Imaging apparatus

Abstract

To improve the air-cooling efficiency while suppressing mixing of dust and liquid like water due to air intake.SOLUTION: An imaging apparatus comprises: a first image pick-up device; an image processing chip which performs signal processing on an output signal of the first image pick-up device; a first member which surrounds the first image pick-up device and the image processing chip; a first heat conduction member whose portion is provided on the outside of the first member and which conducts the heat generated in the first image pick-up device to the first direction side where the first image pick-up device is arranged relative to the image processing chip; a second heat conduction member whose portion is provided on the outside of the first member and which conducts the heat generated in the image processing chip to the first direction side; and a second member which covers the first heat conduction member and the second heat conduction member provided on the outside of the first member from the first direction such that the air flows in contact with the first heat conduction member and the second heat conduction member.SELECTED DRAWING: Figure 13

Description

[Technical field]

[0001] The present invention relates to an imaging device. [Background technology]

[0002] A celestial sphere imaging device has a plurality of imaging optical systems each having a wide-angle lens and an imaging sensor for capturing an image by the wide-angle lens. The celestial sphere imaging device obtains an image within a solid angle of 4π steradians by synthesizing the images captured by each imaging optical system (for example, see Patent Document 1 below).

[0003] However, the spherical imaging device of Patent Document 1 does not take into consideration a configuration for dissipating heat from a heat source such as an imaging sensor. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2013-25255 A Summary of the Invention

[0005] The imaging device disclosed in the present application comprises a first imaging element, an image processing chip that processes an output signal of the first imaging element, a first member surrounding the first imaging element and the image processing chip, a first heat transfer member having a portion provided outside the first member and conducting heat generated by the first imaging element toward the image processing chip in a first direction in which the first imaging element is arranged, a second heat transfer member having a portion provided outside the first member and conducting heat generated by the image processing chip toward the first direction, and a second member covering the first heat transfer member and the second heat transfer member provided outside the first member from the first direction so that air flows in contact with the first heat transfer member and the second heat transfer member.

[0006] The imaging device disclosed in the present application includes a first imaging element, an image processing chip that processes an output signal of the first imaging element, a first member that surrounds the first imaging element, the image processing chip, and wiring connecting the first imaging element and the image processing chip, a first heat transfer member that is partially exposed to the outside of the first member and conducts heat generated by the first imaging element, and a second heat transfer member that is partially exposed to the outside of the first member and conducts heat generated by the image processing chip, and the first member, together with the first heat transfer member and the second heat transfer member, forms a flow path through which air flows from an intake port to an exhaust port.

[0007] The imaging device disclosed in this application has a housing having an intake port and an exhaust port, a heat dissipation structure having a flow path through which air flows between the intake port and the exhaust port, and a plurality of heat sources provided within the housing and isolated from the flow path. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of an imaging device according to a first embodiment. [Diagram 2] FIG. 2 is a plan view or a bottom view of the imaging device according to the first embodiment. [Diagram 3] FIG. 3 is a cross-sectional view of the imaging device according to the first embodiment. [Figure 4] FIG. 4 is a perspective view of an example of an arrangement of cooling fans on the heat sink according to the first embodiment. [Diagram 5] FIG. 5 is a side cross-sectional view showing another example of the arrangement of the heat sources according to the first embodiment. [Figure 6] FIG. 6 is a cross-sectional plan view of an imaging device showing another configuration example 1 of the heat sink according to the first embodiment. [Figure 7] FIG. 7 is a cross-sectional plan view of an imaging device showing another configuration example 2 of the heat sink according to the first embodiment. [Figure 8] FIG. 8 is a cross-sectional plan view of an imaging device illustrating another configuration example 3 of the heat sink according to the first embodiment. [Figure 9]FIG. 9 is a cross-sectional plan view of an imaging device illustrating another configuration example 4 of the heat sink according to the first embodiment. [Figure 10] FIG. 10 is a cross-sectional plan view of an imaging device illustrating another configuration example 5 of the heat sink according to the first embodiment. [Figure 11] FIG. 11 is an external view of the imaging device according to the second embodiment. [Figure 12] FIG. 12 is an exploded perspective view of the imaging device according to the second embodiment. [Figure 13] FIG. 13 is a cross-sectional view of the imaging device according to the second embodiment. [Figure 14] FIG. 14 is a perspective view of an example of mounting a cooling device to an imaging device according to a second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS EXAMPLES

[0009] <External appearance of imaging device> Fig. 1 is a perspective view of an imaging device according to a first embodiment, and Fig. 2 is a plan view or a bottom view of the imaging device according to the first embodiment. In Fig. 1, (A) is a front perspective view, and (B) is a rear perspective view. The imaging device 100 has a housing 101. A wide-angle lens 102A is provided on a front plate 101A of the housing 101.

[0010] Wide-angle lens 102B is provided on rear plate 101B of housing 101. Vent 103C is provided on top plate 101C of housing 101. Vent 103D is provided on bottom plate 101D of housing 101. Slits are formed in vents 103C and 103D, and air passes between the slits.

[0011] Wide-angle lens 102A is provided in housing 101 so as to protrude from housing 101. Wide-angle lens 102A receives light from outside housing 101 and emits the light to imaging element 302A (see FIG. 3) arranged at the rear stage. Wide-angle lens 102B is provided in housing 101 so as to protrude from housing 101 in the direction opposite to the direction in which wide-angle lens 102A protrudes. Wide-angle lens 102B receives light from outside housing 101 and emits the light to imaging element 302B (see FIG. 3) arranged at the rear stage.

[0012] At least one of the wide-angle lenses 102A and 102B has an angle of view of 180 degrees or more. The imaging device 100 images a subject over a solid angle of 4π steradians by arranging the two imaging elements 302A and 302B so that they face in opposite directions and arranging the wide-angle lenses 102A and 102B in front of the imaging elements 302A and 302B, respectively.

[0013] <Internal structure of imaging device 100> 3 is a cross-sectional view of the imaging device 100 according to the first embodiment. (A) is a plan cross-sectional view of the imaging device 100, and (B) is a side cross-sectional view of the imaging device 100. The imaging device 100 has lens barrels 301A and 301B, imaging elements 302A and 302B, a circuit board 303, a circuit 304, a heat transfer sheet 305, and a heat sink 306, which is an example of a heat dissipation structure. The imaging elements 302A and 302B and the circuit 304 are heat sources. X is an optical axis common to the wide-angle lenses 102A and 102B. The direction from the rear plate 101B toward the front plate 101A is +X, and the direction from the front plate 101A toward the rear plate 101B is -X.

[0014] Lens barrels 301A and 301B respectively hold wide-angle lenses 102A and 102B at one end exposed to the outside, and hold imaging elements 302A and 302B at the other end inside housing 101.

[0015] The imaging elements 302A and 302B are disposed behind the wide-angle lenses 102A and 102B, respectively, and receive light collected by the wide-angle lenses 102A and 102B and convert it into an electrical signal. The imaging element 302A is connected to a heat sink 306 via a heat transfer sheet 305. The imaging element 302B is connected to the heat sink 306.

[0016] Furthermore, the imaging elements 302A and 302B are electrically connected to the circuit 304 via the circuit board 303 by a flexible wiring board (not shown) present in the internal space 300. This allows image signals from the imaging elements 302A and 302B to be output to the circuit 304. The internal space 300 is an enclosed space within the imaging device 100 excluding the heat sink 306 and the through-hole 306a.

[0017] The imaging elements 302A and 302B may be, for example, XY address type solid-state imaging elements (for example, CMOS (Complementary Metal-Oxide Semiconductor) sensors) or sequential scan type solid-state imaging elements (for example, CCD (Charge Coupled Device)).

[0018] A plurality of light receiving elements (pixels) are arranged in a matrix on the light receiving surfaces of the imaging elements 302A and 302B. A plurality of types of color filters that transmit light of different color components are arranged in the pixels of the imaging elements 302A and 302B according to a predetermined color array (for example, a Bayer array). Therefore, each pixel of the imaging elements 302A and 302B outputs an analog electrical signal corresponding to each color component to the circuit 304 by color separation by the color filter. Note that the amounts of heat generated by the imaging elements 302A and 302B may be different as long as they are smaller than the amount of heat generated by the circuit 304.

[0019] The image sensors 302A and 302B each have an AFE (Analog Front End). The AFE is an analog front-end circuit that performs signal processing on analog electrical signals from the image sensors 302A and 302B. The AFE sequentially performs gain adjustment of the electrical signals, analog signal processing (correlated double sampling, black level correction, etc.), A / D conversion processing, and digital signal processing (defective pixel correction, etc.) to generate RAW image data and output it to the circuit 304.

[0020] The circuit board 303 is a board on which the circuit 304 is mounted. The circuit board 303 is disposed between the image sensor 302A and the heat sink 306 along a direction perpendicular to the optical axis X. The circuit board 303 has wiring that electrically connects the circuits 304 to each other. The circuit board 303 electrically connects the image sensor 302A, 302B to the circuit 304 by a flexible wiring board (not shown). The circuit 304 is a device mounted on the circuit board 303, and is connected to the heat sink 306 directly or via a heat transfer pad (not shown). This allows heat generated in the circuit 304 to be transferred to the heat sink 306.

[0021] Specifically, the circuit 304 includes, for example, a processor, a memory, and an LSI such as an ASIC (Application Specific Integrated Circuit) or an FPGA (Field-Programmable Gate Array).

[0022] The processor controls the imaging device 100. The processor executes a program. The memory stores the program executed by the processor, data prepared in advance, and data obtained by execution processing of the processor or LSI.

[0023] The LSI executes specific signal processing, such as image processing and compression / expansion processing, using electrical signals from the imaging elements 302A and 302B. This specific signal processing may be realized by a processor executing a program stored in a memory. For example, the LSI that executes image processing and the processor that executes the image processing program stored in a memory are image processing chips. In this way, since the circuit 304 executes various processes, the amount of heat generated by the circuit 304 is greater than that of the imaging elements 302A and 302B. The LSI that executes image processing is referred to as an image processing chip.

[0024] The heat transfer sheet 305 is a sheet having thermal conductivity and flexibility. The heat transfer sheet 305 is, for example, a copper foil or a graphite sheet. One end of the heat transfer sheet 305 is connected to the imaging element 302A directly or via a heat transfer pad (not shown). The other end of the heat transfer sheet 305 is connected to the outer surface of the heat sink 306. In this way, the heat transfer sheet 305 absorbs heat generated by the imaging element 302A and transfers it to the heat sink 306.

[0025] The heat sink 306 is provided between the circuit 304 and the imaging element 302B. The heat sink 306 is a thermally conductive heat dissipation member such as aluminum. The heat sink 306 is cylindrical, and its through hole 306a extends in a direction perpendicular to the optical axis X. Specifically, for example, one end of the through hole 306a communicates with the ventilation hole 103D of the bottom plate 101D, and the other end of the through hole 306a communicates with the ventilation hole 103C of the top plate 101C.

[0026] A lower edge 306c of the heat sink 306 contacts the surface of the bottom plate 101D facing the housing 101, covering the ventilation hole 103D. Similarly, an upper edge 306b of the heat sink 306 contacts the surface of the top plate 101C facing the housing 101, covering the ventilation hole 103C. This separates the housing 101 into the through hole 306a and an internal space 300 excluding the heat sink 306 and the through hole 306a. That is, the internal space 300 is sealed by the inner wall surface of the housing 101 and the outer wall surface of the heat sink 306, preventing the intrusion of dust, water, and other liquids through the ventilation holes 103C, 103D, and the through hole 306a during air cooling.

[0027] Heat sink 306 is fixed to circuit 304 and imaging element 302B directly or via a heat transfer pad (not shown). Therefore, heat sink 306 can absorb heat generated by circuit 304 and imaging element 302B. In addition, heat sink 306 is connected to heat transfer sheet 305 on its outer surface. This allows heat sink 306 to absorb heat generated by imaging element 302A via heat transfer sheet 305.

[0028] Assume that air outside the housing 101 flows in through the ventilation opening 103D of the bottom panel 101D due to, for example, the wind direction or the movement of the imaging device 100. As described above, since the heat sink 306 absorbs heat from the circuit 304 and the imaging elements 302A and 302B, the air that has flowed in flows in the direction of the thick arrow in (B) while being warmed by the heat from the inner wall surface of the heat sink 306, and is discharged from the ventilation opening 103C.

[0029] As a result, the circuit 304 and the imaging elements 302A and 302B in the internal space 300 are cooled by the air flowing outside the internal space 300 (through-hole 306a). Therefore, even if dust or liquid such as water flows into the through-hole 306a together with the air, it does not enter the internal space 300. This makes it possible to suppress malfunctions and lens stains caused by the intrusion of dust, water, or other liquid.

[0030] The air may flow in through the ventilation hole 103C and be discharged through the ventilation hole 103D. The heat sink 306 may be disposed so that the through hole 306a faces in a direction perpendicular to both side surfaces of the housing 101.

[0031] <Cooling fan layout example> FIG. 4 is a perspective view showing an example of arrangement of a cooling fan on a heat sink 306 according to the first embodiment. In the first embodiment, as shown in FIG. 3, the imaging device 100 may not include a cooling fan, and as shown in FIG. 4, the imaging device 100 may include a cooling fan 400. The cooling fan 400 is arranged in a through hole 306a of the heat sink 306. The cooling fan 400 is electrically connected to the circuit 304 via the circuit board 303 by a wiring (not shown) that is routed from the inner wall surface of the through hole 306a where the cooling fan 400 and the heat sink 306 contact each other to the inside of the heat sink 306. This allows the imaging device 100 to drive and control the cooling fan 400 from the circuit 304.

[0032] 4, (A) to (C), the rotation axis of cooling fan 400 is in the same direction as through-hole 306a, and cooling fan 400 draws in air from lower end opening 306e of heat sink 306 and exhausts air from upper end opening 306d.

[0033] 1A shows a configuration in which the cooling fan 400 is disposed at the upper end opening 306d of the heat sink 306. As a result, the cooling fan 400 draws air into the heat sink 306 from the lower end opening 306e. The air absorbs heat from the inner wall surface of the through hole 306a of the heat sink 306. The cooling fan 400 expels the air that has absorbed the heat and been warmed to the outside of the housing 101.

[0034] 1B shows a configuration in which cooling fan 400 is disposed at bottom end opening 306e of heat sink 306. As a result, cooling fan 400 draws air from outside housing 101 through bottom end opening 306e and causes the air to flow into heat sink 306. The air that has flowed in absorbs heat from the inner wall surface of through hole 306a while moving toward top end opening 306d, and is exhausted to the outside of housing 101.

[0035] 1C shows a configuration in which the cooling fan 400 is disposed inside the through hole 306a of the heat sink 306. As a result, the cooling fan 400 causes air to flow in from the lower end opening 306e inside the through hole 306a and expels it to the upper end opening 306d. The air absorbs heat from the inner wall surface of the through hole 306a from the lower end opening 306e to the upper end opening 306d.

[0036] In this way, by mounting cooling fan 400, it is possible to forcibly air-cool the inside of housing 101. Note that since the arrangement position of cooling fan 400 differs between configurations (A) to (C), one of configurations (A) to (C) is adopted in consideration of the weight balance with other parts inside housing 101.

[0037] <Other examples of heat source arrangement> Fig. 5 is a side cross-sectional view showing another example of the arrangement of the heat source according to the first embodiment. In Fig. 5, the vent hole 103D is an intake hole, and the vent hole 103C is an exhaust hole. In Fig. 3, the circuit 304 and the imaging element 302B are connected at positions at the same distance from the bottom plate 101D on the opposite sides of the heat sink 306. In Fig. 5, the circuit 304 and the imaging element 302B are connected at positions at different distances from the bottom plate 101D on the opposite sides of the heat sink 306.

[0038] Specifically, imaging element 302B generates less heat than circuit 304. For this reason, imaging element 302B is connected upstream of circuit 304 in the air flow, for example, to the lower end side of heat sink 306 near ventilation hole 103D. On the other hand, circuit 304 generates more heat than imaging element 302B. For this reason, circuit 304 is connected downstream of image sensor 302B in the air flow, for example, to the upper end side of heat sink 306 near ventilation hole 103C.

[0039] In this way, the heat source (imaging elements 302A, 302B) that generates a relatively small amount of heat is connected to the outer surface of the heat sink 306 on the upstream side of the air flow, and the heat source (circuit 304) that generates a relatively large amount of heat is connected to the outer surface of the heat sink 306 on the downstream side of the air flow. As a result, even if the air that absorbs heat on the upstream side of the through hole 306a flows downstream, it is possible to sufficiently absorb the heat dissipated from the circuit 304 and suppress the temperature rise of the downstream heat source (circuit 304) due to heat transfer from the downstream air. Therefore, efficient air cooling can be achieved. In addition, in the configuration of FIG. 5, a cooling fan 400 may be mounted as shown in (A) to (C) of FIG. 4. This allows rapid air cooling.

[0040] <Other configuration examples of the heat sink 306> Next, another configuration example of the heat sink 306 will be described.

[0041] 6 is a plan cross-sectional view of the imaging device 100 showing another configuration example 1 of the heat sink 306 according to the first embodiment. The heat sink 306 has shielding members 601-603. The shielding members 601-603 extend from the upper end opening 306d to the lower end opening 306e in the penetrating direction of the through hole 306a. The shielding members 601-603 divide the heat sink 306 into sections 612, 613, and 623 for each heat source. The shielding members 601-603 are made of a material having a lower thermal conductivity than the heat sink 306, such as plastic. This suppresses heat transfer between the sections 612, 613, and 623, making it easier to store heat in each of the sections 612, 613, and 623.

[0042] The positions of the shielding members 601-603 are determined by the heat sources (circuit 304, imaging elements 302A, 302B) connected to sections 612, 613, 623. The larger the heat source that generates a large amount of heat is connected to the section, the larger the area is desired to increase the amount of heat storage. For this reason, the positions of the shielding members 601-603 are determined so that the greater the amount of heat generated, the longer the distance between the shielding members 601-603 (for example, so as to be proportional to the power consumption of the heat source). Here, the distance between the shielding members 601 and 602 along the heat sink 306 is D12, the distance between the shielding members 601 and 603 is D13, and the distance between the shielding members 602 and 603 is D23.

[0043] For example, the circuit 304 generates more heat than the imaging elements 302A and 302B. Therefore, the distance D12 of the section 612 to which the circuit 304 is connected is longer than the distances D12 and D23 of the sections 612 and 613 to which the imaging elements 302A and 302B are connected. As a result, the shielding members 601 to 603 are arranged so that the area of ​​the heat sink 306 to which the circuit 304 is connected is larger than the area of ​​the heat sink 306 to which the imaging elements 302A and 302B are connected.

[0044] In this way, by providing the shielding members 601-603 on the heat sink 306 and forming the sections 612, 613, 623, it is possible to suppress the transfer of heat between heat sources via the heat sink, and for example, it is possible to prevent a heat source with a large amount of heat from heating a heat source with a small amount of heat, and it is possible to achieve efficient air cooling according to the amount of heat generated. In addition, in the configuration of Fig. 6, a cooling fan 400 may be mounted as shown in Figs. 4(A)-(C). This allows for rapid air cooling.

[0045] 7 is a plan sectional view of the imaging device 100 showing another configuration example 2 of the heat sink 306 according to the first embodiment. The other configuration example 2 is a configuration in which a partition plate 700 is further provided in the other configuration example 1 of FIG. 6. The partition plate 700 is a plate-like member that connects the shielding members 601 to 603 and extends in the penetrating direction of the through-hole 306a from the upper end opening 306d to the lower end opening 306e. The partition plate 700, like the shielding members 601 to 603, is made of a material having lower thermal conductivity than the heat sink 306, such as plastic. The partition plate 700 divides the through-hole 306a into three through-holes 712, 713, and 723.

[0046] As a result, the air flowing through through hole 712 cools section 612 to which heat generated from circuit 304 is conducted. The air flowing through through hole 713 cools section 613 to which heat generated from image sensor 302A is conducted via heat transfer sheet 305. The air flowing through through hole 723 cools section 623 to which heat generated from image sensor 302B is conducted.

[0047] In this way, by providing the partition plate 700 inside the heat sink 306, it is possible to suppress the transfer of heat between the through holes 712, 713, and 723, and it is possible to air-cool each of the sections 612, 613, and 623 independently. In the configuration of Fig. 6, the cooling fan 400 may be mounted as shown in Fig. 4(A) and (B). This allows for rapid air-cooling.

[0048] FIG. 8 is a plan sectional view of the imaging device 100 showing another configuration example 3 of the heat sink 306 according to the first embodiment. The other configuration example 3 is an example in which the heat sink 306 is recessed in the optical axis X direction. The heat sink 306 has recesses 800A, 800B at the connection points of the circuit 304 and the imaging element 302B. The distance D1 between the recesses 800A, 800B is shorter than the width D2 in the optical axis X direction of the through hole 306a in which the recesses 800A, 800B are not formed. Therefore, when air flows into the through hole 306a, the air flows faster in the space 801 between the recesses 800A, 800B than in the space 802 of the through hole 306a in which the recesses 800A, 800B are not formed, and heat is easily absorbed from the inner wall surfaces of the recesses 800A, 800B. Therefore, the air cooling efficiency in the space 801 is improved.

[0049] Furthermore, since the circuit 304 and the image sensor 302B are housed in the recesses 800A and 800B outside the heat sink 306, the thickness of the housing 101 in the direction of the optical axis X is accordingly reduced. This allows the image pickup device 100 to be made more compact. In the configuration of FIG. 8, a cooling fan 400 may be mounted as shown in FIGS. 4(A) to (C). This allows for rapid air cooling.

[0050] 9 is a plan cross-sectional view of the imaging device 100 showing another configuration example 4 of the heat sink 306 according to the first embodiment. The other configuration example 4 is an example in which the other configuration example 1 (FIG. 6) and the other configuration example 3 (FIG. 8) are combined. As in the other configuration example 1 (FIG. 6), the heat sink 306 is provided with the shielding members 601-603 to form the sections 612, 613, and 623, so that it is possible to suppress the transfer of heat between the heat sources via the heat sink, and for example, it is possible to prevent a heat source with a small amount of heat generation from being heated by heat from a heat source with a large amount of heat generation, and to enable efficient air cooling according to the amount of heat generation.

[0051] As in the third configuration example (FIG. 8), the air flows faster in the space 801 than in the space 802, improving the air-cooling efficiency in the space 801. Since the circuit 304 and the image sensor 302B are accommodated in the recesses 800A and 800B outside the heat sink 306, the thickness of the housing 101 in the direction of the optical axis X is reduced accordingly. This allows the image pickup device 100 to be made more compact. In the configuration of FIG. 9, the cooling fan 400 may be mounted as shown in (A) to (C) of FIG. 4. This allows for rapid air-cooling.

[0052] 10 is a plan cross-sectional view of the imaging device 100 showing another configuration example 5 of the heat sink according to the first embodiment. Another configuration example 5 is an example in which another configuration example 2 (FIG. 7) and another configuration example 3 (FIG. 8) are combined. As in another configuration example 2 (FIG. 7), by providing the partition plate 700 in the heat sink 306, it is possible to suppress the transfer of heat between the through holes 712, 713, and 723, and it is possible to air-cool each of the sections 612, 613, and 623 independently.

[0053] As in the third configuration example (FIG. 8), the air flows faster in the space 801 than in the space 802, improving the air-cooling efficiency in the space 801. Since the circuit 304 and the image sensor 302B are accommodated in the recesses 800A and 800B outside the heat sink 306, the thickness of the housing 101 in the optical axis X direction is accordingly reduced. This allows the image pickup device 100 to be made smaller. In the configuration of FIG. 10, the cooling fan 400 may be mounted as shown in FIGS. 4A and 4B. This allows for rapid air-cooling.

[0054] In this way, according to the first embodiment, it is possible to improve the air-cooling efficiency in the imaging device 100 while suppressing the intrusion of dust, water, and other liquids due to intake into the space in which the circuit 304, the imaging elements 302A and 302B, etc. are present. In the imaging device 100, the wide-angle lens 102A, the imaging element 302A, the circuit 304, the heat sink 306, the imaging element 302B, and the wide-angle lens 102B are arranged on the X axis in this order in the -X direction. The imaging device 100 in which the combination of the wide-angle lens 102A and the imaging element 302A and the combination of the wide-angle lens 102B and the imaging element 302B are arranged back-to-back in the opposite directions images an object at a solid angle of 4π steradians.

[0055] Therefore, when a new mechanism such as the heat sink 306 is added to the inside of the imaging device 100, it is necessary to expand the housing 101 to accommodate the new mechanism. For example, if the housing 101 is elongated in a direction perpendicular to the optical axis X (for example, toward the bottom panel 101D) without changing the thickness of the housing 101 in the optical axis X direction, an image of the expanded part of the housing 101 will be reflected.

[0056] For this reason, it is preferable to arrange the heat sink 306, the circuit 304, and the circuit board 303 on the optical axis X and between the image pickup elements 302A and 302B. By arranging them in this manner, it is possible to suppress the image of the housing 101 from being reflected. EXAMPLES

[0057] Next, a second embodiment will be described. The imaging device 100 according to the first embodiment has a heat sink 306 having a through hole 306a as an air flow path, and has a structure in which the through hole 306a is isolated from the internal space 300 of the housing 101 that houses a heat source such as a circuit 304 and image sensors 302A and 302B. In contrast, the imaging device according to the second embodiment has a heat dissipation structure in which the circuit 304 and image sensors 302A and 302B, which are heat sources, are housed in a housing case and sealed within the imaging device, and heat generated by the heat source in the housing case is dissipated to the outside of the imaging device in the space outside the housing case within the imaging device. Note that the same components as those in the first embodiment are given the same reference numerals, and their description will be omitted.

[0058] <External Appearance of Imaging Device 1100> 11 is an external view of an imaging device 1100 according to a second embodiment. (A) is a perspective view of the imaging device 1100, and (B) is a front view of the imaging device 1100. The imaging device 1100 has a front plate 1101A, a housing case 1101, and a back plate 1101B that constitute a housing. A wide-angle lens 102A is inserted in the center of the front plate 1101A and is exposed. In addition, ventilation holes 1102 to 1104 are provided on the left and right sides and below the wide-angle lens 102A of the front plate 1101A. The front plate 1101A and the back plate 1101B sandwich the housing case 1101 to form a top surface 1101C, a bottom surface 1101D, and a side surface 1101E of the imaging device 1100.

[0059] <Internal structure of the imaging device 1100> Fig. 12 is an exploded perspective view of the imaging device 1100 according to the second embodiment. Fig. 13 is a cross-sectional view of the imaging device 1100 according to the second embodiment. In Fig. 13, (A) is a side cross-sectional view taken along line AA in Fig. 11, (B) is a plan cross-sectional view taken along line BB in Fig. 11, and (C) is a side cross-sectional view taken along line CC in Fig. 11. The storage case 1101 has a box portion 1200A and a lid portion 1200B. An opening 1200A0 of the box portion 1200A is sealed by the lid portion 1200B.

[0060] The box 1200A has a holder 1200Aa and openings 1200Ab2 to 1200Ab4. The holder 1200Aa is, for example, a hollow cylindrical shape, and has a through hole 1200Aa1 into which the lens barrel 1201A can be inserted. The holder 1200Aa holds the lens barrel 1201A by inserting the lens barrel 1201A into the through hole 1200Aa1.

[0061] This seals the through hole 1200Aa1. Therefore, the subject can be captured by the imaging element 302A while preventing dust, water, and other liquids from entering the housing case 1101 through the through hole 1200Aa1. The holding portion 1200Aa is inserted into the opening 1105A of the front plate 1101A.

[0062] The openings 1200Ab2 to 1200Ab4 are provided at positions facing the ventilation holes 1102 to 1104, respectively. The opening 1200Ab2 is sealed by a first heat transfer plate 1212, which will be described later. The opening 1200Ab3 is sealed by a second heat transfer plate 1213. The opening 1200Ab4 is sealed by a fourth heat transfer plate 1215, which will be described later. Therefore, it is possible to dissipate heat from inside the housing case 1101 to the outside of the housing case 1101 while preventing the intrusion of dust, water, or other liquids into the housing case 1101 through the openings 1200Ab2 to 1200Ab4.

[0063] Heat sinks 1202-1204 are accommodated in the space between the front plate 1101A and the box portion 1200A. The heat sink 1202 is disposed between the ventilation hole 1102 and the opening 1200Ab2 of the front plate 1101A. The heat sink 1203 is disposed between the ventilation hole 1103 and the opening 1200Ab3 of the front plate 1101A. The heat sink 1204 is disposed between the ventilation hole 1104 and the opening 1200Ab4 of the front plate 1101A. The front plate 1101A is fixed to the box portion 1200A. The rear plate 1101B is also fixed to the box portion 1200A.

[0064] 13C, a vent 1302 serving as an exhaust port is provided near the heat sink 1204. The vent 1302 communicates with the space between the front plate 1101A and the housing case 1101. This forms a flow path F (see FIG. 14) that runs from the vents 1102-1104 to the vent 1302 via the heat sinks 1202-1204. Therefore, the heat sinks 1202-1204 are cooled by air flowing in from the vents 1102-1104. Then, the air to which heat has been transferred from the heat sinks 1202-1204 is exhausted from the vent 1302.

[0065] Accommodating case 1101 accommodates imaging elements 302A and 302B, circuit board 303, circuit 304, first heat transfer plate 1212, second heat transfer plate 1213, third heat transfer plate 1214, and fourth heat transfer plate 1215. Circuit board 303 electrically connects imaging elements 302A and 302B to circuit 304 via a flexible wiring board (not shown). This flexible wiring board is also accommodated in accommodating case 1101. First heat transfer plate 1212, second heat transfer plate 1213, third heat transfer plate 1214, and fourth heat transfer plate 1215 are, for example, thermally conductive plates such as copper plates.

[0066] A lens barrel 1201A is attached to the imaging element 302A. The lens barrel 1201A is inserted into a through hole 1200Aa1 of the holding portion 1200Aa. As a result, the through hole 1200Aa1 of the lens barrel 1201A is sealed by the imaging element 302A.

[0067] The first heat transfer plate 1212 is disposed parallel to the circuit board 303 so as to be perpendicular to the optical axis X. The first heat transfer plate 1212 is fixed to the imaging element 302A directly or via a heat transfer pad (not shown). This allows the first heat transfer plate 1212 to absorb heat from the imaging element 302A. The first heat transfer plate 1212 is also fixed to the rear surface of the box part 1200A and seals the opening 1200Ab2 of the box part 1200A. This prevents liquids such as dust and water from entering the inside of the housing case 1101 through the opening 1200Ab2.

[0068] By sealing the opening 1200Ab2, a part of the first heat transfer plate 1212 is exposed from the opening 1200Ab2. As a result, the first heat transfer plate 1212 conducts heat absorbed from the imaging element 302A to the heat sink 1202 from this exposed surface. That is, the first heat transfer plate 1212 and the heat sink 1202 serve as heat transfer members that conduct heat generated by the imaging element 302A in the housing case 1101 to the outside of the housing case 1101. The heat transfer path R2 is from the imaging element 302A to the heat sink 1202. Therefore, the heat generated by the imaging element 302A is conducted to the air outside the housing case 1101 via the heat sink 1202, and the air is discharged to the outside of the imaging device 1100 from the ventilation hole 1102.

[0069] The second heat transfer plate 1213 is disposed parallel to the optical axis X so as to be perpendicular to the circuit board 303. One end 1213a and the other end 1213b of the second heat transfer plate 1213 are bent so as to be parallel to the circuit board 303. The bent end 1213a of the second heat transfer plate 1213 is fixed to the imaging element 302B directly or via a heat transfer pad (not shown). As a result, the second heat transfer plate 1213 absorbs heat from the imaging element 302B. In addition, the bent other end 1213b of the second heat transfer plate 1213 is fixed to the rear surface of the box part 1200A and seals the opening 1200Ab3 of the box part 1200A. As a result, the intrusion of liquids such as dust and water into the inside of the housing case 1101 from the opening 1200Ab3 is suppressed.

[0070] By sealing the opening 1200Ab3, the other end 1213b of the second heat transfer plate 1213 is exposed from the opening 1200Ab3. As a result, the second heat transfer plate 1213 conducts heat absorbed from the imaging element 302B to the heat sink 1203 from the exposed other end 1213b. That is, the second heat transfer plate 1213 and the heat sink 1203 serve as heat transfer members that conduct heat generated by the imaging element 302B in the housing case 1101 to the outside of the housing case 1101. The heat transfer path R3 is from the imaging element 302B to the heat sink 1203. Therefore, the heat generated by the imaging element 302B is conducted to the air outside the housing case 1101 via the heat sink 1203, and the air is discharged to the outside of the imaging device 1100 from the ventilation hole 1103.

[0071] The third heat transfer plate 1214 is disposed parallel to the circuit board 303 so as to be perpendicular to the optical axis X. The third heat transfer plate 1214 connects the imaging element 302B and the second heat transfer plate 1213. The third heat transfer plate 1214 conducts heat generated by the imaging element 302B to the second heat transfer plate 1213.

[0072] The fourth heat transfer plate 1215 is disposed parallel to the circuit board 303 so as to be perpendicular to the optical axis X. The fourth heat transfer plate 1215 is fixed to the circuit 304 via a heat transfer pad 1303 (see FIG. 13). This allows the fourth heat transfer plate 1215 to absorb heat generated from the circuit 304. The fourth heat transfer plate 1215 is also fixed to the box part 1200A and seals the opening 1200Ab4. This prevents dust, water, and other liquids from entering the housing case 1101 through the opening 1200Ab4.

[0073] By sealing the opening 1200Ab4, the fourth heat transfer plate 1215 is exposed from the opening 1200Ab4. As a result, the fourth heat transfer plate 1215 conducts heat absorbed from the circuit 304 to the heat sink 1204 from its exposed surface. That is, the fourth heat transfer plate 1215 and the heat sink 1204 serve as heat transfer members that conduct heat generated in the circuit 304 in the casing 1101 to the outside of the casing 1101. The heat transfer path R4 is from the circuit 304 to the heat sink 1204. Therefore, the heat generated from the circuit 304 is conducted to the air outside the casing 1101 via the heat sink 1203, and the air is discharged to the outside of the imaging device 1100 from the ventilation hole 1104.

[0074] Furthermore, the first heat transfer plate 1212, the second heat transfer plate 1213, the third heat transfer plate 1214, and the fourth heat transfer plate 1215 do not contact each other. This suppresses the transfer of heat between the first heat transfer plate 1212, the second heat transfer plate 1213, the third heat transfer plate 1214, and the fourth heat transfer plate 1215. In particular, this suppresses the transfer of heat from the circuit 304, which generates a relatively large amount of heat, to the image pickup elements 302A and 302B, which generate a relatively small amount of heat. This suppresses the reduction in air-cooling efficiency.

[0075] In (A) and (C) of FIG. 13, a battery 1300 is accommodated in the accommodation case 1101. The battery 1300 supplies power to the circuit 304 and the image pickup elements 302A and 302B via the circuit board 303 by a flexible wiring board (not shown) in the accommodation case 1101. The battery 1300 may be rechargeable. In the second embodiment, the battery 1300 is disposed at a position where it does not overlap with the heat sink 1202, the heat sink 1203, and the heat sink 1204 in the optical axis X direction. This makes it possible to prevent the image pickup device 1100 from becoming large. Also, in (A) of FIG. 13, a screw groove 1301 is provided near the heat sink 1204.

[0076] <Example of installing Cooling Fan 400> 14 is a perspective view showing an example of mounting a cooling device to an imaging device 1100 according to Example 2. Fig. 14 shows the internal structures of the imaging device 1100 and the cooling device 1400. The cooling device 1400 is detachable from the imaging device 1100.

[0077] The cooling device 1400 accommodates the cooling fan 400 in a housing 1401. The housing 101 is, for example, rectangular parallelepiped-shaped, and has an attachment / detachment mechanism 1403 on one side thereof. The attachment / detachment mechanism 1403 has a structure including a dial 1403a and a screw (not shown) on its rotation axis. When the dial 1403a is rotated in one direction, the screw enters the screw groove 1301 shown in FIG. 13 and engages with the screw groove 1301, and when the dial 1403a is rotated in the other direction, the screw retreats and disengages from the screw groove 1301. Note that the attachment / detachment mechanism 1403 is not limited to the engagement / detachment between the screw and the screw groove 1301, such as a latch mechanism, as long as it can be freely attached to and detached from the imaging device 1100.

[0078] Moreover, an intake port 1401a is provided on the side surface of the housing 101 on which the attachment / detachment mechanism 1403 is provided. The intake port 1401a communicates with the ventilation port 1302 when the cooling device 1400 is attached to the imaging device 1100. Moreover, an exhaust port 1401b is provided on the other side surface of the housing 101 different from the side surface on which the attachment / detachment mechanism 1403 is provided.

[0079] The cooling fan 400 forcibly draws in air to which heat has been transferred inside the imaging device 1100 through an air intake 1401a as the fan rotates, and exhausts the air through an air exhaust 1401b. The cooling fan 400 receives power from a power source (not shown) in the housing 101 or a battery 1300 of the imaging device 1100, and starts or stops the fan from rotating when an operation button 1404 is pressed.

[0080] In this way, the cooling device 1400 is detachable from the imaging device 1100. As a result, when forced air-cooling is not required, the cooling device 1400 can be detached to reduce the weight of the imaging device 1100. In other words, when air-cooling becomes necessary, the cooling device 1400 can be attached to the imaging device 1100 and the cooling fan 400 can be driven.

[0081] In this way, according to the second embodiment, it is possible to improve the air-cooling efficiency within the imaging device 1100 while suppressing the intrusion of dust, water, and other liquids due to intake air into the space in which the circuit 304, the imaging elements 302A and 302B, etc. are present.

[0082] Also, heat sinks 1202 and 1203 that dissipate heat from a heat source (imaging elements 302A and 302B) that generates a relatively small amount of heat are disposed near the vents 1102 and 1103 on the upstream side of flow path F. A heat sink 1204 that dissipates heat from a heat source (circuit 304) that generates a relatively large amount of heat is disposed near the vent 1302 on the downstream side of flow path F. This allows air that has absorbed heat on the upstream side of flow path F to flow downstream, but is able to sufficiently absorb the heat dissipated from the circuit 304 and suppress a temperature rise in the downstream heat source (circuit 304) due to heat transfer from the downstream air. Therefore, efficient air cooling can be achieved.

[0083] Furthermore, by providing the ventilation hole 1104, the heat sink 1204 absorbs heat not only with the air heated by the heat sinks 1202 and 1203, but also with air from outside the imaging device 1100 that is not heated by the heat sinks 1202 and 1203. This makes it possible to improve the cooling efficiency of the circuit 304.

[0084] Furthermore, in imaging device 1100, wide-angle lens 102A, imaging element 302A, heat sinks 1202-1204, circuit 304, imaging element 302B, and wide-angle lens 102B are arranged on the X axis in this order in the -X direction. Imaging device 1100 in which a combination of wide-angle lens 102A and imaging element 302A and a combination of wide-angle lens 102B and imaging element 302B are arranged back-to-back in the opposite direction images a subject over a solid angle of 4π steradians.

[0085] Therefore, when adding a new mechanism such as heat sinks 1202-1204 to the inside of imaging device 1100, it is necessary to expand imaging device 1100 to accommodate the new mechanism. For example, if imaging device 1100 is elongated in a direction perpendicular to optical axis X (for example, toward bottom panel 101D) without changing the thickness of imaging device 1100 in the optical axis X direction, an image of the expanded part of imaging device 1100 will be reflected.

[0086] For this reason, it is preferable to arrange the heat sinks 1202 to 1204, the circuit 304, and the circuit board 303 on the optical axis X and between the image pickup elements 302A and 302B. By arranging them in this manner, it is possible to suppress reflection of the image of the image pickup device 1100.

[0087] Also, the vents 1102-1104 that supply air from outside the imaging device 1100 are concentrated in the front plate 1101A as air intakes. This allows the front plate 1101A to receive the wind and suck in air, thereby allowing the imaging elements 302A, 302B and the circuit 304 on the front plate 1101A side to be collectively air-cooled.

[0088] For example, when imaging device 1100 provided on a moving object (a person, a bicycle, or an automobile) moves together with the moving object with the +X direction as its travel direction, air flows into the space between front plate 1101A and housing case 1101 from ventilation openings 1102-1104. Then, the flowing-in air is exhausted from ventilation opening 1302 without flowing into housing case 1101. Therefore, it is possible to improve the air-cooling efficiency in imaging device 1100 while suppressing the intrusion of dust, water, or other liquids due to intake air.

[0089] 11 to 14, the heat sink 1202 and the heat sink 1203 are disposed on either side of the optical axis X. The heat sink 1204 is disposed so as to be located between the heat sink 1202 and the heat sink 1203 and the ventilation hole 1302. With this configuration, it is possible to prevent the image pickup device 1100 from becoming large and to perform efficient air cooling.

[0090] 11 to 14, the heat sink 1202, the heat sink 1203, and the heat sink 1204 are all arranged on one lens barrel 1201A side of the imaging device 1100. However, this is not limiting, and one or two of the heat sink 1202, the heat sink 1203, and the heat sink 1204 may be arranged on the other lens barrel 1201B side.

[0091] For example, in a configuration in which the heat sink 1202 is disposed on the other barrel 1201B side, a heat transfer plate 1212 is formed so that heat is transferred to the heat sink 1202 disposed on the other barrel 1201B side, and an air intake is provided on the other barrel 1201B, and heat is dissipated by an air flow formed from the air intake toward the exhaust port 1401b. Similarly, in a configuration in which the heat sinks 1203 and 1204 are disposed on the other barrel 1201B side, heat transfer plates 1213 and 1214 and an air intake are formed.

[0092] 11 to 14, the heat sink 1204 is arranged on the opposite side of the optical axis X to the battery 1300, but the present invention is not limited to this, and the heat sink 1204 may be arranged on the same side as the battery 1300. In this case, the ventilation hole 1302 is provided on the end face of the housing case 1101 opposite to the example in FIGS. 11 to 14.

[0093] As described above, the imaging devices 100 and 1100 according to the first and second embodiments dissipate heat transferred from a heat source sealed inside the imaging device 100 and 1100 to an open portion inside the imaging device 100 and 1100 to the outside of the imaging device. This prevents the heat source from being directly exposed to wind, improving dustproofness and waterproofness.

[0094] The present invention is not limited to the above, and may be implemented by any combination of the above. In addition, other embodiments that are conceivable within the scope of the technical concept of the present invention are also included in the scope of the present invention. [Explanation of symbols]

[0095] 100 imaging device, 101 housing, 103C, 103D ventilation hole, 300 internal space, 302A, 302B imaging element, 303 circuit board, 304 circuit, 305 heat transfer sheet, 306 heat sink, 306a through hole, 400 cooling fan, 601 to 603 shielding member, 1100 imaging device, 1101 housing case, 1101A front plate, 1101B rear plate, 1102 to 1104 ventilation hole, 1200A box part, 1200Aa holding part, 1200B lid part, 1202 to 1204 heat sink, 1212 to 1215 heat transfer plate, 1300 battery, 1302 ventilation hole, 1400 cooling device

Claims

1. a housing having an intake port and an exhaust port; a heat dissipation structure having a flow path through which air flows between the intake port and the exhaust port; A plurality of heat sources provided in the housing and isolated from the flow path; An imaging device having the above configuration.

2. 2. The imaging device according to claim 1, an imaging device having a cooling fan that takes in air from the intake port and exhausts it to the exhaust port through the flow path;

3. 3. The imaging device according to claim 1, The imaging device, wherein the heat dissipation structure is a cylindrical body having the flow path.

4. 4. The imaging device according to claim 3, At least one of the plurality of heat sources is disposed in contact with the heat dissipation structure.

5. 5. The imaging device according to claim 4, The heat dissipation structure of the imaging device is formed of a heat transfer member.

6. 5. The imaging device according to claim 4, At least one of the plurality of heat sources is disposed in the heat dissipation structure via a heat transfer member.

7. 5. The imaging device according to claim 4, The imaging device, wherein the plurality of heat sources are disposed downstream of the flow path of the heat dissipation structure so that the heat sources generate less heat.

8. 8. The imaging device according to claim 4, the heat dissipation structure includes a first plate-shaped portion extending from the intake port to the exhaust port, and a second plate-shaped portion facing the first plate-shaped portion and extending from the intake port to the exhaust port, An imaging device, wherein in the heat dissipation structure, the heat source is positioned at a specific distance from the air intake port of the first plate-shaped portion, and the heat source is not positioned at the specific distance from the air intake port of the second plate-shaped portion.

9. 5. The imaging device according to claim 4, The heat dissipation structure includes: a plurality of regions surrounding the flow passage in a cross section in a direction intersecting a direction in which air flows through the flow passage, the plurality of regions being connected to the heat source; a connection member having a lower thermal conductivity than the heat dissipation structure and connecting two adjacent regions.

10. 10. The imaging device according to claim 9, The heat dissipation structure includes: an imaging device having a partition plate extending in a direction in which air flows through the flow path and dividing the flow path into the regions;

11. The imaging device according to claim 10, An imaging device, wherein an area of ​​the flow path in the cross section for each of the regions partitioned by the partition plate is proportional to the amount of heat generated by the heat source disposed in each of the regions.

12. 5. The imaging device according to claim 4, the heat dissipation structure includes a first plate-shaped portion extending from the intake port to the exhaust port, and a second plate-shaped portion facing the first plate-shaped portion and extending from the intake port to the exhaust port, An imaging device, wherein the width of the flow path between a first specific region of the first plate-shaped portion and a second specific region of the second plate-shaped portion opposite the first specific region is narrower than the width between another region of the first plate-shaped portion and another region of the second plate-shaped portion opposite the other region of the first plate-shaped portion.

13. 13. The imaging device according to claim 12, an imaging device, wherein a first heat source of the plurality of heat sources is disposed in the first specific area, and a second heat source of the plurality of heat sources is disposed in the second specific area.

14. 4. The imaging device according to claim 3, the plurality of heat sources include an image sensor that converts light from outside the housing into an electrical signal, and a signal processing unit that processes the electrical signal; The heat dissipation structure is provided between the plurality of heat sources.

15. 4. The imaging device according to claim 3, a first lens that is provided on the housing so as to be exposed from the housing and that receives light from outside the housing and outputs the light to a first heat source among the plurality of heat sources; a second lens that is provided on the housing so as to be exposed from the housing on the opposite side to the first lens, and that receives light from outside the housing and outputs the light to a second heat source among the plurality of heat sources; the first heat source is a first image sensor that converts light from the first lens into an electrical signal; the second heat source is a second image sensor that converts light from the second lens into an electrical signal; an imaging device, wherein a third heat source among the plurality of heat sources is a signal processing unit that processes electrical signals from the first imaging element and the second imaging element;

16. 16. The imaging device according to claim 15, An imaging device, wherein at least one of the first lens and the second lens has an angle of view of 180 degrees or more.

17. 16. The imaging device according to claim 15, An imaging device that combines images obtained from the first imaging element and the second imaging element to form a spherical image.

18. 17. The imaging device according to claim 15, An imaging device in which a cooling fan that takes in air through the intake port and exhausts it to the exhaust port through the flow path can be disposed on the optical axis of the first lens and the second lens.

19. 3. The imaging device according to claim 1, a container provided within the housing for hermetically housing the plurality of heat sources, The heat dissipation structure of the imaging device comprises an interior of the housing and the container, and the flow path is formed by the interior of the housing and the container.

20. 20. The imaging device according to claim 19, a heat dissipation member provided on the outside of the container in the housing; a heat transfer member that connects the heat source and the heat dissipation member in the flow path; An imaging device having the above configuration.

21. 21. The imaging device according to claim 20, The heat dissipation member is provided on the intake port side inside the housing.

22. 20. The imaging device according to claim 19, The housing has another air intake port, an imaging device, wherein the heat dissipation structure has a first flow path that draws in air from the intake port, passes through a first surface of the housing, and exhausts it to the exhaust port, and a second flow path that draws in air from the other intake port, passes through a second surface of the housing that is different from the first surface, and exhausts it to the exhaust port.

23. 23. The imaging device according to claim 22, The imaging device, wherein the housing has the air intake and the other air intake on a specific surface of the outside of the housing.

24. 20. The imaging device according to claim 19, The imaging device, wherein the plurality of heat sources include an imaging element that converts light from outside the housing into an electrical signal, and a signal processing unit that processes the electrical signal.

25. 25. The imaging device according to claim 24, a first lens that is provided on the housing so as to be exposed from the housing and that receives light from outside the housing and outputs the light to a first heat source among the plurality of heat sources; a second lens that is provided on the housing so as to be exposed from the housing on the opposite side to the first lens, and that receives light from outside the housing and outputs the light to a second heat source among the plurality of heat sources; the first heat source is a first image sensor that converts light from the first lens into an electrical signal; the second heat source is a second image sensor that converts light from the second lens into an electrical signal; an imaging device, wherein a third heat source among the plurality of heat sources is a signal processing unit that processes electrical signals from the first imaging element and the second imaging element;

26. 26. The imaging device according to claim 25, An imaging device, wherein at least one of the first lens and the second lens has an angle of view of 180 degrees or more.

27. 26. The imaging device according to claim 25, An imaging device that combines images obtained from the first imaging element and the second imaging element to form a spherical image.

28. 28. The imaging device according to claim 25, An imaging device in which a cooling fan that takes in air through the intake port and exhausts it to the exhaust port through the flow path can be disposed at a position offset from the optical axes of the first lens and the second lens.

Images