Replacing apparatus and replacing method

Abstract

To provide a technique that prevents a worker from getting dirty when replacing a processing tool.SOLUTION: A replacing apparatus is configured to replace a processing tool used in a processing apparatus. The processing apparatus includes a holder configured to hold a processing target object, a processing mechanism to which the processing tool configured to process the processing target object held by the holder is installed in a replaceable manner, and an exterior cover accommodating therein the holder and the processing mechanism. The replacing apparatus includes a replacing mechanism, a moving mechanism, a traveling table and a traveling mechanism. The replacing mechanism installs the processing tool to the processing mechanism, or separates the processing tool from the processing mechanism. The moving mechanism is configured to move the replacing mechanism from an outside of the exterior cover to an inside thereof through an entrance opening of the exterior cover. The traveling table supports the moving mechanism. The traveling mechanism is configured to allow the traveling table to travel.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present disclosure relates to an exchange device and an exchange method. [Background technology]

[0002] The grinding means described in Patent Document 1 includes a spindle, a wheel mount disposed at the lower end of the spindle, and a grinding wheel removably attached to the underside of the wheel mount. The grinding wheel includes an annular wheel base and a plurality of grinding stones disposed annularly on the underside of the wheel base. An operator attaches the wheel base to the underside of the wheel mount with fastening bolts. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-177444 Summary of the Invention [Problem to be solved by the invention]

[0004] One aspect of the present disclosure provides a technique for preventing an operator from getting dirty when replacing a processing tool. [Means for solving the problem]

[0005] An exchange device according to one aspect of the present disclosure exchanges a processing tool used in a processing device. The processing device includes a holding section that holds a processing body, a processing mechanism to which a processing tool that processes the processing body held in the holding section is replaceably attached, and an exterior cover that houses the holding section and the processing mechanism. The exchange device includes an exchange mechanism, a moving mechanism, a running platform, and a running mechanism. The exchange mechanism attaches the processing tool to the processing mechanism or removes the processing tool from the processing mechanism. The moving mechanism moves the exchange mechanism from the outside to the inside of the exterior cover through an entrance of the exterior cover. The running platform supports the moving mechanism. The running mechanism causes the running platform to travel. Effect of the Invention

[0006] According to one aspect of the present disclosure, it is possible to prevent an operator from getting dirty when replacing a processing tool. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a plan view showing an example of a factory layout. [Diagram 2] FIG. 2 is a plan view showing another example of a factory layout. [Diagram 3] FIG. 3 is a plan view showing an example of the grinding system. [Figure 4] FIG. 4 is a cross-sectional view showing a processing mechanism of a grinding device according to an embodiment. [Diagram 5] FIG. 5 is a cross-sectional view showing a grinding device and an exchange device according to an embodiment. [Figure 6] FIG. 6 is an enlarged cross-sectional view of a portion of FIG. [Figure 7] FIG. 7 is a functional block diagram showing components of the control units of the grinding device and the replacing device according to one embodiment. [Figure 8] FIG. 8 is a cross-sectional view showing a grinding device and an exchanging device according to a first modified example. [Figure 9] FIG. 9 is a cross-sectional view showing a grinding device and an exchanging device according to the second modified example. [Figure 10]FIG. 10 is a cross-sectional view showing a grinding device and an exchanging device according to a third modified example. [Figure 11] FIG. 11 is a plan view showing an example of an exchange device including a storage unit. [Figure 12] FIG. 12 is a cross-sectional view showing a first modified example of the fastener. [Figure 13] FIG. 13 is a cross-sectional view showing a second modified example of the fastener. [Figure 14] FIG. 14 is a cross-sectional view showing an example of the first rotation mechanism. [Figure 15] FIG. 15 is a cross-sectional view showing an example of a gas supply mechanism. [Figure 16] FIG. 16 is a cross-sectional view showing another example of the gas supply mechanism. [Figure 17] FIG. 17 is a cross-sectional view showing an example of the second rotation mechanism. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. In each drawing, the same or corresponding configurations are denoted by the same reference numerals, and the description may be omitted. In this specification, the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other. The X-axis direction and the Y-axis direction are horizontal directions, and the Z-axis direction is vertical.

[0009] 1, in a factory room, for example, there are installed a grinding system 1 that grinds a substrate W, an exchange device 7 that exchanges a grinding tool D mounted on the grinding system 1, a hangar 8 that stores the exchange device 7, and a storage unit 9 that stores the grinding tool D. The factory may be, for example, a semiconductor factory, and the room may be, for example, a clean room.

[0010] The substrate W includes a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, or a glass substrate. The substrate W may further include a device layer formed on the surface of the semiconductor substrate or the glass substrate. The device layer includes an electronic circuit. The substrate W may also be a laminated substrate in which a plurality of substrates are bonded together.

[0011] A plurality of grinding systems 1 may be arranged in a room of a factory as shown in Fig. 1, or only one may be arranged. The grinding system 1 grinds a substrate W with a grinding tool D. When the grinding tool D becomes worn, it is replaced by a replacement device 7. Since the replacement device 7 replaces the grinding tool D instead of a human, it is possible to prevent the human from becoming dirty. Replacing the grinding tool D includes removing the used grinding tool D and installing an unused grinding tool D.

[0012] The storage unit 9 stores the grinding tools D. In this embodiment, the used grinding tools D and the unused grinding tools D are stored in the same storage unit 9, but they may be stored in separate storage units 9. The storage unit 9 is provided outside the grinding system 1. This allows the grinding system 1 to be miniaturized. Since the storage unit 9 is provided outside the grinding system 1, a self-propelled robot is used as the exchange device 7, unlike when the storage unit 9 is provided inside the grinding system 1.

[0013] The replacement device 7 waits in the storage 8 until it receives a replacement command for the grinding tool D. When the replacement device 7 receives the replacement command, it travels, for example, to the grinding system 1 and removes the used grinding tool D from the grinding system 1. Next, the replacement device 7 travels to the storage unit 9 while holding the removed used grinding tool D, and places the used grinding tool D in the storage unit 9. Thereafter, the replacement device 7 acquires an unused grinding tool D from the storage unit 9, and travels to the grinding system 1 while holding the acquired unused grinding tool D, and attaches the unused grinding tool D to the grinding system 1. Finally, the replacement device 7 returns to the storage 8 and waits.

[0014] Alternatively, when the exchange device 7 receives an exchange command, it first travels to the storage unit 9, acquires an unused grinding tool D from the storage unit 9, and travels to the grinding system 1 while holding the acquired unused grinding tool D. Next, the exchange device 7 removes the used grinding tool D from the grinding system 1. Then, the exchange device 7 attaches the unused grinding tool D to the grinding system 1. Thereafter, the exchange device 7 travels to the storage unit 9 while holding the removed used grinding tool D, and places the used grinding tool D in the storage unit 9. Finally, the exchange device 7 returns to the storage shed 8 and waits.

[0015] The storage unit 9 is common to the multiple grinding systems 1. Compared to a case where a storage unit 9 is provided for each grinding system 1, the number of storage units 9 installed can be reduced.

[0016] 2, the storage unit 9 may be provided for each grinding system 1. In this case, the storage unit 9 can be installed closer to the grinding system 1 than when the storage unit 9 is common to a plurality of grinding systems 1.

[0017] 1 and 2 is provided separately from the exchange device 7, but the exchange device 7 may be provided with the storage unit 9 as shown in FIG. 11. The storage unit 9 of the exchange device 7 travels together with the traveling platform 73 of the exchange device 7. In this case, the travel distance of the exchange device 7 can be shortened. The storage unit 9 of the exchange device 7 temporarily stores the grinding tool D transported between the storage unit 9 (see FIG. 1 or FIG. 2) fixed to the outside of the exchange device 7 and the processing mechanism 43 of the grinding system 1.

[0018] Next, the grinding system 1 will be described with reference to Fig. 3. The grinding system 1 includes a carry-in / out unit 2, a cleaning unit 3, a grinding unit 4, and a control unit 5. The carry-in / out unit 2, the cleaning unit 3, and the grinding unit 4 are arranged in this order from the negative side in the X-axis direction to the positive side in the X-axis direction.

[0019] The load / unload section 2 has a mounting table 21. A cassette C is placed on the mounting table 21. The cassette C stores a plurality of substrates W spaced apart in the vertical direction. The mounting table 21 includes a plurality of mounting plates 22 arranged in a line in the Y-axis direction. A cassette C is placed on each of the plurality of mounting plates 22. The number of mounting plates 22 is not particularly limited. Similarly, the number of cassettes C is not particularly limited.

[0020] The loading / unloading section 2 also has a first transfer region 23. In a plan view, the first transfer region 23 is disposed adjacent to the mounting table 21 and a transition device 35 described below so as to be sandwiched between the mounting table 21 and the transition device 35. The loading / unloading section 2 has a first transfer device 24 that transfers the substrate W in the first transfer region 23. The first transfer device 24 transfers the substrate W between a plurality of devices disposed adjacent to the first transfer region 23. The first transfer device 24 includes a first transfer arm 24a that holds the substrate W. The first transfer arm 24a is capable of moving in the horizontal direction (both in the X-axis direction and the Y-axis direction) and the vertical direction, and of rotating about a vertical axis. The number of the first transfer arms 24a may be one or more.

[0021] The cleaning section 3 has a first cleaning device 31. The first cleaning device 31 scrubs and washes the substrate W after it has been ground by a grinding device 40 described below. The first cleaning device 31 includes a cleaning body such as a sponge or a brush, and removes particles such as grinding debris with the cleaning body.

[0022] The cleaning section 3 also has a second cleaning device 32. The second cleaning device 32 etches the substrate W after it has been ground by the grinding device 40 with a chemical solution. The second cleaning device 32 includes a spin chuck that holds the substrate W, and a nozzle that ejects the chemical solution. The nozzle supplies the chemical solution to the center of the upper surface of the rotating substrate W.

[0023] The cleaning section 3 may further include a third cleaning device 33. Unlike the first cleaning device 31 and the second cleaning device 32, the third cleaning device 33 cleans the substrate W before it is ground by the grinding device 40. Like the first cleaning device 31, the third cleaning device 33 scrubs the substrate W. This can prevent foreign matter from getting caught between the chuck 42 of the grinding device 40 and the substrate W, and allows the substrate W to be ground flat.

[0024] The cleaning unit 3 has a detection device 34. The detection device 34 detects the center of the substrate W before it is ground by the grinding device 40. In a plan view, the detection device 34 can align the center of the substrate W with the center of the chuck 42 of the grinding device 40. In addition to the center of the substrate W, the detection device 34 may detect the crystal orientation of the substrate W, and more specifically, may detect a notch or an orientation flat that indicates the crystal orientation of the substrate W. In a rotating coordinate system that rotates together with the chuck 42, the detection device 34 can align the crystal orientation of the substrate W to a desired orientation.

[0025] The first cleaning device 31, the third cleaning device 33, and the detection device 34 may be stacked in the vertical direction to reduce the installation area of ​​the grinding system 1. For example, the detection device 34, the first cleaning device 31, and the third cleaning device 33 are arranged in this order from bottom to top. However, the order is not particularly limited.

[0026] The cleaning section 3 has a transition apparatus 35. The transition apparatus 35 temporarily accommodates the substrate W. A plurality of transition apparatuses 35 may be stacked in the vertical direction. The arrangement and number of the transition apparatuses 35 are not particularly limited.

[0027] The cleaning unit 3 has a second transfer region 36. In a plan view, the second transfer region 36 is disposed adjacent to the first cleaning device 31, the second cleaning device 32, and the transition device 35 so as to be surrounded on three sides by the first cleaning device 31, the second cleaning device 32, and the transition device 35. The cleaning unit 3 has a second transfer device 37 that transfers the substrate W in the second transfer region 36. The second transfer device 37 transfers the substrate W between a plurality of devices disposed adjacent to the second transfer region 36. The second transfer device 37 includes a second transfer arm 37a that holds the substrate W. The second transfer arm 37a is capable of moving in the horizontal direction (both in the X-axis direction and the Y-axis direction) and the vertical direction, and of rotating about a vertical axis. The number of the second transfer arms 37a may be one or more.

[0028] The cleaning unit 3 has a rectangular shape with the corners cut out in a plan view, and the third transport region 38 is disposed at the cut-out position. In a plan view, the third transport region 38 is disposed next to the second transport region 36, the first cleaning device 31, and the grinding device 40, and is surrounded on three sides by the second transport region 36, the first cleaning device 31, and the grinding device 40. The third transport region 38 may be provided inside a housing that covers both the cleaning unit 3 and the third transport region 38, or may be provided inside a housing separate from the housing that covers the cleaning unit 3 and connected to the cleaning unit 3.

[0029] The grinding system 1 includes a third transfer device 39 that transfers the substrate W in a third transfer region 38. The third transfer device 39 transfers the substrate W between a plurality of devices arranged adjacent to the third transfer region 38. The third transfer device 39 includes a suction pad 39a that holds the substrate W. The suction pad 39a suctions the substrate W from above. The suction pad 39a is capable of moving in the horizontal direction (both in the X-axis direction and the Y-axis direction) and the vertical direction, and of rotating about a vertical axis.

[0030] The grinding unit 4 includes a grinding device 40. The grinding device 40 grinds the substrate W. The grinding includes polishing. The abrasive grains used for grinding may be either fixed abrasive grains or loose abrasive grains. The grinding device 40 includes, for example, a table 41, four chucks 42, and three processing mechanisms 43.

[0031] The table 41 holds four chucks 42 at equal intervals around a rotation center line R1 and rotates around the rotation center line R1. Each of the four chucks 42 rotates together with the table 41 and moves to a carry-in / out position A0, a first grinding position A1, a second grinding position A2, a third grinding position A3, and the carry-in / out position A0 in this order.

[0032] The loading / unloading position A0 serves as both a position where the substrate W is loaded and a position where the substrate W is unloaded. In this embodiment, the loading position and the unloading position are the same position, but the loading position and the unloading position may be different positions. The primary grinding position A1 is a position where the primary grinding of the substrate W is performed. The secondary grinding position A2 is a position where the secondary grinding of the substrate W is performed. The tertiary grinding position A3 is a position where the tertiary grinding of the substrate W is performed.

[0033] The four chucks 42 are attached to the table 41 so as to be rotatable about their respective rotation center lines R2 (see FIG. 4). At the first grinding position A1, the second grinding position A2, and the third grinding position A3, the chucks 42 rotate about their respective rotation center lines R2.

[0034] One of the processing mechanisms 43 performs primary grinding of the substrate W at the primary grinding position A1. Another of the processing mechanisms 43 performs secondary grinding of the substrate W at the secondary grinding position A2. The remaining of the processing mechanisms 43 performs tertiary grinding of the substrate W at the tertiary grinding position A3.

[0035] The number of processing mechanisms 43 may be one or more. The number of chucks 42 may be greater than the number of processing mechanisms 43. However, the table 41 may not be present. When the table 41 is not present, the number of chucks 42 may be the same as the number of processing mechanisms 43, or may be one.

[0036] The control unit 5 is, for example, a computer, and includes a CPU (Central Processing Unit) 51 and a storage medium 52 such as a memory. The storage medium 52 stores programs that control various processes executed in the grinding system 1. The control unit 5 controls the operation of the grinding system 1 by causing the CPU 51 to execute the programs stored in the storage medium 52.

[0037] Next, a description will be given of the operation of the grinding system 1. The following operation is performed under the control of the control unit 5.

[0038] First, the first transfer device 24 takes out the substrate W from the cassette C and transfers it to the transition device 35. Then, the second transfer device 37 transfers the substrate W from the transition device 35 to the third cleaning device 33.

[0039] Next, the third cleaning device 33 cleans the substrate W before it is ground by the grinding device 40. The clean substrate W can be placed on the chuck 42 of the grinding device 40, and the inclusion of foreign matter can be suppressed. Therefore, the substrate W can be ground flat, and the deterioration of the thickness deviation of the substrate W can be suppressed. After the substrate W is dried, the second transport device 37 transports the substrate W from the third cleaning device 33 to the detection device 34.

[0040] It should be noted that the third cleaning device 33 may be omitted if the unground substrate W is clean or if the grinding device 40 has a mechanism for cleaning the unground substrate W. In that case, the second transport device 37 transports the substrate W from the transition device 35 to the detection device 34.

[0041] Next, the detection device 34 detects the center of the substrate W. The detection device 34 may also detect the crystal orientation of the substrate W, specifically, may also detect a notch or the like. Thereafter, the third transfer device 39 transfers the substrate W from the detection device 34 to the chuck 42 of the grinding device 40. During this time, the control unit 5 controls the third transfer device 39 based on the detection result of the detection device 34 to align the center of the chuck 42 with the center of the substrate W. The control unit 5 also controls the third transfer device 39 based on the detection result of the detection device 34 to align the crystal orientation of the substrate W to a desired orientation in a rotating coordinate system that rotates together with the chuck 42.

[0042] Next, the grinding device 40 grinds the upper surface of the substrate W. The substrate W rotates together with the table 41, and moves to the load / unload position A0, the first grinding position A1, the second grinding position A2, the third grinding position A3, and the load / unload position A0 in this order. During this time, the first grinding, the second grinding, and the third grinding are performed. Thereafter, the third transfer device 39 transfers the substrate W from the chuck 42 to the first cleaning device 31.

[0043] Next, the first cleaning device 31 cleans the upper surface of the substrate W to remove particles such as grinding debris. After the substrate W is dried, the second transfer device 37 transfers the substrate W from the first cleaning device 31 to the second cleaning device 32.

[0044] Next, the second cleaning device 32 etches the upper surface of the substrate W to remove grinding marks. After the substrate W is dried, the second transfer device 37 transfers the substrate W from the second cleaning device 32 to the transition device 35. Then, the first transfer device 24 transfers the substrate W from the transition device 35 to the cassette C. The substrate W is stored in the cassette C.

[0045] Next, the processing mechanism 43 of the grinding device 40 will be described with reference to Fig. 4. The processing mechanism 43 has a movable part 43a to which a grinding tool D is attached. The processing mechanism 43 is a drive mechanism that drives the grinding tool D. The grinding tool D is brought into contact with the substrate W to grind the substrate W. The grinding tool D has, for example, a disk-shaped grinding wheel D1 and a plurality of grindstones D2 arranged in a ring shape on the lower surface of the grinding wheel D1.

[0046] The movable part 43a includes a flange 43a1 on which the grinding tool D is attached, a spindle shaft 43a2 on whose lower end the flange 43a1 is provided, and a spindle motor 43a3 for rotating the spindle shaft 43a2. The flange 43a1 is disposed horizontally, and the grinding tool D is replaceably attached to its lower surface by a fastener E such as a bolt. A plurality of fasteners E are provided at intervals along the periphery of the flange 43a1. The spindle shaft 43a2 is disposed vertically. The spindle motor 43a3 rotates the spindle shaft 43a2 to rotate the grinding tool D attached to the flange 43a1. The rotation center line R3 of the grinding tool D is the rotation center line of the spindle shaft 43a2.

[0047] The processing mechanism 43 further includes a lifting unit 43b that lifts and lowers the movable unit 43a. The lifting unit 43b includes, for example, a vertical Z-axis guide 43b1, a Z-axis slider 43b2 that moves along the Z-axis guide 43b1, and a Z-axis motor 43b3 that moves the Z-axis slider 43b2. The movable unit 43a is fixed to the Z-axis slider 43b2, and the movable unit 43a and the grinding tool D are lifted and lowered together with the Z-axis slider 43b2. The lifting unit 43b further includes a position detector 43b4 that detects the position of the grinding tool D. The position detector 43b4 detects, for example, the rotation of the Z-axis motor 43b3 to detect the position of the grinding tool D.

[0048] The lifting unit 43b lowers the grinding tool D from the standby position. The grinding tool D rotates while descending, comes into contact with the upper surface of the rotating substrate W, and grinds the entire upper surface of the substrate W. When the thickness of the substrate W reaches a set value, the lifting unit 43b stops the lowering of the grinding tool D. Thereafter, the lifting unit 43b raises the grinding tool D to the standby position.

[0049] Next, the attachment and detachment of the grinding tool D to the processing mechanism 43 will be described with reference to Fig. 5 and Fig. 6. As shown in Fig. 5, the grinding device 40 has an exterior cover 44. The exterior cover 44 houses a chuck 42 as a holder for holding the substrate W, and the processing mechanism 43 to which the grinding tool D is replaceably attached. The exterior cover 44 prevents particles such as grinding dust generated inside from flowing out to the outside. This allows the factory room to be kept clean.

[0050] The exterior cover 44 has an entrance 44a through which the replacement device 7 passes when entering the interior of the exterior cover 44 from the outside. Instead of a person, the replacement device 7 enters the interior of the exterior cover 44 from the outside and replaces the grinding tool D inside the exterior cover 44.

[0051] Since the replacement device 7 enters the inside of the exterior cover 44 instead of a human being to replace the grinding tool D, it is possible to prevent the human being from becoming dirty with the deposits inside the exterior cover 44. In addition, since the replacement device 7 is provided outside the grinding device 40, the grinding device 40 can be made smaller than when the replacement device 7 is provided inside the grinding device 40.

[0052] The grinding device 40 is provided with a shutter 45 that opens and closes the entrance 44a of the exterior cover 44. The shutter 45 basically closes the entrance 44a, and opens the entrance 44a when the exchange device 7 enters. Compared to a case where the entrance 44a is always open, the outflow of particles from the inside to the outside of the exterior cover 44 through the entrance 44a can be suppressed, and the factory room can be kept clean.

[0053] The grinding device 40 may include a moving mechanism 46 that moves the shutter 45 between an open position (e.g., the position shown in FIG. 5) where the entrance 44a is opened and a closed position where the entrance 44a is closed. The moving mechanism 46 is a pneumatic cylinder, an electric cylinder, or the like. The electric cylinder includes a motor and a ball screw. The shutter 45 can be moved automatically, not manually.

[0054] 3, the grinding device 40 includes a plurality of processing mechanisms 43, and an entrance 44a is provided for each processing mechanism 43. For example, the processing mechanisms 43 and the entrances 44a are provided at the first grinding position A1, the second grinding position A2, and the third grinding position A3, respectively. A shutter 45 is provided for each entrance 44a, and the shutter 45 is moved for each entrance 44a.

[0055] The greater the number of processing mechanisms 43, the more pronounced the effect of providing the replacement device 7 outside the grinding apparatus 40. Unlike this embodiment, if an replacement device 7 is provided inside the grinding apparatus 40 for each processing mechanism 43, or if an replacement device 7 common to multiple processing mechanisms 43 is provided inside the grinding apparatus 40, the grinding apparatus 40 becomes large. On the other hand, according to this embodiment, the replacement device 7 is provided outside the grinding apparatus 40, so the grinding apparatus 40 can be made smaller. However, the number of processing mechanisms 43 may be one.

[0056] 5, the grinding device 40 may include a limiting mechanism 47. The limiting mechanism 47 limits the outflow of gas from the inside to the outside of the exterior cover 44 through the inlet 44a of the exterior cover 44. By limiting the outflow of gas, the outflow of particles can be suppressed, and the factory room can be kept clean.

[0057] For example, the restriction mechanism 47 includes an exhaust line 47a that makes the inside of the exterior cover 44 negative pressure compared to the outside. The exhaust line 47a is a duct or the like, and connects the exterior cover 44 to an exhaust source. The exhaust source is, for example, a vacuum pump or an ejector. An air pressure controller 47b, for example, is provided midway along the exhaust line 47a. The air pressure controller 47b controls the air pressure inside the exterior cover 44. An air flow is formed from the entrance 44a of the exterior cover 44 toward the inside due to the air pressure difference. As a result, the outflow of gas from the inside of the exterior cover 44 to the outside can be restricted.

[0058] The connection port of the exhaust line 47a with the exterior cover 44 is above the inlet 44a of the exterior cover 44 in FIG. 5, but it may be below. In the latter case, a downflow can be formed inside the exterior cover 44. A blower such as a fan filter unit may be provided on the ceiling of the exterior cover 44. The amount of air blown and the amount of air exhausted are controlled so as to make the inside of the exterior cover 44 a negative pressure compared to the outside.

[0059] The grinding device 40 may include a cleaning mechanism 48. The cleaning mechanism 48 supplies cleaning liquid to the grinding tool D or the peripheral members of the grinding tool D by a nozzle or the like. The cleaning liquid is, for example, DIW (deionized water) or the like. The peripheral members of the grinding tool D are, for example, a flange 43a1 or a spindle shaft 43a2. Before removing the used grinding tool D from the processing mechanism 43, the grinding tool D and the like are cleaned. This makes it possible to prevent the replacement device 7 from becoming dirty. Furthermore, by cleaning the grinding tool D with the cleaning mechanism 48, it is possible to prevent particles from being carried out together with the grinding tool D.

[0060] The grinding device 40 includes a control unit 50. The control unit 50 is, for example, a computer, and includes a CPU 50a and a storage medium 50b such as a memory. The storage medium 50b stores programs that control various processes executed in the grinding device 40. The control unit 50 controls the operation of the grinding device 40 by causing the CPU 50a to execute the programs stored in the storage medium 50b. The control unit 50 of the grinding device 40 may be a part of the control unit 5 of the grinding system 1.

[0061] The replacement device 7 includes, for example, a replacement mechanism 71, a moving mechanism 72, a running platform 73, and a running mechanism 74. The replacement mechanism 71 attaches a grinding tool D to the processing mechanism 43, or removes the grinding tool D from the processing mechanism 43. The replacement mechanism 71 is capable of moving in the horizontal direction (both the X-axis direction and the Y-axis direction) and the vertical direction, and of rotating about the vertical axis. The moving mechanism 72 moves the replacement mechanism 71 from the outside to the inside of the exterior cover 44 through the entrance 44a of the exterior cover 44. The moving mechanism 72 is, for example, a multi-joint arm, and holds the replacement mechanism 71 at one end and is connected to the running platform 73 at the other end. The running platform 73 supports the moving mechanism 72. The running mechanism 74 moves the running platform 73.

[0062] Since the replacement device 7 is provided outside the grinding device 40, a self-propelled robot is used as the replacement device 7, unlike when the replacement device 7 is provided inside the grinding device 40. The replacement device 7 replaces the grinding tool D instead of a human. This prevents the human from getting dirty. In addition, since the replacement device 7 is provided outside the grinding device 40, the grinding device 40 can be made smaller than when the replacement device 7 is provided inside the grinding device 40.

[0063] As shown in FIG. 6, the replacement mechanism 71 has a holding mechanism 71a that holds a grinding tool D. The holding mechanism 71a holds a container F that houses the grinding tool D. The container F is box-shaped and opens upward, and has a recess on the top surface. The grinding tool D is housed in the recess. The container F houses the grinding tool D and prevents the grinding fluid, grinding chips, etc. from falling when the grinding tool D is removed. The holding mechanism 71a may hold the grinding tool D.

[0064] The replacement mechanism 71 has a rotation-stop mechanism 71b that stops the rotation of the spindle shaft 43a2 of the processing mechanism 43. The rotation-stop mechanism 71b includes, for example, a clamp that grips the flange 43a1 or the spindle shaft 43a2. Alternatively, the rotation-stop mechanism 71b includes a pin that is inserted into a hole in the flange 43a1 or the spindle shaft 43a2. With the rotation of the spindle shaft 43a2 stopped by the rotation-stop mechanism 71b and the rotation of the grinding tool D stopped, the fastener E can be tightened or loosened.

[0065] The replacement mechanism 71 has an operation mechanism 71c that tightens or loosens a fastener E that fastens the grinding tool D to the processing mechanism 43. When the fastener E is a bolt, the operation mechanism 71c is made up of a tool such as a spanner or wrench that fits onto the bolt and a rotation mechanism that turns the tool.

[0066] As shown in Fig. 1 etc., a plurality of pairs of replacement mechanism 71 and movement mechanism 72 may be provided and controlled independently. One pair is used for mounting the grinding tool D, and another pair is used for removing the grinding tool D. Unlike the case where there is only one pair of replacement mechanism 71 and movement mechanism 72, if there are a plurality of pairs, the grinding tool D can be quickly removed and mounted in succession. In other words, the replacement device 7 does not need to go back and forth between the grinding device 40 and the storage unit 9 between the removal and mounting of the grinding tool D.

[0067] If the storage unit 9 (see FIG. 11) of the replacement device 7 stores both used and unused grinding tools D, the grinding tools D can be quickly removed and attached in succession even if there is only one replacement mechanism 71 and one moving mechanism 72. If the storage unit 9 (see FIG. 11) of the replacement device 7 stores a plurality of both used and unused grinding tools D, replacement work can be performed continuously for a plurality of processing mechanisms 43 without going back and forth between the storage unit 9 (see FIGS. 1 and 2) fixed to the outside of the replacement device 7 and the grinding device 40.

[0068] The exchange device 7 may include an imaging device 75 that captures an image of the exchange mechanism 71. The imaging device 75 is attached to one end of the moving mechanism 72, similar to the exchange mechanism 71. The exchange mechanism 71 can be controlled while monitoring the operation of the exchange mechanism 71 by the imaging device 75.

[0069] The exchange device 7 includes a control unit 76. The control unit 76 is, for example, a computer, and includes a CPU 76a and a storage medium 76b such as a memory. The storage medium 76b stores a program that controls various processes executed in the exchange device 7. The control unit 76 controls the operation of the exchange device 7 by causing the CPU 76a to execute the program stored in the storage medium 76b.

[0070] Next, the functions of the control unit 50 of the grinding device 40 and the control unit 76 of the exchanging device 7 will be described with reference to FIG. 7. Note that each functional block shown in FIG. 7 is conceptual, and does not necessarily have to be physically configured as shown in the figure. All or part of each functional block can be functionally or physically distributed and integrated in any unit. All or any part of each processing function performed by each functional block can be realized by a program executed by a CPU, or can be realized as hardware using wired logic.

[0071] First, a description will be given of the function of the control unit 50 of the grinding device 40. The control unit 50 has, for example, a replacement command generating unit 50c, a position detecting unit 50d, an opening / closing control unit 50e, a negative pressure control unit 50f, a cleaning control unit 50g, and an auto-setup control unit 50h.

[0072] The replacement command creation unit 50c judges whether or not the grinding tool D needs to be replaced, and creates a replacement command for the grinding tool D. Specifically, the replacement command creation unit 50c monitors, for example, the number of substrates W ground by the grinding tool D, the amount of wear of the grinding tool D, or the elapsed time since the grinding tool D was attached, and creates a replacement command when the monitored value reaches a set value. The created replacement command is transmitted wirelessly or by wire to the control unit 76 of the replacement device 7. The replacement device 7 and the grinding device 40 may transmit and receive signals via an external computer. When the replacement device 7 receives the replacement command and receives a request from the grinding device 40, it travels to the grinding device 40.

[0073] The position detection unit 50d detects, by the detection unit 53, whether or not the running platform 73 of the replacement device 7 has arrived at a position (for example, the position shown in FIG. 5) where the grinding tool D is replaced. The position where the grinding tool D is replaced is set outside the exterior cover 44, and serves as both a position where the grinding tool D is attached and a position where the grinding tool D is removed. The detection unit 53 detects, for example, that the running platform 73 of the replacement device 7 has arrived at a set position outside the exterior cover 44. The detection unit 53 is attached, for example, to the outer wall surface of the exterior cover 44, and is attached above the entrance 44a. The detection unit 53 is, for example, a camera or the like.

[0074] The opening / closing control unit 50e controls the moving mechanism 46 of the shutter 45 to control the position of the shutter 45. When the running platform 73 of the replacement device 7 arrives at the position where the grinding tool D is replaced, the opening / closing control unit 50e changes the position of the shutter 45 from the closed position to the open position. Also, when the running platform 73 of the replacement device 7 leaves the position where the grinding tool D is replaced, the opening / closing control unit 50e changes the position of the shutter 45 from the open position to the closed position.

[0075] The negative pressure control unit 50f controls the air pressure controller 47b of the exhaust line 47a to make the inside of the exterior cover 44 negative pressure compared to the outside. The negative pressure control unit 50f makes the inside of the exterior cover 44 negative pressure compared to the outside at least while the shutter 45 opens the entrance 44a of the exterior cover 44.

[0076] Before the shutter 45 opens the entrance 44a of the exterior cover 44, the cleaning control unit 50g controls the cleaning mechanism 48 to supply cleaning liquid to the grinding tool D or peripheral members of the grinding tool D. The cleaning liquid is supplied, for example, after a command to replace the grinding tool D is generated. Note that the cleaning liquid may also be supplied during grinding of the substrate W or at the end of grinding.

[0077] The auto-setup control unit 50h performs auto-setup when replacement of the grinding tool D is completed and the replacement device 7 leaves the position for replacing the grinding tool D. The auto-setup includes, for example, dressing of an unused grinding tool D or adjusting the temperature inside the exterior cover 44.

[0078] Next, a description will be given of the function of the control unit 76 of the exchange device 7. The control unit 76 has, for example, a travel control unit 76c, a movement control unit 76d, and an exchange control unit 76e.

[0079] The travel control unit 76c controls the travel mechanism 74 to control the position of the travel platform 73. For example, the travel control unit 76c controls the travel mechanism 74 to make the travel platform 73 travel between a position where the grinding tool D is stored and a position where the grinding tool D is replaced.

[0080] The movement control unit 76d controls the movement mechanism 72 and controls the position of the replacement mechanism 71. When the replacement device 7 detects by a signal or the like transmitted from the grinding device 40 that the traveling platform 73 has stopped at a position for replacing the grinding tool D and the entrance 44a of the exterior cover 44 is open, the movement control unit 76d moves the replacement mechanism 71 from the outside to the inside of the exterior cover 44 through the entrance 44a of the exterior cover 44. In addition, before the traveling platform 73 leaves the position for replacing the grinding tool D, the movement control unit 76d moves the replacement mechanism 71 from the inside to the outside of the exterior cover 44 through the entrance 44a of the exterior cover 44.

[0081] The replacement control unit 76e controls the replacement mechanism 71, and controls the removal or installation of the grinding tool D. The replacement control unit 76e holds the grinding tool D with the holding mechanism 71a, and tightens or loosens the fastener E with the operation mechanism 71c while stopping the rotation of the spindle shaft 43a2 with the rotation prevention mechanism 71b. The replacement control unit 76e controls the replacement mechanism 71 while monitoring the operation of the replacement mechanism 71 with the imaging device 75.

[0082] Next, the operations of the grinding device 40 and the replacement device 7 will be described together. The grinding device 40 judges whether or not the grinding tool D needs to be replaced, and creates a replacement command for the grinding tool D. Then, the grinding device 40 transmits the created replacement command to the replacement device 7. When the grinding device 40 judges that the grinding tool D needs to be replaced, it stops grinding the substrate W and performs cleaning by the cleaning mechanism 48. On the other hand, when the replacement device 7 receives the replacement command from the grinding device 40, it approaches the grinding device 40. When the grinding device 40 detects that the running platform 73 of the replacement device 7 has arrived at a position where the grinding tool D is to be replaced, it opens the shutter 45. Then, the replacement device 7 causes the replacement mechanism 71 to enter the inside through the entrance 44a of the exterior cover 44. Next, the replacement device 7 removes the used grinding tool D from the processing mechanism 43, and attaches an unused grinding tool D to the processing mechanism 43. Thereafter, the exchanging device 7 causes the exchanging mechanism 71 to exit to the outside through the entrance 44a of the exterior cover 44. Thereafter, the grinding device 40 closes the shutter 45 and performs auto-setup control. Next, the grinding device 40 resumes grinding of the substrate W.

[0083] Next, a grinding device 40 and an exchanging device 7 according to a first modified example will be described with reference to Fig. 8. Below, differences from the above embodiment will be mainly described.

[0084] The limiting mechanism 47 of the grinding device 40 of this modification has a seal member 47c in addition to the exhaust line 47a. The limiting mechanism 47 may have only the seal member 47c. The seal member 47c comes into contact with the articulated arm of the exchange device 7 that has entered the entrance 44a of the exterior cover 44, and blocks the entrance 44a of the exterior cover 44. The seal member 47c limits the outflow of gas and suppresses the outflow of particles.

[0085] The seal member 47c is attached to, for example, the shutter 45 and is moved together with the shutter 45. A pair of shutters 45 is provided, and the seal members 47c are attached to the mutually facing surfaces of the pair of shutters 45. The pair of seal members 47c sandwich and encase the exchange device 7, and close the entrance 44a of the exterior cover 44. The seal member 47c is made of a flexible material such as rubber, and is deformed to follow the external shape of the exchange device 7.

[0086] When the running platform 73 of the exchange device 7 reaches a set position outside the exterior cover 44, the opening / closing control unit 50e changes the position of the shutter 45 from the closed position to the open position. Thereafter, the movement control unit 76d moves the exchange mechanism 71 from the outside to the inside of the exterior cover 44 through the entrance 44a of the exterior cover 44. At that time, the seal member 47c does not come into contact with the exchange device 7.

[0087] Thereafter, the opening / closing control unit 50e changes the position of the shutter 45 from the open position to a sealed position (for example, the position shown in FIG. 8). The sealed position is a position where the sealing member 47c comes into contact with the articulated arm or the like of the replacement device 7 and blocks the entrance 44a of the exterior cover 44. With the sealing member 47c blocking the entrance 44a, the replacement control unit 76e controls the replacement mechanism 71 to remove or attach the grinding tool D.

[0088] When the removal or installation of the grinding tool D is completed, the opening / closing control unit 50e changes the position of the shutter 45 from the sealed position to the open position. Then, the movement control unit 76d moves the replacement mechanism 71 from the outside to the inside of the exterior cover 44 through the entrance 44a of the exterior cover 44. Thereafter, the travel control unit 76c controls the travel mechanism 74 to make the travel platform 73 travel from the position where the grinding tool D is replaced to the position where the grinding tool D is stored.

[0089] Next, a grinding device 40 and an exchanging device 7 according to a second modified example will be described with reference to Fig. 9. Below, differences from the above embodiment and the above first modified example will be mainly described.

[0090] The exterior cover 44 of the grinding device 40 of this modification has a main housing 44b in which an entrance 44a is formed, and a sub-housing 44c attached to the outer wall surface of the main housing 44b so as to surround the entrance 44a of the main housing 44b. The main housing 44b houses a chuck 42 as a holder for holding the substrate W, and a processing mechanism 43 to which a grinding tool D is replaceably attached.

[0091] The sub-housing 44c includes a second entrance 44d through which the replacement device 7 passes when entering the inside of the sub-housing 44c from the outside. After arriving at a position where the replacement device 7 replaces the grinding tool D, the replacement device 7 passes through the second entrance 44d and the entrance 44a in this order, enters the inside of the main housing 44b, and replaces the grinding tool D inside the main housing 44b.

[0092] The grinding device 40 includes a second shutter 61 that opens and closes the second entrance 44d of the sub-housing 44c. The second shutter 61 basically closes the second entrance 44d, and opens the second entrance 44d when the exchange device 7 enters. Compared to a case where the second entrance 44d is always open, the outflow of particles from the inside to the outside of the exterior cover 44 through the second entrance 44d can be suppressed, and the factory room can be kept clean.

[0093] The grinding device 40 may include a second moving mechanism 62 that moves the second shutter 61 between a second open position where the second entrance 44d is opened and a second closed position where the second entrance 44d is closed. The second moving mechanism 62 is a pneumatic cylinder, an electric cylinder, or the like. The second shutter 61 can be moved automatically, not manually.

[0094] The second entrance 44d is provided for each processing mechanism 43, similar to the entrance 44a. For example, the second entrance 44d is provided at each of the first grinding position A1, the second grinding position A2, and the third grinding position A3. A second shutter 61 is provided for each second entrance 44d, and the second shutter 61 is moved for each second entrance 44d.

[0095] The control unit 50 of the grinding device 40 includes a second opening / closing control unit (not shown). The second opening / closing control unit controls the second moving mechanism 62 to control the position of the second shutter 61. When the running platform 73 of the replacement device 7 arrives at a position where the grinding tool D is replaced, the second opening / closing control unit changes the position of the second shutter 61 from the second closed position to the second open position. When the running platform 73 of the replacement device 7 leaves the position where the grinding tool D is replaced, the second opening / closing control unit changes the position of the second shutter 61 from the second open position to the second closed position.

[0096] The limiting mechanism 47 of the grinding device 40 may have a second seal member 47d. The second seal member 47d comes into contact with the articulated arm of the exchange device 7 that has entered the second entrance 44d of the sub-housing 44c, and blocks the second entrance 44d of the sub-housing 44c. The second seal member 47d limits the outflow of gas and suppresses the outflow of particles.

[0097] The second seal member 47d is attached to, for example, the second shutter 61 and is moved together with the second shutter 61. A pair of second shutters 61 is provided, and the second seal member 47d is attached to the opposing surfaces of the pair of second shutters 61. The pair of second seal members 47d sandwich and encase the exchange device 7, and close the second entrance 44d of the exterior cover 44. The second seal member 47d is made of a flexible material such as rubber, and is deformed to follow the external shape of the exchange device 7.

[0098] When the running platform 73 of the exchange device 7 reaches a set position outside the exterior cover 44, the second opening / closing control unit changes the position of the second shutter 61 from the second closed position to the second open position. Thereafter, the movement control unit 76d moves the exchange mechanism 71 from the outside to the inside of the sub-housing 44c through the second entrance 44d of the sub-housing 44c. At that time, the second seal member 47d does not come into contact with the exchange device 7.

[0099] Thereafter, the second opening / closing control unit changes the position of the second shutter 61 from the second open position to the second sealed position (for example, the position shown in FIG. 9). The second sealed position is a position where the second sealing member 47d contacts the articulated arm or the like of the replacement device 7 and blocks the second entrance 44d of the sub-housing 44c. With the second sealing member 47d blocking the second entrance 44d, the opening / closing control unit 50e changes the position of the shutter 45 from the closed position to the open position. Next, the movement control unit 76d moves the replacement mechanism 71 from the outside to the inside of the main housing 44b through the entrance 44a of the main housing 44b. Next, the opening / closing control unit 50e changes the position of the shutter 45 from the open position to the sealed position. Thereafter, the replacement control unit 76e controls the replacement mechanism 71 to remove or attach the grinding tool D. In addition, when the second seal member 47d is attached to the second shutter 61, if the second seal member 47d closes the second entrance 44d of the sub-housing 44c, the outflow of particles can be suppressed. Therefore, the seal member 47c is not necessary. However, if the seal member 47c is present, the outflow of particles can be further suppressed.

[0100] When the removal or installation of the grinding tool D is completed, the opening / closing control unit 50e changes the position of the shutter 45 from the sealed position to the open position. Next, the movement control unit 76d moves the replacement mechanism 71 from inside to outside the main housing 44b through the entrance 44a of the main housing 44b. Next, the opening / closing control unit 50e changes the position of the shutter 45 from the open position to the closed position. Thereafter, the second opening / closing control unit changes the position of the second shutter 61 from the second sealed position to the second open position. Next, the movement control unit 76d moves the replacement mechanism 71 from inside to outside the sub-housing 44c through the second entrance 44d of the sub-housing 44c. Thereafter, the travel control unit 76c controls the travel mechanism 74 to travel the travel platform 73 from the position where the grinding tool D is replaced to the position where the grinding tool D is stored. In this manner, by closing at least one of the entrance 44a and the second entrance 44d without simultaneously opening them, the inside of the main housing 44b can be prevented from being exposed to the outside of the grinding device 40.

[0101] Next, a grinding device 40 and an exchanging device 7 according to a third modified example will be described with reference to Fig. 10. Below, differences from the above embodiment, the above first modified example, and the above second modified example will be mainly described.

[0102] The exchange device 7 of this modified example includes a housing 77 attached to the running platform 73. The housing 77 contacts the outer wall surface of the exterior cover 44 in a state in which the exchange mechanism 71 and the moving mechanism 72 are housed therein, and seals the inside of the housing 77. The housing 77 may have a seal member 77a on the contact surface with the exterior cover 44.

[0103] When the shutter 45 opens the entrance 44a of the exterior cover 44, the inside of the housing 77 and the inside of the exterior cover 44 communicate with each other via the entrance 44a of the exterior cover 44. In this state, replacement of the grinding tool D is performed. The housing 77 can restrict the outflow of gas and suppress the outflow of particles, thereby keeping the factory room clean.

[0104] 9, when the exterior cover 44 has a main housing 44b and a sub-housing 44c, the housing 77 comes into contact with the outer wall surface of the sub-housing 44c. When the second shutter 61 opens the second entrance 44d of the sub-housing 44c and the shutter 45 opens the entrance 44a of the main housing 44b, the inside of the housing 77 communicates with the inside of the main housing 44b.

[0105] Meanwhile, as shown in FIG. 6, the processing mechanism 43 includes an attachment portion (e.g., a flange 43a1) to which the grinding tool D is replaceably attached, and a fastener E for fastening the flange 43a1 and the grinding tool D. The fastener E is, for example, a bolt. The fastener E fastens the flange 43a1 and the grinding tool D from above the flange 43a1. For example, the fastener E is inserted into a straight hole that penetrates the flange 43a1 in the vertical direction, and is screwed into a screw hole formed on the upper surface of the grinding tool D (specifically, the grinding wheel D1). The fastener E is operated by an operation mechanism 71c. As shown in FIG. 6, the operation mechanism 71c tightens and loosens the fastener E above the flange 43a1.

[0106] A cover or the like for covering the spindle shaft 43a2 may be provided above the flange 43a1 to protect the spindle shaft 43a2 from grinding fluid containing grinding debris. If a cover or the like is provided, it becomes difficult for the operating mechanism 71c to enter above the flange 43a1, making it difficult to operate the fastener E.

[0107] Therefore, as shown in Fig. 12, the fastener E may fasten the flange 43a1 and the grinding tool D from the side of the flange 43a1. Alternatively, as shown in Fig. 13, the fastener E may fasten the flange 43a1 and the grinding tool D from diagonally below the flange 43a1. In either case, even if a cover or the like is present above the flange 43a1, the operating mechanism 71c does not enter above the flange 43a1, making it easy for the operating mechanism 71c to operate the fastener E.

[0108] 12, the flange 43a1 includes, for example, a disk-shaped upper flange 101 and a disk-shaped lower flange 102 having an outer diameter smaller than that of the upper flange 101. On the other hand, the grinding tool D includes a ring portion 111 that fits the lower flange 102, a disk portion 112 that closes the lower side of the ring portion 111, and a plurality of grindstones 113 arranged along the outer periphery of the disk portion 112.

[0109] 12, the axial direction of the fastener E may be perpendicular to the rotation center line R3 of the spindle shaft 43a2. The fastener E is, for example, inserted into a straight hole that radially penetrates the grinding tool D (specifically, the ring portion 111) and screwed into a screw hole formed on the outer circumferential surface of the flange 43a1 (specifically, the lower flange 102).

[0110] 13, the axial direction of the fastener E may be inclined downward as it moves away from the rotation center line R3 of the spindle shaft 43a2. The fastener E is, for example, inserted into a straight hole that obliquely penetrates the grinding tool D, and screwed into a screw hole formed in the lower surface of the flange 43a1.

[0111] 14, the replacement mechanism 71 has a holding mechanism 71a that holds a grinding tool D. The holding mechanism 71a holds the grinding tool D, for example, from below. The holding mechanism 71a is provided at the tip of a multi-joint arm 72a, for example, via a first rotating mechanism 71d described later. The tip of the multi-joint arm 72a enters below the processing mechanism 43 from the side and is lifted upward. Thereafter, the holding mechanism 71a comes into contact with the grinding tool D and holds the grinding tool D.

[0112] The replacement mechanism 71 may have a first rotation mechanism 71d that rotates the holding mechanism 71a. When the holding mechanism 71a holds the grinding tool D, the rotation center line of the holding mechanism 71a coincides with the rotation center line R3 of the spindle shaft 43a2. By rotating the holding mechanism 71a with the first rotation mechanism 71d, the grinding tool D and the flange 43a1 can be rotated simultaneously, and the fastener E can be directed toward the operating mechanism 71c. This simplifies the operation of the operating mechanism 71c.

[0113] When a plurality of fasteners E are provided at intervals in the circumferential direction of the grinding tool D, the control unit 76 repeatedly rotates the holding mechanism 71a by the first rotation mechanism 71d and loosens the fasteners E by the operation mechanism 71c. Before the operation mechanism 71c loosens the fasteners E, the rotation of the holding mechanism 71a is stopped so that the fasteners E face the operation mechanism 71c. At this time, the control unit 76 may monitor the position of the fasteners E using the imaging device 75 shown in FIG. 6, determine whether the position of the fasteners E is a desired position, and control the rotation stop position of the holding mechanism 71a. When all the fasteners E are removed, the grinding tool D and the processing mechanism 43 are released from the fastening.

[0114] 15, in order to assist in the separation of the grinding tool D and the processing mechanism 43, the replacement mechanism 71 may have a gas supply mechanism 71e that supplies gas between the grinding tool D and the processing mechanism 43. The gas supply mechanism 71e includes a nozzle 121 that discharges gas. The nozzle 121 supplies gas, for example, to a gap between the lower surface of the upper flange 101 and the upper surface of the ring portion 111. The wind pressure of the gas can make it easier to peel off the grinding tool D and the processing mechanism 43.

[0115] 16, the grinding tool D may be formed with a hole 114 for directing the gas supplied from the nozzle 121 to the contact surface between the grinding tool D and the processing mechanism 43. The hole 114 directs the gas supplied from the nozzle 121, for example, to a gap between the lower surface of the flange 43a1 and the upper surface of the grinding tool D. The hole 114 may be a dedicated hole, or may also be used as a hole for attaching a fastener E (for example, a straight hole or a screw hole).

[0116] 17, the replacement mechanism 71 may have a second rotation mechanism 71f that rotates the spindle shaft 43a2 of the processing mechanism 43. The second rotation mechanism 71f includes, for example, a roller 131. The rotation center line of the roller 131 is parallel to the rotation center line R3 of the spindle shaft 43a2, and the roller 131 and the flange 43a1 are in contact with each other. When the roller 131 is rotated, the flange 43a1 is rotated by friction.

[0117] Before attaching the grinding tool D to the flange 43a1, the second rotation mechanism 71f rotates the flange 43a1 to orient the hole 105 (e.g., a screw hole or a straight hole) of the flange 43a1 for attaching the fastener E in the desired direction. At this time, the control unit 76 may monitor the direction of the flange 43a1 using the imaging device 75 shown in Fig. 6, determine whether the direction of the flange 43a1 is the desired direction, and control the rotation stop position of the flange 43a1.

[0118] 17, before attaching the grinding tool D to the flange 43a1, the first rotation mechanism 71d rotates the grinding tool D to orient a hole 115 (e.g., a straight hole or a screw hole) for attaching the fastener E of the grinding tool D in a desired direction. At this time, the control unit 76 may monitor the direction of the grinding tool D using the imaging device 75 shown in FIG. 6, determine whether the direction of the grinding tool D is the desired direction, and control the rotation stop position of the grinding tool D. Thereafter, the tip of the articulated arm 72a is lifted upward, and the grinding tool D comes into contact with the flange 43a1.

[0119] The direction of the hole 115 for mounting the fastener E of the grinding tool D is aligned with the direction of the hole 105 for mounting the fastener E of the flange 43a1. The direction of any pair of holes 115, 105 is directed toward the operation mechanism 71c. After that, the tip of the articulated arm 72a is lifted upward, and the grinding tool D comes into contact with the flange 43a1. Next, the operation mechanism 71c fastens the grinding tool D and the flange 43a1 with the fastener E. After that, the control unit 76 repeatedly rotates the holding mechanism 71a by the first rotation mechanism 71d and tightens the fastener E by the operation mechanism 71c. At this time, the control unit 76 may monitor the positions of the holes 115, 105 using the imaging device 75 shown in FIG. 6, judge whether the positions of the holes 115, 105 are the desired positions, and control the rotation stop position of the holding mechanism 71a. When all the fasteners E are tightened, the fastening of the grinding tool D and the processing mechanism 43 is completed.

[0120] The processing device, the method for attaching the processing tool of the processing device, the replacement device, and the replacement method according to the present disclosure have been described above, but the present disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These naturally fall within the technical scope of the present disclosure.

[0121] For example, the processing device of the present disclosure is a grinding device in the above embodiment, but may be a cutting device or a cutting device, etc. Grinding includes polishing. The processing device may be one that includes a processing mechanism to which a processing tool is replaceably attached. When the processing device is a cutting device, a cutting tool such as an end mill is replaceably attached to the processing mechanism. When the processing device is a cutting device, a cutting tool such as a blade is replaceably attached to the processing mechanism. The processing tool may be one that comes into contact with the processing body and processes the processing body. When the processing tool comes into contact with the processing body and becomes worn, it is replaced.

[0122] Further, the object to be processed by the processing apparatus of the present disclosure is the substrate W in the above embodiment, but is not limited to the substrate W.

[0123] This application claims priority based on Japanese Patent Application No. 2020-081377, filed with the Japan Patent Office on May 1, 2020, the entire contents of which are incorporated herein by reference. [Explanation of symbols]

[0124] 7 Exchange device 40 Grinding equipment (processing equipment) 42 Chuck (holding part) 43 Processing mechanism 44 Exterior cover 44a Entrance 71 Exchange mechanism 72 Moving mechanism 73 Running platform 74 Running mechanism D Grinding tools (machining tools) W substrate (processing body)

Claims

1. A processing tool replacement device for use in a processing device that includes a holding part for holding a processing body, a processing mechanism to which a processing tool for processing the processing body held by the holding part is replaceably attached, and an exterior cover that houses the holding part and the processing mechanism, an exchange mechanism for attaching the processing tool to the processing mechanism or detaching the processing tool from the processing mechanism; a moving mechanism that moves the replacement mechanism from the outside to the inside of the exterior cover through an entrance of the exterior cover; A running platform supporting the moving mechanism; and a running mechanism for running the running platform.

2. A travel control unit that controls the travel mechanism, The processing tool is stored in a storage unit common to the plurality of processing devices, The exchange device according to claim 1 , wherein the travel control unit controls the traveling mechanism to travel the traveling platform between a position where the processing tool is stored and a position where the processing tool is exchanged.

3. A travel control unit that controls the travel mechanism, The processing tools are stored in a storage unit provided outside the processing apparatus for each of the processing apparatuses, The exchange device according to claim 1 , wherein the travel control unit controls the traveling mechanism to travel the traveling platform between a position where the processing tool is stored and a position where the processing tool is exchanged.

4. A storage unit for storing the processing tool is provided, The exchange device according to any one of claims 1 to 3, wherein the storage unit is caused to travel together with the travel platform.

5. a housing attached to the running platform; the housing is in contact with an outer wall surface of the exterior cover while accommodating the replacement mechanism and the moving mechanism therein, and seals the inside of the housing; 5. The replacement device according to claim 1, wherein the inside of the housing and the inside of the exterior cover communicate with each other through the entrance of the exterior cover.

6. The replacing device according to any one of claims 1 to 5, wherein the replacing mechanism has a holding mechanism for holding the processing tool.

7. The changing device according to claim 6 , wherein the holding mechanism holds a container that houses the tool.

8. The exchange device according to claim 6 or 7, wherein the exchange mechanism includes a first rotation mechanism that rotates the holding mechanism.

9. The replacement device according to any one of claims 1 to 8, wherein the replacement mechanism has a rotation prevention mechanism that stops rotation of a spindle shaft of the processing mechanism.

10. The replacement device according to any one of claims 1 to 9, wherein the replacement mechanism has a second rotation mechanism that rotates a spindle shaft of the processing mechanism.

11. The replacement device according to any one of claims 1 to 10, wherein the replacement mechanism has an operating mechanism for tightening or loosening a fastener that fastens the processing tool and the processing mechanism.

12. The replacement device according to any one of claims 1 to 11, wherein the replacement mechanism has a gas supply mechanism that supplies gas between the processing tool and the processing mechanism.

13. 13. The exchange apparatus according to claim 1, wherein a plurality of pairs of the exchange mechanism and the movement mechanism are provided and are controlled independently.

14. A method for replacing a processing tool used in a processing device including a holding part for holding a processing body, a processing mechanism to which a processing tool for processing the processing body held by the holding part is replaceably attached, and an exterior cover for accommodating the holding part and the processing mechanism, A tool changing device receives a tool changing command generated by the tool changing device; the replacement device travels to a set position outside the exterior cover; The replacement device detects that an entrance of the exterior cover is open; and The replacement device enters from the outside of the exterior cover to the inside of the exterior cover through the entrance of the exterior cover; The replacement method includes the replacement device attaching the processing tool to the processing mechanism or detaching the processing tool from the processing mechanism.

Images