Molding device, molding method, and method for manufacturing article

Abstract

To provide a molding device that facilitates peeling a member for molding a composition from a cured composition.SOLUTION: A molding device brings a composition and a molding member for molding a composition discharged onto a substrate 11 into contact with each other to mold the composition. The molding device has a discharge unit that discharges the composition onto the substrate, and a control unit that controls the discharge of the composition performed by the discharge unit. The control unit causes the discharge unit to discharge droplets of the composition into at least one outer peripheral discharge area 36 that is located between an outer edge of the substrate and an outer edge of a molding area on the substrate where the composition is molded, and is connected with the molding area.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a molding apparatus, a molding method, and a method for manufacturing an article. [Background technology]

[0002] As the demand for miniaturization of semiconductor devices advances, in addition to conventional photolithography techniques, microfabrication techniques are attracting attention, in which an uncured composition on a substrate is molded and cured by imprinting with a mold to form a pattern of the composition on the substrate. Such imprinting techniques are called imprinting techniques, and can form fine patterns on the order of several nanometers on a substrate. One imprinting technique is, for example, a photocuring method. An imprinting device that employs the photocuring method imprints with a mold a photocurable composition supplied to a shot area on a substrate, irradiates light to cure the composition, and separates the mold from the cured composition to form a pattern on the substrate. In addition, a technique has been proposed in which a composition is supplied to the entire surface of a substrate, and the entire surface of the substrate is planarized at once with a member having a flat surface, also called a superstrate. The technique disclosed in Patent Document 1 aims to improve the accuracy of planarization by dropping a composition based on the steps of the substrate, and curing the composition in a state where the dropped composition is in contact with a flat template. In addition, a technique has been proposed in which a mold with a pattern formed thereon, rather than a flat template, is imprinted onto a composition on a substrate, thereby forming a pattern on the entire substrate at once.

[0003] In such an apparatus for performing molding processing all at once, a mold with a larger area is used compared to an imprint apparatus that performs processing for each shot area, and the composition must be cured in a state where the composition is in contact with the entire surface of the mold, and then released from the mold, making it difficult to release the mold from the composition. The larger the contact area, the greater the force required to peel it off (mold release force). If a pattern is formed on the mold, the mold release force becomes even greater. For this reason, a technique such as that described in Patent Document 2 has been proposed. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Special Publication No. 2011-529626 [Patent Document 2] Special Publication No. 2022-544891 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in Patent Document 2, a pin is pressed against the outer edge of the mold to apply force to deform the mold and generate a starting point for demolding, which raises concerns that contact between the pin and the mold may result in dust generation or damage to the mold.

[0006] Therefore, an exemplary object of the present invention is to provide a molding device that makes it easy to peel off a member for molding a composition from a cured composition, for example. [Means for solving the problem]

[0007] In order to achieve the above-mentioned object, a molding apparatus as one aspect of the present invention is a molding apparatus that molds a composition by contacting a molding member for molding a composition ejected onto a substrate, and has a discharge section that ejects the composition onto the substrate, and a control section that controls the ejection of the composition by the discharge section, and is characterized in that the control section causes the discharge section to eject droplets of the composition onto at least one peripheral discharge area that is located between the outer edge of a molding area on the substrate where the composition is molded and the outer edge of the substrate and is connected to the molding area. Effect of the Invention

[0008] According to the present invention, it is possible to provide a molding device that makes it easy to peel off a member for molding a composition from the cured composition. [Brief description of the drawings]

[0009] [Figure 1]1 is a schematic diagram showing an example of the configuration of a planarization apparatus according to a first embodiment. [Diagram 2] FIG. 13 is a diagram illustrating a flattening process. [Diagram 3] FIG. 2 is a diagram showing a discharge area of ​​a composition on a substrate. [Figure 4] 4A to 4C are diagrams illustrating an outer peripheral discharge region according to the first embodiment. [Diagram 5] 6A to 6C are diagrams illustrating the peripheral discharge region after hardening according to the first embodiment. [Figure 6] 13A and 13B are diagrams showing an example in which a plurality of outer peripheral discharge regions are configured. [Figure 7] 6 is a diagram showing a cross section of the dashed line portion indicated by AA' in FIG. 5. [Figure 8] 4A to 4C are views illustrating a peeling step according to the first embodiment. [Figure 9] 4 is a flowchart illustrating a flattening process according to the first embodiment. [Figure 10] 6A to 6C are diagrams illustrating a method for discharging a composition according to a second embodiment. [Figure 11] 1A to 1C are diagrams for explaining a method for manufacturing an article. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0011] First Embodiment Hereinafter, a preferred embodiment of the present invention will be described with reference to the accompanying drawings. In this embodiment, a flattening processing apparatus will be used as an example of a molding apparatus. In each drawing, the same members are given the same reference numbers, and duplicated descriptions will be omitted.

[0012] FIG. 1 is a schematic diagram showing a configuration example of a flattening apparatus 100 according to the first embodiment. In this specification and the drawings, directions are shown in an XYZ coordinate system with a horizontal plane as the XY plane. In general, a substrate 11, which is an object to be processed, is placed on a substrate stage 13 so that its surface is parallel to the horizontal plane (XY plane). Therefore, in the following, directions perpendicular to each other in a plane along the surface of the substrate 11 are referred to as the X-axis and Y-axis, and a direction perpendicular to the X-axis and Y-axis is referred to as the Z-axis. In the following, directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are referred to as the X-direction, Y-direction, and Z-direction, respectively, and the rotation direction around the X-axis, the rotation direction around the Y-axis, and the rotation direction around the Z-axis are referred to as the θX-direction, the θY-direction, and the θZ-direction, respectively.

[0013] The planarization apparatus 100 is realized as a molding apparatus that molds a composition on a substrate 11 using a plate 15 (also called a mold, template, or superstrate) having a flat surface, and in this embodiment, flattens the composition on the substrate. The planarization apparatus 100 hardens the composition while the material on the substrate 11 is in contact with the plate 15, and forms a planarization layer (planarization film) made of the material on the substrate 11 by separating the plate 15 from the hardened composition.

[0014] The substrate 11 is typically a silicon wafer, but is not limited thereto. The substrate 11 can be selected from among those known as substrates for semiconductor devices, such as aluminum, titanium-tungsten alloy, aluminum-silicon alloy, aluminum-copper-silicon alloy, silicon oxide, and silicon nitride. The substrate 11 may be a substrate having an adhesion layer formed by surface treatment such as silane coupling treatment, silazane treatment, and organic thin film formation, thereby improving adhesion to the curable composition. The substrate 11 is typically a circle having a diameter of 300 mm, but is not limited thereto.

[0015] The plate 15 may be made of a light-transmitting material in consideration of the light irradiation process. Specific examples of the material for the plate 15 include glass, quartz, light-transmitting resins such as PMMA (Polymethyl methacrylate) and polycarbonate resin, transparent metal deposition films, flexible films such as polydimethylsiloxane, photocured films, metal films, and the like. The plate 15 is preferably a circle with a diameter of more than 300 mm and less than 500 mm, but is not limited thereto. The thickness of the plate 15 is preferably more than 0.25 mm and less than 2 mm, but is not limited thereto. The plate 15 is a member (molding member) for molding the composition discharged onto the substrate.

[0016] The composition may be a curable composition that is cured by irradiation with light, for example, a UV-curable liquid. As the UV-curable liquid, typically, a monomer such as an acrylate or a methacrylate may be used. The curable composition may be called a moldable material. The composition may contain any of a polymerizable compound, a photopolymerization initiator, a non-polymerizable compound, and a solvent, and as the non-polymerizable compound, may contain at least any of a sensitizer, a hydrogen donor, an internal mold release agent, a surfactant, an antioxidant, and a polymer component. The composition of the present embodiment is cured by irradiation with light (ultraviolet light) having a wavelength of, for example, 200 to 380 nm.

[0017] The flattening apparatus 100 includes a substrate chuck 12, a substrate stage 13, a base surface plate 4, a support 5, a top plate 6, a guide bar plate 7, a guide bar 8, a mold driving unit 9, a support 10, a plate chuck 16, a head 17, and an alignment shelf 18. The flattening apparatus 100 also includes a discharge unit 20, an off-axis alignment (OA) scope 21, a substrate transport unit 22, an alignment scope 23, a light source 24, a stage driving unit 31, a plate transport unit 32, and a control unit 200. The substrate chuck 12 and the substrate stage 13 constitute a substrate holding unit that holds the substrate 11, and the plate chuck 16 and the head 17 constitute a plate holding unit (molding member holding unit) that holds the plate 15.

[0018] The substrate 11 to be subjected to planarization is carried in from the outside of the planarization apparatus 100 or from a storage box in which wafers are stored by a substrate transport unit 22 including a transport hand and the like, and is held by the substrate chuck 12. The substrate stage 13 is supported by a base surface plate 4, and is driven in the X-axis direction and the Y-axis direction in order to position the substrate 11 held by the substrate chuck 12 at a predetermined position. The stage driving unit 31 includes, for example, a linear motor or an air cylinder, and drives (moves) the substrate stage 13 at least in the X-axis direction and the Y-axis direction, but may also have a function of driving the substrate stage 13 in two or more axial directions (for example, six axial directions). The stage driving unit 31 also includes a rotation mechanism, and drives (rotates) the substrate chuck 12 and the substrate stage 13 to rotate around an axis parallel to the Z-axis direction.

[0019] The plate 15 is carried in from the outside of the flattening apparatus 100 or from a storage box in which the plate is stored by a plate transport unit 32 including a transport hand and the like, and is held by the plate chuck 16. The plate 15 has, for example, a circular or rectangular outer shape and includes a flat surface on the lower surface. The flat surface has a rigidity such that it comes into contact with the composition on the substrate and follows the surface shape of the substrate 11. The flat surface has the same size as the substrate 11 or a size larger than the substrate 11. The plate chuck 16 is supported by the head 17 and has a function of correcting the inclination of the plate 15 around the Z axis. Each of the plate chuck 16 and the head 17 includes an opening that passes light (ultraviolet light) irradiated from the light source 24 through a collimator lens. In addition, a load cell is arranged on the plate chuck 16 or the head 17 to measure the pressing force (impression force) of the plate 15 against the composition on the substrate.

[0020] Such a plate chuck 16 can adsorb and hold the plate 15, and specifically, an electrostatic chuck mechanism that adsorbs and holds the plate 15 by electrostatic attraction, or a vacuum chuck mechanism that chucks the plate 15 by vacuum suction, etc., can be used. In this embodiment, a description will be given using an example of an electrostatic chuck mechanism.

[0021] A support 5 for supporting a top plate 6 is disposed on the base surface plate 4. A guide bar 8 penetrates the top plate 6, one end of which is fixed to a guide bar plate 7, and the other end of which is fixed to a head 17. The mold driving unit 9 is a mechanism for driving the head 17 in the Z-axis direction via the guide bar 8 to bring the plate 15 held by the plate chuck 16 into contact with the composition on the substrate, or to separate the plate 15 from the composition on the substrate. The mold driving unit 9 also has a function of driving (moving) the head 17 in the X-axis and Y-axis directions, and a function of rotating the plate chuck 16 or the head 17 around an axis parallel to the Z-axis direction. The mold driving unit 9 also has a function of being able to rotate the plate chuck 16 and the head 17 in the Y-axis direction.

[0022] In other words, the control unit 200 controls the stage driving unit 31 and the mold driving unit 9 to adjust the relative positions of the plate 15 held by the plate chuck 16 and the substrate 11 held by the substrate chuck 12 during the planarization process.

[0023] The alignment shelf 18 is suspended from the top plate 6 via the support columns 10. A guide bar 8 passes through the alignment shelf 18. In addition, a height measurement system (not shown) is disposed on the alignment shelf 18 for measuring the height (flatness) of the substrate 11 held by the substrate chuck 12, for example, by using an oblique incidence image shift method.

[0024] The OA scope 21 is supported by the alignment shelf 18. The OA scope 21 detects alignment marks provided in a plurality of shot areas on the substrate 11 and is used in global alignment processing that determines the positions of each of the plurality of shot areas.

[0025] The alignment scope 23 includes an optical system and an imaging system for observing a reference mark provided on the substrate stage 13 and an alignment mark provided on the plate 15. However, if an alignment mark is not provided on the plate 15, the alignment scope 23 may not be necessary. The alignment scope 23 is used for alignment to measure the relative position between the reference mark provided on the substrate stage 13 and the alignment mark provided on the plate 15 and correct the positional deviation. The positional relationship between the plate 15 and the substrate stage 13 is obtained by the alignment scope 23, and the positional relationship between the substrate stage 13 and the substrate 11 is obtained by the OA scope 21, whereby the relative alignment between the plate 15 and the substrate 11 can be performed.

[0026] The discharge unit 20 includes a dispenser including a discharge port (nozzle) for discharging an uncured (liquid) composition onto the substrate 11, and dispenses (supplies) droplets of the composition onto the substrate. The discharge unit 20 employs, for example, a piezo jet system or a micro solenoid system, and can supply droplets of the composition having a minute volume of about 1 pL (picoliter) onto the substrate. The number of discharge ports in the discharge unit 20 is not limited, and may be one (single nozzle) or more than 100. That is, a linear nozzle array may be used, or a combination of multiple linear nozzle arrays may be used. The discharge unit 20 dispenses the composition as multiple droplets so that the composition is disposed on the substrate 11 according to, for example, a drop recipe. The drop recipe is information (map) that indicates the arrangement of droplets of the composition on the substrate. In this embodiment, the discharge unit 20 is provided within the planarization device 100, but may be provided outside the planarization device 100. In this case, the substrate 11 may be provided to the planarization apparatus 100 in a state in which droplets of the composition are disposed on the substrate 8 by the discharge unit 20 .

[0027] The control unit 200 includes a processing unit such as a CPU or other processors, an FPGA, and a storage unit such as a memory, and controls the entire planarization apparatus 100. The control unit 200 controls the discharge unit 20 so that the composition is disposed on the substrate 11 according to a drop recipe that indicates the arrangement of droplets of the composition. The control unit 200 can also store the drop recipe. Furthermore, the control unit 200 may be capable of editing (changing) the drop recipe. The control unit 200 functions as a processing unit that performs planarization processing by comprehensively controlling each unit of the planarization apparatus 100. Here, the planarization processing is a processing that flattens the composition by bringing the flat surface of the plate 15 into contact with the composition on the substrate and making the flat surface conform to the surface shape of the substrate 11. The planarization processing is generally performed on a lot-by-lot basis, that is, for each of a plurality of substrates included in the same lot.

[0028] Next, the planarization treatment will be described with reference to Fig. 2. Fig. 2 is a diagram for explaining the planarization treatment. Here, a treatment will be described in which a composition is dropped onto the entire surface of a substrate, and the composition is brought into contact with a plate having a flat surface to planarize the composition, but the composition on a partial region of the substrate may also be brought into contact with a plate to planarize the composition.

[0029] First, FIG. 2(A) shows a state in which the discharge unit 20 discharges the droplet-shaped composition 14a onto the substrate. As shown in FIG. 2(A), a base pattern 19 is formed on the substrate 11, and the base pattern 19 may have an uneven profile due to a pattern formed in a previous process. The discharge unit 20 drops a plurality of droplet-shaped compositions 14a onto the substrate 11 on which the base pattern 19 is formed. At this time, the discharge amount of the composition is adjusted and supplied based on step information due to a pattern or the like already formed on the substrate 11. FIG. 2(B) shows a state in which the discharge of the droplet-shaped composition 14a onto the base pattern 19 is completed.

[0030] 2(C), the droplet-shaped composition 14a on the substrate is brought into contact with the flat portion 15a of the plate 15. At this time, the plate 15 is released from the plate chuck 16, placed on the droplet-shaped composition 14a, and is further irradiated with light to change into the cured composition 14b. That is, the cured composition 14b is a cured composition.

[0031] Next, as shown in Fig. 2(D), the plate 15 is pulled away (peeled off, separated) from the cured cured composition 14b on the substrate. This allows a planarized layer of the cured composition 14b with a uniform thickness to be formed over the entire surface of the substrate 11. This process is called a peeling process. Fig. 2(D) shows a state in which a planarized layer of the cured composition 14b has been formed on the substrate.

[0032] When carrying out such a planarization process, it is difficult to bring the large-area plate 15 into contact with the composition over the entire surface of the substrate 11 and then peel the composition off over the entire surface. The larger the contact area, the greater the force (peeling force) required to peel the composition off. If the peeling force is too large, the peeling operation itself may not be performed properly, the pattern formed on the substrate may be damaged, or the composition on the substrate may not be planarized properly.

[0033] Next, the process of the flattening device 100 in this embodiment will be specifically described with reference to Figs. 3 to 9. Fig. 3 is a diagram showing the discharge area of ​​the composition on the substrate. This figure shows the state in which the droplet composition 14a is discharged onto the substrate 11, as viewed from a direction perpendicular to the surface of the substrate 11 (Z+ direction). The discharge area 35 of the droplet composition 14a is a circular area centered on the center of the substrate. The diameter of the circular discharge area 35 is smaller than the diameter of the substrate 11, and a clearance is formed between the substrate outer edge 11a and the discharge area outer edge 35a. Here, the substrate outer edge 11a can also be referred to as the outer edge (outer periphery) of the substrate 11, and the discharge area outer edge 35a can also be referred to as the outer edge (outer periphery) of the discharge area 35.

[0034] A method for discharging the composition according to the first embodiment and a region to which the composition is discharged will be described with reference to FIG. 4. FIG. 4 is a diagram for explaining the peripheral discharge region according to the first embodiment. FIG. 4(A) is a diagram showing an example of the peripheral discharge region 36 in this embodiment. In this embodiment, in the process of discharging the droplet-shaped composition 14a by the discharge unit 20 described in FIG. 2(A), droplets of the droplet-shaped composition 14a are discharged to the discharge region 35 and the peripheral discharge region 36. Specifically, between the discharge region outer edge 35a of the discharge region 35 formed in a circular shape and the substrate outer edge 11a, a protruding shape (peripheral discharge region 36) protruding toward the substrate outer edge 11a so as to be continuous from the discharge region outer edge 35a is formed. In other words, the peripheral discharge region 36 is a region connected to the discharge region 35.

[0035] The control unit 200 causes the discharge unit 20 to discharge the droplet-shaped composition 14a onto the discharge region 35 and the outer circumferential discharge region 36 in accordance with the drop recipe.

[0036] 4B is an enlarged view of the outer peripheral discharge region 36. Here, as an example, the outer peripheral discharge region 36 is triangular, but the outer peripheral discharge region 36 may be, for example, rectangular or semicircular in shape or shape with an arc-shaped periphery. By changing the arrangement of the droplets of composition 14a discharged onto the substrate, i.e., by changing the drop recipe, the shape of the outer peripheral discharge region 36 can be changed to any shape.

[0037] FIG. 5 is a diagram illustrating the peripheral discharge region 36 after curing according to the first embodiment. Specifically, this figure shows the state of the composition when it is contacted with the plate 15 from the state of FIG. 4(B) and cured. By contact with the plate 15 and the curing process of irradiating light as described in FIG. 2(C), the discharged droplet composition 14a spreads, the discharge region 35 becomes a cured region 35', and the peripheral discharge region 36 becomes a peripheral cured region 36' while maintaining its shape. That is, the droplet composition 14a discharged on the discharge region 35 is shaped to become a flattened film. That is, it can be said that the discharge region 35 is a shaping region where the composition is shaped. The peripheral discharge region 36 is a region connected to the discharge region 35 as described above. The discharge unit 20 discharges the droplet composition 14a to a position of the peripheral discharge region 36 where at least the cured composition 14b (peripheral cured region 36') is connected to the cured composition 14b (cured region 35') on the discharge region 35. Then, the droplet-like composition 14a discharged into the outer peripheral discharge area 36 spreads upon contact with the plate 15, forming a protruding cured composition 14b (outer peripheral cured area 36') that is continuous (connected) from the outer edge 35a of the discharge area.

[0038] It should be noted that a plurality of outer peripheral discharge regions 36 may be configured. Fig. 6 is a diagram showing an example in which a plurality of outer peripheral discharge regions 36 are configured. Fig. 6(A) is a diagram showing one example in which a plurality of outer peripheral discharge regions 36 are configured. As shown in this figure, a plurality of outer peripheral discharge regions 36 may be configured adjacent to each other. Fig. 6(B) is a diagram showing another example in which a plurality of outer peripheral discharge regions 36 are configured. As shown in Fig. 6(B), the outer peripheral discharge regions 36 may be configured at four locations where the X-axis and Y-axis intersect with the discharge region outer edge 35a.

[0039] The peeling process of the plate 15 and the substrate 11 in this embodiment will be described in detail with reference to Figures 7 and 8. Figure 7 is a cross-sectional view of the dashed line portion indicated by A-A' in Figure 5. This figure shows the state before the start of the peeling process, in which the composition on the plate 15 and the substrate are brought into contact with each other and cured.

[0040] In order to perform the peeling, it is necessary to apply an external force to the plate 15 or the substrate 11 to generate a peeling starting point. As a method of applying an external force, for example, there is a method of deforming the outer periphery of the plate 15 or the substrate 11. As a mechanism for deforming the outer periphery of the plate 15, there is a plate chuck 16 as shown in FIG. 7. The plate chuck 16 shown in FIG. 7 holds the plate 15 by supplying negative pressure to a plurality of regions formed by a plurality of concentric lands. Among the plurality of concentric lands, the outermost land 16b located on the outermost periphery is configured to be lower in height than the inner land 16a located on the inner side. By supplying negative pressure to the region formed by the outermost land 16b, the inner land 16a, and the plate 15 through a flow path not shown in the figure and adsorbing the plate 15, it is possible to deform the outer periphery of the plate 15. Similarly, with respect to the outer periphery deformation mechanism of the substrate 11, it is possible to deform the outer periphery of the substrate 11 by lowering the outermost land 12b of the substrate chuck 12 lower than the inner land 12a, supplying negative pressure, and adsorbing the substrate 11. The above-mentioned deformation method is an example, and plate 15 or substrate 11 may be deformed by other methods. For example, the chuck itself may be deformed. Another method of applying an external force is to tilt plate 15 by tilting head 17 itself, which holds plate chuck 16.

[0041] Next, a specific peeling step according to this embodiment will be described with reference to FIG. 8. FIG. 8 is a diagram for explaining the peeling step according to the first embodiment. FIG. 8(A) is a diagram showing a state in which at least a part of the outer periphery of the plate 15 is deformed, and peeling of the cured composition 14b including the cured region 35' and the outer periphery cured region 36' and the plate 15 has begun. When the outer periphery of the plate 15 is deformed in the Z+ direction (upward in the figure) by applying negative pressure to the region 16c, a force is generated in the direction in which the cured composition 14b is peeled off. At this time, the force due to the deformation is concentrated on the outer periphery cured region 36', which is a protruding portion, so that a crack is generated between the plate 15 and the end 37 of the outer periphery cured region 36', and the crack becomes the starting point of separation, and the plate 15 and the composition on the substrate 11 can be easily separated.

[0042] Fig. 8(B) is a diagram showing a state in which the outer periphery of the substrate 11 is deformed and peeling of the cured composition 14b and the plate 15 has begun. As in the case of deforming the plate 15, by deforming at least a part of the outer periphery of the substrate 11 in the Z-direction (downward in the figure), force is concentrated on the end 37 of the outer periphery hardened region 36', causing cracks, which makes it possible to easily peel them off. Note that in Figs. 8(A) and 8(B), the plate 15 and the substrate 11 are deformed at different times, but they may be deformed at the same time.

[0043] 9 is a flowchart illustrating the flattening process according to the first embodiment. Each operation (step) shown in this flowchart can be executed under the control of the control unit 200.

[0044] In step S01, the control unit 200 causes the substrate transport unit 22 to carry the substrate 11 into the planarization apparatus 100 and place it on the substrate chuck 12. Next, in step S02, the discharge unit 20 supplies droplet-shaped composition 14a to the discharge region 35 and the peripheral discharge region 36.

[0045] After the composition has been discharged, in step S03, the plate 15 is brought into contact with the discharged composition, and then in step S04, the composition is irradiated with curing light (ultraviolet rays) from the light source 24 through the plate 15 to cure the composition.

[0046] Next, in step S05, the outer periphery of plate 15 or substrate 11 is deformed using plate chuck 16 or substrate chuck 12, and a peeling force is applied between plate 15 and cured composition 14b. The applied peeling force causes cracks between the edge of peripheral hardened region 36' and plate 15, and peeling begins.

[0047] In the next step S06, head 17 is raised to complete peeling of the entire contact surface between plate 15 and cured composition 14b. In the next step S07, substrate 11 is removed, and the planarization process is completed.

[0048] In this embodiment, the outer peripheral discharge region 36 is shown as a triangular shape with the apex facing the outer edge 11a of the substrate as an example. As described above, this shape is not limited to a triangular shape, and may be, for example, a rectangular shape or a shape with an arc-shaped periphery. When the outer peripheral discharge region 36 is triangular, it has an acute corner, which is advantageous in that cracks are likely to occur between the end of the outer peripheral hardened region 36' and the plate 15 in the peeling process. On the other hand, when the outer periphery of the outer peripheral discharge region 36 is arc-shaped, it is possible to reduce the amount of the cured composition 14b (outer peripheral hardened region 36') of the outer peripheral discharge region 36 remaining on the plate 15 side. The shape of the outer peripheral discharge region 36 may be changed depending on the thickness of the cured composition 14b.

[0049] Furthermore, increasing the density of the droplet-like composition 14a discharged onto the outer edge of the peripheral discharge region 36 is advantageous in that cracks are more likely to occur between the end of the peripheral hardened region 36' and the plate 15 during the peeling process. Furthermore, if the peripheral discharge region 36 has a triangular or rectangular shape with corners, the density of the droplet-like composition 14a discharged onto the corners of the peripheral discharge region 36 is increased. This is even more advantageous in that cracks are more likely to occur between the end of the peripheral hardened region 36' and the plate 15 during the peeling process.

[0050] The outer edge 11a of the substrate and the outer periphery of the plate 15 may have a curved surface or a tapered shape in which the thickness decreases toward the outer edge. For this reason, it is preferable to make the density of the droplet-shaped composition 14a disposed in the outer peripheral discharge region 36 higher than the density of the droplet-shaped composition 14a disposed in the discharge region 35.

[0051] As described above, according to this embodiment, in a molding apparatus that performs molding processes all at once, such as a flattening apparatus, it becomes possible to easily peel off a molded member from a cured composition.

[0052] <Second embodiment> Next, a second embodiment of the present invention will be described. Note that the description of the same contents as in the first embodiment will be omitted, and the characteristic parts of the second embodiment will be mainly described.

[0053] Fig. 10 is a diagram for explaining a composition ejection method according to the second embodiment. Fig. 10(A) shows the position of the peripheral ejection region 36 in planarization treatment of a substrate 11 (first substrate). Fig. 10(B) shows the position of the peripheral ejection region 36 in planarization treatment of a substrate 11' (second substrate) different from that in Fig. 10(A). In the planarization treatment of the substrate 11', the peripheral ejection region 36 is formed at a position different from that of the substrate 11.

[0054] As described above, the planarization process is generally performed on a lot-by-lot basis, that is, on each of the multiple substrates included in the same lot. In this embodiment, the formation position of the peripheral discharge region 36 is changed sequentially as the substrate on which the planarization process is performed is replaced. Note that the position of the peripheral discharge region 36 may be changed as appropriate for each substrate to be processed, or the position may be changed after multiple substrates have been processed, that is, after each predetermined number of substrates.

[0055] By carrying out such a process, even if the curable composition 14b on the outer peripheral discharge region 36 remains on the plate 15 side during the peeling process, it is possible to reduce the concentration and accumulation of the curable composition 14b in one place on the plate 15 side.

[0056] <Specific application examples of molding equipment> The above-mentioned molding device may be an imprinting device that transfers the pattern of a mold to the imprinting material, which is a composition on a substrate, by contacting the imprinting material with a mold having a concave-convex pattern. In the imprinting device, imprinting can be performed for each of a plurality of shot areas formed on the substrate. Alternatively, in the imprinting device, imprinting (i.e., contact) can be performed collectively for a plurality of shot areas of the substrate (over the entire substrate, or in units of one or more rows of shot areas). In the case of such collective imprinting, a large mold release force is required, and therefore each of the above-mentioned embodiments is particularly suitable.

[0057] <Embodiment of the article manufacturing method> The pattern of the cured product formed by using the imprinting apparatus is used permanently on at least a part of various articles, or temporarily when manufacturing various articles. The articles include electric circuit elements, optical elements, MEMS, recording elements, sensors, and molds. Examples of the electric circuit elements include volatile or non-volatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensors, and FPGA. Examples of the molds include molds for imprinting.

[0058] The pattern of the cured product is used as it is as at least a part of a component of the article, or is used temporarily as a resist mask, which is removed after etching or ion implantation in a substrate processing step.

[0059] Next, a specific method for manufacturing the article will be described. As shown in Fig. 11(A), a substrate 1z such as a silicon wafer having a workpiece 2z such as an insulator formed on its surface is prepared, and then an imprint material 3z is applied to the surface of the workpiece 2z by an inkjet method or the like. Here, a state in which the imprint material 3z in the form of multiple droplets is applied onto the substrate is shown.

[0060] As shown in Fig. 11(B), the imprinting mold 4z is placed facing the imprinting material 3z on the substrate with the side on which the concave-convex pattern is formed. As shown in Fig. 11(C), the substrate 1z to which the imprinting material 3z has been applied is brought into contact with the mold 4z, and pressure is applied. The imprinting material 3z fills the gap between the mold 4z and the workpiece 2z. When light is irradiated through the mold 4z in this state as hardening energy, the imprinting material 3z hardens.

[0061] 11(D), after the imprint material 3z is cured, the mold 4z and the substrate 1z are separated, and a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. In this cured product pattern, the recesses of the mold correspond to the protrusions of the cured product, and the protrusions of the mold correspond to the recesses of the cured product, i.e., the recessed and protruding pattern of the mold 4z is transferred to the imprint material 3z.

[0062] As shown in Fig. 11(E), when etching is performed using the pattern of the cured material as an etching-resistant mask, the portion of the surface of the workpiece 2z where there is no cured material or where only a thin layer remains is removed, forming a groove 5z. As shown in Fig. 11(f), when the pattern of the cured material is removed, an article having grooves 5z formed on the surface of the workpiece 2z can be obtained. Here, the pattern of the cured material is removed, but it may be used as an interlayer insulating film included in a semiconductor element or the like, that is, a component of an article, without being removed after processing. Although the example has been described in which a mold for transferring a circuit pattern provided with a concave-convex pattern is used as the mold 4z, a member having a flat surface without a concave-convex pattern (flat template) may also be used.

[0063] <Other embodiments> Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention.

[0064] The present invention can also be realized by a process in which a program for implementing one or more of the functions of the above-described embodiments is supplied to a system or device via a network or a storage medium, and one or more processors in a computer of the system or device read and execute the program. The present invention can also be realized by a circuit (e.g., ASIC) for implementing one or more of the functions.

[0065] The disclosure of this embodiment includes the following configuration. (Configuration 1) A molding apparatus for molding a composition by contacting a molding member for molding a composition discharged onto a substrate with the composition, the molding apparatus comprising: a discharge unit that discharges the composition onto the substrate; a control unit that controls the discharge of the composition by the discharge unit, A molding apparatus characterized in that the control unit causes the ejection unit to eject droplets of the composition onto at least one peripheral ejection area that is located between the outer edge of a molding area on the substrate where the composition is molded and the outer edge of the substrate and is connected to the molding area.

[0066] (Configuration 2) The molding device described in configuration 1, characterized in that the control unit causes the discharge unit to discharge the droplets at a position in the outer peripheral discharge area where at least the composition after hardening connects with the composition on the molding area.

[0067] (Configuration 3) The molding apparatus according to configuration 1 or 2, characterized in that the control unit is capable of changing the shape of the outer peripheral discharge area to any shape by changing the arrangement of the droplets of the composition discharged onto the substrate.

[0068] (Configuration 4) The molding apparatus according to any one of configurations 1 to 3, wherein the control unit increases the density of the droplets disposed on the outer edge of the outer peripheral discharge area.

[0069] (Configuration 5) The molding device according to any one of configurations 1 to 4, wherein the control unit sets the density of the droplets placed in the outer peripheral discharge area to be higher than the density of the droplets placed in the molding area.

[0070] (Configuration 6) A substrate holder for holding the substrate; a molded member holding portion for holding the molded member, The molding apparatus according to any one of configurations 1 to 5, wherein the substrate holding unit and the molded member holding unit start peeling the molded member from the composition by deforming at least a portion of the outer periphery of the substrate or the molded member after the composition has hardened.

[0071] (Configuration 7) The molding apparatus according to any one of configurations 1 to 6, wherein the outer peripheral discharge area has a triangular shape.

[0072] (Configuration 8) The molding apparatus according to any one of configurations 1 to 6, wherein the outer peripheral discharge area has a rectangular shape.

[0073] (Configuration 9) The molding apparatus according to any one of configurations 1 to 6, wherein the outer peripheral discharge region has an arc-shaped outer periphery.

[0074] (Configuration 10) The molding apparatus according to any one of configurations 1 to 9, wherein the control unit changes a formation position of the outer circumferential discharge region for each predetermined number of the substrates to be processed.

[0075] (Configuration 11) The molding member is a superstrate having a planar portion, The molding apparatus according to any one of configurations 1 to 10, characterized in that the molding apparatus is a planarization apparatus that forms a planarized film of the composition on the substrate by contacting the planar portion of the superstrate with the composition.

[0076] (Configuration 12) The molding member is a mold having a pattern, The molding apparatus described in any one of configurations 1 to 10, characterized in that the molding apparatus is an imprint apparatus that forms a pattern of the composition by simultaneously contacting the pattern of the mold with the composition on multiple shot areas of the substrate.

[0077] (Molding method) A molding method for molding a composition by contacting a molding member for molding a composition discharged onto a substrate with the composition, comprising the steps of: A molding method, comprising ejecting droplets of the composition onto at least one peripheral ejection area that is located between an outer edge of a molding area on the substrate where the composition is molded and an outer edge of the substrate and is connected to the molding area.

[0078] (Article manufacturing method) Molding a composition on a substrate using a molding apparatus according to any one of configurations 1 to 12; and processing the substrate that has been subjected to the molding step, A method for manufacturing an article, comprising the steps of: manufacturing an article from the substrate that has been subjected to the processing step. [Explanation of symbols]

[0079] 11 Substrate 14a Droplet composition 14b Curing composition 15 Plate 20 Discharge part 35 Discharge area 36 Outer discharge area 100 Flattening device 200 Control section

Claims

1. A molding apparatus for molding a composition by contacting a molding member for molding a composition discharged onto a substrate with the composition, the molding apparatus comprising: a discharge unit that discharges the composition onto the substrate; a control unit that controls the discharge of the composition by the discharge unit, A molding apparatus characterized in that the control unit causes the ejection unit to eject droplets of the composition onto at least one peripheral ejection area that is located between the outer edge of a molding area on the substrate where the composition is molded and the outer edge of the substrate and is connected to the molding area.

2. The molding device according to claim 1 , wherein the control unit causes the discharge unit to discharge the droplets at a position in the outer peripheral discharge area where at least the composition after hardening connects with the composition on the molding area.

3. The molding apparatus according to claim 1 , wherein the control unit is capable of changing the shape of the outer peripheral discharge area to any shape by changing the arrangement of the droplets of the composition discharged onto the substrate.

4. The molding apparatus according to claim 1 , wherein the control unit increases the density of the droplets disposed on the outer edge of the outer circumferential discharge region.

5. The molding device according to claim 1 , wherein the control unit makes the density of the droplets disposed in the outer peripheral discharge region higher than the density of the droplets disposed in the molding region.

6. A substrate holder for holding the substrate; a molded member holding portion for holding the molded member, The molding apparatus of claim 1, characterized in that the substrate holding unit and the molded member holding unit begin to peel the molded member from the composition by deforming at least a portion of the outer periphery of the substrate or the molded member after the composition has hardened.

7. 2. The molding apparatus of claim 1, wherein the peripheral discharge area is triangular in shape.

8. 2. The molding apparatus according to claim 1, wherein the outer peripheral discharge area is rectangular in shape.

9. 2. The molding apparatus according to claim 1, wherein the outer peripheral discharge area has an arc-shaped outer periphery.

10. 2. The molding apparatus according to claim 1, wherein the control unit changes a formation position of the outer circumferential discharge region for each predetermined number of the substrates to be processed.

11. The molding member is a superstrate having a planar portion, The molding apparatus according to claim 1 , wherein the molding apparatus is a planarizing apparatus that forms a planarized film of the composition on the substrate by contacting the planar portion of the superstrate with the composition.

12. The molding member is a mold having a pattern, The molding apparatus according to claim 1, wherein the molding apparatus is an imprint apparatus that forms a pattern of the composition by simultaneously contacting the pattern of the mold with the composition on multiple shot areas of the substrate.

13. A molding method for molding a composition by contacting a molding member for molding a composition discharged onto a substrate with the composition, comprising the steps of: A molding method, comprising ejecting droplets of the composition onto at least one peripheral ejection area that is located between an outer edge of a molding area on the substrate where the composition is molded and an outer edge of the substrate and is connected to the molding area.

14. Molding a composition on a substrate using a molding apparatus according to any one of claims 1 to 12; and processing the substrate that has been subjected to the molding step, A method for manufacturing an article, comprising the steps of: manufacturing an article from the substrate that has been subjected to the processing step.

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