Antenna substrate and method of manufacturing the same

Abstract

To provide an antenna substrate capable of adjusting directivity of an emitted beam, and a method of manufacturing the same.SOLUTION: An antenna substrate according to the present invention comprises: an antenna which includes an antenna pattern transmitting or receiving an RF signal; and a directivity adjustment pattern which has a present area, which is composed of a plurality of metal layers arranged separately from one another, which is positioned on one surface of the antenna where the RF signal emitted from the antenna pattern travels, and in which at least one of the plurality of metal layers is provided in such a manner as to be higher than the other metal layers.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an antenna substrate and a manufacturing method thereof, and more particularly to an antenna substrate capable of adjusting the directivity of an emitted beam and a manufacturing method thereof. [Background technology]

[0002] In recent years, millimeter wave (mmWave) communications, including fifth generation (5G) communications, have been actively researched, and research into commercializing antenna modules that will smoothly realize this is also being actively carried out. Traditionally, antenna modules providing a millimeter wave communication environment have used a structure in which the IC and antenna are placed on the module and connected by a coaxial cable in order to meet the high level of antenna performance required by high frequencies.

[0003] However, such a structure may cause a lack of space for arranging the antenna, a restriction on the freedom of the antenna configuration, an increase in interference between the antenna and IC, and an increase in the size and cost of the antenna module. Summary of the Invention [Problem to be solved by the invention]

[0004] The present invention has been made in consideration of the problems with the conventional antenna modules described above, and an object of the present invention is to provide an antenna substrate capable of adjusting the directivity of the radiated beam and a manufacturing method thereof. [Means for solving the problem]

[0005] The antenna substrate according to the present invention, which has been made to achieve the above object, is characterized by comprising: an antenna including an antenna pattern for transmitting or receiving an RF signal; and a directional adjustment pattern, which has a predetermined area and is composed of a plurality of metal layers spaced apart from each other, and is located on one side of the antenna along which the RF signal radiated from the antenna pattern travels, and at least one of the plurality of metal layers is provided to be higher than the rest.

[0006] The directional adjustment pattern may be disposed to face the antenna pattern along a thickness direction of the antenna. It is preferable that the device further comprises a wiring structure on one surface of which the antenna is disposed, and that the antenna is a chip-type antenna. It is preferable that the wiring structure further comprises a suture material disposed on one surface thereof and surrounding at least a portion of the antenna. It is preferable that the optical fiber cable further includes a shielding layer having an insulating property and disposed between the directional adjustment pattern and the antenna pattern. The shielding layer is preferably disposed so as to cover at least a partial area of ​​the antenna pattern. The shielding layer is preferably disposed over the antenna pattern and over at least a portion of the suture material adjacent to the antenna pattern.

[0007] It is preferable that the semiconductor device further has a wiring structure on one side on which the antenna is disposed, and the antenna further includes a dielectric layer surrounding the antenna pattern, and a through via electrically connected to the dielectric layer and extending through the dielectric layer in the direction in which the wiring structure is disposed. Preferably, the antenna further includes a director member disposed between the directional adjustment pattern and the antenna pattern. The optical fiber further preferably includes a shielding layer having insulating properties and disposed between the directional adjustment pattern and the director member. The shielding layer is preferably disposed to cover at least a portion of the director member. The shielding layer is preferably disposed on the director member over at least a portion of the dielectric layer adjacent the director member. It is preferable that a plurality of the antenna patterns are arranged spaced apart from each other on a plane intersecting a thickness direction of the antenna. The directional tuning pattern is preferably provided by a meta-material structure.

[0008] In addition, to achieve the above object, an antenna substrate according to the present invention includes an antenna including an antenna pattern for transmitting or receiving an RF signal, and a directivity control pattern having a predetermined area and consisting of a plurality of metal layers spaced apart from each other and arranged on one side of the antenna, wherein the directivity control pattern includes a first pattern region located at a first distance from a central region of the directivity control pattern, and a second pattern region located at a second distance from the central region of the directivity control pattern that is greater than the first distance, and one of the first pattern region and the second pattern region is higher than the other.

[0009] It is preferable that the first pattern regions have different heights in the vertical direction of the plurality of metal layers. It is preferable that the second pattern regions have different heights in the vertical direction of the plurality of metal layers.

[0010] In order to achieve the above object, a method for manufacturing an antenna substrate according to the present invention includes the steps of: forming a first mask on a shielding layer of an antenna having an antenna pattern for transmitting or receiving an RF signal; forming a first metal layer on the shielding layer using the first mask; forming a second mask on the first mask to cover a portion of the first metal layer and expose a remaining portion of the first metal layer; forming a second metal layer on the first metal layer using the second mask; and removing the first mask and the second mask to form a directivity adjustment pattern in the antenna, the height of which varies from region to region, via the first metal layer and the second metal layer. Effect of the Invention

[0011] According to the antenna substrate and its manufacturing method of the present invention, the first pattern region of the directivity control pattern is provided to be higher in the vertical direction than the second pattern region and the third pattern region, and the second pattern region is provided to be higher in the vertical direction than the third pattern region, so that the portion of the directivity control pattern located on the center region of the antenna pattern is provided to be higher than the rest, and thus the beam radiated from the antenna pattern is concentrated more in the center region of the antenna pattern, and the directivity of the radiated beam can be adjusted. [Brief description of the drawings]

[0012] [Figure 1] 1 is a cross-sectional view showing a schematic configuration of an antenna substrate according to an embodiment of the present invention. [Diagram 2] 2 is a cross-sectional view showing a schematic configuration of a region in which an antenna is arranged on the antenna substrate of FIG. 1. [Diagram 3] 4A to 4C are cross-sectional views illustrating a manufacturing process of a directional control pattern according to an embodiment of the present invention. [Figure 4] 4A to 4C are cross-sectional views illustrating a manufacturing process of a directional control pattern according to an embodiment of the present invention. [Diagram 5] 4A to 4C are cross-sectional views illustrating a manufacturing process of a directional control pattern according to an embodiment of the present invention. [Figure 6] 4A to 4C are cross-sectional views illustrating a manufacturing process of a directional control pattern according to an embodiment of the present invention. [Figure 7] 4A to 4C are cross-sectional views illustrating a manufacturing process of a directional control pattern according to an embodiment of the present invention. [Figure 8] 4A to 4C are cross-sectional views illustrating a manufacturing process of a directional control pattern according to an embodiment of the present invention. [Figure 9] 11 is a cross-sectional view showing a schematic configuration of a directional control pattern according to another embodiment of the present invention. [Figure 10] 11 is a cross-sectional view showing a schematic configuration of a directional control pattern according to still another embodiment of the present invention. [Figure 11]FIG. 11 is a cross-sectional view showing a schematic configuration of an antenna substrate according to another embodiment of the present invention. [Figure 12] 11 is a cross-sectional view showing a schematic configuration of an antenna substrate according to still another embodiment of the present invention. [Figure 13] FIG. 13 illustrates an arrangement of multiple director members according to an embodiment of the present invention. [Figure 14] FIG. 13 illustrates an arrangement of multiple director members according to another embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Next, specific examples of embodiments for carrying out the antenna substrate and the manufacturing method thereof according to the present invention will be described with reference to the drawings.

[0014] This invention may be embodied in several different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly describe the present invention, parts that are not relevant to the description will be omitted, and the same reference numerals will be used to refer to the same or similar components throughout the specification. Furthermore, the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, and the present invention is not necessarily limited to those shown in the drawings. In the drawings, the thickness of layers and regions are exaggerated for clarity. In the drawings, the thicknesses of some layers and regions are exaggerated for ease of explanation.

[0015] In addition, when a part such as a layer, film, region, plate, etc. is said to be "on" or "above" another part, this includes not only when it is "directly on" the other part, but also when there is another part in between. Conversely, when a part is said to be "directly above" another part, it means that there is no other part in the middle. Also, being "above" or "on" a reference part means being located above or below the reference part, and does not necessarily mean being located "above" or "on" the opposite direction of gravity. Also, throughout the specification, when a part is said to "comprise" a certain element, this means that it can further include other elements, rather than excluding other elements, unless specifically stated to the contrary. Additionally, throughout the specification, "on a plane" means when the target part is viewed from above, and "on a cross section" means when the target part is cut vertically and viewed from the side.

[0016] FIG. 1 is a cross-sectional view showing a schematic configuration of an antenna substrate 1 according to an embodiment of the present invention. Referring to FIG. 1, an antenna substrate 1 according to an embodiment of the present invention includes an antenna 100, a wiring structure 130, and a directivity adjustment pattern 180. The antenna substrate 100 includes an antenna 100, a wiring structure 130, and a directivity adjustment pattern 180. The antenna 100 is a chip type antenna.

[0017] The antenna 100 includes one surface and another surface opposite the first surface. FIG. 1 shows a case where one surface of the antenna 100 faces upward. One surface of the antenna 100 is referred to as the upper surface of the antenna 100, and the other surface of the antenna 100 is referred to as the lower surface of the antenna 100. The direction in which one surface faces the other surface is defined as the thickness direction of the antenna 100 . The body of the antenna 100 is a dielectric material. The antenna 100 has an antenna pattern 101 disposed on the upper surface of a dielectric body, and a pad pattern 102 disposed on the lower surface. One or more antennas 100 may be provided. For example, the antennas 100 may be arranged in a variety of configurations, such as a 1x2 array, a 1x4 array, a 2x2 array, and the like.

[0018] The dielectric body of the antenna 100 comprises a material having a high dielectric constant (Dk). For example, the dielectric body may include a ceramic layer and / or a ceramic-polymer composite layer. Alternatively, the dielectric body may include an insulating layer 131 that includes an insulating material having a high dielectric constant (Dk), such as PTFE (Polytetrafluoroetyhlene). The ceramic-polymer composite layer comprises ceramic fillers dispersed in an organic binder. The organic binder can be a polymer such as PTFE or an epoxy. The ceramic filler is SiO 2 , TiO 2 , Al 2 O 3 The filler may be composed of the above. The ceramic filler has a diameter of 50 μm or less. The ceramic-polymer composite layer includes glass fiber reinforcement.

[0019] The antenna pattern 101 and the pad pattern 102 each include a metal material. The metallic material may be copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof. The antenna pattern 101 is a coupling pattern. A patch pattern coupled to the antenna pattern 101 is disposed on the dielectric body. The antenna pattern 101 transmits and receives RF signals in the thickness direction. The pad pattern 102 allows the antenna 100 to be connected to the outside. The pad pattern 102 connects the antenna 100 to a wiring structure 130 . At least one of the pad patterns 102 is connected to a patch pattern in the dielectric body through a feeding via inside the dielectric body. At least one of the pad patterns 102 is connected to a feeding pattern of the wiring structure 130 . At least one of the pad patterns 102 is connected to the ground of the wiring structure 130 .

[0020] Antenna 100 is disposed on one side of wiring structure 130 . Hereinafter, one surface of wiring structure 130 will be referred to as the upper surface of wiring structure 130. The wiring structure 130 includes an insulating layer 131 , a wiring layer 132 , and a via layer 133 . The wiring layer 132 is disposed on the insulating layer 131 . The wiring layer 132 can also be disposed within the insulating layer 131 . A plurality of insulating layers 131 form a multi-layer structure. The via layers 133 each penetrate the insulating layer 131 . The top via layer 133 passes at least partially through the suture material 140 .

[0021] The insulating layer 131 includes an insulating material. Insulating materials include thermosetting resins such as epoxy resins and thermoplastic resins such as polyimides. The insulating material may also contain reinforcing agents such as glass fiber, glass cloth, and glass fabric, and inorganic fillers. For example, the reinforcing agent can be a prepreg, ABF (Ajinomoto Build-up Film), and the like. Additionally, the insulating layer 131 may include a thermoplastic resin layer and a thermosetting resin layer. For example, the insulating layer 131 includes a laminate in which thermoplastic resin layers and thermosetting resin layers are alternately laminated. The thermoplastic layer includes a material that is effective for transmitting high frequency signals. The thermosetting resin layer contains a material that is advantageous for high frequency signal transmission and has excellent bonding properties. This allows the insulating layer 131 to have excellent high-frequency signal transmission characteristics and adhesion.

[0022] The thermoplastic resin layer may be a liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), polyphenylene sulfide (PPS), polyphenylene ether (PPE), polyimide (PI), or the like. The dielectric loss factor (Df) is adjusted by the type of resin in the thermoplastic resin layer, the type of filler contained in the resin, the amount of filler, etc. A thermoplastic resin layer having low dielectric loss characteristics is advantageous in terms of reducing loss in high frequency signal transmission. The thermoplastic resin layer may have a dielectric loss factor (Df) of 0.003 or less. The thermoplastic resin layer has the property of a low dielectric constant. As an example, the dielectric constant (Dk) of the thermoplastic resin layer is 3.5 or less. The thermosetting resin layer may be a modified polyimide (PI), a PPE (Polyphenylene ether), a modified epoxy, or the like. The dielectric loss factor (Df) is adjusted by the type of resin in the thermosetting resin layer, the type of filler contained in the resin, the amount of filler contained, etc. A thermosetting resin layer having low dielectric loss characteristics is advantageous in terms of reducing loss in high frequency signal transmission. The dielectric loss factor (Df) of the thermosetting resin layer may be less than or equal to 0.003. The thermosetting resin layer may also have a dielectric constant (Dk) of 3.5 or less.

[0023] The wiring layer 132 includes a metal material. The metallic material may be copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof. The wiring layer 132 is formed by AP (Additive Process), SAP (Semi AP), MSAP (Modified SAP), TT (Tenting), or the like. The wiring layer 132 includes a seed layer of an electroless plating layer and an electrolytic plating layer formed based on the seed layer. The wiring layer 132 may further include a primer copper foil. The wiring layer 132 includes a feeding pattern connected to the antenna 100 . The wiring layer 132 also includes a ground pattern. The wiring layer 132 also includes a power pattern. The wiring layer 132 may include other signal transmission patterns in addition to the feeding patterns. These patterns each include a line pattern, a plane pattern, and / or a pad pattern.

[0024] The via layer 133 includes a metal material. The metallic material may be copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof. The via layer 133 is formed by a plating process such as AP, SAP, MSAP, or TT. The via layer 133 includes a seed layer of an electroless plating layer and an electrolytic plating layer formed based on the seed layer. The via layer 133 includes connection vias for connecting the feeding pattern, connection vias for ground connection, connection vias for power connection, and other connection vias for other signal connections. The via layer 133 includes a first connection via 135 and a second connection via 137 . At least a partial area of ​​the first connection via 135 and the second connection via 137 is disposed on the upper surface of the wiring structure 130 .

[0025] The wiring layer 132 disposed on the upper portion of the wiring structure 130 is connected to the antenna 100 through a first connection via 135 . The first connection via 135 is connected to the pad pattern 102 of the antenna 100 . Wiring layer 132 disposed on top of wiring structure 130 is connected to heat dissipation structure 150 (described later) through second connection vias 137. The second connection via 137 is connected to the first metal pattern layer 152 below the heat dissipation structure 150 . The first connection vias 135 include a feeding connection via and a ground connection via. The second connection vias 137 include ground connection vias.

[0026] A suture material 140 is disposed on the upper surface of wiring structure 130. The suture 140 surrounds at least a portion of the antenna 100 . The suture material 140 entirely covers the sides of the antenna 100 . The suture 140 covers at least a portion of the underside of the antenna 100 . The suture 140 covers at least a portion of the top surface of the antenna 100 . The suture material 140 is placed to fill the space formed between the wiring structure 130 and the antenna 100 . The suture material 140 is positioned to fill the space formed between the wiring structure 130 and the heat dissipation structure 150 . The suture material 140 comprises an insulating material. Insulating materials include thermosetting resins such as epoxy resins and thermoplastic resins such as polyimides. The insulating material also includes a reinforcing agent such as an inorganic filler. For example, the reinforcing agent may be ABF, or the like.

[0027] A heat dissipation structure 150 is disposed on the outer periphery of the antenna 100 . That is, a through hole 150H is formed in the central region of the heat dissipation structure 150, and the antenna 100 is disposed in the through hole 150H. Heat dissipation structure 150 is located on the upper surface of wiring structure 130. The heat dissipation structure 150 allows the heat generated from the antenna 100 to be efficiently dissipated. In addition, the heat dissipation structure 150 improves the rigidity of the antenna substrate 1. Additionally, the heat dissipation structure 150 improves the thickness uniformity of the suture material 140. The heat dissipation structure 150 includes an insulating substrate 151 , a first metal pattern layer 152 , and a second metal pattern layer 155 .

[0028] The insulating substrate 151 has a preset thickness and is disposed on the outer periphery of the antenna 100. In the central region of the insulating substrate 151, a through hole 150H is formed. The antenna 100 is disposed in the through-hole 150H. The insulating substrate 151 includes an insulating material. Insulation materials may include fiberglass, reinforcing materials, Copper Clad Laminate (CCL) insulation, prepreg, and the like. Additionally, the insulating material may include glass, ceramic, plastic, and the like.

[0029] The first metal pattern layers 152 are disposed on the upper and lower surfaces of the insulating substrate 151, respectively. The first metal pattern layers 152 disposed on the upper and lower surfaces of the insulating substrate 151 are connected to each other by a metal via layer 153 penetrating the insulating substrate 151 . The first metal pattern layer 152 further includes a primer copper foil. The first metal pattern layer 152 includes a ground pattern. The second metal pattern layer 155 is disposed on the inner surface of the insulating substrate 151 . That is, the second metal pattern layer 155 is disposed on the wall surface of the through-hole 150H. The second metal pattern layer 155 further includes a primer copper foil. The second metal pattern layer 155 includes a ground pattern.

[0030] The first metal pattern layer 152, the metal via layer 133, and the second metal pattern layer 155 include metal materials. The metallic material is copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof. The first metal pattern layer 152, the metal via layer 133, and the second metal pattern layer 155 are formed of AP, SAP, MSAP, TT, or the like. The first metal pattern layer 152, the metal via layer 133, and the second metal pattern layer 155 include a seed layer of an electroless plating layer and an electrolytic plating layer formed based on the seed layer.

[0031] A passivation layer 160 is disposed on the underside of wiring structure 130 . The passivation layer 160 covers at least a portion of the wiring layer 132 located at the bottom end of the wiring structure 130 . The passivation layer 160 has an opening that exposes a portion of the wiring layer 132 located at the bottom end of the wiring structure 130 . The passivation layer 160 comprises an insulating material. The insulating material may be a thermosetting resin such as an epoxy resin, a thermoplastic resin such as a polyimide, or a material containing a reinforcing agent such as an inorganic filler together with the above, for example, ABF. The insulating material may also be a solder resist (SR) containing a photosensitive material.

[0032] A connection terminal 165 is disposed on the opening of the passivation layer 160 . Connection terminal 165 is connected to wiring layer 132 located at the lower end of wiring structure 130 . The connection terminal 165 provides a path for connecting the antenna substrate 1 to an external component. The connection terminal 165 may be a low-melting point metal having a lower melting point than copper (Cu). For example, the connection terminal 165 is made of tin (Sn) or an alloy containing tin (Sn). For example, the connection terminal 165 may be a solder or the like. The connection terminal 165 may be a land, a ball, a pin, or the like. Additionally, the connection terminals 165 may include copper pillars and solder.

[0033] FIG. 2 is a cross-sectional view showing a schematic configuration of an area in which the antenna 100 is arranged on the antenna substrate 1 of FIG. Referring to FIG. 2, a shielding layer 170 is disposed on the antenna pattern 101 . The shielding layer 170 is disposed so as to cover at least a portion of the antenna pattern 101 . The shielding layer 170 is disposed in a structure that completely covers the antenna pattern 101 . The shielding layer 170 is disposed over the antenna pattern 101 and over at least a portion of the suture material 140 adjacent to the antenna pattern 101 .

[0034] The shielding layer 170 is provided to have insulating properties. The shielding layer 170 comprises an insulating material. Insulating materials include thermosetting resins such as epoxy resins and thermoplastic resins such as polyimides. The insulating material also includes a reinforcing agent such as an inorganic filler. For example, the reinforcing agent may be ABF, or the like. Additionally, the shielding layer 170 may be provided with a photo imageable encapsulant (PIE), epoxy molding compound (EMC), or the like. The shielding layer 170 is provided from the same material as the suture material 140.

[0035] The directional adjustment pattern 180 is disposed on one side of the antenna 100 . The directivity adjustment pattern 180 is disposed in the traveling direction of the RF signal radiated from the antenna pattern 101 . The directivity adjustment pattern 180 is disposed to face the antenna pattern 101 along the thickness direction of the antenna 100 . A shielding layer 170 is disposed between the directivity adjustment pattern 180 and the antenna pattern 101 . The directivity adjustment pattern 180 is disposed facing the antenna pattern 101 with the shielding layer 170 therebetween. The directional adjustment pattern 180 is disposed on the shielding layer 170 . The directional adjustment pattern 180 is provided from a metallic material. By way of example, directional tuning pattern 180 may be provided by copper or the like.

[0036] The directivity adjustment pattern 180 adjusts the direction of the beam formed by the RF signal radiated from the antenna pattern 101 . The directional control pattern 180 is provided with different heights in the up-down direction depending on the region. The directional adjustment pattern 180 is made of a plurality of metal layers spaced apart from one another and has a predetermined area. At this time, the width of each of the plurality of metal layers along one of the directions intersecting the up-down direction is smaller than the wavelength of the RF signal. The area of ​​the directivity adjustment pattern 180 corresponds to the area of ​​the antenna pattern 101 . The directional adjustment pattern 180 is provided with a plurality of metal layers, at least one of which is higher in height than the rest. That is, the directivity control pattern 180 is provided such that the height in the vertical direction of a region for increasing the directivity of the beam radiated from the antenna pattern 101 is higher than the remaining region.

[0037] The directional adjustment pattern 180 includes a first pattern region 180a, a second pattern region 180b, and a third pattern region 180c. The first pattern region 180 a is located a first distance from the central region of the directional adjustment pattern 180 . As an example, the first pattern region 180a is located on the center region of the antenna pattern 101. The second pattern region 180b is located at a second distance from the central region of the directional adjustment pattern 180, the second distance being greater than the first distance. As an example, the second pattern region 180b is located on the middle region of the antenna pattern 101. The middle region of the antenna pattern 101 is located between the center region and the edge region of the antenna pattern 101 . The second pattern region 180b is located on the outer periphery of the first pattern region 180a. The second pattern region 180b is located so as to be spaced apart from the first pattern region 180a. The third pattern region 180c is located at a third distance from the central region of the directional adjustment pattern 180, the third distance being greater than the second distance. As an example, the third pattern region 180c is located on an edge region of the antenna pattern 101. The third pattern region 180c is located on the outer periphery of the second pattern region 180b. The third pattern region 180c is located so as to be spaced apart from the second pattern region 180b.

[0038] The first pattern region 180a is provided to be higher in the vertical direction than the second pattern region 180b and the third pattern region 180c. Also, the second pattern region 180b is provided to be higher in the up-down direction than the third pattern region 180c. That is, the directivity adjustment pattern 180 is provided such that the portion located on the center region of the antenna pattern 101 is higher than the remaining portion. As a result, the beam radiated from the antenna pattern 101 is more concentrated in the central region of the antenna pattern 101 . As described above, the directional adjustment pattern 180 has one of the first pattern region 180a, the second pattern region 180b, and the third pattern region 180c that is taller than the rest.

[0039] In addition, the directivity control pattern 180 has different vertical heights depending on the regions on the plane intersecting the thickness direction of the antenna 100 . That is, in the first pattern region 180a, the heights of the multiple metal layers in the up-down direction differ from region to region. In the second pattern region 180b, the heights of the metal layers in the vertical direction vary from region to region along the circumferential direction about the center of the directivity adjustment pattern 180. In addition, in the third pattern region 180c, the vertical heights of the plurality of metal layers vary from region to region along a circumferential direction about the center of the directivity control pattern 180. The directional tuning pattern 180 may also be provided by a meta-material structure. As a result, the directivity adjustment pattern 180 can adjust the directivity of the beam radiated from the antenna pattern 101 more effectively.

[0040] 3 to 8 are cross-sectional views illustrating a manufacturing process of the directivity control pattern 180 according to an embodiment of the present invention. Hereinafter, a method for manufacturing the directivity control pattern 180 will be described with reference to FIGS.

[0041] Referring to FIG. 3, a first mask (M1) is formed on the shielding layer 170. The first mask (M1) is formed on a region located opposite the antenna pattern 101 with the shielding layer 170 therebetween. The first mask (M1) is formed by photolithography using a dry film, photoresist, or the like. The first mask M1 is formed so that the shielding layer 170 is exposed in all areas where the directivity control pattern 180 is to be formed.

[0042] Referring to FIG. 4, a first metal layer P1 for forming a directionality control pattern 180 is formed on a shielding layer 170 using a first mask M1. The first metal layer (P1) is formed through a plating process, a deposition process, or the like.

[0043] Referring to FIG. 5, a second mask (M2) is further formed on the first mask (M1). The second mask M2 is formed to extend in the opposite direction to the antenna pattern 101 from the area where the first mask M1 is formed. The second mask (M2) is formed so as to cover a portion of the previously formed first metal layer (P1) and to expose the remainder of the first metal layer (P1). As an example, the second mask (M2) is formed to cover the first metal layer (P1) formed on the edge region of the antenna pattern 101, and to expose the first metal layer (P1) formed on the middle region and center region of the antenna pattern 101.

[0044] Referring to FIG. 6, a second metal layer (P2) is formed on the first metal layer (P1) using a second mask (M2). The second mask (M2) covers a portion of the previously formed first metal layer (P1), so that the second metal layer (P2) is formed on the remaining portion of the first metal layer (P1). As an example, the second metal layer (P2) is formed on the first metal layer (P1) formed on the middle region and the center region of the antenna pattern 101. The second metal layer (P2) is formed through a plating process, a deposition process, or the like.

[0045] Referring to FIG. 7, a third mask M3 is further formed on the second mask M2. The third mask M3 is formed to extend in the opposite direction to the antenna pattern 101 from the area where the second mask M2 is formed. The third mask (M3) is formed so as to cover a part of the previously formed second metal layer (P2) and to expose the remaining part of the second metal layer (P2). As an example, the third mask (M3) is formed to cover the second metal layer (P2) formed on the middle region of the antenna pattern 101, and to expose the second metal layer (P2) formed on the center region of the antenna pattern 101.

[0046] Referring to FIG. 8, a third metal layer P3 is formed on the second metal layer P2 using a third mask M3. The third mask (M3) covers a portion of the previously formed second metal layer (P2), so that the third metal layer (P3) is formed on the remaining portion of the second metal layer (P2). As an example, the third metal layer (P3) is formed on the second metal layer (P2) formed on the center region of the antenna pattern 101. The third metal layer (P3) is formed through a plating process, a deposition process, or the like. Then, the first mask (M1), the second mask (M2), and the third mask (M3) are removed, and the first metal layer (P1), the second metal layer (P2), and the third metal layer (P3) form the directional control pattern 180.

[0047] FIG. 9 is a cross-sectional view showing a schematic configuration of a directionality control pattern 181 according to another embodiment of the present invention. Referring to FIG. 9, the directional control pattern 181 is provided such that the height in the up-down direction increases from one end of the edge region to the other end of the edge region. As an example, the directional adjustment pattern 181 includes a first pattern region 181a, a second pattern region 181b, and a third pattern region 181c. At least a portion of the first pattern region 181a is located above the center region of the antenna pattern 101. The second pattern regions 181b are located on both sides of the first pattern region 181a. At least a portion of the second pattern region 181b is located above the middle region of the antenna pattern 101.

[0048] The second pattern regions 181b facing each other with the first pattern region 181a therebetween are provided to have different heights in the up-down direction. A second pattern region 181b located on one side of the first pattern region 181a is taller than the first pattern region 181a. A second pattern region 181b located on the other side of the first pattern region 181a is lower in height than the first pattern region 181a. The third pattern region 181c is located on the opposite side of the first pattern region 181a with the second pattern region 181b therebetween. The third pattern region 181c is located on the edge region of the antenna pattern 101. A third pattern region 181c located to one side of the first pattern region 181a is taller than the adjacent second pattern region 181b. A third pattern region 181c located on the other side of the first pattern region 181a is lower in height than the adjacent second pattern region 181b.

[0049] FIG. 10 is a cross-sectional view showing a schematic configuration of a directional control pattern 182 according to still another embodiment of the present invention. Referring to FIG. 10, a directional control pattern 182 is provided such that the middle region is higher than the center region and edge regions. As an example, the directional adjustment pattern 182 includes a first pattern region 182a, a second pattern region 182b, and a third pattern region 182c. At least a portion of the first pattern region 182a is located above the center region of the antenna pattern 101. The second pattern regions 182b are located on both sides of the first pattern region 182a. At least a portion of the second pattern region 182b is located above the middle region of the antenna pattern 101. The second pattern region 182b is taller than the first pattern region 182a. The third pattern region 182c is located on the opposite side of the first pattern region 182a with the second pattern region 182b therebetween. The third pattern region 182c is located on the edge region of the antenna pattern 101. The third pattern region 182c is shorter in height than the second pattern region 182b.

[0050] FIG. 11 is a cross-sectional view showing a schematic configuration of an antenna board 2 according to another embodiment of the present invention. Referring to FIG. 11, an antenna substrate 2 according to another embodiment of the present invention includes an antenna 200, a wiring structure 230, a heat dissipation structure 250, and a directivity adjustment pattern 280. The antenna substrate 200 includes an antenna 200a, a wiring structure 230b, a heat dissipation structure 250c, and a directivity adjustment pattern 280b.

[0051] The heat dissipation structure 250 is provided by a conductive block. The heat dissipation structure 250 is provided by a metallic material. As an example, the heat dissipation structure 250 includes copper (Cu) or the like. Heat dissipation structure 250 is disposed on the upper surface of wiring structure 230 . The heat dissipation structure 250 is disposed on the outer periphery of the antenna 200 . At least a portion of the heat dissipation structure 250 is covered by the suture material 240.

[0052] The antenna 200 includes an antenna pattern 201 and a pad pattern 202 . The wiring structure 230 includes an insulating layer 231 , a wiring layer 232 , and a via layer 233 . The first connection via 235 is connected to the antenna 200 . The second connection via 237 is connected to the heat dissipation structure 250 . A suture material 240 is disposed on the upper surface of wiring structure 230. The suture 240 covers at least a portion of the antenna 200 . A passivation layer 260 is disposed on the underside of wiring structure 230 . A connection terminal 265 is disposed on the opening of the passivation layer 260 .

[0053] The structures of antenna 200 and wiring structure 230 are the same as or similar to antenna 100 and wiring structure 130 described above in FIG. 1, and therefore will not be described again. The directional adjustment pattern 280 is disposed on the antenna pattern 201 . A shielding layer 270 is disposed between the directivity adjustment pattern 280 and the antenna pattern 201 . The directional adjustment pattern 280 and the shielding layer 270 are the same as or similar to the directional adjustment patterns (180, 181, 182) and the shielding layer 170 described above in FIG. 1, FIG. 9, and FIG. 10, and therefore will not be described again.

[0054] FIG. 12 is a cross-sectional view showing a schematic configuration of an antenna substrate 9 according to still another embodiment of the present invention. Referring to FIG. 12, an antenna substrate 9 according to another embodiment of the present invention includes an antenna 910, a wiring structure 920, and a directivity adjustment pattern 960.

[0055] The antenna 910 includes one surface and another surface opposite the first surface. FIG. 12 shows a case where one surface of the antenna 910 faces upward. One surface of the antenna 910 is referred to as the top surface of the antenna 910, and the other surface of the antenna 910 is referred to as the bottom surface of the antenna 910. The direction in which one surface faces the other surface is defined as the thickness direction of antenna 910. The antenna 910 includes a director member 911 , an antenna pattern 912 , and a dielectric layer 914 .

[0056] A director member 911 is disposed adjacent one side of the antenna 910 . A director member 911 receives an RF signal or transmits an RF signal with a matching antenna pattern 912 . A plurality of director members 911 are arranged spaced apart from each other on a plane intersecting the thickness direction of the antenna 910 . Depending on the design, director member 911 may be omitted. Also, a plurality of director members 911 may be arranged in a multi-layer structure spaced apart from each other in the thickness direction of the antenna 910 .

[0057] The antenna pattern 912 is disposed so as to be spaced apart from the director member 911 in the direction of the other surface of the antenna 910 . The antenna pattern 912 is electromagnetically coupled to a matching director member 911 and receives RF signals or transmits RF signals with the corresponding director member 911 . The multiple antenna patterns 912 are arranged spaced apart from each other on a plane that intersects with the thickness direction of the antenna 910 . The antenna pattern 912 is one-to-one matched with the director member 911 . The antenna pattern 912 has a shape that corresponds to the matching director member 911 . A through via 913 is electrically connected to the antenna pattern 912 . Through vias 913 provide a path for the RF signal.

[0058] A dielectric layer 914 is disposed to surround the antenna pattern 912 . That is, it can be understood that the antenna pattern 912 is disposed so as to be filled inside the dielectric layer 914 . The through via 913 penetrates the dielectric layer 914 and extends toward the other surface of the antenna 910 . The dielectric layer 914 has a preset thickness. Through the length of the through via 913 and the thickness of the dielectric layer 914, the boundary conditions for the RF signal transmitting and receiving operation of the antenna pattern 912 are adjusted.

[0059] An insulating member 915 is disposed on the outer periphery of each antenna pattern 912 and the dielectric layer 914 surrounding it. At this time, the dielectric layer 914 is provided to have a higher dielectric constant (Dk) than the insulating member 915 . For example, the dielectric layer 914 may be provided from glass, ceramic, silicon, quartz, Teflon, or the like. This improves the performance of the antenna 910 in the antenna pattern 912 . The insulating member 915 has a thickness corresponding to that of the dielectric layer 914 . The insulating member 915 is provided by a copper clad laminate (CCL), a prepreg, or the like.

[0060] A plating layer 917 is formed on the outer surface of the insulating member 915 . As a result, the plating layer 917 is located between the dielectric layer 914 and the insulating member 915 . Furthermore, the plating layer 917 is located on the upper surface of the insulating member 915 . The plating layer 917 provides favorable boundary conditions for the antenna pattern 912 to transmit and receive RF signals. A shielding layer 916 is disposed over the director member 911 . A shielding layer 916 is disposed to cover at least a portion of the director member 911 . Additionally, the shielding layer 916 may be disposed in a structure that completely covers the director member 911 . Also, a shielding layer 916 is disposed on the director member 911 and over at least a portion of the dielectric layer 914 adjacent the director member 911 . Additionally, a shielding layer 916 is disposed over the director member 911 , the dielectric layer 914 , and the plating layer 917 .

[0061] A shielding layer 170 is provided to have insulating properties. The shielding layer 916 comprises an insulating material. Insulating materials include thermosetting resins such as epoxy resins and thermoplastic resins such as polyimides. The insulating material also includes a reinforcing agent such as an inorganic filler. For example, the reinforcing agent may be ABF, or the like. Additionally, the shielding layer 916 may be provided with a photo imageable encapsulant (PIE), epoxy molding compound (EMC), or the like.

[0062] Antenna 910 is disposed on one side of wiring structure 920 . The bottom surface of antenna 910 faces one surface of wiring structure 920 . Hereinafter, one surface of wiring structure 920 will be referred to as the upper surface of wiring structure 920. The wiring structure 920 includes an insulating layer and a wiring layer. The wiring structure 920 has a structure similar to a copper redistribution layer (RDL) of a printed circuit board (PCB). The wiring layer is electrically connected to the antenna pattern 912 through a through via 913, providing a path for the RF signal. The wiring layer also provides a ground region and a power supply region. The wiring layer also provides an electrical path between the core member 940 and the IC 930 .

[0063] An IC 930 , a connection terminal 931 , a manual element 935 , and a core member 940 are arranged on the lower surface of wiring structure 920 . The IC930 generates an RF signal. The IC 930 also receives the RF signal received via the antenna pattern 912 . The IC 930 receives a base signal via the core member 940, performs at least some of the frequency conversion, amplification, filtering, phase control, and power generation of the base signal, and generates an RF signal in the millimeter wave (mmWave) band (e.g., 28 GHz, 60 GHz). The connection terminal 931 electrically connects the IC 930 and the wiring layer 932 . The connection terminal 931 electrically connects the core member 940 and the wiring layer 932 . The connection terminals 931 are sewn with a suture material to improve the placement stability of the IC 930 . The connection terminal 931 may be an electrode, a pin, a solder ball, a land, or the like.

[0064] The manual element 935 provides at least one of a resistance, a capacitance, and an inductance to the IC 930 . The manual element 935 includes a multilayer ceramic capacitor (MLCC). The core member 940 receives the base signal, power, and the like. The core member 940 transmits low-frequency received signals, power, etc. to the IC 930 . The core member 940 is electrically connected to the wiring layer by a connection terminal 931 .

[0065] A directional adjustment pattern 960 is disposed on one side of the antenna 910 . The directivity adjustment pattern 960 is disposed in the direction in which the RF signal radiated from the antenna pattern 912 travels. The directional adjustment pattern 960 is disposed opposite the director member 911 along the thickness direction of the antenna 910 . The directivity adjustment pattern 960 is disposed to face the antenna pattern 912 along the thickness direction of the antenna 910 . A director member 911 is disposed between the directional adjustment pattern 960 and the antenna pattern 912 . A shielding layer 916 is disposed between the directional adjustment pattern 960 and the director member 911 . A shielding layer 916 is disposed between the directional adjustment pattern 960 and the antenna pattern 912 . The directional adjustment pattern 960 is positioned opposite the director member 911 with the shielding layer 916 therebetween. The directivity adjustment pattern 960 is disposed opposite the antenna pattern 912 with the shielding layer 916 therebetween. A directional adjustment pattern 960 is disposed on the shielding layer 916 .

[0066] The directional adjustment pattern 960 is provided in a metallic material. The directivity adjustment pattern 960 adjusts the direction of the beam formed by the RF signal radiated from the antenna pattern 912 . The directional control pattern 960 is provided with different heights in the up-down direction depending on the region. The directivity adjustment pattern 960 is provided such that the vertical height of an area for increasing the directivity of the beam radiated from the antenna pattern 912 is higher than the remaining area.

[0067] The director member 911 is also disposed so as to be filled with a dielectric layer 914 . In this case, the above-mentioned shielding layer 916 may be omitted. That is, the directivity adjustment pattern 960 is disposed to face the director member 911 and the antenna pattern 912 with the dielectric layer 914 located on the top of the antenna 910 therebetween. In this case, the dielectric layer 914 functions as the shielding layer 916 described above. Also, if director member 911 is omitted, shielding layer 916 may be omitted. That is, the directivity adjustment pattern 960 is disposed to face the antenna pattern 912 with the dielectric layer 914 located on the upper portion of the antenna 910 therebetween. In this case, the dielectric layer 914 functions as the shielding layer 916 described above. The structure of the directional control pattern 960 is the same as or similar to the directional control patterns (180, 181, 182) described above in FIG. 1, FIG. 2, FIG. 9, and FIG. 10, so a repeated description will be omitted. Also, the directivity control pattern 960 can be formed by the method described above with reference to FIGS. 3 to 8, and a repeated description will be omitted.

[0068] FIG. 13 is a diagram illustrating an arrangement of multiple director members 911 according to an embodiment of the present invention. Referring to FIG. 13, a plurality of director members 911 are disposed spaced apart from one another on a plane intersecting the thickness direction of the antenna 910 . As an example, multiple director members 911 are arranged in a lattice structure. The director members 911 have corresponding shapes. When viewed in the thickness direction of the antenna 910, the director member 911 has a rectangular structure. The antenna pattern 912 has a shape corresponding to the director member 911 . A plurality of antenna patterns 912 are each matched one-to-one with the director member 911 .

[0069] FIG. 14 is a diagram illustrating an arrangement of multiple director members 911a according to another embodiment of the present invention. 14, a plurality of director members 911a are disposed spaced apart from one another on a plane intersecting the thickness direction of the antenna 910. As shown in FIG. As an example, multiple director members 911a are arranged in a lattice structure. The director members 911a have corresponding shapes to one another. When viewed through the thickness of the antenna 910, the director member 911a has a circular structure. Antenna pattern 912 has a shape that corresponds to director member 911a. A plurality of antenna patterns 912 are each matched one-to-one to a director member 911a.

[0070] As described above with reference to FIGS. 13 and 14, the director members 911, 911a may be adjusted so that the structure thereof when viewed in the thickness direction of the antenna 910 is rectangular, circular, elliptical, or other polygonal. This allows the antenna 910 to adjust characteristic factors such as the gain, HPBW (Half Power Beam Width), bandwidth, and input impedance of the antenna 910.

[0071] The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the technical scope of the present invention. [Explanation of symbols]

[0072] 1 Antenna Board 100 Antennas 101 Antenna Pattern 102 Pad Pattern 130 Wiring structure 131 Insulating layer 132 Wiring layer 133 Via Layer 135 First connection via 137 Second connection via 140 Suture material 150 Heat dissipation structure 150H through hole 151 Insulating Substrate 152 First metal pattern layer 153 Metal via layer 155 Second metal pattern layer 160 Passivation Layer 165 Connection terminal 170 Shielding layer 180 directional adjustment pattern

Claims

1. an antenna including an antenna pattern for transmitting or receiving RF signals; An antenna substrate comprising: a plurality of metal layers spaced apart from each other and having a predetermined area; a directional adjustment pattern located on one surface of the antenna along which an RF signal radiated from the antenna pattern travels; and at least one of the plurality of metal layers having a higher height than the rest.

2. The antenna substrate of claim 1 , wherein the directivity adjustment pattern is disposed to face the antenna pattern in a thickness direction of the antenna.

3. A wiring structure on one surface of which the antenna is disposed is further provided.

2. The antenna board according to claim 1, wherein the antenna is a chip type antenna.

4. 4. The antenna substrate according to claim 3, further comprising a stitching material disposed on one surface of the wiring structure and surrounding at least a portion of the antenna.

5. The antenna substrate according to claim 4 , further comprising a shielding layer having an insulating property and disposed between the directional adjustment pattern and the antenna pattern.

6. The antenna substrate according to claim 5 , wherein the shielding layer is disposed so as to cover at least a portion of the antenna pattern.

7. The antenna substrate according to claim 5 , wherein the shielding layer is disposed on the antenna pattern and over at least a portion of the suture material adjacent to the antenna pattern.

8. A wiring structure on one surface of which the antenna is disposed is further provided. The antenna is a dielectric layer surrounding the antenna pattern; The antenna substrate of claim 1 , further comprising a through via electrically connected to the dielectric layer and extending through the dielectric layer in a direction in which the wiring structure is disposed.

9. The antenna substrate of claim 8 , wherein the antenna further comprises a director member disposed between the directional adjustment pattern and the antenna pattern.

10. 10. The antenna substrate of claim 9, further comprising a shielding layer having insulating properties and disposed between the directional adjustment pattern and the director member.

11. The antenna substrate of claim 10 , wherein the shielding layer is disposed to cover at least a partial area of ​​the director member.

12. The antenna substrate of claim 10 , wherein the shielding layer is disposed on the director member and over at least a portion of the dielectric layer adjacent to the director member.

13. The antenna substrate according to claim 8 , wherein a plurality of the antenna patterns are disposed spaced apart from each other on a plane intersecting a thickness direction of the antenna.

14. The antenna substrate of claim 1 , wherein the directional tuning pattern is provided by a meta-material structure.

15. an antenna including an antenna pattern for transmitting or receiving RF signals; a directivity adjustment pattern having a predetermined area and made of a plurality of metal layers spaced apart from each other, the directivity adjustment pattern being disposed on one surface of the antenna; The directional adjustment pattern is: a first pattern area located a first distance from a central area of ​​the directional control pattern; a second pattern area located at a second distance greater than the first distance from a central area of ​​the directional control pattern, 10. An antenna substrate, comprising: a first pattern region and a second pattern region, the first pattern region and the second pattern region being higher than the second pattern region.

16. The antenna substrate according to claim 15 , wherein the first pattern region has a different height in the vertical direction of the plurality of metal layers for each region.

17. The antenna substrate according to claim 15 , wherein the second pattern regions have different heights in the vertical direction of the plurality of metal layers for each region.

18. forming a first mask on a shielding layer of an antenna having an antenna pattern for transmitting or receiving an RF signal; forming a first metal layer on the shielding layer using the first mask; forming a second mask over the first mask to cover a portion of the first metal layer and to expose a remaining portion of the first metal layer; forming a second metal layer on the first metal layer using the second mask; and removing the first mask and the second mask, and forming a directivity control pattern having different heights in each region on the antenna via the first metal layer and the second metal layer.

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