Method for manufacturing electrode microstructure and electrode microstructure of the same

The method of sputtering one-dimensional metal nanocrystal structures onto a flexible plastic member to create electrode microstructures with pointed features addresses the limitations of existing electrode structures, enhancing electroplating efficiency and electrode performance by improving point discharge and surface area for reaction.

JP2025039546APending Publication Date: 2025-03-21SENSE TECH INNOVATION COMPANY
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Patent Information

Application Number
JP2024152915
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-04-12
Filing Date
2024-09-05
Publication Date
2025-03-21

AI Technical Summary

Technical Problem

Existing electrode structures face challenges in enhancing electroplating efficiency and electrode performance due to limitations in surface microstructure and material properties.

Method used

A method for manufacturing electrode microstructures involves sputtering a surface structure layer made of one-dimensional metal nanocrystal structures onto a flexible plastic member, creating microstructures with pointed features that provide point discharge and a large reactive surface area.

Benefits of technology

The method improves electroplating efficiency by enhancing point discharge and increasing the surface area for reaction with electroplating materials, while also strengthening the bond between the electrode structure and the electroplating material.

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Abstract

To provide a method for manufacturing an electrode microstructure that can enhance electric plating effect, and to provide an electrode microstructure of the same.SOLUTION: A method for manufacturing an electrode microstructure includes steps of: providing a flexible plastic member; and sputtering a surface structure layer at a surface of the plastic member to form an electrode microstructure. In the electrode microstructure thereof, the surface structure layer comprises a one-dimensional metal nanocrystal. The surface structure layer includes a plurality of microstructures, where the microstructures are distributed at the surface of the plastic member while being spaced from one another. Each of the microstructures includes at least one pointed body. The pointed body provides point discharge. Providing the point discharge from such a pointed body of the microstructure can improve efficiency of subsequent production processes of electric plating. The pointed body of the microstructure can provide a large surface area that reacts with an electric plating material and, at the same time, a rough structure surface of the surface structure layer can strengthen the bond strength to the electric plating material.SELECTED DRAWING: Figure 1
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Description

[Technical field]

[0001] The present application relates to the technical field of electrode structures, and in particular to a method for manufacturing an electrode microstructure and the electrode microstructure. [Background technology]

[0002] In conventional technology, the scope of nanotechnology is very broad, and nanomaterials are only a part of it, but they are the basis for the development of nanotechnology. The excellent properties of nanomaterials can be applied in various fields. Nanomaterials refer to materials whose one dimension is at the nanoscale (0.1-100 nm), including zero-dimensional, one-dimensional, and two-dimensional nanomaterials. Any one dimension that appears at the nanoscale can be called a nanomaterial. When a material's scale enters the nanoscale, its special physical architecture will give rise to a series of phenomena and effects, which will enable a series of related applications. Summary of the Invention

[0003] The embodiments of the present application provide a method for manufacturing an electrode microstructure and the electrode microstructure, which can effectively improve the electroplating effect by manufacturing a surface microstructure of an electrode structure using nanomaterials.

[0004] In order to solve the above technical problems, the present application is realized as follows.

[0005] In a first aspect, a method for manufacturing an electrode microstructure is provided, the method comprising the steps of: providing a flexible plastic member; and sputtering a surface structure layer onto a surface of the plastic member to form an electrode microstructure, the surface structure layer being comprised of a structure of one-dimensional metal nanocrystals, the surface structure layer comprising a plurality of microstructures, the microstructures being spaced apart from one another and distributed on the surface of the plastic member, each of the microstructures having at least one pointed feature, the pointed feature providing a pointed-tip discharge.

[0006] In one embodiment, after the step of forming the electrode microstructure, the method further includes a step of winding the electrode microstructure to form a winding material, such that a surface of the electrode microstructure having the surface structure layer is wound on an outer surface of the winding material.

[0007] In one embodiment thereof, the material of the surface structure layer is copper tungsten, silver tungsten alloy, platinum, nickel fiber, nickel copper, iridium oxide, nickel iridium, copper iridium, or tin antimony oxide.

[0008] In one embodiment thereof, the nano-size of the height and width of the features of the microstructure is between 1 nm and 50 nm.

[0009] In a second aspect, a plastic member and a surface structure layer provided on a surface of the plastic member, the surface structure layer being composed of a structure of one-dimensional metal nanocrystals, the surface structure layer having a plurality of microstructures, the microstructures being distributed on the surface of the plastic member at intervals from one another, the microstructures each having at least one pointed feature, the pointed feature providing an electrode microstructure for providing a pointed tip discharge.

[0010] In one embodiment thereof, the structural shape of the microstructure includes tubular, columnar, linear, strip-like, needle-like, spiral, and / or ring-like.

[0011] In one embodiment thereof, the nano-size of the height and width of the features of the microstructure is between 1 nm and 50 nm.

[0012] The present application provides a method for manufacturing an electrode microstructure, which is formed by directly sputtering a surface structure layer on the surface of a plastic member, the surface structure layer being made of a one-dimensional metal nanocrystal structure, the surface structure layer having a plurality of microstructures, the microstructures being spaced apart from one another and distributed on the surface of the plastic member, each of the microstructures having at least one pointed feature, and the pointed feature providing a pointed-tip discharge, and the electrode microstructure. The pointed feature of the microstructure provides a pointed-tip discharge, which can improve the efficiency of the subsequent electroplating manufacturing process, and the pointed feature of the microstructure can provide a large surface area for reaction with the electroplating material, while the incomplete rough structure of the surface structure layer can also strengthen the bonding strength with the electroplating material. [Brief description of the drawings]

[0013] The drawings described herein are provided to facilitate a deeper understanding of the present application, constitute a part of the application, and the schematic embodiments and description thereof are used to interpret the present application and are not intended to unduly limit the present application. [Figure 1] FIG. 1 is a step block diagram of the manufacturing method of the electrode microstructure of the present application. [Diagram 2] FIG. 2 is a schematic diagram of the electrode microstructure of the present application. [Diagram 3] FIG. 3 is another schematic diagram of the electrode microstructure of the present application. EXAMPLES

[0014] Hereinafter, several embodiments of the present application will be disclosed with reference to the drawings. For clarity, many implementation details will be described together below. However, it should be understood that these implementation details are not intended to limit the present application. That is, in some embodiments of the present application, these implementation details are not necessarily required. In addition, in order to simplify the drawings, some conventional structures and components are simply and diagrammatically shown in the drawings. In the following examples, the same reference numerals refer to the same or similar components.

[0015] Please refer to Figures 1 and 2. Figure 1 is a step block diagram of the manufacturing method of the electrode microstructure of the present application, and Figure 2 is a schematic diagram of the electrode microstructure. As shown in the figures, the present application provides a manufacturing method of the electrode microstructure 1, which includes the following steps S:

[0016] Step S100: Prepare a flexible plastic member 11. In this embodiment, the plastic member 11 is polyethylene terephthalate (PET), and the plastic member 11 is used as a base structure. The plastic member 11 can be folded to form a roll structure. The roll structure of the plastic member 11 is easy to handle in the subsequent related manufacturing processes.

[0017] Step S200: A surface structure layer 13 is sputtered on the surface of the plastic member 11 to form an electrode microstructure 1, the surface structure layer 13 being composed of a structure of one-dimensional metal nanocrystals, the surface structure layer 13 having a plurality of microstructures 131, the microstructures 131 being spaced apart from each other and distributed on the surface of the plastic member 11, each of the microstructures 131 having at least one pointed feature 1311, the pointed feature 1311 providing a pointed tip discharge.

[0018] In this embodiment, the plastic member 11 is treated by sputtering. Sputtering is a physical vapor deposition technique, which refers to a physical process in which atoms in a target material are bombarded by high-energy ions and separated into a gas. In sputtering, a high-voltage negative charge is introduced in a stable vacuum environment to cause dissociation in an inert gas to form plasma. The target material is placed at the cathode position, and the object to be sputtered is placed at the anode position. The cations of the ionized inert gas strike the surface of the target material, and the surface atoms of the target material are struck and deposited on the object to be sputtered, forming a surface structure.

[0019] In this embodiment, the target material includes copper tungsten, silver tungsten alloy, platinum, nickel fiber, nickel copper, iridium oxide, nickel iridium, copper iridium, or tin-antimony oxide. The sputtering target is a flexible plastic member 11, and the target material includes copper tungsten, silver tungsten alloy, platinum, nickel fiber, nickel copper, iridium oxide, nickel iridium, copper iridium, or tin-antimony oxide, and the like. The atoms of the target material are knocked out by the cations of the inert gas, and then the target material is deposited on the surface of the plastic member 11 to form a surface structure layer 13.

[0020] The surface structure layer 13 is made of a one-dimensional nanocrystal nanomaterial. The structure of the one-dimensional nanocrystal has three dimensions, namely, length, width, and height, and two dimensions, namely, width and height, are all nano-sized, and the height and width of the structure of the one-dimensional metal nanocrystal are between 1 nm and 50 nm. The shape of the one-dimensional nanocrystal includes, in addition to the pointed body 1311, a tube, a columnar, a wire, a strip, a needle, a spiral, and / or a ring.

[0021] As described above, in the process of gradually forming the surface structure layer 13 on the target material, the target material sputtered onto the surface of the plastic member 11 cannot form a perfect surface, that is, the state of the surface structure layer 13 sputtered onto the surface of the plastic member 11 cannot reach the structural condition in which two-dimensional metal nanocrystals form a perfect plane. In other words, the state of the surface structure layer 13 sputtered onto the surface of the plastic member 11 has the structural characteristics of an incomplete plane composed of one-dimensional metal nanocrystals.

[0022] Furthermore, the surface structure layer 13 is composed of a plurality of microstructures 131, and the plurality of microstructures 131 of the surface structure layer 13 are distributed separately on the surface of the plastic member 11, and the plurality of microstructures 131 have a block-shaped island-like structure, and the side edges of the microstructures 131 are not connected to each other.

[0023] Furthermore, when the microstructures 131 of the surface structure layer 13 are distributed on the plastic member 12, each of the microstructures 131 has at least one pointed body 1311. The pointed body 1311 of the microstructures 131 can provide a pointed discharge, and the sharper the conductive tip, the more prominent the pointed effect. This is because the higher the charge density on the surface of the part with a large curvature of the object surface (for example, the tip of a pointed, thin and small object), the stronger the electric field strength, thus enhancing the effect of electronic discharge. In other words, since the microstructures 131 are separated from each other, each of the microstructures 131 can be regarded as a structure that can discharge independently, and the pointed body 1311 of the microstructures 131 of the surface structure layer 13 can produce the effect of pointed discharge, strengthen the effect of electronic discharge, and improve the efficiency of the manufacturing process.

[0024] In this manner, the discharge action of the pointed bodies 1311 of the microstructures 131 of the surface structure layer 13 of this embodiment is useful for applications such as water electrolysis and material deposition, and can be used according to the needs of the user.

[0025] Furthermore, the surface structure layer 13 is an imperfect, planar, rough structure surface made of a one-dimensional metal nanocrystal structure, i.e., due to each of the cusp features 1311 of the microstructure 131, the surface of the surface structure layer 13 presents a three-dimensional uneven structure. The surface structure layer 13 made of one-dimensional metal nanocrystals has a larger surface area than a typical perfect plane, which is advantageous for providing a large surface area for reaction with the electroplating material for electroplating production, as mentioned above, and the rough structure surface of the surface structure layer 13 can also strengthen the bonding strength with the electroplating material.

[0026] 1 and 3, FIG. 3 is another schematic diagram of the electrode microstructure of the present application. As shown in the figure, in this embodiment, since the flexible plastic member 11 is used as a base, after the step S300: forming the electrode microstructure 1, the electrode microstructure 1 can be further wound to form a winding material 3, so that the surface of the electrode microstructure 1 having the surface structure layer 13 is wound on the outer surface 112 of the winding material 3. In addition, another surface structure layer can be fabricated on the inner surface 111 of another surface of the outer surface 112 of the plastic member 11 according to the needs of the user (not shown).

[0027] In summary, the present application provides a method for manufacturing an electrode microstructure and the electrode microstructure. A surface structure layer, which is an incomplete rough structure surface composed of a one-dimensional metal nanocrystal structure, is formed on a plastic member to form a large surface area. The surface structure layer comprises a plurality of microstructures, which are distributed on the surface of the plastic member, and each of the microstructures has at least one sharp tip. The sharp tip of such a microstructure can provide a sharp tip discharge, which can improve the efficiency of the subsequent electroplating manufacturing process, and can provide a large surface area for reaction with the electroplating material, while the rough structure surface of the surface structure layer can also strengthen the bonding strength with the electroplating material.

[0028] It should be noted that the technical terms "comprises," "including," or any other alternatives thereof are intended to include a non-exclusive inclusion such that a process, method, product, or apparatus of a set of elements not only includes those elements, but also includes other elements not expressly stated or inherent to such process, method, product, or apparatus. Unless otherwise specified, an element defined by the term "comprises a" does not exclude the inclusion of other identical elements within the process, method, product, or apparatus of the set of elements.

[0029] Although several preferred embodiments of the present application have been described above, as mentioned above, the present application is not limited to the forms disclosed herein, and should not be considered to exclude other embodiments. It can be used in various other combinations, modifications, and environments, and can be improved based on the above teachings and the technology or knowledge of related fields within the spirit of the present invention. It should be understood that all improvements and modifications made by those skilled in the art are within the scope of protection of the claims of the present application as long as they do not deviate from the spirit and scope of the present application. [Explanation of symbols]

[0030] 1: Electrode microstructure 11: Plastic parts 111:Inside 112: Exterior 13: Surface structure layer 131: Fine structure 1311: Acuminate 3: Rolling material

Claims

1. Providing a flexible plastic member; sputtering a surface structure layer on the surface of the plastic member to form an electrode microstructure; Including, The surface structure layer is composed of a one-dimensional metal nanocrystal structure, the surface structure layer comprises a plurality of microstructures; the microstructures are distributed at intervals on the surface of the plastic member; each of the microstructures having at least one cusp; The pointed feature provides a pointed discharge. Method for manufacturing electrode microstructures.

2. After the step of forming the electrode microstructure, further comprising the step of winding the electrode microstructure to form a winding, such that a surface of the electrode microstructure having the surface structure layer is wound on an outer surface of the winding. A method for producing the electrode microstructure of claim 1 .

3. The material of the surface structure layer is copper tungsten, silver tungsten alloy, platinum, nickel fiber, nickel copper, iridium oxide, nickel iridium, copper iridium or tin antimony oxide; A method for producing the electrode microstructure of claim 1 .

4. The nano-size of the height and width of the structures of the microstructure is between 1 nm and 50 nm; A method for producing the electrode microstructure of claim 1 .

5. A plastic member; A surface structure layer provided on the surface of the plastic member; Equipped with The surface structure layer is composed of a one-dimensional metal nanocrystal structure, the surface structure layer comprises a plurality of microstructures; the microstructures are distributed at intervals on the surface of the plastic member; each of the microstructures having at least one cusp; The pointed feature provides a pointed discharge. Electrode microstructure.

6. The structural shape of the microstructure further includes tubular, columnar, linear, strip, needle, spiral and / or ring. The electrode microstructure of claim 5.

7. The nano-size of the height and width of the structures of the microstructure is between 1 nm and 50 nm; The electrode microstructure of claim 5.

Citation Information

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