Substrate transfer robot system and substrate detection method

Abstract

To provide a substrate transfer robot system capable of detecting a state of a substrate more accurately, and a substrate detection method.SOLUTION: A substrate transfer robot system 100 comprises: a robot 20 that transfers a substrate 101; an irradiation unit 50 that irradiates a main surface 101a of the substrate 101 held by the robot 20 with detection light L1 having a predetermined shape; an imaging unit 40 that images the detection light L1 reflected at the main surface 101a of the substrate 101 by imaging the substrate 101; and a control unit 60 that detects a state of the substrate 101 based on an imaged image of the detection light L1 imaged by the imaging unit 40.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present disclosure relates to a substrate transport robot system and a substrate detection method. [Background technology]

[0002] Conventionally, a measuring device for measuring deformation of a semiconductor wafer has been disclosed. The measuring device disclosed in Patent Document 1 measures deformation of a semiconductor wafer by analyzing an image of a geometric illumination pattern reflected on the semiconductor wafer. The measuring device described in Patent Document 1 images a semiconductor wafer placed on a turntable in a vacuum chamber and undergoing processing. Since processing in the vacuum chamber is performed while rotating the turntable, a reflected image of the entire semiconductor wafer is captured even when the semiconductor wafer is large in size. In addition, Patent Document 1 describes an example in which a reflected image of the entire semiconductor wafer is captured by linearly moving the semiconductor wafer by a translation means outside the vacuum chamber. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 7169994 Summary of the Invention [Problem to be solved by the invention]

[0004] However, as in the above Patent Document 1, when imaging a substrate placed on a turntable in a vacuum chamber to detect the state of the substrate, such as the deformation of a semiconductor wafer, it is difficult to adjust the position of the substrate to be imaged, since the turntable only moves in the rotational direction. Also, when imaging a reflected image of the entire substrate by linearly moving the substrate by a translation means arranged outside the vacuum chamber, it is difficult to adjust the position of the substrate to be imaged, since the substrate is only moved linearly. When it is difficult to adjust the position of the substrate to be imaged, it is difficult to detect the state of the substrate with higher accuracy. For this reason, when detecting the state of the substrate by imaging the substrate, it is desired to detect the state of the substrate with higher accuracy by adjusting the position of the substrate.

[0005] This disclosure has been made to solve the problems described above, and one object of this disclosure is to provide a substrate transport robot system and a substrate detection method that are capable of detecting the state of a substrate with greater accuracy. [Means for solving the problem]

[0006] A substrate transport robot system according to a first aspect of this disclosure includes a robot that transports a substrate, an irradiation unit that irradiates detection light having a predetermined shape onto a main surface of a substrate held by the robot, an imaging unit that images the substrate and thereby captures the detection light reflected from the main surface of the substrate, and a control unit that detects a state of the substrate based on an image of the detection light captured by the imaging unit.

[0007] As described above, the substrate transport robot system according to the first aspect of the disclosure irradiates a detection light having a predetermined shape onto a main surface of a substrate held by the robot. Then, the state of the substrate is detected based on an image of the detection light captured by an imaging unit. As a result, since the substrate to be imaged is held by the robot transporting the substrate, the position of the substrate can be easily adjusted by the operation of the robot. Therefore, the substrate can be easily positioned at an appropriate position for detecting the state of the substrate by the operation of the robot, so that the state of the substrate can be detected with greater accuracy.

[0008] A substrate detection method according to a second aspect of this disclosure images a substrate held by a robot that transports the substrate, captures detection light having a predetermined shape reflected on a main surface of the substrate, and detects the state of the substrate based on the captured image of the detection light.

[0009] As described above, the substrate inspection system according to the second aspect of the disclosure images the substrate held by the robot, and detects the state of the substrate based on the captured image of the detection light. As a result, since the substrate to be imaged is held by the robot that transports the substrate, the position of the substrate can be easily adjusted by the operation of the robot. Therefore, since the substrate can be easily positioned at an appropriate position for detecting the state of the substrate by the operation of the robot, a substrate detection method capable of detecting the state of the substrate with higher accuracy can be provided. Effect of the Invention

[0010] According to the present disclosure, the state of the substrate can be detected with higher accuracy. [Brief description of the drawings]

[0011] [Figure 1] 1 is a top view showing a substrate processing system in which a substrate transport robot system according to a first embodiment of the present disclosure is disposed. [Diagram 2] FIG. 2 is a perspective view for explaining a configuration of a substrate. [Diagram 3]1 is a block diagram showing a configuration of a substrate transport robot system according to a first embodiment of the present disclosure. [Figure 4] FIG. 1 is a perspective view showing a schematic configuration of a substrate transport robot system. [Diagram 5] 4A and 4B are diagrams illustrating an example of an image of detection light captured by an imaging section. [Figure 6] 11A to 11C are diagrams showing examples of captured images obtained by moving a substrate along a plurality of moving directions. [Figure 7] FIG. 1 is a diagram for explaining learning of a trained model. [Figure 8] FIG. 4 is a flow chart for explaining a substrate detection method according to the first embodiment. [Figure 9] FIG. 11 is a perspective view showing a schematic configuration of a substrate transport robot system according to a second embodiment of the present disclosure. [Figure 10] FIG. 11 is a perspective view showing a schematic configuration of a substrate transport robot system according to a third embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] [First embodiment] Hereinafter, a first embodiment of the present disclosure will be described with reference to the drawings.

[0013] A substrate transport robot system 100 according to a first embodiment will be described with reference to FIGS.

[0014] (Substrate Processing System) As shown in FIG. 1, the substrate transport robot system 100 is disposed in a substrate processing system 400. The substrate processing system 400 includes a processing device 401 that processes the substrate 101. The processing device 401 includes a robot 402, a load lock unit 403, a plurality of processing module units 404, and a transfer chamber 405. The robot 402 is a horizontal articulated robot that transfers the substrate 101. The load lock unit 403 is a room for taking in and taking out the substrate 101. That is, the substrate 101 is placed in the load lock unit 403 to transfer the substrate 101 to the processing device 401. The processing device 401 of the substrate processing system 400 includes two load lock units 403. The load lock unit 403 is connected to the substrate transport robot system 100. In the processing module unit 404, the substrate 101 is subjected to processing such as resist coating and etching. The robot 402 is disposed in the transfer chamber 405. In the transfer chamber 405 , the robot 402 transfers the substrate 101 between a load lock section 403 and a processing module section 404 .

[0015] The substrate transfer robot system 100 transfers the substrate 101 between a FOUP 110 (Front Opening Unify Pod) and a processing device 401 in a substrate processing system 400 in which processing is performed on the substrate 101. The substrate transfer robot system 100 is an EFEM (Equipment Front End Module). The FOUP 110 is a container in which a plurality of substrates 101 are stored. In the FOUP 110, the plurality of substrates 101 are arranged vertically side by side. The FOUP 110 is an example of a substrate storage container.

[0016] 2, the substrate 101 is, for example, a silicon wafer having a disk shape. The substrate 101 has a mirror-like main surface 101a. The substrate 101 also has a notch 101b indicating the orientation of the substrate 101. The notch 101b is a V-shaped groove disposed on the outer periphery of the substrate 101 to indicate the direction of the crystal orientation in the substrate 101.

[0017] (Substrate transport robot system) 3, the substrate transfer robot system 100 includes a transfer chamber 10, a robot 20, an aligner 30, an imaging unit 40, an irradiation unit 50, and a control unit 60. The robot 20 includes a horizontal articulated robot arm 21 and a substrate holding hand 22. The aligner 30 is an example of an adjustment device.

[0018] As shown in FIG. 4, the transfer chamber 10 is a housing having a rectangular parallelepiped shape. The transfer chamber 10 has a front surface 11 on the Y1 direction side and a back surface 12 on the Y2 direction side. The transfer chamber 10 also has a top surface 13 on the vertically upward side, which is the Z1 direction side. In the transfer chamber 10, the substrate 101 is transferred. The transfer chamber 10 accommodates a robot 20, an aligner 30, an imaging unit 40, an irradiation unit 50, and a control unit 60. On the front surface 11 on the Y1 direction side of the transfer chamber 10, three load port units 11a to which the FOUP 110 is attached are arranged side by side in the horizontal direction. The load port unit 11a has an opening / closing mechanism. The load port unit 11a opens and closes the door unit of the attached FOUP 110. In addition, two load lock units 403 are connected to the back surface 12 on the Y2 direction side of the transfer chamber 10. An opening / closing mechanism is also arranged between the load lock unit 403 and the back surface 12. FIG. 4 shows a state in which a FOUP 110 is attached to one of the three load port sections 11a on the X1 direction side.

[0019] The robot 20 is disposed in the transfer chamber 10 in which the substrate 101 is transferred between the FOUP 110 and the load lock unit 403. The robot 20 performs a transfer operation of the substrate 101 in the transfer chamber 10. Specifically, in the robot 20, a substrate holding hand 22, which is an end effector that holds the substrate 101, is disposed at the tip of a robot arm 21. The robot 20 performs a transfer operation of the substrate 101 between the FOUP 110 attached to the load port unit 11a and the load lock unit 403. The robot 20 transfers the substrate 101 in a state in which the substrate holding hand 22 holds the substrate 101 along a horizontal plane. The substrate holding hand 22 is a passive type hand that holds the substrate 101 without fixing it.

[0020] The aligner 30 aligns the substrate 101 transported by the robot 20. The aligner 30 adjusts the orientation of the substrate 101 to a predetermined direction. The aligner 30 is disposed in the transport chamber 10, close to the X2 direction, which is one side of the X direction, which is the left-right direction. The aligner 30 has a substrate placement part 30a on which the substrate 101 is placed. The aligner 30 detects a notch 101b of the substrate 101 from the outer periphery of the substrate 101 by rotating the substrate 101 placed on the substrate placement part 30a along a horizontal plane. Then, based on the position of the notch 101b detected from the outer periphery, the aligner 30 rotates the substrate 101 along a horizontal plane to align the rotational position along the circumferential direction of the main surface 101a of the substrate 101, thereby adjusting the orientation of the substrate 101 to a predetermined direction. The aligner 30 also detects the center position of the substrate 101.

[0021] In the substrate transfer robot system 100, the unprocessed substrate 101 held by the robot 20 is transferred from the FOUP 110 to the aligner 30. Then, the substrate 101 aligned by the aligner 30 is transferred again by the robot 20 to the load lock unit 403. In addition, the substrate 101 after being processed in the processing device 401 is transferred by the robot 20 from the load lock unit 403 to the FOUP 110. The transfer operation of the substrate 101 by the robot 20 includes both an unloading operation of taking out the substrate 101 and an loading operation of placing the substrate 101 with respect to each of the FOUP 110 and the load lock unit 403.

[0022] The imaging unit 40 is, for example, a two-dimensional camera. The imaging unit 40 has, for example, an imaging element such as a CCD (Charge Coupled Device) and a CMOS (Complementary Metal Oxide Semiconductor). The imaging unit 40 is disposed at a position facing the substrate 101 held by the robot 20. The imaging unit 40 captures an image of the substrate 101 held by the robot 20. In the first embodiment, the imaging unit 40 is disposed above the robot 20 in the transfer chamber 10. The imaging unit 40 is disposed, for example, on the top surface 13 of the transfer chamber 10 in the transfer chamber 10. The imaging unit 40 is disposed at a position where it captures an image of the substrate 101 taken out of the FOUP 110. Three imaging units 40 are disposed so as to correspond to the three load port units 11a to which the FOUP 110 is attached.

[0023] The irradiation unit 50 irradiates the detection light L1 onto the main surface 101a of the substrate 101, which is changed in at least one of the position and the angle relative to the substrate 101. In the first embodiment, the irradiation unit 50 irradiates the detection light L1 having a predetermined shape onto the main surface 101a of the substrate 101, which is held by the robot 20 and moves relatively along a predetermined moving direction. The irradiation unit 50 irradiates the detection light L1 in a line shape along a direction intersecting the moving direction in changing the relative position of the substrate 101 with respect to the irradiation unit 50. The irradiation unit 50 includes, for example, an LED (Light-Emitting Diode) that irradiates a red line-shaped light as the detection light L1. Note that the "line-shaped" light here means that when the detection light L1 is irradiated onto a plane such as the main surface 101a of the substrate 101, the detection light L1 extends in a line shape on the irradiated plane. The irradiation unit 50 also irradiates the detection light L1 onto the substrate 101 at the timing when the imaging unit 40 performs imaging. The irradiation unit 50 is disposed above the robot 20 in the transfer chamber 10. The irradiation unit 50 is disposed, for example, on the ceiling surface 13 of the transfer chamber 10. Similar to the imaging unit 40, three irradiation units 50 are disposed to correspond to the three load port units 11a to which the FOUPs 110 are attached.

[0024] As shown in FIG. 1, the control unit 60 includes a machine learning unit 61. The control unit 60 controls the operation of each unit of the substrate transport robot system 100. In the first embodiment, the control unit 60 also serves as a robot control unit that controls the operation of the robot 20. That is, the control unit 60 is a robot controller. The control unit 60 also controls the operation of the aligner 30. The control unit 60 also controls the operation of the imaging unit 40 and the irradiation unit 50. The control unit 60 includes, for example, a calculation device such as a CPU (Central Processing Unit). The control unit 60 also includes memories such as a RAM (Random Access Memory) and a ROM (Read Only Memory), and a storage device such as a hard disk. The control unit 60 executes control processing by the calculation device based on programs and parameters stored in the storage device.

[0025] (Generation of captured images) As shown in FIG. 5, an image 71 is acquired by imaging by the imaging unit 40. The image 71 captured by the imaging unit 40 is transmitted to the control unit 60. The imaging unit 40 captures the detection light L1 reflected on the main surface 101a of the substrate 101 by capturing an image of the substrate 101. When the imaging unit 40 captures the detection light L1, the robot 20 changes the position of the substrate 101 relative to the irradiation unit 50. Specifically, when the imaging unit 40 captures the detection light L1, the robot 20 moves the substrate 101 along a predetermined movement direction, thereby moving the substrate 101 relative to the irradiation unit 50. The irradiation unit 50 irradiates the detection light L1 onto the main surface 101a of the substrate 101, which is moving relatively due to the operation of the robot 20. The imaging section 40 captures the detection light L1 reflected from the main surface 101a of the substrate 101 multiple times in accordance with the relative movement of the substrate 101 by the robot 20, which is a change in the position of the substrate 101 relative to the irradiation section 50. The control section 60 generates a captured image 71 by capturing the multiple reflected detection light L1 through multiple imaging by the imaging section 40. In detail, the control section 60 generates one captured image 71 based on the multiple captured images 70 acquired through multiple imaging by the imaging section 40, such that the detection light L1 reflected over the entire substrate 101 is synthesized.

[0026] For example, the robot 20 moves the substrate 101, which has not yet been processed by the processing device 401, along the Y2 direction as indicated by the dotted arrow in FIG. 5 after being removed from the FOUP 110. The irradiation unit 50 continuously irradiates the main surface 101a of the substrate 101 moved by the robot 20 with linear detection light L1 extending along the X direction perpendicular to the Y2 direction, which is the moving direction, multiple times at the timing of removal from the FOUP 110. The imaging unit 40 continuously captures the detection light L1 reflected by the main surface 101a of the substrate 101 multiple times as the robot 20 moves the substrate 101 in the Y2 direction. The control unit 60 generates one captured image 71 by combining captured images 70 continuously captured by the imaging unit 40 during the movement in the Y2 direction, which is one moving direction. For example, in order to generate one captured image 71, the control unit 60 moves the substrate 101 by the robot 20 at a constant speed, and synthesizes the captured images 70 captured continuously multiple times by the imaging unit 40 at constant time intervals. The synthesis of the captured images 70 is performed by superimposing the multiple captured images 70 in a state where they are shifted from each other in the Y direction so as to correspond to the movement of the substrate 101. That is, the single captured image 71 is generated so as to be an image in which multiple detection lights L1 are reflected over the entire main surface 101a of the substrate 101 along the movement direction of the substrate 101. The inside of the transfer chamber 10 is in a relatively dark state because no light source other than the irradiation unit 50 is disposed. Therefore, each of the multiple captured images 70 is captured so as to be an image in which only the detection light L1 reflected on the main surface 101a of the substrate 101 is extracted. In other words, the captured image 71 is an image in which the detection light L1 reflected in accordance with the shape of the substrate 101 is extracted and captured.

[0027] As shown in FIG. 6, the control unit 60 generates a captured image 72 by capturing an image of the substrate 101 by the imaging unit 40 while moving the substrate 101 along a moving direction different from that in which one captured image 71 is generated. That is, in the first embodiment, the robot 20 moves the substrate 101 along a plurality of moving directions different from each other when the imaging unit 40 captures the detection light L1. Then, the control unit 60 generates a captured image 71 and a captured image 72 in which the detection light L1 is captured by the imaging unit 40 during each of the movements of the substrate 101 along the plurality of moving directions of the robot 20. For example, the control unit 60 generates two captured images 71 and 72 by moving the substrate 101 along two moving directions, the Y2 direction being the first moving direction of the substrate 101 for generating the captured image 71, and the second moving direction being a direction different from the Y2 direction for generating the captured image 72. Note that the captured image 72 is generated by combining a plurality of captured images 70 captured continuously, similar to the captured image 71.

[0028] (Control process for detecting the state of the board) As shown in FIG. 7, in the first embodiment, the control unit 60 detects the state of the substrate 101 based on the captured images 71 and 72 of the detection light L1 captured by the imaging unit 40 in the transfer chamber 10 by using the trained model 62 generated by machine learning. The control unit 60 detects the state of the substrate 101 including the position and the orientation of the substrate 101 based on the captured images 71 and 72. The state of the substrate 101 detected by the control unit 60 includes abnormalities of the substrate 101 such as warping, deformation, chipping, cracking, and scratches. The trained model 62 is generated by machine learning so as to output an identification result 75 that identifies the state of the substrate 101 based on the reflected images of the detection light L1 in the captured images 71 and 72. The trained model 62 is generated in advance by the machine learning unit 61 of the control unit 60 and is stored in a storage device of the control unit 60.

[0029] <Generating trained models> The control unit 60 generates a trained model 62 by machine learning in the machine learning unit 61 based on the teacher image 80, which is input learning data. The trained model 62 is generated by machine learning using a data set in which the teacher image 80 is input and the output teacher data 85 is output. For example, the trained model 62 is trained to input each of the captured image 71 and the captured image 72 and output the coordinates representing the position of the substrate 101 and the orientation of the substrate 101 indicated by the position of the notch 101b as the identification result 75. In addition, when an abnormality such as warping occurs in the substrate 101, the shape of the detection light L1 in each of the captured image 71 and the captured image 72 is different from that in a normal case. In the first embodiment, the trained model 62 is generated by machine learning so that an abnormality in the substrate 101 is identified by the reflected image of the detection light L1 in the captured image 71 and the captured image 72. The trained model 62 is trained to receive the captured image 71 and the captured image 72 as input, and to output an identification result 75 including a likelihood indicating the probability that the substrate 101 contains an abnormality.

[0030] The teacher image 80 includes captured images 71 and 72 obtained by capturing the detection light L1 reflected from each of the main surfaces 101a of a plurality of types of substrates 101 having different states of the substrates 101, such as the position and orientation, or the presence or absence of an abnormality. That is, captured images 71 and 72 captured in a state in which a plurality of types of substrates 101, including a substrate 101 that is known to be normal and has no abnormality, and a substrate 101 that is known to have an abnormality, are arranged in a plurality of positions and orientations, are acquired as a plurality of types of teacher images 80. Also, output teacher data 85 indicating the state of the substrate 101 in each of the plurality of types of teacher images 80 is acquired, and each of the plurality of types of teacher images 80 and the corresponding output teacher data 85 are stored in the storage device of the control unit 60 in an associated state. The output teacher data 85 includes information indicating the position of the substrate 101, information indicating the orientation of the substrate 101, and information indicating whether an abnormality occurs in the substrate 101, as information indicating the state of the substrate 101.

[0031] Then, the machine learning unit 61 performs machine learning to generate the trained model 62 using the multiple teacher images 80 as input teacher data and the multiple output teacher data 85 associated with the multiple teacher images 80 as output teacher data. The machine learning unit 61 generates the trained model 62 by machine learning using deep learning. The machine learning unit 61 generates the trained model 62 by machine learning based on a Fully Convolution Network (FCN), for example.

[0032] The control unit 60 uses the trained model 62 generated by machine learning as described above to obtain the identification result 75 from each of the captured image 71 and the captured image 72. The control unit 60 detects the state of the substrate 101, for example, by calculating the average of the identification result 75 obtained based on the captured image 71 and the identification result 75 obtained based on the captured image 72.

[0033] <Correction of position deviation> In the first embodiment, the control unit 60 detects the positional deviation of the substrate 101 relative to the substrate holding hand 22 based on the detected state of the substrate 101. For example, the detection light L1 in each of the captured images 71 and 72 is captured at a timing when the substrate holding hand 22 is at a predetermined position based on the control amount of the robot 20. Therefore, by detecting information indicating the position of the substrate 101 as the state of the substrate 101 based on each of the captured images 71 and 72, the magnitude and direction of the positional deviation of the position where the substrate 101 is held relative to the position of the substrate holding hand 22 of the robot 20 is detected. The control unit 60 acquires the average of the magnitude and direction of the positional deviation detected based on the captured image 71 and the magnitude and direction of the positional deviation detected based on the captured image 72 as the detected magnitude and direction of the positional deviation, and corrects the transport operation of the robot 20 so as to correct the positional deviation of the substrate 101 based on the acquired magnitude and direction of the positional deviation.

[0034] As an example, the captured images 71 and 72 are obtained by capturing an image of the substrate 101 taken out of the FOUP 110, and when it is detected based on the captured images 71 and 72 that the substrate 101 is shifted from the substrate holding hand 22 by +2 cm in the X direction and -1 cm in the Y direction, the control unit 60 corrects the transport operation of the substrate 101 so that the substrate 101 is placed at a position shifted by -2 cm in the X direction and +1 cm in the Y direction from the taught position set as the position of the substrate placement unit 30a of the aligner 30. Specifically, the control unit 60 corrects the transport operation of the robot 20 by correcting a drive signal output to a drive unit such as a servo motor serving as a drive source for driving the robot arm 21 and the substrate holding hand 22.

[0035] <Aligner Support> In the first embodiment, the control unit 60 controls the operation of the aligner 30 using the state of the substrate 101 detected based on the captured image 71 and the captured image 72. Specifically, the control unit 60 detects the orientation of the substrate 101 held by the substrate holding hand 22 based on the detected state of the substrate 101. The control unit 60 detects the notch 101b in the substrate 101 based on the identification result 75 from the trained model 62 acquired as the state of the substrate 101 detected based on each of the captured images 71 and 72. For example, the control unit 60 acquires the average position of the position of the notch 101b detected based on the captured image 71 and the position of the notch 101b detected based on the captured image 72 as the position of the detected notch 101b. Then, the control unit 60 performs an operation of adjusting the orientation of the substrate 101 by the aligner 30. Based on the position of the notch 101b of the substrate 101 detected using the captured images 71 and 72, the control unit 60 rotates the substrate 101 along a horizontal plane so that the detection target range is not the entire circumference of the outer peripheral edge of the substrate 101 but a part of the outer peripheral edge of the substrate 101 including the position of the detected notch 101b. That is, the control unit 60 roughly detects the orientation of the substrate 101 by detecting the state of the substrate 101 based on the captured images 71 and 72, and then detects the orientation of the substrate 101 in detail using the aligner 30. In other words, the control unit 60 detects the state of the substrate 101 in advance based on the captured images 71 and 72 so as to assist the operation of the aligner 30.

[0036] <Detection of abnormalities in the circuit board> In the first embodiment, the control unit 60 detects an abnormality in the substrate 101 taken out of the FOUP 110 based on the captured images 71 and 72 of the detection light L1 captured at the timing when the substrate 101 is taken out of the FOUP 110 during the transport operation of the robot 20. The control unit 60 determines that an abnormality is detected in the substrate 101 when a likelihood indicating the probability of whether or not an abnormality is included in the substrate 101 included in the identification result 75 output as an inference result by the trained model 62 is greater than a predetermined threshold. For example, when the likelihood included in the identification result 75 is a value between 0 and 1, the detection of an abnormality in the substrate 101 is determined using 0.8 as a predetermined threshold. For example, the control unit 60 determines the detection of an abnormality in the substrate 101 based on an average value of the likelihood included in the identification result 75 acquired based on the captured image 71 and the likelihood included in the identification result 75 acquired based on the captured image 72.

[0037] When an abnormality in the substrate 101 is detected, the control unit 60 outputs abnormality detection information indicating that an abnormality in the substrate 101 has been detected to the outside. For example, the control unit 60 outputs the abnormality detection information to a higher-level control device that controls the entire substrate processing system 400. As an example, when an abnormality in the substrate 101 is detected, the control unit 60 causes the robot 20 to store the substrate 101 in which the abnormality has been detected back into the FOUP 110 based on a signal from the higher-level control device. When the control unit 60 does not receive a signal from the higher-level control device instructing to store the substrate 101 back into the FOUP 110, the control unit 60 stops the transport operation of the substrate 101 and waits for processing. It is to be noted that an abnormality in the substrate 101 has been detected by displaying information indicating that the abnormality detection information has been obtained on a display device. For example, when the substrates 101 stored in the FOUP 110 are sequentially transported to the processing device 401 to be processed in the processing device 401, the control unit 60 controls the transport operation of the robot 20 to transport the substrates 101 one by one to the load lock unit 403 via the aligner 30. The control unit 60 acquires the captured images 71 and 72 during the transport of each of the substrates 101, and detects an abnormality in the substrates 101 based on the captured images 71 and 72 using a trained model 62 that has been generated and stored in advance. When an abnormality is detected in one of the substrates 101, the control unit 60 outputs abnormality detection information and, based on a signal from a higher-level control device, stores the substrate 101 again so that the substrate 101 in which the abnormality was detected is returned to its original position in the FOUP 110. Then, the control unit 60 transports the next substrate 101 after the substrate 101 for which an abnormality was detected to the load lock unit 403 while similarly checking for an abnormality.

[0038] (Substrate detection method) Next, a control process of the substrate detection method by the substrate transport robot system 100 of the first embodiment will be described with reference to Fig. 8. The control process of the substrate detection method of the first embodiment is executed by the control unit 60 of the substrate transport robot system 100.

[0039] First, in step S1, a trained model 62 is generated. Specifically, a teacher image 80 and output teacher data 85 are acquired. Then, using the teacher image 80 and the output teacher data 85 as a data set, the trained model 62 is generated by machine learning so that the state of the substrate 101 is detected based on the captured images 71 and 72. The generated trained model 62 is stored in the storage device of the control unit 60.

[0040] Next, in step S2, the transport operation of the substrate 101 is started. Specifically, the operation of the robot 20 is controlled so that the substrate 101 placed in the FOUP 110 is held by the substrate holding hand 22 of the robot 20.

[0041] Next, in step S3, the substrate 101 is removed from the FOUP 110. With the substrate 101 held by the substrate holding hand 22, one substrate 101 before processing is transferred from the FOUP 110 into the transfer chamber .

[0042] Next, in step S4, the imaging unit 40 images the substrate 101, which is held by the robot 20 and moves relatively along a predetermined movement direction, to obtain captured images 71 and 72 of the detection light L1 reflected on the main surface 101a of the substrate 101. Specifically, the irradiation unit 50 irradiates the main surface 101a of the substrate 101 with the detection light L1, and the imaging unit 40 images the detection light L1 reflected on the main surface 101a, to obtain each of the captured images 71 and 72 of the detection light L1.

[0043] Next, in step S5, by using the trained model 62 generated by machine learning, the state of the substrate 101 is detected based on each of the captured images 71 and 72 of the captured detection light L1. For example, the state of the substrate 101 including the position of the substrate 101 relative to the substrate holding hand 22, the orientation of the substrate 101, and whether or not an abnormality has occurred in the substrate 101 is detected.

[0044] Then, in step S6, it is determined whether or not an abnormality has been detected in the substrate 101 based on the detected state of the substrate 101. If it is determined that an abnormality has been detected in the substrate 101, the process proceeds to step S7. If it is not determined that an abnormality has been detected in the substrate 101, the process proceeds to step S8.

[0045] In step S7, it is determined that an abnormality has been detected in the substrate 101, and abnormality detection information is output indicating that an abnormality has been detected in the substrate 101. For example, when a signal is acquired instructing that the substrate 101 in which an abnormality has been detected be stored again in the FOUP 110, the operation of the robot 20 is controlled so that the substrate 101 in which an abnormality has been detected is stored again in the FOUP 110 without being processed by the processing device 401. Then, the control process of the substrate detection method is terminated.

[0046] In step S8, the positional deviation of the substrate 101 in the substrate holding hand 22 is corrected. Specifically, assuming that no abnormality is detected in the substrate 101, the transport operation of the substrate 101 is continued, and the positional deviation of the substrate 101 with respect to the substrate holding hand 22 is detected based on the position of the substrate 101 detected as the state of the substrate 101 in step S5. Then, based on the detected positional deviation of the substrate 101, the transport operation of the substrate 101 by the robot 20 with respect to the aligner 30 is corrected.

[0047] Then, in step S9, the orientation of the substrate 101 is adjusted to a predetermined direction by the aligner 30. Specifically, the position of the notch 101b on the outer periphery of the substrate 101 is detected based on the state of the substrate 101 detected in step S5. Then, a detection range for detecting the orientation of the substrate 101 by the aligner 30 is set based on the detected position of the notch 101b. Then, from within the set detection range, the aligner 30 detects the notch 101b without using the captured images 71 and 72, and adjusts the rotational position of the substrate 101 so that the substrate 101 faces a predetermined direction.

[0048] Then, in step S10, the robot 20 transports the substrate 101 from the aligner 30 to the load lock unit 403 for processing by the processing device 401. Then, the control process of the substrate detection method is completed.

[0049] When the control process of the substrate detection method is executed successively for a plurality of substrates 101, the generation of the trained model 62 in step S1 is performed only once, and the control process from step S2 to step S10 is repeatedly executed for each substrate 101. Moreover, any one of the control processes in steps S6 to S8 may be executed first.

[0050] [Effects of the first embodiment] As described above, the substrate transport robot system 100 irradiates the main surface 101a of the substrate 101 held by the robot 20 with detection light L1 having a predetermined shape. Then, the state of the substrate 101 is detected based on the captured images 71 and 72 of the detection light L1 captured by the imaging unit 40. As a result, since the substrate 101 to be imaged is held by the robot 20 transporting the substrate 101, the position of the substrate 101 can be easily adjusted by the operation of the robot 20. Therefore, the substrate 101 can be easily placed in an appropriate position for detecting the state of the substrate 101 by the operation of the robot 20, so the state of the substrate 101 can be detected with higher accuracy.

[0051] Furthermore, in the first embodiment, the substrate 101 held by the robot 20 is imaged to detect the state of the substrate 101 while the robot 20 is transporting the substrate 101, and therefore, unlike the case where the substrate 101 is placed on a mounting section dedicated to image capture arranged separately from the robot 20 to image the substrate 101, or the case where the substrate 101 is moved by a movement mechanism such as a translation means arranged separately from the robot 20, it is possible to prevent the device configuration from becoming complicated in order to detect the state of the substrate 101 with higher accuracy. Furthermore, since the substrate 101 is imaged to detect the state of the substrate 101 while the robot 20 is transporting the substrate 101, the workload can be reduced compared to the case where the state of the substrate 101 is detected separately from the transport of the substrate 101.

[0052] In the first embodiment, the irradiation unit 50 irradiates the detection light L1 onto the main surface 101a of the substrate 101, in which at least one of the position and the angle is changed relative to the irradiation unit 50. The imaging unit 40 captures the detection light L1 reflected on the main surface 101a of the substrate 101 multiple times as at least one of the position and the angle of the substrate 101 relative to the irradiation unit 50 is changed. The control unit 60 detects the state of the substrate 101 based on each of the captured images 71 and 72 generated by capturing the reflected detection light L1 multiple times by the imaging unit 40. As a result, even when the detection light L1 is irradiated only to a part of the main surface 101a of the substrate 101, the reflected image of the detection light L1 reflected over the entire main surface 101a of the substrate 101 can be captured by capturing the image multiple times as at least one of the position and the angle of the substrate 101 is changed relative to the substrate 101. Therefore, even when the detection light L1 is irradiated only onto a portion of the main surface 101a of the substrate 101, the overall state of the substrate 101 can be detected with high accuracy.

[0053] Furthermore, in the first embodiment, when the imaging unit 40 captures the detection light L1, the robot 20 changes at least one of the position and angle of the substrate 101 relatively to the irradiation unit 50. This allows the imaging unit 40 to capture an image of the substrate 101 while accurately adjusting at least one of the position and angle of the substrate 101 relative to the imaging unit 40 by relatively changing at least one of the position and angle of the substrate 101 by the robot 20. As a result, the state of the substrate 101 can be detected with even greater accuracy.

[0054] Moreover, in the first embodiment, the irradiation unit 50 irradiates a line-shaped detection light L1 along a direction intersecting a movement direction in changing the relative position of the substrate 101 with respect to the irradiation unit 50. This allows the line-shaped detection light L1 to be reflected at the main surface 101a of the substrate 101, so that the state of the substrate 101 in a continuous region from one end to the other end of the substrate 101 can be acquired based on a reflected image of the line-shaped detection light L1. Therefore, the state of the substrate 101 can be detected with even greater accuracy based on the captured images 71 and 72 capturing the detection light L1 reflected at the main surface 101a of the substrate 101.

[0055] In the first embodiment, the robot 20 moves the substrate 101 along a plurality of different movement directions when the imaging unit 40 captures the detection light L1. The control unit 60 detects the state of the substrate 101 based on the captured images 71 and 72 in each of the movements of the substrate 101 along the plurality of movement directions of the robot 20. As a result, by acquiring the captured images 71 and 72 for each movement of the substrate 101 along each of the plurality of different movement directions, it is possible to acquire a plurality of captured images 71 and 72 in which the substrate 101 moves in different directions when being captured. Therefore, the state of the substrate 101 can be detected based on each of the plurality of types of captured images 71 and 72 in which the substrate 101 moves in different directions, so that the state of the substrate 101 can be detected with even greater accuracy.

[0056] Furthermore, in the first embodiment, the control unit 60 detects the state of the substrate 101, including at least one of the shape, position, and orientation of the substrate 101, and an abnormality occurring in the substrate 101, based on the captured images 71 and 72. This allows the state of the substrate 101, including at least one of the shape, position, and orientation of the substrate 101, and an abnormality occurring in the substrate 101, to be detected with higher accuracy based on the captured images 71 and 72.

[0057] Furthermore, in the first embodiment, the control unit 60 detects the state of the substrate 101 based on each of the captured images 71 and 72, thereby detecting the notch 101b or the orientation flat indicating the orientation of the substrate 101. As a result, the notch 101b or the orientation flat can be detected based on each of the captured images 71 and 72, and therefore the orientation of the substrate 101 can be easily detected based on each of the captured images 71 and 72.

[0058] In the first embodiment, the control unit 60 detects the state of the substrate 101 based on the captured images 71 and 72 by the imaging unit 40 using the trained model 62 generated by machine learning. Here, in machine learning, the trained model 62 can be trained to detect the state of the substrate 101 of a form different from the learned state of the substrate 101 by learning the states of the substrate 101 of multiple types. For example, when detecting an abnormality in the warping of the substrate 101 using the trained model 62 by machine learning, the trained model 62 that has learned that warping at multiple positions and in multiple directions is abnormal can be used to accurately detect warping at a position or direction different from the learned warping. Therefore, the state of the substrate 101 can be detected more accurately by detecting the state of the substrate 101 based on each of the captured images 71 and 72 using the trained model 62 generated by machine learning.

[0059] In the first embodiment, the robot 20 is disposed in the transfer chamber 10 in which the substrate 101 is transferred to the FOUP 110 serving as a substrate storage container in which the substrate 101 is stored. The irradiation unit 50 is disposed above the robot 20 in the transfer chamber 10 and irradiates the main surface 101a of the substrate 101 with detection light L1. The imaging unit 40 is disposed above the robot 20 in the transfer chamber 10 and captures the detection light L1 reflected by the main surface 101a of the substrate 101. The control unit 60 detects the state of the substrate 101 based on the captured images 71 and 72 captured in the transfer chamber 10. This allows the state of the substrate 101 to be detected based on the captured images 71 and 72 while the robot 20 is performing the transfer operation of the substrate 101 to the FOUP 110. Therefore, it is possible to suppress an increase in the operation time required for detecting the state of the substrate 101, compared to a case in which the transfer of the substrate 101 to the FOUP 110 and the detection of the state of the substrate 101 are performed separately.

[0060] In the first embodiment, the substrate transport robot system 100 includes an aligner 30 as an adjustment device that adjusts the orientation of the substrate 101 to a predetermined direction. The control unit 60 controls the operation of the aligner 30 using the state of the substrate 101 detected based on the captured images 71 and 72. This allows the state of the substrate 101 to be detected in advance based on the captured images 71 and 72, so that the orientation of the substrate 101 can be adjusted by the aligner 30 with the approximate orientation of the substrate 101 detected in advance. This allows the time required for the aligner 30 to adjust the orientation of the substrate 101 to be shortened.

[0061] Moreover, in the first embodiment, the robot 20 includes a substrate holding hand 22 that holds the substrate 101. The control unit 60 also serves as a robot control unit that controls the transport operation of the robot 20. The control unit 60 detects a deviation in at least one of the position and orientation of the substrate 101 with respect to the substrate holding hand 22 based on the detected state of the substrate 101, and corrects the detected deviation in at least one of the position and orientation of the substrate 101 in the transport operation of the robot 20. This allows the transport operation of the robot 20 to be corrected by detecting the state of the substrate 101 based on each of the captured images 71 and 72, so that the transport operation by the robot 20 can be performed with higher accuracy.

[0062] [Second embodiment] Next, the configuration of a substrate transport robot system 200 according to a second embodiment will be described with reference to Fig. 9. In the second embodiment, the substrate transport robot system 200 is provided with an irradiation unit 250 that irradiates two detection lights L11 and L12, unlike the substrate transport robot system 100 of the first embodiment that is provided with an irradiation unit 50 that irradiates one detection light L1. Note that the same components as those in the first embodiment are denoted by the same reference numerals and description thereof will be omitted.

[0063] As shown in Fig. 9, the substrate transport robot system 200 according to the second embodiment includes an irradiation unit 250 and a control unit 260. The irradiation unit 250 irradiates the main surface 101a of the substrate 101 with different linear detection lights L11 and L12. The irradiation unit 250 irradiates the main surface 101a of the substrate 101 with two detection lights L11 and L12 that extend in parallel directions and have a common shape such as color and thickness. The detection lights L11 and L12 are examples of the "first detection light" and the "second detection light", respectively.

[0064] The imaging unit 40 captures the detection light L11 and the detection light L12 reflected on the main surface 101a of the substrate 101 multiple times as the robot 20 moves the substrate 101, similar to the imaging of the detection light L1 in the first embodiment. The control unit 260 captures the reflected detection light L11 and the reflected detection light L12 multiple times by the imaging unit 40, thereby acquiring one captured image, similar to the captured images 71 and 72 in the first embodiment. That is, the captured image in the second embodiment includes both the detection light L11 and the detection light L12. Then, the control unit 260 detects the state of the substrate 101 based on the acquired captured image, similar to the captured images 71 and 72 in the first embodiment.

[0065] For example, in the second embodiment, the control unit 260 sets the movement speed of the robot 20 when the imaging unit 40 captures images to twice the movement speed of the robot 20 in the first embodiment. The control unit 260 captures both the detection light L11 and the detection light L12 in one captured image. That is, even when the movement speed of the robot 20 is doubled, the control unit 260 irradiates both the detection light L11 and the detection light L12 onto the main surface 101a of one substrate 101 and captures both the detection light L11 and the detection light L12 reflected by one imaging unit 40, thereby making the total number of the detection light L11 and the detection light L12 included in one captured image equal to the number of the detection light L1 in the first embodiment. The other configurations of the second embodiment are similar to those of the first embodiment.

[0066] [Effects of the second embodiment] In the substrate transport robot system 200 according to the second embodiment, as described above, the irradiation unit 250 irradiates detection light including the detection light L11 as the first detection light and the detection light L12 as the second detection light, which are different from each other in a line shape. The control unit 260 detects the state of the substrate 101 based on one captured image including the detection light L11 and the detection light L12 generated by multiple imaging by the imaging unit 40. As a result, two line-shaped detection lights, the detection light L11 and the detection light L12 reflected on the main surface 101a of the substrate 101, can be imaged by one imaging, so that the number of imaging operations required to image the line-shaped detection lights L11 and L12 reflected over the entire main surface 101a of the substrate 101 can be reduced compared to the case where one line-shaped detection light is reflected. Therefore, the time required to detect the state of the substrate 101 can be shortened. Note that other effects of the second embodiment are similar to those of the first embodiment.

[0067] [Third embodiment] Next, the configuration of a substrate transport robot system 300 according to a third embodiment will be described with reference to Fig. 10. In the substrate transport robot system 300 according to the third embodiment, a robot 320 moves a held substrate 101 so as to change the angle with respect to a horizontal plane. Note that the same components as those in the first embodiment are denoted by the same reference numerals and will not be described.

[0068] As shown in FIG. 10, the substrate transport robot system 300 according to the third embodiment includes a robot 320, an irradiation unit 350, and a control unit 360. The robot 320 includes a robot arm 321 and a substrate holding hand 322. The irradiation unit 350 irradiates the substrate 101 with linear detection light L21 along the YZ plane. That is, the irradiation unit 350 irradiates the substrate 101 with linear detection light L21 extending along the Y direction on the main surface 101a of the substrate 101. In the third embodiment, the irradiation unit 350 irradiates the detection light L21 onto the main surface 101a of the substrate 101, the angle of which is changed relatively. When the imaging unit 40 captures the detection light L21, the robot 320 changes the angle of the substrate 101 relative to the irradiation unit 350. The robot 320 has a rotation drive mechanism that rotates the substrate holding hand 322 in the θ direction with the direction from the base end to the tip of the substrate holding hand 322 as the rotation axis. For example, a rotation drive mechanism such as a servo motor that rotates the substrate holding hand 322, which is an end effector, is disposed at the tip of the horizontally articulated robot arm 321. The irradiation unit 350 irradiates a linear detection light L21 along the rotation axis direction of the rotation operation in changing the relative angle of the substrate 101 with respect to the irradiation unit 350. "Along the rotation axis direction" includes a direction parallel to the rotation axis and a direction inclined from the direction parallel to the rotation axis. In other words, the irradiation unit 350 irradiates a linear detection light L21 that extends in a direction not perpendicular to the rotation axis of the substrate holding hand 322. Specifically, the detection light L21 extends in a direction parallel to the rotation axis of the substrate holding hand 322 in the rotation movement on the main surface 101a of the substrate 101. In the third embodiment, similarly to the first embodiment, the state of the substrate 101 is detected based on an image captured by the detection light L21 reflected by the main surface 101a of the substrate 101. When the imaging unit 40 captures the detection light L21, the robot 320 moves the substrate 101 along a predetermined movement direction so as to change the angle of the substrate 101 held by the substrate holding hand 322 with respect to the horizontal plane. That is, in the third embodiment, the θ direction is an example of the predetermined movement direction.

[0069] In order to detect the state of the substrate 101, the control unit 360 conveys the substrate 101 by the robot 320 to a predetermined position where the substrate 101 is imaged by the imaging unit 40. The control unit 360 rotates the substrate 101 by tilting the substrate 101 along the θ direction so as to change the angle with respect to the horizontal plane without changing the position of the substrate 101 in the XY plane. As an example, the control unit 360 rotates the substrate 101 along the θ direction in a range from −5 degrees to +5 degrees based on a state in which the main surface 101a of the substrate 101 is aligned with the horizontal plane. The imaging unit 40 images the detection light L21 reflected by the main surface 101a of the substrate 101 multiple times as the substrate 101 moves along the θ direction, which is a change in the relative angle of the substrate 101 with respect to the irradiation unit 350. The control unit 360 detects the state of the substrate 101 based on one captured image generated by capturing a plurality of reflected detection lights L21 by the imaging unit 40 multiple times, as in the first embodiment. The detection of the state of the substrate 101 based on the captured image of the detection light L21 is similar to the detection of the state of the substrate 101 based on the captured images 71 and 72 in the first embodiment. The other configurations of the third embodiment are similar to those of the first embodiment. For example, the control unit 360 generates a plurality of captured images by changing the orientation of the substrate holding hand 322 to change the orientation of the rotation axis. Then, the control unit 360 detects the state of the substrate 101 based on the plurality of captured images with different orientations of the rotation axis.

[0070] [Effects of the third embodiment] In the third embodiment, as described above, the irradiation unit 350 irradiates the linear detection light L21 along the rotation axis direction of the rotation operation in changing the relative angle of the substrate 101 with respect to the irradiation unit 350. This allows the linear detection light L21 to be reflected on the main surface 101a of the substrate 101, so that the state of the substrate 101 in a continuous region from one end to the other end of the substrate 101 can be obtained based on a reflected image of the linear detection light L21. Therefore, the state of the substrate 101 can be detected with even greater accuracy based on an image obtained by capturing the detection light L21 reflected on the main surface 101a of the substrate 101.

[0071] In the third embodiment, as described above, the robot 320 changes the angle of the substrate 101 with respect to the horizontal plane when the imaging unit 40 captures the detection light L21. This allows the robot 320 to change the angle of the substrate 101 with respect to the horizontal plane, so that the irradiation angle of the detection light L21 irradiated to the substrate 101 can be changed three-dimensionally. Therefore, the detection light L21 from more diverse irradiation directions can be reflected onto the main surface 101a of the substrate 101, and the state of the substrate 101 can be detected based on an image captured of the reflected detection light L21, so that the state of the substrate 101 can be detected with even greater accuracy. Other effects of the third embodiment are similar to those of the first embodiment.

[0072] [Variations] It should be noted that the embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the present disclosure is indicated by the claims, not by the description of the embodiments above, and further includes all modifications (variations) within the meaning and scope equivalent to the claims.

[0073] For example, in the above-mentioned first, second, and third embodiments, an example was shown in which the state of the substrate 101 is detected based on one captured image generated by capturing a plurality of line-shaped detection lights L1, L11, and L12, L21 reflected by the imaging unit 40 multiple times, but the present disclosure is not limited to this. In the present disclosure, the state of the substrate may be detected based on the captured image of the detection light captured by one imaging. For example, when the detection light is a plurality of point light sources in a lattice shape rather than a line shape, the state of the substrate is detected by capturing the detection light reflected over the entire main surface of the substrate by one imaging. The shape of the detection light irradiated on the main surface of the substrate is not limited to a line shape or a lattice shape, and may have a predetermined geometric shape such as a concentric circle shape. In addition, the irradiation unit may be configured to irradiate detection light having a predetermined color and shape by a projector device that projects an image. In addition, the imaging unit may capture a plurality of images as one moving image, and the state of the substrate may be detected based on the captured image as the moving image.

[0074] In the second embodiment, the state of the substrate 101 is detected based on one captured image including the detection light L11 as the first detection light and the detection light L12 as the second detection light, which are parallel to each other and have the same shape, by the irradiation unit 250. However, the present disclosure is not limited to this. In the present disclosure, when the first detection light and the second detection light, which are two different detection lights, are irradiated, the first detection light and the second detection light may have different shapes or may be lights of different colors. In addition, when the first detection light and the second detection light are both linear, the first detection light and the second detection light may be irradiated so as to cross each other. In addition, three or more different linear detection lights may be irradiated. In addition, when a plurality of detection lights are irradiated, a plurality of irradiation units may be separately arranged.

[0075] In the first, second, and third embodiments, the trained model 62 is used to detect the position, orientation, and abnormality of the substrate 101 as the state of the substrate 101 based on the captured images of the detection lights L1, L11, L12, and L21. However, the present disclosure is not limited to this. In the present disclosure, the state of the substrate detected based on the captured images may be at least one of the shape, position, orientation, and abnormality of the substrate. That is, the shape of the substrate may be detected as the state of the substrate. For example, the shape of the contour line of the substrate may be detected based on the captured images, and the position and orientation of the substrate may be detected by detecting the coordinates of the center position of the substrate and a notch or orientation flat based on the detected shape of the substrate. In addition, the abnormality of the substrate detected as the state of the substrate may be one of warping, deformation, chipping, cracking, and scratches of the substrate, or a plurality of any of them. For example, only warping of the substrate may be detected as an abnormality. In addition, the state of the substrate may be detected without using the trained model. For example, the state of the substrate may be detected by detecting a linear structure from the captured image using a predetermined algorithm other than the trained model based on the captured image captured multiple times with the movement of the substrate using the line-shaped detection light. In this case, the line-shaped detection light may be detected by extracting the center position in the width direction of the line-shaped detection light included in the captured image.

[0076] In the above-mentioned first, second and third embodiments, an example is shown in which, as the substrate 101 is moved by the robot 20, 320, an abnormality of the substrate 101 is detected as the state of the substrate 101 based on the captured images 71 and 72 captured at the timing when the substrate 101 is removed from the FOUP 110 as a substrate storage container, and the substrate 101 for which an abnormality has been detected is stored again in the FOUP 110, but the present disclosure is not limited to this. In the present disclosure, the state of the substrate may be detected based on a captured image of the substrate not being moved by the robot and being stopped. For example, the substrate held by the robot may be moved relative to the irradiation unit by operating the irradiation unit so as to change at least one of the irradiation direction or the position of the irradiation unit. A predetermined detection position may be set in advance, and an abnormality of the substrate may be detected based on a captured image of the substrate moved to the predetermined detection position by the robot. In addition, when the captured image is captured by the imaging unit, at least one of the relative position and angle of the substrate with respect to the irradiation unit may not be changed. For example, while held by the robot, the detection light reflected by the stationary irradiation unit irradiated to the stationary substrate may be captured by the imaging unit. The imaging unit may be moved. The state of the substrate may be detected based on an image captured at the timing when the substrate is stored in the substrate storage container after the processing by the processing device is completed. The substrate in which an abnormality has been detected may not be stored back in the substrate storage container. For example, the substrate in which an abnormality has been detected may be placed in a container or placement position different from the substrate storage container from which the substrate was removed. When an abnormality of the substrate is detected, the imaging unit may capture the substrate again to perform the process of detecting the state of the substrate again using the trained model. When capturing the substrate again, the position, orientation, or movement direction of the substrate may be changed from that of the first capture. A signal indicating the state of the substrate detected may be output to the processing device or the like.In addition, by arranging an alarm unit such as a display device on the front side of the transport chamber, information indicating the detected state of the substrate may be notified by displaying text information and outputting audio information, etc.

[0077] In the above first and second embodiments, the captured image 71 is acquired during the movement of the substrate 101 along a predetermined moving direction, and the captured image 72 is acquired during the movement of the substrate 101 along a separate moving direction different from the predetermined moving direction in which the captured image 71 is acquired. However, the present disclosure is not limited to this. In the present disclosure, the state of the substrate may be detected based on one captured image captured during the movement of the substrate along one moving direction, or captured images may be acquired in each of three or more different moving directions. In addition, even when multiple captured images are acquired, the multiple captured images may be acquired while moving the substrate in a common moving direction. In addition, images may be acquired in a state in which the relative angles between the substrate and the irradiation unit are different from each other.

[0078] In the third embodiment, the state of the substrate 101 is detected based on the captured images of the detection light L21 captured multiple times in association with the rotational movement of the substrate 101 in the θ direction, which changes the angle of the substrate 101 relative to the horizontal plane without changing the position of the substrate 101 in the XY plane. However, the present disclosure is not limited to this. In the present disclosure, the substrate may be moved along the horizontal plane in a state where the angles of the substrate are different from each other, thereby acquiring multiple captured images of the substrate at different angles. In this case, the moving direction of the substrate along the horizontal plane may be made different from each other. That is, both the relative position and the angle of the substrate with respect to the irradiation unit may be changed. In this case, both the relative position and the angle of the substrate with respect to the irradiation unit may be changed by the robot. The detection light irradiated by the irradiation unit may be a linear detection light along a direction intersecting the moving direction in changing the relative position of the substrate with respect to the irradiation unit, and a linear detection light along the rotation axis direction of the rotational operation in changing the relative angle of the substrate with respect to the irradiation unit.

[0079] In the above first, second, and third embodiments, an example has been described in which the notch 101b indicating the orientation of the substrate 101 is detected by detecting the state of the substrate 101, but the present disclosure is not limited to this. In the present disclosure, an orientation flat arranged on the substrate may be detected by detecting the state of the substrate.

[0080] In the above first, second, and third embodiments, the transport operation of the robot 20, 320 is corrected so as to correct at least one of the deviations in the position and orientation of the substrate 101 detected based on the detected state of the substrate 101, and the operation of the aligner 30 as an adjustment device is controlled based on the detected state of the substrate 101, but the present disclosure is not limited to this. In the present disclosure, the transport operation of the robot may be corrected so as to correct at least one of the deviations in the position and orientation of the substrate based on the detected state of the substrate. That is, the transport operation of the robot may be corrected so as to correct the deviation in the orientation of the substrate based on the detected state of the substrate. For example, when the orientation of the substrate held by the substrate holding hand is different from a predetermined orientation set in advance based on the detected state of the substrate, the operation of the robot may be corrected so that the substrate is transported in a predetermined orientation. In addition, when the operation of the aligner as an adjustment device is controlled based on the detected state of the substrate, the adjustment device may perform only the adjustment operation of the position in the rotation direction of the substrate without detecting the orientation of the substrate. Furthermore, when controlling the operation of an aligner as an adjustment device based on the detected state of the substrate, a notch or orientation flat indicating the orientation of the substrate may be detected as the state of the substrate based on an image captured with the detection light, and the rotation direction of the substrate in the aligner may be set according to the position of the detected notch or orientation flat. In this case, the substrate placed in the aligner can be rotated in a direction close to the notch or orientation flat, thereby reducing the time required for the operation of detecting the orientation of the substrate in the aligner.

[0081] In the above first, second, and third embodiments, examples are shown in which the robot 20, 320 has the horizontally articulated robot arm 21, 321, but the present disclosure is not limited to this. In the present disclosure, the robot arm may have a vertically articulated robot arm instead of a horizontally articulated robot arm. The robot may also have a linear movement mechanism such as a slide mechanism. The substrate holding hand may be an active type hand that fixes and holds the substrate by a vacuum or a chuck. In addition, the substrate may be rotated and moved so as to be tilted relative to the horizontal plane while the substrate is fixed, thereby capturing an image of the detection light reflected on each of the main surfaces on both sides of the substrate.

[0082] In the above first, second, and third embodiments, the substrate transport robot system 100 of the present disclosure is an EFEM that transports the substrate 101 to the processing device 401, but the present disclosure is not limited to this. In the present disclosure, the substrate transport robot system may be other than an EFEM. For example, the substrate transport robot system may be a stocker or a sorter that transports substrates from a substrate storage container to a substrate storage container. In addition, the substrate transport robot system may transport substrates transported by a belt conveyor or the like to a substrate storage container or a substrate placement unit, instead of a substrate storage container. In addition, the detection of the substrate state according to the present disclosure may be applied to a system that transports substrates on the processing device side. That is, when the substrate is transported between a load lock unit and a processing module unit, the substrate state may be detected by the substrate detection method according to the present disclosure.

[0083] In the above first, second, and third embodiments, the control unit 60, 260, 360 of the substrate transport robot system 100 generates the trained model 62, detects an abnormality in the substrate 101 based on the captured images 71 and 72, and controls the operation of the robot 20, 320. However, the present disclosure is not limited to this. In the present disclosure, at least one of the generation of the trained model and the control of the operation of the robot may be performed by a control device different from the control unit that detects an abnormality in the substrate based on the captured images. For example, the generation of the trained model may be performed by a control device arranged separately from the robot. That is, the trained model may be generated by machine learning performed by a control device arranged separately from the substrate transport robot system such as EFEM. In addition, the control unit that detects the state of the substrate based on the captured images may be arranged separately from the robot control unit that controls the operation of the robot.

[0084] In the above first, second, and third embodiments, the imaging unit 40 and the irradiation unit 50, 250, and 350 are disposed inside the transfer chamber 10, but the present disclosure is not limited thereto. In the present disclosure, any of the marking member, the imaging unit, and the irradiation unit may be disposed outside the transfer chamber in which the substrate is transferred. For example, in the case of detecting an abnormality of a substrate in a transfer chamber of a processing device that processes the substrate, the ceiling of the transfer chamber of the processing device may be made of a transparent material such as glass, and the marking member, the imaging unit, and the irradiation unit may be disposed above the outside of the transfer chamber.

[0085] In the first, second, and third embodiments, examples have been shown in which the irradiation units 50, 250, and 350 irradiate the detection light L1, L11, and L12, L21 at the timing when the imaging unit 40 performs imaging, but the present disclosure is not limited to this. In the present disclosure, the irradiation of illumination light by the irradiation unit may be performed at all times. Furthermore, the irradiation of illumination light may be controlled by a control process by the control unit based on the captured image. For example, control may be performed to change the amount of light, wavelength, etc. of the illumination light based on the luminance value of the captured image. Furthermore, when an abnormality in the substrate is detected, the illumination light may be controlled to change the amount of light, wavelength, etc. of the illumination light, and the captured image may be captured again to detect an abnormality in the substrate using the trained model again. Furthermore, an illumination unit that irradiates illumination light separately from the irradiation unit may be arranged in the transfer chamber.

[0086] In the above first, second, and third embodiments, examples are shown in which the irradiation units 50, 250, and 350 including LEDs that irradiate red light as the detection light L1, L11, and L12, L21 are arranged, but the present disclosure is not limited to this. In the present disclosure, the irradiation unit may include a light source device other than an LED. Furthermore, the illumination light from the irradiation unit may have a wavelength of a predetermined color other than red. Furthermore, the illumination light may be light with a wavelength other than visible light, such as infrared light. Furthermore, the number of irradiation units may be one, or may be three or more.

[0087] In the above first, second, and third embodiments, three FOUPs 110 are attached as substrate storage containers to the transfer chamber 10 of the substrate transfer robot system 100, 200, and 300, and three imaging units 40 and three irradiation units 50, 250, and 350 are arranged to correspond to the FOUPs 110, but the present disclosure is not limited to this. In the present disclosure, the number of substrate storage containers attached to the transfer chamber may be two or less, or four or more. Also, one imaging unit and one irradiation unit may be arranged for multiple substrate storage containers. In that case, the common imaging unit captures images of substrates transferred to the multiple substrate storage containers. Also, the number of imaging units and the number of irradiation units may be different from each other.

[0088] In the above first, second, and third embodiments, an example has been described in which the trained model 62 is generated by machine learning of deep learning using a full-layer convolutional network, but the present disclosure is not limited to this. In the present disclosure, the machine learning for generating the trained model may not be deep learning. Furthermore, the machine learning for generating the trained model may be machine learning using a convolutional neural network other than a full-layer convolutional network. Furthermore, the machine learning for generating the trained model may be machine learning other than a convolutional neural network.

[0089] In the above first, second, and third embodiments, the substrate 101 whose state is to be detected is a silicon wafer having a disk shape, but the present disclosure is not limited to this. In the present disclosure, the substrate 101 may be a member other than silicon. Also, instead of a disk shape, the state of a rectangular substrate on which electronic components are mounted may be detected. In that case, the state of the substrate including the orientation and position of the substrate may be detected by detecting the sides of the rectangle.

[0090] In the above first, second, and third embodiments, an example has been shown in which an abnormality in the substrate 101 is detected by using the trained model 62 that receives as input the captured images of the detection lights L1, L11, L12, and L21 captured by the imaging unit 40 and outputs the identification result 75, but the present disclosure is not limited to this. In the present disclosure, image processing such as noise removal, edge emphasis, and contrast change may be performed in advance on the captured images to be input to the trained model for detecting abnormalities in the substrate before inputting the captured images to the trained model.

[0091] The functions of the elements disclosed herein can be performed using circuits or processing circuits, including general purpose processors, special purpose processors, integrated circuits, Application Specific Integrated Circuits (ASICs), conventional circuits, and / or combinations thereof, configured or programmed to perform the disclosed functions. Processors are considered processing circuits or circuits because they include transistors and other circuits. In this disclosure, a circuit, unit, or means is hardware that performs the recited functions or hardware that is programmed to perform the recited functions. The hardware may be hardware disclosed herein or other known hardware that is programmed or configured to perform the recited functions. Where the hardware is a processor, which is considered a type of circuit, the circuit, means, or unit is a combination of hardware and software, and the software is used to configure the hardware and / or the processor.

[0092] [Aspects] It will be appreciated by those skilled in the art that the exemplary embodiments described above are examples of the following aspects.

[0093] (Item 1) A robot for transporting the substrate; an irradiation unit that irradiates a main surface of the substrate held by the robot with detection light having a predetermined shape; an imaging unit that images the substrate to capture the detection light reflected at the main surface of the substrate; a control unit that detects a state of the substrate based on an image of the detection light captured by the imaging unit.

[0094] (Item 2) the irradiation unit irradiates the main surface of the substrate with the detection light, the main surface being changed in at least one of a position and an angle relative to the main surface; the imaging unit captures an image of the detection light reflected by the main surface of the substrate a plurality of times in accordance with a change in at least one of a relative position and an angle of the substrate with respect to the irradiation unit; 2. The substrate transport robot system according to claim 1, wherein the control unit detects a state of the substrate based on one of the captured images generated by capturing a plurality of the reflected detection lights through multiple imaging by the imaging unit.

[0095] (Item 3) 3. The substrate transport robot system according to item 2, wherein the robot relatively changes at least one of a position and an angle of the substrate with respect to the irradiation unit when the imaging unit captures the detection light.

[0096] (Item 4) 4. The substrate transport robot system according to item 2 or 3, wherein the irradiation unit irradiates at least one of the detection light in a line shape along a direction intersecting a movement direction when changing the relative position of the substrate with respect to the irradiation unit, and the detection light in a line shape along a rotation axis direction of a rotation operation when changing the relative angle of the substrate with respect to the irradiation unit.

[0097] (Item 5) the robot moves the substrate along a plurality of movement directions different from each other when the imaging unit captures an image of the detection light; 4. The substrate transport robot system according to item 3, wherein the control unit detects a state of the substrate based on the captured images during each of the movements of the substrate along the multiple movement directions of the robot.

[0098] (Item 6) 4. The substrate transport robot system according to item 3, wherein the robot changes an angle of the substrate with respect to a horizontal plane when the imaging unit captures the detection light.

[0099] (Item 7) The control unit detects a state of the substrate, including at least one of a shape, a position, an orientation, and an abnormality occurring in the substrate, based on the captured image.

[0100] (Item 8) 8. The substrate transport robot system according to item 7, wherein the control unit detects a notch or an orientation flat indicating an orientation of the substrate by detecting a state of the substrate based on the captured image.

[0101] (Item 9) 9. The substrate transport robot system according to any one of claims 1 to 8, wherein the control unit detects a state of the substrate based on the image captured by the imaging unit using a trained model generated by machine learning.

[0102] (Item 10) the irradiation unit irradiates the detection light including first detection light and second detection light having different line shapes; The control unit detects a state of the substrate based on the one captured image including the first detection light and the second detection light generated by multiple captures by the imaging unit.

[0103] (Item 11) the robot is disposed in a transfer chamber in which the substrate is transferred to a substrate storage container in which the substrate is stored; the irradiation unit is disposed above the robot within the transfer chamber and irradiates the main surface of the substrate with the detection light; the imaging unit is disposed above the robot within the transfer chamber, and captures an image of the detection light reflected by the main surface of the substrate; 11. The substrate transport robot system according to any one of items 1 to 10, wherein the control unit detects a state of the substrate based on the captured image captured inside the transport chamber.

[0104] (Item 12) An adjustment device that adjusts the orientation of the substrate to a predetermined direction is further provided, 12. The substrate transport robot system according to any one of items 1 to 11, wherein the control unit controls an operation of the adjustment device using a state of the substrate detected based on the captured image.

[0105] (Item 13) the robot includes a substrate holding hand that holds the substrate; The control unit is A robot control unit that controls the transport operation of the robot, Detecting at least one of a positional deviation and an orientation deviation of the substrate with respect to the substrate holding hand based on the detected state of the substrate; 13. The substrate transport robot system according to any one of items 1 to 12, wherein at least one of the detected deviations in position and orientation of the substrate is corrected during a transport operation of the robot.

[0106] (Item 14) capturing an image of the substrate held by a robot that transports the substrate, and capturing an image of detection light having a predetermined shape reflected on a main surface of the substrate; A substrate detection method, comprising: detecting a state of the substrate based on an image captured by the detection light. [Explanation of symbols]

[0107] 10 Transport Room 20,320 Robot 22, 322 Board holding hand 30 Aligner (adjustment device) 40 Imaging unit 50, 250, 350 Irradiation unit 60, 260, 360 Control unit 62 trained models 71, 72 Captured images 100, 200, 300 Substrate transport robot system 101 Substrate 101a Main surface 101b Notch 110 FOUP (substrate storage container) 401 Processing equipment 403 Load lock section

Claims

1. A robot for transporting the substrate; an irradiation unit that irradiates a main surface of the substrate held by the robot with detection light having a predetermined shape; an imaging unit that images the substrate to capture the detection light reflected at the main surface of the substrate; a control unit that detects a state of the substrate based on an image of the detection light captured by the imaging unit.

2. the irradiation unit irradiates the main surface of the substrate with the detection light, the main surface being changed in at least one of a position and an angle relative to the main surface; the imaging unit captures an image of the detection light reflected by the main surface of the substrate a plurality of times in accordance with a change in at least one of a relative position and an angle of the substrate with respect to the irradiation unit; 2. The substrate transport robot system according to claim 1, wherein the control unit detects a state of the substrate based on one of the captured images generated by capturing a plurality of the reflected detection lights by the imaging unit performing imaging a plurality of times.

3. The substrate transport robot system according to claim 2 , wherein the robot changes at least one of a position and an angle of the substrate relative to the irradiation unit when the imaging unit captures the detection light.

4. 4. The substrate transport robot system of claim 2, wherein the irradiation unit irradiates at least one of the detection light in a line shape along a direction intersecting a movement direction when changing the relative position of the substrate with respect to the irradiation unit, and the detection light in a line shape along a rotation axis direction of a rotation operation when changing the relative angle of the substrate with respect to the irradiation unit.

5. the robot moves the substrate along a plurality of movement directions different from each other when the imaging unit captures an image of the detection light; The substrate transport robot system according to claim 3 , wherein the control unit detects a state of the substrate based on the captured images during each of the movements of the substrate along the plurality of movement directions of the robot.

6. The substrate transport robot system according to claim 3 , wherein the robot changes an angle of the substrate with respect to a horizontal plane when the imaging unit captures the detection light.

7. The substrate transport robot system according to any one of claims 1 to 3, wherein the control unit detects the state of the substrate, including at least one of the shape, position, orientation, and abnormality occurring in the substrate, based on the captured image.

8. The substrate transport robot system according to claim 7 , wherein the control unit detects a notch or an orientation flat indicating an orientation of the substrate by detecting a state of the substrate based on the captured image.

9. The substrate transport robot system according to any one of claims 1 to 3, wherein the control unit detects the state of the substrate based on the image captured by the imaging unit using a trained model generated by machine learning.

10. the irradiation unit irradiates the detection light including first detection light and second detection light having different line shapes; 4. The substrate transport robot system of claim 2, wherein the control unit detects a state of the substrate based on the one captured image including the first detection light and the second detection light generated by multiple captures by the imaging unit.

11. the robot is disposed in a transfer chamber in which the substrate is transferred to a substrate storage container in which the substrate is stored; the irradiation unit is disposed above the robot within the transfer chamber and irradiates the main surface of the substrate with the detection light; the imaging unit is disposed above the robot within the transfer chamber, and captures an image of the detection light reflected by the main surface of the substrate; 4. The substrate transport robot system according to claim 1, wherein the control unit detects a state of the substrate based on the image captured inside the transport chamber.

12. An adjustment device that adjusts the orientation of the substrate to a predetermined direction is further provided, 4. The substrate transport robot system according to claim 1, wherein the control unit controls an operation of the adjustment device using a state of the substrate detected based on the captured image.

13. the robot includes a substrate holding hand that holds the substrate; The control unit is A robot control unit that controls the transport operation of the robot, Detecting at least one of a positional deviation and an orientation deviation of the substrate with respect to the substrate holding hand based on the detected state of the substrate; 4. The substrate transport robot system according to claim 1, wherein at least one of a detected deviation in position and a detected deviation in orientation of the substrate is corrected during a transport operation of the robot.

14. capturing an image of the substrate held by a robot that transports the substrate, and capturing an image of detection light having a predetermined shape reflected on a main surface of the substrate; A substrate detection method, comprising: detecting a state of the substrate based on an image captured by the detection light.

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