Substrate processing device

Abstract

To provide a technique capable of avoiding excessive increase in slide resistance when a heat processing plate is slid and moved.SOLUTION: A guide plate 151 is fixed to a main body frame 11 and extends in an X direction. A first plate 153 is slidable in the X direction with respect to the guide plate 151. A second plate 155 is fixed to a hot plate 20 and slidable in the X direction with respect to the first plate 153. An interlocking separating mechanism 70 interlocks the first plate 153 with the second plate when the hot plate 20 moves from a processing position P1 to an intermediate position P3, and separates the second plate 155 from the first plate 153 when the hot plate 20 moves from the intermediate position P3 to a maintenance position P2.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The subject matter disclosed herein relates to substrate processing apparatus. [Background technology]

[0002] For example, in the processing of various substrates such as glass substrates for display devices, a coating liquid may be applied to the substrate, and then the substrate may be heated to volatilize components contained in the coating liquid.

[0003] Patent Document 1 discloses a substrate processing apparatus in which multiple processing chambers, each equipped with a cool plate for cooling a substrate, are stacked vertically, and a multi-stage substrate processing apparatus in which the processing chambers can be pulled out for easy maintenance is also disclosed.

[0004] More specifically, the cool plate is disposed on a slide unit that can be pulled out toward the front relative to the exterior cover. The slide unit includes a pair of slide members, each of which includes a fixed member attached to the exterior cover, a movable member attached to a slide bracket of the slide unit, and an intermediate member provided between the fixed member and the movable member.

[0005] A ball retainer holding a plurality of balls is provided between the fixed member and the intermediate member, and between the movable member and the intermediate member, so that the intermediate member can slide relatively to the fixed member, and the movable member can slide relatively to the intermediate member, in the sliding direction.

[0006] With this configuration, the movable member can be slid relative to the fixed member, so that the slide unit and the cool plate can be pulled out from the exterior cover to which the fixed member is fixed. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] JP 2000-012448 A Summary of the Invention [Problem to be solved by the invention]

[0008] However, in the conventional technology, when the cool plate is pulled out from the processing position inside the exterior cover to the outside of the exterior cover, only the moving member may move first, and then the middle member may move later. In this case, the middle member moves from a position away from the cool plate, so an excessive load is applied to the middle member. This may cause a large sliding resistance, making it difficult to pull out the cool plate smoothly.

[0009] An object of the present invention is to provide a technique capable of preventing the sliding resistance from becoming excessively large when sliding a heat treatment plate. [Means for solving the problem]

[0010] In order to solve the above problem, a first aspect comprises a heat-treatment plate for heat-treating a substrate, a main body frame supporting the heat-treatment plate, and at least one slide member for moving the heat-treatment plate in a first direction intersecting the vertical direction from a processing position inside the main body frame to a maintenance position, the slide member having a guide plate fixed to the main body frame and extending in the first direction, a first plate slidably movable in the first direction relative to the guide plate, a second plate fixed to the heat-treatment plate and slidably movable in the first direction relative to the first plate, and a linking separation mechanism for linking the first plate and the second plate when the heat-treatment plate moves from the processing position to an intermediate position between the processing position and the maintenance position, and for separating the second plate from the first plate when the heat-treatment plate moves from the intermediate position to the maintenance position.

[0011] A second aspect is the substrate processing apparatus of the first aspect, further comprising a processing chamber that houses the thermal processing plate, and the second plate is fixed to the processing chamber.

[0012] A third aspect is a substrate processing apparatus of the first or second aspect, wherein the guide plate has a guide rail extending in the first direction, the first plate has a guide block that engages with the guide rail and is slidable along the guide rail, and the guide block is fixed to the middle of the first plate in the first direction.

[0013] A fourth aspect is a substrate processing apparatus according to any one of the first to third aspects, comprising a pair of the slide members, the pair of slide members being spaced apart from each other in a second direction that intersects with each of the first direction and the vertical direction.

[0014] A fifth aspect is the substrate processing apparatus of the fourth aspect, wherein the heat-treating plate is positioned between the pair of slide members in the second direction.

[0015] A sixth aspect is the substrate processing apparatus of the fifth aspect, in which the first plate is disposed between the guide plate and the second plate in the second direction, and the interlocking separation mechanism includes a movable pressing member provided on the first plate and movable in the second direction, a regulating protrusion provided on the first plate and protruding toward the second plate, a movable engagement protrusion provided on the second plate and engageable with the regulating protrusion and movable in the second direction, an elastic member provided on the second plate and biasing the movable engagement protrusion toward the first plate, and a cam member provided on the guide plate and protruding toward the first plate, wherein when the heat treatment plate moves from the processing position to the intermediate position, the movable engagement protrusion engages with the regulating protrusion in the first direction, and when the heat treatment plate reaches the intermediate position, the movable pressing member is pushed by the cam member to move toward the second plate, and the movable engagement protrusion is pushed by the movable pressing member to move toward the second plate beyond the regulating protrusion.

[0016] A seventh aspect is the substrate processing apparatus of the fifth aspect, further comprising a stopping mechanism for stopping the first plate, which has been moved to a predetermined stopping position, relative to the guide plate, and the interlocking separation mechanism has an engaging member for engaging the second plate with the first plate, and when the second plate moves in the first direction after the first plate has been stopped at the stopping position by the stopping mechanism, the engagement between the first plate and the second plate by the engaging member is released.

[0017] An eighth aspect is a substrate processing apparatus according to any one of the first to seventh aspects, further comprising a substrate lifting mechanism for raising and lowering the substrate above the heat treatment plate, and the slide member enables the heat treatment plate and the substrate lifting mechanism to be pulled out integrally. Effect of the Invention

[0018] According to the substrate processing apparatus of the first to eighth aspects, when the heat-treating plate is moved from the processing position to the intermediate position, the first plate can be moved following the heat-treating plate. This prevents the first plate from moving away from the heat-treating plate, thereby reducing the load on the first plate. As a result, the sliding resistance of the sliding member can be reduced, and the heat-treating plate can be smoothly pulled out.

[0019] According to the substrate processing apparatus of the second aspect, even if the load of the processing chamber increases, the sliding resistance of the sliding member can be reduced, so that the heat-treating plate and the processing chamber can be easily pulled out.

[0020] According to the substrate processing apparatus of the third aspect, the guide block can be brought closer to the heat-treating plate, so that the load applied to the guide block can be reduced.

[0021] According to the substrate processing apparatus of the fourth aspect, the load of the heat-treating plate can be applied to the pair of slide members, so that the heat-treating plate can be smoothly drawn out.

[0022] According to the substrate processing apparatus of the fifth aspect, the pair of slide members are arranged so as not to overlap with the heat-treating plate in the vertical direction, so that the vertical dimension of the apparatus can be reduced.

[0023] According to the substrate processing apparatus of the sixth aspect, while the heat-treating plate moves from the processing position to the intermediate position, the movable engagement protrusion of the second plate engages with the regulating protrusion of the first plate. This allows the first plate and the second plate to be interlocked. When the heat-treating plate reaches the intermediate position, the movable engagement protrusion of the second plate moves toward the second plate relative to the regulating protrusion of the first plate. This releases the engagement. Therefore, the second plate can be moved separately from the first plate, and the heat-treating plate can be moved together with the second plate from the intermediate position to the maintenance position.

[0024] According to the substrate processing apparatus of the seventh aspect, the first plate and the second plate can be moved in conjunction with and separated from each other with a relatively simple configuration.

[0025] According to the substrate processing apparatus of the eighth aspect, even if the load of the substrate lifting mechanism increases, the sliding resistance of the sliding member can be reduced, so that the heat-treating plate and the substrate lifting mechanism can be smoothly drawn out. [Brief description of the drawings]

[0026] [Figure 1] 1 is a perspective view of a substrate heat treatment apparatus according to a first embodiment; [Diagram 2] 2 is a perspective view showing a processing unit of the substrate heat treatment apparatus shown in FIG. 1. [Diagram 3] 3 is a schematic cross-sectional view showing the configuration of a processing unit shown in FIG. 2. [Figure 4] 3 is an enlarged perspective view showing a part of a slide member provided in the processing unit shown in FIG. 2. FIG. [Diagram 5] 2 is a top view showing a stopping mechanism provided in the substrate heat treatment apparatus shown in FIG. 1. [Figure 6] 13A and 13B are diagrams showing a state in which the processing unit is pulled out by the slide member. [Figure 7] 1. FIG. 4 is a diagram showing the operation of an interlocking separation mechanism included in the substrate heat treatment apparatus shown in FIG. [Figure 8] FIG. 13 is a diagram showing the load (kgf) applied to the sliding member in the process of pulling out the processing unit. [Figure 9] FIG. 11 is a perspective view showing an interlocking separation mechanism of the substrate heat treatment apparatus according to the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0027] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. Note that the components described in the embodiment are merely examples, and are not intended to limit the scope of the present invention. In the drawings, the dimensions and numbers of each part may be exaggerated or simplified as necessary for ease of understanding.

[0028] To facilitate understanding of the positional relationships of each element, the drawings may include arrows indicating the XYZ orthogonal coordinate axes. In this XYZ coordinate system, the Z axis corresponds to the vertical axis, and the XY plane that intersects with the Z axis at a right angle corresponds to the horizontal plane. The (-Z) direction corresponds to the vertical downward direction. In the following explanation, the vertical upward direction may be simply referred to as "upward" or "upper", and the vertical downward direction may be simply referred to as "downward" or "lower".

[0029] <1. First embodiment> FIG. 1 is a perspective view of a substrate heat treatment apparatus 1 according to a first embodiment. The substrate heat treatment apparatus 1 volatilizes a solvent component in a coating liquid such as a photoresist by heating the substrate 9, which is coated on its surface, while the substrate 9 is accommodated in a treatment chamber 17 (see FIG. 2) of a treatment unit 13. The substrate heat treatment apparatus 1 is used, for example, for the purpose of forming a photoresist film on the surface of the substrate 9. The substrate 9 is, for example, various substrates to be treated for electronic devices, specifically, a semiconductor wafer, a glass substrate for a liquid crystal display or a plasma display, a glass or ceramic substrate for a magnetic disk or an optical disk, a glass substrate for an organic electroluminescence (EL) device, a glass or silicon substrate for a solar cell, a flexible substrate, a printed circuit board, etc.

[0030] The substrate heat treatment apparatus 1 includes a main body frame 11, a plurality of (five in this embodiment) treatment units 13, and a control unit 8. As shown in Fig. 1, the treatment units 13 are stacked in multiple stages along the Z direction. The main body frame 11 supports the treatment units 13. The treatment units 13 are devices that heat-treat substrates 9.

[0031] The control unit 8 is, for example, a computer, and includes a processor such as a CPU, and a memory that is electrically connected to the processor and stores a program. The processor executes the program stored in the memory to control the operation of each unit in the substrate heat treatment apparatus 1. In this way, various processes such as heat treatment are performed in the substrate heat treatment apparatus 1.

[0032] 2 is a perspective view showing the processing units 13 of the substrate heat treatment apparatus 1 shown in FIG. 1. As shown in FIG. 2, the substrate heat treatment apparatus 1 includes a pair of slide members 15 for each processing unit 13. The processing unit 13 is disposed between the pair of slide members 15 in the Y direction. The pair of slide members 15 is a mechanism for moving the processing unit 13 along the X direction. More specifically, the pair of slide members 15 move the processing unit 13 between a processing position P1 where the processing unit 13 performs a heat treatment and a maintenance position P2 where the processing unit 13 is maintained. The processing position P1 is inside the main body frame 11 in a top view, and the maintenance position P2 is outside (+X side) the main body frame 11 in a top view.

[0033] Fig. 3 is a schematic cross-sectional view showing the configuration of the processing unit 13 shown in Fig. 2. As shown in Fig. 3, the processing unit 13 includes a processing chamber 17, a hot plate 20, and a substrate lifting mechanism 30.

[0034] The processing chamber 17 has a substantially rectangular parallelepiped shape. The processing chamber 17 has a housing 40 and a cover 50. The housing 40 has an opening 41 at an upper portion. The housing 40 accommodates the hot plate 20 inside.

[0035] The lid part 50 has a generally plate-like shape capable of closing the opening 41 at the top of the housing part 40. The lid part 50 is detachable from the top of the housing part 40. The lid part 50 is attached to the top of the housing part 40 via a seal part 43. The seal part 43 is a member that seals the gap between the housing part 40 and the lid part 50.

[0036] When the cover 50 is removed from the housing 40, the inner surface of the housing 40 is exposed to the outside through the opening 41 of the housing 40. In this state, maintenance work such as part replacement or cleaning inside the housing 40 is performed through the opening 41 of the housing 40.

[0037] The hot plate 20 is accommodated inside the processing chamber 17. The hot plate 20 has a flat upper surface 20a. A heater such as an electric heating wire is built into the hot plate 20. When the heater is driven, the upper surface 20a of the hot plate 20 is heated to a predetermined temperature. As a result, the substrate 9 arranged above and in the vicinity of the upper surface 20a is heated. The heater is controlled by the control unit 8.

[0038] The substrate lifting mechanism 30 raises and lowers the substrate 9 above the hot plate 20. The substrate lifting mechanism 30 has a plurality of lift pins 31 and a lift pin lifting unit 33. The substrate lifting mechanism 30 is supported by a support frame (not shown). The support frame is a member connected to the processing chamber 17. In other words, the substrate lifting mechanism 30 is connected to the processing chamber 17 via the support frame. Note that "connected" includes cases where members are directly connected by contacting each other, as well as cases where members are indirectly connected to each other via another member.

[0039] The multiple lift pins 31 extend vertically and are distributed horizontally. The multiple lift pins 31 are inserted into several through-holes provided in the bottom wall of the housing part 40 in the processing chamber 17 and in the hot plate 20, and penetrate the bottom wall of the housing part 40 and the hot plate 20. The multiple lift pins 31 are held by the lift pin lifting part 33 in a state where they protrude above the upper surface 20a of the hot plate 20.

[0040] The lift pin lifting unit 33 raises and lowers the multiple lift pins 31 up and down as a unit. The lift pin lifting unit 33 is disposed outside and below the processing chamber 17. The lift pin lifting unit 33 is configured by, for example, a rack-and-pinion mechanism including a motor or a ball screw mechanism.

[0041] Substrate 9 is supported on the upper ends of multiple lift pins 31. Lift pin lifting unit 33 moves multiple lift pins 31 between a close position where substrate 9 approaches upper surface 20a of hot plate 20 and an upper position that is higher than the close position. The operation of lift pin lifting unit 33 is controlled by control unit 8.

[0042] <Slide member 15> Next, the configuration of slide member 15 will be described. In the following description, the slide member 15 located on the +Y side of the pair of slide members 15 will be described, but the slide member 15 on the -Y side has the same configuration. However, the pair of slide members 15 are disposed symmetrically with respect to an axis of symmetry that passes between them and is parallel to the Z axis.

[0043] Fig. 4 is an enlarged perspective view showing a portion of the slide member 15 included in the processing unit 13 shown in Fig. 2. The slide member 15 has a guide plate 151, a first plate 153, and a second plate 155. The first plate 153 is located between the guide plate 151 and the second plate 155 in the Y direction.

[0044] <Guide plate 151> The guide plate 151 is fixed to the main body frame 11. The guide plate 151 is a plate-like member extending in the X direction. The guide plate 151 has approximately the same dimensions in the X direction as the processing chamber 17. A plurality of (two in this example) first guide rails 61 extending in the X direction are fixed to a surface of the guide plate 151 facing the first plate 153 (the side surface on the -Y side). It is to be noted that the number of first guide rails 61 may be one.

[0045] <Plate 153> The first plate 153 is a plate-like member extending in the X direction. The dimensions of the first plate 153 in the X direction are approximately the same as those of the second plate 155. The first plate 153 is provided so as to be slidable in the X direction relative to the guide plate 151. In detail, a plurality of first guide blocks 62 are fixed to a surface (a surface on the +Y side) of the first plate 153 facing the guide plate 151. The first guide blocks 62 are engaged with the first guide rail 61 and are movable along the first guide rail 61. One of the several first guide blocks 62 is preferably fixed to the middle of the first plate 153 in the X direction, and more preferably fixed to the center of the first plate 153.

[0046] A plurality of (two in this example) second guide rails 63 extending in the X direction are fixed at intervals in the vertical direction to the surface (-Y side surface) of the first plate 153 facing the second plate 155. Note that the number of second guide rails 63 may be one.

[0047] <2nd Plate 155> The second plate 155 is a plate-like member extending in the X direction. In the X direction, the dimensions of the second plate 155 are approximately the same as those of the guide plate 151 and the first plate 153. The second plate 155 is provided so as to be slidable in the X direction relative to the first plate 153. In detail, a plurality of second guide blocks 64 are fixed to a surface of the second plate 155 facing the first plate 153 (a surface on the +Y side). The second guide blocks 64 mesh with the second guide rail 63 of the first plate 153 and are movable along the second guide rail 63.

[0048] The first guide rail 61 may be provided on the first plate 153, and the first guide block 62 may be provided on the guide plate 151. The second guide rail 63 may be provided on the second plate 155, and the second guide block 64 may be provided on the first plate 153.

[0049] Fig. 5 is a top view showing a stopping mechanism 65 provided in the substrate heat treatment apparatus 1 shown in Fig. 1. The stopping mechanism 65 is a mechanism for stopping the first plate 153, which has moved to a predetermined stopping position, with respect to the guide plate 151 while the processing unit 13 including the hot plate 20 is moving from the processing position P1 to the maintenance position P2.

[0050] 5, the stop mechanism 65 has a stop protrusion 651 and a contact protrusion 653. The stop protrusion 651 is provided on the guide plate 151 and protrudes toward the first plate 153. The contact protrusion 653 is provided on the first plate 153 and protrudes toward the guide plate 151. When the first plate 153 moves in the +X direction relative to the guide plate 151 and reaches the stop position, the contact protrusion 653 collides with the stop protrusion 651. This limits the movement of the first plate 153 toward the +X side from the stop position.

[0051] The first plate 153 is also provided with a stop mechanism (not shown) that limits the movement of the second plate 155 in the X direction. The stop mechanism is composed of, for example, a stop protrusion provided on the first plate 153 and a contact protrusion provided on the second plate 155. When the second plate 155 moves in the +X side relative to the first plate 153 and reaches a predetermined position, the contact protrusion comes into contact with the stop protrusion. This limits the movement of the second plate 155 in the +X side.

[0052] FIG. 6 is a diagram showing a state in which the processing unit 13 is pulled out by the slide member 15. FIG. 6(A) is a schematic top view showing a state in which the processing unit 13 is in the processing position P1. FIG. 6(B) is a schematic top view showing a state in which the processing unit 13 is in the intermediate position P3. FIG. 6(C) is a schematic top view showing a state in which the processing unit 13 is in the maintenance position P2. The intermediate position P3 is a position between the processing position P1 and the maintenance position P2 in the X direction. Note that, of the pair of slide members 15, only the slide member 15 on the +Y side is shown in FIG. 6.

[0053] As shown in Fig. 6, the slide member 15 has an interlocking separation mechanism 70. When the processing unit 13 including the hot plate 20 moves from the processing position P1 to the intermediate position P3, the interlocking separation mechanism 70 interlocks the first plate 153 and the second plate 155 so that the first plate 153 and the second plate 155 move integrally. As a result, as shown in Fig. 6(A) and Fig. 6(B), while the processing unit 13 moves from the processing position P1 to the intermediate position P3, the first plate 153 and the second plate 155 move to the +X side together with the processing unit 13.

[0054] Furthermore, when the processing unit 13 including the hot plate 20 moves from the intermediate position P3 to the maintenance position P2, the interlocking separation mechanism 70 releases the connection between the second plate 155 and the first plate 153. Therefore, as shown in Fig. 6(B) and Fig. 6(C), the second plate 155 is separated from the first plate 153 and moves to the +X side. Note that, when the processing unit 13 is in the intermediate position P3, the movement of the first plate 153 to the X side is restricted by the stop mechanism 65. As a result, only the second plate 155 moves to the +X side together with the processing unit 13.

[0055] It is preferable that each of the pair of slide members 15 has the interlocking separation mechanism 70. However, only one of the pair of slide members 15 may have the interlocking separation mechanism 70.

[0056] Fig. 7 is a diagram showing the operation of the interlocking separation mechanism 70 included in the substrate heat treatment apparatus 1 shown in Fig. 1. Fig. 7(A) is a partial top view showing a state in which the interlocking separation mechanism 70 interlocks the first plate 153 and the second plate 155. Figs. 7(B) and (C) are partial top views showing a process in which the interlocking separation mechanism 70 separates the first plate 153 and the second plate 155. Fig. 7(D) is a partial top view showing a state in which the interlocking separation mechanism 70 has separated the first plate 153 and the second plate 155.

[0057] As shown in FIGS. 7(A) to (D), the interlocking separation mechanism 70 has a movable pressing member 71, a restricting protrusion 72, a movable engaging protrusion 73, an elastic member 74, and a cam member 75.

[0058] The movable pressing member 71 is a rod-shaped member extending in the Y direction and provided on the first plate 153. The movable pressing member 71 is inserted into a through hole provided in the first plate 153 and is held so as to be movable in the Y direction relative to the insertion hole.

[0059] The restricting protrusion 72 is provided on a surface of the first plate 153 facing the second plate 155 side (the +Y side in FIG. 7), and protrudes toward the second plate 155 beyond the surface of the first plate 153. The restricting protrusion 72 has a substantially right-angled trapezoidal shape in a top view. The surface of the restricting protrusion 72 facing the second plate 155 side (the +Y side) has a restricting slope 721 that slopes toward the guide plate 151 side (the -Y side) in the +X direction.

[0060] The movable engagement protrusion 73 is provided on the second plate 155 and is held movably in the Y direction relative to the second plate 155. The movable engagement protrusion 73 is provided so as to be able to protrude from the second plate 155 toward the first plate 153 side (the -Y side in FIG. 7), and the movable engagement protrusion 73 is able to engage with the regulating protrusion 72.

[0061] The elastic member 74 is provided on the second plate 155 and biases the movable engagement protrusion 73 toward the first plate 153. The elastic member 74 is, for example, a spring disposed in a concave hole provided in the second plate 155.

[0062] As shown in FIGS. 7(B) to (D), cam member 75 is provided on guide plate 151 and protrudes from guide plate 151 toward first plate 153 (-Y side in FIG. 7). Cam member 75 has a generally right-angled trapezoidal shape in top view. The surface of cam member 75 facing first plate 153 (+Y side) has cam slope 751 that slopes toward first plate 153 (+Y side) in the +X direction. As shown in FIGS. 6(A) to (C), cam member 75 is provided in the middle of guide plate 151 in the X direction, more preferably in the center of guide plate 151.

[0063] While the processing unit 13 including the hot plate 20 moves from the processing position P1 (see FIG. 6(A)) to the intermediate position P3 (see FIG. 6(B)), the movable engagement protrusion 73 is pushed by the elastic member 74 and placed in the protruding position, as shown in FIG. 7(A). The movable engagement protrusion 73 at the discharge position is in contact with the regulating protrusion 72 in the X direction. That is, the movable engagement protrusion 73 is engaged with the regulating protrusion 72. Therefore, when the second plate 155 moves in the +X direction together with the processing unit 13, the first plate 153 also moves in the +X direction in conjunction therewith.

[0064] When the processing unit 13 including the hot plate 20 reaches the intermediate position P3 (see FIG. 6(B)), the movable pressing member 71 moves to the +X side while sliding against the cam inclined surface 751 of the cam member 75, as shown in FIG. 7(B). As a result, the movable pressing member 71 is pushed by the cam member 75, and the movable pressing member 71 moves to the second plate 155. Then, as shown in FIG. 7(C), the movable engagement protrusion 73 is pushed by the movable pressing member 71, and the movable engagement protrusion 73 moves toward the second plate 155 side (+Y side) beyond the regulating protrusion 72. As a result, the engagement of the movable engagement protrusion 73 with the regulating protrusion 72 is released. Then, as shown in FIG. 7(D), the movable pressing member 71 moves in the +X direction over the regulating protrusion 72. As a result, the second plate 155 can move in the +X direction relative to the first plate 153. The movement of the first plate 153 in the X direction is limited by the stop mechanism 65. This limits the movement of the movable pressing member 71 to the +X side relative to the cam member 75.

[0065] Furthermore, when the processing unit 13 at the maintenance position P2 is returned to the processing position P1, the movable engagement protrusion 73 moves in the -X direction and comes into sliding contact with the regulating slope 721 of the regulating protrusion 72. This allows the movable engagement protrusion 73 to move over the regulating protrusion 72 to the -X side. This allows the movable engagement protrusion 73 to engage with the regulating protrusion 72 when the processing unit 13 is pulled out to the maintenance position P2 again.

[0066] <Effects of the interlocking separation mechanism 70> Fig. 8 is a diagram showing the load (kgf) applied to slide member 15 during each process of pulling out processing unit 13. For ease of explanation, Fig. 8 assumes that processing unit 13 weighs 200 kg and that the center of gravity of processing unit 13 is at the center of processing unit 13 in the X direction. Second plate 155 has second guide blocks 64 at the center in the X direction and at its -X end. First plate 153 has first guide blocks 62 at the center in the X direction and at its -X end.

[0067] Fig. 8(A) is a diagram showing the load when the processing unit 13 is in the processing position P1. Fig. 8(B) is a diagram showing the load when the processing unit 13 is in the intermediate position P3. Fig. 8(C) is a diagram showing the load when the processing unit 13 is in the maintenance position P2. Fig. 8(D) is a diagram showing the load when the processing unit 13 is in the intermediate position P3. Note that Fig. 8(D) shows a comparative example in which the first plate 153 and the second plate 155 are not interlocked.

[0068] 8(A), when the processing unit 13 is at the processing position P1, the positions of the central first guide block 62 and second guide block 64 coincide with the center of gravity. Therefore, a load of 100 kgf (= 980 N) is applied evenly downward to each of them. In addition, the load applied to the first guide block 62 and second guide block 64 at the -X side end is 0 kgf.

[0069] 8(C), when the processing unit 13 is in the maintenance position P2, a downward load of 200 kgf (=1960 N) is applied to the first guide block 62 at the center of the first plate 153, and an upward load of 100 kgf is applied to the first guide block 62 at the -X side end. This is because the center of gravity of the processing unit 13 is moved away from the first plate 153 in the X direction, causing each first guide block 62 to receive a rotational force.

[0070] Also, as shown in FIG. 8(B), when the processing unit 13 is in the intermediate position P3, the load applied to each of the first guide blocks 62 and each of the second guide blocks 64 is the same as that in FIG. 8(A). That is, a downward load of 100 kgf is applied to the first guide block 62 and the second guide block 64 in the center, and no load is applied to the first guide block 62 and the second guide block 64 at the -X side end. Therefore, the sliding resistance applied to the first plate 153 is constant until the processing unit 13 moves from the processing position P1 to the intermediate position P3. Then, the sliding resistance gradually increases as the processing unit 13 moves from the maintenance position P2 to the intermediate position P3.

[0071] On the other hand, as shown in FIG. 8(D), if the first plate 153 is not interlocked with the second plate 155 by the interlocking separation mechanism 70, when the processing unit 13 reaches the intermediate position P3, a downward load of 200 kgf is applied to the central first guide block 62, and an upward load of 100 kgf is applied to the first guide block 62 at the -X side end. That is, the same load as when the processing unit 13 is in the maintenance position P2 is applied to each first guide block 62. In the initial stage of the pull-out, the sliding resistance of the first plate 153 becomes large immediately. In the initial stage of the pull-out, the processing unit 13 does not have sufficient momentum, so a relatively large force is required to pull out the processing unit 13.

[0072] As described above, when processing unit 13 including hot plate 20 starts to be pulled out, first plate 153 is linked to second plate 155 by interlocking separation mechanism 70, so that processing unit 13 can be pulled out with a relatively small force. Furthermore, although the sliding resistance increases after processing unit 13 passes intermediate position P3, sufficient momentum can be built up against processing unit 13 up to that point. Therefore, processing unit 13 can be easily pulled out to maintenance position P2.

[0073] 8, when the processing unit 13 is pulled out from the processing position P1 to the maintenance position P2, a larger load is applied to the first plate 153 than to the second plate 155. Therefore, if the rigidity of the first plate 153 is low, it may be deformed by stress. Furthermore, if the first plate 153 is deformed during the sliding movement, the sliding resistance may be large. Therefore, as shown in FIG. 4, the rigidity of the first plate 153 may be increased by making the thickness (dimension in the Y direction) of the first plate 153 thicker than that of the second plate 155.

[0074] As described above, the substrate heat treatment apparatus 1 includes the hot plate 20 as a heat treatment plate, the main body frame 11, and at least one slide member 15. The hot plate 20 performs heat treatment on the substrate 9. The main body frame 11 supports the hot plate 20. The slide member 15 moves the hot plate 20 from a treatment position P1 inside the main body frame 11 to a maintenance position P2 in the X direction as a first direction intersecting with the vertical direction. The slide member 15 includes a guide plate 151, a first plate 153, a second plate 155, and an interlocking separation mechanism 70. The guide plate 151 is fixed to the main body frame 11 and extends in the X direction. The first plate 153 is slidable in the X direction relative to the guide plate 151. The second plate 155 is fixed to the hot plate 20 and slidable in the X direction relative to the first plate 153. When the hot plate 20 moves from the processing position P1 to the intermediate position P3 between the processing position P1 and the maintenance position P2, the interlocking separation mechanism 70 interlocks the first plate 153 with the first plate 153. When the hot plate 20 moves from the intermediate position P3 to the maintenance position P2, the interlocking separation mechanism 70 separates the second plate 155 from the first plate 153. According to this configuration, when the hot plate 20 moves from the processing position P1 to the intermediate position P3, the first plate 153 can be moved following the hot plate 20. This can prevent the first plate 153 from being separated from the hot plate 20, so that the load applied to the first plate 153 can be reduced. As a result, the sliding resistance of the slide member 15 can be reduced, so that the hot plate 20 can be pulled out well.

[0075] The substrate heat treatment apparatus 1 further includes a treatment chamber 17. The treatment chamber 17 accommodates a hot plate 20. The second plate 155 is fixed to the treatment chamber 17. According to this configuration, even if the load of the treatment chamber 17 increases, the sliding resistance of the sliding member 15 can be reduced, so that the hot plate 20 and the treatment chamber 17 can be smoothly pulled out.

[0076] Guide plate 151 has a first guide rail 61 extending in the X direction. First plate 153 has a first guide block 62. First guide block 62 engages with first guide rail 61 and is slidable along first guide rail 61. First guide block 62 is fixed to the middle of first plate 153 in the X direction. With this configuration, first guide rail 61 can be brought closer to hot plate 20, thereby reducing the load applied to first guide block 62.

[0077] The substrate heat treatment apparatus 1 has a pair of slide members 15. The pair of slide members 15 are spaced apart from each other in the Y direction, which is a second direction intersecting both the X direction and the vertical direction. With this configuration, the load of the hot plate 20 can be applied to the pair of slide members 15, so that the hot plate 20 can be smoothly drawn out.

[0078] Hot plate 20 is positioned between a pair of slide members 15 in the Y direction. With this configuration, the pair of slide members 15 are arranged so as not to overlap with hot plate 20 in the vertical direction, so that the device dimension in the vertical direction can be reduced.

[0079] The first plate 153 is disposed between the guide plate 151 and the second plate 155 in the Y direction. The interlocking separation mechanism 70 has a movable pressing member 71, a restricting protrusion 72, a movable engaging protrusion 73, an elastic member 74, and a cam member 75. The movable pressing member 71 is provided on the first plate 153 and is movable in the Y direction. The restricting protrusion 72 is provided on the first plate 153 and protrudes toward the second plate 155. The movable engaging protrusion 73 is provided on the second plate 155 and is engageable with the restricting protrusion 72 and is movable in the Y direction. The elastic member 74 is provided on the second plate 155 and biases the movable engaging protrusion 73 toward the first plate 153. The cam member 75 is provided on the guide plate 151 and protrudes toward the first plate 153. When the hot plate 20 moves from the processing position P1 to the intermediate position P3, the movable engagement protrusion 73 engages with the regulating protrusion 72 in the X direction. When the hot plate 20 reaches the intermediate position P3, the movable pressing member 71 is pushed by the cam member 75, so that the movable pressing member 71 moves toward the second plate 155, and the movable engagement protrusion 73 is pushed by the movable pressing member 71, so that the movable engagement protrusion 73 moves toward the second plate 155 more than the regulating protrusion 72. According to this configuration, while the hot plate 20 moves from the processing position P1 to the maintenance position P2, the movable engagement protrusion 73 of the second plate 155 engages with the regulating protrusion 72 of the first plate 153. This allows the first plate 153 and the second plate 155 to be interlocked. Furthermore, when the hot plate 20 reaches the intermediate position P3, the movable engagement protrusion 73 of the second plate 155 moves toward the second plate 155 more than the regulating protrusion 72 of the first plate 153. This releases the engagement, and therefore second plate 155 can be moved separately from first plate 153, so that second plate 155 can be moved together with hot plate 20 from intermediate position P3 to maintenance position P2.

[0080] Substrate heat treatment apparatus 1 further includes substrate lifting mechanism 30 that raises and lowers substrate 9 above hot plate 20. Slide member 15 enables hot plate 20 and substrate lifting mechanism 30 to be pulled out together. With this configuration, even if the load of substrate lifting mechanism 30 increases, the sliding resistance of slide member 15 can be reduced, so that hot plate 20 and substrate lifting mechanism 30 can be pulled out smoothly.

[0081] <2. Second embodiment> 9 is a perspective view showing an interlocking separation mechanism 70a of the substrate heat treatment apparatus 1 according to the second embodiment. The slide member 15 of the second embodiment has an interlocking separation mechanism 70a instead of the interlocking separation mechanism 70. The interlocking separation mechanism 70a has an engagement protrusion 76 and an engagement recess 77.

[0082] The engaging protrusion 76 is provided on the second plate 155. In this example, the engaging protrusion 76 is fixed to the +X side end of the second plate 155. The engaging protrusion 76 protrudes from the second plate 155 towards the first plate 153. The engaging recess 77 is provided on the first plate 153. In this example, the engaging recess 77 is fixed to the +X side end of the first plate 153. The engaging recess 77 is recessed towards the second plate 155. Note that the engaging protrusion 76 may be provided on the first plate 153, and the engaging recess 77 may be provided on the second plate 155.

[0083] While the processing unit 13 moves from the processing position P1 to the intermediate position P3, the tip of the engagement protrusion 76 is disposed inside the engagement recess 77. As a result, the engagement protrusion 76 is caught in the engagement recess 77, and the second plate 155 is engaged with the first plate 153. In this state, when the second plate 155 moves to the +X side together with the processing unit 13 at the processing position P1, the second plate 155 moves in conjunction with the first plate 153. The engagement protrusion 76 and the engagement recess 77 are an example of an engagement member that engages the second plate 155 with the first plate 153.

[0084] Furthermore, when the processing unit 13 reaches the intermediate position P3, the first plate 153 is stopped at the stop position by the stop mechanism 65. If the second plate 155 moves in the +X direction after the first plate 153 is stopped at the stop position, the engagement protrusion 76 is disengaged from the engagement recess 77, and the engagement between the first plate 153 and the second plate 155 is released. Therefore, the second plate 155 is separated from the first plate 153 and can move in the +X direction.

[0085] At least one of the engaging protrusion 76 and the engaging recess 77 may be formed to be elastically deformable. In this case, by moving the engaging protrusion 76 in the X direction relative to the engaging recess 77, the engaging protrusion 76 can be easily engaged with and disengaged from the engaging recess 77.

[0086] As described above, the substrate heat treatment apparatus 1 includes the stop mechanism 65. The stop mechanism 65 stops the first plate 153, which has been moved to a predetermined stop position, with respect to the guide plate 151. The interlocking separation mechanism 70a has an engaging protrusion 76 and an engaging recess 77 as engaging members. The engaging protrusion 76 and the engaging recess 77 engage the second plate 155 with the first plate 153. When the second plate 155 moves in the +X direction after the first plate 153 is stopped at the stop position by the stop mechanism 65, the engagement between the first plate 153 and the second plate 155 by the engaging protrusion 76 and the engaging recess 77 is released. With this configuration, the interlocking of the first plate 153 and the second plate 155 and the separation of the first plate 153 and the second plate 155 can be realized with a relatively simple configuration.

[0087] <3. Modification>

[0088] Although several embodiments have been described above, the present invention is not limited to the above, and various modifications are possible.

[0089] For example, the interlocking separation mechanisms 70, 70a interlock the first plate 153 and the second plate 155 by engaging them. However, the interlocking mechanism is not limited to this. For example, the first plate 153 and the second plate 155 may be interlocked by connecting them using the magnetic force of a magnet.

[0090] The substrate heat treatment apparatus 1 is configured to heat the substrate 9 by the hot plate 20. However, the substrate heat treatment apparatus 1 may be configured to cool the substrate 9. In this case, the substrate heat treatment apparatus 1 may include a heat treatment plate (cool plate) without a heater, or a heat treatment plate (cool plate) with a cooling mechanism such as a cooling water flow path or a Peltier element, instead of the hot plate 20. The treatment chamber 17 may not be provided.

[0091] Although the present invention has been described in detail, the above description is merely illustrative in all respects, and the present invention is not limited thereto. It is understood that countless variations not illustrated can be envisioned without departing from the scope of the present invention. The configurations described in the above embodiments and variations can be appropriately combined or omitted as long as they are not mutually contradictory. [Explanation of symbols]

[0092] 1. Substrate heat treatment equipment 9 Substrate 11 Main frame 13 Processing Unit 15 Slide member 17 Processing chamber 20 Hot Plate 20a top side 30 Substrate lifting mechanism 31 Lift pin 33 Lift pin lifting section 61 First guide rail 62 First guide block 65 Stopping mechanism 70, 70a interlocking separation mechanism 71 Movable pressing member 72 Regulating protrusion 73 Movable engagement protrusion 74 Elastic Members 75 Cam member 76 Engagement protrusion (engagement member) 77 Engagement recess (engagement member) 151 Guide plate 153 Plate 1 155 Second Plate

Claims

1. a heat treatment plate for performing heat treatment on the substrate; a main body frame supporting the heat treatment plate; at least one slide member that moves the heat-treating plate in a first direction intersecting a vertical direction from a treatment position inside the main body frame to a maintenance position; Equipped with The slide member is a guide plate fixed to the main body frame and extending in the first direction; a first plate slidably movable in the first direction relative to the guide plate; a second plate fixed to the heat treatment plate and slidable in the first direction relative to the first plate; a linking and separating mechanism that links the first plate and the second plate when the heat-treatment plate moves from the treatment position to an intermediate position between the treatment position and the maintenance position, and separates the second plate from the first plate when the heat-treatment plate moves from the intermediate position to the maintenance position; The substrate processing apparatus includes:

2. The substrate processing apparatus according to claim 1 , a treatment chamber housing the thermal treatment plate; Further equipped with The second plate is fixed relative to the processing chamber.

3. 3. The substrate processing apparatus according to claim 1, The guide plate has a guide rail extending in the first direction, The first plate has a guide block that engages with the guide rail and is slidable along the guide rail, The guide block is fixed to a middle of the first plate in a first direction.

4. 3. The substrate processing apparatus according to claim 1, A pair of the slide members is provided, The pair of slide members are spaced apart from each other in a second direction intersecting the first direction and the vertical direction.

5. The substrate processing apparatus according to claim 4, The heat treatment plate is positioned between the pair of slide members in the second direction.

6. The substrate processing apparatus according to claim 5 , the first plate is disposed between the guide plate and the second plate in the second direction, The interlocking separation mechanism includes: a movable pressing member provided on the first plate and movable in the second direction; a restricting protrusion provided on the first plate and protruding toward the second plate; a movable engagement protrusion provided on the second plate, capable of engaging with the restricting protrusion and movable in the second direction; an elastic member provided on the second plate and biasing the movable engagement protrusion toward the first plate; a cam member provided on the guide plate and protruding toward the first plate; Equipped with When the heat-treating plate moves from the treatment position to the intermediate position, the movable engagement protrusion engages with the restriction protrusion in the first direction, when the heat treatment plate reaches the intermediate position, the movable pressing member is pushed by the cam member, causing the movable pressing member to move toward the second plate, and the movable engagement protrusion is pushed by the movable pressing member, causing the movable engagement protrusion to move toward the second plate further than the regulating protrusion.

7. The substrate processing apparatus according to claim 5 , a stopping mechanism that stops the first plate, which has been moved to a predetermined stopping position, with respect to the guide plate; Further equipped with the interlocking separation mechanism has an engagement member that engages the second plate with the first plate, A substrate processing apparatus, wherein when the second plate moves in the first direction after the first plate is stopped at the stop position by the stopping mechanism, the engagement between the first plate and the second plate by the engaging member is released.

8. 3. The substrate processing apparatus according to claim 1, a substrate lifting mechanism for lifting and lowering the substrate above the heat treatment plate; Further equipped with The slide member enables the heat-treating plate and the substrate lifting mechanism to be pulled out integrally.

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