Protective sheet, electronic device package, and manufacturing method thereof

Abstract

To provide a protective sheet for a circuit board for protecting an IC chip mounted onto a substrate from an electromagnetic wave, and securing a good heat dissipation.SOLUTION: A protective sheet 38 for a circuit board has: a first surface (first protection layer 32 side); and a second surface (second protection layer 34 side) on the side opposite to the first surface. An adhesion force by a probe tack test of the first surface is 0.15 N / cm2 or less, and an index X calculated by the following formula 1 is 0.5 to 2.0, and contains a filler in a content amount of 1.0 to 9.8 mass%: Formula 1 of X=Ftotal / Ttotal. The Ftotal is an average (μm) of four sides of a flow length of a part where there is the most flow in each side when the protective sheet in a rectangular form of 0.5 cm*1.0 cm is heated and pressed for 5 minutes under 180°C and 1 MPa, and the Ttotal is a total thickness (μm) of the protective sheet.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a protective sheet, an electronic device package, and a method for manufacturing the same. [Background technology]

[0002] A method is known in which an insulating layer is formed on a substrate on which an IC chip is mounted to protect the chip from electromagnetic waves (for example, Patent Document 1). [Patent Document 1] U.S. Patent Publication No. 7,445,968 General Disclosure

[0003] In a first aspect of the present invention, there is provided a protective sheet for a circuit board having a first surface and a second surface opposite to the first surface, the adhesive strength of the first surface being 0.15 N / cm in a probe tack test. 2 The present invention provides a protective sheet for circuit boards, wherein the index X determined by the following formula 1 is 0.5 to 2.0: [Formula 1] X=F total / T total (F total The average flow length (μm) of the four sides of the part with the greatest flow on each side when a protective sheet cut into a rectangle of 0.5 cm × 1.0 cm is heated and pressed at 180°C and 1 MPa for 5 minutes, T total ; Total thickness of protective sheet (μm)

[0004] The protective sheet has a tensile breaking strength of 10 to 70 N / mm 2 It may be.

[0005] The protective sheet may include a first protective layer and a second protective layer. The first protective layer may be the outermost layer on the first surface side of the protective sheet. Furthermore, the second protective layer may be the outermost layer on the second surface side of the protective sheet.

[0006] In any of the protective sheets described above, the second protective layer may have an index Y determined by the following formula 2 of 0.5 to 1.5. [Formula 2] Y=F2 / T2 (F2: average of the four sides of the flow length of the most flowing part on each side when the second protective layer is cut into a rectangle of 0.5 cm x 1.0 cm and heated and pressed at 180°C and 1 MPa for 5 minutes (μm); T2: thickness of the second protective layer (μm))

[0007] In any of the protective sheets described above, the first protective layer may have an index Z determined by the following formula 3 of 2.0 to 15.0. [Formula 3] Z=F1 / T1 (F1: average of the four sides of the flow length of the part with the greatest flow on each side when a rectangular first protective layer of 0.5 cm x 1.0 cm is heated and pressed at 180°C and 1 MPa for 5 minutes, T1: thickness of the first protective layer (μm))

[0008] In any of the above protective sheets, the second protective layer may have a glass transition temperature of 60° C. or lower.

[0009] In any of the above protective sheets, the first protective layer may have a thickness of 5 to 150 μm, and the second protective layer may have a thickness of 10 to 200 μm.

[0010] Any of the protective sheets described above may further include a third protective layer between the first protective layer and the second protective layer, and the third protective layer may have an index W of 1.0 to 3.0 as determined by the following formula 4: [Formula 4] W=F3 / T3 (F3: average of the four sides of the flow length of the most flowing part on each side when the third protective layer is cut into a rectangle of 0.5 cm x 1.0 cm and heated and pressed at 180°C and 1 MPa for 5 minutes (μm); T3: thickness of the third protective layer (μm))

[0011] In any of the above protective sheets, the third protective layer may have a thickness of 20 to 200 μm.

[0012] In any of the protective sheets described above, the first protective layer, the second protective layer and the third protective layer may contain a polyurethane resin and a curing agent.

[0013] In any of the protective sheets described above, the protective sheet may contain a filler, and the mass concentration of the filler on the second surface side of the protective sheet may be greater than that on the first surface side.

[0014] In addition, in a second aspect, there is provided an electronic device package comprising: a circuit board having a conductive circuit on a surface thereof; an electronic device arranged on the circuit board; and a protective layer provided on the circuit board and the electronic device, wherein the electronic device has a polygonal shape with five or more sides when observed from a main surface of the circuit board or from a side of the main surface.

[0015] In the electronic device package, the electronic device may have a recess on a side surface.

[0016] In any of the above electronic device packages, the electronic device may have a polygonal shape having five or more sides when observed on a main surface.

[0017] In addition, in a third aspect, there is provided an electronic device package comprising a circuit board having a conductive circuit on a surface thereof, an electronic device arranged on the circuit board, and a protective layer provided on the circuit board and the electronic device, the protective layer at least partially covering a connection member electrically connecting the electronic device and the circuit board.

[0018] In the electronic device package, the connection members may be bumps disposed on the bottom surface of the electronic device.

[0019] In any of the above electronic device packages, the connection member may be a lead frame on which the electronic device is mounted.

[0020] In addition, in a fourth aspect, there is provided an electronic device package comprising: a circuit board having a conductive circuit on a surface thereof; an electronic device arranged on the circuit board; and a protective layer provided on the circuit board and the electronic device, wherein the electronic device has a multilayer ceramic capacitor (MLCC).

[0021] In the above electronic device package, the protective layer may include at least two layers.

[0022] In any of the above electronic device packages, the protective layer may be a cured product of a thermosetting resin.

[0023] In any of the above electronic device packages, a conductive layer may be formed on the protective layer.

[0024] In a fifth aspect, there is provided a method for manufacturing an electronic device package, comprising the steps of: placing any of the above protective sheets on a mounting board having an electronic device mounted on a substrate having a conductive circuit on its surface, with a first surface facing the electronic device, to form a protective layer made of the protective sheet on the mounting board.

[0025] In the above manufacturing method, the step of forming the protective layer may include heat pressing the protective sheet onto the mounting board after the protective sheet is disposed.

[0026] The above manufacturing method may further include a step of forming a conductive layer on the protective layer.

[0027] The above summary of the invention does not list all of the necessary features of the present invention. Also, subcombinations of these features may also be inventions. [Brief description of the drawings]

[0028] [Figure 1] 1 shows an example of an electronic device package 100 according to the present embodiment. [Diagram 2] An example of the protective sheet 38 in this embodiment is shown. [Diagram 3] 4 shows an example of a flow length in this embodiment. [Figure 4] 2 shows another example of the protective sheet 38 in this embodiment. [Diagram 5]An example of a flow of a method for manufacturing the electronic device package 100 of this embodiment will be described. [Figure 6] An example of S200 in the flow of FIG. 5 is shown below. [Figure 7] An example of a mounting substrate 12 on which a protective layer 30 is formed is shown. [Figure 8] An example of a metal-containing sheet 46 is shown. [Figure 9] An example of S300 using a metal-containing sheet 46 is shown. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0029] The present invention will be described below through embodiments of the invention, but the following embodiments do not limit the scope of the invention according to the claims. In addition, not all of the combinations of features described in the embodiments are necessarily essential to the solution of the invention.

[0030] 1 shows an example of an electronic device package 100 in this embodiment. The electronic device package 100 is a package in which an electronic device such as an IC chip is mounted, and has good electromagnetic shielding and heat dissipation properties. The electronic device package 100 includes a circuit board 10, an electronic device 20 and an electronic device 22 (hereinafter also simply referred to as "electronic device 20, etc."), a connection member 24, a protective layer 30, and a conductive layer 40.

[0031] The circuit board 10 has a conductive circuit (not shown) provided on its surface, and mounts an electronic device 20 or the like. The circuit board 10 may be a printed wiring board, a mounting module board, or the like. The conductive circuit may be a circuit formed of a conductive metal such as copper or a material containing a conductive metal. The circuit board 10 may be a rigid board or a flexible board.

[0032] If necessary, the circuit board 10 may be processed. For example, the circuit board 10 may be provided with printing, markings, dicing grooves, and the like.

[0033] The electronic device 20 and the like are disposed on the circuit board 10 and perform various functions. The electronic device 20 and the like may be, for example, an integrated circuit such as a memory chip, a power chip, a sound source chip, or a CPU chip, an active element such as a transistor or a diode, or a passive element such as a capacitor such as a multilayer ceramic capacitor (MLCC), a thermistor, an inductor, or a resistor. In particular, an MLCC has external electrodes on its side, and is highly required to be insulated and protected from the viewpoint of preventing contact with other conductors and electric leakage. According to the protective sheet of this embodiment described later, the entire MLCC component can be sufficiently insulated and protected by the protective layer 30.

[0034] The electronic device 20 etc. may have a cubic or rectangular parallelepiped shape. The electronic device 20 etc. may have a more complicated shape, and may have a polygon with five or more sides when observed on the main surface of the circuit board (the XY plane in FIG. 1).

[0035] For example, the electronic device 20 etc. may have a hexagonal, octagonal, or other polygonal planar shape when observed from the main surface. As an example, the electronic device 22 may be an inductor having an octagonal planar shape. Also, the electronic device 20 etc. may have a polygonal shape with 5 or more sides when observed from the side of the main surface (such as the XZ plane or YZ plane in FIG. 1). For example, the electronic device 20 etc. may have a cubic or rectangular parallelepiped shape with recesses or protrusions on the side, and the electronic device 22 may be an inductor provided with a recess for forming a coil on the side.

[0036] A single electronic device 20 or a plurality of electronic devices may be arranged on the circuit board 10. For example, the electronic devices 20 may be formed in an n×m array on the circuit board 10 (n and m are integers of 2 or more).

[0037] The thickness of the electronic devices 20, etc. is desirably 2000 μm or less. If it exceeds 2000 μm, there is a risk of the electronic devices being torn at the step with the circuit board 10 when forming the protective layer 30 and the conductive layer 40. In addition, the distance between the electronic devices 20 is desirably 50 μm or more. If the distance is less than 50 μm, there is a risk of the protective layer 30 and the conductive layer 40 not being sufficiently formed.

[0038] The connection members 24 electrically connect the electronic device 20 and the circuit board 10. The connection members 24 may include one or more of bumps such as solder balls arranged on the underside of the electronic device 20, a lead frame on which the electronic device 20 is mounted, and bonding wires. In the example of FIG. 1, bumps are used as the connection members 24 that connect the electronic device 20 and the circuit board 10.

[0039] The protective layer 30 is provided on the circuit board 10, the electronic device 20, etc., and protects the circuit board 10, the electronic device 20, etc. from electromagnetic waves, impacts, etc. The protective layer 30 also plays a role in insulating and protecting the circuit board 10, the electronic device 20, etc. from the conductive layer 40. The protective layer 30 may cover the electronic device 20, etc., and the entire or part of the area of ​​the circuit board 10 where the electronic device 20, etc. are not provided. The protective layer 30 may cover only the area of ​​the circuit board 10 where the conductive circuit is provided, and need not cover the area where there is no conductive circuit.

[0040] As described above, even when the electronic device 20 or the like has a complex shape such as a polygon, the protective layer 30 sufficiently covers the electronic device 20 or the like. For example, even when the electronic device 22 has a recess on the side as shown in Fig. 1, the protective layer 30 fills a part or the whole of the recess to protect the electronic device 22. Furthermore, even when the electronic device 20 or the like has a shape with many corners such as a polygon that makes the thickness of the protective layer 30 prone to become thin, the protective layer 30 of this embodiment can cover the corners with a sufficient thickness.

[0041] The protective layer 30 may at least partially cover the connection member 24. For example, in Fig. 1, the protective layer 30 covers the side surface of the connection member 24, which is a bump. Even if the connection member 24 includes a lead frame or a bonding wire, the protective layer 30 may cover at least a part of these.

[0042] The protective layer 30 may be a cured product of a thermosetting resin or the like. The protective layer 30 may include at least two layers. For example, the protective layer 30 may be two layers, three layers, or four or more layers. In order to keep the film thickness of the protective layer 30 within an appropriate range, the protective layer 30 is preferably three layers. Such layers may be formed based on the layer structure of the protective sheet described later. The layer structure and materials of the protective layer 30 will be described later.

[0043] The protective layer 30 may have a different thickness depending on the location. For example, the protective layer 30 may be thinner at the corners of the electronic device 20 than at the top surface of the electronic device 20. Also, for example, the protective layer 30 may be thicker at the corner recess where the electronic device 20 and the circuit board 10 contact each other than the top surface of the electronic device 20.

[0044] The conductive layer 40 is provided on the protective layer 30, and protects the electronic device 20 and the like from external electromagnetic waves and / or dissipates heat generated from the electronic device 20 and the like to the outside. The conductive layer 40 may be a layer containing a metal. For example, the conductive layer 40 may be a metal thin film formed of a metal itself, or a resin layer in which a conductive filler is dispersed. Details of the material of the conductive layer 40 will be described later.

[0045] The thickness of the conductive layer 40 may be 2 to 500 μm, preferably 5 to 100 μm, when it is a thermosetting resin containing a conductive filler. On the other hand, when it is plated, vapor-deposited, or sputtered, it may be 0.01 to 10 μm, preferably 0.1 to 5 μm. If the thickness is too thin, the electromagnetic wave blocking effect, heat dissipation effect, and mechanical strength may be insufficient, and if it is too thick, the electronic device package 100 may become unnecessarily large and bulky.

[0046] The metal thin film and conductive filler used in the conductive layer 40 preferably have good electrical conductivity and / or thermal conductivity. For example, the volume resistivity is 10 -3 It may have a thermal conductivity of 10 W / m K or more and / or a thickness of Ω·cm or less.

[0047] The conductive layer 40 may be connected to a ground pattern exposed on the side or top surface of the circuit board 10 and / or a ground pattern of the electronic device 20. The electronic device package 100 does not necessarily have to have the conductive layer 40.

[0048] Thus, in the electronic device package 100 according to the present embodiment, the protective layer 30 insulates and protects the electronic device 20 and the like, which have complex shapes, and the connection members 24. Moreover, in the electronic device package 100, the conductive layer 40 protects the electronic device 20 and the like from electromagnetic waves, while also enabling dissipation of heat generated by the electronic device 20 and the like.

[0049] As described below, the protective layer 30 can be formed of a protective sheet 38. The protective sheet 38 prevents air from being trapped between the protective layer 30 and the circuit board 10, and can adequately cover the periphery of the electronic device 20 or the like having a complex shape to provide insulating protection.

[0050] Fig. 2 shows an example of a protective sheet 38 in this embodiment. The protective sheet 38 is a sheet for a circuit board, and is used to form the protective layer 30 shown in Fig. 1. As shown in the figure, the protective sheet 38 has a first protective layer 32, a second protective layer 34, and a third protective layer 36.

[0051] The protective sheet 38 has a first surface (lower side in FIG. 1) and a second surface (upper side in FIG. 1) opposite to the first surface. The first surface side is the side that contacts the circuit board 10, the electronic device 20, etc., and the second surface side is the side that contacts the conductive layer 40. The first protective layer 32 is the outermost layer on the first surface side of the protective sheet 38. The second protective layer 34 is the outermost layer on the second surface side. The third protective layer 36 is provided between the first protective layer 32 and the second protective layer 34.

[0052] The adhesive strength of the first surface of the protective sheet 38 measured by a probe tack test is 0.15 N / cm 2 Less than or equal to 0.12N / cm 2 Less than or equal to 0.10 N / cm 2 The probe tack test may be performed by the same test method as or a test method conforming to the Japanese Pharmacopoeia, 18th Edition, General Test Methods, 6. Preparation Test Methods, 6.12 Adhesive Strength Test Method, 3.4 Probe Tack Test Method.

[0053] By ensuring that the adhesive strength satisfies the above range, the adhesiveness of protective sheet 38 can be suppressed when protective sheet 38 is placed on circuit board 10, and it is possible to prevent unintended portions of protective sheet 38 from sticking to circuit board 10 or from spreading when wet (so-called puddling). Furthermore, if protective sheet 38 has high tackiness, it may stick to circuit board 10 when pressed, hindering air escape (so-called air entrapment). However, protective sheet 38 with an adhesive strength that satisfies the above range allows air to escape smoothly.

[0054] The adhesive strength of the second surface of the protective sheet 38 measured by a probe tack test is 0.01 N / cm 2 More than 0.05N / cm 2 More preferably, 0.10N / cm 2 The difference in adhesive strength between the first and second surfaces may be 0.05 N / cm 2 ~0.40N / cm 2 , preferably 0.05N / cm 2 ~0.30N / cm 2 , more preferably 0.10 N / cm 2 ~0.20N / cm 2 When the adhesive strength satisfies the above range, the adhesion between the cushioning material that is laminated on the protective sheet in contact with the second surface and the second surface is sufficiently ensured, and pressing can be performed efficiently. The cushioning material can be laminated on the protective sheet for the purpose of applying an appropriate pressure to the protective sheet during hot pressing.

[0055] In addition, the protective sheet 38 may have an index X determined by the following formula 1 of 0.5 to 2.0, preferably 0.6 to 1.7, and more preferably 0.7 to 1.5. [Formula 1] X=F total / T total Here, F total is the average (μm) of the four sides of the flow length of the part that flows most on each side when a rectangular protective sheet 38 of 0.5 cm × 1.0 cm is heated and pressed at 180°C and 1 MPa for 5 minutes. total is the total thickness (μm) of protective sheet 38, which in the case of protective sheet 38 in Fig. 2 is equal to the sum of the thicknesses of first protective layer 32, second protective layer 34, and third protective layer 36. If protective sheet 38 includes a release layer, the total thickness does not include the thickness of the release layer.

[0056] 3 shows an example of the flow length in this embodiment. Protective sheet 38 was sandwiched between two polyimide films and cut into a standard rectangular shape of 0.5 cm x 1.0 cm. This was pressed at 1 MPa for 5 minutes while maintaining the temperature at 180°C. During this process, a part of protective sheet 38 softens and flows out from between the polyimide films, and the length from the polyimide film to the part that flows the most was measured for each side.

[0057] For example, as shown in Fig. 3, flow occurs so that the film protrudes from the four sides of a polyimide film 35 having the same shape (standard shape) as the protective sheet 38 before pressing. Here, for each of the four sides, lengths L1 to L4 from the side of the most flowing part are measured along a straight line extending at 90 degrees from each side of the polyimide film 35. The average of the flow lengths L1 to L4 of the four sides, expressed in µm, is the flow length F. total (μm).

[0058] When the index X is within the above range, a sufficient amount of the protective layer 30 is formed around the circuit board 10 and the electronic device 20, etc., and the electronic device package 100 can be more reliably insulated and protected. On the other hand, when the index X is too large, the fluidity of the protective sheet 38 during thermocompression bonding is too high, causing a problem that the thickness of some parts of the protective layer 30 (for example, corners of the electronic device 20, etc.) is insufficient.

[0059] If the index X is smaller than the above range, the protective sheet 38 will not have sufficient fluidity during thermocompression bonding, and the electronic device 20, etc. will not be sufficiently insulated and protected by the protective layer 30, which may result in a risk of insufficient voltage resistance. For example, there is a risk that the protective layer 30 will not be sufficiently formed around the recessed corners where the circuit board 10 and the electronic device 20, etc. meet, around the connecting members 24, and / or around the electronic device 20, etc. having a complex shape (particularly in recesses).

[0060] The protective sheet 38 has a tensile breaking strength of 10 to 70 N / mm 2 and preferably 15 to 50 N / mm 2 More preferably, it is 20 to 40 N / mm 2 The tensile breaking strength may be measured in accordance with JIS-C-2151:2019. For example, the tensile breaking strength may be calculated by using a tensile tester to pull protective sheet 38 at a speed of 50 mm / min per minute in an environment of 23°C and 60% RH, and calculating the strength (tensile load value / cross-sectional area of ​​protective sheet 38) when protective sheet 38 breaks.

[0061] If the tensile breaking strength is too high, the protective sheet 38 will not have sufficient fluidity during thermocompression bonding, and there is a risk that the electronic device 20, etc. will not be sufficiently insulated and protected by the protective layer 30. If the tensile breaking strength is too low, the protective sheet 38 will have too much fluidity during thermocompression bonding, causing a problem of insufficient thickness in some parts of the protective layer 30 (for example, corners of the electronic device 20, etc.). On the other hand, if the tensile breaking strength is within the above range, a sufficient amount of protective layer 30 will be formed around the circuit board 10 and the electronic device 20, etc., and the electronic device package 100 can be more reliably insulated and protected.

[0062] The protective sheet 38 may have a thickness of 50 to 500 μm, preferably 100 to 250 μm.

[0063] The main role of the first protective layer 32 is to impart fluidity to the protective sheet 38. The first protective layer 32 may have an index Z calculated by the following formula 2 of 2.0 to 15.0, preferably 4.0 to 12.0, and more preferably 5.0 to 10.0. [Formula 2] Z=F1 / T1 Here, F1 is the average (μm) of the four sides of the flow length of the most flowing part on each side when the first protective layer 32 is cut into a rectangle of 0.5 cm x 1.0 cm and heated and pressed at 180°C and 1 MPa for 5 minutes. T1 is the thickness (μm) of the first protective layer 32. F1 is the F total may be measured in a similar manner.

[0064] As described above, the index Z has a numerical range larger than that of the index X. This allows the first protective layer 32 to flow well during thermocompression bonding of the protective sheet 38, and to penetrate into the periphery (particularly recesses) of the electronic device 20 having a complex shape, the connecting member 24, and / or the gap between the circuit board 10 and the electronic device 20, etc.

[0065] If the index Z is too large, the fluidity becomes too high, causing a problem of insufficient thickness at some parts of the protective layer 30 (for example, corners of the electronic device 20, etc.). On the other hand, if the index Z is smaller than the above range, the fluidity of the protective sheet 38 during thermocompression bonding is insufficient, causing a risk that the electronic device 20, etc. will not be sufficiently insulated and protected by the protective layer 30. On the other hand, if the index Z is within the above range, a sufficient amount of the protective layer 30 is formed around the circuit board 10 and the electronic device 20, etc., and the electronic device package 100 can be more reliably insulated and protected.

[0066] The thickness of the first protective layer 32 may be 5 to 150 μm, more preferably 5 to 50 μm, and more preferably 10 to 30 μm. When the thickness of the first protective layer 32 is within the above range, the adhesiveness of the protective sheet 38 can be suppressed while providing appropriate fluidity.

[0067] The glass transition temperature of the first protective layer 32 may be 80° C. or lower, preferably 60° C. or lower, and more preferably 50° C. or lower. The glass transition temperature of the first protective layer 32 may be 20° C. or higher, preferably 30° C. or higher, and more preferably 35° C. or higher.

[0068] The second protective layer 34 mainly serves to prevent ion migration of metal ions from the conductive layer 40 in contact with it, while ensuring the thickness of the protective layer 30. The second protective layer 34 may have an index Y calculated by the following formula 3 of 0.5 to 1.5, preferably 0.6 to 1.4, and more preferably 0.7 to 1.2. [Formula 3] Y=F2 / T2 Here, F2 is the average (μm) of the four sides of the flow length of the most flowing part on each side when the second protective layer 34 is cut into a rectangle of 0.5 cm × 1.0 cm and heated and pressed at 180°C and 1 MPa for 5 minutes. T2 is the thickness (μm) of the second protective layer 34. F2 is F total may be measured in a similar manner.

[0069] As described above, when the index Y falls within the above range, the second protective layer 34 does not flow too much when the protective sheet 38 is thermocompression bonded, and remains firmly in parts where the protective layer 30 is likely to be thin, such as corners of the electronic device 20. This makes it possible to more reliably insulate and protect the electronic device package 100. Furthermore, when the conductive layer 40 is formed on the protective layer 30, ion migration from the conductive layer 40 can be sufficiently prevented.

[0070] If the index Y is too large, the fluidity of the protective sheet 38 during thermocompression bonding is too high, causing a problem of insufficient thickness at some parts of the protective layer 30 (for example, corners of the electronic device 20, etc.). On the other hand, if the index Y is smaller than the above range, the fluidity of the protective sheet 38 during thermocompression bonding is insufficient, so that the electronic device 20, etc. is not sufficiently insulated and protected by the protective layer 30, and there is a risk of ion migration.

[0071] The thickness of the second protective layer 34 may be 10 to 200 μm, more preferably 30 to 150 μm, and more preferably 50 to 100 μm. When the thickness of the second protective layer 34 satisfies the above conditions, the thickness of the entire protective layer 30 can be ensured while maintaining the heat dissipation properties of the electronic device 20, etc.

[0072] The second protective layer 34 may be thicker than the first protective layer 32. In this case, it is possible to more reliably prevent the thickness from being insufficient in a part of the protective layer 30 (for example, a corner of the electronic device 20, etc.). Furthermore, the first protective layer 32 may be thicker than the second protective layer 34. In this case, it is possible to more reliably protect the periphery (particularly recesses) of the electronic device 20, etc. having a complex shape, the connection member 24, and / or the gap between the circuit board 10 and the electronic device 20, etc. with the protective layer 30.

[0073] The glass transition temperature of the second protective layer 34 may be 60° C. or lower, preferably 50° C. or lower, and more preferably 40° C. or lower. The glass transition temperature of the second protective layer 34 may be 0° C. or higher, preferably 10° C. or higher, and more preferably 20° C. or higher. The glass transition temperature of the second protective layer 34 may be lower than the glass transition temperature of the first protective layer 32. This ensures sufficient adhesion between the cushioning material that comes into contact with the second protective layer 34 during hot pressing and the second protective layer 34, allowing efficient pressing.

[0074] The second protective layer 34 has a main role of ensuring a certain degree of fluidity while also ensuring the thickness of the protective layer 30. The third protective layer 36 may have an index W calculated by the following formula 4 of 1.0 to 3.0, preferably 1.2 to 2.7, and more preferably 1.5 to 2.5. [Formula 4] W=F3 / T3 Here, F3 is the average (μm) of the four sides of the flow length of the part that flows most on each side when the third protective layer 36 is cut into a rectangle of 0.5 cm x 1.0 cm and heated and pressed at 180°C and 1 MPa for 5 minutes. T3 is the thickness (μm) of the third protective layer 36. F3 is the F total may be measured in a similar manner.

[0075] As described above, the index W is in a numerical range between the indexes Y and Z. As a result, when the protective sheet 38 is thermocompression-bonded, the third protective layer 36 has fluidity between the first protective layer 32 and the second protective layer 34, and has an effect of complementing the coverage by the first protective layer 32 and the second protective layer 34.

[0076] The thickness of the third protective layer 36 may be 20 to 200 μm, more preferably 30 to 150 μm, and more preferably 40 to 80 μm. When the thickness of the third protective layer 36 satisfies the above conditions, it is possible to obtain an effect of protecting the periphery (particularly recesses) of the electronic device 20 having a complex shape, the connection member 24, and / or the gap between the circuit board 10 and the electronic device 20, etc., with the protective layer 30, and an effect of the protective layer 30 remaining firmly in the portion where the thickness is likely to become thin.

[0077] The third protective layer 36 may be composed of a plurality of layers. For example, the third protective layer 36 may be composed of two identical resin films laminated together.

[0078] The third protective layer 36 may be thicker than the first protective layer 32. In this case, it is possible to more reliably prevent the thickness from being insufficient in a part of the protective layer 30 (for example, a corner of the electronic device 20, etc.). Furthermore, the first protective layer 32 may be thicker than the third protective layer 36. In this case, it is possible to more reliably protect the periphery (particularly recesses) of the electronic device 20, etc. having a complex shape, the connection member 24, and / or the gap between the circuit board 10 and the electronic device 20, etc. with the protective layer 30.

[0079] The glass transition temperature of the third protective layer 36 may be 60° C. or lower, preferably 50° C. or lower, and more preferably 40° C. or lower. The glass transition temperature of the third protective layer 36 may be 0° C. or higher, preferably 10° C. or higher, and more preferably 20° C. or higher. The glass transition temperature of the third protective layer 36 may be lower than the glass transition temperature of the first protective layer 32. This improves the impact absorption of the third protective layer 36, and the impact absorption of the entire protective layer 30 can be increased.

[0080] At high temperatures, the second protective layer 34 may have properties that are harder than the first protective layer 32. For example, at 120°C, the Young's modulus of the second protective layer 34 may be higher than that of the first protective layer 32. For example, at 120°C, the Young's modulus of the first protective layer 32 may be 0.5 to 3, and the Young's modulus of the second protective layer 34 may be 3 to 7. The Young's modulus of the third protective layer 36 may be intermediate between those of the first protective layer 32 and the second protective layer 34, and may be, for example, 1.5 to 3.5 at 120°C. When the first protective layer 32 to the third protective layer 36 have such Young's moduli, the protective sheet 38 can exhibit appropriate fluidity at the high temperatures at which heat pressing is performed.

[0081] The first protective layer 32, the second protective layer 34, and the third protective layer 36 may be a thermosetting resin. For example, the first protective layer 32, the second protective layer 34, and the third protective layer 36 may include a thermosetting resin and a curing agent.

[0082] The thermosetting resin may be a polymer having one or more functional groups in one molecule that undergo a crosslinking reaction upon heating. The functional groups may be, for example, one or more of hydroxyl groups, phenolic hydroxyl groups, methoxymethyl groups, carboxyl groups, amino groups, epoxy groups, oxetanyl groups, oxazoline groups, oxazine groups, aziridine groups, thiol groups, isocyanate groups, blocked isocyanate groups, blocked carboxyl groups, and silanol groups.

[0083] Examples of the thermosetting resin include one or more of polyurethane resin, acrylic resin, maleic acid resin, polybutadiene resin, polyester resin, urea resin, epoxy resin, oxetane resin, phenoxy resin, polyimide resin, polyamide resin, polyamideimide resin, phenol resin, cresol resin, melamine resin, alkyd resin, amino resin, polylactic acid resin, oxazoline resin, benzoxazine resin, silicone resin, and fluorine resin. Two or three of the first protective layer 32, the second protective layer 34, and the third protective layer 36 may use the same or similar resin as the thermosetting resin.

[0084] As the curing agent, one or more of epoxy-based curing agents, aziridine-based curing agents, phenol-based curing agents, amine-based curing agents, isocyanate-based curing agents, and metal chelate-based curing agents may be used. The aziridine-based curing agent may be a curing agent containing a compound having an aziridine group, the phenol-based curing agent may be a curing agent containing a compound having a structure in which a hydroxyl group is directly bonded to an aromatic group (aromatic ring), the amine-based curing agent may be a curing agent containing a compound having an amino group, and the isocyanate-based curing agent may be a curing agent containing a compound containing an isocyanate group. The metal chelate-based curing agent may be a curing agent containing a complex formed by coordination of a multidentate ligand (chelate ligand) with a metal ion. The same or similar curing agents may be used for two or three of the first protective layer 32, the second protective layer 34, and the third protective layer 36.

[0085] The epoxy-based curing agent may be an epoxy compound. An epoxy compound is a compound having two or more epoxy groups in one molecule. The epoxy compound may be in either a liquid or solid form. The epoxy compound may be, for example, a glycidyl ether type epoxy compound, a glycidyl amine type epoxy compound, a glycidyl ester type epoxy compound, or a cyclic aliphatic (alicyclic) epoxy compound.

[0086] The glycidyl ether type epoxy compound may be selected from one or more of, for example, bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, bisphenol AD ​​type epoxy compounds, cresol novolac type epoxy compounds, phenol novolac type epoxy compounds, α-naphthol novolac type epoxy compounds, bisphenol A type novolac type epoxy compounds, dicyclopentadiene type epoxy compounds, tetrabromobisphenol A type epoxy compounds, brominated phenol novolac type epoxy compounds, tris(glycidyloxyphenyl)methane, tetrakis(glycidyloxyphenyl)ethane, and the like.

[0087] Examples of the glycidylamine type epoxy compound include tetraglycidyldiaminodiphenylmethane, triglycidyl paraaminophenol, triglycidyl meta-aminophenol, and tetraglycidyl meta-xylylenediamine.

[0088] Examples of the glycidyl ester type epoxy compound include diglycidyl phthalate, diglycidyl hexahydrophthalate, and diglycidyl tetrahydrophthalate.

[0089] Examples of cyclic aliphatic (alicyclic) epoxy compounds include epoxycyclohexylmethyl-epoxycyclohexanecarboxylate, bis(epoxycyclohexyl)adipate, etc. Liquid epoxy compounds may also be used.

[0090] The aziridine-based curing agent may be an aziridine compound. Examples of the aziridine compound include N,N'-diphenylmethane-4,4'-bis(1-aziridinecarboxite), N,N'-toluene-2,4-bis(1-aziridinecarboxite), bisisophthaloyl-1-(2-methylaziridine), tri-1-aziridinylphosphine oxide, N,N'-hexamethylene-1,6-bis(1-aziridinecarboxite), trimethylolpropane-tri-β-aziridinylpropionate, tetramethylolmethane-tri-β-aziridinylpropionate, tris-2,4,6-(1-aziridinyl)-1,3,5-triazine, trimethylolpropane tris[3-(1-aziridinyl)propionate], trimethylolpropane tris[3-(1- aziridinyl)butyrate], trimethylolpropane tris[3-(1-(2-methyl)aziridinyl)propionate], trimethylolpropane tris[3-(1-aziridinyl)-2-methylpropionate], 2,2'-bishydroxymethylbutanol tris[3-(1-aziridinyl)propionate], pentaerythritol tetra[3-(1-aziridinyl)propionate], diphenylmethane-4,4-bis-N,N'-ethyleneurea, 1,6-hexamethylene bis-N,N'-ethyleneurea, 2,4,6-(triethyleneimino)-Sym-triazine, bis[1-(2-ethyl)aziridinyl]benzene-1,3-carboxylic acid amide, and the like.

[0091] The phenol-based curing agent may be a phenol compound. For example, the phenol compound may be a phenol resin having two or more phenolic hydroxyl groups in one molecule, and may be selected from one or more of bisphenol A type phenol resin, bisphenol F type phenol resin, phenol aralkyl type phenol resin, triphenylmethane type phenol resin, novolac type phenol resin, dicyclopentadiene type phenol resin, xylylene type phenol resin, and biphenyl type phenol resin.

[0092] The amine-based curing agent may be an amine compound. The amine compound may be a compound having two or more amino groups, and may be a dimer diamine or other polyamine.

[0093] The isocyanate-based curing agent may be an isocyanate compound. The isocyanate compound may be selected from one or more of aromatic polyisocyanates, aliphatic polyisocyanates, and alicyclic polyisocyanates.

[0094] Examples of aromatic polyisocyanates include 1,3-phenylene diisocyanate, 1,4-phenylene diisocyanate, 2,4-tolylene diisocyanate (TDI), 2,6-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate (MDI), 2,4-diphenylmethane diisocyanate, 4,4'-diisocyanatobiphenyl, 3,3'-dimethyl-4,4'-diisocyanatobiphenyl, 3,3'-dimethyl-4,4'-diisocyanatodiphenylmethane, 1,5-naphthylene diisocyanate, 4,4',4''-triphenylmethane triisocyanate, m-isocyanatophenylsulfonyl isocyanate, and p-isocyanatophenylsulfonyl isocyanate.

[0095] Examples of aliphatic polyisocyanates include ethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate (HDI), dodecamethylene diisocyanate, 1,6,11-undecane triisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, lysine diisocyanate, 2,6-diisocyanatomethyl caproate, bis(2-isocyanatoethyl) fumarate, bis(2-isocyanatoethyl) carbonate, and 2-isocyanatoethyl-2,6-diisocyanatohexanoate.

[0096] Examples of alicyclic polyisocyanates include isophorone diisocyanate (IPDI), 4,4'-dicyclohexylmethane diisocyanate (H12-MDI), cyclohexylene diisocyanate, methylcyclohexylene diisocyanate (hydrogenated TDI), bis(2-isocyanatoethyl)-4-cyclohexene-1,2-dicarboxylate, 2,5-norbornane diisocyanate, and 2,6-norbornane diisocyanate.

[0097] Further examples include trimethylolpropane adducts of diisocyanates, biuret forms reacted with water, and trimers having an isocyanurate ring.

[0098] The blocked isocyanate compound is not particularly limited as long as it is a blocked isocyanate group-containing compound in which the isocyanate group in the isocyanate group-containing compound is protected with ε-caprolactam, MEK oxime, etc. Specific examples include compounds in which the isocyanate group of the isocyanate group-containing compound is blocked with ε-caprolactam, MEK oxime, cyclohexanone oxime, pyrazole, phenol, etc. In particular, hexamethylene diisocyanate trimer having an isocyanurate ring and blocked with MEK oxime or pyrazole is very preferable when used in this embodiment because it is excellent in storage stability, as well as adhesive strength to bonding materials such as polyimide and copper, and solder heat resistance.

[0099] The metal chelate curing agent may be selected from one or more of an aluminum chelate compound, a titanium chelate compound, and a zirconium chelate compound. The central metal may be selected from iron, cobalt, indium, and the like.

[0100] The curing agent may be used in an amount of 1 to 50 parts by weight, preferably 10 to 40 parts by weight, and more preferably 20 to 30 parts by weight, based on 100 parts by weight of the thermosetting resin.

[0101] The amount of the curing agent may be adjusted to adjust the fluidity and tackiness of the first protective layer 32, the second protective layer 34, and the third protective layer 36. For example, the second protective layer 34 may have the highest content of curing agent, the third protective layer 36 may have the next highest content of curing agent, and the first protective layer 32 may contain no curing agent or may contain an amount of curing agent equal to or less than that of the third protective layer 36.

[0102] The first protective layer 32, the second protective layer 34, and the third protective layer 36 may further include a filler. The filler is preferably insulating and may be selected from, for example, an inorganic filler, a phosphorus-based filler, a nitrogen-based filler, a fluorine-based filler, and a polymer filler. One or more types of fillers may be used.

[0103] Examples of inorganic fillers include silica, hollow silica, porous silica, mica, talc, kaolin, clay, hydrotalcite, wollastonite, xonotlite, silicon nitride, boron nitride, aluminum nitride, calcium hydrogen phosphate, calcium phosphate, glass flakes, hydrated glass, calcium titanate, sepiolite, magnesium sulfate, aluminum hydroxide, magnesium hydroxide, zirconium hydroxide, barium hydroxide, calcium hydroxide, titanium oxide, tin oxide, aluminum oxide, magnesium oxide, zirconium oxide, zinc oxide, molybdenum oxide, antimony oxide, nickel oxide, zinc carbonate, magnesium carbonate, calcium carbonate, barium carbonate, zinc borate, aluminum borate, and inorganic ion scavengers (an example is IXE (registered trademark) manufactured by Toagosei Co., Ltd.).

[0104] Examples of phosphorus-based fillers include (poly)phosphate-based compounds such as melamine phosphate, melamine polyphosphate, guanidine phosphate, guanidine polyphosphate, ammonium phosphate, ammonium polyphosphate, ammonium amido phosphate, ammonium amido polyphosphate, carbamate phosphate, and carbamate polyphosphate; organic phosphate compounds, phosphazene compounds, phosphonic acid compounds, phosphinic acid compounds such as aluminum diethylphosphinate, aluminum methylethylphosphinate, aluminum diphenylphosphinate, aluminum ethylbutylphosphinate, aluminum methylbutylphosphinate, and aluminum polyethylenephosphinate; phosphine oxide compounds, phosphorane compounds, and phosphoramide compounds.

[0105] Examples of the nitrogen-based filler include benzoguanamine, melamine, melam, melem, melon, melamine cyanurate, cyanuric acid compounds, isocyanuric acid compounds, triazole compounds, tetrazole compounds, diazo compounds, and urea.

[0106] Examples of the fluorine-based filler include polytetrafluoroethylene powder and modified products thereof, tetrafluoroethylene-perfluoroalkyl vinyl ether powder, tetrafluoroethylene-ethylene powder, tetrafluoroethylene-hexafluoropropylene powder, tetrafluoroethylene-vinylidene fluoride powder, tetrafluoroethylene-hexafluoropropylene-perfluoroalkyl vinyl ether powder, polychlorotrifluoroethylene powder, chlorotrifluoroethylene-ethylene powder, chlorotrifluoroethylene-vinylidene fluoride powder, polyvinylidene fluoride powder, and polyvinyl fluoride powder.

[0107] Examples of the polymer filler include polyethylene powder, polyacrylic ester powder, epoxy resin powder, polyamide powder, polyimide powder, polyurethane powder, liquid crystal polymer beads, polysiloxane powder, and the like, as well as multi-layered core-shell structures using silicone, acrylic, styrene-butadiene rubber, butadiene rubber, and the like.

[0108] Average particle size of filler D 50 The thickness may be 0.01 to 100 μm, preferably 0.02 to 40 μm, and more preferably 0.05 to 20 μm.

[0109] The second protective layer 34 and the third protective layer 36 may contain 0.1 to 30% by weight, preferably 1 to 25% by weight, and more preferably 5 to 20% by weight of a filler. By setting the filler content within the above range, the index X, index Y, and / or index Z (fluidity) can be adjusted to approach an appropriate range.

[0110] The first protective layer 32 may not contain a filler, or if it does contain a filler, it may contain the filler at a lower mass concentration than the second protective layer 34 and the third protective layer 36. For example, when the first protective layer 32 contains a filler, it may contain 0.01 to 1 part by weight, preferably 0.01 to 0.5 parts by weight, and more preferably 0.01 to 0.1 parts by weight, per 100 parts by weight of the thermosetting resin.

[0111] As an example, the second protective layer 34 may have the highest filler content, the third protective layer 36 may have the next highest filler content, and the first protective layer 32 may contain no filler or may contain filler at a mass concentration equal to or lower than that of the third protective layer 36.

[0112] As a result, although the protective sheet 38 contains a filler, the mass concentration of the filler on the second surface side of the protective sheet 38 is greater than that on the first surface side. This makes it possible to suppress the tackiness (adhesiveness) of the first protective layer 32 (i.e., the first surface side) and increase the fluidity. In addition, by adjusting the amount of filler and / or the amount of hardener in the first protective layer 32, the adhesive strength of the first surface of the protective sheet 38 in a probe tack test can be adjusted to a predetermined value or less. In addition, by adjusting the amount of filler and / or the amount of hardener, it is easy to adjust the fluidity so that the first protective layer 32, the third protective layer 36, and the second protective layer 34 are in that order.

[0113] As another example, the second protective layer 34 and the third protective layer 36 may contain the same amount of filler, and the first protective layer 32 may contain no filler or a filler at a mass concentration equal to or lower than the second protective layer 34 and the third protective layer 36. Alternatively, the third protective layer 36 may have the highest filler content, the second protective layer 34 may have the next highest filler content, and the first protective layer 32 may contain no filler or a filler at a mass concentration equal to or lower than the third protective layer 36.

[0114] When the entire protective sheet 38 is taken as 100% by weight, the filler content may be 0.1 to 30.0% by weight, preferably 1.0 to 9.8% by weight, and more preferably 3.5 to 8.5% by weight. If the filler content of the entire protective sheet 38 is lower than this range, the fluidity will be too high, and if it is higher, cracks will occur in the protective layer when subjected to thermal cycles, which may cause poor appearance. The filler content in the entire protective sheet 38 is merely an additional improvement and is not essential.

[0115] The first protective layer 32, the second protective layer 34, and the third protective layer 36 may further contain a thermoplastic resin. For example, the thermoplastic resin is preferably one or more selected from polyester, acrylic resin, polyether, urethane resin, styrene elastomer, polycarbonate, butadiene rubber, polyamide, ester amide resin, polyisoprene, and cellulose. When the thermoplastic resin is contained, the content of the thermoplastic resin in each of the first protective layer 32, the second protective layer 34, and / or the third protective layer 36 is preferably 5 to 40% by weight.

[0116] The first protective layer 32, the second protective layer 34, and the third protective layer 36 may further contain additives. For example, as the additives, one or more of the following may be used: a colorant (e.g., a pigment, a dye, or a carbon powder such as carbon black, carbon nanotube, graphene, or fullerene), a flame retardant, an antiblocking agent, a metal deactivator, a thickener, a dispersant, a silane coupling agent, a rust inhibitor, a copper damage inhibitor, a reducing agent, an antioxidant, a tackifier resin, a plasticizer, an ultraviolet absorber, an antifoaming agent, and a leveling adjuster.

[0117] Fig. 4 shows another example of the protective sheet 38 in this embodiment. As shown in Fig. 4, the protective sheet 38 is composed of only the first protective layer 32 and the second protective layer 34, and may not include the third protective layer 36. In this case, the configurations, materials, etc. of the first protective layer 32 and the second protective layer 34 may be as described above.

[0118] As another example, multiple layers may be provided for one or more of the first protective layer 32, the second protective layer 34, and the third protective layer 36. For example, the protective sheet 38 may have one first protective layer 32, one second protective layer 34, and multiple third protective layers 36 sandwiched therebetween.

[0119] The protective sheet 38 may include other layers as necessary. For example, the protective sheet 38 may further include a release layer that is peeled off after being attached to the circuit board 10. When a release layer is provided, it may be provided further above the second protective layer 34 (on the opposite side to the first protective layer 32).

[0120] 5 shows an example of a flow of a method for manufacturing the electronic device package 100 of this embodiment. The electronic device package 100 may be manufactured by performing at least a part of S100 to S300. For convenience of explanation, S100 to S300 are described in this order, but these processes may be performed in a different order and / or at least a part of them may be performed in parallel.

[0121] In S100, a protective sheet 38 is produced for forming the protective layer 30. The protective sheet 38 may be the one described with reference to FIGS.

[0122] The method for producing the protective sheet 38 is not particularly limited, and examples thereof include a method in which a composition in which the material such as the thermosetting resin that forms each layer (first protective layer 32, second protective layer 34, third protective layer 36) of the protective sheet 38 is dissolved in a solvent or the like is sequentially applied and dried to form a laminated structure, or a method in which the composition that has been cured or semi-cured in advance is laminated, etc. Examples of application methods include a gravure coating method, a kiss coating method, a die coating method, a lip coating method, a comma coating method, a blade method, a roll coating method, a knife coating method, a spray coating method, a bar coating method, a spin coating method, a dip coating method, or various printing methods.

[0123] Next, in S200, a protective layer 30 made of a protective sheet 38 is formed on the mounting board 12. For example, first, the mounting board 12 is prepared. The mounting board 12 may be a circuit board 10 having a conductive circuit on its surface, on which an electronic device 20 or the like is mounted. The protective sheet 38 manufactured in S100 is placed on the mounting board 12 such that the first protective layer 32 (first surface side) faces the electronic device 20 or the like.

[0124] Fig. 6 shows an example of S200 in the flow of Fig. 5. As shown in the figure, the protective sheet 38 may be placed so that the first protective layer 32 side faces the electronic device 20, etc., and then the protective sheet 38 may be attached to the mounting substrate 12.

[0125] After the protective sheet 38 is placed, it may be heat-pressed onto the mounting substrate 12. The heat press can cure the uncured or semi-cured thermosetting resin of each protective layer of the protective sheet 38. When the thermosetting resin is completely cured, the protective sheet 38 becomes the protective layer 30. When the protective sheet 38 has a release sheet, the release sheet may be removed from the protective sheet 38 after the heat press.

[0126] The heat pressing may be performed under reduced pressure or vacuum. This can increase the degree of adhesion of the first protective layer 32 to the mounting substrate 12. The heat pressing may be performed at 100 to 220°C, preferably 120 to 200°C, more preferably 140 to 180°C, for 1 to 120 minutes, preferably 1 to 40 minutes, more preferably 1 to 10 minutes, under conditions of 0.1 to 10 MPa, preferably 0.5 to 3 MPa, more preferably 1 to 2 MPa. When additional heating is performed, it may be performed under the same temperature conditions as the heat pressing.

[0127] When the heat press is performed, each layer constituting the protective sheet 38 softens before being completely hardened, and flows to the recesses at the corners of the circuit board 10 and the electronic device 20, etc., and to the sides of the connecting members 24, such as bumps. In particular, the first protective layer 32, which has a higher fluidity than the other layers, flows to these areas and adequately protects the areas where the protective layer 30 is difficult to form. This makes it possible to prevent contact between the connecting members 24 and other conductors and electric leakage.

[0128] On the other hand, the second protective layer 34 and the third protective layer 36, which have relatively low fluidity, do not move significantly even when heat-pressed, and therefore remain in a certain amount over the entire electronic device 20, etc. This makes it possible to more reliably eliminate insufficient thickness in parts of the protective layer 30 (for example, corners of the electronic device 20, etc.).

[0129] 7 shows an example of the mounting substrate 12 on which the protective layer 30 is formed. As described above, the protective layer 30 is formed by curing the protective sheet 38, and the entire surface of the mounting substrate 12 is insulated and protected.

[0130] In the above description, an example is given in which protective sheet 38 that does not include a release sheet is used, but the present invention is not limited to this. For example, heat pressing may be performed using protective sheet 38 having a release sheet on the second protective layer 34 side, and the release sheet may be peeled off after heat pressing.

[0131] Next, in S300, a conductive layer 40 is formed on the protective layer 30. The conductive layer 40 may be formed in part or in the entire area where the protective layer 30 is formed. The conductive layer 40 may be formed by transferring metal from a metal-containing sheet 46 to the mounting substrate 12.

[0132] 8 shows an example of a metal-containing sheet 46. The metal-containing sheet 46 has a metal material layer 44 formed on a release sheet 42.

[0133] A film-like release base material that can be peeled off later or a release resin having cushioning properties can be used for the release sheet 42. The release sheet 42 may be composed of a single layer or multiple layers of the release base material and / or the release resin.

[0134] The release substrate is a film-like substrate having releasability on one or both sides. The release substrate is preferably a sheet having a tensile breaking strain of less than 50% at 150°C. Examples of the release substrate include plastic sheets such as polyethylene terephthalate, polyethylene naphthalate, polyvinyl fluoride, polyvinylidene fluoride, hard polyvinyl chloride, polyvinylidene chloride, nylon, polyimide, polystyrene, polyvinyl alcohol, ethylene-vinyl alcohol copolymer, polycarbonate, polyacrylonitrile, polybutene, soft polyvinyl chloride, polyvinylidene fluoride, polyethylene, polypropylene, polyurethane resin, ethylene-vinyl acetate copolymer, polyvinyl acetate, and the like; papers such as glassine paper, fine paper, craft paper, and coated paper; various nonwoven fabrics; synthetic paper; metal foil; and composite films combining these.

[0135] The release resin is a resin that has the ability to conform to the shape of the electronic device 20 and the like and also has releasability. In other words, the release resin is a resin that can be peeled off from the release cushion member after heat pressing or the like. The release resin preferably has a tensile breaking strain of 50% or more at 150°C. In addition, the release resin preferably melts during heat pressing.

[0136] Examples of the release resin include one or more selected from polyethylene, polypropylene, polyethersulfone, polyphenylene sulfide, polystyrene, polymethylpentene, polybutylene terephthalate, cyclic olefin polymer, and silicone. In particular, polypropylene, polymethylpentene, polybutylene terephthalate, and silicone are preferable from the viewpoint of achieving both embeddability and releasability.

[0137] The metal material layer 44 may be formed of a conductive paste containing a thermosetting resin and a conductive filler. For example, the metal material layer 44 may be formed by applying a conductive paste onto the release sheet 42 and drying the solvent. The thermosetting resin in the conductive paste is preferably in an uncured or semi-cured state. Examples of the application method include the above-mentioned application method of the composition of each protective layer and a method such as screen printing.

[0138] The thermosetting resin may be the same as that used in forming the first to third protective layers.

[0139] Examples of the conductive filler include metal particles, carbon particles, conductive resin particles, etc. The conductive filler may contain metal particles as an essential component, and may further contain one or more selected types of other components such as carbon particles.

[0140] Examples of metal particles include gold, platinum, silver, copper, nickel, aluminum, iron, and alloys thereof, with copper being preferred in terms of cost and electrical conductivity. Metal particles may also be particles that have a core made of a metal and a coating layer made of a metal other than the core, covering the core. The above-listed metals are used for the core and coating layer. One example is silver-coated copper particles having a core made of copper and a coating layer made of silver.

[0141] Examples of the carbon particles include one or more selected from acetylene black, ketjen black, furnace black, carbon nanotubes, carbon nanofibers, graphite, fullerene, carbon nanowalls, graphene, etc. Examples of the conductive resin particles include one or more selected from poly(3,4-ethylenedioxythiophene), polyacetylene, polythiophene, etc.

[0142] Average particle size of conductive filler D 50 is preferably about 1 to 100 μm, more preferably about 3 to 75 μm, and even more preferably about 5 to 50 μm. The average particle size of the conductive filler can be measured by a laser diffraction method, a scattering method, or the like, and for example, the average diameter of a circle assumed to be equal to the projected area of ​​the filler particle aggregate is obtained as the average particle size. By setting the average particle size of the conductive filler within the above range, the electromagnetic wave shielding effect of the conductive layer 40 formed later can be further improved. In addition, for example, the fluidity when mixed with a thermosetting resin is improved, and thus the moldability of the conductive layer 40 is improved.

[0143] The conductive filler may have any shape, such as a sphere, needle, scale, flake, dendritic, grape-like, fibrous, or plate-like shape. The content of the conductive filler in the metal material layer 44 is not particularly limited, but is preferably 100 to 1500 parts by weight, more preferably 100 to 1000 parts by weight, relative to 100 parts by weight of the thermosetting resin. This makes it possible to impart necessary and sufficient conductivity to the conductive layer 40 regardless of the type of conductive particles, and to sufficiently enhance the electromagnetic wave shielding effect. This is also preferable because it increases the fluidity of the composition containing the thermosetting resin and the conductive filler, making it easier to form the metal material layer 44.

[0144] The metal material layer 44 may further contain a thermoplastic resin. As the thermoplastic resin, the same materials that can be used for the first to third protective layers may be used.

[0145] The metal material layer 44 may contain other additives, such as one or more of a crosslinking agent, a coloring agent, a flame retardant, a filler, a lubricant, an antiblocking agent, a metal deactivator, a thickener, a dispersant, a silane coupling agent, a rust inhibitor, a copper damage inhibitor, a reducing agent, an antioxidant, a tackifier resin, a plasticizer, an ultraviolet absorber, an antifoaming agent, and a leveling adjuster.

[0146] The crosslinking agent may be a compound that undergoes a crosslinking reaction with the functional group of the thermosetting resin. For example, the crosslinking agent may be one or more of a phenol-based curing agent, an amine-based curing agent, an isocyanate-based curing agent, an epoxy-based curing agent, an aziridine-based curing agent, and a metal chelate-based curing agent.

[0147] The colorant may be one or more of organic pigments, carbon black, ultramarine, red iron oxide, zinc oxide, titanium oxide, graphite, dyes, etc. The flame retardant may be one or more of halogen-containing flame retardants, phosphorus-containing flame retardants, nitrogen-containing flame retardants, inorganic flame retardants, etc. The filler may be one or more of glass fiber, silica, talc, ceramics, etc.

[0148] The lubricant may be one or more of fatty acid esters, hydrocarbon resins, paraffins, higher fatty acids, fatty acid amides, fatty alcohols, metal soaps, modified silicones, etc. The anti-blocking agent may be one or more of calcium carbonate, silica, polymethylsilsesquioxane, aluminum silicate, etc.

[0149] The metal material layer 44 may be a metal foil. In this case, the metal foil may be formed by plating the same metal as that exemplified as the conductive filler on the release sheet 42.

[0150] 9 shows an example of S300 using a metal-containing sheet 46. As shown in the figure, the metal material layer 44 side of the metal-containing sheet 46 is placed and attached to the protective layer 30. Next, the metal-containing sheet 46 is heat-pressed to harden the thermosetting resin of the metal material layer 44, thereby forming the conductive layer 40. Thereafter, the release sheet 42 is removed. In this way, an electronic device package 100 as shown in FIG. 1 is manufactured.

[0151] The heat pressing may be performed under reduced pressure or in a vacuum, which can increase the adhesion of the metal material layer 44 to the mounting substrate 12. The heat pressing may be performed under conditions of 100 to 220°C (preferably 120 to 180°C), 1 to 120 minutes (preferably 1 to 60 minutes), and 0.1 to 10 MPa (preferably 0.5 to 3 MPa).

[0152] In addition, in S300, the conductive layer 40 may be formed by another method without using the metal-containing sheet 46. For example, the conductive layer 40 may be formed by depositing a metal by plating, vapor deposition, or sputtering (hereinafter also referred to as "plating, etc."). Examples of metals used for plating, etc. include gold, platinum, silver, copper, nickel, aluminum, iron, and alloys thereof. As another example, the conductive layer 40 may be formed by coating or spraying a conductive paste (e.g., one that can be used for the metal material layer 44) on the protective layer 30 or the second protective layer 34 (before heat pressing) and curing it.

[0153] After S300, a step of singulating the electronic device package 100 may be performed as necessary. For example, the electronic device package 100 may be diced in the X direction and the Y direction at positions corresponding to the product areas to obtain individual products. Alternatively, S300 may not be performed, and an electronic device package 100 without the conductive layer 40 may be used.

[0154] As described above, according to this embodiment, the protective layer 30 is formed on the mounting substrate 12 by the process of S100 to S300 using the protective sheet 38 having a predetermined configuration and physical properties. This makes it possible to form the protective layer 30 with a sufficient thickness even in areas where the protective layer 30 is likely to flow too much and become thin, such as corners of the electronic device 20, and in areas where the protective layer 30 does not flow sufficiently. Furthermore, according to this embodiment, it is possible to prevent the first surface side from adhering to the circuit substrate 10, etc., and puddling when the protective sheet 38 is attached.

[0155] The protective layer 30 may include a layer structure derived from the protective sheet 38. For example, when the protective sheet 38 has a three-layer structure, at least a part of the protective layer 30 may have a three-layer structure derived from each of the first protective layer 32 to the third protective layer 36. In particular, at corner recesses where the circuit board 10 and the electronic device 20 or the like come into contact, the thickness of the protective layer 30 is thick, and the layer structure of the protective sheet 38 is likely to remain. On the other hand, at corners of the electronic device 20 or the like where the thickness of the protective layer 30 is thin, the layer structure of the protective sheet 38 may not remain.

[0156] Hereinafter, examples of this embodiment will be described with reference to examples.

[0157] [Example] [First protective layer composition A1] A composition A1 for the first protective layer 32 was prepared having the following composition. Polyurethane resin (acid value: 5 mgKOH / g, weight average molecular weight: 54,000, Tg: -7°C, manufactured by Toyochem) 100 parts by weight Epoxy compound (YDF-2005RD, Nippon Steel Chemical & Material Co., Ltd.) 20 parts by weight Solvent (methyl ethyl ketone) 20 parts by weight

[0158] [First protective layer composition A2] Silica (Admatechs SO-C6, D 50 A composition A2 for the first protective layer 32 was prepared having the same composition as composition A1, except that 6 parts by weight of cellulose acylate (fiber); 2.0 μm) was added.

[0159] [First protective layer composition A3] Silica (Admatechs SO-C6, D 50 A composition A3 for the first protective layer 32 was prepared having the same composition as composition A1, except that 12 parts by weight of cellulose acylate (CuO 2 ; 2.0 μm) was added.

[0160] [First protective layer composition A4] Silica (Admatechs SO-C6, D 50 A composition A4 for the first protective layer 32 was prepared having the same composition as composition A1, except that 15 parts by weight of cellulose acylate (fiber); 2.0 μm) was added.

[0161] [First protective layer composition A5] Silica (Admatechs SO-C6, D 50 A composition A5 for the first protective layer 32 was prepared having the same composition as composition A1, except that 55 parts by weight of cellulose acylate (fiber); 2.0 μm) was added.

[0162] [First protective layer composition A6] Silica (Admatechs SO-C6, D 50 A composition A6 for the first protective layer 32 was prepared having the same composition as composition A1, except that 1.5 parts by weight of cellulose acylate (fiber); 2.0 μm) was added.

[0163] [First protective layer composition A7] Silica (Admatechs SO-C6, D 50 A composition A7 for the first protective layer 32 was prepared having the same composition as composition A1, except that 20 parts by weight of cellulose acylate (MgO; 2.0 μm) was added.

[0164] [Second protective layer composition B1] A composition B1 for the second protective layer 34 was prepared having the following composition: Polyurethane resin (acid value: 5 mgKOH / g, weight average molecular weight: 54,000, Tg: -7°C, manufactured by Toyochem) 100 parts by weight Epoxy compound (YDF-2001, manufactured by Nippon Steel Chemical & Material Co., Ltd.) 20 parts by weight Silica (Admatechs SO-C6, D 50 2.0 μm) 13.6 parts by weight (10% by weight of solids excluding solvent) Solvent (methyl ethyl ketone) 20 parts by weight

[0165] [Second protective layer composition B2] Silica was added to talc (Fuji Talc Co., Ltd. FH104 D 50 A composition B2 for the second protective layer 34 was prepared having the same composition as composition B1, except that the amount of 24.4 parts by weight of the silica gel (4.0 μm) was changed to 24.4 parts by weight of composition B1.

[0166] [Second protective layer composition B3] A composition B3 for the second protective layer 34 was prepared having the same composition as the composition B1, except that the content of silica was changed to 35.0 parts by weight.

[0167] [Second protective layer composition B4] Composition B4 was prepared for the second protective layer 34 having a composition similar to composition B1, except that no silica was added.

[0168] [Second protective layer composition B5] Silica (Admatechs SO-C6, D 50 A composition B5 for the second protective layer 34 was prepared having the same composition as the composition B1, except that the content of the silica gel (2.0 μm) was changed to 0.10 parts by weight.

[0169] [Second protective layer composition B6] Silica (Admatechs SO-C6, D 50 A composition B6 for the second protective layer 34 was prepared having the same composition as the composition B1, except that the content of the silica gel (fiber); 2.0 μm) was changed to 0.15 parts by weight.

[0170] [Second protective layer composition B7] Silica (Admatechs SO-C6, D 50 A composition B7 for the second protective layer 34 was prepared having the same composition as the composition B1, except that the content of the silica gel (2.0 μm) was changed to 55 parts by weight.

[0171] [Second protective layer composition B8] Silica (Admatechs SO-C6, D 50 A composition B8 for the second protective layer 34 was prepared having the same composition as the composition B1, except that the content of the sintered fine particles (; 2.0 μm) was changed to 20 parts by weight.

[0172] [Second protective layer composition B9] Silica (Admatechs SO-C6, D 50 A composition B9 for the second protective layer 34 was prepared having the same composition as the composition B1, except that the content of the sintered fine particles (; 2.0 μm) was changed to 15 parts by weight.

[0173] [Second protective layer composition B10] Silica (Admatechs SO-C6, D 50 A composition B10 for the second protective layer 34 was prepared having the same composition as the composition B1, except that the content of the silica gel (2.0 μm) was changed to 1.5 parts by weight.

[0174] [Third protective layer composition C1] A composition C1 for the third protective layer 36 was prepared having the following composition: Polyurethane resin (acid value: 5 mgKOH / g, weight average molecular weight: 54,000, Tg: -7°C, manufactured by Toyochem) 100 parts by weight Epoxy compound (YDF-170, manufactured by Nippon Steel Chemical & Material Co., Ltd.) 20 parts by weight Silica (Admatechs SO-C6, D 50 2.0 μm) 13.6 parts by weight Solvent (methyl ethyl ketone) 20 parts by weight [Third protective layer composition C2] Composition C2 was prepared for the third protective layer 36 having a similar composition to composition C1, except that no silica was added. [Third protective layer composition C3] Silica (Admatechs SO-C6, D 50 A composition C3 for the third protective layer 36 was prepared having the same composition as the composition C1, except that the content of the silica gel (fiber-reinforced polysiloxane; 2.0 μm) was changed to 1.5 parts by weight. [Third protective layer composition C4] Silica (Admatechs SO-C6, D 50 A composition C4 for the third protective layer 36 was prepared having the same composition as the composition C1, except that the content of the sintered fine particles (; 2.0 μm) was changed to 20 parts by weight. [Third protective layer composition C5] Silica (Admatechs SO-C6, D 50 A composition C5 for the third protective layer 36 was prepared having the same composition as the composition C1, except that the content of the sintered fine particles (; 2.0 μm) was changed to 15 parts by weight. [Third protective layer composition C6] Silica (Admatechs SO-C6, D 50 A composition C6 for the third protective layer 36 was prepared having the same composition as the composition C1, except that the content of the sintered fine particles (; 2.0 μm) was changed to 55 parts by weight.

[0175] [Manufacturing of single layer A1] The composition A1 was applied onto a release sheet, and then heated at 120° C. for 5 minutes to dry and semi-cure, forming a single layer A1 corresponding to the first protective layer 32 with a thickness of 15 μm.

[0176] [Manufacturing of single layer B1] The composition B1 was applied onto a release sheet, and then heated at 120° C. for 5 minutes to dry and semi-cure, forming a single layer B1 corresponding to the second protective layer 34 with a thickness of 45 μm.

[0177] [Manufacturing of single-layer C1] The composition C1 was applied onto a release sheet, and then heated at 120° C. for 5 minutes to dry and semi-cure the composition, thereby forming a single layer C1 corresponding to the third protective layer 36 having a thickness of 60 μm.

[0178] [Manufacturing of protective sheet H1] Composition A1 was applied onto the release sheet. Then, the mixture was heated at 120°C for 5 minutes, dried and semi-cured to form a first protective layer 32 having a thickness of 15 μm. Composition C1 was applied onto the first protective layer 32. Then, the mixture was heated at 120°C for 5 minutes, dried and semi-cured to form a third protective layer 36 having a thickness of 60 μm. Then, composition B1 was applied onto the third protective layer 36. Then, the mixture was heated at 120°C for 5 minutes, dried and semi-cured to form a second protective layer 34 having a thickness of 45 μm. In this manner, a protective sheet H1 consisting of the first protective layer 32, the third protective layer 36, and the second protective layer 34 was formed.

[0179] [Manufacturing of protective sheet H2] Protective sheet H2 was produced in the same manner as protective sheet H1, except that composition B2 was used instead of composition B1.

[0180] [Manufacturing of protective sheet H3] Protective sheet H3 was produced in the same manner as protective sheet H1, except that composition B3 was used in place of composition B1.

[0181] [Manufacturing of protective sheet H4] Protective sheet H4 was produced in the same manner as protective sheet H1, except that composition B4 was used in place of composition B1.

[0182] [Manufacturing of protective sheet H5] Protective sheet H5 was produced in the same manner as protective sheet H1, except that composition B5 was used in place of composition B1.

[0183] [Manufacturing of protective sheet H6] Protective sheet H6 was produced in the same manner as protective sheet H1, except that composition B6 was used in place of composition B1.

[0184] [Manufacturing of protective sheet H7] Protective sheet H7 was produced in the same manner as protective sheet H1, except that composition A5 was used in place of composition A1, composition B7 was used in place of composition B1, and composition C6 was used in place of composition C1.

[0185] [Manufacturing of protective sheet H8] Protective sheet H8 was produced in the same manner as protective sheet H1, except that composition A2 was used instead of composition A1.

[0186] [Manufacturing of protective sheet H9] Protective sheet H9 was produced in the same manner as protective sheet H1, except that composition A3 was used in place of composition A1.

[0187] [Manufacturing of protective sheet H10] Protective sheet H10 was produced in the same manner as protective sheet H1, except that composition A4 was used instead of composition A1.

[0188] [Manufacture of protective sheet H11] Protective sheet H11 was produced in the same manner as protective sheet H1, except that composition B4 was used in place of composition B1 and composition C2 was used in place of composition C1.

[0189] [Manufacture of protective sheet H12] Protective sheet H12 was produced in the same manner as protective sheet H1, except that composition A6 was used in place of composition A1, composition B10 was used in place of composition B1, and composition C3 was used in place of composition C1.

[0190] [Manufacturing of protective sheet H13] Protective sheet H13 was produced in the same manner as protective sheet H1, except that composition A7 was used in place of composition A1, composition B8 was used in place of composition B1, and composition C4 was used in place of composition C1.

[0191] [Manufacturing of protective sheet H14] Protective sheet H14 was produced in the same manner as protective sheet H1, except that composition A4 was used in place of composition A1, composition B9 was used in place of composition B1, and composition C5 was used in place of composition C1.

[0192] The following tests and evaluations were carried out on the single layers A1 to A7, the single layers B1 to B10, the single layers C1 to C6, and the protective sheets H1 to H14.

[0193] [Glass transition temperature] The glass transition temperature of each layer was measured. Single layer A1: 42℃ Single layer B1: 22℃ Single layer C1: 27℃ It was.

[0194] Flow Length One side of each of the monolayers A1 to C1 and protective sheets H1 to H14 is laminated to a polyimide film (Capton500H) at a heating condition of 90°C at a speed of 2 m / min, and then punched out into a rectangle of 0.5 cm x 1 cm. After lamination, the release sheet is peeled off and the monolayers A1 to C1 and protective sheets H1 to H14 are placed on the polyimide film (Capton500H). As a result, each of the monolayers A1 to C1 and protective sheets H1 to H14 is sandwiched between two polyimide films.

[0195] A heat-resistant release film (Opulent CR1012MT4 150μm, manufactured by Mitsui Chemicals Tohcello) was placed on each of the monolayers A1 to C1 and protective sheets H1 to H14 sandwiched between polyimide films, and these were sandwiched between silicone rubber with a rubber hardness of 70 degrees (JIS K 6253 A, measured with a TECLOCK rubber-plastic hardness tester (durometer) GS-719N), and pressed for 5 minutes at 1MPa under heating conditions of 180°C. The length of the most flowing part among the parts that melted and flowed from each side of the polyimide film was calculated, and the average of the four sides was measured as the flow length (μm). Four samples were prepared for each of the monolayers A1 to C1 and protective sheets H1 to H14, and the average flow length (μm) was measured. In addition, the indices X, Z, Y, and W were calculated based on the average measured flow length (μm) and film thickness (μm).

[0196] [Cold-heat cycle] (Preparation of test pieces) A substrate was prepared in which mold-sealed electronic components (1000 μm×1000 μm) were mounted in an array of 5×5 on a substrate made of glass epoxy. The thickness of the substrate was 0.3 mm, and the mold sealing thickness, i.e., the height (component height) H from the top surface of the substrate to the top surface of the mold sealing material, was 0.7 mm. Then, half-dicing was performed along the grooves between the components to obtain a test substrate. The half-cut groove depth was 0.8 mm (the cut groove depth of the substrate 20 was 0.1 mm), and the half-cut groove width was 200 μm. The protective sheets H1 to H14 were thermocompressed to the test substrate under conditions of 8 MPa and 170° C. for 5 minutes, and the cushioning material was peeled off by hand. Then, the obtained electronic component-mounted substrate was full-diced along the half-cut grooves to obtain 25 test pieces for each protective sheet. The obtained test pieces were placed in a thermal shock device ("TSE-11-A", manufactured by Espec Corporation) and exposed 1,000 times alternately under the following conditions: high temperature exposure: 125°C, 15 minutes; low temperature exposure: -50°C, 15 minutes. After that, the test pieces were removed, the appearance of the electronic component protective layer was observed, and the number of damaged test pieces was counted and evaluated according to the following criteria. Ten test pieces were tested for each example. +++: The number of broken test pieces was 0. ++: The number of damaged test pieces is 1 or more and 2 or less. +: The number of broken test pieces is 3 or more and 5 or less. (Practical level) NG: The number of damaged test pieces is 6 or more. [Table 1A] [Table 1B] [Table 1C] [Table 2A] [Table 2B]

[0197] [Probe tack test] A probe tack test was conducted using protective sheets H1 to H10. In accordance with the 17th Edition of the Japanese Pharmacopoeia, General Test Methods, 6. Preparation Test Methods, 6.12 Adhesive Strength Test Method, 3.4 Probe Tack Test Method, protective sheets H1 to H10 were cut into pieces 2 cm square or larger and tested. The test was also conducted by attaching the sheet to a weight ring and placing a total of 200 g of weights on top of it to apply a load. The test was conducted with N=4 and the average was recorded as the result. The results are shown below. [Table 3A] [Table 3B]

[0198] As shown in the figure, the first protective layer 32 side (first surface side) shows almost no tackiness, whereas the second protective layer 34 side (second surface side) shows increased tackiness depending on the amount of filler (silica).

[0199] [Electronic device packaging manufacturing] A mounting board was prepared on which an IC chip connected to the circuit board by bumps and an octagonal inductor were mounted, and the first protective layer side was placed facing the circuit board side, and the protective sheet H1 was thermocompressed at 180°C and 1 MPa for 5 minutes to produce an electronic device package P1 having a protective layer. Electronic device packages P2 to P14 were produced from protective sheets H2 to H14 in the same manner. In the electronic device packages P1 to P14, except for P7, P11, and P13 (satisfying index X=0.5 to 2.0), all of the protective layers were formed with a thickness of 15 μm or more on the side of the bump, the side of the inductor, and the upper corners of the IC chip, and it was confirmed that they performed a sufficient insulating protection function. However, in P11 (index X>2.0), the fluidity of the protective layer was too high, resulting in some parts with a thin film thickness. In addition, in P7 and P13 (index X<0.5), the fluidity of the protective layer was too low, resulting in some parts where the protective layer did not spread. Furthermore, the protective sheets according to H3, H7, H10, H13 and H14, in which the filler amount was 10 parts by weight or more, showed inferior results in the thermal cycle test compared to the others.

[0200] Although the present invention has been described above using the embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It is clear to those skilled in the art that various modifications and improvements can be made to the above embodiments. It is clear from the claims that such modifications and improvements can also be included in the technical scope of the present invention.

[0201] It should be noted that the order of execution of each process, such as operations, procedures, steps, and stages, in the methods shown in the claims, specifications, and drawings, is not specifically indicated as "before," "prior to," etc., and may be realized in any order, unless the result of a previous process is used in a later process. Even if the flow of operations in the claims, specifications, and drawings is described using "first," "next," etc. for convenience, it does not mean that it is essential to perform the operations in this order. [Explanation of symbols]

[0202] 10 Circuit Board 12 Mounting board 20 Electronic Devices 22 Electronic Devices 24 Connection parts 30 protective layer 35 Polyimide film 32 1st protective layer 34 Second protective layer 36 Third protective layer 38 Protective Sheet 40 Conductive Layer 42 Release sheet 44 Metal material layer 46 Metal-containing sheet 100 Electronic Device Packages

Claims

1. A protective sheet for a circuit board having a first surface and a second surface opposite to the first surface, The adhesion strength of the first surface by a probe tack test is 0.15 N / cm ２ The following: And the index X calculated by the following formula 1 is 0.5 to 2.0, The protective sheet contains a filler in an amount of 1.0 to 9.8% by weight. Protective sheet for circuit boards. [Formula 1] X=F ｔｏｔａｌ / T ｔｏｔａｌ (F ｔｏｔａｌ T is the average (μm) of the four sides of the flow length of the part that flows the most on each side when a protective sheet is cut into a rectangle of 0.5 cm × 1.0 cm and heated and pressed at 180° C. and 1 MPa for 5 minutes; ｔｏｔａｌ ; Total thickness of protective sheet (μm)

2. Tensile breaking strength: 10 to 70 N / mm ２ That is, The protective sheet according to claim 1 .

3. The protective sheet is A first protective layer; a second protective layer; the first protective layer is an outermost layer on the first surface side of the protective sheet, The second protective layer is an outermost layer on the second surface side of the protective sheet. The protective sheet according to claim 1 .

4. The second protective layer has an index Y calculated by the following formula 2 of 0.5 to 1.5: The protective sheet according to claim 3. [Formula 2] Y=F ２ / T ２ (F ２ The average (μm) of the four sides of the flow length of the part that flows most on each side when the second protective layer is cut into a rectangle of 0.5 cm × 1.0 cm and heated and pressed at 180° C. and 1 MPa for 5 minutes, T ２ ; Thickness of the second protective layer (μm)

5. The protective sheet according to claim 3 , wherein the first protective layer has an index Z calculated by the following formula 3 of 2.0 to 15.0: [Formula 3] Z=F １ / T １ (F １ The average (μm) of the four sides of the flow length of the part that flows most on each side when a rectangular shape of the first protective layer having dimensions of 0.5 cm×1.0 cm is heated and pressed at 180° C. and 1 MPa for 5 minutes, T １ ; Thickness of the first protective layer (μm)

6. The second protective layer has a glass transition temperature of 60° C. or lower. The protective sheet according to claim 3.

7. The first protective layer has a thickness of 5 to 150 μm. The thickness of the second protective layer is 10 to 200 μm. The protective sheet according to claim 3.

8. a third protective layer is provided between the first protective layer and the second protective layer; The protective sheet according to claim 3.

9. The third protective layer has an index W calculated by the following formula 4 of 1.0 to 3.0: The protective sheet according to claim 8. [Formula 4] W=F ３ / T ３ (F ３ The average (μm) of the flow lengths of the four sides of the part that flows most on each side when a rectangular third protective layer of 0.5 cm × 1.0 cm is heated and pressed at 180° C. and 1 MPa for 5 minutes, T ３ ; Thickness of the third protective layer (μm)

10. The third protective layer has a thickness of 20 to 200 μm. The protective sheet according to claim 8.

11. The first protective layer, the second protective layer, and the third protective layer each contain a polyurethane resin and a curing agent. The protective sheet according to claim 8.

12. the protective sheet includes a filler, and a mass concentration of the filler on the second surface side of the protective sheet is greater than that on the first surface side; The protective sheet according to claim 1 .

13. A circuit board having a conductive circuit on a surface thereof; an electronic device disposed on the circuit board; a protective layer disposed on the circuit board and the electronic device; Equipped with the electronic device has a polygonal shape having five or more sides when observed from a main surface of the circuit board or a side surface of the main surface; Electronic device package.

14. The electronic device has a recess on the side surface.

14. The electronic device package of claim 13.

15. The electronic device has a polygonal shape having 5 or more sides when observed from the main surface.

14. The electronic device package of claim 13.

16. A circuit board having a conductive circuit on a surface thereof; an electronic device disposed on the circuit board; a protective layer disposed on the circuit board and the electronic device; Equipped with The protective layer at least partially covers a connection member that electrically connects the electronic device and the circuit board. Electronic device package.

17. The connection members are bumps disposed on the bottom surface of the electronic device.

17. The electronic device package of claim 16.

18. the connecting member is a lead frame on which the electronic device is mounted; 17. The electronic device package of claim 16.

19. A circuit board having a conductive circuit on a surface thereof; an electronic device disposed on the circuit board; a protective layer disposed on the circuit board and the electronic device; Equipped with The electronic device has a multilayer ceramic capacitor (MLCC). Electronic device package.

20. The protective layer includes at least two layers.

14. The electronic device package of claim 13.

21. The protective layer is a cured product of a thermosetting resin.

21. The electronic device package of claim 20.

22. A conductive layer is formed on the protective layer.

22. An electronic device package according to any one of claims 13 to 21.

23. The method includes a step of: disposing the protective sheet according to claim 1 on a mounting board having an electronic device mounted on a substrate having a conductive circuit on a surface thereof, with the first surface facing the electronic device, to form a protective layer formed from the protective sheet on the mounting board. A method for manufacturing an electronic device package.

24. The step of forming the protective layer includes heat pressing the protective sheet onto the mounting substrate after the protective sheet is disposed. The method of manufacturing the electronic device package of claim 23.

25. The method of claim 23 further comprising forming a conductive layer on the protective layer.

Images