Semiconductor device and inverter

Abstract

To provide a semiconductor device in which the decrease in heat dissipation can be suppressed.SOLUTION: A semiconductor element includes a protection film 411 having an opening part 411a so as to expose a part of a source electrode 41s with an end part of the opening part 411a provided on the source electrode. A re-wiring layer includes source wires 44s, 47, 48a, and 48b connected to the source electrode and a solder 80, and an insulator 43 that covers a part of the source wires. The insulator includes an insulating film 431 having an opening part 431a so as to expose a part of the source wires with an end part of the opening part 431a provided in a counter region of the opening part 411a, and an insulating film 432 having an opening part 432a so as to expose a part of the source wires and have the solder disposed therein with an end part of the opening part 432a provided out of the counter region of the opening part 411a. The opening area of the opening part 431a is narrower than that of the opening part 411a, and the opening area of the opening part 432a is more than or equal to the area of the opening part 411a.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present disclosure relates to a semiconductor device. [Background technology]

[0002] Patent Document 1 discloses a semiconductor device including a semiconductor substrate, an electrode, a protective film, a front metal film, an oxidation prevention film, and a solder wettability prevention film (third embodiment).

[0003] The protective film is formed so as to cover the end of the electrode. The oxidation prevention film is formed on the front metal film at the opening of the protective film. The solder wetting prevention film covers a predetermined region of the opening of the protective film from a portion located on the surface of the oxidation prevention film at the interface between the protective film and the oxidation prevention film. In the semiconductor device, the electrodes and the lead frame are connected via solder. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2016-86069 A Summary of the Invention [Problem to be solved by the invention]

[0005] In the semiconductor device, the opening area of ​​the solder wetting prevention film is smaller than the opening area of ​​the protective film, so there is a risk that the heat dissipation performance of the semiconductor device will be reduced compared to a configuration in which solder is connected without providing a solder wetting prevention film.

[0006] One disclosed object is to provide a semiconductor device capable of suppressing a decrease in heat dissipation performance. [Means for solving the problem]

[0007] The semiconductor device disclosed herein comprises: a semiconductor element (41) including a semiconductor substrate (410), an electrode (41s) formed on one surface (410a) of the semiconductor substrate, and a protective film (411) having a first opening (411a) so that a part of the electrode is exposed, the end of the first opening being provided on the electrode; a rewiring layer (42) having a sealing resin body (45) for sealing the semiconductor element so that the electrodes are exposed, wiring (44s, 44a1, 48a, 48b) connected to the electrodes and to which a conductive connection member is connected, and an insulator (43) covering a part of the wiring, and disposed on one side of the semiconductor element; The insulator is a first insulator (431) having a second opening (431a) so that a part of the wiring is exposed, the end of the second opening being provided within a region facing the first opening; a second insulator (432, 433) having a third opening (432a, 433a) through which a part of the wiring is exposed and a connection member is disposed, the end of the third opening being provided outside the opposing region of the first opening; The opening area of ​​the second opening is smaller than the opening area of ​​the first opening, and the opening area of ​​the third opening is equal to or larger than the opening area of ​​the first opening; The connecting member is characterized in that a fillet is formed and the fillet angle is 135° or more.

[0008] In this manner, since the second opening has a smaller opening area than the first opening, the semiconductor device is configured such that the first insulator covers the position where the end of the first opening overlaps with the electrode. Therefore, the semiconductor device can suppress the application of stress to the position of the electrode where the end of the first opening overlaps. Also, in the semiconductor device, the third opening in which the connection member is disposed has an opening area equal to or larger than that of the first opening. Therefore, even if the second opening has a smaller opening area than the first opening, the semiconductor device can suppress the connection area between the wiring and the connection member from becoming smaller. Therefore, the semiconductor device can suppress the deterioration of heat dissipation. The semiconductor device disclosed herein is a semiconductor element (41) including a semiconductor substrate (410), an electrode (41s) formed on one surface (410a) of the semiconductor substrate, and a protective film (411) having a first opening (411a) so that a part of the electrode is exposed, the end of the first opening being provided on the electrode; a rewiring layer (42) having a sealing resin body (45) for sealing the semiconductor element so that the electrodes are exposed, wiring (44s, 44a1, 48a, 48b) connected to the electrodes and to which a conductive connection member is connected, and an insulator (43) covering a part of the wiring, and disposed on one side of the semiconductor element; The insulator is a first insulator (431) having a second opening (431a) so that a part of the wiring is exposed, the end of the second opening being provided within a region facing the first opening; a second insulator (432, 433) having a third opening (432a, 433a) through which a part of the wiring is exposed and a connection member is disposed, the end of the third opening being provided outside the opposing region of the first opening; The opening area of ​​the second opening is smaller than the opening area of ​​the first opening, and the opening area of ​​the third opening is equal to or larger than the opening area of ​​the first opening; The wiring has multiple layers laminated with an insulator interposed therebetween, The wiring in the multiple layers has a dummy wiring including an isolation portion (44a2) electrically isolated from the electrode, The separating portion is provided between the boundary between the semiconductor substrate and the sealing resin body and a portion of the wiring in the multiple layers that is electrically connected to the electrode.

[0009] The aspects disclosed in this specification adopt different technical means to achieve their respective objectives. The claims and the parenthetical symbols described in this section are illustrative of the corresponding relationship with the embodiments described below, and are not intended to limit the technical scope. The objectives, features, and effects disclosed in this specification will become clearer by referring to the following detailed description and the attached drawings. [Brief description of the drawings]

[0010] [Figure 1]1 is a diagram showing a circuit configuration of a power conversion device to which a semiconductor device according to an embodiment is applied; [Diagram 2] 1 is a plan view showing a semiconductor device according to a first embodiment. [Diagram 3] FIG. 3 is a cross-sectional view taken along line III-III in FIG. [Figure 4] 1 is a partial cross-sectional view showing a semiconductor device; [Diagram 5] FIG. 2 is a plan view showing a semiconductor element. [Figure 6] FIG. 2 is a plan view showing the element package. [Figure 7] FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. [Figure 8] FIG. 7 is a cross-sectional view taken along line VIII-VIII in FIG. [Figure 9] FIG. 2 is a partial plan view showing the device package. [Figure 10] FIG. 11 is a partial cross-sectional view showing an element package according to a first modified example. [Figure 11] FIG. 11 is a partial cross-sectional view showing an element package according to a second modified example. [Figure 12] FIG. 11 is a cross-sectional view showing a semiconductor device according to a third modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, with reference to the drawings, a number of embodiments for carrying out the present disclosure will be described. In each embodiment, the same reference numerals may be used to designate parts corresponding to matters described in the preceding embodiment, and duplicated descriptions may be omitted. In each embodiment, when only a part of the configuration is described, other parts of the configuration may be applied by referring to the other embodiment described previously. A corresponding part is a part that corresponds functionally and / or structurally and / or is associated with another part.

[0012] In the following, the three mutually perpendicular directions are referred to as the X, Y, and Z directions. Furthermore, the plane defined by the X and Y directions is referred to as the XY plane, the plane defined by the X and Z directions is referred to as the XZ plane, and the plane defined by the Y and Z directions is referred to as the YZ plane.

[0013] The semiconductor device of this embodiment is applied to, for example, a power conversion device of a moving body using a rotating electric machine as a drive source. The moving body is, for example, an electric vehicle such as an electric vehicle (EV), a hybrid vehicle (HV), a fuel cell vehicle (FCV), an aircraft such as a drone, a ship, a construction machine, or an agricultural machine. An example of application to a vehicle will be described below.

[0014] (Embodiment) First, a schematic configuration of a drive system of a vehicle will be described with reference to FIG.

[0015] <Vehicle drive system> As shown in FIG. 1, a vehicle drive system 1 includes a DC power supply 2, a motor generator 3, and a power conversion device 4.

[0016] The DC power supply 2 is a DC voltage source composed of a chargeable and dischargeable secondary battery. The secondary battery is, for example, a lithium-ion battery or a nickel-metal hydride battery. The motor generator 3 is a three-phase AC rotating electric machine. The motor generator 3 functions as a drive source for the vehicle, that is, an electric motor. The motor generator 3 functions as a generator during regeneration. The power conversion device 4 performs power conversion between the DC power supply 2 and the motor generator 3.

[0017] <Power conversion device> Next, a circuit configuration of the power conversion device 4 will be described with reference to Fig. 1. The power conversion device 4 includes a power conversion circuit. The power conversion device 4 of this embodiment includes a smoothing capacitor 5 and an inverter 6 which is the power conversion circuit.

[0018] The smoothing capacitor 5 mainly smoothes the DC voltage supplied from the DC power supply 2. The smoothing capacitor 5 is connected to a P line 7 which is a power line on the high potential side and an N line 8 which is a power line on the low potential side. The P line 7 is connected to the positive electrode of the DC power supply 2, and the N line 8 is connected to the negative electrode of the DC power supply 2. The positive electrode of the smoothing capacitor 5 is connected to the P line 7 between the DC power supply 2 and the inverter 6. The negative electrode of the smoothing capacitor 5 is connected to the N line 8 between the DC power supply 2 and the inverter 6. The smoothing capacitor 5 is connected in parallel to the DC power supply 2.

[0019] The inverter 6 is a DC-AC conversion circuit. The inverter 6 converts a DC voltage into a three-phase AC voltage in accordance with switching control by a control circuit (not shown) and outputs the voltage to the motor generator 3. This drives the motor generator 3 to generate a predetermined torque. During regenerative braking of the vehicle, the inverter 6 converts the three-phase AC voltage generated by the motor generator 3 upon receiving rotational force from the wheels into a DC voltage in accordance with switching control by the control circuit and outputs the DC voltage to the P line 7. In this way, the inverter 6 performs bidirectional power conversion between the DC power source 2 and the motor generator 3.

[0020] The inverter 6 is configured to include upper and lower arm circuits 9 for three phases. The upper and lower arm circuits 9 are sometimes referred to as legs. The upper and lower arm circuits 9 each include an upper arm 9H and a lower arm 9L. The upper arm 9H and the lower arm 9L are connected in series between the P line 7 and the N line 8, with the upper arm 9H on the P line 7 side. A connection point between the upper arm 9H and the lower arm 9L is connected to the winding 3a of the corresponding phase in the motor generator 3 via an output line 10. The inverter 6 has six arms. Each arm is configured to include a switching element. At least a portion of each of the P line 7, the N line 8, and the output line 10 is configured of a conductive member such as a bus bar.

[0021] In this embodiment, an n-channel MOSFET 11 is used as a switching element constituting each arm. In the upper arm 9H, the drain of the MOSFET 11 is connected to the P line 7. In the lower arm 9L, the source of the MOSFET 11 is connected to the N line 8. The source of the MOSFET 11 in the upper arm 9H and the drain of the MOSFET 11 in the lower arm 9L are connected to each other.

[0022] A freewheeling diode 12 is connected in anti-parallel to each of the MOSFETs 11. The diode 12 may be a parasitic diode (body diode) of the MOSFET 11, or may be provided separately from the parasitic diode. The anode of the diode 12 is connected to the source of the corresponding MOSFET 11, and the cathode is connected to the drain.

[0023] The power conversion device 4 may further include a converter as a power conversion circuit. The converter is a DC-DC conversion circuit that converts a DC voltage into a DC voltage of a different value. The converter is provided between the DC power source 2 and the smoothing capacitor 5. The converter is configured to include, for example, a reactor and the above-mentioned upper and lower arm circuits 9. With this configuration, voltage can be increased and decreased. The power conversion device 4 may include a filter capacitor that removes power supply noise from the DC power source 2. The filter capacitor is provided between the DC power source 2 and the converter.

[0024] The power conversion device 4 may include a drive circuit for a switching element constituting the inverter 6 or the like. The drive circuit supplies a drive voltage to the gate of the MOSFET 11 of the corresponding arm based on a drive command from the control circuit. The drive circuit drives the corresponding MOSFET 11, i.e., turns it on and off, by applying the drive voltage. The drive circuit is sometimes referred to as a driver.

[0025] The power conversion device 4 may include a control circuit for the switching element. The control circuit generates a drive command for operating the IGBT 11 and outputs it to the drive circuit. The control circuit generates the drive command based on a torque request input from a higher-level ECU (not shown) and signals detected by various sensors.

[0026] The various sensors include, for example, a current sensor, a rotation angle sensor, and a voltage sensor. The current sensor detects the phase current flowing through the winding 3a of each phase. The rotation angle sensor detects the rotation angle of the rotor of the motor generator 3. The voltage sensor detects the voltage across the smoothing capacitor 5. The control circuit outputs, for example, a PWM signal as a drive command. The control circuit is configured with, for example, a microcomputer. ECU is an abbreviation for Electronic Control Unit. PWM is an abbreviation for Pulse Width Modulation.

[0027] <Semiconductor device> Next, the schematic configuration of the entire semiconductor device will be described with reference to Figures 2, 3, 4, and 5. Figure 2 is a plan view showing the semiconductor device. Figure 2 is a top plan view of the semiconductor device. Figure 3 is a cross-sectional view taken along line III-III in Figure 2. Figure 3 shows a simplified structure of the element package. Figure 4 is an enlarged cross-sectional view of a connection point of the solder 80. Figure 5 is a plan view showing a schematic configuration of a semiconductor element included in the element package. In Figure 5, the area surrounded by the dashed line is the element area.

[0028] In the following, the thickness direction of the semiconductor element (semiconductor substrate) is defined as the Z direction. The extension direction of the external connection terminals, which is perpendicular to the Z direction, is defined as the Y direction. The direction perpendicular to both the Z direction and the Y direction is defined as the X direction. Unless otherwise specified, the shape viewed from the Z direction, in other words the shape along the XY plane defined by the X and Y directions, is defined as the planar shape. The planar view from the Z direction is simply referred to as the planar view.

[0029] 2 and 3 constitute one of the arms. That is, one phase of upper and lower arm circuits 9 is constituted by two semiconductor devices 20. The semiconductor device 20 includes a sealing resin body 30, an element package 40, heat dissipation members 50 and 60, and main terminals 70 and 71 and a signal terminal 72 which are external connection terminals.

[0030] The sealing resin body 30 seals a portion of the other elements constituting the semiconductor device 20. The remaining portions of the other elements are exposed to the outside of the sealing resin body 30. The sealing resin body 30 is made of, for example, an epoxy resin. The sealing resin body 30 is molded, for example, by a transfer molding method. As shown in FIG. 2, the sealing resin body 30 has a generally rectangular shape in plan view.

[0031] 2 and 3, the sealing resin body 30 has one surface 30a and a back surface 30b that is the surface opposite to the one surface. The sealing resin body 30 has side surfaces 30c and 30d. The side surface 30d is the surface opposite to the side surface 30c in the Y direction.

[0032] The element package 40 is a package of a switching element that constitutes an arm and wiring that connects the switching element to other elements of the semiconductor device 20. As shown in Figs. 2 to 4, the element package 40 includes a semiconductor element 41, a rewiring layer 42, and a sealing resin body 45.

[0033] The semiconductor element 41 is formed by forming a switching element on a semiconductor substrate 410 made of silicon (Si), a wide band gap semiconductor having a wider band gap than silicon, or the like. Examples of wide band gap semiconductors include silicon carbide (SiC), gallium nitride (GaN), gallium oxide (Ga2O3), and diamond. The semiconductor element 41 is sometimes called a power element or a semiconductor chip.

[0034] The semiconductor element 41 of this embodiment is formed by forming the above-mentioned n-channel type MOSFET 11 on a semiconductor substrate 410 made of SiC. The MOSFET 11 has a vertical structure so that a main current flows in the thickness direction of the semiconductor element 41 (semiconductor substrate 410), i.e., in the Z direction. The semiconductor element 41 has main electrodes on each of the plate surfaces of the semiconductor substrate 410. The semiconductor element 41 has a gate electrode (not shown). The gate electrode has, for example, a trench structure.

[0035] 5, the semiconductor element 41 has, as main electrodes, a source electrode 41s formed on one surface 410a of the semiconductor substrate 410 and a drain electrode 41d formed on a back surface 410b opposite to the one surface. When the diode 12 is a parasitic diode, the source electrode 41s also serves as an anode electrode, and the drain electrode 41d also serves as a cathode electrode. The diode 12 may be formed on a chip separate from the MOSFET 11. The source electrode 41s corresponds to an electrode.

[0036] In the present embodiment, as an example, a configuration is adopted in which a plating layer 48a and a metal layer 47 are provided on the source electrode 41s (FIG. 4). However, in FIG. 5, the plating layer 48a and the metal layer 47 are omitted in order to simplify the drawing.

[0037] The drain electrode 41d is formed on almost the entire surface of the back surface 410b of the semiconductor substrate 410. The source electrode 41s is formed on a portion of one surface 410a of the semiconductor substrate 410. A pad 41p, which is a signal electrode, is formed on a region of the one surface 410a of the semiconductor substrate 410 different from the region where the source electrode 41s is formed. The pad 41p is electrically isolated from the source electrode 41s.

[0038] As shown in FIG. 5, the pad 41p is formed near an end on the opposite side to the formation region of the source electrode 41s in the Y direction. The pad 41p is provided side by side with the source electrode 41s in the Y direction. The pad 41p includes at least a pad for a gate electrode. The semiconductor element 41 of this embodiment has five pads 41p. Specifically, there are pads for a gate electrode, a Kelvin source for detecting the potential of the source electrode 41s, a current sense, an anode potential of a temperature sensing diode (temperature sensing element) for detecting the temperature of the semiconductor element 41, and a cathode potential of the same. The five pads 41p are formed together at one end side in the Y direction of the semiconductor element 41 having a substantially rectangular shape in plan view, and are also formed side by side in the X direction.

[0039] In the present embodiment, as an example, the source electrode 41s is made of a material mainly composed of aluminum (Al). The drain electrode 41d and the pad 41p may be made of the same material as the source electrode 41s. However, the present disclosure is not limited to this.

[0040] The redistribution layer 42 is disposed on one surface side of the semiconductor element 41, i.e., on the source electrode 41s side. The redistribution layer 42 is in contact (close contact) with one surface of the semiconductor element 41. The redistribution layer 42 has a mounting surface 42a which is the surface on the semiconductor element 41 side, and a back surface 42b which is the surface opposite the mounting surface 42a in the Z direction. The semiconductor element 41 is disposed on the mounting surface 42a of the redistribution layer 42.

[0041] The rewiring layer 42 has an insulator 43 and a wiring 44 provided on the insulator 43. The insulator 43 is formed containing a resin material such as polyimide. The wiring 44 is formed using a metal with good conductivity such as Cu. The wiring 44 includes a source wiring 44s electrically connected to the source electrode 41s and a signal wiring 44p electrically connected to the pad 41p. The source wiring 44s is connected to the source electrode 41s and is connected with solder 80. The source wiring 44s corresponds to a wiring and a main wiring section.

[0042] A portion of each of the source wiring 44s and the signal wiring 44p is exposed from the insulator 43 on the back surface 42b side of the redistribution layer 42. The exposed portion of the signal wiring 44p from the insulator 43 forms a terminal portion 440p for external connection. The redistribution layer 42 of this embodiment has five signal wirings 44p corresponding to the pads 41p. That is, the redistribution layer 42 has five terminal portions 440p that are independent of each other.

[0043] The sealing resin body 45 seals at least a part of the mounting surface 42a of the rewiring layer 42 and the semiconductor element 41. The sealing resin body 45 is formed, for example, from an epoxy resin. The epoxy resin contains a filler (not shown), such as silica. The sealing resin body 45 is molded, for example, by a compression molding method. The sealing resin body 45 is a primary molded body that seals the semiconductor element 41, and the sealing resin body 30 is a secondary molded body that seals the element package 40.

[0044] The sealing resin body 45 has one surface 45a and a back surface 45b that is the surface opposite to the surface 45a in the Z direction. The surface 45a is a surface on one side of the semiconductor substrate 410. The sealing resin body 45 and the semiconductor element 41 form a molded element. The rewiring layer 42 is disposed on the molded element, i.e., across the semiconductor element 41 and the sealing resin body 45.

[0045] The drain electrode 41d of the present embodiment is covered with a conductive electrode protection material 46. That is, the electrode protection material 46 is exposed from the rear surface 45b. The drain electrode 41d of the semiconductor element 41 may be exposed from the rear surface 45b. That is, the element package 40 may not include the electrode protection material 46. Details of the element package 40 will be described later.

[0046] The heat dissipation members 50 and 60 dissipate heat generated by the semiconductor element 41 to the outside on both sides of the semiconductor device 20 in the Z direction. The heat dissipation members 50 and 60 are sometimes referred to as heat sinks. The heat dissipation members 50 and 60 are arranged to sandwich a part of the element package 40 including the semiconductor element 41. The heat dissipation members 50 and 60 are arranged to face each other in the Z direction. The heat dissipation members 50 and 60 contain the semiconductor element 41 and the source wiring 44s in a plan view. The heat dissipation members 50 and 60 contain a part of the signal wiring 44p in a plan view. In this embodiment, the signal wiring 44p is drawn from the pad 41p to an outer region that does not overlap with the heat dissipation members 50 and 60 in a plan view. The terminal portion 440p is located outside the heat dissipation members 50 and 60 in a plan view. Instead of this configuration, the terminal portion 440p may be disposed in a region overlapping with the heat dissipation members 50, 60 in a plan view.

[0047] The heat dissipation members 50, 60 may be, for example, a metal plate made of copper (Cu) or a Cu alloy, a metal ceramic substrate such as a DBC substrate or an AMB substrate, or a metal resin substrate in which metal and highly thermally conductive resin are laminated, similar to a metal ceramic substrate. The metal plate is sometimes called a lead frame. DBC is an abbreviation for Direct Bonded Copper. AMB is an abbreviation for Active Metal Brazed. The heat dissipation members 50, 60 may have a plating film of nickel (Ni), gold (Au), or the like, on the metal surface.

[0048] The heat dissipation members 50 and 60 of this embodiment are AMB substrates. The heat dissipation member 50 includes an insulating base material 51 and metal bodies 52 and 53. The insulating base material 51 is made of nitride ceramic. The metal bodies 52 and 53 are provided as Cu plates or Cu foils. The metal bodies 52 and 53 are connected to the insulating base material 51 by a brazing material containing an active metal such as titanium (Ti).

[0049] The metal body 52 is provided on the surface of the insulating base material 51 facing the element package 40. The metal body 53 is provided on the surface of the insulating base material 51 opposite to the metal body 52. ​​The metal body 52 is connected to the source wiring 44s via the solder 80. In detail, in the present embodiment, as an example, a configuration in which a plating layer 48b is provided on the source electrode 41s is adopted. Thus, the metal body 52 is connected to the source wiring 44s via the plating layer 48b. The plating layer 48b is made of the same material as the plating layer 48a. However, the present disclosure can also be adopted in a configuration in which the plating layer 48b is not provided. The solder 80 corresponds to a connection member.

[0050] The metal body 52 functions as wiring for the source electrode 41s. For this reason, the heat dissipation member 50 is sometimes referred to as a wiring member. The metal body 53 is electrically isolated from the metal body 52 by the insulating base material 51. Heat generated by the semiconductor element 41 is transferred to the metal body 53 via the solder 80, the metal body 52, and the insulating base material 51. The metal body 53 provides a heat dissipation function.

[0051] Here, the connection portion of the solder 80 will be described in detail with reference to FIG. 4. FIG. 4 is an enlarged view of the region IV indicated by the dashed line in FIG. 3. As shown in FIG. 4, the solder 80 has a fillet formed in a state where it is connected to the plating layer 48b and the metal body 52. ​​In other words, the solder 80 has a shape in which the cross-sectional area becomes wider from the source electrode 41s side to the metal body 52. ​​The cross-sectional area here is an area along the XY plane. The angle of the fillet (fillet angle α) is preferably 135° or more. This allows the semiconductor device 20 to increase the connection area between the solder 80 and the metal body 52. ​​Therefore, the semiconductor device 20 can improve the connection reliability line of the solder 80 and the heat dissipation through the solder 80. In FIG. 3, the shape of the solder 80 is simplified.

[0052] The heat dissipation member 50 has a substantially rectangular planar shape. The heat dissipation member 50 has an opposing surface 50a, which is the surface on the element package 40 side, and a back surface 50b, which is the surface opposite to the opposing surface 50a. The opposing surface 50a is the surface of the metal body 52 opposite to the insulating base material 51, and the back surface 50b is the surface of the metal body 53 opposite to the insulating base material 51. In this embodiment, the back surface 50b of the heat dissipation member 50 is exposed from one surface 30a of the sealing resin body 30. The back surface 50b may be referred to as a heat dissipation surface or an exposed surface. The one surface 30a is the one surface side of the semiconductor element 41 in the Z direction, that is, the surface on the source electrode 41s side. The one surface 30a is, for example, a flat surface. The back surface 50b is substantially flush with the one surface 30a of the sealing resin body 30.

[0053] The heat dissipation member 60 has the same configuration as the heat dissipation member 50. The heat dissipation member 60 includes an insulating base material 61 and metal bodies 62 and 63. The metal body 62 is provided on the surface of the insulating base material 61 facing the element package 40. The metal body 62 is connected to the electrode protection material 46 via solder 81. The metal body 62 functions as wiring for the drain electrode 41d. For this reason, the heat dissipation member 60 is sometimes referred to as a wiring member. The metal body 63 is provided on the surface of the insulating base material 61 opposite to the metal body 62. The metal body 63 is electrically separated from the metal body 62 by the insulating base material 61. Heat generated by the semiconductor element 41 is transferred to the metal body 63 via the solder 81, the metal body 62, and the insulating base material 61. The metal body 63 provides a heat dissipation function.

[0054] The heat dissipation member 60 has a substantially rectangular shape in plan view. The heat dissipation member 60 has an opposing surface 60a, which is the surface on the element package 40 side, and a back surface 60b, which is the surface opposite to the opposing surface 60a. The opposing surface 60a is the surface of the metal body 62 opposite to the insulating base material 61, and the back surface 60b is the surface of the metal body 63 opposite to the insulating base material 61. In this embodiment, the back surface 60b of the heat dissipation member 60 is exposed from the back surface 30b of the sealing resin body 30. The back surface 60b may be referred to as a heat dissipation surface or an exposed surface. The back surface 30b is the back surface side of the semiconductor element 41, that is, the surface on the drain electrode 41d side. The back surface 30b is the surface opposite to the one surface 30a in the Z direction. The back surface 30b is, for example, a flat surface. The back surface 60b is substantially flush with the back surface 30b of the sealing resin body 30.

[0055] The main terminals 70, 71 and the signal terminal 72 are external connection terminals for electrically connecting the semiconductor device 20 to an external device. The main terminals 70, 71 are electrically connected to main electrodes. The main terminal 70 is electrically connected to the source electrode 41s. The main terminal 70 is sometimes referred to as a source terminal. The main terminal 71 is electrically connected to the drain electrode 41d. The main terminal 71 is sometimes referred to as a drain terminal.

[0056] The main terminal 70 is connected to the source electrode 41s via the heat dissipation member 50. The main terminal 70 is connected to one end of the metal body 52 of the heat dissipation member 50 in the Y direction. The thickness of the main terminal 70 is thinner than the metal body 52, for example. The main terminal 70 may be connected to the heat dissipation member 50 (metal body 52) by being provided integrally therewith, or may be provided as a separate member and connected thereto. The main terminal 70 extends from the heat dissipation member 50 in the Y direction and protrudes to the outside from the side surface 30c of the sealing resin body 30. The main terminal 70 has a bent portion midway through a portion covered by the sealing resin body 30, and protrudes from near the center in the Z direction on the side surface 30c.

[0057] The main terminal 71 is connected to the drain electrode 41d via the heat dissipation member 60. The main terminal 71 is connected to one end of the metal body 62 of the heat dissipation member 60 in the Y direction. The thickness of the main terminal 71 is thinner than the metal body 62, for example. The main terminal 71 may be connected to the heat dissipation member 60 (metal body 62) by being provided integrally therewith, or may be provided as a separate member and connected thereto. The main terminal 71 extends from the heat dissipation member 60 in the Y direction and protrudes to the outside from the same side surface 30c as the main terminal 70. The main terminal 71 also has a bent portion in the middle of the portion covered by the sealing resin body 30, and protrudes from the center of the side surface 30c in the Z direction. The two main terminals 70, 71 are arranged side by side in the X direction.

[0058] The signal terminal 72 is electrically connected to the pad 41p of the semiconductor element 41. The signal terminal 72 of this embodiment is connected to the terminal portion 440p of the rewiring layer 42 via the solder 82. That is, the signal terminal 72 is electrically connected to the pad 41p via the solder 82 and the signal wiring 44p including the terminal portion 440p. The signal terminal 72 extends in the Y direction and protrudes to the outside from the side surface 30d of the sealing resin body 30. The semiconductor device 20 of this embodiment includes five signal terminals 72 corresponding to the pads 41p. The signal terminals 72 are connected to the corresponding pads 41p via the signal wiring 44p. The solders 80, 81, and 82 are multi-element lead-free solders containing, for example, Cu, Ni, and the like in addition to Sn. Note that, instead of the solders 80, 81, and 82, a conductive connecting material other than solder, such as sintered silver, may be used.

[0059] As described above, in the semiconductor device 20, the semiconductor element 41 constituting one arm is encapsulated by the encapsulating resin body 30. The encapsulating resin body 30 integrally encapsulates the element package 40 including the semiconductor element 41, a portion of the heat dissipation member 50, a portion of the heat dissipation member 60, a portion of each of the main terminals 70 and 71, and a portion of each of the signal terminals 72.

[0060] In the Z direction, the semiconductor element 41 is disposed between the heat dissipation members 50, 60. The semiconductor element 41 is sandwiched between the heat dissipation members 50, 60 disposed opposite each other. This allows the heat of the semiconductor element 41 to be dissipated to both sides in the Z direction. The semiconductor device 20 has a double-sided heat dissipation structure. The back surface 50b of the heat dissipation member 50 is substantially flush with one surface 30a of the sealing resin body 30. The back surface 60b of the heat dissipation member 60 is substantially flush with the back surface 30b of the sealing resin body 30. Since the back surfaces 50b, 60b are exposed surfaces, the heat dissipation properties can be improved.

[0061] In the semiconductor device 20, the semiconductor element 41 is packaged together with the rewiring layer 42. The rewiring layer 42 has signal wiring 44p that electrically connects the pad 41p of the semiconductor element 41 and the signal terminal 72. The signal terminal 72 is solder-connected to the terminal portion 440p of the signal wiring 44p. This makes it possible to eliminate the need for bonding wires. Also, it is not necessary to place a terminal (metal block) between the semiconductor element 41 and the heat dissipation member 50 in order to ensure the height of the bonding wires. This makes it possible to reduce the size in the Z direction. Also, it is possible to simplify the structure and manufacturing process.

[0062] <Element package> Next, the structure of the element package 40 will be described in detail with reference to Figures 5, 6, 7, 8, and 9. In Figure 6, the redistribution layer 42 is indicated by a two-dot chain line for convenience. Figure 9 is a partial plan view of the element package 40. In Figure 9, the configuration other than the openings 411a, 431a, and 432a is simplified in order to compare the opening areas of the openings 411a, 431a, and 432a.

[0063] 5 to 8, the semiconductor element 41 has a protective film 411 in addition to a semiconductor substrate 410, a source electrode 41s, a drain electrode 41d, and a pad 41p. The protective film 411 is an electrically insulating film provided on one surface 410a of the semiconductor substrate 410 so as to cover the peripheral portions of the electrodes. The protective film 411 is not provided on a back surface 410b of the semiconductor substrate 410. The protective film 411 is sometimes referred to as an element insulating film.

[0064] The protective film 411 has an opening 411a formed at a position overlapping the source electrode 41s in a plan view. The protective film 411 has an opening 411b formed at a position overlapping the pad 41p in a plan view. The opening 411b is provided for each pad 41p. The source electrode 41s and the pad 41p are exposed to the outside through the corresponding openings 411a, 411b.

[0065] The openings 411a and 411b are both through holes that penetrate the protective film 411 in the Z direction. The protective film 411 covers the periphery of the source electrode 41s and the periphery of the pad 41p. In other words, the protective film 411 has the opening 411a so that, for example, a part of the source electrode 41s is exposed. The end of the opening 411a is provided on the source electrode 41s. Therefore, the connection end between the source electrode 41s and the protective film 411 is formed in a ring shape. The opening 411a corresponds to a first opening. The protective film 411 of this embodiment is made of polyimide.

[0066] As shown in FIG. 5, the semiconductor substrate 410 has an element region 412 and a scribe region 413. The element region 412 includes an active region in which elements are formed, and a peripheral voltage-withstanding region. The active region is sometimes called a main region. In the active region, portions of one surface side of the MOSFET 11, such as a trench gate, a base region, and a source region, are formed. The peripheral voltage-withstanding region is a region outside the element region 412, and surrounds the element region 412 in a plan view. In the peripheral voltage-withstanding region, a voltage-withstanding structure such as a guard ring is formed on the surface layer on the one surface 410a side of the semiconductor substrate 410. A source electrode 41s and a pad 41p are formed on the element region 412.

[0067] The scribe region 413 is a region of a predetermined range from the outer peripheral edge of the semiconductor substrate 410 in a planar view. The scribe region 413 surrounds the element region 412 in a planar view. The scribe region 413 is a dicing region when the semiconductor substrate is diced into chips (individualized) from a wafer state. The wafer-like semiconductor substrate is diced along the scribe region 413 to obtain a chip-like semiconductor substrate 410. The protective film 411 of this embodiment is disposed only on the element region 412. The protective film 411 is not disposed on the scribe region 413.

[0068] The redistribution layer 42 is disposed so as to overlap the molded element, i.e., the semiconductor element 41 and the sealing resin body 45, in a plan view. The insulator 43 of the redistribution layer 42 is provided so as to cover a part of the source wiring 44s and the signal wiring 44p. The insulator 43 is made of insulating films 431 and 432 arranged in multiple layers. The insulating film 431 is laminated on one surface of the semiconductor element 41 and one surface 45a of the sealing resin body 45. The insulating film 432 is laminated on the insulating film 431. The insulating films 431 and 432 of this embodiment are formed using the same material as the protective film 411, specifically, polyimide.

[0069] The first insulating film 431 has openings 431a and 431b. The opening 431a is formed at a position overlapping with the source electrode 41s in a planar view. The opening 431a overlaps at least a part of the opening 411a in a planar view. The opening 431b is formed at a position overlapping with the pad 41p in a planar view. The opening 431b overlaps at least a part of the opening 411b in a planar view. The opening 431b is provided for each pad 41p.

[0070] In other words, the insulating film 431 has an opening 431a so that a part of the source wiring 44s is exposed. An end of the opening 431a is provided in a region facing the opening 411a. As will be described later, a plating layer 48b and a metal layer 47 are provided on the source wiring 44s. Thus, the insulating film 431 has an opening 431a so that the metal layer 47 is exposed as a part of the source wiring 44s. The insulating film 431 corresponds to a first insulator. The opening 431a corresponds to a second opening.

[0071] In a configuration in which the metal layer 47 is not provided, the plating layer 48b is exposed from the opening 431a. In a configuration in which the metal layer 47 and the plating layer 48b are not provided, the source wiring 44s itself is exposed from the opening 431a.

[0072] The second insulating film 432 has openings 432a and 432b. The opening 432a is formed at a position overlapping the source electrode 41s in a plan view. The opening 432b is formed at a position overlapping the terminal portion 440p of the signal line 44p.

[0073] In other words, the insulating film 432 has an opening 432a so that a part of the source wiring 44s is exposed. An end of the opening 432a is provided outside the region facing the opening 411a. Solder 80 is provided in the opening 432a. A plating layer 48b is provided on the portion of the source wiring 44s exposed from the opening 432a. The insulating film 432 corresponds to a second insulator. The opening 432a corresponds to a third opening.

[0074] 7 and 9, the opening area of ​​opening 431a is smaller than the opening area of ​​opening 411a. Furthermore, the opening area of ​​opening 432a is larger than or equal to the opening area of ​​opening 411a. In other words, opening 431a is formed inside the area surrounded by opening 411a in a plan view. Moreover, opening 432a is formed outside the area surrounded by opening 411a in a plan view.

[0075] For this reason, the connection end between the source electrode 41s and the protective film 411 is covered with the insulating film 432. Therefore, it can be said that the insulating film 431 is disposed on the connection end between the source electrode 41s and the protective film 411 in the Z direction. On the other hand, the connection end between the metal layer 47 and the insulating film 431 is not covered with the insulating film 432.

[0076] The opening area may be the area along the XY plane of each of the openings 411a, 431a, and 432a. The opening area of ​​the opening 432a may be equal to the opening area of ​​the opening 411a.

[0077] The wiring 44 can be formed by, for example, a plating method, a dispensing method, or a printing method. The wiring 44 of this embodiment is formed by a plating method. As shown in FIG. 8 and other figures, the source wiring 44s is formed directly on the source electrode 41s. The source wiring 44s is laminated on at least the exposed portion of the source electrode 41s. The source wiring 44s includes a first layer of wiring arranged on the insulating film 431 so as to cover the exposed portion of the source electrode 41s in the opening 431a. The periphery of the first layer of wiring is covered by the insulating film 432. The plating layer 48b can also be said to be a second layer of wiring of the source wiring 44s. The second layer of wiring is laminated on the first layer of wiring in the opening 432a.

[0078] In addition, in this embodiment, the source wiring 44s electrically connected to the source electrode 41s via the metal layer 47 and the plating layer 48a is adopted. In detail, the plating layer 48a, the metal layer 47, and the source wiring 44s are laminated in this order on the source electrode 41s. The plating layer 48a is a plating film made of a material mainly composed of a metal, for example, Ni, which improves the connectivity with the solder. The metal layer 47 can be made of a material mainly composed of a metal such as Au. Therefore, the plating layer 48a and the metal layer 47 can be regarded as a part of the source wiring 44s of the rewiring layer 42. In other words, the semiconductor device 20 includes wiring for the main electrode, which includes the source wiring 44s, the plating layer 48a, and the metal layer 47. The wiring for the main electrode is wiring electrically connected to the source electrode 41s. However, the present disclosure is not limited thereto. The source wiring 44s may not include the plating layer 48a or the metal layer 47. The plating layer 48b can also be regarded as a part of the source wiring 44s.

[0079] 8, the signal wiring 44p is laminated on the exposed portion of the pad 41p. The signal wiring 44p includes a first-layer wiring arranged on the insulating film 431 so as to cover the exposed portion of the pad 41p in the opening 431b. A part of the first-layer wiring is exposed through the opening 432b, and the remaining part is covered by the insulating film 432. The exposed portion of the first-layer wiring forms the terminal portion 440p of the signal wiring 44p. The first-layer wiring is extended from the corresponding pad 41p to the terminal portion 440p so as to straddle the boundary between the element region 412 and the scribe region 413 in the Y direction.

[0080] The signal wiring 44p may include a second-layer wiring, similar to the source wiring 44s. The second-layer wiring is laminated on the first-layer wiring in the opening 432b. The second-layer wiring and the first-layer wiring form the terminal portion 440p. The signal wiring 44p may be made of the same material as the source wiring 44s. The second-layer wiring of the signal wiring 44p may be made of the same material as the second-layer wiring of the source wiring 44s.

[0081] The sealing resin body 45 seals the semiconductor element 41 as described above. As shown in FIG. 8, the sealing resin body 45 covers the side surface 410c of the semiconductor substrate 410. The sealing resin body 45 is in contact with (close contact with) the side surface 410c. The side surface 410c is a surface that connects the one surface 410a and the back surface 410b and is substantially parallel to the Z direction. The sealing resin body 45 of this embodiment covers the entire surface of the side surface 410c. The sealing resin body 45 seals the semiconductor element 41 so that the source electrode 41s is exposed. Furthermore, the sealing resin body 45 seals the semiconductor element 41 so that the drain electrode 41d and the pad 41p are exposed.

[0082] <Effects> In this way, the semiconductor device 20 has a configuration in which the opening 431a has a narrower opening area than the opening 411a, and the first insulator covers the position where the end of the opening 411a and the source electrode 41s overlap. That is, in the Z direction, the insulating film 431 is disposed on the connection end of the source electrode 41s and the protective film 411. In addition, in the semiconductor device 20, the connection end of the source wiring 44s with the insulating film 431 and the connection end of the source electrode 41s with the protective film 411 are located away from each other in a plan view. Therefore, the semiconductor device 20 can suppress the application of stress to the position of the source electrode 41s that overlaps with the end of the opening 411a. As a result, the semiconductor device 20 can suppress the crack from occurring in the source electrode 41s, and can ensure the reliability of the source electrode 41s.

[0083] Furthermore, in the semiconductor device 20, the opening 432a in which the solder 80 is disposed is equal to or larger than the opening area of ​​the opening 411a. Therefore, even if the opening area of ​​431a is smaller than that of the opening 411a, the semiconductor device 20 can prevent the connection area between the source wiring 44s and the solder 80 from becoming smaller. Therefore, the semiconductor device 20 can prevent a decrease in heat dissipation performance.

[0084] Although the semiconductor device 20 can suppress stress as described above, stress may be applied to the connection end of the source electrode 41s with the protective film 411. Furthermore, in the semiconductor device 20, stress is also applied to the connection end of the source wiring 44s with the insulating film 431 due to thermal stress of the solder 80. Furthermore, in the semiconductor device 20, stress is more likely to be applied to the connection end of the source wiring 44s with the insulating film 431 than to the connection end of the source electrode 41s with the protective film 411.

[0085] Therefore, in this embodiment, it is preferable to provide a plating layer 48a mainly made of nickel on the source electrode 41a mainly made of aluminum. In general, nickel has a higher strength than aluminum. Strength is material strength, and is elastic modulus and hardness. Therefore, the semiconductor device 20 can easily ensure the reliability of the source electrode 41a, which has a relatively high strength.

[0086] The connection end of the source wiring 44s with the insulating film 431 is located in a portion surrounded by a frame A in Fig. 4. The connection end of the source wiring 44s with the insulating film 431 is located at a position overlapping an end of the opening 431a in the source wiring 44s.

[0087] The above describes the preferred embodiment of the present disclosure. However, the present disclosure is not limited to the above embodiment, and various modifications are possible within the scope of the present disclosure. Below, as other embodiments of the present disclosure, modifications 1 to 3 are described. The above embodiment and modifications 1 to 3 can be implemented individually, but can also be implemented in appropriate combination. The present disclosure is not limited to the combinations shown in the embodiments, and can be implemented in various combinations.

[0088] (Variation 1) A semiconductor device 20 according to the first modification will be described with reference to Fig. 10. The semiconductor device 20 differs from the above embodiment in that the wiring is stacked. The semiconductor device 20 includes a first wiring 44a and an insulating film 433 in addition to the configuration of the above embodiment.

[0089] The first wiring 44a is made of the same material as the source wiring 44s. The first wiring 44a has a connection portion 44a1 and a separation portion 44a2. The connection portion 44a1 is electrically connected to the metal layer 47 and the source wiring 44s. A part of the connection portion 44a1 is directly connected to the metal layer 47 and the source wiring 44s. Another part of the connection portion 44a1 is laminated with the metal layer 47 via an insulating film 431. Another part of the connection portion 44a1 is laminated with the source wiring 44s via an insulating film 432.

[0090] Therefore, the connection portion 44a1 can be regarded as a part of the source wiring 44s of the redistribution layer 42. In other words, the semiconductor device 20 includes wiring for a main electrode including the source wiring 44s, the plating layer 48a, the metal layer 47, and the connection portion 44a1. The connection portion 44a1 corresponds to wiring. In this modification, as an example, the source wiring 44s electrically connected to the pad 41p is adopted.

[0091] The separation portion 44a2 is electrically isolated from the source electrode 41s. That is, the separation portion 44a2 is electrically isolated from the connection portion 44a1. The separation portion 44a2 can be said to be a portion electrically independent from the source electrode 41s. However, since the separation portion 44a2 is manufactured in the same process as the connection portion 44a1 or is disposed in the same layer, the separation portion 44a2 can be considered to be a part of the first wiring 44a. In this way, in the semiconductor device 20, the first wiring 44a includes the separation portion 44a2. Therefore, the first wiring 44a can be said to be a dummy wiring.

[0092] The separation portion 44a2 is provided between the insulating films 431 and 432. The separation portion 44a2 is provided between the boundary between the semiconductor substrate 410 and the sealing resin body 45 and the source wiring 44s. In the semiconductor device 20, the boundary between the semiconductor substrate 410 and the sealing resin body 45, the separation portion 44a2, and the source wiring 44s are stacked in this order in the Z direction. The source wiring 44s corresponds to a portion of the multiple layers of wiring that is electrically connected to the source electrode 41s.

[0093] The insulator 43 is made of insulating films 431, 432, and 433 arranged in a multilayer structure. The insulating film 433 is made of the same material as the other insulating films 431 and 432. The insulating film 433 is laminated on a part of the source wiring 44s. The insulating film 432 has an opening 432c in a region facing the pad 41p. A part of the wiring 44 is arranged in the opening 432c.

[0094] The insulating film 433 has openings 433a and 433b. The opening 433a is formed at a position overlapping the source electrode 41s in a plan view. The opening 433a overlaps at least a part of the opening 411a in a plan view. The opening 433b is formed at a position shifted from the pad 41p in a plan view. In this modification, the insulating film 433 corresponds to the second insulator, and the opening 433a corresponds to the third opening. Therefore, the opening area of ​​the opening 433a is larger than or equal to the opening area of ​​the opening 411a.

[0095] The semiconductor device 20 of the first modification can achieve the same effects as the above embodiment. In the semiconductor device 20, the source wiring 44s and the connection portion 44a1 are stacked. Therefore, the semiconductor device 20 can improve the degree of freedom in routing the wiring connected to the source electrode 41s.

[0096] In the semiconductor device 20, the boundary between the semiconductor substrate 410 and the sealing resin body 45 may peel off due to thermal stress. If peeling occurs in the semiconductor device 20, cracks may occur in the insulating film 431. Therefore, the semiconductor device 20 includes the separating portion 44a2. This makes it possible to prevent the cracks from reaching the source wiring 44s. This makes it possible for the semiconductor device 20 to ensure electrical insulation reliability in the source wiring 44s.

[0097] (Variation 2) As shown in Modification 2 of FIG. 11, the semiconductor device 20 does not need to have a plating layer 48a provided on the source electrode 41s. In the semiconductor device 20, the connection portion 44a1 is directly connected to the source electrode 41s. In the semiconductor device 20, it can be said that the wiring for the main electrode is directly connected to the source electrode 41s. In addition, in the semiconductor device 20, a part of the first wiring 44a is disposed between the protective film 411 and the insulating film 431. The semiconductor device 20 of Modification 2 can achieve the same effects as the above embodiment.

[0098] (Variation 3) As shown in Fig. 12, the semiconductor device 20 can employ heat dissipation members 50, 60 that do not include insulating base materials 51, 61. Even with such a semiconductor device 20, the same effects as those of the above-described embodiment can be achieved. Note that in Fig. 12, the sealing resin body 30 is omitted in order to simplify the drawing.

[0099] Although the present disclosure has been described based on the embodiment, it is understood that the present disclosure is not limited to the embodiment or structure. The present disclosure also encompasses various modifications and modifications within the equivalent range. In addition, although various combinations and forms are shown in the present disclosure, other combinations and forms including only one element, more than one element, or less than one element are also within the scope and concept of the present disclosure. [Explanation of symbols]

[0100] 20...semiconductor device, 30...sealing resin body, 30a...one side, 30b...rear side, 30c, 30d...side, 40...element package, 41...semiconductor element, 410...semiconductor substrate, 410a...one side, 410b...rear side, 410c...side, 411...protective film, 411a, 411b...opening, 411c...side, 411d...edge, 411e...upper surface, 412...element region, 413...scribe region, 41d...drain electrode, 41p...pad, 41s...source electrode, 42...rewiring layer, 42a...mount Mounting surface, 42b... rear surface, 43... insulator, 431, 432, 433... insulating film, 431a, 431b, 432a, 432b, 432c, 433a, 433b... opening, 44... wiring, 44p... signal wiring, 440p... terminal portion, 44s... source wiring, 44a... dummy wiring, 44a1... connection portion, 44a2... separation portion, 45, 45a... one surface, 45b... rear surface, 46... electrode protection material, 47... metal layer, 48a, 48b... plating layer, 70, 71... main terminal, 72... signal terminal, 80 to 82... solder

Claims

1. A semiconductor element (41) including a semiconductor substrate (410), an electrode (41s) formed on one surface (410a) of the semiconductor substrate, and a protective film (411) having a first opening (411a) so that a part of the electrode is exposed, and an end of the first opening is provided on the electrode; a rewiring layer (42) having a sealing resin body (45) that seals the semiconductor element so that the electrodes are exposed, wiring (44s, 44a1, 48a, 48b) that is connected to the electrodes and to which a conductive connecting member is connected, and an insulator (43) that covers a part of the wiring, and is disposed on the one surface side of the semiconductor element; The insulator is A first insulator (431) having a second opening (431a) so that a part of the wiring is exposed, and an end of the second opening is provided within an opposing region of the first opening; a second insulator (432, 433) having a third opening (432a, 433a) through which a part of the wiring is exposed and through which the connection member is disposed, the second insulator having an end portion of the third opening provided outside an opposing region of the first opening, an opening area of ​​the second opening is smaller than an opening area of ​​the first opening, and an opening area of ​​the third opening is equal to or larger than an opening area of ​​the first opening; The connection member has a fillet formed thereon, and the angle of the fillet is 135° or more.

2. A semiconductor element (41) including a semiconductor substrate (410), an electrode (41s) formed on one surface (410a) of the semiconductor substrate, and a protective film (411) having a first opening (411a) so that a part of the electrode is exposed, and an end of the first opening is provided on the electrode; a rewiring layer (42) having a sealing resin body (45) that seals the semiconductor element so that the electrodes are exposed, wiring (44s, 44a1, 48a, 48b) that is connected to the electrodes and to which a conductive connecting member is connected, and an insulator (43) that covers a part of the wiring, and is disposed on the one surface side of the semiconductor element; The insulator is A first insulator (431) having a second opening (431a) so that a part of the wiring is exposed, and an end of the second opening is provided within an opposing region of the first opening; a second insulator (432, 433) having a third opening (432a, 433a) through which a part of the wiring is exposed and through which the connection member is disposed, the second insulator having an end portion of the third opening provided outside an opposing region of the first opening, an opening area of ​​the second opening is smaller than an opening area of ​​the first opening, and an opening area of ​​the third opening is equal to or larger than an opening area of ​​the first opening; The wiring has a plurality of layers laminated with the insulator interposed therebetween, The wiring in the plurality of layers has a dummy wiring including an isolation portion (44a2) electrically isolated from the electrode, The semiconductor device, wherein the separation portion is provided between a boundary between the semiconductor substrate and the sealing resin body and a portion of the wiring in the plurality of layers that is electrically connected to the electrode.

3. 3. The semiconductor device according to claim 2, wherein the connection member is formed with a fillet, and the angle of the fillet is 135 degrees or more.

4. The wiring has a main wiring portion (44s) and a metal layer (48a) disposed between the main wiring portion and the electrode, the first insulator has the second opening so that the metal layer is exposed as a part of the wiring; 4. The semiconductor device according to claim 1, wherein the second insulator has the third opening so that the main wiring portion is exposed as a part of the wiring.

5. 5. The semiconductor device according to claim 1, wherein the wiring is directly connected to the electrode.

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