Light emitting diode

Abstract

To provide a light emitting diode structure and a manufacturing method, capable of improving the problem of low brightness, complex manufacturing process, high cost, excessive forward voltage, or the like.SOLUTION: The present invention relates to a light emitting diode 2 which includes multiple dot-like transparent conductive electrodes 170, a dielectric layer 160, and an epitaxial composite layer. The dielectric layer is disposed around each dot-like transparent conductive electrode. The epitaxial composite layer is disposed both on each dot-like transparent conductive electrode and the dielectric layer, and includes a carbon-doped gallium arsenide epitaxial layer 150 electrically connected to each dot-like transparent conductive electrode.SELECTED DRAWING: Figure 9

Description

[Technical field]

[0001] The present invention relates to a light emitting diode, and more particularly to a high brightness light emitting diode. [Background technology]

[0002] Light emitting diodes (hereinafter referred to as LEDs) have advantages such as high brightness, small size, low power consumption, and long life, and are widely used in lighting and display products. In conventional short-wave infrared light emitting diodes (SWIR LEDs), various specifications are developed and various tests are usually performed on the P-type ohmic contact metal and mirror reflection system in the light emitting diode structure in order to improve the light reflection and light extraction efficiency. Specifically, FIG. 1 shows the structure of a currently common 850-1100 nanometer (nm) quaternary infrared light emitting diode 1. The structure of this type of light emitting diode 1 has a transition layer 10, a magnesium (Mg)-doped gallium phosphide (GaP) P-type semiconductor layer 20, and a carbon (C)-doped gallium phosphide (GaP) P-type semiconductor layer 30. The structure of this type of light-emitting diode 1 uses a transition layer 10 to adjust the lattice mismatch between the magnesium-doped gallium phosphide epitaxial layer 20 and the aluminum indium phosphide epitaxial layer 40 located thereon, and uses the magnesium-doped gallium phosphide epitaxial layer 20 as a current spreading layer to achieve the effects of current spreading and brightness improvement. Also, the carbon-doped gallium phosphide epitaxial layer 30 is used as a P-type ohmic contact layer to be electrically connected to the lower metal electrode 50. However, the carbon-doped gallium phosphide epitaxial layer 30 absorbs light, which adversely affects the brightness.

[0003] In order to overcome the above problems, it has become an urgent task for the industry to develop an innovative light-emitting diode structure and manufacturing process that can increase brightness while improving problems such as increased costs due to complicated processes and high forward voltage. Summary of the Invention

[0004] The main objective of the present invention is to provide a light-emitting diode that realizes high brightness, simplified manufacturing process, and low cost. The innovative mirror structure realizes the effect of improving the light extraction efficiency, and improves the problems of the conventional light-emitting diode structure, such as insufficient brightness, complicated manufacturing process, high cost, and high forward voltage.

[0005] In order to achieve the above object, the present invention provides a light-emitting diode including a plurality of dot-shaped transparent conductive electrodes, a dielectric layer, and an epitaxial composite layer, the dielectric layer being disposed to surround each of the dot-shaped transparent conductive electrodes, and the epitaxial composite layer being disposed on each of the dot-shaped transparent conductive electrodes and the dielectric layer, and including a carbon-doped gallium arsenide epitaxial layer electrically connected to each of the dot-shaped transparent conductive electrodes.

[0006] In an embodiment of the present invention, the material of the dot-shaped transparent conductive electrodes of the light-emitting diode includes indium tin oxide.

[0007] In an embodiment of the present invention, the ratio of the total distribution area of ​​the dot-shaped transparent conductive electrodes to the area of ​​the epitaxial composite layer in the light-emitting diode is about 3.5% to 8%.

[0008] In an embodiment of the present invention, the carbon-doped gallium arsenide epitaxial layer of the light emitting diode has a thickness of about 100-1000 angstroms (Å).

[0009] In an embodiment of the present invention, the carbon-doped gallium arsenide epitaxial layer of the light emitting diode has a carbon doping concentration of about 4.0*E19 to 1.5*E20.

[0010] In an embodiment of the present invention, the epitaxial composite layer of the light emitting diode includes a first semiconductor layer, a light emitting layer, a second semiconductor layer, and a third semiconductor layer, where the third semiconductor layer is disposed on the carbon-doped gallium arsenide epitaxial layer, the second semiconductor layer is disposed on the third semiconductor layer, the light emitting layer is disposed on the second semiconductor layer, and the first semiconductor layer is disposed on the light emitting layer.

[0011] In an embodiment of the present invention, the first semiconductor layer of the light emitting diode is an N-type aluminum gallium arsenide (AlGaAs) epitaxial layer, the second semiconductor layer is a P-type aluminum gallium arsenide (AlGaAs) epitaxial layer, and the third semiconductor layer is a P-type aluminum indium phosphide (AlInP) epitaxial layer.

[0012] In an embodiment of the present invention, the light-emitting diode further includes a first transparent conductive layer, a second transparent conductive layer, and a metal layer, where the first transparent conductive layer is disposed on the second transparent conductive layer and electrically connected to each dot-shaped transparent conductive electrode, and the second transparent conductive layer is disposed on the metal layer.

[0013] In an embodiment of the present invention, the material of the first transparent conductive layer of the light emitting diode includes indium tin oxide.

[0014] In an embodiment of the present invention, the second transparent conductive layer of the light emitting diode is made of indium tin oxide, zinc aluminum oxide, zinc tin oxide, nickel oxide, cadmium tin oxide, antimony tin oxide, or a combination thereof.

[0015] In an embodiment of the present invention, the light emitting diode further includes an upper electrode disposed on the epitaxial composite layer, and the upper electrode does not overlap with each dot-shaped transparent conductive electrode when viewed in a vertical direction.

[0016] Those skilled in the art can understand other objects of the present invention, as well as the technical means and embodiments of the present invention, by referring to the drawings and the embodiments described below. [Brief description of the drawings]

[0017] [Figure 1] Schematic diagram showing the structure of a conventional light-emitting diode [Diagram 2] 1 is a diagram showing a manufacturing process of a light-emitting diode according to an embodiment of the present invention. [Diagram 3] 1 is a diagram showing a manufacturing process of a light-emitting diode according to an embodiment of the present invention. [Figure 4] 1 is a diagram showing a manufacturing process of a light-emitting diode according to an embodiment of the present invention. [Diagram 5] 1 is a diagram showing a manufacturing process of a light-emitting diode according to an embodiment of the present invention. [Figure 6] 1 is a diagram showing a manufacturing process of a light-emitting diode according to an embodiment of the present invention. [Figure 7] 1 is a diagram showing a manufacturing process of a light-emitting diode according to an embodiment of the present invention. [Figure 8] 1 is a diagram showing a manufacturing process of a light-emitting diode according to an embodiment of the present invention. [Figure 9] 1 is a diagram showing a manufacturing process of a light-emitting diode according to an embodiment of the present invention. [Figure 10] FIG. 1 is a top view showing a structure of a light-emitting diode according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] The contents of the present invention will be described below through examples. The examples of the present invention are examples of embodiments, and are not intended to limit the present invention to the environments, applications, or specific aspects described in the examples. Therefore, the explanation of the examples is for explaining the present invention, but does not limit the present invention. In the embodiments and drawings, components that are not directly related to the present invention are omitted and not shown. The dimensional relationship between the components in the drawings is for ease of understanding, and does not limit the actual dimensions.

[0019] FIG. 2 is a diagram showing an embodiment of a light-emitting diode produced by the present invention. The present invention takes as an example a short-wavelength infrared light-emitting diode using gallium arsenide (GaAs) as an epitaxial growth substrate 100, but is not limited thereto. Next, an epitaxial composite layer is formed on the gallium arsenide substrate. The composite layer is a double heterostructure of aluminum gallium arsenide (AlGaAs). Specifically, in this embodiment, the double heterostructure includes a first semiconductor layer 110, a light-emitting layer 120 formed on the first semiconductor layer 110, a second semiconductor layer 130 formed on the light-emitting layer 120, and a third semiconductor layer 140 formed on the second semiconductor layer 130. The light-emitting layer 120 is formed in a multiple quantum well (MQW) structure. In this embodiment, the multiple quantum well has an emission wavelength of 1000 to 1200 nanometers (nm). The first semiconductor layer 110 is an epitaxial layer of N-type aluminum gallium arsenide (AlGaAs). The second semiconductor layer 130 is an epitaxial layer of P-type aluminum gallium arsenide. The third semiconductor layer 140 is an epitaxial layer of P-type aluminum indium phosphide (AlInP). Note that the materials described in the above embodiment are merely examples, and the present invention is not limited thereto. In practice, the materials and their compositions can be adjusted according to the emission wavelength. For example, the epitaxial layer may be aluminum gallium indium phosphide (AlGaInP), indium gallium phosphide (InGaP), aluminum gallium arsenide (AlGaAs), indium gallium arsenide (InGaAs), indium phosphide (InP), or the like.

[0020] 2, a P-type carbon (C)-doped gallium arsenide (GaAs) epitaxial layer 150 is formed on the third semiconductor layer 140. In particular, since there is no lattice mismatch between the carbon-doped gallium arsenide epitaxial layer 150 and the aluminum indium phosphide epitaxial layer 140, the transition layer in the conventional structure can be omitted. Note that the carbon-doped gallium arsenide epitaxial layer 150 does not have the problem of light absorption by the carbon-doped gallium phosphide epitaxial layer described in the prior art in the emission band of 1000 to 1200 nanometers (nm). Therefore, the light-emitting diode structure of the present invention can use a single layer structure of carbon-doped gallium arsenide epitaxial layer 150 to replace the three-layer structure of transition layer 10, magnesium-doped gallium phosphide epitaxial layer 20, and carbon-doped gallium phosphide epitaxial layer 30 in the conventional light-emitting diode structure shown in FIG. 1. This not only simplifies the structure of the light-emitting diode, but also reduces the time and cost of the conventional time-consuming epitaxial process. In a preferred embodiment of the present invention, the thickness of carbon-doped gallium arsenide epitaxial layer 150 is about 100-1000 angstroms (Å). The carbon-doped gallium arsenide epitaxial layer 150 has a carbon doping concentration of about 4.0*E19-1.5*E20.

[0021] As shown in FIG. 3, a dielectric layer 160 covering the entire wafer surface is formed by a deposition method. This dielectric layer 160 is a low refractive index dielectric layer, and is made of silicon dioxide (SiO 2 ), silicon nitride (Si 3 N 4) and the like. Next, a portion of the dielectric layer 160 is removed by a yellow light etching process until the carbon-doped gallium arsenide epitaxial layer 150 is exposed. This defines the distribution position and area of ​​the subsequent dot-shaped lower electrodes. As shown in FIG. 4, a plurality of dot-shaped transparent conductive electrodes 170 are formed of a transparent conductive material to cover the exposed carbon-doped gallium arsenide epitaxial layer 150 by a deposition process. After the formation of the plurality of dot-shaped transparent conductive electrodes 170, the deposition process is continued to form a first transparent conductive layer 180 of a transparent conductive material to cover the dielectric layer 160 and the dot-shaped transparent conductive electrodes 170. The first transparent conductive layer 180 is electrically connected to each dot-shaped transparent conductive electrode 170. In a specific embodiment, the transparent conductive material includes at least indium tin oxide (ITO).

[0022] 5, in a preferred embodiment, a second transparent conductive layer 182 electrically connected to the first transparent conductive layer 180 may be formed by a deposition process to enhance adhesion. The material of the second transparent conductive layer 182 is indium tin oxide, aluminum zinc oxide (AZO), zinc tin oxide (IZO), nickel oxide, cadmium tin oxide, antimony tin oxide, or a combination thereof.

[0023] As shown in Fig. 6, a bonding metal layer 184 is formed on the second transparent conductive layer 182 by a deposition process, and then metal bonding is performed with the bonding metal layer 184 of the permanent bonding substrate 186. The transparent conductive layers 180, 182 and the bonding metal layer 184 function as a reflector system of the light-emitting diode of the present invention, which can reflect the light emitted from the light-emitting layer upward and improve the light extraction efficiency. The material of the bonding metal layer 184 is gold (Au) or indium gold (InAu) alloy. The permanent bonding substrate 186 can be, but is not limited to, a silicon substrate or a sapphire substrate.

[0024] As shown in FIG. 7, the gallium arsenide epitaxial substrate 100 is removed to expose the first semiconductor layer 110. The whole is turned over so that the permanent bonding substrate 186 is the bottom of the light-emitting diode structure. Next, as shown in FIG. 7, a planar region of the top electrode to be formed next on the N-type first semiconductor layer 110 is defined, and other regions of the N-type first semiconductor layer 110 are roughened. Next, as shown in FIG. 8, a MESA process is performed to etch a part of the epitaxial composite layer. That is, a part of the N-type first semiconductor layer 110, the light-emitting layer 120, the P-type second semiconductor layer 130, the P-type third semiconductor layer 140, and the P-type carbon-doped gallium arsenide epitaxial layer 150 is etched to expose a part of the dielectric layer 160. A protective thin film layer (e.g., a silicon oxide protective thin film layer, not shown) is formed on the surface of the dielectric layer 160 and the surface of the first semiconductor layer 110 after the roughening process. Finally, a street is formed on the substrate. In a preferred embodiment of the present invention, after the MESA process, in the light emitting diode according to the present invention, the ratio of the total distribution area of ​​the dot-shaped transparent conductive electrodes 170 to the area of ​​the epitaxial composite layer is about 3.5% to 8%.

[0025] As shown in FIG. 9, a patterned N-type upper electrode 190 is formed on the planar region of the first semiconductor layer 110, completing the structure of the light-emitting diode 2 according to the present invention. The material of the upper electrode 190 is gold germanium (GeAu), germanium gold nickel (GeAuNi), or a combination thereof. In particular, the upper electrode 190 does not overlap with the plurality of lower dot-shaped transparent conductive electrodes 170 when viewed from the vertical direction. FIG. 10 is a top view of the light-emitting diode 2 according to the present invention in FIG. 9. As shown in FIG. 10, the upper electrode 190 does not overlap with the plurality of lower dot-shaped transparent conductive electrodes 170 when viewed from the vertical direction. In this way, the design of the upper electrode and the lower electrode not only achieves the purpose of current spreading, but also prevents the light emitted from the light-emitting layer from being blocked by the upper electrode 190, and improves the light extraction efficiency.

[0026] Based on the above, the structure of the short-wavelength infrared light-emitting diode according to the present invention has at least the following advantages: (1) Lattice matching is achieved between the P-type carbon-doped gallium arsenide epitaxial layer 150 and the aluminum indium phosphide epitaxial layer 140 thereon. Therefore, the P-type carbon-doped gallium arsenide epitaxial layer 150 of the present invention does not require a transition layer in the conventional light-emitting diode structure, and can replace the three-layer structure of the transition layer, the P-type magnesium-doped gallium phosphide epitaxial layer, and the P-type carbon-doped gallium phosphide epitaxial layer in the conventional structure. Therefore, the present invention can simplify the epitaxial structure of the light-emitting diode and its manufacturing process, and reduce the process cost. (2) The P-type carbon-doped gallium arsenide epitaxial layer 150 does not have the problem of light absorption by the carbon-doped gallium phosphide epitaxial layer described in the prior art in the emission band of 1000 to 1200 nanometers (nm) set in the light-emitting diode of the present invention. Therefore, compared with the conventional structure, the light-emitting diode of the present invention can effectively increase the overall brightness. (3) Compared with the conventional carbon-doped gallium phosphide epitaxial layer, the P-type carbon-doped gallium arsenide epitaxial layer 150 can contribute to a reduction in forward voltage.

[0027] The above examples are for explaining the embodiments of the present invention and for explaining the characteristic configuration of the present invention. The present invention is not limited to the above examples. Modifications or equivalent arrangements that can be easily made by those skilled in the art are also within the scope of the present invention. The scope of protection of the rights of the present invention is based on the claims. [Explanation of symbols]

[0028] 1, 2 Light emitting diode 10 Transition layer 20 Magnesium-doped gallium phosphide epitaxial layer (magnesium-doped gallium phosphide p-type semiconductor layer) 30 Carbon-doped gallium phosphide epitaxial layer (carbon-doped gallium phosphide p-type semiconductor layer) 40 Epitaxial layer of aluminum indium phosphide 50 Lower metal electrode 100 Substrates 110 First semiconductor layer 120 Light-emitting layer 130 Second semiconductor layer 140 Third semiconductor layer (epitaxial layer of aluminum indium phosphide) 150 Carbon-doped gallium arsenide epitaxial layers 160 Dielectric layer 170 Dot-shaped transparent conductive electrodes 180 First transparent conductive layer 182 Second transparent conductive layer 184 Bonding metal layer 186 Permanently Bonded Substrate 190 Upper electrode

Claims

1. A light emitting diode, A plurality of dot-shaped transparent conductive electrodes; a dielectric layer disposed around the dot-shaped transparent conductive electrodes; an epitaxial composite layer; the epitaxial composite layer is disposed on the dot-shaped transparent conductive electrodes and the dielectric layer, and includes a carbon-doped gallium arsenide epitaxial layer electrically connected to each of the dot-shaped transparent conductive electrodes.

2. 2. The light-emitting diode according to claim 1, wherein the material of the dot-shaped transparent conductive electrodes includes indium tin oxide.

3. 2. The light emitting diode according to claim 1, wherein a ratio of a total distribution area of ​​the dot-shaped transparent conductive electrodes to an area of ​​the epitaxial composite layer is about 3.5% to 8%.

4. 2. The light emitting diode of claim 1, wherein the carbon-doped gallium arsenide epitaxial layer has a thickness of about 100-1000 angstroms (Å).

5. 2. The light emitting diode of claim 1, wherein the carbon doped gallium arsenide epitaxial layer has a carbon doping concentration of about 4.0*E19 to 1.5*E20.

6. 2. The light-emitting diode of claim 1, wherein the epitaxial composite layer includes a first semiconductor layer, a light-emitting layer, a second semiconductor layer, and a third semiconductor layer, the third semiconductor layer being disposed on the carbon-doped gallium arsenide epitaxial layer, the second semiconductor layer being disposed on the third semiconductor layer, the light-emitting layer being disposed on the second semiconductor layer, and the first semiconductor layer being disposed on the light-emitting layer.

7. 7. The light-emitting diode of claim 6, wherein the first semiconductor layer is an N-type aluminum gallium arsenide (AlGaAs) epitaxial layer, the second semiconductor layer is a P-type aluminum gallium arsenide (AlGaAs) epitaxial layer, and the third semiconductor layer is a P-type aluminum indium phosphide (AlInP) epitaxial layer.

8. 2. The light-emitting diode according to claim 1, further comprising a first transparent conductive layer, a second transparent conductive layer, and a metal layer, wherein the first transparent conductive layer is disposed on the second transparent conductive layer and electrically connected to the dot-shaped transparent conductive electrodes, and the second transparent conductive layer is disposed on the metal layer.

9. 9. The light emitting diode of claim 8, wherein the material of the first transparent conductive layer comprises indium tin oxide.

10. 9. The light emitting diode of claim 8, wherein the second transparent conductive layer is made of indium tin oxide, zinc aluminum oxide, zinc tin oxide, nickel oxide, cadmium tin oxide, antimony tin oxide, or a combination thereof.

11. The light emitting diode according to claim 1 , further comprising an upper electrode disposed on the epitaxial composite layer, the upper electrode not overlapping the dot-shaped transparent conductive electrodes when viewed in a vertical direction.

Images