Processing device and method for manufacturing mobile body

Abstract

To provide a processing device that can properly form a structure in an object.MEANS: A processing device (1) includes: a light irradiation device (11) for irradiating a surface of an object (S, SF) with processing light (EL); and a partition wall member (132) for surrounding a space including an optical path located between an optical member (1123) positioned nearest to an object side of the optical systems (112) of the light irradiation device that transmit processing light therethrough and the surface of the object.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a processing device capable of processing an object by irradiating the object with processing light, and a manufacturing method for manufacturing a moving body. [Background technology]

[0002] As a processing device capable of processing an object, Patent Document 1 describes a processing device that irradiates a laser beam onto the surface of an object to form a structure and reduce the resistance associated with the surface. This type of processing device is required to appropriately form a structure on the object. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] U.S. Patent No. 4,994,639 Summary of the Invention

[0004] According to a first aspect, there is provided a processing apparatus comprising: a light irradiation device that irradiates processing light onto a surface of an object; and a partition member that encloses a space including an optical path between the surface of the object and an optical element located closest to the object among the optical elements of the light irradiation device that pass the processing light.

[0005] According to a second aspect, there is provided a processing apparatus including a light irradiation device that irradiates a surface of an object with processing light, and a suction device that sucks up a substance produced by the irradiation of the processing light.

[0006] According to a third aspect, there is provided a method for manufacturing a moving body that moves through a fluid, comprising: irradiating a processing light onto a surface of an object via an optical system of a light irradiation device; and surrounding a space including an optical path between an optical member of the optical system that is positioned closest to the object and the surface of the object with a partition member, wherein the thickness of a part of the object is changed by irradiating the processing light, thereby forming a structure on the surface of the object.

[0007] According to a fourth aspect, there is provided a method for manufacturing a moving body that moves through a fluid, comprising: irradiating a processing light onto a surface of an object via an optical system of a light irradiation device; and surrounding a space including an optical path between an optical member of the optical system that is positioned closest to the object and the surface of the object with a partition member, wherein a portion of the object is removed by irradiating the processing light to form a structure on the surface of the object.

[0008] According to a fifth aspect, there is provided a method for manufacturing a moving body that moves through a fluid, comprising irradiating a surface of an object with processing light and sucking up a substance that is produced by the irradiation of the processing light, and changing a thickness of a part of the object by irradiating the processing light to form a structure on the surface of the object.

[0009] According to a sixth aspect, there is provided a method for manufacturing a moving body that moves through a fluid, comprising irradiating a surface of an object with processing light and sucking up a substance resulting from the irradiation of the processing light, thereby removing a part of the object by irradiating the processing light and forming a structure on the surface of the object. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a cross-sectional view showing a schematic overall structure of a processing device according to the present embodiment. [Diagram 2] 2(a) and 2(b) are cross-sectional views each showing a schematic state of processing of a coating film formed on the surface of an object to be processed. [Diagram 3] FIG. 3(a) is a cross-sectional view showing a schematic diagram of a light irradiation device provided in the processing apparatus of this embodiment, FIG. 3(b) and FIG. 3(c) are cross-sectional views showing the configuration of a light source system provided in the light irradiation device, and FIG. 3(d) is a perspective view showing a schematic diagram of another example of the optical system of the light irradiation device. [Figure 4] FIG. 4 is a side view showing the storage device. [Diagram 5] FIG. 5(a) is a cross-sectional view showing a cross section of a riblet structure formed by the processing apparatus of this embodiment, and FIG. 5(b) is a perspective view showing the riblet structure formed by the processing apparatus of this embodiment. [Figure 6] Figures 6(a) and 6(b) are each a front view showing an aircraft, which is an example of a workpiece on which a riblet structure is formed, and Figure 6(c) is a side view showing an aircraft, which is an example of a workpiece on which a riblet structure is formed. [Figure 7] FIG. 7 is a plan view showing a plurality of unit processing areas set on the surface of the coating film SF. [Figure 8] FIG. 8 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 9] Figure 9(a) is a cross-sectional view showing a processing device performing one step of a processing operation to form a riblet structure, and Figure 9(b) is a plan view showing the surface of a paint film during one step of the processing operation shown in Figure 9(a). [Figure 10] FIG. 10 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 11] Figure 11(a) is a cross-sectional view showing a processing device performing one step of a processing operation to form a riblet structure, and Figure 11(b) is a plan view showing the surface of a paint film during one step of the processing operation shown in Figure 11(a). [Figure 12] FIG. 12 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 13] FIG. 13 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 14] FIG. 14 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 15] FIG. 15 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 16] FIG. 16 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 17] FIG. 17 is a cross-sectional view showing a processing device performing one step of a processing operation for forming a riblet structure. [Figure 18] FIG. 18 is a cross-sectional view illustrating a schematic diagram of another example of the light irradiation device. [Figure 19] FIG. 19 is a cross-sectional view illustrating a schematic diagram of another example of the light irradiation device. [Figure 20] FIG. 20 is a cross-sectional view illustrating a schematic diagram of another example of the light irradiation device. [Figure 21] FIG. 21 is a cross-sectional view illustrating a schematic diagram of another example of the light irradiation device. [Figure 22] FIG. 22 is a cross-sectional view illustrating a schematic diagram of another example of the light irradiation device. [Figure 23] FIG. 23 is a cross-sectional view illustrating a schematic diagram of another example of the light irradiation device. [Figure 24] FIG. 24 is a cross-sectional view illustrating a schematic diagram of another example of the light irradiation device. [Diagram 25] FIG. 25 is a cross-sectional view that illustrates a schematic overall structure of a processing apparatus according to a second modified example. [Figure 26] Figure 26(a) is a cross-sectional view showing how the surface of a paint film is located within the focal depth of the optical system when the surface of the paint film is flat, Figure 26(b) is a cross-sectional view showing how the surface of a paint film is located within the focal depth of the optical system when the surface of the paint film is curved, Figure 26(c) is a cross-sectional view showing how the surface of a paint film is located within the focal depth of the optical system when the surface of the paint film has unevenness, and Figure 26(d) is a cross-sectional view showing how the surface of a paint film is located within the focal depth of the optical system when the surface of the paint film is inclined with respect to the optical axis of the optical system. [Figure 27] FIG. 27 is a cross-sectional view that typically shows a light irradiation device that can individually adjust the focusing positions of a plurality of processing beams. [Figure 28] FIG. 28 is a cross-sectional view showing how a plurality of processing beams are irradiated in a case where the optical system is non-telecentric on the coating film side. [Figure 29]Figure 29(a) is a cross-sectional view showing how the focusing positions of multiple processing light beams are located on the surface of a coating film when the surface of the coating film is flat, Figure 29(b) is a cross-sectional view showing how the focusing positions of multiple processing light beams are located on the surface of a coating film when the surface of the coating film is curved, Figure 29(c) is a cross-sectional view showing how the focusing positions of multiple processing light beams are located on the surface of a coating film when the surface of the coating film is uneven, and Figure 29(d) is a cross-sectional view showing how the focusing positions of multiple processing light beams are located on the surface of a coating film when the surface of the coating film is inclined with respect to the optical axis of the optical system. [Diagram 30] Figure 30(a) is a cross-sectional view showing the range of focal depth of an optical system set to include the surface of a paint film when the surface of the paint film is flat, Figure 30(b) is a cross-sectional view showing the range of focal depth of an optical system set to include the surface of a paint film when the surface of the paint film is curved, Figure 30(c) is a cross-sectional view showing the range of focal depth of an optical system set to include the surface of a paint film when the surface of the paint film is uneven, and Figure 30(d) is a cross-sectional view showing the range of focal depth of an optical system set to include the surface of a paint film when the surface of the paint film is inclined with respect to the optical axis of the optical system. [Diagram 31] Figure 31(a) is a cross-sectional view showing an image plane set to match the surface of the coating film SF when the surface of the coating film SF is flat, Figure 31(b) is a cross-sectional view showing an image plane set to match the surface of the coating film SF when the surface of the coating film SF is curved, Figure 31(c) is a cross-sectional view showing an image plane set to match the surface of the coating film SF when the surface of the coating film is uneven, and Figure 31(d) is a cross-sectional view showing an image plane set to match the surface of the coating film SF when the surface of the coating film is inclined with respect to the optical axis of the optical system. [Diagram 32] FIG. 32(a) is a cross-sectional view showing the non-processed region, and FIG. 32(b) is a plan view showing the non-processed region. [Diagram 33]Each of Figs. 33(a) to 33(c) is a graph showing the relationship between the reflectance of a coating film with respect to the processing light and the intensity of the processing light set by the control device. [Diagram 34] Each of Figs. 34(a) to 34(c) is a graph showing the relationship between the reflectance of the coating film with respect to the processing light and the irradiation time of the processing light set by the control device. [Diagram 35] FIG. 35 is a graph showing the reflectance of a coating film for a plurality of measurement lights having different wavelengths. [Diagram 36] FIG. 36 is a cross-sectional view that illustrates a light irradiation device that includes a plurality of light source systems. [Figure 37] FIG. 37 is a cross-sectional view showing the range in which the surface characteristic measuring device measures the shape of the surface of the coating film when the light irradiation device moves relative to the coating film SF. [Figure 38] FIG. 38 is a cross-sectional view that typically shows the overall structure of a processing apparatus according to a third modified example. [Figure 39] FIG. 39 is a plan view showing the positional relationship between a light projecting device and a detecting device provided in the structure measuring instrument. [Diagram 40] FIG. 40 is a plan view showing a sample area where the structure measurement device measures the properties of the riblet structures. [Diagram 41] Figure 41(a) is a cross-sectional view showing the ideal riblet structure that the processing device should form, Figure 41(b) is a cross-sectional view showing a riblet structure of the same size as the ideal riblet structure, Figure 41(c) is a cross-sectional view showing a riblet structure smaller than the ideal riblet structure, and Figure 41(d) is a cross-sectional view showing a riblet structure larger than the ideal riblet structure. [Diagram 42] Figure 42(a) is a cross-sectional view showing a riblet structure having the same shape as the ideal riblet structure, and Figure 42(b) is a cross-sectional view showing a riblet structure having a shape different from the ideal riblet structure. [Diagram 43]Figure 43 is a cross-sectional view showing a riblet structure including a concave structure at the same position as the concave structure that constitutes an ideal riblet structure, and a riblet structure including a concave structure at a different position than the concave structure that constitutes the ideal riblet structure. [Diagram 44] Figure 44(a) is a cross-sectional view showing a sample area in which a riblet structure is formed, and Figure 44(b) is a cross-sectional view showing a sample area in which a riblet structure is not formed. [Diagram 45] Figure 45(a) is a cross-sectional view showing how processing light is irradiated to a riblet structure that is smaller than the ideal size in order to correct the riblet structure, and Figure 45(b) is a cross-sectional view showing the corrected riblet structure. [Diagram 46] FIG. 46 is a cross-sectional view that illustrates a schematic structure of a light irradiation device provided in a processing apparatus of the fourth modified example. [Figure 47] Figures 47(a) and 47(b) are plan views showing multiple irradiation areas with different arrangement pitches, and Figures 47(c) and 47(d) are cross-sectional views showing a riblet structure formed by irradiating multiple processing light beams to the multiple irradiation areas shown in Figures 47(a) and 47(b), respectively. [Figure 48] Figures 48(a) and 48(b) are plan views showing multiple processing lights having different relative angles, and Figures 48(c) and 48(d) are plan views showing multiple irradiation areas to which the multiple processing lights shown in Figures 48(a) and 48(b) are irradiated, respectively. [Figure 49] Figures 49(a) and 49(b) are plan views showing multiple processing light beams irradiated from light irradiation devices at different distances from the coating film SF, and Figures 49(c) and 49(d) are plan views showing multiple irradiation areas to which the multiple processing light beams shown in Figures 49(a) and 49(b) are irradiated, respectively. [Figure 50] Figures 50(a) and 50(c) are plan views showing multiple processing light beams irradiated from light irradiation devices having different numbers of light sources irradiating the processing light, and Figures 50(b) and 50(d) are plan views showing multiple irradiation areas to which the multiple processing light beams shown in Figures 50(a) and 50(c) are irradiated, respectively. [Figure 51] Figures 51(a) and 51(c) are plan views showing first and second split light beams having different intersecting angles, and Figures 51(b) and 51(d) are plan views showing interference fringes formed on the surface of a coating film due to interference between the first and second split light beams shown in Figures 51(a) and 51(c), respectively. [Figure 52] FIG. 52 is a cross-sectional view that illustrates a schematic diagram of a light irradiation device that is capable of adjusting the angle at which the first and second split light beams intersect. [Figure 53] FIG. 53 is a cross-sectional view that typically shows the overall structure of a processing apparatus according to the fifth modified example. [Figure 54] Figures 54(a) and 54(c) are cross-sectional views showing the intensity distribution on the surface of a coating film, and Figures 54(b) and 54(d) are cross-sectional views showing a riblet structure formed by irradiating multiple processing light beams having the intensity distributions shown in Figures 54(a) and 54(c), respectively. [Figure 55] Figures 55(a) and 55(c) are cross-sectional views showing multiple irradiation areas of different shapes, and Figures 55(b) and 55(d) are cross-sectional views showing a riblet structure formed by irradiating multiple processing light beams onto multiple irradiation areas having the shapes shown in Figures 55(a) and 55(c), respectively. [Figure 56] Figures 56(a) and 56(c) are cross-sectional views showing multiple irradiation areas of different sizes, and Figures 56(b) and 56(d) are cross-sectional views showing a riblet structure formed by irradiating multiple processing light beams onto multiple irradiation areas having the sizes shown in Figures 56(a) and 56(c), respectively. [Figure 57] Figures 57(a) and 57(c) are cross-sectional views showing multiple processing light beams of different intensities, and Figures 57(b) and 57(d) are cross-sectional views showing a riblet structure formed by irradiating multiple processing light beams of the intensities shown in Figures 57(a) and 57(c), respectively. [Figure 58] Figure 58(a) is an oblique view showing a riblet structure in which the cross-sectional shape of the concave structure changes along the extension direction, Figure 58(b) is a cross-sectional view taken along II' in Figure 58(a), and Figure 58(c) is a cross-sectional view taken along II' in Figure 58(a). [Figure 59] Figure 59(a) is an oblique view showing a riblet structure in which the width of the concave structure changes along the extension direction, Figure 59(b) is a cross-sectional view taken along II' in Figure 59(a), and Figure 59(c) is a cross-sectional view taken along II' in Figure 59(a). [Figure 60] FIG. 60 is a cross-sectional view that typically shows the overall structure of a processing apparatus according to a sixth modified example. [Figure 61] FIG. 61 is a cross-sectional view that typically shows the overall structure of a processing apparatus according to a seventh modified example. [Figure 62] FIG. 62 is a cross-sectional view that typically shows the overall structure of a processing apparatus according to an eighth modified example. [Figure 63] FIG. 63 is a cross-sectional view showing an example of the structure of an adsorption part that positions the light irradiation device on the coating film. [Figure 64] FIG. 64 is a cross-sectional view illustrating a schematic overall structure of a processing apparatus according to a ninth modified example. [Figure 65] FIG. 65 is a cross-sectional view showing a schematic overall structure of a processing apparatus according to a tenth modified example. [Figure 66] Each of Figures 66(a) and (b) is a plan view showing a unit processing area which partially overlaps with another adjacent unit processing area. [Figure 67] FIG. 67 is a cross-sectional view showing how processing light is irradiated onto two adjacent unit processing areas. [Figure 68] FIG. 68 is a cross-sectional view showing how processing light is irradiated onto two adjacent unit processing areas. [Figure 69] FIG. 69 is a cross-sectional view showing the intensities of processing light irradiated onto two adjacent unit processing areas. [Figure 70] FIG. 70 is a cross-sectional view showing the intensities of processing light irradiated onto two adjacent unit processing areas. [Figure 71] Each of Figures 71(a) to 71(c) is a plan view showing an area across which multiple irradiation areas move in one scanning operation. [Figure 72] Each of Figures 72(a) and 72(b) is a cross-sectional view showing a structure in which multiple layers are laminated. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. However, the present invention is not limited to the embodiment described below.

[0012] (1) Structure of processing device 1 The structure of the processing device 1 of this embodiment will be described with reference to FIG. 1. FIG. 1 is a cross-sectional view that shows a schematic structure of the processing device 1 of this embodiment. In the following, the structure of the processing device 1 will be described in a three-dimensional coordinate space defined by mutually orthogonal X-axis, Y-axis, and Z-axis. The X-axis and Y-axis are directions along a horizontal plane, and the Z-axis is a direction perpendicular to the X-axis and Y-axis. However, although the processing device 1 is disposed on the processing object S having a surface along a horizontal plane in FIG. 1, the processing device 1 is not necessarily disposed on the processing object S having a surface along a horizontal plane. For example, as will be described later in detail with reference to FIG. 6, the processing device 1 may be disposed on the processing object S having a surface intersecting a horizontal plane, or may be suspended from the processing object S. In this case, the X-axis and Y-axis may be defined as directions along the surface of the processing object S for convenience.

[0013] As shown in FIG. 1, the processing device 1 processes a coating film SF formed on the surface of a processing object S. The processing object S may be, for example, a metal, an alloy (e.g., duralumin, etc.), a resin (e.g., CFRP (Carbon Fiber Reinforced Plastic), etc.), glass, or an object made of any other material. The coating film SF is a film of paint that covers the surface of the processing object S. The thickness of the coating film SF is, for example, several tens of micrometers to several hundreds of micrometers, but may be any other size. The paint constituting the coating film SF may include, for example, a resin-based paint (e.g., at least one of a polyurethane-based paint, a vinyl-based paint, a silicon-based paint, and an epoxy-based paint), or may include other types of paint.

[0014] The processing device 1 irradiates the coating film SF with processing light EL in order to process the coating film SF. The processing light EL may be any type of light as long as it is capable of processing the coating film SF when irradiated therewith. As an example, the processing light EL may be laser light. Furthermore, the processing light EL may be light of any wavelength as long as it is capable of processing the coating film SF when irradiated therewith. In this embodiment, the explanation will be given using an example in which the processing light EL is invisible light (e.g., at least one of infrared light and ultraviolet light). However, the processing light EL may be visible light.

[0015] The processing device 1 irradiates the processing light EL to the irradiation area EA set (in other words, formed) on the surface of the coating film SF. As shown in FIG. 2(a), when the processing light EL is irradiated to the irradiation area EA, a part of the coating film SF overlapping the irradiation area EA (i.e., the coating film located on the -Z side of the irradiation area EA) is evaporated by the processing light EL. At this time, in the thickness direction of the coating film SF, not all of the coating film SF overlapping the irradiation area EA is evaporated. That is, in the thickness direction of the coating film SF, a part of the coating film SF overlapping the irradiation area EA (specifically, a part of the coating film SF relatively close to the irradiation area EA) is evaporated, while the other part of the coating film SF overlapping the irradiation area EA (specifically, a part of the coating film SF relatively far from the irradiation area EA) is not evaporated. In other words, the coating film SF is evaporated only to the extent that the processing object S is not exposed from the coating film SF. As a result, the coating film SF is removed in the part where the coating film SF has evaporated. On the other hand, the coating film SF remains as it is in the part where the coating film SF has not evaporated. That is, as shown in FIG. 2(b), the coating film SF is partially removed in the portion irradiated with the processing light EL. As a result, as shown in FIG. 2(b), the thickness of the coating film SF is thinner in the portion irradiated with the processing light EL than in the portion not irradiated with the processing light EL. In other words, as shown in FIG. 2(b), on the surface of the processing object S, there exists a coating film SF that remains relatively thick because the processing light EL is not irradiated, and a coating film SF that has become relatively thin because the processing light EL is irradiated. That is, the thickness of the coating film SF is at least partially adjusted by the irradiation of the processing light EL. As a result, a recess (in other words, a groove portion) C corresponding to the portion where the coating film SF is relatively thin is formed on the surface of the coating film SF. Therefore, the "operation of processing the coating film SF" in this embodiment includes an operation of adjusting the thickness of the coating film SF, an operation of removing a part of the coating film SF, and an operation of forming a recess C in the coating film SF. In addition, the energy of the processing light EL irradiated to the coating film SF is determined so that the irradiation of the processing light EL does not affect the processing object S. In other words, the energy of the processing light EL is determined so that irradiation with the processing light EL affects only the coating film SF.

[0016] The coating film SF evaporates by absorbing the processing light EL. That is, the coating film SF is, for example, photochemically decomposed and removed when the energy of the processing light EL is transmitted to the coating film SF. When the processing light EL is laser light, the phenomenon in which the energy of the processing light EL is transmitted to the coating film SF and the coating film SF is photochemically decomposed and removed is sometimes called laser ablation. For this reason, the coating film SF contains a material capable of absorbing the processing light EL. Specifically, for example, the coating film SF may contain a material whose absorptance for the processing light EL (that is, the absorptance for light of a wavelength different from the wavelength range of visible light) is equal to or higher than a predetermined first absorption threshold. Such a material may be a pigment.

[0017] When the coating film SF contains a pigment, the pigment may be a pigment that exhibits a desired color when irradiated with visible light. As a result, the coating film SF containing such a pigment exhibits the desired color. In this case, the pigment may have a characteristic that the absorptance of a first light component of a wavelength that is reflected by the coating film SF in the wavelength range of visible light and recognized by humans as light of the desired color differs from the absorptance of a second light component of visible light other than the first light component, so that the coating film SF exhibits the desired color. For example, the pigment may have a characteristic that the absorptance of the first light component is smaller than the absorptance of the second light component. For example, the pigment may have a characteristic that the absorptance of the first light component is equal to or smaller than a predetermined second absorption threshold (wherein the second absorption threshold is smaller than the first absorption threshold) and the absorptance of the second light component is equal to or larger than a predetermined third absorption threshold (wherein the third absorption threshold is larger than the second absorption threshold). An example of a dye that can adequately absorb invisible processed light EL while exhibiting a desired color is a near-infrared absorbing dye manufactured by Spectrum Info, located in Kiev, Ukraine (one example is tetrafluoroboronated 4-((E)-2-{(3E)-2-chloro-3-[2-(2,6-diphenyl-4H-thiopyran-4-ylidene)ethylidene]cyclohex-1-en-1-yl}vinyl)-2,6-diphenylthiopyrylium).

[0018] Alternatively, when the coating film SF contains a pigment, the pigment may be a pigment transparent to visible light. As a result, the coating film SF containing such a pigment becomes a transparent film (so-called clear coat). In this case, the pigment may have a property of not absorbing much visible light (i.e., reflecting it accordingly) so that the coating film SF becomes transparent. For example, the pigment may have a property of having an absorptivity of visible light smaller than a predetermined fourth absorption threshold. An example of a pigment that can adequately absorb the invisible processed light EL while being transparent to visible light is, for example, a near-infrared absorbing pigment manufactured by Spectrum Info (for example, tetrafluoroboronated 6-chloro-2-[(E)-2-(3-{(E)-2-[6-chloro-1-ethylbenzo[cd]indol-2(1H)-ylidene]ethylidene}-2-phenyl-1-cyclopenten-1-yl)ethenyl]-1-ethylbenzo[cd]indolium).

[0019] Returning to FIG. 1, in order to process the coating film SF, the processing apparatus 1 is equipped with a light irradiation device 11, a drive system 12, a storage device 13, a support device 14, a drive system 15, an exhaust device 16, a gas supply device 17, and a control device 18.

[0020] The light irradiation device 11 can irradiate the coating film SF with processing light EL under the control of the control device 18. In order to irradiate the processing light EL, the light irradiation device 11 includes a light source system 111 capable of emitting the processing light EL, and an optical system 112 that guides the processing light EL emitted from the light source system 111 to the coating film SF, as shown in Fig. 3(a).

[0021] The light source system 111 simultaneously emits, for example, a plurality of processing lights EL. For this reason, the light source system 111 includes a plurality of light sources 1111 as shown in FIG. 3(b). The plurality of light sources 1111 are arranged in a row at equal intervals. Each light source 1111 emits pulsed light as the processing light EL. When the emission time width (hereinafter referred to as the "pulse width") of the pulsed light is shortened, the processing accuracy (for example, the formation accuracy of the riblet structure described later) is improved. Therefore, each light source 1111 may emit pulsed light having a relatively short pulse width as the processing light EL. For example, each light source 1111 may emit pulsed light having a pulse width of 1000 nanoseconds or less as the processing light EL. Alternatively, as shown in FIG. 3(c), the light source system 111 may include a single light source 1111 and a splitter 1112 that splits the light from the single light source 1111 into a plurality of processing lights EL. The multiple exits from which the multiple processing lights EL branched by the splitter 1112 are respectively output are arranged in a row at equal intervals. An example of the splitter 1112 is at least one of an optical fiber coupler and a waveguide type splitter. As described later, the splitter 1112 may be at least one of a lens array, a diffractive optical element, a spatial light modulator, etc.

[0022] The optical system 112 includes a focus lens 1121, a galvanometer mirror 1122, and an fθ lens 1123. The multiple processing lights EL are irradiated onto the coating film SF via the focus lens 1121, the galvanometer mirror 1122, and the fθ lens 1123.

[0023] The focus lens 1121 is an optical element that is composed of one or more lenses and adjusts the positions of at least some of the lenses along the optical axis direction to adjust the focusing positions of the multiple processing light beams EL (i.e., the focal position of the optical system 112). The galvanometer mirror 1122 deflects the multiple processing light beams EL so that the multiple processing light beams EL scan the surface of the coating film SF (i.e., the multiple irradiation areas EA onto which the multiple processing light beams EL are respectively irradiated move on the surface of the coating film SF). The galvanometer mirror 112 includes an X-scanning mirror 1122X and a Y-scanning mirror 1122Y. The X-scanning mirror 1122X reflects the multiple processing light beams EL toward the Y-scanning mirror 1122Y. The X-scanning mirror 1122X can swing or rotate in the θY direction (i.e., the rotation direction around the Y axis). The swing or rotation of the X-scanning mirror 1122X causes the multiple processing light beams EL to scan the surface of the coating film SF along the X-axis direction. By the oscillation or rotation of the X-scanning mirror 1122X, the multiple irradiation areas EA move along the X-axis direction on the coating film SF. The X-scanning mirror 1122X changes the relative positional relationship along the X-axis direction between the multiple irradiation areas EA and the coating film SF. The Y-scanning mirror 1122Y reflects the multiple processing lights EL toward the fθ lens 1123. The Y-scanning mirror 1122Y can oscillate or rotate in the θX direction (i.e., the rotation direction around the X-axis). By the oscillation or rotation of the Y-scanning mirror 1122Y, the multiple processing lights EL scan the surface of the coating film SF along the Y-axis direction. By the oscillation or rotation of the Y-scanning mirror 1122Y, the multiple irradiation areas EA move along the Y-axis direction on the coating film SF. The Y-scanning mirror 1122Y changes the relative positional relationship along the Y-axis direction between the multiple irradiation areas EA and the coating film SF. The fθ lens 1123 is an optical element for focusing the multiple processing lights EL from the galvanometer mirror 1122 on the coating film SF.

[0024] The fθ lens 1123 is a terminal optical element located closest to the light emission side of the optical system 112 (in other words, closest to the coating film SF or located at the end of the optical paths of the multiple processing lights EL) among the optical elements included in the optical system 112. The fθ lens 1123 is configured to be detachable from the optical system 112. As a result, it is possible to attach a new fθ lens 1123 to the optical system 112 after removing the old fθ lens 1123 from the optical system 112. However, if the optical system 112 includes an optical element (e.g., a cover lens, etc.) provided on the emission side of the fθ lens 1123, the optical element becomes the terminal optical element, and the optical element is configured to be detachable from the optical system 112.

[0025] The directions of travel of the multiple processing lights EL from the optical system 112 are, for example, parallel to each other. As a result, in this embodiment, the coating film SF is simultaneously irradiated with multiple processing lights EL traveling in parallel to each other. In other words, multiple irradiation areas EA are simultaneously set on the coating film SF. Therefore, the throughput of processing the coating film SF is improved compared to when a single processing light EL is irradiated to the coating film SF. Note that the optical system 112 may be configured such that all optical components (for example, the focus lens 1121, the galvanometer mirror 1122, and the fθ lens 1123) are not located on the same plane, as shown in FIG. 3(d), for example.

[0026] 1 again, the driving system 12 moves the light irradiation device 11 relative to the coating film SF (i.e., relative to the workpiece S on whose surface the coating film SF is formed) under the control of the control device 18. That is, the driving system 12 moves the light irradiation device 11 relative to the coating film SF so as to change the relative positional relationship between the light irradiation device 11 and the coating film SF. When the relative positional relationship between the light irradiation device 11 and the coating film SF is changed, the relative positional relationship between the multiple irradiation areas EA, which are respectively irradiated with the multiple processing lights EL, and the coating film SF is also changed. Therefore, it can be said that the driving system 12 moves the light irradiation device 11 relative to the coating film SF so as to change the relative positional relationship between the multiple irradiation areas EA and the coating film SF. The driving system 12 may move the light irradiation device 11 along the surface of the coating film SF. In the example shown in FIG. 1, the surface of the coating film SF is a plane parallel to at least one of the X-axis and the Y-axis, so the driving system 12 may move the light irradiation device 11 along at least one of the X-axis and the Y-axis. As a result, the irradiation area EA moves along at least one of the X-axis and Y-axis on the coating film SF. The driving system 12 may move the light irradiation device 11 along the thickness direction of the coating film SF (i.e., the direction intersecting the surface of the coating film SF). In the example shown in Fig. 1, the thickness direction of the coating film SF is along the Z-axis, so the driving system 12 may move the light irradiation device 11 along the Z-axis. The driving system 12 may move the light irradiation device 11 along at least one of the θX direction, θY direction, and θZ direction (i.e., the rotation direction around the Z-axis) in addition to at least one of the X-axis, Y-axis, and Z-axis.

[0027] The drive system 12 supports the light irradiation device 11 and moves the supported light irradiation device 11. In this case, the drive system 12 includes, for example, a first support member that supports the light irradiation device 11 and a first movement mechanism that moves the first support member.

[0028] The accommodation device 13 includes a ceiling member 131 and a partition member 132. The ceiling member 131 is disposed on the +Z side of the light irradiation device 11. The ceiling member 131 is a plate-like member along the XY plane. The ceiling member 131 supports the drive system 12 via a support member 133. The partition member 132 is disposed on the outer edge (or in the vicinity thereof) of the -Z side surface of the ceiling member 131. The partition member 132 is a tubular (for example, cylindrical or rectangular tubular) member extending from the ceiling member 131 toward the -Z side. The space surrounded by the ceiling member 131 and the partition member 132 becomes an accommodation space SP for accommodating the light irradiation device 11 and the drive system 12. Therefore, the above-mentioned drive system 12 moves the light irradiation device 11 within the accommodation space SP. Furthermore, the accommodation space SP includes a space between the light irradiation device 11 and the coating film SF (particularly, a space including the optical path of the processing light EL). More specifically, the accommodation space SP includes the space between the final optical element (for example, the fθ lens 1123) included in the light irradiation device 11 and the coating film SF (particularly, the space including the optical path of the processing light EL).

[0029] Each of the ceiling member 131 and the partition member 132 is a member capable of blocking the processing light EL. That is, each of the ceiling member 131 and the partition member 132 is opaque to the wavelength of the processing light EL. As a result, the processing light EL propagating in the storage space SP does not leak out to the outside of the storage space SP (that is, the outside of the storage device 13). Note that each of the ceiling member 131 and the partition member 132 may be a member capable of attenuating the processing light EL. That is, each of the ceiling member 131 and the partition member 132 may be semi-transparent to the wavelength of the processing light EL. Furthermore, each of the ceiling member 131 and the partition member 132 is a member that does not transmit (that is, can block) unnecessary substances generated by irradiation of the processing light EL. An example of the unnecessary substances is the vapor of the coating film SF. As a result, the unnecessary substances generated in the storage space SP do not leak out to the outside of the storage space SP (that is, the outside of the storage device 13).

[0030] An end 134 of the partition member 132 (specifically, an end on the coating film SF side, in the example shown in FIG. 1, an end on the -Z side) can come into contact with the surface of the coating film SF. When the end 134 comes into contact with the coating film SF, the accommodation device 13 (i.e., the ceiling member 131 and the partition member 132) cooperates with the coating film SF to maintain the airtightness of the accommodation space SP. When the end 134 comes into contact with the coating film SF, it is possible to change its shape (particularly, the shape of the contact surface of the end 134 that comes into contact with the coating film SF (in the example shown in FIG. 1, the surface on the -Z side), the same below) according to the shape of the surface of the coating film SF. For example, when the end 134 comes into contact with the coating film SF whose surface is flat, the shape of the end 134 becomes flat like the coating film SF. For example, when the end 134 comes into contact with the coating film SF whose surface is curved, the shape of the end 134 becomes curved like the coating film SF. As a result, the sealing performance of the accommodation space SP is improved compared to a case where the end 134 cannot change its shape according to the surface shape of the coating film SF. An example of the shape-changeable end 134 is an end 134 made of an elastic material such as rubber (in other words, a flexible material). Note that, as the shape-changeable end 134, for example, a bellows-shaped end 134a having an elastic structure as shown in FIG. 4 may be used.

[0031] Returning to FIG. 1, the end 134 can be attached to the coating film SF while in contact with the coating film SF. For example, the end 134 may be equipped with an adsorption mechanism that can adsorb to the coating film SF. When the end 134 adheres to the coating film SF, the airtightness of the storage space SP is further improved compared to when the end 134 is not attached to the coating film SF. However, the end 134 does not have to be able to adhere to the coating film SF. Even in this case, as long as the end 134 contacts the coating film SF, the airtightness of the storage space SP is still appropriately maintained.

[0032] The partition member 132 is a member that can expand and contract along the Z axis by a drive system (for example, an actuator) (not shown) that operates under the control of the control device 18. For example, the partition member 132 may be a bellows-shaped member (so-called bellows). In this case, the partition member 132 can expand and contract by the expansion and contraction of the bellows portion. Alternatively, for example, the partition member 132 may include a telescopic pipe in which a plurality of hollow cylindrical members having different diameters are combined. In this case, the partition member 132 can expand and contract by the relative movement of the plurality of cylindrical members. The state of the partition member 132 can be set to at least a first extended state in which the partition member 132 extends along the Z axis and thus has a relatively long length in the Z axis direction, and a first contracted state in which the partition member 132 contracts along the Z axis and thus has a relatively short length in the Z axis direction. When the partition member 132 is in the first extended state, the end portion 134 can come into contact with the coating film SF. On the other hand, when the partition member 132 is in the first contracted state, the end 134 does not contact the coating film SF. In other words, when the partition member 132 is in the first contracted state, the end 134 is away from the coating film SF on the +Z side. Note that the configuration for switching the state of the partition member 132 between the first extended state in which the end 134 of the partition member 132 can contact the coating film SF and the first contracted state in which the end 134 is away from the coating film SF is not limited to a configuration for expanding and contracting the partition member 132. For example, the state of the partition member 132 may be switched between the first extended state and the first contracted state by configuring the storage device 13 itself to be movable along the ±Z directions.

[0033] The accommodation device 13 further includes a detection device 135. The detection device 135 detects unwanted substances (i.e. substances generated by irradiation with the processing light EL) in the accommodation space SP. As will be described in detail later, the detection result of the detection device 135 is referred to by the control device 18 when changing the state of the partition member 132 from the first extended state to the first contracted state.

[0034] The support device 14 supports the storage device 13. Since the storage device 13 supports the drive system 12 and the light irradiation device 11, the support device 14 essentially supports the drive system 12 and the light irradiation device 11 via the storage device 13. In order to support the storage device 13, the support device 14 includes a beam member 141 and a plurality of leg members 142. The beam member 141 is disposed on the +Z side of the storage device 13. The beam member 141 is a beam-shaped member extending along the XY plane. The beam member 141 supports the storage device 13 via a support member 143. A plurality of leg members 142 are disposed on the beam member 141. The leg member 142 is a rod-shaped member extending from the beam member 141 toward the -Z side.

[0035] An end 144 of the leg member 142 (specifically, an end on the coating film SF side, in the example shown in FIG. 1, an end on the -Z side) can come into contact with the surface of the coating film SF. As a result, the support device 14 is supported by the coating film SF (i.e., by the workpiece S). That is, the support device 14 supports the storage device 13 with the end 144 in contact with the coating film SF (in other words, with the support device 14 supported by the coating film S). When the end 144 comes into contact with the coating film SF, like the end 134 of the storage device 13, it is possible to change its shape (particularly, the shape of the contact surface of the end 144 that comes into contact with the coating film SF (in the example shown in FIG. 1, the surface on the -Z side), the same below) according to the shape of the surface of the coating film SF. The end 144 can adhere to the coating film SF in a state of contact with the coating film SF. For example, the end 144 may be provided with an adsorption mechanism capable of adsorbing to the coating film SF. When the end 144 is attached to the coating film SF, the stability of the support device 14 is improved compared to a case in which the end 144 is not attached to the coating film SF. However, the end 144 does not have to be able to be attached to the coating film SF.

[0036] The beam member 141 is a member that can be extended and retracted along at least one of the X-axis and Y-axis (or along any direction along the XY plane) by the drive system 15 that operates under the control of the control device 18. For example, the beam member 141 may include a telescopic pipe in which multiple tubular members having different diameters are combined. In this case, the beam member 141 can be extended and retracted by the relative movement of the multiple tubular members.

[0037] The leg member 142 is a member that can be extended and retracted along the Z axis by the drive system 15 that operates under the control of the control device 18. For example, the leg member 142 may include a telescopic pipe in which a plurality of tubular members having different diameters are combined. In this case, the leg member 142 can be extended and retracted by the relative movement of the plurality of tubular members. The state of the leg member 142 can be set to at least a second extended state in which the leg member 142 extends along the Z axis and thus has a relatively long length in the Z axis direction, and a second contracted state in which the leg member 142 contracts along the Z axis and thus has a relatively short length in the Z axis direction. When the leg member 142 is in the second extended state, the end portion 144 can come into contact with the coating film SF. On the other hand, when the leg member 142 is in the second contracted state, the end portion 144 does not come into contact with the coating film SF. In other words, when the leg member 142 is in the second contracted state, the end portion 144 is separated from the coating film SF on the +Z side.

[0038] The drive system 15 moves the support device 14 relative to the coating film SF (i.e., relative to the workpiece S on whose surface the coating film SF is formed) under the control of the control device 18. That is, the drive system 15 moves the support device 14 relative to the coating film SF so as to change the relative positional relationship between the support device 14 and the coating film SF. Since the support device 14 supports the storage device 13, the drive system 15 essentially moves the support device 14 to move the storage device 13 relative to the coating film SF. That is, the drive system 15 essentially moves the support device 14 relative to the coating film SF so as to change the relative positional relationship between the storage device 13 and the coating film SF. Furthermore, the storage device 13 supports the light irradiation device 11 via the drive system 12. Therefore, the drive system 15 essentially moves the support device 14 to move the light irradiation device 11 relative to the coating film SF. That is, the drive system 15 can move the support device 14 with respect to the coating film SF so as to change the relative positional relationship between the light irradiation device 11 and the coating film SF. In other words, the drive system 15 can move the support device 14 with respect to the coating film SF so as to change the relative positional relationship between the multiple irradiation areas EA and the coating film SF.

[0039] The drive system 15 expands and contracts the beam members 141 under the control of the control device 18 in order to move the support device 14. Furthermore, the drive system 15 expands and contracts the multiple leg members 142 under the control of the control device 18 in order to move the support device 14. The manner in which the support device 14 is moved by the drive system 15 will be described in detail later with reference to Figures 7 to 17.

[0040] The exhaust device 16 is connected to the accommodation space SP via an exhaust pipe 161. The exhaust device 16 can exhaust the gas in the accommodation space SP. In particular, the exhaust device 16 can suck the unnecessary substances generated by the irradiation of the processing light EL from the accommodation space SP to the outside of the accommodation space SP by exhausting the gas in the accommodation space SP. In particular, if the unnecessary substances are present on the optical path of the processing light EL, they may affect the irradiation of the processing light EL to the coating film SF. For this reason, the exhaust device 16 particularly sucks the unnecessary substances together with the gas in the space from the space including the optical path of the processing light EL between the terminal optical element of the optical system 112 and the coating film SF. The unnecessary substances sucked by the exhaust device 16 from the accommodation space SP are discharged to the outside of the processing device 1 through the filter 162. The filter 162 adsorbs the unnecessary substances. In addition, the filter 162 may be detachable or replaceable.

[0041] The gas supply device 17 is connected to the accommodation space SP via an intake pipe 171. The gas supply device 17 can supply gas to the accommodation space SP. The gas to be supplied to the accommodation space SP can be at least one of the atmosphere, CDA (clean dry air), and an inert gas. An example of an inert gas is nitrogen gas. In this example, the gas supply device 17 supplies CDA. Therefore, the accommodation space SP becomes a space purged by CDA. At least a part of the CDA supplied to the accommodation space SP is sucked in by the exhaust device 16. The CDA sucked in by the exhaust device 16 from the accommodation space SP passes through a filter 162 and is discharged to the outside of the processing device 1.

[0042] The gas supply device 17 particularly supplies a gas such as CDA to the optical surface 1124 on the side of the accommodation space SP of the fθ lens 1123 shown in FIG. 3 (i.e., the optical surface on the side of the accommodation space SP of the terminal optical element of the optical system 112). Since the optical surface 1124 faces the accommodation space SP, it may be exposed to unnecessary substances generated by irradiation with the processing light EL. As a result, the unnecessary substances may adhere to the optical surface 1124. Furthermore, since the processing light EL passes through the optical surface 1124, the unnecessary substances adhered to the optical surface 1124 may be burned (i.e., fixed) by the processing light EL passing through the optical surface 1124. The unnecessary substances attached (and further fixed) to the optical surface 1124 may become stains on the optical surface 1124 and may affect the characteristics of the processing light EL. However, when a gas such as CDA is supplied to the optical surface 1124, contact between the optical surface 1124 and the unnecessary substances is prevented. This prevents dirt from adhering to the optical surface 1124. Therefore, the gas supply device 17 also functions as an adhesion prevention device that prevents dirt from adhering to the optical surface 1124. Furthermore, even if dirt has adhered (or even become stuck) to the optical surface 1124, the dirt may be removed (e.g., blown away) by the CDA supplied to the optical surface 1124. Therefore, the gas supply device 17 may also function as an adhesion prevention device that removes dirt adhering to the optical surface 1124.

[0043] The control device 18 controls the overall operation of the processing device 1. In particular, the control device 18 controls the light irradiation device 11, the drive system 12, the containing device 13, and the drive system 15 so that a recess C having a desired shape is formed at a desired position, as will be described later in detail.

[0044] (2) Specific examples of processing operations by the processing device 1 (2-1) Examples of structures formed by machining operations As described above with reference to FIG. 2, in this embodiment, the processing device 1 forms a recess C in the coating film SF. The recess C is formed in a portion of the coating film SF that is actually irradiated with the processing light EL (i.e., a portion where an irradiation area EA where the processing light EL is actually irradiated is set). Therefore, by appropriately setting a position on the coating film SF where the processing light EL is actually irradiated (i.e., a position where an irradiation area EA where the processing light EL is actually irradiated is set), the recess C can be formed at a desired position on the coating film SF. In other words, a structure made of the coating film SF can be formed on the workpiece S.

[0045] In this embodiment, the processing device 1 forms a riblet structure, which is an example of a structure formed by such a coating film SF, on the workpiece S under the control of the control device 18. The riblet structure is a structure that can reduce the resistance of the surface of the coating film SF to a fluid (particularly, frictional resistance and turbulent frictional resistance). The resistance of the workpiece S on which the riblet structure is formed to a fluid is smaller than the resistance of the workpiece S on which the riblet structure is not formed to a fluid. For this reason, it can also be said that the riblet structure is a structure that can reduce the resistance of the surface of the workpiece S to a fluid. Note that the fluid referred to here may be any medium (gas, liquid) that flows over the surface of the coating film SF. For example, when the medium itself is stationary but the surface of the coating film SF moves, this medium may be referred to as a fluid.

[0046] An example of the riblet structure is shown in FIG. 5(a) and FIG. 5(b). As shown in FIG. 5(a) and FIG. 5(b), the riblet structure is a structure in which a plurality of concave structures CP1 (i.e., concave structures CP1 formed linearly so as to extend along the first direction) formed by continuously forming recesses C along a first direction (in the example shown in FIG. 5(a) and FIG. 5(b), the Y-axis direction) are arranged along a second direction intersecting the first direction (in the example shown in FIG. 5(a) and FIG. 5(b), the X-axis direction). Between two adjacent concave structures CP1, a convex structure CP2 protruding from the periphery is substantially present. Therefore, the riblet structure can also be said to be a structure in which a plurality of convex structures CP2 extending linearly along the first direction (for example, the Y-axis direction) are arranged along a second direction intersecting the first direction (for example, the X-axis direction). The riblet structure shown in FIG. 5(a) and FIG. 5(b) is a periodic structure.

[0047] The interval between two adjacent concave structures CP1 (i.e., the arrangement pitch P1 of the concave structures CP1) is, for example, several microns to several hundreds of microns, but may be other sizes. Furthermore, the depth (i.e., the depth in the Z-axis direction) D of each concave structure CP1 is, for example, several microns to several hundreds of microns, but may be other sizes. The depth D of each concave structure CP1 may be equal to or less than the arrangement pitch P1 of the concave structures CP1. The depth D of each concave structure CP1 may be equal to or less than half the arrangement pitch P1 of the concave structures CP1. The shape of a cross section including the Z axis of each concave structure CP1 (specifically, a cross section along the XZ plane) is a bowl-shaped curved shape, but may be a triangle, a rectangle, or a polygon having pentagons or more. Similarly, the interval between two adjacent convex structures CP2 (i.e., the arrangement pitch P2 of the convex structures CP2) is, for example, several microns to several hundreds of microns, but may be other sizes. Furthermore, the height H of each convex structure CP2 (i.e., the height in the Z-axis direction) is, for example, several microns to several hundred microns, but may be other sizes. The height H of each convex structure CP2 may be equal to or less than the arrangement pitch P2 of the convex structures CP2. The height H of each convex structure CP2 may be equal to or less than half the arrangement pitch P2 of the convex structures CP2. The shape of a cross section including the Z axis of each convex structure CP2 (specifically, a cross section along the XZ plane) is a mountain shape with a curved slope, but may be a triangle, a rectangle, or a polygon with pentagons or more. The riblet structure itself formed by the processing device 1 may be an existing riblet structure as described in, for example, Chapter 5 of "Mechanical Engineering Handbook Basics α4 Fluid Engineering" edited by the Japan Society of Mechanical Engineers, and therefore a detailed description of the riblet structure itself will be omitted.

[0048] As described above, such a riblet structure can reduce the resistance to a fluid on the surface of the workpiece S on which the riblet structure is formed. For this reason, the workpiece S may be an object (e.g., a structure) for which it is desired to reduce the resistance to a fluid. For example, the workpiece S may include an object (i.e., a moving object) that is movable so that at least a part of it moves through a fluid (e.g., at least one of a gas and a liquid). Specifically, for example, the workpiece S may include the body of an aircraft PL (e.g., at least one of a fuselage PL1, a main wing PL2, a vertical tail PL3, and a horizontal tail PL4) as shown in Figs. 6(a) to 6(c). In this case, the processing device 1 may be self-supported on the body of the aircraft PL by a support device 14 as shown in Figs. 6(a) and 6(c). Alternatively, since the end 144 of the leg member 142 of the support device 14 can be attached to the paint film SF, the processing device 1 may be attached to the body of the aircraft PL so as to be suspended (i.e., hanging) from the body of the aircraft PL by the support device 14, as shown in FIG. 6(b). Furthermore, since the end 144 of the leg member 142 of the support device 14 can be attached to the paint film SF and the end 134 of the bulkhead member 132 of the storage device 13 can be attached to the paint film SF, the processing device 1 can stand on its own on the paint film SF even if the surface of the paint film SF is facing upward and inclined with respect to the horizontal plane. Furthermore, the processing device 1 can be attached to the paint film SF so as to be suspended from the paint film SF even if the surface of the paint film SF is facing downward and inclined with respect to the horizontal plane. In either case, the light irradiation device 11 can be moved along the surface of the aircraft by the drive system 12 and / or by the movement of the support device 14. Therefore, the processing apparatus 1 is capable of forming a riblet structure using a coating film SF even on a workpiece S such as an aircraft fuselage (i.e., a workpiece S having a curved surface, a surface that is inclined relative to the horizontal plane, or a surface that faces downward).

[0049] Alternatively, for example, the workpiece S may include the body of an automobile. For example, the workpiece S may include the hull of a ship. For example, the workpiece S may include the body of a rocket. For example, the workpiece S may include a turbine (for example, at least one of a water turbine and a wind turbine, etc., and in particular a turbine blade thereof). Alternatively, for example, the workpiece S may include a part constituting an object that is movable such that at least a portion of the object moves through a fluid. Alternatively, for example, the workpiece S may include an object at least a portion of which is fixed within a flowing fluid. Specifically, for example, the workpiece S may include a bridge girder installed in a river or the sea.

[0050] Incidentally, one example of the workpiece S given here is a relatively large object (e.g., an object having a size on the order of several meters to several hundred meters). In this case, as shown in Figs. 6(a) to 6(c), the size of the light irradiation device 11 is smaller than the size of the workpiece S. However, the workpiece S may be an object of any size. For example, the workpiece S may be an object having a size on the order of kilometers, centimeters, millimeters, or micrometers.

[0051] The size of the above-mentioned riblet structure (for example, at least one of the arrangement pitch P1 of the concave structures CP1, the depth D of each concave structure CP1, the arrangement pitch P2 of the convex structures CP2, the height H of each convex structure CP2, etc.) may be set to an appropriate size such that the friction reduction effect is appropriately obtained depending on the type of object S to be processed. More specifically, the size of the riblet structure may be set to an appropriate size such that the friction reduction effect is appropriately obtained depending on at least one of the type of fluid distributed around the object S to be processed during use (i.e., during operation), the relative speed of the object S to be processed with respect to the fluid, and the shape of the object S to be processed. For example, when the object S to be processed is the body of an aircraft flying at an altitude of 10 km at a speed of 1000 km per hour during cruising, the arrangement pitch P1 of the concave structures CP1 (i.e., the arrangement pitch P2 of the convex structures CP2) may be set to, for example, about 78 micrometers.

[0052] Furthermore, the size of the riblet structure described above may be set to an appropriate size that appropriately obtains the effect of reducing friction, depending on what type of object the workpiece S is and on what portion of the object the riblet structure is formed in. For example, when the workpiece S is the body of an aircraft PL, the size of the riblet structure formed on the fuselage PL1 may be different from the size of the riblet structure formed on the main wing PL2.

[0053] (2-2) Processing flow Next, the flow of processing operations for forming a riblet structure will be described with reference to FIGS.

[0054] First, as described above, the multiple processing lights EL are deflected by the galvanometer mirror 1122. In order to form the riblet structure, the galvanometer mirror 1122 deflects the multiple processing lights EL so that a scanning operation in which the multiple processing lights EL scan the surface of the coating film SF along the Y axis (i.e., moving the multiple irradiation areas EA on the surface of the coating film SF along the Y axis) and a step operation in which the multiple irradiation areas EA on the surface of the coating film SF are moved by a predetermined amount along the X axis are alternately repeated. At this time, there is a limit to the size of the area on the surface of the coating film SF that can be scanned with the multiple processing lights EL by controlling the galvanometer mirror 1122 while keeping the light irradiation device 11 stationary relative to the coating film SF. Therefore, in this embodiment, as shown in FIG. 7, the control device 18 sets multiple unit processing areas SA on the surface of the coating film SF (particularly, the area of ​​the coating film SF where the riblet structure is to be formed). Each unit processing area SA corresponds to an area on the coating film SF that can be scanned with the multiple processing lights EL by controlling the galvanometer mirror 1122 while keeping the light irradiation device 11 stationary relative to the coating film SF. Each unit processing area SA has a rectangular shape, but the shape is arbitrary.

[0055] The control device 18 controls the light irradiation device 11 to irradiate one unit processing area SA (e.g., SA1) with a plurality of processing lights EL deflected by the galvanometer mirror 1122, thereby forming a riblet structure in the one unit processing area SA (SA1). After that, the control device 18 controls at least one of the drive systems 12 and 15 to move the light irradiation device 11 relative to the coating film SF, thereby disposing the light irradiation device 11 at a position where the light irradiation device 11 can irradiate another unit processing area SA (e.g., SA2) with a plurality of processing lights EL. After that, the control device 18 controls the light irradiation device 11 to irradiate the other unit processing area SA (SA2) with a plurality of processing lights EL deflected by the galvanometer mirror 1122, thereby forming a riblet structure in the other unit processing area SA. The control device 18 repeats the following operations for all unit processing areas SA1 to SA16 to form a riblet structure.

[0056] The following description will be given using an example of the operation of forming a riblet structure in the unit processing areas SA1 to SA4 shown in Fig. 7. Note that the following description will be given using an example in which two unit processing areas SA adjacent to each other along the X-axis are located in the accommodation space SP. However, the same operation is performed even when any number of unit processing areas SA are located in the accommodation space SP.

[0057] As shown in FIG. 8, first, the control device 18 controls the drive system 15 to move the support device 14 relative to the coating film SF so that the storage device 13 is disposed at the first storage position where the unit processing areas SA1 and SA2 are located in the storage space SP. That is, the control device 18 moves the storage device 13 supported by the support device 14 so that the storage device 13 covers the unit processing areas SA1 and SA2. Furthermore, the control device 18 controls the drive system 12 to move the light irradiation device 11 relative to the coating film SF so that the light irradiation device 11 is disposed at the first irradiation position where the unit processing area SA1 can be irradiated with multiple processing lights EL. After the storage device 13 is disposed at the first storage position and the light irradiation device 11 is disposed at the first irradiation position, the partition member 132 is in the first extension state. Therefore, the end 134 of the partition member 132 contacts and adheres to the coating film SF. Similarly, the multiple leg members 142 are in the second extension state. Therefore, the ends 144 of the multiple leg members 142 contact and adhere to the paint film SF.

[0058] Thereafter, as shown in FIG. 9(a) and FIG. 9(b), the control device 18 controls the light irradiation device 11 (particularly, the galvanometer mirror 1122) so that the multiple processing lights EL scan the unit processing area SA1. Specifically, the control device 18 controls the Y-scanning mirror 1122Y of the galvanometer mirror 1122 so that the multiple processing lights EL scan a certain area in the unit processing area SA1 along the Y-axis direction in order to perform the above-mentioned scanning operation. During the scanning operation, the light source system 111 irradiates the multiple processing lights EL. Thereafter, the control device 18 rotates the X-scanning mirror 1122X of the galvanometer mirror 1122 by a unit step amount in order to perform the above-mentioned stepping operation. During the stepping operation, the light source system 111 does not irradiate the multiple processing lights EL. Thereafter, the control device 18 controls the Y-scanning mirror 1122Y of the galvanometer mirror 1122 so that the multiple processing lights EL scan a certain area in the unit processing area SA1 along the Y-axis direction in order to perform the above-mentioned scanning operation. In this way, the control device 18 controls the galvanometer mirror 1122 so that the multiple processing lights EL scan the entire unit processing area SA1 (or a portion of the unit processing area SA1 where the riblet structure is to be formed) by alternating between scanning and stepping operations. As a result, a riblet structure is formed in the unit processing area SA1. Note that, as shown in Figures 9(a) and 9(b), the width of the area scanned by the processing light EL (i.e., the width of the unit processing area SA, particularly the width in the X-axis direction) is larger than the width of the light irradiation device 11 (particularly the width in the X-axis direction).

[0059] The control device 18 controls the drive system 15 so that the multiple leg members 142 are maintained in the second extended state while the light irradiation device 11 is irradiating the processing light EL. As a result, the ends 144 of the multiple leg members 142 continue to adhere to the coating film SF. As a result, the stability of the support device 14 is improved, and the possibility that the irradiation area EA of the processing light EL will be unintentionally shifted on the coating film SF due to instability of the support device 14 is reduced. However, as long as the support device 14 is capable of standing on the coating film SF (or is capable of being attached to the coating film SF so as to be suspended from the coating film SF) during at least a portion of the period during which the light irradiation device 11 is irradiating the processing light EL, some of the multiple leg members 142 may be in the second contracted state.

[0060] The control device 18 controls a drive system (not shown) that expands and contracts the partition member 132 so that the partition member 132 is maintained in the first extended state while the light irradiation device 11 is irradiating the processing light EL. As a result, the end 134 of the partition member 132 continues to adhere to the coating film SF. As a result, the hermeticity of the storage space SP is maintained, so that the processing light EL propagating within the storage space SP does not leak out to the outside of the storage space SP (i.e., the outside of the storage device 13). Furthermore, unnecessary substances generated within the storage space SP do not leak out to the outside of the storage space SP (i.e., the outside of the storage device 13).

[0061] Incidentally, there is a possibility that at least a part of the end 134 that should be attached to the coating film SF may become detached from the coating film SF due to some factor. In this case, if the light irradiation device 11 continues to irradiate the processing light EL, at least one of the processing light EL and the unnecessary material may leak out to the outside of the storage device 13. Therefore, the control device 18 may control the light irradiation device 11 to stop irradiating the processing light EL when it detects that at least a part of the end 134 has become detached from the coating film SF during the period when the light irradiation device 11 is irradiating the processing light EL.

[0062] 10, the control device 18 controls the drive system 12 so that the light irradiation device 11 moves from the first irradiation position to a second irradiation position where the light irradiation device 11 can irradiate the unit processing area SA2 with a plurality of processing lights EL. During the period when the light irradiation device 11 is moving, the control device 18 controls the light irradiation device 11 so that the light irradiation device 11 does not irradiate the processing light EL.

[0063] Thereafter, as shown in Fig. 11(a) and Fig. 11(b), the control device 18 controls the light irradiation device 11 (particularly, the galvanometer mirror 1122) so that the multiple processing lights EL scan the unit processing area SA2. Specifically, the control device 18 controls the light irradiation device 11 (particularly, the galvanometer mirror 1122) so that the multiple processing lights EL scan the entire unit processing area SA2 (or a part of the unit processing area SA2 where the riblet structure is to be formed) by alternately repeating the above-mentioned scanning operation and the above-mentioned step operation. As a result, the riblet structure is formed in the unit processing area SA2. Note that each of the recesses CP1 constituting the riblet structure in the unit processing area SA1 may or may not be continuously connected to each of the recesses CP1 constituting the riblet structure in the unit processing area SA2 (or other unit processing area SA) adjacent to the unit processing area SA1. This is because the size of the unit processing area SA can be ensured to be at least approximately 10 cm, and therefore the continuous length of a single recess CP1 formed as a result of scanning the processing light EL within the unit processing area SA will be at least approximately 10 cm, which is sufficiently longer than the continuous length (approximately a few mm) at which the riblet structure can function, calculated from the airspeed and frequency of turbulence phenomena when the aircraft is in use (i.e., during cruising).

[0064] When the riblet structure is formed in the unit processing area SA2, there are no unit processing areas SA in which a riblet structure has not yet been formed remaining in the storage space SP. Therefore, the light irradiation device 11 cannot form a riblet structure by irradiating a plurality of processing lights EL to the unit processing areas SA in which a riblet structure has not yet been formed simply by moving the light irradiation device 11 in the storage space SP using the drive system 12. Therefore, when there are no unit processing areas SA in which a riblet structure has not yet been formed remaining in the storage space SP, the control device 18 controls the drive system 15 by moving the support device 14 (i.e., by moving the storage device 13) so that the unit processing areas SA in which a riblet structure has not yet been formed are newly positioned in the storage space SP.

[0065] 12, the control device 18 first controls a drive system (not shown) that expands and contracts the partition member 132 so that the state of the partition member 132 switches from a first extended state to a first contracted state. As a result, the end 134 of the partition member 132 separates from the coating film SF. Note that while the support device 14 is moving, the control device 18 controls the light irradiation device 11 so that the light irradiation device 11 does not irradiate the processing light EL. Therefore, even if the end 134 separates from the coating film SF, there is no possibility that at least one of the processing light EL and the unnecessary material will leak out to the outside of the storage device 13.

[0066] However, although the unnecessary substances present in the storage space SP are sucked out of the storage space SP by the exhaust device 16 described above, there is a possibility that, due to some factor, not all of the unnecessary substances present in the storage space SP are sucked out by the exhaust device 16 (i.e., the unnecessary substances remain in the storage space SP). In this case, when the end portion 134 is separated from the coating film SF, the unnecessary substances may leak out to the outside of the storage device 13. For this reason, the control device 18 determines whether or not to switch the partition member 132 from the first extended state to the first contracted state based on the detection result of the detection device 135 that detects the unnecessary substances in the storage space SP. If the unnecessary substances remain in the storage space SP, the control device 18 does not switch the partition member 132 from the first extended state to the first contracted state. In this case, the unnecessary substances remaining in the storage space SP are continuously sucked in by the exhaust device 16. On the other hand, if no unnecessary substances remain in the storage space SP, the control device 18 switches the partition member 132 from the first extended state to the first contracted state.

[0067] Furthermore, the control device 18 controls the drive system 15 so that at least some of the leg members 142 that move relative to the coating film SF in association with the movement of the support device 14 (particularly, as described later, the extension of the beam member 141 that had been contracted) among the multiple leg members 142 are switched from the second extended state to the second contracted state. The leg member 142 that moves relative to the coating film SF in association with the extension of the beam member 141 that had been contracted is typically the leg member 142 that is located on the front side of the movement direction of the support device 14 (i.e., the movement direction of the storage device 13) among the multiple leg members 142. In the example shown in FIG. 12, the support device 14 moves toward the +X side, and the leg member 142 located on the front side of the movement direction of the support device 14 is the leg member 142 located on the +X side. Hereinafter, the leg member 142 located on the front side of the movement direction of the support device 14 is referred to as the "front leg member 142". As a result, the end 144 of the front leg member 142 moves away from the coating film SF.

[0068] 13, the control device 18 controls the drive system 15 so that the accommodation device 13 moves from the first accommodation position to the second accommodation position where the unit processing areas SA3 and SA4 are located in the accommodation space SP. Specifically, the control device 18 controls the drive system 15 so that the beam member 141 extends along the movement direction of the support device 14. As a result, the beam member 141 extends while supporting the accommodation device 13 (and further while supporting the light irradiation device 11 supported by the accommodation device 13). Furthermore, in parallel with the movement of the support device 14, the control device 18 controls the drive system 12 so that the light irradiation device 11 moves from the second irradiation position to the third irradiation position where the light irradiation device 11 can irradiate the unit processing area SA3 with a plurality of processing lights EL.

[0069] During the period when the supporting device 14 is moving (i.e., the beam member 141, which had been contracted, is expanding), the control device 18 controls a drive system (not shown) that expands and contracts the partition member 132 so that the partition member 132 is maintained in the first contracted state. As a result, the movement of the supporting device 14 (i.e., the movement of the storage device 13) is not hindered by contact between the end 134 of the partition member 132 and the coating film SF. Furthermore, the coating film SF is not damaged by contact between the end 134 and the coating film SF during the movement of the supporting device 14. However, if the movement of the supporting device 14 is not hindered by contact between the end 134 and the coating film SF, at least a part of the end 134 may be in contact with the coating film SF during at least a part of the period when the supporting device 14 is moving. If the coating film SF is not damaged by contact between the end portion 134 and the coating film SF during movement of the support device 14, at least a portion of the end portion 134 may be in contact with the coating film SF during at least a portion of the period during which the support device 14 is moving.

[0070] Furthermore, during the period when the support device 14 is moving, the control device 18 controls the drive system 15 so that the front leg member 142 is maintained in the second contracted state. As a result, the movement of the support device 14 (i.e., the movement of the storage device 13) is not hindered by contact between the end 144 of the front leg member 142 and the coating film SF. Furthermore, the coating film SF is not damaged by contact between the end 144 and the coating film SF during the movement of the support device 14. However, if the movement of the support device 14 is not hindered by contact between the end 144 and the coating film SF, at least a part of the end 144 may be in contact with the coating film SF during at least a part of the period when the support device 14 is moving. If the coating film SF is not damaged by contact between the end 144 and the coating film SF during the movement of the support device 14, at least a part of the end 144 may be in contact with the coating film SF during at least a part of the period when the support device 14 is moving.

[0071] Furthermore, during the period when the support device 14 is moving, the control device 18 controls the drive system 15 so that the leg members 142 other than the front leg member 142 among the multiple leg members 142 are maintained in the second extended state. As a result, the movement of the support device 14 (i.e., the movement of the storage device 13) is not hindered by the contact between the end 144 of the front leg member 142 and the coating film SF. Furthermore, the coating film SF is not damaged by the contact between the end 144 and the coating film SF during the movement of the support device 14. Even if the end 144 of the front leg member 142 is separated from the coating film SF, the end 144 of the other leg members 142 other than the front leg member 142 is in contact with the coating film SF. Therefore, the support device 14 can still stand on the coating film SF (or can be attached to the coating film SF so as to hang from the coating film SF) in the same way as when all the end parts 144 of the multiple leg members 142 are in contact with the coating film SF.

[0072] Furthermore, during the period in which the supporting device 14 is moving, the control device 18 controls the light irradiation device 11 so that the light irradiation device 11 does not irradiate the processing light EL.

[0073] After the storage device 13 is placed in the second storage position, as shown in FIG. 14, the control device 18 controls a drive system (not shown) that expands and contracts the partition member 132 so that the partition member 132 switches from the first contracted state to the first extended state. As a result, the end 134 of the partition member 132 contacts and adheres to the paint film SF. Furthermore, the control device 18 controls the drive system 15 so that the front leg member 142 switches from the second contracted state to the second extended state. As a result, the end 144 of the front leg member 142 contacts and adheres to the paint film SF. Here, the extension operation of the partition member 132 and the extension operation of the front leg member 142 may be performed simultaneously or with a time lag.

[0074] Thereafter, as shown in FIG. 15, the control device 18 controls the drive system 15 so that the state of at least some of the leg members 142 that move relative to the coating film SF as the support device 14 moves (particularly, as described later, the extended beam member 141 contracts) among the multiple leg members 142 is switched from the second extended state to the second contracted state. The leg member 142 that moves relative to the coating film SF as the extended beam member 141 contracts is typically the leg member 142 located on the rear side of the movement direction of the support device 14 among the multiple leg members 142. In the example shown in FIG. 15, the leg member 142 located on the rear side of the movement direction of the support device 14 is the leg member 142 located on the -X side. Hereinafter, the leg member 142 located on the rear side of the movement direction of the support device 14 is referred to as the "rear leg member 142". As a result, the end portion 144 of the rear leg member 142 moves away from the coating film SF.

[0075] Thereafter, as shown in FIG. 16, the control device 18 controls the drive system 15 so that the beam members 141, which have been extended along the movement direction of the support device 14, contract.

[0076] After the beam member 141 has been contracted, the control device 18 controls the drive system 15 so that the rear leg member 142 switches from the second contracted state to the second extended state, as shown in Fig. 17. As a result, the end 144 of the rear leg member 142 comes into contact with and adheres to the paint film SF.

[0077] Thereafter, the control device 18 controls the light irradiation device 11 so that the multiple processing lights EL scan the unit processing areas SA3 and SA4 in the same manner as when the multiple processing lights EL scan the unit processing areas SA1 and SA2. Thereafter, the same operation is repeated, and the multiple processing lights EL are irradiated onto the surface of the coating film SF (particularly, the area of ​​the coating film SF where the riblet structure is to be formed). As a result, the riblet structure is formed by the coating film SF on the processing object S.

[0078] (3) Technical effect of processing device 1 As described above, the processing apparatus 1 of this embodiment can form a riblet structure by the coating film SF on the surface of the workpiece S by irradiating the processing light EL onto the workpiece S (particularly, the coating film SF formed on the surface of the workpiece S). Therefore, the processing apparatus 1 can form a riblet structure relatively easily and in a relatively short time, compared to a processing apparatus that forms a riblet structure by scraping off the surface of the workpiece S with a cutting tool such as an end mill.

[0079] Furthermore, the processing apparatus 1 can simultaneously irradiate a plurality of processing light beams EL to form a plurality of concave structures CP1 at the same time. Therefore, the throughput for forming the riblet structure is improved compared to a processing apparatus that can irradiate a single processing light beam EL to form only a single concave structure CP1 at a time.

[0080] Furthermore, the processing apparatus 1 can scan the coating film SF at a relatively high speed by deflecting a plurality of processing light beams EL with the galvanometer mirror 1122. This improves the throughput in forming the riblet structure.

[0081] Furthermore, instead of directly processing the workpiece S, the processing apparatus 1 processes the coating film SF formed on the surface of the workpiece S, thereby forming a riblet structure on the surface of the workpiece S. Therefore, it is possible to avoid an increase in the weight of the workpiece S due to the formation of the riblet structure, compared to a processing apparatus that forms a riblet structure by newly adding (e.g., attaching) a special material for forming the riblet structure to the surface of the workpiece S (i.e., the surface of the coating film SF).

[0082] Furthermore, because the processing apparatus 1 does not directly process the workpiece S, it can relatively easily re-form the riblet structure. Specifically, when re-forming the riblet structure, first the riblet structure formed by the coating film SF is peeled off, and then a new coating film SF is applied. The processing apparatus 1 can then process the newly applied coating film SF to form a new riblet structure. Therefore, deterioration of the riblet structure (e.g., damage, etc.) can be dealt with relatively easily by re-forming the riblet structure.

[0083] Furthermore, because the processing apparatus 1 does not directly process the workpiece S, it can form a riblet structure even on the surface of the workpiece S that is difficult to process directly or on which a riblet structure is not originally formed. In other words, if the coating film SF is applied to the surface of the workpiece S and then the processing apparatus 1 processes the coating film SF, it is possible to form a riblet structure relatively easily.

[0084] Furthermore, the processing device 1 can form a riblet structure by the coating film SF. The coating film SF usually has a relatively high durability against the external environment (for example, at least one of heat, light, and wind). Therefore, the processing device 1 can relatively easily form a riblet structure having a relatively high durability.

[0085] Furthermore, in this embodiment, the optical path of the processing light EL between the final optical element of the optical system 112 and the coating film SF is included in the accommodation space SP. Therefore, compared to a processing device in which the optical path of the processing light EL is not included in the accommodation space SP (i.e., it is open to an open space), it is possible to appropriately prevent the processing light EL irradiated to the coating film SF (or the scattered light or reflected light of the processing light EL from the coating film SF, etc.) from propagating to the surroundings of the processing device 1 (in other words, scattering). Furthermore, it is possible to appropriately prevent unnecessary substances generated by the irradiation of the processing light EL from propagating to the surroundings of the processing device 1 (in other words, scattering).

[0086] Furthermore, in this embodiment, the light irradiation device 11 is supported by a support device 14 that is movable over the coating film SF. Therefore, the processing device 1 can relatively easily process a coating film SF that spreads over a relatively wide area. In other words, the processing device 1 can form a riblet structure by the coating film SF over a relatively wide area of ​​the surface of the workpiece S. Furthermore, since the processing device 1 does not need to move the workpiece S, it can relatively easily form a riblet structure even on the surface of a relatively large or heavy workpiece S.

[0087] Furthermore, the processing apparatus 1 can use the exhaust device 16 to suck unnecessary substances generated by the irradiation of the processing light EL to the outside of the accommodation space SP. Therefore, the irradiation of the processing light EL to the coating film SF is hardly hindered by unnecessary substances. Therefore, the irradiation accuracy of the processing light EL is improved compared to a processing apparatus that does not have the exhaust device 16 (i.e., the irradiation of the processing light EL to the coating film SF may be hindered by unnecessary substances). As a result, the formation accuracy of the riblet structure is improved.

[0088] Furthermore, the processing apparatus 1 can use the gas supply device 17 to prevent dirt from adhering to the optical surface 1124 (i.e., the optical surface on the side of the storage space SP of the terminal optical element of the optical system 112). Therefore, compared to a processing apparatus not equipped with the gas supply device 17, there is a smaller possibility that the irradiation of the processing light EL to the coating film SF will be hindered by dirt that has adhered to the optical surface 1124. This improves the irradiation accuracy of the processing light EL. As a result, the formation accuracy of the riblet structure is improved.

[0089] (4) Variations Next, a modified example of the processing device 1 will be described.

[0090] (4-1) First Modification The structure of the light irradiation device 11 shown in Fig. 3 described above is one example, and the processing device 1 may be provided with another light irradiation device having a structure different from that of the light irradiation device 11 shown in Fig. 3. Hereinafter, as examples of the other light irradiation devices having a structure different from that of the light irradiation device 11, the light irradiation device 21a, the light irradiation device 22a, the light irradiation device 23a, the light irradiation device 24a, the light irradiation device 25a, the light irradiation device 26a, and the light irradiation device 27a will be described.

[0091] (4-1-1) Structure of the light irradiation device 21a In order to irradiate the coating film SF with processing light EL, the light irradiation device 21a is equipped with a light source system 211a capable of emitting processing light EL, and an optical system 212a that guides the processing light EL emitted from the light source system 211a to the coating film SF, as shown in Figure 18.

[0092] The light source system 211a includes a single light source 2111a. The light source 2111a may be the same as the light source 1111 described above, and therefore a detailed description thereof will be omitted.

[0093] The optical system 212a splits the processing light EL emitted from the light source 2111a into a plurality of beams (typically two beams), and then forms interference fringes on the surface of the coating film SF by interfering with the two branched processing lights EL. To form interference fringes, the optical system 212a includes a beam splitter 2121a, a beam outlet 2123a, a beam outlet 2124a, a focusing optical system 2125a, and a focusing optical system 2126a. The beam splitter 2121a splits the processing light EL emitted from the light source 2111a into a first branched light EL1 and a second branched light EL2. The first branched light EL1 is output from the beam outlet 2123a via a light guide path (e.g., optical fiber, etc.) not shown. The second branched light EL2 is output from the beam outlet 2124a via a light guide path (e.g., optical fiber, etc.) not shown. The first branched light EL1 emitted from the light outlet 2123a is converted into parallel light by the focusing optical system 2125a and then irradiated onto the surface of the coating film SF. The second branched light EL2 emitted from the light outlet 2124a is converted into parallel light by the focusing optical system 2126a and then irradiated onto the surface of the coating film SF. The first branched light EL1 irradiated from the focusing optical system 2125a and the second branched light EL2 irradiated from the focusing optical system 2126a interfere with each other to form interference fringes on the surface of the coating film SF, which have an interference pattern that is a fringe pattern in a periodic direction along the X direction in the figure, corresponding to the above-mentioned riblet structure (or the concave structure CP1). In other words, the coating film SF is irradiated with interference light having an intensity distribution on the surface of the coating film SF as processing light for forming the riblet structure. As a result, a part of the coating film SF evaporates according to the interference fringes, and a riblet structure by the coating film SF is formed on the surface of the processing object S.

[0094] The irradiation area EA where the light irradiation device 21a irradiates the first branched light EL1 and the second branched light EL2 (i.e., the irradiation area EA where the interference fringes are formed) is an area that spreads two-dimensionally along the surface of the coating film SF. Therefore, the processing device 1a equipped with the light irradiation device 21a alternately repeats an operation of forming interference fringes on the surface of the coating film SF and a step operation of moving the irradiation area EA where the interference fringes are formed by a predetermined amount along at least one of the X-axis and the Y-axis on the surface of the coating film SF, thereby forming a riblet structure by the coating film SF. In other words, the processing device 1a equipped with the light irradiation device 21a forms interference fringes in a certain area on the surface of the coating film SF, and then moves the light irradiation device 21a relative to the coating film SF, and repeats the operation of forming interference fringes in another area on the surface of the coating film SF. Note that the light irradiation device 21a cannot move the irradiation area EA by deflecting the first branched light EL1 and the second branched light EL2. Therefore, the processing apparatus 1a including the light irradiation device 21a moves the light irradiation device 21a by the drive system 12, thereby moving the irradiation area EA with respect to the coating film SF. In the light irradiation device 21a, a galvanometer mirror may be disposed between the condensing optical systems 2125a and 2126a and the coating film SF to move the irradiation area EA. Also, the pitch of the fringe pattern of the interference fringes may be changed by changing the intersection angle between the first branched light EL1 from the condensing optical system 2125a and the second branched light EL2 from the condensing optical system 2126a. In this case, the light exit 2123a and the condensing optical system 2125a may be provided as a unit to be movable, and the light exit 2123b and the condensing optical system 2125b may be provided as a unit to be movable, and the intersection angle of the first branched light EL1 and the second branched light EL2 reaching the irradiation area EA may be changed.

[0095] (4-1-2) Structure of the light irradiation device 22a In order to irradiate the coating film SF with processing light EL, the light irradiation device 22a is equipped with a light source system 221a capable of emitting processing light EL, and an optical system 222a that guides the processing light EL emitted from the light source system 221a to the coating film SF, as shown in Figure 19.

[0096] The light source system 221a includes a single light source 2211a. The light source 2211a may be the same as the light source 1111 described above, and therefore a detailed description thereof will be omitted.

[0097] The optical system 222a converts the processing light EL emitted from the light source 2211a into a plurality of processing lights EL0, and projects the plurality of processing lights EL0 onto the coating film SF. The optical system 222a includes a mirror array 2221a. The mirror array 2221a includes a plurality of mirrors M arranged in a matrix. Each mirror M is configured so that its tilt angle is variable. As an example of the operation, the processing light EL incident on each mirror M is switched between a state in which the processing light EL incident on each mirror M is reflected toward the coating film SF and a state in which the processing light EL incident on each mirror M is not reflected toward the coating film SF. The tilt angle of each mirror M may be controlled so as to change the position on the coating film SF of the processing light EL0 from each mirror M. The control device 18 controls the mirror array 2221a so that a plurality of processing lights EL0 capable of forming the above-mentioned riblet structure (particularly, the plurality of concave structures CP1 that are a part of it) are emitted from the mirror array 2221a. As a result, the light irradiation device 22a can simultaneously irradiate the surface of the coating film SF with a plurality of processing lights EL, similar to the above-mentioned light irradiation device 11. That is, a plurality of irradiation areas EA, into which a plurality of processing lights EL0 are respectively irradiated, are simultaneously set on the surface of the coating film SF. As a result, the light irradiation device 22a can form a riblet structure by the coating film SF on the surface of the processing object S, similar to the above-mentioned light irradiation device 11.

[0098] The optical system 222a of the light irradiation device 22a may include a galvanometer mirror 1122 and an fθ lens 1123, similar to the light irradiation device 11. In this case, the light irradiation device 22a can control the galvanometer mirror 1122 to cause the multiple processing lights EL to scan the surface of the coating film SF. Alternatively, even if the optical system 222a does not include the galvanometer mirror 1122 and the fθ lens 1123, the light irradiation device 22a may be moved by the drive system 12 to cause the multiple processing lights EL to scan the surface of the coating film SF. Note that the inclination angle of each mirror M of the mirror array 2221a may be controlled to change the position of the reflecting surface of each mirror M to cause the multiple processing lights EL to scan the surface of the coating film SF.

[0099] (4-1-3) Structure of the light irradiation device 23a In order to irradiate the coating film SF with processing light EL, the light irradiation device 23a is equipped with a light source system 231a capable of emitting processing light EL, and an optical system 232a that guides the processing light EL emitted from the light source system 231a to the coating film SF, as shown in Figure 20.

[0100] The light source system 231a may be the same as the light source system 111 described above, and therefore a detailed description thereof will be omitted. In addition, in Fig. 20, the description will be given using the light source system 231a including a plurality of light sources 1111 (that is, the light source system 231a having the configuration shown in Fig. 3(b)).

[0101] The optical system 232a reduces the multiple processing lights EL emitted from the multiple light sources 1111, respectively, and projects them onto the coating film SF. The optical system 232a includes multiple collimator lenses 2321a and a projection optical system 2322a. The multiple collimator lenses 2321a convert the multiple processing lights EL emitted from the multiple light sources 1111, respectively, into parallel light. The projection optical system 2322a projects the multiple processing lights EL, each converted into parallel light, onto the coating film SF at a predetermined reduction magnification (for example, 1 / 10 projection magnification). The projection optical system 2322a may be configured to form a light source image on the coating film SF, or may be configured to form a light source image at a position away from the coating film SF in the optical axis direction. As a result, the light irradiation device 23a can simultaneously irradiate the coating film SF with multiple processing lights EL, similar to the above-mentioned light irradiation device 11. That is, multiple irradiation areas EA, into which the multiple processing lights EL are irradiated, are simultaneously set on the surface of the coating film SF. As a result, the light irradiation device 23a can form a riblet structure by the coating film SF on the surface of the workpiece S, similarly to the light irradiation device 11 described above. Here, the projection magnification of the projection optical system 2322a is not limited to a reduction magnification, and may be the same magnification or may be an enlargement magnification. In addition, one or more optical members constituting the projection optical system 2322a may be provided movably (typically movable along the optical axis direction) to change the projection magnification. In this case, the interval at which the multiple irradiation areas EA are formed can be changed, and thus the pitch of the riblet structure can be changed. Note that each of the multiple collimator lenses 2321a may be provided on the light source 1111. In addition, the traveling directions of the multiple processing light EL emitted from the projection optical system 2322a are not limited to being parallel to each other, and may be configured so that the interval between the multiple processing light EL increases or decreases as the multiple processing light EL advances.

[0102] The optical system 232a of the light irradiation device 23a may include a galvanometer mirror 1122, similar to the light irradiation device 11. In this case, the light irradiation device 23a can control the galvanometer mirror 1122 to cause the multiple processing lights EL to scan the surface of the coating film SF. Alternatively, even if the optical system 232a does not include the galvanometer mirror 1122, the optical system 232a may be configured to move the light irradiation device 23a by the drive system 12 so that the multiple processing lights EL scan the surface of the coating film SF. Alternatively, the optical system 232a may be configured to move the light source 1111 so that the multiple processing lights EL scan the surface of the coating film SF.

[0103] (4-1-4) Structure of the light irradiation device 24a In order to irradiate the coating film SF with processing light EL, the light irradiation device 24a is equipped with a light source system 241a capable of emitting processing light EL, and an optical system 242a that guides the processing light EL emitted from the light source system 241a to the coating film SF, as shown in FIG. 21.

[0104] The light source system 241a includes a single light source 2411a and an illumination optical system 2412a. The light source 2411a may be the same as the above-mentioned light source 1111, and therefore a detailed description thereof will be omitted. The illumination optical system 2412a makes the amount of light of the processing light EL from the light source 2411a uniform within the cross section of the beam of the processing light EL.

[0105] The optical system 242a includes a mask 2421a and a projection optical system 2422a. The mask 2421a is a photomask (in other words, a reticle) on which a mask pattern (for example, a pattern in which a transmission pattern through which the processing light EL can pass and a light blocking pattern that blocks the processing light EL are periodically arranged in the X direction) having a light transmittance distribution corresponding to the riblet structure (or a structure to be formed) is formed. The processing light EL that has passed through the illumination optical system 2412a passes through the mask 2421a to become the processing light EL having a periodically changing intensity distribution corresponding to the riblet structure. The projection optical system 2422a projects the processing light EL that has passed through the mask 2421a onto the coating film SF at a predetermined reduction magnification (for example, a projection magnification of 1 / 10). In other words, the projection optical system forms a reduced image of the mask 2421a on the coating film SF. As a result, the light irradiation device 24a irradiates the processing light EL having an intensity distribution corresponding to the above-mentioned riblet structure (or the concave structure CP1) onto the surface of the coating film SF. That is, the surface of the coating film SF is irradiated with the processing light EL having an intensity distribution corresponding to the riblet structure on the surface of the coating film SF. As a result, a part of the coating film SF evaporates according to the intensity distribution of the processing light EL, and the riblet structure is formed by the coating film SF on the surface of the processing object S. Here, the projection magnification of the projection optical system 2422a is not limited to a reduction magnification, and may be the same magnification or an enlargement magnification. In addition, one or more optical members constituting the projection optical system 2422a may be provided movable (typically movable along the optical axis direction) to change the projection magnification. In this case, the period of the periodically changing intensity distribution can be changed, and thus the pitch of the riblet structure can be changed.

[0106] The irradiation area EA where the light irradiation device 24a irradiates the processing light EL is an area that spreads two-dimensionally along the surface of the coating film SF. Therefore, in the processing device 1a equipped with the light irradiation device 24a, the operation of irradiating the surface of the coating film SF with the processing light EL through the mask 2421a and the step operation of moving the irradiation area EA by a predetermined amount along at least one of the X-axis and the Y-axis on the surface of the coating film SF are alternately repeated to form a riblet structure by the coating film SF. Note that the light irradiation device 24a cannot move the irradiation area EA by deflecting the processing light EL. For this reason, the processing device 1a equipped with the light irradiation device 24a moves the irradiation area EA relative to the coating film SF by moving the light irradiation device 24a by the drive system 12.

[0107] The optical system 242a of the light irradiation device 24a may include a galvanometer mirror 1122, similar to the light irradiation device 11. In this case, the light irradiation device 24a can control the galvanometer mirror 1122 to cause a plurality of processing lights EL to scan the surface of the coating film SF. In addition, the mask 2421a and the light source system 241a may be moved relative to the projection optical system 2422a.

[0108] In addition, the light irradiation device 24a may be provided with a spatial light modulator capable of spatially modulating the processing light EL with a modulation pattern according to the riblet structure, instead of the mask 2421a. "Spatially modulating the processing light EL" means changing the distribution of at least one of the optical characteristics of the processing light EL in a cross section crossing the traveling direction of the processing light EL, which is the amplitude (intensity), the phase of the light, the polarization state of the light, the wavelength of the light, and the traveling direction of the light (in other words, the polarization state). The spatial light modulator may be a transmissive spatial light modulator that transmits the processing light EL and spatially modulates it, or a reflective spatial light modulator that reflects the processing light EL and spatially modulates it.

[0109] (4-1-5) Structure of the light irradiation device 25a In order to irradiate the coating film SF with the processing light EL, the light irradiation device 25a, as shown in FIG. 22, is equipped with a light source system 251a capable of emitting the processing light EL, a lens array 2513a that divides the processing light EL emitted from the light source system 251a into multiple beams, and an optical system 252a that guides the multiple beams from the lens array 2513a to the coating film SF.

[0110] The light source system 251a includes a single light source 2511a and a beam expander 2512a that shapes, typically expands, an incident beam from the light source 2511a and emits the beam. The beam expander 2512a may have an optical member for making uniform the intensity distribution in the beam cross section of the incident beam from the light source 2511a.

[0111] The lens array 2513a includes a plurality of lens elements arranged in a direction intersecting the incident beam, typically in the YZ plane in the drawing, each of which focuses the incident beam. A two-dimensionally arranged light source image is formed on the exit side of the lens array 2513a.

[0112] The optical system 252a includes an afocal zoom lens 2522a for adjusting the spacing between the multiple incident beams to a predetermined interval, a focusing optical system 2523a for focusing the multiple beams from the afocal zoom lens 2522a at a predetermined position, and an fθ lens 2524a for focusing the multiple beams from the focusing optical system 2523a onto the coating film SF as multiple processing beams EL0.

[0113] The multiple processing beams EL0 from the optical system 252a (the multiple processing beams EL0 from the fθ lens 2524a) form multiple irradiation areas EA on the coating film SF. In other words, the multiple processing beams EL0 are irradiated onto the coating film SF.

[0114] Here, the afocal zoom lens 2522a can be regarded as a double-telecentric zoom lens. In this case, the positions where a plurality of light source images are formed by the lens array 2513a, the optical path between the afocal zoom lens 2522a and the focusing optical system 2523a, and the coating film SF may be optically conjugate with each other. Since the optical path between the afocal zoom lens 2522a and the focusing optical system 2523a, i.e., the optical path on the exit side of the afocal zoom lens 2522a and the coating film SF are conjugate with each other, it is clear that if the interval between the plurality of beams emitted from the afocal zoom lens 2522a is changed, the interval between the processing light EL0 reaching the coating film SF is also changed. Therefore, the magnification (angular magnification) of the afocal zoom lens 2522a may be changed by a drive unit (not shown) to change the interval between the processing light EL0 reaching the coating film SF.

[0115] In addition, some of the lenses constituting the light collecting optical system 2523a may be provided to be movable in the optical axis direction and used as a focus lens.

[0116] In the above description, the lens array 2513a can be called a light branching element. A reflective mirror array may be used instead of the lens array 2513a.

[0117] (4-1-6) Structure of the light irradiation device 26a In order to irradiate the coating film SF with the processing light EL, the light irradiation device 26a, as shown in FIG. 23, is equipped with a light source system 261a capable of emitting the processing light EL, a lens array 2613a that divides the processing light EL emitted from the light source system 261a into multiple beams, and an optical system 262a that guides the multiple beams from the lens array 2613a to the coating film SF.

[0118] The light irradiation device 26a shown in Fig. 23 differs from the light irradiation device 25a shown in Fig. 22 in that the galvanometer mirror 2624a is disposed between the focusing optical system 2623a (focus lens) and the fθ lens 2625a. The other configurations of the light irradiation device 26a may be the same as the other configurations of the light irradiation device 25a. Even though the location of the galvanometer mirror 2624a is different in this way, the light irradiation device 26a shown in Fig. 23 can achieve the same effects as the light irradiation device 25a shown in Fig. 22.

[0119] 23, the fθ lens 2625a may be a telecentric optical system on the coating film SF side, or may be a non-telecentric optical system on the coating film SF side. When the fθ lens 2625a is a non-telecentric optical system on the coating film SF side, the processing light EL can be irradiated onto an area larger than the size of the fθ lens 2625a.

[0120] 22 and 23, when a part of the lenses in the light collecting optical system 2523a or 2623a is moved in the optical axis direction to be a focus lens, the magnification of the optical system 252a or 262a may be changed with the movement of the focus lens. In this case, the magnification fluctuation caused by the movement of the focus lens may be corrected by changing the magnification of the afocal zoom lens 2522a or 2622a.

[0121] In this example, the galvanometer mirror 2624a may be a two-axis galvanometer mirror that is movable around two axes that are perpendicular to each other, but is not limited thereto. As shown in FIG. 3, a combination of two one-axis galvanometer mirrors may also be used.

[0122] (4-1-7) Structure of the light irradiation device 27a In order to irradiate the coating film SF with the processing light EL, the light irradiation device 27a includes a light source system 271a capable of emitting the processing light EL, a light branching unit including a light branching member 2713a that branches the processing light emitted from the light source 271a into multiple beams, and an optical system 272a that guides the multiple beams from the light branching unit to the coating film SF, as shown in Fig. 24. Here, the configurations of the light source system 271a and the optical system 272a are similar to those of the light source system 251a and the optical system 252a shown in Fig. 22, and therefore description thereof will be omitted here.

[0123] A reflective diffractive optical element can be used as the light splitter 2713a. An incident beam incident on the light splitter 2713a is split into multiple diffracted beams traveling in different directions, for example, by diffraction. A collimating optical system 2714a having a front focal point located at the position of the light splitter 2713a is provided on the exit side of the light splitter 2713a, and the multiple beams traveling in different directions are redirected by the collimating optical system 2714a to be parallel to each other, and travel toward the optical system 272a as multiple parallel beams.

[0124] The light branching member 2713a is not limited to a reflective diffractive optical element, and may be a reflective spatial light modulator. As the reflective spatial light modulator, various spatial light modulators may be used, such as a mirror array having a plurality of mirrors whose positions and / or postures can be changed, or a LCOS (Liquid Crystal On Silicon) type spatial light modulator. Here, if a spatial light modulator capable of actively changing the state of reflected light is used as the light branching member 2713a, the state (intensity distribution, traveling direction, etc.) of the light from the spatial light modulator can be changed to adjust at least one of the position, shape, distribution, etc. of the irradiation area EA on the coating film SF. Also, at least one of a transmissive diffractive optical element and a transmissive spatial light modulator may be used as the light branching member 2713a.

[0125] Incidentally, the optical system 262a shown in FIG. 25 may be used as the optical system 272a shown in FIG.

[0126] (4-1-8) Modification of the light irradiation device 11 shown in FIG. 3 In the light source system 111 shown in FIG. 3(b), the multiple light sources 1111 are arranged in a row at equal intervals. However, the multiple light sources 111 do not have to be arranged at equal intervals, and they do not have to be arranged in a row. That is, the multiple light sources 1111 may be arranged in an array pattern other than the array pattern shown in FIG. 3(b). For example, the multiple light sources 1111 may be arranged in a matrix at equal intervals. For example, the multiple light sources 1111 may be arranged in a staggered array pattern. For example, the multiple light sources 1111 may be arranged in a row or multiple rows at random intervals.

[0127] In the light source system 111 shown in FIG. 3(c), the multiple exits from which the multiple processed lights EL branched by the splitter 1112 are respectively emitted are arranged in a line at equal intervals. However, the multiple exits may not be arranged at equal intervals, or may not be arranged in a line. That is, the multiple exits may be arranged in other arrangement patterns different from the arrangement pattern shown in FIG. 3(c). For example, the multiple exits may be arranged in a matrix at equal intervals. For example, the multiple exits may be arranged in a staggered arrangement pattern. For example, the multiple exits may be arranged in a line or in multiple lines at random intervals. Alternatively, the light source system 111 may have a single exit. That is, the light source system 111 may irradiate a single processed light EL. In this case, the light source system 111 may not have the splitter 1112.

[0128] According to the light irradiation device 11 shown in FIG. 3, the coating film SF is irradiated with a plurality of processing lights EL at the same time. However, the plurality of processing lights EL do not have to be irradiated with the coating film SF at the same time. For example, during a period in which some of the plurality of processing lights EL are irradiated with the coating film SF, other parts of the plurality of processing lights EL do not have to be irradiated with the coating film SF. For example, some of the plurality of processing lights EL may be irradiated with the coating film SF at a first timing, and then other parts of the plurality of processing lights EL may be irradiated with the coating film SF at a second timing different from the first timing. For example, the plurality of processing lights EL may be irradiated with the coating film SF in sequence.

[0129] In the light irradiation device 11 shown in FIG. 3, the galvanometer mirror 1122 is a two-axis galvanometer mirror including both the X-scanning mirror 1122X and the Y-scanning mirror 1122Y. However, the galvanometer mirror 1122 may be a one-axis galvanometer mirror including either the X-scanning mirror 1122X or the Y-scanning mirror 1122Y. A processing device including such a one-axis galvanometer mirror may control the galvanometer mirror to scan the surface of the coating film SF along either the X-axis direction or the Y-axis direction with a plurality of processing lights EL, and may move the light irradiation device including the one-axis galvanometer mirror along the other of the X-axis direction or the Y-axis direction using the drive system 12, thereby scanning the surface of the coating film SF along either the X-axis direction or the Y-axis direction with a plurality of processing lights EL. The galvanometer mirror 1122 may be a mirror that can rotate around two orthogonal axes.

[0130] (4-2) Second Modification Next, a processing apparatus 1b of a second modified example will be described with reference to FIG. 25. As shown in FIG. 25, the processing apparatus 1b of the second modified example is different from the processing apparatus 1 described above in that it further includes a surface characteristic measuring device 19b. The surface characteristic measuring device 19b measures the characteristics of the surface of the coating film SF (particularly, a part of the surface of the coating film SF to which the light irradiation device 11 is going to irradiate the multiple processing lights EL) before the light irradiation device 11 irradiates the surface of the coating film SF with multiple processing lights EL. The surface characteristic measuring device 19b is supported by the accommodation device 13 via the support member 136b. Therefore, in the accommodation space SP, the relative positional relationship between the light irradiation device 11 and the surface characteristic measuring device 19b is fixed. Furthermore, the processing apparatus 1b of the second modified example is different from the processing apparatus 1 described above in that the light irradiation device 11 is controlled based on the measurement result of the surface characteristic measuring device 19b. Other features of the processing apparatus 1b may be the same as other features of the processing apparatus 1.

[0131] A specific example of a pre-measurement control operation for controlling the light irradiation device 11 based on the measurement results of the surface property measuring device 19b will be described below.

[0132] (4-2-1) First concrete example of pre-measurement control operation In the first specific example, the surface characteristic measuring device 19b measures the shape of the surface of the coating film SF as the surface characteristic of the coating film SF. The surface characteristic measuring device 19b irradiates the coating film SF with a measuring light MLb (hereinafter, the measuring light MLb used in the first specific example is referred to as "measuring light MLb1"). For this purpose, the surface characteristic measuring device 19b includes a light projecting device 191b that irradiates the measuring light MLb1. Furthermore, the surface characteristic measuring device 19b measures the reflected light of the measuring light MLb1 from the coating film SF. For this purpose, the surface characteristic measuring device 19b includes a detection device 192b that detects the reflected light of the measuring light MLb1. Since the reflected light is the measuring light MLb1 reflected by the surface of the coating film SF, the measurement result of the reflected light (i.e., the output of the surface characteristic measuring device 19b) includes information on the shape of the surface of the coating film SF. For this purpose, the control device 18 can identify the shape of the surface of the coating film SF based on the measurement result of the surface characteristic measuring device 19b. An example of the surface characteristic measuring device 19b for measuring the shape of the surface of the coating film SF is a measuring device (such as a measuring device using a light-section method) that can measure the surface shape by irradiating the surface of the coating film SF with measuring light MLb1 having a predetermined light emission pattern (such as a linear light emission pattern or a lattice-like light emission pattern) and measuring the pattern image from a direction different from the irradiation direction of the measuring light MLb1. Also, an example of the surface characteristic measuring device 19b can be an optical measuring device using various methods such as a moire topography method using a grating irradiation method or a grating projection method, a holographic interferometry method, an autocollimation method, a stereo method, an astigmatism method, a critical angle method, or a knife-edge method.

[0133] In the first specific example, the control device 18 sets the irradiation conditions (i.e., irradiation states) of the multiple processing lights EL based on the shape of the surface of the coating film SF. In the first specific example, the irradiation condition of the multiple processing lights EL is the condensing position FP of the multiple processing lights EL. Specifically, the control device 18 sets, for example, the condensing position FP of the multiple processing lights EL to a position where the coating film SF can be processed by irradiating the multiple processing lights EL. Here, as described above, the coating film SF is processed so that a part of the coating film SF evaporates by irradiation with the processing light EL. The coating film SF evaporates due to the energy applied to the coating film SF from the processing light EL by irradiation with the processing light EL (i.e., the energy of the processing light EL absorbed by the coating film SF). The energy applied to the coating film SF from the processing light EL increases as the intensity of the processing light EL on the surface of the coating film SF increases. Therefore, if the intensity of the processing light EL on the surface of the coating film SF is equal to or higher than the intensity capable of evaporating the coating film SF, the coating film SF evaporates by irradiation with the processing light EL. Therefore, the control device 18 considers the relationship between the relative position of the condensing position FP of the processing light EL with respect to the surface of the coating film SF and the intensity of the processing light EL on the surface of the coating film SF, and sets the condensing positions FP of the multiple processing lights EL to positions where the coating film SF can be processed by irradiating the multiple processing lights EL. Also, since the coating film SF is processed so that a part of the coating film SF in the irradiation area EA irradiated with the processing light EL evaporates, if the condensing position of the processing light EL deviates significantly from the surface of the coating film SF (i.e., deviates along the Z-axis direction), the irradiation area EA irradiated with the processing light EL becomes large, and there is a risk that the desired riblets cannot be obtained. Therefore, the control device 18 sets the condensing positions FP of the multiple processing lights EL so that the size of the irradiation area EA of the processing light EL on the surface of the coating film SF becomes the required size.

[0134] Based on this premise, if the surface of the coating film SF is located within the range of the focal depth of the optical system 112 (i.e., DOF: Depth Of Focus, an area extending from the focal position FP of the multiple processing lights EL to the object plane side and the image plane side), the intensity of the processing light EL on the surface of the coating film SF will be accordingly large (i.e., it will be greater than the intensity capable of evaporating the coating film SF). Also, if the surface of the coating film SF is located within the focal depth of the optical system 112, the size of the irradiation area EA of the processing light EL on the surface of the coating film SF will be a required size. The fact that the surface of the coating film SF is located within the focal depth of the optical system 112 may mean that the size of the irradiation area EA of the processing light EL formed on the surface of the coating film SF is within a required range. Therefore, as shown in Figures 26(a) to 26(d), the control device 18 may set the focal positions FP of the multiple processing lights EL so that the surface of the coating film SF (particularly, a part of the surface of the coating film SF that is irradiated with the multiple processing lights EL) is located within the focal depth of the optical system 112. Fig. 26(a) is a cross-sectional view showing how the surface of the coating film SF is located within the range of the focal depth of the optical system 112 when the surface of the coating film SF is flat. Fig. 26(b) is a cross-sectional view showing how the surface of the coating film SF is located within the range of the focal depth of the optical system 112 when the surface of the coating film SF is curved. Fig. 26(c) is a cross-sectional view showing how the surface of the coating film SF is located within the range of the focal depth of the optical system 112 when the surface of the coating film SF has irregularities. Fig. 26(d) is a cross-sectional view showing how the surface of the coating film SF is located within the range of the focal depth of the optical system 112 when the surface of the coating film SF is inclined with respect to the optical axis AX of the optical system 112 (i.e., the optical axis AX along the Z axis).

[0135] When the focusing positions FP of the multiple processing beams EL move along the Z axis relative to the coating film SF, the relative positional relationship (particularly the positional relationship in the Z axis direction) between the coating film SF and the range of the focal depth of the optical system 112 changes. For this reason, it can be said that the control device 18, by setting the focusing positions FP of the multiple processing beams EL, essentially sets the relative positional relationship between the coating film SF and the range of the focal depth of the optical system 112.

[0136] After setting the focusing position FP in this way, the control device 18 controls the focus lens 1121 provided in the light irradiation device 11 so that the multiple processing lights EL are focused at the set focusing position FP. That is, the control device 18 controls (i.e., adjusts) the focusing positions FP of the multiple processing lights EL collectively by controlling the focus lens 1121 so that the multiple processing lights EL are focused at the set focusing position FP. In other words, the control device 18 controls (changes) the focusing positions FP of the multiple processing lights EL simultaneously by controlling the focus lens 1121 so that the multiple processing lights EL are focused at the set focusing position FP. Note that, in the light irradiation devices 21a to 24a described in the first modified example, if the optical systems 212a to 242a are provided with the focus lens 1121, the control device 18 can control the light irradiation devices 21a to 24a so that the multiple processing lights EL are focused at the set focusing position FP. As a result, the surface of the coating film SF is located within the range of the focal depth of the optical system 112. Therefore, the surface of the coating film SF is irradiated with the processing light EL having an intensity equal to or greater than that capable of evaporating the coating film SF. Therefore, the coating film SF is appropriately processed by the multiple processing lights EL.

[0137] According to a first specific example of such a pre-measurement control operation, the processing apparatus 1b can process the coating film SF without being restricted by the surface shape of the coating film SF, while enjoying effects similar to those that can be enjoyed by the processing apparatus 1 described above.

[0138] In addition, with the scanning of the multiple processing lights EL, the relative positions (particularly the positions in the direction along the surface of the coating film SF) of the multiple irradiation areas EA onto which the multiple processing lights EL are respectively irradiated change on the surface of the coating film SF. That is, the multiple processing lights EL move relative to the surface of the coating film SF. If the relative positions of the multiple irradiation areas EA on the surface of the coating film SF change, the shape of the portion of the surface of the coating film SF on which the multiple irradiation areas EA are formed may also change while the multiple processing lights EL are being irradiated. For this reason, when the multiple processing lights EL are irradiated onto the coating film SF (that is, when the multiple processing lights EL are moving relative to the coating film SF), the control device 18 may appropriately set the focusing position FP based on the shape of the portion of the surface of the coating film SF on which the multiple irradiation areas EA are formed, and control the focus lens 1121 so that the multiple processing lights EL are condensed at the set focusing position FP.

[0139] Depending on the shape of the surface of the coating film SF, even if the focusing positions FP of the multiple processing lights EL are set, a part of the surface of the coating film SF (particularly, a part of the surface of the coating film SF that is irradiated with the multiple processing lights EL) may not be located within the focal depth range of the optical system 112. In other words, while a part of the surface of the coating film SF is located within the focal depth range of the optical system 112, another part of the surface of the coating film SF may not be located within the focal depth range of the optical system 112. In this case, the processing device 1b may selectively irradiate only a part of the multiple processing lights EL to the coating film SF so that the processing light EL is irradiated to a part of the coating film SF whose surface is located within the focal depth range of the optical system 112, while the processing light EL is not irradiated to another part of the coating film SF whose surface is not located within the focal depth range of the optical system 112.

[0140] Furthermore, the control of the focusing positions FP of the multiple processing light beams EL by the focus lens 1121 is equivalent to the control of the relative positional relationship between the surface of the coating film SF and the focusing positions FP of the multiple processing light beams EL in the Z-axis direction. Therefore, in addition to or instead of controlling the focusing positions FP of the multiple processing light beams EL by controlling the focus lens 1121, the control device 18 may control the drive system 12 to control the relative position of the light irradiation device 11 with respect to the coating film SF in the Z-axis direction. Even in this case, the processing device 1b can process the coating film SF without being restricted by the shape of the surface of the coating film SF.

[0141] Furthermore, when the focusing position FP changes, the intensity distribution of the multiple processing light beams EL changes in a plane including an axis intersecting with the surface of the coating film SF (for example, the XZ plane in the example shown in FIG. 26(a) to FIG. 26(d)). Therefore, the control of the focusing position FP of the multiple processing light beams EL by the focus lens 1121 is equivalent to the control of the intensity distribution of the multiple processing light beams EL in a plane including an axis intersecting with the surface of the coating film SF. In other words, the control device 18 may control the intensity distribution of the multiple processing light beams EL in a plane including an axis intersecting with the surface of the coating film SF so that the coating film SF can be processed by irradiating the multiple processing light beams EL. In this case, the optical system 112 may include an intensity distribution adjustment element for adjusting the intensity distribution of the multiple processing light beams EL under the control of the control device 18. As the intensity distribution adjustment element, for example, a filter having a required concentration distribution in a plane intersecting the optical path, an aspheric (refractive or reflective) optical element having a required surface shape in a plane intersecting the optical path, a diffractive optical element, a spatial light modulator, or the like can be used. Alternatively, when the shapes of the multiple processing lights EL in a plane including an axis intersecting the surface of the coating film SF change, the intensity distribution of the multiple processing lights EL may also change. For this reason, the control device 18 may control the shapes of the multiple processing lights EL in a plane including an axis intersecting the surface of the coating film SF so that the coating film SF can be processed by irradiating the multiple processing lights EL. In this case, the optical system 112 may be provided with a light shape adjustment element for adjusting the shapes of the multiple processing lights EL under the control of the control device 18. As the light shape adjustment element, for example, a diaphragm having a predetermined aperture shape, a filter having a required concentration distribution in a plane intersecting the optical path, an aspheric (refractive or reflective) optical element having a required surface shape in a plane intersecting the optical path, a diffractive optical element, a spatial light modulator, etc. can be used. Note that when the control device 18 controls at least one of the intensity distribution and the shape of the multiple processing lights EL, it may or may not control the focusing position FP of the multiple processing lights EL.

[0142] In addition, when the focusing position FP changes, the size of the irradiation area EA on the surface of the coating film SF changes. Specifically, the closer the focusing position FP is to the surface of the coating film SF in the direction along the surface of the coating film SF, the smaller the size of the irradiation area EA becomes. The farther the focusing position FP is from the surface of the coating film SF in the direction along the surface of the coating film SF, the larger the size of the irradiation area EA becomes. Therefore, the control of the focusing position FP of the multiple processing lights EL by the focus lens 1121 is equivalent to the control of the size of the multiple irradiation areas EA on the coating film SF. Therefore, it can be said that the control device 18 essentially controls the size of the multiple irradiation areas EA on the surface of the coating film SF based on the positional relationship between the coating film SF and the multiple irradiation areas EA. For example, in the example shown in Fig. 26(c), the control device 18 can be said to control the sizes of the multiple irradiation areas EA so as to (i) relatively reduce the size of the irradiation area EA formed in the first portion (the portion located on the left side in Fig. 26(c)) on the coating film SF, and (i) relatively increase the size of the irradiation area EA formed in the second portion (the portion located in the center in Fig. 26(c)) and the third portion (the portion located on the right side in Fig. 26(c)) on the coating film SF. In other words, the control device 18 can be said to set the size of the irradiation area EA formed in the first portion on the coating film SF to a desired first size, set the size of the irradiation area EA formed in the second portion on the coating film SF to a desired second size, and set the size of the irradiation area EA formed in the third portion on the coating film SF to a desired third size.

[0143] In the above description, the control device 18 can collectively control (simultaneously control) the focusing positions FP of the multiple processing lights EL by controlling the focus lens 1121. However, the control device 18 may control the focusing positions FP of the multiple processing lights EL individually or independently. However, when controlling the focusing positions FP of the multiple processing lights EL individually or independently, the processing device 1b includes a light irradiation device 11b-1 including multiple focus lenses 1121 for adjusting the focusing positions FP of the multiple processing lights EL, instead of the light irradiation device 11. An example of the light irradiation device 11b-1 including multiple focus lenses 1121 is shown in FIG. 27. As shown in FIG. 27, the light irradiation device 11b-1 includes multiple irradiation units 110b-1. Each irradiation unit 110b-1 includes a light source system 111b-1 and the above-mentioned optical system 112. The light source system 111b-1 includes a single light source 1111. In such a light irradiation device 11b-1, the multiple irradiation units 110b-1 that respectively irradiate the multiple processing light beams EL are each provided with multiple focus lenses 1121, so that the focusing positions FP of the multiple processing light beams EL can be controlled individually or independently. Note that each irradiation unit 110b-1 is not limited to irradiating the coating film SF with the multiple processing light beams EL, and may irradiate the coating film SF with a single processing light beam EL.

[0144] In addition, when each irradiation unit 110b-1 irradiates a single processing light EL, if the optical system 112 of each irradiation unit 110b-1 is a non-telecentric optical system on the coating film SF side as shown in Fig. 28, the distance from the optical system 112 to the focusing position FP changes depending on the position on the coating film SF even if the surface of the coating film SF is flat. In this case, the focus lens 1121 can be controlled according to the irradiation position on the coating film SF of the processing light EL.

[0145] Even when the focusing positions FP of the multiple processing lights EL are controlled individually or independently, the control device 18 may set the focusing positions FP of the multiple processing lights EL so that the surface of the coating film SF is located within the range of the focal depth of the optical system 112. Alternatively, the control device 18 may set the focusing positions FP of the multiple processing lights EL so that the focusing positions FP of each of the multiple processing lights EL are located on the surface of the coating film SF, as shown in Figures 29(a) to 29(d). Figure 29(a) is a cross-sectional view showing how the focusing positions FP of the multiple processing lights EL are located on the surface of the coating film SF when the surface of the coating film SF is flat. Figure 29(b) is a cross-sectional view showing how the focusing positions FP of the multiple processing lights EL are located on the surface of the coating film SF when the surface of the coating film SF is curved. Figure 29(c) is a cross-sectional view showing how the focusing positions FP of the multiple processing lights EL are located on the surface of the coating film SF when the surface of the coating film SF has unevenness. FIG. 29(d) is a cross-sectional view showing a state in which the focusing positions FP of the multiple processing beams EL are located on the surface of the coating film SF when the surface of the coating film SF is inclined with respect to the optical axis AX of the optical system 112.

[0146] Furthermore, even when the focusing positions FP of the multiple processing lights EL are controlled individually or independently, depending on the shape of the surface of the coating film SF, some of the focusing positions FP of the multiple processing lights EL may not be located on the surface of the coating film SF. That is, while some of the focusing positions FP of the multiple processing lights EL are located on the surface of the coating film SF, some of the focusing positions FP of the multiple processing lights EL may not be located on the surface of the coating film SF. In this case, the processing device 1b may selectively irradiate only some of the multiple processing lights EL to the coating film SF so that the processing light EL whose focusing position FP is located on the surface of the coating film SF is irradiated to the coating film SF, while the processing light EL whose focusing position FP is not located on the surface of the coating film SF is not irradiated. Alternatively, even when the focusing positions FP of the multiple processing lights EL are controlled individually or independently, the surface of the coating film SF may not be located within the range of the focal depth of the optical system 112 for irradiating some of the processing lights EL of the multiple processing lights EL. That is, there are cases where the surface of the coating film SF is located within the focal depth range of one optical system 112 for irradiating one of the multiple processing lights EL, while the surface of the coating film SF cannot be located within the focal depth range of another optical system 112 for irradiating another of the multiple processing lights EL. Even in this case, the processing device 1b may selectively irradiate only a part of the multiple processing lights EL to the coating film SF so that the processing light EL is irradiated via the optical system 112 whose focal depth range includes the surface of the coating film SF, while the processing light EL is not irradiated via the optical system 112 whose focal depth range includes the surface of the coating film SF.

[0147] As shown in FIG. 29(a) to FIG. 29(d), the individual control of the condensing positions FP of the processing light EL is substantially equivalent to changing the relative positional relationship of the condensing positions FP of the processing light EL with respect to the coating film SF in the Z-axis direction (or the direction intersecting the surface of the coating film SF). Therefore, in addition to or instead of controlling the multiple focus lenses 1121 to control the condensing positions FP of the processing light EL, the control device 18 may control a drive system (not shown) capable of individually moving the multiple irradiation units 110b-1 to control the relative positions of each of the multiple irradiation units 110b-1 with respect to the coating film SF in the Z-axis direction. By controlling the relative positions of each of the multiple irradiation units 110b-1 in the Z-axis direction, the relative positional relationship between the surface of the coating film SF and the condensing positions FP of the multiple processing light EL in the Z-axis direction changes. Therefore, even if the processing device 1b controls the relative positions of each of the multiple irradiation units 110b-1 in the Z-axis direction, the processing device 1b can process the coating film SF without being restricted by the shape of the surface of the coating film SF.

[0148] Alternatively, even if the attitude of each of the multiple irradiation units 110b-1 with respect to the coating film SF (for example, the tilt amount, the relative position in at least one of the θX direction and the θY direction) changes, the relative positional relationship of the condensing positions FP of the multiple processing lights EL emitted by the multiple irradiation units 110b-1 changes. For this reason, the control device 18 may control the attitude of each of the multiple irradiation units 110b-1 with respect to the coating film SF by controlling a drive system (not shown) that can move the multiple irradiation units 110b-1 individually. Even in this case, the processing device 1b can process the coating film SF without being restricted by the shape of the surface of the coating film SF. Note that even if the processing device 1b is equipped with a light irradiation device 11 that does not have multiple irradiation units 110b-1, the control device 18 may control the attitude of the light irradiation device 11 with respect to the coating film SF. Even in this case, the relative position of the condensing positions FP of the multiple processing lights EL with respect to the coating film SF can be controlled.

[0149] (4-2-2) Second specific example of pre-measurement control operation The second specific example of the advance measurement control operation differs from the first specific example of the advance measurement control operation described above in that, instead of the focusing positions FP of the multiple processing lights EL, a condition related to the focal depth of the optical system 112 (in the following description, a range of the focal depth is used) is used as the irradiation condition of the multiple processing lights EL. Other features of the second specific example of the advance measurement control operation may be the same as those of the first specific example of the advance measurement control operation.

[0150] In the second specific example, similarly to the first specific example, the control device 18 sets the focusing positions FP of the multiple processing lights EL to positions where the coating film SF can be processed by the multiple processing lights EL. For example, as shown in FIG. 30(a) to FIG. 30(d), the control device 18 may set the range of the depth of focus of the optical system 112 so that the surface of the coating film SF (particularly, a part of the surface of the coating film SF that is irradiated with the multiple processing lights EL) is located within the range of the depth of focus of the optical system 112. In other words, the control device 18 may set the range of the depth of focus of the optical system 112 so that the size of the irradiation area EA of the processing light EL formed on the surface of the coating film SF is within a required range. FIG. 30(a) is a cross-sectional view showing the range of the depth of focus of the optical system 112 set to include the surface of the coating film SF when the surface of the coating film SF is flat. FIG. 30(b) is a cross-sectional view showing the range of the depth of focus of the optical system 112 set to include the surface of the coating film SF when the surface of the coating film SF is curved. Fig. 30(c) is a cross-sectional view showing the range of the focal depth of the optical system 112 set to include the surface of the coating film SF when the surface of the coating film SF has irregularities. Fig. 30(d) is a cross-sectional view showing the range of the focal depth of the optical system 112 set to include the surface of the coating film SF when the surface of the coating film SF is inclined with respect to the optical axis AX of the optical system 112.

[0151] In the second specific example, the optical system 112 includes an optical element for adjusting the range of the focal depth of the optical system 112 (hereinafter, this optical element is referred to as a "focal depth adjustment element"). The focal depth adjustment element may be, for example, a focus lens 1121. The focal depth range may be the lower and upper limit positions of the focal depth range in the light traveling direction. The control device 18 controls the focal depth adjustment element so that the focal depth range of the optical system 112 is within the set focal depth range. As a result, the surface of the coating film SF is located within the focal depth range of the optical system 112. Therefore, the surface of the coating film SF is irradiated with processing light EL having an intensity equal to or greater than that capable of evaporating the coating film SF, and the coating film SF is removed within a required range. Therefore, the coating film SF is appropriately processed by a plurality of processing lights EL. In the second specific example, the size of the focal depth range is constant, but the size of the focal depth range may be changed. When the size of the focal depth range is changed, the numerical aperture on the coating film SF side of the optical system 112 may be changed.

[0152] According to the second specific example of the advance measurement control operation, the processing apparatus 1b can obtain the same effects as those obtainable by the first specific example of the advance measurement control operation described above.

[0153] In the second specific example, as in the first specific example, depending on the shape of the surface of the coating film SF, even if the range of the focal depth of the optical system 112 is set, a part of the surface of the coating film SF (particularly, a part of the surface of the coating film SF onto which the multiple processing lights EL are irradiated) may not be located within the focal depth of the optical system 112. In this case, the processing device 1b may selectively irradiate only a part of the multiple processing lights EL onto the coating film SF so that the processing light EL is irradiated onto a part of the coating film SF whose surface is located within the focal depth of the optical system 112, while the processing light EL is not irradiated onto another part of the coating film SF whose surface is not located within the focal depth of the optical system 112.

[0154] (4-2-3) Third specific example of pre-measurement control operation The third specific example of the preliminary measurement control operation differs from the first specific example of the preliminary measurement control operation described above in that the control device 18 sets the state of the image plane of the optical system 112 (that is, the optical surface on which the processing light EL is imaged via the optical system 112) based on the shape of the surface of the coating film SF. Furthermore, the third specific example of the preliminary measurement control operation differs from the first specific example of the preliminary measurement control operation described above in that the control device 18 controls the optical system 112 so that the state of the image plane of the optical system 112 becomes the set state. Other features of the third specific example of the preliminary measurement control operation may be the same as those of the first specific example of the preliminary measurement control operation. Here, the image plane of the optical system 112 may be a virtual plane to which multiple focusing positions FP are fitted. In addition, in the case of the modified example of FIG. 21, it may be a plane on which the image of the mask 2421a is formed.

[0155] The control device 18 may set the size of the image plane based on the shape of the surface of the coating film SF. For example, the control device 18 may set the size of the image plane to a predetermined size according to the shape of the surface of the coating film SF. The control device 18 may set the relative position of the image plane with respect to the coating film SF (particularly, the surface of the coating film SF) (for example, the relative position along at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction) based on the shape of the surface of the coating film SF. For example, the control device 18 may set the position of the image plane to a predetermined position according to the shape of the surface of the coating film SF. The control device 18 may set the shape of the image plane based on the shape of the surface of the coating film SF. For example, the control device 18 may set the shape of the image plane to a predetermined shape according to the shape of the surface of the coating film SF.

[0156] When setting the state of the image plane, the control device 18 may set the state of the image plane so that the image plane coincides with the surface of the coating film SF, as shown in Fig. 31(a) to Fig. 31(d). Fig. 31(a) is a cross-sectional view showing an image plane set to coincide with the surface of the coating film SF when the surface of the coating film SF is flat. Fig. 31(b) is a cross-sectional view showing an image plane set to coincide with the surface of the coating film SF when the surface of the coating film SF is curved. As shown in Fig. 31(b), when the surface of the coating film SF is curved (i.e., curved), the state of the image plane is set so that the image plane to be set is also curved (i.e., curved). Fig. 31(c) is a cross-sectional view showing an image plane set to coincide with the surface of the coating film SF when the surface of the coating film SF has irregularities. As shown in Fig. 31(c), depending on the shape of the surface of the coating film SF, it may be difficult to make a single image plane coincide with the surface of the coating film SF. In this case, the surface of the coating film SF may be divided into a plurality of divided regions (three divided regions #1 to #3 in the example shown in FIG. 31(c)), and the state of the image plane (particularly, at least one of the size and the position) may be set so that an image plane that coincides with the surface of each divided region (three image planes #1 to #3 in the example shown in FIG. 31(c)) is obtained. Furthermore, in this case, the processing light EL is irradiated to the plurality of divided regions in sequence. That is, the processing device 1b irradiates the processing light EL with the image plane of the optical system 112 set to the image plane #1 to process the divided region #1, then irradiates the processing light EL with the image plane of the optical system 112 set to the image plane #2 to process the divided region #2, and then irradiates the processing light EL with the image plane of the optical system 112 set to the image plane #3 to process the divided region #3. FIG. 31(d) is a cross-sectional view showing an image plane set to coincide with the surface of the coating film SF when the surface of the coating film SF is inclined with respect to the optical axis AX of the optical system 112. As shown in FIG. 31(d), when the surface of the coating film SF is inclined, the state of the image plane is set so that the set image plane is also inclined.

[0157] In the third specific example, the optical system 112 that guides the processing light EL to the coating film SF includes an optical element for adjusting the state of the image plane (hereinafter, this optical element is referred to as an "image plane adjustment element"). The control device 18 controls the image plane adjustment element so that the image plane on which the processing light EL is actually formed becomes the set image plane. Alternatively, the control device 18 may control at least one of the relative position and attitude of the light irradiation device 11 with respect to the coating film SF so that the image plane on which the processing light EL is actually formed becomes the set image plane. As a result, the image plane on which the processing light EL is formed coincides with the surface of the coating film SF. Therefore, the coating film SF is appropriately processed by the multiple processing lights EL. Note that, for example, among the optical members that constitute the optical system 112, a movable or deformable optical member may be used as the image plane adjustment element. For example, a pair of wedge prisms that can rotate around the optical axis may be provided, and the apex angle of the entire pair of wedge prisms may be changed to tilt the image plane. As an image plane adjustment element, at least one of the optical members constituting the optical system 112 may be decentered with respect to the optical axis or tilted with respect to the optical axis to tilt the image plane. As an image plane adjustment element, a pair of cylindrical lenses rotatable around the optical axis may be provided, and the degree of field curvature may be adjusted by changing the relative angle between them around the optical axis. As an image plane adjustment element, a deformable optical member may be provided, and the degree of field curvature of the optical system 112 may be adjusted by deformation of this optical member. When the processing light EL is a single processing light, the focus lens 1121 may be used as the image plane adjustment element.

[0158] According to the third specific example of the advance measurement control operation, the processing apparatus 1b can obtain the same effects as those obtainable by the first specific example of the advance measurement control operation described above.

[0159] (4-2-4) Fourth specific example of pre-measurement control operation The fourth specific example of the advance measurement control operation differs from the first specific example of the advance measurement control operation described above in that the control device 18 sets a non-processing area on the surface of the coating film SF where the coating film SF should not be processed by irradiating the processing light EL based on the shape of the surface of the coating film SF. Furthermore, the fourth specific example of the advance measurement control operation differs from the first specific example of the advance measurement control operation described above in that the control device 18 controls the light irradiation device 11 so as not to irradiate the processing light EL onto the non-processing area. Other features of the fourth specific example of the advance measurement control operation may be the same as those of the first specific example of the advance measurement control operation.

[0160] The control device 18 sets, as the non-machining area, an area on the surface of the coating film SF where a structure of a size equal to or larger than the allowable size exists, as shown in FIG. 32(a). Specifically, for example, the control device 18 sets, as the non-machining area, an area on the surface of the coating film SF where a convex structure that protrudes from the surroundings and where a protrusion amount T1 from the surroundings is greater than a predetermined protrusion threshold value corresponding to the allowable size (e.g., several millimeters, several centimeters, etc.) exists. For example, in addition to or instead of an area where a convex structure exists, the control device 18 sets, as the non-machining area, an area on the surface of the coating film SF where a concave structure that is recessed from the surroundings and where a recess amount T2 from the surroundings is greater than a predetermined recess threshold value corresponding to the allowable size (e.g., several millimeters, several centimeters, etc.) exists. Such a convex structure or concave structure typically exists in a portion where the processing object S itself protrudes or recesses, as shown in FIG. 32(a).

[0161] As described above, an example of the processing target S is the fuselage of the aircraft PL. In this case, the structure that is equal to or larger than the allowable size includes, for example, an operational structure formed on the surface of the fuselage for the operation of the aircraft PL. An example of the operational structure is an antenna structure related to an antenna. The antenna structure includes, for example, at least one of the antenna itself and an accessory installed in association with the antenna. An example of the antenna includes at least one of an ELT (Emergency Locator Transmitter) antenna, a VHF (Very High Frequency) antenna, an ADF (Automatic Direction Finder) antenna, an ATC (Air Traffic Control) transponder antenna, a TCAS (Traffic alert and Collision Avoidance System) antenna, and a weather radar antenna. An example of the operational structure is a sensor structure related to a sensor. The sensor structure includes, for example, at least one of the sensor itself and an accessory installed in association with the sensor. An example of the sensor includes at least one of an ice detection sensor, a pitot tube, an AOA (Angle Of Attack) sensor, and an altitude sensor. An example of an operational structure is a flow structure related to the inflow and outflow of a fluid (typically, gas). An example of a flow structure is at least one of an inlet (e.g., at least one of an air intake and a cooling port) through which a fluid flows in, and an outlet (e.g., at least one of a drain outlet and an exhaust port) through which the fluid flows out. Other examples of operational structures include at least one of a window, a wiper, and a storage door for a surveillance camera.

[0162] After the non-processing area is set, the control device 18 controls the light irradiation device 11 so that the multiple processing lights EL scan the surface of the coating film SF. During this time, as shown in Fig. 32(a) and Fig. 32(b), the control device 18 controls the light irradiation device 11 so that the processing light EL is not irradiated to the non-processing area. In other words, when a certain irradiation area EA overlaps with the non-processing area, the control device 18 may turn off the processing light EL irradiated to the certain irradiation area EA. The turning off of the processing light EL can be realized by, for example, at least one of turning off the light source 1111 and inserting a light shielding member into the optical path of the processing light EL. On the other hand, the control device 18 controls the light irradiation device 11 so that the processing light EL is irradiated to areas not set as the non-processing area. In addition, when there is a single processing light EL, the control may be performed so that the scanning range of the processing light EL is limited to the processing area other than the non-processing area.

[0163] According to the fourth specific example of such advance measurement control operation, the processing device 1b can obtain the same effect as that obtainable by the processing device 1 described above. Furthermore, in the fourth specific example, the processing device 1b does not irradiate the processing light EL to a portion of the coating film SF that should not be processed. Therefore, the processing device 1b can process the coating film SF while preventing the adverse effects of the irradiation of the processing light EL from reaching any structure such as an operational structure.

[0164] In the above description, the area on the surface of the coating film SF where a structure larger than the allowable size exists is set as the non-processing area. However, in some cases, it may be desired to form a riblet structure in an area where a structure larger than the allowable size exists. For example, although the above-mentioned operational structure does not exist, an area where a structure larger than the allowable size exists on the surface of the coating film SF may occur due to at least one of the distortion of the processing target S and the uneven thickness of the coating film SF. In this case, the area where a structure larger than the allowable size exists may be an area where a riblet structure should be formed because it is not an area where an operational structure exists. Therefore, the control device 18 may irradiate the processing light EL to the desired processing area without setting the area where a structure larger than the allowable size exists but where a riblet structure is desired to be formed (hereinafter, for convenience, this area will be referred to as the "desired processing area") as a non-processing area. Alternatively, the control device 18 may once set the desired processing area as a non-processing area, and then irradiate the desired processing area with the processing light EL before or after irradiating the area other than the desired processing area on the surface of the coating film SF with the processing light EL. However, the area where structures larger than the allowable size exist corresponds to a protruding area compared to an area where structures larger than the allowable size exist (i.e., an area where unevenness shown in FIG. 26(c) exists). Therefore, in order to irradiate the processing light EL to an area where structures larger than the allowable size exist, the control device 18 may adjust the focusing positions FP of the multiple processing lights EL (see the first specific example described above), or may control the drive system 12 to move the light irradiation device 11 along the Z axis (see the first specific example described above), or may adjust the focal depth of the optical system 112 (see the second specific example described above).

[0165] Furthermore, the control device 18 may set, as the non-processing region, a region where a riblet structure has already been formed (i.e., where a concave structure CP1 and / or a convex structure CP2 has been formed) in addition to or instead of a region where a structure of a permissible size or larger exists on the surface of the coating film SF. In this case, the already formed riblet structure is not processed so that its characteristics are deteriorated (for example, its shape becomes undesirable) by irradiation with the processing light EL again.

[0166] Furthermore, the control device 18 may control the light irradiation device 11 so that the irradiation area EA does not overlap the non-processing area (i.e., the irradiation area EA moves to avoid the non-processing area on the surface of the coating film SF). For example, the control device 18 may control the drive system 12 to move the light irradiation device 11 relative to the coating film SF while the light irradiation device 11 is irradiating the processing light EL so that the irradiation area EA does not overlap the non-processing area. Even in this case, the processing device 1b does not irradiate the processing light EL to parts of the coating film SF that should not be processed, so that the coating film SF can be processed while preventing the adverse effects of the irradiation of the processing light EL from extending to some structure such as an operational structure.

[0167] (4-2-5) Fifth specific example of pre-measurement control operation In the fifth specific example, the surface characteristic measuring device 19b measures the reflectance R of the coating film SF with respect to the processing light EL as a surface characteristic of the coating film SF. To measure the reflectance R, the light projecting device 191b of the surface characteristic measuring device 19b irradiates the coating film SF with the measurement light MLb (hereinafter, the measurement light MLb used in the fifth specific example is referred to as the "measurement light MLb2"). The measurement light MLb2 is light having the same wavelength as the wavelength of the processing light EL. Alternatively, the measurement light MLb2 may be light including a light component having the same wavelength as the wavelength of the processing light EL. In this case, if the intensity of the measurement light MLb2 is equal to or greater than the intensity capable of evaporating the coating film SF, the coating film SF may be evaporated by the irradiation of the measurement light MLb2. For this reason, the light projecting device 191b irradiates the measurement light MLb2 having an intensity less than the intensity capable of evaporating the coating film SF. In other words, the light projecting device 191b irradiates the measurement light MLb having an intensity so low that it cannot evaporate the coating film SF.

[0168] The detection device 192b of the surface characteristic measuring device 19b measures the reflected light (particularly, its intensity) of the measurement light MLb2 from the coating film SF. Because the measurement light MLb2 is light with the same wavelength as the processing light EL, the intensity of the reflected light of the measurement light MLb2 increases as the reflectance R of the coating film SF with respect to the processing light EL increases. Therefore, the measurement result of the reflected light (i.e., the output of the surface characteristic measuring device 19b) contains information regarding the reflectance R. Therefore, the control device 18 can identify the reflectance R based on the measurement result of the surface characteristic measuring device 19b.

[0169] In the fifth specific example, the control device 18 sets the intensities of the multiple processing lights EL based on the reflectance R. Specifically, as shown in Fig. 33(a), the control device 18 sets the intensities of the multiple processing lights EL such that the intensity of the multiple processing lights EL increases as the reflectance R increases. After setting the intensities of the multiple processing lights EL in this manner, the control device 18 controls the light irradiation device 11 to irradiate the multiple processing lights EL having the set intensities. Note that the relationship between the reflectance R and the intensity of the processing light EL is not limited to being linear as shown in Fig. 33(a), and may be nonlinear, for example, as shown in Figs. 33(b) and 33(c).

[0170] According to the fifth specific example of such a pre-measurement control operation, the processing device 1b can obtain the same effect as that obtainable by the processing device 1 described above. Furthermore, in the fifth specific example, the processing device 1b irradiates the coating film SF with processing light EL of a higher intensity as the reflectance R of the coating film SF with respect to the processing light EL increases. Therefore, the processing device 1b can appropriately process the coating film SF without being affected by differences in the reflectance R of the coating film SF. In other words, the processing device 1b can process a coating film SF with a relatively high reflectance R and a coating film SF with a relatively low reflectance R in the same way to form the same riblet structure. The reason for this will be explained below.

[0171] First, as described above, the coating film SF evaporates due to the energy applied from the processing light EL to the coating film SF by irradiation of the processing light EL. For this reason, if the intensity of the processing light EL applied to the coating film SF with a relatively high reflectance R is the same as the intensity of the processing light EL applied to the coating film SF with a relatively low reflectance R, the energy from the processing light EL applied to the coating film SF with a relatively high reflectance R is smaller than the energy from the processing light EL applied to the coating film SF with a relatively low reflectance R. This is because the coating film SF with a relatively high reflectance R reflects more processing light EL than the coating film SF with a relatively low reflectance R, and therefore the proportion of the processing light EL absorbed as energy by the coating film SF is smaller. In other words, the degree to which the coating film SF with a relatively high reflectance R absorbs the processing light EL (i.e., the absorptance of the coating film SF for the processing light EL) is smaller than the degree to which the coating film SF with a relatively low reflectance R absorbs the processing light EL (i.e., the absorptance of the coating film SF for the processing light EL). As a result, there is a possibility that a coating film SF with a relatively high reflectance R and a coating film SF with a relatively low reflectance R will not be processed in the same way. In other words, there is a possibility that the riblet structure formed by processing a coating film SF with a relatively high reflectance R will not be the same as the riblet structure formed by processing a coating film SF with a relatively low reflectance R.

[0172] However, in the fifth concrete example, the intensity of the processing light EL irradiated to the coating film SF with a relatively high reflectance R is greater than the intensity of the processing light EL irradiated to the coating film SF with a relatively low reflectance R, so that the energy applied from the processing light EL to the coating film SF with a relatively high reflectance R and the energy applied from the processing light EL to the coating film SF with a relatively low reflectance R can be equal. In other words, the control device 18 sets the intensities of the multiple processing lights EL based on the reflectance R so that the energy applied from the processing light EL to the coating film SF with a relatively high reflectance R and the energy applied from the processing light EL to the coating film SF with a relatively low reflectance R are equal. As a result, the coating film SF with a relatively high reflectance R and the coating film SF with a relatively low reflectance R are processed in the same way. In other words, the riblet structure formed by processing the coating film SF with a relatively high reflectance R is the same as the riblet structure formed by processing the coating film SF with a relatively low reflectance R. Therefore, the processing device 1b can prevent variation in the formation accuracy of the riblet structure due to differences in the reflectance R of the coating film SF. If high-intensity processing light EL is irradiated onto a coating film SF with a relatively low reflectance R, the processing range of the riblets may exceed the coating film SF and affect the workpiece S. In this example, the intensities of multiple processing lights EL are set based on the reflectance R, so there is little risk of adversely affecting the workpiece S.

[0173] As described above, the relative positions of the multiple irradiation areas EA on the surface of the coating film SF, to which the multiple processing lights EL are respectively irradiated, change with the scanning of the multiple processing lights EL (particularly, the positions in the direction along the surface of the coating film SF). If the relative positions of the multiple irradiation areas EA on the surface of the coating film SF change, the reflectance R of the portion of the surface of the coating film SF where the multiple irradiation areas EA are set may also change while the multiple processing lights EL are being irradiated. For this reason, when the multiple processing lights EL are irradiated to the coating film SF (that is, when the multiple processing lights EL are moving relative to the coating film SF), the control device 18 may set the intensity of the multiple processing lights EL based on the reflectance R of the portion of the surface of the coating film SF where the multiple irradiation areas EA are set, and control the light irradiating device 11 to irradiate the multiple processing lights EL with the set intensity. Depending on the shape of the surface of the coating film SF, if the relative positions of the multiple irradiation areas EA on the surface of the coating film SF change, the incident angle of the processing light EL to the coating film SF may change. Alternatively, even if the relative positions of the multiple irradiation areas EA on the surface of the coating film SF do not change, the angle of incidence of the processing light EL with respect to the coating film SF may change due to some factor. If the angle of incidence of the processing light EL with respect to the coating film SF changes, the reflectance R may change. In this case, the control device 18 may set the intensity of the processing light EL to an appropriate intensity using information on the shape of the surface of the coating film SF that has been measured or that has been prepared in advance.

[0174] In addition, the energy applied from the processing light EL to the coating film SF can vary depending not only on the intensity of the processing light EL but also on the irradiation time of the processing light EL. Specifically, the energy applied from the processing light EL to the coating film SF increases as the irradiation time of the processing light EL becomes longer. The "irradiation time of the processing light EL" here means the time during which the processing light EL is irradiated to the same area on the surface of the coating film SF. For this reason, the control device 18 may set the irradiation times of the processing light EL based on the reflectance R in addition to or instead of the intensities of the processing light EL. Specifically, as shown in Fig. 34(a) to Fig. 34(c), the control device 18 sets the irradiation times of the processing light EL so that the irradiation times of the processing light EL are longer as the reflectance R increases. Note that Fig. 34(a) shows a case where the relationship between the irradiation time of the processing light EL and the reflectance R changes linearly, and Fig. 34(b) and Fig. 34(c) show a case where the relationship between the irradiation time of the processing light EL and the reflectance R changes nonlinearly. After setting the irradiation times of the processing light EL in this way, the control device 18 controls the light irradiation device 11 to irradiate the processing light EL based on the set irradiation times. Specifically, the control device 18 controls the scanning speed of the processing light EL (i.e., the relative movement speed of the multiple irradiation areas EA with respect to the coating film SF) based on the set irradiation times. More specifically, the control device 18 controls the scanning speed of the processing light EL so that the scanning speed of the processing light EL becomes slower as the irradiation time becomes longer. In order to control the scanning speed, the control device 18 may control the rotation frequency or oscillation frequency of the galvanometer mirror 1122. Specifically, the control device 18 may control the rotation frequency or oscillation frequency of the galvanometer mirror 1122 so that the rotation frequency or oscillation frequency of the galvanometer mirror 1122 becomes lower as the irradiation time becomes longer. As a result, the scanning speed of the processing light EL becomes slower as the irradiation time becomes longer. Even when the irradiation time of the multiple processing lights EL is set based on the reflectance R in this way, it is possible to enjoy the same effect as when the intensity of the multiple processing lights EL is set based on the reflectance R. Note that, depending on the shape of the surface of the coating film SF, if the relative positions of the multiple irradiation areas EA on the surface of the coating film SF change, the incident angle of the processing light EL with respect to the coating film SF may change. Or, even if the relative positions of the multiple irradiation areas EA on the surface of the coating film SF do not change, the incident angle of the processing light EL with respect to the coating film SF may change due to some factor. When the incident angle of the processing light EL with respect to the coating film SF changes, the reflectance R may change.In this case as well, the control device 18 may set the irradiation time of the processing light EL to an appropriate time using information on the shape of the surface of the coating film SF that has been measured or that has been prepared in advance.

[0175] In addition, when the processing apparatus 1b performs at least one of the first to fourth specific examples of the preliminary measurement operation in addition to the fifth specific example of the preliminary measurement operation, the processing apparatus 1b is provided with a surface characteristic measuring device 19b-1 that measures the shape of the surface of the coating film SF, and a surface and structure measuring device 19b-2 that measures the reflectance of the coating film SF. In this case, the surface characteristic measuring devices 19b-1 and 19b-2 irradiate the measurement light beams MLb1 and ML2, respectively, but the light source of the measurement light beams MLb1 and ML2 may be shared. In other words, the surface characteristic measuring devices 19b-1 and 19b-2 may share a single light source that emits the measurement light beam MLb that can be used as the measurement light beams MLb1 and ML2.

[0176] In the above description, the measurement light MLb2 for measuring the reflectance R is light having the same wavelength as the wavelength of the processing light EL (or light containing a light component having the same wavelength as the wavelength of the processing light EL). However, the measurement light MLb2 may be light having a different wavelength from the wavelength of the processing light EL (or light not containing a light component having the same wavelength as the wavelength of the processing light EL). Even in this case, as long as measurement light MLb2 is used that has some correlation between the reflectance of the coating film SF with respect to the measurement light MLb2 and the reflectance R of the coating film SF with respect to the processing light EL, the control device 18 can identify the reflectance R from the measurement results of the surface characteristic measuring device 19b.

[0177] In the above description, the surface characteristic measuring device 19b measures the reflectance R of the coating film SF to the processing light EL. However, the higher the reflectance R of the coating film SF to the processing light EL, the lower the absorptance of the coating film SF to the processing light EL. For this reason, it can be said that the surface characteristic measuring device 19b essentially measures the absorptance of the coating film SF to the processing light EL. In this case, it can be said that the control device 18 essentially sets the intensities of the multiple processing lights EL so that the intensity of the multiple processing lights EL decreases as the absorptance of the coating film SF to the processing light EL increases. Furthermore, it can be said that the control device 18 essentially sets the irradiation times of the multiple processing lights EL so that the irradiation times of the multiple processing lights EL decrease as the absorptance of the coating film SF to the processing light EL increases.

[0178] (4-2-6) Sixth specific example of pre-measurement control operation In the sixth specific example, the surface characteristic measuring device 19b measures the reflectance Ra of the coating film SF for a plurality of measuring lights MLb with different wavelengths (hereinafter, the measuring light MLb used in the sixth specific example is referred to as "measuring light MLb3") as a surface characteristic of the coating film SF. In order to measure the reflectance Ra, the light projecting device 191b of the surface characteristic measuring device 19b irradiates the coating film SF with a plurality of measuring lights MLb3 with different wavelengths. The plurality of measuring lights MLb3 may or may not include light with the same wavelength as the processing light EL. The plurality of measuring lights MLb3 may or may not include light including a light component with the same wavelength as the processing light EL. The intensity of the plurality of measuring lights MLb3 is set to an intensity less than the intensity capable of evaporating the coating film SF, as in the fifth specific example. Furthermore, the detection device 192b of the surface characteristic measuring device 19b further measures the reflected light (particularly, its intensity) of each of the plurality of measuring lights MLb3 from the coating film SF. Therefore, the control device 18 can specify the reflectance Ra of the coating film for each of the multiple measurement light MLb3 based on the measurement results of the surface property measuring device 19b. Note that Fig. 35 is a graph showing an example of the specified multiple reflectances Ra.

[0179] Thereafter, the control device 18 sets the wavelength of one of the plurality of measurement lights MLb3 to the wavelength of the processing light EL. Specifically, the control device 18 sets the wavelength of one measurement light MLb3 having the smallest reflectance Ra among the plurality of measurement lights MLb3 to the wavelength of the processing light EL. That is, the control device 18 sets the wavelength of one measurement light MLb3 having the largest absorptance of the coating film SF among the plurality of measurement lights MLb3 to the wavelength of the processing light EL. In the example shown in FIG. 35, the reflectance Ra corresponding to the measurement light MLb3(#3) among the five measurement lights MLb3 (that is, the measurement light MLb3(#1) to the measurement light MLb3(#5)) is the smallest. Therefore, the control device 18 sets the wavelength of the measurement light MLb3(#3) to the wavelength of the processing light EL.

[0180] Thereafter, the control device 18 controls the light irradiation device 11 so as to irradiate the coating film SF with the processing light EL of the set wavelength. Specifically, the processing device 1b performing the sixth specific example of the preliminary measurement control operation is provided with a light irradiation device 11b-6 having a plurality of light source systems 111 with different wavelengths of the processing light EL emitted, as shown in FIG. 36, instead of the above-mentioned light irradiation device 11. The wavelengths of the processing light EL emitted by each of the plurality of light source systems 111 are the same as the wavelengths of the plurality of measurement lights MLb3. The control device 18 controls one of the plurality of light source systems 111 capable of emitting the processing light EL of the set wavelength so as to emit the plurality of processing light EL of the set wavelength. On the other hand, the control device 18 controls the other light source systems 111 so that the other light source systems 111 other than the one light source system 111 among the plurality of light source systems 111 do not emit the processing light EL. As a result, the light irradiation device 11b-6 can irradiate the coating film SF with the processing light EL having the set wavelength.

[0181] In the above example, the light irradiation device 11b-6 had a plurality of light source systems 111 that each emitted a plurality of processing lights EL having different wavelengths from each other, but instead of or in addition to this, the light irradiation device 11b-6 may be provided with a light source system 111 that includes a wavelength-variable light source that can continuously change the emission wavelength.

[0182] According to the sixth specific example of such a preliminary measurement control operation, the processing device 1b can obtain the same effect as that obtainable by the processing device 1 described above. Furthermore, in the sixth specific example, the processing device 1b can irradiate the coating film SF with processing light EL having the same wavelength as one of the measurement lights MLb3 having the smallest reflectance Ra of the coating film SF among the multiple measurement lights MLb3. Therefore, the processing device 1b can irradiate the coating film SF with processing light EL having a relatively small reflectance R of the coating film (i.e., a relatively large absorptance of the coating film SF). Therefore, the processing device 1b can appropriately process the coating film SF without being affected by differences in the characteristics of the coating film SF.

[0183] As described in the fifth specific example, the reflectance Ra of the portion of the surface of the coating film SF where the irradiation areas EA are set may also change while the multiple processing lights EL are being irradiated. Therefore, when the multiple processing lights EL are irradiated to the coating film SF (that is, when the multiple processing lights EL are moving relative to the coating film SF), the control device 18 may set the wavelength of the processing light EL based on the reflectance Ra of the portion of the surface of the coating film SF where the multiple irradiation areas EA are set, and control the light irradiation device 11 to irradiate the multiple processing lights EL of the set wavelength. As described in the fifth specific example, when the incident angle of the processing light EL to the coating film SF changes, the reflectance R may change. In this case, the control device 18 may set the wavelength of the processing light EL to an appropriate wavelength using information on the shape of the surface of the coating film SF that has been measured or that has been prepared in advance.

[0184] Furthermore, the control device 18 may set the wavelength of one of the multiple measurement lights MLb3, the wavelength of which is equal to or lower than a predetermined reflection threshold (i.e., the absorptance of the coating film SF is equal to or higher than a predetermined absorption threshold), as the wavelength of the processing light EL. The reflection threshold is set so as to satisfy the condition that the coating film SF can be evaporated by the processing light EL even if a part of the processing light EL irradiated to the coating film SF is reflected by the coating film SF, the reflectance R of which is equal to or higher than the reflection threshold. The absorption threshold is also set from the same viewpoint. Even in this case, the processing device 1b can appropriately process the coating film SF without being affected by differences in the characteristics of the coating film SF.

[0185] (4-2-7) Seventh specific example of pre-measurement control operation The seventh specific example of the advance measurement control operation differs from the first specific example of the advance measurement control operation described above in that the control device 18 controls the relative positional relationship between the coating film SF and the multiple irradiation areas EA based on the shape of the surface of the coating film SF. Other features of the seventh specific example of the advance measurement control operation may be the same as those of the first specific example of the advance measurement control operation.

[0186] Specifically, in the seventh specific example, in the case where the light irradiation device 11 moves relative to the coating film SF (furthermore, the surface characteristic measuring device 19b, whose relative position with respect to the light irradiation device 11 is fixed, also moves relative to the coating film SF), the surface characteristic measuring device 19b measures the shape of the surface of the coating film SF before the light irradiation device 11 moves, and measures the shape of the surface of the coating film SF after the light irradiation device 11 moves (or while the light irradiation device 11 moves, the same applies below). At this time, as shown in FIG. 37, the surface characteristic measuring device 19b measures the shape of the surface of the coating film SF so that a region 31b on the surface of the coating film SF that was the measurement target by the surface characteristic measuring device 19b before the light irradiation device 11 moves and a region 32b on the surface of the coating film SF that was the measurement target by the surface characteristic measuring device 19b after the light irradiation device 11 moves partially overlap. In other words, the surface characteristic measuring device 19b performs measurement in accordance with the movement of the light irradiation device 11 so as to measure the shape of the surface of the overlapping region 33b included in both the regions 31b and 32b. As a result, the measurement results of the region 31b and the measurement results of the region 32b both include the measurement results of the overlap region 33b that is included in both the region 31b and the region 32b.

[0187] The control device 18 identifies how the overlapping region 33b has moved based on the measurement results of the region 31b and the measurement results of the region 32b. Specifically, the control device 18 identifies a specific region in the region 31b whose surface shape is a uniquely distinguishable shape from the measurement results of the region 31b. Furthermore, the control device 18 determines whether or not a specific region exists in the region 32b from the measurement results of the region 32b by pattern matching using the surface shape of the specific region as a template. If a specific region does not exist in the region 32b, the control device 18 identifies a new specific region in the region 31b and determines whether the new specific region exists in the region 32b. If a specific region exists in the region 32b, the specific region corresponds to the overlapping region 33b. The control device 18 compares the position of the overlapping region 33b in the region 31b with the position of the overlapping region 33b in the region 32b to determine how the relative position of the surface characteristic measuring device 19b with respect to the overlapping region 33b has changed with the movement of the light irradiation device 11. Specifically, the control device 18 determines how much the surface characteristic measuring device 19b has moved along the X-axis direction and the Y-axis direction with respect to the overlapping region 33b. The light irradiation device 11 may irradiate the processing light EL onto the surface of the coating film SF so as to form a specific region in the region 31b whose surface shape is some shape that can be uniquely distinguished. For example, the riblet structure may be processed so that a part of a convex structure or a concave structure that extends linearly along a predetermined direction is cut out, or the riblet structure may have a cross-sectional shape that differs in the extension direction of the riblets, as shown in Figures 58 and 59 described later.

[0188] The relative movement amount of the surface characteristic measuring device 19b with respect to the overlapping region 33b is the same as the relative movement amount of the light irradiation device 11 with respect to the coating film SF. The relative movement direction of the surface characteristic measuring device 19b with respect to the overlapping region 33b is the same as the relative movement direction of the light irradiation device 11 with respect to the coating film SF. Therefore, the control device 18 can identify how much the light irradiation device 11 has moved along each of the X-axis direction and the Y-axis direction with respect to the coating film SF. In other words, the control device 18 can identify the relative position of the light irradiation device 11 with respect to the coating film SF by identifying the relative position of the surface characteristic measuring device 19b with respect to the overlapping region 33b.

[0189] Since the light irradiation device 11 irradiates the coating film SF with the processing light EL, the determination of the relative position of the light irradiation device 11 with respect to the coating film SF is substantially equivalent to the determination of the relative positions of the multiple irradiation areas EA with respect to the coating film SF. Therefore, the control device 18 can determine the relative positions of the multiple irradiation areas EA with respect to the coating film SF (particularly, the positions along the X-axis direction and the Y-axis direction) based on the surface shape of the coating film SF. Thereafter, when the positions of the multiple irradiation areas EA that have been determined are deviated from the positions of the multiple irradiation areas EA required to form a riblet structure (or a structure to be formed by processing the coating film SF), the control device 18 controls the light irradiation device 11 so that the multiple irradiation areas EA move relative to the coating film SF. That is, the control device 18 controls the relative positional relationship between the coating film SF and the multiple irradiation areas EA. For example, the control device 18 may move the multiple irradiation areas EA relative to the coating film SF by controlling the drive system 12 to move the light irradiation device 11 with respect to the coating film SF.

[0190] According to the seventh specific example of such a pre-measurement control operation, the processing device 1b can obtain the same effects as those obtainable by the above-mentioned processing device 1. Furthermore, in the seventh specific example, the processing device 1b can appropriately adjust the relative positions of the multiple irradiation areas EA on the surface of the coating film SF, and therefore can form the riblet structure more appropriately (e.g., with even greater accuracy).

[0191] (4-2-8) Other examples of pre-measurement control operations In the above description, the processing device 1b includes the surface characteristic measuring device 19b. However, the processing device 1b does not have to include the surface characteristic measuring device 19b. In this case, as long as the control device 18 can acquire information about the surface of the coating film SF, the processing device 1b can perform the above-mentioned preliminary measurement control operation. For example, the shape of the surface of the coating film SF can be estimated from design data such as a three-dimensional model of the workpiece S. For this reason, the control device 18 may acquire design data of the workpiece S, estimate the shape of the surface of the coating film SF from the design data, and perform the first to fourth specific examples of the above-mentioned preliminary measurement control operation based on the estimated shape of the surface of the coating film SF. Alternatively, the control device 18 may acquire data in which information about the processing area and the non-processing area is added to the design data in advance. Alternatively, for example, the reflectance R of the coating film SF can be estimated from the specifications of the coating film SF. For this reason, the control device 18 may acquire information about the specifications of the coating film SF, estimate the reflectance R of the coating film SF from the information about the specifications, and perform the fifth to sixth specific examples of the above-mentioned preliminary measurement control operation based on the estimated reflectance R. Alternatively, the control device 18 may acquire data in which paint reflectance information (generally color information) has been added to the design data in advance. As a result, measurement by the surface characteristic measuring device 19b is not required, and the time required for processing the coating film SF can be shortened. Note that the operation performed in this case does not need to be called a pre-measurement control operation, since it does not require measurement by the surface characteristic measuring device 19b. Note that the non-processing area may be masked with masking tape or the like.

[0192] In the above description, the control device 18 controls at least one of the focusing position FP of the processing light EL, the intensity distribution of the processing light EL, the shape of the processing light EL, and the focal depth of the optical system 112 based on the shape of the surface of the coating film SF. The control device 18 controls at least one of the intensities of the multiple processing lights EL, the irradiation times of the multiple processing lights EL, and the wavelengths of the multiple processing lights EL based on the reflectance of the coating film SF. However, the control device 18 may control any characteristic of the processing light EL based on any characteristic of the coating film SF so that the coating film SF can be processed by irradiating the multiple processing lights EL. Examples of any characteristic of the processing light EL include at least one of the shapes of the multiple irradiation areas EA, the sizes of the multiple irradiation areas EA, the positions of the multiple irradiation areas EA, the relative positions between the multiple processing lights EL, the relative angles between the multiple processing lights EL, the polarization states of the multiple processing lights EL, the intensities of the multiple processing lights EL, the irradiation times of the multiple processing lights EL, and the wavelengths of the multiple processing lights EL.

[0193] In the above description, the surface characteristic measuring device 19b measures the characteristics of the surface of the coating film SF before the light irradiation device 11 irradiates the surface of the coating film SF with a plurality of processing lights EL. That is, during the period during which the surface characteristic measuring device 19b measures the characteristics of the surface of the coating film SF, the light irradiation device 11 does not irradiate the plurality of processing lights EL, and during the period during which the light irradiation device 11 irradiates the surface of the coating film SF with a plurality of processing lights EL, the surface characteristic measuring device 19b does not measure the characteristics of the surface of the coating film SF. However, the surface characteristic measuring device 19b may measure the characteristics of the surface of the coating film SF during at least a part of the period during which the light irradiation device 11 irradiates the surface of the coating film SF with a plurality of processing lights EL. The light irradiation device 11 may irradiate the surface of the coating film SF with a plurality of processing lights EL during at least a part of the period during which the surface characteristic measuring device 19b measures the characteristics of the surface of the coating film SF. That is, the surface characteristic measuring device 19b may measure the characteristics of the surface of the coating film SF and the light irradiation device 11 may irradiate the coating film SF with a plurality of processing lights EL (that is, the coating film SF processing operation) in parallel. For example, the surface characteristic measuring device 19b may measure the characteristics of another region different from the one region of the coating film SF during at least a part of the period during which the light irradiation device 11 irradiates the one region of the coating film SF whose characteristics have already been measured by the surface characteristic measuring device 19b with a plurality of processing lights EL. For example, the light irradiation device 11 may irradiate the one region of the coating film SF whose characteristics have already been measured by the surface characteristic measuring device 19b with a plurality of processing lights EL during at least a part of the period during which the surface characteristic measuring device 19b measures the characteristics of the other region of the coating film SF. In this case, an improvement in the throughput regarding the formation of the riblet structure can be expected.

[0194] (4-3) Third Modification Next, a processing apparatus 1c of a third modified example will be described with reference to Fig. 38. As shown in Fig. 38, the processing apparatus 1c of the third modified example is different from the processing apparatus 1 described above in that it further includes a structure measuring device 19c. Other features of the processing apparatus 1c may be the same as other features of the processing apparatus 1.

[0195] The structure measuring device 19c measures the characteristics of the riblet structure (or any other structure, the same applies below in this modified example) formed by irradiation with the processing light EL from the light irradiation device 11. Examples of the characteristics of the riblet structure include at least one of the presence or absence of the riblet structure, the shape of the riblet structure (for example, at least one of the cross-sectional shape of the concave structure CP1 and the cross-sectional shape of the concave structure CP1), the size of the riblet structure (for example, at least one of the depth D of the concave structure CP1, the width of the concave structure CP1, the arrangement pitch P1 of the concave structure CP1, the height H of the convex structure CP2, the width of the convex structure CP2, and the arrangement pitch P2 of the convex structure CP2), and the position of the riblet structure (for example, the position of at least one of the concave structure CP1 and the convex structure CP2).

[0196] In order to measure the characteristics of the riblet structure, the structure measuring device 19c includes a light projecting device 191c and a detection device 192c. The light projecting device 191c and the detection device 192c are supported by the accommodation device 13 via the support member 136c. The light projecting device 191c irradiates the riblet structure (i.e., the coating film SF) with measurement light MLc1. When the measurement light MLc1 is irradiated onto the riblet structure, the measurement light MLc1 is reflected or scattered by the riblet structure. As a result, measurement light MLc2 including at least one of the reflected light and scattered light of the measurement light MLc1 is emitted from the riblet structure. The detection device 192c detects this measurement light MLc2.

[0197] When the measurement light MLc1 is irradiated to a portion where the riblet structure is formed, the measurement light MLc2 includes at least one of reflected light and scattered light propagating in a traveling direction intersecting the traveling direction of the measurement light MLc1. On the other hand, when the measurement light MLc1 is irradiated to a portion where the riblet structure is not formed, the measurement light MLc2 does not include at least one of reflected light and scattered light propagating in a traveling direction intersecting the traveling direction of the measurement light MLc1. In other words, the traveling direction of the measurement light MLc2 is approximately parallel to the traveling direction of the measurement light MLc1. Therefore, as shown in FIG. 39, when the light projecting device 191c and the detection device 192c are arranged to detect the measurement light MLc2 traveling in a direction intersecting the traveling direction of the measurement light MLc1, the control device 18 can determine the presence or absence of the riblet structure in the portion where the measurement light MLc1 is irradiated based on the detection result of the detection device 192c. Furthermore, the characteristics (e.g., intensity, etc.) of the measurement light MLc2 vary depending on at least one of the shape and size of the riblet structure. Therefore, based on the detection results of the detection device 192c, the control device 18 can identify at least one of the shape of the riblet structure, the size of the riblet structure, the position of the concave structure CP1 that constitutes the riblet structure, and the position of the convex structure CP2 that constitutes the riblet structure.

[0198] The structure measuring device 19c is further configured to be able to change the traveling direction of the measurement light MLc1. For example, if the light projecting device 191c has an optical element that optically changes the traveling direction of the measurement light MLc1, the traveling direction of the measurement light MLc1 may be changed by the optical element. For example, if the light projecting device 191c is movable relative to the coating film SF, the traveling direction of the measurement light MLc1 may be changed by the relative movement of the light projecting device 191c. Here, if the measurement light MLc1 can be irradiated onto the riblet structure only from one direction, depending on the extension direction of the riblet structure, even if the measurement light MLc1 is irradiated onto the riblet structure, there is a possibility that the measurement light MLc2 will not be generated. However, if the traveling direction of the measurement light MLc1 can be changed, the light projecting device 191c can irradiate the measurement light MLc1 from various directions onto the riblet structure extending in a certain direction. Therefore, the structure measuring device 19c can measure the characteristics of the riblet structure without being affected by differences in the extension direction of the riblet structure. In order to change the traveling direction of the measuring light MLc1, the structure measuring device 19c itself may be rotated around the Z axis. Also, a plurality of structure measuring devices 19c may be provided in which the traveling directions of the measuring light MLc1 are different from each other.

[0199] In addition to or instead of changing the traveling direction of the measurement light MLc1, the structure measuring device 19c may be configured to change the traveling direction of the measurement light MLc2 that the detector 192c can detect. For example, if the detector 192c is movable relative to the coating film SF, the traveling direction of the measurement light MLc2 that the detector 192c can detect may be changed by the relative movement of the detector 192c. Here, if the detector 192c can detect only the measurement light MLc2 traveling in one direction, depending on the extension direction of the riblet structure, the measurement light MLc2 may not travel toward the detector 192c, and the detector 192c may not be able to detect the measurement light MLc2. However, if the traveling direction of the measurement light MLc2 that the detector 192c can detect is changeable, the detector 192c can detect the measurement light MLc2 traveling in various directions from the riblet structure extending in a certain direction. Therefore, the structure measurement device 19c can measure the characteristics of the riblet structure without being affected by differences in the extension direction of the riblet structure.

[0200] The structure measuring device 19c may measure the characteristics of all riblet structures formed by the processing device 1c. However, if the characteristics of all riblet structures formed by the processing device 1c are measured, the time required to measure the characteristics of the riblet structures becomes enormous. For this reason, in the third modified example, as shown in FIG. 40, the structure measuring device 19c selectively measures the characteristics of the riblet structures formed in the sample area DAc corresponding to a part of the processed area in which the processing device 1c formed the riblet structures. The structure measuring device 19c selectively measures the characteristics of the riblet structures formed in multiple sample areas DAc distributed evenly in the processed area. However, the structure measuring device 19c may selectively measure the characteristics of the riblet structures formed in multiple (or one) sample areas DAc distributed randomly in the processed area.

[0201] After the processing device 1c forms a riblet structure in a certain area where the riblet structure is to be formed, the structure measuring device 19c may selectively measure the characteristics of the riblet structure formed in a sample area DAc in the certain area. For example, after the processing device 1c forms a riblet structure in a certain unit processing area SA, the structure measuring device 19c may set a sample area DAc in the unit processing area SA and selectively measure the characteristics of the riblet structure formed in the set sample area DAc. If the processing device 1c then forms a riblet structure in another unit processing area SA, the structure measuring device 19c may set a sample area DAc in the other unit processing area SA and selectively measure the characteristics of the riblet structure formed in the set sample area DAc. In other words, the formation of the riblet structure by the processing device 1c and the measurement of the characteristics of the riblet structure by the structure measuring device 19c may be alternately repeated.

[0202] Alternatively, the structure measuring device 19c may measure the characteristics of a riblet structure already formed by the processing device 1c in another area different from the one area during at least a part of the period during which the processing device 1c irradiates a plurality of processing lights EL to a certain area on the surface of the coating film SF (i.e., forms a riblet structure in the one area). For example, the structure measuring device 19c may selectively measure the characteristics of a riblet structure formed in a sample area DAc in another unit processing area SA different from the one unit processing area SA and in which the processing device 1c has already formed a riblet structure during at least a part of the period during which the processing device 1c forms a riblet structure in the certain unit processing area SA. In other words, the formation of the riblet structure by the processing device 1c and the measurement of the characteristics of the riblet structure by the structure measuring device 19c may be performed in parallel. In this case, an improvement in throughput can be expected.

[0203] When the measurement by the structure measuring device 19c is completed, the measurement results by the structure measuring device 19c are output to the control device 18. As described above, the control device 18 identifies the characteristics of the riblet structure based on the measurement results by the structure measuring device 19c. The control device 18 judges whether the characteristics of the riblet structure are good or bad based on the identified characteristics of the riblet structure. Furthermore, the control device 18 notifies the operator of the processing device 1c of the result of the pass / fail judgment of the characteristics of the riblet structure via an output device including at least one of a display, a speaker, etc.

[0204] For example, the control device 18 may determine whether the size of the riblet structure in the direction intersecting the surface of the coating film SF (i.e., the depth D of the concave structure CP1 or the height H of the convex structure CP2) is good or bad. FIG. 41(a) is a cross-sectional view showing an ideal riblet structure to be formed by the processing device 1c. When the size of the identified riblet structure becomes the same as the size of the ideal riblet structure as shown in FIG. 41(b), the control device 18 determines that the size of the riblet structure is normal (i.e., the riblet structure is a good product). In this case, the control device 18 notifies that the size of the riblet structure is normal. On the other hand, when the size of the identified riblet structure becomes smaller than the size of the ideal riblet structure as shown in FIG. 41(c), the control device 18 determines that the size of the riblet structure is abnormal (i.e., the riblet structure is defective). In this case, the control device 18 notifies that the size of the riblet structure is abnormal (in particular, that the size is small). On the other hand, if the size of the identified riblet structure is larger than the size of an ideal riblet structure as shown in Fig. 41(d), the control device 18 judges that the size of the riblet structure is abnormal (i.e., the riblet structure is defective). In this case, the control device 18 notifies that the size of the riblet structure is abnormal (especially that the size is large).

[0205] For example, the control device 18 may determine whether the shape of the riblet structure is good or bad. When the shape of the identified riblet structure is the same as the shape of an ideal riblet structure as shown in FIG. 42(a), the control device 18 determines that the shape of the riblet structure is normal (i.e., the riblet structure is a good product). In this case, the control device 18 notifies that the shape of the riblet structure is normal. On the other hand, when the shape of the identified riblet structure is different from the shape of the ideal riblet structure as shown in FIG. 42(b), the control device 18 determines that the shape of the riblet structure is abnormal (i.e., the riblet structure is a defective product). In this case, the control device 18 notifies that the shape of the riblet structure is abnormal.

[0206] For example, the control device 18 may determine whether the position of the concave structure CP1 (and further, the convex structure CP2, the same below) constituting the riblet structure is good or bad. When the position of the identified concave structure CP1 becomes the same as the position of the concave structure CP1 constituting the ideal riblet structure as shown in the upper part of FIG. 43, the control device 18 determines that the position of the concave structure CP1 constituting the riblet structure is normal (i.e., the riblet structure is a good product). In this case, the control device 18 notifies that the position of the concave structure CP1 constituting the riblet structure is normal. On the other hand, when the position of the identified concave structure CP1 differs from the position of the concave structure CP1 constituting the ideal riblet structure as shown in the lower part of FIG. 43, the control device 18 determines that the position of the concave structure CP1 constituting the riblet structure is abnormal (i.e., the riblet structure is a defective product). In this case, the control device 18 notifies that the position of the concave structure CP1 constituting the riblet structure is abnormal.

[0207] For example, the control device 18 may determine whether a riblet structure is present or not. When a riblet structure is present in the sample area DA, as shown in FIG. 44(a), the control device 18 determines that the riblet structure is formed (i.e., the riblet structure is of good quality). In this case, the control device 18 notifies that the riblet structure is formed. On the other hand, when a riblet structure is not present in the sample area DA, as shown in FIG. 44(b), the control device 18 determines that a riblet structure is not formed (i.e., the riblet structure is defective). In this case, the control device 18 notifies that a riblet structure is not formed.

[0208] When the control device 18 judges that the riblet structure is defective, the control device 18 may control the light irradiation device 11 to correct the already formed riblet structure. Specifically, when the riblet structure is judged to be defective, not only is the riblet structure in the sample area DA in which the defective riblet structure exists defective, but the riblet structure in a wider area on the coating film SF that includes the sample area DA may also be defective. Therefore, the control device 18 controls the light irradiation device 11 to irradiate the processing light EL onto the wider area on the coating film SF that includes the sample area DA (hereinafter, this area will be referred to as the "area to be corrected"), and correct the riblet structure in the correction area. For example, as shown in FIG. 45(a), when the size (here, depth D) of the concave structure CP1 constituting the riblet structure becomes smaller than the size of the concave structure CP1 constituting the ideal riblet structure, the control device 18 may control the light irradiation device 11 to irradiate the concave structure CP1 with the processing light EL to further remove the coating film SF (i.e., to further thin the coating film SP1) so that the concave structure CP1 becomes larger. As a result, as shown in FIG. 45(b), the size of the riblet structure in the correction target area is corrected to match the size of the ideal riblet structure. The processing conditions of the processing device 1c may be changed using the measurement results of the characteristics of the riblet structure by the structure measurement device 19c. For example, when it is measured that the shape, formation position, and size of the riblet structure are about to deviate from the upper and lower limits of a predetermined range (standard), the processing conditions of the processing device 1c may be changed so that the shape, formation position, and size of the riblet structure approach the central value of the standard.

[0209] The processing device 1c of the third modified example can achieve the same effects as those achieved by the above-described processing device 1. Furthermore, the processing device 1c can appropriately evaluate the quality of the riblet structure that is actually formed.

[0210] (4-4) Fourth Modification Next, a processing device 1d of a fourth modified example will be described. The processing device 1d of the fourth modified example can change the arrangement pitch P1 of the concave structures CP1. When the arrangement pitch P1 of the concave structures CP1 changes, the arrangement pitch P2 of the convex structures CP2 also changes. Therefore, it can be said that the processing device 1d can change the arrangement pitch P2 of the convex structures CP2.

[0211] In order to change the arrangement pitch P1, the processing apparatus 1d is provided with a light irradiation apparatus 11d instead of the above-described light irradiation apparatus 11. As shown in FIG. 46, the light irradiation apparatus 11d differs from the light irradiation apparatus 11 in that the light irradiation apparatus 11d is provided with an optical system 112d having a zoom lens 1124d. Other features of the light irradiation apparatus 11d may be the same as other features of the light irradiation apparatus 11. The zoom lens 1124d can change the projection magnification of the optical system 112d under the control of the control apparatus 18. The zoom lens 1124d can change the interval between the multiple processing lights EL to be emitted under the control of the control apparatus 18.

[0212] When the projection magnification of the optical system 112d changes, the relative positional relationship of the multiple irradiation areas EA in the direction along the surface of the coating film SF changes. Specifically, as shown in FIG. 47(a), when the projection magnification of the optical system 112d is a first magnification (i.e., the interval between the multiple processing lights EL emitted is a first interval), the arrangement pitch of the multiple irradiation areas EA is a first pitch Pe1. The arrangement pitch of the multiple irradiation areas EA means the arrangement pitch along the direction in which the multiple irradiation areas EA move on the surface of the coating film EA during the step operation (the X-axis direction in the example shown in FIG. 47(a)). On the other hand, as shown in FIG. 47(b), when the projection magnification of the optical system 112d is a second magnification larger than the first magnification (i.e., the interval between the multiple processing lights EL emitted is a second interval larger than the first interval), the arrangement pitch of the multiple irradiation areas EA is a second pitch Pe2 larger than the first pitch Pe1. In other words, the control device 18 can change the relative positional relationship of the multiple irradiation areas EA in the direction along the surface of the coating film SF (in particular, the arrangement pitch of the multiple irradiation areas EA) by changing the projection magnification of the optical system 112d.

[0213] When the arrangement pitch of the multiple irradiation areas EA changes, the arrangement pitch P1 of the multiple concave structures CP1 formed by the multiple processing light EL irradiated to the multiple irradiation areas EA, respectively, also changes. Specifically, as shown in FIG. 47(c), the arrangement pitch P1 of the multiple concave structures CP1 formed by the processing light EL irradiated to the multiple irradiation areas EA with the arrangement pitch being the first pitch Pe1 is the first pitch Pp1 corresponding to the first pitch Pe1. On the other hand, as shown in FIG. 47(d), the arrangement pitch P1 of the multiple concave structures CP1 formed by the processing light EL irradiated to the multiple irradiation areas EA with the arrangement pitch being the second pitch Pe2 is the second pitch Pp2 corresponding to the second pitch Pe2. Since the second pitch Pe2 is larger than the first pitch Pe1, the second pitch Pp2 is also larger than the first pitch Pp1.

[0214] Since the light irradiation device 11d irradiates multiple parallel processing light beams EL, when the arrangement pitch of the multiple irradiation areas EA changes, the relative positional relationship of the multiple processing light beams EL changes. That is, as shown in Fig. 47(c) and Fig. 47(d), the relative positional relationship of the multiple processing light beams EL changes so that the larger the arrangement pitch of the multiple irradiation areas EA, the larger the interval between the multiple processing light beams EL (particularly, the interval in the direction along the surface of the coating film SF). Therefore, controlling the arrangement pitch of the multiple irradiation areas EA is equivalent to controlling the relative positional relationship of the multiple processing light beams EL. Therefore, it can be said that the control device 18 essentially changes the arrangement pitch of the concave structure CP1 by changing the relative positional relationship of the multiple processing light beams EL.

[0215] The control device 18 may change the arrangement pitch P1 of the concave structures CP1 depending on which part of the workpiece S corresponds to the region where the riblet structure is to be formed. For example, as described above, when the workpiece S is an aircraft, the arrangement pitch P1 of the concave structures CP1 capable of efficiently exerting the effect of reducing friction on the fuselage PL1 is not necessarily the same as the arrangement pitch P1 of the concave structures CP1 capable of efficiently exerting the effect of reducing friction on the main wing PL2. For this reason, the control device 18 may change the arrangement pitch P1 of the concave structures CP1 so that the arrangement pitch P1 of the concave structures CP1 formed by processing the paint film SF on the fuselage PL1 is different from the arrangement pitch P1 of the concave structures CP1 formed by processing the paint film SF on the main wing PL2.

[0216] The control device 18 may change the arrangement pitch P1 of the concave structures CP1 based on the shape of the surface of the coating film SF. Specifically, as described above, the shape of the surface of the coating film SF is likely to depend on the shape of the surface of the workpiece S under the coating film SF. That is, the surface of the coating film SF applied to the workpiece S having a flat surface is likely to be flat, and the surface of the coating film SF applied to the workpiece S having a curved surface is likely to be curved. In this case, the arrangement pitch P1 of the concave structures CP1 capable of efficiently exerting the effect of reducing friction on the surface of the workpiece S having a first shape is not necessarily the same as the arrangement pitch P1 of the concave structures CP1 capable of efficiently exerting the effect of reducing friction on the surface of the workpiece S having a second shape different from the first shape. For this reason, the control device 18 may change the arrangement pitch P1 of the concave structures CP1 so that the arrangement pitch P1 of the concave structures CP1 formed by processing the coating film SF having a first surface shape is different from the arrangement pitch P1 of the concave structures CP1 formed by processing the coating film SF having a second surface shape. In this case, the processing device 1d may be provided with a surface characteristic measuring device 19b capable of measuring the surface shape of the coating film SF, similar to the processing device 1b, in order to change the arrangement pitch P1 of the concave structures CP1 based on the surface shape of the coating film SF, or may acquire information on the surface shape of the coating film SF (for example, the above-mentioned design data). In addition, when the light irradiation device 11d irradiates the coating film SF with multiple parallel processing lights EL, if the shape of the processing target S is not flat, the interval (pitch) of the multiple processing lights EL and the arrangement pitch P1 of the formed concave structures CP1 are not necessarily the same. In this case, the interval between the multiple processing lights EL may be changed so that the arrangement pitch P1 of the concave structures CP1 is a predetermined pitch. Furthermore, even if the light irradiation device 11d irradiates multiple non-parallel processing light EL onto the coating film SF, when the shape of the workpiece S is not flat, the spacing (pitch) between the multiple processing light EL and the arrangement pitch P1 of the formed concave structure CP1 are not necessarily the same, so the spacing between the multiple processing light EL may be changed.

[0217] As the multiple processing lights EL are scanned, the relative positions (particularly the positions in the direction along the surface of the coating film SF) of the multiple irradiation areas EA onto which the multiple processing lights EL are respectively irradiated change. When the relative positions of the multiple irradiation areas EA on the surface of the coating film SF change, the area in which the multiple irradiation areas EA are formed may change from an area corresponding to a certain part of the processing object S (for example, an area corresponding to the fuselage PL1) to an area corresponding to another part of the processing object S (for example, an area corresponding to the main wing PL2) while the multiple processing lights EL are being irradiated. Alternatively, when the relative positions of the multiple irradiation areas EA on the surface of the coating film SF change, the shape of the part of the surface of the coating film SF where the multiple irradiation areas EA are formed may also change while the multiple processing lights EL are being irradiated. For this reason, the control device 18 may change the arrangement pitch P1 of the concave structure CP1 when the multiple processing lights EL are irradiated to the coating film SF (that is, when the multiple processing lights EL are moving relative to the coating film SF). As described above, even if the intervals between the multiple processing lights EL are constant, the arrangement pitch of the formed concave structures CP1 may differ if the shape of the processing object S is different. In this case, the intervals (pitch) between the multiple processing lights EL may be changed according to the shape of the coating film SF.

[0218] The processing device 1d of the fourth modified example can change the arrangement pitch of the concave structure CP1 and the convex structure CP2 that constitute the riblet structure while enjoying the same effects as those that can be enjoyed by the processing device 1 described above. Therefore, a more appropriate riblet structure can be formed compared to a case in which the arrangement pitch of the concave structure CP1 and the convex structure CP2 cannot be changed. Specifically, for example, a riblet structure can be formed in which an appropriate arrangement pitch is adopted that can appropriately obtain the effect of reducing friction.

[0219] At least one of the light irradiation devices 21a to 27a described with reference to Figures 18 to 24 may also include a zoom lens 1124d. In this case, too, the arrangement pitch of the concave structures CP1 and the convex structures CP2 constituting the riblet structure can be changed.

[0220] In the above description, the control device 18 changes the arrangement pitch P1 of the concave structures CP1 (i.e., the arrangement pitch of the multiple irradiation areas EA) and / or the intervals of the multiple processing lights EL by changing the projection magnification of the optical system 112d using the zoom lens 1124d. However, the control device 18 may change the arrangement pitch P1 of the concave structures CP1 (i.e., the arrangement pitch of the multiple irradiation areas EA) and / or the intervals of the multiple processing lights EL by other methods. Even when the processing device 1d is equipped with any of the above-mentioned light irradiation devices 21a to 27a instead of the light irradiation device 11d, the control device 18 may change the arrangement pitch P1 of the concave structures CP1 (i.e., the arrangement pitch of the multiple irradiation areas EA) and / or the intervals of the multiple processing lights EL by other methods.

[0221] For example, a parallel plane plate capable of changing the inclination angle with respect to the optical axis may be provided in each optical path of the multiple processing light beams EL emitted from the light source system 111, and the angle of each of these parallel plane plates may be set to a predetermined angle, thereby changing the arrangement pitch of the multiple irradiation areas EA and / or the interval between the multiple processing light beams EL. At least one of the above-mentioned light irradiation devices 22a to 23a and 25a to 27a that irradiate the multiple processing light beams EL may also be provided with a parallel plane plate.

[0222] For example, when the processing device 1d is provided with the plurality of irradiation units 110b-1 shown in FIG. 27, the control device 18 may change the arrangement pitch of the plurality of irradiation areas EA and / or the intervals of the plurality of processing lights EL by moving the plurality of irradiation units 110b-1 in a direction along the surface of the coating film SF. Specifically, the control device 18 may change the arrangement pitch of the plurality of irradiation areas EA and / or the intervals of the plurality of processing lights EL by moving the plurality of irradiation units 110b-1 to change the arrangement intervals of the plurality of irradiation units 110b-1. As a result, the arrangement pitch P1 of the concave structure CP1 is changed. The same applies when the processing device 1d is provided with any of the above-mentioned light irradiation devices 22a to 23a and 25a to 27a capable of irradiating a plurality of processing lights EL and any of the light irradiation devices 22a to 23a and 25a to 27a is provided with a plurality of irradiation units 110b-1 to irradiate a plurality of processing lights EL.

[0223] For example, when the processing device 1d is provided with the plurality of light sources 1111 shown in FIG. 3(b) above, the control device 18 may change the arrangement pitch of the plurality of irradiation areas EA and / or the intervals of the plurality of processing lights EL by moving the plurality of light sources 1111 along the direction along the surface of the coating film SF. Specifically, the control device 18 may change the arrangement pitch of the plurality of irradiation areas EA and / or the intervals of the plurality of processing lights EL by moving the plurality of light sources 1111 to change the arrangement intervals of the plurality of light sources 1111. As a result, the arrangement pitch P1 of the concave structure CP1 is changed. The same applies when the processing device 1d is provided with any of the above-mentioned light irradiation devices 22a to 23a and 25a to 27a capable of irradiating a plurality of processing lights EL and any of the light irradiation devices 22a to 23a and 25a to 27a is provided with a plurality of light sources 1111 to irradiate a plurality of processing lights EL.

[0224] For example, when the processing device 1d splits the processing light EL from the single light source 1111 shown in FIG. 3(c) at the splitter 1112 and outputs it from the multiple exits, the control device 18 may change the arrangement pitch of the multiple irradiation areas EA and / or the intervals of the multiple processing lights EL by changing the positions of the multiple exits. Specifically, the control device 18 may change the arrangement pitch of the multiple irradiation areas EA and / or the intervals of the multiple processing lights EL by changing the arrangement intervals of the multiple exits. As a result, the arrangement pitch P1 of the concave structure CP1 is changed. The same applies when the processing device 1d includes any one of the above-mentioned light irradiation devices 22a to 23a and 25a to 27a capable of irradiating multiple processing lights EL and the processing light EL from the single light source 1111 is split at the splitter 1112 so that any one of the light irradiation devices 22a to 23a and 25a to 27a irradiates multiple processing lights EL.

[0225] For example, if the processing device 1d is equipped with a light irradiation device 22a having a mirror array 222a, the control device 18 may change the arrangement pitch of the multiple irradiation areas EA and / or the intervals of the multiple processing lights EL by controlling the tilt angle of each mirror M of the mirror array 2221a to change the position of the reflecting surface of each mirror M (particularly, the position around the Y axis). For example, if the mirror array 2221a is equipped with multiple mirrors M arranged in a matrix on the XY plane, the control device 18 may change the arrangement pitch of the multiple irradiation areas EA arranged along the X-axis direction and / or the intervals of the multiple processing lights EL by controlling the tilt angle of each mirror M in units of a group of mirrors M arranged along the Y-axis direction.

[0226] For example, if the processing device 1d is equipped with a light irradiation device 11d-1 capable of changing the relative angle of the multiple processing lights EL, the control device 18 may change the arrangement pitch of the multiple irradiation areas EA and / or the interval between the multiple processing lights EL by changing the relative angle of the multiple processing lights EL. Specifically, FIG. 48(a) shows a state in which the relative angle of the multiple processing lights EL is in a first angle state, and FIG. 48(b) shows a state in which the relative angle of the multiple processing lights EL is in a second angle state different from the first angle state. As shown in FIG. 48(a) and FIG. 48(b), when the relative angle of the multiple processing lights EL changes, the angle at which the multiple processing lights EL enter the coating film SF changes. On the other hand, even if the relative angle of the multiple processing lights EL changes, the emission points of the multiple processing lights EL remain unchanged as the light source system of the light emission device 11d-1. As a result, as shown in FIG. 48(c) and FIG. 48(d), when the relative angle of the multiple processing lights EL changes, the arrangement pitch of the multiple irradiation areas EA changes. Specifically, as shown in FIG. 48(c), when the relative angle of the processing light EL is in a first angle state, the arrangement pitch of the irradiation areas EA is a third pitch Pe3. On the other hand, as shown in FIG. 48(d), when the relative angle of the processing light EL is in a second angle state, the arrangement pitch of the irradiation areas EA is a fourth pitch Pe4 that is larger than the third pitch Pe3. As a result, the arrangement pitch P1 of the concave structure CP1 is changed. The light irradiation device 11d-1 may be a light irradiation device provided with an optical member for changing the relative angle of the processing light EL for any one of the above-mentioned light irradiation device 11 and light irradiation devices 22a to 23a and 25a to 27a that can irradiate the processing light EL.

[0227] For example, if the processing device 1d includes a light irradiation device 11d-2 capable of irradiating a coating film SF with a plurality of processing lights EL that are non-parallel to each other, the control device 18 can change the relative positional relationship (the distance between the light irradiation device 11d-2 and the coating film SF) in the direction intersecting the surface of the coating film SF (in the example shown in FIGS. 49(a) to 49(b), the Z-axis direction) of the light irradiation device 11d-2 and the coating film SF, so as to change the arrangement pitch of the plurality of irradiation regions EA and / or the interval between the plurality of processing lights EL. Specifically, as shown in FIG. 49(a), when the distance between the light irradiation device 11d-2 and the coating film SF in the Z-axis direction is D5, the arrangement pitch of the plurality of irradiation regions EA is the fifth pitch Pe5. Thereafter, as shown in FIG. 49(b), as a result of the light irradiation device 11d-2 moving along the Z-axis away from the coating film SF by the drive system 12, when the distance between the light irradiation device 11d-2 and the coating film SF in the Z-axis direction becomes D6 (where D5 < D6), the arrangement pitch of the plurality of irradiation regions EA is the sixth pitch Pe6 that is larger than the fifth pitch Pe5. As a result, the arrangement pitch P1 of the concave structure CP1 is changed. Note that the light irradiation device 11d-2 may be a light irradiation device provided with an optical member for irradiating a plurality of processing lights EL that are non-parallel to each other with respect to any one of the above-described light irradiation devices 11 and light irradiation devices 22a to 23a and 25a to 27a capable of irradiating a plurality of processing lights EL.

[0228] For example, if the processing device 1d includes a plurality of light sources 1111 each capable of emitting processing light EL, the control device 18 may change the arrangement pitch of the plurality of irradiation areas EA and / or the intervals between the plurality of processing light EL by changing the number of light sources 111 that actually emit the processing light EL among the plurality of light sources 1111. Specifically, in the example shown in FIG. 50(a), six light sources 1111 among the plurality of light sources 1111 are selected as light sources 111 that emit the processing light EL. In this case, the six light sources 1111 emit the processing light EL, and the other light sources 1111 do not emit the processing light EL. Alternatively, the other light sources 1111 may also emit the processing light EL, but the emitted processing light EL is blocked and is not irradiated to the coating film SF. In this case, as shown in FIG. 50(b), the arrangement pitch of the plurality of irradiation areas EA is the seventh pitch Pe7. On the other hand, in the example shown in FIG. 50(c), three light sources 1111 of the multiple light sources 1111 (particularly, three light sources 1111 selected every other one of the six light sources 1111 selected in the example shown in FIG. 50(a)) are selected as the light sources 111 that emit the processing light EL. In this case, as shown in FIG. 50(d), the arrangement pitch of the multiple irradiation areas EA is an eighth pitch Pe8 that is larger (for example, twice) than the seventh pitch Pe7. As a result, the arrangement pitch P1 of the concave structure CP1 is changed. The same is true in the case where the processing device 1d is equipped with any of the above-mentioned light irradiation devices 22a to 23a and 25a to 27a that can irradiate multiple processing lights EL, and any of the light irradiation devices 22a to 23a and 25a to 27a is equipped with multiple light sources 1111 to irradiate multiple processing lights EL.

[0229] Alternatively, in addition to or instead of changing the arrangement pitch of the multiple irradiation areas EA (i.e., changing the relative positional relationship of the multiple irradiation areas EA), the control device 18 may change the arrangement pitch of the concave structures CP1 and / or the intervals of the multiple processing lights EL by other methods. For example, a shutter may be provided in the optical path of each of the multiple processing lights EL emitted from the light source system 111.

[0230] For example, if the processing device 1d includes a light irradiation device 21a that forms interference fringes formed by interfering with the first branched light EL1 and the second branched light EL2 shown in FIG. 18 on the surface of the coating film SF, the control device 18 may change the arrangement pitch P1 of the concave structure CP1 by changing the angle at which the first branched light EL1 and the second branched light EL intersect (i.e., the relative angle between the first branched light EL1 and the second branched light). Specifically, in the example shown in FIG. 51(a), the angle at which the first branched light EL1 and the second branched light EL intersect is the first angle θ1. In this case, as shown in FIG. 51(b), the pitch of the interference fringes formed on the surface of the coating film SF is the ninth pitch Pe9. On the other hand, in the example shown in FIG. 51(c), the angle at which the first branched light EL1 and the second branched light EL intersect is the second angle θ2 different from the first angle θ1. In this case, as shown in Fig. 51(d), the pitch of the interference fringes formed on the surface of the coating film SF is a tenth pitch Pe10 different from the ninth pitch Pe9, and as a result, the arrangement pitch P1 of the concave structures CP1 is changed.

[0231] However, in order to change the angle at which the first branched light EL1 and the second branched light EL intersect, the processing apparatus 1d includes a light irradiation device 11d-3 including an angle adjustment element 2127d for adjusting the angle at which the first branched light EL1 and the second branched light EL intersect, as shown in FIG. 52, instead of the light irradiation device 21a. The angle adjustment element 2127d can adjust the relative angle of the first branched light EL1 with respect to the second branched light EL2 by synchronously moving the light exit 2123a and the focusing optical system 2125a. Furthermore, the angle adjustment element 2127d may be capable of adjusting the relative angle of the second branched light EL2 with respect to the first branched light EL1 by synchronously moving the light exit 2124a and the focusing optical system 2126a in addition to or instead of synchronously moving the light exit 2123a and the focusing optical system 2125a. Therefore, the angle adjustment element 2127d can change the angle at which the first split light EL1 and the second split light EL intersect.

[0232] For example, when the arrangement pitch of the plurality of irradiation areas EA and / or the intervals of the plurality of processing lights EL are changed, the intensity distribution of the plurality of processing lights EL on the surface of the coating film SF is changed. Therefore, changing the arrangement pitch of the plurality of irradiation areas EA and / or the intervals of the plurality of processing lights EL is equivalent to controlling the intensity distribution of the plurality of processing lights EL on the surface of the coating film SF. Similarly, when the pitch of the interference fringes formed on the surface of the coating film SF by the interference of the first branched light EL1 and the second branched light EL2 is changed, the intensity distribution of the plurality of processing lights EL on the surface of the coating film SF is changed. Therefore, changing the angle at which the first branched light EL1 and the second branched light EL2 intersect is equivalent to controlling the intensity distribution of the plurality of processing lights EL on the surface of the coating film SF. For this reason, the control device 18 may control the intensity distribution of the plurality of processing lights EL on the surface of the coating film SF (or the intensity distribution of the plurality of processing lights EL in a plane along the surface of the coating film SF) in addition to or instead of changing the arrangement pitch P1 of the concave structure CP1 and / or the intervals of the plurality of processing lights EL. In this case, the optical system 112 may include an intensity distribution adjusting element for adjusting the intensity distribution of the multiple processing light beams EL under the control of the control device 18. The intensity distribution adjusting element may be, for example, a spatial light modulator capable of spatially modulating the processing light beam EL. Therefore, if the processing device 1d includes a light irradiation device 24a (see FIG. 21) including a spatial light modulator, the control device 18 may control the spatial light modulator to change the intensity distribution of the multiple processing light beams EL.

[0233] In the above description, the control device 18 changes at least one of the following: the arrangement pitch of the irradiation area EA and / or the interval of the multiple processing lights EL, the angle at which the first branched light EL1 and the second branched light EL intersect, and the intensity distribution of the multiple processing lights EL on the surface of the coating film SF, in order to change the arrangement pitch P1 of the concave structures CP1. However, the control device 18 may change at least one of the arrangement pitch of the irradiation area EA and / or the interval of the multiple processing lights EL, the angle at which the first branched light EL1 and the second branched light EL intersect, and the intensity distribution of the multiple processing lights EL on the surface of the coating film SF, in order to maintain the arrangement pitch P1 of the concave structures CP1 (i.e., to prevent the arrangement pitch P1 from fluctuating). Specifically, as described above, the processing device 1d scans the unit processing area SA with the multiple processing lights EL via the galvanometer mirror 1122. Here, strictly speaking, the length of the optical path of the processing light EL from the galvanometer mirror 1122 to the center of the unit processing area SA is different from the length of the optical path of the processing light EL from the galvanometer mirror 1122 to the end of the unit processing area SA. Therefore, the arrangement pitch of the multiple irradiation areas EA at the center of the unit processing area SA may not match the arrangement pitch of the multiple irradiation areas EA at the end of the unit processing area SA. Or, as described above, since the processing target S is an aircraft fuselage or the like, the surface of the coating film SF is likely to be curved, uneven, or inclined. In this case, too, the length of the optical path of the processing light EL from the galvanometer mirror 1122 to a part of the unit processing area SA is different from the length of the optical path of the processing light EL from the galvanometer mirror 1122 to another part of the unit processing area SA. Therefore, the arrangement pitch of the multiple irradiation areas EA at a part of the unit processing area SA may not match the arrangement pitch of the multiple irradiation areas EA at another part of the unit processing area SA. As a result, in a situation where it is desired to form concave structures CP1 with the same arrangement pitch P1 in the unit processing area SA, the arrangement pitch P1 of the concave structures CP1 formed in one part of the unit processing area SA may unintentionally become mismatched with the arrangement pitch P1 of the concave structures CP1 formed in another part of the unit processing area SA.Therefore, the control device 18 may perform at least one of changing the arrangement pitch of the irradiation area EA, changing the angle at which the first branched light EL1 and the second branched light EL intersect, and changing the intensity distribution of the multiple processing lights EL on the surface of the coating film SF, so as to offset such unintended fluctuations in the arrangement pitch P1 of the concave structures CP1. As a result, the unintended fluctuations in the arrangement pitch P1 of the concave structures CP1 are offset, and concave structures CP1 having the same arrangement pitch P1 can be appropriately formed.

[0234] (4-5) Fifth Modification The processing device 1d of the fourth modified example described above changes the characteristics of the processing light EL (for example, at least one of the relative positional relationship between the multiple irradiation areas EA, the angle at which the first branched light EL1 and the second branched light EL2 intersect, and the intensity distribution of the multiple processing light EL on the coating film SF) in order to change the arrangement pitch P1 of the concave structures CP1 that constitute the riblet structure. On the other hand, the processing device e of the fifth modified example changes any characteristic of the processing light EL in order to change any characteristic of the riblet structure. As an example of "any characteristic of the riblet structure" in the fifth modified example, as described in the third modified example, there is at least one of the following: the presence or absence of a riblet structure, the shape of the riblet structure (for example, at least one of the cross-sectional shape of the concave structure CP1 and the cross-sectional shape of the concave structure CP1), the size of the riblet structure (for example, at least one of the depth D of the concave structure CP1, the width of the concave structure CP1, the arrangement pitch P1 of the concave structure CP1, the height H of the convex structure CP2, the width of the convex structure CP2, and the arrangement pitch P2 of the convex structure CP2), and the position of the riblet structure (for example, the position of at least one of the concave structure CP1 and the convex structure CP2). For this reason, the processing device 1e differs from the above-mentioned processing device 1 in that it is provided with a characteristic adjustment device 41e for adjusting the characteristics of the processing light EL, as shown in FIG. The processing apparatus 1e may include a characteristic adjustment device 41e separate from the light irradiation device 11, or may include a characteristic adjustment device 41e incorporated in the light irradiation device 11 (i.e., constituting a part of the light irradiation device 11). Other features of the processing apparatus 1e may be the same as other features of the processing apparatus 1.

[0235] The control device 18 may change any characteristic of the processing light EL so as to change any characteristic of the riblet structure to form a more appropriate riblet structure. For example, the control device 18 may change any characteristic of the processing light EL so as to change any characteristic of the riblet structure to form an appropriate riblet structure that appropriately obtains the effect of reducing friction.

[0236] The characteristics of the multiple processing lights EL may include the intensity distribution of the multiple processing lights EL on the surface of the coating film SF. That is, the control device 18 may control the characteristic adjustment device 41e to change the intensity distribution of the multiple processing lights EL on the surface of the coating film SF. When the intensity distribution of the multiple processing lights EL on the surface of the coating film SF changes, the characteristics of the concave structure CP1 (particularly, at least one of the shape and the position) change. As a result, the characteristics of the riblet structure formed from such a concave structure CP1 (particularly, at least one of the shape and the position) change. For example, when the multiple processing lights EL having a first intensity distribution shown in FIG. 54(a) are irradiated onto the surface of the coating film SF, the concave structure CP1 shown in FIG. 54(b) is formed. On the other hand, when the multiple processing lights EL having a second intensity distribution different from the first intensity distribution shown in FIG. 54(c) are irradiated onto the surface of the coating film SF, the concave structure CP1 shown in FIG. 54(d) is formed, which has characteristics different from the concave structure CP1 shown in FIG. 54(b).

[0237] The characteristics of the multiple processing lights EL may include the shapes of the multiple irradiation areas EA. That is, the control device 18 may control the characteristic adjustment device 41e to change the shapes of the multiple irradiation areas EA. When the shapes of the multiple irradiation areas EA change, the characteristics of the concave structure CP1 (particularly, at least one of the shape and the position) change. As a result, the characteristics of the riblet structure formed from such a concave structure CP1 (particularly, at least one of the shape and the position) change. For example, when multiple processing lights EL are irradiated to multiple irradiation areas EA of a first shape shown in FIG. 55(a), a concave structure CP1 shown in FIG. 55(b) is formed. On the other hand, when multiple processing lights EL are irradiated to multiple irradiation areas EA of a second shape different from the first shape shown in FIG. 55(c), a concave structure CP1 shown in FIG. 55(d) having characteristics different from the concave structure CP1 shown in FIG. 55(b) is formed.

[0238] The characteristics of the multiple processing lights EL may include the sizes of the multiple irradiation areas EA. That is, the control device 18 may control the characteristic adjustment device 41e to change the sizes of the multiple irradiation areas EA. When the sizes of the multiple irradiation areas EA change, the characteristics of the concave structure CP1 (particularly, at least one of the shape and the position) change. As a result, the characteristics of the riblet structure formed from such a concave structure CP1 (particularly, at least one of the shape and the position) change. For example, when multiple processing lights EL are irradiated to multiple irradiation areas EA of a first size shown in FIG. 56(a), a concave structure CP1 shown in FIG. 51(b) is formed. On the other hand, when multiple processing lights EL are irradiated to multiple irradiation areas EA of a second size smaller than the first size shown in FIG. 56(c), a concave structure CP1 shown in FIG. 56(d) having a narrower width than the concave structure CP1 shown in FIG. 56(b) is formed.

[0239] The characteristics of the multiple processing lights EL may include the intensities of the multiple processing lights EL. That is, the control device 18 may control the characteristic adjustment device 41e to change the intensities of the multiple processing lights EL. When the intensities of the multiple processing lights EL change, the characteristics (particularly, the shape, etc.) of the concave structure CP1 change. Specifically, the greater the intensities of the multiple processing lights EL, the greater the energy applied to the coating film SF by the irradiation of the multiple processing lights EL, and therefore more of the coating film SF is removed. Therefore, the greater the intensities of the multiple processing lights EL, the greater the depth of the concave structure CP1 formed. As a result, the characteristics (particularly, the shape, etc.) of the riblet structure formed from such a concave structure CP1 change. For example, when multiple processing lights EL having a first intensity shown in FIG. 57(a) are irradiated, the concave structure CP1 shown in FIG. 57(b) is formed. On the other hand, for example, when multiple processing lights EL having a second intensity greater than the first intensity shown in Figure 57(c) are irradiated, a concave structure CP1 shown in Figure 57(d) is formed which is deeper than the concave structure CP1 shown in Figure 57(b).

[0240] The characteristics of the multiple processing lights EL may include the irradiation times of the multiple processing lights EL. That is, the control device 18 may control the characteristic adjustment device 41e to change the irradiation times of the multiple processing lights EL. When the irradiation times of the multiple processing lights EL change, the characteristics (particularly, the shape, etc.) of the concave structure CP1 change. Specifically, the longer the irradiation times of the multiple processing lights EL, the greater the energy applied to the coating film SF by the irradiation of the multiple processing lights EL, and therefore more of the coating film SF is removed. Therefore, the longer the irradiation times of the multiple processing lights EL, the greater the depth of the formed concave structure CP1. As a result, the characteristics (particularly, the shape, etc.) of the riblet structure formed from such a concave structure CP1 change.

[0241] The characteristics of the multiple processing lights EL may include the polarization states of the multiple processing lights EL (for example, at least one of the difference between s-polarized light and p-polarized light, and the difference between circularly polarized light, linearly polarized light, and elliptically polarized light). That is, the control device 18 may control the characteristic adjustment device 41e to change the polarization states of the multiple processing lights EL. When the polarization states of the multiple processing lights EL change, the degree of absorption of the multiple processing lights EL by the coating film SF may change. As a result, the energy applied to the coating film SF by the irradiation of the multiple processing lights EL may change, and the characteristics (particularly, shape, etc.) of the multiple concave structures CP1 may change. As a result, the characteristics (particularly, shape, etc.) of the riblet structure formed from such a concave structure CP1 may change.

[0242] The characteristics of the multiple processing lights EL may include the wavelengths of the multiple processing lights EL. That is, the control device 18 may control the characteristic adjustment device 41e to change the wavelengths of the multiple processing lights EL. When the wavelengths of the multiple processing lights EL change, the degree of absorption of the multiple processing lights EL by the coating film SF may change. As a result, the energy applied to the coating film SF by irradiation with the multiple processing lights EL may change, and the characteristics (particularly, shape, etc.) of the multiple concave structures CP1 may change. As a result, the characteristics (particularly, shape, etc.) of the riblet structure formed from such a concave structure CP1 may change.

[0243] The control device 18 may change the characteristics of the multiple processing lights EL when the multiple processing lights EL are irradiated onto the coating film SF (that is, when the multiple processing lights EL are moving relatively to the coating film SF). As a result, a series of concave structures CP1 extending in a certain direction will have a portion having a first characteristic and a portion having a second characteristic different from the first characteristic. For example, as shown in Figures 58(a) to 58(c), a series of concave structures CP1 extending in a certain direction will have a portion having a first shape (see Figure 58(b), which is a cross-sectional view taken along the line I-I' in Figure 58(a)) and a portion having a second shape different from the first shape (see Figure 58(c), which is a cross-sectional view taken along the line II-II' in Figure 58(a)). That is, the cross-sectional shape of the concave structures CP1 changes along the extension direction of the concave structures CP1. Alternatively, for example, as shown in Figures 59(a) to 59(c), a series of concave structures CP1 extending in a certain direction has a portion having a first width (see Figure 59(b), which is a cross-sectional view taken along I-I' in Figure 59(a)) and a portion having a second width different from the first width (see Figure 59(c), which is a cross-sectional view taken along II-II' in Figure 59(a)). In other words, the width of the concave structures CP1 changes along the extension direction of the concave structures CP1.

[0244] The processing device 1e of the fifth modified example can change the characteristics of the riblet structure while obtaining the same effects as those obtained by the processing device 1 described above. Therefore, a more appropriate riblet structure can be formed compared to a case where the characteristics of the riblet structure cannot be changed. Specifically, for example, a riblet structure having appropriate characteristics that can appropriately obtain the effect of reducing friction can be formed.

[0245] (4-6) Sixth Modification Next, a processing apparatus 1f of a sixth modified example will be described with reference to FIG. 60. In the above description, the end 144 of the supporting device 14 is capable of contacting the surface of the coating film SF. In other words, the supporting device 14 supports the storage device 13 (and further the light irradiation device 11 supported by the storage device 13) in a state of contacting the coating film SF. On the other hand, the processing apparatus 1f of the sixth modified example differs from the above-described processing apparatus 1 in that, instead of such a supporting device 14, it is provided with a supporting device 14f that does not contact the surface of the coating film SF, as shown in FIG. 60. Other features of the processing apparatus 1f may be the same as other features of the processing apparatus 1.

[0246] Since the supporting device 14f is not in contact with the surface of the coating film SF, the supporting device 14 supports the containing device 13 (and further the light irradiation device 11 supported by the containing device 13; the same applies below in the sixth modified example) without contacting the coating film SF. The supporting device 14f is supported by a supporting frame (or any supporting member, etc.) Ff that is separated from the coating film SF (and further the workpiece S). The supporting device 14f supports the containing device 13 while being in contact with the supporting frame Ff.

[0247] The support device 14f includes a beam member 141, similar to the support device 14. Furthermore, the support device 14f includes a plurality of pillar members 142f arranged on the beam member 141, instead of the plurality of leg members 142 included in the support device 14. The pillar members 142f are rod-shaped members extending from the beam member 141 toward the +Z side. An end 144f (the end on the +Z side in the example shown in FIG. 60) of the leg member 142f is capable of coming into contact with the support frame Ff. The end 144f, similar to the end 144 of the leg member 142, is capable of being attached to the support frame Ff while being in contact with the support frame Ff.

[0248] The pillar member 142f is a member that can be expanded and contracted along the Z axis by the drive system 15, similar to the leg member 142. That is, the state of the pillar member 142f can be switched between a third extended state in which the pillar member 142f extends along the Z axis and has a relatively long length in the Z axis direction, and a third contracted state in which the pillar member 142f contracts along the Z axis and has a relatively short length in the Z axis direction. Similarly to the leg member 142, the state of the pillar member 142f can be switched between the third extended state and the third contracted state when the support device 14f moves. When the pillar member 142f is in the third extended state, the end 144f of the pillar member 142f can come into contact with the support frame Ff. On the other hand, when the pillar member 142f is in the third contracted state, the end 144f does not come into contact with the support frame Ff. That is, when the pillar member 142f is in the third contracted state, the end 144f is away from the support frame Ff on the -Z side. Therefore, the movement of the support device 14f is not hindered by contact between the end 144f of the pillar member 142f and the support frame Ff. The pillar member 142f may be attached to an overhead crane that is movable along at least one of the X-axis and the Y-axis. The support device 14f may be at least one of a crane and a robot arm.

[0249] The processing apparatus 1f of the sixth modified example can achieve the same effects as those achieved by the processing apparatus 1 described above.

[0250] However, in the processing device 1f, since the support device 14f and the coating film SF are not in contact with each other, the support device 14f and the coating film SF are vibrationally separated. Since the support device 14f supports the light irradiation device 11, the light irradiation device 11 and the coating film SF are vibrationally separated. Therefore, when the coating film SF moves relative to the light irradiation device 11 due to vibration or the like, the irradiation position of the processing light EL by the light irradiation device 11 on the surface of the coating film SF (i.e., the position of the irradiation area EA) may shift from the original irradiation position. In other words, the relative positional relationship between the coating film SF and the irradiation area EA may change. Therefore, in the sixth modified example, the control device 18 moves the irradiation area EA relative to the support device 14f so that the relative position of the irradiation area EA to the coating film SF does not change based on at least one of the vibration state of the coating film SF relative to the support device 14f and the relative positional relationship of the coating film SF relative to the support device 14f. When the coating film SF vibrates (or moves) relative to the support device 14f, the relative positional relationship between the coating film SF and the irradiation area EA changes, and therefore the control device 18 changes the relative position of the irradiation area EA with respect to the coating film SF based on the relative positional relationship between the coating film SF and the irradiation area EA so that the relative positional relationship of the irradiation area EA with respect to the coating film SF is maintained constant.

[0251] For this reason, the processing device 1f is provided with a vibration measuring device 51f that measures the relative vibration state of the coating film SF with respect to the supporting device 14f. As the vibration measuring device, for example, an optical measuring device having various measurement principles such as a moire topography method using a grating projection method or a grating projection method, a holographic interferometry method, an autocollimation method, a stereo method, an astigmatism method, a critical angle method, or a knife edge method can be used. The processing device 1f may also be provided with a vibration measuring device equipped with a displacement meter, a speed meter, or an accelerometer that measures its own vibration state. Based on the measurement result of the vibration measuring device 51f, the control device 18 changes the position of the irradiation area EA with respect to the supporting device 14f so that the position of the irradiation area EA with respect to the coating film SF does not change even if the coating film SF vibrates with respect to the supporting device 14f. Here, if the coating film SF moves by one movement amount in one movement direction with respect to the supporting device 14f due to vibration, while the irradiation area EA is stationary with respect to the supporting device 14f, the coating film SF moves by one movement amount with respect to the irradiation area EA with respect to the supporting device 14f. That is, on the surface of the coating film SF, the irradiation area EA moves by one movement amount toward another movement direction opposite to the one movement direction relative to the coating film SF. Therefore, in order to keep the relative position of the irradiation area EA relative to the coating film SF unchanged, it is necessary to move the irradiation area EA in the same manner as the coating film SF. That is, if the irradiation area EA moves by one movement amount in one movement direction in accordance with the movement of the coating film SF, the position of the irradiation area EA relative to the coating film SF will not change. More specifically, if the irradiation area EA moves by one movement amount in one movement direction relative to the support device 14f, the position of the irradiation area EA relative to the coating film SF will not change. Therefore, the control device 18 moves the irradiation area EA relative to the support device 14f by the same movement amount as the movement amount of the coating film SF relative to the support device 14f in the same direction as the movement direction of the coating film SF relative to the support device 14f. Furthermore, the movement of the irradiation area EA may be achieved by moving the light irradiation device 11 using the drive system 12, or by moving and / or controlling the attitude of at least one of the optical members included in the light irradiation device 11 (for example, controlling the rotational state of the galvanometer mirror 1122), or by other methods.

[0252] Incidentally, even in the above-mentioned processing device 1 etc. in which the supporting device 14 and the coating film SF are capable of contacting each other, there is a possibility that the vibration state of the supporting device 14 and the vibration state of the coating film SF do not match. For this reason, even in the above-mentioned processing device 1 etc., the control device 18 may move the irradiation area EA relatively to the supporting device 14f based on the vibration state of the coating film SF with respect to the supporting device 14f (i.e., the relative position of the coating film SF with respect to the supporting device 14f) so that the relative position of the irradiation area EA with respect to the coating film SF does not change.

[0253] (4-7) Seventh Modification Next, a processing apparatus 1g of a seventh modified example will be described with reference to Fig. 61. The processing apparatus 1 described above is capable of moving the light irradiation device 11 relative to the coating film SF by the drive systems 12 and 15 without moving the workpiece SF. On the other hand, the processing apparatus 1g of the seventh modified example differs from the processing apparatus 1 described above in that the coating film SF (i.e., the workpiece SF) can be moved relative to the light irradiation device 11 without moving the light irradiation device 11. Other features of the processing apparatus 1g may be the same as other features of the processing apparatus 1.

[0254] In order to move the workpiece SF, the processing apparatus 1g is equipped with a stage 61g. The stage 61g is supported from the -Z side by a base plate 62g. The stage 61g is accommodated in the accommodation space SP. The stage 61g is disposed to face the light irradiation device 11. The stage 61g can hold the workpiece S such that the coating film SF faces the light irradiation device 11. The stage 61g can hold the workpiece S such that a plurality of processing lights EL from the light irradiation device 11 are irradiated onto the coating film SF. The stage 61g can release the held workpiece S.

[0255] The stage 61g can be moved by a driving system 63g. The stage 61g can be moved while holding the processing object S. The stage 61g can be moved relative to the light irradiation device 11. The stage 61g can be moved relative to the irradiation area EA to which a plurality of processing lights EL are irradiated from the light irradiation device 11. The driving system 63g moves the stage 61g under the control of the control device 18 so as to change the relative positional relationship between the light irradiation device 11 and the coating film SF (i.e., the relative positional relationship between the irradiation area EA and the coating film SF). The driving system 63g may move the stage 61g along at least one of the X-axis and the Y-axis. As a result, the irradiation area EA moves along at least one of the X-axis and the Y-axis on the coating film SF. The driving system 63g may move the stage 61g along the Z-axis. The driving system 63g may move the stage 61g along at least one of the X-axis, Y-axis, and Z-axis, as well as at least one of the θX-direction, θY-direction, and θZ-direction.

[0256] Since the workpiece S moves relative to the light irradiation device 11 due to the movement of the stage 61g, the coating film SF moves relative to the storage device 13 (particularly, the end 134 of the partition member 132) and the support device 14 (particularly, the end 144 of the leg member 142). Therefore, if the stage 61g moves with at least one of the ends 134 and 144 in contact with the coating film SF, the movement of the stage 61g (i.e., the movement of the workpiece S) may be hindered by the contact between at least one of the ends 134 and 144 and the coating film SF. Therefore, in the seventh modified example, the ends 134 and 144 do not contact the coating film SF. In this case, the end 134 contacts, for example, the base plate 62g. As a result, the storage device 13 cooperates with the base plate 62g to maintain the sealing of the storage space SP. Furthermore, the end 144 also contacts, for example, the base plate 62g. As a result, the support device 14 can stand on its own on the base plate 62g. In other words, the supporting device 14 supports the containing device 13 with the end portion 144 in contact with the base plate 62g.

[0257] In the seventh modified example, since the light irradiation device 11 does not need to be moved, the processing device 1g does not need to include the drive system 12 for moving the light irradiation device 11 and the drive system 15 for moving the support device 15. However, the processing device 1g may move the light irradiation device 11 in the same manner as the processing device 1 described above, and in that case, may include at least one of the drive systems 12 and 15.

[0258] The processing apparatus 1g of the seventh modified example can change the relative position between the coating film SF and the irradiation area EA by moving the stage 61g (i.e., moving the workpiece S), which was realized by moving the light irradiation device 11 in the processing apparatus 1 described above. Furthermore, the processing apparatus 1g can also change the relative position between the coating film SF and the irradiation area EA by moving the stage 61g (i.e., moving the workpiece S), which was realized by rotating the galvanometer mirror 1122 in the processing apparatus 1 described above. Therefore, the processing apparatus 1g can also enjoy the same effects as the processing apparatus 1 can enjoy. In other words, the processing apparatus 1g can alternately repeat a scan operation in which multiple processing lights EL scan the surface of the coating film SF along the Y axis (i.e., moving multiple irradiation areas EA along the Y axis) and a step operation in which multiple irradiation areas EA are moved by a predetermined amount along the X axis by moving the stage 61g to move the workpiece S. As a result, the processing device 1g can scan a plurality of unit processing areas SA with a plurality of processing lights EL, and as a result, the above-mentioned riblet structure can be formed.

[0259] (4-8) Eighth Modification Next, the processing apparatus 1h of the eighth modified example will be described with reference to FIG. 62. The processing apparatus 1 described above moves the light irradiation device 11 by the drive system 12 while the light irradiation device 11 is supported by the storage device 13. That is, the processing apparatus 1 moves the light irradiation device 11 without contacting the coating film SF. On the other hand, the processing apparatus 1h of the eighth modified example differs from the processing apparatus 1 described above in that the light irradiation device 11h is moved while the light irradiation device 11h is not supported by the storage device 13. Therefore, the processing apparatus 1h differs from the processing apparatus 1 described above in that the storage device 13 does not need to support the light irradiation device 11. That is, the processing apparatus 1h differs from the processing apparatus 1 described above in that the processing apparatus 1h includes the light irradiation device 11h that is not supported by the storage device 13. Furthermore, the processing apparatus 1h differs from the processing apparatus 1 described above in that the processing apparatus 1h includes the drive system 12h for moving the light irradiation device 11h that is not supported by the storage device 13, instead of the drive system 12 described above. Other features of the processing apparatus 1h may be the same as other features of the processing apparatus 1.

[0260] Since the storage device 13 does not support the light irradiation device 11h, the light irradiation device 11h is placed on the surface of the coating film SF. The light irradiation device 11h differs from the above-mentioned light irradiation device 11 in that it is provided with a contact portion 113h that can contact the surface of the coating film SF. Other features of the light irradiation device 11h may be the same as other features of the light irradiation device 11. The light irradiation device 11h is placed on the surface of the coating film SF in a state of contacting the surface of the coating film SF via the contact portion 113h. Therefore, the light irradiation device 11h is supported by the coating film SF.

[0261] The drive system 12h moves the light irradiation device 11h relative to the coating film SF (i.e., relative to the workpiece S) under the control of the control device 18. More specifically, the drive system 12h moves the light irradiation device 11h along the surface of the coating film SF. At this time, the drive system 12h moves the light irradiation device 11h in a state in which the light irradiation device 11h is in contact with the coating film SF via the contact portion 113h. Therefore, the contact portion 113h is a member having a relatively small friction resistance between the light irradiation device 11h and the coating film SF. Alternatively, the contact portion 113h is a member having a relatively small rolling resistance (for example, at least one of a tire and a ball). Therefore, the light irradiation device 11h can move along the surface of the coating film SF as if it were self-propelled on the surface of the coating film SF.

[0262] The light irradiation device 11h irradiates the processing light EL while the light irradiation device 11h is in contact with the coating film SF via the contact portion 113h. The light irradiation device 11 may irradiate the processing light EL while the light irradiation device 11h is moving along the surface of the coating film SF. As a result, the irradiation area EA moves relative to the coating film SF, so that a scanning operation can be performed in which a plurality of processing lights EL scan the surface of the coating film SF along the Y axis (i.e., a plurality of irradiation areas EA are moved along the Y axis). In other words, the processing device 1h can form a riblet structure by alternately repeating the scanning operation and the above-mentioned step operation by moving the light irradiation device 11h, without rotating the galvanometer mirror 1122. However, the processing device 1h may alternately repeat the scanning operation and the step operation by rotating the galvanometer mirror 1122.

[0263] As described above, the processing device 1h may be arranged with respect to the coating film SF so as to be suspended from the coating film SF by the support device 14 (for example, suspended from the fuselage of the aircraft PL, which is an example of the processing target S) (see FIG. 6(b) described above). When the processing device 1h is suspended from the coating film SF in this manner, the light irradiation device 11h may fall because it is not supported by the storage device 13. For this reason, the light irradiation device 11 itself may be attachable to the coating film SF. For example, the contact portion 113h may be attachable to the coating film SF. For example, the contact portion 113h may be provided with an adsorption mechanism capable of adsorbing to the coating film SF. Alternatively, for example, as shown in FIG. 63, an adsorption portion 114h may be provided to position the light irradiation device 11h on the coating film SF. In FIG. 63, the light irradiation device 11h is supported by a frame 115h. The frame 115h is provided with wheels 113h as contact portions and a suction nozzle 114h1 constituting a part of the adsorption portion 114h. The suction nozzle 114h1 is connected to a suction pump 114h3 via a suction pipe 114h2. The suction pump 114h3 reduces the pressure between the suction nozzle 114h1 and the coating film SF via the suction pipe 114h2, and adsorbs the light irradiation device 11h to the coating film SF. The wheels 113h can be driven by a drive system 12h. The adsorption unit 114h is not limited to the negative pressure suction type described above, and may be, for example, a magnet suction type.

[0264] Such a processing apparatus 1h of the eighth modified example can achieve the same effects as those achieved by the processing apparatus 1 described above. Furthermore, in the processing apparatus 1h, the light irradiation device 11h can move along the surface of the coating film SF while in contact with the coating film SF. Therefore, regardless of the shape of the surface of the coating film SF, the light irradiation device 11 can move along the surface of the coating film SF. Therefore, the processing apparatus 1h can process the coating film SF without being restricted much by the shape of the surface of the coating film SF.

[0265] (4-9) 9th Variation Next, a processing apparatus 1i of a ninth modified example will be described with reference to Fig. 64. As shown in Fig. 64, the processing apparatus 1i differs from the above-described processing apparatus 1 in that the processing apparatus 1i further includes a position measuring device 71i. Other features of the processing apparatus 1i may be the same as other features of the processing apparatus 1.

[0266] The position measuring device 71i measures the positions of the multiple irradiation areas EA relative to the coating film SF (i.e., relative to the workpiece S). In the ninth modified example, in order to measure the positions of the multiple irradiation areas EA, the position measuring device 71i includes an imaging device (e.g., a camera) 72i capable of simultaneously imaging at least a part of the coating film SF and at least a part of the light irradiation device 11, and measures the position of the light irradiation device 11 relative to the coating film SF to indirectly measure the position of the irradiation area EA relative to the coating film SF. In order to simultaneously image at least a part of the coating film SF and at least a part of the light irradiation device 11, the imaging device 72i is aligned with at least one of the coating film SF (i.e., the workpiece S) and the light irradiation device 11 so that at least a part of the coating film SF and at least a part of the light irradiation device 11 are simultaneously included in the imaging range of the imaging device 72i. In this case, the imaging device 72i is typically disposed at a position at least a predetermined distance away from the coating film SF and the light irradiation device 11. In this case, the imaging device 72i images at least a part of the coating film SF and at least a part of the light irradiation device 11 from a position that is a predetermined distance or more away from the coating film SF and the light irradiation device 11. In other words, the imaging device 72i images at least a part of the coating film SF and at least a part of the light irradiation device 11 while looking down on the coating film SF and the light irradiation device 11.

[0267] Because the imaging device 72i simultaneously images at least a portion of the coating film SF and at least a portion of the light irradiation device 11, the imaging results of the imaging device 72i (i.e., the measurement results of the position measurement device 71i) include information regarding the position of the light irradiation device 11 relative to the coating film SF.

[0268] Here, as described above, the light irradiation device 11 is accommodated in the accommodation space SP surrounded by the partition member 132. If the partition member 132 is a member that ...

Claims

1. a light irradiation device including an optical system, which irradiates a surface of an object with processing light from the optical system to process the surface of the object; a partition member that encloses a space including an optical path between an optical member that is located closest to the object in the optical system and a surface of the object; A partition wall support device for supporting the partition wall member; Control device and Equipped with The bulkhead support device does not come into contact with the object. Processing equipment.

2. 2. The processing apparatus according to claim 1, The apparatus further includes a vibration measuring device that measures a vibration state of at least one of the object and the light irradiation device.

3. 3. The processing apparatus according to claim 2, the light irradiation device includes a galvanometer mirror that controls an irradiation position of the processing light, The control device controls the galvanometer mirror so as to change the irradiation position of the processing light based on an output of the vibration measuring device.

4. In the processing apparatus according to claim 2 or 3, The controller controls the galvanometer mirror to maintain the illumination position on the object.

5. In the processing device according to any one of claims 2 to 4, The vibration measurement device includes an optical measurement device.

6. In the processing device according to any one of claims 2 to 5, The vibration measuring device includes at least one of a displacement meter, a speed meter, and an accelerometer.

7. The processing device according to any one of claims 2 to 6, The light source device further includes a drive system that moves the light irradiation device in the space surrounded by the partition member.

8. The processing apparatus according to claim 7, The drive system moves the light irradiation device in a direction intersecting a traveling direction of the processing light from the optical system.

9. In the processing apparatus according to claim 7 or 8, The drive system moves the light irradiation device so as to change the irradiation position of the processing light based on an output of the vibration measuring device.

10. 10. The processing apparatus according to claim 9, The drive system moves the light irradiation device so as to maintain the irradiation position on the object.

11. The processing device according to any one of claims 1 to 10, The partition wall support device further includes a drive device for driving at least a part of the partition wall support device.

12. The processing apparatus according to claim 11, The drive device moves at least a part of the partition wall support device in a direction different from a direction intersecting a traveling direction of the processing light from the optical system.

13. The processing device according to any one of claims 1 to 12, The bulkhead support device includes a robot arm.

14. The processing device according to any one of claims 1 to 13, The light projection device is vibrationally isolated from the object.

15. irradiating a surface of an object with processing light from an optical system to process the surface of the object; Surrounding a space including an optical path between an optical member located closest to the object side in the optical system and the surface of the object with a partition member; and supporting the bulkhead member with a bulkhead support device; Including, The bulkhead support device does not come into contact with the object. Processing method.

16. The processing method according to claim 15, Measuring a vibration state of at least one of the object and the optical system. Further includes:

17. The processing method according to claim 16, changing an irradiation position of the processing light based on a measurement result of the vibration state; Further includes:

18. The processing method according to claim 17, The varying includes maintaining the illumination position on the object. Includes.

19. The processing method according to any one of claims 16 to 18, moving the optical system in the space surrounded by the partition member; Further includes:

20. 20. The method according to claim 19, The moving includes moving the optical system along a direction intersecting a traveling direction of the processing light from the optical system. Further includes:

21. In the processing method according to claim 19 or 20, The moving includes moving the optical system so as to change the irradiation position of the processing light based on the measurement result of the vibration state. Includes.

22. 22. The processing apparatus according to claim 21, The moving includes maintaining the illumination position on the object. Includes.

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