Dynamic release tape for assembling discrete component

Abstract

To provide a dynamic release tape for assembling a discrete component.SOLUTION: A method includes the steps of placing a discrete component assembly on a support fixture of a component transfer system, the discrete component assembly including a dynamic release tape having a flexible support layer, a dynamic release structure disposed on the flexible support layer, and a discrete component adhered to the dynamic release tape. The method includes a step of applying radiation to the dynamic release structure to release the discrete component from the dynamic release tape.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] Claiming priority This application claims priority to U.S. Patent Application No. 62 / 843,904, filed May 6, 2019, and U.S. Patent Application No. 62 / 806,154, filed February 15, 2019, both of which are incorporated by reference in their entireties herein. [Background technology]

[0002] The present disclosure relates generally to assembling discrete components onto a substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] US Patent Application Publication No. 2014 / 0238592 [Patent Document 2] International Publication No. 2018 / 231344 Summary of the Invention [Means for solving the problem]

[0004] In one aspect, the method includes the steps of placing an individual component assembly on a support fixture of a component transfer system, the individual component assembly including a dynamic release tape including a flexible support layer and a dynamic release structure disposed on the flexible support layer, and an individual component adhered to the dynamic release tape, and irradiating the dynamic release structure to release the individual component from the dynamic release tape, wherein at least a portion of the flexible support layer is unsupported when the individual component assembly is placed on the support fixture.

[0005] Implementations may have one or more of the following features.

[0006] Placing the discrete component assemblies on the support fixture includes mounting a wafer ring of the discrete component assemblies on a frame of the support fixture.

[0007] The method includes adhering the individual components to the dynamic release tape. Adhering the individual components to the dynamic release tape includes adhering the individual components to a component adhesive layer of a dynamic release structure. Adhering the individual components to the dynamic release tape includes transferring the individual components from a dicing tape to the dynamic release tape.

[0008] The method includes adhering a wafer to a dynamic release tape. Adhering a wafer to a dynamic release tape includes adhering the wafer to a component adhesive layer of a dynamic release structure. The method includes dicing the bonded wafer to form individual components. Placing the individual component assembly on a transparent support plate includes attaching the dynamic release tape including the individual components to a support plate of a support fixture. Placing the individual component assembly on the support plate includes holding the individual component assembly on the support plate by applying suction.

[0009] Irradiating the dynamic release structure includes irradiating the dynamic release structure with light from a light source of a component transfer system.

[0010] In one aspect, the method includes placing an individual component assembly on a support fixture of a component transfer system, the individual component assembly including a dynamic release tape including a flexible support layer and a dynamic release structure disposed on the flexible support layer, and individual components adhered to the dynamic release tape, and placing the individual component assembly on the support fixture includes placing the flexible support layer of the dynamic release tape directly on a support plate of the support fixture, and irradiating the dynamic release structure to release the individual components from the dynamic release tape.

[0011] Implementations may have one or more of the following features.

[0012] Placing the discrete component assemblies on the support fixture includes mounting a wafer ring of the discrete component assemblies on a frame of the support fixture.

[0013] The method includes applying radiation through a support plate to a dynamic release structure to release the discrete components from the dynamic release tape. The method includes orienting a component transfer system such that the discrete components are disposed between the support plate and a target substrate.

[0014] Placing the individual component assemblies on a support plate includes placing the individual component assemblies on a rigid support plate.

[0015] Placing the discrete component assemblies on the support fixture includes attaching the flexible support layer directly to a support plate.

[0016] Placing the individual component assemblies on the support plate includes holding the individual component assemblies on the support plate by applying suction.

[0017] The step of placing the individual component assemblies onto the support plate includes extending a dynamic release tape across the support plate.

[0018] The method includes adhering the individual components to the dynamic release tape. Adhering the individual components to the dynamic release tape includes adhering the individual components to a component adhesive layer of a dynamic release structure. Adhering the individual components to the dynamic release tape includes transferring the individual components from a dicing tape to the dynamic release tape.

[0019] The method includes adhering a wafer to a dynamic release tape. Adhering a wafer to a dynamic release tape includes adhering the wafer to a component adhesive layer of a dynamic release structure. The method includes dicing the bonded wafer to form individual components. Placing the individual component assembly on a transparent support plate includes attaching the dynamic release tape including the individual components to a support plate of a support fixture. Placing the individual component assembly on a transparent support plate includes holding the individual component assembly on the support plate by applying suction.

[0020] The step of irradiating the dynamic release structure includes irradiating the dynamic release structure with light from a light source of the component transfer system.

[0021] In one aspect, the individual component transfer system includes a light source, an individual component support fixture including a support frame and a support plate disposed on the support frame, the support plate transmitting light emitted by the light source, and an optical element disposed between the light source and the support frame.

[0022] Implementations may have one or more of the following features.

[0023] The system includes a suction source configured to apply suction to an air flow passage of the individual component support fixture to hold a flexible support layer of the individual component assembly against the support plate.

[0024] The system includes a dynamic release tape including a flexible support layer and a dynamic release structure disposed on the flexible support layer, and a discrete component assembly including discrete components adhered to the dynamic release tape, where the flexible support layer of the dynamic release tape is placed directly on a support plate and held in place by suction through air channels of the discrete component support fixtures. The air channels are formed through the thickness of the support frame. The air channels are formed through the thickness of the support plate.

[0025] The top surface of the support plate is offset from the top surface of the support frame by an amount sufficient to introduce a tensile stress into the dynamic release tape held on the individual component support fixture.

[0026] The support plate includes a glass plate.

[0027] The support plate includes a quartz plate.

[0028] The support plate has high rigidity.

[0029] The optical element includes a lens.

[0030] In one aspect, an individual component transfer system includes a light source, an individual component support fixture, an individual component assembly disposed on the individual component support fixture, the individual component assembly including a dynamic release tape including a flexible support layer and a dynamic release structure disposed on the flexible support layer, and an individual component adhered to the dynamic release tape, wherein the dynamic release tape is in an unsupported state when the individual component assembly is disposed on the individual component support fixture, and an optical element disposed between the light source and the individual component assembly.

[0031] Implementations may include one or more of the following features.

[0032] The discrete component assembly includes a wafer ring disposed on a discrete component support fixture.

[0033] In one aspect, a method includes dicing a wafer adhered to a dicing tape to form individual components, transferring the individual components from the dicing tape to a dynamic release tape to form an individual component assembly including a flexible support layer and a dynamic release structure disposed on the flexible support layer, and placing the flexible support layer of the individual component assembly directly on a support plate of a component transfer system.

[0034] Implementations may include one or more of the following features.

[0035] Transferring the discrete components to the dynamic release tape includes adhering the discrete components to a component adhesive layer of the dynamic release structure.

[0036] The dynamic release structure of the dynamic release tape includes a plurality of layers. The dynamic release structure includes an active layer structure and a component adhesive layer, and adhering the wafer to the dynamic release tape includes adhering the wafer to the component adhesive layer.

[0037] Placing the flexible support layer directly on the support plate includes attaching the flexible support layer directly to the support plate.

[0038] The step of placing the flexible support layer directly onto the support plate includes the step of holding the individual component assemblies onto the support plate by applying suction.

[0039] The step of placing the flexible support layer directly onto the support plate includes stretching a dynamic release tape across the support plate.

[0040] The method includes the step of irradiating a dynamic release structure of a discrete component assembly through a support plate to release the discrete components from the dynamic release tape.

[0041] In one aspect, a method includes dicing a wafer adhered to a dicing tape to form individual components; transferring the individual components from the dicing tape to a dynamic release tape to form an individual component assembly including a flexible support layer and a dynamic release structure disposed on the flexible support layer; and placing the individual component assembly in a component transfer system such that at least a portion of the dynamic release tape is unsupported.

[0042] Implementations may include one or more of the following features.

[0043] The method includes the step of irradiating the unsupported dynamic release tape to release the discrete components from the dynamic release tape.

[0044] The dynamic release structure of the dynamic release tape includes a plurality of layers. The dynamic release structure includes an active layer structure and a component adhesive layer, and adhering the wafer to the dynamic release tape includes adhering the wafer to the component adhesive layer.

[0045] In one aspect, the method includes adhering a wafer to a dynamic release tape including an unsupported flexible support layer and a dynamic release structure disposed on the flexible support layer, and dicing the adhered wafer to form individual components adhered to the dynamic release tape.

[0046] Implementations may include one or more of the following features.

[0047] Adhering the wafer to the dynamic release tape includes adhering the wafer to a component adhesive layer of a dynamic release structure.

[0048] The dynamic release structure of the dynamic release tape includes a plurality of layers. The dynamic release structure includes an active layer structure and a component adhesive layer, and adhering the wafer to the dynamic release tape includes adhering the wafer to the component adhesive layer.

[0049] In one aspect, a method includes the steps of adhering a wafer to a dynamic release tape including a flexible support layer and a dynamic release structure disposed on the flexible support layer, dicing the adhered wafer to form individual components adhered to the dynamic release tape, the individual components adhered to the dynamic release tape including an individual component assembly, and placing the flexible support layer of the individual component assembly directly onto a support plate of a component transfer system.

[0050] Implementations may include one or more of the following features.

[0051] The step of placing the flexible support layer directly on the support plate includes attaching the flexible support layer of the dynamic release tape directly to the support plate.

[0052] The step of placing the flexible support layer directly onto the support plate includes the step of holding the individual component assemblies onto the support plate by applying suction.

[0053] The step of placing the flexible support layer onto the support plate includes extending a dynamic release tape across the support plate.

[0054] The method includes the step of irradiating a dynamic release structure of a discrete component assembly through a support plate to release the discrete components from the dynamic release tape.

[0055] The dynamic release structure of the dynamic release tape includes a plurality of layers. The dynamic release structure includes an active layer structure and a component adhesive layer, and adhering the wafer to the dynamic release tape includes adhering the wafer to the component adhesive layer.

[0056] In one aspect, a method includes the steps of adhering a wafer to a dynamic release tape including a flexible support layer and a dynamic release structure disposed on the flexible support layer, dicing the adhered wafer to form individual components adhered to the dynamic release tape, the individual components adhered to the dynamic release tape including individual component assemblies, and placing the individual component assemblies in a component transfer system such that at least a portion of the dynamic release tape is unsupported.

[0057] Implementations may include one or more of the following features.

[0058] The method includes the step of irradiating the unsupported dynamic release tape to release the discrete components from the dynamic release tape.

[0059] The dynamic release structure of the dynamic release tape includes a plurality of layers. The dynamic release structure includes an active layer structure and a component adhesive layer, and adhering the wafer to the dynamic release tape includes adhering the wafer to the component adhesive layer.

[0060] In one aspect, an apparatus includes a dynamic release tape, the dynamic release tape including a flexible support layer and a dynamic release structure disposed on the flexible support layer.

[0061] Implementations may include one or more of the following features.

[0062] The dynamic release tape has sufficient stiffness to allow for laser transfer of the individual components from the dynamic release tape.

[0063] The dynamic release tape has sufficient rigidity to maintain a substantially planar configuration upon laser transfer of the discrete components from the dynamic release tape. The flexible support layer includes a polymer. The dynamic release structure includes a plurality of layers. The dynamic release structure includes an absorbing adhesive layer disposed on the flexible support layer, the absorbing adhesive layer configured to adhere to the flexible support layer and generate a gas in response to irradiation by light, and an active layer disposed on the absorbing adhesive layer. The active layer includes a foam layer configured to mechanically respond to generation of gas by the absorbing adhesive layer. The dynamic release structure includes an adhesive layer disposed on the flexible support layer, the adhesive layer configured to adhere to the flexible support layer, and an active layer structure disposed on the adhesive layer. The active layer structure includes an absorbing foam layer, the absorbing foam layer configured to generate a gas in response to irradiation by light and to mechanically respond to generation of gas. The active layer structure includes an absorbing layer disposed on the adhesive layer, the absorbing layer configured to generate a gas in response to irradiation by light, and a foam layer configured to mechanically respond to generation of gas by the absorbing layer. One of the layers of the dynamic release structure includes a component adhesive layer, the adhesion of which responds to the application of a stimulus.

[0064] The tape is stretchable.

[0065] The flexible support layer is transparent to ultraviolet radiation.

[0066] The device includes a discrete component attached to a dynamic release structure, the discrete component including a light emitting diode (LED).

[0067] In one aspect, the method includes forming a dynamic release structure on a flexible support layer to form a dynamic release tape.

[0068] Implementations may include one or more of the following features.

[0069] The step of forming the dynamic release structure includes forming a plurality of layers on a flexible support layer. The step of forming the dynamic release structure includes forming an absorbing adhesive layer on the flexible support layer, the absorbing adhesive layer configured to adhere to the flexible support layer and generate gas in response to irradiation with light, and forming an active layer on the absorbing adhesive layer, the active layer including a foam layer configured to mechanically respond to generation of gas by the absorbing adhesive layer. The step of forming the dynamic release structure includes forming an adhesive layer on the flexible support layer, the adhesive layer configured to adhere to the flexible support layer, and forming an active layer structure on the adhesive layer, the active layer structure including an absorbing foam layer configured to generate gas in response to irradiation with light and to mechanically respond to generation of gas. The step of forming the active layer structure includes the steps of forming an absorbent layer on the adhesive layer, the absorbent layer configured to generate gas in response to irradiation with light, and forming a foam layer on the absorbent layer, the foam layer configured to mechanically respond to generation of gas by the absorbent layer.

[0070] In one aspect, a dynamic release device includes a flexible support layer and a dynamic release structure disposed on the flexible support layer, the dynamic release structure including an adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer, and an active layer structure disposed on the adhesive layer.

[0071] Implementations may include one or more of the following features.

[0072] The active layer structure includes an absorbing foam layer configured to generate gas in response to illumination with light and to mechanically respond to the gas generation.

[0073] The active layer structure includes an absorbent layer disposed on the adhesive layer, the absorbent layer configured to generate gas in response to illumination by light, and a foam layer configured to mechanically respond to generation of gas by the absorbent layer.

[0074] The dynamic release structure includes component adhesive layers.

[0075] In one aspect, a method includes placing a discrete component assembly on a support fixture of a component transfer system, the discrete component assembly including a dynamic release tape including a flexible support layer and a dynamic release structure disposed on the flexible support layer, and a discrete component adhered to the dynamic release tape. The method includes applying radiation to the dynamic release structure to release the discrete component from the dynamic release tape.

[0076] In one aspect, the individual component transfer system includes an individual component support fixture including a light source and including a support frame, a support plate disposed on the support frame that transmits light emitted by the light source, and an optical element disposed between the light source and the support frame.

[0077] In one aspect, a discrete component transfer system includes a light source, a discrete component support fixture, and a discrete component assembly disposed on the discrete component support fixture. The discrete component assembly includes a dynamic release tape having a flexible support layer and a dynamic release structure disposed on the flexible support layer, and a discrete component adhered to the dynamic release tape. The discrete component transfer system includes an optical element disposed between the light source and the discrete component assembly.

[0078] In one aspect, a method includes dicing a wafer adhered to a dicing tape to form individual components, and transferring the individual components from the dicing tape to a dynamic release tape to form an individual component assembly including a flexible support layer and a dynamic release structure disposed on the flexible support layer.

[0079] In one aspect, a method includes adhering a wafer to a dynamic release tape including a flexible support layer and a dynamic release structure disposed on the flexible support layer, and dicing the adhered wafer to form individual components adhered to the dynamic release tape.

[0080] In one aspect, an apparatus includes a dynamic release tape including a flexible support layer and a dynamic release structure disposed on the flexible support layer.

[0081] In one aspect, the method includes forming a dynamic release structure on a flexible support layer to form a dynamic release tape. In one aspect, a dynamic release device includes a support layer and a dynamic release structure disposed on the support layer, the dynamic release structure including an adhesive layer disposed on the support layer and configured to adhere to the support layer, and an active layer structure disposed on the adhesive layer. [Brief description of the drawings]

[0082] [Figure 1A] FIG. 1 is an illustration of a laser assisted transfer process. [Figure 1B] FIG. 1 is an illustration of a laser assisted transfer process. [Figure 2A] FIG. 2 is a diagram of a dynamic release tape having a support fixture. [Figure 2B] FIG. 2 is a diagram of a dynamic release tape having a support fixture. [Diagram 3] FIG. 2 is a diagram of a dynamic release tape having a support fixture. [Figure 4] FIG. 1 is a diagram of a system for laser assisted transfer of discrete components. [Diagram 5] FIG. 1 is a diagram of a system for laser assisted transfer of discrete components. [Figure 6] FIG. [Figure 7] FIG. [Figure 8A] FIG. 2 is a diagram of a multi-layer dynamic release tape mounted on a support plate. [Figure 8B] FIG. 2 is a diagram of a multi-layer dynamic release tape mounted on a support plate. [Figure 8C] FIG. 2 is a diagram of a multi-layer dynamic release tape mounted on a support plate. [Figure 9A] FIG. 1 is a diagram of a multi-layer dynamic release structure. [Figure 9B] FIG. 1 is a diagram of a multi-layer dynamic release structure. [Figure 9C] FIG. 1 is a diagram of a multi-layer dynamic release structure. [Figure 10] FIG. 2 is a diagram of a dynamic release tape having a support fixture. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0083] Described herein is a technique for laser-assisted transfer of individual components from a thin, flexible dynamic release tape disposed on a support plate of a component transfer system. The dynamic release tape includes a multi-layer dynamic release structure disposed on a support layer, such as a backing. Each layer of the dynamic release structure can be specifically designed for one or more functions of the dynamic release structure, such as adhesion, optical properties, or mechanical properties. Laser-assisted transfer of individual components from a dynamic release tape disposed on a carrier substrate is also described.

[0084] 1A and 1B show a laser-assisted transfer process for high-throughput, low-cost, non-contact assembly of discrete components 102 onto rigid or flexible substrates. The term discrete component generally refers to any unit, e.g., electronic, electromechanical, photovoltaic, photonic, or optoelectronic component, module, or system that is part of, e.g., a product or electronic device, e.g., any semiconductor material with circuitry formed on a portion of the semiconductor material. In some examples, the discrete component can be a light-emitting diode (LED). The discrete component can be ultra-thin, i.e., a maximum thickness of 50 μm or less, 40 μm or less, 30 μm or less, 25 μm or less, 20 μm or less, 10 μm or less, or 5 μm or less. The discrete component can be ultra-small, i.e., a maximum length or width dimension of 300 μm or less per side, 100 μm or less per side, 50 μm or less per side, 20 μm or less per side, or 5 μm or less per side. The individual components can be extremely thin and compact.

[0085] 1A and 1B show a portion of a support fixture 100 of a component transfer system for laser-assisted transfer of an individual component 102. The support fixture 100 holds a flexible individual component assembly 108 in position for the laser-assisted transfer process. The support fixture (described in more detail below) can include a rigid support plate 106 mounted on a frame (not shown, described in more detail below). The frame provides stability to the rigid support plate 106. In some examples, the frame can be manipulated, for example, for alignment purposes. The individual component assembly 108 can be attached to the support plate 106 by suction, tensile stress, or other methods, as described in more detail below. The placement of the individual component assembly 108 on the support plate 106 is non-permanent, for example, thereby allowing the individual component assembly 108 to be removed from the support plate 106 after the laser-assisted transfer process is completed without damaging the support plate 106. The non-permanent mounting of the individual component assemblies 108 on the support plate 106 allows the support plate 106 to be utilized for multiple transfer processes involving multiple individual component assemblies 108 .

[0086] The discrete component assembly 108 includes a dynamic release tape 110 mounted on a wafer ring (not shown) to which discrete components 102 are adhered. Although only a single discrete component 102 is shown here, multiple discrete components 102 can be adhered to the dynamic release tape 110 and transferred by a component transfer system. The dynamic release tape (e.g., tape 110) is a tape that includes a flexible support layer 112 and a dynamic release structure 114 disposed on the flexible support layer 112. The tape is a thin, flexible material made up of one or more layers. The flexible support layer 112 contacts the support plate 106 of the support fixture 100, and the discrete components 102 are adhered to the dynamic release structure 114. The dynamic release structure 114 can be a multi-layer structure, such as a structure having two, three, four, or more than four layers, as described in more detail below.

[0087] 1B, in the laser-assisted transfer process, the backside of the support plate 106 is irradiated with radiation 116, such as light, e.g., a laser beam. Both the support plate 106 and the flexible support layer 112 of the dynamic release tape 110 are transparent to the wavelength of the radiation 116 (e.g., laser energy). An element that is transparent to a given wavelength is an element through which at least some radiation of the given wavelength passes. The radiation 116 passes through the support plate 106 and the flexible support layer 112 of the dynamic release tape 110 and impinges on an area of ​​the dynamic release structure 114, causing a partial thickness of the dynamic release structure 114 to be ablated in the area where the radiation 116 impinges (referred to as the irradiated area). The ablation generates trapped gas, which expands and creates stress in the dynamic release structure 114. This stress deforms at least a portion of the material of the dynamic release structure 114, forming blisters 118. The blisters 118 exert a mechanical force on the individual components 102. When the mechanical force applied by the blister 118 is sufficient to overcome the adhesion between the individual components 102 and the dynamic release structure 114, the mechanical force applied by the blister 118 (combined with gravity) pulls the individual components away from the support plate 106 (e.g., downward) and transfers them to the target substrate 130.

[0088] The target substrate 130 can be positioned in close proximity to the individual components 102, for example, at a distance between about 5 μm and about 300 μm. Using a rigid support plate 106 to support the tape-based individual component assembly 108 helps to maintain a constant separation distance between the individual components 102 of the individual component assembly 108 and the target substrate 130, for example, by preventing sagging or other structural variations in the tape 110. In some examples, the support plate 106 can be provided with a high degree of surface flatness. For example, the support plate 106 can be machined with high precision.

[0089] In some laser-assisted transfer processes, the individual components are adhered to a rigid transparent carrier substrate by a dynamic release structure. The carrier substrate with the adhered individual components is provided to a component transfer system for laser-assisted transfer of the individual components. The component transfer system described herein incorporates a rigid transparent support plate into the component transfer system itself, allowing the individual components to be transferred from a tape rather than from a rigid carrier substrate, reducing the cost (e.g., in terms of materials, manufacturing, transportation, etc.) of the end-to-end individual component transfer process. For example, a rigid carrier substrate may be significantly more expensive than a dynamic release tape. Furthermore, the dynamic release tape is disposable, eliminating the associated costs of refurbishment of a rigid carrier substrate.

[0090] In some examples, the dynamic release tape used in the individual component transfer process is an unsupported tape. An unsupported tape is a tape that is not attached to a rigid substrate. In some examples, the unsupported tape can be placed on a rigid substrate for one or more steps of the individual component transfer process, but cannot be attached. For example, the unsupported tape can be placed on a rigid substrate during attachment of the individual components to the tape, during introduction into the component transfer system, or during laser-assisted transfer of the individual components.

[0091] In some examples, the dynamic release tape used in the individual component transfer process is not an unsupported tape, but instead is attached to a rigid substrate during attachment of the individual components to the tape, during introduction into the component transfer system, and during laser-assisted transfer of the individual components.

[0092] Further description of the laser assisted transfer process is provided in U.S. Patent Application Publication No. 2014 / 0238592, the contents of which are incorporated herein by reference in their entirety.

[0093] 2A and 2B show cutaway views of an exemplary support fixture 200 including a support plate 206 for positioning an individual component assembly 208 for a laser-assisted transfer process. The support plate 206 is a rigid plate that is transparent to wavelengths of radiation used in the laser transfer process, e.g., ultraviolet (UV) light. For example, the support plate 206 can be a glass plate, a quartz plate, or a plate of another material. The support plate 206 is mounted on a frame 220 of the support fixture. In some examples, as shown in FIGS. 2A and 2B, the frame 220 has an opening 221 to allow radiation to reach the support plate 206. In some examples, the frame 220 may not have an opening and may be transparent to the wavelengths of radiation so that the radiation is transmitted through the frame 220.

[0094] The individual component assembly 208 includes an unsupported dynamic release tape 210 mounted on a wafer ring 222, with the individual components 102 adhered to the dynamic release tape 210. For example, the dynamic release tape 210 can be stretched over the wafer ring 222. In the example of FIGS. 2A-2B, the dynamic release tape 210 includes a flexible support layer 212 having a multi-layer dynamic release structure 214 disposed thereon. The exemplary multi-layer dynamic release structure 214 includes a number of sub-layers 224a, 224b having adhesive, radiation absorbing, and foaming functions, and a component adhesive layer 226 that adheres to the individual components 102. The multi-layer dynamic release structure 214 is described in more detail below.

[0095] 2B , to place the individual component assembly 208 on the support plate 206 of the component transfer system, the wafer ring 222 is brought into contact with the frame 220 and the backside of the flexible support layer 212 of the dynamic release tape 210 is brought into contact with the support plate 206. Once placed, the top surface 223 of the wafer ring 222 is substantially level (e.g., aligned) with the top surface 207 of the support plate 206, such that the dynamic release tape 210 is substantially flat throughout its lateral extent.

[0096] For example, suction is applied by a suction source of the component transfer system through the air passage 228 to hold the dynamic release tape 210 against the support plate 206. For example, the air passage 228 can be defined through a thickness of the frame 220 of the component transfer system (as shown), can be defined through a thickness of the support plate 206, or can be defined through both the thickness of the frame 220 and the thickness of the support plate 206. Application of suction draws the dynamic release tape 210 tightly against the support plate 206, e.g., thereby causing the dynamic release structure 214 to become substantially flat.

[0097] As can be seen with reference to FIG. 10, in some examples, the support fixture 150 includes the frame 170 but does not include the support plate (e.g., does not include the support plate 206 as shown in FIGS. 2A and 2B). The wafer ring 222 of the individual component assembly 208 is mounted on the frame 170 of the support fixture 150, and the dynamic release tape 210 is optionally left unsupported for the laser-assisted transfer process. When the dynamic release tape 210 has sufficient rigidity, such as sufficient rigidity to maintain a substantially planar configuration for the duration of the laser-assisted transfer process, the laser-assisted transfer can be performed directly from the unsupported dynamic release tape 210. For example, the dynamic release tape 210 can have sufficient rigidity to reduce the maximum slippage of the dynamic release tape 210 in a direction z perpendicular to the plane of the tape 210 to less than a threshold amount, e.g., less than 20 μm, less than 10 μm, or less than 5 μm, when the individual component assembly 208 is mounted on the frame 170.

[0098] 3 shows a cutaway view of an exemplary support fixture 300 including a support plate 306 for positioning the individual component assemblies 208 for a laser assisted transfer process. The support plate 306 is a rigid plate that is transparent to wavelengths of radiation used in the laser transfer process, e.g., UV light. The support plate 306 is mounted on a frame 320 of the support fixture 300. The frame 320 has an opening 321 to allow the radiation to reach the support plate 306. In some examples, the frame 320 can be transparent to the wavelengths of radiation such that the radiation is transmitted through the frame 320.

[0099] 3, when the individual component assembly 208 is placed on the support fixture 300, the top surface 223 of the wafer ring 222 is at a lower level than (e.g., offset from) the top surface 307 of the support plate 306. For example, the frame 320 of the support fixture 300 can be offset from the top surface of the support plate 306 by an amount such that when the individual component assembly 208 is placed on the support plate, the support plate 306 and the wafer ring 222 are still offset. This offset introduces a tensile stress to the dynamic release tape 210 that holds the dynamic release tape 210 against the support plate 306, e.g., causing the dynamic release structure 214 to become substantially flat. The amount of tensile stress, and therefore the force to hold the dynamic release tape 210 against the support plate 306, can be controlled by varying the height difference between the top surface 223 of the wafer ring 222 and the top surface 307 of the support plate 306.

[0100] In some examples, other techniques can be used to position the dynamic release tape 210 on the support plate of the component transfer system, such as by using magnetic forces, electrostatic forces, techniques involving mechanical fastening, or other techniques.

[0101] 4 illustrates an example of a component transfer system 450. The component transfer system 450 includes a support fixture 400 having a support plate 406 mounted on a frame 420. The support fixture 400 is positioned such that an individual component assembly 408 is held on the support plate 406. The individual component assembly 408 includes a dynamic release tape 410 having adhered individual components 102 thereto, the dynamic release tape 410 being mounted on a wafer ring 422, e.g., stretched over the wafer ring 422. For example, the wafer ring 422 is positioned on a frame 420, and the stretched dynamic release tape 410 is held against the support plate 406. The individual component assembly 408 can be illuminated with radiation (e.g., light such as UV light) from a light source 452, e.g., a laser. The light from the light source 452 can be manipulated, e.g., focused, by an optical element 454, e.g., a lens, positioned between the light source 452 and the support plate 406. The frame 420 has an opening 421 to allow radiation from the light source 452 to reach the support plate 406. A substrate holder 432 holds a target substrate 430 onto which discrete components are to be transferred by the laser assisted transfer process.

[0102] In some examples, such as when the support fixture 400 is configured to hold the individual component assemblies against the support plate 406 by applying suction, the component transfer system 450 may include a suction source 434 fluidly connected (e.g., by piping, not shown) to one or more air flow paths (not shown) in the support plate 406 or frame 420.

[0103] 5 illustrates an example of a component transfer system 550 having a light source 552 and an optical element 554. The component transfer system 550 includes a support fixture 500 that includes a frame 520. No support plate is mounted on the frame 520. An individual component assembly 508 is held on the frame 520, and the individual component assembly 508 includes a dynamic release tape 510 mounted on a wafer ring 522. In this configuration, the wafer ring 522 of the individual component assembly 508 is placed on the frame 520, and the dynamic release tape 510 is an unsupported tape during the laser assisted transfer process (i.e., a tape that is not supported by a rigid substrate or support plate). An individual component 102 is transferred onto a target substrate 530 held by a substrate holder 532.

[0104] In some examples, the component transfer system 450, 550 can be configured to transfer multiple individual components in parallel or can be configured to have a single component transfer mode and a multi-component transfer mode as described in more detail in WO2018 / 231344, filed April 25, 2018, the contents of which are incorporated by reference in their entirety herein.

[0105] 6, in some examples, the individual components 602 can be transferred to the dynamic release tape 610 after the dicing process. For example, using standard wafer processing techniques for wafer dicing, a wafer 630 including one or more electronic components (e.g., integrated circuits) is adhered (650) to a dicing tape 632 and diced (652) to form the individual components 602. For example, the dicing tape 632 can be attached onto a wafer ring. In some examples, the dicing process can include laterally stretching the dicing tape to separate the individual components 602, for example, by rolling the dicing tape 632 out onto the wafer ring.

[0106] The individual components 602 are transferred (654) onto the dynamic release tape 610 and the dicing tape 632 is removed (656), leaving the individual components 602 adhered to the dynamic release tape 610. For example, the individual components 602 can be adhered to a component adhesive layer (described below) of the dynamic release tape 610. The dynamic release tape 610 with the adhered individual components 602 is attached (658) to a transparent rigid support plate 606 of a component transfer system for laser assisted transfer of the individual components 602 onto a target substrate. For example, the flexible support layer of the dynamic release tape 610 is attached to the support plate, for example, by suction, tensile stress, or otherwise.

[0107] As can be seen with reference to FIG. 7, in some examples, the individual components 702 can be diced directly on the dynamic release tape 710. A wafer 730 including one or more semiconductor dies (e.g., integrated circuits) is attached (750) to the dynamic release tape 710, e.g., to a component adhesive layer of the dynamic release tape 710. The attached wafer 730 is diced (752) to form the individual components 702, e.g., using standard wafer processing techniques for wafer dicing. For example, the dynamic release tape 710 can be attached onto a wafer ring. In some examples, the dynamic release tape 710 is stretchable, and the dicing process can include laterally stretching the dynamic release tape 710 to separate the individual components 702, e.g., by unfolding the dynamic release tape over the wafer ring.

[0108] The dynamic release tape 710 with the individual components 702 attached thereto is attached (754) to a transparent, rigid support plate 706 of a component transfer system for laser-assisted transfer of the individual components 702 onto a target substrate. For example, a flexible support layer of the dynamic release tape 710 is attached to the support plate, for example, by suction, tensile stress, or otherwise.

[0109] In the process of FIG. 7, the step of transferring the diced individual components 702 from the dicing tape to the dynamic release layer tape is not included, making the process of FIG. 7 streamlined and efficient.

[0110] 8A-8C, the dynamic release layer tapes 800, 820, 840 can be multi-layer tapes having a flexible support layer 812 and a multi-layer dynamic release structure 814, 834, 854 disposed on the flexible support layer 812, respectively. The individual components 802 can be adhered to the dynamic release structures 814, 834, 854 by a component adhesive layer 808 that forms part of each multi-layer dynamic release structure 814, 834, 854. The multi-layer dynamic release structures 814, 834, 854 can be formed by varying the number of layers with various compositions and functions. As shown in FIG. 8A-8C, the dynamic release layer tapes 800, 820, 840 can be disposed on a rigid support such as a support plate 806 of a component transfer system that is transparent to the radiation used in the laser-assisted transfer process. In some examples, the dynamic release layer tapes 800, 820, 840 can be used in other environments, such as by being attached to a wafer ring or otherwise used.

[0111] The flexible support layer 812 is a thin, flexible film that is transparent to the radiation used in the laser-assisted transfer process, for example, UV light. For example, the flexible support layer 812 can be a polymer film, such as polyvinyl chloride (PVC), polyethylene terephthalate (PET), or poly(methyl methacrylate) (PMMA). The flexible support layer 812 is thin and flexible enough to allow the dynamic release layer tape 800, 820, 840 to be manipulated, for example, rolled, bent, or stretched, without cutting the tape. The presence of the flexible support layer 812 allows the dynamic release layer tape 800, 820, 840 to be an unsupported tape that has sufficient mechanical integrity to be handled, for example, without being attached to a rigid substrate.

[0112] 8A , in some examples, the dynamic release structure 814 of the dynamic release layer tape 800 can be a three-layer structure having an absorbent adhesive layer 804 disposed on a flexible support layer 812 and an active layer 805, such as a foam layer (shown in FIG. 8A ), disposed on the absorbent adhesive layer 804. A component adhesive layer 808 is disposed on the active layer 805.

[0113] The absorbing adhesive layer 804 has two functions: to bond the active layer 805 to the flexible support layer 812 and to absorb energy from irradiation during the laser assisted transfer process. For example, the absorbing adhesive layer 804 may absorb at least 90%, at least 95%, at least 98%, or at least 99% of the energy incident on the absorbing adhesive layer 804, e.g., to prevent the radiation from reaching and potentially damaging individual components adhered to the tape 800.

[0114] Energy absorption by the absorbing adhesive layer 804 cauterizes the layer, generating gas. The generated gas induces a mechanical response in the adjacent active layer 805. For example, as shown in Figure 8A, the active layer 805 can be a foam layer that forms blisters in response to gas generation (e.g., as shown in Figure 1B).

[0115] 8B, in some examples, the dynamic release structure 834 of the dynamic release layer tape 820 can be a three-layer structure having an adhesive layer 824 disposed on the flexible support layer 812 and an active layer 826, such as an absorbent foam layer (as shown in FIG. 8B), disposed on the adhesive layer 824. The component adhesive layer 808 is disposed on the active layer 826.

[0116] The adhesive layer 824 exhibits sufficient adhesion to bond the active layer 826 to the flexible support layer 812. In the example of FIG. 8B, the active layer 826 is an absorbing foam layer. The active layer 826 absorbs energy from irradiation during the laser assisted transfer process and generates gas that induces a mechanical response, such as the formation of blisters, in the active layer 826. For example, the active layer 826 can absorb at least 90%, at least 95%, at least 98%, or at least 99% of the incident energy.

[0117] 8C , in some examples, the dynamic release structure 854 of the dynamic release layer tape 840 can be a four-layer structure having an adhesive layer 844 disposed on the flexible support layer 812 and an active layer structure 846 disposed on the adhesive layer 844. The component adhesive layer 808 is disposed on the active layer structure 846.

[0118] The adhesive layer 844 exhibits sufficient adhesion to bond the active layer structure 846 to the flexible support layer 812. The active layer structure 846 includes two layers: an absorbing layer 848 and a foam layer 850. The absorbing layer 848 absorbs energy from irradiation during the laser assisted transfer process and generates a gas. For example, the absorbing layer 848 can absorb at least 90%, at least 95%, at least 98%, or at least 99% of the incident energy. The generation of gas induces a mechanical response in the foam layer 850, such as the formation of blisters.

[0119] The dynamic release structures (e.g., dynamic release structures 814, 834, 854) have multiple functions, such as adhesion to a flexible support layer, internal adhesion between layers, absorption of incident radiation, and mechanical response (e.g., foaming), etc. The multi-layer nature of the dynamic release structures 814, 834, 854 can allow each layer to be specifically designed to achieve one or more of these functions.

[0120] In the example of FIG. 8A, the absorbing adhesive layer 804 can be designed to adhere to the support layer 812 and absorb incident radiation and generate a sufficient amount of gas to form blisters in the active layer 805. In some examples, the absorbing adhesive layer 804 can be designed to adhere to the active layer 805 with sufficient adhesion to promote internal adhesion and, for example, to at least partially avoid delamination of the blisters. Delamination of the blisters may result in larger diameter blisters that may affect the transfer of individual components at nearby locations, for example individual components that are not to be transferred. In designing the absorbing adhesive layer 804, the optical and adhesive properties of the layer can be the primary focus of the design, while the mechanical properties of the layer, such as the strength or modulus of the layer, can be secondary to the design. In contrast, the thickness and composition of the active layer 805 can be designed to prioritize mechanical properties, for example, to achieve a desired foaming reaction, while the optical and adhesive properties of the layer can be secondary. In some examples, the active layer 805 can be designed to allow formation of blisters of a target size, have mechanical properties that do not cause the blisters to rupture, and prevent gas generated by the absorbing adhesive layer 804 from escaping the dynamic release structure 814. For example, the target size of the blisters can be a height-to-diameter ratio of about 1, with a base diameter no greater than about 3 times the diameter of the irradiating beam (e.g., laser beam). In a particular example, the active layer 805 can be a polymer film, e.g., a PET or polyimide film, with a thickness between about 2 μm and about 5 μm.

[0121] Furthermore, in the dynamic release structure 814 of FIG. 8A, the active layer 805 itself does not absorb energy and is therefore not partially ablated. Instead, ablation occurs in the adjacent absorbing adhesive layer 804. Because no ablation occurs in the active layer 805, the thickness of the active layer 805 is not affected by the amount of laser energy delivered to the blister location, i.e., the active layer 805 is not thinned by irradiation. Separating the ablation and blister formation into two different layers in this manner allows for the use of higher pulse energies to form larger blisters.

[0122] In some examples, such as when transferring individual components 802 from a dicing tape (as in FIG. 6 ) or other source substrate to a dynamic release layer tape, when a wafer is diced directly on the dynamic release layer tape to form the individual components 802, the component adhesive layer 808 can be designed to have an adhesive strength greater than the force holding the individual components 802 to their source substrate. In some examples, a relatively low adhesion between the component adhesive layer 808 and the individual components 802 can contribute to increased precision during the laser-assisted transfer process. The component adhesive layer 808 can be designed to have an adhesive strength as low as possible, while being strong enough to keep the individual components adhered to the dynamic release layer tape prior to the laser-assisted transfer process. In some examples, to meet these mutually contradictory criteria for the component adhesive layer 808 to have both high and low adhesive strength, the component adhesive layer 808 can be designed to have an adhesive strength that can be modified by application of a stimulus such as UV light or heat. The initial strong adhesion of the component adhesive layer 808 can facilitate reliable transfer of the individual components 802 from their source substrate to the dynamic release layer tape. The initial adhesion of component adhesion layer 808 can also support the wafer during the dicing process to form the individual components. Prior to the laser assisted transfer process, a stimulus can be applied to reduce the adhesion between component adhesion layer 808 and individual components 802 to a level that can contribute to the accuracy of component placement during transfer.

[0123] 9A-9C, in some examples, the multilayer dynamic release structures 914, 934, 954 can be affixed to a rigid carrier substrate 910, such as a glass carrier substrate. Individual components 902 can be adhered to the rigid carrier substrate 910 by the dynamic release structures 914, 934, 954 to form individual component assemblies 900, 920, 940. The individual components 902 can be directly transferred from the rigid carrier substrate 910 to a target substrate by a laser assisted transfer process.

[0124] The dynamic release structure can be provided as an unsupported tape and can be applied as a tape onto a carrier substrate 910, for example, by roll coating or other tape application methods. In some examples, the dynamic release structure can be spin coated onto a carrier substrate. Application of a dynamic release structure in tape form onto a carrier substrate can have advantages over spin coating, such as reduced cost, reduced processing labor, and more efficient application.

[0125] The dynamic release structures 914, 934, 954 provided in tape form for application to the rigid carrier substrate 910 can be multi-layer structures as described above with respect to Figures 8A-8C.

[0126] 9A , in some examples, the dynamic release structure 914 can be a three-layer structure having an absorbent adhesive layer 904 adhered to a rigid carrier substrate 910. An active layer 906, such as a foam layer (as shown in FIG. 9A ), is disposed on the absorbent adhesive layer 904. A component adhesive layer 908 is disposed on the active layer 906.

[0127] The absorbing adhesive layer 904 has two functions: to bond the active layer 906 to the rigid carrier substrate 910 and to absorb energy from irradiation during the laser assisted transfer process. The absorption of energy by the absorbing adhesive layer 904 cauterizes the layer and generates gas. The generated gas induces a mechanical response in the adjacent active layer 906. For example, as shown in FIG. 9A, the active layer 906 can be a foam layer that blister in response to gas generation, causing the transfer of the discrete components 902.

[0128] 9B, in some examples, the dynamic release structure 934 can be a three-layer structure having an adhesive layer 924 that adheres to a rigid carrier substrate 910 and an active layer 926, such as an absorbing foam layer (as shown in FIG. 9B), disposed on the adhesive layer 924. A component adhesive layer 908 is disposed on the active layer 926. The adhesive layer 924 exhibits sufficient adhesion to adhere to the carrier substrate 910. In the example of FIG. 9B, the active layer 926 is an absorbing foam layer that absorbs energy from irradiation during the laser assisted transfer process and generates a gas that induces a mechanical response, such as the formation of blisters, in the active layer 926.

[0129] 9C, in some examples, the dynamic release structure 954 can be a four-layer structure having an adhesive layer 944 that adheres to the rigid carrier substrate 910 and an active layer structure 946 disposed on the adhesive layer 944. The component adhesive layer 908 is disposed on the active layer structure 946. The active layer structure 946 has two layers, an absorbing layer 948 and a foam layer 950. The absorbing layer 948 absorbs energy from irradiation during the laser assisted transfer process and generates a gas. The generation of gas induces a mechanical response in the foam layer 950, such as the formation of blisters.

[0130] The individual layers of the multi-layer dynamic release structure can be designed to achieve the desired functionality described above with respect to Figures 8A-8C. For example, the adhesive layers 904, 924, 954 that adhere to the carrier substrate 910 can be designed to have low enough adhesion to the carrier substrate to allow for easy removal, facilitating refurbishment of the carrier substrate after the laser transfer process is complete.

[0131] Although several embodiments have been described, it will be understood that various modifications may be made without departing from the spirit and scope of the present invention. For example, some of the steps described above are order-independent and therefore may be performed in an order different from that described above.

[0132] Other implementations are within the scope of the following claims.

[0133] [1] placing an individual component assembly on a support fixture of a component transfer system, the individual component assembly comprising: 1. A dynamic release tape comprising: A flexible support layer; a dynamic release tape comprising a dynamic release structure disposed on the flexible support layer; a discrete component adhered to the dynamic release tape; and applying radiation to the dynamic release structure to release the individual components from the dynamic release tape; The method of claim 1, wherein at least a portion of the flexible support layer is unsupported when the discrete component assembly is placed on the support fixture. [2] The method of [1], wherein the step of placing the individual component assemblies on the support fixture comprises mounting a wafer ring of the individual component assemblies on a frame of the support fixture. [3] The method of [1] or [2], further comprising adhering the discrete components to the dynamic release tape. [4] The method of [3], wherein the step of adhering the individual components to the dynamic release tape comprises adhering the individual components to a component adhesive layer of the dynamic release structure. [5] The method according to [3] or [4], wherein the step of adhering the individual components to the dynamic release tape includes a step of transferring the individual components from a dicing tape to the dynamic release tape. [6] The method according to [1] or [2], further comprising the step of adhering a wafer to the dynamic release tape. [7] The method of [6], wherein the step of adhering the wafer to the dynamic release tape includes adhering the wafer to a component adhesive layer of the dynamic release structure. [8] The method of [6] or [7], comprising dicing the bonded wafer to form individual components. [9] The method according to [8], wherein the step of placing the individual component assembly on a transparent support plate includes attaching the dynamic release tape with the individual components to a support plate of the support fixture.

[10] The method of [8] or [9], wherein the step of placing the individual component assembly on a support plate includes the step of holding the individual component assembly on the support plate by applying suction.

[11] The method according to any one of [1] to

[10] , wherein the step of irradiating the dynamic release structure includes a step of irradiating the dynamic release structure with light from a light source of the component transfer system.

[12] placing an individual component assembly on a support fixture of a component transfer system, the individual component assembly comprising: 1. A dynamic release tape comprising: A flexible support layer; a dynamic release tape comprising a dynamic release structure disposed on the flexible support layer; and a discrete component adhered to the dynamic release tape; said step of placing said discrete component assembly on said support fixture comprises placing said flexible support layer of said dynamic release tape directly on a support plate of said support fixture; and applying radiation to the dynamic release structure to release the discrete components from the dynamic release tape.

[13] The method of

[12] , wherein the step of placing the individual component assemblies on the support fixture comprises mounting a wafer ring of the individual component assemblies on a frame of the support fixture.

[14] The method according to

[12] or

[13] , comprising the step of irradiating the dynamic release structure through the support plate so as to release the individual components from the dynamic release tape.

[15] The method of

[14] , comprising orienting the component transfer system so that the individual components are disposed between the support plate and a target substrate.

[16] A method according to any one of

[12] to

[15] , wherein the step of placing the individual component assembly on a support plate comprises the step of placing the individual component assembly on a rigid support plate.

[17] The method of any one of

[12] to

[16] , wherein the step of positioning the individual component assembly on the support fixture comprises attaching the flexible support layer directly to the support plate.

[18] A method according to any one of

[12] to

[17] , wherein the step of placing the individual component assembly on the support plate includes a step of holding the individual component assembly on the support plate by applying suction.

[19] The method according to any one of

[12] to

[18] , wherein the step of placing the individual component assembly on the support plate comprises stretching the dynamic release tape across the support plate.

[20] The method according to any one of

[12] to

[19] , comprising adhering the individual components to the dynamic release tape.

[21] The method of

[20] , wherein the step of adhering the individual components to the dynamic release tape comprises adhering the individual components to a component adhesive layer of the dynamic release structure.

[22] The method according to

[20] or

[21] , wherein the step of adhering the individual components to the dynamic release tape comprises the step of transferring the individual components from a dicing tape to the dynamic release tape.

[23] The method according to any one of

[12] to

[19] , comprising adhering a wafer to the dynamic release tape.

[24] The method of

[23] , wherein the step of adhering the wafer to the dynamic release tape comprises adhering the wafer to a component adhesive layer of the dynamic release structure.

[25] The method of

[23] or

[24] , comprising dicing the bonded wafer to form individual components.

[26] The method according to

[25] , wherein the step of placing the individual component assembly on a transparent support plate includes attaching the dynamic release tape with the individual components to a support plate of the support fixture.

[27] The method of

[25] or

[26] , wherein the step of positioning the individual component assembly on the support plate comprises holding the individual component assembly on the support plate by applying suction.

[28] The method according to any one of

[12] to

[27] , wherein the step of irradiating the dynamic release structure includes a step of irradiating the dynamic release structure with light from a light source of the component transfer system.

[29] A discrete component transcription system, comprising: A light source; 1. A discrete component support fixture comprising: A support frame; a discrete component support fixture comprising a support plate disposed on the support frame, the support plate being transparent to light emitted by the light source; and an optical element disposed between the light source and the support frame.

[30] a suction source configured to apply suction to an air flow path of the individual component support fixture to hold a flexible support layer of an individual component assembly against the support plate, the individual component assembly comprising: a dynamic release tape comprising the flexible support layer and a dynamic release structure disposed on the flexible support layer; and a discrete component adhered to the dynamic release tape.

[31] A discrete component assembly, comprising: a dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer; and a discrete component adhered to the dynamic release tape; The system of

[29] or

[30] , wherein the flexible support layer of the dynamic release tape is placed directly on the support plate and held in place by suction through air flow paths of the individual component support fixture.

[32] The system of

[30] or

[31] , wherein the air flow passage is formed through a thickness of the support frame.

[33] The system of any one of

[30] to

[32] , wherein the air flow passage is formed through the thickness of the support plate.

[34] The system of any one of

[29] to

[33] , wherein the upper surface of the support plate is offset from the upper surface of the support frame by an amount sufficient to introduce tensile stress into a dynamic release tape held on the individual component support fixture.

[35] The system of any one of

[29] to

[34] , wherein the support plate comprises a glass plate.

[36] The system of any one of

[29] to

[34] , wherein the support plate comprises a quartz plate.

[37] The system described in any one of

[29] to

[36] , wherein the support plate has high rigidity.

[38] The system of any one of

[29] to

[37] , wherein the optical element comprises a lens.

[39] A discrete component transcription system, comprising: A light source; a discrete component support fixture; an individual component assembly disposed on the individual component support fixture, a dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer; and a discrete component adhered to the dynamic release tape; an individual component assembly, the dynamic release tape being unsupported when the individual component assembly is disposed on the individual component support fixture; an optical element disposed between the light source and the discrete component assembly.

[40] The system of

[39] , wherein the individual component assembly comprises a wafer ring disposed on the individual component support fixture.

[41] Dicing a wafer adhered to a dicing tape to form individual components; A flexible support layer; a dynamic release structure disposed on the flexible support layer; transferring the individual components from the dicing tape to a dynamic release tape to form an individual component assembly comprising: placing the flexible support layer of the individual component assembly directly onto a support plate of a component transfer system.

[42] The method of

[41] , wherein the step of transferring the individual components to the dynamic release tape includes adhering the individual components to a component adhesive layer of the dynamic release structure.

[43] The method of

[41] or

[42] , wherein the dynamic release structure of the dynamic release tape comprises multiple layers.

[44] The method according to

[43] , wherein the dynamic release structure comprises an active layer structure and a component adhesive layer, and the step of adhering the wafer to the dynamic release tape includes the step of adhering the wafer to the component adhesive layer.

[45] The method according to any one of

[41] to

[44] , wherein the step of placing the flexible support layer directly on the support plate comprises a step of attaching the flexible support layer directly to the support plate.

[46] A method according to any one of

[41] to

[45] , wherein the step of placing the flexible support layer directly on the support plate includes a step of holding the individual component assembly on the support plate by applying suction.

[47] The method according to any one of

[41] to

[46] , wherein the step of placing the flexible support layer directly on the support plate comprises stretching the dynamic release tape over the entire support plate.

[48] ​​A method according to any one of

[41] to

[47] , comprising the step of irradiating the dynamic release structure of the individual component assembly through the support plate so as to peel the individual components from the dynamic release tape.

[49] Dicing a wafer adhered to a dicing tape to form individual components; A flexible support layer; a dynamic release structure disposed on the flexible support layer; transferring the individual components from the dicing tape to a dynamic release tape to form an individual component assembly comprising: placing the individual component assembly in a component transfer system such that at least a portion of the dynamic release tape is unsupported.

[50] The method of

[49] , comprising irradiating the unsupported dynamic release tape to release the discrete components from the dynamic release tape.

[51] The method of

[49] or

[50] , wherein the dynamic release structure of the dynamic release tape comprises multiple layers.

[52] The method according to

[51] , wherein the dynamic release structure comprises an active layer structure and a component adhesive layer, and the step of adhering the wafer to the dynamic release tape includes the step of adhering the wafer to the component adhesive layer.

[53] The wafer is an unsupported flexible support layer; a dynamic release tape having a dynamic release structure disposed on the flexible support layer; and dicing the bonded wafer to form individual components that are adhered to the dynamic release tape.

[54] The method of

[53] , wherein the step of adhering the wafer to the dynamic release tape comprises adhering the wafer to a component adhesive layer of the dynamic release structure.

[55] The method of

[53] or

[54] , wherein the dynamic release structure of the dynamic release tape comprises multiple layers.

[56] The method of

[55] , wherein the dynamic release structure comprises an active layer structure and a component adhesive layer, and the step of adhering the wafer to the dynamic release tape includes the step of adhering the wafer to the component adhesive layer.

[57] The wafer is A flexible support layer; a dynamic release tape having a dynamic release structure disposed on the flexible support layer; dicing the bonded wafer to form individual components bonded to the dynamic release tape, the individual components bonded to the dynamic release tape comprising an individual component assembly; placing the flexible support layer of the individual component assembly directly onto a support plate of a component transfer system.

[58] The method of

[57] , wherein the step of placing the flexible support layer directly on the support plate comprises attaching the flexible support layer of the dynamic release tape directly to the support plate.

[59] The method of

[57] or

[58] , wherein the step of placing the flexible support layer directly on the support plate comprises holding the individual component assembly on the support plate by applying suction.

[60] The method according to any one of

[57] to

[59] , wherein the step of disposing the flexible support layer on the support plate comprises stretching the dynamic release tape across the support plate.

[61] A method according to any one of

[57] to

[60] , comprising the step of irradiating the dynamic release structure of the individual component assembly through the support plate so as to peel the individual components from the dynamic release tape.

[62] The method according to any one of

[57] to

[61] , wherein the dynamic release structure of the dynamic release tape comprises multiple layers.

[63] The method according to

[62] , wherein the dynamic release structure comprises an active layer structure and a component adhesive layer, and the step of adhering the wafer to the dynamic release tape includes the step of adhering the wafer to the component adhesive layer.

[64] The wafer is A flexible support layer; a dynamic release tape having a dynamic release structure disposed on the flexible support layer; dicing the bonded wafer to form individual components bonded to the dynamic release tape, the individual components bonded to the dynamic release tape comprising an individual component assembly; placing the individual component assembly in a component transfer system such that at least a portion of the dynamic release tape is unsupported.

[65] The method of

[64] , comprising irradiating the unsupported dynamic release tape to release the discrete components from the dynamic release tape.

[66] The method of

[64] or

[65] , wherein the dynamic release structure of the dynamic release tape comprises multiple layers.

[67] The method of

[66] , wherein the dynamic release structure includes an active layer structure and a component adhesive layer, and the step of adhering the wafer to the dynamic release tape includes adhering the wafer to the component adhesive layer.

[68] A dynamic release tape, comprising: A flexible support layer; a dynamic release structure disposed on the flexible support layer.

[69] The apparatus of

[68] , wherein the dynamic release tape has sufficient stiffness to enable laser transfer of discrete components from the dynamic release tape.

[70] The apparatus of

[68] or

[69] , wherein the dynamic release tape has sufficient rigidity to maintain a substantially planar configuration upon laser transfer of individual components from the dynamic release tape.

[71] The device of

[68] , wherein the flexible support layer comprises a polymer.

[72] The device of any one of

[68] to

[71] , wherein the dynamic release structure comprises multiple layers.

[73] The dynamic release structure comprises: an absorbing adhesive layer disposed on the flexible support layer, the absorbing adhesive layer being configured to adhere to the flexible support layer and to generate a gas in response to irradiation by light; and an active layer disposed on the absorbing adhesive layer.

[74] The device of

[73] , wherein the active layer comprises a foam layer configured to mechanically respond to gas generation by the absorbing adhesive layer.

[75] The dynamic release structure comprises: an adhesive layer disposed on the flexible support layer, the adhesive layer configured to adhere to the flexible support layer; The device described in any one of

[72] to

[74] , comprising an active layer structure disposed on the adhesive layer.

[76] The device of

[75] , wherein the active layer structure comprises an absorbing foam layer configured to generate gas in response to illumination by light and to mechanically respond to the gas generation.

[77] The active layer structure comprises: an absorbing layer disposed on the adhesive layer, the absorbing layer configured to generate a gas in response to illumination by light; and a foam layer configured to mechanically respond to the generation of gas by the absorbent layer.

[78] The device of any one of

[72] to

[77] , wherein one of the layers of the dynamic release structure comprises a component adhesive layer.

[79] A device described in any one of

[72] to

[77] , wherein adhesion of the component adhesive layer responds to the application of a stimulus.

[80] The device of any one of

[68] to

[79] , wherein the tape is stretchable.

[81] The device described in any one of

[68] to

[80] , wherein the flexible support layer is transparent to ultraviolet light.

[82] The device described in any one of

[68] to

[81] , comprising individual components adhered to the dynamic release structure.

[83] The apparatus of

[82] , wherein the individual components comprise light emitting diodes (LEDs).

[84] A method comprising forming a dynamic release structure on a flexible support layer to form a dynamic release tape.

[85] The method of

[84] , wherein the step of forming the dynamic release structure comprises forming a plurality of layers on the flexible support layer.

[86] The step of forming the dynamic release structure comprises: forming an absorbing adhesive layer on the flexible support layer, the absorbing adhesive layer configured to adhere to the flexible support layer and to generate gas in response to irradiation by light; and forming an active layer on the absorbing adhesive layer.

[87] The method of

[86] , wherein the active layer comprises a foam layer configured to mechanically respond to the generation of gas by the absorbing adhesive layer.

[88] The step of forming the dynamic release structure comprises: forming an adhesive layer on the flexible support layer, the adhesive layer configured to adhere to the flexible support layer; and forming an active layer structure on the adhesion layer.

[89] The method of

[88] , wherein the active layer structure comprises an absorbing foam layer configured to generate gas in response to illumination by light and to mechanically respond to the gas generation.

[90] The step of forming an active layer structure comprises: forming an absorbing layer on the adhesive layer, the absorbing layer configured to generate gas in response to illumination by light; and forming a foam layer on the absorbent layer, the foam layer configured to mechanically respond to the generation of gas by the absorbent layer.

[91] A dynamic peeling device, comprising: A flexible support layer; a dynamic release structure disposed on the flexible support layer, the dynamic release structure comprising: an adhesive layer disposed on the flexible support layer, the adhesive layer configured to adhere to the flexible support layer; and an active layer structure disposed on the adhesive layer.

[92] The device of

[91] , wherein the active layer structure comprises an absorbing foam layer configured to generate gas in response to illumination by light and to mechanically respond to the gas generation.

[93] The active layer structure comprises: an absorbing layer disposed on the adhesive layer, the absorbing layer configured to generate a gas in response to illumination by light; and a foam layer configured to mechanically respond to the generation of gas by the absorbent layer.

[94] The device of any one of

[91] to

[93] , wherein the dynamic release structure comprises a component adhesive layer.

[95] Placing an individual component assembly on a support fixture of a component transfer system, the individual component assembly comprising: 1. A dynamic release tape comprising: A flexible support layer; a dynamic release tape including a dynamic release structure disposed on the flexible support layer; a discrete component attached to the dynamic release tape; and applying radiation to the dynamic release structure to release the discrete components from the dynamic release tape.

[96] A discrete component transcription system, comprising: A light source; a discrete component support fixture; an individual component assembly disposed on the individual component support fixture, a dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer; a discrete component assembly comprising a discrete component adhered to the dynamic release tape; A discrete component transfer system comprising an optical element disposed between the light source and the discrete component assembly.

[97] Dicing a wafer adhered to a dicing tape to form individual components; A flexible support layer; a dynamic release structure disposed on the flexible support layer; and transferring the individual components from the dicing tape to a dynamic release tape to form an individual component assembly comprising:

[98] The wafer is A flexible support layer; a dynamic release tape having a dynamic release structure disposed on the flexible support layer; and dicing the bonded wafer to form individual components that are adhered to the dynamic release tape. [Explanation of symbols]

[0134] 100 Support fixture 102 Individual components 106 High rigidity support plate 108 Individual Component Assembly 110 Dynamic release tape 112 Flexible support layer 114 Dynamic peeling structure 116 Radiation 118 Blister 130 Target Board 150 Support fixture 170 frames 200 Support fixture 206 Support plate 207 Top surface 208 Individual Component Assembly 210 Dynamic Release Tape 212 Flexible support layer 214 Multi-layer dynamic peeling structure 220 frames 221 Opening 222 Wafer Ring 223 Top surface 224a, 224b sublayer 226 Component adhesive layer 228 Air Flow Path 300 Support fixture 306 Support plate 307 Top surface 320 frames 321 Opening 400 Support fixture 406 Support plate 408 Individual Component Assembly 410 Dynamic Release Tape 420 frames 421 Opening 422 Wafer Ring 430 Target Board 432 PCB Holder 434 Suction source 450 Component Transcription System 452 Light source 454 Optical Elements 500 Support fixture 508 Individual Component Assembly 510 Dynamic Release Tape 520 frames 522 Wafer Ring 530 Target Board 532 PCB Holder 550 Component Transcription System 552 Light source 554 Optical Elements 602 Individual components 606 High rigidity support plate 610 Dynamic Release Tape 630 Wafer 632 Dicing Tape 702 Individual components 706 High rigidity support plate 710 Dynamic Release Tape 730 Wafers 800, 820, 840 Dynamic Release Tape 802 Individual components 804 Absorbing adhesive layer 805 Active layer 808 Component adhesive layer 812 Flexible support layer 814, 834, 854 Multi-layer dynamic peeling structure 824 Adhesive layer 826 Active layer 844 Adhesive layer 846 Active layer structure 848 Absorbing layer 850 Foam layer 900, 920, 940 Individual Component Assemblies 902 Individual components 904 Absorbing adhesive layer 906 Active layer 908 Component adhesive layer 910 Highly rigid carrier substrate 914, 934, 954 Multi-layer dynamic peeling structure 924 Adhesive layer 926 Active layer 946 Active layer structure 948 Absorption Layer 950 Foam layer

Claims

1. An apparatus comprising a dynamic release tape, the dynamic release tape comprising: (a) a flexible support layer; and (b) a dynamic release structure disposed on the flexible support layer.

2. The apparatus of claim 1, wherein the dynamic peeling tape has sufficient rigidity to enable laser transfer of individual components from the dynamic peeling tape.

3. The apparatus of claim 1, wherein the dynamic peeling tape has sufficient rigidity to maintain a substantially planar configuration upon laser transfer of individual components from the dynamic peeling tape.

4. The device of claim 1, wherein the flexible support layer comprises a polymer.

5. The device described in claim 1, wherein the dynamic peeling structure includes multiple layers.

6. The dynamic peeling structure is (a) an absorbing adhesive layer disposed on the flexible support layer, the absorbing adhesive layer (i) adhering to the flexible support layer and (ii) configured to generate a gas in response to irradiation by light; (b) an active layer disposed on the absorbing adhesive layer; The apparatus of claim 1 , comprising:

7. The device of claim 6, wherein the active layer comprises a foam layer configured to mechanically respond to gas generation by the absorbent adhesive layer.

8. The device of claim 1, wherein the dynamic peeling structure comprises: (a) an adhesive layer disposed on the flexible support layer, the adhesive layer configured to adhere to the flexible support layer; and (b) an active layer structure disposed on the adhesive layer.

9. The device described in claim 8, wherein the active layer structure comprises an absorbing foam layer configured to generate gas in response to irradiation with light and to mechanically respond to the gas.

10. The device of claim 8, wherein the active layer structure comprises: (a) an absorption layer disposed on the adhesive layer, the absorption layer configured to generate gas in response to irradiation with light; and (b) a foam layer configured to mechanically respond to gas generation by the absorption layer.

11. Forming a dynamic release structure on a flexible support layer to form a dynamic release tape. A method comprising:

12. The method of claim 11, wherein the step of forming the dynamic peeling structure includes forming a plurality of layers on the flexible support layer.

13. The step of forming the dynamic release structure comprises: forming an absorbent adhesive layer on the flexible support layer, the absorbent adhesive layer configured to adhere to the flexible support layer and to generate gas in response to irradiation by light; forming an active layer on the absorbing adhesive layer; The method of claim 11 , comprising:

14. The method of claim 13, wherein the active layer comprises a foam layer configured to mechanically respond to the generation of the gas by the absorbent adhesive layer.

15. The step of forming the dynamic release structure, forming an adhesive layer on the flexible support layer, the adhesive layer configured to adhere to the flexible support layer; forming an active layer structure on the adhesion layer; The method of claim 11 , comprising:

16. The step of forming the active layer structure, forming an absorbing layer on the adhesive layer, the absorbing layer configured to generate gas in response to illumination by light; forming a foam layer on the absorbent layer, the foam layer configured to mechanically respond to gas generation by the absorbent layer; 16. The method of claim 15, comprising:

17. A dynamic peeling device comprising: A flexible support layer; a dynamic release structure disposed on the flexible support layer, the dynamic release structure comprising: (a) an adhesive layer disposed on the flexible support layer, the adhesive layer configured to adhere to the flexible support layer; and (b) an active layer structure disposed on the adhesive layer. A dynamic peeling device comprising:

18. The dynamic peeling device of claim 17, wherein the active layer structure comprises an absorbing foam layer configured to (a) generate gas in response to irradiation with light, and (b) mechanically respond to the gas generation.

19. The dynamic peeling device of claim 17, wherein the active layer structure comprises: (a) an absorbent layer disposed on the adhesive layer, the absorbent layer configured to generate gas in response to irradiation with light; and (b) a foam layer configured to mechanically respond to gas generation by the absorbent layer.

20. The dynamic peeling device of claim 17, wherein the dynamic peeling structure comprises a component adhesive layer.

21. The method of claim 1, further comprising the steps of: providing individual components adhered to a dicing tape; transferring the discrete components from the dicing tape to a dynamic release tape to form a discrete component assembly including: (a) a flexible support layer; and (b) a dynamic release structure disposed on the flexible support layer; placing the flexible support layer of the individual component assembly directly onto a support plate of a component transfer system; A method comprising:

22. The method of claim 21, wherein the step of transferring the individual components to the dynamic release tape includes a step of adhering the individual components to a component adhesive layer of the dynamic release structure.

23. The method of claim 21, wherein the dynamic release structure of the dynamic release tape comprises multiple layers.

24. The method of claim 23, wherein the step of transferring the individual components from the dicing tape to the dynamic peel tape includes a step of adhering a wafer to a component adhesive layer.

25. The method described in claim 21, wherein the step of placing the flexible support layer directly on the support plate includes a step of attaching the flexible support layer directly to the support plate.

26. The method of claim 21, wherein the step of placing the flexible support layer directly on the support plate includes a step of holding the individual component assembly on the support plate by applying suction.

27. ​​The method of claim 21, wherein the step of placing the flexible support layer directly on the support plate includes a step of stretching the dynamic release tape across the entire support plate.

28. The method of claim 21, further comprising irradiating the dynamic release structure of the individual component assembly through the support plate so as to peel the individual components from the dynamic release tape.

29. The method of claim 21, wherein the dynamic release tape is an unsupported tape.

30. The method of claim 21, wherein the individual components are adhered to the dynamic release structure, the dynamic release structure including an active layer, the dynamic release structure configured to generate a gas in response to irradiation with light, the gas inducing a mechanical reaction in the active layer.

31. A method of manufacturing a semiconductor device comprising: adhering a wafer to a dynamic release tape, the dynamic release tape comprising: (a) a flexible support layer; and (b) a dynamic release structure disposed on the flexible support layer; dicing the bonded wafer to form individual components bonded to the dynamic release tape, the individual components bonded to the dynamic release tape forming individual component assemblies; A method comprising:

32. The method of claim 31, further comprising a step of placing the flexible support layer of the dynamic release tape directly onto a support plate of a component transfer system.

33. The method described in claim 32, wherein the step of placing the flexible support layer directly on the support plate includes a step of attaching the flexible support layer of the dynamic release tape directly to the support plate.

34. The method of claim 32, wherein the step of placing the flexible support layer directly on the support plate includes a step of holding the individual component assembly on the support plate by applying suction.

35. The method of claim 32, wherein the step of placing the flexible support layer on the support plate includes a step of stretching the dynamic release tape across the entire support plate.

36. The method of claim 32, further comprising the step of irradiating the dynamic release structure of the individual component assembly through the support plate so as to peel the individual components from the dynamic release tape.

37. The method of claim 32, wherein the dynamic release structure of the dynamic release tape comprises multiple layers.

38. The method of claim 37, wherein the step of adhering the wafer to the dynamic release tape includes a step of adhering the wafer to a component adhesive layer of the dynamic release structure, the dynamic release structure comprising: (a) the component adhesive layer; and (b) an active layer structure.

39. The method of claim 31, further comprising the step of placing the individual component assembly in a component transfer system so that at least a portion of the dynamic peeling tape is unsupported.

40. The method of claim 39, further comprising irradiating the unsupported tape so as to peel the individual components from the dynamic peel tape.

41. The method of claim 31, wherein the dynamic release tape is an unsupported tape.

42. The method of claim 31, wherein the dynamic exfoliation structure includes an active layer, the dynamic exfoliation structure configured to generate a gas in response to irradiation with light, the gas inducing a mechanical reaction in the active layer.

43. The method of claim 1, further comprising the steps of: providing individual components adhered to a dicing tape; transferring the discrete components from the dicing tape to a dynamic release tape to form a discrete component assembly, the dynamic release tape being an unsupported tape, the dynamic release tape including (a) a flexible support layer and (b) a dynamic release structure disposed on the flexible support layer, the discrete components being adhered to the dynamic release structure, the dynamic release structure including an active layer, the dynamic release structure configured to generate a gas in response to illumination by light, the gas inducing a mechanical response in the active layer; A method comprising:

44. A step of adhering a wafer to a dynamic release tape, the dynamic release tape being an unsupported tape, the dynamic release tape including (a) a flexible support layer and (b) a dynamic release structure disposed on the flexible support layer, the dynamic release structure including an active layer, the dynamic release structure configured to generate a gas in response to irradiation with light, the gas inducing a mechanical reaction in the active layer; dicing the bonded wafer to form individual components bonded to the dynamic release tape; A method comprising:

45. A step of placing the discrete component assembly on a discrete component support fixture of a discrete component transfer system, the discrete component transfer system comprising: A light source; the discrete component support fixture comprising: (a) a support frame; and (b) a support plate disposed on the support frame, the support plate being transparent to light emitted by the light source; an optical element disposed between the light source and the support frame; The discrete component assembly comprises: (a) a dynamic release tape including a flexible support layer and a dynamic release structure disposed on the flexible support layer; and (b) a discrete component adhered to the dynamic release tape; applying radiation to the dynamic release structure to release the individual components from the dynamic release tape; A method comprising:

46. The method of claim 45, wherein at least a portion of the flexible support layer is unsupported when the individual component assembly is placed on the individual component support fixture.

47. The method described in claim 45, wherein the step of positioning the individual component assembly onto the individual component support fixture includes a step of placing the flexible support layer of the dynamic release tape directly onto the support plate of the individual component support fixture.

48. The method described in claim 45, wherein the step of placing the individual component assembly on the individual component support fixture includes a step of mounting a wafer ring of the individual component assembly on the support frame of the individual component support fixture.

49. The method of claim 45, further comprising the step of adhering the individual components to the dynamic release tape prior to positioning the individual components.

50. The method of claim 45, further comprising adhering the individual components to a component adhesive layer of the dynamic peeling structure.

51. The method of claim 45, further comprising adhering a wafer including the individual components to the dynamic peel tape.

52. The method of claim 51, wherein the step of adhering the wafer to the dynamic release tape includes a step of adhering the wafer to a component adhesive layer of the dynamic release structure.

53. The method described in claim 45, wherein the step of placing the individual component assembly on the individual component support fixture includes a step of attaching the dynamic release tape including the individual components to the support plate of the individual component support fixture.

54. The method of claim 53, wherein the step of placing the individual component assembly on the support plate includes a step of holding the individual component assembly on the support plate by applying suction.

55. The method of claim 45, wherein the step of irradiating the dynamic peeling structure includes the step of irradiating the dynamic peeling structure with light from the light source of the individual component transfer system.

56. The method described in claim 45, wherein the upper surface of the support plate is offset from the upper surface of the support frame by an amount sufficient to introduce tensile stress into the dynamic release tape held on the individual component support fixture.

57. A discrete component transcription system comprising: A light source; a discrete component support fixture comprising: (a) a support frame; and (b) a support plate disposed on the support frame, the support plate being transparent to light emitted by the light source; an optical element disposed between the light source and the support frame; A discrete component transcription system comprising:

58. The method of claim 58, further comprising: providing a suction source configured to apply suction to an air flow path of the discrete component support fixture to hold a flexible support layer of a discrete component assembly against the support plate; 58. The individual component transfer system of claim 57, wherein the individual component assembly comprises: (a) a dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer; and (b) an individual component adhered to the dynamic release tape.

59. An individual component transfer system as described in claim 58, wherein the air flow path is formed through a thickness of the support frame.

60. An individual component transfer system as described in claim 58, wherein the air flow path is formed through the thickness of the support plate.

61. The method of claim 61, further comprising: (a) a dynamic release tape comprising: (i) a flexible support layer; and (ii) a dynamic release structure disposed on the flexible support layer; and (b) a discrete component adhered to the dynamic release tape; 58. The discrete component transfer system of claim 57, wherein the flexible support layer of the dynamic release tape is placed directly on the support plate and held in place by suction through air passages in the discrete component support fixture.

62. An individual component transfer system as described in claim 57, wherein the upper surface of the support plate is offset from the upper surface of the support frame by an amount sufficient to introduce tensile stress into a dynamic peel tape held on the individual component support fixture.

63. A discrete component transcription system comprising: A light source; a discrete component support fixture comprising: (a) a support frame; and (b) a support plate disposed on the support frame, the support plate being transparent to light emitted by the light source; an individual component assembly disposed on the individual component support fixture, the individual component assembly comprising: (a) a dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer; and (b) an individual component adhered to the dynamic release tape, the dynamic release structure configured such that the individual component is released from the dynamic release tape in response to illumination of the dynamic release structure by the light source; an optical element disposed between the light source and the support frame; A discrete component transcription system comprising:

64. An individual component transfer system as described in claim 63, wherein the dynamic peeling tape is in an unsupported state when the individual component assembly is disposed on the individual component support fixture.

65. An individual component transfer system as described in claim 63, wherein the individual component assembly comprises a wafer ring disposed on the individual component support fixture.

66. An individual component transfer system as described in claim 63, wherein the upper surface of the support plate is offset from the upper surface of the support frame by an amount sufficient to introduce tensile stress into the dynamic peel tape held on the individual component support fixture.

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