Component mounting system and component mounting method

Abstract

To provide a component mounting system capable of properly capturing a target on a circuit board even when the circuit board has a warp, and a component mounting method.SOLUTION: The component mounting method includes the steps of: measuring the height of multiple measurement positions on a circuit board (ST3); obtaining the warpage data (estimated height) of the circuit board based on the measured height of multiple measurement positions (ST7); adjusting the focal length of the imaging means based on the obtained warpage data (ST8, ST9); and capturing the mounting position of the component on the circuit board by the imaging means before mounting the component on the circuit board (ST10).SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present invention relates to a component mounting apparatus and a component mounting method for mounting components on a board. [Background technology]

[0002] When a component mounting device mounts a component on a board, the component may accidentally fall onto the board. If a component is mounted when there is a foreign object, such as a component, at the mounting position on the board, there is a risk of the component not being mounted properly on the board, resulting in a mounting error. Therefore, immediately after the board is loaded or immediately before component mounting, the mounting position on the board is inspected for foreign objects, and components are mounted only after confirming that there are no foreign objects. Patent Document 1 discloses a component mounting device (surface mounter) that determines the presence or absence of foreign objects by comparing a reference image of the mounting position, which is captured in advance by a board recognition camera and shows no foreign objects, with an image of the mounting position captured immediately before component mounting. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-60249 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the prior art including Patent Document 1, when a board held at the mounting position of a component mounting device has upward or downward warpage, the distance between the board recognition camera and the mounting position on the board deviates from the focal length of the board recognition camera, resulting in a blurred image and making it impossible to correctly determine whether or not a foreign object is present. Also, when the imaging range on the board is larger than the field of view of the board recognition camera, it is necessary to move the board recognition camera and take images of the board multiple times, but when the board has upward or downward warpage, there is a problem in that a difference in blur occurs between the captured images and it may be impossible to correctly combine the images.

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a component mounting apparatus and a component mounting method that are capable of properly capturing an image of an object to be captured on a board even if the board is warped. [Means for solving the problem]

[0006] The component mounting apparatus of the present invention comprises an imaging means for imaging the mounting position of a component on a board before the component is mounted on the board, a height measuring means for measuring heights of a plurality of measurement positions on the board, a warpage data acquiring means for acquiring warpage data of the board based on the heights of the plurality of measurement positions measured by the height measuring means, and a focal length adjusting means for adjusting the focal length of the imaging means based on the warpage data acquired by the warpage data acquiring means.

[0007] The component mounting method of the present invention measures the heights of a plurality of measurement positions on the board, acquires warpage data of the board based on the measured heights of the plurality of measurement positions, adjusts the focal length of an imaging means based on the acquired warpage data, and images the mounting positions of the components on the board using the imaging means before mounting the components on the board. [Effects of the Invention]

[0008] According to the present invention, it is possible to properly capture an image of an object on a substrate even if the substrate is warped. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view of a component mounting apparatus according to an embodiment of the present invention; [Figure 2] FIG. 1 is a diagram illustrating the configuration of a component mounting device according to an embodiment of the present invention; [Figure 3] FIG. 1 is a diagram illustrating the configuration of a board recognition camera provided in a component mounting apparatus according to an embodiment of the present invention; [Figure 4] FIG. 1 is a block diagram showing the configuration of a control system of a component mounting apparatus according to an embodiment of the present invention. [Figure 5]FIG. 1 is an explanatory diagram of an example of a measurement position set on a board to measure the warpage of the board by a component mounting device according to an embodiment of the present invention; [Figure 6] FIG. 1 is a diagram illustrating the relationship between the warp of a board held by a component mounting apparatus according to an embodiment of the present invention and the subject distance of a board recognition camera. [Figure 7] FIG. 10 is an explanatory diagram of an example of focal length adjustment data used in a component mounting device according to an embodiment of the present invention. [Figure 8] 1 is a flow diagram of a component mounting method according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0010] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanation purposes and can be modified as appropriate depending on the specifications of the component mounting device, board recognition camera, and height sensor. In the following, corresponding elements in all drawings will be given the same reference numerals, and duplicated explanations will be omitted. In FIG. 1 and in some parts described below, two axes that are orthogonal to each other in a horizontal plane are shown: the X-axis in the board transport direction (the left-right direction in FIG. 1) and the Y-axis that is orthogonal to the board transport direction (the up-down direction in FIG. 1). In FIG. 2 and in some parts described below, the Z-axis (the up-down direction in FIG. 2) is shown as the height direction that is orthogonal to the horizontal plane.

[0011] First, the configuration of the component mounting apparatus 1 will be described with reference to Figures 1 and 2. Note that Figure 2 schematically shows a part of the component mounting apparatus 1 in Figure 1. The component mounting apparatus 1 has the function of performing component mounting work, which involves attaching components supplied from a component supply unit to a board. A board transport mechanism 2 is arranged along the X-axis in the center of the base 1a. The board transport mechanism 2 transports a board 3 transported from upstream to a mounting work position, positions it, and holds it. In addition, the board transport mechanism 2 transports the board 3 downstream after the component mounting work has been completed.

[0012] Component supply units 4 are arranged on both sides (front and back along the Y axis) of the board transport mechanism 2. Each component supply unit 4 has multiple tape feeders 5 attached in parallel along the X axis. The tape feeders 5 pitch-feed a component tape formed with pockets for storing components D in a direction (tape feed direction) from the outside of the component supply unit 4 toward the board transport mechanism 2, thereby supplying components D to a component supply position from which the components D are picked up by a mounting head, which will be described below.

[0013] 1 and 2, a Y-axis table 6 equipped with a linear drive mechanism is arranged along the Y-axis at both ends in the X-axis direction on the top surface of the base 1a. A beam 7, similarly equipped with a linear drive mechanism, is connected to the Y-axis table 6 so as to be movable along the Y-axis. The beam 7 is arranged along the X-axis. A plate 7a is attached to the beam 7 so as to be movable along the X-axis. A mounting head 8 is attached to the plate 7a. The mounting head 8 is a multiple head equipped with multiple (four in this case) holding heads 9. Note that the number of holding heads 9 equipped on the mounting head 8 is not limited to four. The mounting head 8 may also be a rotary head in which multiple suction nozzles 10 are arranged concentrically.

[0014] 2, a suction nozzle 10 that picks up and holds a component D on a suction surface 10a is attached to the lower end of each holding head 9. Each holding head 9 is equipped with a nozzle lifting mechanism 11 that raises and lowers the suction nozzle 10 up and down (vertical direction), and a nozzle rotation mechanism (not shown) that rotates the suction nozzle 10 by θ around a vertical axis (Z axis). The holding head 9 rotates the suction nozzle 10 by a predetermined rotation angle using the nozzle rotation mechanism, and then lowers it to a predetermined mounting height in the Z direction using the nozzle lifting mechanism 11 (arrow a), and places the component D held by the suction nozzle 10 at a mounting position P on the upper surface 3b of the board 3.

[0015] 1, the Y-axis table 6 and the beam 7 constitute a head movement mechanism 12 that moves the mounting head 8 in the X-axis and Y-axis directions. The head movement mechanism 12 and the mounting head 8 perform a mounting turn in which the component D is picked up by the suction nozzle 10 from the component supply position of the tape feeder 5 arranged in the component supply unit 4, removed, and mounted at the mounting position P of the board 3 positioned by the board transport mechanism 2. In other words, the Y-axis table 6, the beam 7, and the mounting head 8 constitute a component mounting means that holds the component D supplied to the component supply position of the tape feeder 5 by the suction nozzle 10 and mounts it on the board 3.

[0016] Here, the detailed configuration of the substrate transport mechanism 2 will be described with reference to Figure 2. In the substrate transport mechanism 2, a pair of transport conveyors 14 are installed inside a pair of plate-like members 13 extending along the X-axis. The transport conveyor 14 supports both ends of the substrate 3 from below and transports it along the X-axis by a transport belt driven by a motor (not shown). A pressure plate 15 (see also Figure 1) that protrudes above the transport conveyor 14 is installed at the upper end of each of the pair of plate-like members 13. The distance between the lower surface of the pressure plate 15 and the upper surface of the transport conveyor 14 is wider than the thickness of the substrate 3 transported by the transport conveyor 14.

[0017] Below the board 3 being transported to the mounting work position, a lower support member 17 (see also FIG. 1) that moves up and down (arrow b) by a cylinder 16 is installed. The board transport mechanism 2 positions the board 3 at the mounting work position, raises the lower support member 17 to lift the board 3 from the transport conveyor 14, and holds the board 3 at the mounting work position by pressing down both edges of the board 3 from above with the lower surfaces of the pressure plates 15 (the state shown in FIG. 2). When transporting the board 3, the board transport mechanism 2 lowers the lower support member 17 to a position where it does not interfere with the underside of the board 3.

[0018] 1 and 2, a component recognition camera 18 is disposed between the component supply unit 4 and the board transport mechanism 2. When the mounting head 8, which has picked up a component D from the component supply unit 4, moves above the component recognition camera 18, the component recognition camera 18 captures an image of the component D held by the mounting head 8. From the image capture result, the holding posture of the component D is recognized. A board recognition camera 20 is attached to the plate 7a to which the mounting head 8 is attached. The board recognition camera 20 moves integrally with the mounting head 8.

[0019] As the mounting head 8 moves, the board recognition camera 20 moves above the board 3 positioned by the board transport mechanism 2, and captures images of the board marks 3a provided on the board 3 and the mounting positions P of the components D. The position of the board 3 is recognized from the image of the board marks 3a. Furthermore, the image of the mounting positions P is used to recognize the presence or absence of components D and foreign matter such as dust at the mounting positions P. When the mounting head 8 mounts components on the board 3, the mounting positions P are corrected taking into account the recognition results of the components D by the component recognition camera 18 and the recognition results of the board position by the board recognition camera 20.

[0020] 1, a touch panel 19 operated by the worker is installed at the position where the worker works on the front of the component mounting device 1. The touch panel 19 displays various information on its display unit, and the worker inputs data and operates the component mounting device 1 using operation buttons and the like displayed on the display unit.

[0021] 1 and 2, a height sensor S, such as a laser displacement sensor, is installed on one side of the mounting head 8 and moves integrally with the mounting head 8 by the head moving mechanism 12. The height sensor S includes a laser light source that projects laser light downward and a light receiving element that receives the reflected light of the laser light projected by the laser light source. The height sensor S is controlled by a height measurement control unit 36 ​​(see FIG. 4), and projects and receives laser light to derive the distance to the measurement target using the principle of triangulation. The height sensor S measures the distance Hs to the upper surface 3b of the substrate 3 when the substrate 3 is held at the mounting work position by the substrate transport mechanism 2.

[0022] Next, the configuration of the board recognition camera 20 will be described with reference to Fig. 3. The board recognition camera 20 has an image sensor 22, a focal length adjustment mechanism 23, and an illumination unit 24 installed inside a housing 21. The image sensor 22 is composed of a two-dimensional CMOS sensor or the like, and is disposed on the ceiling inside the housing 21 with its optical axis facing downward. The focal length adjustment mechanism 23 is composed of a lens, an actuator for moving the lens, and the like, and has the function of adjusting the focal length Lf (the distance from the lens to the image sensor 22) of the board recognition camera 20.

[0023] A window member 25 such as glass that transmits light is installed at the bottom of the housing 21 by cutting out part of the housing 21. The illumination unit 24 includes a side illumination unit 24a that illuminates the imaging target below from an upward diagonal direction, a coaxial illumination unit 24b, and a half mirror 24c that reflects the light emitted from the coaxial illumination unit 24b toward the imaging target below. Depending on the illumination conditions transmitted from the mounting control unit 39 (FIG. 4), the illumination unit 24 switches between side illumination by the side illumination unit 24a and coaxial illumination by the coaxial illumination unit 24b, or combines them.

[0024] Next, the configuration of the control system of the component mounting apparatus 1 will be described with reference to Fig. 4. The component mounting apparatus 1 includes a control device 30, a board conveying mechanism 2, a tape feeder 5, a mounting head 8, a head moving mechanism 12, a component recognition camera 18, a board recognition camera 20, a touch panel 19, and a height sensor S. The control device 30 includes a mounting memory unit 31, a height measurement control unit 36, an imaging control unit 37, a warpage model extraction unit 38, a mounting control unit 39, a warpage data acquisition means 40, and an adjustment amount calculation unit 41. The mounting memory unit 31 is a storage device that stores mounting data 32, height measurement result data 33, a warpage model 34, focal length adjustment data 35, etc.

[0025] The mounting data 32 stores information necessary for component mounting work, such as the size of the board 3, the type and mounting position P (XY coordinates) of the component D to be mounted, and the position (XY coordinates) of the board mark 3a, for each type (board type) of board 3. Furthermore, the mounting data 32 sets the component D, which is to be determined whether or not a foreign object exists in the mounting position P before mounting, as a component subject to foreign object detection.

[0026] 4, height measurement control unit 36 ​​controls head moving mechanism 12 and height sensor S based on various information stored in mounting storage unit 31 to measure height Δh (see FIG. 6) of upper surface 3b of substrate 3 at a plurality of measurement positions An (see FIG. 5) set on upper surface 3b of substrate 3. The measured height Δh of substrate 3 at measurement positions An is stored in mounting storage unit 31 as height measurement result data 33.

[0027] 5 and 6, an example of a plurality of measurement positions An set on the upper surface 3b of the substrate 3 and measurement of the height Δh of the upper surface 3b of the substrate 3 by the height measurement control unit 36 ​​will be described. A plurality of measurement positions An (n=1, 2, . . . 9) are set on the upper surface 3b of the substrate 3 to measure the distance Hs to the upper surface 3b of the substrate 3 in order to extract the warpage of the substrate 3. The height measurement control unit 36 ​​controls the head moving mechanism 12 to move the height sensor S above the measurement positions An, and projects laser light from the height sensor S toward the measurement positions An to measure the distance Hs to the upper surface 3b of the substrate 3.

[0028] Next, the height measurement control unit 36 ​​compares the measured distance Hs with a reference distance Hs0 to the top surface 3b of the unwarped substrate 3 to calculate the height Δh of the substrate 3 at the measurement position An. That is, the height Δh of the substrate 3 at the measurement position An is the height Δh of the measurement position An relative to the top surface 3b of the unwarped substrate 3 (Δh = Hs0 - Hs). In this way, the head moving mechanism 12, the height sensor S, and the height measurement control unit 36 ​​constitute a height measurement means 42 that measures the heights Δh of multiple measurement positions An on the substrate 3.

[0029] 4, a board warpage model extraction unit 38 extracts a curved surface model that approximates the shape of the upper surface 3b of the board 3 based on heights Δh (height measurement result data 33) of the measured measurement positions An on the board 3. The curved surface model is calculated, for example, as a second-order polynomial with X coordinates and Y coordinates as variables. The extracted curved surface model (coefficients of the polynomial, etc.) is stored in the mounting storage unit 31 as a warpage model 34.

[0030] 4, the imaging control unit 37 controls the head moving mechanism 12 and the board recognition camera 20 based on the mounting data 32 to cause the board recognition camera 20 to capture images of the board mark 3a, mounting position P, and the like on the top surface 3b of the board 3. Furthermore, when the imaging control unit 37 is causing the top surface 3b of the board 3 to be imaged, the imaging control unit 37 controls the lighting unit 24 based on the lighting conditions included in the mounting data 32 to irradiate (illuminate) the target to be imaged with predetermined light.

[0031] 4, before a component for which foreign matter detection is to be performed is mounted at mounting position P on board 3, imaging control unit 37 causes board recognition camera 20 to capture an image of mounting position P. Based on the captured image of mounting position P, mounting control unit 39 determines whether or not a foreign matter such as component D or dust is present at mounting position P where the component for which foreign matter detection is to be performed is to be mounted. For example, mounting control unit 39 determines whether or not a foreign matter is present by comparing (pattern matching) the captured image of mounting position P of component D on board 3 with a pre-stored image (reference image) of mounting position P in a state where no foreign matter is present.

[0032] In this way, the head moving mechanism 12, the board recognition camera 20, and the imaging control unit 37 constitute an imaging means 43 that images the mounting position P of the component D (the component for which foreign matter detection is to be performed) on the board 3 before the component D is mounted on the board 3. Furthermore, the imaging means 43 images the board mark 3a on the board 3 when the board 3 is held at the mounting work position by the board transport mechanism 2. That is, the imaging means 43 images the board mark 3a attached to the board 3 before the height measurement means 42 measures the heights Δh of the multiple measurement positions An.

[0033] 4, the warpage data acquiring means 40 calculates (acquires) an estimated value of the height Δh of the mounting position P above the substrate 3 (hereinafter referred to as the "estimated height Δhe") based on the warpage model 34. That is, the warpage data acquiring means 40 acquires the estimated height Δhe (warpage data) of the substrate 3 based on the warpage model 34 extracted based on the heights Δh (height measurement result data 33) of the plurality of measurement positions An measured by the height measuring means 42. Note that the warpage data acquiring means 40 may acquire the estimated height Δhe by interpolating the heights Δh of the plurality of measurement positions An around the mounting position P included in the height measurement result data 33, in addition to acquiring the estimated height Δhe from the warpage model 34.

[0034] 4, the adjustment amount calculation unit 41 calculates an adjustment amount ΔLf for adjusting the focal length Lf of the focal length adjustment mechanism 23 provided in the board recognition camera 20 so that the focus is on the mounting position P on the upper surface 3b of the board 3 held by the board transport mechanism 2. Specifically, the adjustment amount calculation unit 41 calculates the adjustment amount ΔLf based on the focal length adjustment data 35 stored in the mounting storage unit 31 and the estimated height Δhe (warpage data) of the mounting position P acquired by the warpage data acquisition means 40.

[0035] 6 and 7, the calculation of the adjustment amount ΔLf by the adjustment amount calculation unit 41 will be described. In Fig. 6, the subject distance Ls from the lens of the board recognition camera 20 to the mounting position P on the board 3 varies depending on the warpage of the board 3. That is, the subject distance Ls to the mounting position P varies by the height Δh of the board 3 at the mounting position P (Hs = Hs0 - Δh) using as a reference subject distance Ls0 from the lens of the board recognition camera 20 to the upper surface 3b of the unwarped board 3 as a reference.

[0036] Fig. 7 shows an example of focal length adjustment data 35 stored in the mounting storage unit 31. The focal length adjustment data 35 includes information indicating the relationship between the adjustment amount ΔLf and the height Δh of the board 3. In the example of Fig. 7, the focal length adjustment data 35 is stored as a function of the height Δh and the adjustment amount ΔLf.

[0037] In this example, the height Δh is zero (0) and the adjustment amount ΔLf is zero. That is, when the subject distance Ls is the reference subject distance Ls0, the adjustment amount ΔLf is zero. Also, at an upwardly curved (convex upward) mounting position P (height Δh is positive), the subject distance Ls becomes shorter, so the adjustment amount ΔLf becomes negative. Conversely, at an upwardly curved (convex downward) mounting position P (height Δh is negative), the subject distance Ls becomes longer, so the adjustment amount ΔLf becomes positive.

[0038] In this embodiment, the adjustment amount calculation unit 41 calculates the adjustment amount ΔLf by using the estimated height Δhe (warpage data) of the mounting position P acquired by the warpage data acquisition means 40 as the height Δh of the board 3 in the focal length adjustment data 35. Then, the focal length adjustment mechanism 23 adjusts the focal length Lf of the board recognition camera 20 provided in the imaging means 43 based on the calculated adjustment amount ΔLf. In this way, the focal length adjustment mechanism 23 and the adjustment amount calculation unit 41 constitute a focal length adjustment means 44 that adjusts the focal length Lf of the imaging means 43 based on the warpage data (estimated height Δhe) acquired by the warpage data acquisition means 40.

[0039] 4, the mounting control unit 39 controls each unit of the component mounting apparatus 1 based on the mounting data 32 to perform a component mounting operation in which a component D supplied from the tape feeder 5 is mounted at a mounting position P on the board 3. Before mounting the component D, which is set in the mounting data 32 as a component subject to foreign matter detection, on the board 3, the mounting control unit 39 causes the imaging means 43 to capture an image of the mounting position P of the component D on the board 3 and determines from the captured image whether or not a foreign matter is present at the mounting position P. If the mounting control unit 39 determines that no foreign matter is present at the mounting position P, it mounts the component D on the board 3. If the mounting control unit 39 determines that a foreign matter is present at the mounting position P, it causes the touch panel 19 to display a warning indicating that a foreign matter is present at the mounting position P.

[0040] Next, a component mounting method for mounting a component D on a board 3 will be described with reference to the flow in Fig. 8. Here, the flow from when the board 3 is carried into the component mounting device 1 until when it is carried out will be described. First, the mounting control unit 39 of the component mounting device 1 controls the board transport mechanism 2 to carry the board 3 into the mounting work position and hold it there (ST1: board carrying-in step). Next, the imaging means 43 images the board marks 3a marked on the board 3 (ST2: board mark imaging step). Based on the image of the board marks 3a, the holding position of the board 3 is recognized.

[0041] Next, the height measurement means 42 measures heights Δh at a plurality of measurement positions An on the board 3, and stores the height measurement result data 33 in the mounting storage unit 31 (ST3: height measurement step). That is, before the height measurement means 42 measures the heights Δh at a plurality of measurement positions An (before ST3), the imaging means 43 images the board mark 3a marked on the board 3 (ST2 is executed).

[0042] In this way, the multiple measurement positions An are corrected based on the positions of the board marks 3a imaged in the board mark imaging step (ST2). This makes it possible to extract an accurate warpage model 34 of the board 3. Note that by positioning the board marks 3a close to the presser plate 15 that holds the board 3, the influence of the warpage of the board 3 on the imaging of the board marks 3a can be reduced.

[0043] 8, next, the warpage model extraction unit 38 extracts a warpage model 34 of the board 3 based on the heights Δh of the multiple measurement positions An included in the height measurement result data 33, and stores the warpage model 34 in the mounting storage unit 31 (ST4: warpage model extraction step). Next, the mounting control unit 39 controls the mounting head 8 and head moving mechanism 12 based on the mounting data 32 to take out the component D from the tape feeder 5 and hold it on the mounting head 8 (ST5: component holding step). Next, the mounting control unit 39 determines based on the mounting data 32 whether the component D held by the mounting head 8 is a component that is subject to foreign matter detection (ST6: foreign matter detection target determination step).

[0044] If the component D held by the mounting head 8 is a component subject to foreign matter detection (Yes in ST6), the warpage data acquisition means 40 calculates the estimated height Δhe of the mounting position P of the component D based on the warpage model 34 (acquires warpage data) (ST7: warpage data acquisition step). Next, the adjustment amount calculation unit 41 calculates the adjustment amount ΔLf based on the calculated estimated height Δhe and the focal length adjustment data 35 (ST8: adjustment amount calculation step). Next, the focal length adjustment mechanism 23 adjusts the focal length Lf of the board recognition camera 20 (imaging means 43) based on the adjustment amount Δhe (ST9: focal length adjustment step). Next, the imaging means 43 captures an image of the mounting position P of the component D on the board 3 (ST10: mounting position imaging step).

[0045] 8, the mounting control unit 39 then determines whether or not a foreign object is present at the mounting position P from the captured image of the mounting position P (ST11: determination step). If it is determined that a foreign object is present in the determination step (ST11) (Yes), the mounting control unit 39 causes the touch panel 19 to display a warning that a foreign object is present at the mounting position P (ST12: warning step).

[0046] If the component D held by the mounting head 8 is not a component subject to foreign matter detection (No in ST6), or if it is not determined that a foreign matter is present in the determination process (ST11) (No), the mounting control unit 39 mounts the component D held by the mounting head 8 at the mounting position P on the board 3 based on the mounting data 32 (ST13: component mounting process).

[0047] 8, if all components D have not been mounted on the board 3 (No in ST14), the process returns to the component holding step (ST5) and the next component D is held by the mounting head 8. Once all components D have been mounted on the board 3 (Yes in ST14), the mounting control unit 39 controls the board transport mechanism 2 to unload the board 3 from the component mounting apparatus 1 (ST15: board unloading step).

[0048] As described above, the component mounting method of this embodiment measures heights Δh of a plurality of measurement positions An on the board 3 (ST3), acquires warpage data (estimated height Δhe) of the board 3 based on the measured heights Δh of the plurality of measurement positions An (ST7), adjusts the focal length Lf of the imaging means 43 based on the acquired warpage data (ST8, ST9), and images the mounting position P of the component D on the board 3 by the imaging means 43 before mounting the component D on the board 3 (ST10). This makes it possible to properly image the imaging target (mounting position P) on the board 3 even if the board 3 is warped.

[0049] As described above, the component mounting apparatus 1 of this embodiment includes an imaging means 43 that images the mounting position P of the component D on the board 3 before the component D is mounted on the board 3, a height measurement means 42 that measures heights Δh of multiple measurement positions An on the board 3, a warpage data acquisition means 40 that acquires warpage data (estimated height Δhe) of the board 3 based on the heights Δh of the multiple measurement positions An measured by the height measurement means 42, and a focal length adjustment means 44 that adjusts the focal length Lf of the imaging means 43 based on the warpage data acquired by the warpage data acquisition means 40. This makes it possible to properly image the imaging target (mounting position P) on the board 3 even if the board 3 is warped. [Industrial Applicability]

[0050] The component mounting apparatus and component mounting method of the present invention have the effect of being able to properly capture an image of an object on a board even if the board is warped, and are useful in the field of mounting components on boards. [Explanation of symbols]

[0051] 1. Component mounting equipment 3. Circuit Board 3a PCB mark (mark) 20 Circuit Board Recognition Camera 23 Focal length adjustment mechanism 43 Imaging means 44 Focal length adjustment means An measurement position D parts Lf focal length P mounting position S Height Sensor Δh height Δhe Estimated height (warpage data)

Claims

1. an imaging means for imaging a mounting position of the component on the board before the component is mounted on the board; a height measuring means for measuring heights of a plurality of measurement positions on the substrate; a warpage data acquisition means for acquiring warpage data of the substrate based on heights of the plurality of measurement positions measured by the height measurement means; and a focal length adjustment means for adjusting a focal length of the imaging means based on the warpage data acquired by the warpage data acquisition means.

2. The focal length adjustment means is an adjustment amount calculation unit that calculates an adjustment amount of the focal length based on the warp data; 2. The component mounting apparatus according to claim 1, further comprising: a focal length adjustment mechanism that adjusts a focal length of said imaging means based on said calculated adjustment amount.

3. 2. The component mounting apparatus according to claim 1, wherein said imaging means images a mark affixed to said substrate before said height measuring means measures the heights of said plurality of measurement positions.

4. measuring heights of a plurality of measurement positions on the substrate; acquiring warpage data of the substrate based on the measured heights of the plurality of measurement positions; adjusting a focal length of an imaging means based on the acquired warpage data; A component mounting method comprising: imaging a mounting position of the component on the board by the imaging means before the component is mounted on the board.

Images