Semiconductor device transport unit, and chamber executing steps for semiconductor device including semiconductor device transport unit

Abstract

To provide a transport unit for a semiconductor device that can ensure good transport performance in various temperature conditions.SOLUTION: A semiconductor device transport unit according to an example of the present invention includes: a transport shaft that is arranged in an internal space formed by a chamber, and is extended along a transportation direction of a semiconductor device; a moving holder that is mounted on the transport shaft to have a permitted interval, and transports a carrier on which the semiconductor device is mounted along the transportation direction; and a temperature regulator that regulates the temperature of at least one of the moving holder and the transport shaft, so as to prevent the moving holder from being fastened onto the transport shaft in a temperature atmosphere.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a semiconductor device-transfer unit and a chamber for performing processes on semiconductor devices that includes the semiconductor device-transfer unit. [Background technology]

[0002] A device performance tester is a device that tests various devices after they are manufactured. Such a device performance tester artificially creates various environments for connected devices to test whether the devices are working properly. For example, a semiconductor device can include various semiconductor elements such as D-RAM, S-RAM, SO-DIMM, U-DIMM, LPCAMM, SSD, HBM, semiconductor modules and electronic components, die (DIE) cut from a wafer, IC chips including dies with integrated circuits formed, stacks using die (DIE), etc. Here, HBM (High Bandwidth Memory) is a high-performance memory formed by vertically stacking DRAM dies, and each layer of die is formed to exchange signals through through electrodes such as TSV (Through Silicon Via) and microbump structures.

[0003] Due to its structural characteristics, HBM has hundreds to thousands of fine pins and is extremely small in size, so it requires special care when loading and transporting. For example, since HBM has many fine pins compared to its small size, it requires highly difficult fine pitch alignment during testing and is vulnerable to damage due to contact.

[0004] The devices that have undergone the test can be classified by a handler into pass, retest, fail, etc. according to the test results. Here, the handler is a device that loads a number of packaged devices into a device performance tester and / or separates the devices that have completed the test from the device performance tester and then classifies them according to the results.

[0005] The tester can continuously perform testing by exchanging trays loaded with devices to be tested and trays loaded with devices that have already been tested through a handler.

[0006] On the other hand, one type of device performance test is a temperature load test, which is a test for checking whether a device satisfies required performance conditions under specific temperature conditions (high temperature to low temperature).

[0007] The temperature load test was carried out with the internal space of the test chamber in which the test process was carried out set to a specific temperature condition. The test chamber was set to maintain the temperature condition until all of the target number of devices had been tested.

[0008] In addition, the system for performing the temperature load test may include a soak chamber and / or a desoak chamber. The soak chamber is a chamber in which the semiconductor device exposed to room temperature conditions is aged to be exposed to the temperature atmosphere of the temperature load test. On the other hand, the desoak chamber is a chamber in which the semiconductor device is aged after the test is completed to be returned to the external environment.

[0009] Meanwhile, various parts disposed inside the chamber where the temperature atmosphere is changed for the progress of the test need to be designed taking into consideration the influence of temperature changes. In particular, a transfer unit for transferring semiconductor devices and / or carriers carrying semiconductor devices inside the chamber needs to be designed taking into consideration thermal expansion, condensation, and / or frost so that the transfer unit can transfer semiconductor devices under various temperature conditions. Summary of the Invention [Problem to be solved by the invention]

[0010] SUMMARY OF THE PRESENTLY PREFERRED EMBODIMENTS An object of the present invention is to provide a transfer unit for semiconductor devices that can ensure good transfer performance even under various temperature conditions.

[0011] The object of the present invention is not limited to the above-mentioned objects, and other objects not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0012] To solve the above problem, a semiconductor device transfer unit according to an embodiment of the present invention includes a transfer shaft disposed in an internal space formed by the chamber and extending along a transport direction of the semiconductor device, a moving holder attached to the transfer shaft with an allowable interval and transferring a carrier loaded with the semiconductor device along the transport direction, and a temperature regulator that adjusts a temperature of at least one of the moving holder and the transfer shaft to prevent the moving holder from sticking to the transfer shaft in the temperature atmosphere.

[0013] The temperature regulator adjusts the temperatures of the moving holder and the transport shaft so that the degree of thermal deformation of the moving holder and the transport shaft due to the temperature atmosphere is reduced.

[0014] The temperature regulator is configured to transfer heat to the transport shaft and includes a heat wire extending a predetermined length along the transport direction.

[0015] The hot wire has one end inserted into the transport shaft and extended by the predetermined length along the transport direction, and the other end protruding out of the transport shaft is connected to a control device.

[0016] The chamber includes a first gate that separates an external space from the internal space, and a second gate that separates the internal space from a space formed by an external chamber in which a process on the semiconductor device is performed.

[0017] The transfer shaft extends between the first gate and the second gate.

[0018] The other end of the hot wire is protruded from the transfer shaft toward the first gate.

[0019] The temperature atmosphere is set to a temperature below room temperature, and the temperature regulator transfers heat to the transport shaft and the moving holder to prevent at least one of condensation and frost from forming in the allowed interval.

[0020] The moving holder includes a moving block having a through hole into which the transport shaft is inserted, and a ball that is mounted inside the moving block so as to protrude into the through hole and support the transport shaft at a position within the through hole.

[0021] A plurality of the balls protrude into the through hole to prevent the conveying shaft from contacting the moving block.

[0022] The moving holder includes a moving block that advances and retreats on the transfer shaft, and a holding block that is formed below the moving block so as to be movable up and down relative to the moving block and that holds the carrier.

[0023] The moving holder further includes a guide rail extending along an extension direction of the transport shaft, raised and lowered together with the holding block, and supporting the holding block which advances and retreats along the moving block as the moving block advances and retreats on the transport shaft.

[0024] The holding block includes a first holding frame having downwardly protruding hooks that are inserted into grooves on the carrier when the holding block is lowered, and a second holding frame having downwardly protruding other hooks that are formed so that the distance between the first holding frame and the second holding frame can be adjusted and that are inserted into other grooves on the carrier when the holding block is lowered.

[0025] The carrier carries an HBM or a die forming an HBM as the semiconductor device, and includes terminals electrically connected to the carried semiconductor device.

[0026] A chamber for performing a process on a semiconductor device in accordance with an embodiment of the present invention for solving the above problem includes a chamber housing that forms an internal space through which the semiconductor device passes, and a transfer unit that is installed to transfer the semiconductor device.

[0027] The transfer unit includes a transfer shaft disposed in the internal space and extending along a transport direction of the semiconductor devices, a moving holder attached to the transfer shaft with an allowable interval therebetween and transferring a carrier loaded with the semiconductor devices along the transport direction, and a temperature regulator for adjusting a temperature of at least one of the moving holder and the transfer shaft to prevent the moving holder from sticking to the transfer shaft in the temperature atmosphere.

[0028] Further details of the invention are contained in the detailed description and the drawings. Effect of the Invention

[0029] According to the embodiment of the present invention, at least the following effects are obtained.

[0030] Good transport performance can be ensured even under various temperature conditions.

[0031] The effects of the present invention are not limited to the above-mentioned examples, and more diverse effects are included in the present specification. [Brief description of the drawings]

[0032] [Figure 1] 1 is a conceptual diagram illustrating a chamber to which a semiconductor device transfer unit according to an embodiment of the present invention can be applied. [Diagram 2] FIG. 2 illustrates a semiconductor device transfer unit according to one embodiment of the present invention. [Diagram 3] 3 is a diagram showing a transfer unit according to an embodiment of the present invention, viewed from a different angle than in FIG. 2. [Figure 4] 1 is an enlarged view of a moving holder portion in a transfer unit according to an embodiment of the present invention; [Diagram 5] FIG. 2 is a front view of a transport shaft and a moving block according to an embodiment of the present invention. [Figure 6] FIG. 2 is a conceptual diagram illustrating an example in which a semiconductor device transfer unit according to an embodiment of the present invention is installed inside a chamber. [Figure 7] FIG. 2 is a partial view of a holding block and test tray according to one embodiment of the present invention. [Figure 8] 13 is a diagram showing a state in which a transfer unit according to an embodiment of the present invention is holding a test tray in an initial position. [Figure 9] 13 is a diagram showing a state in which a transfer unit according to an embodiment of the present invention transfers a test tray to a target position. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0033] The advantages and features of the present invention, as well as the methods for achieving them, will become apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and may be embodied in various different forms. The embodiments are provided solely for the purpose of fully disclosing the present invention and fully conveying the scope of the invention to those skilled in the art to which the present invention pertains. The present invention is defined by the scope of the claims.

[0034] In addition, the embodiments described herein are described with reference to cross-sectional views and / or schematic diagrams that are ideal exemplary views of the present invention. Therefore, the shapes of the exemplary views may be modified depending on manufacturing techniques and / or tolerances. In addition, the components in each drawing shown in the present invention are illustrated slightly enlarged or reduced in size for convenience of explanation. The same reference numerals refer to the same components throughout the specification.

[0035] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the drawings illustrating a semiconductor device transfer unit and a chamber including the semiconductor device transfer unit for performing a process on a semiconductor device according to an embodiment of the present invention.

[0036] FIG. 1 is a conceptual diagram showing a chamber to which a semiconductor device transfer unit according to an embodiment of the present invention can be applied.

[0037] The semiconductor device transfer unit according to an embodiment of the present invention may be applied to various chambers c1, c2, and c3 that perform processes on semiconductor devices. For example, the process on the semiconductor devices is a temperature load test for evaluating the performance of the semiconductor devices. In this case, the semiconductor device transfer unit according to an embodiment of the present invention may be applied to at least one of the various chambers c1, c2, and c3 used for the temperature load test.

[0038] The test chamber c1 may include sockets in which semiconductor devices are mounted. The semiconductor devices may be electrically connected to a test unit while being mounted in the respective sockets. The test unit may exchange signals with each of the electrically connected semiconductor devices to evaluate the performance of the semiconductor devices.

[0039] The test chamber c1 can set the internal space to a predetermined temperature atmosphere as needed to test whether the semiconductor device operates properly in a predetermined temperature environment. Such a temperature atmosphere can be set according to the needs of a user. For example, the internal temperature of the test chamber c1 can be set to a specific range from +150°C to -70°C (based on Celsius).

[0040] The soak chamber c2 is a chamber in which the semiconductor device is aged before being exposed to the temperature atmosphere of the test chamber c1. The semiconductor device can be prepared to be exposed to the temperature of the test chamber c1 for a predetermined period of time inside the soak chamber c2.

[0041] The soak chamber c2 may have a gate formed on one side through which the semiconductor device is introduced from the external space and a gate formed on the other side through which the semiconductor device is transferred to the test chamber c1. The gate may include a structure for maintaining the temperature atmosphere of the internal space of the soak chamber c2 and / or the test chamber c1.

[0042] The desoak chamber c3 is a chamber in which the semiconductor device is aged to return to room temperature after the test is completed. In the desoak chamber c3, the semiconductor device can be prepared to be taken out for a predetermined period of time.

[0043] The desoak chamber c3 may have a gate on one side through which the semiconductor devices are carried out to the outside space and a gate on the other side through which the semiconductor devices are transferred from the test chamber c1. The gate may include a structure for maintaining the temperature atmosphere of the internal space of the desoak chamber c3 and / or the test chamber c1.

[0044] The transfer unit according to one embodiment of the present invention is installed in the above-mentioned chambers c1, c2, and c3, and can transfer the semiconductor devices themselves or carriers carrying the semiconductor devices between the chambers c1, c2, and c3.

[0045] At this time, the carrier is a unit formed to be able to load semiconductor devices regardless of the type. Exemplarily, the carrier is a test tray capable of loading a plurality of semiconductor devices. The test tray may include a plurality of inserts corresponding to the sockets, and each insert may be formed to be able to load a semiconductor device. Alternatively, for example, the carrier is an insert dedicated to the HBM formed in consideration of the fine pitch and fragile characteristics of the HBM so that the HBM can be loaded. In this case, one or more HBMs may be loaded on the carrier, and each fine fin of the HBM may be electrically connected to a terminal formed on the carrier when loaded on the carrier. Alternatively, similarly, the carrier is an insert formed to be able to load each individual die (DIE) constituting the HBM. Similarly, in this case, the loaded die (DIE) may have fine pins or bumps electrically connected to a terminal of the carrier when loaded on the carrier.

[0046] In the following description, an example will be described in which a transfer unit according to an embodiment of the present invention picks up / places and transfers a test tray, but the present invention is not necessarily limited to such an embodiment. Therefore, a holding unit for holding a semiconductor device or a carrier according to an embodiment of the present invention may be provided in various ways corresponding to a holding object.

[0047] Hereinafter, a semiconductor device transfer unit 100 according to an embodiment of the present invention will be described with reference to Fig. 2. Fig. 2 is a diagram showing a semiconductor device transfer unit according to an embodiment of the present invention.

[0048] As shown in FIG. 2, a semiconductor device transfer unit 100 according to an embodiment of the present invention may include a transfer shaft 101, a moving holder 110, and temperature controllers 121 and 123.

[0049] The transfer shaft 101 is an axial member disposed in the internal space of the chamber and extending in a direction corresponding to a transport direction of the semiconductor device. The transfer shaft 101 may extend along a moving path of the moving holder 110 inside the chamber.

[0050] The moving holder 110 is a unit that is attached to the transport shaft 101 at an allowable interval, picks up the test tray, and transports it to a target position. At this time, the allowable interval is a design tolerance, and can be set to a tolerance of about 1 / 10 to 5 / 100. The moving holder 110 can have various configurations that can transport the carrier along the transport direction and place it at the target position.

[0051] The temperature regulators 121 and 123 are modules for ensuring various temperature compatibility for the transfer unit 100. The temperature regulators 121 and 123 can prevent the moving holder 110 from being stuck to the transfer shaft 101 due to the temperature atmosphere inside the chamber.

[0052] The temperature regulators 121, 123 can regulate the temperature of the transport shaft 101 and / or the moving holder 110 to prevent the moving holder 110 from being stuck to the transport shaft 101. Such temperature regulators 121, 123 can be configured to include a control device 121 and a hot wire 123. The temperature regulators 121, 123 can exchange heat with the transport shaft 101 and / or the moving holder 110 to ensure a minimum gap between the transport shaft 101 and the moving holder 110 that does not interfere with the movement of the moving holder 110.

[0053] The control device 121 may be connected to the hot wire 123 to control the hot wire 123. The hot wire 123 may be heated to a required temperature by a control signal from the control device 121. The hot wire 123 may be extended to a predetermined length inside the transfer shaft 101. To this end, the transfer shaft 101 may have an accommodation groove for accommodating the hot wire 123. The accommodation groove may be formed along the central axis of the transfer shaft 101 so that heat exchange with the hot wire 123 may be performed uniformly at each portion.

[0054] One end of the hot wire 123 is inserted into the receiving groove, and the one end may be extended a predetermined length along the transportation direction inside the transfer shaft 101. The other end of the hot wire 123 may be protruded to the outside of the transfer shaft 101, and the protruded part may be mounted in a structure capable of interacting with the control device 121.

[0055] For ease of explanation, the following description will be given by taking an example in which the thermal expansion / contraction rate of the moving holder 110 is higher than that of the transport shaft 101. If the thermal expansion / contraction rate of the moving holder 110 is lower than that of the transport shaft 101, each configuration / situation can be configured / acted in the opposite manner, and therefore, redundant explanations will be omitted.

[0056] If the moving holder 110 has a higher thermal expansion / contraction rate than the transport shaft 101, the moving holder 110 may become stuck on the transport shaft 101 due to excessive contraction of the moving holder 110 under low temperature conditions.

[0057] To prevent this situation, the temperature controllers 121 and 123 can heat the hot wire 123 to heat the moving shaft 101. At this time, the moving holder 110 can be indirectly heated by receiving heat from the heated moving shaft 101.

[0058] The temperature regulators 121 and 123 can reduce the degree of thermal deformation of the transfer shaft 101 and the moving holder 110 compared to when they are exposed to the temperature atmosphere inside the chamber without protection. Ideally, the temperature regulators 121 and 123 can transfer heat to the transfer shaft 101 and the moving holder 110 so that the distance between the transfer shaft 101 and the moving holder 110 is similar to the distance at room temperature.

[0059] Meanwhile, in low temperature conditions, not only thermal shrinkage but also condensation and frost may form between the moving shaft 101 and the moving holder 110, hindering the movement of the moving holder 110. According to one embodiment of the present invention, since the moving holder 110 and the moving shaft 101 are heated, the formation of condensation and frost on the surfaces of the moving holder 110 and the moving shaft 101 can be prevented. Therefore, even in such a case, according to one embodiment of the present invention, good moving performance of the moving holder 110 can be ensured.

[0060] 2, the transfer unit 100 may include a mounting frame 103 for fixing other components of the transfer unit 100 in position inside the chamber. The mounting frame 103 may be fixed to an inner wall of the chamber and may support other components included in the transfer unit 100.

[0061] Hereinafter, the moving holder 110 according to an embodiment of the present invention will be described in detail with reference to Figures 3 and 4. Figure 3 is a view showing a moving unit according to an embodiment of the present invention as viewed from a different angle than that of Figure 2. Also, Figure 4 is an enlarged view of a moving holder portion in the moving unit according to an embodiment of the present invention.

[0062] 3 and 4, a pair of transport shafts 101 according to an embodiment of the present invention may be provided, each extending in a substantially straight line along the transport direction. The moving holder 110 may be mounted on the pair of transport shafts 101 and may be moved forward and backward while being supported on both sides by the transport shafts 101.

[0063] 3 and 4, the moving holder 110 according to an embodiment of the present invention may include a moving block 111, a holding block 115, a guide rail 117, and a lifting actuator 119.

[0064] The moving block 111 is a block that is mounted on the pair of moving shafts 101 and moves forward and backward along the pair of moving shafts 101. The moving block 111 may have through holes formed in its body to accommodate each of the moving shafts 101. The pair of through holes may be formed at an interval corresponding to the interval between the moving shafts 101, and the central axes may be positioned on the same plane.

[0065] The advancement and retreat of the moving block 111 may be realized by various conventional driving units, and such driving units may be controlled by the control device 121 or a control unit that controls the transport unit 100 .

[0066] The holding block 115 is located on one side of the moving block 111, and the relative distance between the holding block 115 and the moving block 111 can be adjusted. For convenience of explanation, the holding block 115 is described below the moving block 111, but the below can be described as the above, left, right, etc. depending on the installation direction of the transport unit 100.

[0067] The holding block 115 may be connected to the moving block 111 so as to be movable up and down, and may be configured to hold a test tray positioned below. The holding block 115 may include a block housing 1153, a first holding frame 1151, a second holding frame 1152, and rollers 1154.

[0068] For example, the holding block 115 may be configured such that each of the first holding frame 1151 and the second holding frame 1152 carries one test tray, or as another example, the holding block 115 may be configured such that both the first holding frame 1151 and the second holding frame 1152 hold one test tray.

[0069] The block housing 1153 is a housing that is connected to the moving block 111 so as to be capable of ascending and descending.

[0070] The first holding frame 1151 is a frame that is coupled to the block housing 1153. At least one hook 1151a may be protruded from the lower side of the first holding frame 1151. The hook 1151a included in the first holding frame 1151 is referred to as the first hook 1151a for convenience in order to distinguish it from the hook 1152a of the second holding frame 1152.

[0071] The second holding frame 1152 is a frame coupled to the block housing 1153 so as to be located to the side of the first holding frame 1151. At least one hook 1152a may protrude from the lower side of the second holding frame 1152. The hook 1152a included in the second holding frame 1152 is referred to as the second hook 1152a for convenience in order to distinguish it from the first hook 1151a.

[0072] The first holding frame 1151 and the second holding frame 1152 may be coupled to a block housing 1153 so that the relative distance between them can be adjusted. A drive unit for adjusting the distance between the first holding frame 1151 and the second holding frame 1152 may be any one of various conventional drive units. In addition, such a drive unit may be controlled by the control device 121 or a control unit for controlling the transfer unit 100.

[0073] The rollers 1154 may be disposed on the sides of the block housing 1153 to support the transport of the holding block 115. The rollers 1154 are coupled to one side of the block housing 1153, inserted into the inside of the guide rail 117, and can move forward and backward along the guide rail 117.

[0074] The guide rail 117 is a rail that supports the movement of the holding block 115. A roller 1154 may be inserted into the guide rail 117. The guide rail 117 may extend in a direction corresponding to the extension direction of the transfer shaft 101. For example, the guide rail 117 may extend along an axis parallel to the central axis of the transfer shaft 101.

[0075] The holding block 115 is coupled to the moving block 111 and can be advanced and retreated along with the movement of the moving block 111. During this advancement and retreat process, the holding block 115 is supported by a guide rail 117, so that shaking during the advancement and retreat process can be minimized.

[0076] Meanwhile, the front and rear ends of the guide rail 117 may be coupled to a lift actuator 119. The lift actuator 119 may be embodied in various configurations in which the position is fixed by being coupled to the mounting frame 103 and / or the inner wall of the chamber, and the lower end is extendable downward in length. The lift actuator 119 may be controlled by the control device 121 or a control unit that controls the transfer unit 100.

[0077] The guide rail 117 may have side wall portions coupled to the lower ends of the lift actuators 119. Thereby, the guide rail 117 may be raised and lowered in response to the lowering and rising of the lower ends of the lift actuators 119.

[0078] When the guide rail 117 is raised and lowered, the roller 1154 inserted inside the guide rail 117 may be raised and lowered accordingly. The holding block 115 may also be raised and lowered in response to the raising and lowering of the roller 1154. However, the present invention is not limited to this embodiment, and the lifting actuator 119 may raise and lower the holding block 115, and the guide rail 117 may be raised and lowered accordingly.

[0079] Hereinafter, the coupling relationship between the transport shaft 101 and the moving block 111 according to an embodiment of the present invention will be described in detail with reference to Fig. 5. Fig. 5 is a front view of the transport shaft and the moving block according to an embodiment of the present invention.

[0080] 5, the moving holder 110 may include a plurality of balls 113 mounted inside the moving block 111 and protruding into the through holes 111a, so that the moving block 111 can function as a ball bushing that moves along the axis of the transport shaft 101.

[0081] The plurality of balls 113 may be arranged at regular intervals inside the through hole 111a. More specifically, the plurality of balls 113 may be arranged on a side wall of the through hole 111a at intervals that evenly divide the length around the through hole 111a. The transfer shaft 101 inserted into the through hole 111a may be supported inside the through hole 111a by the plurality of balls 113. Considering the size of the plurality of balls 113, the diameter of the transfer shaft 101 may be slightly smaller than the diameter of the through hole 111a. Also, this difference in diameter may define the above-mentioned allowed interval.

[0082] Due to the plurality of balls 113, the transfer shaft 101 can be in point contact with the balls 113 without contacting the surface of the moving block 111. This can minimize the contact area between the moving holder 110 and the transfer shaft 101, and can also minimize friction between the moving holder 110 and the transfer shaft 101.

[0083] Hereinafter, an example in which a transfer unit according to an embodiment of the present invention is installed inside a chamber will be described with reference to Fig. 6. Fig. 6 is a conceptual diagram showing an example in which a semiconductor device transfer unit according to an embodiment of the present invention is installed inside a chamber.

[0084] Referring to FIG. 6, chamber c is the soak or desoak chamber previously described.

[0085] The chamber c extends in the up-down direction with reference to FIG. 6, and the test tray can be transferred along the extended direction.

[0086] The chamber c may include a chamber housing that defines an internal space cc3 through which the semiconductor device passes and divides the internal space cc3 from an external space. The chamber housing forms an inner wall of the chamber c and may be coupled to the mounting frame 103.

[0087] A first gate cc1 may be formed on one side of the chamber c to separate the external space from the internal space cc3, and a second gate cc2 may be formed on the other side of the chamber c to separate the internal space cc3 from the internal space of another chamber, where the other external chamber is a test chamber.

[0088] The transfer shaft 101 can be aligned between the first gate cc1 and the second gate cc2. The mounting frame 103 can be coupled to the inner wall of the chamber c so that the transfer shaft 101 and the moving holder 110 are supported.

[0089] The transfer shaft 101 may be installed such that a front end thereof is maximally adjacent to the first gate cc1. The hot wire 123 may be inserted into the receiving groove through the front end of the transfer shaft 101. The other exposed end of the hot wire 123 may be protruded from the front end of the transfer shaft 101 in the direction of the first gate cc1.

[0090] Such a position of the hot wire 123 is advantageous in terms of securing space for installing the control device 121 and / or a temperature control configuration. More specifically, such a position of the hot wire 123 allows the control device 121 and / or a temperature control configuration to be installed in the external space. Therefore, such a position of the hot wire 123 does not require consideration of interference with the configuration of other chambers, and has the advantage that a configuration for protecting the control device 121, etc. from the temperature atmosphere inside the chamber c can be omitted.

[0091] Hereinafter, a method for the holding block 115 to pick up the test tray t according to an embodiment of the present invention will be described with reference to Fig. 7. Fig. 7 is a partial view of the holding block and the test tray according to an embodiment of the present invention.

[0092] Hereinafter, the embodiment of the present invention will be described with a focus on the transportation of the test tray t by taking as an example an embodiment of the present invention transporting a test tray t, but the present invention is not limited thereto. For example, the groove t1 of the test tray t may be formed in the semiconductor device or a separate member or other type of carrier attached thereto, and the holding block 115 may transport the semiconductor device and / or carrier using such groove t1.

[0093] When the first holding frame 1151 and the second holding frame 1152 each carry one test tray t, the first hook 1151a and the second hook 1152a can be inserted into the grooves t1 of different test trays t when the holding block 115 is lowered. The first hook 1151a to the second hook 1152a can have shapes corresponding to the grooves t1 formed on the test tray t.

[0094] At this time, the hooks 1151a, 1152a may each hold one of the test trays t based on various methods. Exemplarily, each of the hooks 1151a, 1152a may be provided with a protruding member (not shown) at a lower end portion thereof to be selectively protrudible. The protruding member may protrude outward (in a direction intersecting with an extension direction of the groove and / or a direction intersecting with a thickness direction of the test tray) from the body of the hooks 1151a, 1152a when the hooks 1151a, 1152a are fully inserted into the groove t1 of the test tray t. When protruding, the protruding member may support the rear surface (the surface not facing the first and second holding frames) of the test tray t.

[0095] Alternatively, the first holding frame 1151 and the second holding frame 1152 may be formed to be able to adjust the distance between them and hold one test tray t. In this case, when the first holding frame 1151 and the second holding frame 1152 maintain an initial distance, the first hooks 1151a and the second hooks 1152a may have a positional relationship corresponding to a plurality of grooves t1 formed on the test tray t.

[0096] With the block housing 1153, the first holding frame 1151, and the second holding frame 1152 lowered, the first hook 1151a and the second hook 1152a can each be inserted into a corresponding groove t1 on the test tray t.

[0097] Thereafter, when the distance between the first holding frame 1151 and the second holding frame 1152 becomes narrower or wider than the initial distance, the first hook 1151a and the second hook 1152a can apply forces in opposite directions to the side walls of the test tray t. In this state, the test tray t can be held by the holding block 115.

[0098] 8 and 9, Fig. 8 is a diagram showing a state in which the transfer unit according to the embodiment of the present invention holds the test tray at an initial position, while Fig. 9 is a diagram showing a state in which the transfer unit according to the embodiment of the present invention transfers the test tray to a target position.

[0099] When the test tray t is transferred into the chamber in which the transfer unit 100 is installed, the test tray t may be positioned as shown in Fig. 8. In the initial position of the test tray t, the groove t1 of the test tray t may be positioned directly below the hooks 1151a and 1152a of the holding block 115. When the transfer of the test tray t begins, the holding block 115 descends to hold the test tray t as described above.

[0100] 9, the test tray t may be transported to the target position. During the movement of the moving block 111, the holding block 115 is supported by the guide rail 117, so that the fluctuation of the test tray t in the height direction may be minimized.

[0101] 6 again, when the moving block 111 is fully advanced, the test tray t can be moved from the internal space cc3 of the chamber c to the external space. In this state, the test tray t can be picked up by a transport unit or transfer of another chamber and moved to another device.

[0102] Hereinafter, a semiconductor device transfer unit according to another embodiment of the present invention will be described based on the above description. In order to avoid repetition, the description of the same or similar parts to the above embodiment will be omitted and the description will focus on the differences.

[0103] In the above-described embodiment, the hot wire 123 of the temperature regulator is inserted into the moving shaft 101, but in this embodiment, the hot wire 123 may be attached to the moving holder 110. Exemplarily, in this embodiment, the hot wire 123 may be attached to the moving block 111. In this embodiment, the moving shaft 101 may exchange heat with the moving block 111, the temperature of which is adjusted by the hot wire 123, thereby reducing the degree of thermal deformation.

[0104] In the above description, in another embodiment of the present invention, the hot wire 123 is attached to the moving block 111 instead of the transport shaft 101, but the semiconductor device transport unit according to the other embodiment of the present invention is not limited to such an embodiment.

[0105] For example, in the semiconductor device transfer unit according to another embodiment of the present invention, the hot wires 123 can be installed on both the transfer shaft 101 and the moving block 111 .

[0106] Those skilled in the art will understand that the present invention can be embodied in other specific forms without changing the technical idea or essential features of the present invention. Therefore, the above-described embodiments are merely illustrative and should not be construed as limiting. The scope of the present invention is defined by the claims below rather than the above detailed description, and all modifications and variations derived from the meaning and scope of the claims and their equivalents should be interpreted as being included in the scope of the present invention. [Explanation of symbols]

[0107] 100 Transport Units 101 Transfer shaft 103 Mounting Frame 110 Moving Holder 111 Moving Block 111a Through hole 113 Ball 115 Holding Block 1151, 1152 holding frame 1151a, 1152a Hook 1153 Block Housing 1154 Lola 117 Guide Rail 119 Lift actuator 121 Control device 123 Heat ray c Chamber c1 Test chamber c2 Soak chamber c3 Desoak chamber cc1 First Gate cc2 Second Gate cc3 internal space t Test Tray t1 groove

Claims

1. A semiconductor device transfer unit installed in a chamber that provides a temperature atmosphere set as required, a transfer shaft disposed in an internal space defined by the chamber and extending along a transport direction of the semiconductor device; a moving holder that is attached to the transport shaft with an allowable gap therebetween and that transports the carrier on which the semiconductor devices are loaded along the transport direction; and a temperature regulator that regulates a temperature of at least one of the moving holder and the transport shaft so as to prevent the moving holder from being stuck on the transport shaft in the temperature atmosphere.

2. The temperature regulator comprises:

2. The semiconductor device transfer unit of claim 1, further comprising: controlling temperatures of the moving holder and the transfer shaft so that a degree of thermal deformation of the moving holder and the transfer shaft due to the temperature atmosphere is reduced.

3. The temperature regulator comprises:

3. The semiconductor device transfer unit of claim 2, further comprising: a heat wire configured to transfer heat to the transfer shaft and extending a predetermined length along the transport direction.

4. The heat rays are 4. The semiconductor device transport unit of claim 3, wherein one end is inserted into the transport shaft to extend the predetermined length along the transport direction, and the other end protruding out of the transport shaft is connected to a control device.

5. The chamber comprises: a first gate separating an external space from the internal space, and a second gate separating the internal space from a space formed by an external chamber for performing a process on the semiconductor device; the transfer shaft extends between the first gate and the second gate; The semiconductor device transfer unit according to claim 4 , wherein the other end of the hot wire is protruded in a direction toward the first gate on the transfer shaft.

6. 2. The semiconductor device transfer unit of claim 1, wherein the temperature atmosphere is set to a temperature below room temperature, and the temperature regulator transfers heat to the transfer shaft and the moving holder to prevent the formation of at least one of condensation and frost in the allowed gap.

7. The moving holder includes: a moving block having a through hole through which the transport shaft is inserted; and 2. The semiconductor device transfer unit of claim 1, further comprising: a ball mounted inside the moving block so as to protrude into the through hole, and supporting the transfer shaft at a position within the through hole.

8. The ball is 8. The semiconductor device transfer unit of claim 7, wherein a plurality of protruding members protrude into the through hole to prevent the transfer shaft from contacting the moving block.

9. The moving holder includes: a moving block that moves back and forth on the transfer shaft; and 2. The semiconductor device transfer unit according to claim 1, further comprising: a holding block formed below said moving block so as to be capable of rising and lowering relative to said moving block, and for holding said carrier.

10. The moving holder includes: The semiconductor device transport unit of claim 9, further comprising: a guide rail extending along an extension direction of the transport shaft, raised and lowered together with the holding block, and supporting the holding block as the moving block moves forward and backward on the transport shaft.

11. The holding block is a first holding frame having a hook protruding downward, the hook being inserted into a groove on the carrier when lowered; and 10. The semiconductor device transfer unit of claim 9, further comprising: a second holding frame formed so that the distance between the second holding frame and the first holding frame can be adjusted, and having another hook protruding downwardly which is inserted into another groove on the carrier when the second holding frame is lowered.

12. The carrier is 2. The semiconductor device transfer unit according to claim 1, further comprising a terminal electrically connected to the semiconductor device, the terminal being configured to electrically connect the semiconductor device to the HBM or a die forming the HBM.

13. In a chamber for performing a process on a semiconductor device by providing a temperature atmosphere set as required, The chamber comprises: a chamber housing defining an interior space through which the semiconductor device passes; and a transfer unit configured to transfer the semiconductor device; The transfer unit includes: a transfer shaft disposed in the internal space and extending along a transport direction of the semiconductor device; a moving holder that is attached to the transport shaft with an allowable gap therebetween and that transports the carrier on which the semiconductor devices are loaded along the transport direction; and a temperature controller that controls a temperature of at least one of the moving holder and the transfer shaft so as to prevent the moving holder from being stuck on the transfer shaft in the temperature atmosphere.

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