Connector removal method

Abstract

To provide a connector removal method capable of completing connector removal efficiently and quickly.SOLUTION: The connector removal method is a method of removing a connector that includes a first space with an opening on the side away from the mounting surface of a printed circuit board, a second space that communicates with the first space with an opening on the side closer to the mounting surface, and a contact pin with leg soldered to the mounting surface at the bottom end from the print circuit board. The connector removal method includes: a step of inserting a hot air nozzle into the first space; and a step of supplying hot air blown out from the hot air nozzle towards the leg via the second space.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present invention relates to a method for removing a connector. [Background technology]

[0002] Conventionally, repair nozzles for removing components mounted on a printed circuit board by soldering are known (see, for example, Patent Document 1). The repair nozzle disclosed in Patent Document 1 has vanes that obstruct the flow of hot air toward the tip of the repair nozzle, and is equipped with an impeller that is rotated by the flow of hot air. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 4-124896 Summary of the Invention [Problem to be solved by the invention]

[0004] By the way, there are many kinds of components mounted on a printed circuit board by soldering. For example, a connector into which a memory module such as a dual inline memory module (DIMM) is inserted and removed is also mounted on a printed circuit board by soldering. The connector may be removed during rework. A central processing unit (CPU) and other electronic components are mounted around the connector. When removing a connector by rework, it is desirable that the influence of heat accompanying the removal of the connector does not extend to the electronic components mounted around the connector as much as possible. When removing a connector, in order to suppress the influence of heat on the electronic components mounted around the connector, it is essential to complete the removal of the connector efficiently and in a short time. The repair nozzle disclosed in Patent Document 1 is difficult to apply to the removal of a connector due to its shape and configuration. Therefore, it is considered difficult to complete the removal of a connector efficiently and in a short time using the repair nozzle disclosed in Patent Document 1.

[0005] In one aspect, a method for removing a connector disclosed in the present specification aims to complete removal of the connector efficiently and in a short period of time. [Means for solving the problem]

[0006] In one aspect, a method for removing a connector from a printed circuit board includes a first space opening on a side away from a mounting surface of the printed circuit board, a second space communicating with the first space and opening on a side closer to the mounting surface, and a contact pin having a leg at its lower end soldered to the mounting surface, the method including the steps of inserting a hot air nozzle into the first space and supplying hot air from the hot air nozzle toward the leg through the second space. Effect of the Invention

[0007] According to the method of removing a connector disclosed in this specification, removal of the connector can be completed efficiently and in a short period of time. [Brief description of the drawings]

[0008] [Figure 1] Fig. 1A is a plan view of a printed circuit board on which a connector to which the connector removal method of the first embodiment is applied is mounted, and Fig. 1B is a front view of a DIMM to be inserted into or removed from a connector to which the connector removal method of the first embodiment is applied. [Diagram 2] FIG. 2 is an explanatory diagram showing a state in which a hot air nozzle is attached to a connector mounted on a printed circuit board. [Diagram 3] FIG. 3 is an explanatory diagram showing a state in which the connector and the hot air nozzle are separated. [Figure 4] Fig. 4(A) is a top view of the connector, and Fig. 4(B) is a front view of the connector. [Diagram 5] Fig. 5(A) is a diagram showing a pair of contact pins, and Fig. 5(B) is a cross-sectional view taken along line BB in Fig. 4(B). [Figure 6] Fig. 6(A) is a front view of the hot air nozzle, and Fig. 6(B) is a cross-sectional view taken along line CC in Fig. 6(A). [Figure 7] Fig. 7(A) is a cross-sectional view of the hot air nozzle taken along a cutting line corresponding to the line AA in Fig. 2. Fig. 7(B) is a cross-sectional view of the printed circuit board taken along the line AA in Fig. 2 to which the connector removal method of the first embodiment is applied. [Figure 8] Fig. 8(A) is a diagram showing how the protrusion of the lock lever is inserted into a side notch provided on the hot air nozzle when the hot air nozzle is fixed to the connector. Fig. 8(B) is a diagram showing how the protrusion of the lock lever is inserted into a side notch provided on the hot air nozzle when the hot air nozzle is fixed to the connector. Fig. 8(C) is a diagram showing how the protrusion of the lock lever is ejected from the side notch provided on the hot air nozzle when the hot air nozzle is removed from the connector. [Figure 9] FIG. 9 is a front view of the hot air nozzle used in the second embodiment. [Figure 10]Fig. 10(A) is a cross-sectional view of a hot air nozzle used in the second embodiment taken along the line DD in Fig. 9. Fig. 10(B) is a cross-sectional view of a printed circuit board to which the connector removal method of the second embodiment is applied, taken along a cutting line corresponding to the line DD in Fig. 9. [Figure 11] FIG. 11 is a cross-sectional view taken along a line corresponding to the line AA in FIG. 2 of a printed circuit board to which the connector removing method of the third embodiment is applied. [Figure 12] FIG. 12 is a cross-sectional view taken along a line corresponding to the line AA in FIG. 2 of a printed circuit board to which the connector removing method of the fourth embodiment is applied. [Figure 13] FIG. 13 is a cross-sectional view taken along a cutting line corresponding to the line AA in FIG. 2 of a printed circuit board to which the connector removing method of the fifth embodiment is applied. [Figure 14] FIG. 14 is a plan view of a connector used in the connector detaching method of the sixth embodiment. [Figure 15] FIG. 15 is a cross-sectional view taken along a cutting line corresponding to the line AA in FIG. 2 of a printed circuit board to which the connector removing method of the seventh embodiment is applied. [Figure 16] FIG. 16 is a cross-sectional view taken along a cutting line corresponding to the line AA in FIG. 2 of a printed circuit board to which the connector removing method of the eighth embodiment is applied. [Figure 17] FIG. 17 is a cross-sectional view taken along a cutting line corresponding to the line AA in FIG. 2 of a printed circuit board to which the connector removing method of the ninth embodiment is applied. [Figure 18] FIG. 18 is a plan view of a printed circuit board on which a connector is mounted, to which the connector removing method of the ninth embodiment is applied. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. However, in the drawings, the dimensions, ratios, etc. of each part may not be illustrated to be completely consistent with the actual ones. In addition, in some drawings, for the convenience of explanation, components that actually exist may be omitted, or dimensions may be exaggerated compared to the actual ones.

[0010] (First embodiment) A method for removing the connector 10 of the first embodiment will be described with reference to FIGS.

[0011] [Printed circuit board] First, a schematic configuration of a printed circuit board 1 to which a method for removing a connector 10 according to a first embodiment is applied will be described with reference to Figs. 1(A) to 3. A plurality of connectors 10 are mounted on a mounting surface 1a of the printed circuit board 1. Each of the connectors 10 may be a target for removal during rework. Each connector 10 is mounted with its longitudinal direction aligned with the X direction of the printed circuit board 1. The plurality of connectors 10 are arranged in parallel in the Y direction of the printed circuit board 1. In the printed circuit board 1, a CPU 3 is mounted on the side of the plurality of connectors 1 arranged in parallel along the Y direction. In addition, the printed circuit board 1 is provided with a component mounting area 4 on which other electronic components are mounted. The components mounted in the component mounting area 4 are, for example, power supply components. The components mounted in the component mounting area 4 are not limited to power supply components, and various electronic components may be mounted.

[0012] The printed circuit board 1 is provided with a through hole 1b that penetrates from the mounting surface 1a to the opposite surface. The mounting surface 1a of the printed circuit board 1 is provided with a solder pad 2 to which a leg 19a (see FIG. 5(A)) of a contact pin 19 of the connector 10 is soldered. The connector 10 has an insertion pin 16 that extends from the bottom surface opposite the mounting surface 1a. The insertion pin 16 has a function of fixing the connector 10 to the printed circuit board 1. The insertion pin 16 is sometimes called a fork lock.

[0013] The connector 10 is fixed and mounted on the mounting surface 1a of the printed circuit board 1 by soldering the leg portions 19a of the contact pins 19 to the solder pads 2 and inserting the insertion pins 16 into the through holes 1b.

[0014] A DIMM 7 as shown in Fig. 1(B) is inserted into and removed from the connector 10 mounted on the mounting surface 1a. In other words, the connector 10 functions as a slot for a memory module. The DIMM 7 is an example of an electronic board that is inserted into and removed from the connector 10. The electronic board that is inserted into and removed from the connector 10 is not limited to the DIMM 7, and card-shaped components such as other memory modules are included in the electronic board.

[0015] The DIMM 7 includes a substrate 7a. The substrate 7a includes a side cutout 7a1 and a bottom cutout 7a2. An electronic component 7b is mounted on the substrate 7a. The substrate 7a includes electrodes 7c. The DIMM 7 is inserted into a first space 12 (see FIG. 4A) in a body 11 of the connector 10. At this time, the bottom cutout 7a2 engages with a protrusion 11a provided in the first space 12, and the DIMM 7 is positioned. A lock lever 18 switches between a locked state and an unlocked state of the DIMM 7 relative to the connector 10. A protrusion 18c (see FIGS. 8A to 8C) provided on the lock lever 18 enters or exits the side cutout 7a1 in response to the operation of the lock lever 18.

[0016] In this embodiment, when the connector 10 is removed from the mounting surface 1a, the hot air nozzle 50 is inserted into the connector 10 in place of the DIMM 7.

[0017] The structure of the connector 10 will be described in further detail below, and the hot air nozzle 50 will be described in detail.

[0018] <Connector> As shown in FIGS. 4(A) to 5(B), the connector 10 includes a main body 11, a lock lever 18, and a contact pin 19. The main body 11 has a lock lever 18 and a contact pin 19. As shown in FIG.

[0019] A first space 12 is provided inside the main body 11 above the center in the width direction. The first space 12 has an upper opening 12a that opens to the edge on the side away from the mounting surface 1a of the printed circuit board 1, i.e., the upper surface of the main body 11. The first space 12 is formed as a single space that spreads along the longitudinal direction of the main body 11. The DIMM 7 is inserted and removed into the first space 12, and the hot air nozzle 50 is also inserted and removed therefrom.

[0020] A protrusion 11a is provided at the bottom end of the first space 12, approximately at the center in the longitudinal direction of the main body 11. As described above, the protrusion 11a engages with the bottom notch 7a2 of the DIMM 7. The protrusion 11a also engages with the bottom notch 51b of the hot air nozzle 50, which will be described in detail later.

[0021] Inside the main body 11, a second space 13 communicating with the first space 12 is provided. The second space 13 is provided below the first space 12. In this embodiment, the second space 13 is formed as one space extending along the longitudinal direction of the main body 11. The second space 13 opens at an edge portion on the side closer to the mounting surface 1a of the printed circuit board 1, that is, at the lower end edge 11b of the main body 11. The width dimension of the second space 13 is smaller than the width dimension of the first space 12. A step portion 14 is formed at the boundary between the first space 12 and the second space 13. The step portion 14 functions as a stopper that prevents the hot air nozzle 50 from being inserted excessively.

[0022] A contact pin storage section 15 is provided inside the main body section 11. The contact pin storage section 15 is provided on both sides of the first space 12 in the width direction of the main body section 11. The contact pin storage section 15 has an upper edge opening section 15a that opens at the upper edge of the main body section 11. The contact pin storage section 15 stores a contact pin 19 shown in Fig. 5(A). The contact pin storage section 15 has a contact pin holding section 15b whose inner diameter is smaller than that of the upper end side. A plurality of contact pin storage sections 15 are provided along the longitudinal direction of the main body section 11 (see Fig. 4(A)).

[0023] In this embodiment, the contact pins 19 are arranged in pairs. As shown in FIG. 5A, the contact pins 19 have legs 19a formed at the lower end. The legs 19a are placed on the solder pads 2 and soldered. The contact pins 19 have contact portions 19b on the upper side of the legs 19a. The contact portions 19b are bent so that the two contact pins 19 approach each other when the two contact pins 19 are arranged facing each other. When the DIMM 7 is inserted into the connector 10, the contact portions 19b come into contact with the electrodes 7c of the DIMM 7. When the hot air nozzle 50 is inserted into the connector 10, the contact portions 19b come into contact with the hot air nozzle 50. The upper ends 19c of the contact pins 19 are bent so as to protrude outward in the width direction of the connector 10 when the contact pins 19 are stored in the contact pin storage portion 15. The upper end portion 19 c of the contact pin 19 is exposed from the upper edge opening portion 15 a of the contact pin storage portion 15 .

[0024] The area between the leg portion 19a and the contact portion 19b of the contact pin 19 is located in the contact pin holding portion 15b.

[0025] Lock lever support parts 17 are provided on both longitudinal sides of the main body 11. Each lock lever support part 17 is provided with a lock lever 18. The lock lever support parts 17 and the lock lever 18 function as a fixing mechanism for the DIMM 7 and the hot air nozzle 50. The lock lever 18 includes a rotating shaft part 18a, an operating piece 18b, and a protrusion part 18c (see Figs. 8(A) to 8(C)). The detailed configuration and operation of the lock lever 18 will be described in detail later.

[0026] <Hot air nozzle> As shown in FIG. 2, FIG. 3, and FIG. 6(A) to FIG. 7(B), the hot air nozzle 50 includes a main body 51 and a hot air introduction section 52. The hot air introduction section 52 is provided in the center of the main body 51 in the longitudinal direction. This is to distribute the hot air as uniformly as possible inside the main body 51. Note that a plurality of hot air introduction sections 52 may be provided. In this case, the plurality of hot air introduction sections 52 are arranged so that the hot air is distributed as uniformly as possible inside the main body 51, taking into consideration the flow of the hot air. A hot air source 60 is connected to the hot air introduction section 52. High-temperature hot air is supplied from the hot air source 60. The temperature of the hot air can be set appropriately, but is set to a temperature at which the connector 10 can be efficiently removed while taking into consideration the effect of heat on the CPU 3 and the like arranged in the vicinity.

[0027] The main body 51 and the hot air introduction section 52 are formed from sheet metal. By forming them from sheet metal, even if high-temperature hot air passes through the main body 51 and the hot air introduction section 52, the main body 51 and the hot air introduction section 52 are not softened by heat and can maintain their shapes.

[0028] The dimensions and shape of the main body 51 are generally the same as those of the board 7a of the DIMM 7. Therefore, the main body 51 has a side notch 51a provided at a position corresponding to the side notch 7a1 of the DIMM 7. The main body 51 also has a bottom notch 51b provided at a position corresponding to the bottom notch 7a2 of the DIMM 7.

[0029] A first hot air guide portion 53 and a second hot air guide portion 54 are provided in the internal space of the main body portion 51. The first hot air guide portion 53 and the second hot air guide portion 54 are formed of polyimide. The first hot air guide portion 53 and the second hot air guide portion 54 can be provided with heat resistance by using polyimide resin. Note that polyimide resin is one example of a material, and other conventionally known materials may be used as long as the first hot air guide portion 53 and the second hot air guide portion 54 are made of a material that can provide heat resistance.

[0030] A plurality of first hot air guide parts 53 are provided. The arrangement position of the first hot air guide parts 53 is appropriately set. In this embodiment, the first hot air guide parts 53 are provided higher in the height direction of the main body part 51 than the second hot air guide parts 54. The first hot air guide parts 53 are arranged at intervals along the longitudinal direction of the main body part 51. The height direction positions of the first hot air guide parts 53 are highest in the longitudinal center part of the main body part 51, and are arranged at lower positions toward both sides in the longitudinal direction. This is in consideration of the fact that the hot air introduction part 52 is provided in the central part of the main body part 51. The first hot air guide parts 53 adopt a mountain-shaped arrangement in which the longitudinal center part is higher, so that the hot air introduced from the hot air introduction part 52 can be efficiently supplied to the entire longitudinal area of ​​the main body part 51.

[0031] A plurality of second hot air guide sections 54 are provided along the lower edge extending in the longitudinal direction of the main body section 51. Each second hot air guide section 54 has a columnar shape extending in the vertical direction of the main body section 51, i.e., in the height direction. The length of each second hot air guide section 54 varies depending on the position in the longitudinal direction of the main body section 51. The second hot air guide section 54 provided in the central part of the main body section 51 is the longest. The length of the second hot air guide section 54 is set to be shorter toward both sides in the longitudinal direction. This is set in consideration of the fact that the hot air introduction section 52 is provided in the central part of the main body section 51 and the arrangement of the first hot air guide section 53.

[0032] By providing the first hot air guide portion 53 and the second hot air guide portion 54, a hot air flow path 55 is formed inside the main body portion 51. In particular, by arranging a plurality of second hot air guide portions 54 at the lower end portion of the main body portion 51, a hot air delivery portion 55a sandwiched between the second hot air guide portions 54 is formed. The hot air delivery portion 55a corresponds to a third space. The second hot air guide portion 54 can straighten the flow of hot air. The hot air nozzle 50 can smoothly deliver hot air by including the hot air delivery portion 55a partitioned by the second hot air guide portion 54. The length and width of each second hot air guide portion 54 can be appropriately set so that the hot air flows efficiently.

[0033] The hot air nozzle 50 may be configured such that either or both of the first hot air guide portion 53 and the second hot air guide portion 54 are omitted. However, by providing the first hot air guide portion 53 and the second hot air guide portion 54, hot air can be caused to flow efficiently in the hot air nozzle 50. Furthermore, by providing the first hot air guide portion 53 and the second hot air guide portion 54, the strength of the hot air nozzle 50 can be improved.

[0034] 7(B), the hot air nozzle 50 is inserted into the first space 12. At this time, the hot air nozzle 50 is fixed to the connector 10 by a fixing mechanism including a lock lever 18.

[0035] <Fixing mechanism> 8(A) to 8(C), the lock lever 18 includes a rotating shaft 18a, an operating piece 18b, and a protrusion 18c. The lock lever 18 is rotatable about the lock lever support 17 (omitted in FIGS. 8(A) to 8(C), see FIG. 2) by the rotating shaft 18a. The lock lever 18 includes an operating piece 18b above the rotating shaft 18a. An operator can operate the lock lever 18 by hooking a finger on the operating piece 18b. The lock lever 18 includes a protrusion 18c on a surface facing the center of the connector 10. The protrusion 18c is provided to correspond to the side notch 7a1 of the DIMM 7 and the side notch 51a of the hot air nozzle 50. When an operator operates the operating piece 18b to rotate the lock lever 18 as shown by the arrow 6a, as shown in Fig. 8(A), the protrusion 18c descends to enter the side cutout 51a as shown by the arrow 6b, and pushes down the hot air nozzle 50. Then, when the protrusion 18c enters the side cutout 51a completely as shown in Fig. 8(B), the hot air nozzle 50 is fixed to the connector 10. When an operator operates the operating piece 18b to rotate the lock lever 18 as shown by the arrow 6c, as shown in Fig. 8(C), the protrusion 18c rises to be discharged from the side cutout 51a as shown by the arrow 6d, and pushes up the hot air nozzle 50.

[0036] When removing the connector 10 from the printed circuit board 1, the connector 10 can be pulled up and removed while the hot air nozzle 50 remains fixed to the connector 10 by the lock lever 18.

[0037] [Remove connector] Next, a method for removing the connector 10 will be described.

[0038] As shown in Fig. 2, an operator attaches the hot air nozzle 50 to the connector 10 to be removed. As shown in Fig. 7(B), the hot air nozzle 50 is inserted into the first space 12 of the connector 10. After the hot air nozzle 50 is inserted to a certain position into the first space 12, the lock lever 18 is operated to push the hot air nozzle 50 into a fixed position. The hot air nozzle 50 comes into contact with the contact portion 19b of the contact pin 19.

[0039] The width of the hot air nozzle 50 is narrower than the width of the connector 10, and does not protrude in the width direction of the connector 10. Therefore, even if multiple connectors 10 are densely mounted on the printed circuit board 1, the hot air nozzle 50 can be easily attached to the connector 10 to be removed.

[0040] Furthermore, the hot air nozzle 50 is fixed to the connector 10 by the lock lever 18. Therefore, the hot air nozzle 50 can be attached to the connector 10 in a stable state.

[0041] After attaching the hot air nozzle 50 to the connector 10, the worker activates the hot air source 60. As a result, hot air supplied from the hot air source 60 is blown out from the hot air nozzle 50 as indicated by the arrow 5a. The hot air then passes through the second space 13 and is supplied toward the leg 19a soldered to the solder pad 2 as indicated by the arrow 5b. Inside the hot air nozzle 50, the hot air is straightened by the first hot air guide portion 53 and the second hot air guide portion 54. As a result, the hot air is smoothly supplied toward the leg 19a, and the temperature of the leg 19a can be quickly increased.

[0042] When hot air is supplied to leg 19a, the solder that fixes leg 19a to solder pad 2 is melted. At this time, contact pin 19 is in contact with hot air nozzle 50. Hot air nozzle 50 stores heat as high-temperature hot air passes through it. This heat is transferred to contact pin 19, contributing to an increase in temperature of contact pin 19. As a result, the solder can be melted effectively, and connector 10 can be removed in a short time.

[0043] The hot air nozzle 50 is fixed to the connector 10 by a lock lever 18. By grasping the hot air nozzle 50 fixed to the connector 10 and lifting up the connector 10, the connector 10 to be removed can be easily removed from among the connectors 10 mounted closely together.

[0044] As described above, according to the method for removing the connector 10 of the present embodiment, the removal of the connector 10 can be completed efficiently in a short time. In addition, since the removal of the connector 10 can be completed in a short time, the time for supplying hot air can be shortened. Therefore, the influence of heat on the CPU 3 and other electronic components arranged around the connector 10 can be suppressed.

[0045] Second embodiment Next, a second embodiment will be described with reference to Fig. 9 to Fig. 10(B). Fig. 9 is a front view of a hot air nozzle 150 used in the second embodiment. Fig. 10(A) is a cross-sectional view of the hot air nozzle 150 used in the second embodiment taken along the line DD in Fig. 9. Fig. 10(B) is a cross-sectional view of a printed circuit board 1 to which the method for removing a connector 10 of the second embodiment is applied taken along a cutting line corresponding to the line DD in Fig. 9.

[0046] The hot air nozzle 150 has a narrow width portion 155 where the distance between the opposing wall portions is narrow. Other configurations of the hot air nozzle 150 are not different from the hot air nozzle 50 used in the first embodiment. Configurations common to both are indicated in the drawings with the same reference numbers. In the following explanation, explanations of the common configurations are omitted. It should be noted that explanations of the common configurations are also omitted in the explanations of the third and subsequent embodiments.

[0047] The narrow width portion 155 is formed following the curved shape of the contact portion 19b of the contact pin 19 (see FIG. 5(A)). This makes it easier for the hot air nozzle 150 and the contact pin 19 to come into close contact with each other. When hot air is flowed into the hot air nozzle 150 with the hot air nozzle 150 in close contact with the contact pin 19, the efficiency of heat transfer from the hot air nozzle 150 to the contact pin 19 improves. As a result, the temperature of the contact pin 19 is more likely to rise, and the solder that secures the leg portion 19a to the solder pad 2 is more likely to melt. This makes it possible to efficiently complete removal of the connector 10 in a short period of time.

[0048] Third embodiment Next, a third embodiment will be described with reference to Fig. 11. Fig. 11 is a cross-sectional view taken along a line corresponding to the line AA in Fig. 2 of the printed circuit board 1 to which the method for removing the connector 10 of the third embodiment is applied.

[0049] The hot air nozzle 250 used in the third embodiment includes a lid 255 that closes the upper edge opening 15a of the contact pin storage section 15. Hot air supplied from the main body section 51 may flow into the contact pin storage section 15. By providing the lid 255, it is possible to prevent the hot air that has flowed into the contact pin storage section 15 from flowing out of the main body section 51 through the upper edge opening 15a. This allows the hot air nozzle 250 to improve the efficiency of melting the solder that fixes the contact pin 19 to the solder pad 2. Note that the lid 255 in this embodiment is provided on the hot air nozzle 250, but the upper edge opening 15a may be closed by a lid separate from the hot air nozzle 250.

[0050] (Fourth embodiment) Next, a fourth embodiment will be described with reference to Fig. 12. Fig. 12 is a cross-sectional view taken along a line corresponding to the line AA in Fig. 2 of the printed circuit board 1 to which the method for removing the connector 10 of the fourth embodiment is applied.

[0051] The hot air nozzle 350 used in the fourth embodiment includes a first hot air introduction section 352 inserted into the first space 12 and a second hot air introduction section 353 installed in the upper edge opening 15a of the contact pin storage section 15. The hot air introduced from the first hot air introduction section 352 inserted into the first space 12 is supplied toward the leg 19a of the contact pin 19 through the second space 13 as shown by arrows 5a and 5b. The hot air introduced from the second hot air introduction section 353 installed in the upper edge opening 15a merges with the second space 13 through the contact pin storage section 15 as shown by arrow 5c, and is supplied toward the leg 19a of the contact pin 19 as shown by arrow 5b. The hot air introduced into the contact pin storage section 15 can directly heat the contact pin 19. In addition, the hot air introduced into the contact pin storage section 15 can increase the total amount of hot air supplied toward the leg 19a of the contact pin 19. This allows the hot air nozzle 350 to improve the efficiency of melting the solder that fixes the contact pins 19 to the solder pads 2.

[0052] Fifth embodiment Next, a fifth embodiment will be described with reference to Fig. 13. Fig. 13 is a cross-sectional view taken along a line corresponding to the line AA in Fig. 2 of the printed circuit board 1 to which the method for removing the connector 10 of the fifth embodiment is applied.

[0053] The hot air nozzle 450 used in the fifth embodiment includes a heat transfer plate 451 inserted into the first space 12 and a hot air introduction section 452 installed in the upper edge opening 15a of the contact pin storage section 15. The heat transfer plate 451 abuts against the contact pin 19. The upper end of the heat transfer plate 451 is exposed in a hot air flow path 452a provided in the hot air introduction section 452. This allows the heat transfer plate 451 to transfer the heat of the hot air to the contact pin 19 to warm the contact pin 19. The hot air introduced from the hot air introduction section 452 installed in the upper edge opening 15a flows into the second space 13 through the contact pin storage section 15 as shown by arrow 5c, and is supplied toward the leg 19a of the contact pin 19 as shown by arrow 5b. The hot air introduced into the contact pin storage section 15 can directly warm the contact pin 19. This allows the hot air nozzle 450 to improve the efficiency of melting the solder that fixes the contact pins 19 to the solder pads 2.

[0054] Sixth embodiment Next, the sixth embodiment will be described with reference to FIG. 14. FIG. 14 is a plan view of the connector 110 used in the method for removing the connector 110 of the sixth embodiment. The connector 110 includes a second space 131. In the second space 131, a plurality of walls 131a are provided along the longitudinal direction of the connector 110. As a result, in the second space 131, a plurality of spaces 131b divided by the walls 131a are formed along the longitudinal direction of the connector 110. The strength of the connector 110 is improved by providing the walls 131a inside. In addition, since the walls 131a function as a straightening plate, the flow of hot air can be made uniform in the second space 131. As a result, the connector 110 can improve the efficiency of melting the solder that fixes the contact pins 19 to the solder pads 2.

[0055] Seventh embodiment Next, a seventh embodiment will be described with reference to Fig. 15. Fig. 15 is a cross-sectional view taken along a line corresponding to the line AA in Fig. 2 of the printed circuit board 1 to which the method for removing a connector 210 of the seventh embodiment is applied.

[0056] The connector 210 includes a solid portion 213 provided below the first space 12. The solid portion 213 is an example of a branch portion. The connector 210 is branched by the solid portion 213, and includes a sending portion 215b formed on both sides of the solid portion 213 in the width direction of the connector 210. The solid portion 213 is provided at a position where the second space 13 is formed in the connector 10 of the first embodiment. The sending portion 215b is formed as a part of the contact pin storage portion 215. The sending portion 215b is formed by enlarging the diameter of the contact pin holding portion 15b (see FIG. 7(B)) of the contact pin storage portion 15 included in the connector 10 of the first embodiment. The sending portion 215b functions as a second space communicating with the first space 12. In this embodiment, a solid portion 213 is used as the branching portion, but as long as the structure is capable of branching the flow of warm air, the portion in question does not necessarily have to be solid and may have a hollow structure inside.

[0057] In the seventh embodiment, the hot air nozzle 250 used in the third embodiment shown in Fig. 11 is used. Therefore, the upper edge opening 215a of the contact pin storage portion 215 is closed by the lid portion 255.

[0058] The hot air flowing in the direction of arrow 5a inside the main body 51 of the hot air nozzle 250 branches out as indicated by arrow 5d when it collides with the solid portion 213. The branched hot air flows into the delivery portion 215b, which functions as a second space, and is supplied toward the leg portion 19a.

[0059] Even in this configuration, the connector 210 is able to melt the solder that secures the contact pins 19 to the solder pads 2 .

[0060] Eighth embodiment Next, an eighth embodiment will be described with reference to Fig. 16. Fig. 16 is a cross-sectional view taken along a line corresponding to the line AA in Fig. 2 of printed circuit board 1 to which a method for removing connector 310 according to an eighth embodiment is applied.

[0061] The connector 310 differs from the connector 210 of the seventh embodiment in the following respects. The connector 210 of the seventh embodiment has a solid portion 213 below the first space 12. In contrast, the connector 310 of the eighth embodiment has a second space 13 provided below the first space 12, similar to the connector 10 of the first embodiment. The connector 310 has a sending portion 215b, similar to the connector 210. By using the connector 310, hot air is supplied toward the leg 19a through the second space 13 and the sending portion 215b.

[0062] Even when such a connector 310 is used, the solder that secures the contact pins 19 to the solder pads 2 is melted.

[0063] Ninth embodiment Next, a ninth embodiment will be described with reference to Fig. 17 and Fig. 18. Fig. 17 is a cross-sectional view of a printed circuit board 1 to which a method for removing a connector 410 according to the ninth embodiment is applied, taken along a cutting line corresponding to line AA in Fig. 2. Fig. 18 is a plan view of a printed circuit board 1 mounted with a connector 410 to which a method for removing a connector 410 according to the ninth embodiment is applied.

[0064] The connector 410 has a shielding plate 411 extending along the longitudinal direction at the lower end. The shielding plates 411 are provided on both sides in the width direction of the connector 410. The shielding plates 411 have a function of preventing the hot air sent out from the second space 13 as shown by the arrow 5a from flowing out to the sides in the width direction of the connector 410. As a result, the hot air flows along the longitudinal direction of the connector 410 as shown by the arrow 5e. The hot air is then discharged from both ends in the longitudinal direction of the connector 410.

[0065] This reduces the effect of the hot air on connectors 410 other than the connector 410 to be removed. Also, when a connector 410 mounted in a position close to the CPU 3 or the component mounting area 4 is to be removed, the effect of the hot air on the CPU 3 and the electronic components mounted in the component mounting area 4 is reduced.

[0066] The shielding plate 411 can also improve the strength of the connector 410 in the height direction. A DIMM 7 (see FIG. 1(B)) and a hot air nozzle 50 are inserted into the connector 410. At this time, a force (vertical load) toward the mounting surface 1a may be applied to the connector 410. Providing the shielding plate 411 improves the strength of the connector 410 against such a force.

[0067] [effect] The effects of the connector detachment method disclosed in this specification will now be described.

[0068] In the method for removing a connector disclosed in this specification, a hot air nozzle is inserted into a first space, and hot air sent from the hot air nozzle is supplied toward the leg of the contact pin through a second space communicating with the first space. This allows the removal of the connector to be completed efficiently in a short time. This makes it possible to suppress the effect of the hot air on other components mounted around the connector to be removed. Furthermore, even if the connectors are arranged closely together, the connector can be removed by attaching the hot air nozzle to the connector.

[0069] The hot air nozzle has a third space sandwiched between multiple hot air guides arranged inside, and by supplying hot air through this third space, the flow of hot air can be straightened. This allows hot air to be efficiently supplied to the legs of the contact pins. Furthermore, by providing the hot air guides, the strength of the hot air nozzle can be improved.

[0070] Since the hot air nozzle supplies hot air while being fixed to the connector by a fixing mechanism provided on the connector, the connector can be removed in this state after melting the solder, thereby improving work efficiency.

[0071] The hot air nozzle supplies hot air while in contact with the contact pins, which makes it possible to efficiently heat the contact pins and melt the solder in a short period of time.

[0072] The hot air nozzle has a narrow portion where the distance between the opposing wall portions is narrow, and by supplying hot air with the contact pin in contact with the narrow portion, the heat transfer effect to the contact pin can be improved.

[0073] The hot air nozzle supplies hot air in a state where the upper edge opening of the contact pin storage section is closed by the lid section, so that the hot air can be efficiently supplied to the legs of the contact pins.

[0074] The hot air nozzle can directly heat the contact pins by introducing hot air from the first hot air introduction section inserted into the first space and the second hot air introduction section installed at the upper edge opening of the contact pin storage section that communicates with the second space. The hot air nozzle can increase the amount of hot air.

[0075] The hot air nozzle can efficiently heat the contact pins by inserting a heat transfer plate into the first space and supplying the hot air through a hot air inlet section installed in the upper edge opening of the contact pin storage section that is connected to the second space.

[0076] The connector supplies hot air toward the legs through a plurality of spaces divided by walls disposed in the second space, thereby enabling efficient supply of hot air to the legs.

[0077] The connector is divided by a branch located below the first space, and by supplying warm air through the second space inside which part of the contact pin is housed, warm air can be efficiently supplied to the leg.

[0078] The connector has a shielding plate at its lower end extending along the longitudinal direction, and causes the hot air to flow along the longitudinal direction at the lower end of the connector, thereby making it possible to suppress the effect of the hot air on the surroundings.

[0079] Although the preferred embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various modifications and changes are possible within the scope of the gist of the present invention described in the claims.

[0080] In addition, the following supplementary notes are disclosed in relation to the above-described embodiment. (Appendix 1) A method for removing a connector from a printed circuit board, the connector comprising: a first space opening on a side away from a mounting surface of the printed circuit board; a second space communicating with the first space and opening on a side closer to the mounting surface; and contact pins having legs at their lower ends soldered to the mounting surface, the method comprising the steps of: A hot air nozzle is inserted into the first space; A step of supplying hot air from the hot air nozzle toward the leg portion through the second space; Includes instructions on how to remove the connector. (Appendix 2) The hot air nozzle has a plurality of hot air guide parts therein and a third space sandwiched between the hot air guide parts, and supplies the hot air through the third space. How to remove the connector described in Appendix 1. (Appendix 3) The hot air nozzle includes a narrow portion having a narrow gap between opposing wall portions, and supplies the hot air in a state in which the narrow portion is in contact with the contact pin. How to remove the connector described in Appendix 1. (Appendix 4) the hot air nozzle supplies the hot air in a state in which an upper edge opening of a contact pin storage portion formed on a side of the first space in a width direction of the connector is covered with a lid portion. How to remove the connector described in Appendix 1. (Appendix 5) The hot air nozzle supplies the hot air through a first hot air introduction section inserted into the first space and a second hot air introduction section formed on a side of the first space in the width direction of the connector and installed at an upper edge opening of a contact pin storage section communicating with the second space. How to remove the connector described in Appendix 1. (Appendix 6) The hot air nozzle inserts a heat transfer plate into the first space, and supplies the hot air through a hot air introduction section that is formed on a side of the first space in the width direction of the connector and is installed at an upper edge opening of a contact pin storage section that communicates with the second space. How to remove the connector described in Appendix 1. (Appendix 7) The second space is divided into a plurality of spaces by a wall portion disposed in the second space, and the hot air is supplied toward the leg portion through the plurality of spaces. How to remove the connector described in Appendix 1. (Appendix 8) The second space is divided in the width direction of the hot air nozzle by a branch portion provided below the first space, and a part of the contact pin is housed inside the divided space, The hot air nozzle supplies the hot air through the divided second space. How to remove the connector described in Appendix 1. (Appendix 9) The connector has a shielding plate extending along the longitudinal direction at a lower end thereof, and the hot air flows along the longitudinal direction at the lower end of the connector. How to remove the connector described in Appendix 1. (Appendix 10) The hot air nozzle supplies hot air while being fixed to the connector by a fixing mechanism provided in the connector. How to remove the connector described in Appendix 1. (Appendix 11) The hot air nozzle supplies the hot air in a state of contact with the contact pin. How to remove the connector described in Appendix 1. [Explanation of symbols]

[0081] 1 printed circuit board, 1a mounting surface, 2 solder pad, 7 DIMM, 10, 110, 210, 310, 410 connector, 11 main body, 12 first space, 13, 131 second space, 15 contact pin storage section, 15a upper edge opening, 15b contact pin holding section, 17 lock lever support section, 18 lock lever, 50, 150, 250, 350, 450 hot air nozzle, 53 first hot air guide section, 54 second hot air guide section, 131a wall section, 155 narrow section, 255 cover section, 352 first hot air introduction section, 353 second hot air introduction section, 451 heat transfer plate, 131b space, 213 solid section, 215b delivery section, 411 shielding plate.

Claims

1. A method for removing a connector from a printed circuit board, the connector comprising: a first space opening on a side away from a mounting surface of the printed circuit board; a second space communicating with the first space and opening on a side closer to the mounting surface; and contact pins having legs at their lower ends soldered to the mounting surface, the method comprising the steps of: A hot air nozzle is inserted into the first space; A step of supplying hot air from the hot air nozzle toward the leg portion through the second space; Includes instructions on how to remove the connector.

2. The hot air nozzle has a plurality of hot air guide parts therein and a third space sandwiched between the hot air guide parts, and supplies the hot air through the third space. The method for removing a connector according to claim 1 .

3. The hot air nozzle includes a narrow portion having a narrow gap between opposing wall portions, and supplies the hot air in a state in which the narrow portion is in contact with the contact pin. The method for removing a connector according to claim 1 .

4. the hot air nozzle supplies the hot air in a state in which an upper edge opening of a contact pin storage portion formed on a side of the first space in a width direction of the connector is closed by a lid portion. The method for removing a connector according to claim 1 .

5. The hot air nozzle supplies the hot air through a first hot air introduction section inserted into the first space and a second hot air introduction section formed on a side of the first space in the width direction of the connector and installed at an upper edge opening of a contact pin storage section communicating with the second space. The method for removing a connector according to claim 1 .

6. The hot air nozzle inserts a heat transfer plate into the first space, and supplies the hot air through a hot air introduction section that is formed on a side of the first space in the width direction of the connector and is installed at an upper edge opening of a contact pin storage section that communicates with the second space. The method for removing a connector according to claim 1 .

7. The second space is divided into a plurality of spaces by a wall portion disposed in the second space, and the hot air is supplied toward the leg portion through the plurality of spaces. The method for removing a connector according to claim 1 .

8. The second space is divided in the width direction of the hot air nozzle by a branch portion provided below the first space, and a part of the contact pin is housed inside the divided space, The hot air nozzle supplies the hot air through the divided second space. The method for removing a connector according to claim 1 .

9. The connector has a shielding plate extending along the longitudinal direction at a lower end thereof, and the hot air flows along the longitudinal direction at the lower end of the connector. The method for removing a connector according to claim 1 .

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