Antenna and manufacturing method for antenna

Abstract

To provide an antenna and a manufacturing method for the antenna, in which the thicknesses of a radiation electrode, a ground electrode, and a power supply wire can be reduced.SOLUTION: An antenna 10 includes a substrate 20 having a first surface 21, a second surface 22 existing on the opposite side of the first surface, and a side surface 23 existing between the first surface and the second surface, a film 30 including a film first part 31 facing the first surface of the substrate, a film second part 32 facing the second surface of the substrate, and a film third part 33 facing the side surface of the substrate at least partially and existing between the film first part and the film second part, and a conductive layer 40 existing on the film. The conductive layer includes a first patch layer (radiation electrode) 41 existing on the film first part, a ground layer 43 existing on at least the film second part, and a first wire 42 connected to the first patch layer and extending along the film from the first patch layer to the ground layer.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] SUMMARY OF THE DISCLOSURE Embodiments of the present disclosure relate to antennas and methods of manufacturing antennas. [Background technology]

[0002] In a communication system, as disclosed in Patent Document 1, for example, an antenna is used that includes a substrate having a first surface and a second surface, a radiation electrode located on the first surface of the substrate, and a ground electrode and a power supply line located on the second surface of the substrate. The radiation electrode and the power supply line are electrically connected by a through electrode that penetrates the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 7-235825 Summary of the Invention [Problem to be solved by the invention]

[0004] After the radiating electrode, the ground electrode, and the power supply line are formed on the surface of the substrate, the through electrode is formed by plating. In this case, the thickness of the radiating electrode, the ground electrode, and the power supply line increases during the plating process, and therefore the thickness of the antenna increases.

[0005] An object of the embodiments of the present disclosure is to provide an antenna and a method for manufacturing the antenna that can effectively solve such problems. [Means for solving the problem]

[0006] The embodiments of the present disclosure relate to the following [1] to

[35] . [1] An antenna comprising: a substrate including a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface; a film including a film first portion facing the first side of the substrate, a film second portion facing the second side of the substrate, and a film third portion at least partially facing the side of the substrate and positioned between the film first portion and the film second portion; a conductive layer overlying the film; The conductive layer includes a first patch layer located on the first portion of the film, a ground layer located on at least the second portion of the film, and a first wiring connected to the first patch layer and extending along the film from the first patch layer toward the ground layer.

[0007] [2] The antenna described in [1] may include a signal terminal connected to the first wiring and a ground portion connected to the ground layer, and may include a first connector to which a first cable is connected.

[0008] [3] In the antenna described in [2], the ground layer may extend from the second film portion to the first film portion, the first wiring may extend along the film from the first patch layer toward the ground layer located on the first film portion, and the first connector may be located on the ground layer located on the first film portion.

[0009] [4] In the antenna described in [3], the first cable extending along the first surface of the substrate may be connected to the first connector.

[0010] [5] In the antenna described in [4], the ground layer may extend from the second film portion to the third film portion, the first wiring may extend along the film from the first patch layer toward the ground layer located on the third film portion, and the first connector may be located on the ground layer located on the third film portion.

[0011] [6] In the antenna described in [5], the first cable extending along the first surface of the substrate may be connected to the first connector.

[0012] [7] In the antenna described in [5], the first cable extending along a normal direction of the second surface of the substrate may be connected to the first connector.

[0013] [8] In the antenna described in [2], the first wiring may extend along the film from the first patch layer toward the ground layer located on the second film portion, and the first wiring may include a wiring first portion located on the first film portion, a wiring second portion located on the second film portion, and a wiring third portion located between the wiring first portion and the wiring second portion, and the first connector may be located on the ground layer located on the second film portion.

[0014] [9] In the antenna described in [8], the second wiring portion may include a portion extending in a direction different from a direction in which the first wiring portion extends.

[0015]

[10] In the antenna described in [8] or [9], the antenna may have a first direction and a second direction that is a direction perpendicular to the first direction. The first direction is a direction in which the first wiring extends from the first patch layer. The second wiring portion may have a dimension in the first direction that is equal to or smaller than 1 / 2 of the wavelength of the radio wave emitted by the antenna.

[0016]

[11] In the antenna according to any one of [8] to

[10] , the antenna may have a first direction and a second direction that is a direction perpendicular to the first direction. The first direction is a direction in which the first wiring extends from the first patch layer. The first wiring may include a first end located on the first part of the film and a second end located on the second part of the film at a position different from the first end in the second direction. The first end of the first wiring may be an end of the first part of the wiring connected to the first patch layer. The second end of the first wiring may be an end of the second part of the wiring facing the ground layer along a surface direction of the film.

[0017]

[12] In the antenna described in any one of [8] to

[11] , the first cable extending along the second surface of the substrate may be connected to the first connector.

[0018]

[13] In the antenna described in any one of [8] to

[11] , the first cable extending along a normal direction of the second surface of the substrate may be connected to the first connector.

[0019]

[14] The antenna according to any one of [1] to

[13] may include a first surface, a second surface, and a third surface. The first surface is located on the first portion of the film, the second surface is located on the second portion of the film, and the third surface overlaps the side surface when viewed along the normal direction of the substrate. The antenna may include a design sheet or a protective sheet including at least a design first portion constituting the first surface.

[0020]

[15] In the antenna described in

[14] , the design sheet may include a design third portion constituting the third surface. Alternatively, the protective sheet may include a protective third portion constituting the third surface.

[0021]

[16] The antenna described in any one of [1] to

[15] may further include a second conductive layer located between the first patch layer and the first surface of the substrate and not electrically connected to the first patch layer and the ground layer.

[0022]

[17] The antenna described in any one of [1] to

[15] may comprise an insulating layer located on the first patch layer, and a second conductive layer located on the insulating layer and not electrically connected to the first patch layer and the ground layer.

[0023]

[18] The antenna described in

[14] may comprise an insulating layer located on the first patch layer, and a second conductive layer located between the insulating layer and the design sheet or between the insulating layer and the protective sheet, and not electrically connected to the first patch layer and the ground layer.

[0024]

[19] The antenna described in any one of [1] to

[18] may include a shielding layer located on the first portion of the film, and a plurality of first EBG structures connected to the shielding layer and having electrical conductivity, each of the first EBG structures may include a first penetration portion connected to the shielding layer and penetrating the first portion of the film, and a first planar portion connected to the first penetration portion and extending along the first surface of the substrate.

[0025]

[20] The antenna described in any one of [1] to

[19] may include a plurality of second EBG structures connected to the ground layer and having electrical conductivity, and each of the second EBG structures may include a second penetration portion connected to the ground layer and penetrating the second part of the film, and a second planar portion connected to the second penetration portion and extending along the second surface of the substrate.

[0026]

[21] In the antenna described in any one of [1] to

[20] , the conductive layer may include a second patch layer located on the first portion of the film, and a second wiring connected to the second patch layer and extending along the film from the second patch layer toward the ground layer, and the direction in which the second wiring extends from the second patch layer may be the same as the direction in which the first wiring extends from the first patch layer.

[0027]

[22] The antenna described in

[21] may include a signal terminal connected to the second wiring and a ground portion connected to the ground layer, and may also include a second connector to which a second cable is connected.

[0028]

[23] In the antenna described in any one of [1] to

[22] , the conductive layer may include a third patch layer located on the first portion of the film, and a third wiring connected to the third patch layer and extending along the film from the third patch layer toward the ground layer, and the direction in which the third wiring extends from the third patch layer may be different from the direction in which the first wiring extends from the first patch layer.

[0029]

[24] The antenna described in

[23] may include a signal terminal connected to the third wiring and a ground portion connected to the ground layer, and may also include a third connector to which a third cable is connected.

[0030]

[25] The antenna described in any one of [1] to

[24] may comprise a first adhesive layer located between the first surface of the substrate and the first film portion of the film, and a second adhesive layer located between the second surface of the substrate and the second film portion of the film.

[0031]

[26] The antenna described in

[25] may further include a third adhesive layer located between the side of the substrate and the third film portion of the film.

[0032]

[27] In the antenna described in

[26] , the side surface of the substrate may include a curved portion.

[0033]

[28] In the antenna described in

[25] , the substrate may include a first corner portion where the first surface and the side surface are connected, and a second corner portion where the second surface and the side surface are connected, the first adhesive layer may not cover the first corner portion, the second adhesive layer may not cover the second corner portion, and the first corner portion and the second corner portion may be in contact with the film.

[0034]

[29] The antenna according to any one of [1] to

[28] may further include a buffer material located between the side surface of the substrate and the third film portion of the film.

[0035]

[30] In the antenna according to any one of [1] to

[29] , the substrate may include an opening extending from the first surface to the second surface.

[0036]

[31] In the antenna according to

[30] , the first wiring may at least partially overlap the opening in a plan view.

[0037]

[32] In the antenna described in any one of [2] to

[13] , the substrate may include an opening extending from the first surface to the second surface, and the first connector may overlap the opening in a planar view.

[0038]

[33] In the antenna described in any one of [1] to

[32] , the film may be bent at the film third portion so that the film first portion and the film second portion face each other in the thickness direction of the substrate.

[0039]

[34] The antenna described in [1] may include a first cable including an inner conductor connected to the first wiring and an outer conductor connected to the ground layer.

[0040]

[35] A method for manufacturing an antenna, comprising: providing a substrate including a first surface, a second surface opposite the first surface, and a side surface between the first surface and the second surface; and a mounting step of mounting the laminate on the substrate, a laminate attached to the substrate, the laminate comprising a film including a film first portion facing the first side of the substrate, a film second portion facing the second side of the substrate, and a film third portion at least partially facing the side of the substrate and positioned between the film first portion and the film second portion; and a conductive layer positioned on the film; A method for manufacturing an antenna, wherein the conductive layer includes a first patch layer located on the first portion of the film, a ground layer located on at least the second portion of the film, and a first wiring connected to the first patch layer and extending along the film from the first patch layer toward the ground layer. Effect of the Invention

[0041] According to an embodiment of the present disclosure, the thickness of the antenna can be reduced. [Brief description of the drawings]

[0042] [Figure 1] FIG. 2 is a perspective view showing an example of an antenna. [Diagram 2] FIG. 2 is a cross-sectional view showing an example of an antenna. [Figure 3A] FIG. 2 is a plan view showing an example of a laminate. [Figure 3B] FIG. 2 is a cross-sectional view showing an example of a laminate. [Figure 4] 1A to 1C are diagrams illustrating a method for manufacturing an antenna. [Diagram 5] 1A to 1C are diagrams illustrating a method for manufacturing an antenna. [Figure 6] 11A to 11C are diagrams illustrating a manufacturing method of the antenna in the first comparative embodiment. [Figure 7] 11A to 11C are diagrams illustrating a manufacturing method of the antenna in the first comparative embodiment. [Figure 8]11A to 11C are diagrams illustrating a manufacturing method of the antenna in the first comparative embodiment. [Figure 9] 11A to 11C are diagrams illustrating a manufacturing method of the antenna in the first comparative embodiment. [Figure 10] FIG. 11 is a cross-sectional view showing an antenna in a first modified example. [Figure 11] FIG. 11 is a perspective view showing an antenna in a second modified example. [Figure 12] FIG. 11 is a cross-sectional view showing an antenna in a second modified example. [Figure 13] FIG. 11 is a cross-sectional view showing an antenna in a third modified example. [Figure 14] FIG. 13 is a cross-sectional view showing an antenna in a fourth modified example. [Figure 15] FIG. 13 is a cross-sectional view showing an antenna in a fifth modified example. [Figure 16] FIG. 13 is a cross-sectional view showing an antenna in a sixth modified example. [Figure 17] FIG. 13 is a cross-sectional view showing an antenna in a seventh modified example. [Figure 18] FIG. 13 is a cross-sectional view showing an antenna in an eighth modified example. [Figure 19A] FIG. 13 is a cross-sectional view showing an antenna in a ninth modified example. [Figure 19B] FIG. 13 is a cross-sectional view showing an antenna in a ninth modified example. [Figure 20] FIG. 23 is a cross-sectional view showing an antenna in a tenth modified example. [Figure 21] FIG. 23 is a plan view showing a laminate in an eleventh modified example. [Figure 22] FIG. 23 is a plan view showing an antenna in an eleventh modified example. [Diagram 23] FIG. 23 is a plan view showing a laminate in a twelfth modified example. [Figure 24] FIG. 23 is a plan view showing an antenna in a twelfth modified example. [Diagram 25] FIG. 23 is a plan view showing a laminate in a thirteenth modified example. [Figure 26] FIG. 23 is a plan view showing an antenna in a thirteenth modified example. [Figure 27] FIG. 23 is a plan view showing a laminate in a fourteenth modified example. [Figure 28] FIG. 23 is a plan view showing an antenna in a fourteenth modified example. [Figure 29] FIG. 23 is a perspective view showing an antenna in a fifteenth modified example. [Diagram 30] FIG. 23 is a plan view showing a laminate in a sixteenth modified example. [Diagram 31] A cross-sectional view showing an antenna in a sixteenth modified example. [Diagram 32] FIG. 23 is a perspective view showing an antenna in a sixteenth modified example. [Diagram 33] FIG. 23 is a plan view showing a laminate in a seventeenth modified example. [Diagram 34] A cross-sectional view showing an antenna in a seventeenth modified example. [Diagram 35] FIG. 23 is a perspective view showing an antenna in a seventeenth modified example. [Diagram 36] FIG. 11 is a plan view showing an antenna in a second comparative embodiment. [Figure 37] FIG. 23 is a plan view showing a laminate in an 18th modified example. [Figure 38] A cross-sectional view showing an antenna in an 18th modified example. [Figure 39] FIG. 23 is a plan view showing a laminate in a nineteenth modified example. [Diagram 40] A cross-sectional view showing an antenna in a 19th modified example. [Diagram 41] FIG. 26 is a plan view showing a laminate in a twentieth modified example. [Diagram 42] FIG. 26 is a plan view showing an antenna in a twentieth modified example. [Diagram 43] A cross-sectional view showing an antenna in a twentieth modified example. [Diagram 44] A cross-sectional view showing an antenna in a 21st modified example. [Diagram 45] A cross-sectional view showing an antenna in a twenty-second modified example. [Figure 46] A cross-sectional view showing an antenna in a 23rd modified example. [Figure 47] A cross-sectional view showing an antenna in a 24th modified example. [Figure 48] FIG. 25 is a perspective view showing an antenna in a twenty-fifth modified example. [Figure 49] A cross-sectional view showing an antenna in a 25th modified example. [Figure 50] A cross-sectional view showing an antenna in a 26th modified example. [Figure 51] A cross-sectional view showing an antenna in a 27th modified example. [Figure 52] A cross-sectional view showing an antenna in a 28th modified example. [Diagram 53] A cross-sectional view showing an antenna in a 29th modified example. [Figure 54] A cross-sectional view showing an antenna in a 30th modified example. [Figure 55] A cross-sectional view showing an antenna in a thirty-first modified example. [Figure 56] FIG. 32 is a perspective view showing a substrate in a thirty-second modified example. [Figure 57] FIG. 32 is a plan view showing an antenna in a thirty-second modified example. [Figure 58] A cross-sectional view showing an antenna in a thirty-second modified example. [Figure 59] FIG. 33 is a perspective view showing a substrate in a thirty-third modified example. [Figure 60] A cross-sectional view showing an antenna in a thirty-third modified example. [Figure 61] A cross-sectional view showing an antenna in a thirty-fourth modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0043] In this specification and drawings, unless otherwise specified, terms that refer to a material that serves as the basis of a certain configuration, such as "substrate," "base material," "plate," "sheet," and "film," are not to be distinguished from one another solely on the basis of differences in name.

[0044] In this specification and drawings, unless otherwise specified, terms that specify shapes, geometric conditions, and the extent thereof, such as "parallel" and "orthogonal," and values ​​of lengths and angles, are not bound by strict meanings, but are interpreted to include a range within which similar functions may be expected.

[0045] In this specification and drawings, unless otherwise specified, when a certain configuration such as a certain member or a certain region is described as being "on" or "under", "upper" or "lower" or "above" or "below" another configuration such as another member or another region, this includes the case where the certain configuration is in direct contact with the other configuration. It also includes the case where another configuration is included between a certain configuration and the other configuration, that is, where the configuration is indirectly in contact. Furthermore, unless otherwise specified, the words "on", "upper side", "upper", or "lower", "lower side", and "lower" may be used in the up-down direction.

[0046] In this specification and drawings, unless otherwise specified, the same or similar parts or parts having similar functions are denoted by the same or similar symbols, and repeated explanations may be omitted. In addition, the dimensional ratios of the drawings may differ from the actual ratios for the convenience of explanation, and some components may be omitted from the drawings.

[0047] In this specification and drawings, unless otherwise specified, the present invention may be combined with other embodiments or modified versions as long as no contradictions arise. In addition, other embodiments may be combined with each other, or other embodiments and modified versions may be combined as long as no contradictions arise. In addition, modified versions may be combined as long as no contradictions arise.

[0048] In this specification and drawings, unless otherwise specified, when a plurality of steps are disclosed in a method such as a manufacturing method, other steps that are not disclosed may be performed between the disclosed steps. In addition, the order of the disclosed steps is arbitrary within the range that does not cause contradiction.

[0049] In this specification, when multiple upper limit candidates and multiple lower limit candidates are given for a certain parameter, the numerical range of the parameter may be formed by combining any one of the upper limit candidates and any one of the lower limit candidates. For example, consider a case where "parameter B is, for example, A1 or more, may be A2 or more, or may be A3 or more. Parameter B is, for example, A4 or less, may be A5 or less, or may be A6 or less." In this case, the numerical range of parameter B may be A1 or more and A4 or less, A1 or more and A5 or less, A1 or more and A6 or less, A2 or more and A4 or less, A2 or more and A5 or less, A2 or more and A6 or less, A3 or more and A4 or less, A3 or more and A5 or less, or A3 or more and A6 or less.

[0050] An embodiment of the present disclosure will be described in detail with reference to the drawings. Note that the embodiment described below is an example of the present disclosure, and the present disclosure is not to be interpreted as being limited to only these embodiments.

[0051] In recent years, high-frequency radio waves such as microwaves, millimeter waves, and submillimeter waves have begun to be used in various fields. Microwaves are radio waves with a frequency band of approximately 3 GHz to 30 GHz. Millimeter waves are radio waves with a frequency band of approximately 30 GHz to 300 GHz. Submillimeter waves are radio waves with a frequency band of approximately 300 GHz to 3 THz. Examples of fields in which they are used include 5th generation mobile communication systems, mobile and automotive communication systems, radar for collision prevention systems, and medical biosensing.

[0052] 1 and 2 are a perspective view and a cross-sectional view showing an antenna 10. The antenna 10 includes a first surface 11 and a second surface 12. The second surface 12 is located on the opposite side of the first surface 11 in the thickness direction of the antenna 10. The antenna 10 may be installed on various structures with the second surface 12 facing the structure. For example, the antenna 10 may be installed on a wall, ceiling, pillar, or the like of a building. For example, the antenna 10 may be installed on a pole of a traffic light, a smart street lamp, or the like.

[0053] When the antenna 10 is installed in a place visible to people, it is preferable that the antenna 10 is inconspicuous. For example, it is preferable that the thickness of the antenna 10 is small. For example, it is preferable that the antenna 10 has an appearance that blends in with the surrounding environment. By making the antenna 10 inconspicuous, it is possible to prevent the antenna 10 from spoiling the appearance of the structure.

[0054] The configuration of the antenna 10 will be described. The antenna 10 includes a substrate 20, a film 30, and a conductive layer 40. The substrate 20 includes a first surface 21, a second surface 22, and a side surface 23. The first surface 21 faces the first surface 11. The second surface 22 is located on the opposite side of the first surface 21 in the thickness direction of the antenna 10. The second surface 22 faces the second surface 12. The side surface 23 is located between the first surface 21 and the second surface 22. The side surface 23 extends from the first surface 21 to the second surface 22. The side surface 23 may extend along the thickness direction of the substrate 20. For example, the side surface 23 may include a surface parallel to the thickness direction of the substrate 20.

[0055] 1, the outline of the first surface 21 and the second surface 22 may be a rectangle. In this case, the substrate 20 includes four side surfaces 23.

[0056] The film 30 is attached to both the first side 21 and the second side 22 of the substrate 20. A portion of the film 30 facing the first side 21 of the substrate 20 is also referred to as a film first portion 31. A portion of the film 30 facing the second side 22 of the substrate 20 is also referred to as a film second portion 32. The film 30 includes the film first portion 31 and the film second portion 32, and a film third portion 33 located between the film first portion 31 and the film second portion 32. The film third portion 33 at least partially faces the side surface 23 of the substrate 20.

[0057] The surface of the film 30 facing the substrate 20 is referred to as the inner surface 302. The surface of the film 30 opposite the inner surface 302 is referred to as the outer surface 301. The inner surface 302 of the first film portion 31 and the inner surface 302 of the second film portion 32 face each other in the thickness direction of the antenna 10. The film 30 is bent at the third film portion 33 so that the first film portion 31 and the second film portion 32 face each other in the thickness direction of the substrate 20.

[0058] The conductive layer 40 includes a first patch layer 41, a first wiring 42, and a ground layer 43. The first patch layer 41 is located on the film first portion 31. The ground layer 43 is located on at least the film second portion 32. The first wiring 42 extends from the first patch layer 41 toward the ground layer 43.

[0059] 1 and 2, the ground layer 43 extends from the second film portion 32 through the third film portion 33 to the first film portion 31. In this case, the first wiring 42 extends along the surface of the film 30 from the first patch layer 41 toward the ground layer 43 located on the first film portion 31.

[0060] The first wiring 42 is connected to the first patch layer 41. The end of the first wiring 42 connected to the first patch layer 41 is also referred to as a first end 425. The first wiring 42 may be close to the ground layer 43 in the surface direction of the film 30. The end of the first wiring 42 close to the ground layer 43 is also referred to as a second end 426.

[0061] The direction in which the first wiring 42 extends from the first patch layer 41 at the first end 425 is also referred to as the first direction D1. The first direction D1 may be a direction parallel to one side constituting the outline of the first surface 21. The first direction D1 may be a direction perpendicular to a side of the first surface 21 that contacts the side surface 23 overlapping the second film portion 32. A direction perpendicular to the first direction D1 within the plane of the first surface 21 is also referred to as the second direction D2.

[0062] 1 and 2, the antenna 10 may include a first adhesive layer 36 located between the first surface 21 of the substrate 20 and the first film portion 31 of the film 30. The antenna 10 may include a second adhesive layer 37 located between the second surface 22 of the substrate 20 and the second film portion 32 of the film 30.

[0063] When a certain component of the antenna 10 is located outside the first surface 21 in the thickness direction of the substrate 20, it is also referred to as being "located on the first side D10." "Outside in the thickness direction" means the side away from the substrate 20 in the thickness direction. The above-mentioned first film portion 31, first patch layer 41, first wiring 42, first adhesive layer 36, etc. are located on the first side D10. A part of the ground layer 43 is located on the first side D10.

[0064] When a certain component of the antenna 10 is located outside the second surface 22 in the thickness direction of the substrate 20, it is also referred to as being "located on the second side D20." The above-mentioned second film portion 32, second adhesive layer 37, etc. are located on the second side D20. A part of the ground layer 43 is located on the second side D20.

[0065] Each component of antenna 10 will now be described in detail.

[0066] (substrate) The substrate 20 includes a material having insulating properties. The material of the substrate 20 may be an inorganic substance or a resin. The material of the substrate 20 may be an inorganic-organic mixture. Examples of inorganic substances include glass, quartz, and silicon. Examples of resins include fluororesin, liquid crystal polymer (LCP), polypropylene (PP), modified polypropylene (modified PP), polyimide (PI), cycloolefin polymer (COP), and polystyrene (PS). Examples of fluororesin include fully fluorinated resins such as polytetrafluoroethylene (PTFE), partially fluorinated resins such as polychlorotrifluoroethylene (PCTFE), and fluorinated resin copolymers such as ethylene-tetrafluoroethylene copolymer (ETFE). The resin may include voids.

[0067] The substrate 20 may be composed of a single layer or multiple layers.

[0068] The substrate 20 may have a low relative dielectric constant. The relative dielectric constant of the substrate 20 may be 4.5 or less, 4.0 or less, 3.5 or less, 3.0 or less, 2.5 or less, or 2.0 or less. This can increase the radiation efficiency and gain of the antenna 10. The relative dielectric constant of the substrate 20 may be 1.0 or more, or 1.5 or more.

[0069] Fluorine resin has a relative dielectric constant of, for example, 2.0 or more and 3.0 or less. Liquid crystal polymer has a relative dielectric constant of, for example, 2.9 or more and 3.7 or less. Polypropylene has a relative dielectric constant of, for example, 2.2 or more and 2.6 or less. Polyimide has a relative dielectric constant of about 3.5. The values ​​of the relative dielectric constant in this application are values ​​when the ambient temperature is 20°C and the radio wave frequency is 10 GHz.

[0070] The substrate 20 may have a low dielectric loss tangent tan δ. The dielectric loss tangent tan δ of the substrate 20 may be 0.01 or less, 0.005 or less, 0.001 or less, or 0.0005 or less.

[0071] The thickness T1 of the substrate 20 may be determined relative to the wavelength λ of the radio wave. The wavelength λ is calculated by dividing the speed of light by the frequency of the radio wave. The thickness T1 of the substrate 20 is, for example, λ×1 / 10 or less, or may be λ×1 / 20 or less, or may be λ×1 / 50 or less, or may be λ×1 / 100 or less. The thickness T1 of the substrate 20 is λ×1 / 10000 or more, or may be λ×1 / 5000 or more, or may be λ×1 / 2000 or more, or may be λ×1 / 1000 or more. The smaller the thickness T1, the higher the frequency of the radio wave that the antenna 10 can transmit or receive.

[0072] (film) 3A and 3B are plan and cross-sectional views showing film 30 and conductive layer 40 prior to attachment to substrate 20. The laminate including film 30 and conductive layer 40 is designated by the numeral 15.

[0073] As described above, when the film 30 is attached to the substrate 20, the film third portion 33 is deformed such that the orientation of the inner surface 302 is reversed between the film first portion 31 and the film second portion 32. The film 30 has a degree of flexibility that allows it to be deformed.

[0074] The material of the film 30 is, for example, a resin. Examples of the resin include polyimide, epoxy resin, benzocyclobutene resin, polyamide, phenol resin, fluororesin, liquid crystal polymer, polyamideimide, polybenzoxazole, cyanate resin, aramid resin, polyolefin, polyester, polyacetal, polystyrene, polyphenylene sulfide, polyether ether ketone, polyether nitrile, polycarbonate, polyphenylene ether polysulfone, polyether sulfone, polyarylate, and polyetherimide.

[0075] The film 30 may have a low relative dielectric constant. The relative dielectric constant of the film 30 may be 4.0 or less, 3.5 or less, 3.0 or less, 2.5 or less, or 2.0 or less. This can increase the radiation efficiency and gain of the antenna 10. The relative dielectric constant of the film 30 may be 1.0 or more, or 1.5 or more.

[0076] The film 30 may have a low dielectric loss tangent tan δ. The dielectric loss tangent tan δ of the film 30 may be 0.01 or less, 0.005 or less, 0.001 or less, or 0.0005 or less.

[0077] The thickness T2 of the film 30 may be determined relative to the wavelength λ of the radio wave. The thickness T2 of the film 30 is, for example, λ×1 / 200 or less, or may be λ×1 / 500 or less, or may be λ×1 / 1000 or less, or may be λ×1 / 2000 or less. The thickness T2 of the film 30 is, for example, λ×1 / 20000 or more, or may be λ×1 / 10000 or more, or may be λ×1 / 5000 or more, or may be λ×1 / 3000 or more.

[0078] The thickness T2 of the film 30 may be smaller than the thickness T1 of the substrate 20. The ratio of the thickness T2 to the thickness T1, T2 / T1, is, for example, 0.99 or less, or may be 0.30 or less, or may be 0.10 or less. T2 / T1 is, for example, 0.001 or more, or may be 0.01 or more, or may be 0.03 or more.

[0079] The thickness T2 of the film 30 may be greater than the thickness T1 of the substrate 20. The ratio of the thickness T2 to the thickness T1, T2 / T1, is, for example, 1.01 or more, may be 1.10 or more, or may be 1.50 or more. T2 / T1 is, for example, 3.00 or less, may be 2.50 or less, or may be 2.00 or less.

[0080] As shown in FIG. 2, the inner surface 302 of the third film portion 33 may not be in contact with the side surface 23 of the substrate 20. The symbol G1 represents the distance between the side surface 23 and the third film portion 33 in the planar direction of the first surface 21. The distance G1 is measured at a position where the distance G1 is maximum. The distance G1 may be determined relative to the wavelength λ of the radio wave. The distance G1 is, for example, λ×1 / 2000 or more, may be λ×1 / 1000 or more, may be λ×1 / 500 or more, or may be λ×1 / 200 or more. The distance G1 is, for example, λ×1 / 2 or less, may be λ×1 / 4 or less, may be λ×1 / 5 or less, or may be λ×1 / 10 or less.

[0081] When the film third portion 33 is curved with a semicircular profile, the distance G1 is about half the thickness T1 of the substrate 20. The ratio G1 / T1 of the distance G1 to the thickness T1 of the substrate 20 may be less than 0.5. G1 / T1 is, for example, 0.49 or less, or may be 0.40 or less, or may be 0.30 or less. G1 / T1 is, for example, 0.10 or more, or may be 0.15 or more, or may be 0.20 or more.

[0082] G1 / T1 may be greater than 0.5. G1 / T1 may be, for example, 0.51 or more, or 0.55 or more, or 0.60 or more. G1 / T1 may be, for example, 1.00 or more, or 0.90 or less, or 0.80 or less. G1 / T1 may be adjusted by adjusting the positions of the ends of the first adhesive layer 36 and the second adhesive layer 37, thereby adjusting the radius of curvature of the film third portion 33.

[0083] (Conductive layer) The first patch layer 41 is an element that transmits or receives radio waves. A patch layer such as the first patch layer 41 is also called a radiating electrode.

[0084] In FIG. 1, the symbol L10 represents the dimension of the first patch layer 41 in the first direction D1. The symbol W10 represents the dimension of the first patch layer 41 in the second direction D2. The dimensions L10 and W10 may be determined relative to the wavelength λ of the radio wave. The dimensions L10 and W10 may be, for example, λ or less, λ×1 / 2 or less, λ×1 / 4 or less, or λ×1 / 5 or less. The dimensions L10 and W10 may be, for example, λ×1 / 10 or more.

[0085] The dimensions L10 and W10 may be determined based on the frequency of the radio waves that the antenna 10 transmits or receives. When the frequency of the radio waves is 3 GHz or more and 6 GHz or less, the dimensions L10 and W10 may be 5 mm or more and 100 mm or less. When the frequency of the radio waves is 25 GHz or more and 30 GHz or less, the dimensions L10 and W10 may be 1 mm or more and 12 mm or less. When the frequency of the radio waves is 50 GHz or more and 75 GHz or less, the dimensions L10 and W10 may be 0.4 mm or more and 6 mm or less. When the frequency of the radio wave is 75 GHz or more and 300 GHz or less, the dimensions L10 and W10 may be 0.1 mm or more and 4 mm or less.

[0086] The ground layer 43 forms a capacitor between the first patch layer 41 and the ground layer 43. The ground layer 43 is also referred to as a ground electrode. The ground layer 43 may have an area larger than the area of ​​the first patch layer 41.

[0087] The direction in which the first patch layer 41 and the ground layer 43 are arranged on the surface of the film 30 is also referred to as a first arrangement direction E1. The film 30 may be attached to the substrate 20 so that the first arrangement direction E1 coincides with the above-mentioned first direction D1. A direction perpendicular to the first arrangement direction E1 within the surface of the film 30 is also referred to as a second arrangement direction E2.

[0088] The first wiring 42 may supply power from a control device (not shown) to the first patch layer 41. The first wiring 42 is also referred to as a power supply wiring. The control device includes, for example, a semiconductor element.

[0089] The first wiring 42 has a width W2. The width W2 of the first wiring 42 is smaller than the dimension W10 of the first patch layer 41. The width W2 may be determined relative to the sum T0 of the thickness T1 of the substrate 20 and the thickness T2 of the film 30. The width W2 may be, for example, T0×1.5 or more, T0×2.0 or more, T0×2.5 or more, or T0×3.0 or more. The width W2 may be, for example, T0×4.0 or less, or T0×5.0 or less.

[0090] The second end 426 of the first wiring 42 may not be connected to the ground layer 43. In FIGS. 2 to 3B, the symbol G2 represents the distance between the second end 426 of the first wiring 42 and the ground layer 43 in the first direction D1. The distance G2 is, for example, 10 μm or more, may be 20 μm or more, may be 50 μm or more, or may be 100 μm or more. The distance G2 is, for example, 10 mm or less, may be 5 mm or less, may be 2 mm or less, or may be 1 mm or less.

[0091] The conductive layer 40, such as the first patch layer 41, the first wiring 42, and the ground layer 43, includes a material having electrical conductivity. For example, the conductive layer 40 includes a metal material such as copper (Cu), gold (Au), silver (Ag), aluminum (Al), or an alloy using these materials. The conductive layer 40 may include a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO). The conductive layer 40 may include a carbon-based conductive material such as graphite, carbon nanotubes, graphene, or fullerene.

[0092] The thickness T3 of the conductive layer 40, such as the first patch layer 41, the first wiring 42, and the ground layer 43, is, for example, 0.1 μm or more, and may be 1 μm or more, 3 μm or more, or 5 μm or more. The thickness T3 of the conductive layer 40 is, for example, 35 μm or less, and may be 25 μm or less, 20 μm or less, or 15 μm or less.

[0093] The lower limit of the thickness T3 of the conductive layer 40 may be determined according to the frequency of the radio waves transmitted or received by the antenna 10. For example, the lower limit of the thickness T3 of the conductive layer 40 may be larger than the skin depth of the signal flowing through the first wiring 42. The skin depth of the signal depends on the frequency of the radio waves.

[0094] (Adhesive layer) Adhesive layers such as first adhesive layer 36 and second adhesive layer 37 are elements for attaching film 30 to substrate 20. The adhesive layer may be a layer that can be peeled off from an object. Alternatively, the adhesive layer may be a layer that is difficult to peel off from an object, or a layer that is not intended to be peeled off from an object.

[0095] The adhesive layer may be transparent. The adhesive layer may be, for example, an optical adhesive sheet. The material of the adhesive layer may be an adhesive such as a polyester urethane-based adhesive. The material of the adhesive layer may have a curing property. The curing type may be thermosetting, ultraviolet curing, solvent volatility, moisture curing, curing agent mixing, anaerobic curing, heat solubility, pressure sensitivity, rewetting, etc.

[0096] The thickness of the adhesive layer is, for example, 2 μm or more, may be 5 μm or more, or may be 10 μm or more. The thickness of the adhesive layer is, for example, 200 μm or less, may be 100 μm or less, may be 50 μm or less, may be 30 μm or less, or may be 20 μm or less.

[0097] Next, an example of a method for manufacturing the antenna 10 will be described.

[0098] First, the substrate 20 is prepared. Then, as shown in FIG. 4, a first adhesive layer 36 is formed on the first surface 21 of the substrate 20, and a second adhesive layer 37 is formed on the second surface 22. The method of forming adhesive layers such as the first adhesive layer 36 and the second adhesive layer 37 is not particularly limited. For example, a material constituting the adhesive layer may be applied onto the surface of the substrate 20. The material constituting the adhesive layer may be applied by printing or spraying. Alternatively, an adhesive sheet including an adhesive layer and a base material may be brought into contact with the surface of the substrate 20, and the adhesive layer may be transferred onto the surface of the substrate 20.

[0099] Also, a step of preparing the laminate 15 is performed. First, the film 30 is prepared. Next, the first patch layer 41, the first wiring 42, and the ground layer 43 are formed on the surface of the film 30.

[0100] Although not shown, adhesive layers such as the first adhesive layer 36 and the second adhesive layer 37 may be formed on the surface of the film 30 .

[0101] There is no particular limitation on the method of forming the first patch layer 41, the first wiring 42, and the ground layer 43. For example, the conductive layer 40 may first be formed on the film 30 by a plating method, a printing method, a sputtering method, a vapor deposition method, or the like, and then the conductive layer 40 may be partially removed by etching or the like. In this case, a laminate in which the conductive layer 40 has been formed in advance on the surface of the film 30 may be used. Alternatively, the first patch layer 41, the first wiring 42, and the ground layer 43 may be formed by partially forming a layer of a conductive material on the film 30 by an inkjet method or the like.

[0102] 5, an attachment step is performed to attach the laminate 15 to the substrate 20. The attachment step includes the steps of deforming the film 30 at the film third portion 33, attaching the inner surface 302 of the film first portion 31 to the first surface 21 of the substrate 20, and attaching the inner surface 302 of the film second portion 32 to the second surface 22 of the substrate 20.

[0103] The attachment step may be performed continuously while the substrate 20 and the laminate 15 are transported along the second direction D2. In this case, the substrate 20 and the laminate 15 have a form extending along the second direction D2. For example, the substrate 20 and the laminate 15 have dimensions in the second direction D2 corresponding to a plurality of antennas 10. In this case, the laminate 15 includes a plurality of first patch layers 41 and first wirings 42 arranged along the second direction D2. After the attachment step, the substrate 20 and the laminate 15 are cut at regular intervals in the second direction D2 to obtain the antenna 10. By performing the attachment step continuously, the productivity of the antenna 10 can be increased.

[0104] Next, a method for manufacturing an antenna in the first comparative embodiment will be described with reference to Fig. 6 to Fig. 9. First, as shown in Fig. 6, a substrate 20 having a conductive layer 140 formed on a first surface 21 and a second surface 22 is prepared. Then, as shown in Fig. 7, the conductive layer 140 on the first surface 21 is processed by an etching method or the like. As a result, a first patch layer 141, a first wiring 142, and a ground layer 143 are formed on the first surface 21 of the substrate 20. The conductive layer 140 on the second surface 22 constitutes a ground layer 144.

[0105] 8, through holes 28 are formed in the substrate 20. Then, as shown in Fig. 9, through electrodes 145 are formed in the through holes 28 by plating. The through electrodes 145 electrically connect the ground layers 143 and 144.

[0106] In the first comparative example, the thicknesses of the first patch layer 141, the first wiring 142, the ground layer 143, and the ground layer 144 increase during the formation of the through electrode 145 by plating. This increases the thickness of the antenna.

[0107] 1 to 5, the first patch layer 41, the first wiring 42, and the ground layer 43 are obtained by attaching the laminate 15 to the substrate 20. Therefore, compared to the first comparative embodiment, the thicknesses of the first patch layer 41, the first wiring 42, and the ground layer 43 can be controlled more precisely. This allows, for example, the thickness of the antenna 10 to be reduced. Also, the productivity of the antenna 10 can be improved.

[0108] The above-described embodiment can be modified in various ways. Hereinafter, other embodiments will be described with reference to the drawings as necessary. In the following description and the drawings used in the following description, the same reference numerals as those used for the corresponding parts in the above-described embodiment are used for parts that can be configured similarly to the above-described embodiment. Duplicate descriptions will be omitted. In addition, if it is clear that the effects obtained in the above-described embodiment can also be obtained in other embodiments, the description may be omitted.

[0109] (First Modification) 10 is a cross-sectional view showing an antenna 10 in a first modified example. The antenna 10 may include a first connector 60. The first connector 60 may be located on the film first portion 31. For example, the first connector 60 may include a signal terminal 601 connected to the first wiring 42 on the film first portion 31, and a ground portion 602 connected to the ground layer 43 on the film first portion 31.

[0110] The antenna 10 may include a first cable 61 connected to the first connector 60. The first cable 61 may include an inner conductor connected to a signal terminal 601 and a signal terminal connected to a ground portion 602. The first cable 61 may be a coaxial cable. The first cable 61 may extend at least partially along the first surface 21 of the substrate 20.

[0111] (Second Modification) 11 and 12 are a perspective view and a cross-sectional view showing the antenna 10 in the second modified example. The ground layer 43 may not extend to the film third portion 33 and the film first portion 31. That is, the ground layer 43 may be located only in the film second portion 32. In this case, the first wiring 42 may extend from the film first portion 31 through the film third portion 33 to the film second portion 32. For example, the first wiring 42 may extend from the first patch layer 41 located on the film first portion 31 toward the ground layer 43 located on the film second portion 32 to the film second portion 32.

[0112] A portion of the first wiring 42 located on the film first portion 31 is also referred to as a wiring first portion 421. A portion of the first wiring 42 located on the film second portion 32 is also referred to as a wiring second portion 422. A portion of the first wiring 42 located between the wiring first portion 421 and the wiring second portion 422 is also referred to as a wiring third portion 423. As shown in FIG. 12 , a part of the wiring first portion 421 and the wiring second portion 422 may face each other in the thickness direction of the substrate 20.

[0113] (Third Modification) 13 is a cross-sectional view showing the antenna 10 in the third modified example. The first connector 60 may be located on the film second portion 32. For example, the first connector 60 may include a signal terminal 601 connected to the wiring second portion 422, and a ground portion 602 connected to the ground layer 43 located on the film second portion 32.

[0114] The first cable 61 may at least partially extend along the second surface 22 of the substrate 20. For example, the portion of the first cable 61 that extends along the second surface 22 of the substrate 20 may be connected to the first connector 60.

[0115] (Fourth Modification) 14 is a cross-sectional view showing the antenna 10 in the fourth modified example. The first cable 61 may extend along the normal direction of the second surface 22 of the substrate 20. For example, a portion of the first cable 61 extending along the normal direction of the second surface 22 may be connected to the first connector 60. In this case, the first cable 61 may be inserted into a hole formed in a structure to which the antenna 10 is attached. For example, when the antenna 10 is attached to the wall of a building, the first cable 61 may be inserted into a hole in the wall and led to the back side of the wall.

[0116] (Fifth Modification) 15 is a cross-sectional view showing an antenna 10 in a fifth modified example. The ground layer 43 may extend from the film second portion 32 to the film third portion 33. The ground layer 43 may not extend to the film first portion 31. In this case, the first wiring 42 may extend from the film first portion 31 to the film third portion 33. For example, the first wiring 42 may extend from the first patch layer 41 located on the film first portion 31 to the film third portion 33 toward the ground layer 43 located on the film third portion 33.

[0117] (Sixth Modification) 16 is a cross-sectional view showing antenna 10 in a sixth modified example. First connector 60 may be located on film third portion 33. For example, first connector 60 may include a signal terminal 601 connected to wiring third portion 423 on film third portion 33, and a ground portion 602 connected to ground layer 43 on film third portion 33.

[0118] By positioning the first connector 60 on the film third portion 33, it is possible to prevent the first connector 60 from protruding in the thickness direction outside the film first portion 31 or outside the second surface 22. This makes it possible to reduce the dimension of the antenna 10 in the thickness direction.

[0119] The first cable 61 may at least partially extend along a normal direction of the second surface 22 of the substrate 20. For example, the portion of the first cable 61 extending along the second surface 22 of the substrate 20 may be connected to the first connector 60. In this case, the first cable 61 may be inserted into a hole formed in a structure to which the antenna 10 is attached. For example, when the antenna 10 is attached to the wall of a building, the first cable 61 may be inserted into a hole in the wall and led to the back side of the wall.

[0120] (Seventh Modification) 17 is a cross-sectional view showing the antenna 10 in the seventh modified example. The first cable 61 may extend along the first surface 21 of the substrate 20. For example, a portion of the first cable 61 extending along the first surface 21 may be connected to the first connector 60. This makes it possible to prevent the first connector 60 from being located outside the first film portion 31 or outside the second surface 22 in the thickness direction. This makes it possible to reduce the dimension of the antenna 10 including the first connector 60 in the thickness direction.

[0121] (Eighth Modification) 18 is a cross-sectional view showing an antenna 10 in an eighth modified example. The antenna 10 may include a design sheet 70. The design sheet 70 is a member that imparts a visual design to the antenna 10.

[0122] The design sheet 70 may be located on the surface of the antenna 10. The design sheet 70 may cover the first connector 60. The design sheet 70 may be a colorless and transparent layer. The design sheet 70 may be configured to exhibit some color. In other words, the design sheet 70 does not have to be a colorless and transparent layer. By providing the design sheet 70, it is possible to prevent the first patch layer 41 from being visible. Therefore, it is possible to prevent the first patch layer 41 from impairing the appearance of the structure 121. Colorless and transparent means that there is no color and the transmittance of light having a wavelength of 360 nm to 830 nm is 95% or more.

[0123] The design sheet 70 may include a colorant and a binder resin. The design sheet 70 may be configured to present the same color over the entire area. For example, the colorant may be uniformly distributed over the entire area of ​​the design sheet 70. The design sheet 70 may be configured to present some kind of pattern. For example, the colorant may be distributed in some kind of pattern on the design sheet 70. The design sheet 70 may be configured to present one color, or two or more colors. The design sheet 70 may include a transparent portion.

[0124] The colorant may include an organic ink or an inorganic ink. The organic ink is a colorant mainly made of an organic compound. The inorganic ink is a colorant mainly made of an inorganic compound. The colorant is a pigment or a dye.

[0125] The design sheet 70 may have a pattern. For example, the design sheet 70 may have a pattern that is the same as or similar to the structure on which the antenna 10 is installed. This allows the antenna 10 to have an appearance that blends in with the surrounding environment. This makes it possible to prevent the antenna 10 from being conspicuous.

[0126] The thickness T4 of the design sheet 70 is, for example, 5 μm or more, may be 10 μm or more, may be 20 μm or more, may be 50 μm or more, or may be 100 μm or more. The thickness T4 of the design sheet 70 is, for example, 2 mm or less, may be 1 mm or less, may be 500 μm or less, or may be 200 μm or less.

[0127] 18, the design sheet 70 includes a design first portion 71 that constitutes the first surface 11 of the antenna 10. The first surface 11 is the surface of the antenna 10 located on the first side D10. That is, the first surface 11 is located on the film first portion 31. When the first connector 60 is located on the film first portion 31, the design first portion 71 may cover the first connector 60.

[0128] The antenna 10 may include a protective sheet instead of the design sheet 70. The protective sheet is the same as the design sheet 70 described above, except that it does not have a visual design. The protective sheet is a colorless and transparent layer. The protective sheet may cover components of the antenna 10, such as the first connector 60. The configuration related to the design sheet 70 may also be adopted in the protective sheet. The description of the configuration related to the design sheet 70, such as the design first part 71 described in this specification, is replaced with the description of the configuration related to the protective sheet by replacing "design" with "protection". For example, the protective sheet includes a protective first part that constitutes the first surface 11 of the antenna 10. For example, the protective sheet may include a protective third part that constitutes the third surface 13 of the antenna 10 in addition to the protective first part.

[0129] (Ninth Variation) FIG. 19A is a cross-sectional view showing an antenna 10 in a ninth modified example. In addition to the design first portion 71, the design sheet 70 may include a design third portion 73 constituting the third surface 13. The third surface 13 is the surface of the antenna 10 that overlaps the side surface 23 when viewed along the normal direction of the side surface 23 of the substrate 20. In the example shown in FIG. 19A, the design sheet 70 includes a design third portion 73 that overlaps the side surface 23A of the substrate 20 and a design third portion 73 that overlaps the side surface 23B of the substrate 20. The side surface 23A and the side surface 23B face each other in the first direction D1. The side surface 23A is also referred to as the first side surface, and the side surface 23B is also referred to as the second side surface. The first side surface 23A faces the inner surface of the film third portion 33. The design third portion 73 that overlaps the first side surface 23A is located on the film third portion 33.

[0130] 19A, the design sheet 70 may cover a portion of the first cable 61. The design sheet 70 may include a hole through which the first cable 61 is inserted.

[0131] As shown in FIG. 19B, the design sheet 70 may include a design third portion 73 that overlaps the side 23C of the substrate 20, and a design third portion 73 that overlaps the side 23D of the substrate 20. The side 23C and the side 23D face each other in the second direction D2. The side 23C is also referred to as the third side, and the side 23D is also referred to as the fourth side. The design sheet 70 may overlap all of the first side 23A, the second side 23B, the third side 23C, and the fourth side 23D of the substrate 20.

[0132] (Tenth Modification) 20 is a cross-sectional view showing an antenna 10 in a tenth modified example. In addition to a first design portion 71 and a third design portion 73, the design sheet 70 may include a second design portion 72 constituting a second surface 12. The second surface 12 is a surface of the antenna 10 located on the second side D20. That is, the second surface 12 is located on the second film portion 32.

[0133] (Eleventh Variation) 21 is a plan view showing laminate 15 in an eleventh modified example. In the eleventh modified example, first wiring 42 extends from film first portion 31 to film second portion 32.

[0134] Fig. 22 is a plan view showing the antenna 10 in the eleventh modified example. In Fig. 22, the wiring first portion 421 of the first wiring 42 is shown by a solid line, and the wiring second portion 422 of the first wiring 42 is shown by a dotted line. As shown in Fig. 22, the wiring second portion 422 may include a portion that does not overlap the wiring first portion 421 in a plan view. This can reduce the parasitic capacitance generated in the first wiring 42. Therefore, the amount of loss generated in the signal transmitted through the first wiring 42 can be reduced.

[0135] As shown in Fig. 22, in a plan view, the wiring first portion 421 may include a portion extending in a direction inclined with respect to the first direction D1. The angle θ1 represents an angle between the direction in which a portion of the wiring first portion 421 extends and the first direction D1. As shown in Fig. 22, in a plan view, the wiring second portion 422 may include a portion extending in a direction inclined with respect to the first direction D1. The angle θ2 represents an angle between the direction in which a portion of the wiring second portion 422 extends and the first direction D1. The plan view means that the antenna 10 is viewed along the normal direction of the first surface 21.

[0136] The angle θ1 is, for example, 20° or more, and may be 30° or more, or 40° or more. The angle θ1 is, for example, 70° or less, and may be 60° or less, or 50° or less.

[0137] The angle θ2 may be different from the angle θ1. That is, the wiring second portion 422 may include a portion that extends in a direction different from the direction in which the wiring first portion 421 extends. As a result, as shown in Fig. 22, the wiring second portion 422 may include a portion that does not overlap with the wiring first portion 421 in a plan view. This makes it possible to reduce the parasitic capacitance generated in the first wiring 42.

[0138] An angle inclined toward the first edge 303 of the film 30 with respect to the first direction D1 is represented by a positive value. An angle inclined toward the second edge 304 of the film 30 with respect to the first direction D1 is represented by a negative value. In the example shown in Figure 22, angle θ1 has a positive value, and angle θ2 has a negative value.

[0139] The difference between the angle θ1 and the angle θ2 is, for example, 30° or more, may be 50° or more, or may be 70° or more. The difference between the angle θ1 and the angle θ2 is, for example, 150° or less, may be 130° or less, or may be 110° or less.

[0140] The configuration of the first wiring 42 will be described in more detail. As shown in FIG. 21, the film 30 includes a first edge 303 and a second edge 304 extending along the first arrangement direction E1. The wiring first portion 421 may include a portion extending from the center of the film 30 in the second arrangement direction E2 toward the first edge 303 along a direction inclined with respect to the first arrangement direction E1. The wiring third portion 423 may include a portion extending from the first edge 303 toward the second edge 304 along a direction inclined with respect to the first arrangement direction E1. The wiring second portion 422 may include a portion extending from the second edge 304 toward the center of the film 30 in the second arrangement direction E2 along a direction inclined with respect to the first arrangement direction E1.

[0141] 22, the reference character L1 indicates the shortest distance, in plan view, between the wiring first portion 421 and the wiring third portion 423 located between the fold-back line 331 and the film second portion 32. The reference character L2 indicates the shortest distance, in plan view, between the wiring second portion 422 and the wiring third portion 423 located between the fold-back line 331 and the film first portion 31. The shorter the shortest distances L1 and L2 are, the more the parasitic capacitance generated in the first wiring 42 can be reduced.

[0142] The shortest distances L1 and L2 may be determined relative to the wavelength λ of the radio wave. The shortest distances L1 and L2 are, for example, λ×1 / 5 or more, λ×2 / 5 or more, or λ×3 / 5 or more. The shortest distances L1 and L2 are, for example, λ×2 or less, λ or less, or λ×4 / 5 or less.

[0143] (Twelfth Variation) 23 is a plan view showing laminate 15 in the twelfth modification. In the twelfth modification, first wiring 42 also extends from film first portion 31 to film second portion 32, similar to the eleventh modification.

[0144] Fig. 24 is a plan view showing the antenna 10 in the twelfth modified example. In Fig. 24, the wiring first portion 421 of the first wiring 42 is indicated by a solid line, and the wiring second portion 422 of the first wiring 42 is indicated by a dotted line. Reference character L3 represents the dimension of the wiring first portion 421 in the first direction D1. Reference character L4 represents the dimension of the wiring second portion 422 in the first direction D1.

[0145] The dimension L4 of the wiring second portion 422 is sufficiently smaller than the dimension L3 of the wiring first portion 421. This can reduce the parasitic capacitance generated in the first wiring 42. Therefore, the amount of loss generated in the signal transmitted through the first wiring 42 can be reduced.

[0146] The dimension L4 may be determined relative to the wavelength λ of the radio wave. The dimension L4 may be, for example, λ×1 / 2 or less, λ×1 / 3 or less, λ×1 / 5 or less, or λ×1 / 10 or less. The dimension L4 may be, for example, λ×1 / 50 or more, λ×1 / 30 or more, or λ×1 / 20 or more.

[0147] (13th Variation) 25 is a plan view showing laminate 15 in the 13th modification. In the 13th modification, first wiring 42 extends from film first portion 31 to film second portion 32, similar to the 11th modification.

[0148] Fig. 26 is a plan view showing an antenna 10 in a thirteenth modified example. In Fig. 26, a wiring first portion 421 of the first wiring 42 is indicated by a solid line, and a wiring second portion 422 of the first wiring 42 is indicated by a dotted line.

[0149] As in the eleventh modification, in plan view, the wiring first portion 421 may include a portion that extends in a direction inclined with respect to the first direction D1. The angle θ1 represents the angle that the extension direction of a part of the wiring first portion 421 forms with respect to the first direction D1.

[0150] The wiring second portion 422 may include a portion that extends in a direction different from the direction in which the wiring first portion 421 extends. For example, the wiring second portion 422 may extend along the first direction D1. As a result, as shown in Fig. 22, the wiring second portion 422 may include a portion that does not overlap with the wiring first portion 421 in a plan view. This allows the parasitic capacitance generated in the first wiring 42 to be reduced.

[0151] As in the twelfth modification, the dimension L4 of the wiring second portion 422 may be small. This also contributes to reducing the parasitic capacitance generated in the first wiring 42. Therefore, the amount of loss generated in the signal transmitted through the first wiring 42 can be reduced.

[0152] (14th Variation) 27 is a plan view showing laminate 15 in a fourteenth modification. In the fourteenth modification, first wiring 42 extends from film first portion 31 to film second portion 32, similar to the eleventh modification.

[0153] Fig. 28 is a plan view showing an antenna 10 in a fourteenth modified example. In Fig. 28, a wiring first portion 421 of the first wiring 42 is indicated by a solid line, and a wiring second portion 422 of the first wiring 42 is indicated by a dotted line.

[0154] The second end 426 of the first wiring 42 may be at a position different from the first end 425 in the second direction D2. This can prevent the wiring second portion 422 from overlapping with the wiring first portion 421 in a plan view. In addition, the shortest distance between the wiring first portion 421 and the wiring second portion 422 can be increased. This can reduce the parasitic capacitance generated in the first wiring 42. This can reduce the amount of loss generated in the signal transmitted through the first wiring 42.

[0155] The symbol L5 represents the distance between the first end 425 and the second end 426 in the second direction D2. The distance L5 may be determined relative to the wavelength λ of the radio wave. The distance L5 is, for example, λ×1 / 10 or more, may be λ×1 / 5 or more, or may be λ×1 / 3 or more. The distance L5 is, for example, λ×10 or less, may be λ×5 or less, or may be λ×2 or less.

[0156] (Fifteenth Variation) Fig. 29 is a perspective view showing an antenna 10 in a fifteenth modified example. The conductive layer 40 of the antenna 10 may include a plurality of patch layers. For example, as shown in Fig. 29, the conductive layer 40 may include a plurality of first patch layers 41.

[0157] A plurality of first patch layers 41 may be located on the film first portion 31. The plurality of first patch layers 41 may be electrically connected to one first wiring 42. As shown in FIG. 29 , the first wiring 42 may extend from the film first portion 31 through the film third portion 33 to the film second portion 32 toward a ground layer 43 located on the film second portion 32.

[0158] (16th Modification) Fig. 30 is a plan view showing the laminate 15 in the sixteenth modified example. Fig. 31 is a cross-sectional view showing the antenna 10 in the sixteenth modified example. Fig. 32 is a perspective view showing the antenna 10 in the sixteenth modified example. The conductive layer 40 of the antenna 10 may include a plurality of patch layers. For example, as shown in Figs. 30 to 32, the conductive layer 40 may include a second patch layer 46 in addition to a first patch layer 41. Both the first patch layer 41 and the second patch layer 46 may be located on the first portion 31 of the film.

[0159] The conductive layer 40 may include a second wiring 47 connected to the second patch layer 46. The second wiring 47 includes a first end 475 connected to the second patch layer 46 and a second end 476 proximate to the ground layer 43. The second end 476 does not have to be connected to the ground layer 43.

[0160] The second wiring 47 extends along the surface of the film 30 from the second patch layer 46 toward the ground layer 43. In the example shown in Figures 30 and 31, since the ground layer 43 is located on the film second portion 32, the second wiring 47 extends from the film first portion 31 through the film third portion 33 to the film second portion 32. That is, the second end 476 is located on the film second portion 32.

[0161] Although not shown, the ground layer 43 may extend from the second film portion 32 through the third film portion 33 to the first film portion 31. In this case, the second wiring 47 extends along the surface of the film 30 from the second patch layer 46 toward the ground layer 43 located on the first film portion 31.

[0162] The direction in which the second wiring 47 extends from the second patch layer 46 may be the same as the direction in which the first wiring 42 extends from the first patch layer 41. For example, the direction in which the first patch layer 41 and the ground layer 43 are arranged may be the same as the direction in which the second patch layer 46 and the ground layer 43 are arranged. For example, as shown in FIG. 30, the first patch layer 41 and the ground layer 43 may be arranged in the first arrangement direction E1 along the surface of the film 30, and the second patch layer 46 and the ground layer 43 may be arranged in the first arrangement direction E1 along the surface of the film 30. When the first patch layer 41 can receive or receive polarized waves in the x direction, the second patch layer 46 can also receive or receive polarized waves in the x direction. The x direction is the vibration direction of the electric field of the radio wave. The y direction, which will be described later, is also the vibration direction of the electric field of the radio wave and is perpendicular to the x direction. When the polarized waves in the x direction are vertically polarized waves, the polarized waves in the y direction are horizontally polarized waves. If the polarization in the x direction is horizontal polarization, the polarization in the y direction is vertical polarization.

[0163] The frequency of radio waves that the first patch layer 41 can transmit or receive may be different from the frequency of radio waves that the second patch layer 46 can transmit or receive. For example, the dimensions of the second patch layer 46 may be different from the dimensions of the first patch layer 41. The second patch layer 46 has a dimension L20 in the first direction D1 and a dimension W20 in the second direction D2. The ratio of L20 to L10, L20 / L10, is, for example, 1.1 or more, may be 1.3 or more, or may be 1.5 or more. The ratio of L20 / L10 is, for example, 3.0 or less, may be 2.5 or less, or may be 2.0 or less. The numerical range of W20 / W10, which is the ratio of W20 to W10, may be the same as the above-mentioned numerical range of L20 / L10.

[0164] According to the sixteenth modification, the range of radio wave frequencies that the antenna 10 can transmit or receive can be expanded.

[0165] As shown in FIGS. 30 to 32, the film first portion 31 may include one film second portion 32, two film third portions 33, and two film first portions 31. One film first portion 31 supports the first patch layer 41, and the other film first portion 31 supports the second patch layer 46. One film third portion 33A is located between the film first portion 31 supporting the first patch layer 41 and the film second portion 32. The other film third portion 33B is located between the film first portion 31 supporting the second patch layer 46 and the film second portion 32. The inner surface 302 of one film third portion 33A faces the side surface 23A of the substrate 20. The inner surface 302 of the other film third portion 33B faces the side surface 23B of the substrate 20. The side surface 23A and the side surface 23B face each other in the first direction D1. Side 23A is also referred to as a first side, and side 23B is also referred to as a second side.

[0166] 31 and 32, the first patch layer 41 and the second patch layer 46 may be aligned in the first direction D1 in a plan view. The film first portion 31 supporting the first patch layer 41 and the film first portion 31 supporting the second patch layer 46 do not need to overlap.

[0167] 31 and 32, the antenna 10 may include a second connector 62. The second connector 62 may include a signal terminal 621 connected to the second wiring 47 and a ground portion 622 connected to the ground layer 43. The second connector 62 may be located on the same surface of the film 30 as the surface on which the first connector 60 is located. For example, both the first connector 60 and the second connector 62 may be located on the film second portion 32. Although not shown, both the first connector 60 and the second connector 62 may be located on the film first portion 31.

[0168] The antenna 10 may include a second cable 63 connected to the second connector 62. The second cable 63 may include an inner conductor connected to the signal terminal 621 and a signal terminal connected to the ground portion 622. The second cable 63 may be a coaxial cable. The second cable 63 may extend at least partially along the second surface 22 of the substrate 20. Although not shown, the second cable 63 may extend at least partially along the first surface 21, or may extend along the normal direction of the second surface 22 of the substrate 20.

[0169] (17th Variation) Fig. 33 is a plan view showing the laminate 15 in the seventeenth modified example. Fig. 34 is a cross-sectional view showing the antenna 10 in the seventeenth modified example. Fig. 35 is a perspective view showing the antenna 10 in the seventeenth modified example. The conductive layer 40 of the antenna 10 may include a plurality of patch layers. For example, as shown in Figs. 33 to 35, the conductive layer 40 may include a third patch layer 51 in addition to a first patch layer 41. Both the first patch layer 41 and the third patch layer 51 may be located on the first portion 31 of the film.

[0170] The conductive layer 40 may include a third wiring 52 connected to the third patch layer 51. The third wiring 52 includes a first end 525 connected to the third patch layer 51 and a second end 526 adjacent to the ground layer 43. The second end 526 does not have to be connected to the ground layer 43.

[0171] The third wiring 52 extends from the third patch layer 51 toward the ground layer 43 along the surface of the film 30. In the example shown in Figures 33 and 34, since the ground layer 43 is located on the film second portion 32, the third wiring 52 extends from the film first portion 31 through the film third portion 33 to the film second portion 32. That is, the second end 526 is located on the film second portion 32.

[0172] The direction in which the third wiring 52 extends from the third patch layer 51 may be different from the direction in which the first wiring 42 extends from the first patch layer 41. For example, the direction in which the first patch layer 41 and the ground layer 43 are arranged may be different from the direction in which the third patch layer 51 and the ground layer 43 are arranged. For example, as shown in FIG. 33, the first patch layer 41 and the ground layer 43 may be arranged in the first arrangement direction E1 along the surface of the film 30, and the third patch layer 51 and the ground layer 43 may be arranged in the second arrangement direction E2 along the surface of the film 30. In this case, the direction in which the third wiring 52 extends from the third patch layer 51 is different from the direction in which the first wiring 42 extends from the first patch layer 41 by 90°. When the first patch layer 41 can receive or receive polarized waves in the x direction, the second patch layer 46 can receive or receive polarized waves in the y direction perpendicular to the x direction.

[0173] According to a seventeenth variant, the antenna 10 can receive or transmit both x-polarized and y-polarized waves.

[0174] As shown in FIGS. 33 to 35, the film first portion 31 may include one film second portion 32, two film third portions 33, and two film first portions 31. One film first portion 31 supports the first patch layer 41, and the other film first portion 31 supports the third patch layer 51. One film third portion 33A is located between the film first portion 31 supporting the first patch layer 41 and the film second portion 32. The other film third portion 33C is located between the film first portion 31 supporting the third patch layer 51 and the film second portion 32. One film third portion 33A faces the side surface 23A of the substrate 20. The other film third portion 33C faces the side surface 23C of the substrate 20. The side surface 23A and the side surface 23C face in different directions. For example, the normal direction of side surface 23C is perpendicular to the normal direction of side surface 23A. Side surface 23A is also referred to as a first side surface, and side surface 23C is also referred to as a third side surface.

[0175] 34 and 35, the first patch layer 41 and the third patch layer 51 may be aligned in the first direction D1 in a plan view. The film first portion 31 supporting the first patch layer 41 and the film first portion 31 supporting the third patch layer 51 do not need to overlap.

[0176] Although not shown, the antenna 10 may include a third connector. The third connector may include a signal terminal connected to the third wiring 52 and a ground portion connected to the ground layer 43. The third connector may be located on the same surface of the film 30 as the surface on which the first connector 60 is located. For example, both the first connector 60 and the third connector may be located on the film second portion 32. Although not shown, both the first connector 60 and the third connector may be located on the film first portion 31.

[0177] The antenna 10 may include a third cable 65 connected to the third connector. The third cable 65 may include an inner conductor connected to a signal terminal of the third connector and a signal terminal connected to a ground portion of the third connector. The third cable 65 may be a coaxial cable. The third cable 65 may extend at least partially along the second surface 22 of the substrate 20. Although not shown, the third cable 65 may extend at least partially along the first surface 21, or may extend along the normal direction of the second surface 22 of the substrate 20.

[0178] FIG. 36 is a plan view showing an antenna according to a second comparative embodiment. In the second comparative embodiment, in order to adjust the direction of the polarization received or transmitted by the first patch layer 41, the direction in which the first wiring 42 extends from the first patch layer 41 is different from the direction in which the first patch layer 41 and the ground layer 43 are arranged. Specifically, the first patch layer 41 and the ground layer 43 are arranged in the first arrangement direction E1, and the first wiring 42 extends from the first patch layer 41 along the second arrangement direction E2. The second arrangement direction E2 is perpendicular to the first arrangement direction E1. Therefore, as shown in FIG. 36, the path of the first wiring 42 is bent at three points while the first wiring 42 extends from the first patch layer 41 toward the ground layer 43.

[0179] In contrast, in the seventeenth modification, the direction of polarization is adjusted by making the direction in which the first patch layer 41 and the ground layer 43 are arranged different from the direction in which the third patch layer 51 and the ground layer 43 are arranged. Therefore, the first wiring 42 can extend from the first patch layer 41 toward the ground layer 43 without bending. Similarly, the third wiring 52 can extend from the third patch layer 51 toward the ground layer 43 without bending. Therefore, the amount of loss occurring in the signal traveling through the first wiring 42 and the third wiring 52 can be reduced compared to the second comparative embodiment.

[0180] (18th Variation) FIG. 37 is a plan view showing the laminate 15 in the 18th modified example. FIG. 38 is a cross-sectional view showing the antenna 10 in the 18th modified example. In the 18th modified example, the conductive layer 40 includes the first patch layer 41 and the second patch layer 46, similar to the 16th modified example. As shown in FIG. 38, the film first portion 31A supporting the first patch layer 41 and the film first portion 31B supporting the second patch layer 46 may overlap. In this case, the antenna 10 may include a third adhesive layer 38 located between the film first portion 31A supporting the first patch layer 41 and the film first portion 31B supporting the second patch layer 46. The second patch layer 46 may not overlap the first patch layer 41 in a plan view. The other configurations of the 18th modified example are the same as those of the 16th modified example, and therefore will not be described.

[0181] (19th Variation) FIG. 39 is a plan view showing the laminate 15 in the 19th modified example. FIG. 40 is a cross-sectional view showing the antenna 10 in the 19th modified example. In the 19th modified example, the conductive layer 40 includes the first patch layer 41 and the third patch layer 51, similar to the 17th modified example. As shown in FIG. 40, the film first portion 31A supporting the first patch layer 41 and the film first portion 31C supporting the third patch layer 51 may overlap. In this case, the antenna 10 may include a third adhesive layer 38 located between the film first portion 31A supporting the first patch layer 41 and the film first portion 31C supporting the third patch layer 51. The third patch layer 51 may not overlap the first patch layer 41 in a plan view. The other configurations of the 19th modified example are the same as those of the 17th modified example, and therefore will not be described.

[0182] (20th Variation) FIG. 41 is a plan view showing the laminate 15 in the twentieth modified example. FIG. 42 is a plan view showing the antenna 10 in the twentieth modified example. FIG. 43 is a cross-sectional view showing the antenna 10 in the twentieth modified example. The conductive layer 40 of the antenna 10 may include a first patch layer 41, a second patch layer 46, a third patch layer 51, and a fourth patch layer 56. The first patch layer 41, the second patch layer 46, the third patch layer 51, and the fourth patch layer 56 may all be located on the film first portion 31. The second patch layer 46 may be located on the film first portion 31 supporting the first patch layer 41. The fourth patch layer 56 may be located on the film first portion 31 supporting the third patch layer 51.

[0183] The conductive layer 40 may include a first wiring 42, a second wiring 47, a third wiring 52, and a fourth wiring 57. The fourth wiring 57 includes a first end connected to the fourth patch layer 56 and a second end proximate to the ground layer 43. The second end does not have to be connected to the ground layer 43.

[0184] The direction in which the fourth wiring 57 extends from the fourth patch layer 56 may be the same as the direction in which the third wiring 52 extends from the third patch layer 51. For example, the direction in which the third patch layer 51 and the ground layer 43 are arranged may coincide with the direction in which the fourth patch layer 56 and the ground layer 43 are arranged. For example, as shown in FIG. 41 , the third patch layer 51 and the ground layer 43 may be arranged in the second arrangement direction E2 along the surface of the film 30, and the fourth patch layer 56 and the ground layer 43 may be arranged in the second arrangement direction E2 along the surface of the film 30.

[0185] As in the sixteenth modified example, the frequency of radio waves that the first patch layer 41 can transmit or receive may be different from the frequency of radio waves that the second patch layer 46 can transmit or receive. For example, the dimensions of the second patch layer 46 may be different from the dimensions of the first patch layer 41. The direction in which the second wiring 47 extends from the second patch layer 46 may be the same as the direction in which the first wiring 42 extends from the first patch layer 41.

[0186] As in the seventeenth modified example, the direction in which the third wiring 52 extends from the third patch layer 51 may be different from the direction in which the first wiring 42 extends from the first patch layer 41. For example, the direction in which the third wiring 52 extends from the third patch layer 51 may be different from the direction in which the first wiring 42 extends from the first patch layer 41 by 90°.

[0187] The frequency of radio waves that the third patch layer 51 can transmit or receive may be different from the frequency of radio waves that the fourth patch layer 56 can transmit or receive. For example, the dimensions of the fourth patch layer 56 may be different from the dimensions of the third patch layer 51. The numerical range of the ratio of the dimensions therebetween may be the same as the above-mentioned numerical range of L20 / L10. The direction in which the fourth wiring 57 extends from the fourth patch layer 56 may be the same as the direction in which the third wiring 52 extends from the third patch layer 51.

[0188] 43 , the film first portion 31 supporting the first patch layer 41 and the second patch layer 46 and the film first portion 31 supporting the third patch layer 51 and the fourth patch layer 56 may overlap. In this case, the antenna 10 may include a third adhesive layer 38 located between the film first portion 31 supporting the first patch layer 41 and the film first portion 31 supporting the second patch layer 46.

[0189] 42, the first patch layer 41 and the third patch layer 51 may be aligned in a first direction D1 in a planar view. The second patch layer 46 and the fourth patch layer 56 may be aligned in the first direction D1 in a planar view. The first patch layer 41 and the fourth patch layer 56 may be aligned in a second direction D2 in a planar view. The second patch layer 46 and the third patch layer 51 may be aligned in the second direction D2 in a planar view.

[0190] According to the twentieth modification, it is possible to expand the range of frequencies of radio waves that can be transmitted or received by the antenna 10. Also, according to the twentieth modification, the antenna 10 can receive or transmit both polarized waves in the x direction and polarized waves in the y direction.

[0191] (21st Variation) 44 is a cross-sectional view showing the antenna 10 in the twenty-first modified example. The antenna 10 may include a second conductive layer 82 that is not electrically connected to the first patch layer 41. The second conductive layer 82 may overlap the first patch layer 41 in a plan view. The second conductive layer 82 may not be connected to a wiring. The second conductive layer 82 includes a material having electrical conductivity, similar to the conductive layer 40. The numerical range of the thickness of the second conductive layer 82 may be the same as the above-mentioned numerical range of the thickness of the conductive layer 40.

[0192] 44, the second conductive layer 82 may be located between the first patch layer 41 and the first surface 21 of the substrate 20. The second conductive layer 82 may be located on the first surface 21 of the substrate 20. For example, the second conductive layer 82 may be in contact with the first surface 21. In the manufacturing method of the antenna 10, the substrate 20 may be prepared with the second conductive layer 82 formed in advance.

[0193] The shape and arrangement of the second conductive layer 82 in a plan view are not particularly limited. The second conductive layer 82 may overlap the first patch layer 41 in a plan view. In this case, a portion of the second conductive layer 82 may overlap the first patch layer 41, or the entire second conductive layer 82 may overlap the first patch layer 41. Although not shown, the second conductive layer 82 does not have to overlap the first patch layer 41.

[0194] (22nd Variation) 45 is a cross-sectional view showing an antenna 10 in a twenty-second modified example. As in the twenty-first modified example, the antenna 10 may include a second conductive layer 82 that is not electrically connected to the first patch layer 41. The second conductive layer 82 may overlap the first patch layer 41 in a plan view.

[0195] 45, the second conductive layer 82 may be located between the first patch layer 41 and the first surface 21 of the substrate 20. The second conductive layer 82 may be located on the inner surface 302 of the film 30. For example, the second conductive layer 82 may be in contact with the inner surface 302. In the method for manufacturing the antenna 10, the film 30 may be prepared with the second conductive layer 82 formed in advance.

[0196] As in the twenty-first modified example, the shape and arrangement of the second conductive layer 82 in a plan view are not particularly limited.

[0197] (23rd Variation) 46 is a cross-sectional view showing an antenna 10 in a twenty-third modified example. As in the twenty-first modified example, the antenna 10 may include a second conductive layer 82 that is not electrically connected to the first patch layer 41. The second conductive layer 82 may overlap the first patch layer 41 in a plan view.

[0198] As shown in FIG. 46, the antenna 10 may include a second film 83 located on the first patch layer 41. The second conductive layer 82 may be located on the inner surface of the second film 83. For example, the second conductive layer 82 may be in contact with the inner surface of the second film 83. The second film 83 includes a material having insulating properties. Therefore, the second film 83 can function as an insulating layer that electrically insulates the second conductive layer 82 from the first patch layer 41. The antenna 10 may include an adhesive layer 84 located between the first patch layer 41 and the second film 83.

[0199] Although not shown, the second conductive layer 82 may be located on the outer surface of the second film 83. For example, the second conductive layer 82 may be in contact with the outer surface of the second film 83.

[0200] Second film 83 may contain a resin, similar to substrate 20. The numerical range of the thickness of second film 83 may be the same as the numerical range of the thickness of film 30 described above.

[0201] The manufacturing process of the antenna 10 includes a step of attaching the second film 83 onto the first patch layer 41. The second film 83 may be prepared with the second conductive layer 82 already formed thereon.

[0202] As in the twenty-first modified example, the shape and arrangement of the second conductive layer 82 in a plan view are not particularly limited.

[0203] (24th Variation) 47 is a cross-sectional view showing an antenna 10 in a twenty-fourth modified example. As in the twenty-first modified example, the antenna 10 may include a second conductive layer 82 that is not electrically connected to the first patch layer 41. The second conductive layer 82 may overlap the first patch layer 41 in a plan view.

[0204] 47, the antenna 10 may include a design sheet 70 including a design first portion 71 that defines the first surface 11. The second conductive layer 82 may be located on an inner surface of the design first portion 71. The second conductive layer 82 may be in contact with the inner surface of the design first portion 71. The antenna 10 may include an adhesive layer 84 located between the first patch layer 41 and the second conductive layer 82.

[0205] As in the twenty-first modified example, the shape and arrangement of the second conductive layer 82 in a plan view are not particularly limited.

[0206] (25th Variation) Fig. 48 is a perspective view showing an antenna 10 in a twenty-fifth modified example. Fig. 49 is a cross-sectional view taken along line XLIX-XLIX of the antenna 10 shown in Fig. 48. The antenna 10 may include a shielding layer 85 and a plurality of first EBG structures 86. The EBG structure is a structure for blocking electromagnetic waves. EBG stands for electromagnetic band gap.

[0207] The shield layer 85 includes a material having electrical conductivity, similar to the conductive layer 40. The numerical range of the thickness of the second conductive layer 82 may be the same as the numerical range of the thickness of the conductive layer 40 described above.

[0208] 49 , the shielding layer 85 may be located on the film first portion 31 of the film 30. For example, the shielding layer 85 may be located on the outer surface 301 of the film first portion 31. The shielding layer 85 may be in contact with the outer surface 301.

[0209] Each of the multiple first EBG structures 86 includes a material having electrical conductivity. Each of the multiple first EBG structures 86 includes a first penetration portion 861 and a first planar portion 862. The first penetration portion 861 is connected to the shield layer 85. The first penetration portion 861 penetrates from the outer surface 301 to the inner surface 302 of the film first portion 31. The first planar portion 862 is connected to the first penetration portion 861. The first planar portion 862 extends along the first surface 21 of the substrate 20. For example, the first planar portion 862 may extend along the inner surface 302 of the film first portion 31.

[0210] According to the twenty-fifth modification, it is possible to block unnecessary electromagnetic waves, thereby making it possible to prevent malfunction of the antenna 10.

[0211] (26th Variation) 50 is a cross-sectional view showing the antenna 10 in a twenty-sixth modified example. The antenna 10 may include a plurality of second EBG structures 87. The second EBG structures 87 may be located in the film second portion 32 of the film 30.

[0212] The antenna 10 may include a plurality of second EBG structures 87 that do not overlap the first patch layer 41 in a planar view. For example, the antenna 10 does not need to include the second EBG structures 87 that overlap the first patch layer 41 in a planar view.

[0213] Each of the second EBG structures 87 includes a material having electrical conductivity. Each of the second EBG structures 87 includes a second penetration portion 871 and a second planar portion 872. The second penetration portion 871 is connected to the ground layer 43. The second penetration portion 871 penetrates from the outer surface 301 to the inner surface 302 of the film second portion 32. The second planar portion 872 is connected to the second penetration portion 871. The second planar portion 872 extends along the second surface 22 of the substrate 20. For example, the second planar portion 872 may extend along the inner surface 302 of the film second portion 32.

[0214] (27th Variation) 51 is a cross-sectional view showing the antenna 10 in the twenty-seventh modified example. The antenna 10 may include a plurality of second EBG structures 87, similar to the twenty-sixth modified example.

[0215] The antenna 10 may include a plurality of second EBG structures 87 that overlap the first patch layer 41 in a planar view. For example, the antenna 10 may include a plurality of second EBG structures 87 that overlap the first patch layer 41 in a planar view, and a plurality of second EBG structures 87 that do not overlap the first patch layer 41 in a planar view.

[0216] (28th Variation) 52 is a cross-sectional view showing antenna 10 in the 28th modified example. Side surface 23 of substrate 20 may include a curved portion. This allows the shape of film third portion 33 of film 30 to easily follow the shape of side surface 23. For example, film third portion 33 is likely to have a curved shape similar to that of side surface 23. This allows the position of film third portion 33 to be easily fixed relative to side surface 23, thereby improving the reliability of film third portion 33. For example, it is possible to prevent film third portion 33 from peeling off from side surface 23 or deformation of film third portion 33.

[0217] 52, the antenna 10 may include a third adhesive layer 38 located between the side surface 23 of the substrate 20 and the third film portion 33 of the film 30. This allows the third film portion 33 to be stably fixed to the side surface 23. This makes it possible to further improve the reliability of the third film portion 33.

[0218] (29th Variation) 53 is a cross-sectional view showing antenna 10 in a twenty-ninth modified example. The first adhesive layer 36 does not have to cover the first corner portion 24 of the substrate 20. That is, the distance S1 between the end portion 361 of the first adhesive layer 36 and the first corner portion 24 may be greater than zero. The first corner portion 24 is a portion where the first surface 21 and the side surface 23 are connected.

[0219] When the first adhesive layer 36 does not cover the first corner portion 24, as shown in Fig. 53, elastic deformation of the film 30 starts at a position inside the first corner portion 24 in a plan view. This makes it easier for the inner surface 302 of the film 30 to come into contact with the first corner portion 24. The contact of the inner surface 302 with the first corner portion 24 makes it easier for the position of the third film portion 33 to be fixed relative to the side surface 23. This increases the reliability of the third film portion 33.

[0220] Similar to the first adhesive layer 36, the second adhesive layer 37 does not have to cover the second corner portion 25 of the substrate 20. That is, the distance S2 between the end portion 371 of the second adhesive layer 37 and the second corner portion 25 may be greater than zero. The second corner portion 25 is a portion where the second surface 22 and the side surface 23 are connected.

[0221] When the second adhesive layer 37 does not cover the second corner portion 25, as shown in Fig. 53, elastic deformation of the film 30 starts at a position inside the second corner portion 25 in a plan view. This makes it easier for the inner surface 302 of the film 30 to come into contact with the second corner portion 25. The inner surface 302 coming into contact with the first corner portion 24 makes it easier for the position of the third film portion 33 to be fixed relative to the side surface 23. This increases the reliability of the third film portion 33.

[0222] The distances S1 and S2 are, for example, 1 mm or more, may be 5 mm or more, or may be 20 mm or more. The distances S1 and S2 are, for example, 100 mm or less, may be 50 mm or less, or may be 30 mm or less.

[0223] (30th Variation) 54 is a cross-sectional view showing antenna 10 in a 30th modified example. Side surface 23 of substrate 20 may include a plane extending along the normal direction of first surface 21. Antenna 10 may also include a third adhesive layer 38 located between the plane of side surface 23 and third film portion 33 of film 30. This allows the shape of third film portion 33 to follow the plane of side surface 23.

[0224] (31st Variation) 55 is a cross-sectional view showing antenna 10 in a thirty-first modified example. Antenna 10 may include a cushioning material 26 located between side surface 23 of substrate 20 and film third portion 33 of film 30. Inner surface 302 of film third portion 33 may be in contact with cushioning material 26. This makes it easier to fix the position of film third portion 33 relative to side surface 23, thereby improving the reliability of film third portion 33.

[0225] As long as the cushioning material 26 can contact the side surface 23 and the inner surface 302 of the film third portion 33, the material and shape of the cushioning material 26 are not particularly limited. For example, the cushioning material 26 may have a circular cross section as shown in Fig. 55. For example, although not shown, the cushioning material 26 may be formed by filling a resin having fluidity between the inner surface 302 of the film third portion 33 and the side surface 23.

[0226] Preferably, the buffer material 26 has a low relative dielectric constant, which can reduce dielectric loss occurring in the conductive layer 40 located on the film third portion 33. The relative dielectric constant of the buffer material 26 is, for example, 5.0 or less, may be 4.0 or less, or may be 3.0 or less.

[0227] (32nd Variation) 56 is a perspective view showing the substrate 20 in the thirty-second modified example. The substrate 20 may include an opening 27 that extends from the first surface 21 to the second surface 22. The opening 27 may expand to reach the side surface 23 in a plan view.

[0228] Fig. 57 is a plan view showing antenna 10 in the thirty-second modified example. In Fig. 57, side surface 23 and opening 27 of substrate 20 that overlap film 30 in plan view are indicated by dotted lines. First connector 60 may be disposed so as to overlap opening 27 in plan view. In the example shown in Fig. 57, first connector 60 entirely overlaps opening 27.

[0229] FIG. 58 is a cross-sectional view showing the antenna 10 in the 32nd modified example. The portions of the film 30 and the conductive layer 40 that overlap the opening 27 in a plan view may be deformed so as to be inserted into the opening 27. For example, the inner surface 302 of the film first portion 31 and the inner surface 302 of the film second portion 32 may be in contact with each other at the opening 27. As a result, the first connector 60 is also at least partially inserted into the opening 27. Therefore, the dimension of the portion of the first connector 60 that protrudes from the first surface 21 or the second surface 22 of the substrate 20 in the thickness direction of the substrate 20 can be reduced. This allows the thickness of the antenna 10 to be reduced. Although not shown, the entire first connector 60 may be inserted into the opening 27.

[0230] (33rd Variation) 59 is a perspective view showing the substrate 20 in the thirty-third modified example. The substrate 20 may include an opening 27 that extends from the first surface 21 to the second surface 22. The opening 27 may extend so as not to reach the side surface 23 in a plan view.

[0231] 60 is a cross-sectional view showing an antenna 10 in a thirty-third modified example. The first wiring 42 may at least partially overlap the opening 27 in a plan view. There is no dielectric constituting the substrate 20 between the first wiring 42 overlapping the opening 27 and the ground layer 43. This makes it possible to reduce the amount of dielectric loss occurring in the first wiring 42. The first patch layer 41 may at least partially overlap the opening 27 in a plan view.

[0232] (34th Variation) 61 is a cross-sectional view showing antenna 10 in a thirty-fourth modified example. First cable 61 may be electrically connected to first wiring 42 and ground layer 43 without using first connector 60. First cable 61 includes, for example, inner conductor 611 and outer conductor 612 surrounding inner conductor 611. For example, inner conductor 611 may be connected to first wiring 42 via solder or a terminal, and outer conductor 612 may be connected to ground layer 43 via solder or a terminal. This allows the thickness of antenna 10 to be reduced. [Explanation of symbols]

[0233] 10 Antennas 11 1st surface 12 Second surface 13 Third surface 15 Laminate 20 Substrate 21 Page 1 22 Side 2 23 Side 24 1st corner 25 Second corner 26 Cushioning material 27 Aperture 30 Film 301 External surface 302 Inside 31 Film Part 1 32 Film Part 2 33 Film Part 3 36 1st adhesive layer 37 Second adhesive layer 38 Third adhesive layer 40 Conductive Layer 41 1st patch layer 42 1st wiring 421 Wiring 1st part 422 Wiring 2nd part 423 Wiring 3rd part 425 First end 426 Second end 43 Ground Layer 46 2nd patch layer 47 2nd wiring 51 3rd patch layer 52 3rd wiring 56 4th patch layer 57 4th wiring 60 1st Connector 601 Signal terminal 602 Ground Section 61 First Cable 611 Inner conductor 612 Outer conductor 62 Second Connector 63 Second Cable 64 3rd Connector 65 3rd Cable 67 4th Cable 70 Design Sheet 81 Insulating layer 82 Second conductive layer 83 2nd Film 84 Adhesive layer 85 Shielding Layer 86 First EBG structure 87 2nd EBG structure

Claims

1. a substrate including a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface; a film including a film first portion facing the first side of the substrate, a film second portion facing the second side of the substrate, and a film third portion at least partially facing the side of the substrate and positioned between the film first portion and the film second portion; a conductive layer overlying the film; The antenna, wherein the conductive layer includes a first patch layer located on the first portion of the film, a ground layer located on at least the second portion of the film, and a first wiring connected to the first patch layer and extending along the film from the first patch layer toward the ground layer.

2. The antenna according to claim 1 , further comprising a first connector including a signal terminal connected to the first wiring and a ground portion connected to the ground layer, the first connector being connected to a first cable.

3. the ground layer extends from the second film portion to the first film portion; the first wiring extends along the film from the first patch layer toward the ground layer located on the first portion of the film; The antenna of claim 2 , wherein the first connector is located on the ground layer located on the first portion of the film.

4. The antenna of claim 3 , wherein the first cable extending along the first surface of the substrate is connected to the first connector.

5. the ground layer extends from the second film portion to the third film portion; the first wiring extends along the film from the first patch layer toward the ground layer located on the third portion of the film; The antenna of claim 2 , wherein the first connector is located on the ground layer located on the third portion of the film.

6. The antenna of claim 5 , wherein the first cable extending along the first surface of the substrate is connected to the first connector.

7. The antenna according to claim 5 , wherein the first cable extending along a normal direction of the second surface of the substrate is connected to the first connector.

8. the first wiring extends along the film from the first patch layer toward the ground layer located on the second portion of the film; the first wiring includes a wiring first portion located on the film first portion, a wiring second portion located on the film second portion, and a wiring third portion located between the wiring first portion and the wiring second portion; The antenna of claim 2 , wherein the first connector is located on the ground layer located on the second portion of the film.

9. The antenna according to claim 8 , wherein the second wiring portion includes a portion extending in a direction different from a direction in which the first wiring portion extends.

10. The antenna has a first direction and a second direction that is orthogonal to the first direction, the first direction is a direction in which the first wiring extends from the first patch layer, The antenna according to claim 8 , wherein the second wiring portion has a dimension in the first direction that is equal to or smaller than half the wavelength of the radio wave emitted by the antenna.

11. The antenna has a first direction and a second direction that is orthogonal to the first direction, the first direction is a direction in which the first wiring extends from the first patch layer, the first wiring includes a first end portion located on the first film portion and a second end portion located on the second film portion and at a position different from the first end portion in the second direction; the first end of the first wiring is an end of the first portion of the wiring that is connected to the first patch layer, The antenna according to claim 8 , wherein the second end of the first wiring is an end of the second wiring portion that faces the ground layer along a surface direction of the film.

12. The antenna of claim 8 , wherein the first cable extending along the second surface of the substrate is connected to the first connector.

13. The antenna according to claim 8 , wherein the first cable extending along a normal direction of the second surface of the substrate is connected to the first connector.

14. the antenna includes a first surface, a second surface, and a third surface; the first surface is located on the first portion of the film; the second surface is located on the second portion of the film; the third surface overlaps the side surface when viewed along a normal direction of the substrate; The antenna according to any one of claims 1 to 13, comprising a design sheet or a protective sheet including at least a first design portion constituting the first surface.

15. The antenna of claim 14, wherein the design sheet includes a design third portion constituting the third surface, or the protective sheet includes a protective third portion constituting the third surface.

16. An antenna as described in any one of claims 1 to 13, comprising a second conductive layer located between the first patch layer and the first surface of the substrate, the second conductive layer not electrically connected to the first patch layer and the ground layer.

17. 14. The antenna of claim 1, further comprising: an insulating layer located on the first patch layer; and a second conductive layer located on the insulating layer and not electrically connected to the first patch layer and the ground layer.

18. The antenna of claim 14, comprising: an insulating layer located on the first patch layer; and a second conductive layer located between the insulating layer and the design sheet or between the insulating layer and the protective sheet, the second conductive layer not electrically connected to the first patch layer and the ground layer.

19. a shielding layer positioned on the first portion of the film; a plurality of first EBG structures connected to the shield layer and having electrical conductivity; The antenna according to any one of claims 1 to 13, wherein each of the first EBG structures includes a first penetration portion connected to the shielding layer and penetrating the first portion of the film, and a first planar portion connected to the first penetration portion and extending along the first surface of the substrate.

20. a plurality of second EBG structures connected to the ground layer and having electrical conductivity; The antenna according to any one of claims 1 to 13, wherein each of the second EBG structures includes a second penetration portion connected to the ground layer and penetrating the second portion of the film, and a second planar portion connected to the second penetration portion and extending along the second surface of the substrate.

21. the conductive layer includes a second patch layer located on the first portion of the film, and a second trace connected to the second patch layer and extending along the film from the second patch layer toward the ground layer; The antenna according to any one of claims 1 to 13, wherein the direction in which the second wiring extends from the second patch layer is the same as the direction in which the first wiring extends from the first patch layer.

22. The antenna according to claim 21 , further comprising a second connector including a signal terminal connected to the second wiring and a ground portion connected to the ground layer, the second connector being connected to a second cable.

23. the conductive layer includes a third patch layer located on the first portion of the film, and a third wiring connected to the third patch layer and extending along the film from the third patch layer toward the ground layer; The antenna according to any one of claims 1 to 13, wherein a direction in which the third wiring extends from the third patch layer is different from a direction in which the first wiring extends from the first patch layer.

24. 24. The antenna according to claim 23, further comprising a third connector including a signal terminal connected to the third wiring and a ground portion connected to the ground layer, and to which a third cable is connected.

25. a first adhesive layer positioned between the first surface of the substrate and the first film portion of the film; The antenna of any one of claims 1 to 13, further comprising: a second adhesive layer located between the second surface of the substrate and the second film portion of the film.

26. 26. The antenna of claim 25, comprising a third adhesive layer located between the side of the substrate and the film third portion of the film.

27. The antenna of claim 26 , wherein the side of the substrate includes a curved portion.

28. the substrate includes a first corner portion where the first surface and the side surface are connected, and a second corner portion where the second surface and the side surface are connected, The first adhesive layer does not cover the first corner portion, The second adhesive layer does not cover the second corner portion, 26. The antenna of claim 25, wherein the first corner and the second corner are in contact with the film.

29. The antenna according to any one of claims 1 to 13, further comprising a cushioning material located between the side of the substrate and the third film portion of the film.

30. The antenna according to any one of claims 1 to 13, wherein the substrate includes an opening extending from the first surface to the second surface.

31. The antenna according to claim 30 , wherein the first wiring at least partially overlaps the opening in a plan view.

32. the substrate includes an opening extending from the first surface to the second surface; The antenna according to any one of claims 2 to 13, wherein the first connector overlaps with the opening in a plan view.

33. The antenna according to any one of claims 1 to 13, wherein the film is bent at the film third portion so that the film first portion and the film second portion face each other in the thickness direction of the substrate.

34. The antenna of claim 1 , comprising a first cable including an inner conductor connected to the first wiring and an outer conductor connected to the ground layer.

35. providing a substrate including a first surface, a second surface opposite the first surface, and a side surface between the first surface and the second surface; and attaching the laminate to the substrate. the laminate attached to the substrate includes a film including a film first portion facing the first side of the substrate, a film second portion facing the second side of the substrate, and a film third portion at least partially facing the side of the substrate and located between the film first portion and the film second portion; and a conductive layer located on the film; A method for manufacturing an antenna, wherein the conductive layer includes a first patch layer located on the first portion of the film, a ground layer located on at least the second portion of the film, and a first wiring connected to the first patch layer and extending along the film from the first patch layer toward the ground layer.

Images