Cleaning method and cleaning solution

Abstract

To enable efficient removal of particles to be removed that adhere to a target to be cleaned.SOLUTION: A cleaning method including a cleaning process for performing a cleaning by supplying a rotating cleaning target with a cleaning solution in which coarse particles that have a diameter of 1 μm or more and that promote the removal of particles to be removed adhere to the target are dispersed, is provided.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a cleaning method and a cleaning liquid, and in particular to a method for cleaning a substrate and a cleaning liquid for cleaning a substrate. [Background technology]

[0002] Patent Document 1 discloses a cleaning composition for use after chemical mechanical polishing, which contains organic polymer particles having an average dispersed particle size of 10 nm or more and less than 100 nm. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2008-47842 A [Patent Document 2] JP 2011-165751 A [Patent Document 3] Special Publication No. 2012-531748 [Patent Document 4] Japanese Patent Application Publication No. 2-252237 [Patent Document 5] Patent No. 6112330 Summary of the Invention [Problem to be solved by the invention]

[0004] To efficiently remove particles to be removed that are attached to a cleaning target. [Means for solving the problem]

[0005] According to one aspect of the present invention, [1] The present invention provides a cleaning method including a cleaning step of supplying a cleaning liquid having dispersed therein coarse particles having a diameter of 1 μm or more and facilitating the removal of particles to be removed adhering to the object to be cleaned, to the object to be cleaned as it rotates.

[0006] According to one aspect of the present invention, [2] The present invention provides a cleaning method including a cleaning step of supplying a cleaning liquid to a rotating object to be cleaned, the cleaning liquid containing dispersed coarse particles that are larger than the particles to be removed adhering to the object to be cleaned and that promote the removal of the particles to be removed.

[0007] [3] In the cleaning method according to [1] or [2], The particles to be removed may become detached from the object to be cleaned by electrically or physically adhering to the coarse particles.

[0008] [4] In the cleaning method according to any one of [1] to [3], When the cleaning liquid containing the coarse particles is stirred in the vicinity of the cleaning target, the particles to be removed may become detached from the cleaning target.

[0009] [5] In the cleaning method according to any one of [1] to [4], When the coarse particles collide with the object to be cleaned, the particles to be removed may become detached from the object to be cleaned.

[0010] [6] [1] to [5], the cleaning method according to any one of the above, The coarse particles may be acrylic, silica, zirconia, alumina or polypropylene particles.

[0011] [7] [1] to [6], the cleaning method according to any one of the above, The coarse particles may be particles charged with a polarity different from that of the target particles.

[0012] [8] [1] to [7], the cleaning method according to any one of the above, The method may include a temperature adjustment step of adjusting the temperature of the object to be cleaned and / or the cleaning liquid so that the difference between the temperature of the object to be cleaned and the temperature of the cleaning liquid becomes large.

[0013] [9] [1] to [8], the cleaning method according to any one of the above, The cleaning liquid may include an ultrasonic vibration applying step of applying ultrasonic vibration to the cleaning liquid.

[0014]

[10] [1] to [9], the cleaning method according to any one of the above, In the cleaning step, in addition to the cleaning liquid, a mixed fluid of liquid and gas may be supplied to the object to be cleaned.

[0015]

[11] [1] to

[10] , the cleaning method according to any one of the above, In the cleaning step, the cleaning liquid may be supplied in a direction substantially perpendicular to the object to be cleaned.

[0016]

[12] [1] to

[11] , the cleaning method according to any one of the above, In the cleaning step, the cleaning liquid may be supplied in a direction substantially parallel to the object to be cleaned.

[0017]

[13] [1] to

[12] , the cleaning method according to any one of the above, In the cleaning step, the cleaning liquid may be supplied to a plurality of positions from near the center of the object to the outer periphery.

[0018]

[14] [1] to

[13] , the cleaning method according to any one of the above, In the cleaning step, the cleaning liquid may be supplied to an edge of the object to be cleaned.

[0019]

[15] [1] to

[14] , the cleaning method according to any one of the above, In the cleaning step, the cleaning liquid may be supplied in a fan shape to the object to be cleaned.

[0020]

[16] [1] to

[15] , the cleaning method comprising: In the cleaning step, a cleaning liquid in which the concentration of the coarse particles is a first concentration and a cleaning liquid in which the concentration of the coarse particles is a second concentration different from the first concentration may be supplied in sequence.

[0021]

[17] [1] to

[16] , the cleaning method according to any one of the above, In the cleaning step, a first cleaning liquid in which first coarse particles having a diameter of 10 μm or more are dispersed, and a second cleaning liquid in which second coarse particles different from the first coarse particles and having a diameter of 10 μm or more are dispersed may be supplied.

[0022]

[18] [1] to

[17] , the cleaning method according to any one of the above, The coarse particles may have a specific gravity of 1.15 or more.

[0023]

[19] [1] to

[18] , the cleaning method according to any one of the above, The coarse particles may have a diameter larger than that of the particles to be removed.

[0024]

[20] [1] to

[19] , the cleaning method comprising: The object to be cleaned may be a substrate.

[0025] According to another aspect of the present invention, [twenty one] A first cleaning step of performing roll scrub cleaning, pen scrub cleaning and / or two-fluid jet cleaning of the substrate; Thereafter, a cleaning liquid containing dispersed coarse particles having a diameter of 10 μm or more and facilitating the removal of particles to be removed adhering to the substrate is supplied to the rotating substrate to perform cleaning.

[0026] According to another aspect of the present invention, [twenty two] A first cleaning step of performing roll scrub cleaning, pen scrub cleaning and / or two-fluid jet cleaning of the substrate; Thereafter, a cleaning liquid containing dispersed coarse particles that are larger than the particles to be removed adhering to the substrate and that promote the removal of the particles to be removed is supplied to the rotating substrate to perform cleaning.

[0027] [twenty three]

[21] or

[22] , the method for cleaning a substrate comprising: a rinsing step of rinsing the substrate while rotating the substrate at a first rotation speed before and / or after the second cleaning step; In the second cleaning step, the cleaning liquid may be supplied to the substrate rotating at a second rotation speed that is faster than the first rotation speed.

[0028] According to another aspect of the present invention, [twenty four] A cleaning liquid for cleaning a substrate is provided, in which coarse particles having a diameter of 1 μm or more and which promote the removal of target particles adhering to the substrate are dispersed.

[0029] According to another aspect of the present invention, [twenty five] A cleaning liquid is provided in which coarse particles having a diameter of 1 μm or more and which promote the removal of particles to be removed adhering to a cleaning object are dispersed, and the cleaning liquid is used to supply the dispersed particles to a rotating cleaning object. Effect of the Invention

[0030] Particles to be removed that are attached to the object to be cleaned can be removed efficiently. [Brief description of the drawings]

[0031] [Figure 1] FIG. 2 is a diagram for explaining the mechanism of cleaning using a cleaning solution having a large particle dispersion. [Figure 2A]FIG. 1 is a diagram for explaining a first cleaning model. [Figure 2B] FIG. 13 is a diagram illustrating a second cleaning model. [Figure 2C] FIG. 13 is a diagram illustrating a third cleaning model. [Figure 2D1] FIG. 13 is a diagram illustrating a fourth cleaning model. [Figure 2D2] FIG. 13 is a diagram illustrating a fourth cleaning model. [Figure 3A] FIG. 13 is a diagram showing an experimental result showing the cleaning effect of a cleaning solution having a large particle dispersion. [Figure 3B] FIG. 13 is a diagram showing an experimental result showing the cleaning effect of a cleaning solution having a large particle dispersion. [Figure 4A] 1 is a flow chart illustrating an example of a substrate cleaning procedure. [Figure 4B] 4B is a flowchart showing a substrate cleaning procedure that is a variation of FIG. 4A. [Figure 4C] 4B is a flowchart showing a substrate cleaning procedure that is a variation of FIG. 4A. [Figure 4D] 4B is a flowchart showing a substrate cleaning procedure that is a variation of FIG. 4A. [Figure 5A] 11 is a flow chart illustrating another example of a substrate cleaning procedure. [Figure 5B] 5B is a flowchart showing a substrate cleaning procedure that is a variation of FIG. 5A. [Figure 5C] 5B is a flowchart showing a substrate cleaning procedure that is a variation of FIG. 5A. [Figure 5D] 5B is a flowchart showing a substrate cleaning procedure that is a variation of FIG. 5A. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0032] Hereinafter, an embodiment of the present invention will be specifically described with reference to the drawings.

[0033] When cleaning a substrate (such as a semiconductor substrate or a glass substrate), a cleaning solution that contains as few particles as possible is usually used, because if particles are contained in the cleaning solution, they may become a source of contamination for the substrate.

[0034] However, the inventors discovered that by supplying to the substrate a cleaning liquid in which coarse particles having a diameter of 1 μm or more are deliberately dispersed (hereinafter referred to as a "coarse particle-dispersed cleaning liquid"), the target particles adhering to the substrate can be efficiently removed.

[0035] Figure 1 is a diagram explaining the mechanism of cleaning using a coarse particle dispersion cleaning solution. It shows how a coarse particle dispersion cleaning solution is supplied while rotating a substrate with minute particles to be removed adhering to its surface. The rotation speed of the substrate is about 100 rpm, and the supply rate of the coarse particle dispersion cleaning solution is about 1 L / min. The speed of movement in the circumferential direction of the coarse particle dispersion cleaning solution supplied onto the substrate is slower the closer it is to the substrate, and faster the further away it is from the substrate. The liquid layer that moves particularly slowly, about 10 μm from the substrate, is called the viscous bottom layer.

[0036] The coarse particles dispersed in the coarse particle-dispersed cleaning solution are carried along by the faster moving liquid layer and approach the particles to be removed. This causes the particles to be removed to detach from the substrate surface (details will be described later). The movement of the coarse particles also agitates the cleaning solution near the substrate, causing the slow-moving viscous bottom layer and the faster-moving liquid layer to mix up and down (vertically). This causes the particles to be removed that have detached from the substrate to move to the faster-moving liquid layer and be discharged.

[0037] A cleaning model that can be considered as the principle by which large particles detach the particles to be removed from the substrate surface will be described.

[0038] 2A is a diagram illustrating a first cleaning model. As shown in the figure, when the particles to be removed and the coarse particles are charged with opposite polarities, the particles to be removed electrically adhere to the coarse particles, causing the particles to be removed to detach from the substrate surface.

[0039] 2B is a diagram illustrating the second cleaning model. As shown in the figure, the coarse particles collide with the particles to be removed with great force, and the particles to be removed physically adhere to the coarse particles, causing the particles to be removed to detach from the substrate surface.

[0040] 2C is a diagram illustrating the third cleaning model. As shown in the figure, large particles collide with the substrate surface with force, stirring the liquid layer near the substrate in the vertical direction, which causes the particles to be removed to be lifted up and detached from the substrate surface.

[0041] 2D1 and 2D2 are diagrams (front view and plan view, respectively) explaining the fourth cleaning model. As shown in FIG. 2D2, when a coarse particle collides with the substrate surface with force and passes through, the coarse particle pushes out the particles to be removed, and the particles to be removed are detached from the substrate surface.

[0042] FIG. 3A shows the results of an experiment showing the cleaning effect of a cleaning solution containing dispersed coarse particles. According to an experiment conducted by the inventors, the number of particles to be removed remaining on a substrate when the substrate is cleaned with a cleaning solution containing dispersed coarse particles having a diameter of about 1.5 μm is about 29.1% of the number of particles to be removed remaining on the substrate when the substrate is cleaned with a cleaning solution that does not contain coarse particles. Therefore, as long as the diameter of the coarse particles is at least 1 μm or more, there is a cleaning effect. Also, there is an effect even if the diameter of the coarse particles is 100 nm or more.

[0043] 3B shows another experimental result showing the cleaning effect of a cleaning solution containing dispersed coarse particles. According to an experiment conducted by the inventors, the number of particles to be removed remaining on a substrate when the substrate is cleaned with a cleaning solution containing dispersed coarse particles having a diameter of about 10 μm is about 22.8% of the number of particles to be removed remaining on the substrate when the substrate is cleaned with a cleaning solution that does not contain coarse particles. Therefore, the cleaning effect is achieved even when the diameter of the coarse particles is 10 μm or more.

[0044] The coarse particles may be any particles that can promote the removal of the particles to be removed. For example, particles of acrylic, silica, zirconia, alumina, polypropylene, etc. can be used as the coarse particles. In order to prevent the substrate surface from being scratched, the coarse particles may be resin, or particles of iron oxide, etc., coated with resin or silica. Furthermore, the coarse particles may be soluble polymers that dissolve in the cleaning solution by heat or chemicals so that the coarse particles do not remain on the substrate after cleaning.

[0045] The diameter of the coarse particles does not necessarily have to be 1 μm or more, as long as it is larger than the particles to be removed. There is no limitation on the shape of the coarse particles, and they may be, for example, spherical or cylindrical. The surface of the coarse particles may be porous, or may have minute irregularities. The specific gravity of the coarse particles is preferably 1.15 or more, and for example, acrylic particles with a specific gravity of about 1.2 are suitable. The larger the specific gravity of the coarse particles, the more they can approach the vicinity of the substrate without being discharged by the liquid flow, and the more effective they can be expected in the vicinity of the substrate.

[0046] Also, appropriate coarse particles may be used depending on the particles to be removed. For example, coarse particles charged with a polarity different from that of the particles to be removed may be used. As a more specific example, when the particles to be removed are negatively charged fine silica particles, positively charged alumina particles are suitable as the particles to be removed. This promotes electrical adhesion between the coarse particles and the particles to be removed (see FIG. 2A).

[0047] Furthermore, when the cleaning solution is acidic, an acid-resistant material is preferable, and when the cleaning solution is alkaline, an alkali-resistant material is preferable.

[0048] Below, we will list some methods to further improve cleaning power.

[0049] By reducing the thickness of the cleaning solution with dispersed coarse particles, the coarse particles can easily approach the substrate, and the particles to be removed can be easily removed. In order to reduce the thickness of the cleaning solution with dispersed coarse particles, it is preferable to rotate the substrate at a high speed.

[0050] By strengthening the mixing of the coarse particle dispersion cleaning solution in the vertical direction (the direction perpendicular to the substrate), the stirring effect is enhanced and the coarse particles and the particles to be removed are more likely to adhere to each other. As a method for achieving this, the coarse particle dispersion cleaning solution may be supplied at a temperature different from that of the substrate. That is, the temperature of the substrate and / or the coarse particle dispersion cleaning solution may be adjusted so that the difference between the temperature of the substrate and the temperature of the coarse particle dispersion cleaning solution becomes large. Either the temperature of the substrate or the temperature of the coarse particle dispersion cleaning solution may be higher. As another method, ultrasonic vibration may be applied to the coarse particle dispersion cleaning solution. As another method, a fluid (e.g., a mixed fluid of liquid and gas) may be supplied to the substrate together with the coarse particle dispersion cleaning solution.

[0051] The supply direction of the coarse particle-dispersed cleaning liquid may be substantially perpendicular to the substrate. In this way, the coarse particles collide strongly with the substrate, and the particles to be removed can be effectively detached from the substrate. Specifically, the substrate may be held in a horizontal direction, and the coarse particle-dispersed cleaning liquid may be supplied in a substantially vertical direction. Alternatively, the substrate may be held in a vertical direction, and the coarse particle-dispersed cleaning liquid may be supplied in a substantially horizontal direction.

[0052] The supply direction of the coarse particle dispersion cleaning liquid may be substantially parallel to the substrate. In this way, the flow of the coarse particle dispersion cleaning liquid in the vicinity of the substrate is promoted, and the particles to be removed can be effectively detached from the substrate. Specifically, the substrate may be held in a horizontal direction, and the coarse particle dispersion cleaning liquid may be supplied in a substantially horizontal direction. Alternatively, the substrate may be held in a vertical direction, and the coarse particle dispersion cleaning liquid may be supplied in a substantially vertical direction. In consideration of the dischargeability of the coarse particle dispersion cleaning liquid, it is preferable that the supply direction of the coarse particle dispersion cleaning liquid is a direction from the vicinity of the center of the substrate toward the outer periphery.

[0053] Depending on the particles to be removed, it may be more effective to supply the cleaning liquid with a coarse particle dispersion in a direction perpendicular to the substrate, or it may be more effective to supply the cleaning liquid with a coarse particle dispersion in a direction parallel to the substrate. Therefore, a suitable supply method may be adopted depending on the particles to be removed.

[0054] The position where the coarse particle dispersion cleaning liquid is supplied may be one position on the substrate, but preferably multiple positions. As an example, multiple single-tube nozzles, spray nozzles, or jet nozzles may be arranged in the radial direction from the vicinity of the center of the substrate to the outer periphery, and the coarse particle dispersion cleaning liquid may be supplied from each of the nozzles in a direction perpendicular to the substrate. This allows the coarse particle dispersion cleaning liquid to be efficiently supplied to the substrate surface. It is also preferable to supply the coarse particle dispersion cleaning liquid to the edge of the substrate.

[0055] The cleaning liquid having a dispersed coarse particle may be supplied in the form of a spray, or may be supplied in the form of a fan so as to spread from above to below the substrate.

[0056] Alternatively, the coarse particle dispersion cleaning liquids having different coarse particle concentrations may be supplied in sequence. For example, a coarse particle dispersion cleaning liquid having a high coarse particle concentration may be supplied first, and then a coarse particle dispersion cleaning liquid having a low coarse particle concentration may be supplied. Alternatively, a coarse particle dispersion cleaning liquid having a low coarse particle concentration may be supplied first, and then a coarse particle dispersion cleaning liquid having a high coarse particle concentration may be supplied.

[0057] In addition, multiple types of coarse particle-dispersed cleaning liquids in which different coarse particles are dispersed may be supplied in sequence or simultaneously. Since the functions and effects differ depending on the coarse particles, this allows the target particles to be removed effectively. For example, a cleaning liquid in which coarse particles suitable for removing the target particles by electrical adhesion are dispersed (see FIG. 2A) and a cleaning liquid in which coarse particles suitable for removing the target particles by physical adhesion are dispersed (see FIG. 2B) may be supplied in sequence or simultaneously.

[0058] Next, a substrate cleaning process will be exemplified. The above-described substrate cleaning method can be applied to cleaning a substrate having polishing debris or polishing liquid attached thereto as particles to be removed after polishing in a substrate polishing apparatus in a CMP (Chemical Mechanical Polishing) apparatus.

[0059] 4A is a flow chart showing an example of a substrate cleaning procedure, in which cleaning with a cleaning solution having coarse particles dispersed therein is performed after the final cleaning and before the drying process.

[0060] After polishing, the substrate is first subjected to a first roll scrub cleaning (step S1) and a second roll scrub cleaning (step S2) using a roll-type cleaning tool. Next, a pen scrub cleaning is performed using a pen-type cleaning tool (step S3). After that, a chemical rinse is performed in which a chemical solution is supplied while the substrate is rotated (step S4). Then, cleaning is performed using the above-mentioned coarse particle dispersion cleaning solution (step S5). Furthermore, a pure water rinse is performed in which pure water is supplied while the substrate is rotated (step S6).

[0061] However, various modifications are possible. For example, as shown in Fig. 4B, two-fluid jet cleaning (step S3') using a mixture of liquid and gas may be performed instead of the pen scrub cleaning. Alternatively, as shown in Fig. 4C and Fig. 4D, the second roll scrub cleaning (step S2) may be omitted.

[0062] In any case, in substrate cleaning, roll scrub cleaning, pen scrub cleaning and / or two-fluid jet cleaning is performed, and then cleaning using a cleaning liquid containing dispersed coarse particles is performed.

[0063] As described above, when cleaning with the cleaning solution containing dispersed coarse particles, it is better to rotate the substrate at a higher speed in order to reduce the thickness of the film. Specifically, it is better to rotate the substrate at a higher speed when cleaning with the cleaning solution containing dispersed coarse particles than when performing the chemical rinsing (step S4) or the pure water rinsing (step S6).

[0064] 5A is a flow chart showing another example of a substrate cleaning procedure, in which cleaning using a cleaning solution with dispersed coarse particles is performed after each scrub cleaning.

[0065] After polishing, the substrate is first subjected to a first roll scrub cleaning using a roll-type cleaning tool (step S11). Next, cleaning is performed using a cleaning solution containing dispersed coarse particles (step S12). After that, a pure water rinse is performed by supplying pure water while rotating the substrate (step S13).

[0066] Further, a second roll scrub cleaning is performed (step S14), followed by cleaning using a cleaning solution containing dispersed coarse particles (step S15).

[0067] Further, pen scrub cleaning is performed using a pen-shaped cleaning tool (step S16). Next, chemical rinsing is performed by supplying a chemical solution while rotating the substrate (step S17). After that, cleaning is performed using a cleaning solution containing dispersed coarse particles (step S18). Then, pure water rinsing is performed (step S19).

[0068] However, various modifications are possible. For example, as shown in Fig. 5B, two-fluid jet cleaning (step S16') may be performed instead of pen scrubbing. Alternatively, as shown in Fig. 5C and Fig. 5D, the second roll scrubbing (step S14) and the associated cleaning using a cleaning solution containing dispersed coarse particles (step S15) may be omitted.

[0069] The application of cleaning using the cleaning solution with dispersed coarse particles is not limited to substrates.

[0070] Based on the above description, a person skilled in the art may be able to conceive additional effects and various modifications of the present invention, but the aspects of the present invention are not limited to the individual embodiments described above. Various additions, modifications, and partial deletions are possible within the scope of the conceptual idea and intent of the present invention derived from the contents defined in the claims and their equivalents.

[0071] Furthermore, not all of the features described in this specification are essential requirements, and in particular, any feature described in this specification but not included in the claims may be considered as optional additional features.

[0072] It should be noted that the applicant is merely aware of the inventions disclosed in the documents in the "Prior Art Documents" column of this specification, and the present invention does not necessarily aim to solve the problems of the inventions disclosed in the documents. The problems that the present invention aims to solve should be identified by taking into consideration the entire specification. For example, if the specification states that a specific effect is achieved by a specific configuration, it can also be said that the problem that is the reverse of the specific effect is solved. However, it is not necessarily intended that such a specific configuration is an essential requirement.

Claims

1. A cleaning method including a cleaning step of supplying a cleaning liquid having dispersed therein coarse particles having a diameter of 1 μm or more and facilitating the removal of particles to be removed adhering to the object to be cleaned, to the object to be cleaned as it rotates.

2. A cleaning method including a cleaning step of supplying a cleaning liquid to a rotating object to be cleaned, the cleaning liquid containing dispersed coarse particles that are larger than particles to be removed and that promote the removal of the particles to be removed.

3. 3. The cleaning method according to claim 1, wherein the particles to be removed are detached from the object to be cleaned by electrically or physically attaching to the coarse particles.

4. 3. The cleaning method according to claim 1, wherein the particles to be removed are detached from the object to be cleaned by agitating the cleaning liquid in which the coarse particles are present in the vicinity of the object to be cleaned.

5. The cleaning method according to claim 1 , wherein the particles to be removed are detached from the object to be cleaned by the collision of the coarse particles with the object to be cleaned.

6. 3. The cleaning method according to claim 1, wherein the coarse particles are particles of acrylic, silica, zirconia, alumina or polypropylene.

7. 3. The cleaning method according to claim 1, wherein the coarse particles are particles charged with a polarity different from that of the target particles.

8. 3. The cleaning method according to claim 1, further comprising a temperature adjustment step of adjusting the temperature of the object to be cleaned and / or the cleaning liquid so that a difference between a temperature of the object to be cleaned and a temperature of the cleaning liquid becomes large.

9. The cleaning method according to claim 1 , further comprising an ultrasonic vibration applying step of applying ultrasonic vibration to the cleaning liquid.

10. 3. The cleaning method according to claim 1, wherein in the cleaning step, a mixed fluid of liquid and gas is supplied to the object to be cleaned in addition to the cleaning liquid.

11. 3. The cleaning method according to claim 1, wherein the cleaning liquid is supplied in a direction substantially perpendicular to the object to be cleaned in the cleaning step.

12. 3. The cleaning method according to claim 1, wherein in the cleaning step, the cleaning liquid is supplied in a direction substantially parallel to the object to be cleaned.

13. The cleaning method according to claim 1 , wherein the cleaning step comprises supplying the cleaning liquid to a plurality of positions from a center of the object to an outer periphery of the object.

14. The cleaning method according to claim 1 , wherein the cleaning step comprises supplying the cleaning liquid to an edge of the object to be cleaned.

15. The cleaning method according to claim 1 , wherein in the cleaning step, the cleaning liquid is supplied to the object to be cleaned in a fan-shaped manner.

16. 3. The cleaning method according to claim 1, wherein in the cleaning step, a cleaning solution having a first concentration of the coarse particles and a cleaning solution having a second concentration of the coarse particles different from the first concentration are supplied in sequence.

17. 3. The cleaning method according to claim 1, wherein the cleaning step comprises supplying a first cleaning solution in which first coarse particles having a diameter of 1 μm or more are dispersed, and a second cleaning solution in which second coarse particles different from the first coarse particles and having a diameter of 1 μm or more are dispersed.

18. 3. The cleaning method according to claim 1, wherein the specific gravity of the coarse particles is 1.15 or more.

19. The cleaning method according to claim 1 , wherein the coarse particles have a diameter larger than the particles to be removed.

20. The cleaning method according to claim 1 , wherein the object to be cleaned is a substrate.

21. a first cleaning step of performing roll scrub cleaning, pen scrub cleaning and / or two-fluid jet cleaning of the substrate; Thereafter, a cleaning liquid containing dispersed coarse particles having a diameter of 1 μm or more and facilitating the removal of particles to be removed adhering to the substrate is supplied to the rotating substrate to perform cleaning.

22. a first cleaning step of performing roll scrub cleaning, pen scrub cleaning and / or two-fluid jet cleaning of the substrate; The substrate cleaning method includes a second cleaning step of supplying, to the rotating substrate, a cleaning liquid having dispersed therein coarse particles that are larger than the particles to be removed attached to the substrate and that promote the removal of the particles to be removed.

23. a rinsing step of performing rinsing while rotating the substrate at a first rotation speed before and / or after the second cleaning step, 23. The substrate cleaning method according to claim 21, wherein in the second cleaning step, the cleaning liquid is supplied to the substrate rotating at a second rotation speed that is faster than the first rotation speed.

24. A cleaning solution for cleaning a substrate, in which coarse particles having a diameter of 1 μm or more are dispersed, which facilitates the removal of target particles adhering to the substrate.

25. A cleaning liquid in which coarse particles having a diameter of 1 μm or more that promote the removal of particles to be removed that have adhered to the object to be cleaned are dispersed, and which is used to supply the liquid to a rotating object to be cleaned.

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