Reduced footprint platform architecture with linear vacuum transfer module

Abstract

To provide a variety of substrate processing tool configurations to maximize substrate processing tool density.SOLUTION: An atmospheric-to-vacuum (ATV) transfer module 204 for a substrate processing tool 200-1 includes: a first side that interfaces with at least one loading station 220; a transfer robot 216 disposed within the ATV transfer module; and a second side opposite the first side. The transfer robot transfers substrates between the at least one loading station and at least one load lock 208 disposed between the ATV transfer module and a vacuum transfer module (VTM) 212. The second side interfaces with the at least one load lock. The transfer robot is disposed adjacent to the second side, and the at least one load lock extends through the second side into an interior of the ATV transfer module.SELECTED DRAWING: Figure 2A

Description

[Technical field]

[0001] [CROSS REFERENCE TO RELATED APPLICATIONS] This application claims the benefit of U.S. Provisional Application No. 62 / 471,478, filed March 15, 2017, the entire disclosure of which is incorporated herein by reference.

[0002] The present disclosure relates to substrate processing systems, and more particularly to the configuration of substrate processing tools in substrate processing systems. [Background technology]

[0003] The Background Description provided in this section is provided to provide a general overview of the present disclosure, and the inventions of the currently named inventors are not admitted expressly or impliedly as prior art to the present disclosure to the extent described in this Background section, or to the extent any aspect of the description is not prior art at the time of filing.

[0004] Substrate processing systems may be used to perform deposition, etching, and / or other processing of substrates, such as semiconductor wafers. During processing, the substrate is positioned on a substrate support within a processing chamber of the substrate processing system. A gas mixture including one or more precursors may be introduced into the processing chamber and a plasma may be struck to activate a chemical reaction.

[0005] The substrate processing system may include a number of substrate processing tools arranged in a fabrication chamber. Each substrate processing tool may include a number of processing modules. Typically, a substrate processing tool includes up to six processing modules.

[0006] 1, an overall view of an example of a substrate processing tool 100 is shown. The substrate processing tool 100 comprises a number of processing modules 104. By way of example only, each processing module 104 may be configured to perform one or more respective processes on a substrate. A substrate to be processed is loaded into the substrate processing tool 100 via a port in a loading station of an atmospheric-to-vacuum (ATV) transfer module, such as an equipment front-end module (EFEM) 108, and then transferred into one or more processing modules 104. For example, a transfer robot 112 is arranged to transfer the substrate from the loading station 116 to an airlock 120 or a loadlock 120, and a vacuum transfer robot 124 of a vacuum transfer module 128 is arranged to transfer the substrate from the loadlock 120 to the various processing modules 104. Summary of the Invention

[0007] An atmospheric-to-vacuum (ATV) transfer module of a substrate processing tool includes a first side configured to interface with at least one loading station, a transfer robot assembly disposed within the ATV transfer module, and a second side opposite the first side. The transfer robot assembly is configured to transfer substrates between the at least one loading station and at least one load lock disposed between the ATV transfer module and a vacuum transfer module (VTM). The second side is configured to interface with the at least one load lock. The transfer robot assembly is disposed adjacent to the second side, and the at least one load lock extends through the second side into the interior of the ATV transfer module.

[0008] In other features, at least about 30% of the at least one load lock is located inside the ATV transport module. At least about 50% of the at least one load lock is located inside the ATV transport module. At least about 70% of the at least one load lock is located inside the ATV transport module.

[0009] In other features, the ATV transport module corresponds to a front end of equipment module (EFEM). The at least one load lock comprises a first load lock and a second load lock disposed above the first load lock. The at least one loading station comprises a first loading station and a second loading station disposed above the first loading station. The transport robot assembly is configured to access the first load lock and the second load lock.

[0010] In other features, the ATV transport further comprises a horizontal rail and a vertical rail attached to the horizontal rail. The transport robot assembly is attached to the vertical rail and configured to rise and fall vertically on the vertical rail, and the vertical rail is configured to slide horizontally on the horizontal rail. The transport robot assembly comprises two arms, each arm comprising an arm segment and an end effector. The length of the end effector is greater than the length of the arm segment. The length of the end effector is twice the length of the arm segment. When the transport robot assembly is in a folded state, the arm segments and the end effector are coaxial.

[0011] In other features, the transport robot assembly includes a transport robot platform configured to support the transport robot. The transport robot assembly is configured to raise and lower the transport robot platform to adjust a position of the transport robot platform vertically and to adjust a position of the transport robot platform horizontally. The transport robot assembly includes a first robot positioning arm and a second robot positioning arm configured to adjust a position of the transport robot platform. The transport robot includes an arm having (i) an arm segment and (ii) an end effector.

[0012] In other features, a substrate processing tool includes an ATV transport module and further includes a VTM. The VTM includes a plurality of processing modules, the plurality of processing modules including at least three processing modules disposed on a first side of the VTM and at least three processing modules disposed on a second side of the VTM opposite the first side. The plurality of processing modules includes the processing modules in a vertically stacked configuration.

[0013] Further areas of applicability of the present disclosure will become apparent from the detailed description, the claims, and the drawings. The detailed description and specific examples are for illustrative purposes only and are not intended to limit the scope of the present disclosure. [Brief description of the drawings]

[0014] The present disclosure will become more fully understood from the detailed description and the accompanying drawings, in which:

[0015] The present disclosure will become more fully understood from the detailed description and the accompanying drawings, in which:

[0016] [Figure 1] Examples of substrate processing tools.

[0017] [Figure 2A] FIG. 1 is a plan view showing an example of the configuration of a substrate processing tool including six processing modules. [Figure 2B] FIG. 1 is a plan view showing an example of the configuration of a substrate processing tool including six processing modules. [Figure 2C] FIG. 1 is a plan view showing an example of the configuration of a substrate processing tool including six processing modules. [Figure 2D] FIG. 1 is a plan view showing an example of the configuration of a substrate processing tool including six processing modules.

[0018] [Figure 3A] Example of an equipment front-end module and a transfer robot. [Figure 3B] Example of an equipment front-end module and a transfer robot. [Figure 3C] Example of an equipment front-end module and a transfer robot. [Figure 3D] Example of an equipment front-end module and a transfer robot.

[0019] [Figure 4A] 1 is a side view of an example substrate processing tool.

[0020] [Figure 4B] FIG. 2 is a plan view of an example load lock located within the equipment front end module.

[0021] [Figure 5A] Another example of an equipment front-end module and a transfer robot. [Figure 5B] Another example of an equipment front-end module and a transfer robot. [Figure 5C] Another example of an equipment front-end module and a transfer robot.

[0022] [Figure 6A] FIG. 1 is a plan view showing an example of the configuration of a substrate processing tool including 10 processing modules. [Figure 6B] FIG. 1 is a plan view showing an example of the configuration of a substrate processing tool including 10 processing modules. [Figure 6C] FIG. 1 is a plan view showing an example of the configuration of a substrate processing tool including 10 processing modules.

[0023] In the drawings, reference numbers may be reused to identify similar and / or identical elements. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0024] The number, location, etc. of substrate processing tools within a fabrication chamber may be constrained by the dimensions and respective configurations of the substrate processing tools. Accordingly, the configurations of the substrate processing tools define the tool footprint, spacing, and / or pitch, which in turn define the tool density of the fabrication chamber. Tool density may refer to the number of substrate processing tools and / or processing modules per unit area of ​​the fabrication chamber. Systems and methods according to the principles of the present disclosure provide various substrate processing tool configurations to maximize substrate processing tool density.

[0025] For example, an Equipment Front End Module (EFEM) of a substrate processing tool may include one or more transfer robots for transferring substrates between the EFEM and a load lock located between the EFEM and a vacuum transfer module (VTM). The interior of the EFEM must be of sufficient volume to accommodate the transfer robots. Thus, the load lock is typically located outside the footprint of the EFEM between the Equipment Front End Module (EFEM) and the VTM. Systems and methods according to principles of the present disclosure implement modified airlocks configured to reduce the footprint of the substrate processing tool. In some examples, the EFEM may include a transfer robot having a configuration that allows the airlock to be located at least partially within the EFEM.

[0026] 2A, 2B, 2C, and 2D illustrate plan views of example configurations of a first substrate processing tool 200-1, a second substrate processing tool 200-2, and a third substrate processing tool 200-3 (collectively, substrate processing tools 200) according to the principles of the present disclosure. Each processing tool 200 includes an improved equipment front end module (EFEM) 204 configured to house at least a portion of a load lock 208. That is, the load lock 208 extends into the interior of the EFEM 204, rather than being located outside the EFEM 204 in a gap between the EFEM 204 and a vacuum transport module (VTM) 212. For example, at least about 50% (e.g., 45%-55%) of the entire external length or volume of the load lock 208 may be located within the EFEM 204. In some examples, at least about 70% (e.g., 65%-75%) of the entire external length or volume of the load lock 208 may be located within the EFEM 204. In other examples, at least about 30% (e.g., 25%-35%) of the total external length or volume of the load lock 208 may be located within the EFEM 204. Accordingly, the EFEM 204 may be located closer to the VTM 212, reducing the overall footprint and increasing the pitch of the tool 200. For example, the transfer robot 216 of the EFEM 204 according to the present disclosure may be located closer to the loading station 220 on the front wall (e.g., first side) than on the back wall 224 (e.g., second side) of the EFEM 204 to provide space for the load lock 208 to extend into the interior of the EFEM 204. The EFEM 204 and the transfer robot 216 are described in more detail below in FIG. 3. In some examples, the load lock 208 may be configured as shown in the alternative arrangement of the tool 200-3 in FIG. 2D. By way of example only, the loading station 220 may correspond to a closed airtight transport container (FOUP).

[0027] As shown, tool 200 includes six processing modules 228. However, other configurations of tool 200 may include more than six processing modules 228. For example, the length of VTM 212 may be extended to accommodate additional processing modules 228. Similarly, VTM 212 may include vacuum transfer robots 232 having various configurations. For example, tool 200-1 includes three vacuum transfer robots 232, and tool 200-2 includes two vacuum transfer robots 232. In tools 200-1 and 200-3, the robots 232 are aligned with the central longitudinal axis of VTM 212. In contrast, tool 200-3 includes one vacuum transfer robot 232 that is positioned off-center (i.e., offset to the right or left toward processing module 228) with respect to the central longitudinal axis of VTM 212. That is, the first rotation axis of robot 232 is off-center. Although robot 216 and robot 232 are shown having one or two arms, each may have a configuration with one, two, or more arms. In some examples, robot 232 may have two end effectors 234 on each arm, as shown in Figures 2C and 2D.

[0028] The substrate processing tool 200 may include one or more storage buffers 236 configured to store one or more substrates between processing stages. In some examples, the storage buffer 240 may be located within the VTM 212. In some examples, the one or more storage buffers 236 may be replaced by a processing module or other component.

[0029] In some examples, one or more of the EFEM 204, the load locks 208, the VTMs 212, and the processing modules 228 may have a stacked configuration, which is described in more detail below. For example, each processing module 228 may correspond to two processing modules 228 in a vertically stacked configuration (i.e., one processing module 228 disposed above / below the other), the VTMs 212 may correspond to two VTMs 212 in a vertically stacked configuration, each load lock 208 may correspond to two load locks 208 in a vertically stacked configuration, and each loading station 220 may correspond to two loading stations 220 in a vertically stacked configuration. The height of the EFEM 204 may be increased to allow the robot 216 to ascend and descend to different levels within the EFEM 204 to access multiple levels of the loading stations 220 and the load locks 208.

[0030] 3A, 3B, 3C, and 3D show an example of an EFEM 300 and a transport robot assembly 304 according to the principles of the present disclosure. The assembly 304 may be mounted to one or more vertical rails 308 in the EFEM 300, which in turn may be mounted to horizontal rails 312. The assembly 304 is configured to move up and down the vertical rails 308 in a vertical, Z-direction. For example, the assembly 304 may be mounted in a slot 316 in the vertical rails 308. Conversely, the assembly 304 is configured to slide along the horizontal rails 312 in a horizontal, X-direction relative to the vertical rails 308. In this manner, the position of the assembly 304 may be adjusted in the Z and X directions to provide access to the load locks 320 and loading stations 324 at different heights (i.e., levels).

[0031] In one example, the transport robot assembly 304 includes two arms 328, each including an arm segment 332 and an end effector 336. By way of example only, the end effector 336 may be longer than the arm segment 332. In one example, the length L2 of the end effector 336 is twice the length L1 of the arm segment 332 (e.g., L2=~2*L1). The length L2 of the end effector 336 corresponds to the distance between approximately the center of the substrate support end of the end effector 336 and the axis of rotation of the end effector 336 (i.e., the axis of rotation of the end effector 336 relative to the arm segment 332). The length L1 of the arm segment 332 corresponds to the distance between the axis of rotation of the arm segment 332 (i.e., the axis of rotation of the end effector 336 relative to the arm segment 332) and the axis of rotation of the arm segment 332 relative to the substrate of the transport robot assembly 304. The length L2 of the end effector 336 being longer than the length L1 of the arm segment 332 allows the end effector 336 to access the load lock 320 without the arm segment 332 having to enter the load lock 320 as well.

[0032] When the assembly 304 is in the folded state as shown, it has a relatively narrow profile (e.g., depending on the dimensions of the substrate being transported) relative to the EFEM 300. Accordingly, the EFEM is configured to accommodate at least a portion of the load lock 320. The assembly 304 may include an integrated substrate aligner 340. In this example, when the transport robot assembly 304 is in the folded state shown in FIG. 3C, the longer length L2 of the end effector 336 allows the end effector 336 to be positioned above the substrate aligner 340. For example, the relative lengths of the arm segment 332 and the end effector 336 allow for a relatively linear folded state in which the arm segment 332, the end effector 336, and the substrate aligner 340 are aligned with (i.e., coaxial with) the line 344.

[0033] Each arm 328 may be attached to a respective slot 316 in the longitudinal rail 308. For example, the longitudinal rails 308 may move independently of one another. That is, while the longitudinal rails 308 are shown in a compact arrangement in FIGS. 3A, 3B, and 3C (i.e., the longitudinal rails 308 are relatively close to one another), one of the rails 308 may move to an end of the EFEM 300 opposite the other of the rails 308, as shown in FIG. 3D. In this manner, each arm 328 is configured to simultaneously access different loading stations 324 and / or load locks 320. In other examples, the EFEM 300 may include only one longitudinal rail 308 and each arm 328.

[0034] In some examples, the additional space within the EFEM 300 provided by the configuration of the transport robot assembly 304 may allow additional substrate processing and transport system components to be installed within the EFEM 300. For example, components including, but not limited to, metrology stations, storage buffers, notch alignment stations, edge ring storage, etc. may be located within the EFEM 300. In one example, the transport robot assembly 304 occupies less than 50% of the total depth of the EFEM 300 when in the collapsed state.

[0035] 4A shows a side view of an example substrate processing tool 400 in a double vertically stacked configuration. The substrate processing tool 400 includes an EFEM 404 having an extended height to accommodate a transport robot assembly 408, as described above in FIGS. 3A-3C. The transport robot assembly 408 is configured to be raised and lowered on vertical rails 412 and horizontal rails 416 to access horizontally stacked loading stations 420 and load locks 424. The load locks 424 are located at least partially within the EFEM 404.

[0036] The tool 400 includes vertically stacked VTMs 428. Each VTM 428 includes one or more vacuum transfer robots 432. The vacuum transfer robots 432 are configured to transfer substrates between the load locks 424 and vertically stacked processing modules 436.

[0037] 4B illustrates a top view of an example of a load lock 424 located within the EFEM 404. As shown, more than 70% of the load lock 424's total exterior length (e.g., length L from the first exterior wall 440 to the second exterior wall 444) is located within the EFEM 404. Substrates are transferred from the EFEM 404 to the load lock 424 (e.g., using the transfer robot assembly 408) via a port 448 located within the EFEM 404. Conversely, substrates are transferred from the load lock 424 to the VTM 428 via a port 452. As shown, the load lock 424 includes two loading stations 456, two ports 448, and two ports 452.

[0038] The valve 460 and pump 464 may operate to pump down, maintain the loadlock 424 at a vacuum, purge the loadlock 424, etc. In some examples, the valve 460 connects to the loadlock 424 at an exterior surface of the EFEM 404. In other examples, the valve 460 connects to the loadlock 424 at an interior surface of the EFEM 404.

[0039] 5A, 5B, and 5C show another example of an EFEM 500 and a transport robot assembly 504. For example, the EFEM 500 and the transport robot assembly 504 may be implemented in any of the substrate processing tools 200 of FIGS. 2A-2D. The assembly 504 may be mounted in a front end region of the EFEM 500 (i.e., on the loading station side). For example, the assembly 504 may be coupled to a mounting chassis 508 disposed in the front end region of the EFEM 500. The assembly 504 is configured to raise and lower the transport robot platform 512 in a vertical Z direction and adjust the lateral position of the platform 512 in a horizontal X direction. In this manner, the position of the assembly platform 512 may be adjusted in the Z direction and the X direction to provide access to the load lock 516 and the loading station 520 at different heights (i.e., levels).

[0040] In one example, the transport robot assembly 504 includes two robot positioning arms 524 and 528 configured to function about rotation axes 530 and 532 (which may include corresponding motors) to adjust the position of the platform 512. The platform 512 supports a transport robot 536. The transport robot 536 includes an arm including an arm segment 540 and an end effector 544. The assembly 504 and transport robot 536 have a relatively narrow profile (e.g., depending on the dimensions of the substrate being transported) relative to the EFEM 500 when in a folded state as shown. Accordingly, the EFEM 500 is configured to accommodate at least a portion of the load lock 516 in a manner similar to the EFEM 300 of FIGS. 3A-3D. In some examples, the platform 512 may include an integrated substrate aligner 548. 5A, 5B, and 5C, the end effector 544 is positioned above the substrate aligner 548. The transfer robot 536 has a relatively linear folded state in which the arm segments 540, the end effector 544, and the substrate aligner 548 are aligned with (e.g., coaxial with) line 552.

[0041] In some examples, the additional space within the EFEM 500 provided by the configuration of the transport robot assembly 504 may allow additional substrate processing and transport system components to be located within the EFEM 500. For example, components including, but not limited to, metrology stations, storage buffers, notch alignment stations, edge ring storage, etc. may be located within the EFEM 500. In one example, the transport robot assembly 504 occupies less than 50% of the total depth of the EFEM 500 when in the collapsed state.

[0042] 3A-3D and 5A-5C show EFEM 300 and EFEM 500 positioned to access vertically stacked loading stations and load locks, in other examples, EFEM 300 and EFEM 500 may be implemented in substrate processing tools that do not include a vertically stacked configuration. For example, some substrate processing tools may include loading stations, load locks, and / or processing modules that are located higher on / within the tool and have access slots located higher than the loading stations, load locks, and / or processing modules.

[0043] 6A, 6B, and 6C show plan views of an example configuration of another substrate processing tool 600 according to the principles of the present disclosure. The processing tool 600 includes an enhanced equipment front end module (EFEM) 604 configured to house at least a portion of one or more load locks 608. That is, the load locks 608 extend into the interior of the EFEM 604, rather than being completely outside the EFEM 604 in a gap between the EFEM 604 and a vacuum transfer module (VTM) 612. As a result, the EFEM 604 can be located closer to the VTM 612 while reducing the overall footprint and increasing the pitch of the multiple tools 600. The EFEM 604 can be configured to include, for example, the transport robot assembly 304 of FIGS. 3A-3D, the transport robot assembly 504 of FIGS. 5A-5C, or the like.

[0044] As shown, the tool 600 includes ten processing modules 616. For example, the length of the VTM 612 may be extended to accommodate additional processing modules 616. Similarly, the VTM 612 may include one or more vacuum transfer robots 620 (e.g., transfer robot 620-1, transfer robot 620-2, transfer robot 620-3, transfer robot 620-4, and transfer robot 620-5) having various configurations. As shown, the transfer robot 620 includes one arm 624 with three arm segments 628 and one end effector 632 in each configuration. In other configurations, the transfer robot 620 may include one, two, or more arms 624. In some examples, the robot 620 may include two end effectors 632 on each arm 624.

[0045] As shown in FIG. 6A, the tool 600 includes one vacuum transfer robot 620-1 that is positioned off-center (i.e., offset to the right or left toward the processing module 616) relative to the central longitudinal axis of the VTM 612. That is, the first rotational axis of the robot 620-1 is off-center. The robot 620-1 is positioned and configured to access each of the ten processing modules 616 and the load lock 608. In configurations in which the tool 600 includes a storage buffer 636 and / or a storage buffer 640, the robot 620-1 is also configured to access the storage buffer 636 / 640.

[0046] 6B and 6C, the tool 600 includes two vacuum transfer robots 620-2 and 620-3, or vacuum transfer robots 620-4 and 620-5, each positioned off-center (i.e., offset to the right or left toward the processing modules 616) relative to a central longitudinal axis of the VTM 612. The robots 620-2 and 620-4 are positioned and configured to access selected ones of the ten processing modules 616 and the load lock 608. Conversely, the robots 620-3 and 620-5 are positioned and configured to access the other ones of the ten processing modules 616. In a configuration in which tool 600 includes storage buffer 636 and / or storage buffer 640, robot 620-3 and robot 620-5 are also configured to access storage buffer 636, while both robot 620-2 and robot 620-3 in FIG. 6B, and both robot 620-4 and robot 620-5 in FIG. 6A, are configured to access storage buffer 640.

[0047] For example, as shown in Figure 6B, robot 620-2 is aligned with one of the process modules 616 (e.g., centered on the horizontal axis of one of the process modules 616), while robot 620-3 is centered between adjacent ones of the process modules 616. Conversely, as shown in Figure 6C, robots 620-4 and 620-5 are each aligned with their respective process modules 616.

[0048] The foregoing is merely exemplary in nature and is not intended to limit the disclosure, its application, or uses. The broad teachings of the disclosure may be embodied in various forms. Thus, while the disclosure includes specific examples, other variations will become apparent upon review of the drawings, specification, and claims that follow, and the true scope of the disclosure is not so limited. It should be understood that one or more steps of a method may be performed in different orders (or simultaneously) without altering the principles of the disclosure. Furthermore, although each embodiment is described above as having certain features, one or more of these features described with respect to any embodiment of the disclosure may be implemented in other embodiments and / or in combination with features of other embodiments (even if the combination is not expressly stated). In other words, the described embodiments are not mutually exclusive, and permutations of one or more embodiments with each other remain within the scope of the disclosure.

[0049] Spatial and functional relationships between elements (e.g., between modules, circuit elements, semiconductor layers, etc.) are described using various terms including "connected," "engaged," "coupled," "adjacent," "adjacent," "on," "above," "below," and "disposed." Unless specified as "direct," when a relationship between a first element and a second element is described in the above disclosure, the relationship may be a direct relationship where there are no other intervening elements between the first element and the second element, but it may also be an indirect relationship where there are one or more intervening elements (spatial or functional) between the first element and the second element. In this specification, the expression "at least one of A, B, and C" should be interpreted as meaning logic (A or B or C) with a non-exclusive logical OR, and not as meaning "at least one of A, at least one of B, and at least one of C."

[0050] In some embodiments, the controller is part of a system that may be part of the examples described above. Such systems may include semiconductor processing equipment, including processing tools, chambers, processing platforms, and / or specific processing components (wafer pedestals, gas flow systems, etc.). These systems may be integrated with electronics for controlling operations before, during, and after processing of the semiconductor substrate or substrates. The electronics may be referred to as a "controller" that may control various components or sub-parts of the system. The controller may be programmed to control the processes disclosed herein, including supply of process gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid supply settings, position operation settings, wafer transfer to tools and other transfer tools, and / or load locks connected or interfaced with the specific system, depending on the processing conditions and / or type of system.

[0051] In general, a controller may be defined as an electronic device having various integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operations, enable cleaning operations, enable endpoint measurements, etc. Integrated circuits may include chips in firmware format that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors or microcontrollers that execute program instructions (e.g., software). Program instructions may be instructions communicated to the controller in the form of various personalizations (or program files) that define operational parameters for performing a particular process on or for a semiconductor wafer or for a system. In some embodiments, the operational parameters may be part of a recipe defined by a process engineer to accomplish one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or substrate dies.

[0052] In some embodiments, the controller may be part of or coupled to a computer integrated or coupled with the system, or otherwise networked or combined with the system. For example, the controller may be in the "cloud" or may be all or part of a fab host computer system that allows remote access of substrate processing. The computer may allow remote access to the system to monitor the progress of a fabrication operation, review the history of past fabrication operations, review trends or performance metrics from multiple fabrication operations, modify parameters of a current process, set processing steps following a current process, or start a new process. In some examples, a remote computer (e.g., a server) may provide a process recipe to the system over a network, which may include a local network or the Internet. The remote computer may include a user interface that allows entry or programming of parameters and / or settings that are then communicated from the remote computer to the system. In some examples, the controller receives instructions in the form of data that specify parameters for each processing step to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process being performed and the type of tool the controller is configured to connect to or control. Thus, as discussed above, the controller may be distributed, for example, by including one or more individual controllers networked together and working together toward a common purpose, such as the process or control described herein. An example of a controller distributed for such a purpose would be one or more integrated circuits on the chamber that are located remotely (e.g., at the platform level or as part of a remote computer) and that cooperate to control the process in the chamber.

[0053] Without being limiting, example systems may include plasma etch chambers or modules, deposition chambers or modules, spin rinse chambers or modules, metal plating chambers or modules, clean chambers or modules, bevel edge etch chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etch (ALE) chambers or modules, ion implantation chambers or modules, track chambers or modules, and other semiconductor processing systems that may be related to or used in the fabrication and / or manufacturing of semiconductor substrates.

[0054] As mentioned above, depending on the process steps being performed by the tool, the controller may be in communication with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, nearby tools, tools installed throughout the factory, a main computer, another controller, or tools used to transport materials to and from tool locations and / or load ports in a semiconductor manufacturing factory.

Claims

1. 1. An atmospheric-to-vacuum (ATV) transfer module for a substrate processing tool, comprising: a first side configured to connect with at least one loading station; a transport robot assembly disposed within the ATV transport module, the transport robot assembly configured to transport substrates between the at least one loading station and at least one load lock disposed between the ATV transport module and a vacuum transport module (VTM); a second side opposite the first side and configured to interface with the at least one load lock, the transport robot assembly being disposed adjacent the second side and the at least one load lock extending through the second side into an interior of the ATV transport module; 1. An ATV transport module comprising:

2. 2. The ATV transport module of claim 1, The ATV transport module, wherein at least about 30% of the at least one load lock is located within the interior of the ATV transport module.

3. 2. The ATV transport module of claim 1, The ATV transport module, wherein at least about 50% of the at least one load lock is located within the interior of the ATV transport module.

4. 2. The ATV transport module of claim 1, The ATV transport module, wherein at least about 70% of the at least one load lock is located within the interior of the ATV transport module.

5. 2. The ATV transport module of claim 1, The ATV transport module corresponds to an equipment front-end module (EFEM).

6. 2. The ATV transport module of claim 1, The at least one load lock comprises a first load lock and a second load lock disposed above the first load lock.

7. 7. The ATV transport module of claim 6, The at least one loading station comprises a first loading station and a second loading station disposed above the first loading station.

8. 7. The ATV transport module of claim 6, The ATV transport module, wherein the transport robot assembly is configured to access the first load lock and the second load lock.

9. 2. The ATV transport module of claim 1, further comprising: A horizontal rail and a vertical rail attached to the horizontal rail, The ATV transport module, wherein the transport robot assembly is mounted on the vertical rail and configured to move vertically up and down on the vertical rail, and the vertical rail is configured to slide horizontally on the horizontal rail.

10. 10. The ATV transport module of claim 9, The ATV transport module, wherein the transport robot assembly comprises two arms, each of the arms comprising an arm segment and an end effector, the length of the end effector being greater than the length of the arm segment.

11. 11. The ATV transport module of claim 10, The ATV transport module, wherein the length of the end effector is twice the length of the arm segment.

12. 11. The ATV transport module of claim 10, The ATV transport module, wherein the arm segment and the end effector are coaxial when the transport robot assembly is in a folded position.

13. 2. The ATV transport module of claim 1, The ATV transport module, wherein the transport robot assembly includes a transport robot platform configured to support a transport robot, the transport robot assembly configured to (i) raise and lower the transport robot platform to vertically adjust a position of the transport robot platform, and (ii) horizontally adjust the position of the transport robot platform.

14. 14. The ATV transport module of claim 13, The ATV transport module, wherein the transport robot assembly includes a first robot positioning arm and a second robot positioning arm configured to adjust the position of the transport robot platform.

15. 14. The ATV transport module of claim 13, The transport robot is an ATV transport module comprising: (i) an arm segment and (ii) an arm having an end effector.

16. 1. A substrate processing tool comprising:

2. An ATV transport module according to claim 1, Further, a substrate processing tool comprising said VTM.

17. 17. A substrate processing tool according to claim 16, comprising:

1. A substrate processing tool comprising: a VTM comprising a plurality of processing modules, the plurality of processing modules including at least three processing modules disposed on a first side of the VTM and at least three processing modules disposed on a second side of the VTM opposite the first side.

18. 20. A substrate processing tool according to claim 17, comprising: The substrate processing tool, wherein the plurality of processing modules comprises processing modules in a vertically stacked configuration.

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