Power module bridge and manufacturing method therefor

Abstract

To provide a power module bridge and a method for manufacturing the power module bridge.SOLUTION: In a power module bridge, a plurality of power modules 100.1 comprises: a circuit board 102; a semiconductor switch 110; connection boars 120.1 and 120.2; a flexible print board; and spacers 108.1 and 108.2. A volume surrounded by a frame including a gate print board, a definition part of a side surface, a region that is not covered toward an upper and / or lower direction includes a frame filled with a gal and a connection element, and the circuit board 102, the semiconductor switch, each spacer, and each connection board are alternately bonded by a sintering bonding.SELECTED DRAWING: Figure 1.1

Description

[Technical field]

[0001] The present invention relates to a power module bridge, in particular a power module bridge for converting direct current into alternating current, for example a power module-B6-bridge. The present invention further relates to one or more power modules without a moulding body and their incorporation into a power module bridge, as well as to a gelling of one or more power modules in a power module bridge. [Background technology]

[0002] In the prior art, for example, a power module mounted in a power module bridge is additionally molded. In the molding, the power module is embedded in a robust protective housing, for example made of plastic (molding compound). The molding compound serves to encapsulate and protect the inside of the power module. However, this encapsulation of the power module by the molding compound is not particularly robust against cracks.

[0003] From DE 112017004390 A1 a power module is known which has the following characteristics: an insulating substrate on whose front side power semiconductor components are fixed, a base plate which is joined to the rear side of the insulating substrate, a housing which is fixed to the base plate and surrounds the insulating substrate, a cover which is fixed to the housing and forms a sealed area, and a silicone gel which fills the entire sealed area and which serves as a filling element having an internal stress which acts as a compressive stress. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] DE 112017004390 Summary of the Invention [Means for solving the problem]

[0005] According to the present invention, - one or more power modules, i. one or more circuit boards including at least three layers of material, a middle circuit board layer including an insulating material, a first outer circuit board layer and a second outer circuit board layer including a conductive material, the outer layers being formed as one or more conductor structures; ii. one or more semiconductor switches; iii. one or more connection substrates including at least three material layers, a middle connection substrate layer including an insulating material, a first outer connection substrate layer and a second outer connection substrate layer including a conductive material, the one or more connection substrates having one or more contact elements; iv. one or more flexible printed circuit boards; v. One or more spacers one or more power modules having - a gate printed circuit board; - a frame having side definitions and an uncovered area towards the top and / or bottom, the volume enclosed by the frame being filled with gel; - with one or more connection elements A power module bridge, such as a power module-B2-bridge or a power module-B6-bridge, according to a first aspect, comprising: A power module bridge is disclosed in which one or more circuit boards, one or more semiconductor switches, one or more spacers, and one or more connection boards are bonded together by sinter bonding.

[0006] The solution according to the invention shows a power module bridge. A power module bridge is an electronic circuit in which power electronics, e.g. a power module, are used. Power module bridges are used in various applications, e.g. motor controls, rectifier circuits, switching power supplies and power converters. The solution according to the invention is particularly suitable for power converters, e.g. in electric vehicles, where the power converter converts a direct current (DC) into an alternating current (AC).

[0007] The circuit board is a component of the power module. The circuit board may include, for example, multiple material layers, for example, outer layers containing conductive layers and inner layers containing non-conductive materials. The conductive layers may be used, for example, to electrically connect various power electronic components. Furthermore, effective thermal management of the power electronics may be enabled, for example, by the incorporation of non-conductive layers. The integration of conductive and non-conductive layers may provide a heat dissipation path for conducting heat away from, for example, power components. For example, the outer layers of the circuit board may be formed as conductor structures, the number and shape of which may vary depending on the power module. The conductor structures include conductive materials that are applied onto the insulating circuit board and help to enable current flow between components and ensure efficient energy transmission.

[0008] The connection board is also a component of the power module. The connection board can be, for example, a multi-layer structure, for example, with outer layers being conductive layers and inner layers being non-conductive materials. The conductive layers can be used, for example, to electrically connect various power electronic components. Furthermore, the incorporation of non-conductive layers can, for example, enable effective thermal management of the power electronics. The integration of conductive and non-conductive layers can provide a heat dissipation path for the heat dissipation of the power components.

[0009] Within the scope of the present invention, the power module includes one or more spacers, which are arranged, for example, between the printed circuit board, the semiconductor switch and the circuit board. The spacers can include an insulating material and can minimize electrical and technical problems. By incorporating the spacers in the power module, short circuits can be avoided. Furthermore, the incorporation of the spacers leads to efficient heat dissipation, which improves the performance of the power module and provides a reliable function. Furthermore, the spacers are, for example, joined to the semiconductor switch, the printed circuit board and the circuit board by sintering. The advantage of sintering is, for example, the absence of additional fastening elements, such as screws, adhesives or welded seams, which, for example, eliminates weak points or defect sources associated with the use of such fastening elements. Furthermore, sintering implies a uniform stress distribution on the components of the power module, since it distributes the stress uniformly over the entire joining surface. This can reduce stress concentrations and improve the overall stability of the fastening.

[0010] In the sense of the present invention, the power module bridge comprises a gate printed circuit board. The gate printed circuit board is a component of the power module bridge, for example a single printed circuit board on which all components of the power module bridge are fixed. In the sense of the present invention, the power module bridge further comprises a frame, which comprises a robust material, for example plastic. The frame according to the present invention provides a stable mounting and positioning of the power module on the gate printed circuit board, and furthermore the frame provides a physical barrier to protect the components of the power module bridge from damage and to extend the life of the power module. Moreover, the frame according to the present invention provides an enclosed volume that is filled with a gel material.

[0011] According to the invention, the power module bridge comprises one or more flexible printed circuit boards. A flexible printed circuit board, also called Flex-PCB (Flexible Printed Circuit Board), is an electronic component that comprises a flexible substrate material that contains conductor tracks and electrical connections. The substrate material consists, for example, of plastic, polyamide or other flexible materials. Due to their flexibility and bendability, flexible printed circuit boards can conform to various shapes and surfaces and can be integrated into the power module bridge without taking up space.

[0012] The solution according to the invention provides a particularly advantageous construction of the power module bridge, in which the power modules installed in the power module bridge are not encapsulated with a molding compound, as is the case with other constructions possible according to the prior art, but rather the power modules are potted with a gel without such additional encapsulation.

[0013] In an advantageous variant of the power module bridge proposed according to the invention, a power module bridge is proposed in which one or more conductor paths of one or more flexible printed circuit boards are fixed to the contact elements, a part of the flexible printed circuit board is fixed to one or more connection substrates by a material-bonding joint, and the remaining part of the flexible printed circuit board is oriented perpendicular to the fixed part of the flexible printed circuit board.

[0014] According to the invention, one or more flexible printed circuit boards include one or more conductor paths, which are connected to the contact elements of the power module. The part of the flexible printed circuit board adjacent to the contact elements is then joined to the power module in a material-bonded manner. The part of the flexible printed circuit board adjacent to the bonding point can be oriented perpendicular to the bonding point, for example at 90°.

[0015] In a variant of the power module bridge according to the invention, it is proposed that one or more power modules are positioned in a frame. In a variant of the power module bridge proposed according to the invention, a power module bridge is proposed in which the frame has a variable frame height, which is 12 mm, preferably 2 to 7 mm, particularly preferably 4 to 5 mm.

[0016] According to the invention, a variable frame height is proposed, which is determined based on the height of the power module to be installed in the frame, since it forms an enclosed volume for filling with gel, and which is higher than the power module and the components connected with it, such as bonding wires and semiconductor circuits, according to the proposed solution.

[0017] In a variant of the power module bridge according to the invention, a power module bridge is proposed in which the volume enclosed by the frame is filled with gel, so that the power module or modules are completely covered with gel.

[0018] The enclosed volume of the frame refers to the area of ​​the frame's defining structure. The enclosed volume includes the space defined by the outer dimensions of the frame, including the surfaces of the power module, the connection elements, the bonding wires, and other electronic components of the power module. The enclosed volume includes at least one open side.

[0019] In a variant of the power module bridge according to the invention, a power module bridge is proposed in which the gel is a silicone gel. Silicone gel is a semi-solid material that includes a silicone polymer network suspended in a liquid or viscous medium. In the context of the application of the power module bridge according to the present invention, silicone gel has excellent temperature resistance and tolerates thermal stresses when the temperature increases very well without reducing the structural strength or without deformation. Among other things, unlike molding materials, it has high elasticity and flexibility, and therefore can absorb and dissipate thermal stresses without tearing or cracking. Moreover, silicone gel has a relatively low thermal conductivity coefficient, which improves insulation and the demarcation of local temperature differences.

[0020] According to the invention, a method for the manufacture of a power module bridge according to the invention, comprising one or more power modules, a gate printed circuit board, a frame, a gel and one or more connection elements according to one of the preceding forms of the power module bridge according to the invention, is provided, which comprises the following steps: a. providing one or more power modules; b. fastening one or more flexible printed circuit boards to one or more power modules; c. mounting one or more power modules to a gate printed circuit board; d. attaching a frame to the gate printed circuit board around the one or more power modules; e. attaching one or more connection elements to one or more power modules, the one or more connection elements being attached such that each connection element is also fixed to a gate printed circuit board beyond the frame; f. filling the inner area of ​​the frame with gel; A method for the manufacture is proposed which includes:

[0021] The proposed method allows the power module bridge to be integrated in various embodiments, for example in an electric vehicle. Furthermore, a particularly advantageous structure of the power module bridge is achieved by this method, which is formed in such a way that the thermomechanical load of the components of the power module bridge is reduced by eliminating the encapsulation of the power module with a molding compound and by gelling the electronic components in the frame. This reduces, for example, the occurrence of material fatigue and / or crack formation, which leads to a longer service life of the power module bridge. Moreover, by means of, for example, the correct application of cooling measures, the occurring temperature differences can be reduced, which can result in improved structural integrity and service life.

[0022] The method according to the invention is particularly well suited for efficient heat dissipation, for example, since the gel material has excellent thermal properties that allow efficient heat dissipation from the encapsulated components. This allows, for example, the operating temperature of the power module bridge to be optimally maintained. Moreover, the application of the gel provides an effective protective layer for the encapsulated power module components against harmful environmental influences, such as moisture, dust, dirt, or chemicals. Moreover, the gel material may have a shock- and vibration-damping effect by acting like a cushion and protecting the encapsulated power module components from mechanical loads. This is particularly advantageous in applications where electronic components are exposed to vibrations or shocks, such as, for example, in the automotive industry. In addition to this, the gel material offers a relatively high flexibility in comparison with rigid encapsulation materials as well as the ability to adapt to the shape and size of the encapsulated power module components. Moreover, the use of the gel material instead of the rigid encapsulation is less expensive due to the relatively small material requirements and the relatively less laborious processing steps.

[0023] In an advantageous variant of the method according to the invention for the production of a power module bridge, it is proposed that the power module or modules are fastened to the gate printed circuit board by means of a material-bonding joint.

[0024] In a further advantageous variant of the method according to the invention for the production of a power module bridge, it is proposed that the frame is fixed to the gate printed circuit board by gluing or soldering.

[0025] In a further advantageous variant of the method according to the invention for the production of a power module bridge, it is proposed that the fastening of the flexible printed circuit board or boards takes place after the mounting of the frame on the gate printed circuit board.

[0026] In a further advantageous variant of the method according to the invention for the production of a power module bridge, it is proposed that the power module bridge is fastened to a cooling element. According to the present invention, according to a third aspect, a use of a power module bridge in a vehicle is disclosed, the power module bridge serving for current conversion from direct current to alternating current. Advantages of the Invention The solution according to the invention is characterized in that an effective robustness against thermomechanical loads is achieved due to the gel coating of the power modules installed in the power module bridge, and not only that, but by eliminating the molding of the power modules, the risk of cracks is completely avoided.

[0027] Moreover, the solution according to the invention features an uncomplicated method that allows for integration into known power module bridges without interface modifications, eliminating the need for molding of the power module, which can result in additional cost savings.

[0028] A further advantage of the solution according to the invention is that, unlike potted power modules mounted in a power module bridge, the presented solution places no or only very little mechanical stress on the power electronics of the power module, which is achieved by eliminating the molding encapsulation of the power module and instead gel-coating it.

[0029] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the accompanying drawings and the following description. [Brief description of the drawings]

[0030] [Figure 1] FIG. 1 is a schematic plan view of one exemplary embodiment of a power module according to the present invention. [Figure 1.1] FIG. 2 is a schematic diagram of the power module in the Z direction. [Diagram 2] FIG. 2 is a schematic plan view of one exemplary embodiment of a power module according to the present invention with a flexible printed circuit board; [Diagram 3] FIG. 2 is a schematic perspective view of a power module bridge. [Figure 3.1] FIG. 2 is a schematic plan view of a gate printed circuit board with a frame. [Figure 4] FIG. 2 is a schematic perspective view of a power module bridge with a connecting element. [Diagram 5] FIG. 2 is a schematic cross-sectional view of a power module bridge. [Figure 6] FIG. 2 is a schematic diagram of a method for the manufacture of a power module bridge. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0031] In the following description of embodiments of the invention, identical or similar elements are represented by the same reference numerals and individual repeated description of these elements is not provided. The figures only diagrammatically illustrate the subject matter of the invention.

[0032] In the schematic diagram according to Fig. 1, an exemplary embodiment of a power module 100 according to the invention comprises a circuit board 102 with an insulating layer 116 on which a first conductor structure 104, a second conductor structure 105, a third conductor structure 106 and a fourth conductor structure 107 are arranged, all of which conductor structures 104, 105, 106 and 107 have a conductor shape. The conductor structures 104 and 105 each have at least two semiconductor switches 110, whereas the third conductor structure 106 has four semiconductor switches 110. As is evident from Fig. 1, the power module 100 comprises two connection boards 120, which have a number of contact elements 118. Furthermore, Fig. 1 shows the power connection 112 of the semiconductor switches 110 and the connection boards 120 by power bonding wires 112.1. The power connection 112, for example by means of the power bonding wire 112.1, can be established by material bonding, in particular by soldering. The power bonding wire 112.1 comprises, for example, a wire made of gold, aluminum or copper. Furthermore, Fig. 1 includes a directional arrow pointing in the Z direction.

[0033] In the schematic diagram according to Fig. 1.1, an exemplary embodiment includes a view 100.1 in the Z direction of a power module 100 according to Fig. 1. Fig. 1.1 further includes a circuit board 102, which contains three material layers 101, consisting of a first outer circuit board layer 103.1, a middle circuit board layer 103.2 and a second outer circuit board layer 103.3. Fig. 1.1 further includes a connection board 120, which contains three material layers 101, consisting of a first outer connection board layer 120.1, a middle connection board layer 120.2 and a second outer connection board layer 120.3. Fig. 1.1 further shows three spacers 108.1 and 108.2, the outer spacer 108.1 being formed over the semiconductor switch 110 and the spacer 108.2 being shown between the circuit board 102 and the connection board 120.

[0034] For example, when one or more components of the power module 100, such as the semiconductor switch 110, the connection board 120, and the circuit board 102, are heated by heat, the thermal load of these components is effectively removed by the spacers 108.1 and 108.2. For example, the spacers 108.1 and 108.2 can be made of ceramic, plastic, or even metal. The type of the spacers 108.1 and 108.2 in the power module 100 can vary depending on, for example, the size, performance, and surrounding environment. For example, the spacers 108.1 and 108.2 are bonded to the power module components, such as the semiconductor switch 110, the connection board 120, and the circuit board 102, by sintering. Furthermore, the semiconductor switch 110 is bonded to the circuit board 102 by sintering.

[0035] In the schematic diagram according to Fig. 2, an exemplary embodiment of a power module 100 according to the invention comprises a circuit board 102 with an insulating layer 116 on which a first conductor structure 104, a second conductor structure 105, a third conductor structure 106 and a fourth conductor structure 107 are arranged, all of which conductor structures 104, 105, 106 and 107 have a conductor shape. As can be seen from Fig. 2, the power module 100 comprises two connection boards 120, which have a number of contact elements 118. Furthermore, Fig. 2 shows the power connection 112 of the semiconductor switch 110 and the connection boards 120 by means of power bonding wires 112.1. Fig. 2 further shows a flexible printed circuit board 204 with 14 conductor tracks 205, whereby on one connection board 120, seven conductor tracks 205 in each case are connected to the contact elements 118 of the connection board 120, for example via solder joints.

[0036] Alternatively, electrical contact between the flexible printed circuit board 204 and the connecting substrate 120 may be made via a solder joint or an adhesive joint or a plug joint. Alternatively, the contact elements 118 of the connecting substrate 120 may be formed as sockets or plugs.

[0037] 3 shows a schematic perspective view of a power module bridge 300 with a gate PCB 306, a frame 302 made for example from plastic, and three power modules 100 positioned in the frame 302, each with one FPCB 204 fixed thereto. FIG. 3 shows an exemplary orientation of the unfixed portion of the FPCB 204, which is oriented perpendicular or at about 90° to the fixed portion of the FPCB 204 or the power modules 100.

[0038] Instead, the orientation of the flexible printed circuit board 204 can be adapted to the surrounding environment. Figure 3 further shows an area 304 filled with gel 502. The area 304 filled with gel 502 is within a volume 310 enclosed by the frame 302.

[0039] For example, the enclosed volume 310 can be influenced by the outer dimensions of the frame 302, which can be done, for example, by determining the length, width and depth dimensions of the power module 100 that is installed within the frame 302. The frame 302 preferably includes a frame height that is greater than the overall height of the power module 100 and its electronic components, such as the connection board 120 and the power bond wires 112.1.

[0040] In the schematic diagram of FIG. 3.1, a plan view of the gate PCB 306 and the frame 302 are shown. In addition, in FIG. 3.1, the area 304 or enclosed volume 310 to be filled with gel 502 is shown (in plan view). For example, the frame 302 can be mounted at any position on the gate PCB 306, the positioning being variably performed according to the application requirements, for example in an electric vehicle. The frame 302 is for example joined to the gate PCB 306 in a material-bonded manner. Alternatively, the frame 302 can be joined to the gate PCB 306 by screw fastening, bolt fastening, by clip fasteners or by a holding clamp. Depending on the size and shape of the frame 302, the mechanical load, the required stability and the mounting method, a mounting option can be adapted. Depending on the application requirements, the thickness of the frame 302 can also be varied.

[0041] 4 shows a schematic perspective view of a power module bridge 300 with a gate printed circuit board 306, a connection element 402, a frame 302 made, for example, from plastic, and three power modules 100 positioned in the frame 302 and each having one flexible printed circuit board 204 fixed thereto. FIG. 4 shows an exemplary orientation of the free portion of the flexible printed circuit board 204, which is oriented perpendicularly or at about 90° to the fixed portion of the flexible printed circuit board 204 or the power modules 100.

[0042] Instead, the orientation of the flexible printed circuit board 204 can be adapted to the surrounding environment. Fig. 4 further shows an area 304 filled with gel 502. The area 304 filled with gel 502 is within a volume 310 surrounded by the frame 302. A connecting element 402 is connected to the conductor structures 104, 105, 106 beyond the frame 302. The connecting element 402 is, for example, a power transmission rail, which, among other things, comprises a material with high electrical conductivity and has a relatively large cross-section, which facilitates current flow and minimizes resistance.

[0043] In the schematic diagram of Fig. 5, a cross-section of the power module bridge 300 on the cooling element 504 is shown. In this cross-section, the section is through the gate PCB 306, the frame 302 with the frame height 506, the connection element 402, the power module 100 and the flexible printed circuit board 204. In addition, in this cross-section, the area 304 filled with gel 502 can be seen. In Fig. 5, it can be seen that the gel 502 filled in the frame 302 completely encapsulates all the electronic components. Furthermore, the orientation of the flexible printed circuit board 204 in the cross-section of the power module bridge 300 is shown, and it can be seen that the part of the flexible printed circuit board 204 fixed to the power module 100 is completely encapsulated with gel 502.

[0044] As is clear from FIG. 6 , the illustrated exemplary embodiment of a method 600 for the manufacture of a power module bridge 300 according to the present invention includes a first step 602 of preparing one or more power modules 100, a second step 604 of fixing one or more flexible printed circuit boards 204 to the one or more power modules 100, a third step 606 of mounting the one or more power modules 100 to a gate printed circuit board 306, a fourth step 608 of mounting a frame 302 to the gate printed circuit board 306 around the one or more power modules 100, a fifth step 610 of attaching one or more connection elements 402 to the one or more power modules 100, and a sixth step 612 of filling the enclosed area 304 of the frame 302 with a gel 502.

[0045] For example, one or more power modules 100 may be secured to the cooling element 504 by soldering, and then the frame 302 may be secured around the one or more power modules 100 by adhesively attaching.

[0046] The present invention is not limited to the exemplary embodiments described herein and the aspects highlighted therein, but rather is susceptible to numerous variations within the scope of the claims, which are within the skill of the art. [Explanation of symbols]

[0047] 100 Power Module 101 Material layer 102 Circuit Board 103.1 First outer circuit board layer 103.2 Middle circuit board layer 103.3 Second outer circuit board layer 104, 105, 106, 107 Conductor structure 108.1, 108.2 spacer 110 Semiconductor Switch 112 Power connection 112.1 Power Bond Wire 116 Insulating Layer 118 Contact Elements 120 Connection board 120.1 First outer connection substrate layer 120.2 Middle connection layer 120.3 Second outer connection layer 204 Flexible Printed Circuit Board 205 Conductor Path 300 Power Module Bridge 302 Frames 304 Enclosed Areas, Filled Areas 306 Gate Printed Circuit Board 310 Enclosed Volume 402 Connection Element 502 Gel 504 Cooling element 506 Frame Height 600 Method for manufacturing 602 Preparation Steps 604 Fixing Step 606 Installation steps 608 Installation steps 610 Attachable Steps 612 Filling Step

Claims

1. one or more power modules (100), i. one or more circuit boards (102) comprising at least three layers of material (101), a middle circuit board layer (103.2) comprising an insulating material, a first outer circuit board layer (103.1) and a second outer circuit board layer (103.3) comprising conductive material, said outer layers being formed as one or more conductor structures (104, 105, 106); ii. one or more semiconductor switches (110); iii. one or more connection substrates (120) comprising at least three material layers (101), a middle connection substrate layer (120.2) comprising an insulating material, a first outer connection substrate layer (120.1) and a second outer connection substrate layer (120.3) comprising a conductive material, said one or more connection substrates (120) comprising one or more contact elements (118); iv. one or more flexible printed circuit boards (204); v. one or more spacers (108.1, 108.2); One or more power modules (100) having a gate printed circuit board (306), a frame (302) having lateral definitions and an uncovered area (304) towards the top and / or bottom, the volume (310) enclosed by said frame (302) being filled with a gel (502); one or more connection elements (402), One or more power module bridges (300) including: one or more circuit boards (102), one or more semiconductor switches (110), one or more spacers (108.1, 108.2), and one or more connection substrates (120) are bonded to one another by sintering bonding; A power module bridge (300).

2. 2. The power module bridge (300) of claim 1, wherein one or more conductor paths (205) of the one or more flexible printed circuit boards (204) are fixed to the contact elements (118), a portion of the flexible printed circuit board (204) is fixed to one or more connection boards (120) by a material-bonding type joint, and a remaining portion of the flexible printed circuit board (204) is positioned perpendicular to the fixed portion of the flexible printed circuit board (204).

3. The power module bridge (300) of claim 1 or 2, wherein the one or more power modules (100) are positioned within a frame (302).

4. 4. The power module bridge (300) according to claim 1, wherein the frame (302) has a variable frame height (506), the variable frame height (506) being 12 mm, preferably between 2 mm and 7 mm, particularly preferably between 4 mm and 5 mm.

5. 5. The power module bridge (300) of claim 1, wherein the volume (310) enclosed by the frame (302) is filled with the gel (502) such that one or more power modules (100) are completely covered with the gel (502).

6. The power module bridge (300) of any one of claims 1 to 5, wherein the gel (502) is a silicone gel.

7. A method (600) for the manufacture of a power module bridge (300) comprising one or more power modules (100), a gate printed circuit board (306), a frame (302), a gel (502) and one or more connection elements (402) according to any one of claims 1 to 6, comprising the steps of: a. providing (602) one or more power modules (100); b. fastening (604) the one or more flexible printed circuit boards (204) to the one or more power modules (100); c. mounting (606) the one or more power modules (100) to the gate printed circuit board (306); d. attaching (608) a frame (302) to the gate printed circuit board (306) around the one or more power modules (100); e. attaching the one or more connection elements (402) to the one or more power modules (100), the one or more connection elements (402) being attached such that each connection element (402) extends beyond the frame (302) and is also fixed to the gate printed circuit board (306); f. filling (612) the enclosed area (304) of the frame (302) with a gel (502); A method (600) for manufacturing comprising:

8. The method (600) for manufacturing a power module bridge (300) according to claim 7, wherein the one or more power modules (100) are fixed to the gate printed circuit board (306) by a material-bonding type bond.

9. 9. The method (600) for manufacturing a power module bridge (300) according to claim 7 or 8, wherein the frame (302) is fixed to the gate printed circuit board (306) by gluing or soldering.

10. The method (600) for manufacturing a power module bridge (300) according to any one of claims 7 to 9, wherein the fixing (604) of the one or more flexible printed circuit boards (204) is performed after a step (608) of mounting a frame (302) to the gate printed circuit board (306).

11. A method (600) for manufacturing a power module bridge (300) according to any one of claims 7 to 10, wherein said power module bridge (300) is fixed to a cooling element (504).

12. 2. Use of one or more power module bridges (300) in a vehicle, said power module bridges (300) serving for current conversion from direct current to alternating current.

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