting device according to the embodiment that corresponds to a curing step. [Figure 15]15 is a diagram showing a part of the pressing unit and an ultraviolet irradiator as viewed from an arrow J in FIG. 14. [Figure 16] 1A to 1C are diagrams illustrating a method of conveying an antenna sheet according to an embodiment. [Figure 17] 1A to 1C are diagrams illustrating an IC chip placement process according to an embodiment. [Figure 18] FIG. 2 is a diagram illustrating a curing process according to an embodiment. [Figure 19] FIG. 19 is a diagram illustrating a configuration example of an ultraviolet curing unit in FIG. 18. [Figure 20] FIG. 2 is a diagram illustrating a curing process according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] The IC chip mounting device and the IC chip mounting method according to the embodiment will be described below with reference to the drawings. Please refer to the following for explanation. The IC chip mounting device 1 according to the embodiment is an inlay for non-contact communication such as an RFID inlay. This is a device that mounts IC chips onto thin-film antennas when manufacturing semiconductor devices. In FIG. 1, an exemplary antenna AN having a predetermined antenna pattern is shown. The antenna pattern is not intended to be limiting. FIG. 1 also shows an IC chip C The figures show an enlarged view of part E before and after the antenna is mounted. The IC chip C is mounted at a predetermined reference position Pref that is determined in advance based on the line. The IC chip C is extremely small, for example, with a length and width of several hundred μm. It is required that an IC chip C of a certain size be mounted accurately at a reference position Pref.

[0009] To mount the IC chip C on the antenna AN, the antenna AN is aligned to the reference position Pref. an IC chip placement step of applying adhesive to the IC chip C and placing the IC chip C on the adhesive; A curing process is required to harden the adhesive and strengthen the connection between the antenna AN and the IC chip C. .

[0010] In the IC chip placement process described later, as shown in FIG. 2, multiple antennas AN are arranged at a constant pitch. The strip-shaped antenna sheet AS (an example of an antenna continuum) formed on the substrate BM is wound with a The roll body PR is then set in place. The antenna sheet AS is continuously pulled from the roll body PR. Then, the parts are sent to the line for the IC chip placement process. The material of the substrate BM is not particularly limited, but may be, for example, fine paper, coated paper, art paper, etc. Paper substrates such as paper, PET (polyethylene terephthalate), PE (polyethylene), Synthetic resin films made of PP (polypropylene) and PS (polystyrene), as well as the above A composite sheet made of a combination of multiple synthetic resins, a composite sheet made of a synthetic resin film and paper can also be used. The antenna AN is formed by, for example, attaching a metal foil to the substrate BM, or by applying a conductive material to the substrate BM. The film is formed by screen printing or vapor deposition in a predetermined pattern.

[0011] In the following description, the XYZ coordinate system is defined as shown in FIG. When referring to a diagram of the state in which the product is arranged at each process, the diagram viewed on the YZ plane is called a front view, A view seen on the XY plane is called a plan view, and a view seen on the XZ plane is called a side view. The X direction is the direction in which the antenna sheet AS unwound from the roll body PR passes through each process described below. The Y direction is the direction in which the sheet is conveyed during the conveying process, and is also referred to as the conveying direction D1. The Z direction is the width direction of the antenna sheet AS, and is also referred to as the width direction D2 as appropriate. This is the direction perpendicular to the AS.

[0012] (1) IC chip placement process The IC chip arrangement process will be described below with reference to FIGS. FIG. 1 is a diagram showing a portion of the IC chip mounting device 1 corresponding to an IC chip placement step. FIG. 4 shows a plan view of the chip-containing tape CT and an enlarged view of its cross section taken along line AA. In the IC chip placement process, the IC chip mounting device 1 mounts each antenna on the antenna sheet AS. The extremely small IC chip is precisely aligned with the reference position Pref (see Figure 1) of the antenna AN. It is possible to arrange it easily.

[0013] As shown in FIG. 3, in the IC chip placement process, the IC chip mounting device 1 moves the conveyor 8 1, a dispenser 2, a rotary mounter 3, an ultraviolet irradiator 41, and an imaging device CA 1 to CA3, a tape feeder 71, a tape body take-up reel 72, and a film take-up It includes a reel 73 and a separation roller 74 .

[0014] The conveyor 81 (an example of a conveying section) is an antenna pulled out from a roll body PR (see FIG. 2). The sheet AS is conveyed downstream of the process at a predetermined conveying speed. This corresponds to the conveying surface. The dispenser 2 dispenses a fixed amount of anisotropic radiation toward the reference position Pref of each of the conveyed antennas AN. Anisotropic Conductive Paste (ACP) This conductive paste is an example of an ultraviolet-curing adhesive. The dispenser 2 accurately positions the ejection position relative to the reference position Pref of each antenna AN. In order to achieve this, the ejection position is configured to be adjustable in the width direction.

[0015] The image pickup device CA1 is provided upstream of the dispenser 2 and is positioned to dispense the conductive paste. In order to determine the position of each antenna AN, an image of the portion near the reference position Pref is captured. The imaging device CA2 is provided downstream of the dispenser 2 and is induced in the respective antennas AN. Inspects whether the conductive paste is applied and whether the conductive paste is accurately placed at the reference position Pref. In order to check whether the coating has been applied to the area including the reference position Pref of each antenna AN, An image of the adjacent area is captured.

[0016] The rotary mounter 3 mounts IC chips on the conductive paste applied to each antenna AN. The rotary mounter 3 rotates counterclockwise in Fig. 3. The suspension plate 86 is attached to and suspended from the support base 85. The suspension plate 86 is movable in the Y direction. As a result, the rotary mounter 3 is suspended from above on the support base 85. The structure is also movable in the Y direction. As will be described later, the rotary mounter 3 picks up IC chips from the chip-containing tape and The IC chip is then attached to the antenna sheet AS toward the reference position Pref of each antenna AN on the antenna sheet AS. At this time, the IC chip is precisely aligned to the reference position of the antenna AN. The position and orientation of the adsorbed IC chip are corrected in order to place it on the position Pref. When mounting the IC chip on the antenna AN, the imaging device CA3 determines the position of the IC chip. In addition, in order to carry out the correction process to correct the orientation, the IC chip is held by the nozzle (described later). Take a picture of the top.

[0017] The tape feeder 71 is loaded with a tape including an IC chip wound thereon. The chip-containing tape is then loaded in the direction of the arrow in Figure 3 at a speed synchronized with the rotary mounter 3. The device is configured to extract a loop. Now, with reference to FIG. 4, an example of the chip-containing tape will be described. As shown in FIG. 4, the chip-containing tape CT has a constant recess Td that contains the IC chip C. The tape body T is formed at an interval of 10 mm, and the tape body T is attached to the tape body T so as to close the recess Td. The recesses Td are, for example, embossed on the tape body T. The IC chip C is formed along the extending direction of the chip-containing tape CT. The chips are contained in each recess Td. The attachment holes H are formed in the separation roller 74. The attachment holes H are formed in the separation roller 74 so as to allow accurate positioning with respect to the peripheral surface of the separation roller 74. When the chip-containing tape CT is conveyed to the separation roller 74, When the sheet is conveyed, it is inserted into a protrusion 74p (described later) provided on the separation roller 74.

[0018] As shown in FIG. 4, the bottom surface of the recess Td and the back surface of the tape body T (where the covering film CF is adhered) are Between the surface (opposite the surface being covered) and the surface being covered, suction holes Ts are formed. In order to prevent the IC chip C from falling out of the recess Td when the cover film CF is peeled off, The IC chip C is attached by suction using a roller 74 .

[0019] Referring again to FIG. 3, at the separation roller 74, one or more tape feeders 71 are fed. The covering film CF is peeled off from the chip-containing tape CT, which is fed through an auxiliary roller. The tape body T and the covering film CF are separated. The covering film CF is peeled off and exposed. The IC chips C are successively sucked by the nozzles provided on the rotary mounter 3 . The chip-containing tape CT is separated into the tape body T and the covering film CF by the separation roller 74. After being released, the tape body T is wound around the tape body take-up reel 7 via one or more auxiliary rollers. 2, and the covering film CF is wound on the film winding ring via one or more auxiliary rollers. It is wound onto coil 73.

[0020] Next, the rotary mounter 3 will be described with reference to FIGS. FIG. 5 is a side view of the rotary mounter 3 in the IC chip mounting device 1 of the embodiment. FIG. 6A is a plan view of the nozzle unit mounted on the rotary mounter 3. FIG. 7 is a side view of the rotary mounter 3 and the antenna system. FIG. 1 is a diagram for explaining the relationship between the UE and the UE AS.

[0021] As shown in FIG. 5, the rotary mounter 3 includes a rotary head 3H (a nozzle mounting portion A plurality of nozzle units 30-1 to 30-1 (12 in the illustrated example) are arranged radially from the nozzle unit 30-1 to 30-1. In the following description, the nozzle units 30-1 to 30-12 are provided with When referring to the above items, they will be collectively referred to as nozzle unit 30. Although the rotary head 3H is not shown in detail, the nozzle unit is arranged counterclockwise in FIG. A rotary drive motor (rotary drive motor M31 described later) that rotates the motors 30-1 to 30-12 a vacuum pump for adsorbing an IC chip to the nozzle unit 30; 30 is connected to a blower for discharging the IC chip.

[0022] Referring to FIG. 6, a nozzle 32, a sleeve 33, a solenoid valve 35, and a cylinder drive motor The nozzle 32 is provided at the tip of the nozzle unit 30. The cylinder drive motor M30 is connected to the cylinder drive motor M30 in the lobe 33. The first rotating portion (e.g., a stepping motor) is a motor that rotates the nozzle 32 around its axis. The nozzle 32 is formed with a passage that can communicate with an intake pipe 36 and an exhaust pipe 37. It has been made. An intake pipe 36 and an exhaust pipe 37 are connected to the sleeve 33. The intake pipe 36 is a vacuum The exhaust pipe 37 is connected to a blower (not shown). The solenoid valve 35 is, for example, a three-port solenoid valve. The passage 34 of the nozzle 32 is opened between the intake pipe 36 and the exhaust pipe 37, or The nozzle 32 is connected to the exhaust pipe 37 via an open circuit, and the intake pipe 36 is connected to a closed circuit. The solenoid valve 35 is configured to suck in the air by the nozzle 32 through the intake pipe 36. or exhausting the air from the nozzle 32 through the exhaust pipe 37. It is structured as follows.

[0023] Referring to FIG. 7, the rotary head 3H is rotated counterclockwise by a rotation drive motor (not shown). 3H of each nozzle unit 30. In other words, the position of a particular nozzle unit 30 in the rotary head is changed over in sequence. In response to the rotation of the handle 3H, the conveyor moves along a circular track on a plane perpendicular to the conveying surface from the position PA. Each of the 12 positions PA to PL on the circumference of the rotary head 3H in a counterclockwise direction up to position PL The positions of the 100 and 110 are determined in order.

[0024] Here, the position PA (an example of the first position) is a position where the nozzle unit 30 is The position PE is a position where a new IC chip C is picked up from the nozzle of the nozzle unit 30. The image of the IC chip C in the state of being sucked to the roller is captured by the imaging device CA3. do. The position PK (an example of the second position) is a position where the antenna AN is painted on the antenna sheet AS to be conveyed. This is the position where the adsorbed IC chip C is released onto the conductive paste that is being spread. At position PK, the moving direction of the nozzle tip coincides with the conveying direction D1 of the antenna sheet AS. Then, air is discharged from the nozzle of the nozzle unit 30 to release the IC chip C. At position PL, since the IC chip C has already been discharged at position PK, the nozzle unit 30 The IC chip C is not being held by suction. At position PL, dust that may adhere to the nozzle is removed. Air may be emitted from the nozzle to collect the dust that may be emitted from the nozzle. An example is shown in which a dirt collection tray TR is positioned at position PL for collection.

[0025] For example, the nozzle unit 30-1 at the position PA in FIG. Then, while still holding IC chip C, it rotates counterclockwise and reaches position PK. When the IC chip C is released, it returns to position PA and picks up a new IC chip C again. This process is repeated. In this IC chip mounting method, the conveyance of the antenna sheet AS is not stopped. This allows IC chips to be placed on each antenna AN in a quick and continuous manner, resulting in high productivity.

[0026] The nozzle unit 30 which reaches the position PK in sequence receives the antenna sheet A The rotor is set so that the IC chip C is emitted toward the reference position Pref of each antenna AN of S. The angular velocity of the read head 3H and the transport speed of the antenna sheet AS are set or controlled. In order to reliably place the IC chip C, the speed of the tip of the nozzle unit 30 in the vicinity of the position PK is It is preferable to provide a section in which the conveying speed of the antenna sheet AS and the conveying speed of the antenna sheet AS are constant.

[0027] In this embodiment, twelve nozzle units 30 are arranged on the rotary head 3H. The nozzles arranged on the rotary head 3H are as follows, but are not limited to the above. The number of units 30 can be set arbitrarily.

[0028] Next, referring to FIG. 8 and FIG. 9, the IC chip C is sucked by the nozzle unit 30. The following describes the operations that can be performed. FIG. 8 is a perspective view showing a state in which the chip-containing tape CT is separated by a separation roller 74. FIG. 9 is a side view of the vicinity of the separation roller 74, showing the nozzles from the chip-containing tape CT. 9 is a diagram illustrating an operation of supplying an IC chip C to the module unit 30. In order to clarify the state of the containing tape CT, only the chip containing tape CT is shown in cross section.

[0029] As shown in FIG. 8, the mounting holes of the chip-containing tape CT supplied from the tape feeder 71 The protrusion 74p of the separation roller 74 is inserted into the gap H, so that the width of the chip-containing tape CT is After the positioning is completed, the chip-containing tape CT is transported. The covering film CF of the chip-containing tape CT is peeled off and wound onto the film take-up reel 7. On the other hand, the tape body T of the chip-containing tape CT is wound on the tape body take-up reel 7 Head to 2.

[0030] As shown in FIG. 9, the IC chip C is exposed after the covering film CF is peeled off. At this time, the IC chip C is exposed and then the nozzle unit 30 In order to prevent the IC chip C from falling off during the short time it takes for the IC chip C to be attracted by the knit 30, The separation roller 74 has a mechanism for sucking the IC chip C toward the center of rotation of the separation roller 74. A suction passage (not shown) is provided. This suction passage and the suction holes T provided in the tape body T The IC chip C is sucked through s (see FIG. 4).

[0031] Next, referring to FIG. 10, a moving mechanism 8 for moving the rotary head 3H in the width direction D2 is 10 is a front view of the moving mechanism 8. As shown in FIG. The moving mechanism 8 corrects the position of the IC chip C in the width direction D2 that is picked up by the nozzle unit 30. As shown in FIG. 10, the moving mechanism 8 includes a bearing 76, a shaft The lift 77, the suspension plate 86, the guide plate 87, the slider 88, and the width direction drive motor M32 has. The bearing 76, the shaft 77, and the width direction drive motor M32 are mounted on a support base 85. The shaft 77 is a rod-shaped member having a threaded portion, and the width direction drive motor M The shaft 77 is rotated by a bearing 76 fixed to the upper surface of the support base 85. It is rotatably supported by (2 points). The rotary head 3H is attached to a suspension plate 86. The upper end of the suspension plate 86 is secured to the A hole (not shown) is formed by cutting the threads of the shaft 77. Therefore, as the shaft 77 rotates, the suspension plate 86 and the suspension The rotary head 3H attached to the plate 86 is movable in the width direction D2. The upper part of the support base 85 and the guide plate 87 are provided with a central portion within the movable range of the suspension plate 86 in the width direction D2. The slider 88 is attached to the suspension plate 86 and has a width of the suspension plate 86. As the roller 82 moves in the width direction in the direction D2, it slides on the upper surface of the guide plate 87. With the above-mentioned configuration, the moving mechanism 8 moves the roller 10 in response to the rotation of the width direction driving motor M32. The tally head 3H is displaceable in the width direction D2.

[0032] In this embodiment, the rotary head 3H is moved in the width direction D2 by the moving mechanism 8. As a result, the nozzle unit 30 attached to the rotary head 3H is rotated in the width direction D2. For example, the rotary head is moved in the width direction D2 Each nozzle unit 30 is individually moved in the width direction inside the rotary head without moving the rotary head. The rotary head may be configured to be displaceable to D2.

[0033] Referring again to FIG. 3, the nozzle unit 30 of the rotary mounter 3 is connected to the antenna A. An ultraviolet ray irradiator 41 is installed near the position where the IC chip is released to N (position PK in FIG. 7). can be done. The ultraviolet irradiator 41 irradiates ultraviolet light onto the conductive paste on the conveyed antenna AN. The ultraviolet irradiator 41 irradiates the IC chips in the IC chip placement process. The purpose is different from the ultraviolet irradiation in the subsequent curing process (described later), and antenna A The purpose of the present invention is to adjust the viscosity of the conductive paste on the substrate N. The cumulative amount of ultraviolet light given to the conductive paste by the It is preferable that the amount of ultraviolet light is less than the cumulative amount of ultraviolet light given. Since it is expressed as the product of intensity and exposure time, to adjust the integrated light amount, the light intensity and exposure time must be adjusted. At least one of them needs to be adjusted.

[0034] In the IC chip mounting device 1 of this embodiment, the dispenser 2 is used to mount the IC chip on the antenna AN. A thermosetting adhesive such as an epoxy resin is applied, and a thermosetting device is used instead of the ultraviolet ray irradiator 41. It may be provided.

[0035] In FIG. 3, the ultraviolet irradiator 41 is set to irradiate ultraviolet light after the IC chip is placed. However, this is not the only possible arrangement. The ultraviolet irradiator 41 is Alternatively, the IC chip may be disposed so that ultraviolet light is irradiated onto the substrate. It may be arranged to project a line. When irradiating ultraviolet light after the IC chip is placed, the viscosity of the conductive paste decreases. By this, the IC chip is prevented from shifting or tilting after being placed on the conductive paste. This makes it difficult for problems such as the IC chip being damaged. When the conductive paste is exposed to ultraviolet light at the same time as it is heated, the IC Since the chip is placed on the conductive paste, the IC chip is placed on the conductive paste. Since it becomes difficult to move, the IC chip is less likely to become displaced or tilted. In either case, by irradiating the area near the IC chip with ultraviolet light, The fluidity of the conductive paste causes the IC chip to become unstable on the conductive paste. That is, by irradiating the IC chip with the ultraviolet irradiator 41, This has the advantage that the mounting accuracy can be improved.

[0036] Next, referring to FIG. 11 to FIG. 13, the control unit 100 that controls the rotary mounter 3 11 is a functional block diagram of the control unit 100. As shown in FIG. FIG. 12 shows an example of an image captured by the imaging device CA1. 13 is a diagram illustrating an example of the adsorbed IC chip C before and after the rotation of the nozzle 32. The state before rotation shows an example of an image captured by the imaging device CA3. After the nozzle is rotated, the XYZ axes are shown when the nozzle is at position PK (see Figure 7). is doing.

[0037] The control unit 100 is mounted on a circuit board (not shown), and controls the image pickup devices CA1 to CA3, dispenser 2, cylinder drive motor M30, rotation drive motor M31, width direction drive motor M 32, the solenoid valve 35, and the ultraviolet irradiator 41. The rotor M31 (an example of a second rotor) is a nozzle unit 30- 1 to 30-12 are driving means for rotating them. The control unit 100 includes a microcomputer, a memory (RAM (Random Access Memory), Includes ROM (Read Only Memory), storage, and drive circuits. Microcomputer reads out and executes a program recorded in the memory, and controls the ejection position adjustment means 101, The functions of the IC chip correction means 102, the valve control means 103, and the hardening execution means 104 are Be realized.

[0038] The discharge position adjustment means 101 adjusts the conductive pen based on the image captured by the imaging device CA1. The discharge position of the conductive paste is determined, and the discharge timing and the width direction of the dispenser 2 are determined. The method of determining the discharge position of the conductive paste is shown in FIG. For reference, see below. As shown in FIG. 12, an image captured by the imaging device CA1 is captured by the antenna AN 1 is an image of a portion in the vicinity of a reference position Pref. The ejection position adjustment means 101 determines the reference position Pref from the characteristic portion of the shape included in the image. Specifically, the ejection position adjustment means 101 determines whether the antenna A in the image of FIG. Analyze the shape of N, and determine the reference lines L1 and L2 that are parallel to each other in the X direction and the reference lines L2 and L3 that are parallel to each other in the Y direction. Identify the reference lines L3 and L4 that are parallel to each other, and align the center line of the reference lines L1 and L2 with the reference lines L3 and L4. The intersection of the central lines is identified as the reference position Pref.

[0039] A point Pj1 in the image of FIG. 12 is a target position of the reference position Pref on the image, and the imaging device Calibration was performed between the image captured by CA1 and the conductive paste drop position of Dispenser 2. The position is determined in advance based on the result of scanning. The discharge timing of the dispenser 2 and the width direction are adjusted so that the position Pref coincides with the target position Pj1. By adjusting the position of D2, the conductive paste is applied to the reference position of the actual antenna AN. It is possible. In the example of FIG. 12, the reference position Pref specified on the image coincides with the target position Pj1. To do this, you need to adjust the position by x1 in the X direction and y1 in the Y direction. Based on this, the timing of discharge from the dispenser 2 is determined by taking into account the conveying speed of the antenna AN. The distance y1 is determined, and the dispenser 2 is displaced in the width direction D2 based on the distance y1. The position adjustment means 101 adjusts the discharge timing and the width direction D2 of the dispenser 2. A control signal for instructing the position is transmitted, and the dispenser 2 is operated based on the control signal. Perform the work.

[0040] The image captured by the imaging device CA2 is, except for the conductive paste being applied, This is the same image as in FIG.

[0041] The IC chip correction means 102 has a function of correcting the IC chip sucked by the nozzle 32. The correction method of the IC chip is as follows, referring to FIG. 12 and FIG. 13: . As shown in the state before rotation in FIG. 13, an image is captured by an image capture device CA3 (an example of an image acquisition unit). The captured image shows the nozzle end 32e of the nozzle 32 and the IC chip attracted to the nozzle end 32e. The point Pc1 is the center position of the IC chip C before the nozzle rotates. The point Pj2 in the image of FIG. 13 is the target position of the center position of the IC chip C on the image. In other words, the center position of the IC chip C is set to coincide with the target position Pj1 of the By matching it with the target position Pj1, the IC chip is placed at the reference position of the actual antenna AN to be transported. It is now possible to place Cup C.

[0042] The center of rotation Prc of the nozzle 32 around the axis is set at the attachment of the nozzle units 30-1 to 30-12. Due to variations in the placement of the nozzles, the center of rotation Prc is not the theoretical center of the axis of each nozzle. It differs depending on the Zuhr unit and is specified, for example, based on actual measurement data obtained in advance. First, the nozzle 32 rotates about the axis of the rotation center Prc in the IC chip C shown in the image. When the center Pc1 is rotated, the reference line of the IC chip C (for example, the reference line of the IC chip C in FIG. 13) The amount of rotation until the reference side Sc) becomes parallel to the Y direction is determined. In the example of the state after rotation in FIG. 13, the IC chips in the captured image are arranged around the rotation center Prc. The IC chip C is rotated so that the reference side Sc of the IC chip C is parallel to the Y direction. The rotation angle at this time is specified as the correction amount (an example of the first correction amount) of the rotation direction of the IC chip C. Here, if the center position of the IC chip C after the movement is set to point Pc2, then point Pc2 is the target position. In order to match Pj2, the correction amount in the X direction (an example of the second correction amount) is x2, and the correction amount in the Y direction is (An example of a third correction amount) is identified as y2.

[0043] The IC chip correction means 102 is a control means for correcting the amount of correction in the rotation direction around the axis of the nozzle 32. A signal is sent to the cylinder drive motor M30, thereby positioning the cylinder at a position PE (measured by the imaging device CA3). The nozzle 32 rotates around the axis between the position where the image is captured by the nozzle 32 and the position PK where the IC chip is released. Rotate in the opposite direction. The IC chip correction means 102 outputs a control signal corresponding to the correction amount x2 in the X direction to the rotation drive motor. The motor M31 is sent to the drive circuit which drives the motor M31, and the angular velocity of the rotary head 3H is The IC chip correction means 102 outputs a control signal corresponding to the amount of correction y2 in the Y direction as follows: The motor M32 is driven by a drive circuit that drives the rotary head 3. The position of the rotary head 3H in the width direction D2 is adjusted. As a result, the position of the nozzle 32 in the width direction D2 is also adjusted.

[0044] In the IC chip mounting device 1 of this embodiment, the IC chip is corrected by the IC chip correction means 102. The position of the nozzle in the X and Y directions, and the position of the IC chip in a plane perpendicular to the nozzle axis. Since the orientation is corrected, the mounting accuracy of the IC chip antenna relative to the reference position is extremely high. It has the advantage of being expensive.

[0045] The valve control means 103 controls the twelve nozzle units 30- For each of the nozzle units 30-1 to 30-12, the nozzle units Each electromagnetic device is adapted to either suck air from 30 or expel air from 30. Specifically, the valve control means 103 controls the nozzle unit 30 when the nozzle unit 30 is in the position PA- When the nozzle unit 30 is positioned at PJ (see FIG. 7), the solenoid valve 35 is operated to suck air from the nozzle unit 30. When the nozzle unit 30 is located at the position PK or PL, The solenoid valve 35 is controlled to exhaust air from the

[0046] The hardening implementation means 104 performs a preset hardening process for each of the antennas AN being carried. A predetermined drive signal is applied to the ultraviolet irradiator 41 so that ultraviolet light is irradiated from the ultraviolet irradiator 41 with the integrated light amount. The projectile is then sent to the launcher 41.

[0047] (2) Curing process Next, the curing step will be described with reference to FIGS. In the curing process, the conductive paste applied to each antenna that has gone through the IC chip placement process described above is cured. This hardens the paste to strengthen the physical connection between the antenna and the IC chip, Ensures electrical continuity between the tenna and the IC chip.

[0048] FIG. 14 is a diagram showing a portion corresponding to a curing step in the IC chip mounting device 1 of the embodiment. FIG. 15 shows a part of the pressing unit 6 and the ultraviolet irradiator 42 as viewed from the arrow J in FIG. FIG.

[0049] As shown in FIG. 14, in the curing step, the IC chip mounting device 1 has a conveyor 82 and a hardener. The image processing apparatus includes a signal processing device CA4 and an image capturing device CA4. The conveyor 82 conveys the antenna sheet AS conveyed from the upstream IC chip placement process. The material is conveyed toward the flow at a predetermined conveying speed. The imaging device CA4 is located at the most upstream side in the curing process (i.e., the most upstream side in the IC chip placement process). It is placed above the antenna sheet AS on the downstream side of the IC chip placement process. The image capturing device CA4 captures images of each antenna AN being transported from the IC chip placement process. This is provided to check whether the IC chip is properly placed in the do.

[0050] As shown in FIG. 14, the curing device 4 includes one or more pressing units 6 and an ultraviolet irradiator 42. has. The pressing unit 6 moves up and down in a direction perpendicular to the conveying surface, and presses the conductive paste of the antenna AN. The IC chips placed on the antennas are pressed while the antennas are irradiated with ultraviolet light. The number of pressure units 6 is not important, but can be set to any number from the viewpoint of productivity and cost. . The ultraviolet irradiator 42 is disposed along the conveying direction D1. It is also possible to irradiate many antennas AN on S with ultraviolet light simultaneously.

[0051] Referring to FIG. 15, ultraviolet rays are irradiated to each antenna AN by an ultraviolet irradiator 42. As shown in FIG. 15, the pressing unit 6 has a shaft 63 at the tip thereof. The pressing unit 6 has a pressing portion 61 attached thereto. The pressing surface of the pressing portion 61 (the surface on which the ultraviolet irradiator 42 is disposed) is open. The glass plate 61p is made of glass that transmits ultraviolet light. The ultraviolet irradiator 42 has a light source 42e such as an LED (Light Emitting Device). The light source 42e irradiates ultraviolet light toward the antenna AN from a direction inclined obliquely with respect to the conveyance plane. The optical fiber is configured to irradiate the optical fiber. The IC chip on the conductive paste applied to each antenna AN is pressed and exposed to ultraviolet light. By irradiating the antennas, the conductive paste applied to each antenna hardens, This strengthens the physical connection between the antenna and the IC chip, and also electrically connects the antenna and the IC chip. The continuity is ensured.

[0052] As described above, a plurality of antennas are formed on a substrate at a constant pitch in a strip shape. The antenna sheet is fed into the line, and goes through the IC chip placement process and hardening process, and then each antenna The IC chip mounting device of this embodiment performs an IC chip placement process. In the antenna, adhesive is applied toward the reference position and an IC chip is placed on the adhesive. The adhesive is then hardened in the curing process to strengthen the connection between the antenna and the IC chip. In particular, in the present embodiment, in the IC chip placement process, the X-direction and Y-direction of the IC chip are and the position of the IC chip in a plane perpendicular to the axis of the nozzle that picks up the IC chip. Therefore, when mounting an IC chip on the antenna, the IC chip This can improve the accuracy of the mounting position.

[0053] The embodiments of the IC chip mounting device and the IC chip mounting method have been described above. The present invention is not limited to the above-described embodiment. In addition, the above-described embodiment may be modified without departing from the spirit of the present invention. Various improvements and modifications are possible within the scope of the present invention.

[0054] For example, in the embodiment shown in FIG. 3, in the IC chip arrangement step, the antenna sheet A Although the case where S is transported in one direction on the conveyor 81 has been described, this is not the only possible case. In one embodiment, as shown in FIG. 16, in the IC chip placement process, a suction drum 92 , 94 and a number of conveying rollers (for example, conveying rollers 91, 93, 95 in FIG. 17) In FIG. 16, the antenna sheet AS is conveyed at the highest position of the suction drum 92. A conductive paste is dispensed by a dispenser 2 onto the reference position of an antenna AN on an antenna sheet AS. Also, at the highest position of the suction drum 94, an IC chip is placed on the conductive paste. In this case, at least the suction drums 92 and 94 suck the rear surface of the antenna sheet AS. It is preferable that the roller is a suction roller that adheres to the antenna sheet AS. (especially in the longitudinal direction) can be prevented, and the discharge of the conductive paste and the arrangement of the IC chip can be This can be done with high precision.

[0055] In one embodiment, the conductive layer applied to the antenna AN on the conveyed antenna sheet AS is Instead of releasing the IC chip onto the conductive paste, the IC chip is pressed against the conductive paste. The placement may also be achieved by inserting Figure 17 shows a rotor in which the IC chip is placed by pressing it against the conductive paste. The operation of the rotary mounter 3 is shown in time sequence. Each nozzle unit 30 can be moved individually in the radial direction by a built-in driving device. It is composed of Noh. In the state ST1, the nozzle unit 30 picks up the IC chip C. When the C chip C is arranged, as shown in state ST2, the nozzle unit 30 is moved in the emitting direction. 2. The Z-direction in FIG. 2 is a reference position. ) and press the IC chip C onto the conductive paste applied to the antenna AN. After placing the IC chip C, it is sucked up. The nozzle unit 30 is released and returned to the position of state ST1. When the unit 30 reaches the position PK (see FIG. 7), the operation of the states ST1 to ST3 is performed. By this, the IC chip C is placed on the conductive paste applied to the antenna AN.

[0056] The curing process of one embodiment is shown in Figure 18. Figure 18 shows the curing process of one embodiment. The curing device 4A has a plurality of ultraviolet curing units 43 mounted on a mounting plate 4. 4. The antenna AN adjacent to the antenna sheet AS is removably attached to the antenna sheet AS. A plurality of mounting plates 44 with different mounting positions are prepared according to the intervals. By replacing the mounting plate 44, it is possible to accommodate various antenna sheets AS. . The support shaft 45 supports the mounting plate 44 and is configured to be able to raise and lower the mounting plate 44. The antenna sheet AS conveyed from the chip placement process is conveyed by conveying rollers 96 to 98. The conveying roller 97 is configured to be movable up and down by a driving device (not shown). It is being done.

[0057] A configuration example of the ultraviolet curing unit 43 is shown in FIG. The unit 43 includes a light source 432 (e.g., an LED light source) for irradiating ultraviolet light into the housing 431. The light source 432 is connected to the UV curing unit 43 through a cable 43 provided from the outside. The housing 431 is illuminated by a light source 432. A condenser lens for condensing the ultraviolet light irradiated may be provided. The ultraviolet light emitted from the light source 432 is incident on each of the antennas. The light is irradiated onto the conductive paste applied to the tena AN, hardening the conductive paste.

[0058] Referring again to FIG. 18, the conveying state is such that the antenna sheet AS is The antenna AN, which is coated with uncured conductive paste, is shown in purple. The conveyance of the antenna sheet AS stops when it is located directly under the external radiation curing unit 43. Then, when the conveyance of the antenna sheet AS is stopped (stopped state), The external radiation curing unit 43 is moved downward to press the antenna AN against the glass plate 435. While doing so, ultraviolet light is applied to harden the conductive paste.

[0059] Even when the machine is stopped, the antenna sheet AS is transported from the IC chip placement process. Therefore, while the ultraviolet rays are being irradiated, the conveying roller 97 descends under its own weight, and the conveyed The tena sheet AS is absorbed between the transport roller 96 and the transport roller 98. The irradiation of ultraviolet rays is completed. Then, the antennas AN, the number of which corresponds to the number of the ultraviolet curing units 43, are rapidly transported downstream. The uncured antenna AN is stopped so as to be positioned directly below the ultraviolet curing unit 43. In the curing step of one embodiment, the antenna sheet AS is conveyed and stopped (irradiated with ultraviolet light). When the antenna AN is rapidly transported, the transport roller 97 rises due to the tension applied to the antenna sheet AS.

[0060] In one embodiment, the curing step may be performed using a thermal curing device. When a thermosetting adhesive such as an epoxy resin is applied in step 2, the heat The adhesive is hardened by performing a curing process. FIG. 20 shows a state in which the antenna sheet AS is repeatedly conveyed and stopped, similarly to FIG. The curing device 4B is configured to be used in the curing process. Unlike the curing device 4A, the curing device 4B is The device includes a plurality of heat curing units 46. Each heat curing unit 46 is connected to a cable (not shown). When the antenna sheet AS is in a stopped state, a heat source is placed in the antenna sheet. The support shaft 45 is driven to move down, and each heat curing unit 46 is connected to the corresponding antenna A. The adhesive is heated and hardened while pressing N. When heating is completed, the support shaft 45 rises. At the same time, the antenna sheet AS is transported.

[0061] In FIG. 18, when the conductive paste is cured by ultraviolet light, Instead of the ultraviolet curing unit 43, a pressing unit that presses the antenna AN through a glass plate is provided. The conductive paste on the antenna AN is pressed in the stopped state. Alternatively, an ultraviolet ray irradiation device that irradiates ultraviolet rays from obliquely above may be provided. In one embodiment, the antenna sheet AS may be in a stopped state when irradiating ultraviolet light. In order to prevent this, the ultraviolet curing units 43 are linked to the traveling speed of the antenna sheet AS. While pressing the antenna AN, ultraviolet light is irradiated from the built-in light source. Good too. Similarly, in one embodiment, when the conductive paste is thermally cured, a plurality of thermal curing units 4 6 is moved in a circular manner in conjunction with the moving speed of the antenna sheet AS, and the antenna AN is pressed. The heating may be performed while the heating is being performed. [Explanation of symbols]

[0062] 1...IC chip mounting device, 2...dispenser, 3...rotary mounter, 3H...rotor head, 4, 4A, 4B...hardening device, 6...pressure unit, 8...movement mechanism, 30...nozzle a nozzle unit, 32... a nozzle end, 32e... a nozzle tip, 33... a sleeve, 34... a passage, 35... an electric Magnetic valve, 36... intake pipe, 37... exhaust pipe, 41, 42... ultraviolet irradiator, 42e... light source, 43... UV curing unit, 44...mounting plate, 45...support shaft, 46...thermal curing unit, 61...pressure part, 61p...glass plate, 63...shaft, 71...tape feeder, 72...tape main body winding reel, 73...film take-up reel, 74...separation roller, 74p...projection, 75...branch Member, 76... bearing, 77... shaft, 81, 82... conveyor, 85... support, 86... suspension Plate, 87... guide plate, 88... slider, 91, 93, 95-98... conveyor rollers, 92, 9 4... suction drum, 100... control unit, 101... discharge position adjustment means, 102... IC chip correction means, 103... valve control means, 104... hardening execution means, AN... antenna, AS... antenna system BM...substrate, C...IC chip, CA1~CA4...imaging device, CF...covering film, CT…Chip containing tape, H…Mounting hole, M30…Cylinder drive motor, M31…Rotation drive Motor, M32...Width direction drive motor, PR...Roll body, T...Tape body, TR...Waste collection Tray, Td: recess, Ts: suction hole

Claims

1. The antenna for inlay is transported and an IC chip is mounted at the specified reference position of the antenna. An IC chip mounted device for performing When the IC chip is attached to the first position, the IC chip is attached to the second position. a nozzle configured to place a tip on the antenna at the reference position; a nozzle attachment portion to which the nozzle is attached; A first rotating unit that rotates the nozzle about an axis; The nozzle attachment portion is adapted to move the nozzle from the first position to the second position. A second rotating unit that rotates the A moving mechanism that moves the nozzle; When the nozzle is at a predetermined position between the first position and the second position, an image acquisition unit for acquiring an image of the IC chip adsorbed on the Based on the image acquired by the image acquisition unit, the IC chip sucked by the nozzle is As the correction amount of the nozzle, a first correction amount which is a correction amount of the angle around the axis of the nozzle, and a second correction amount which is a correction amount of the position in the conveying direction of the image forming apparatus; and a third correction amount which is a correction amount of the position in the width direction of the image forming apparatus. a correction amount determination unit that determines a correction amount; Equipped with The first rotation unit rotates the nozzle about an axis based on the first correction amount, The second rotating portion rotates at an angular velocity adjusted based on the second correction amount, the nozzle attachment portion Rotate the The movement mechanism moves the nozzle in a transport direction of the antenna based on the third correction amount. Move in the perpendicular width direction, Device equipped with IC chip.

2. A continuous antenna assembly in which a plurality of the antennas are continuously formed is transported on a predetermined transport surface. A conveying unit for conveying the The second rotating portion has the nozzle move along a circular orbit on a plane perpendicular to the conveying surface, and The movement direction of the nozzle when the nozzle is in the second position corresponds to the movement direction of the antenna continuum. Rotating the nozzle attachment portion so that it coincides with the feed direction.

2. An IC chip mounting device according to claim 1.

3. A plurality of the nozzles are attached to the nozzle attachment portion, The second rotating portion rotates the nozzle mounting portion, so that each nozzle is sequentially positioned at the first position. The reference position of each antenna of the antenna array to be transported is moved from the first position to the second position. An IC chip is placed in the position.

3. An IC chip mounting device according to claim 1 or 2.

4. A plurality of the nozzles are attached to the nozzle attachment portion, the correction amount determination unit determines the first correction amount corresponding to each nozzle; The first rotation unit adjusts the corresponding nozzle based on the first correction amount determined for each nozzle. Rotate the nozzle around the axis.

4. An IC chip mounting device according to claim 1.

5. The moving mechanism moves the nozzle attachment portion in the width direction, thereby moving the nozzle Moving the roll in the width direction.

5. An IC chip mounting device according to claim 1.

6. The nozzle attachment portion is suspended on a support base.

6. An IC chip mounting device according to claim 1.

7. The nozzle ejects an IC chip toward the reference position of the antenna. , disposing the IC chip at the reference position of the antenna; 7. An IC chip mounting device according to claim 1.

8. The moving mechanism further moves the nozzle while the nozzle is holding the IC chip. By placing the antenna close to the The nozzle releases the suction from the IC chip at the reference position. placing the IC chip at the reference position of the antenna; 7. An IC chip mounting device according to claim 1.

9. The antenna for inlay is transported and an IC chip is mounted at the specified reference position of the antenna. An IC chip mounting method for When the nozzle attached to the nozzle attachment portion is in the first position, The IC chip is then attached to the The nozzle attachment portion is adapted to move the nozzle from the first position toward the second position. Rotate, When the nozzle is at a predetermined position between the first position and the second position, An image of the IC chip attached to the rod is obtained. Based on the acquired image, a correction amount for the IC chip sucked by the nozzle is calculated as A first correction amount which is a correction amount of the angle around the axis of the nozzle and a correction amount of the position of the antenna in the conveying direction a second correction amount which is a positive amount, and a third correction amount which is a correction amount for the position in the width direction perpendicular to the conveying direction. Determine the amount, Rotating the nozzle about an axis based on the first correction amount; rotating the nozzle attachment portion at an angular velocity adjusted based on the second correction amount; moving the nozzle in the width direction based on the third correction amount; When the nozzle is in the second position, the IC chip sucked by the nozzle is attached to the antenna. Place the nozzle at the reference position of the nozzle. IC chip mounting method.

10. A continuous antenna assembly in which a plurality of the antennas are continuously formed is transported on a predetermined transport surface. death, The nozzle moves along a circular orbit on a plane perpendicular to the conveying surface, and the nozzle The nozzle is moved in the second position so that the nozzle moves in the same direction as the antenna continuum. Rotating the nozzle attachment portion as shown in FIG.

10. The method for mounting an inlay IC chip according to claim 9.

11. A plurality of the nozzles are attached to the nozzle attachment portion, The nozzle attachment portion is adapted to move each nozzle in sequence from the first position to the second position. Rotate, The antenna array carried by each nozzle when each nozzle is in the second position. placing an IC chip at the reference position of each antenna of the series; 11. The IC chip mounting method according to claim 9 or 10.

12. A plurality of the nozzles are attached to the nozzle attachment portion, determining the first correction amount corresponding to each nozzle; Based on the first correction amount determined for each nozzle, the corresponding nozzle is rotated around the axis. Rotate, 12. The IC chip mounting method according to claim 9, wherein the IC chip mounting method is a method for mounting an IC chip on a substrate.

13. The nozzle attachment portion is moved in the width direction to move the nozzle in the width direction. Move, 13. The IC chip mounting method according to claim 9, wherein the IC chip mounting method is a method for mounting an IC chip on a substrate.

14. The placement of the IC chip at the reference position of the antenna is performed by the nozzle. toward the reference position of the antenna, 14. The IC chip mounting method according to claim 9, wherein the IC chip mounting method is a method for mounting an IC chip on a substrate.

15. The placement of the IC chip at the reference position of the antenna is performed by the nozzle. The nozzle is moved while adsorbing the nozzle, so that the nozzle approaches the antenna. by releasing the suction to the IC chip at the reference position.

14. The IC chip mounting method according to claim 9, wherein the IC chip mounting method is a method for mounting an IC chip on a substrate.

Images