Holding assembly

Abstract

To provide a holding assembly capable of appropriately holding an object.SOLUTION: A holding assembly A1 includes: an outer cylinder 1 which has a through hole 11 extending in a first direction z and one or more abutting surfaces 121 facing a z1 side of the first direction z; a holding part 2 which is at least partially inserted into the through hole 11 and having a holding surface 22 facing the z1 side of the first direction z; and a relative motion mechanism 3 which brings the holding part 2 into an initial state in which by relatively moving the holding part 2 relative to the outer cylinder 1 in the first direction z, the holding surface 22 is positioned closer to the z1 side of the first direction z than the abutting surface 121 or is positioned at the same position as the abutting surface in the first direction z or a caving state in which the holding surface 22 is closer to a z2 side of the first direction z than the abutting surface 121.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present disclosure relates to a retainer. [Background technology]

[0002] An example of a conventional die bonding apparatus is disclosed in Patent Document 1. The die bonding apparatus disclosed in the document has a collet. This collet is used to hold a semiconductor chip when bonding the semiconductor chip. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-048201

[0004] [overview] Depending on the object to be held, the collet may not be able to hold it properly.

[0005] The present disclosure has been devised in light of the above circumstances, and an object of the present disclosure is to provide a holder capable of more appropriately holding an object.

[0006] The retainer provided by the present disclosure comprises an outer tube portion having a through hole extending in a first direction and one or more abutment surfaces facing a first side in the first direction, a retaining portion at least partially inserted into the through hole and having a retaining surface facing the first side in the first direction, and a relative movement mechanism that moves the retaining portion relative to the outer tube portion in the first direction to cause the retaining portion to take an initial state in which the retaining surface is located on the first side in the first direction of the abutment surface or is at the same position as the abutment surface in the first direction, and a recessed state in which the retaining surface is located on a second side in the first direction of the abutment surface.

[0007] Other features and advantages of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view showing a holder according to a first embodiment of the present disclosure. [Diagram 2] FIG. 2 is a perspective view showing a holder according to the first embodiment of the present disclosure. [Diagram 3] FIG. 3 is a front view showing the holder according to the first embodiment of the present disclosure. [Figure 4] FIG. 4 is a bottom view showing the holder according to the first embodiment of the present disclosure. [Diagram 5] FIG. 5 is a cross-sectional view taken along line VV in FIG. [Figure 6] FIG. 6 is a cross-sectional view taken along line VV in FIG. [Figure 7] FIG. 7 is a partially enlarged cross-sectional view showing the holder according to the first embodiment of the present disclosure. [Figure 8] FIG. 8 is a plan view showing an example of a semiconductor device manufactured using the holder according to the first embodiment of the present disclosure. [Figure 9] FIG. 9 is a plan view showing a manufacturing process of a semiconductor device manufactured using the holder according to the first embodiment of the present disclosure. [Figure 10] FIG. 10 is a cross-sectional view taken along the line XX in FIG. [Figure 11] FIG. 11 is a plan view showing a manufacturing process of a semiconductor device manufactured using the holder according to the first embodiment of the present disclosure. [Figure 12] FIG. 12 is a cross-sectional view taken along line XII-XII in FIG. [Figure 13] FIG. 13 is a bottom view showing a first modified example of the holder according to the first embodiment of the present disclosure. [Figure 14] FIG. 14 is a bottom view showing a second modified example of the holder according to the first embodiment of the present disclosure. [Figure 15]FIG. 15 is a bottom view showing a third modified example of the holder according to the first embodiment of the present disclosure. [Figure 16] FIG. 16 is a bottom view showing a fourth modified example of the holder according to the first embodiment of the present disclosure. [Figure 17] FIG. 17 is a perspective view showing a fifth modified example of the holder according to the first embodiment of the present disclosure. [Figure 18] FIG. 18 is a cross-sectional view showing a fifth modified example of the holder according to the first embodiment of the present disclosure. [Figure 19] FIG. 19 is a cross-sectional view showing a holder according to a second embodiment of the present disclosure. [Figure 20] FIG. 20 is an enlarged cross-sectional view of a main portion showing a holder according to a second embodiment of the present disclosure.

[0009] [Detailed Description] Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the drawings.

[0010] The terms "first," "second," "third," etc. in this disclosure are used merely for identification purposes and are not intended to impose any ordering on their objects.

[0011] In this disclosure, "a certain object A is formed on a certain object B" and "a certain object A is formed on a certain object B" include "a certain object A is formed directly on a certain object B" and "a certain object A is formed on a certain object B with another object interposed between the certain object A and the certain object B" unless otherwise specified. Similarly, "a certain object A is disposed on a certain object B" and "a certain object A is disposed on a certain object B" include "a certain object A is disposed directly on a certain object B" and "a certain object A is disposed on a certain object B with another object interposed between the certain object A and the certain object B" unless otherwise specified. Similarly, "a certain object A is located on a certain object B" includes "a certain object A is located on a certain object B in contact with a certain object B" and "a certain object A is located on a certain object B with another object interposed between the certain object A and the certain object B". Furthermore, unless otherwise specified, "an object A overlaps an object B when viewed in a certain direction" includes "an object A overlaps the entire object B" and "an object A overlaps a part of an object B." Furthermore, in this disclosure, "a surface A faces (one side or the other side of) direction B" is not limited to the case where the angle of surface A with respect to direction B is 90°, but also includes the case where surface A is tilted with respect to direction B.

[0012] 1 to 7 show a holder according to a first embodiment of the present disclosure. The holder A1 of this embodiment includes an outer cylinder portion 1, a holding portion 2, and a relative movement mechanism 3. The specific configuration and use of the holder A1 are not limited in any way. Uses of the holder A1 include, for example, holding in the manufacture of semiconductor devices described below.

[0013] In these figures, the first direction of the present disclosure is defined as the first direction z. The first side of the first direction z is referred to as the z1 side, and the second side opposite the first side of the z direction is referred to as the z2 side. A direction perpendicular to the first direction z is defined as the second direction x. The first side of the second direction x is referred to as the x1 side, and the second side opposite the x1 side is referred to as the x2 side. A direction perpendicular to the first direction z and the second direction x is defined as the third direction y. The first side of the third direction y is referred to as the y1 side, and the second side opposite the y1 side is referred to as the y2 side.

[0014] 1 to 7, the outer tubular portion 1 has a through hole 11 and one or more contact surfaces 121. The through hole 11 extends in a first direction z and penetrates the outer tubular portion 1 in the first direction z. The one or more contact surfaces 121 are surfaces facing the z1 side in the first direction z.

[0015] The material of the outer tube portion 1 is not limited in any way, and may be, for example, metal, resin, or the like. The specific shape of the outer shape of the outer tube portion 1 is not limited in any way, and various shapes such as a rectangular shape, a circular shape, an ellipse, a polygonal shape, etc., may be selected when viewed in the first direction z. In the example shown in FIG. 4, the outer shape of the outer tube portion 1 is rectangular when viewed in the first direction z. The specific shape of the through hole 11 is not limited in any way, and various shapes such as a rectangular shape, a circular shape, an ellipse, a polygonal shape, etc., may be selected when viewed in the first direction z. In the example shown in FIG. 4, the through hole 11 is circular when viewed in the first direction z.

[0016] As shown in FIG. 5 and FIG. 6, in the illustrated example, the through hole 11 includes a sliding portion 111, a storage portion 112, and a step portion 113. The through hole 11 is a portion that opens to the z1 side of the first direction z. The storage portion 112 is located on the z2 side of the first direction z with respect to the sliding portion 111. The size of the cross section of the storage portion 112 perpendicular to the first direction z is larger than that of the sliding portion 111. The step portion 113 is interposed between the sliding portion 111 and the storage portion 112. In the illustrated example, the step portion 113 has a surface facing the z2 side of the first direction z and has an annular surface when viewed from the z2 side of the first direction z.

[0017] 2 to 6, in this embodiment, the outer tubular portion 1 has one or more protrusions 12 and a main surface 13. The main surface 13 is a surface facing the z1 side in the first direction z. The main surface 13 is located on the z2 side in the first direction z with respect to one or more contact surfaces 121. In the illustrated example, the through hole 11 opens to the main surface 13.

[0018] The one or more protrusions 12 protrude from the main surface 13 toward the z1 side in the first direction z. Each protrusion 12 includes a contact surface 121. In the illustrated example, the main surface 13 has a portion located between the through hole 11 and the one or more protrusions 12. In other words, each protrusion 12 is spaced apart from the through hole 11.

[0019] The number of the one or more protrusions 12 and the one or more abutment surfaces 121 is not limited in any way and may be one or more. In the illustrated example, the outer cylinder portion 1 has four protrusions 12 and four abutment surfaces 121.

[0020] The four protrusions 12 include two protrusions 12 located on both sides of the through hole 11 in the second direction x. That is, the four abutment surfaces 121 include two abutment surfaces 121 located on both sides of the through hole 11 in the second direction x. Also, the four protrusions 12 include two protrusions 12 located on both sides of the through hole 11 in the third direction y. That is, the four abutment surfaces 121 include two abutment surfaces 121 located on both sides of the through hole 11 in the third direction y. In the illustrated example, the four abutment surfaces 121 are separated from each other. Also, in the illustrated example, the four protrusions 12 (abutment surfaces 121) are separated from the four corners of the outer tube portion 1 when viewed in the first direction z.

[0021] Two of the four protrusions 12 (abutment surfaces 121) are positioned in the second direction x at the same position as the through hole 11. Furthermore, two of the four protrusions 12 (abutment surfaces 121) are positioned in the third direction y at the same position as the through hole 11. In other words, the four protrusions 12 (abutment surfaces 121) are separated from the four corners of the outer shape of the outer tube portion 1 when viewed in the first direction z.

[0022] The shape and size of the contact surface 121 are not limited in any way, and various shapes such as a rectangle, a circle, an ellipse, a polygon, etc. can be selected. In the example shown in Figures 2 and 4, the contact surface 121 is rectangular, and is an elongated rectangle extending long along the four sides of the outer shape of the outer tubular portion 1. In the illustrated example, the longitudinal size of the contact surface 121 is 0.5 mm or more and 10 mm or less, and the lateral size is 0.1 mm or more and 2 mm or less.

[0023] As shown in Figs. 2 to 6, at least a portion of the holding portion 2 is inserted into the through hole 11. The holding portion 2 has a holding surface 22. The holding surface 22 is a surface facing the z1 side in the first direction z, and is a surface that holds an object (the first bonding sheet 96A and the second bonding sheet 96B in Figs. 2, 5, and 6). The specific shape of the holding surface 22 is not limited in any way, and various shapes such as a rectangular shape, a circular shape, an elliptical shape, a polygonal shape, etc. can be selected as viewed in the first direction z. In the example shown in Fig. 4, the holding surface 22 is circular as viewed in the first direction z.

[0024] The mechanism by which the holding unit 2 holds the object is not limited in any way. Various mechanisms such as suction, adhesion, electrostatic adsorption, etc. can be adopted for holding by the holding unit 2. In the following explanation, a case where the holding unit 2 holds the object by suction will be described.

[0025] As shown in Fig. 2 and Figs. 4 to 6, the holding portion 2 has a suction hole 23. The suction hole 23 opens in the holding surface 22. There is no limitation on the specific shape of the suction hole 23, and in the illustrated example, the suction hole 23 is circular when viewed in the first direction z. There is no limitation on the number of the suction holes 23. The holding portion 2 may have one suction hole 23 or multiple suction holes 23.

[0026] As shown in FIG. 5 and FIG. 6, in this embodiment, the suction hole 23 communicates with the through hole 11. In the illustrated example, the holder A1 is attached to, for example, a base 8. The base 8 functions to impart a suction force necessary for holding to the holder A1 and to move the holder A1 to a desired position. In the illustrated example, the base 8 has a suction hole 81. The suction hole 81 communicates with the suction hole 23 via the through hole 11. The suction hole 23 sucks the target object by sucking in gas from the suction hole 81. Note that the suction hole 23 is not limited to a configuration that communicates with the through hole 11, and may be a configuration that does not communicate with the through hole 11, for example, by being connected to a pipe not shown.

[0027] 5 and 6, in the illustrated example, the holding part 2 has a main body part 21 and a flange part 24. The main body part 21 is inserted into the sliding part 111 and is a part that slides with the sliding part 111. The holding surface 22 is a tip surface of the main body part 21.

[0028] The flange portion 24 is located on the z2 side in the first direction z with respect to the main body portion 21. The size of a cross section of the flange portion 24 perpendicular to the first direction z is larger than that of the sliding portion 111 and smaller than that of the accommodation portion 112. The flange portion 24 is accommodated in the accommodation portion 112.

[0029] The relative movement mechanism 3 is a mechanism that moves the holding portion 2 relative to the outer tube portion 1 in the first direction z, thereby causing the holding portion 2 to assume an initial state and a collapsed state. The initial state of the holding portion 2 is a state in which the holding surface 22 is located on the z1 side of the abutment surface 121 in the first direction z, as shown in FIG. 5. The collapsed state of the holding portion 2 is a state in which the holding surface 22 is located on the z2 side of the abutment surface 121 in the first direction z, as shown in FIG. 7. In the illustrated example, the holding surface 22 is located on the z2 side of the abutment surface 121 in the first direction z by a height dz. At this time, the holding surface 22 abuts against the step portion 113.

[0030] The specific configuration of the relative movement mechanism 3 is not limited in any way. The relative movement mechanism 3 can employ various mechanisms, such as a mechanism that utilizes elastic force, or a mechanism that utilizes an actuator such as a motor or an air cylinder. In this embodiment, the relative movement mechanism 3 includes a spring 31, which is a mechanism that utilizes elastic force. The spring 31 is, for example, a metallic helical spring, but the specific configuration is not limited in any way as long as it is configured to exert elastic force.

[0031] As shown in FIG. 5 and FIG. 6, the spring 31 is accommodated in the accommodation portion 112. The spring 31 is located between the flange portion 24 and the base portion 8 in the first direction z. In the initial state shown in FIG. 5, the spring 31 may exert an elastic force that pushes the holding portion 2 toward the z1 side in the first direction z, or the spring 31 may not exert a significant elastic force because it has a natural length. In the collapsed state shown in FIG. 7, as shown in FIG. 6, the holding portion 2 moves relative to the outer tube portion 1 toward the z2 side in the first direction z, and the holding portion 2 and the base portion 8 approach each other. The spring 31 is arranged between the flange portion 24 and the base portion 8 of the holding portion 2, and is compressed in the first direction z. As a result, the spring 31 exerts an elastic force that moves the holding portion 2 toward the z1 side in the first direction z.

[0032] 8 shows a semiconductor device B, which is an example of a device manufactured using the holder A1. The semiconductor device B includes, for example, an insulating substrate 9, a plurality of first semiconductor elements 95A, a plurality of second semiconductor elements 95B, a plurality of first bonding sheets 96A, a plurality of second bonding sheets 96B, a positive input terminal 97A, an output terminal 97B, a negative input terminal 97C, a plurality of control terminals 97D, a plurality of control terminals 97E, a plurality of first wires 98A, a plurality of second wires 98B, a plurality of third wires 98C, a plurality of fourth wires 98D, and a sealing resin 99.

[0033] There is no limitation on the specific use of the semiconductor device B. In the semiconductor device B, a half-bridge circuit is configured by a plurality of first semiconductor elements 95A configuring an upper arm circuit and a plurality of second semiconductor elements 95B configuring a lower arm circuit. The semiconductor device B, for example, configures an inverter for converting DC power into AC power and supplying power to a drive source such as a motor. The semiconductor device B of this embodiment will be described taking the case where it has one half-bridge circuit as an example, but it may also be configured to have, for example, three half-bridge circuits and supply power to a so-called three-phase AC motor.

[0034] Each of the first semiconductor elements 95A and the second semiconductor elements 95B is made of a semiconductor material mainly made of SiC (silicon carbide). The semiconductor material is not limited to SiC, and may be Si (silicon), GaAs (gallium arsenide), or GaN (gallium nitride). In this embodiment, the first semiconductor element 95A and the second semiconductor element 95B are MOSFETs (Metal-Oxide-Semiconductor Field Effect Transistors). The first semiconductor element 95A and the second semiconductor element 95B are not limited to the first semiconductor element 95A and the second semiconductor element 95B, and may be a field effect transistor including a MISFET (Metal-Insulator-Semiconductor FET), a bipolar transistor such as an IGBT (Insulated Gate Bipolar Transistor), an IC chip such as an LSI, a diode, a capacitor, or the like.

[0035] As shown in FIG. 10, the insulating substrate 9 has an insulating layer 90, a back surface metal layer 91, a first main surface metal layer 92A, a second main surface metal layer 92B, a third main surface metal layer 93A, a fourth main surface metal layer 93B, a bonding layer 94A and a bonding layer 94B.

[0036] The insulating layer 90 is an insulating plate-like member including, for example, ceramic. The back metal layer 91 is laminated on the z1 side of the insulating layer 90 in the first direction z. The back metal layer 91 includes a metal such as Cu (copper). The first main surface metal layer 92A is laminated on the x1 side of the second direction x on the z2 side of the insulating layer 90 in the first direction z. The second main surface metal layer 92B is laminated on the x2 side of the second direction x on the z2 side of the insulating layer 90 in the first direction z. The first main surface metal layer 92A and the second main surface metal layer 92B are separated from each other and each includes a metal such as Cu (copper). The insulating layer 90, the back metal layer 91, the first main surface metal layer 92A, and the second main surface metal layer 92B may form, for example, a DBC (Direct Bonded Copper) substrate or an AMB (Active Metal Brazing) substrate.

[0037] The third principal surface metal layer 93A is bonded to the first principal surface metal layer 92A via a bonding layer 94A. The third principal surface metal layer 93A contains a metal such as Cu (copper). The bonding layer 94A is for bonding the first principal surface metal layer 92A and the bonding layer 94A by, for example, solid-state diffusion bonding. The specific configuration of the bonding layer 94A is not limited in any way, and may be, for example, a configuration in which a metal layer containing, for example, Ag (silver) is formed on both sides of a base layer containing Al (aluminum). In this case, a metal layer containing, for example, Ag (silver) may be formed on the surfaces of the first principal surface metal layer 92A and the third principal surface metal layer 93A.

[0038] The fourth principal surface metal layer 93B is bonded to the second principal surface metal layer 92B via a bonding layer 94B. The fourth principal surface metal layer 93B contains a metal such as Cu (copper). The bonding layer 94B is for bonding the second principal surface metal layer 92B and the bonding layer 94B by, for example, solid-phase diffusion bonding. The specific configuration of the bonding layer 94B is not limited in any way, and may be, for example, a configuration in which a metal layer containing, for example, Ag (silver) is formed on both sides of a base layer containing Al (aluminum). In this case, a metal layer containing, for example, Ag (silver) may be formed on the surfaces of the second principal surface metal layer 92B and the fourth principal surface metal layer 93B.

[0039] The first semiconductor elements 95A are conductively bonded to the third principal surface metal layer 93A via the first bonding sheets 96A. The first bonding sheet 96A is for conductively bonding the first semiconductor elements 95A and the third principal surface metal layer 93A, for example, by solid-phase diffusion bonding. The specific configuration of the first bonding sheet 96A is not limited in any way, and may be, for example, a configuration in which a metal layer containing, for example, Ag (silver) is formed on both sides of a base layer containing Al (aluminum). In this case, a metal layer containing, for example, Ag (silver) may be formed on the surfaces of the first semiconductor elements 95A and the third principal surface metal layer 93A. As a result, for example, the drain electrodes of the first semiconductor elements 95A are conductive with the third principal surface metal layer 93A.

[0040] The second semiconductor elements 95B are conductively bonded to the fourth principal surface metal layer 93B via the second bonding sheets 96B. The second bonding sheet 96B is for conductively bonding the second semiconductor elements 95B and the fourth principal surface metal layer 93B, for example, by solid-phase diffusion bonding. The specific configuration of the second bonding sheet 96B is not limited in any way, and may be, for example, a configuration in which a metal layer containing, for example, Ag (silver) is formed on both sides of a base layer containing Al (aluminum). In this case, a metal layer containing, for example, Ag (silver) may be formed on the surfaces of the second semiconductor elements 95B and the fourth principal surface metal layer 93B. As a result, for example, the drain electrodes of the second semiconductor elements 95B are conductive with the fourth principal surface metal layer 93B.

[0041] The positive input terminal 97A is a terminal that is connected to the positive side of a DC power supply, and is conductively joined to the third main surface metal layer 93A.

[0042] The output terminal 97B is a terminal that is connected to a load such as a motor, etc. The output terminal 97B is conductively joined to the fourth main surface metal layer 93B.

[0043] The negative input terminal 97C is a terminal connected to the negative side of a DC power supply. The negative input terminal 97C is electrically connected to, for example, source electrodes of the second semiconductor elements 95B via a plurality of second wires 98B. The second wires 98B include a metal such as copper (Cu), aluminum (Al), or gold (Au).

[0044] For example, source electrodes of the multiple first semiconductor elements 95A are electrically connected to the fourth main surface metal layer 93B via multiple first wires 98A. The first wires 98A include a metal such as copper (Cu), Al (aluminum), or gold (Au).

[0045] The multiple control terminals 97D are terminals for controlling the multiple first semiconductor elements 95A. The multiple control terminals 97D are electrically connected to, for example, gate electrodes, source sense electrodes, etc. of the multiple first semiconductor elements 95A via multiple third wires 98C. The third wires 98C include a metal such as copper (Cu), Al (aluminum), or gold (Au).

[0046] The control terminals 97E are terminals for controlling the second semiconductor elements 95B. The control terminals 97E are electrically connected to, for example, gate electrodes, source sense electrodes, etc. of the second semiconductor elements 95B via fourth wires 98D. The fourth wires 98D include a metal such as copper (Cu), aluminum (Al), or gold (Au).

[0047] The sealing resin 99 covers a part of the insulating substrate 9, the plurality of first semiconductor elements 95A, the plurality of second semiconductor elements 95B, etc. A portion of each of the positive input terminal 97A, the output terminal 97B, the negative input terminal 97C, the plurality of control terminals 97D, and the plurality of control terminals 97E protrudes from the sealing resin 99.

[0048] Next, a step in the method for manufacturing the semiconductor device B using the holder A1 will be described.

[0049] In the manufacturing method of the semiconductor device B, a plurality of first semiconductor elements 95A are conductively bonded to the third main surface metal layer 93A, and a plurality of second semiconductor elements 95B are conductively bonded to the fourth main surface metal layer 93B. In this embodiment, solid-state diffusion bonding is used for these conductive bondings. The plurality of first bonding sheets 96A and second bonding sheets 96B are provided to more appropriately realize solid-state diffusion bonding.

[0050] As shown in Figures 9 and 10, an insulating substrate 9 is prepared. Next, a plurality of first bonding sheets 96A are placed on the third principal surface metal layer 93A using a holder A1, and a plurality of second bonding sheets 96B are placed on the fourth principal surface metal layer 93B. The first bonding sheet 96A and the second bonding sheet 96B are formed in a state similar to metal foil, and an example of the size thereof when viewed in the first direction z is, for example, about 2 mm square to 15 mm square, and the thickness in the first direction z (thickness t0 in Figure 7) is, for example, 0.05 mm to 0.3 mm, for example, about 0.11 mm.

[0051] As shown in FIG. 5, the first bonding sheet 96A or the second bonding sheet 96B prepared at a predetermined position outside the figure is held by the holder A1. At this time, the holder 2 is in an initial state, and the holding surface 22 protrudes toward the z1 side in the first direction z relative to the contact surface 121. With the holding surface 22 in close proximity to or in contact with the first bonding sheet 96A or the second bonding sheet 96B, suction is applied through the suction hole 23. The first bonding sheet 96A or the second bonding sheet 96B is attracted by this suction force and held by the holding surface 22. At this time, the contact surface 121 is separated from the first bonding sheet 96A or the second bonding sheet 96B.

[0052] Next, the holder A1 is moved above the third principal surface metal layer 93A or the fourth principal surface metal layer 93B on which the first bonding sheet 96A or the second bonding sheet 96B is to be placed. Then, the holder A1 is moved toward the z1 side in the first direction z. This downward movement brings the first bonding sheet 96A or the second bonding sheet 96B into contact with the third principal surface metal layer 93A or the fourth principal surface metal layer 93B.

[0053] When the holder A1 is further moved toward the z1 side in the first direction z, the spring 31 is pressed by the third principal surface metal layer 93A or the fourth principal surface metal layer 93B via the holder 2. As a result, the spring 31 contracts in the first direction z. As a result, the holder 2 is kept pressed against the third principal surface metal layer 93A or the fourth principal surface metal layer 93B via the first bonding sheet 96A or the second bonding sheet 96B, and the outer cylinder 1 moves toward the z1 side in the first direction z. Then, as shown in FIG. 6, the contact surface 121 contacts the first bonding sheet 96A or the second bonding sheet 96B.

[0054] Furthermore, when the holder A1 is pressed toward the z1 side in the first direction z by the base 8, a part of the first bonding sheet 96A or the second bonding sheet 96B is crushed by the pressing force from the contact surface 121 as shown in FIG. 7. This crushed part becomes a pressing portion 961. The thickness t1 of the pressing portion 961 is thinner than the above-mentioned thickness t0 by a height dz. That is, the contact surface 121 is located on the z1 side by the height dz from the holding surface 22 in the first direction z. In other words, the holding surface 22 is located on the z2 side by the height dz from the contact surface 121 in the first direction z.

[0055] The first bonding sheet 96A or the second bonding sheet 96B is temporarily bonded to the third principal surface metal layer 93A or the fourth principal surface metal layer 93B by the pressing force of the contact surface 121. Although this bonding has a lower bonding strength than bonding by solid-phase diffusion bonding, it prevents the first bonding sheets 96A and the second bonding sheets 96B from moving during subsequent transportation of the insulating substrate 9. In addition to the pressing force of the contact surface 121, ultrasonic waves may be applied via the outer tube portion 1, for example, to perform temporary bonding.

[0056] After the first bonding sheets 96A and the second bonding sheets 96B are temporarily bonded, the first semiconductor elements 95A and the second semiconductor elements 95B are placed on or temporarily bonded to the first bonding sheets 96A and the second bonding sheets 96B as shown in FIG. 11 and FIG. 12. After this, solid-phase diffusion bonding is performed on the integrated product of the insulating substrate 9, the first bonding sheets 96A and the second bonding sheets 96B, and the first semiconductor elements 95A and the second semiconductor elements 95B as shown in FIG. 11 and FIG. 12. As a result, the first semiconductor elements 95A and the second semiconductor elements 95B are conductively bonded to the third main surface metal layer 93A and the fourth main surface metal layer 93B via the first bonding sheets 96A and the second bonding sheets 96B. Through such processes, the semiconductor device B is manufactured.

[0057] Next, the function of the holder A1 will be described.

[0058] 5, when no significant external force is applied to the holder A1, the holder 2 is in an initial state. In this state, the holder surface 22 is located on the z1 side in the first direction z relative to the contact surface 121. Therefore, when the holder surface 22 holds an object (such as the first bonding sheet 96A or the second bonding sheet 96B), it is possible to prevent the contact surface 121 from interfering with the object (such as the first bonding sheet 96A or the second bonding sheet 96B). Therefore, the object (such as the first bonding sheet 96A or the second bonding sheet 96B) can be held more appropriately.

[0059] When a thin object such as the first bonding sheet 96A or the second bonding sheet 96B is held by suction, unlike the present embodiment, if the peripheral portions of the first bonding sheet 96A or the second bonding sheet 96B are held, there is a concern that the central portions of the first bonding sheet 96A or the second bonding sheet 96B may bend unduly due to the negative pressure of suction. In the present embodiment, the holding surface 22 is capable of holding the vicinity of the center of the object (the first bonding sheet 96A, the second bonding sheet 96B, etc.). Therefore, it is suitable for holding a thin object.

[0060] As shown in Fig. 6 and Fig. 7, after the object (the first bonding sheet 96A, the second bonding sheet 96B, etc.) is brought into contact with the third main surface metal layer 93A and the fourth main surface metal layer 93B, a force is applied to move the outer cylinder portion 1 further toward the z1 side in the first direction z, so that the object (the first bonding sheet 96A, the second bonding sheet 96B, etc.) can be partially pressed by the contact surface 121. This allows the pressing portion 961 to be formed at a desired position of the first bonding sheet 96A and the second bonding sheet 96B, for example. On the other hand, since the spring 31 is provided, the holding surface 22 in Fig. 7 is not pressed against the first bonding sheet 96A and the second bonding sheet 96B with a strong force. Therefore, the pressing portion 961 is not formed at the contact portion with the holding surface 22. For example, in the subsequent solid-state diffusion bonding of the first semiconductor element 95A and the second semiconductor element 95B, if the pressing portion 961 is present at a position overlapping the first semiconductor element 95A and the second semiconductor element 95B, the bonding strength of the solid-state diffusion bonding may decrease, but this type of problem can be suppressed.

[0061] The relative movement mechanism 3 includes a spring 31. This allows the holding portion 2 to smoothly transition between the initial state and the collapsed state. In addition, the relative movement mechanism 3 utilizing elastic force has the advantage that it is possible to avoid a complex structure.

[0062] The four contact surfaces 121 include two contact surfaces 121 arranged on both sides of the through hole 11 in the second direction x, and two contact surfaces 121 arranged on both sides of the through hole 11 in the third direction y. This allows the first bonding sheet 96A and the second bonding sheet 96B to be pressed in a more balanced manner.

[0063] 13 to 16 show modified examples of the present disclosure. In these figures, elements that are the same as or similar to those in the above embodiment are given the same reference numerals as those in the above embodiment. In addition, the configurations of the various parts in each of the modified examples and each of the embodiments can be appropriately combined with each other as long as no technical contradiction occurs.

[0064] 13 shows a first modified example of the holder A1. The holder A11 of this modified example differs from the above-mentioned examples in the configurations of the protrusion 12 and the contact surface 121.

[0065] In this embodiment, the contact surface 121 (protrusion 12) has a rectangular ring shape when viewed in the first direction z. In other words, four contact surfaces 121 are connected to each other.

[0066] This modification also makes it possible to hold the object more appropriately.

[0067] 14 shows a second modified example of the holder A1. The holder A12 of this modified example has four contact surfaces 121 (protrusions 12) disposed at the four corners of the outer shape of the outer tubular portion 1. The contact surfaces 121 are L-shaped when viewed in the first direction z.

[0068] This modification also makes it possible to hold the object more appropriately. Furthermore, according to this modification, the pressing portions 961 shown in Fig. 7 can be formed at the four corners of the first bonding sheet 96A or the second bonding sheet 96B.

[0069] 15 shows a third modified example of the holder A1. The holder A13 of this modified example has two contact surfaces 121 (protrusions 12). The two contact surfaces 121 (protrusions 12) are disposed on both sides of the through hole 11 in the second direction x.

[0070] This modified example also makes it possible to hold the object more appropriately. Moreover, as can be understood from this modified example, the number of the one or more contact surfaces 121 is not limited in any way.

[0071] 16 shows a fourth modified example of the holder A1. The holder A14 of this modified example has a different shape of the sliding part 111 and the holding surface 22 (main body part 21) from the above-mentioned example. In this modified example, the sliding part 111 and the holding surface 22 (main body part 21) are rectangular when viewed in the first direction z.

[0072] This modified example also makes it possible to hold the object more appropriately. As can be understood from this modified example, the shapes of the sliding portion 111 and the holding surface 22 (main body portion 21) are not limited in any way.

[0073] 17 and 18 show a fifth modified example of the holder A1. The holder A15 of this modified example has a different configuration of the protrusion 12 from that of the holder A1 described above.

[0074] The protrusion 12 of this modification has a contact surface 121 and an inclined surface 122. The contact surface 121 is a surface having the above-mentioned configuration. The inclined surface 122 is located outside the contact surface 121 in the second direction x or the third direction y. The inclined surface 122 is inclined so as to be located closer to the z2 side in the first direction z as it moves outward in the second direction x or the third direction y.

[0075] This modification also allows the object to be held more appropriately. In addition, according to this modification, the inclined surface 122 of the protrusion 12 can prevent the protrusion 12 from interfering with an external object (for example, a tray on which the first bonding sheet 96A or the second bonding sheet 96B is placed, etc.).

[0076] 19 and 20 show a holder according to a second embodiment of the present disclosure. A holder A2 of this embodiment differs from the above-described embodiments in the configuration of a relative movement mechanism 3.

[0077] In this embodiment, the holding portion 2 also serves as the relative movement mechanism 3. Specifically, the holding portion 2 is made of a material that exhibits significant elastic deformation, such as rubber. In the initial state shown in Fig. 19, the holding surface 22 is at the same position as the contact surface 121 in the first direction z. Note that, in this embodiment as well, the holding surface 22 may protrude further toward the z1 side in the first direction z than the contact surface 121.

[0078] In Fig. 20, the holder A2 is pressed against the first bonding sheet 96A or the second bonding sheet 96B placed on the third main surface metal layer 93A or the fourth main surface metal layer 93B, causing the holder A2 to assume a depressed state. The holder 2 has a smaller elastic modulus than the first bonding sheet 96A or the second bonding sheet 96B, which are made of metal, for example, and is significantly elastically deformed. For this reason, in Fig. 20, the holder 2 is compressed in the first direction z, and the size in the first direction z is smaller than the initial state. As a result of the compression of the holder 2, the holding surface 22 is located on the z2 side in the first direction z relative to the abutting surface 121, and the holder 2 assumes a depressed state.

[0079] This embodiment also makes it possible to hold the object more appropriately. As can be understood from this embodiment, the holding portion 2 itself may function as the relative movement mechanism 3, for example, by forming the holding portion 2 from a material that exhibits significant elastic deformation.

[0080] The holder according to the present disclosure is not limited to the above-described embodiment. The specific configuration of each part of the holder according to the present disclosure can be freely designed in various ways.

[0081] [Appendix 1] An outer cylinder portion (1) having a through hole (11) extending in a first direction and one or more abutment surfaces (121) facing a first side in the first direction; a holding portion (2) at least a portion of which is inserted into the through hole (11) and has a holding surface (22) facing the first side in the first direction; a relative movement mechanism (3) that moves the holding portion (2) relative to the outer tube portion (1) in the first direction, thereby causing the holding portion (2) to take an initial state in which the holding surface (22) is located on the first side of the abutment surface (121) in the first direction or at the same position as the abutment surface (121) in the first direction, and a recessed state in which the holding surface (22) is located on a second side of the abutment surface (121) in the first direction. [Appendix 2] The holder (A1) according to claim 1, wherein the holding portion (2) has a suction hole (23) opening into the holding surface (22). [Appendix 3] The holder (A1) according to claim 2, wherein the suction hole (23) communicates with the through hole (11). [Appendix 4] The outer cylinder portion (1) has a main surface (13) facing the first side in the first direction and one or more protrusions protruding from the main surface (13) toward the first side in the first direction, 4. The holder (A1) according to any one of claims 1 to 3, wherein the protrusion (12) includes the contact surface (121). [Appendix 5] The holder (A1) according to appended claim 4, wherein the through hole (11) opens to the main surface (13). [Appendix 6] The holder (A1) according to appendix 5, wherein the main surface (13) has a portion located between the through hole (11) and the protrusion (12). [Appendix 7] The holder (A1) described in Appendix 6, wherein the outer tube portion (1) has two abutment surfaces (121) located on both sides of the through hole (11) in a second direction perpendicular to the first direction. [Appendix 8] The holder (A1) described in Appendix 7, wherein the outer tube portion (1) further has two abutment surfaces (121) located on either side of the through hole (11) in a third direction perpendicular to the first direction and the second direction, thereby having four abutment surfaces (121). [Appendix 9] The holder (A1) according to claim 8, wherein the four contact surfaces (121) are spaced apart from one another. [Appendix 10] The holder (A11) according to claim 8, wherein the four contact surfaces (121) are connected to each other. [Appendix 11] 11. The holder (A1) according to any one of claims 1 to 10, wherein the outer shape of the outer tubular portion (1) is rectangular when viewed in the first direction (z). [Appendix 12] 12. The holder (A1) according to any one of claims 1 to 11, wherein the outer shape of the holding surface (22) is circular when viewed in the first direction (z). [Appendix 13] 13. The holder (A1) according to any one of appendixes 1 to 12, wherein the relative movement mechanism (3) includes a spring (31). [Appendix 14] the through hole (11) includes a sliding portion (111) that opens to the first side in the first direction (z), a storage portion (112) that is located on the second side in the first direction (z) with respect to the sliding portion (111) and has a cross-sectional size perpendicular to the first direction (z) that is larger than that of the sliding portion (111), and a step portion (113) that is interposed between the sliding portion (111) and the storage portion (112), 14. The holder (A1) according to any one of claims 1 to 13, wherein the spring (31) is accommodated in the accommodation portion (112). [Appendix 15] the holding portion (2) has a main body portion (21) that slides on the sliding portion (111) and a flange portion (24) that is located on the second side in the first direction (z) with respect to the main body portion (21), the flange portion (24) has a cross-sectional size perpendicular to the first direction (z) that is larger than the sliding portion (111) and smaller than the accommodation portion (112), and is accommodated in the accommodation portion (112); The retainer (A1) according to appendix 14, wherein the spring (31) is located on the second side in the first direction (z) with respect to the flange portion (24). [Explanation of symbols]

[0082] A1,A11,A12,A13,A14: Holder B: Semiconductor device 1: Outer cylinder 2: Holding part 3: Relative movement mechanism 8: Base 9: Insulating substrate 11: Through hole 12: Convex part 13: Main surface 21: Main body 22: Holding surface 23: Suction hole 24: Flange part 31: Spring 81: Suction hole 90: Insulating layer 91: Back metal layer 92A: First main surface metal layer 92B: 2nd main surface metal layer 93A: Third main surface metal layer 93B: 4th main surface metal layer 94A: Bonding layer 94B: Bonding layer 95A: First semiconductor element 95B: Second semiconductor element 96A: First bonding sheet 96B: Second bonding sheet 97A: Positive input terminal 97B: Output terminal 97C: Negative input terminal 97D, 97E: Control terminal 98A: 1st wire 98B: Second wire 98C: 3rd wire 98D: 4th wire 99: Sealing resin 111: Sliding part 112: Storage unit 113: Step 121: Contact surface 122: Inclined surface 961: Pressing part dz :height t0, t1: thickness x :Second direction y : third direction z: first direction

Claims

1. An outer cylinder portion having a through hole extending in a first direction and one or more abutment surfaces facing a first side in the first direction; a holding portion having a holding surface at least partially inserted into the through hole and facing the first side in the first direction; a relative movement mechanism that moves the holding portion relative to the outer tube portion in the first direction to cause the holding portion to take an initial state in which the holding surface is located on the first side of the abutment surface in the first direction or at the same position as the abutment surface in the first direction, and a recessed state in which the holding surface is located on the second side of the abutment surface in the first direction.

2. The holder according to claim 1 , wherein the holding portion has a suction hole that opens into the holding surface.

3. The holder according to claim 2 , wherein the suction hole communicates with the through hole.

4. the outer cylinder portion has a main surface facing the first side in the first direction and one or more protrusions protruding from the main surface to the first side in the first direction, The holder according to claim 1 , wherein the protrusion includes the contact surface.

5. The holder according to claim 4 , wherein the through hole is open to the main surface.

6. The holder according to claim 5 , wherein the main surface has a portion located between the through hole and the protrusion.

7. The holder according to claim 6 , wherein the outer cylinder portion has two of the contact surfaces located on both sides of the through hole in a second direction perpendicular to the first direction.

8. The retainer described in claim 7, wherein the outer tube portion further has two abutment surfaces located on either side of the through hole in a third direction perpendicular to the first direction and the second direction, thereby having four abutment surfaces.

9. The retainer of claim 8 , wherein the four abutment surfaces are spaced apart from one another.

10. The retainer of claim 8 , wherein the four abutment surfaces are interconnected.

11. The holder according to claim 1 , wherein an outer shape of the outer tubular portion is rectangular when viewed in the first direction.

12. The holder according to claim 1 , wherein an outer shape of the holding surface is circular when viewed in the first direction.

13. The holder of claim 1 , wherein the relative motion mechanism includes a spring.

14. the through hole includes a sliding portion that opens to the first side in the first direction, a housing portion that is located on the second side in the first direction with respect to the sliding portion and has a cross-sectional size perpendicular to the first direction larger than that of the sliding portion, and a step portion that is interposed between the sliding portion and the housing portion, The retainer according to claim 1 , wherein the spring is housed in the housing.

15. The holding portion has a main body portion that slides against the sliding portion and a flange portion that is located on the second side in the first direction with respect to the sliding portion, The flange portion has a cross section perpendicular to the first direction that is larger than the sliding portion and smaller than the accommodation portion, and is accommodated in the accommodation portion. The retainer according to claim 14 , wherein the spring is located on the second side in the first direction relative to the flange portion.

Images