Antenna module implemented in multilayer board package and electronic device including the same

Abstract

To provide a multilayer circuit type antenna package in which the number of stacked layers is minimized.SOLUTION: An antenna module implemented in a multilayer package includes: a printed circuit board (PCB) having a plurality of layers; a radio frequency integrated circuit (RFIC) disposed on a first surface among outermost surfaces of the PCB; a first array antenna disposed on a second surface, perpendicular to the first surface, among the outermost surfaces of the PCB; a second array antenna disposed on a third surface, perpendicular to the first and second surfaces, among the outermost surfaces of the PCB; and a third array antenna disposed on a fourth surface, perpendicular to the second and third surfaces, among the outermost surfaces of the PCB. First to third signal lines connected to the first to third array antennas form first to third coplanar waveguide structures in which first to third ground regions are formed, respectively.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] The present invention relates to a multilayer circuit type antenna package for millimeter wave band communication, and also to an electronic device including an antenna module in the form of the multilayer circuit type antenna package.

[0002] Related Art This application claims priority under Article 4 of the Paris Convention based on Korean Patent Application No. 10-2023-0112089 (filing date: August 25, 2023; DAS Code: 562A), and the present application is based on the contents disclosed in the Korean patent application. For reference, the contents of the specification, claims and drawings of the Korean patent application are incorporated herein by reference. [Background technology]

[0003] The millimeter wave band communication method being developed for transmitting ultra-high speed, large volume AV data at the GBps level can transmit high volume data several times faster than conventional short / medium range communication methods such as WiFi, WLAN, and WPAN.

[0004] Unlike conventional short / medium distance communication methods, this type of millimeter wave communication method separates the antenna and RFIC, making it extremely difficult to realize using a cable connection. In the millimeter wave band, signal attenuation occurs several tens of times more than in conventional commercial frequency bands. In addition, the unit price of a signal cable dedicated to the millimeter wave band usually reaches several tens of dollars, which is a major obstacle to the commercialization of 60 GHz communication modules. Therefore, in the millimeter wave band, there is a demand for antenna and package design technology that positions the antenna and RFIC within the shortest distance to prevent signal loss and attenuation.

[0005] Conventional technology for realizing millimeter-wave band antennas / packages is widely used to incorporate antennas and stripline or microstrip transmission lines in multilayer circuits and electrically connect them to RFICs. This method realizes the TEM (Transverse Electro Magnetic) mode required for wideband signal wiring, thereby achieving the wide bandwidth required in the millimeter-wave band.

[0006] The multi-layer circuit method using the stripline or microstrip described above is an ideal method for achieving antenna performance. However, the stripline requires at least three layers, since the signal line is arranged in the middle layer and the ground layers are arranged above and below the signal line. Meanwhile, the microstrip requires at least two layers, including the layer on which the signal line is arranged and the ground layer arranged above or below the signal line.

[0007] Therefore, when designing a multi-layer circuit by mixing antennas, RF interfaces, inner cavities, power lines, etc., the number of layers reaches about 7 to 10. The LTCC (Low Temperature Co-fired Ceramic) process that realizes this has high manufacturing costs, which is an obstacle to the commercialization of millimeter wave communication technology. Summary of the Invention [Problem to be solved by the invention]

[0008] The present invention provides a multi-layer circuit type antenna package for millimeter wave band communication, which has a structure in which the number of layers is minimized.

[0009] The present invention provides a patch array antenna structure for millimeter wave band communications, which minimizes the signal phase difference for each patch.

[0010] The present invention provides an antenna module that is realized with a low height and allows signal transmission to the front, bottom and side regions.

[0011] The present invention provides a structure that minimizes signal interference between multiple array antennas. [Means for solving the problem]

[0012] [Preferred embodiment of the present invention] The present invention can propose the following aspects of the invention. [Aspect 1] An antenna module realized in a multi-layer package, A PCB with multiple layers; an RFIC provided on a first surface of the outermost surfaces of the PCB; a first array antenna provided on a second surface of the outermost surface of the PCB, the second surface being perpendicular to the first surface; a second array antenna provided on a third surface of the outermost surface of the PCB, the third surface being perpendicular to the first surface and the second surface; a third array antenna provided on a fourth surface of the outermost surface of the PCB, the fourth surface being perpendicular to the second surface and the third surface; the first surface and the fourth surface form opposing surfaces; the second surface and the third surface are formed between the first surface and the fourth surface, the plurality of layers includes a plurality of ground layers and a layer in which a plurality of coplanar waveguides are formed; The plurality of layers are stacked from a first layer to a twelfth layer, the first surface forms one surface of a first layer among the plurality of layers; a second layer forming a first ground layer among the plurality of ground layers is formed on a surface opposite to the first surface of the first layer; a third layer laminated on the second layer includes a first coplanar waveguide; the first coplanar waveguide includes a first signal line and a first ground region; the first signal line and the first ground area are electrically connected to the first array antenna; a fourth layer laminated on the third layer forms a second ground layer; a fifth layer laminated on the fourth layer includes a second coplanar waveguide; the second coplanar waveguide includes a second signal line and a second ground region; the second signal line and the second ground area are electrically connected to the second array antenna; A sixth layer laminated on the fifth layer forms a third ground layer; a seventh layer laminated on the sixth layer includes a third coplanar waveguide; the third coplanar waveguide includes a third signal line and a third ground region; the third signal line and the third ground area are electrically connected to the third array antenna; A plurality of fourth ground layers and a plurality of non-metallic regions disposed in inner regions of the plurality of fourth ground layers are formed in an eighth layer to a twelfth layer stacked on the seventh layer, An antenna module, wherein the third array antenna is formed in a non-metallic region of the twelfth layer. [Aspect 2] The second surface of the outermost surface of the PCB is A first array antenna arrangement area; and a region in which a first ground wall is formed by each of the ground layers arranged on the plurality of layers. [Aspect 3] a plurality of first connection lines are formed to electrically connect the first array antenna and the RFIC; The plurality of first connection lines are a plurality of first horizontal lines formed in the first layer; a plurality of first vertical lines vertically connecting the first layer to the third layer; a plurality of the first coplanar waveguides formed in the third layer; The first vertical lines are formed to have a first equal length, The first plurality of coplanar waveguides are formed to have a second equal length; 2. The antenna module of claim 1, wherein the multiple first connection lines are formed to have the same length. Aspect 4 A fourth array antenna is provided on a fifth surface of the outermost surface of the PCB, the fifth surface being perpendicular to the third surface and the fourth surface; 2. The antenna module of claim 1, wherein the second surface and the fifth surface form opposing surfaces. Aspect 5 The third surface of the outermost surface of the PCB is A second array antenna arrangement area; and a region in which a second ground wall is formed by each ground layer disposed on the plurality of layers. Aspect 6 a plurality of second connection lines are formed to electrically connect the second array antenna and the RFIC; The plurality of second connection lines are a plurality of second horizontal lines formed in the first layer; a plurality of second vertical lines vertically connecting the first layer to the fifth layer; the second coplanar waveguides being formed in the fifth layer. Aspect 7 The second vertical lines are formed to have a third equal length, The second plurality of coplanar waveguides are formed to have a fourth equal length; 7. The antenna module of claim 6, wherein the second connection lines are formed to have the same length. Aspect 8 8. The antenna module according to claim 7, wherein the second coplanar waveguides are formed in an even number and are formed in a symmetrical structure with respect to the X-axis. Aspect 9 the second array antenna comprises 14 antenna elements; four pins arranged in the first region of the RFIC are electrically connected to first to fourth antenna elements of the second array antenna by first to fourth waveguides of the second coplanar waveguide; four pins arranged in the second region of the RFIC are electrically connected to a fifth antenna element, a sixth antenna element, a ninth antenna element, and a tenth antenna element of the second array antenna by a fifth waveguide, a sixth waveguide, a ninth waveguide, and a tenth waveguide of the second coplanar waveguide; four pins arranged in a third region of the RFIC are electrically connected to an eleventh antenna element to a fourteenth antenna element of the second array antenna by an eleventh waveguide to a fourteenth waveguide of the second coplanar waveguide; The antenna module of aspect 8, wherein the two pins arranged in the fourth region of the RFIC are electrically connected to the seventh antenna element and the eighth antenna element of the second array antenna via the seventh waveguide and the eighth waveguide of the second coplanar waveguide. Aspect 10 the first region and the third region of the RFIC are disposed in opposing positions; the second region and the fourth region of the RFIC are disposed in opposing positions; The two pins of the fourth region of the RFIC are formed to be closest to a seventh antenna element and an eighth antenna element of the second array antenna, The antenna module of aspect 9, wherein the second coplanar waveguide is formed in a symmetrical structure with respect to the central axis of the seventh antenna element and the eighth antenna element of the second array antenna. Aspect 11 9. The antenna module of claim 8, wherein the second coplanar waveguide is formed in an X-axis direction and the first coplanar waveguide is formed in a Y-axis direction. Aspect 12 The third array antenna disposed on the fourth surface of the outermost surface of the PCB includes a plurality of antenna elements; each of the plurality of antenna elements comprises two patch antenna structures; A first patch antenna of the two patch antennas is disposed on the fourth surface of the PCB; A second patch antenna of the two patch antennas is disposed apart from the first patch antenna and is disposed on any one of a plurality of layers inside the PCB; The antenna module of aspect 1, wherein a portion of the first patch antenna and a portion of the second patch antenna are stacked so as to overlap each other. Aspect 13 The fourth surface of the outermost surface of the PCB is formed of a metal layer connected to ground, The antenna module of claim 12, wherein an internal region of the metal layer is formed of a non-metallic region in which the first patch antenna is disposed. Aspect 14 The non-metallic area of ​​the PCB is the same area as the non-metallic area, a first vertical region from an outermost surface of the PCB to a ground layer formed on an upper portion of an inner layer in which the third coplanar waveguide is disposed within the PCB defines a first inner space formed of a dielectric material; A second patch antenna is disposed on the tenth layer of the first internal space; The antenna module of embodiment 13, wherein an outer peripheral surface of the first internal space forms a third ground wall to which the grounds of each layer are connected by vias. Aspect 15 a plurality of third connection lines are formed to electrically connect the third array antenna and the RFIC; The third connection lines include a plurality of third horizontal lines formed in the first layer; a plurality of third vertical lines vertically connecting the first to seventh layers; a plurality of the third coplanar waveguides formed on the seventh layer; 13. The antenna module of embodiment 12, comprising: a fourth vertical line vertically connecting the plurality of third coplanar waveguides and the second patch antenna. Aspect 16 a first length, which is a radius of the first patch antenna, is longer than a second length, which is a radius of the second patch antenna; The antenna module of aspect 15, wherein the center of the second patch antenna, the center of the first patch antenna, and the feed area of ​​the second patch antenna to which the fourth vertical line is connected are arranged on a straight line. Aspect 17 The third vertical lines are formed to have a fifth equal length, The second plurality of coplanar waveguides are formed to have a sixth equal length; The plurality of fourth vertical lines are formed to have a seventh equal length; The antenna module of embodiment 16, wherein the multiple third connection lines are formed to be the same length. Aspect 18 a third horizontal line formed in the first layer forms a plurality of signal connection lines; Among the plurality of signal connection lines, a first group of the third horizontal lines electrically connected to the second patch antenna is disposed in a first region based on a first horizontal axis; The antenna module of embodiment 16, wherein among the multiple signal connecting lines, a second group of the third horizontal lines electrically connected to the second patch antenna are arranged in a second region based on the first horizontal axis. Aspect 19 the third coplanar waveguide formed on the seventh layer forms a plurality of signal connection lines; Among the plurality of signal connection lines, a first group of the third coplanar waveguides electrically connected to the second patch antenna is disposed in a first region with respect to the first horizontal axis; The antenna module of embodiment 15, wherein a second group of the third coplanar waveguides among the multiple signal connecting lines that are electrically connected to the second patch antenna are arranged in a second region based on the first horizontal axis. Aspect 20 The antenna module according to aspect 15, wherein the third coplanar waveguides are formed in an even number and are formed in a symmetrical structure with respect to the X-axis. Aspect 21 the third array antenna comprises 12 antenna elements; the six pins arranged in the second region of the RFIC are electrically connected to the second antenna element, the fourth antenna element, the sixth antenna element, the seventh antenna element, the ninth antenna element, and the eleventh antenna element of the third array antenna by the second waveguide, the fourth waveguide, the sixth waveguide, the seventh waveguide, the ninth waveguide, and the eleventh waveguide of the third coplanar waveguide, which are arranged in the first region; The antenna module of aspect 15, wherein the six pins arranged in the fourth region of the RFIC are electrically connected to the first antenna element, the third antenna element, the fifth waveguide, the eighth waveguide, the tenth waveguide, and the twelfth antenna element of the third array antenna by the first waveguide, the third waveguide, the fifth waveguide, the eighth waveguide, the tenth waveguide, and the twelfth waveguide of the third coplanar waveguide, which are arranged in the second region. Aspect 22 the third coplanar waveguide disposed in the first region and the third coplanar waveguide disposed in the second region are formed to have an asymmetric structure with respect to a Y axis, the third coplanar waveguide disposed in the first region is formed to have a symmetrical structure with respect to an X-axis, 22. The antenna module according to claim 21, wherein the third coplanar waveguide arranged in the second region is formed in a symmetrical structure with respect to the X-axis.

[0013] [Preferred embodiment of the present invention] An antenna module realized in a multi-layer package according to one embodiment of the present invention includes a PCB including a plurality of layers, an RFIC provided on a first surface of the outermost surface of the PCB, a first array antenna provided on a second surface perpendicular to the first surface of the outermost surface of the PCB, a second array antenna provided on a third surface perpendicular to the first and second surfaces of the outermost surface of the PCB, and a third array antenna provided on a fourth surface perpendicular to the second and third surfaces of the outermost surface of the PCB. First to third signal lines connected to the first to third array antennas are formed in first to third coplanar waveguide structures in which first to third ground regions are formed, respectively.

[0014] According to an embodiment, the first surface and the fourth surface form opposing surfaces. The second surface and the third surface are formed between the first surface and the fourth surface. The multiple layers include multiple ground layers and a layer in which multiple coplanar waveguides are formed. The multiple layers are stacked from a first layer to a twelfth layer, and the first surface forms one surface of a first layer among the multiple layers, and a second layer forming the first ground layer among the multiple ground layers is formed on a surface opposite to the first surface of the first layer.

[0015] According to an embodiment, a third layer laminated on the second layer includes a first coplanar waveguide, the first coplanar waveguide includes a first signal line and a first ground area, and the first signal line and the first ground area are electrically connected to the first array antenna. A fourth layer laminated on the third layer forms a second ground layer, and a fifth layer laminated on the fourth layer includes a second coplanar waveguide, the second coplanar waveguide includes a second signal line and a second ground area, and the second signal line and the second ground area are electrically connected to the second array antenna.

[0016] According to an embodiment, a sixth layer laminated on the fifth layer forms a third ground layer, and a seventh layer laminated on the sixth layer includes a third coplanar waveguide, the third coplanar waveguide includes a third signal line and a third ground region, and the third signal line and the third ground region are electrically connected to the third array antenna. A plurality of fourth ground layers and a plurality of non-metallic regions disposed in inner regions of the plurality of fourth ground layers are formed in the eighth to twelfth layers laminated on the seventh layer. The third array antenna is formed in the non-metallic region of the twelfth layer.

[0017] An electronic device according to another aspect of the present invention includes a display panel that displays images and information, and a communication module for wirelessly receiving signals related to the images and information from an external device, the communication module including a transmitter / receiver circuit and first, second, and third antenna resonating elements, a control unit that converts a signal received from the communication module and supplies it to the display panel, a first coplanar waveguide configured to transmit the signal at a frequency of 10 GHz to 300 GHz between the transmitter / receiver circuit and the first antenna resonating element, a second coplanar waveguide configured to transmit the signal at a frequency of 10 GHz to 300 GHz between the transmitter / receiver circuit and the second antenna resonating element, and a third coplanar waveguide configured to transmit the signal at a frequency of 10 GHz to 300 GHz between the transmitter / receiver circuit and the third antenna resonating element.

[0018] According to an embodiment, the first coplanar waveguide is interposed between the second coplanar waveguide and the transceiver circuit, the second coplanar waveguide is interposed between the first coplanar waveguide and the third coplanar waveguide, and the third coplanar waveguide is interposed between the second coplanar waveguide and the third antenna resonating element. The first antenna resonating element is interposed between the second coplanar waveguide and the transceiver circuit, the second antenna resonating element is interposed between the first coplanar waveguide and the second coplanar waveguide, and the third antenna resonating element is interposed on the opposite side of the transceiver circuit.

[0019] According to an embodiment, the control unit measures the signal strength when the signal is received from the external device by the first, second, and third antenna resonating elements, and selects the antenna resonating element with the strongest signal strength to receive the signal. Effect of the Invention

[0020] The above-described multilayer circuit type antenna package provides a structure that can minimize the number of layers and can wirelessly transmit a wideband signal.

[0021] The above-mentioned multi-layer circuit type antenna package has a small loss during signal transmission and is economical in process cost.

[0022] The above-mentioned multilayer circuit type antenna package has an antenna module arrangement structure in which the coplanar waveguides are stacked so as to be separated by multiple ground layers, thereby minimizing interference between multiple array antennas of different structures.

[0023] Further scope of applicability of the present invention will become apparent from the following detailed description. However, since various changes and modifications within the spirit and scope of the present invention will be clearly understood by those skilled in the art, the detailed description and specific embodiments such as preferred embodiments are merely illustrative of the present invention. [Brief description of the drawings]

[0024] [Figure 1] 1 is a diagram illustrating a configuration of a wireless display system according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a block diagram illustrating a detailed configuration of a communication device and an electronic device. [Diagram 3] 1 is a structural diagram showing an electronic device on which a display is formed that wirelessly communicates with other communication devices disposed at various positions; [Figure 4] 1A and 1B are diagrams illustrating a structure of an antenna module disposed at the bottom of an electronic device. [Diagram 5] 1A to 1C are diagrams illustrating a structure in which an antenna module according to an embodiment is disposed in an electronic device and a structure in which the antenna module is fastened to the electronic device. [Figure 6] 1A and 1B are diagrams showing a cross-sectional view and a three-dimensional structure of a substrate on which an antenna module is formed. [Figure 7] FIG. 2 is a front view of a substrate on which an antenna module is formed. [Figure 8] 8 is a partial perspective view and a cross-sectional view taken along a particular line of the antenna module of FIG. 7. [Figure 9a] 9 is a side view of a partial area of ​​an antenna module formed by the patch antenna of the overlapping structure of FIG. 8. [Figure 9b] FIG. 9b shows the size and separation of radiators arranged on different layers, as well as the separation between the radiators and the ground wall in the side view of the antenna module of FIG. 9a. [Figure 10] 1A and 1B are diagrams showing a via wall formation structure according to an embodiment; [Figure 11a] 9 is a front view showing each layer of the antenna module of FIG. 8. [Figure 11b] 9 is a front view showing each layer of the antenna module of FIG. 8. [Figure 12a] 9 is a diagram showing the first and third layers of the antenna module of FIG. 8. FIG. [Figure 12b] 9 is a diagram showing the first and fifth layers of the antenna module of FIG. 8. FIG. [Figure 12c]9 is a diagram showing the first and seventh layers of the antenna module of FIG. 8. FIG. [Figure 13a] FIG. 2 is a front perspective view of an antenna module implemented in a multi-layer antenna package. [Figure 13b] FIG. 2 is a side view of an antenna module realized in a multi-layer antenna package. [Figure 14a] 9 is a diagram showing the tenth and twelfth layers on which patch antennas of the antenna module of FIG. 8 are laminated. [Figure 14b] 9 is a diagram showing a superimposed arrangement structure of patch antennas arranged in the array antenna arrangement area of ​​the antenna module of FIG. 8. FIG. [Figure 15] 1A and 1B are diagrams showing a cross-sectional view and a three-dimensional structure of a substrate on which an antenna module is formed. [Figure 16] 16 is a partial perspective view and a cross-sectional view taken along a particular line of the antenna module of FIG. 15. [Figure 17a] 17 is a front view showing each layer of the third array antenna of the antenna module of FIG. 16. FIG. [Figure 17b] 17 is a diagram showing the first and seventh layers of the antenna module of FIG. 16. FIG. [Figure 18a] 17 is a diagram showing the tenth and twelfth layers on which patch antennas of the antenna module of FIG. 16 are laminated. FIG. [Figure 18b] 17 is a diagram showing a superimposed arrangement structure of patch antennas arranged in the array antenna arrangement area of ​​the antenna module of FIG. 16. [Figure 19] 4 is a flowchart showing the operation of an electronic device that transmits and receives wireless signals to and from a communication device according to the present invention. [Figure 20] 4 is a flowchart of a method for selecting, modifying, or restoring a wireless beamforming signal for an electronic device to transmit or receive an A / V signal according to the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] Specific embodiments of the present invention will be described in detail below.

[0026] Hereinafter, the embodiments of the present invention will be described in more detail with reference to the drawings. The suffixes "module" and "part" of components used in the following description are given or mixed to facilitate the writing of the specification, and do not have any significance or usefulness in themselves.

[0027] An audio / video (hereinafter, referred to as A / V) transmitting device according to an embodiment of the present invention may be, for example, an intelligent device in which a computer-assisted function is added to a broadcast receiving function, and in which the broadcast receiving function is normally performed while an Internet function is added, and which is equipped with an interface for more convenient use, such as a handwritten input device, a touch screen, or a spatial remote control.

[0028] In addition, since the device supports wired or wireless Internet functions, it can also perform functions such as e-mail, web browsing, Internet banking, games, etc. by connecting to the Internet and a computer. A standardized general-purpose OS may be used for such various functions.

[0029] Therefore, the A / V transmitting device according to the present invention can freely add and delete various applications on the kernel of a general-purpose OS, for example, and can therefore execute a variety of user-friendly functions.

[0030] FIG. 1 is a diagram illustrating the configuration of a wireless display system according to this embodiment.

[0031] As shown in FIG. 1, the wireless display system according to the present embodiment includes a communication device 100 and an electronic device 200.

[0032] The wireless display system is a system in which a communication device 100 wirelessly transmits A / V data to an electronic device 200, and the electronic device 200 outputs the A / V data.

[0033] The communication device 100 is a device that encodes video and audio and transmits the encoded video and audio content wirelessly.

[0034] An example of the communication device 100 is an AIO (All In One) box capable of transmitting data, and specifically, a set-top box.

[0035] Other examples of the communication device 100 include those connected to external devices such as a set-top box and a USB memory. The communication device 100 transmits a video signal or an audio signal received from the connected external device to the electronic device 200.

[0036] The electronic device 200 is a display device that wirelessly receives encoded video and audio and decodes the received video and audio.

[0037] The communication device 100 and the electronic device 200 form a video wall display system.

[0038] In a video wall, a thin display bezel plays an important role in visualizing video content. In order to make the display bezel thin, it is efficient to have only components that play a minimum role and to execute circuits and components for main functions in a separate device.

[0039] The communication device 100 determines the type of the video content, and determines the compression rate of the video content based on the determined type. The compression rate of the video content is determined according to the ratio of the video data size before and after encoding.

[0040] The types of video content include a still image type, a general moving image type, and a game moving image type.

[0041] The communication device 100 compresses the video content at the determined compression rate, and transmits the compressed video content to the electronic device 200 wirelessly.

[0042] The electronic device 200 decompresses the compressed video content received from the communication device 100 and displays the decompressed video content on a display, such as a display device.

[0043] 2 is a block diagram illustrating a detailed configuration of a communication device and an electronic device. As shown in FIG. 2, the communication device 100 includes a microphone 110, a Wi-Fi module 120, a Bluetooth (registered trademark) module 130, a memory 140, an RF transmission module 150, and a processor 190.

[0044] The microphone 110 transmits an input audio signal to the processor 190 .

[0045] The microphone 110 receives the voice spoken by the user.

[0046] The WiFi module 120 performs wireless communication according to the WiFi standard.

[0047] The WiFi module 120 performs wireless communication with an external device or an electronic device 200 according to the WiFi standard.

[0048] The Bluetooth module 130 performs wireless communication in accordance with the Bluetooth Low Energy (BLE) standard.

[0049] The Bluetooth module 130 performs wireless communication with an external device such as a remote control or the electronic device 200 according to the Bluetooth Low Energy (BLE) standard.

[0050] The memory 140 stores programs for signal processing and control, and stores processed video, audio, or data signals.

[0051] The memory 140 performs a function of temporarily storing video, audio or data signals input from the outside, and also stores information about a predetermined image through a channel storage function.

[0052] The RF transmitting module 150 transmits the A / V signal to the RF receiving module 240 of the electronic device 200 by RF (Radio Frequency) communication.

[0053] The RF transmitting module 150 transmits the compressed A / V signals in digital form to the RF receiving module 240 .

[0054] The RF transmit module 150 transmits the A / V signals to the RF receive module 240 over at least one channel.

[0055] The processor 190 generally controls the operation of the communication device 100 .

[0056] The processor 190 is configured in the form of a system on chip (SoC).

[0057] A plurality of processors 190 are provided.

[0058] The processor 190 compresses a video signal or an audio signal input from the outside, and transmits the compressed signal to the RF transmission module 150 .

[0059] The processor 190 includes an encoder for compressing the video or audio signal.

[0060] The processor 190 is also referred to as the main SoC.

[0061] The processor 190 includes at least one interface for connecting to an external device, for example, the processor 190 includes at least one HDMI port and at least one USB port.

[0062] The processor 190 includes a tuner for receiving broadcast signals.

[0063] The electronic device 200 includes a Wi-Fi module 210 , a Bluetooth module 220 , an IR module 230 , an RF receiving module 240 , a memory 250 , a display panel 260 , and a processor 290 .

[0064] The WiFi module 210 performs wireless communication according to the WiFi standard.

[0065] The WiFi module 120 performs wireless communication with an external device or the communication device 100 according to the WiFi standard.

[0066] The Bluetooth module 220 performs wireless communication according to the Bluetooth Low Energy (BLE) standard.

[0067] The Bluetooth module 220 performs wireless communication with an external device such as a remote control or the A / V transmission device 200 according to the Bluetooth Low Energy (BLE) standard.

[0068] The IR module 230 receives a signal from a remote control (not shown) via IR (Infrared) communication.

[0069] The RF receive module 240 receives the A / V signals from the RF transmit module 150 .

[0070] The RF receiving module 240 includes a plurality of antennas and is disposed below the display panel 260.

[0071] An example of the RF receiving module 240 includes a first antenna module and a second antenna module, each of which includes a plurality of antennas.

[0072] Another example of the RF receiver module 240 is an antenna module that includes multiple antennas.

[0073] The RF receiving module 240 receives the compressed A / V signals in digital form from the RF transmitting module 150 and transfers the received A / V signals to a processor 290 .

[0074] The memory 250 stores programs for signal processing and control, and also stores processed video, audio, or data signals.

[0075] The display panel 260 is a display panel 260 that displays the video signal received from the processor 290. An example of such a display panel 260 is an LED panel.

[0076] The display panel 260 displays the video signal under the drive of a timing controller (not shown).

[0077] The processor 290 generally controls the operation of the electronic device 200 .

[0078] The processor 290 decompresses the compressed A / V signals received by the RF receiving module 240. To that end, the processor 290 includes a decoder.

[0079] The antenna module arranged in the electronic device according to the present invention will be described below. Note that Fig. 3 is a structural diagram showing an electronic device on which a display is formed, which performs wireless communication with other communication devices arranged in various positions.

[0080] As shown in FIG. 3, the communication device 100 is disposed in front of, below, on one side or on the other side of the electronic device 200. The communication device 100 is an AV transmitting device that transmits AV content to the electronic device 200. The communication device 100 is a set-top box, but is not limited to this. The electronic device 200 is an AV receiving device that receives AV content from the communication device 100. The electronic device 200 is a display device, but is not limited to this. The electronic device 200 receives data from the communication device 100, but can also transmit data to the communication device 100.

[0081] The communication device 100 may be disposed in a first direction D1 below the electronic device 200. In this case, the electronic device 200 transmits and receives wireless signals in the first direction D1 below. The upper side of the electronic device 200 is defined as a second direction D2.

[0082] The communication device 100 may be disposed in a third direction D3 that is to the left of the electronic device 200 or in a fourth direction D4 that is to the right of the electronic device 200. In this case, the electronic device 200 transmits and receives wireless signals in the third direction D3 that is to the left or the fourth direction D4 that is to the right.

[0083] The communication device 100 may be disposed in a fifth direction D5, which is in front of the electronic device 200. In this case, the electronic device 200 transmits and receives wireless signals in the fifth direction D5, which is in the front. The rear of the electronic device 200 is defined as a sixth direction D6.

[0084] On the other hand, there may be cases where an obstacle is present between the communication device 100 and the electronic device 200 and a wireless link on a line-of-sight (LOS) path is not formed. In such a case, the electronic device 200 transmits and receives wireless signals via a wireless link on a non-LOS path such as a reflected path. The communication device 100 transmits and receives wireless signals in the direction of the ceiling above and in front of it. Communication between the communication device 100 and the electronic device 200 is performed by the wireless signals reflected by the ceiling or a wall surface.

[0085] On the other hand, the electronic device according to the present invention includes a plurality of antenna modules (structures) and performs wireless communication with a communication device by using the plurality of antenna modules (structures). Note that Fig. 4 is a diagram showing the structure of an antenna module disposed at the bottom of the electronic device.

[0086] 3 and 4, the electronic device 200 includes a display panel 260 and antenna modules 1000a and 1000b. A first antenna module 1000a and a second antenna module 1000b are disposed around the display panel 260. The first antenna module 1000a and the second antenna module 1000b in FIG. 4 correspond to the antenna module 1000 in FIG. 7 and the antenna module 1000 in FIG. 15, respectively.

[0087] The first antenna module 1000a is disposed in one side region of the electronic device 200. The second antenna module 1000b is disposed in the other side region of the electronic device 200.

[0088] The first antenna module 1000a includes a first array antenna 1100a, a fourth array antenna 1100b, a second array antenna 1300, and a third array antenna 1200.

[0089] The first array antenna 1100a operates as a horizontally polarized antenna that transmits and receives signals in the left direction. The fourth array antenna 1100b operates as a horizontally polarized antenna that transmits and receives signals in the right direction. The first array antenna 1100a forms a polarized wave in the X-axis direction and radiates a polarized signal traveling in the left direction in the Y-axis direction. The fourth array antenna 1100b forms a polarized wave in the X-axis direction and radiates a polarized signal traveling in the right direction in the Y-axis direction.

[0090] The third array antenna 1200 operates as a vertically polarized antenna that transmits and receives downward signals. The second array antenna 1300 operates as a horizontally polarized antenna that transmits and receives forward signals. The third array antenna 1200 forms a polarized wave in the X-axis direction and radiates a polarized signal traveling downward in the Z-axis direction. The second array antenna 1300 forms a polarized wave in the Y-axis direction and radiates a polarized signal traveling in the X-axis direction.

[0091] The second antenna module 1000b includes a first array antenna 1100a, a fourth array antenna 1100b, a second array antenna 1300, and a third array antenna 1200.

[0092] The first array antenna 1100a operates as a horizontally polarized antenna that transmits and receives signals in the left direction. The fourth array antenna 1100b operates as a horizontally polarized antenna that transmits and receives signals in the right direction. The first array antenna 1100a forms a polarized wave in the X-axis direction and radiates a polarized signal traveling in the left direction in the Y-axis direction. The fourth array antenna 1100b forms a polarized wave in the X-axis direction and radiates a polarized signal traveling in the right direction in the Y-axis direction.

[0093] The third array antenna 1200 operates as a horizontally polarized antenna that transmits and receives downward signals. The second array antenna 1300 operates as a horizontally polarized antenna that transmits and receives forward signals. The third array antenna 1200 forms a polarized wave in the Y-axis direction and radiates a polarized signal traveling downward in the Z-axis direction. The second array antenna 1300 forms a polarized wave in the Y-axis direction and radiates a polarized signal traveling in the X-axis direction.

[0094] Meanwhile, the antenna module according to the present invention may be arranged in a horizontal arrangement structure. Fig. 5 is a diagram showing a structure in which the antenna module according to the embodiment is arranged in an electronic device and a structure in which it is fastened. Fig. 5(a) is a diagram showing a structure in which the antenna module 1000 is arranged in the lower region of the electronic device 200. Fig. 5(b) is a diagram showing a structure in which the antenna module 1000 is fastened to a support structure such as a heat sink 204.

[0095] As shown in (a) of FIG. 5, the antenna module 1000 is coupled to an end of a heat sink 204 disposed in a space between the first cover 201 and the second cover 202. The antenna module 1000 includes a plurality of surfaces. Of the plurality of surfaces, a first surface S1 is formed so as to face upward of the electronic device 200, and a second surface S2 is formed so as to face the front of the electronic device 200. Of the plurality of surfaces, a third surface S3 is formed so as to face the right side of the electronic device 200, and a fourth surface S4 is formed so as to face downward of the electronic device 200. Of the plurality of surfaces, a fifth surface S5 is formed so as to face the rear of the electronic device 200, and a sixth surface (not shown) is formed so as to face the rear of the electronic device 200.

[0096] The length of the lower end of the first cover 201 to which the antenna module 1000 is coupled is realized to be a predetermined length (for example, 9.8 mm) or less. One end and a rear surface of the antenna module 1000 are coupled to a side region and a rear surface of the first cover 201, so that the antenna module 1000 is arranged parallel to a horizontal plane. The assembly structure or crimping structure is for assembly or crimping downward or upward.

[0097] 5(b), a support structure such as the heat sink 204 includes a first end 204a, a second end 204b, and a third end 204c that are coupled to the antenna module 1000. A first hole 204d and a second hole 204e are formed in the first end 204a and the second end 204b of the heat sink 204, respectively. A region of the antenna module 1000 in which electronic components such as an RFIC chip are disposed is coupled to the third end 204c of the heat sink 204. Thus, heat generated from electronic components such as an RFIC chip is discharged to an external region by the heat sink 204.

[0098] A plurality of holes are formed in a specific area of ​​the antenna module 1000 where no radiator is disposed. A first through hole 1001 and a second through hole 1002 are formed on one side and the other side of the antenna module 1000. A first screw 205a is coupled to a first hole 204d of the heat sink 204 and the first through hole 1001 of the antenna module 1000. A second screw 205b is coupled to a second hole 204e of the heat sink 204 and the second through hole 1002 of the antenna module 1000. As shown in FIG. 5, the antenna module 1000 is coupled to a support structure such as the heat sink 204 by a screw-hole coupling structure.

[0099] An antenna module arranged in an electronic device according to the present invention will now be described. Fig. 6 is a cross-sectional view of a substrate on which the antenna module is formed, and a diagram showing a three-dimensional structure. Fig. 7 is a front view of the substrate on which the antenna module is formed. Fig. 8 is a partial perspective view and a cross-sectional view taken along a specific line of the antenna module in Fig. 7.

[0100] Fig. 6(a) is a cross-sectional view of an antenna module 1000 showing a structure in which multiple array antennas are arranged on a substrate 1010. Fig. 6(b) is a diagram showing a three-dimensional structure of a substrate 1010 having multiple surfaces. Fig. 6(c) is a cross-sectional view of an antenna module 1000 formed of multiple layers in Fig. 6(a).

[0101] 6, the substrate 1010 is formed to include a first surface S1 to a sixth surface S6. An RFIC chip 1400 is disposed on the first surface S1 of the substrate 1010. A first array antenna 1100a is disposed on the second surface S2 of the substrate 1010. A second array antenna 1300 is disposed on the third surface S3 of the substrate 1010. A third array antenna 1200 is disposed on the fourth surface S4 of the substrate 1010. A fourth array antenna 1100b is disposed on the fifth surface S5 of the substrate 1010.

[0102] Fig. 7(a) is a diagram showing a substrate on which the antenna module 1000 is formed divided into regions. Fig. 7(b) is a diagram showing an array antenna arranged in each region of the antenna module 1000. Fig. 7(c) is a diagram showing a structure in which a feed signal is applied to some antenna elements arranged in the array antenna arrangement region.

[0103] 7, the substrate 1010 includes a central portion CR and a periphery PE surrounding the central portion CR. The periphery PE of the substrate 1010 includes a first portion P1 to a fourth portion P4. The first portion P1 constitutes a lower region of the substrate 1010, and the second portion P2 constitutes one side region of the substrate 1010. The third portion P3 constitutes the other side region of the substrate 1010, and the fourth portion P4 constitutes an upper region of the substrate 1010. The antenna module 1000 includes the substrate 1010 and a third array antenna 1200 arranged in the array antenna arrangement region 1010r.

[0104] Fig. 8(a) is a perspective view of one side region based on the center of the antenna module 1000. Fig. 8(b) is a cross-sectional view of the antenna module 1000 taken along line AA'. Fig. 8(c) is a cross-sectional view of the antenna module 1000 taken along line BB'.

[0105] As shown in Figures 6 to 8, a first array antenna 1100a is disposed on a second surface S2 of the substrate 1010. A third array antenna 1200 is disposed on a third surface S3 of the substrate 1010 and in an internal space. A second array antenna 1300 is disposed on a fourth surface S4 of the substrate 1010. The region where the second array antenna 1300 is disposed forms a first ground layer 1100g of a first co-planar waveguide structure.

[0106] A fourth array antenna 1100b is further disposed on the fifth surface S5 of the substrate 1010. The region in which the first array antenna 1100a and the fourth array antenna 1100b are disposed forms a second ground layer 1200g of a second coplanar waveguide structure. The region in which the third array antenna 1200 is disposed forms a third ground layer 1300g of a third coplanar waveguide structure.

[0107] An inner ground wall (GW) 1130-1 formed on the inside of the PCB 1010 acts as a ground for radiation from the patch antennas PA1 to PA12 and CP1 to CP12. The ground wall (GW) 1130 functions as a reflector to suppress side radiation from the patch antennas PA1 to PA12 and CP1 to CP12. In addition, an outer ground wall (GW) 1130-2 formed on the outer surface of the PCB 1010 suppresses radiation to the opposing side of the dipole antennas DA21 to DA23 with a side radiation structure, and functions as a reflector in that direction. The ground wall (GW) 1130 suppresses rear radiation from the dipole antennas DA1 to DA14 with a front radiation structure, and functions as a reflector in the forward direction.

[0108] The ground wall (GW) 1130 is formed on the side of the antenna module 1000 by a plurality of vias connecting ground layers formed in a plurality of layers. The ground wall (GW) 1130 includes horizontal ground walls GH1, GH2 and vertical ground walls GV1 to GV4. The first and second patch antennas are disposed in a space formed by the horizontal ground walls GH1, GH2, the vertical ground walls GV1, GV2, and the ground layers inside the PCB.

[0109] An antenna module 1000 according to the present invention will be described with reference to Figures 5 to 8. The antenna module 1000 comprises a substrate 1010, first to fourth array antennas 1100a, 1300, 1200, 1100b, and an RFIC 1400 which is a millimeter wave transmitting and receiving circuit.

[0110] The substrate 1010 includes a first surface S1, a fourth surface S4, and a periphery PE. The periphery PE is formed between the first surface S1 and the fourth surface S4. The first surface S1 is formed on the opposite side to the fourth surface S4. A ground area and an array antenna arrangement area 1010r are formed on the fourth surface S4. The substrate 1010 is realized as a multi-layer substrate. For example, the substrate 1010 is realized as a 12-layer substrate, but is not limited thereto and may be changed depending on the application.

[0111] The fourth surface S4 of the substrate 1010 is divided into a central portion CR, a first portion P1, a second portion P2, a third portion P3, and a fourth portion P4. The second portion P2 is formed on the left side of the first portion P1, and the third portion P3 is formed on the right side. An array antenna arrangement region 1010r is formed in the central portion CR, which is inside the ground region of the first portion P1 and the fourth portion P4. A ground region is arranged in the second portion P2, and a first through hole 1001 is arranged inside the ground region. A ground region is arranged in the third portion P3, and a second through hole 1002 is arranged inside the ground region. Screws are inserted into the first through hole 1001 of the second portion P2 and the second through hole 1002 of the third portion P3, and the antenna module 1000 is fastened to a support structure such as a heat sink inside the electronic device.

[0112] A first array antenna 1100a is formed in the outer peripheral surface PE region of the second portion P2. A fourth array antenna 1100b is formed in the outer peripheral surface PE region of the third portion P3. The first array antenna 1100a and the fourth array antenna 1100b form a beam pattern in the side region of the electronic device. The first array antenna 1100a and the fourth array antenna 1100b radiate a horizontally polarized signal to the side region of the electronic device.

[0113] The first array antenna 1100a includes a plurality of dipole antennas DA21 to DA23. The fourth array antenna 1100b includes a plurality of dipole antennas DA24 to DA26. The first array antenna 1100a and the fourth array antenna 1100b are realized by three antenna elements on one side and the other side of the peripheral portion PE of the substrate 1010. The first array antenna 1100a is realized by a 1×3 array antenna on one side of the substrate 1010, but is not limited thereto. The fourth array antenna 1100b is realized by a 1×3 array antenna on the other side of the substrate 1010, but is not limited thereto.

[0114] A third array antenna 1200 is formed on the fourth surface S4 of the substrate 1010. The third array antenna 1200 forms a beam pattern in the lower region of the electronic device. The third array antenna 1200 radiates a horizontally polarized signal to the lower region of the electronic device. The third array antenna 1200 is realized by 12 antenna elements in the center CR of the substrate 1010.

[0115] The third array antenna 1200 includes a plurality of patch antennas PA1 to PA12 formed on the fourth surface S4 of the substrate 1010. The third array antenna 1200 is realized by twelve 1×12 array antennas in the center CR of the substrate 1010, but is not limited to this.

[0116] Each patch antenna of the third array antenna 1200 includes a first patch element 1220 and a second patch element 1210. The second patch element 1210 is stacked on the first patch element 1220 in the Z-axis direction, which is the height direction, so that the signal of the first patch element 1220 is coupled. The center of the second patch antenna 1210 is offset from the center of the first patch antenna 1220 in the Y-axis direction, which is the horizontal axis.

[0117] The second patch antennas 1210 in the first, third, fifth, seventh, ninth, and eleventh columns are arranged offset to the right side in the Y-axis direction with respect to the first patch antenna 1220. The second patch antennas 1210 in the second, fourth, sixth, eighth, tenth, and twelfth columns are arranged offset to the left side in the Y-axis direction with respect to the first patch antenna 1220. Thus, the second patch antennas 1210 are arranged offset alternately in different directions with respect to the first patch antenna 1220.

[0118] The current direction of the signal applied to the second patch antenna 1210 in the first region is formed in the direction from right to left. The current direction of the signal applied to the second patch antenna 1210 in the first, third, fifth, seventh, ninth, and eleventh rows is formed in the direction from right to left. The current direction of the signal applied to the second patch antenna 1210 in the second region is formed in the direction from right to left. The current direction of the signal applied to the second patch antenna 1210 in the second, fourth, sixth, eighth, tenth, and twelfth rows is formed in the direction from left to right. Therefore, the current direction of the signal applied to the second patch antenna 1210 arranged alternately offset in different directions and the corresponding first patch antenna 1220 is opposite. Therefore, it is necessary to make the phase difference of the signal applied to the second patch antenna 1210 arranged alternately offset to 180 degrees so that the current in the same direction is formed. To achieve this, the RFIC 1400 controls a phase shifter so that the phase difference between the signals applied to the second patch antennas 1210 arranged with an offset from one another becomes 180 degrees.

[0119] A first feed signal FS1 is applied to the coupling patch CP1, which is the second patch antenna 1210 in the first row. A second feed signal FS2 is applied to the coupling patch CP2, which is the second patch antenna 1210 in the second row. If the first feed signal FS1 and the second feed signal FS2 are in-phase signals, the directions of the electric fields formed in the coupling patches CP1 and CP2 will be opposite. If the electric fields generated by the coupling patches CP1 and CP2 are formed to be in the same direction, a directional beam is formed. To achieve this, the first feed signal FS1 and the second feed signal FS2 need to be formed so that the phase difference between them is 180 degrees.

[0120] Similarly, a seventh feed signal FS7 is applied to the coupling patch CP7, which is the second patch antenna 1210 in the seventh row. An eighth feed signal FS8 is applied to the coupling patch CP8, which is the second patch antenna 1210 in the eighth row. If the seventh feed signal FS7 and the eighth feed signal FS8 are in-phase signals, the directions of the electric fields formed in the coupling patches CP7 and CP8 are opposite to each other. If the electric fields formed by the coupling patches CP7 and CP8 are in the same direction, a directional beam is formed. To achieve this, the seventh feed signal FS7 and the eighth feed signal FS8 need to be formed so that the phase difference between them is 180 degrees.

[0121] Therefore, the phases of the first feed signal FS1, the third feed signal FS3, the fifth feed signal FS5, and the seventh feed signal FS7 applied to the coupling patches CP1, CP3, CP5, and CP7 of the second patch antennas 1210 in the first, third, fifth, and seventh rows have a first phase value, while the phases of the second feed signal FS2, the fourth feed signal FS4, the sixth feed signal FS6, and the eighth feed signal FS8 applied to the coupling patches CP2, CP4, CP6, and CP8 of the second patch antennas 1210 in the second, fourth, sixth, and eighth rows have a second phase value that is 180 degrees out of phase with the first phase value.

[0122] A second array antenna 1300 is formed in a first portion P1 of the peripheral portion PE of the substrate 1010. The second array antenna 1300 forms a beam pattern in a front area of ​​the electronic device. The second array antenna 1300 radiates a horizontally polarized signal to the front area of ​​the electronic device.

[0123] The second array antenna 1300 includes a plurality of dipole antennas DA1 to DA14 formed in a first portion P1 of the peripheral portion PE of the substrate 1010. The second array antenna 1300 is realized by 14 antenna elements below the peripheral portion PE of the substrate 1010. The second array antenna 1300 is realized by 14 1×14 array antennas below the peripheral portion PE of the substrate 1010, but is not limited thereto.

[0124] The RFIC 1400 is configured to transmit and receive signals at frequencies between 10 GHz and 400 GHz using at least one of the first array antenna 1100a, the fourth array antenna 1100b, the third array antenna 1200, and the second array antenna 1300. The RFIC 1400 is configured to transmit and receive signals at frequencies between 10 GHz and 400 GHz using at least one of the multiple dipole antennas DA21 to DA26, the multiple patch antennas PA1 to PA12, and the multiple dipole antennas DA1 to DA14. The RFIC 1400 is also called an RFIC (Radio Frequency Integrated Chip).

[0125] The number of elements of the second array antenna 1300 forming a beam pattern in the front region is set to be greater than the number of elements of the third array antenna 1200 forming a beam pattern in the lower region. The number of elements of the third array antenna 1200 forming a beam pattern in the lower region is set to be greater than the numbers of the first array antenna 1100a and the fourth array antenna 1100b forming beam patterns in the side regions.

[0126] Of the 32 pins of the RFIC 1400, 12 pins are connected to the third array antenna 1200 that forms a beam pattern in the lower region. Of the 32 pins of the RFIC 1400, 14 pins are connected to the second array antenna 1300 that forms a beam pattern in the front region. Of the 32 pins of the RFIC 1400, 6 pins are connected to the first array antenna 1100a and the fourth array antenna 1100b that form beam patterns in the side regions.

[0127] Since the second array antenna 1300 has the largest number of elements, it can transmit signals far into the front area of ​​the electronic device, but its beam coverage is narrow. The narrow beam coverage can be compensated for by changing the beam direction through beamforming in the horizontal direction of the front area. The second array antenna 1300 has multiple elements in the Y-axis direction and one element in the Z-axis direction. For example, the second array antenna 1300 is realized as a 1×14 array antenna.

[0128] The electronic device needs to perform wireless communication with other electronic devices arranged in the lower region. For wireless communication, beamforming is realized in the lower region of the electronic device in narrow beam coverage units in the horizontal direction, which is the Y-axis direction. On the other hand, the lower region of the electronic device does not need to transmit signals farther than the front region. The number of elements of the third array antenna 1200 is realized as multiple elements in one axis direction and one element in the other axis direction. For example, the third array antenna 1200 is realized as a 1×8, 1×10, or 1×12 array antenna.

[0129] In an indoor radio wave environment where an electronic device is placed, a signal may be transmitted to the side area of ​​the electronic device. In the side area of ​​the electronic device, it is more important to realize a wide beam coverage without beamforming than to transmit a signal far away. Since the first array antenna 1100a and the fourth array antenna 1100b have the smallest number of elements, they can provide a wide beam coverage to the side area of ​​the electronic device. Therefore, the number of elements of the first array antenna 1100a and the fourth array antenna 1100b is realized as multiple elements in one axis direction and one element in the other axis direction. For example, the first array antenna 1100a and the fourth array antenna 1100b are realized as 1×3 array antennas on one side and the other side.

[0130] Meanwhile, the patch antennas of the third array antenna 1300 according to the present invention are stacked so that some regions overlap each other. Fig. 9a is a side view of a part of an antenna module formed by the patch antennas of the overlapping structure of Fig. 8. Fig. 9b is a diagram showing the size and separation distance of radiators arranged on different layers in the side view of the antenna module of Fig. 9a, and the separation distance between the radiators and the ground wall.

[0131] As shown in Figs. 7 to 9a, the array antenna arrangement region 1010r forms a first vertical region VR1 including a plurality of layers. A first patch antenna 1220 and a second patch antenna 1210 are arranged in the first vertical region VR1. The second patch antenna 1210 is connected to a fourth portion SL4 of the signal connection lines SL1 to SL4. The second patch antenna 1210 is arranged offset from the first patch antenna 1220 to one or the other side in the Y-axis direction so that a signal transmitted to the second patch antenna 1210 is coupled to the first patch antenna 1220.

[0132] As shown in FIG. 7 to FIG. 9b, the second patch antenna 1210 is formed with a length of d=2*R2 in one axis direction. The distance b from one end of the second patch antenna 1210 to a point where the signal connection lines are connected to the fourth portion SL4 is formed to have a value of b=R2. The power feed connection area of ​​the second patch antenna 1210 is offset from the center of the second patch antenna 1210 in one axis direction and formed at the center point in the other axis direction. The distance g from the power feed connection area of ​​the second patch antenna 1210 to the horizontal ground wall GH2 is formed to be a predetermined interval or more so that the characteristic change at each operating frequency is below a threshold value. The distance g' from the other end of the second patch antenna 1210 to the vertical ground wall GV3 is formed to be a predetermined interval or more so that the characteristic change at each operating frequency is below a threshold value.

[0133] With reference to Figs. 7 to 9b, an antenna module 1000 including multiple layers according to the present invention will be described. In the antenna module 1000 disclosed in the present invention, the fourth portion SL4 connected to the second patch antenna 1210 is disposed in the dielectric region. In this case, the signal via corresponding to the fourth portion SL4 is disposed in the dielectric region so as not to be electrically connected to the ground region of the fourth lower conductive layer 1144. Note that a slot region SR1 is formed in the ground region of the fourth lower conductive layer 1144.

[0134] The antenna module 1000 includes at least one lower conductive layer below the fourth lower conductive layer 1144. The antenna module 1000 includes the fourth lower conductive layer 1144 and a third lower conductive layer 1143 disposed below the fourth lower conductive layer 1144. The third lower conductive layer 1143 is disposed in the same layer as the third portion SL3, separated by a predetermined distance from one end and the other end of the third portion SL3. Thus, the multiple lower conductive layers 1140 include the third lower conductive layer 1143 and the fourth lower conductive layer 1144.

[0135] Meanwhile, one end of the third portion SL3 and one end of the third lower conductive layer 1143 are located at an inner point of the lower region of the second patch antenna 1210. Note that the region where the conductive layer is removed between one end of the third portion SL3 and one end of the third lower conductive layer 1143 is also referred to as a second slot region SR2. The third lower conductive layer 1143 is electrically connected to the ground region of the fourth lower conductive layer 1144 and is realized by a ground layer. Alternatively, the third lower conductive layer 1143 may be electrically separated from the ground region of the fourth lower conductive layer 1144 and is realized by a signal line.

[0136] Meanwhile, the antenna module 1000 further includes a second lower conductive layer 1142 disposed below the third portion SL3 of the power supply line. The ground region of the fourth lower conductive layer 1144 above the third lower conductive layer 1143 is also referred to as the third lower conductive layer. Thus, the multiple lower conductive layers 1140 may be composed of the first lower conductive layer 1141, the second lower conductive layer 1142, and the third lower conductive layer 1143.

[0137] The second lower conductive layer 1142 includes a third slot region SR3 where the conductive layer is removed in a region corresponding to the lower region of the second patch antenna 1210. The length of the third slot region SR3 on one axis is formed to be longer than the length of the pads of the fourth portion SL4, which are signal vias, on one axis. Thus, the third slot region SR3 where the conductive layer is removed is formed in the second ground layer GND2 at the lower stage at the point where the fourth portion SL4 connected to the second patch antenna 1210 is connected to the third portion SL3.

[0138] The area where the conductive layer is removed, such as the slot areas SR1 to SR3, is also called an open space. The open space such as the slot areas SR1 to SR3 allows the resonant frequency of the antenna to be lowered to a low frequency band without increasing the size of the patch antenna. Thus, by removing a portion of the ground area, the overall height of the antenna is increased, enabling wideband operation.

[0139] Also, the multiple lower conductive layers 1140 may be composed of a first lower conductive layer 1141, a second lower conductive layer 1142, a third lower conductive layer 1143, and a fourth lower conductive layer 1144. The first lower conductive layer 1141 is disposed adjacent to the pad of the second portion SL2 so as to cover the lower area of ​​the area where the second patch antenna 1210 is disposed. The first lower conductive layer 1141 is realized as a ground layer. Alternatively, depending on the application, the first lower conductive layer 1141 may be realized as a floating conductive layer without being electrically connected to the ground layer. The first lower conductive layer 1141 may be realized as a separated multiple conductive layers, some of which act as ground layers and the rest of which act as floating conductive layers.

[0140] Meanwhile, the antenna module 1000 further includes vertical ground walls 1131-1134 composed of a plurality of pads above the ground region of the fourth lower conductive layer 1144. The first patch antenna 1220 and the second patch antenna 1210 are stacked so as to partially overlap in the space between the vertical ground walls 1131 and 1132.

[0141] The patch antenna, which is laminated to have an overlapping region on another layer of the antenna module 1000 according to the present invention, is disposed in a space formed by the ground wall 1130. As shown in Figs. 7 to 9b, the ground wall 1130 is formed along the side region of the substrate 1010 realized by multiple layers. The ground wall 1130 is composed of conductive pads disposed on multiple layers and vias connecting the conductive pads. The ground wall 1130 including the conductive pads and vias is also called a ground via wall.

[0142] The ground wall 1130 includes a first ground wall 1131 formed along one side region of the first vertical region VR1 and a second ground wall 1132 formed along the other side region. The ground wall 1130 further includes a third ground wall 1133 formed along one side region of the second vertical region VR2 and a fourth ground wall 1134 formed along one side of the third vertical region VR3.

[0143] The ground wall 1130 is arranged on the edge of the substrate 1010 and on the edge of the array antenna arrangement region 1010r with the first patch antenna 1220 at the center. The ground wall 1130 is arranged on at least one of the four surfaces of the upper, lower, left and right regions with the first patch antenna 1220 at the center. The ground wall 1130 is connected to a ground layer to improve the antenna gain. Alternatively, the ground wall 1130 may be configured as a floating conductor wall composed only of via pads without using a vertical connection portion.

[0144] 10 is a diagram showing a via wall formation structure according to an embodiment. As shown in FIG. 10, the via wall is configured to form a signal connection line or to connect a ground plane. The via pads VP1 to VPn in the form of copper foil may be arranged on all layers of the substrate 1010, or may be arranged on only some layers.

[0145] As shown in (a) and (b) of Fig. 10, the ground wall includes vertical connection portions VC1, VC2 to VCn-1 and a plurality of via pads VP1, VP2 to VPn-1. As shown in (a) of Fig. 10, adjacent pads among the plurality of pads VP1, VP2 to VPn-1 are connected to each other by one of the vertical connection portions VC1, VC2 to VCn-1. On the other hand, as shown in (b) of Fig. 10, at least one adjacent pad among the plurality of pads VP1, VP2 to VPn-1 of the ground wall 1130 may be configured not to be connected by a vertical connection portion.

[0146] For example, the first pad VP1 and the second pad VP2 may be configured to be coupled without using a vertical connection part, and the remaining pads may be connected by the vertical connection parts VP2 to VPn-1. However, the present invention is not limited to these structures, and each layer may be configured to be connected or not connected. In addition, when the signal line is disposed in an area adjacent to the via wall, the via wall may be configured to be coupled without using a vertical connection part. On the other hand, without using a vertical connection part, the multiple conductive layers may be configured to form an EBG (electronic band gap) structure without being electrically connected to the ground layer during coupling. This can reduce mutual interference due to adjacent radiators or signal lines, or prevent deformation due to pressure or heat applied to the substrate 1010.

[0147] On the other hand, as shown in Fig. 10(c), the pads VP1, VP2 to VPn-1 of the ground wall 1130 may be configured to be coupled without using a vertical connection part. Therefore, the vertical ground walls GV1 to GV5 in Fig. 7 to Fig. 9b are realized by any of the structures of the ground walls in Fig. 10(a) to (c).

[0148] The layout structure of each layer of the antenna module according to the present invention will be described below. Fig. 11a and Fig. 11b are front views showing each layer of the antenna module of Fig. 8. Fig. 12a is a diagram showing the first and third layers of the antenna module of Fig. 8. Fig. 12b is a diagram showing the first and fifth layers of the antenna module of Fig. 8. Fig. 12c is a diagram showing the first and seventh layers of the antenna module of Fig. 8.

[0149] Each layer of the antenna module 1000 will be described in detail with reference to Fig. 6 to Fig. 12c. The antenna module 1000 is configured by laminating a first layer La1 on which the transceiver circuit 1400 is arranged to a fifth layer La5 on which a feeder line for the second array antenna 1300 is arranged, and a sixth layer La6. The antenna module 1000 further includes a seventh layer La7 on which a feeder line for the third array antenna 1200 is arranged to a twelfth layer La12 on which antenna elements of the third array antenna 1200 are arranged.

[0150] The transmitter / receiver circuit 1400 is disposed on the first layer La1, and the transmitter / receiver circuit 1400 has a plurality of pins, and signal connection lines are formed to connect to the plurality of pins. The transmitter / receiver circuit 1400 is disposed around the center line of the first layer La1 in one axial direction.

[0151] The second layer La2 is formed with a metal layer and is configured as a first ground layer GND1 for the first layer La1. The dipole antennas DA21-DA26 of the first array antenna 1100a and the fourth array antenna 1100b are arranged in one and other side regions of the third layer La3. Ends of the first feed lines Fa1-Fa6 of the dipole antennas DA21-DA26 are connected to the signal connection lines of the first layer La1 by the first vias Va1-Va6. Each of the first feed lines Fa1-Fa6 forms a first ground part GP1 by the ground patterns GL and GR in which vias are formed on one and other sides. Thus, the first feed lines Fa1-Fa6 are formed into a co-planar waveguide structure.

[0152] The fourth layer La4 is formed with a metal layer and is configured as a ground layer GND2 for the third layer La3. The first power supply line of the third layer La3 is disposed between the ground layer of the second layer La2 and the ground layer of the fourth layer La4. Therefore, the first power supply line of the third layer La3 is formed into a first coplanar waveguide structure in which ground layers are formed on the upper and lower layers in the height direction. The metal layers of the ground layer of the second layer La2 and the ground layer of the fourth layer La4 are partially removed so that the first vias are vertically connected.

[0153] In the XY plane, dipole antennas DA1 to DA14 of the second array antenna 1300 are arranged in the lower region of the fifth layer La5. Ends of second feed lines of the dipole antennas DA1 to DA14 are connected to the lines of the first layer La1 by second vias Vb1 to Vb14.

[0154] The sixth layer La6 is formed with a metal layer and is configured as a ground layer GND3 for the fifth layer La5. The second feed line of the fifth layer La5 is disposed between the ground layer of the fourth layer La4 and the ground layer of the sixth layer La6. Therefore, the second feed line of the fifth layer La5 is formed in a second coplanar waveguide structure in which ground layers are formed on the upper and lower layers in the height direction. Part of the metal layer of the ground layer of the fourth layer La4 and the ground layer of the sixth layer La6 is removed so that the first and second vias are vertically connected.

[0155] The seventh layer La7 is provided with third feed lines for the second patch antennas CP1 to CP12 of the third array antenna 1200. The distances between one end and the other end of the third feed lines are formed to be the same. The third feed lines are electrically connected to the lines of the first layer La1 by third vias Vc1 to Vc12 formed at one end of the third feed lines.

[0156] The eighth layer La8 is formed with a metal layer and is configured as the fourth ground layer GND4. The third feeder line of the seventh layer La7 is disposed between the ground layer of the sixth layer La6 and the ground layer of the eighth layer La8. Thus, the third feeder line of the seventh layer La7 is formed into a third coplanar waveguide structure in which ground layers are formed on the upper and lower layers in the height direction. The metal layers provided on the ground layer of the sixth layer La6 and the ground layer of the eighth layer La8 are partially removed so that the second and third vias are vertically connected.

[0157] As described above, the second layer La2, the fourth layer La4, the sixth layer La6, and the eighth layer La8 respectively constitute the first ground layer GND1 to the fourth ground layer GND4. The ground layers are electrically connected to each other by connection vias that connect the ground layers. The substrate 1010 includes the first ground layer GND1 for the transceiver circuit 1400 to the fourth ground layer GND4 for the third array antenna 1200. The first array antenna 1100a and the fourth array antenna 1100b are arranged with antennas and signal lines on the layer between the first ground layer GND1 and the second ground layer GND2.

[0158] The third array antenna 1200 is disposed on the fourth ground layer GND4 with its antennas and signal lines. The second array antenna 1300 is disposed between the metal layer which is the ground layer of the fourth layer La4 and the metal layer which is the ground layer of the sixth layer La6 with its antennas and signal lines. Thus, the first array antenna 1100a and the fourth array antenna 1100b, and the third array antenna 1200 and the second array antenna 1300 have their respective signal lines isolated from each other by the second ground layer GND2 to the fourth ground layer GND4. Thus, the second ground layer GND2 to the fourth ground layer GND4 reduce mutual interference occurring between the signal lines of the array antennas which are isolated from each other.

[0159] In the RFIC 1400, the length of the feeder of the third array antenna 1200 is configured to be the same for all antenna elements. The length of the feeder of the third array antenna 1200 is determined by the sum of the first length L1a to the fourth length L4a. The lengths of the feeders for all second patch antennas CP1 to CP12 of the third array antenna 1200 are all configured to be the same. The first length L1a to the fourth length L4a are configured to be the same for all second patch antennas CP1 to CP12, respectively. Therefore, the signals applied from the RFIC 1400 to all second patch antennas CP1 to CP12 have the same phase, and a beam is formed at the center point.

[0160] The third vias Vc1 to Vc12 are formed so as to be vertically connected from the first layer La1 to the seventh layer La7. The eighth layer La8 to the twelfth layer La12 are formed with a ground region made of a metal layer, and an array antenna arrangement region 1010r which is a first dielectric region where the metal layer has been removed. The tenth layer La10 is formed with coupling patches CP1 to CP12 which are connected to the ends of the third vias Vc1 to Vc12. The coupling patches CP1 to CP12 are also called feeding plates.

[0161] The ground regions made of metal layers formed on the first layer La1 to the twelfth layer La12 are connected by a plurality of vias. On the tenth layer La10, coupling patches CP1 to CP12 of the third array antenna are arranged.

[0162] The first patch antennas PA1-PA12 of the third array antenna 1200 are arranged on a twelfth layer La12. Adjacent antennas among the first patch antennas PA1-PA12 are arranged at equal intervals. The centers of the second patch antennas CP1-CP12 are offset in the Y-axis direction, which is the horizontal axis, from the centers of the first patch antennas PA1-PA12.

[0163] Hereinafter, the dipole antenna arrangement structure of an antenna module 1000 realized in a multi-layered antenna package according to the present invention will be described with reference to the drawings. Fig. 13a and Fig. 13b are a front perspective view and a side view of an antenna module realized in a multi-layered antenna package.

[0164] As shown in Figures 13a and 13b, the antenna module 1000 includes a first ground plane 1011, a second ground plane 1012, a signal line 1020, and a dipole antenna. The dipole antenna constitutes a first array antenna 1100a including dipole antennas DA21 to DA23 in Figures 7 and 12a, or a fourth array antenna 1100b. The dipole antenna constitutes a second array antenna 1300 including dipole antennas DA1 to DA14 in Figures 7 and 12b.

[0165] With reference to FIG. 7, FIG. 11a, FIG. 12a, and FIG. 13b, an antenna module 1000 arranged on multiple layers realized by a dipole antenna will be described. As described above, the antenna module 1000 is composed of a first ground plane 1011, a second ground plane 1012, a signal line 1020, and a dipole antenna. The first ground plane 1011 is arranged on the same plane as the signal line 1020. The second ground plane 1012 is arranged on a different plane from the signal line 1020. In the dipole antenna constituting the first array antenna 1100a, the second ground plane 1012 is arranged on a first layer La1. In the dipole antenna constituting the first array antenna 1100a, the first ground plane 1011 and the signal line 1120 are arranged on a third layer La3.

[0166] The antenna module 1000 is composed of a ground wall (GW) 1130 and a dielectric region 1010d. A first via (V1a) is arranged adjacent to an end of the ground wall 1130 adjacent to the dielectric region 1010d. The inside of the ground wall 1130 forms a transmission line section 1020r1. Inside the ground wall (GW) 1130, vias are arranged in the ground region on both sides of the signal line 1020. Thus, the signal line 1020 inside the ground wall (GW) 1130 is formed into a coplanar waveguide structure with a symmetrical structure.

[0167] Meanwhile, in the first region of the dielectric region 1010d, the second via V2a is arranged only in the ground region 1011a on one side of the signal line 1020. Thus, in the first region of the dielectric region 1010d, the signal line 1020 is formed into a coplanar waveguide structure having an asymmetrical structure. The first region of the dielectric region adjacent to the ground wall 1130 forms an E-field transition section 1020r2.

[0168] A second region of the dielectric region 1010d forms a radiator section 1030r3. The first array antenna 1100a or the second array antenna 1300 realized by a dipole antenna is disposed in the radiator section 1030r3.

[0169] In the radiator section 1030r3, the region where the electric field strength is strongest is the horizontal direction, which is parallel to the substrate. The dipole antenna in the radiator section 1030r3 is formed to have horizontal polarization characteristics. In the coplanar waveguide structure inside the ground wall (GW) 1130, the region where the electric field strength is strongest is the vertical direction, which is perpendicular to the substrate. Therefore, it is necessary to partially change the transmission line configuration in the electric field transition section 1020r2 so that a transition occurs between the vertical electric field component of the transmission line and the horizontal electric field component of the antenna. For this purpose, in the first region of the dielectric region 1010d, the second via V2a is arranged only in the ground region 1011a on one side of the signal line 1020.

[0170] Hereinafter, the patch antenna arrangement structure of the antenna module 1000 realized by the multi-layered antenna package according to the present invention will be described with reference to the drawings. Fig. 14a is a diagram showing the tenth and twelfth layers on which the patch antennas of the antenna module of Fig. 8 are stacked. Fig. 14b is a diagram showing the overlapping arrangement structure of the patch antennas arranged in the array antenna arrangement area of ​​the antenna module of Fig. 8.

[0171] As shown in Fig. 14a, the first patch antennas PA1 to PA12 are spaced apart from each other by the same distance, which is the third interval G3. The first patch antennas PA1 to PA12 are spaced apart from each other by the same distance, which is the third interval G3 on the Y axis. On the other hand, the second patch antennas CP1 to CP12 are spaced apart from each other by the first interval G1 or the second interval G2 on the Y axis. The length of the first interval G1 is shorter than the length of the third interval G3. The length of the second interval G2 is longer than the length of the third interval G3.

[0172] As shown in FIG. 14b, the first patch antenna 1220 and the second patch antenna 1210 are arranged on a first horizontal axis Hy1 which is the center of the array antenna arrangement area 1010r.

[0173] The centers of the patch antennas of the first group of the first patch antenna 1220 are aligned in the direction of the first vertical axis Vx1. The centers of the patch antennas of the first group of the second patch antenna 1210 are aligned in the direction of the second vertical axis Vx2. The second vertical axis Vx2 is spaced apart from the first vertical axis Vx1 in parallel in the positive Y-axis direction.

[0174] The centers of the patch antennas of the second group of the first patch antenna 1220 are aligned in the direction of the third vertical axis Vx3. The centers of the patch antennas of the second group of the second patch antenna 1210 are aligned in the direction of the fourth vertical axis Vx4. The fourth vertical axis Vx4 is spaced apart from the third vertical axis Vx3 in parallel in the negative Y-axis direction.

[0175] The first patch antenna 1220 is a circular patch antenna having a first diameter R1. The second patch antenna 1210 is a circular patch antenna having a second diameter R2 smaller than the first diameter R1. The first patch antenna 1220 and the second patch antenna 1210 are arranged to have an overlapping region Ro in the horizontal axis direction. The length of the overlapping region Ro between the first patch antenna 1210 and the second patch antenna 1220 is smaller than the radius R2 of the second patch antenna 1210.

[0176] When the second patch antenna 1210 is connected to the connection regions CR2 and CR3 through a power feed via at an offset point, for example, at the right / left point, the polarization of the electromagnetic wave radiated from the second patch antenna 1210 is formed in the left-right direction. The connection regions CR2 and CR3 are formed at points offset by a predetermined distance from the center point of the second patch antenna 1210.

[0177] The current distribution in the adjacent regions centered on the connection regions CR2 and CR3 is higher than the current distribution in the peripheral regions. In this manner, the mode formed in the second patch antenna 1210 in which the current distribution is formed in the left-right direction is the TE11 mode.

[0178] Connection regions CR2 and CR3 are formed in the second patch antenna 1210 in the direction away from the center of the second patch antenna 1210 in the Y-axis direction. Therefore, the current generated from the second patch antenna 1210 is formed in the left-right direction, resulting in a dominant current distribution. Therefore, the antenna element including the first patch antenna 1210 and the second patch antenna 1220 operates like a TE11 mode. Therefore, the radiation performance of the main polarization (co-polarization) in the left-right direction is improved, instead of the cross-polarization component in the up-down direction, and the antenna gain performance is improved.

[0179] The TE11 mode attenuates and essentially eliminates the vertical current components. This improves the radiation performance of the main polarization, which corresponds to the horizontal polarization, and increases the antenna gain. In addition, the cross-polarized components are reduced, which is expected to improve data throughput performance through improved MIMO performance.

[0180] Meanwhile, in the antenna module realized by the multi-layer package according to the present invention, the third array antenna arranged at the center of the PCB may be realized with vertical polarization instead of horizontal polarization. Fig. 15 shows a cross-sectional view and a three-dimensional structure of the substrate on which the antenna module is formed. Fig. 16 shows a partial perspective view and a cross-sectional view along a specific line of the antenna module of Fig. 15.

[0181] Fig. 15(a) is a diagram showing a substrate on which the antenna module 1000 is formed divided into regions. Fig. 15(b) is a diagram showing an array antenna arranged in each region of the antenna module 1000. Fig. 15(c) is a diagram showing a structure in which a feed signal is applied to some antenna elements arranged in the array antenna arrangement region.

[0182] 15, the substrate 1010 includes a central portion CR and a periphery PE surrounding the central portion CR. The periphery PE of the substrate 1010 includes a first portion P1 to a fourth portion P4. The first portion P1 constitutes a lower region of the substrate 1010, and the second portion P2 constitutes one side region of the substrate 1010. The third portion P3 constitutes the other side region of the substrate 1010, and the fourth portion P4 constitutes an upper region of the substrate 1010. The antenna module 1000 includes the substrate 1010 and a third array antenna 1200 arranged in the array antenna arrangement region 1010r.

[0183] Fig. 16(a) is a perspective view of one side region based on the center of the antenna module 1000. Fig. 16(b) is a cross-sectional view of the antenna module 1000 taken along line AA'. Fig. 16(c) is a cross-sectional view of the antenna module 1000 taken along line BB'.

[0184] 6, 15 and 16, a first array antenna 1100a is disposed on a second surface S2 of the substrate 1010. A third array antenna 1200 is disposed on a third surface S3 of the substrate 1010 and in an internal space. A second array antenna 1300 is disposed on a fourth surface S4 of the substrate 1010. The region where the second array antenna 1300 is disposed forms a first ground layer 1100g of a first co-planar waveguide structure.

[0185] A fourth array antenna 1100b is further disposed on the fifth surface S5 of the substrate 1010. The region in which the first array antenna 1100a and the fourth array antenna 1100b are disposed forms a second ground layer 1200g of a second coplanar waveguide structure. The region in which the third array antenna 1200 is disposed forms a third ground layer 1300g of a third coplanar waveguide structure.

[0186] An inner ground wall (GW) 1130-1 formed on the inside of the PCB 1010 acts as a ground for radiation from the patch antennas PA1 to PA12 and CP1 to CP12. The ground wall (GW) 1130 functions as a reflector to suppress side radiation from the patch antennas PA1 to PA12 and CP1 to CP12. In addition, an outer ground wall (GW) 1130-2 formed on the outer surface of the PCB 1010 suppresses radiation to the opposing side of the dipole antennas DA21 to DA23 with a side radiation structure, and functions as a reflector in that direction. The ground wall (GW) 1130 suppresses rear radiation from the dipole antennas DA1 to DA14 with a front radiation structure, and functions as a reflector in the forward direction.

[0187] The ground wall (GW) 1130 is formed on the side of the antenna module 1000 by a plurality of vias connecting ground layers formed in a plurality of layers. The ground wall (GW) 1130 includes horizontal ground walls GH1, GH2 and vertical ground walls GV1 to GV4. The first and second patch antennas are disposed in a space formed by the horizontal ground walls GH1, GH2, the vertical ground walls GV1, GV2, and the ground layers inside the PCB.

[0188] The distance between the ground wall (GW) 1130 and the dummy patterns DP1 and DP2, and the size of each of them are realized within a predetermined range based on a half wavelength period of 60 GHz, which is the operating frequency. Here, the distances Dy1 and Dx1 between the ground wall (GW) 1130 and the dummy pattern DP1 are defined as the distance from the dummy pattern DP1 to the upper end of the ground wall (GW) 1130 on the horizontal axis and the vertical axis. The distances Dy2 and Dx2 between the ground wall (GW) 1130 and the dummy pattern DP2 are defined as the distance from the dummy pattern DP1 to the lower end of the ground wall (GW) 1130 on the horizontal axis and the vertical axis. The distance Dpy between the dummy patterns DP1 and DP2 adjacent to each other in the horizontal axis direction is realized within a predetermined range based on a half wavelength period of 60 GHz. The layer position and size of the second patch antenna 1210, which is a coupling patch, and the overlapping area with the first patch antenna 1220 are designed taking into consideration the radiation characteristics and arrangement characteristics.

[0189] An antenna module 1000 according to the present invention will be described with reference to Figures 6, 15 and 16. The antenna module 1000 comprises a substrate 1010, first to fourth array antennas 1100a, 1300, 1200, 1100b, and an RFIC 1400 which is a millimeter wave transmitting and receiving circuit.

[0190] The substrate 1010 includes a first surface S1, a fourth surface S4, and a periphery PE. The periphery PE is formed between the first surface S1 and the fourth surface S4. The first surface S1 is formed on the opposite side to the fourth surface S4. A ground area and an array antenna arrangement area 1010r are formed on the fourth surface S4. The substrate 1010 is realized as a multi-layer substrate. For example, the substrate 1010 is realized as a 12-layer substrate, but is not limited thereto and may be changed depending on the application.

[0191] The fourth surface S4 of the substrate 1010 is divided into a central portion CR, a first portion P1, a second portion P2, a third portion P3, and a fourth portion P4. The second portion P2 is formed on the left side of the first portion P1, and the third portion P3 is formed on the right side. An array antenna arrangement region 1010r is formed in the central portion CR, which is inside the ground region of the first portion P1 and the fourth portion P4. A ground region is arranged in the second portion P2, and a first through hole 1001 is arranged inside the ground region. A ground region is arranged in the third portion P3, and a second through hole 1002 is arranged inside the ground region. Screws are inserted into the first through hole 1001 of the second portion P2 and the second through hole 1002 of the third portion P3, and the antenna module 1000 is fastened to a support structure such as a heat sink inside the electronic device.

[0192] The fourth surface S4 forms the outermost surface of the PCB 1010. The fourth surface S4 is formed of a metal layer connected to ground. On the inner surface of the metal layer, a first region RS1 in which the first patch antenna 1220 is disposed, and a second region RS2 and a third region RS3 that do not operate as grounds are disposed on both sides of the first region RS1.

[0193] In the same region as the first region RS1, a first vertical region VR1 is formed in an internal layer in which a signal connection line is arranged from the outermost surface of the PCB 1010 to the upper ground layer in the antenna direction, the first vertical region VR1 being formed from patch antennas 1210 and 1220 arranged in the first vertical region VR1 and a dielectric material. The outer peripheral surface of the first vertical region VR1 forms a ground wall.

[0194] A second vertical region VR2 is formed in the same region as the second region RS2, from the outermost surface of the PCB 1010 to the ground layer inside the PCB. The inside of the second vertical region VR2 is formed from a first parasitic metal DP1 and a dielectric material. The outer peripheral surface of the second vertical region VR2 forms a ground wall. A third vertical region VR3 is formed in the same region as the third region RS3, from the outermost surface of the PCB 1010 to the ground layer inside the PCB. The inside of the third vertical region VR3 is formed from a second parasitic metal DP2 and a dielectric material. The outer peripheral surface of the third vertical region VR3 forms the ground wall. The first parasitic metal DP1 and the second parasitic metal DP2 correspond to the first dummy pattern and the second dummy pattern.

[0195] The first vertical height Vh1 of the first vertical region VR1 is longer than the second vertical height Vh2 of the second vertical region VR2. The first vertical height Vh1 of the first vertical region VR1 is longer than the third vertical height Vh3 of the third vertical region VR3. The second vertical height Vh2 of the second vertical region VR2 is equal to the third vertical height Vh3 of the third vertical region VR3.

[0196] The first surface S1 of the substrate 1010 is divided into a central portion CR, a first portion P1, a second portion P2, a third portion P3, and a fourth portion P4. The second portion P2 is formed on the left side of the first portion P1, and the third portion P3 is formed on the right side. A ground area is arranged in the first portion P1, and a second dummy array pattern area 1010d2 is formed therein. An array antenna arrangement area 1010r is formed in the central portion CR. A ground area is arranged in the fourth portion P4, and a first dummy array pattern area 1010d1 is formed therein. A ground area is arranged in the second portion P2, and a first through hole 1001 is arranged inside the ground area. A ground area is arranged in the third portion P3, and a second through hole 1002 is arranged inside the ground area. Screws are inserted into the first through hole 1001 of the second portion P2 and the second through hole 1002 of the third portion P3, and the antenna module 1000 is fastened to a support structure such as a heat sink inside the electronic device.

[0197] A first array antenna 1100a is formed in the outer peripheral surface PE region of the second portion P2. A fourth array antenna 1100b is formed in the outer peripheral surface PE region of the third portion P3. The first array antenna 1100a and the fourth array antenna 1100b form a beam pattern in the side region of the electronic device. The first array antenna 1100a and the fourth array antenna 1100b radiate vertically polarized signals to the side region of the electronic device.

[0198] The first array antenna 1100a includes a plurality of dipole antennas DA21 to DA23. The fourth array antenna 1100b includes a plurality of dipole antennas DA24 to DA26. The first array antenna 1100a and the fourth array antenna 1100b are realized by three antenna elements on one side and the other side of the peripheral portion PE of the substrate 1010. The first array antenna 1100a is realized by a 1×3 array antenna on one side of the substrate 1010, but is not limited thereto. The fourth array antenna 1100b is realized by a 1×3 array antenna on the other side of the substrate 1010, but is not limited thereto.

[0199] A third array antenna 1200 is formed on the first surface S1 of the substrate 1010. The third array antenna 1200 forms a beam pattern in the lower region of the electronic device. The third array antenna 1200 radiates a vertically polarized signal to the lower region of the electronic device. The third array antenna 1200 is realized by 12 antenna elements in the center CR of the substrate 1010.

[0200] The third array antenna 1200 includes a plurality of patch antennas PA1 to PA12 formed on the first surface S1 of the substrate 1010. Dummy patterns DP1 and DP2 are arranged in the upper and lower regions of the patch antennas PA1 to PA12 on the XY plane to suppress side surface radiation. The third array antenna 1200 is realized by twelve 1×12 array antennas in the center CR of the substrate 1010, but is not limited to this.

[0201] Each patch antenna of the third array antenna 1200 includes a first patch antenna 1220 and a second patch antenna 1210. The second patch antenna 1210 is stacked on the first patch antenna 1220 in the Z-axis direction, which is the height direction, so that the signal of the first patch antenna 1220 is coupled. The center of the second patch antenna 1210 is offset from the center of the first patch antenna 1220 in the X-axis direction, which is the vertical axis.

[0202] The second patch antennas 1210 in the first, third, fifth, eighth, tenth, and twelfth columns are arranged offset in a lower region in the X-axis direction with respect to the first patch antenna 1220. The second patch antennas 1210 in the second, fourth, sixth, seventh, ninth, and eleventh columns are arranged offset in an upper region in the X-axis direction with respect to the first patch antenna 1220. Thus, the second patch antennas 1210 are arranged alternately offset in different directions with respect to the first patch antenna 1220.

[0203] The current direction of the signal applied to the second patch antennas 1210 in the first, third, fifth, eighth, tenth, and twelfth rows is formed from bottom to top. The current direction of the signal applied to the second patch antennas 1210 in the second, fourth, sixth, seventh, ninth, and eleventh rows is formed from top to bottom. Therefore, the current direction of the signal applied to the second patch antennas 1210 arranged alternately offset in different directions and the corresponding first patch antennas 1220 is opposite. Therefore, it is necessary to make the phase difference of the signal applied to the second patch antennas 1210 arranged alternately offset to 180 degrees so that the current in the same direction is formed. To this end, the RFIC 1400 controls a phase shifter so that the phase difference of the signal applied to the second patch antennas 1210 arranged alternately offset to 180 degrees.

[0204] A first feed signal FS1 is applied to the coupling patch CP1, which is the second patch antenna 1210 in the first row. A second feed signal FS2 is applied to the coupling patch CP2, which is the second patch antenna 1210 in the second row. If the first feed signal FS1 and the second feed signal FS2 are in-phase signals, the directions of the electric fields formed in the coupling patches CP1 and CP2 will be opposite. If the electric fields generated by the coupling patches CP1 and CP2 are formed to be in the same direction, a directional beam is formed. To achieve this, the first feed signal FS1 and the second feed signal FS2 need to be formed so that the phase difference between them is 180 degrees.

[0205] Similarly, a seventh feed signal FS7 is applied to the coupling patch CP7, which is the second patch antenna 1210 in the seventh row. An eighth feed signal FS8 is applied to the coupling patch CP8, which is the second patch antenna 1210 in the eighth row. If the seventh feed signal FS7 and the eighth feed signal FS8 are in-phase signals, the directions of the electric fields formed in the coupling patches CP7 and CP8 are opposite to each other. If the electric fields formed by the coupling patches CP7 and CP8 are in the same direction, a directional beam is formed. For this purpose, it is necessary to form the seventh feed signal FS7 and the eighth feed signal FS8 so that the phase difference between them is 180 degrees.

[0206] Therefore, the phases of the first feed signal FS1, the third feed signal FS3, the fifth feed signal FS5, and the eighth feed signal FS8 applied to the coupling patches CP1, CP3, CP5, and CP8, which are the second patch antennas 1210 in the first, third, fifth, and eighth rows, have a first phase value. On the other hand, the phases of the second feed signal FS2, the fourth feed signal FS4, the sixth feed signal FS6, and the seventh feed signal FS7 applied to the coupling patches CP2, CP4, CP6, and CP7, which are the second patch antennas 1210 in the second, fourth, sixth, and seventh rows, have a second phase value that is 180 degrees out of phase with the first phase value.

[0207] A second array antenna 1300 is formed in a first portion P1 of the peripheral portion PE of the substrate 1010. The second array antenna 1300 forms a beam pattern in a front area of ​​the electronic device. The second array antenna 1300 radiates a horizontally polarized signal to the front area of ​​the electronic device.

[0208] The second array antenna 1300 includes a plurality of dipole antennas DA1 to DA14 formed in a first portion P1 of the peripheral portion PE of the substrate 1010. The second array antenna 1300 is realized by 14 antenna elements below the peripheral portion PE of the substrate 1010. The second array antenna 1300 is realized by 14 1×14 array antennas below the peripheral portion PE of the substrate 1010, but is not limited thereto.

[0209] The RFIC 1400 is configured to transmit and receive signals at frequencies between 10 GHz and 400 GHz using at least one of the first array antenna 1100a, the fourth array antenna 1100b, the third array antenna 1200, and the second array antenna 1300. The RFIC 1400 is configured to transmit and receive signals at frequencies between 10 GHz and 400 GHz using at least one of the multiple dipole antennas DA21 to DA26, the multiple patch antennas PA1 to PA12, and the multiple dipole antennas DA1 to DA14. The RFIC 1400 is also called an RFIC (Radio Frequency Integrated Chip).

[0210] The number of elements of the second array antenna 1300 forming a beam pattern in the front region is set to be greater than the number of elements of the third array antenna 1200 forming a beam pattern in the lower region. The number of elements of the third array antenna 1200 forming a beam pattern in the lower region is set to be greater than the numbers of the first array antenna 1100a and the fourth array antenna 1100b forming beam patterns in the side regions.

[0211] Of the 32 pins of the RFIC 1400, 12 pins are connected to the third array antenna 1200 that forms a beam pattern in the lower region. Of the 32 pins of the RFIC 1400, 14 pins are connected to the second array antenna 1300 that forms a beam pattern in the front region. Of the 32 pins of the RFIC 1400, 6 pins are connected to the first array antenna 1100a and the fourth array antenna 1100b that form beam patterns in the side regions.

[0212] Since the second array antenna 1300 has the largest number of elements, it can transmit signals far into the front area of ​​the electronic device, but its beam coverage is narrow. The narrow beam coverage can be compensated for by changing the beam direction through beamforming in the horizontal direction of the front area. The second array antenna 1300 has multiple elements in the Y-axis direction and one element in the Z-axis direction. For example, the second array antenna 1300 is realized as a 1×14 array antenna.

[0213] The electronic device needs to perform wireless communication with other electronic devices arranged in the lower region. For wireless communication, beamforming is realized in the lower region of the electronic device in narrow beam coverage units in the horizontal direction, which is the Y-axis direction. On the other hand, the lower region of the electronic device does not need to transmit signals farther than the front region. The number of elements of the third array antenna 1200 is realized as multiple elements in one axis direction and one element in the other axis direction. For example, the third array antenna 1200 is realized as a 1×8, 1×10, or 1×12 array antenna.

[0214] In an indoor radio wave environment where an electronic device is placed, a signal may be transmitted to the side area of ​​the electronic device. In the side area of ​​the electronic device, it is more important to realize a wide beam coverage without beamforming than to transmit a signal far away. Since the first array antenna 1100a and the fourth array antenna 1100b have the smallest number of elements, they can provide a wide beam coverage to the side area of ​​the electronic device. Therefore, the number of elements of the first array antenna 1100a and the fourth array antenna 1100b is realized as multiple elements in one axis direction and one element in the other axis direction. For example, the first array antenna 1100a and the fourth array antenna 1100b are realized as 1×3 array antennas on one side and the other side.

[0215] Now, the layout structure of each layer of the antenna module according to the present invention will be described. Fig. 17a is a front view showing each layer of the third array antenna of the antenna module of Fig. 16. Fig. 11a and Fig. 17a are front views showing each layer of the antenna module of Fig. 16. Furthermore, Fig. 17b is a view showing the first and seventh layers of the antenna module of Fig. 16.

[0216] 15 to 17b, a detailed description will be given of each layer of the antenna module 1000. Note that the first layer La1 to the seventh layer La7 of the antenna module have been described in detail in FIG. 11a, so duplicated description will be omitted.

[0217] The third array antenna 1200 of the antenna module 1000 will be described for each layer with reference to Figs. 15 to 17b. The eighth layer La8 is formed with a metal layer and is configured as a fourth ground layer GND4. The third feeder line of the seventh layer La7 is disposed between the ground layer of the sixth layer La6 and the ground layer of the eighth layer La8. Thus, the third feeder line of the seventh layer La7 is formed in a third coplanar waveguide structure in which ground layers are formed on the upper and lower layers in the height direction. The metal layers provided on the ground layer of the sixth layer La6 and the ground layer of the eighth layer La8 are partially removed so that the second and third vias are vertically connected.

[0218] As described above, the second layer La2, the fourth layer La4, the sixth layer La6, and the eighth layer La8 respectively constitute the first ground layer GND1 to the fourth ground layer GND4. The ground layers are electrically connected to each other by connection vias that connect the ground layers. The substrate 1010 includes the first ground layer GND1 for the transceiver circuit 1400 to the fourth ground layer GND4 for the third array antenna 1200. The first array antenna 1100a and the second array antenna 1100b are arranged with antennas and signal lines on the layer between the first ground layer GND1 and the second ground layer GND2.

[0219] The third array antenna 1200 is disposed on the fourth ground layer GND4 with its antennas and signal lines. The second array antenna 1300 is disposed between the metal layer which is the ground layer of the fourth layer La4 and the metal layer which is the ground layer of the sixth layer La6 with its antennas and signal lines. Thus, the first array antenna 1100a and the fourth array antenna 1100b, and the third array antenna 1200 and the second array antenna 1300 have their respective signal lines isolated from each other by the second ground layer GND2 to the fourth ground layer GND4. Thus, the second ground layer GND2 to the fourth ground layer GND4 reduce mutual interference occurring between the signal lines of the array antennas which are isolated from each other.

[0220] In the RFIC 1400, the length of the feeder of the third array antenna 1200 is configured to be the same for all antenna elements. The length of the feeder of the third array antenna 1200 is determined by the sum of the first length L1a to the fourth length L4a. The lengths of the feeders for all second patch antennas CP1 to CP12 of the third array antenna 1200 are all configured to be the same. The first length L1a to the fourth length L4a are configured to be the same for all second patch antennas CP1 to CP12, respectively. Therefore, the signals applied from the RFIC 1400 to all second patch antennas CP1 to CP12 have the same phase, and a beam is formed at the center point.

[0221] The third vias Vc1 to Vc12 are formed so as to be vertically connected from the first layer La1 to the seventh layer La7. The eighth layer La8 to the twelfth layer La12 are formed with a ground region made of a metal layer, and an array antenna arrangement region 1010r which is a first dielectric region where the metal layer has been removed. The tenth layer La10 is formed with coupling patches CP1 to CP12 which are connected to the ends of the third vias Vc1 to Vc12. The coupling patches CP1 to CP12 are also called feeding plates.

[0222] The ground regions made of metal layers formed on the first layer La1 to the twelfth layer La12 are connected by a plurality of vias. On the tenth layer La10, coupling patches CP1 to CP12 of the third array antenna are arranged.

[0223] A metal layer forming a ground wall (GW) is partially disposed on the 11th layer La11. A second dielectric region 1010d1 and a third dielectric region 1010d2 are formed in the upper and lower regions of the 11th layer La11, from which the metal layer acting as the ground has been removed. Dummy patterns DP1 and DP2 are disposed inside the second dielectric region 1010d1 and the third dielectric region 1010d2.

[0224] The tenth layer La10 to the twelfth layer La12 further include a ground region made of a metal layer, and a second dielectric region 1010d1 and a third dielectric region 1010d2 from which the metal layer has been removed. The second dielectric region 1010d1 and the third dielectric region 1010d2 correspond to the first dummy array pattern region 1010d1 and the second dummy array pattern region 1010d2.

[0225] The first patch antennas PA1-PA12 of the third array antenna 1200 are arranged on a twelfth layer La12. Adjacent antennas among the first patch antennas PA1-PA12 are arranged at equal intervals. The centers of the second patch antennas CP1-CP12 are offset in the X-axis direction, which is the vertical axis direction, from the centers of the first patch antennas PA1-PA12.

[0226] Hereinafter, the patch antenna arrangement structure of the antenna module 1000 realized by the multi-layered antenna package according to the present invention will be described with reference to the drawings. Fig. 18a is a diagram showing the tenth and twelfth layers on which the patch antennas of the antenna module of Fig. 16 are stacked. Fig. 18b is a diagram showing the overlapping arrangement structure of the patch antennas arranged in the array antenna arrangement area of ​​the antenna module of Fig. 16.

[0227] As shown in Fig. 18a, the first patch antennas PA1 to PA12 are spaced apart from each other by the same distance, which is a third interval G3. The second patch antennas CP1 to CP12 are spaced apart from each other by the same distance, which is a third interval G3 on the Y axis. On the other hand, the second patch antennas CP1 to CP12 are spaced apart from each other by the first interval G1 on the X axis. The length of the first interval G1 is shorter than the length of the third interval G3.

[0228] As shown in FIG. 18b, the first patch antenna 1220 is disposed on the first horizontal axis Hy1 which is the center of the array antenna arrangement region 1010r. The centers of the patch antennas of the first group of the second patch antenna 1210 are aligned in the direction of the second horizontal axis Hy2 and disposed in the first region RG1. The second horizontal axis Hy2 is disposed in the first region RG1 at a predetermined distance in parallel from the first horizontal axis Hy1. The centers of the patch antennas of the second group of the second patch antenna 1210 are aligned in the direction of the third horizontal axis Hy3 and disposed in the second region RG2. The third horizontal axis Hy3 is disposed in the second region RG2 at a predetermined distance in parallel from the first horizontal axis Hy1.

[0229] The first patch antenna 1220 is a circular patch antenna having a first diameter R1. The second patch antenna 1210 is a circular patch antenna having a second diameter R2 smaller than the first diameter R1. The first patch antenna 1220 and the second patch antenna 1210 are arranged to have an overlapping region Ro of arc regions in the vertical axis direction. The overlapping region Ro between the first patch antenna 1220 and the second patch antenna 1210 belonging to the first group is arranged in a first region RG1. The overlapping region Ro between the first patch antenna 1220 and the second patch antenna 1210 belonging to the second group is arranged in a second region RG2. The length of the overlapping region Ro between the first patch antenna 1210 and the second patch antenna 1220 is formed to be smaller than the radius R2 of the second patch antenna 1210.

[0230] When the second patch antenna 1210 is connected to the connection regions CR2 and CR3 through a power feed via at an offset point, for example, at the top / bottom point, the polarization of the electromagnetic wave radiated from the second patch antenna 1210 is formed in the up / down direction. The connection regions CR2 and CR3 are formed at offset points offset by a predetermined distance from the center point of the second patch antenna 1210.

[0231] The current distribution in the adjacent regions centered on the connection regions CR2 and CR3 is higher than the current distribution in the peripheral regions. In this manner, the mode formed in the second patch antenna 1210 in which the current distribution is formed in the vertical direction is the TE11 mode.

[0232] Connection regions CR2 and CR3 are formed in the second patch antenna 1210 in a direction away from the center of the second patch antenna 1210 in the X-axis direction. Therefore, the current generated from the second patch antenna 1210 is formed in the up-down direction, which results in a dominant current distribution. Therefore, the antenna element including the first patch antenna 1210 and the second patch antenna 1220 operates like a TE11 mode. Therefore, the radiation performance of the main polarization (co-polarization) in the up-down direction, rather than the cross-polarization component in the left-right direction, is improved, and the antenna gain performance is improved.

[0233] The TE11 mode attenuates and essentially eliminates the left and right current components. This improves the radiation performance of the main polarization, which corresponds to the vertical polarization, and increases the antenna gain. In addition, the cross-polarization components are reduced, which is expected to improve data throughput performance through improved MIMO performance.

[0234] Hereinafter, an antenna module realized by a multi-layer package according to one embodiment of the present invention will be described. The multi-layer package includes a plurality of array antennas formed in a plurality of coplanar waveguide structures. The antenna module realized by the multi-layer package formed in a plurality of coplanar waveguide structures will be described with reference to Figs. 4 to 18b.

[0235] The antenna module 1000 includes a PCB 1010, an RFIC 1400, a first array antenna 1100a, a second array antenna 1300, and a third array antenna 1200. The antenna module 1000 is further configured to include a first coplanar waveguide WG1, a second coplanar waveguide WG2, and a third coplanar waveguide WG3.

[0236] The PCB 1010 includes multiple layers. The RFIC 1400 is provided on a first surface S1 of the outermost surface of the PCB 1010. The first array antenna 1100a is provided on a second surface S2 of the outermost surface of the PCB 1010 that is perpendicular to the first surface S1. The second array antenna 1300 is provided on a third surface S3 of the outermost surface of the PCB 1010 that is perpendicular to the first surface S1 and the second surface S2. The third array antenna 1200 is provided on a fourth surface S4 of the outermost surface of the PCB 1010 that is perpendicular to the second surface S2 and the third surface S3.

[0237] The first surface S1 and the fourth surface S4 form opposing surfaces. The second surface S2 and the third surface S3 are formed between the first surface S1 and the fourth surface S4. The multiple layers include multiple ground layers and a layer in which multiple coplanar waveguides are formed. The multiple layers are configured to be stacked from the first layer La1 to the twelfth layer La12. The first surface S1 forms one surface of the first layer La1 among the multiple layers. On the surface opposite to the first surface S1 of the first layer La1, a second layer La2 that forms the first ground layer GND1 among the multiple ground layers is formed.

[0238] The third layer La3 laminated on the second layer La2 includes a first coplanar waveguide WG1. The first coplanar waveguide WG1 includes first signal lines Fa1-Fa3 and a first ground area GP1. The first signal lines Fa1-Fa3 and the first ground area GP1 are electrically connected to the first array antenna 1100a.

[0239] The fourth layer La4 laminated on the third layer La3 forms the second ground layer GND2. The fifth layer La5 laminated on the fourth layer La4 includes a second coplanar waveguide WG2. The second coplanar waveguide WG2 includes second signal lines Fb1-Fb3 and a second ground area GP2. The second signal lines Fb1-Fb14 and the second ground area GP2 are electrically connected to the second array antenna 1300.

[0240] The sixth layer La6 laminated on the fifth layer La5 forms the third ground layer GDN3. The seventh layer La7 laminated on the sixth layer La6 includes a third coplanar waveguide WG3. The third coplanar waveguide WG3 includes third signal lines Fc1-Fc12 and a third ground area GP3. The third signal lines Fc1-Fc12 and the third ground area GP3 are electrically connected to the third array antenna 1200. Therefore, the first coplanar waveguide WG1, the second coplanar waveguide WG2, and the third coplanar waveguide WG3 are isolated by the ground layers GND1, GND2, and GND3, so that mutual interference can be minimized.

[0241] A plurality of fourth ground layers GND4 and a plurality of non-metallic regions arranged in the inner regions of the plurality of fourth ground layers GND4 are formed in the eighth layer La8 to the twelfth layer La12 stacked on the seventh layer La7. The third array antenna 1200 is formed in the non-metallic region of the twelfth layer La12.

[0242] Meanwhile, the second surface S2 of the outermost surface of the PCB 1010 includes a first array antenna arrangement area 1010r1 and an area in which a first ground wall 1151 is formed by ground layers arranged in a plurality of layers. Therefore, the first ground wall 1151 acts as a reflector for the first array antenna 1100a. Therefore, it is possible to reduce interference between the first array antenna 1100a and other array antennas.

[0243] A plurality of first connection lines CL1 are formed to electrically connect the first array antenna 1100a and the RFIC 1400. The plurality of first connection lines CL1 are composed of a plurality of first horizontal lines HL1 formed on the first layer La1, a plurality of first vertical lines VL1 vertically connecting the first layer La1 to the third layer La3, and a plurality of first coplanar waveguides WG1 formed on the third layer La3. The plurality of first horizontal lines HL1 are formed to have a first equal length, the plurality of first coplanar waveguides WG1 are formed to have a second equal length, and the plurality of first connection lines CL1 are formed to have the same length. Thus, the lengths from the RFIC 1400 to each element of the first array antenna 1100a are formed to be the same. Thus, it is possible to control the phases of the radio signals applied to the first array antenna 1100a to be the same.

[0244] Meanwhile, the antenna module 1000 realized in the multi-layer package according to the present invention is configured to further include a fourth array antenna 1100b. The fourth array antenna 1100b is provided on a fifth surface S5 perpendicular to the third surface S3 and the fourth surface S4 among the outermost surfaces of the PCB 1010. The second surface S2 and the fifth surface S5 form opposing surfaces.

[0245] In the antenna module 1000 realized by the multi-layer package according to the present invention, a ground wall is formed so as to reduce interference between the array antennas. Among the outermost surfaces of the PCB 1010, the third surface S3 includes a second array antenna arrangement region 1010r2 and a region in which the second ground wall 1152 is formed by each of the ground layers arranged in a plurality of layers. Thus, the second ground wall 1152 acts as a reflector for the second array antenna 1300. Thus, it is possible to reduce interference between the second array antenna 1300 and other array antennas.

[0246] A plurality of second connection lines CL2 are formed to electrically connect the second array antenna 1300 and the RFIC 1400. The plurality of second connection lines CL2 are composed of a plurality of second horizontal lines HL2 formed on the first layer La1, a plurality of second vertical lines VL2 vertically connecting the first layer La1 to the fifth layer La5, and a plurality of second coplanar waveguides WG2 formed on the fifth layer La5. The plurality of second vertical lines VL2 are formed to have a third identical length, and the plurality of second coplanar waveguides WG2 are formed to have a fourth identical length. Thus, the plurality of second connection lines CL2 are formed to have the same length. Thus, the lengths from the RFIC 1400 to each element of the second array antenna 1300 are formed to be the same. Thus, it is possible to control the phases of the radio signals applied to the second array antenna 1300 to be the same.

[0247] The second coplanar waveguide WG2 is formed in an even number and is formed in a symmetrical structure with respect to the X-axis. The second coplanar waveguide WG2 is formed in an even number and is formed in a symmetrical structure with respect to the X-axis so that the lengths from the RFIC 1400 to each element of the second array antenna 1300 are the same.

[0248] The second array antenna 1300 is composed of 14 antenna elements. The second coplanar waveguide WG2 is composed of the first to fourteenth waveguides. The first waveguide includes the first line Fb1 of the second signal line and ground patterns GL, GR arranged on both sides. The fourteenth waveguide includes the fourteenth line Fb14 of the second signal line and ground patterns arranged on both sides.

[0249] The four pins arranged in the first region Sd1 of the RFIC 1400 are electrically connected to the first antenna element DA1 to the fourth antenna element DA4 of the second array antenna 1300 by the first to fourth waveguides of the second coplanar waveguide WG2. The four pins arranged in the second region Sd2 of the RFIC 1400 are electrically connected to the fifth antenna element DA5, the sixth antenna element DA6, the ninth antenna element DA9, and the tenth antenna element DA10 of the second array antenna 1300 by the fifth, sixth, ninth, and tenth waveguides of the second coplanar waveguide WG2. The four pins arranged in the third region Sd3 of the RFIC 1400 are electrically connected to the eleventh antenna element DA11 to the fourteenth antenna element DA14 of the second array antenna 1300 by the eleventh to fourteenth waveguides of the second coplanar waveguide WG2. The two pins arranged in the fourth region Sd4 of the RFIC 1400 are electrically connected to the seventh antenna element DA7 and the eighth antenna element DA8 of the second array antenna 1300 by the seventh and eighth waveguides of the second coplanar waveguide WG2.

[0250] The first region Sd1 and the third region Sd3 of the RFIC 1400 are disposed in opposing positions. The second region Sd2 and the fourth region Sd4 of the RFIC 1400 are disposed in opposing positions. The two pins of the fourth region Sd4 of the RFIC 1400 are formed so as to be at the shortest distance from the seventh and eighth antenna elements of the second array antenna 1300. The second coplanar waveguide WG2 is formed in a symmetrical structure with respect to the central axis of the seventh and eighth antenna elements of the second array antenna 1300. The second coplanar waveguide WG2 is formed in the X-axis direction, and the first coplanar waveguide is formed in the Y-axis direction. Thus, the first coplanar waveguide and the second coplanar waveguide WG2 are separated by the ground layer and disposed in a vertical position. Thus, the ends of the first signal line and the second signal line constituting the first coplanar waveguide WG1 and the second coplanar waveguide WG2 are disposed vertically, so that the mutual interference between orthogonal signals can be minimized.

[0251] The third array antenna 1200 disposed on the fourth surface S4 of the outermost surface of the PCB 1010 includes a plurality of antenna elements. Each of the plurality of antenna elements is composed of two patch antenna structures. Of the two patch antennas, a first patch antenna 1220 is disposed on the fourth surface of the PCB 1010. Of the two patch antennas, a second patch antenna 1210 is disposed apart from the first patch antenna 1220 and disposed on one of a plurality of layers inside the PCB 1010. A portion of the first patch antenna 1220 and a portion of the second patch antenna 1210 are laminated to overlap each other.

[0252] Of the outermost surface of the PCB 1010, the fourth surface S4 is formed of a metal layer connected to ground. An internal region of the metal layer is formed of a non-metallic region in which the first patch antenna 1220 is disposed. The non-metallic region of the PCB 1010 forms a first internal space VR1. The first internal space VR1 is formed in the same region as the non-metallic region of the PCB 1010. A first vertical region from the outermost surface of the PCB 1010 to a ground layer formed on the upper part of the internal layer in which the third coplanar waveguide WG3 inside the PCB 1010 is disposed forms the first internal space VR1 formed of a dielectric material.

[0253] The second patch antenna 1210 is disposed on the tenth layer of the first internal space VR1. The outer peripheral surface of the first internal space VR1 forms third ground walls GV1 and GV2 to which the grounds of the layers are connected by vias. Thus, the third ground walls GV1 and GV2 act as reflectors for the third array antenna 1200. Thus, it is possible to reduce interference between the third array antenna 1200 and other array antennas.

[0254] Meanwhile, a plurality of third connection lines are formed to electrically connect the third array antenna 1200 and the RFIC 1400. The plurality of third connection lines CL3 include a plurality of third horizontal lines SL1, a plurality of third vertical lines SL2, a plurality of third coplanar waveguides WG3, and a plurality of fourth vertical lines SL4. The plurality of third horizontal lines SL1 are formed on the first layer La1. The plurality of third vertical lines SL2 vertically connect the first layer La1 to the seventh layer La7. The plurality of third coplanar waveguides WG3 are formed on the seventh layer La7. The plurality of fourth vertical lines SL4 vertically connect the plurality of third coplanar waveguides WG3 and the plurality of second patch antennas 1210.

[0255] A first length R1, which is the radius of the first patch antenna 1220, is longer than a second length R2, which is the radius of the second patch antenna 1220. The center of the second patch antenna 1210, the center of the first patch antenna 1220, and the feeding regions CR2 and CR3 of the second patch antenna 1210 to which the fourth vertical line is connected are arranged on a straight line.

[0256] The third vertical lines SL2 are formed to have a fifth equal length, the second coplanar waveguides WG2 are formed to have a sixth equal length, and the fourth vertical lines SL4 are formed to have a seventh equal length. Thus, the third connection lines CL3 are formed to have the same length. Thus, the lengths from the RFIC 1400 to each element of the third array antenna 1200 are formed to be the same. Thus, it is possible to control the phases of the radio signals applied to the third array antenna 1200 to be the same.

[0257] The third horizontal lines SL1 formed on the first layer La1 form a plurality of signal connection lines. Of the plurality of signal connection lines, a first group of the third horizontal lines SL1 electrically connected to the second patch antenna 1210 is disposed in a first region RG1 with respect to the first horizontal axis. Of the plurality of signal connection lines, a second group of the third horizontal lines SL1 electrically connected to the second patch antenna 1210 is disposed in a second region RG2 with respect to the first horizontal axis.

[0258] The third coplanar waveguide WG3 formed on the seventh layer La7 forms a plurality of signal connection lines. Of the plurality of signal connection lines, a first group of the third coplanar waveguides WG3 electrically connected to the second patch antenna 1210 is disposed in a first region RG1 with respect to the first horizontal axis. Of the plurality of signal connection lines, a second group of the third coplanar waveguides WG3 electrically connected to the second patch antenna 1210 is disposed in a second region RG2 with respect to the first horizontal axis.

[0259] The third coplanar waveguide WG3 is formed in an even number and is formed in a symmetrical structure with respect to the X-axis. The third coplanar waveguide WG3 is formed in an even number and is formed in a symmetrical structure with respect to the X-axis so that the lengths from the RFIC 1400 to each element of the third array antenna 1200 are the same.

[0260] The third array antenna 1200 includes 12 antenna elements. The third coplanar waveguide WG3 is composed of the first to twelfth waveguides. The first waveguide includes the first line Fc1 of the third signal line and ground patterns GL, GR arranged on both sides. The twelfth waveguide includes the twelfth line Fc12 of the third signal line and ground patterns arranged on both sides.

[0261] The six pins arranged in the second region Sd2 of the RFIC 1400 are electrically connected to the second, fourth, sixth, seventh, nineth, and eleventh antenna elements of the third array antenna 1200 by the second, fourth, sixth, seventh, nineth, and eleventh waveguides of the third coplanar waveguide WG3 arranged in the first region RG1. The six pins arranged in the fourth region Sd4 of the RFIC 1400 are electrically connected to the first, third, fifth, eighth, tenth, and twelfth antenna elements of the third array antenna 1200 by the first, third, fifth, eighth, tenth, and twelfth waveguides of the third coplanar waveguide WG3 arranged in the second region RG2.

[0262] The third coplanar waveguide WG3 arranged in the first region RG1 and the third coplanar waveguide WG3 arranged in the second region RG2 are formed to have a structure that is asymmetrical up and down with respect to the Y axis. The third coplanar waveguide WG3 arranged in the first region RG1 is formed to have a structure that is symmetrical left and right with respect to the X axis. The third coplanar waveguide WG3 arranged in the second region is formed to have a structure that is symmetrical left and right with respect to the X axis.

[0263] The antenna module realized by the multi-layer package formed on a plurality of coplanar waveguide structures according to one aspect of the present invention has been described above. Hereinafter, an electronic device including a communication module realized by the multi-layer package formed on a plurality of coplanar waveguide structures according to another aspect of the present invention will be described.

[0264] 1 to 18b, an electronic device including a communication module realized by a multi-layer package formed in a plurality of coplanar waveguide structures will be described. The electronic device 200 is composed of a display panel 260, a communication module, and a control unit. The RF receiving module 240 and the processor 290 of the electronic device 200 correspond to the communication module 240 and the control unit 290, respectively.

[0265] The communication module 240 is configured to wirelessly receive signals related to video and information from an external device. The control unit 290 is configured to convert the signals received from the communication module 240 and provide them to the display panel 260. The communication module 240 includes a transceiver circuit 1400, a first antenna resonating element 1100a, a second antenna resonating element 1300, and a third antenna resonating element 1200.

[0266] The communication module 240 corresponds to the antenna module 1000. The communication module 240 (or the antenna module 1000) of the electronic device 200 is configured to further include a first coplanar waveguide WG1, a second coplanar waveguide WG2, and a third coplanar waveguide WG3.

[0267] The first coplanar waveguide WG1 is configured to transmit signals at a frequency of 10 GHz to 300 GHz between the transmitter / receiver circuit 1400 and the first antenna resonating element 1100a. The second coplanar waveguide WG2 is configured to transmit signals at a frequency of 10 GHz to 300 GHz between the transmitter / receiver circuit 1400 and the second antenna resonating element 1300. The third coplanar waveguide WG3 is configured to transmit signals at a frequency of 10 GHz to 300 GHz between the transmitter / receiver circuit 1400 and the third antenna resonating element 1200.

[0268] First coplanar waveguide WG1 is interposed between second coplanar waveguide WG2 and transceiver circuit 1400. Second coplanar waveguide WG2 is interposed between first coplanar waveguide WG1 and third coplanar waveguide WG3. Third coplanar waveguide WG3 is interposed between second coplanar waveguide WG2 and third antenna resonating element 1200. Third antenna resonating element 1200 is interposed on the opposite side of transceiver circuit 1400.

[0269] Meanwhile, the control unit 290 selects a specific antenna resonating element based on the strength measurement of a signal received from an external device. When the first antenna resonating element 1100a, the second antenna resonating element 1300, and the third antenna resonating element 1200 receive a signal from an external device, the control unit 290 measures the strength of the signal. The control unit 290 selects the antenna resonating element with the maximum signal strength and controls it to receive the signal.

[0270] Meanwhile, the control unit 290 selects a specific antenna resonating element using at least two antenna structures (modules). Fig. 19 is a flowchart showing the operation of an electronic device for transmitting and receiving wireless signals with a communication device according to the present invention. A method for electronic device 200 according to the present invention to transmit and receive wireless signals using a plurality of array antennas of first and second antenna structures will be described with reference to Fig. 19.

[0271] 1 to 19, a method for changing or restoring an A / V signal transmission / reception beam according to the present invention will be described. When the communication device 100 and the electronic device 200 are powered on (S11), the electronic device 200 identifies the device ID of the communication device 100 (S12). Based on the device ID, the electronic device 200 performs settings for wireless communication with the communication device 100. The electronic device 200 searches for the position and rotation state where the identified communication device 100 is located (S13).

[0272] The electronic device 200 searches whether the communication device 100 is placed in the front region, the bottom region, one side region, or the other side region of the electronic device 200. The electronic device 200 determines whether the communication device 100 is placed in the bottom region of the electronic device 200 (S14). The electronic device 200 determines whether the communication device 100 is placed on the front surface or one of the two side surfaces of the electronic device 200 (S16).

[0273] When communication device 100 is placed in the lower region of electronic device 200, it is determined whether communication device 100 operates with horizontal polarization or not based on the rotation state of communication device 100 (S15). If communication device 100 is placed within a predetermined angle range based on 0 degrees, it is determined that it operates with horizontal polarization. If communication device 100 is placed within a predetermined angle range based on 90 degrees, it is determined that it operates with vertical polarization.

[0274] When the communication device 100 is placed within a predetermined range from 0 degrees and operates with horizontal polarization, 1T1R operation is performed by the horizontally polarized antenna of the first antenna structure 1000a and the second antenna structure 1000b (S21). Note that 1T1R operation is performed by the third array antenna 1200 of the first antenna structure 1000a operating as a horizontally polarized antenna (S21).

[0275] When the communication device 100 is placed within a predetermined range from 90 degrees and operates with vertical polarization, 1T1R operation is performed by the vertically polarized antenna of the first antenna structure 1000a and the second antenna structure 1000b (S22). Note that 1T1R operation is performed by the third array antenna 1200 of the second antenna structure 1000b operating as a vertically polarized antenna (S22). Thus, the communication device 100 and the electronic device 200 perform 1T1R operation by either the first antenna structure 1000a or the second antenna structure 1000b. On the other hand, when the communication device 100 is placed within a predetermined range from 45 degrees and operates with diagonal polarization, 1T2R operation is performed by the first antenna structure 1000a and the second antenna structure 1000b (S23).

[0276] When the communication device 100 is disposed on the front surface or one of both sides of the electronic device 200 (S16), a diversity operation is performed by the first antenna structure 1000a and the second antenna structure 1000b (S23). Therefore, a diversity operation is performed in which the same polarized signal is transmitted and received by the first antenna structure 1000a and the second antenna structure 1000b.

[0277] In summary, when the communication device 100 is not disposed in the front area or one of both sides of the electronic device 200, 1T1R operation is performed using either the first antenna structure 1000a or the second antenna structure 1000b (S21, S22). When the communication device 100 is disposed in the front area or one of both sides of the electronic device 200, 1T2R operation is performed using the first antenna structure 1000a and the second antenna structure 1000b (S23). Thus, the communication device 100 and the electronic device 200 perform 1T2R operation using the first antenna structure 1000a and the second antenna structure 1000b.

[0278] Meanwhile, the electronic device according to the present invention appropriately selects a plurality of array antennas of the first and second antenna structures based on the position of the communication device, and receives A / V signals by optimal beamforming. Note that Fig. 20 is a flowchart of a method for selecting, changing or restoring a wireless beamforming signal for transmitting and receiving A / V signals by the electronic device according to the present invention. As shown in Fig. 20, the operation mode of the plurality of array antennas is selected / changed, and then, as shown in Fig. 19, a beam selection, change or restoration process is performed, but is not limited thereto.

[0279] 1 to 20, a method for selecting, changing or restoring a wireless beamforming signal for transmitting and receiving an A / V signal by an electronic device will be described. The processor 290 searches for beams that can be formed between the communication device 100 and the electronic device 200 (S111). The processor 290 obtains all beams that can be formed between the communication device 100 and the electronic device 200 as a search result. Meanwhile, all beams have a pair of beams consisting of a transmission beam that transmits an A / V signal from the communication device 100 and a reception beam that receives an A / V signal from the electronic device 200.

[0280] The processor 290 also obtains an effective beam from the beams 300 that are searched as being formable between the communication device 100 and the electronic device 200 (S112). The effective beam may be one or more beams selected for actually transmitting and receiving A / V signals among all beams searched by the processor 290. Alternatively, the effective beam may be one or more beams that transmit and receive A / V signals at a minimum transmission rate or higher among the beams 300 that are formable between the communication device 100 and the electronic device 200.

[0281] The processor 290 also obtains a beam angle based on the beam ID (S113). The beam ID is an ID for identifying each beam 300 formed in the communication device 100 and the electronic device 200. The beam angle includes a beam reception angle, which is an angle on the electronic device 200 side, and a beam transmission angle, which is an angle on the communication device 100 side. The beam reception angle and the beam transmission angle are angles measured in an LOS path formed between the communication device 100 and the electronic device 200.

[0282] The processor 290 also determines whether at least one effective beam is formed within a detection range of a sensor (not shown) (S121). The sensor (not shown) obtains at least a part or all of the position and velocity of an object.

[0283] Furthermore, when the processor 290 determines that an effective beam is formed within the detection range of a sensor (not shown), it sets a reference range (S122). The reference range may be a range in which an A / V signal transmission / reception failure is expected to occur during object monitoring, which will be described later. The reference range may be a range that serves as a reference for the processor 290 to transmit a beam change command or a beam restoration command during object monitoring, which will be described later.

[0284] Furthermore, the processor 290 starts object monitoring (S131). Object monitoring is an operation of monitoring at least a part or all of the position and velocity of an object located between the communication device 100 and the electronic device 200.

[0285] Meanwhile, the processor 290 adjusts the set reference range (S132). The processor 290 may adjust the reference range depending on the object, or may not adjust the reference range. That is, step S132 may be omitted depending on the embodiment. The processor 290 adjusts the reference range set in step S122. For example, the processor 290 obtains the velocity of the object and adjusts the reference range based on the velocity of the object.

[0286] Since the electronic device 200 according to an embodiment of the present invention can adjust the width of the reference range in real time in consideration of the speed of the object, the transmission efficiency can be maximized by maximizing the time during which the A / V signal is transmitted by the main beam having a high transmission speed, and the A / V signal transmission / reception error can be minimized. The processor 290 determines whether the object has entered the reference range (S133).

[0287] If the processor 290 determines that the object has not entered the reference range, it does not send a beam change command and continues to determine whether or not the object has entered the reference range.

[0288] On the other hand, when the processor 290 determines that the object has entered the reference range, it transmits a beam change command to the communication device 100 (S141). The beam change command is a command to change a beam for transmitting and receiving an A / V signal. The beam change command changes one of the effective beams to a beam for transmitting and receiving an A / V signal. The beam selected as the beam for transmitting and receiving an A / V signal by the beam change command is a sub-beam.

[0289] When an object enters the reference range and the wireless communication performance of the LOS path between the communication device 100 and the electronic device 200 deteriorates, a wireless link is established via another path. The electronic device 200 establishes the wireless link so that the wireless signal transmitted from the communication device 100 is reflected by the ceiling or wall surface.

[0290] Meanwhile, processor 290 determines whether or not the object has deviated from the reference range (S142). When the object enters the reference range and the beam is changed, processor 290 determines whether or not the object has deviated from the reference range.

[0291] When the processor 290 determines that the object has not deviated from the reference range, it does not transmit a beam restoration command and continues to determine whether the object has deviated from the reference range. On the other hand, when the processor 290 determines that the object has deviated from the reference range, it transmits a beam restoration command to the communication device 100 (S143).

[0292] As described above, electronic device 200 receives wireless signals by selecting a specific array antenna consisting of specific antenna resonating elements in at least one antenna structure (module). Note that electronic device 200 receives wireless signals by selecting a specific array antenna having a specific polarization.

[0293] A method for selecting a specific array antenna having a specific polarization and receiving a radio signal will be described below with reference to Figs. 4 to 19. First array antenna 1100a and second array antenna 1300 are configured as horizontally polarized antennas. First antenna resonating element 1100a and second antenna resonating element 1300 constitute first array antenna 1100a and second array antenna 1300. Signals received by first array antenna 1100a and second array antenna 1300 are signals received in a direction horizontal to the bottom surface of display panel 260.

[0294] Meanwhile, third array antenna 1200 is configured as a horizontally polarized antenna or a vertically polarized antenna. Third antenna resonating element 1200 constitutes third array antenna 1200. When third array antenna 1200 is configured as a horizontally polarized antenna, the signals received by third array antenna 1200 are signals received in a direction parallel to the rear surface of display panel 260. When third array antenna 1200 is configured as a vertically polarized antenna, the signals received by third array antenna 1200 are signals received in a direction perpendicular to the rear surface of display panel 260.

[0295] Meanwhile, a beam direction is formed in a different path by the second array antenna 1300 arranged in front of the electronic device 200. In the beam direction of the signal received by the second array antenna 1300, the signal may not be received while the signal is being received in the first path. The control unit 290 controls so that the beam direction of the signal received by the second array antenna 1300 is changed to the second path. Note that the beam direction of the second array antenna 1300 is changed in the horizontal axis direction. Furthermore, if a plurality of second array antennas 1300 are arranged in the vertical axis direction as well, the beam direction of the second array antenna 1300 is changed in the vertical axis direction as well.

[0296] Meanwhile, the communication module 240 of the electronic device 200 is realized by a PCB 1010 including multiple layers of a multi-layer package structure. An RFIC 1400, which is a transceiver circuit, is provided on a first surface S1 of the outermost surface of the PCB 1010. The first array antenna 1100a is provided on a second surface S2 perpendicular to the first surface S1 of the outermost surface of the PCB 1010. The second array antenna 1300 is provided on a third surface S3 perpendicular to the first surface S1 and the second surface S2 of the outermost surface of the PCB 1010. The third array antenna 1200 is provided on a fourth surface S4 perpendicular to the second surface S2 and the third surface S3 of the outermost surface of the PCB 1010.

[0297] Meanwhile, a ground wall is formed in the communication module 240 of the electronic device 200 according to the present invention to reduce interference between the array antennas. The second surface S2 of the outermost surface of the PCB 1010 includes a first array antenna arrangement region 1010r1 and a region in which the first ground wall 1151 is formed by each ground layer arranged in a plurality of layers. Thus, the first ground wall 1151 acts as a reflector for the first array antenna 1100a. Thus, interference between the first array antenna 1100a and other array antennas can be reduced.

[0298] Among the outermost surfaces of the PCB 1010, the third surface S3 includes the second array antenna arrangement region 1010r2 and a region in which the second ground wall 1152 is formed by the ground layers arranged in a plurality of layers. Therefore, the second ground wall 1152 acts as a reflector for the second array antenna 1300. Therefore, it is possible to reduce interference between the second array antenna 1300 and other array antennas.

[0299] Meanwhile, the communication module 240 of the electronic device 200 according to the present invention is configured to further include a fourth array antenna 1100b. The fourth array antenna 1100b is provided on a fifth surface S5 perpendicular to the third surface S3 and the fourth surface S4 among the outermost surfaces of the PCB 1010. The second surface S2 and the fifth surface S5 form opposing surfaces.

[0300] Meanwhile, in the communication module 240 of the electronic device 200 according to the present invention, a plurality of connection lines are formed to connect the plurality of array antennas and the RFIC 1400. A plurality of first connection lines CL1 are formed to electrically connect the first array antenna 1100a and the RFIC 1400. The plurality of first connection lines CL1 are composed of a plurality of first horizontal lines HL1 formed on the first layer La1, a plurality of first vertical lines VL1 vertically connecting the first layer La1 to the third layer La3, and a plurality of first coplanar waveguides WG1 formed on the third layer La3.

[0301] The first horizontal lines HL1 are formed to have a first equal length, the first coplanar waveguides WG1 are formed to have a second equal length, and the first connection lines CL1 are formed to have the same length. Thus, the lengths from the RFIC 1400 to each element of the first array antenna 1100a are formed to be the same. Thus, it is possible to control the phases of the radio signals applied to the first array antenna 1100a to be the same.

[0302] A plurality of second connection lines CL2 are formed to electrically connect the second array antenna 1300 and the RFIC 1400. The plurality of second connection lines CL2 are composed of a plurality of second horizontal lines HL2 formed on the first layer La1, a plurality of second vertical lines VL2 vertically connecting the first layer La1 to the fifth layer La5, and a plurality of second coplanar waveguides WG2 formed on the fifth layer La5. The plurality of second vertical lines VL2 are formed to have a third identical length, and the plurality of second coplanar waveguides WG2 are formed to have a fourth identical length. Thus, the plurality of second connection lines CL2 are formed to have the same length. Thus, the lengths from the RFIC 1400 to each element of the second array antenna 1300 are formed to be the same. Thus, it is possible to control the phases of the radio signals applied to the second array antenna 1300 to be the same.

[0303] A third connection line is formed to electrically connect the third array antenna 1200 and the RFIC 1400. The third connection line CL3 includes a third horizontal line SL1, a third vertical line SL2, a third coplanar waveguide WG3, and a fourth vertical line SL4. The third horizontal line SL1 is formed on the first layer La1. The third vertical line SL2 vertically connects the first layer La1 to the seventh layer La7. The third coplanar waveguide WG3 is formed on the seventh layer La7. The fourth vertical line SL4 vertically connects the third coplanar waveguide WG3 and the second patch antenna 1210.

[0304] On the other hand, the second array antenna 1300 is composed of 14 antenna elements. The second coplanar waveguide WG2 is composed of the first to fourteenth waveguides. The first waveguide includes the first line Fb1 of the second signal line and ground patterns GL, GR arranged on both sides. The fourteenth waveguide includes the fourteenth line Fb14 of the second signal line and ground patterns arranged on both sides.

[0305] The four pins arranged in the first region Sd1 of the RFIC 1400 are electrically connected to the first antenna element DA1 to the fourth antenna element DA4 of the second array antenna 1300 by the first to fourth waveguides of the second coplanar waveguide WG2. The four pins arranged in the second region Sd2 of the RFIC 1400 are electrically connected to the fifth antenna element DA5, the sixth antenna element DA6, the ninth antenna element DA9, and the tenth antenna element DA10 of the second array antenna 1300 by the fifth, sixth, ninth, and tenth waveguides of the second coplanar waveguide WG2. The four pins arranged in the third region Sd3 of the RFIC 1400 are electrically connected to the eleventh antenna element DA11 to the fourteenth antenna element DA14 of the second array antenna 1300 by the eleventh to fourteenth waveguides of the second coplanar waveguide WG2. The two pins arranged in the fourth region Sd4 of the RFIC 1400 are electrically connected to the seventh antenna element DA7 and the eighth antenna element DA8 of the second array antenna 1300 by the seventh and eighth waveguides of the second coplanar waveguide WG2.

[0306] The third array antenna 1200 disposed on the fourth surface S4 of the outermost surface of the PCB 1010 includes a plurality of antenna elements. Each of the plurality of antenna elements is composed of two patch antenna structures. Of the two patch antennas, a first patch antenna 1220 is disposed on the fourth surface of the PCB 1010. Of the two patch antennas, a second patch antenna 1210 is disposed apart from the first patch antenna 1220 and disposed on one of a plurality of layers inside the PCB 1010. A portion of the first patch antenna 1220 and a portion of the second patch antenna 1210 are laminated to overlap each other.

[0307] Of the outermost surface of the PCB 1010, the fourth surface S4 is formed of a metal layer connected to ground. An internal region of the metal layer is formed of a non-metallic region in which the first patch antenna 1220 is disposed. The non-metallic region of the PCB 1010 forms a first internal space VR1. The first internal space VR1 is formed in the same region as the non-metallic region of the PCB 1010. A first vertical region from the outermost surface of the PCB 1010 to a ground layer formed on the upper part of the internal layer in which the third coplanar waveguide WG3 inside the PCB 1010 is disposed forms the first internal space VR1 formed of a dielectric material.

[0308] The second patch antenna 1210 is disposed on the tenth layer of the first internal space VR1. The outer peripheral surface of the first internal space VR1 forms third ground walls GV1 and GV2 to which the grounds of the layers are connected by vias. Thus, the third ground walls GV1 and GV2 act as reflectors for the third array antenna 1200. Thus, it is possible to reduce interference between the third array antenna 1200 and other array antennas.

[0309] Meanwhile, the multiple signal connection lines of the third array antenna 1200 of the communication module 240 of the electronic device 200 according to the present invention are realized by the third coplanar waveguide WG3. The third coplanar waveguide WG3 formed on the seventh layer La7 forms multiple signal connection lines. Among the multiple signal connection lines, a first group of the third coplanar waveguide WG3 electrically connected to the second patch antenna 1210 is arranged in the first region RG1 with reference to the first horizontal axis. Among the multiple signal connection lines, a second group of the third coplanar waveguide WG3 electrically connected to the second patch antenna 1210 is arranged in the second region RG2 with reference to the first horizontal axis Hy1.

[0310] On the other hand, in the communication module 240 of the electronic device 200 according to the present invention, the third array antenna 1200 includes 12 antenna elements. The six pins arranged in the second region Sd2 of the RFIC 1400 are electrically connected to the second, fourth, sixth, seventh, nineth, and eleventh antenna elements of the third array antenna 1200 by the second, fourth, sixth, seventh, nineth, and eleventh waveguides arranged in the first region RG1 of the third coplanar waveguide WG3. The six pins arranged in the fourth region Sd4 of the RFIC 1400 are electrically connected to the first, third, fifth, eighth, tenth, and twelfth antenna elements of the third array antenna 1200 by the first, third, fifth, eighth, tenth, and twelfth waveguides arranged in the second region RG2 of the third coplanar waveguide WG3.

[0311] The third coplanar waveguide WG3 arranged in the first region RG1 and the third coplanar waveguide WG3 arranged in the second region RG2 are formed to have a structure that is asymmetrical up and down with respect to the Y axis. The third coplanar waveguide WG3 arranged in the first region RG1 is formed to have a structure that is symmetrical left and right with respect to the X axis. The third coplanar waveguide WG3 arranged in the second region is formed to have a structure that is symmetrical left and right with respect to the X axis.

[0312] The antenna module realized in the multi-layer package and the electronic device including the same have been described above. The technical effects of the antenna module realized in the multi-layer package and the electronic device including the same according to the present invention are as follows.

[0313] The present invention provides a multi-layer circuit type antenna package for millimeter wave band communication, which has a structure in which the number of layers is minimized.

[0314] The present invention provides a patch array antenna structure for millimeter wave band communications, which minimizes the signal phase difference for each patch.

[0315] The present invention provides an antenna module that is realized with a low height and allows signal transmission to the front, bottom and side regions.

[0316] The present invention provides a structure that minimizes signal interference between multiple array antennas.

[0317] Further scope of the present invention will become apparent from the above detailed description. However, since various changes and modifications within the spirit and scope of the present invention can be clearly understood by those skilled in the art, the detailed description and specific embodiments such as preferred embodiments are merely illustrative of the present invention. The detailed description should not be construed as limiting in all respects, but should be considered as illustrative. The scope of the present invention should be determined by a reasonable interpretation of the claims, and any changes within the equivalent scope of the present invention are included in the present invention.

Claims

1. An antenna module realized in a multi-layer package, A PCB comprising a plurality of layers; An RFIC provided on a first surface of the outermost surfaces of the PCB; a first array antenna provided on a second surface of the outermost surface of the PCB, the second surface being perpendicular to the first surface; a second array antenna provided on a third surface of the outermost surface of the PCB, the third surface being perpendicular to the first surface and the second surface; a third array antenna provided on a fourth surface of the outermost surface of the PCB, the fourth surface being perpendicular to the second surface and the third surface; the first surface and the fourth surface form opposing surfaces; the second surface and the third surface are formed between the first surface and the fourth surface, the plurality of layers includes a plurality of ground layers and a layer in which a plurality of coplanar waveguides are formed; The plurality of layers are stacked from a first layer to a twelfth layer, the first surface forms one surface of a first layer among the plurality of layers; a second layer forming a first ground layer among the plurality of ground layers is formed on a surface opposite to the first surface of the first layer; a third layer laminated on the second layer, the third layer including a first coplanar waveguide; the first coplanar waveguide includes a first signal line and a first ground region; the first signal line and the first ground area are electrically connected to the first array antenna; a fourth layer laminated on the third layer forms a second ground layer; a fifth layer laminated on the fourth layer includes a second coplanar waveguide; the second coplanar waveguide includes a second signal line and a second ground region; the second signal line and the second ground area are electrically connected to the second array antenna; a sixth layer laminated on the fifth layer forms a third ground layer; a seventh layer laminated on the sixth layer includes a third coplanar waveguide; the third coplanar waveguide includes a third signal line and a third ground region; the third signal line and the third ground area are electrically connected to the third array antenna; A plurality of fourth ground layers and a plurality of non-metallic regions disposed in inner regions of the plurality of fourth ground layers are formed in the eighth to twelfth layers stacked on the seventh layer, The third array antenna is formed in a non-metallic region of the twelfth layer.

2. The second surface of the outermost surface of the PCB is A first array antenna arrangement area; The antenna module according to claim 1 , further comprising: a region in which a first ground wall is formed by each of the ground layers arranged on the plurality of layers.

3. A plurality of first connection lines are formed to electrically connect the first array antenna and the RFIC; The plurality of first connection lines are a plurality of first horizontal lines formed in the first layer; a plurality of first vertical lines vertically connecting the first layer to the third layer; a plurality of the first coplanar waveguides formed in the third layer; The first vertical lines are formed to have a first equal length, The first plurality of coplanar waveguides are formed to have a second equal length; The antenna module according to claim 1 , wherein the first connection lines are formed to have the same length.

4. a fourth array antenna provided on a fifth surface of the outermost surface of the PCB, the fifth surface being perpendicular to the third surface and the fourth surface; The antenna module of claim 1 , wherein the second surface and the fifth surface form opposing surfaces.

5. The third surface of the outermost surface of the PCB is A second array antenna arrangement area; The antenna module according to claim 1 , further comprising: a region in which a second ground wall is formed by each of the ground layers arranged on the plurality of layers.

6. A plurality of second connection lines are formed to electrically connect the second array antenna and the RFIC; The plurality of second connection lines are a plurality of second horizontal lines formed in the first layer; a plurality of second vertical lines vertically connecting the first layer to the fifth layer; The antenna module according to claim 1 , further comprising: a plurality of the second coplanar waveguides formed in the fifth layer.

7. The second vertical lines are formed to have a third equal length, The second plurality of coplanar waveguides are formed to have a fourth equal length; The antenna module according to claim 6 , wherein the second connection lines are formed to have the same length.

8. The antenna module according to claim 7 , wherein the second coplanar waveguides are formed in an even number and are formed in a symmetrical structure with respect to an X-axis.

9. The second array antenna comprises 14 antenna elements; four pins arranged in the first region of the RFIC are electrically connected to first to fourth antenna elements of the second array antenna by first to fourth waveguides of the second coplanar waveguide; four pins arranged in the second region of the RFIC are electrically connected to a fifth antenna element, a sixth antenna element, a ninth antenna element, and a tenth antenna element of the second array antenna by a fifth waveguide, a sixth waveguide, a ninth waveguide, and a tenth waveguide of the second coplanar waveguide; four pins arranged in a third region of the RFIC are electrically connected to eleventh to fourteenth antenna elements of the second array antenna by eleventh to fourteenth waveguides of the second coplanar waveguide; 9. The antenna module according to claim 8, wherein two pins arranged in a fourth region of the RFIC are electrically connected to a seventh antenna element and an eighth antenna element of the second array antenna by a seventh waveguide and an eighth waveguide of the second coplanar waveguide.

10. the first region and the third region of the RFIC are disposed in opposing positions; The second region and the fourth region of the RFIC are disposed in opposing positions, The two pins of the fourth region of the RFIC are formed to be at the shortest distance from a seventh antenna element and an eighth antenna element of the second array antenna, The antenna module according to claim 9 , wherein the second coplanar waveguide is formed in a symmetrical structure with respect to a central axis of the seventh antenna element and the eighth antenna element of the second array antenna.

11. 9. The antenna module according to claim 8, wherein the second coplanar waveguide is formed in an X-axis direction, and the first coplanar waveguide is formed in a Y-axis direction.

12. The third array antenna disposed on the fourth surface of the outermost surface of the PCB includes a plurality of antenna elements; each of the plurality of antenna elements comprises two patch antenna structures; a first patch antenna of the two patch antennas is disposed on the fourth surface of the PCB; A second patch antenna of the two patch antennas is disposed apart from the first patch antenna and is disposed on any one of a plurality of layers inside the PCB; The antenna module according to claim 1 , wherein a portion of the first patch antenna and a portion of the second patch antenna are laminated to overlap each other.

13. The fourth surface of the outermost surface of the PCB is formed of a metal layer connected to ground, The antenna module of claim 12 , wherein an inner region of the metal layer is formed of a non-metallic region in which the first patch antenna is disposed.

14. The non-metallic area of ​​the PCB is the same area as the non-metallic area, a first vertical region from an outermost surface of the PCB to a ground layer formed on an upper portion of an inner layer in which the third coplanar waveguide is disposed within the PCB defines a first inner space formed of a dielectric material; A second patch antenna is disposed on the tenth layer of the first internal space; The antenna module according to claim 13 , wherein an outer peripheral surface of the first internal space forms a third ground wall to which grounds of each layer are connected by vias.

15. A plurality of third connection lines are formed to electrically connect the third array antenna and the RFIC; The third connection lines include a plurality of third horizontal lines formed in the first layer; a plurality of third vertical lines vertically connecting the first layer to the seventh layer; a plurality of the third coplanar waveguides formed on the seventh layer; The antenna module of claim 12 , further comprising: a fourth vertical line vertically connecting the third plurality of coplanar waveguides and the second patch antenna.

16. a first length, which is a radius of the first patch antenna, is longer than a second length, which is a radius of the second patch antenna; The antenna module according to claim 15 , wherein a center of the second patch antenna, a center of the first patch antenna, and a feed area of ​​the second patch antenna to which the fourth vertical line is connected are arranged on a straight line.

17. The third vertical lines are formed to have a fifth equal length, The second plurality of coplanar waveguides are formed to have a sixth equal length; The fourth vertical lines are formed to have a seventh equal length; The antenna module according to claim 16 , wherein the third connection lines are formed to have the same length.

18. a third horizontal line formed in the first layer forming a plurality of signal connection lines; Among the plurality of signal connection lines, a first group of the third horizontal lines electrically connected to the second patch antenna is disposed in a first region based on a first horizontal axis; 17. The antenna module of claim 16, wherein a second group of the third horizontal lines, among the plurality of signal connection lines, electrically connected to the second patch antenna, is arranged in a second region based on the first horizontal axis.

19. the third coplanar waveguide formed on the seventh layer forms a plurality of signal connection lines; Among the plurality of signal connection lines, a first group of the third coplanar waveguides electrically connected to the second patch antenna is disposed in a first region with respect to the first horizontal axis; 16. The antenna module according to claim 15, wherein a second group of the third coplanar waveguides, among the plurality of signal connection lines, electrically connected to the second patch antenna, are disposed in a second region with respect to the first horizontal axis.

20. The antenna module according to claim 15 , wherein the third coplanar waveguides are formed in an even number and are formed in a symmetrical structure with respect to an X-axis.

21. the third array antenna comprises 12 antenna elements; the six pins arranged in the second region of the RFIC are electrically connected to the second antenna element, the fourth antenna element, the sixth antenna element, the seventh antenna element, the ninth antenna element, and the eleventh antenna element of the third array antenna by the second waveguide, the fourth waveguide, the sixth waveguide, the seventh waveguide, the ninth waveguide, and the eleventh waveguide arranged in the first region of the third coplanar waveguide; 16. The antenna module according to claim 15, wherein the six pins arranged in the fourth region of the RFIC are electrically connected to the first antenna element, the third antenna element, the fifth waveguide, the eighth waveguide, the tenth waveguide, and the twelfth antenna element of the third array antenna by the first waveguide, the third waveguide, the fifth waveguide, the eighth waveguide, the tenth waveguide, and the twelfth waveguide of the third coplanar waveguide that are arranged in the second region.

22. the third coplanar waveguide disposed in the first region and the third coplanar waveguide disposed in the second region are formed to have a vertically asymmetric structure with respect to a Y axis, the third coplanar waveguide disposed in the first region is formed to have a symmetrical structure with respect to an X-axis, The antenna module according to claim 21 , wherein the third coplanar waveguide arranged in the second region is formed in a symmetrical structure with respect to an X-axis.

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