Method for processing workpiece

Abstract

To provide a method for processing a workpiece that is capable of reducing a burden on a worker.SOLUTION: A method for processing a workpiece includes first automatic processing in which a control unit automatically performs an alignment step for imaging one surface of the workpiece transferred from a cassette onto a holding table and detecting the position of a planned division line from a captured image, a processing step for processing, along a planned division line, the workpiece for which the planned division line could be detected in the alignment step, and a cleaning step for cleaning the workpiece on which the processing step has been performed and an error workpiece for which no planned division line has been detected in the alignment step and thus the processing step has not been performed, and second automatic processing in which the control unit automatically performs at least the alignment step and the processing step out of the first automatic processing again on the error workpiece on which the cleaning step has been performed after the first automatic processing is performed.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a method for machining a workpiece. [Background technology]

[0002] A fully automatic operation is performed in which the control unit of the processing device automatically performs the alignment step of detecting the division line of the workpiece, the processing step of processing the workpiece, the cleaning step of cleaning the workpiece, and the storage step of storing the cleaned workpiece in a cassette. If an error occurs in the alignment step due to a foreign object attached to the workpiece, the workpiece is stored in the cassette without being processed in the processing step. In such a processing method, the operator manually handles the workpiece that was not processed due to the error.

[0003] Also, a processing position detection method has been implemented in which a dividing line formed on a workpiece is recognized based on the position of a pattern formed on the surface of the workpiece (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5602548 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the conventional technology, an error in the alignment step may be caused by foreign matter attached to the workpiece. In this case, alignment may be successful if the alignment step is performed again after the foreign matter attached to the workpiece is removed in a cleaning step. However, it is inefficient for an operator to manually apply the alignment step again to a workpiece that has failed in the alignment step. Therefore, there is a problem to be solved, which is to reduce the burden on the operator.

[0006] The present invention has been made in view of the above-mentioned points, and an object of the present invention is to provide a method for processing a workpiece that can reduce the burden on an operator. [Means for solving the problem]

[0007] The method for processing a workpiece of the present invention is a method for processing a workpiece having a plurality of device regions defined by a plurality of planned division lines formed on one side of the workpiece in a processing apparatus equipped with a cassette for accommodating the workpiece, a holding table, a processing unit, a cleaning unit, and a transport arm for transporting the workpiece between each unit, the method including: processing the workpiece along the planned division lines, the workpiece having a plurality of device regions defined by the planned division lines formed on one side of the workpiece transported from the cassette to the holding table; an alignment step for imaging one side of the workpiece transported from the cassette to the holding table, and detecting the position of the planned division lines from the image; A first automatic process is performed automatically by a control unit, which includes a processing step of processing the detected workpiece along the planned division line, and a cleaning step of cleaning the workpiece on which the processing step has been performed and an error workpiece on which the planned division line cannot be detected in the alignment step and the processing step has not been performed; and after the first automatic process is performed, the control unit again automatically performs at least the alignment step and the processing step of the first automatic process on the error workpiece on which the cleaning step has been performed.

[0008] Furthermore, if the control unit cannot detect the planned dividing line in the alignment step of the first automatic process, the control unit may continue the first automatic process on another workpiece.

[0009] Moreover, the second automatic processing may be performed after the first automatic processing has been performed on all of the workpieces contained in the cassette. Effect of the Invention

[0010] According to the present invention, it is possible to provide a method for processing a workpiece that can reduce the burden on an operator. [Brief description of the drawings]

[0011] [Figure 1] 1 is a perspective view showing an example of a processing apparatus for carrying out a processing method for a workpiece according to an embodiment of the present invention; [Diagram 2] 1 is an example of a flowchart of a processing process performed by a processing method of a processing device. [Diagram 3] 13 is an example of a flowchart illustrating a first automatic process. [Figure 4] 4 is an example of an image captured by a camera in an alignment step of the first automatic process. [Diagram 5] 13 is an example of a flowchart illustrating a second automatic process. [Figure 6] 11 is an example of an image captured by a camera in an alignment step of the second automatic process. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] A method for processing a workpiece according to this embodiment will be described with reference to Figs. 1 to 6. Fig. 1 is a perspective view showing an example of a processing device for carrying out the method for processing a workpiece according to this embodiment. Fig. 2 is an example of a flowchart of processing carried out by the processing method of the processing device. Fig. 3 is an example of a flowchart showing a first automatic processing. Fig. 4 is an example of an image acquired by a camera in an alignment step of the first automatic processing. Fig. 5 is an example of a flowchart showing a second automatic processing. Fig. 6 is an example of an image acquired by a camera in an alignment step of the second automatic processing.

[0013] The X-axis, Y-axis, and Z-axis directions in each diagram are perpendicular to each other. The X-axis and Y-axis directions are nearly horizontal, and the Z-axis direction is up-down (vertical). In each diagram, of the two arrows indicating the X-axis direction, the -X side is the left, and the +X side is the right. Of the two arrows indicating the Y-axis direction, the -Y side is the front, and the +Y side is the rear. Of the two arrows indicating the Z-axis direction, the +Z side is the up, and the -Z side is the down.

[0014] The method for processing a workpiece according to the present embodiment is carried out by a processing device that processes a workpiece. The processing device processes a workpiece such as a semiconductor wafer. In the present embodiment, the processing device is described as a cutting device, but is not limited to this. The processing device can carry out the method for processing a workpiece in a grinding device, a polishing device, a grinding and polishing device, a plasma processing device, a laser processing device, a cutting tool cutting device, a tape application device, a cleaning device, a film formation device, an inspection device, a tape peeling device, or the like, in addition to a cutting device.

[0015] 1 functions as a cutting device including cutting units 11 and 12 that cut a workpiece 51. Each of the cutting units 11 and 12 includes a cutting blade 47, and cuts the workpiece 51 using the cutting blade 47. Each of the cutting units 11 and 12 is an example of a processing unit.

[0016] The processing device 10 of this embodiment is equipped with two cutting units 11 and 12 and can simultaneously process two locations on the workpiece 51, but the number of cutting units is not limited to two and may be one or three or more. In other words, it is sufficient to have at least one cutting unit.

[0017] The workpiece 51 is typically a disk-shaped wafer made of a semiconductor such as silicon (Si), and has a circular front surface 52 and a circular back surface (not shown) opposite the front surface 52. The front surface 52 side of the workpiece 51 is partitioned into a plurality of small regions by a plurality of mutually intersecting division lines (streets) 53, and each small region has a device region 54 such as an IC (Integrated Circuit) formed therein.

[0018] A tape 55 (dicing tape) having a diameter larger than that of the workpiece 51 is attached to the back side of the workpiece 51. A ring-shaped frame 56 is fixed to the outer edge of the tape 55 so as to surround the workpiece 51. In this manner, the workpiece 51 is accommodated in the cassette 15 of the processing device 10 while being supported by the frame 56 via the tape 55. A pattern is formed on the front surface 52 of the workpiece 51.

[0019] The processing device 10 is generally controlled by a control unit 100. The control unit 100 has a processing unit 101 (processor) that generates signals for controlling each part of the processing device 10, and a storage unit 102 that stores various information used in the processing unit 101. The processing unit 101 reads out and executes a program stored in the storage unit 102 to control the operation of each part of the processing device 10, which will be described later.

[0020] The processing device 10 has a base 13, and various components are arranged on the base 13. A cassette 15 is placed on a cassette placement section 14 provided in a corner of the base 13. Workpieces 51 are carried into the processing device 10 while contained in the cassette 15. The cassette 15 can contain multiple workpieces 51, and the height position of the workpieces 51 taken in and out of the cassette 15 is adjusted by raising and lowering the cassette placement section 14 up and down.

[0021] An opening 16 is formed on the base 13 at a position adjacent to the cassette placement portion 14 in the Y-axis direction. The opening 16 extends in the X-axis direction, and a table cover 17 is supported inside the opening 16, and a holding table 18 is provided on the table cover 17. The holding table 18 is a table having a holding surface 19 on its upper surface for holding the workpiece 51. The holding table 18 is provided with a clamp 20 on the outside of the holding surface 19. The holding table 18 also has a suction mechanism (not shown) that applies a suction force to the holding surface 19 to suck and hold the workpiece 51. Bellows 21 are connected to both sides of the table cover 17 in the X-axis direction, and the opening 16 is covered by the table cover 17 and the bellows 21.

[0022] The table cover 17 and the holding table 18 are moved in the X-axis direction by a table feed mechanism (not shown) provided inside the base 13 below the opening 16. The table feed mechanism includes an X-axis guide rail and an X-axis ball screw extending in the X-axis direction, and a base portion supporting the table cover 17 and the holding table 18 is supported by the X-axis guide rail so as to be movable in the X-axis direction. The X-axis ball screw is screwed into the base portion, and when the X-axis ball screw is rotated by a motor, the base portion moves in the X-axis direction. In addition, the holding table 18 is rotated by a table rotation mechanism (not shown) about an axis facing the Z-axis direction relative to the base portion.

[0023] The table cover 17 and the holding table 18 are moved in the X-axis direction by a table feed mechanism, and can be positioned in a carry-in / out area adjacent to the cassette placement unit 14 and a processing area below the cutting units 11 and 12. A pair of holding rails 22 extending in the Y-axis direction and crossing above the opening 16 are provided above the carry-in / out area of ​​the holding table 18. The distance between the pair of holding rails 22 in the X-axis direction can be changed.

[0024] A cleaning section 23 is provided on the base 13 on the opposite side in the Y-axis direction (+Y direction) from the cassette placement section 14, with the opening 16 in between. The cleaning section 23 includes a spinner table 24 that can hold and rotate the workpiece 51, and a cleaning nozzle (not shown) that sprays cleaning liquid and drying air toward the workpiece 51 on the spinner table 24. The cleaning section 23 is an example of a cleaning unit.

[0025] A gate-shaped column 26 is provided on the base 13 and straddles the opening 16 in the Y-axis direction. The column 26 is provided with a guide rail 27 and a guide rail 28 extending in the Y-axis direction. A slider 29 movable in the Y-axis direction along the guide rail 27, and a slider 30 movable in the Y-axis direction along the guide rail 28 are provided. The slider 29 supports a transport arm 31 so as to be movable in the Z-axis direction. The slider 30 supports a transport arm 32 so as to be movable in the Z-axis direction. That is, the transport arm 31 and the transport arm 32 are supported so as to be movable in the Y-axis direction and the Z-axis direction, respectively. The transport arm 31 and the transport arm 32 are each an example of a transport arm.

[0026] The transport arm 31 transports the workpiece 51 between the cassette 15 placed on the cassette placement section 14 and the holding table 18 located in the carry-in / out area. The transport arm 31 includes a suction holding section (not shown) that suction-holds the upper surface of the workpiece 51, and a gripping section (not shown) that grips the edge of the workpiece 51. The transport arm 31 pulls out the workpiece 51 held by the gripping section from the cassette 15 and places it on the pair of holding rails 22. After positioning the workpiece 51 in the X-axis direction by the pair of holding rails 22, the transport arm 31 holds the upper surface of the workpiece 51 with the suction holding section, and lowers the transport arm 31 to place the workpiece 51 on the holding surface 19 of the holding table 18 located in the carry-in / out area. The holding table 18 on which the workpiece 51 is placed holds the workpiece 51 on the holding surface 19 by the suction force of a suction mechanism, and is moved from the carry-in / out area to the processing area by the table feed mechanism.

[0027] When the workpiece 51 is supported by a ring-shaped frame 56 , the workpiece 51 is suction-held on the holding surface 19 and the frame 56 is fixed by the clamps 20 of the holding table 18 .

[0028] A camera (imaging unit) 46 for capturing images of the workpiece 51 etc. held on the holding table 18 is provided at a position adjacent to the cutting unit 11. When the indexing feed unit 33 moves the Y-axis moving table 38 along the Y direction, the cutting unit 11 and the camera 46 also move along the Y direction (indexing feed). When the indexing feed unit 33 moves the lifting unit 35 along the Z direction, the cutting unit 11 and the camera 46 also move along the Z direction (cutting feed).

[0029] In the machining area, the workpiece is machined using the cutting unit 11 and the cutting unit 12. The cutting unit 11 and the cutting unit 12 are examples of machining units. The configurations of the cutting unit 11 and the cutting unit 12 will be described later.

[0030] The transport arm 32 transports the workpiece between the holding table 18 located in the carry-in / out area and the cleaning section 23. When the cutting of the workpiece 51 is completed, the table feed mechanism moves the holding table 18 from the processing area in the X-axis direction to the carry-in / out area. The transport arm 32 holds the workpiece on the holding surface 19 of the holding table 18 that has moved to the carry-in / out area, transports it to the cleaning section 23, and places it on the spinner table 24. Then, a cleaning liquid is sprayed from a cleaning nozzle (not shown) and the spinner table 24 is rotated to clean the workpiece 51. Air is also sprayed from the cleaning nozzle to dry the workpiece 51 after cleaning.

[0031] When cleaning of the workpiece in the cleaning section 23 is completed, the workpiece 51 on the spinner table 24 is held by the transport arm 32, and the transport arm 32 is moved in the Y-axis direction to place the workpiece 51 on the pair of holding rails 22. The workpiece 51 is positioned in the X-axis direction by the pair of holding rails 22, and then the workpiece 51 is gripped by the gripping section of the transport arm 31. The transport arm 31 is then moved in the Y-axis direction to transport the workpiece 51 to the cassette placement section 14 and accommodated inside the cassette 15. In this manner, the workpiece 51 that has been cut and cleaned is collected in the cassette 15.

[0032] In the back area of ​​the guide rails 27 and 28 of the column 26, there are provided an indexing feed unit 33 and an indexing feed unit 34 which move the cutting units 11 and 12, respectively, in the Y-axis direction, and a lifting unit 35 and a lifting unit 36 ​​which raise and lower the cutting units 11 and 12, respectively, in the Z-axis direction.

[0033] A pair of Y-axis guide rails (not shown) extending in the Y-axis direction and a pair of Y-axis ball screws (not shown) are provided on the support plate 37 fixed to the column 26. The pair of Y-axis guide rails support the Y-axis moving table 38 and the Y-axis moving table 39 so that they can move in the Y-axis direction. One of the Y-axis ball screws is screwed into a female screw portion (not shown) of the Y-axis moving table 38, and the other Y-axis ball screw is screwed into a female screw portion (not shown) of the Y-axis moving table 39. The Y-axis moving table 38 moves in the Y-axis direction by driving one of the Y-axis ball screws to rotate with a motor (not shown). The Y-axis moving table 39 moves in the Y-axis direction by driving the other Y-axis ball screw to rotate with a motor (not shown).

[0034] The Y-axis moving table 38 and the mechanism for moving it (Y-axis guide rail, Y-axis ball screw, and motor) constitute the indexing feed unit 33. The Y-axis moving table 39 and the mechanism for moving it (Y-axis guide rail, Y-axis ball screw, and motor) constitute the indexing feed unit 34.

[0035] The Y-axis moving table 38 is provided with a pair of Z-axis guide rails (not shown) extending in the Z-axis direction and a Z-axis ball screw (not shown). The pair of Z-axis guide rails support the Z-axis moving table 40 so that it can move in the Z-axis direction, and the Z-axis ball screw is screwed into a female screw portion (not shown) provided on the Z-axis moving table 40. The Z-axis moving table 40 moves in the Z-axis direction by rotating the Z-axis ball screw with a motor 351. The Z-axis moving table 40 and the mechanism for moving it (the Z-axis guide rails, the Z-axis ball screw, and the motor 351) form the lifting unit 35.

[0036] The Y-axis moving table 39 is provided with a pair of Z-axis guide rails (not shown) extending in the Z-axis direction and a Z-axis ball screw (not shown). The pair of Z-axis guide rails support the Z-axis moving table 41 so that it can move in the Z-axis direction, and the Z-axis ball screw is screwed into a female screw portion (not shown) provided in the Z-axis moving table 40. The Z-axis moving table 41 moves in the Z-axis direction by rotating the Z-axis ball screw with a motor 361. The Z-axis moving table 41 and the mechanism for moving it (the Z-axis guide rails, the Z-axis ball screw, and the motor 361) form the lifting unit 36.

[0037] An alarm unit 61 is disposed in the -X direction of the base 13. The alarm unit 61 mainly uses a display as an alarm means, but a speaker or a lamp (not shown) can also be used. The control unit 100 notifies the operator of the failure of the second alignment for the workpiece 51 in which an error has occurred (hereinafter also referred to as the "error workpiece") through an alarm step described below. That is, if alignment fails again in the alignment step of the second automatic process despite having been cleaned in the cleaning step of the first automatic process, it is highly likely that the error has occurred due to a cause other than a foreign substance attached to the workpiece 51. In this case, the control unit 100 can promptly solve the problem by notifying the operator through the alarm unit 61.

[0038] The cutting unit 11 is supported at the lower end of the Z-axis moving table 40, and the cutting unit 12 is supported at the lower end of the Z-axis moving table 41. Therefore, the cutting unit 11 is moved in the Y-axis direction by the indexing feed unit 33, and is raised and lowered in the Z-axis direction by the lifting unit 35. The cutting unit 12 is moved in the Y-axis direction by the indexing feed unit 34, and is raised and lowered in the Z-axis direction by the lifting unit 36.

[0039] When cutting the workpiece 51, the control unit 100 adjusts the relative positions of the holding table 18 and the cutting units 11, 12 in the X-axis direction and the Y-axis direction by using the table feed mechanism and the indexing feed units 33, 34, and positions the cutting blades 47 of the cutting units 11, 12 above the end of the planned division line that is the cutting target. Next, the control unit 100 lowers the cutting units 11, 12 by using the lifting units 35, 36. The cutting blades 47 of the cutting units 11, 12 cut into the workpiece 51 held on the holding table 18 while rotating. Then, the table feed mechanism moves the holding table 18 in the X-axis direction (processing feed), whereby cutting is performed by the cutting blades 47 along the planned division line extending in the X-axis direction.

[0040] When the cutting process along a set of division lines by each of the cutting units 11, 12 is completed, the control unit 100 causes each of the cutting units 11, 12 to rise by each of the lifting units 35, 36, and separates the cutting blade 47 from the workpiece. Next, the control unit 100 causes each of the cutting units 11, 12 to move in the Y-axis direction (indexing feed) by each of the indexing feed units 33, 34, and positions the cutting blade 47 of each of the cutting units 11, 12 above the end of the next uncut division line. Then, in the same manner as above, each of the lifting units 35, 36 lowers each of the cutting units 11, 12 (cutting feed), and the table feed mechanism moves the holding table 18 in the X-axis direction (processing feed), and cutting is performed along the division lines.

[0041] When cutting along all the planned division lines aligned in the Y-axis direction is completed, the control unit 100 rotates the holding table 18 by 90 degrees using a table rotation mechanism (not shown). As a result, the workpiece on the holding table 18 is in a state where multiple uncut planned division lines are aligned in the Y-axis direction (extending toward the X-axis direction). Then, in the same manner as above, each of the cutting units 11 and 12 is caused to perform cutting processing sequentially along all the uncut planned division lines.

[0042] It is also possible to operate only one of the two cutting units 11 and 12 to perform cutting along one planned dividing line at a time.

[0043] 2 to 6, a method for processing a workpiece 51 performed by the processing apparatus 10 will be described. Fig. 2 is an example of a flowchart of a processing process performed by the processing method of the processing apparatus 10.

[0044] In the processing, the control unit 100 automatically performs a second automatic processing following a first automatic processing. Automatically performing means that a plurality of processings are performed consecutively without the intervention of an operator. In the processing method of the workpiece 51 performed by the processing device 10, as shown in FIG. 2, the control unit 100 first performs a first automatic processing (step S11). The first automatic processing will be described later with reference to FIG. 3. The control unit 100 determines whether or not an error workpiece 51 has occurred as a result of performing the first automatic processing (step S12). If an error workpiece 51 has not occurred (step S12: NO), the control unit 100 ends the processing without performing the second automatic processing on the workpiece 51 on which the first automatic processing has been performed.

[0045] On the other hand, if an erroneous workpiece 51 occurs as a result of performing the first automatic process (step S12: YES), the control unit 100 performs a second automatic process on the erroneous workpiece 51 (step S13). The second automatic process will be described later with reference to FIG. 5. That is, the second automatic process is performed only on the erroneous workpiece 51 that has become an error as a result of performing the first automatic process. When the second automatic process ends, the machining process ends.

[0046] The first automatic process will be described with reference to FIG. 3. FIG. 3 is an example of a flowchart showing the first automatic process. In the first automatic process, the control unit 100 automatically performs at least an alignment step, a processing step, and a cleaning step in this order. In the first automatic process, a storage step may be performed after the cleaning step. Also, in the first automatic process, an initial step may be performed before the alignment step. Also, in the first automatic process, unlike the second automatic process, a notification step described below is not performed.

[0047] In the first automatic processing, as shown in Fig. 3, the control unit 100 first performs an initial step (step S21). The initial step is performed before an alignment step in the first automatic processing, which will be described later. In the initial step, the control unit 100 performs a teaching operation to register (teach) a predetermined pattern that is to be a target formed on the workpiece 51 and the distance between the pattern and the planned division line. Note that the teaching operation may be completed before performing the first automatic processing.

[0048] When the initial step performed in step S21 is completed, the control unit 100 performs an alignment step (step S22). The alignment step is performed to align the cutting blade 47 with the dividing line 53 to be cut in the Y-axis direction before cutting by the cutting unit 11. In step S22, the control unit 100 captures an image of one side of the workpiece 51 transferred from the cassette 15 to the holding table 18 with the camera 46. Then, the control unit 100 detects the position of the dividing line 53 of the workpiece 51 from the image captured and acquired by the camera 46. The control unit 100 determines whether the alignment performed in the alignment step of the first automatic process was successful or unsuccessful (step S23).

[0049] With reference to FIG. 4, an image 70 acquired by the camera 46 in the alignment step of the first automatic processing will be described. FIG. 4 is an example of an image acquired by the camera 46 in the alignment step of the first automatic processing. A predetermined pattern (not shown) serving as a target is formed on the workpiece 51. The shape of the pattern is an example, and has a characteristic shape, and serves as a key pattern of a planar shape and color that can be detected and identified in an image captured by the camera 46 (see FIG. 1). The pattern formed on the workpiece 51 serves as a mark for cutting along the planned division lines 53. Through the teaching operation in step S21 of the initial step, the distance R between the pattern formed on the workpiece 51 and the planned division lines 53 is registered. As shown in FIG. 4, a pattern image 71 corresponding to the pattern formed on the workpiece 51 and a planned division line image 73 corresponding to the planned division line 53 are displayed on the image 70 acquired by the camera 46 in the alignment step of the first automatic processing.

[0050] In the alignment step, the control unit 100 captures an image 70 of a workpiece 51 such as a wafer with the camera 46. Then, the control unit 100 performs pattern matching based on the captured image 70 to detect a pattern image 71 that corresponds to a predetermined target pattern.

[0051] If the alignment performed in the first automatic process is successful (step S23: YES), the control unit 100 performs a processing step (step S24). In the processing step, the control unit 100 controls the cutting units 11 and 12 to perform cutting on the workpiece 51 based on the pattern image 71 detected in the alignment step. After performing the processing step, the process proceeds to step S25. That is, the processing step and cleaning step are automatically continued for the workpieces 51 other than the error workpiece for which alignment was successful in the first automatic process.

[0052] When performing pattern matching in the alignment step of the first automatic process, if a foreign object or the like is attached to the workpiece 51, the foreign object image 72 corresponding to the foreign object is displayed in the image 70 captured by the camera 46. If a foreign object or the like is attached to the pattern of the workpiece 51, the pattern image 71 cannot be correctly recognized from the captured image 70, and pattern matching may fail. In this case, the control unit 100 may not be able to detect the position of the planned division line 53 due to the error workpiece 51, causing an alignment error and resulting in unsuccessful alignment. Conventionally, when an alignment error occurs, the automatic process is stopped and confirmation by an operator is requested. The operator checks the state of the error workpiece 51 and performs processing such as manually carrying out a cleaning step.

[0053] When a foreign object attached to the error workpiece 51 is the cause of the alignment error, the foreign object may be removed by performing a cleaning step to clean the workpiece 51. After the foreign object is removed by cleaning, the alignment step is performed again to remove a foreign object image 72 corresponding to the foreign object from the image 70 captured by the camera 46. This allows the pattern image 71 in the captured image 70 to be accurately recognized, increasing the likelihood of successful alignment.

[0054] Therefore, if it is determined that alignment has failed in the first automatic processing (step S23: NO), i.e., if the planned division line 53 cannot be detected in the alignment step of the first automatic processing, the control unit 100 does not perform the processing step of step S24, and the processing proceeds to step S25.

[0055] In step S25, the control unit 100 performs a cleaning step (step S25). In the cleaning step, the control unit 100 controls the cleaning unit 23 to clean the workpiece 51 with a cleaning liquid. By performing the cleaning step, it is expected that foreign matter adhering to the workpiece 51 will be cleaned and removed by the cleaning unit 23. After the cleaning step, the control unit 100 performs a storage step (step S26).

[0056] In the accommodation step, the control unit 100 moves the transport arm 31 in the Y-axis direction to transport the workpiece 51 to the cassette placement unit 14 and accommodates it inside the cassette 15. The control unit 100 stores in the memory unit 102 the position in the cassette 15 where the error workpiece 51, which has failed to be aligned, is accommodated. When the accommodation step is completed, the first automatic process is completed.

[0057] Only when an error workpiece 51 occurs and alignment fails as a result of the first automatic processing (step S12 in FIG. 2: YES), does the control unit 100 perform a second automatic processing only on the error workpiece 51 (step S13 in FIG. 2).

[0058] The second automatic process will be described with reference to FIG. 5. FIG. 5 is an example of a flow chart showing the second automatic process. In the second automatic process, the control unit 100 automatically performs at least an alignment step and a processing step in this order. In the second automatic process, a cleaning step may be performed after the processing step. In the second automatic process, a storage step may be performed after the cleaning step. In addition, in the second automatic process, an initial step may be performed before the alignment step. In addition, in the second automatic process, unlike the first automatic process, a notification step described later is performed. In addition, in the second automatic process, the second automatic process may include a cleaning step and an alignment step again for the error workpiece 51 each time the error workpiece 51 occurs before carrying out the unprocessed workpiece still stored in the cassette 15 after the occurrence of the error workpiece 51. However, if the second automatic processing is performed on each error workpiece, there may be a time when other workpieces cannot be transported to the holding table 18 until the erroneous workpiece 51 undergoes the cleaning step and the re-alignment step, which may reduce productivity. Therefore, the second automatic processing may be performed on all workpieces 51 accommodated in the cassette 15 after the first automatic processing has been performed.

[0059] In the second automatic processing, as shown in Fig. 5, the control unit 100 first performs an initial step (step S31). The initial step is performed before an alignment step in the second automatic processing, which will be described later. In the initial step, the control unit 100 performs a teaching operation to register (teach) a predetermined pattern that is to be a target formed on the workpiece 51 and a distance between the pattern and the planned division line.

[0060] When the initial step performed in step S31 is completed, the control unit 100 performs an alignment step (step S32). The alignment step is performed to align the cutting blade 47 with the dividing line 53 to be cut in the Y-axis direction before cutting by the cutting unit 11. In step S32, the control unit 100 captures an image of one side of the workpiece 51 transferred from the cassette 15 to the holding table 18 with the camera 46. Then, the control unit 100 detects the position of the dividing line 53 of the workpiece 51 from the image captured and acquired by the camera 46. The control unit 100 determines whether the alignment performed in the alignment step of the second automatic process was successful or unsuccessful (step S33).

[0061] With reference to FIG. 6, an image 80 acquired by the camera 46 in the alignment step of the second automatic processing will be described. FIG. 6 is an example of an image acquired by the camera 46 in the alignment step of the second automatic processing. A predetermined pattern (not shown) serving as a target is formed on the workpiece 51. Through a teaching operation in step S31 of the initial step, a distance R between the pattern formed on the workpiece 51 and the planned division line 53 is registered. As shown in FIG. 6, a pattern image 81 corresponding to the pattern formed on the workpiece 51 and a planned division line image 83 corresponding to the planned division line 53 are displayed on the image 80 acquired by the camera 46 in the alignment step of the second automatic processing.

[0062] In the alignment step, the control unit 100 captures an image 80 of a workpiece 51 such as a wafer with the camera 46. Then, the control unit 100 performs pattern matching based on the captured image 80 to detect a pattern image 81 that corresponds to a predetermined target pattern.

[0063] If the alignment performed in the second automatic process is successful (step S33: YES), the control unit 100 performs a processing step (step S34). In the processing step, the control unit 100 controls the cutting units 11 and 12 to cut the workpiece 51 based on the pattern image 81 detected in the alignment step. After performing the processing step, the process proceeds to step S36.

[0064] When pattern matching is performed in the alignment step of the first automatic processing, if foreign matter or the like is attached to the workpiece 51, the control unit 100 may be unable to detect the position of the planned division line 53, causing an alignment error and resulting in unsuccessful alignment. In this regard, in the processing of this embodiment, after the alignment step of the first automatic processing, a cleaning step is performed to clean the workpiece 51. It is expected that cleaning in the cleaning step of the first automatic processing will remove foreign matter attached to the workpiece 51.

[0065] Therefore, in this embodiment, when alignment fails in the first automatic processing, the control unit 100 automatically performs the second automatic processing on the workpiece 51 for which alignment has failed, and by performing an alignment step and a processing step in the second automatic processing, it is expected that a foreign body image 72 corresponding to a foreign body can be removed from the image 80 of the captured result as shown in FIG. 6. This allows the pattern image 81 in the captured image 80 to be accurately recognized and alignment to be successful. Conventionally, when an error occurs, the automatic processing is stopped and an operator is called, so not only the processing of the erroneous workpiece is stopped, but also the processing of other workpieces 51 is stopped. In contrast, in this embodiment, even if a workpiece 51 for which alignment has failed occurs, there is no need to stop the automatic processing and request confirmation by a work vehicle, and the alignment can be successfully performed and the workpiece 51 can be automatically processed. This reduces the need to call an operator every time an error occurs, and the processing of the workpiece 51 for which alignment has failed can be continued by the processing device 10 without any trouble, thereby reducing the burden on the operator.

[0066] When it is determined that the alignment has failed in the second automatic processing (step S33: NO), the control unit 100 performs the notification step (step S35) without performing the processing step of step S34. In the notification step, the control unit 100 notifies the operator that the alignment has failed and an error has occurred by a display or a speaker (not shown). That is, when the control unit 100 cannot detect the division line 53 in the alignment step of the first automatic processing, it does not notify the error in the notification step, but when the control unit 100 cannot detect the division line 53 in the alignment step of the second automatic processing, it notifies the error in the notification step. This allows the operator to recognize that the error cannot be resolved even if the workpiece 51 is washed. After the notification step, the process proceeds to step S36. Note that after the notification step, the second automatic processing may be terminated by omitting the cleaning step described later.

[0067] In step S36, the control unit 100 performs a cleaning step. In the cleaning step, the control unit 100 controls the cleaning unit 23 to clean the workpiece 51 with a cleaning liquid. After the cleaning step, the control unit 100 performs a storage step (step S37).

[0068] In the accommodation step, the control unit 100 moves the transport arm 31 in the Y-axis direction to transport the workpiece 51 to the cassette placement unit 14 and accommodate it inside the cassette 15. When the accommodation step is completed, the second automatic processing is completed. Note that even for a workpiece 51 for which the planned division line 53 cannot be detected in the alignment step of the second automatic processing in step S32, the cleaning step in step S36 and the accommodation step in step S37 may be performed without stopping the automatic processing.

[0069] As described above, in this embodiment, the control unit 100 performs the second automatic processing only on the error workpiece 51 in which an alignment error occurred as a result of performing the alignment step of the first automatic processing. In the first automatic processing, cleaning is performed in the cleaning step on the error workpiece 51 in which an alignment error occurred in the alignment step. Then, the second automatic processing is performed on the error workpiece 51 in which an error occurred, and the alignment step is performed again in the second automatic processing.

[0070] If a foreign object attached to the workpiece 51 is the cause of the alignment error, the foreign object is removed by cleaning in the cleaning step of the first automatic processing, and therefore the alignment can be made successful by performing the alignment step again in the second automatic processing. Therefore, the alignment can be made successful and the workpiece 51 can be automatically processed without the operator having to manually perform the cleaning step and the alignment step again on the workpiece 51 for which alignment has failed. As a result, the processing device 10 can continue to process the workpiece 51 for which alignment has failed without requiring the operator to take the time and effort, thereby reducing the burden on the operator.

[0071] The embodiments of the present invention are not limited to the above-mentioned embodiments and modifications, and may be modified, substituted, or altered in various ways without departing from the spirit of the technical idea of ​​the present invention. Furthermore, if the technical idea of ​​the present invention can be realized in a different way due to technological progress or a different technology derived therefrom, the present invention may be implemented using that method. Therefore, the claims cover all embodiments that may be included within the scope of the technical idea of ​​the present invention. [Industrial Applicability]

[0072] As described above, the method for processing a workpiece of the present invention can reduce the burden on an operator when processing a workpiece, and is therefore particularly useful in fields where workpieces are processed. [Explanation of symbols]

[0073] 10: processing device, 11: cutting unit, 12: cutting unit, 13: base, 14: cassette placement portion, 15: cassette, 18: holding table, 19: holding surface, 23: cleaning unit, 31: transport arm, 32: transport arm, 33: indexing feed unit, 34: indexing feed unit, 35: lifting unit, 36: lifting unit, 37: support plate 46: camera, 47: cutting blade, 51: workpiece, 52: surface, 53: division line, 54: device, 55: tape, 56: frame, 61: Notification unit, 70: Image, 71: Pattern image, 72: Foreign object image, 73: Division line image, 80: Image, 81: Pattern image, 83: division line image, 100: control unit, 101: processing unit, 102: storage unit

Claims

1. A cassette for accommodating a workpiece, a holding table, a processing unit, and a cleaning unit, A processing apparatus including a transport arm for transporting a workpiece between each unit, A method for processing a workpiece, the method comprising the steps of: processing a workpiece having a plurality of device regions defined by a plurality of planned division lines on one surface thereof along the planned division lines, the method comprising the steps of: One surface of the workpiece transferred from the cassette to the holding table is imaged. an alignment step of detecting the positions of the planned division lines from the captured image; The workpiece on which the division line can be detected in the alignment step is A processing step of processing along the planned division line; A workpiece on which the processing step has been performed; and an error workpiece on which the division line cannot be detected in the alignment step and the processing step has not been performed; and a cleaning step for cleaning the error workpiece. a first automatic process in which the control unit automatically performs the above; After the first automatic process is performed, For the error workpiece on which the cleaning step was performed At least the alignment step and the processing step of the first automatic processing a second automatic process that is again automatically performed by the control unit; A method for processing a workpiece, comprising carrying out the steps of:

2. The control unit 2. The method for processing a workpiece according to claim 1, further comprising the step of: if the planned dividing line cannot be detected in the alignment step of the first automatic processing, continuing the first automatic processing for another workpiece.

3. The second automated process includes: For all workpieces contained in the cassette, The method is characterized in that the method is performed after the first automatic process is performed.

3. A method for processing a workpiece according to claim 1 or 2.

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