Connecting assembly and electronic apparatus including connecting assembly
The connection assembly addresses the challenge of stable and reliable alignment in modular electronic devices by using heat dissipation fins and engagement/engaged portions to secure the devices, reducing mechanical stress and preventing accidental connections.
Patent Information
- Application Number
- JP2024075049
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-03-15
- Filing Date
- 2024-05-07
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2044-05-07
AI Technical Summary
Existing connection assemblies for modular electronic devices struggle to provide stable and reliable alignment and connection between two electronic devices, leading to potential mechanical stress and accidental connections.
A connection assembly featuring a first connection component with heat dissipation fins and engagement portions, a second connection component with heat dissipation fins and engaged portions, and pins that align and secure the components, providing perpendicular support to reduce mechanical stress and prevent accidental connections.
The connection assembly ensures stable and intimate alignment of electronic devices, reducing vertical shear force on the pins and preventing damage or accidental connections, thereby enhancing the reliability and foolproof nature of the device connections.
Smart Images

Figure 2025039513000001_ABST
Abstract
Description
[Technical field]
[0001] The present invention relates to a connection assembly and an electronic device having the connection assembly, and in particular to a connection assembly that allows two electronic devices to be stably and closely aligned and connected to each other, and an electronic device having the connection assembly. [Background technology]
[0002] In order to meet the needs of use in different application fields, modular design is gradually becoming the mainstream trend of electronic devices. Modular electronic devices usually include multiple removable devices that can be structurally and electrically connected with each other. For example, the removable devices can be a power supply device, a switch, a processing device, etc. Therefore, how to provide a stable and close alignment connection between two removable devices to ensure the reliability of electronic devices is currently an important issue that the industry is paying attention to. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] European Patent Application Publication No. 2672361 Summary of the Invention [Problem to be solved by the invention]
[0004] One object of the present invention is to provide a connection assembly that allows two electronic devices to be connected to each other in a stable and closely aligned manner, and an electronic device having the connection assembly. [Means for solving the problem]
[0005] In order to achieve the above object, the present invention discloses a connection assembly, which is used for aligning and connecting a first electronic device and a second electronic device, the connection assembly includes a first connection component, a plurality of first heat dissipation fins, a second connection component, a plurality of second heat dissipation fins and a pin, the first connection component is mounted on the first electronic device, the plurality of first heat dissipation fins are mounted on the first connection component, at least one of the plurality of first heat dissipation fins is formed with an engagement portion, the second connection component is mounted on the second electronic device, and the plurality of second heat dissipation fins are mounted on the second connection component. a pin protruding from the first connection component and used for insertion into the second connection component along a first direction, when the pin is inserted into the second connection component along the first direction, the first heat dissipation fins are used for aligning and abutting the second heat dissipation fins along the first direction, and the engaging portion is used for engaging with the engaged portion along the first direction, and for abutting the engaged portion along a second direction perpendicular to the first direction and a third direction opposite to the second direction.
[0006] According to one embodiment of the present invention, one of the engaging portion and the engaged portion is an engaging protrusion and an engaging recess, respectively.
[0007] According to one embodiment of the present invention, the width of the engagement protrusion gradually decreases from the bottom of the engagement protrusion, and the width of the engagement recess gradually increases from the bottom of the engagement recess.
[0008] According to one embodiment of the present invention, at least three of the plurality of first heat dissipating fins are respectively formed with a first engagement portion, a second engagement portion, and a third engagement portion, and the corresponding first heat dissipating fin of the plurality of first heat dissipating fins on which the second engagement portion is formed is located between the corresponding first heat dissipating fin of the plurality of first heat dissipating fins on which the first engagement portion is formed and the corresponding first heat dissipating fin of the plurality of first heat dissipating fins on which the third engagement portion is formed along the arrangement direction of the plurality of first heat dissipating fins, and the second engagement portion and the first engagement portion are arranged so as not to align with each other along the arrangement direction of the plurality of first heat dissipating fins, and the second engagement portion and the third engagement portion are arranged so as not to align with each other along the arrangement direction of the plurality of first heat dissipating fins, At least three of the plurality of second heat dissipating fins are respectively formed with a first engaged portion, a second engaged portion, and a third engaged portion, and the corresponding second heat dissipating fin among the plurality of second heat dissipating fins on which the second engaged portion is formed is located along the arrangement direction of the plurality of second heat dissipating fins between the corresponding second heat dissipating fin among the plurality of second heat dissipating fins on which the second engaged portion is formed and the corresponding second heat dissipating fin among the plurality of second heat dissipating fins on which the third engaged portion is formed, and the second engaged portion and the first engaged portion are arranged so as not to be aligned with each other along the arrangement direction of the plurality of second heat dissipating fins, and the second engaged portion and the third engaged portion are arranged so as not to be aligned with each other along the arrangement direction of the plurality of second heat dissipating fins.
[0009] According to one embodiment of the present invention, the connection assembly further includes an elastic component and a locking component, the elastic component is installed in the second connection component, the elastic component is used to apply a radial elastic force to the pin inserted in the second connection component, and the locking component is screwed into and locked in the second connection component, the locking component is used to apply a radial locking force to the pin inserted in the second connection component.
[0010] According to one embodiment of the present invention, the connection assembly further includes an abutment component, which is installed in the second connection component and is used to abut against the pin, and the elastic component contacts the abutment component and indirectly applies the radial elastic force to the pin through the abutment component.
[0011] According to one embodiment of the present invention, the pin is formed with a groove for mating (cooperating / cooperating with) the abutment component and the locking component, and the groove is formed on the outer periphery of the pin along the circumferential direction of the pin.
[0012] According to one embodiment of the present invention, the connection assembly further includes a sealing component, which is installed between the first connection component and the second connection component, and when the locking component is locked and installed on the second connection component, the locking component cooperates with the groove to move the pin from an initial insertion position to a predetermined insertion position along the first direction, so that the first connection component moves together with the pin along the first direction, and the sealing component is pressed by the first connection component and the second connection component, causing elastic deformation.
[0013] According to one embodiment of the present invention, the abutment component is a ball structure or a convex trapezoid structure, the locking component is a screw or a bolt, and the elastic component is a compression spring.
[0014] According to one embodiment of the present invention, the connection assembly further includes a sealing component, which is installed between the first connection component and the second connection component, and when the locking component is locked and installed on the second connection component, the locking component cooperates with the pin to move the pin from an initial insertion position to a predetermined insertion position along the first direction, so that the first connection component moves together with the pin along the first direction, and the sealing component is pressed by the first connection component and the second connection component, causing elastic deformation.
[0015] The present invention further discloses an electronic device, which includes a first electronic device, a second electronic device, and a connection assembly, the second electronic device is detachably connected to the first electronic device, and the connection assembly is used to align and connect the first electronic device and the second electronic device, the connection assembly including a first connection component, a plurality of first heat dissipation fins, a second connection component, a plurality of second heat dissipation fins, and a pin, the first connection component is mounted on the first electronic device, the plurality of first heat dissipation fins are mounted on the first connection component, at least one of the plurality of first heat dissipation fins is formed with an engagement portion, and the second connection component is mounted on the second electronic device. the plurality of second heat dissipating fins are installed on the second connection component, an engaging portion is formed on at least one of the plurality of second heat dissipating fins, the pin is protruded from the first connection component and is used for being inserted into the second connection component along a first direction, when the pin is inserted into the second connection component along the first direction, the plurality of first heat dissipating fins are used for aligning and abutting against the plurality of second heat dissipating fins along the first direction, and the engaging portion is used for engaging with the engaged portion along the first direction, and abutting against the engaged portion along a second direction perpendicular to the first direction and a third direction opposite to the second direction. Effect of the Invention
[0016] In summary, in the present invention, the engaging portion abuts against the corresponding engaged portion (the two work together) to provide support in the vertical direction (with respect to the pin), thereby effectively reducing the vertical shear force acting on the pin and preventing the pin from breaking and being damaged. It also ensures that the first electronic device and the second electronic device can only be connected to each other, thereby preventing the first electronic device or the second electronic device from being mistakenly connected to another electronic device, and creating a fool-proof effect, so that the present invention is more reliable in use. [Brief description of the drawings]
[0017] [Figure 1] FIG. 1 is a diagram showing an electronic device according to an embodiment of the present invention. [Diagram 2] FIG. 2 is an exploded view (part 1) of elements of an electronic device according to an embodiment of the present invention, viewed from different viewing angles. [Diagram 3] FIG. 3 is an exploded view (part 2) of elements of an electronic device according to an embodiment of the present invention viewed from different viewing angles. [Figure 4] FIG. 4 is a cross-sectional view (part 1) of a partial structure taken along a different cutting line of an electronic device in an embodiment of the present invention. [Diagram 5] FIG. 5 is a cross-sectional view (part 2) of a partial structure taken along a different cutting line of an electronic device in an embodiment of the present invention. [Figure 6] FIG. 6 is a cross-sectional view (part 3) of a partial structure taken along a different cutting line of an electronic device in an embodiment of the present invention. [Figure 7] FIG. 7 is a fourth cross-sectional view of a partial structure taken along a different cutting line of an electronic device according to an embodiment of the present invention. [Figure 8] FIG. 8 is a cross-sectional view of a partial structure of an electronic device according to an embodiment of the present invention. [Figure 9] FIG. 9 is a diagram showing a partial structure of an electronic device in an embodiment of the present invention when the electronic device is in an unlocked state. [Figure 10]FIG. 10 is a cross-sectional view (part 1) of a partial structure taken along a different cutting line when the electronic device according to the embodiment of the present invention is in an unlocked state. [Figure 11] FIG. 11 is a cross-sectional view (part 2) of a partial structure taken along a different cutting line when the electronic device in the embodiment of the present invention is in an unlocked state. [Figure 12] FIG. 12 is a diagram showing a partial structure of an electronic device in an embodiment of the present invention when the electronic device is in a locked state. [Figure 13] FIG. 13 is a cross-sectional view (part 1) of a partial structure taken along a different cutting line when the electronic device according to the embodiment of the present invention is in a locked state. [Figure 14] FIG. 14 is a cross-sectional view (part 2) of a partial structure taken along a different cutting line when the electronic device in the embodiment of the present invention is in a locked state. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0018] The above and other technical contents, features, functions, and effects of the present invention will be made clearer by the following detailed description of preferred embodiments based on the accompanying drawings. Note that the directional terms used in the following embodiments, such as up, down, left, right, front, back, etc., are merely directions in the accompanying drawings. Therefore, the directional terms used are only for explaining the present invention, and are not intended to limit the present invention. In addition, unless otherwise stated, the term "connected" herein includes any direct and indirect electrical or structural connection means. Thus, for example, when a description is made that a first device is connected to a second device, it means that the first device is electrically / structurally connected directly to the second device, or is electrically / structurally connected to the second device indirectly through another device or connection means.
[0019] Please refer to Fig. 1 to Fig. 7. Fig. 1 is a diagram showing an electronic device 1 in an embodiment of the present invention, Fig. 2 and Fig. 3 are exploded views of elements of the electronic device 1 in the embodiment of the present invention at different viewing angles, and Fig. 4 to Fig. 7 are cross-sectional views of a part of the structure of the electronic device 1 along different cutting lines in the embodiment of the present invention. As shown in Fig. 1 to Fig. 7, the electronic device 1 includes a first electronic device 11 and a second electronic device 12, and the second electronic device 12 is detachably connected to the first electronic device 11. In this embodiment, the electronic device 1 may be a remote terminal unit, the first electronic device 11 may be a signal converter, and the second electronic device may be a wireless RF communication device, but the present invention is not limited to this embodiment.
[0020] As shown in Fig. 2 to Fig. 7, the electronic device 1 further includes a connection assembly 13, which is used to make the first electronic device 11 and the second electronic device 12 stably and closely aligned and connected to each other. The connection assembly 13 includes a first connection component 131, a second connection component 132, four pins 133, six first heat dissipation fins 13A and six second heat dissipation fins 13B. The first connection component 131 is mounted on the first electronic device 11, and the second connection component 132 is mounted on the second electronic device 12, and each pin 133 is protruded from the first connection component 131 and is used to be inserted into the second connection component 132 along the first direction D1. Preferably, the four pins 133 are located at the four corners of the first connection component 131, respectively. The six first heat dissipation fins 13A are installed on the first connection component 131 and are used to quickly dissipate heat generated by the first electronic device 11, and the six second heat dissipation fins 13B are installed on the second connection component 132 and are used to quickly dissipate heat generated by the second electronic device 12, and four of the six first heat dissipation fins 13A are each formed with two engaging portions 13A1, and four of the six second heat dissipation fins 13B are each formed with two engaged portions 13B1. When each pin 133 is inserted into the second connection component 132 along the first direction D1, the six first heat dissipation fins 13A align and abut against the six second heat dissipation fins 13B along the first direction D1, and each engaging portion 13A1 engages with a corresponding engaged portion 13B1 along the first direction D1, and abuts against a corresponding engaged portion 13B1 along a second direction D2 perpendicular to the first direction D1 and a third direction D3 opposite to the second direction D2. The abutment cooperation between each engaging portion 13A1 and the corresponding engaged portion 13B1 provides support for the pin 133 in the vertical direction (with respect to the pin 133), thereby effectively reducing the vertical shear force acting on the pin 133 and preventing the pin 133 from being broken or damaged. It is also possible to ensure that the first electronic device 11 and the second electronic device 12 can only be connected to each other, thereby preventing the first electronic device 11 or the second electronic device 12 from being mistakenly connected to other electronic devices, and creating a fool-proof effect.
[0021] It can be understood that the number of pins, first heat dissipating fins, second heat dissipating fins, engaging parts and engaged parts of the present invention is not limited to this embodiment. For example, in another embodiment, the connection assembly may only include one pin, two first heat dissipating fins and two second heat dissipating fins, and one of the two first heat dissipating fins and one of the two second heat dissipating fins may be respectively formed with one engaging part and one engaged part.
[0022] Also, in this embodiment, as shown in Figures 2 and 3, the first connection component 131 may be integrally connected to the left cover of the first electronic device 11, and the second connection component 132 may be integrally connected to the right cover of the second electronic device 12, but the present invention is not limited to this embodiment. For example, in another embodiment, the first connection component may be an independent element and detachably connected to the left cover of the first electronic device, and the second connection component may be an independent element and detachably connected to the right cover of the second electronic device.
[0023] Furthermore, in this embodiment, as shown in Figures 2 and 3, the first heat dissipating fin 13A may be integrally connected to the first connecting component 131, and the second heat dissipating fin 13B may be integrally connected to the first connecting component 132, but the present invention is not limited to this embodiment. For example, in another embodiment, the first heat dissipating fin may be an independent element and detachably connected to the first connecting component, and the second heat dissipating fin may be an independent element and detachably connected to the second connecting component.
[0024] Preferably, in order to allow the engaging portion 13A1 and the engaged portion 13B1 to be smoothly engaged with each other, as shown in Fig. 2 and Fig. 3, the engaging portion 13A1 and the engaged portion 13B1 may be respectively an engaging protrusion and an engaging recess, and the width of the engaging protrusion gradually decreases from the bottom of the engaging protrusion, and the width of the engaging recess gradually increases from the bottom of the engaging recess. For example, the engaging protrusion and the engaging recess may be respectively a trapezoidal protrusion whose width gradually decreases along the first direction D1 and a trapezoidal recess whose width gradually decreases along the first direction D1, and such an arrangement allows the engaging portion 13A1 and the engaged portion 13B1 to be guided and aligned with each other by sliding contact between the inclined surfaces during the process in which the first electronic device 11 and the second electronic device 12 approach each other, but the present invention is not limited to this embodiment. For example, in another embodiment, the engaging portion and the engaged portion may be an engaging recess and an engaging protrusion, respectively, and the width of the engaging recess and the width of the engaging protrusion may be fixed values, that is, each engaging protrusion and each engaging recess may be a rectangular protrusion and a rectangular recess, respectively.
[0025] In addition, in order to avoid stress concentration, as shown in Fig. 3, six first heat dissipating fins 13A may be arranged in sequence along the fourth direction D4, and the engagement parts 13A1 located on different first heat dissipating fins 13A may be defined as two first engagement parts 13A11, two second engagement parts 13A12, two third engagement parts 13A13, and two fourth engagement parts 13A14 along the fourth direction D4. The first heat dissipating fin 13A on which the second engagement part 13A12 is formed is located between the first heat dissipating fin 13A on which the first engagement part 13A11 is formed and the first heat dissipating fin 13A on which the third engagement part 13A13 is formed along the fourth direction D4, and each second engagement part 13A12 and the corresponding first engagement part 13A11 are arranged so as not to align with each other along the fourth direction D4, and each second engagement part 13A12 and the corresponding third engagement part 13A13 are arranged so as not to align with each other along the fourth direction D4. The first heat dissipating fin 13A on which the third engaging portion 13A13 is formed is located between the first heat dissipating fin 13A on which the second engaging portion 13A12 is formed and the first heat dissipating fin 13A on which the fourth engaging portion 13A14 is formed along the fourth direction D4, and each third engaging portion 13A13 and the corresponding second engaging portion 13A12 are arranged so as not to align with each other along the fourth direction D4, and each third engaging portion 13A13 and the corresponding fourth engaging portion 13A14 are arranged so as not to align with each other along the fourth direction D4. Correspondingly, as shown in FIG. 2, the six second heat dissipating fins 13B may also be arranged in sequence along the fourth direction D4, and the engaged portions 13B1 located on different second heat dissipating fins 13B may be defined as two first engaged portions 13B11, two second engaged portions 13B12, two third engaged portions 13B13, and two fourth engaged portions 13B14 along the fourth direction D4. The second heat dissipation fin 13B on which the second engaged portion 13B12 is formed is located along the fourth direction D4 between the second heat dissipation fin 13B on which the first engaged portion 13B11 is formed and the second heat dissipation fin 13B on which the third engaged portion 13B13 is formed, and each second engaged portion 13B12 and the corresponding first engaged portion 13B11 are arranged so as not to be aligned with each other along the fourth direction D4, and each second engaged portion 13B12 and the corresponding third engaged portion 13B13 are arranged so as not to be aligned with each other along the fourth direction D4.The second heat dissipation fin 13B on which the third engaged portion 13B13 is formed is located along the fourth direction D4 between the second heat dissipation fin 13B on which the second engaged portion 13B12 is formed and the second heat dissipation fin 13B on which the fourth engaged portion 13B14 is formed, and each third engaged portion 13B13 and the corresponding second engaged portion 13B12 are arranged so as not to be aligned with each other along the fourth direction D4, and each third engaged portion 13B13 and the corresponding fourth engaged portion 13B14 are arranged so as not to be aligned with each other along the fourth direction D4.
[0026] Also, please refer to Fig. 2, Fig. 3 and Fig. 8 to Fig. 14. Fig. 8 is a cross-sectional view of a partial structure of the electronic device 1 in the embodiment of the present invention, Fig. 9 is a diagram showing a partial structure when the electronic device 1 in the embodiment of the present invention is in an unlocked state, Fig. 10 and Fig. 11 are cross-sectional views of the partial structure along different cutting lines when the electronic device 1 in the embodiment of the present invention is in an unlocked state, Fig. 12 is a diagram showing a partial structure when the electronic device 1 in the embodiment of the present invention is in a locked state, and Fig. 13 and Fig. 14 are cross-sectional views of the partial structure along different cutting lines when the electronic device 1 in the embodiment of the present invention is in a locked state. As shown in Figs. 2, 3 and 8 to 14, the connection assembly 13 further includes four elastic components 134, four locking components 135 and four abutting components 136 to lock the four pins 133 inserted into the second connection component 132, each elastic component 134 is installed in the second connection component 132, each elastic component 134 is used to apply a radial elastic force to a corresponding pin 133 inserted into the second connection component 132, each locking component 135 is used to lock the corresponding pin 133 inserted into the second connection component 132, each locking component 135 is used to lock the corresponding pin 133 inserted into the second connection component 132, each elastic component 134 is used to apply a radial elastic force to a corresponding pin 133 inserted into the second connection component 132, each locking component 135 is used to lock the corresponding pin 133 inserted into the second connection component 132, each abutting component 136 ... Each locking component 135 is rotated into the connecting component 132 and locked, and is used to apply a radial locking force to a corresponding pin 133 inserted into the second connecting component 132, and each abutment component 136 is installed in the second connecting component 132 and is used to abut against a corresponding pin 133, i.e., the elastic component 134 contacts the abutment component 136 and applies an elastic force to the abutment component 136, thereby indirectly applying a radial elastic force to the pin 133 through the abutment component 136.Specifically, taking FIG. 8 as an example, the elastic component 134 shown in FIG. 8 is used to apply a radial elastic force to the corresponding pin 133 inserted in the second connecting component 132 along a first force applying direction F1, and the locking component 135 shown in FIG. 8 is used to apply a radial locking force to the corresponding pin 133 inserted in the second connecting component 132 along a second force applying direction F2, where the first force applying direction F1 and the second force applying direction F2 may be substantially perpendicular to each other and may be substantially perpendicular to the first direction D1, and the first force applying direction F1 and the second force applying direction F2 may be substantially opposite to the fourth direction D4 and the second direction D2, respectively.
[0027] In this embodiment, the locking component 135 may be a screw or a bolt, the elastic component 134 may be a compression spring, and the abutment component 136 may be a spherical structure made of a metallic material, but the invention is not limited to this embodiment. By way of example, in another embodiment, the abutment component may be a convex pedestal structure made of a plastic material or an elastic material.
[0028] As can be appreciated, the number of pins, resilient components, and locking components is not limited to this embodiment, and by way of example, in another embodiment, the connection assembly may include only one pin, one resilient component, and one locking component.
[0029] Furthermore, it can be understood that the locking mechanism for locking the pin is not limited to this embodiment, for example, in another embodiment, the provision of the abutment component may be omitted, and the elastic component may be a U-shaped spring that directly contacts both sides of the pin to directly apply two opposing radial elastic forces to the pin.
[0030] Specifically, as shown in Figs. 2, 3 and 8 to 14, the pin 133 may be formed with a groove 1331 for cooperating with the abutment component 136 and the locking component 135, the groove 1331 is formed on the outer periphery of the pin 133 along the circumferential direction of the pin 133, and the abutment component 136 and the locking component 135 are respectively abutted against the groove 1331 along two perpendicular directions (first force application direction F1 and second force application direction F2), so that the radial elastic force generated by the elastic component 134 and the radial locking force generated by the locking component 135 simultaneously lock the pin 133 along the two perpendicular directions. As can be understood, in another embodiment, the pin may be formed with different grooves for cooperating with the abutment component and the locking component, and the radial elastic force generated by the elastic component and the radial locking force generated by the locking component may simultaneously lock the pin along two opposite directions.
[0031] 2, 3 and 8 to 14, the connection assembly 13 further includes a sealing component 137, which may be made of an elastic material, and the sealing component 137 is disposed between the first connection component 131 and the second connection component 132. The sealing component 137 can be disposed so that the pin 133 is located at the initial insertion position P1 shown in Figs. 9 and 10 when the pin 133 is inserted into the second connection component 132. When the locking component 135 is locked into the second connection component 132, the locking component 135 and the groove 1331 cooperate with each other to move the pin 133 from the initial insertion position P1 shown in Figs. 9 and 10 to the predetermined insertion position P2 shown in Figs. 12 and 13 along the first direction D1. Thus, when the first connection component 131 moves together with the pin 133 along the first direction D1, the sealing component 137 can be pressed by the first connection component 131 and the second connection component 132, causing elastic deformation. With this structural arrangement, the first connection component 131 and the second connection component 132 can be seamlessly connected to each other to meet specific waterproof and dustproof requirements, thereby effectively preventing external moisture and ash dust from entering the first electronic device 11 and the second electronic device 12.
[0032] In this embodiment, the sealing component may be an O-ring surrounding the electrical connector of the first electronic device and the electrical connector of the second electronic device, but the present invention is not limited to this embodiment.
[0033] As can be appreciated, in another embodiment, when there is no need for waterproofing or dustproofing, the sealing component may be omitted, the pin may be in a predetermined insertion position when inserted into the second connecting component, and the locking component may be locked to the pin in the predetermined insertion position.
[0034] Compared with the prior art, in the present invention, the engaging portion abuts against the corresponding engaged portion (the cooperation of the two) to provide vertical (relative to the pin) support to the pin, effectively reducing the vertical shear force acting on the pin and preventing the pin from breaking and being damaged. It also ensures that the first electronic device and the second electronic device can only be connected to each other, preventing the first electronic device or the second electronic device from being mistakenly connected to other electronic devices, and creating a fool-proof effect, so that the present invention is more reliable in use.
[0035] The present invention has been disclosed above based on the preferred embodiment described above, but the preferred embodiment described above is not intended to limit the present invention, and a person skilled in the art may make minor modifications and adaptations to the present invention without departing from the spirit and scope of the present invention, and therefore the scope of protection of the present invention is based on the scope of the appended claims. In addition, it is not necessary for any embodiment or claim of the present invention to achieve all of the objectives, advantages or features disclosed in the present invention. In addition, a part of the abstract and the title of the invention are only intended to assist in searching the literature, and are not intended to limit the scope of the rights of the present invention. In addition, the terms "first", "second", etc., used in the present specification or claims are only intended to name elements or distinguish different embodiments or scopes, and are not intended to limit the upper or lower limits on the quantity of elements. [Explanation of symbols]
[0036] 1:Electronic equipment 11:First electronic device 12:Second electronic device 13: Connection Assembly 131: First connection component 132: Second connection component 133: Pin 1331: Groove 134: Elastic components 135: Lock component 136: Contact component 137:Sealed コンポーネント 13A: First heat release 13A1: Joint 13A11: First Department 13A12: Second Series 13A13: The third department 13A14: Quaternary System 13B: Second exothermic filter 13B1: quilted part 13B11: First quilted part 13B12: Second quilt fastening part 13B13: The third quilt closure 13B14: The fourth quilted part D1: First direction D2: Second direction D3: Third direction D4: The fourth direction F1: First Force Inca Direction F2: Second force direction P1: Initial insertion position P2: Determined insertion position
Claims
1. A connection assembly for use in aligning and connecting a first electronic device and a second electronic device, comprising: a first connection component disposed on the first electronic device; a plurality of first heat dissipating fins disposed on the first connection component, at least one of the plurality of first heat dissipating fins having an engagement portion formed thereon; a second connection component disposed on the second electronic device; A plurality of second heat dissipating fins are provided on the second connection component, at least one of the plurality of second heat dissipating fins having an engaged portion; and A pin is provided on the first connection component and is adapted to be inserted into the second connection component along a first direction; A connection assembly, wherein when the pin is inserted into the second connection component along the first direction, the plurality of first heat dissipation fins are used to align and abut against the plurality of second heat dissipation fins along the first direction, and the engaging portion is used to engage with the engaged portion along the first direction and abut against the engaged portion along a second direction perpendicular to the first direction and a third direction opposite to the second direction.
2. 2. The connection assembly of claim 1, A connection assembly, wherein one and the other of the engaging portion and the engaged portion are an engaging protrusion and an engaging recess, respectively.
3. 3. The connection assembly of claim 2, A connection assembly, wherein the width of the engagement protrusion gradually decreases from a bottom of the engagement protrusion and the width of the engagement recess gradually increases from a bottom of the engagement recess.
4. 2. The connection assembly of claim 1, At least three of the first heat dissipation fins are each formed with a first engagement portion, a second engagement portion, and a third engagement portion; Among the plurality of first heat dissipating fins, the corresponding first heat dissipating fin on which the second engagement portion is formed is located between the corresponding first heat dissipating fin on which the first engagement portion is formed and the corresponding first heat dissipating fin on which the third engagement portion is formed, along an arrangement direction of the plurality of first heat dissipating fins; the second engaging portion and the first engaging portion are arranged so as not to be aligned with each other along the arrangement direction of the plurality of first heat dissipation fins, and the second engaging portion and the third engaging portion are arranged so as not to be aligned with each other along the arrangement direction of the plurality of first heat dissipation fins, At least three of the second heat dissipation fins are each formed with a first engaged portion, a second engaged portion, and a third engaged portion, Among the plurality of second heat dissipating fins, the corresponding second heat dissipating fin on which the second engaged portion is formed is located between the corresponding second heat dissipating fin on which the first engaged portion is formed and the corresponding second heat dissipating fin on which the third engaged portion is formed, among the plurality of second heat dissipating fins, along an arrangement direction of the plurality of second heat dissipating fins; A connection assembly, wherein the second engaged portion and the first engaged portion are arranged so as not to be aligned with each other along the arrangement direction of the plurality of second heat dissipation fins, and the second engaged portion and the third engaged portion are arranged so as not to be aligned with each other along the arrangement direction of the plurality of second heat dissipation fins.
5. A connection assembly according to any one of claims 1 to 4, an elastic component installed in the second connection component, the elastic component being used to apply a radial elastic force to the pin inserted in the second connection component; and A connection assembly further comprising a locking component threadedly locked into the second connection component, the locking component being used to apply a radial locking force to the pin inserted into the second connection component.
6. 6. The connection assembly of claim 5, Further comprising an abutment component; the abutment component is disposed within the second connecting component and is adapted to abut against the locking component; A connection assembly, wherein the elastic component contacts the abutment component and indirectly applies the radial elastic force to the pin through the abutment component.
7. 7. The connection assembly of claim 6, A connection assembly, wherein the pin is formed with a groove for cooperating with the abutment component and the locking component, the groove being formed on an outer periphery of the pin along a circumferential direction of the pin.
8. 8. A connection assembly according to claim 7, comprising: Further comprising a sealing component; the sealing component is disposed between the first connecting component and the second connecting component; When the locking component is locked and installed on the second connection component, the locking component cooperates with the groove to move the pin from an initial insertion position to a predetermined insertion position along the first direction, so that the first connection component moves along the first direction together with the pin, and the sealing component is pressed by the first connection component and the second connection component, resulting in elastic deformation.
9. 7. The connection assembly of claim 6, A connection assembly, wherein the abutment component is a spherical structure or a convex trapezoid structure, the locking component is a screw or a bolt, and the elastic component is a compression spring.
10. A connection assembly according to any one of claims 1 to 4, Further comprising a sealing component; the sealing component is disposed between the first connecting component and the second connecting component; A connection assembly in which, when a locking component is locked and installed on the second connection component, the locking component cooperates with the pin to move the pin from an initial insertion position along the first direction to a predetermined insertion position, whereby the first connection component moves along the first direction together with the pin, and the sealing component is pressed by the first connection component and the second connection component, resulting in elastic deformation.
11. An electronic device, First electronic device; a second electronic device that is removably connected to the first electronic device; and a connection assembly adapted to align and connect the first electronic device and the second electronic device; The connection assembly includes: a first connection component disposed on the first electronic device; a plurality of first heat dissipating fins disposed on the first connection component, at least one of the plurality of first heat dissipating fins having an engagement portion formed thereon; a second connection component disposed on the second electronic device; A plurality of second heat dissipating fins are provided on the second connection component, at least one of the plurality of second heat dissipating fins having an engaged portion; and A pin is provided on the first connection component and is adapted to be inserted into the second connection component along a first direction; an electronic device, wherein when the pin is inserted into the second connection component along the first direction, the plurality of first heat dissipation fins are used to align and abut against the plurality of second heat dissipation fins along the first direction, and the engaging portion is used to engage with the engaged portion along the first direction and abut against the engaged portion along a second direction perpendicular to the first direction and a third direction opposite to the second direction.
12. The electronic device according to claim 11, An electronic device, wherein one of the engaging portion and the engaged portion is an engaging protrusion and an engaging recess, respectively.
13. The electronic device according to claim 12, a width of the engagement protrusion gradually decreases from a bottom of the engagement protrusion, and a width of the engagement recess gradually increases from a bottom of the engagement recess.
14. The electronic device according to claim 11, At least three of the first heat dissipation fins are each formed with a first engagement portion, a second engagement portion, and a third engagement portion; Among the plurality of first heat dissipating fins, the corresponding first heat dissipating fin on which the second engagement portion is formed is located between the corresponding first heat dissipating fin on which the first engagement portion is formed and the corresponding first heat dissipating fin on which the third engagement portion is formed, along an arrangement direction of the plurality of first heat dissipating fins; the second engaging portion and the first engaging portion are arranged so as not to be aligned with each other along the arrangement direction of the plurality of first heat dissipation fins, and the second engaging portion and the third engaging portion are arranged so as not to be aligned with each other along the arrangement direction of the plurality of first heat dissipation fins, At least three of the second heat dissipation fins are each formed with a first engaged portion, a second engaged portion, and a third engaged portion, Among the plurality of second heat dissipating fins, the corresponding second heat dissipating fin on which the second engaged portion is formed is located between the corresponding second heat dissipating fin on which the first engaged portion is formed and the corresponding second heat dissipating fin on which the third engaged portion is formed, among the plurality of second heat dissipating fins, along an arrangement direction of the plurality of second heat dissipating fins; an electronic device, wherein the second engaged portion and the first engaged portion are arranged so as not to be aligned with each other along the arrangement direction of the plurality of second heat dissipation fins, and the second engaged portion and the third engaged portion are arranged so as not to be aligned with each other along the arrangement direction of the plurality of second heat dissipation fins.
15. 15. An electronic device according to any one of claims 11 to 14, The connection assembly includes: an elastic component installed in the second connection component, the elastic component being used to apply a radial elastic force to the pin inserted in the second connection component; and The electronic device further includes a locking component that is threadedly inserted into the second connection component and locked therein, the locking component being used to apply a radial locking force to the pin that is inserted into the second connection component.
16. 16. The electronic device according to claim 15, The connection assembly further includes an abutment component; the abutment component is disposed within the second connecting component and is adapted to abut against the locking component; The elastic component contacts the abutment component and indirectly applies the radial elastic force to the pin through the abutment component.
17. 17. The electronic device according to claim 16, An electronic device, wherein the pin has a groove formed therein that cooperates with the abutment component and the lock component, the groove being formed on an outer circumferential edge of the pin along a circumferential direction of the pin.
18. 18. The electronic device according to claim 17, the connection assembly further includes a sealing component; the sealing component is disposed between the first connecting component and the second connecting component; When the locking component is locked and installed on the second connection component, the locking component cooperates with the groove to move the pin from an initial insertion position to a predetermined insertion position along the first direction, so that the first connection component moves along the first direction together with the pin, and the sealing component is pressed by the first connection component and the second connection component, causing elastic deformation.
19. 17. The electronic device according to claim 16, The electronic device, wherein the abutment component is a spherical structure or a convex base structure, the locking component is a screw or a bolt, and the elastic component is a compression spring.
20. 15. An electronic device according to any one of claims 11 to 14, the connection assembly further includes a sealing component; the sealing component is disposed between the first connecting component and the second connecting component; When a locking component is locked and installed on the second connection component, the locking component cooperates with the pin to move the pin from an initial insertion position to a predetermined insertion position along the first direction, whereby the first connection component moves along the first direction together with the pin, and the sealing component is pressed by the first connection component and the second connection component, causing elastic deformation.
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