Component mounting device and component mounting method

Abstract

To automatically set an optimum mounting speed of a component.SOLUTION: A component mounting device includes: a head for adsorbing a component with a nozzle to rotate the nozzle around an axis at a rotation speed and attaching the component to a substrate; a mechanism control unit for rotating the nozzle at a plurality of speeds in a state where the component is adsorbed by the nozzle, and determining whether or not the component is positioned in a control position at a predetermined angle to the substrate; and a rotation speed setting unit for setting the highest speed when the mechanism control unit determines that the component is positioned among the plurality of speeds, to a rotation speed.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present disclosure relates to a component mounting apparatus and a component mounting method. [Background technology]

[0002] Patent Document 1 discloses a component transfer device in which multiple suction heads each having a suction nozzle are rotatably supported and equipped with a drive device that rotates a pinion provided on each suction head using a rack. The component transfer device is characterized in that the multiple suction heads are divided into multiple groups, and each group is provided with a drive device that rotates the suction head at a different rotation speed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2005-327773 A Summary of the Invention [Problem to be solved by the invention]

[0004] Patent Document 1 discloses that the suction head is rotated at different rotation speeds depending on the component to be mounted. However, if the rotation speed is too fast for the shape and weight of the component, the suction head may not be stopped at the correct position, and the component may not be placed on the board at the correct angle.

[0005] The present disclosure has been devised in consideration of the above-mentioned conventional situation, and has an object to automatically set an optimal mounting speed for components. [Means for solving the problem]

[0006] The present disclosure provides a component mounting device comprising: a head that picks up a component with a nozzle and rotates the nozzle at a rotational speed around an axis to mount the component on a board; a mechanism control unit that rotates the nozzle at multiple speeds while the nozzle has picked up the component and determines whether the component is positioned to be a control position at a predetermined angle relative to the board; and a rotational speed setting unit that sets the rotational speed to the highest speed among the multiple speeds at which the mechanism control unit determines that the component has been positioned.

[0007] The present disclosure also provides a component mounting method that includes picking up a component with a nozzle, rotating the nozzle around an axis at a rotational speed to mount the component on a board, rotating the nozzle at a plurality of speeds while the nozzle has picked up the component, determining whether the component is positioned to be a control position at a predetermined angle with respect to the board, and setting the highest speed among the plurality of speeds at which it is determined that the component is positioned as described above as the rotational speed.

[0008] These comprehensive or specific aspects may be realized as a system, an apparatus, a method, an integrated circuit, a computer program, or a recording medium, or may be realized as any combination of a system, an apparatus, a method, an integrated circuit, a computer program, and a recording medium. Effect of the Invention

[0009] According to the present disclosure, the optimal component mounting speed can be automatically set. [Brief description of the drawings]

[0010] [Figure 1] FIG. 2 is a top view illustrating a mechanical configuration of the component mounting apparatus according to the embodiment; [Diagram 2] FIG. 2 is a side view illustrating a mechanical configuration of the component mounting apparatus shown in FIG. [Diagram 3] FIG. 3 is a perspective view illustrating the operation of the moving head shown in FIG. [Figure 4] FIG. 1 is a block diagram illustrating a functional configuration of a control unit of a component mounting apparatus; [Diagram 5] A diagram showing an example of part data [Figure 6] A flowchart showing an example of a process for setting a rotation speed DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, with reference to the drawings as appropriate, an embodiment specifically disclosing a component mounting apparatus and a component mounting method according to the present disclosure will be described in detail. However, more detailed explanation than necessary may be omitted. For example, detailed explanation of already well-known matters and duplicate explanation of substantially the same configuration may be omitted. This is to avoid the following explanation becoming unnecessarily redundant and to facilitate understanding by those skilled in the art. Note that the attached drawings and the following explanation are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims.

[0012] For example, the term "unit" or "device" in the embodiments is not limited to a physical configuration that is mechanically realized by hardware, but also includes a configuration whose functions are realized by software such as a program. Also, the functions of one configuration may be realized by two or more physical configurations, or the functions of two or more configurations may be realized by, for example, one physical configuration.

[0013] <Mechanical configuration of component mounting equipment> First, the mechanical configuration of the component mounting apparatus 1 will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a top view illustrating the mechanical configuration of the component mounting apparatus 1 according to the present embodiment. Fig. 2 is a side view illustrating the mechanical configuration of the component mounting apparatus 1 shown in Fig. 1. In Figs. 1 and 2, the front side of the component mounting apparatus 1 (the lower side on the paper surface of Fig. 1, the left side on the paper surface of Fig. 2) is also referred to as the front side, and the back side of the component mounting apparatus 1 (the upper side on the paper surface of Fig. 1, the right side on the paper surface of Fig. 2) is also referred to as the rear side.

[0014] One or more component mounting devices 1 are arranged in a mounting board manufacturing line for attaching various components P to a board W to manufacture the board, and mount the components P in a predetermined position and attitude on the board W transported from upstream of the mounting board manufacturing line.

[0015] 1 and 2, the component mounting apparatus 1 is mainly configured to include a main body mechanism section 10 (an example of a component mounting section) that mounts components P (e.g., electronic components such as integrated circuits, transistors, and capacitors, or BGA components) on a board W by the operation of each section mechanism, and a control section 40 that controls the operation of the main body mechanism section 10. The main body mechanism section 10 has a mounting machine main body 11 that is configured with a base 12 and the like, and a head unit 23 (an example of a component mounting section) that is configured to be movable relative to the mounting machine main body 11. The control section 40 is housed inside the base 12 of the component mounting apparatus 1, and controls various mechanisms such as the mounting machine main body 11 and the head unit 23.

[0016] 1 (the conveying direction of the board W). The board conveying mechanism 13 has a pair of conveyor units 14 extending along the X direction, and conveys the board W placed on the pair of conveyor units 14, and positions and holds the board W at a predetermined mounting position.

[0017] A pair of component supply mechanisms 15 are disposed facing each other on both the front and rear sides of the board transport mechanism 13 (top and bottom sides in the plane of FIG. 1, left and right sides in the plane of FIG. 2). Each of the pair of component supply mechanisms 15 has a feeder base 16 in which a slot 17 is provided, and a plurality of tape feeders 18 are attached in parallel to the slot 17 as part feeders.

[0018] The component mounting apparatus 1 further includes a feeder cart 19. The feeder cart 19 includes a carriage unit 20 having a plurality of wheels disposed on its lower side, and a plurality of reel stock units (not shown) disposed on the upper side of the carriage unit 20. A reel 21 is housed in each of the plurality of reel stock units. A carrier tape 22 containing a component P is pulled out from each of the reels 21, and the component P is supplied to a tape feeder 18 of the component supply mechanism 15. As a result, the tape feeder 18 of the component supply mechanism 15 pitch-feeds the carrier tape 22 in the tape feed direction, thereby supplying the component P to a pick-up position where pick-up of the component P is performed by a moving head 26 of a head unit 23 described below.

[0019] Head unit 23 is disposed above base 12, and configured to be movable between a mounting position and a removal position where component supply mechanism 15 and substrate W are disposed. Specifically, head unit 23 is capable of linear movement along the X and Y directions by X-axis table mechanism 25 and Y-axis table mechanism 24 that are disposed orthogonal to each other on a plane substantially parallel to the surface of substrate W.

[0020] A Y-axis table mechanism 24 is disposed on the upper surface of the base 12 along the Y direction. A pair of front and rear X-axis table mechanisms 25 are disposed along the X direction, and are attached to the Y-axis table mechanism 24 so as to be slidable along the Y direction. A moving head 26 is attached to the tip of each of the pair of front and rear X-axis table mechanisms 25 so as to be slidable along the X direction. That is, in the first embodiment, the moving head 26 is mounted on the head unit 23, and the moving head 26 is provided so as to be movable independently of each other by the X-axis table mechanism 25 and the Y-axis table mechanism 24. As a result, the moving head 26 is arbitrarily positioned on a plane approximately parallel to the surface of the substrate W, that is, on a horizontal plane (XY plane). Both the X-axis table mechanism 25 and the Y-axis table mechanism 24 are configured by linear guide drive mechanisms.

[0021] A component recognition camera 28 (an example of an imaging unit) is disposed between the pair of front and rear component supply mechanisms 15 and the board transport mechanism 13. The component holding nozzle 27, which is attached to the moving head 26 while taking out and holding the component P from the component supply mechanism 15, moves and passes above the component recognition camera 28. At this time, the component recognition camera 28 images the component P sucked and held by the component holding nozzle 27 passing by, multiple times at a predetermined timing and with a predetermined illumination pattern. In other words, the component recognition camera 28 images the component P held by the component holding nozzle 27, and while the illumination pattern is changed multiple times by the control unit 40 while the component P is moving above it, the component recognition camera 28 continuously images the component P at a timing corresponding to each illumination pattern. Each of these imaging results is integrated and subjected to recognition processing, thereby enabling identification and position detection of the component P to be performed with high accuracy.

[0022] Furthermore, a nozzle holder 38 and a waste box 37 are disposed between the pair of front and rear component supply mechanisms 15 and the board transport mechanism 13. The nozzle holder 38 stores a plurality of types of component holding nozzles 27 of the moving head 26 corresponding to the components P to be held. The component holding nozzle 27 suitable for the object to be held is attached to the moving head 26 by having the moving head 26 access the nozzle holder 38 and performing a predetermined nozzle replacement operation. The waste box 37 is formed in a box shape and has an internal space, in which components P determined to be defective as a result of image capture by the component recognition camera 28 are discarded.

[0023] <About the configuration and operation of the moving head> Next, the configuration and operation of the moving head 26 will be described with reference to Fig. 3. Fig. 3 is a perspective view illustrating the operation of the moving head 26 shown in Fig. 2.

[0024] 3, the moving head 26 is a multiple head (not shown) having a plurality of moving heads 26, and a plurality of component holding nozzles 27 are arranged side by side at the lower end of each moving head 26. In addition, a reflector (not shown) for reflecting illumination light emitted from a transmitted illumination unit (not shown) is fixed to the moving head 26. The reflector is disposed above the held component P.

[0025] Each of the component holding nozzles 27 vacuum-adsorbs and holds a component P from the tape feeder 18 of the component supply mechanism 15, for example, by using air pressure, and moves up and down individually. The moving head 26 further includes a Z-axis lifting mechanism (not shown) for individually lifting and lowering each of the component holding nozzles 27, and a θ-motor 51 (see FIG. 4) which is a θ-axis rotation mechanism for individually rotating each of the component holding nozzles 27 around the nozzle axis. The θ-axis is a rotation axis set in the longitudinal direction of the moving head 26. The moving head 26 is positioned arbitrarily in the horizontal plane (XY plane) by driving the Y-axis table mechanism 24 and the X-axis table mechanism 25. By this movement, the moving head 26 adsorbs and picks up the component P by the component holding nozzle 27 from the pick-up position of the tape feeder 18 of the component supply mechanism 15.

[0026] A board recognition camera 36 (see FIG. 1) is fixed to the moving head 26. The board recognition camera 36 is disposed on the underside of the X-axis table mechanism 25 and moves integrally with the moving head 26. As the moving head 26 moves, the board recognition camera 36 passes above the board W positioned by the board transport mechanism 13 and captures an image of the board W. The image capture result (image capture information) is similarly subjected to recognition processing to detect the position and posture of the board W.

[0027] As a result of detecting the position of the board W, the moving head 26 places the components P at their respective mounting points (e.g., the mounting positions and mounting orientations on the board W where the components P are to be placed) using their component holding nozzles 27 in accordance with instructions from the control unit 40. This mounting of the components P at one time is continued until all of the components P sucked and held by each of the component holding nozzles 27 of the moving head 26 are placed on the board W. In this manner, the components P are held and moved by the component holding nozzles 27 of the moving head 26 between the removal position and the mounting operation position, and are finally placed on the board W.

[0028] The component mounting apparatus 1 repeatedly executes a series of operations of removing and mounting a plurality of components P by the component holding nozzle 27 of the moving head 26, and then moving the moving head 26 back to the removal position, until mounting is completed at all of the mounting points on the board W. By repeating this operation, a large number of components P are sequentially mounted on each of the boards W that are transported in sequence, and after mounting, the boards W on which all of the components P have been mounted are transported to a downstream process. In this manner, the mounting machine main body 11 and the head unit 23 operate in cooperation with each other, and this cooperative operation is executed in accordance with instructions from the control unit 40.

[0029] A θ motor 51 (see FIG. 4) is attached to moving head 26, and moving head 26 can rotate component holding nozzle 27 in the θ axis direction by means of θ motor 51. Moving head 26 determines the angle of component P with respect to board W by rotating component holding nozzle 27 based on a control signal from mechanism control unit 46 (see FIG. 4). Mechanism control unit 46 can change the rotation speed of component holding nozzle 27 by changing the output of θ motor 51. Mechanism control unit 46 controls component holding nozzle 27 to rotate at a high speed, thereby shortening the time required to determine the position of component P in the θ axis direction, thereby shortening the time required to place component P on board W, and improving productivity.

[0030] However, if the rotation speed is too fast for the weight, size, and shape of the component P (for example, the component P is heavy and the rotation speed is fast), the component P rotated by the component holding nozzle 27 may deviate from the correct position (i.e., the correct angle). Here, the correct position refers to the orientation of each component that is predetermined for mounting on the board W. Hereinafter, the correct position will be referred to as the control position.

[0031] For example, if the rotation speed is high relative to the weight, size, and shape of the component P, inertial force acts in the rotation direction of the component holding nozzle 27, and the component holding nozzle 27 is unable to stop the component P at the control position, and the component holding nozzle 27 stops at a position where the component P has rotated further from the control position. Since the stop position of the component holding nozzle 27 is shifted, the mechanism control unit 46 rotates the component holding nozzle 27 in the opposite direction to the previous rotation direction so that the component P is at the control position. However, since inertial force acts in the rotation direction, the component holding nozzle 27 stops at a position where the component P has rotated further from the control position. Since the mechanism control unit 46 rotates the component holding nozzle 27 while alternating the rotation direction until the component holding nozzle 27 reaches the control position, there is a problem that the component holding nozzle 27 oscillates in the rotation direction or it takes a long time for the moving head 26 to stop.

[0032] Thus, if the rotation speed of the component holding nozzle 27 is too fast for the weight of the component P, it takes time for the component P to reach the control position, resulting in reduced productivity. The optimal rotation speed of the component holding nozzle 27 for the weight of the component P can only be adjusted manually by a user such as an operator, which has problems such as time-consuming adjustment work, adjustment accuracy differing depending on the user's level of skill, and complicated adjustment work. In addition, when the rotation speed is adjusted manually by a user, a rotation speed slower than the fastest rotation speed that can be set for the weight of the component P may be specified, which may result in reduced production efficiency. In view of these problems, a technology is desired that automatically sets the optimal rotation speed according to the type of component P.

[0033] Next, software calibration (functional configuration) of the control unit of the component mounting apparatus 1 will be described with reference to Fig. 4. Fig. 4 is a block diagram illustrating an example of the functional configuration of the control unit of the component mounting apparatus 1.

[0034] The control unit 40 of the component mounting apparatus 1 may be configured by a general-purpose computer including a storage device represented by a Read Only Memory and a Random Access Memory, and an arithmetic device represented by a Central Processing Unit. The arithmetic device realizes the software configuration (functional configuration) shown in FIG. 4 by reading and executing a computer program stored in the storage device. That is, each block shown in the control unit 40 in FIG. 4 represents a function realized by software. However, at least a part of the functions expressed as blocks is not limited to software, and may be realized by the physical configuration (hardware) of the "apparatus".

[0035] The control unit 40 includes a storage unit 41 , a mechanism control unit 46 , a rotation speed setting unit 47 , and an image capture processing unit 49 .

[0036] The storage unit 41 holds at least mounting data 42 and component data 43. The mounting data 42 stores information such as the type of component P to be mounted on each board W, the mounting attitude (e.g., direction or angle), the mounting sequence of the components P, and the mounting timing of the components P. The component data 43 stores information such as the component ID, type, size, horizontal movement speed in the XY plane, and rotation speed in the XY plane. The component data 43 stores, for example, component data 100 (see FIG. 5).

[0037] The mechanism control unit 46 controls the driving of the tape feeder 18, the board transport mechanism 13, and the component mounting mechanism 50. For example, the mechanism control unit 46 controls the driving of the tape feeder 18, the board transport mechanism 13, and the component mounting mechanism 50, and causes the tape feeder 18, the board transport mechanism 13, and the component mounting mechanism 50 to operate in a coordinated manner. The mechanism control unit 46 obtains information on the amount of rotation, the rotation angle, and the rotation direction of the θ motor 51 from the encoder 52. The mechanism control unit 46 controls the component mounting mechanism 50 so that the component holding nozzle 27 rotates at the rotation speed of the component data stored in the component data 43.

[0038] The component mounting mechanism 50 is a mechanism for mounting a component P at a mounting point on the board W, and includes the moving head 26, a θ motor 51, and an encoder 52. The θ motor 51 rotates the component holding nozzle 27 in the XY plane, and changes the angle in the XY plane of the component P picked up by the moving head 26. The encoder 52 is connected to the θ motor 51, and detects information such as the amount of rotation, the rotation angle, and the rotation direction of the θ motor 51.

[0039] The rotation speed setting unit 47 sets a rotation speed appropriate for the type of part. A detailed method for setting the rotation speed performed by the rotation speed setting unit 47 will be described later.

[0040] The imaging processing unit 49 includes a camera control unit 54. The component recognition camera 28 and the board recognition camera 36 are controlled by the imaging processing unit 49.

[0041] Next, an example of part data will be described with reference to Fig. 5. Fig. 5 is a diagram showing an example of part data. Part data is data related to parts stored in part data 43.

[0042] The part data 100 is data in which a part ID, which is identification information of a part, is linked to the type of part, the size of the part, the horizontal movement speed in the XY plane, and the rotation speed in the XY plane. The part type is written with the name of the part, etc. The part size is written with information on the length, width, and height of the part, for example. The horizontal movement speed is written with a speed that can be arbitrarily set by an operator, etc. The rotation speed is written with the rotation speed around the θ axis set by the rotation speed setting unit 47.

[0043] Next, an example of the process of setting the rotation speed will be described with reference to Fig. 6. Fig. 6 is a flow chart showing an example of the process of setting the rotation speed.

[0044] The mechanism control unit 46 controls the moving head 26 to pick up the component to be mounted on the board W (step St101).

[0045] The rotation speed setting unit 47 sets the rotation speed to the minimum speed (step St102). The rotation speed setting unit 47 outputs the value of the rotation speed set in the process of step St102 to the mechanism control unit .

[0046] The mechanism control unit 46 outputs the value of the rotation speed set by the rotation speed setting unit 47 to the θ motor 51, and operates the θ motor 51 to rotate the component holding nozzle 27 (step St103).

[0047] The mechanism control unit 46 judges whether the positioning of the component picked up by the moving head 26 in the θ-axis direction has been completed (step St104). The mechanism control unit 46 judges whether the positioning of the component picked up in the θ-axis direction has been completed based on, for example, information on the rotation amount, rotation angle, and rotation direction of the θ motor 51 acquired from the encoder 52. When the mechanism control unit 46 judges from the information acquired from the encoder 52 that the θ motor 51 continues to rotate while switching the rotation direction (i.e., oscillating) or that the component has stopped at a position shifted from the determined angle, the mechanism control unit 46 judges that the positioning has not been completed. The mechanism control unit 46 may also rotate the component holding nozzle 27 and judge whether the positioning has been completed after a predetermined time has elapsed. The fact that the positioning has not been completed indicates that the rotation speed is too fast and not appropriate for the picked up target component. On the other hand, when the positioning has been completed, it indicates that the rotation speed is appropriate or slow and not appropriate for the picked up target component. In other words, the rotation speed is gradually increased, and the rotation speed set just before the rotation speed at which positioning cannot be completed is determined to be the optimum rotation speed for each component.

[0048] When the mechanism control unit 46 determines that the positioning is completed (step St104, YES), it outputs a signal indicating that the positioning is completed to the rotation speed setting unit 47. The rotation speed setting unit 47 determines whether or not the set rotation speed is the maximum speed (step St105).

[0049] If the set rotation speed is not the maximum speed, that is, if the rotation speed can be made faster (step St105, NO), the rotation speed setting unit 47 increases the rotation speed of the component holding nozzle 27 by one step (step St106). Here, the rotation speed is set to any one of a plurality of speeds, and is set in advance by a user or the like so as to increase from the minimum speed in increments of a predetermined value. In other words, when the rotation speed increases by one step from the first speed, the rotation speed is set to a second speed that is a predetermined value higher than the first speed. The above-mentioned predetermined value can be set arbitrarily by the user. In addition, the rotation speed does not necessarily need to be increased by a constant speed, and the manner of increasing the rotation speed may be arbitrarily set by the user. The rotation speed setting unit 47 outputs the rotation speed set in the process of step St106 to the mechanism control unit 46. The mechanism control unit 46 executes the process of step St103 again using the rotation speed received from the rotation speed setting unit 47.

[0050] If the set rotation speed is the maximum speed, that is, if the rotation speed cannot be made any faster (step St105, YES), the rotation speed setting unit 47 reflects the set rotation speed in the part data (step St107). The rotation speed setting unit 47 writes and saves the last set rotation speed in the rotation speed of the part data (for example, the part data 100 shown in FIG. 5) stored in the part data 43.

[0051] After the process of step St107, the control unit 40 discards the parts used for setting the rotation speed (step St112). Note that the process of step St112 may be omitted.

[0052] When the mechanism control unit 46 determines that the positioning is not complete (step St104, NO), it restarts the θ motor 51 and stops the operation of the θ motor 51 (step St108). Examples of a method for stopping the operation of the θ motor 51 include turning off the power to the θ motor 51 or pressing a brake or a friction machine against the θ motor 51 to mechanically stop it.

[0053] The rotation speed setting unit 47 determines whether or not the set rotation speed is the minimum speed (step St109).

[0054] When the rotation speed setting unit 47 determines that the set speed is the minimum speed (step St109, YES), it notifies an error that control is not possible (step St110). If positioning cannot be performed correctly even at the minimum speed, that means that the component is too heavy and cannot be mounted by the current component mounting device 1. Here, as a method of notifying the error, the rotation speed setting unit 47 notifies a display device (not shown) provided in the component mounting device 1 or a terminal device such as a smartphone owned by the worker that the rotation speed of the target component could not be set.

[0055] After the process of step St110, the control unit 40 proceeds to the process of step St112.

[0056] When it is determined that the set speed is not the minimum speed (step St109, NO), the rotation speed setting unit 47 reflects a speed one step lower than the currently set speed in the component data (step St111).

[0057] After the process of step St111, the control unit 40 proceeds to the process of step St112.

[0058] As a result, the component mounting apparatus 1 can gradually increase the rotation speed from the lowest speed that can be set, and set the highest rotation speed among the rotation speeds at which positioning is completed. This allows the component mounting apparatus 1 to determine the optimal rotation speed for each component. In this way, the component mounting apparatus 1 can automatically determine the optimal rotation speed, which eliminates the need for the user to manually set the rotation speed of the components, thereby improving the user's work efficiency. It is also possible to prevent the user from erroneously setting a speed slower than the optimal rotation speed.

[0059] Furthermore, the component mounting apparatus 1 can store the determined rotation speed in association with the component ID of the component data. This allows the component mounting apparatus 1 to mount the component P on the board W at an optimal rotation speed by referring to the component data, thereby improving productivity. Furthermore, the component mounting apparatus 1 can mount the component P on the board W using the rotation speed stored in the component data, thereby preventing the component holding nozzle 27 from moving multiple times until the component holding nozzle 27 oscillates or the component P reaches the control position, which would otherwise take time, thereby improving productivity.

[0060] Summary of the Disclosure The above description of the embodiments discloses the following techniques.

[0061] <Technology 1> The component mounting device of this embodiment includes a head that picks up a component with a nozzle and rotates the nozzle at a rotational speed around an axis to mount the component on a board, a mechanism control unit that rotates the nozzle at multiple speeds while the nozzle has picked up the component and determines whether the component is positioned to be a control position at a predetermined angle relative to the board, and a rotational speed setting unit that sets the rotational speed to the highest speed among the multiple speeds at which the mechanism control unit determines that the component is positioned.

[0062] As a result, the component mounting device according to this embodiment can set the highest speed among a plurality of speeds at which positioning is performed as the rotation speed, and can automatically set the optimal mounting speed for components. By setting the highest speed among the speeds at which positioning is performed as the rotation speed, the component mounting device can mount components on the board at the optimal speed, thereby improving productivity.

[0063] <Technology 2> In the component mounting device described in Technique 1, the mechanism control unit rotates the nozzle at a first speed among the multiple speeds, and when it is determined that the component is positioned, rotates the nozzle at a second speed among the multiple speeds that is faster than the first speed.

[0064] As a result, the component mounting device according to this embodiment can determine the optimal rotation speed by increasing the speed and repeatedly determining whether positioning is being performed.

[0065] <Technology 3> In the component mounting device according to the first or second technique, the second speed is the second fastest speed among the multiple speeds.

[0066] As a result, the component mounting device of this embodiment can prevent the rotational speed from being erroneously set to a speed slower than the optimum speed by gradually increasing the rotational speed from a low speed.

[0067] <Technology 4> In the component mounting device described in any one of Techniques 1 to 3, the mechanism control unit rotates the nozzle at a first speed among a plurality of speeds, and if it is determined that the component is positioned, determines whether the first speed is the highest speed of the plurality of speeds, and if it is determined that the first speed is not the highest speed of the plurality of speeds, rotates the nozzle at a second speed, and if it is determined that the first speed is the highest speed of the plurality of speeds, the rotation speed setting unit sets the first speed as the rotation speed.

[0068] As a result, the component mounting device according to this embodiment can set the fastest speed among a plurality of speeds at which positioning can be performed as the rotation speed.

[0069] <Technology 5> In the component mounting device described in any one of Techniques 1 to 4, when the mechanism control unit rotates the nozzle at the lowest speed among a plurality of speeds and determines that the component is not positioned, the rotation speed setting unit notifies the user that the component cannot be mounted.

[0070] As a result, the component mounting device of this embodiment can improve user convenience by notifying the user that components that cannot be positioned even at the lowest settable speed cannot be mounted using the current component mounting device.

[0071] <Technology 6> In the component mounting device described in any one of Techniques 1 to 5, the mechanism control unit determines whether or not the nozzle is positioned based on an output signal from an encoder attached to a motor that drives the nozzle in a rotational direction.

[0072] As a result, the component mounting device according to this embodiment can determine whether the nozzle is oscillating by referring to the output signal from the encoder, and can make decisions regarding positioning.

[0073] <Technology 7> In the component mounting device according to any one of Techniques 1 to 6, the rotation speed setting unit associates the set rotation speed with identification information of the component and stores the same in the storage device.

[0074] As a result, the component mounting device according to this embodiment can generate data linking the set rotation speed to the identification information of the component.

[0075] Although the embodiments have been described above with reference to the accompanying drawings, the present disclosure is not limited to such examples. It is clear that a person skilled in the art can conceive of various modifications, corrections, substitutions, additions, deletions, and equivalents within the scope of the claims, and it is understood that these also belong to the technical scope of the present disclosure. In addition, the components in the above-mentioned embodiments may be arbitrarily combined within the scope of the invention. [Industrial Applicability]

[0076] The technology disclosed herein is useful as a component mounting apparatus and a component mounting method that automatically sets an optimal component mounting speed. [Explanation of symbols]

[0077] 1. Component mounting equipment 10 Main body mechanism section 11 Mounting machine body 12 Foundation 13 Substrate transport mechanism 14 Conveyor section 15 Parts supply mechanism 16 Feeder Base 17 Slots 18 Tape Feeder 19 Feeder Cart 20 Bogie section 21 Reel 22 Carrier Tape 23 Head Unit 24 Y-axis table mechanism 25 X-axis table mechanism 26 Moving Head 27 Part holding nozzle 28 Parts Recognition Camera 36 Circuit Board Recognition Camera 37 Disposal Box 38 Nozzle holder 40 Control section 41 Storage section 42 Implementation Data 43 Parts Data 46 Mechanical control unit 47 Rotation speed setting section 50 Component mounting mechanism 51 θ motor 52 Encoder 54 Camera control unit P parts W substrate

Claims

1. a head that picks up a component with a nozzle and rotates the nozzle about an axis at a rotational speed to place the component on a board; a mechanism control unit that rotates the nozzle at a plurality of speeds while the nozzle is picking up a component and determines whether the component is positioned at a control position at a predetermined angle with respect to the board; a rotation speed setting unit that sets the highest speed at which the mechanism control unit determines that the part is positioned as the rotation speed among the plurality of speeds, Component mounting equipment.

2. the mechanism control unit rotates the nozzle at a first speed among the plurality of speeds, and when it is determined that the part is positioned, rotates the nozzle at a second speed among the plurality of speeds that is faster than the first speed; The component mounting device according to claim 1 .

3. The second speed is a speed next to the first speed among the plurality of speeds. The component mounting apparatus according to claim 2 .

4. The mechanism control unit includes: rotating the nozzle at the first speed of the plurality of speeds, and if it is determined that the component has been positioned, determining whether the first speed is a maximum speed of the plurality of speeds; When it is determined that the first speed is not the highest speed of the plurality of speeds, rotating at the second speed; When it is determined that the first speed is the highest speed of the plurality of speeds, the rotation speed setting unit sets the first speed as the rotation speed. The component mounting apparatus according to claim 2 .

5. the rotation speed setting unit, when the mechanism control unit rotates the nozzle at the lowest speed among the plurality of speeds and determines that the component is not positioned, notifies the user that the component is an unmountable component. The component mounting device according to claim 1 .

6. the mechanism control unit determines whether the nozzle is positioned based on an output signal from an encoder attached to a motor that drives the nozzle in a rotational direction; The component mounting device according to claim 1 .

7. The rotation speed setting unit stores the set rotation speed in a storage device in association with identification information of the component. The component mounting device according to claim 1 .

8. The part is picked up by the nozzle, Rotating the nozzle about an axis at a rotational speed to place the component on the substrate; rotating the nozzle at a plurality of speeds while the nozzle is holding the component, and determining whether the component is positioned at a control position at a predetermined angle with respect to the board; a maximum speed at which it is determined that the part is positioned among the plurality of speeds is set as the rotation speed; Component mounting method.

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