Mounting device, method for manufacturing semiconductor device, and method for controlling mounting device

Abstract

To provide a technique that can improve the accuracy of a mounting position.SOLUTION: A mounting device comprises: a head that is provided with a collet; a driving unit that has a servo motor and a servo driver, and raises and lowers the head; a valve that allows the collet to suck in and release a die; and a control unit that controls the servo driver. The servo driver is configured to control the servo motor on the basis of an instruction from the control unit and encoder information from the servo motor, and control opening and closing of the valve on the basis of information set by the control unit and the encoder information.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present disclosure relates to a mounting apparatus and is applicable, for example, to a die bonder equipped with a servo motor driver. [Background technology]

[0002] As one step in the manufacturing process of a semiconductor device, in a die bonding device (semiconductor manufacturing device, mounting device) such as a die bonder, a die separated from a wafer is picked up by adsorption with a collet, and the picked up die is bonded to a substrate. In this die bonder, the pickup head and bond head may be raised and lowered by, for example, a servo motor (for example, JP 2021-136732 A). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2021-136732 A Summary of the Invention [Problem to be solved by the invention]

[0004] Depending on the height position of the head when the vacuum is supplied to the collet, the die may be adsorbed out of alignment, which may reduce the die bond position accuracy (mounting position accuracy).

[0005] An object of the present disclosure is to provide a technique capable of improving mounting position accuracy. Other objects and novel features will become apparent from the description of this specification and the accompanying drawings. [Means for solving the problem]

[0006] A brief summary of representative aspects of this disclosure is as follows. That is, the mounting device includes a head on which a collet is provided, a drive unit having a servo motor and a servo driver and for raising and lowering the head, a valve for attracting and releasing the die by the collet, and a control device for controlling the servo driver. The servo driver is configured to control the servo motor based on an instruction from the control device and encoder information from the servo motor, and to control opening and closing of the valve based on information set by the control device and the encoder information. Effect of the Invention

[0007] According to the present disclosure, it is possible to improve mounting position accuracy. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic top view showing an example of the configuration of a die bonder in an embodiment. [Diagram 2] FIG. 2 is a diagram for explaining a schematic configuration when viewed from the direction of arrow A in FIG. [Diagram 3] FIG. 3 is a block diagram showing a schematic configuration of a control system of the die bonder shown in FIG. [Figure 4] FIG. 4 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in FIG. [Diagram 5] FIG. 5 is a schematic cross-sectional view of the bond head shown in FIG. [Figure 6] FIG. 6 is a block diagram for explaining the control of the lifting and lowering operation of the bond head shown in FIG. [Figure 7] FIG. 7 is a diagram showing an outline of the operation control of the solenoid valve control section. [Figure 8] FIG. 8 is a block diagram for explaining the control of the lifting and lowering operation of the bond head in the comparative example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, the embodiments and modifications will be described with reference to the drawings. However, in the following description, the same components are given the same reference numerals and repeated description may be omitted. Note that, in order to make the description clearer, the width, thickness, shape, etc. of each part may be shown in a schematic manner compared to the actual embodiment. Furthermore, the dimensional relationship between each element, the ratio of each element, etc. do not necessarily match between multiple drawings.

[0010] The configuration of a die bonder as an embodiment of a mounting device will be described with reference to Figures 1 and 2. Figure 1 is a schematic top view showing an example of the configuration of a die bonder in an embodiment. Figure 2 is a diagram illustrating the schematic configuration as seen from the direction of arrow A in Figure 1.

[0011] The die bonder 1 broadly comprises a wafer supply unit 10, a pickup unit 20, an intermediate stage unit 30, a bonding unit 40, a transport unit 50, a substrate supply unit 60, a substrate unloading unit 70, and a control unit (control device) 80. The Y2-Y1 direction is the front-rear direction of the die bonder 1, the X2-X1 direction is the left-right direction, and the Z1-Z2 direction is the up-down direction. The wafer supply unit 10 is disposed on the front side of the die bonder 1, and the bonding unit 40 is disposed on the rear side.

[0012] The wafer supply section 10 includes a wafer cassette lifter 11, a wafer holder 12, a peeling unit 13, and a wafer recognition camera 14.

[0013] A wafer cassette lifter 11 moves a wafer cassette (not shown), in which a plurality of wafer rings WR are stored, up and down to the wafer transport height. A wafer correction chute (not shown) aligns the wafer rings WR supplied from the wafer cassette lifter 11. A wafer extractor (not shown) removes the wafer rings WR from the wafer cassette and supplies them to the wafer holder 12, or removes them from the wafer holder 12 and stores them in the wafer cassette.

[0014] A wafer W is attached (pasted) onto a dicing tape DT, and the wafer W is divided into a number of dies D. The dicing tape DT is held by a wafer ring WR. The wafer W is, for example, a semiconductor wafer or a glass wafer, and the dies D are semiconductor chips or glass chips. A film-like adhesive material DF called a die attach film (DAF) may be attached between the wafer W and the dicing tape DT. The adhesive material DF hardens when heated.

[0015] The wafer holder 12 is moved in the X1-X2 and Y1-Y2 directions by a drive unit (not shown), and moves the die D to be picked up to the position of the peeling unit 13. The wafer holder 12 also rotates the wafer ring WR in the XY plane by a drive unit (not shown). The peeling unit 13 is moved in the vertical direction by a drive unit (not shown). The peeling unit 13 peels the die D from the dicing tape DT.

[0016] The wafer recognition camera 14 recognizes the pick-up position of the die D to be picked up from the wafer W and inspects the surface of the die D.

[0017] The pickup unit 20 has a pickup head 21 and a pickup head table 23. The pickup head 21 is provided with a collet unit 22 that suction-holds the peeled die D at its tip. The pickup head 21 picks up the die D from the wafer supply unit 10 and places it on the intermediate stage 31. The pickup head table 23 moves the pickup head 21 in the Z1-Z2 direction, the Y1-Y2 direction, and the X1-X2 direction. The pickup head table 23 may rotate the pickup head 21.

[0018] The intermediate stage unit 30 has an intermediate stage 31 on which the die D is placed, and a stage recognition camera 34 for recognizing the die D on the intermediate stage 31. The intermediate stage 31 has suction holes that adsorb the placed die D. The placed die D is temporarily held on the intermediate stage 31. The intermediate stage 31 is both a placement stage on which the die D is placed, and a pick-up stage on which the die D is picked up.

[0019] The bonding section 40 has a bond head 41, a bond head table 43, a substrate recognition camera 44, and a bond stage 46. The bond head 41 is provided with a collet section 42 that holds the die D by suction at its tip. The bond head table moves the bond head 41 in the Z1-Z2 direction, the Y1-Y2 direction, and the X1-X2 direction. The bond head table 43 may rotate the bond head 41. The substrate recognition camera 44 captures an image of the substrate S and recognizes the bond position. Here, the substrate S may be, for example, a wiring substrate, a lead frame, or a glass substrate. The substrate S has a plurality of product areas (hereinafter, referred to as package areas P) that will eventually become one package. The substrate S also has a position recognition mark (not shown) for the package area P. The bond stage 46 is raised when the die D is placed on the substrate S, and supports the substrate S from below. The bond stage 46 has a suction port (not shown) for vacuum-adsorbing the substrate S, and is capable of fixing the substrate S. The bond stage 46 has a heating unit (not shown) for heating the substrate S.

[0020] With this configuration, the bond head 41 corrects the pick-up position and attitude based on the imaging data of the stage recognition camera 34, and picks up the die D from the intermediate stage 31. Then, the bond head 41 bonds the die D onto the package area P of the substrate S based on the imaging data of the substrate recognition camera 44, or bonds the die D by stacking it on top of a die already bonded onto the package area P of the substrate S.

[0021] The transport section 50 has a transport claw 51 that grips and transports the substrate S, and a transport lane 52 along which the substrate S moves. The substrate S moves in the X1 direction by driving a nut (not shown) of the transport claw 51 provided on the transport lane 52 by a ball screw (not shown) provided along the transport lane 52. With this configuration, the substrate S moves from the substrate supply section 60 along the transport lane 52 to the bonding position, and after bonding, moves to the substrate unloading section 70 and hands the substrate S over to the substrate unloading section 70.

[0022] The substrate supplying section 60 removes the substrate S, which has been stored in the transport jig and carried in, from the transport jig and supplies it to the transporting section 50. The substrate unloading section 70 stores the substrate S transported by the transporting section 50 in the transport jig.

[0023] Next, the control unit 80 will be described with reference to Fig. 3. Fig. 3 is a block diagram showing a schematic configuration of a control system of the die bonder shown in Fig. 1.

[0024] The control system 8 includes a control unit (control device) 80, a drive unit 86, a signal unit 87, and an optical system 88. The control unit 80 is broadly configured as a computer including a control and arithmetic unit 81 mainly configured with a CPU (Central Processing Unit), a storage unit 82, an input / output unit 83, a bus line 84, and a power supply unit 85. The storage unit 82 has a main storage unit 82a and an auxiliary storage unit 82b. The main storage unit 82a is configured with a RAM (Random Access Memory) that stores processing programs and the like. The auxiliary storage unit 82b is configured with an HDD (Hard Disk Drive) or SSD (Solid State Drive) that stores control data and image data necessary for control. In addition, an external storage device can be connected to the control unit 80.

[0025] The input / output device 83 includes a monitor 83a for displaying the device status and information, a touch panel 83b for inputting an operator's instruction, a mouse 83c for operating the monitor 83a, and an image capture device 83d for capturing image data from the optical system 88. The input / output device 83 further includes a motor control device 83e and an I / O signal control device 83f. The motor control device 83e controls the drive unit 86 for the XY table (not shown) of the wafer supply unit 10, the pickup head table 23, the bond head table 43, and the like. The I / O signal control device 83f captures signals from various sensors of the signal unit 87, and controls switches and volumes for controlling the brightness of the lighting device of the signal unit 87, valves for controlling vacuum suction, and the like. The optical system 88 includes a wafer recognition camera 14, a stage recognition camera 34, and a substrate recognition camera 44. The wafer recognition camera 14, the stage recognition camera 34, and the substrate recognition camera 44 convert light intensity and color into numerical values. The control / arithmetic unit 81 takes in necessary data via a bus line 84, performs calculations, controls the pickup head 21 and the like, and sends information to a monitor 83a and the like.

[0026] The control unit 80 stores image data captured by the wafer recognition camera 14, the stage recognition camera 34, and the substrate recognition camera 44 in the storage device 82 via the image capture device 83d. Using software programmed based on the stored image data, the control and calculation device 81 is used to position the package area P of the die D and the substrate S, and to perform an appearance inspection of the die D and the substrate S. Based on the positions of the package area P of the die D and the substrate S calculated by the control and calculation device 81, the software moves the drive unit 86 via the motor control device 83e. Through this process, the die on the wafer is positioned, and the pickup head table 23 and the bond head table 43 are operated to bond the die D onto the package area P of the substrate S.

[0027] The control unit 80 can be configured by installing the above-mentioned program stored in the external storage device to the computer. The external storage device includes, for example, a HDD, a USB memory, an SSD, etc. The auxiliary storage device 82b and the external storage device are configured as computer-readable recording media. Hereinafter, these are collectively referred to simply as recording media. When the term recording media is used in this specification, it may include only the auxiliary storage device 82b alone, only the external storage device alone, or both. Note that the provision of programs and data to the computer and the provision of programs and data from the computer to the external device may be performed using communication means such as the Internet or a dedicated line, without using an external storage device.

[0028] A part of the manufacturing process of a semiconductor device using the die bonder 1 (a method for manufacturing a semiconductor device) will be described with reference to Fig. 4. Fig. 4 is a flowchart showing a method for manufacturing a semiconductor device using the die bonder shown in Fig. 1. In the following description, the operation of each part constituting the die bonder 1 is controlled by a control unit 80.

[0029] (Wafer loading process: process S1) The wafer cassette containing the wafer ring WR is loaded into the wafer cassette lifter 11. The loaded wafer ring WR is then supplied (carried) to the wafer holder 12.

[0030] (Substrate loading process: Process S2) The transport jig storing the substrate S is inserted into the substrate supply section 60. In the substrate supply section 60, the substrate S stored in the transport jig is removed from the transport jig. Then, the substrate S is supplied (carried in) to the bonding section 40 via the transport section 50.

[0031] (Pickup process: process S3) After step S1, the wafer holder 12 is moved so that the desired die D can be picked up from the dicing tape DT. The die D is photographed by the wafer recognition camera 14, and the die D is positioned and its surface inspected based on the image data acquired by photographing. The image data is processed to calculate the amount of deviation (X, Y, and θ directions) of the die D on the wafer holder 12 from the die position reference point of the die bonder, and the die is positioned. Note that the die position reference point is previously held at a predetermined position of the wafer holder 12 as the initial setting of the device. The image data is processed to inspect the surface of the die D.

[0032] The positioned die D is peeled off from the dicing tape DT by the peeling unit 13 and the pickup head 21. The die D peeled off from the dicing tape DT is attracted to and held by a collet portion 22 provided on the pickup head 21, and is transported to and placed on the intermediate stage 31.

[0033] The die D on the intermediate stage 31 is photographed by the stage recognition camera 34, and the positioning and surface inspection of the die D are performed based on the image data acquired by photographing. The image data is subjected to image processing to calculate the amount of deviation (X, Y, and θ directions) of the die D on the intermediate stage 31 from the die position reference point of the die bonder, and positioning is performed. Note that the die position reference point is previously held at a predetermined position of the intermediate stage 31 as the initial setting of the device. The image data is subjected to image processing to perform surface inspection of the die D.

[0034] The pickup head 21 that transported the die D to the intermediate stage 31 is returned to the wafer supply unit 10. The next die D is peeled off from the dicing tape DT according to the above-mentioned procedure, and thereafter, the dies D are peeled off one by one from the dicing tape DT according to the same procedure.

[0035] (Bond process: Process S4) The substrate S is transported to the bond stage 46 by the transport unit 50. The substrate S placed on the bond stage 46 is imaged by the substrate recognition camera 44, and image data is acquired by the image capture. The image data is processed to calculate the amount of deviation (X, Y, and θ directions) of the substrate S from the substrate position reference point of the die bonder 1. Note that the substrate position reference point is previously held at a predetermined position of the bonding unit 40 as the initial setting of the device.

[0036] The suction position of the bond head 41 is corrected based on the deviation amount of the die D on the intermediate stage 31 calculated in step S3, and the die D is suctioned by the collet portion 42. The bond head 41 that has suctioned the die D from the intermediate stage 31 bonds the die D to a predetermined position of the substrate S supported by the bond stage 46. The substrate recognition camera 44 photographs the die D bonded to the substrate S, and based on the image data acquired by photographing, an inspection is performed to determine whether the die D has been bonded to the desired position (inspection of the relative position between the die D and the substrate S), etc.

[0037] After bonding the die D to the substrate S, the bond head 41 is returned to the intermediate stage 31. Following the procedure described above, the next die D is picked up from the intermediate stage 31 and bonded to the substrate S. This is repeated until a die D is bonded to every package area P of the substrate S.

[0038] (Substrate unloading process: Process S5) The transfer section 50 transfers the substrate S to which the die D is bonded from the bonding section 40 to the substrate unloading section 70. In the substrate unloading section 70, the substrate S is removed and stored in a transfer jig, and then the substrate S is unloaded. The transfer jig in which the substrate S is stored is unloaded from the die bonder 1.

[0039] As described above, the die D is mounted on the substrate S and is carried out from the die bonder 1. Thereafter, for example, a transport jig storing the substrate S on which the die D is mounted is transported to a wire bonding process, and the electrodes of the die D are electrically connected to the electrodes of the substrate S via Au wires or the like. Then, the substrate S is transported to a molding process, and the die D and the Au wires are sealed with molding resin (not shown), thereby completing a semiconductor package.

[0040] In the case of stacked bonding, following the wire bonding process, a transport jig on which a substrate S on which a die D is mounted is loaded and stored is carried into a die bonder, where the die D is stacked on the die D mounted on the substrate S, and after being carried out of the die bonder, the die D is electrically connected to the electrodes of the substrate S via Au wires in a wire bonding process. The dies D above the second stage are peeled off from the dicing tape DT by the above-mentioned method, then transported to the bonding section and stacked on the dies D. After the above process is repeated a predetermined number of times, the substrate S is transported to a molding process, where the multiple dies D and Au wires are sealed with molding resin (not shown) to complete a stacked package.

[0041] The structure of the bond head 41 will be described with reference to Fig. 5. Fig. 5 is a schematic cross-sectional view of the bond head shown in Fig. 1.

[0042] Bond head 41 is connected to Z drive unit 47. Bond head 41 is provided with collet unit 42. Collet unit 42 has collet 421 made of an elastic body such as rubber at its tip and collet holder 422 for mounting collet 421. Z drive unit 47 is moved in the Y1-Y2 directions by the Y drive unit.

[0043] The Z driving unit 47 has a stage 471 mounted on the Y driving unit, and a Z axis 473 that moves (raises and lowers) a guide rail 472 fixed to the stage 471. The stage 471 is provided with an elevation driving unit 100, which will be described later. The Z axis 473 is raised and lowered by the elevation driving unit 100 along the stage 471 arranged in the vertical direction.

[0044] A suction hole 421v having one open end is provided on the lower end surface of the collet 421. The other end of the suction hole 421v communicates with a suction hole 422v of the collet holder 422, the suction hole 411 of the bond head 41, the suction cable 412, and the pipe 481.

[0045] Pipe 481 also communicates with a vacuum supply source (not shown). Pipe 481 is provided with a flow rate sensor 482 that detects the flow rate of air suction by the vacuum supply source, and a valve 483. Pipe 481 is connected to pipe 484, which communicates with an air supply source (not shown). Pipe 484 is provided with a valve 485. The vacuum source and air supply source may be included in vacuum suction system 48 of die bonder 1, or may be provided outside die bonder 1. When using a vacuum supply source and air supply source in a factory, it is preferable to provide a pressure regulator in vacuum suction system 48. Valves 483 and 485 are composed of solenoid valves.

[0046] By closing valve 485 and opening valve 483, air is sucked in through pipe 481, suction cable 412, suction hole 411, suction hole 422v, and suction hole 421v, and a suction force is generated on the lower end surface of collet 421. By closing valve 483 and opening valve 485, air is blown out through pipe 481, suction cable 412, suction hole 411, suction hole 422v, and suction hole 421v.

[0047] The control of the lifting and lowering operation of the bond head will be described with reference to Fig. 6. Fig. 6 is a block diagram for explaining the control of the lifting and lowering operation of the bond head shown in Fig. 5.

[0048] The lifting and lowering drive unit 100 is composed of, for example, a servo motor (SM) 101 equipped with an encoder (EN) 102, a servo driver (SD) 103 that controls the servo motor 101, a ball screw, etc. When a current is applied to the servo motor 101, the servo motor 101 rotates, and the bond head 41 is driven via the rotation of the ball screw.

[0049] The encoder 102 detects the rotation state of the servo motor 101. The encoder 102 includes, for example, a disk with many slits according to the phase to be detected, a light-emitting element arranged on one side of the disk facing the slits, and a light-receiving element arranged on the other side of the disk for detecting light that has passed through the slits. When the disk rotates in sync with the rotation of the servo motor 101, the slits pass in front of the light-emitting element one after another, and an electrical pulse is generated according to the on / off state of the light detected by the light-receiving element. The encoder 102 detects the Z phase, the A phase, and the B phase, but can also detect other signals as necessary.

[0050] Phase A and phase B are mutually shifted in phase by 1 / 4 pitch and are used to detect the rotation angle and direction of servo motor 101. Phase Z is a signal that is generated once per rotation of servo motor 101 and is used to recognize the rotation speed and absolute position of servo motor 101. Based on these signals input from encoder 102, servo driver 103 controls servo motor 101 to move bond head 41 to a predetermined position. In this specification, the above-mentioned phase Z, phase A, phase B, and other signals related to the rotation of servo motor 101 are collectively referred to as encoder information (ENI).

[0051] The servo driver 103 includes a drive unit that supplies a drive current to the servo motor 101 and a drive control unit 110 that controls the drive unit. The servo driver 103 further includes a solenoid valve drive control unit 120 having a solenoid valve control unit (OC) 120a and a solenoid valve drive unit (OB) 120b. The solenoid valve control unit (OC) 120a controls the solenoid valve drive unit (OB) based on the encoder information from the encoder 102 and a set value from the I / O signal control device 83f of the control unit 80. The solenoid valve control unit (OC) 120a and the drive control unit 110 are composed of, for example, a control circuit including a CPU and a memory that stores a program executed by the CPU. The solenoid valve drive unit (OB) 120b passes or cuts off a current to the solenoids of the valves 483 and 485. The solenoid valve drive unit (OB) 120b is provided in the I / O unit of the servo driver 103.

[0052] The motor control device 83e includes a motion controller 130 and controls the servo driver 103. The motion controller 130 includes, for example, an ideal waveform generating unit and a command waveform generating unit that perform processing to generate an ideal command waveform. The motion controller 130 may include a DAC (Digital to Analog Converter).

[0053] The motion controller 130 and the servo driver 103 are in a closed loop control. Therefore, the speed control is performed by the drive control unit 110 of the servo driver 103 using the current command position and the actual position and actual speed obtained from the encoder information. The ideal waveform generating unit and the command waveform generating unit are composed of, for example, a CPU and a memory that stores the programs executed by the CPU.

[0054] The control of the valve 483 by the solenoid valve control unit (OC) 120a will be described with reference to Fig. 7. Fig. 7 is a diagram showing an outline of the operation control of the solenoid valve control unit. MRD in Fig. 7 indicates the rotation direction of the servo motor 101.

[0055] (Step S11) The I / O signal control device 83f of the control unit 80 sets an output start position (OSP) and an output stop position (OEP) in the solenoid valve control unit (OC) 120a. Here, the output start position is the position (height) of the bond head 41 where the valve 483 serving as the suction solenoid valve is opened (turned ON). The output stop position is the position (height) of the bond head 41 where the valve 483 serving as the suction solenoid valve is closed (turned OFF).

[0056] (Step S12) The I / O signal controller 83f supplies a flag (FLG) indicating the process type of the bond head 41 to the solenoid valve controller (OC) 120a. The flag (FLG) is set to "1" during a pickup operation (pickup cycle) and to "0" during a bond operation (release cycle). The I / O signal controller 83f determines the process type of the bond head 41 based on the XY coordinates (horizontal position) of the bond head 41. In other words, the flag (FLG) is set based on the XY coordinates of the bond head 41.

[0057] (Step S13) During the pick-up operation, the solenoid valve control unit (OC) 120a judges whether the bond head 41 has reached the output start position (OSP) while it is descending based on the encoder information (ENI). During the bond head 41 is descending, for example, the servo motor 101 of the lifting drive unit 100 rotates in the negative direction. Furthermore, when the flag (FLG) is "1" during the pick-up operation, the solenoid valve control unit (OC) 120a changes the output of the control signal (SOVAC) to the solenoid valve drive unit (OB) 120b when it judges that the output start position (OSP) has been reached. The control signal (SOVAC) is changed from non-active to active. The solenoid valve drive unit (OB) 120b passes a current through the valve 483 to turn on the solenoid valve. As a result, the collet unit 42 provided on the bond head 41 starts suction.

[0058] (Step S14) The collet part 42 lands on the die D and adsorbs the die D. Then, the bond head 41 starts to rise. Even if the bond head 41 reaches the output start position (OSP) or the output stop position (OEP) while rising, the output of the control signal (SOVAC) does not change because the flag (FLG) is "0".

[0059] When the bond head 41 has risen to a predetermined position, the bond head 41 starts to move in the Y1 direction. In other words, when the motor control device 83e determines that the bond head 41 has risen to a predetermined position, the Y drive unit starts to move the bond head 41 in the Y1 direction.

[0060] After the pickup, the I / O signal controller 83f updates the flag (FLG) from "1" to "0."

[0061] (Step S15) When the motor control device 83e determines that the bond head 41 has reached the bonding coordinates, it causes the servo motor 101 to rotate in the negative direction by the servo driver 103. As a result, the bond head 41 starts to descend.

[0062] When the solenoid valve control unit (OC) 120a determines based on the encoder information (ENI) and the flag (FLG) that the bond head 41 has reached the output stop position (OEP) during descent, it changes the output of the control signal to the solenoid valve drive unit (OB) 120b. The control signal (SOVAC) is changed from active to inactive. The solenoid valve drive unit (OB) 120b cuts off the current to the valve 483 to turn off the solenoid valve. This causes the collet member 42 provided on the bond head 41 to stop suction. Note that the die D is attracted to the collet member 42 for a while after suction is stopped. The die D attracted to the collet member 42 lands on the substrate S and bonding of the die D is performed.

[0063] Thereafter, the motor control device 83e raises the bond head 41 again and causes it to proceed to the pick-up operation. After bonding is performed and before the pick-up operation, the I / O signal control device 83f updates the flag (FLG) from "0" to "1".

[0064] In order to explain the effect of this embodiment, a technique (comparative example) that the present inventors have examined prior to the present disclosure will be described with reference to Fig. 8. Fig. 8 is a block diagram for explaining the control of the lifting and lowering operation of the bond head in the comparative example.

[0065] The I / O signal control device 83f of the control unit 80 has a solenoid valve control unit (OC) 220. The solenoid valve control unit (OC) 220 reads out encoder information (ENI), which is position information of the up and down axis of the bond head 41, from the encoder 102 via the servo driver 203 by polling using software. Then, when the bond head 41 is at the suction start position, the solenoid valve control unit (OC) 220 outputs a control signal to the solenoid valve drive board (OB) 230 to open the valve 483. When the bond head 41 is at the suction stop position, the solenoid valve control unit (OC) 220 outputs a control signal to the solenoid valve drive board (OB) 230 to close the valve 483. The solenoid valve drive board (OB) 230 supplies and stops current to the valve 483 to turn the valve 483 ON / OFF.

[0066] Polling by software causes variations in operation due to the CPU usage rate of the I / O signal control device 83f and delays in the response of communication with the servo driver 203. The accuracy of the timing of suction of the die D when picking up the die D affects the mounting accuracy.

[0067] In the embodiment, a signal is sent directly from the I / O unit of the servo driver 103 to the valve 483 for control, so that the variation in time lag caused by a delay in the communication response with the servo driver 103 is reduced. This makes it possible to reduce the variation in the suction start timing.

[0068] In the embodiment, since the position information of the encoder is controlled without being passed to the upper I / O signal control device 83f, it is possible to reduce the CPU load of the I / O signal control device 83f.

[0069] In the embodiment, the solenoid valve drive board 230 between the control unit 80 and the valve 483 is not necessary, which makes it possible to reduce the cost of the product.

[0070] In the embodiment, the variation in the timing at which the die D starts to be sucked when it is picked up is reduced, so that the mounting accuracy can be improved.

[0071] <Modification> Below, some representative modified examples of the embodiment are exemplified. In the following description of the modified examples, the same reference numerals as those in the above-mentioned embodiment may be used for parts having the same configuration and function as those described in the above-mentioned embodiment. The description of such parts may be appropriately cited within the scope of technical inconsistency. Furthermore, a part of the above-mentioned embodiment and all or a part of the multiple modified examples may be appropriately applied in a composite manner within the scope of technical inconsistency.

[0072] (First Modification) In the embodiment, an example has been described in which one bond head 41 is provided on the bond head table 43, but multiple bond heads that are each independently controlled may be provided. When controlling simultaneous pickup using multiple heads, the suction timing tends to vary as the number of bond heads increases in the comparative example. However, in this embodiment, it is possible to reduce the variation in the suction timing.

[0073] (Second Modification) In the embodiment, the die D is attracted to the collet part 42 for a while after suction is stopped at the output stop position (OEP). Therefore, there is a possibility that variation occurs in the timing of releasing the die D. The timing of discharging the air (releasing the vacuum state) by turning on the valve 485 may be controlled.

[0074] (Third Modification) In the embodiment, an example has been described in which the solenoid valve control unit (OC) 120a performs control based on the encoder information (ENI), but the control may also be performed using position information obtained from a linear scale used in counter control or the like.

[0075] The disclosure made by the present inventors has been specifically described above based on embodiments and modified examples. However, it goes without saying that the present disclosure is not limited to the above-described embodiments and modified examples, and various modifications are possible.

[0076] For example, although the embodiment has been described taking a bond head as an example, the present invention can also be applied to a pick-up head or a flip pick-up head, which will be described later. The bond head, pick-up head and flip pick-up head are collectively referred to as heads.

[0077] In the embodiment, an example in which a die attach film is used has been described, but a preform section that applies adhesive to a substrate may be provided, eliminating the need for a die attach film. The preform section includes a preform head that applies a paste adhesive and a preform table that drives the preform head in vertical and horizontal directions.

[0078] In the embodiment, a die bonder has been described in which a pick-up head picks up a die from a wafer supply unit, places it on an intermediate stage, and bonds the die placed on the intermediate stage to a substrate with a bond head. However, the present invention is not limited to this, and can also be applied to a die bonder in which a bond head picks up a die from a wafer supply unit, and bonds it to a substrate.

[0079] For example, the present invention can also be applied to a die bonder that does not have an intermediate stage and a pick-up head, and that bonds a die from a wafer supply section to a substrate with a bond head.

[0080] The present invention can also be applied to a flip chip bonder that does not have an intermediate stage, picks up a die from a wafer supply unit, turns the flip pick-up head upside down, transfers the die to the bond head, and bonds the die to a substrate using the bond head.

[0081] In the embodiment, a die bonder has been described as an example, but the present invention can also be applied to a mounting device that picks up a workpiece by suction and places the picked-up workpiece on a substrate or the like. [Explanation of symbols]

[0082] 1. Die bonder (mounting device) 41 Bond head (head) 421···Collet 80... Control unit (control device) 100 Lifting drive unit (drive unit) 101 Servo motor 103 Servo driver 483 Valve

Claims

1. a head in which the collet is provided; a drive unit having a servo motor and a servo driver for raising and lowering the head; a valve for adsorbing and releasing the die by the collet; A control device for controlling the servo driver; Equipped with The servo driver is an implementation device configured to control the servo motor based on instructions from the control device and encoder information from the servo motor, and to control the opening and closing of the valve based on information set by the control device and the encoder information.

2. In the mounting device of claim 1, The control device is a mounting device configured to set, in the servo driver, an output start position that is the height of the head at which the valve is turned ON and an output stop position that is the height of the head at which the valve is turned OFF.

3. In the mounting device of claim 2, The mounting device is configured such that the control device sets a flag in the servo driver that indicates a processing type, whether the head is performing a pick-up operation or a bond operation.

4. In the mounting device of claim 3, The mounting device is configured such that the control device determines a processing type of the head based on a horizontal position of the head and sets the flag.

5. In the mounting device of claim 2, The mounting device is configured such that the control device sets a flag indicating a type of processing, whether the head is performing a pick-up operation or a bond operation, based on a horizontal position of the head.

6. In the mounting device of claim 3, The mounting device is configured such that, when the flag indicates a pickup operation, the servo driver determines whether the head has reached the output start position while descending based on the encoder information.

7. 7. The mounting device according to claim 6, The mounting device is configured such that the servo driver turns on the valve when it determines that the head has reached the output start position.

8. In the mounting device of claim 3, The mounting device is configured such that, when the flag indicates a bonding operation, the servo driver determines whether the head has reached the output stop position while descending based on the encoder information.

9. The mounting device according to claim 8, The mounting device is configured such that the servo driver turns off the valve when it determines that the head has reached the output stop position.

10. A step of carrying a substrate into the mounting apparatus of claim 1; picking up a die with the head and bonding the picked die to the substrate; A method for manufacturing a semiconductor device having the above structure.

11. A control method for a mounting device including: a valve that adsorbs and releases a workpiece using a collet provided on a head; a drive unit that has a servo motor and a servo driver and that raises and lowers the head; and a control device that controls the servo driver, comprising: The servo driver includes: Controlling the servo motor based on an instruction from the control device and encoder information from the servo motor; A control method for a mounting device that controls opening and closing of the valve based on information set by the control device and the encoder information.

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