Sensor element and physical quantity sensor
Patent Information
- Application Number
- JP2023140882
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-08-31
- Publication Date
- 2025-03-13
Smart Images
Figure 2025034484000001_ABST
Abstract
Description
[Technical field]
[0001] The present invention relates to a sensor element and a physical quantity sensor. [Background technology]
[0002] The vibration device described in Patent Document 1 has a box-shaped base, a support substrate supported by the base, and a vibration element supported by the support substrate. The vibration element is an angular velocity detection element that detects an angular velocity around the Z axis, and has a base located at the center, a pair of detection arms extending from the base to both sides in the Y direction, a pair of connecting arms extending from the base to both sides in the X direction, a pair of drive arms extending from the tip of one connecting arm to both sides in the Y direction, and a pair of drive arms extending from the tip of the other connecting arm to both sides in the Y direction. In addition, the vibration element has six electrode pads arranged on the lower surface of the support, and each of these terminals is joined to an element mounting portion of the support substrate, which will be described later, via a conductive joining member such as a metal bump.
[0003] The support substrate has a gimbal structure and has an element mounting portion on which a vibration element is mounted, a frame-shaped support portion located outside the element mounting portion and fixed to the base, a frame portion located between the element mounting portion and the support portion and forming a frame shape surrounding the element mounting portion, a pair of inner beam portions extending from the element mounting portion on both sides in the X direction and connecting the element mounting portion and the frame portion, and a pair of outer beam portions extending from the frame portion on both sides in the Y direction and connecting the frame portion and the support portion.
[0004] In this manner, by interposing the support substrate between the vibration element and the base, stress is less likely to be transmitted to the vibration element, and the detection characteristics of the vibration device are improved. [Prior art documents] [Patent documents]
[0005] [Patent Document 1] JP 2021-117070 A Summary of the Invention [Problem to be solved by the invention]
[0006] However, in the vibration device 1 of Patent Document 1, the area is small, and the distance between each electrode pad, particularly the distance between the electrode pad to which the drive signal is applied and the electrode pad to which the detection signal is output, is small. Therefore, noise occurs in the detection signal due to the capacitance between the electrode pad for the drive signal and the electrode pad for the detection signal. In Patent Document 1, the size of the electrode pad for reducing such capacitance and improving the detection characteristics of the vibration device was not taken into consideration. [Means for solving the problem]
[0007] The sensor element of the present invention comprises a base and A drive vibration unit connected to the base; A detection vibration unit connected to the base; a drive signal electrode disposed on the drive vibration section and to which a drive signal is applied; a detection signal electrode disposed on the detection vibration portion and outputting a detection signal; a drive signal electrode pad disposed on the base and electrically connected to the drive signal electrode; a detection signal electrode pad disposed on the base and electrically connected to the detection signal electrode; At least one of the drive signal electrode pads and the detection signal electrode pads has a width of 30 μm or more and 100 μm or less.
[0008] The physical quantity sensor of the present invention includes a package and a support substrate accommodated in the package and bonded to the package; The sensor element is housed in the package and bonded to the support substrate. [Brief description of the drawings]
[0009] [Figure 1] 1 is a cross-sectional view of a physical quantity sensor according to a first embodiment. [Diagram 2]FIG. 2 is a top view showing the inside of the physical quantity sensor. [Diagram 3] FIG. [Figure 4] FIG. 2 is a top view showing a sensor element. [Diagram 5] FIG. 2 is a perspective view showing a sensor element. [Figure 6] FIG. 4 is a schematic diagram showing a driving vibration mode of a sensor element. [Figure 7] 5A and 5B are schematic diagrams showing detection vibration modes of a sensor element. [Figure 8] FIG. 2 is an enlarged perspective view showing the base of the sensor element. [Figure 9] 13 is a graph showing the relationship between the width and capacitance of an electrode pad. [Figure 10] FIG. 11 is a top view showing a support substrate of the physical quantity sensor according to the second embodiment. [Figure 11] FIG. 2 is an enlarged perspective view showing the base of the sensor element. [Figure 12] 1 is a graph showing the relationship between width W and bonding area. [Figure 13] 1 is a graph showing the relationship between width W and capacitance. [Figure 14] FIG. 11 is an enlarged perspective view showing a base portion of a sensor element according to a third embodiment. [Figure 15] FIG. 11 is a top view showing the inside of a physical quantity sensor according to a fourth embodiment. [Figure 16] FIG. [Figure 17] FIG. 2 is an enlarged plan view showing a base portion of a support substrate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a sensor element and a physical quantity sensor of the present invention will be described in detail based on embodiments shown in the accompanying drawings.
[0011] First Embodiment FIG. 1 is a cross-sectional view of the physical quantity sensor according to the first embodiment. FIG. 2 is a top view showing the inside of the physical quantity sensor. FIG. 3 is a top view showing a support substrate. FIG. 4 is a top view showing a sensor element. FIG. 5 is a see-through view showing the sensor element. FIG. 6 is a schematic diagram showing a drive vibration mode of the sensor element. FIG. 7 is a schematic diagram showing a detection vibration mode of the sensor element. FIG. 8 is an enlarged see-through view showing the base of the sensor element. FIG. 9 is a graph showing the relationship between the width of the electrode pad and the electrostatic capacitance.
[0012] For ease of explanation, each figure shows three mutually orthogonal axes: the X-axis, the Y-axis, and the Z-axis. In the following, the arrow side of each axis will be referred to as the "plus side," and the opposite side as the "minus side." The plus side in the Z-axis direction will be referred to as the "upper side," and the minus side as the "lower side." The planar view from the Z-axis direction will be referred to simply as the "planar view."
[0013] 1 is an angular velocity sensor that detects an angular velocity ωz about the Z axis. Such a physical quantity sensor 1 has a package 2, and a circuit element 3, a support substrate 4, and a sensor element 6 that are housed in the package 2.
[0014] Package 2 The package 2 has a base 21 having a recess 211 opening on the top surface, and a lid 22 joined to the top surface of the base 21 via a joining member 23 so as to close the opening of the recess 211. An internal space S is formed inside the package 2 by the recess 211, and a circuit element 3, a support substrate 4, and a sensor element 6 are housed in the internal space S. The base 21 can be made of ceramics such as alumina, and the lid 22 can be made of a metal material such as kovar. However, the materials of the base 21 and the lid 22 are not particularly limited.
[0015] The internal space S is airtight and in a reduced pressure state, preferably in a state closer to a vacuum, which reduces viscous resistance and improves the vibration characteristics of the sensor element 6. However, the atmosphere of the internal space S is not particularly limited, and may be, for example, atmospheric pressure or pressurized.
[0016] The recess 211 is composed of a plurality of recesses, and includes a recess 211a that opens on the top surface of the base 21, a recess 211b that opens on the bottom surface of the recess 211a and has a smaller opening width than the recess 211a, and a recess 211c that opens on the bottom surface of the recess 211b and has a smaller opening width than the recess 211b. The support substrate 4 is fixed to the bottom surface of the recess 211a while supporting the sensor element 6, and the circuit element 3 is fixed to the bottom surface of the recess 211c.
[0017] Further, a plurality of internal terminals 241 are arranged on the bottom surface of the recess 211a, a plurality of internal terminals 242 are arranged on the bottom surface of the recess 211b, and a plurality of external terminals 243 are arranged on the lower surface of the base 21. Each internal terminal 242 is electrically connected to the internal terminal 241 or the external terminal 243 via a wiring (not shown) formed in the base 21.
[0018] <Support substrate 4> As shown in FIG. 1, the support substrate 4 is a substrate for TAB (Tape Automated Bonding) mounting, and as shown in FIG. 2 and FIG. 3, the support substrate 4 has a plate frame-shaped substrate 49 having an opening 491, and six leads 41, 42, 43, 44, 45, 46 supported by the substrate 49. The substrate 49 is made of a flexible resin such as polyimide, and the leads 41, 42, 43, 44, 45, 46 are made of copper foil, for example. The sensor element 6 is joined to the tip of each of the leads 41, 42, 43, 44, 45, 46 via a conductive joining member B1, and the substrate 49 is joined to the bottom surface of the recess 211a via a conductive joining member B2. The support substrate 4 is located below the sensor element 6 and supports the sensor element 6 so as to lift it up from the bottom. In this way, by interposing the support substrate 4 between the sensor element 6 and the base 21, the support substrate 4 absorbs or reduces the stress transmitted from the base 21, making it difficult for the stress to be transmitted to the sensor element 6. Therefore, it is possible to effectively suppress the deterioration or fluctuation of the vibration characteristics of the sensor element 6, and it is possible to exhibit stable vibration characteristics.
[0019] The bonding members B1 and B2 are not particularly limited as long as they have both electrical conductivity and bonding properties. For example, various metal bumps such as gold bumps, silver bumps, copper bumps, and solder bumps, conductive adhesives in which conductive fillers such as silver fillers are dispersed in various adhesives such as polyimide, epoxy, silicone, and acrylic adhesives, etc. can be used. In this embodiment, the former metal bumps are used as the bonding member B1, and the latter conductive adhesives are used as the bonding member B2. By using the metal bumps as the bonding member B1, it is possible to suppress the generation of gas from the bonding member B1, and it is possible to effectively suppress environmental changes in the internal space S, particularly the increase in pressure. In addition, the diameter of the bonding member B1 can be reduced. In addition, by using the conductive adhesive as the bonding member B2, it is easy to bond the support substrate 4 and the base 21.
[0020] The leads 41, 42, 43, 44, 45, and 46 are each bonded to the lower surface of the substrate 49 by an adhesive (not shown). The leads 41, 42, 43, 44, 45, and 46 are each electrically connected to the corresponding internal terminals 241 via a bonding member B2.
[0021] In plan view from the Z-axis direction, the tips of the leads 41, 42, 43, 44, 45, and 46 each extend into the opening 491. The leads 41, 42, 43, 44, 45, and 46 are each bent and inclined midway, and their tips pass through the opening 491 and are positioned above the substrate 49. The base 70 of the sensor element 6 is fixed to the tip of each of the leads 41, 42, 43, 44, 45, and 46 via the bonding member B1.
[0022] <Sensor element 6> The sensor element 6 is an angular velocity sensor element that detects an angular velocity ωz around the Z-axis. As shown in Fig. 4 and Fig. 5, the sensor element 6 has a vibration substrate 7 and an electrode 8 arranged on the surface of the vibration substrate 7. The vibration substrate 7 is, for example, made of a Z-cut quartz substrate, and has a base 70 located in the center of the element, a detection vibration part 61 extending from the base 70, and a drive vibration part 62 extending from the base 70. The base 70 is joined to the tip parts of the leads 41, 42, 43, 44, 45, and 46 of the support substrate 4 via six joining members B1.
[0023] The detection vibration unit 61 has a first detection vibration arm 71 and a second detection vibration arm 72 extending from the base 70 toward both sides in the Y-axis direction. The drive vibration unit 62 has a first connecting arm 73 and a second connecting arm 74 extending from the base 70 toward both sides in the X-axis direction, a first drive vibration arm 75 and a second drive vibration arm 76 extending from the tip of the first connecting arm 73 toward both sides in the Y-axis direction, and a third drive vibration arm 77 and a fourth drive vibration arm 78 extending from the tip of the second connecting arm 74 toward both sides in the Y-axis direction.
[0024] The base 70 is rectangular and has a first side 70a located on the positive side in the Y-axis direction, a second side 70b located on the negative side in the Y-axis direction and facing the first side 70a, a third side 70c located on the positive side in the X-axis direction, and a fourth side 70d located on the negative side in the X-axis direction and facing the third side 70c. The first and second sides 70a and 70b each extend in the X-axis direction, and the third and fourth sides 70c and 70d each extend in the Y-axis direction. The third side 70c connects the ends of the first and second sides 70a and 70b on the positive side in the X-axis direction, and the fourth side 70d connects the ends of the first and second sides 70a and 70b on the negative side in the X-axis direction. In addition, the term "rectangle" as used herein refers not only to shapes that coincide with a rectangle, but also to shapes that can be considered to be substantially rectangular, such as a shape in which at least one corner is chamfered or a shape in which at least one corner is deviated from a right angle.
[0025] In the base 70 having such a shape, a first detection vibration arm 71 extends from the first side 70a toward the positive side in the Y-axis direction, a second detection vibration arm 72 extends from the second side 70b toward the negative side in the Y-axis direction, a first connecting arm 73 extends from the third side 70c toward the positive side in the X-axis direction, and a second connecting arm 74 extends from the fourth side 70d toward the negative side in the X-axis direction.
[0026] In addition, electrode 8 has a drive signal electrode 811, a drive ground electrode 821, a first detection signal electrode 831 which is a detection signal electrode, a first detection ground electrode 841 which is a detection ground electrode, a second detection signal electrode 851 which is a detection signal electrode, and a second detection ground electrode 861 which is a detection ground electrode.
[0027] The drive signal electrode 811 is arranged on the upper and lower surfaces of the first and second drive vibration arms 75, 76 and on both side surfaces of the third and fourth drive vibration arms 77, 78. On the other hand, the drive ground electrode 821 is arranged on both side surfaces of the first and second drive vibration arms 75, 76 and on the upper and lower surfaces of the third and fourth drive vibration arms 77, 78. The drive signal electrode 811 is an electrode to which a drive signal is applied, and the drive ground electrode 821 is connected to a potential that is grounded with respect to the drive signal electrode 811. In this embodiment, the circuit element 3 detects the drive state of the drive vibration section 62 based on a signal output from the drive ground electrode 821 when the circuit element 3 is driven in a drive vibration mode described later.
[0028] Further, the first detection signal electrode 831 is arranged on the upper and lower surfaces of the first detection vibration arm 71, and the first detection ground electrode 841 is arranged on both side surfaces of the first detection vibration arm 71. The first detection signal electrode 831 is an electrode that outputs a first detection signal in a detection vibration mode described later, and the first detection ground electrode 841 is connected to a potential that is grounded with respect to the first detection signal electrode 831, particularly to the ground in this embodiment. Further, the second detection signal electrode 851 is arranged on the upper and lower surfaces of the second detection vibration arm 72, and the second detection ground electrode 861 is arranged on both side surfaces of the second detection vibration arm 72. The second detection signal electrode 851 is an electrode that outputs a second detection signal in a detection vibration mode described later, and the second detection ground electrode 861 is connected to a potential that is grounded with respect to the second detection signal electrode 851, particularly to the ground in this embodiment.
[0029] Such a sensor element 6 detects the angular velocity ωz as follows. When a drive signal is applied between the drive signal electrode 811 and the drive ground electrode 821, the drive vibration mode is excited. In the drive vibration mode, as shown in FIG. 6, the first and second drive vibration arms 75, 76 and the third and fourth drive vibration arms 77, 78 flexurally vibrate in opposite phases along the XY plane. In this state, the vibrations of the first, second, third and fourth drive vibration arms 75, 76, 77, 78 are cancelled, and the first and second detection vibration arms 71, 72 do not substantially vibrate. When an angular velocity ωz is applied to the sensor element 6 while it is driven in the drive vibration mode, the detection vibration mode is newly excited. In the detection vibration mode, as shown in FIG. 7, the Coriolis force acts on the first, second, third, and fourth drive vibration arms 75, 76, 77, and 78, exciting bending vibration in the Y-axis direction, and in response to this bending vibration, the first and second detection vibration arms 71 and 72 perform bending vibration in the X-axis direction.
[0030] Returning to the description of the electrode 8, as shown in Fig. 8, the electrode 8 has four electrode pads arranged on the lower surface of the base 70. The four electrode pads include a drive signal electrode pad 812, a drive ground electrode pad 822, a first detection signal electrode pad 832, and a second detection signal electrode pad 852. The drive signal electrode pad 812 is electrically connected to the drive signal electrode 811, the drive ground electrode pad 822 is electrically connected to the drive ground electrode 821, the first detection signal electrode pad 832 is electrically connected to the first detection signal electrode 831, and the second detection signal electrode pad 852 is electrically connected to the second detection signal electrode 851. The electrode pad 812 for drive signals and the lead 41, the electrode pad 822 for drive ground and the lead 44, the electrode pad 832 for first detection signals and the lead 45, and the electrode pad 852 for second detection signals and the lead 46 are each mechanically joined and electrically connected via a joining member B1.
[0031] Further, the drive signal electrode pad 812 is located on the X-axis intersecting with the center O of the sensor element 6 and is disposed along the third side 70c. In contrast to this, the drive ground electrode pad 822 is located on the X-axis intersecting with the center O of the sensor element 6 and is disposed along the fourth side 70d. That is, the drive signal electrode pad 812 is closer to the third side 70c than the fourth side 70d and is disposed at a position intermediate between the first side 70a and the second side 70b, and the drive ground electrode pad 822 is closer to the fourth side 70d than the third side 70c and is disposed at a position intermediate between the first side 70a and the second side 70b.
[0032] The first detection signal electrode pad 832 is disposed at a corner between the first side 70a and the fourth side 70d. On the other hand, the second detection signal electrode pad 852 is disposed at a corner between the second side 70b and the fourth side 70d. That is, the first detection signal electrode pad 832 is disposed at a position closer to the first side 70a than the second side 70b and closer to the fourth side 70d than the third side 70c, and the second detection signal electrode pad 852 is disposed at a position closer to the second side 70b than the first side 70a and closer to the fourth side 70d than the third side 70c. Furthermore, the first and second detection signal electrode pads 832 and 852 are each disposed slightly shifted toward the third side 70c (positive side in the X-axis direction) with respect to the driving ground electrode pad 822.
[0033] By arranging the four electrode pads 812, 822, 832, 852 as described above, the drive signal electrode pad 812 and the first and second detection signal electrode pads 832, 852 can be arranged as far apart as possible within the base 70. Therefore, capacitive coupling between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832, 852 is suppressed, making it difficult for noise caused by the drive signal to be carried in the first and second detection signals.
[0034] In particular, in this embodiment, the electrode pad 812 for the drive signals and the electrode pads 832 and 852 for the first and second detection signals are each circular in plan view. In this way, by making the electrode pads 812, 832, and 852 circular, it becomes easier to increase the distance between the electrode pad 812 for the drive signals and the electrode pads 832 and 852 for the first and second detection signals. Therefore, the capacitive coupling between the electrode pad 812 for the drive signals and the electrode pads 832 and 852 for the first and second detection signals is suppressed, and noise caused by the drive signals is less likely to be carried in the first and second detection signals. The shapes of the electrode pad 812 for the drive signals and the electrode pads 832 and 852 for the first and second detection signals are not particularly limited, and for example, at least one of them may be a rectangle such as a square or a rectangle, a triangle, a pentagon, or a polygon having more than one side, or an ellipse, an oval, an irregular shape, or the like.
[0035] Moreover, the widths W of the drive signal electrode pad 812, the drive ground electrode pad 822, the first detection signal electrode pad 832, and the second detection signal electrode pad 852 are 30 μm or more and 100 μm or less, respectively. By setting the width W in such a numerical range, the distance between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 can be sufficiently increased, and the capacitance between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 can be effectively reduced. Furthermore, the distance between the drive ground electrode pad 822 and the first and second detection signal electrode pads 832 and 852 can be sufficiently increased, and the capacitance between the drive ground electrode pad 822 and the first and second detection signal electrode pads 832 and 852 can be effectively reduced. However, the signal output from the drive ground electrode pad 822 is weak and has almost no effect on the first and second detection signals.
[0036] FIG. 9 shows the measurement results of the capacitance between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852. The measurement results are calculation results obtained by simulation. As can be seen from the figure, by setting the width W to 100 μm or less, the capacitance can be suppressed to 1.25 fF or less. Therefore, the capacitance can be suppressed sufficiently small, and noise caused by the drive signal is less likely to be carried in the first and second detection signals. In addition, in an area where the width W is less than 30 μm, the reduction rate of the capacitance with respect to the width W is significantly reduced. Therefore, the disadvantage of reducing the width W is greater than the above-mentioned advantage of reducing the capacitance. The disadvantages include, for example, a decrease in the bonding strength caused by a decrease in the bonding area with the bonding member B1.
[0037] The width W may be 30 μm or more and 100 μm or less, and is preferably 80 μm or less, which can further reduce the capacitance between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832, 852, and can further reduce noise in the first and second detection signals.
[0038] In this embodiment, the widths W of the drive signal electrode pads 812, the first detection signal electrode pads 832, and the second detection signal electrode pads 852 are all 30 μm or more and 100 μm or less, but the present invention is not limited to this, and it is sufficient that the width W of at least one of the drive signal electrode pads 812, the first detection signal electrode pads 832, and the second detection signal electrode pads 852 is 30 μm or more and 100 μm or less. Even in such a case, the same effect as in this embodiment can be achieved.
[0039] The electrode 8 also has a plurality of wirings arranged on the lower surface of the base 70. The plurality of wirings include a first detection ground wiring 843 arranged on the lower surface of the base 70 and electrically connected to the first detection ground electrode 841, and a second detection ground wiring 863 arranged on the lower surface of the base 70 and electrically connected to the second detection ground electrode 861. The first detection ground wiring 843 and the lead 42, and the second detection ground wiring 863 and the lead 43 are mechanically joined and electrically connected via a joining member B1. When an axis passing through the center O of the sensor element 6 and extending in the Y-axis direction is taken as a virtual central axis, the joining member B1 joined to the first detection signal electrode pad 832 and the joining member B1 joined to the first detection ground wiring 843, the joining member B1 joined to the second detection signal electrode pad 852, and the joining member B1 joined to the second detection ground wiring 863 are each arranged symmetrically with respect to the virtual central axis.
[0040] Among these, the first detection ground wiring 843 is located between the drive signal electrode pad 812 and the drive ground electrode pad 822 and the first detection signal electrode pad 832, and is arranged to spread so as to fill almost the entire gap between them. Similarly, the second detection ground wiring 863 is located between the drive signal electrode pad 812 and the drive ground electrode pad 822 and the second detection signal electrode pad 852, and is arranged to spread so as to fill almost the entire gap between them. In this way, by arranging the first and second detection ground wirings 843 and 863 connected to ground between the drive signal electrode pad 812 to which the drive signal is applied and the first and second detection signal electrode pads 832 and 852 to which the first and second detection signals are output, the capacitive coupling between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852 is suppressed, and noise caused by the drive signal is less likely to be carried in the first and second detection signals. Therefore, it is possible to effectively suppress the deterioration of the detection characteristics of the angular velocity ωz. In particular, since the first and second detection signals are very weak compared to the drive signal, the above-mentioned effect is more pronounced.
[0041] The electrode 8 also has a driving ground wiring 823 that connects the driving ground electrode 821 and the driving ground electrode pad 822. The driving ground wiring 823 is disposed so as to surround the driving signal electrode pad 812. More specifically, the driving ground wiring 823 extends from the driving ground electrode pad 822 to the positive side in the X-axis direction, wraps around both sides of the driving signal electrode pad 812 just before colliding with the driving signal electrode pad 812, and then extends further to the positive side in the X-axis direction. The first detection ground wiring 843 is located between the driving ground wiring 823 and the first detection signal electrode pad 832, and the second detection ground wiring 863 is located between the driving ground wiring 823 and the second detection signal electrode pad 852. This suppresses capacitive coupling between the driving ground wiring 823 and the first and second detection signal electrode pads 832, 852, making it difficult for noise caused by the signal output from the driving ground electrode 821 to be carried in the first and second detection signals.
[0042] <Circuit element 3> 1, the circuit element 3 is fixed to the bottom surface of the recess 211c. The circuit element 3 also includes a drive / detection circuit that applies drive vibration to the sensor element 6 to drive the sensor element 6 and detects the angular velocity ωz based on the first and second detection signals output from the sensor element 6. However, the configuration of the circuit element 3 is not particularly limited, and may include other circuits such as a temperature compensation circuit.
[0043] The physical quantity sensor 1 has been described above. As described above, the sensor element 6 included in the physical quantity sensor 1 includes the base 70, the drive vibration section 62 connected to the base 70, the detection vibration section 61 connected to the base 70, the drive signal electrode 811 disposed on the drive vibration section 62 and to which a drive signal is applied, the first and second detection signal electrodes 831, 851 disposed on the detection vibration section 61 and serving as detection signal electrodes from which the first and second detection signals, which are detection signals, are output, the drive signal electrode pad 812 disposed on the base 70 and electrically connected to the drive signal electrode 811, and the first and second detection signal electrode pads 832, 852 disposed on the base 70 and serving as detection signal electrode pads electrically connected to the first and second detection signal electrodes 831, 851. At least one of the drive signal electrode pad 812 and the first and second detection signal electrode pads 832, 852 has a width of 30 μm or more and 100 μm or less. In this way, by setting the width W to 30 μm or more and 100 μm or less, the capacitive coupling between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832, 852 is suppressed, and noise caused by the drive signal is less likely to be carried in the first and second detection signals, so that the deterioration of the detection characteristics of the angular velocity ωz can be effectively suppressed.
[0044] As described above, the widths W of the drive signal electrode pad 812 and the first and second detection signal electrode pads 832, 852 are 30 μm or more and 100 μm or less, respectively. With this configuration, the capacitive coupling between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832, 852 is more effectively suppressed, and noise caused by the drive signal is less likely to be carried in the first and second detection signals. Therefore, the deterioration of the detection characteristics of the angular velocity ωz can be effectively suppressed.
[0045] As described above, the width W of the drive signal electrode pad 812 and the first and second detection signal electrode pads 832, 852 is 80 μm or less. With this configuration, the capacitive coupling between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832, 852 is more effectively suppressed, and noise caused by the drive signal is less likely to be carried in the first and second detection signals. Therefore, the deterioration of the detection characteristics of the angular velocity ωz can be effectively suppressed.
[0046] As described above, the drive signal electrode pad 812 and the first and second detection signal electrode pads 832, 852 are each circular in a plan view of the base 70, that is, in a plan view from the Z-axis direction. With this configuration, it is easy to increase the distance between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832, 852. Therefore, capacitive coupling between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832, 852 is suppressed, and noise caused by the drive signal is less likely to be carried in the first and second detection signals.
[0047] As described above, the sensor element 6 has the first and second detection ground electrodes 841, 861, which are detection ground electrodes arranged in the detection vibration section 61 and connected to a potential that is grounded with respect to the first and second detection signal electrodes 831, 851, and the first and second detection ground wirings 843, 863, which are detection ground wirings arranged in the base section 70 and electrically connected to the first and second detection ground electrodes 841, 861. The first and second detection ground wirings 843, 863 are arranged between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832, 852. According to this configuration, the first and second detection ground wirings 843, 863 suppress the capacitive coupling between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832, 852, making it difficult for noise caused by the drive signal to be carried in the first and second detection signals. Therefore, it is possible to effectively suppress the deterioration of the detection characteristics of the angular velocity ωz.
[0048] As described above, the sensor element 6 has a driving ground electrode 821 disposed in the driving vibration section 62 and connected to a potential that is grounded with respect to the driving signal electrode 811, and a driving ground electrode pad 822 disposed in the base section 70 and electrically connected to the driving ground electrode 821. The driving signal electrode pad 812 is surrounded by a driving ground wiring 823 that connects the driving ground electrode 821 and the driving ground electrode pad 822, and the first and second detection signal electrode pads 832 and 852 are interposed between the driving ground wiring 823 and the first and second detection signal electrode pads 832 and 852. With this configuration, the capacitive coupling between the driving ground wiring 823 and the first and second detection signal electrode pads 832 and 852 is suppressed, and noise caused by the signal output from the driving ground electrode 821 is less likely to be carried in the first and second detection signals.
[0049] As described above, in a plan view of the base 70, that is, in a plan view from the Z-axis direction, the base 70 has a first side 70a, a second side 70b facing the first side 70a, a third side 70c intersecting with the first side 70a, and a fourth side 70d facing the third side 70c. The detection vibration section 61 has a first detection vibration arm 71 extending from the first side 70a and a second detection vibration arm 72 extending from the second side 70b. The detection signal electrode has a first detection signal electrode 831 arranged on the first detection vibration arm 71 and a second detection signal electrode 851 arranged on the second detection vibration arm 72. The detection signal electrode pad has a first detection signal electrode pad 832 electrically connected to the first detection signal electrode 831 and a second detection signal electrode pad 852 electrically connected to the second detection signal electrode 851. The driving vibration section 62 has a first connecting arm 73 extending from the third side 70c, a first driving vibration arm 75 and a second driving vibration arm 76 extending from the first connecting arm 73 in opposite directions, a second connecting arm 74 extending from the fourth side 70d, and a third driving vibration arm 77 and a fourth driving vibration arm 78 extending from the second connecting arm 74 in opposite directions. The driving signal electrode pad 812 is closer to the third side 70c than the fourth side 70d and is disposed at a position intermediate between the first side 70a and the second side 70b, and the driving ground electrode pad 822 is closer to the fourth side 70d than the third side 70c and is disposed at a position intermediate between the first side 70a and the second side 70b. Further, the first detection signal electrode pad 832 is disposed at a position closer to the first side 70a than the second side 70b and closer to the fourth side 70d than the third side 70c, and the second detection signal electrode pad 852 is disposed at a position closer to the second side 70b than the first side 70a and closer to the fourth side 70d than the third side 70c. With this configuration, the drive signal electrode pad 812 and the first and second detection signal electrode pads 832, 852 can be disposed as far apart as possible within the base 70. Therefore, the capacitive coupling between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832, 852 is suppressed, and noise caused by the drive signal is less likely to be carried in the first and second detection signals.
[0050] As described above, the physical quantity sensor 1 has the package 2, the support substrate 4 housed in the package 2 and joined to the package 2, and the sensor element 6 housed in the package 2 and joined to the support substrate 4. With this configuration, it is possible to obtain the effects of the sensor element 6 described above, and it is possible to effectively suppress deterioration of the physical quantity detection characteristics of the physical quantity sensor 1.
[0051] <Second embodiment> Fig. 10 is a top view showing a support substrate of the physical quantity sensor according to the second embodiment. Fig. 11 is an enlarged perspective view showing a base of a sensor element. Fig. 12 is a graph showing the relationship between width W and bonding area. Fig. 13 is a graph showing the relationship between width W and capacitance.
[0052] This embodiment is similar to the first embodiment described above, except that the number of bonding members B1 that bond the sensor element 6 to the support substrate 4 and the number of leads on the support substrate 4 are different. In the following description, the present embodiment will be described with a focus on the differences from the first embodiment described above, and descriptions of similar matters will be omitted. In each drawing of this embodiment, the same reference numerals are used for configurations similar to those of the above-mentioned embodiment.
[0053] 10, the support substrate 4 of this embodiment has eight leads 41, 42, 43, 44, 45, 46, 47, and 48. The sensor element 6 is joined to the tip portions of the leads 41, 42, 43, 44, 45, 46, 47, and 48 by eight joining members B1. As shown in FIG. 11, in this embodiment, two joining members B1 are joined to the first detection ground wiring 843, and two joining members B1 are joined to the second detection ground wiring 863.
[0054] One joint member B1a joined to the first detection ground wiring 843 is disposed at the corner between the first side 70a and the third side 70c. That is, the joint member B1a is disposed at a position closer to the first side 70a than the second side 70b, and closer to the third side 70c than the fourth side 70d. In contrast, the other joint member B1b is disposed at a position closer to the first side 70a than the second side 70b, and at a midpoint between the third side 70c and the fourth side 70d. The first detection ground wiring 843 is joined to the lead 42 via the joint member B1a, and joined to the lead 47 via the joint member B1b.
[0055] Similarly, one of the joint members B1c joined to the second detection ground wiring 863 is disposed at the corner between the second side 70b and the third side 70c. That is, the joint member B1c is disposed at a position closer to the second side 70b than the first side 70a, and closer to the third side 70c than the fourth side 70d. In contrast, the other joint member B1d is disposed at a position closer to the second side 70b than the first side 70a, and at a midpoint between the third side 70c and the fourth side 70d. The second detection ground wiring 863 is joined to the lead 43 via the joint member B1c, and joined to the lead 48 via the joint member B1d.
[0056] These eight joint members B1 are disposed symmetrically with respect to the center O of the sensor element 6. This makes it possible to support the sensor element 6 in a well-balanced manner.
[0057] In this way, by using eight bonding members B1, it becomes easier to ensure the bonding strength between the sensor element 6 and the support substrate 4. Therefore, the width W of each electrode pad 812, 822, 832, 852 can be reduced while maintaining sufficient bonding strength. Here, FIG. 12 is a graph showing the relationship between the width W and the bonding area. Note that the "bonding area" is the bonding area between the electrode 8 and the bonding member B1, and in this graph, the diameter of the bonding member B1 is 80 μm. Also, FIG. 13 is a graph showing the relationship between the width W and the capacitance. Note that the "capacitance" is the capacitance between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832, 852.
[0058] 12 shows that when the number of bonding members B1 is eight, the width W needs to be 67 μm or more to obtain a bonding strength exceeding that of the width W=80 μm when the number of bonding members B1 is six. Also, from FIG. 13, it shows that the capacitance at the width W=67 μm when the number of bonding members B1 is eight is smaller than the capacitance at the width W=80 μm when the number of bonding members B1 is six. Thus, according to this embodiment, the capacitance can be effectively reduced while maintaining sufficient bonding strength.
[0059] The second embodiment as described above can also achieve the same effects as the first embodiment.
[0060] <Third embodiment> FIG. 14 is an enlarged perspective view showing a base portion of the sensor element according to the third embodiment.
[0061] This embodiment is similar to the second embodiment described above, except for the configuration of the sensor element 6. In the following description, the present embodiment will be described focusing on the differences from the previous embodiment, and the description of the similarities will be omitted. In the drawings of this embodiment, the same reference numerals are used for the same configurations as the previous embodiment.
[0062] As shown in FIG. 14, in this embodiment, the electrode 8 has six electrode pads arranged on the lower surface of the base 70. The six electrode pads include a drive signal electrode pad 812, a drive ground electrode pad 822, a first detection signal electrode pad 832, a first detection ground electrode pad 842, a second detection signal electrode pad 852, and a second detection ground electrode pad 862. The first detection ground electrode pad 842 is electrically connected to the first detection ground electrode 841, and the second detection ground electrode pad 862 is electrically connected to the second detection ground electrode 861. The first detection ground electrode pad 842 and the lead 47, and the second detection ground electrode pad 862 and the lead 48 are mechanically joined and electrically connected via the joining member B1, respectively. The other electrode pads are the same as those in the above-mentioned embodiment.
[0063] The electrode 8 also has a plurality of wirings arranged on the lower surface of the base 70. The plurality of wirings include a first ground wiring 873 and a second ground wiring 883. The first ground wiring 873 and the lead 42, and the second ground wiring 883 and the lead 43 are mechanically joined and electrically connected via a joining member B1, respectively. The first and second ground wirings 873 and 883 are each connected to the ground.
[0064] The first ground wiring 873 is disposed between the drive signal electrode pad 812 and the drive ground electrode pad 822 and the first detection signal electrode pad 832 and the first detection ground electrode pad 842. Similarly, the second ground wiring 883 is disposed between the drive signal electrode pad 812 and the drive ground electrode pad 822 and the second detection signal electrode pad 852 and the second detection ground electrode pad 862. According to this configuration, the first and second ground wirings 873 and 883 suppress the capacitive coupling between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852, making it difficult for noise caused by the drive signal to be carried in the first and second detection signals. Therefore, it is possible to effectively suppress the deterioration of the detection characteristics of the angular velocity ωz.
[0065] In such a configuration, the first and second detection ground electrodes 841, 861 can be used as detection signal electrodes rather than as ground electrodes. When the first and second detection ground electrodes 841, 861 are used as detection signal electrodes, the first detection ground electrode 841 is also referred to as a third detection signal electrode 841a, the second detection ground electrode 861 is also referred to as a fourth detection signal electrode 861a, the first detection ground electrode pad 842 is also referred to as a third detection signal electrode pad 842a, and the second detection ground electrode pad 862 is also referred to as a fourth detection signal electrode pad 862a.
[0066] When the first and second detection ground electrodes 841, 861 are used as the third and fourth detection signal electrodes 841a, 861a, the first detection signal is obtained by adding the detection signal output from the first detection signal electrode 831 and the detection signal output from the fourth detection signal electrode 861a, and the second detection signal is obtained by adding the detection signal output from the second detection signal electrode 851 and the detection signal output from the third detection signal electrode 841a. This makes it possible to obtain the first and second detection signals with twice the amount of charge compared to the first embodiment described above. Therefore, the detection sensitivity of the sensor element 6 can be improved.
[0067] In particular, the first ground wiring 873 is disposed between the drive signal electrode pad 812 and the drive ground electrode pad 822 and the first detection signal electrode pad 832 and the third detection signal electrode pad 842a, and the second ground wiring 883 is disposed between the drive signal electrode pad 812 and the drive ground electrode pad 822 and the second detection signal electrode pad 852 and the fourth detection signal electrode pad 862a. Therefore, the first and second ground wirings 873 and 883 suppress the capacitive coupling between the drive signal electrode pad 812 and the first, second, third, and fourth detection signal electrode pads 832, 852, 842a, and 862a, making it difficult for noise caused by the drive signal to be carried in the detection signal. Therefore, the deterioration of the detection characteristic of the angular velocity ωz can be effectively suppressed.
[0068] Furthermore, the widths W of the drive signal electrode pad 812, the drive ground electrode pad 822, the first detection signal electrode pad 832, the first detection ground electrode pad 842, the second detection signal electrode pad 852, and the second detection ground electrode pad 862 are each 30 μm or more and 100 μm or less. This allows the distance between the drive signal electrode pad 812 and the first, second, third, and fourth detection signal electrode pads 832, 852, 842a, and 862a to be sufficiently large, and the electrostatic capacitance between the drive signal electrode pad 812 and the first, second, third, and fourth detection signal electrode pads 832, 852, 842a, and 862a can be effectively reduced. In addition, the distance between the driving ground electrode pad 822 and the first, second, third, and fourth detection signal electrode pads 832, 852, 842a, and 862a can be made sufficiently large, and the electrostatic capacitance between the driving ground electrode pad 822 and the first, second, third, and fourth detection signal electrode pads 832, 852, 842a, and 862a can be effectively reduced.
[0069] As described above, when the first and second detection ground electrodes 841 and 861 are not used as detection signal electrodes, the sensor element 6 of this embodiment has, in a plan view of the base 70, a first side 70a, a second side 70b facing the first side 70a, a third side 70c intersecting with the first side 70a, and a fourth side 70d facing the third side 70c. The detection vibration section 61 also has a first detection vibration arm 71 extending from the first side 70a and a second detection vibration arm 72 extending from the second side 70b. The detection signal electrodes also have a first detection signal electrode 831 arranged on the first detection vibration arm 71 and a second detection signal electrode 851 arranged on the second detection vibration arm 72. The detection signal electrode pads include a first detection signal electrode pad 832 electrically connected to the first detection signal electrode 831, and a second detection signal electrode pad 852 electrically connected to the second detection signal electrode 851. The drive vibration section 62 includes a first connecting arm 73 extending from the third side 70c, a first drive vibration arm 75 and a second drive vibration arm 76 extending from the first connecting arm 73 in opposite directions, a second connecting arm 74 extending from the fourth side 70d, and a third drive vibration arm 77 and a fourth drive vibration arm 78 extending from the second connecting arm 74 in opposite directions. The sensor element 6 further includes a first detection ground electrode 841 arranged on the first detection vibration arm 71 and connected to a potential that is ground relative to the first detection signal electrode 831, a first detection ground electrode pad 842 arranged on the base 70 and electrically connected to the first detection ground electrode 841, a second detection ground electrode 861 arranged on the second detection vibration arm 72 and connected to a potential that is ground relative to the second detection signal electrode 851, a second detection ground electrode pad 862 arranged on the base 70 and electrically connected to the second detection ground electrode 861, and a first ground wiring 873 and a second ground wiring 883 arranged on the base 70 and connected to ground. The electrode pad 812 for drive signals is closer to the third side 70c than the fourth side 70d and is positioned midway between the first side 70a and the second side 70b, and the electrode pad 822 for drive ground is closer to the fourth side 70d than the third side 70c and is positioned midway between the first side 70a and the second side 70b.The first detection signal electrode pad 832 is disposed at a position closer to the first side 70a than the second side 70b and closer to the fourth side 70d than the third side 70c, the first detection ground electrode pad 842 is disposed at a position closer to the first side 70a than the second side 70b and intermediate between the third side 70c and the fourth side 70d. The second detection signal electrode pad 852 is disposed at a position closer to the second side 70b than the first side 70a and closer to the fourth side 70d than the third side 70c, and the second detection ground electrode pad 862 is disposed at a position closer to the second side 70b than the first side 70a and intermediate between the third side 70c and the fourth side 70d. The first ground wiring 873 is disposed between the drive signal electrode pad 812 and the drive ground electrode pad 822 and the first detection signal electrode pad 832 and the first detection ground electrode pad 842, and the second ground wiring 883 is disposed between the drive signal electrode pad 812 and the drive ground electrode pad 822 and the second detection signal electrode pad 852 and the second detection ground electrode pad 862. With this configuration, the first and second ground wirings 873 and 883 suppress capacitive coupling between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852, making it difficult for noise caused by the drive signal to be carried in the detection signal. Therefore, it is possible to effectively suppress deterioration in the detection characteristics of the angular velocity ωz.
[0070] On the other hand, when the first and second detection ground electrodes 841 and 861 are used as detection signal electrodes, the sensor element 6 of this embodiment has, in a plan view of the base 70, a first side 70a, a second side 70b facing the first side 70a, a third side 70c intersecting with the first side 70a, and a fourth side 70d facing the third side 70c. The detection vibration section 61 has a first detection vibration arm 71 extending from the first side 70a and a second detection vibration arm 72 extending from the second side 70b. The detection signal electrodes have a first detection signal electrode 831 arranged on the first detection vibration arm 71 and a second detection signal electrode 851 arranged on the second detection vibration arm 72. The detection signal electrode pads include a first detection signal electrode pad 832 electrically connected to the first detection signal electrode 831, and a second detection signal electrode pad 852 electrically connected to the second detection signal electrode 851. The drive vibration section 62 includes a first connecting arm 73 extending from the third side 70c, a first drive vibration arm 75 and a second drive vibration arm 76 extending from the first connecting arm 73 in opposite directions, a second connecting arm 74 extending from the fourth side 70d, and a third drive vibration arm 77 and a fourth drive vibration arm 78 extending from the second connecting arm 74 in opposite directions. The sensor element 6 further includes a third detection signal electrode 841a disposed on the first detection vibration arm 71, a third detection signal electrode pad 842a disposed on the base 70 and electrically connected to the third detection signal electrode 841a, a fourth detection signal electrode 861a disposed on the second detection vibration arm 72, a fourth detection signal electrode pad 862a disposed on the base 70 and electrically connected to the fourth detection signal electrode 861a, and a first ground wiring 873 and a second ground wiring 883 disposed on the base 70 and connected to ground. The drive signal electrode pad 812 is closer to the third side 70c than the fourth side 70d and is disposed at a position intermediate between the first side 70a and the second side 70b, and the drive ground electrode pad 822 is closer to the fourth side 70d than the third side 70c and is disposed at a position intermediate between the first side 70a and the second side 70b.The first detection signal electrode pad 832 is disposed at a position closer to the first side 70a than the second side 70b and closer to the fourth side 70d than the third side 70c, the third detection signal electrode pad 842a is disposed at a position closer to the first side 70a than the second side 70b and at an intermediate position between the third side 70c and the fourth side 70d, the second detection signal electrode pad 852 is disposed at a position closer to the second side 70b than the first side 70a and closer to the fourth side 70d than the third side 70c, and the fourth detection signal electrode pad 862a is disposed at a position closer to the second side 70b than the first side 70a and at an intermediate position between the third side 70c and the fourth side 70d. The first ground wiring 873 is disposed between the drive signal electrode pad 812 and the drive ground electrode pad 822 and the first detection signal electrode pad 832 and the third detection signal electrode pad 842a, and the second ground wiring 883 is disposed between the drive signal electrode pad 812 and the drive ground electrode pad 822 and the second detection signal electrode pad 852 and the fourth detection signal electrode pad 862a. With this configuration, the first and second ground wirings 873 and 883 suppress the capacitive coupling between the drive signal electrode pad 812 and the first and second detection signal electrode pads 832 and 852, making it difficult for noise caused by the drive signal to be carried in the first and second detection signals. Therefore, it is possible to effectively suppress the deterioration of the detection characteristics of the angular velocity ωz.
[0071] The third embodiment as described above can also achieve the same effects as the first embodiment described above.
[0072] <Fourth embodiment> Fig. 15 is a top view showing the inside of the physical quantity sensor according to the fourth embodiment, Fig. 16 is a top view showing a support substrate, and Fig. 17 is an enlarged plan view showing a base portion of the support substrate.
[0073] This embodiment is similar to the third embodiment described above, except that a support substrate 9 is used instead of the support substrate 4. In the following description, the present embodiment will be described mainly with respect to the differences from the previous embodiment, and a description of the similarities will be omitted. In each drawing of this embodiment, the same reference numerals are used to designate the same components as those in the previous embodiment.
[0074] 15 and 16, the support substrate 9 has a base 90 located at the center, a frame-shaped support portion 91 surrounding the base 90, beam portions 921 and 922 connecting the base 90 and the support portion 91 on the positive side of the base 90 in the X-axis direction, and beam portions 923 and 924 connecting the base 90 and the support portion 91 on the negative side of the base 90 in the X-axis direction. The base 70 of the sensor element 6 is fixed to the base 90 via a bonding member B1, and the support portion 91 is fixed to the bottom surface of the recess 211a via a bonding member B2.
[0075] The support substrate 9 is formed of a quartz substrate, similar to the vibration substrate 7. This allows the support substrate 9 and the vibration substrate 7 to have the same thermal expansion coefficient. Therefore, thermal stress caused by the difference in thermal expansion coefficient between the support substrate 9 and the vibration substrate 7 does not substantially occur between them, and the sensor element 6 is less susceptible to stress. Therefore, the sensor element 6 can exhibit stable vibration characteristics. However, the material of the support substrate 9 is not particularly limited.
[0076] Moreover, the wiring 5 electrically connecting the sensor element 6 and the internal terminal 241 is arranged on the support substrate 9 as described above. As shown in Fig. 17, the wiring 5 has eight element side terminals 511, 521, 531, 541, 551, 561, 571, 581 arranged on the upper surface of the base 90. The element side terminal 511 and the drive signal electrode pad 812, the element side terminal 521 and the drive ground electrode pad 822, the element side terminal 541 and the first detection signal electrode pad 832, the element side terminal 531 and the first detection ground electrode pad 842, the element side terminal 561 and the second detection signal electrode pad 852, the element side terminal 551 and the second detection ground electrode pad 862, the element side terminal 571 and the first ground wiring 873, and the element side terminal 581 and the second ground wiring 883 are mechanically joined and electrically connected via the joining member B1. When the first and second detection ground electrodes 841, 861 are used as the third and fourth detection signal electrodes 841a, 861a, as shown in the figure, the element side terminals 531, 561 are electrically connected and combined into one terminal, and the element side terminals 541, 551 are electrically connected and combined into one terminal. This makes it possible to reduce the number of wirings, which will be described later.
[0077] 15 and 16, the wiring 5 has six base-side terminals 512, 522, 542, 562, 572, and 582 arranged on the lower surface of the support 91. The wiring 5 also has six wires (not shown) that respectively connect the element-side terminal 511 and the base-side terminal 512, the element-side terminal 521 and the base-side terminal 522, the element-side terminal 541 and the base-side terminal 542, the element-side terminal 561 and the base-side terminal 562, the element-side terminal 571 and the base-side terminal 572, and the element-side terminal 581 and the base-side terminal 582. Each wire is routed from the base 90 to the support 91 through any one of the beams 921, 922, 923, and 924.
[0078] The fourth embodiment as described above can also achieve the same effects as the first embodiment described above.
[0079] The sensor element and the physical quantity sensor of the present invention have been described above based on the illustrated embodiment, but the present invention is not limited thereto, and the configuration of each part can be replaced with any configuration having a similar function. In addition, any other configuration may be added to the present invention. In addition, each embodiment may be appropriately combined. [Explanation of symbols]
[0080] 1...physical quantity sensor, 2...package, 21...base, 211...recess, 211a...recess, 211b...recess, 211c...recess, 22...lid, 23...joint member, 241...internal terminal, 242...internal terminal, 243...external terminal, 3...circuit element, 4...support substrate, 41...lead, 42...lead, 43...lead, 44...lead, 45...lead, 46...lead, 47...lead, 48...lead, 49...substrate, 491...opening, 5...wiring, 511...element side terminal, 512...base side terminal, 521...element side terminal, 522...base side terminal, 531...element side terminal, 541...element side terminal, 542...base side terminal, 551...element side terminal, 561...element side terminal, 562...base side terminal, 571...element side terminal, 572...base side terminal, 581...element side terminal, 582...base side terminal, 6...sensor element, 61...detection vibration section, 62...drive vibration section, 7...vibration substrate, 70...base, 70a...first side, 70b...second side, 70c...third side, 70d...fourth side, 71...first detection vibration arm, 72...second detection vibration arm, 73...first connecting arm, 74...second connecting arm, 75...first drive vibration arm, 7 6...second drive vibration arm, 77...third drive vibration arm, 78...fourth drive vibration arm, 8...electrodes, 811...drive signal electrode, 812...electrode pad for drive signal, 821...drive ground electrode, 822...electrode pad for drive ground, 823...wiring for drive ground, 831...first detection signal electrode, 832...electrode pad for first detection signal, 841...first detection ground electrode, 841a...third detection signal electrode, 842...electrode pad for first detection ground, 842a...electrode pad for third detection signal, 843...wiring for first detection ground, 851...second detection signal electrode, 852...second detection Signal electrode pad, 861...second detection ground electrode, 861a...fourth detection signal electrode, 862...second detection ground electrode pad, 862a...fourth detection signal electrode pad, 863...second detection ground wiring, 873...first ground wiring, 883...second ground wiring, 9...support substrate, 90...base, 91...support portion, 921...beam portion, 922...beam portion, 923...beam portion, 924...beam portion, B1...joint member, B1a...joint member, B1b...joint member, B1c...joint member, B1d...joint member, B2...joint member, O...center, S...internal space, ωz...angular velocity
Claims
1. A base and A driving vibration part connected to the base part; A detection vibration unit connected to the base; a drive signal electrode disposed on the drive vibration section and to which a drive signal is applied; a detection signal electrode disposed on the detection vibration portion and outputting a detection signal; a drive signal electrode pad disposed on the base and electrically connected to the drive signal electrode; a detection signal electrode pad disposed on the base and electrically connected to the detection signal electrode; The sensor element according to claim 1, wherein at least one of the drive signal electrode pad and the detection signal electrode pad has a width of 30 μm or more and 100 μm or less.
2. 2. The sensor element according to claim 1, wherein the width of the drive signal electrode pad and the detection signal electrode pad are not less than 30 [mu]m and not more than 100 [mu]m, respectively.
3. 3. The sensor element according to claim 2, wherein the width of each of the drive signal electrode pads and the detection signal electrode pads is 80 [mu]m or less.
4. In a plan view of the base, The sensor element according to claim 1 , wherein the drive signal electrode pad and the detection signal electrode pad are each circular.
5. a detection ground electrode disposed on the detection vibration portion and connected to a potential that serves as a ground with respect to the detection signal electrode; a detection ground wiring disposed on the base and electrically connected to the detection ground electrode; 2. The sensor element according to claim 1, wherein the detection ground wiring is disposed between the drive signal electrode pad and the detection signal electrode pad.
6. a drive ground electrode that is disposed on the drive vibration section and is connected to a potential that serves as a ground with respect to the drive signal electrode; a driving ground electrode pad disposed on the base and electrically connected to the driving ground electrode; the drive signal electrode pad is surrounded by a drive ground wiring that connects the drive ground electrode and the drive ground electrode pad; 6. The sensor element according to claim 5, wherein the detection ground wiring is disposed between the drive ground wiring and the detection signal electrode pad.
7. In a plan view of the base, the base portion has a first side, a second side opposite to the first side, a third side intersecting the first side, and a fourth side opposite to the third side, the detection vibration section has a first detection vibration arm extending from the first side and a second detection vibration arm extending from the second side, The detection signal electrode includes a first detection signal electrode arranged on the first detection vibration arm and a second detection signal electrode arranged on the second detection vibration arm, the detection signal electrode pad includes a first detection signal electrode pad electrically connected to the first detection signal electrode and a second detection signal electrode pad electrically connected to the second detection signal electrode, the drive vibration section has a first connecting arm extending from the third side, a first drive vibration arm and a second drive vibration arm extending from the first connecting arm in opposite directions, a second connecting arm extending from the fourth side, and a third drive vibration arm and a fourth drive vibration arm extending from the second connecting arm in opposite directions, one of the drive signal electrode pad and the drive ground electrode pad is disposed closer to the third side than the fourth side and at a midpoint between the first side and the second side, and the other is disposed closer to the fourth side than the third side and at a midpoint between the first side and the second side, the first detection signal electrode pad is disposed at a position closer to the first side than to the second side and closer to the fourth side than to the third side; The sensor element according to claim 6 , wherein the second detection signal electrode pad is disposed at a position closer to the second side than to the first side and closer to the fourth side than to the third side.
8. In a plan view of the base, the base portion has a first side, a second side opposite to the first side, a third side intersecting the first side, and a fourth side opposite to the third side, the detection vibration section has a first detection vibration arm extending from the first side and a second detection vibration arm extending from the second side, The detection signal electrode includes a first detection signal electrode arranged on the first detection vibration arm and a second detection signal electrode arranged on the second detection vibration arm, the detection signal electrode pad includes a first detection signal electrode pad electrically connected to the first detection signal electrode and a second detection signal electrode pad electrically connected to the second detection signal electrode, the drive vibration section has a first connecting arm extending from the third side, a first drive vibration arm and a second drive vibration arm extending from the first connecting arm in opposite directions, a second connecting arm extending from the fourth side, and a third drive vibration arm and a fourth drive vibration arm extending from the second connecting arm in opposite directions, A first detection ground electrode is disposed on the first detection vibration arm and is connected to a potential that is a ground with respect to the first detection signal electrode; a first detection ground electrode pad disposed on the base and electrically connected to the first detection ground electrode; A second detection ground electrode is disposed on the second detection vibration arm and is connected to a potential that is a ground with respect to the second detection signal electrode; a second detection ground electrode pad disposed on the base and electrically connected to the second detection ground electrode; a first ground wiring and a second ground wiring that are disposed on the base and connected to a ground; the drive signal electrode pad is disposed closer to the third side than to the fourth side and at a midpoint between the first side and the second side, the driving ground electrode pad is disposed closer to the fourth side than to the third side and at a midpoint between the first side and the second side, the first detection signal electrode pad is disposed at a position closer to the first side than to the second side and closer to the fourth side than to the third side; the first detection ground electrode pad is disposed closer to the first side than to the second side and at a midpoint between the third side and the fourth side; the second detection signal electrode pad is disposed at a position closer to the second side than to the first side and closer to the fourth side than to the third side; the second detection ground electrode pad is disposed closer to the second side than to the first side and at a midpoint between the third side and the fourth side; the first ground wiring is disposed between the drive signal electrode pad and the drive ground electrode pad, and the first detection signal electrode pad and the first detection ground electrode pad; The sensor element according to claim 1 , wherein the second ground wiring is disposed between the drive signal electrode pad and the drive ground electrode pad, and the second detection signal electrode pad and the second detection ground electrode pad.
9. In a plan view of the base, the base portion has a first side, a second side opposite to the first side, a third side intersecting the first side, and a fourth side opposite to the third side, the detection vibration section has a first detection vibration arm extending from the first side and a second detection vibration arm extending from the second side, The detection signal electrode includes a first detection signal electrode arranged on the first detection vibration arm and a second detection signal electrode arranged on the second detection vibration arm, the detection signal electrode pad includes a first detection signal electrode pad electrically connected to the first detection signal electrode and a second detection signal electrode pad electrically connected to the second detection signal electrode, the drive vibration section has a first connecting arm extending from the third side, a first drive vibration arm and a second drive vibration arm extending from the first connecting arm in opposite directions, a second connecting arm extending from the fourth side, and a third drive vibration arm and a fourth drive vibration arm extending from the second connecting arm in opposite directions, A third detection signal electrode disposed on the first detection vibration arm; a third detection signal electrode pad disposed on the base and electrically connected to the third detection signal electrode; A fourth detection signal electrode disposed on the second detection vibration arm; a fourth detection signal electrode pad disposed on the base and electrically connected to the fourth detection signal electrode; a first ground wiring and a second ground wiring that are disposed on the base and connected to a ground; the drive signal electrode pad is disposed closer to the third side than to the fourth side and at a midpoint between the first side and the second side, the driving ground electrode pad is disposed closer to the fourth side than to the third side and at a midpoint between the first side and the second side, the first detection signal electrode pad is disposed at a position closer to the first side than to the second side and closer to the fourth side than to the third side; the third detection signal electrode pad is disposed closer to the first side than to the second side and at a midpoint between the third side and the fourth side; the second detection signal electrode pad is disposed at a position closer to the second side than to the first side and closer to the fourth side than to the third side; the fourth detection signal electrode pad is disposed closer to the second side than to the first side and at a midpoint between the third side and the fourth side; the first ground wiring is disposed between the drive signal electrode pad and the drive ground electrode pad, and the first detection signal electrode pad and the third detection signal electrode pad; The sensor element according to claim 1 , wherein the second ground wiring is arranged between the drive signal electrode pad and the drive ground electrode pad, and the second detection signal electrode pad and the fourth detection signal electrode pad.
10. Package and a support substrate accommodated in the package and bonded to the package; A physical quantity sensor comprising: the sensor element according to claim 1 housed in the package and bonded to the support substrate.
Citation Information
Patent Citations
Vibration device, electronic apparatus, and moving body
JP2021117070A