Processing device

Abstract

To provide a processing device capable of preventing occurrence of processing failure along with shifts of processing position and alignment error of a workpiece by suppressing a centroid of a portal column to be low.SOLUTION: In a cutting device (processing device) 1 that includes a chuck table 10, an x-axis movement mechanism 20 for moving the chuck table 10 to x-axis direction (processing feed direction), a base 2, a portal column 3, a cutting unit (processing mechanism) 30 for processing a wafer (workpiece) W, and a y-axis movement mechanism 50 arranged in the portal column 3 for moving the cutting unit 30 to the y-axis direction which is an indexing direction of the wafer W, the y-axis movement mechanism 30 includes a guide rail 51 arranged on the top face of the portal column 3 and extending in the y-axis direction, a y-axis ball screw 54 for moving the cutting unit 30 to the y-axis direction, a y-axis servomotor 55 (power unit), and a y-axis base 52 moving in the y-axis direction along the guide rail 51.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a processing apparatus for processing a workpiece such as a wafer. [Background technology]

[0002] For example, in the manufacturing process of semiconductor chips, the surface of a thin, disk-shaped semiconductor wafer (hereinafter simply referred to as a "wafer") is divided into many rectangular regions by planned division lines called streets that are arranged in a grid pattern, and devices such as ICs and LSIs are formed in each rectangular region. Then, the wafer on which many devices are thus formed is cut along the planned division lines with a cutting blade of a cutting device called a dicer, thereby obtaining multiple semiconductor chips.

[0003] Incidentally, as disclosed in Patent Documents 1 to 3, for example, a cutting device that cuts a wafer held on a chuck table with a cutting blade includes an X-axis moving mechanism that moves the chuck table in the X-axis direction, which is the cutting feed direction of the cutting blade, a gate-type column arranged on a base so as to straddle the X-axis moving mechanism, a Y-axis moving mechanism arranged on the gate-type column, and a Z-axis moving mechanism arranged on the Y-axis moving mechanism. Here, the Y-axis moving mechanism is a mechanism that moves the cutting mechanism equipped with the cutting blade in the Y-axis direction, which is the indexing feed direction parallel to the axial direction of a spindle that rotates the cutting blade. And the Z-axis moving mechanism is a mechanism that moves the cutting mechanism equipped with the cutting blade in the cutting feed direction perpendicular to the upper surface of the chuck table, and causes the cutting blade to cut into the wafer held on the chuck table.

[0004] A conventional cutting device will now be described with reference to Figures 6 to 8. Figure 6 is a perspective view of the conventional cutting device, Figure 7 is a cross-sectional view taken along line CC in Figure 6, and Figure 8 is a view taken in the direction of arrow D in Figure 7. In the following description, the alignment in Figure 6 is taken as the X-axis direction (cutting feed direction), the left-right direction as the Y-axis direction (indexing feed direction), and the up-down direction as the Z-axis direction (cutting feed direction).

[0005] In a conventional cutting device 101 shown in Fig. 6, a gate-type column 103 is vertically installed at the rear end (-X axis direction end) on a base 102, and a Y-axis movement mechanism 150 and a Z-axis movement mechanism 140 are provided on the front end face (the end face on the near side in Fig. 6) of this gate-type column 103. In addition, an X-axis movement mechanism 120 is disposed in the approximate center of the base 102, which moves a chuck table 110 that holds a wafer W, which is an object to be cut, in the X-axis direction.

[0006] Here, the Y-axis movement mechanism 150 includes a pair of upper and lower Y-axis guide rails 151 arranged parallel to each other along the Y-axis direction on the front end surface of the gate column 103, a Y-axis base 152 that can move in the Y-axis direction along these Y-axis guide rails 151, a Y-axis ball screw 154 that can rotate forward and backward and is arranged along the Y-axis direction between the pair of Y-axis guide rails 151, and a Y-axis servo motor 155 connected to one axial end of the Y-axis ball screw 154.

[0007] The Z-axis movement mechanism 140 includes a pair of left and right Z-axis guide rails 141 arranged parallel to each other along the Z-axis on the front end surface of the Y-axis base 152, a Z-axis base 142 that can be raised and lowered in the Z-axis direction along these Z-axis guide rails 141, a Z-axis ball screw 143 that can rotate forward and backward and is arranged along the Z-axis between the pair of left and right Z-axis guide rails 141, and a Z-axis servo motor 144 connected to the upper end of the Z-axis ball screw 143. A cutting unit 130 including a cutting blade 133 and the like is attached to the lower end of the Z-axis base 142, and a camera 153 serving as an imaging means is attached to the tip of a support arm 142A that is bent at a right angle from the Z-axis base 142 and extends horizontally, as shown in FIG. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] JP 2006-156809 A [Patent Document 2] JP 2014-161963 A [Patent Document 3] JP 2014-161964 A Summary of the Invention [Problem to be solved by the invention]

[0009] In the conventional cutting device 101 shown in Fig. 6 to Fig. 8, the Y-axis moving mechanism 150 and the Z-axis moving mechanism 140 are supported in a cantilevered state together with the cutting unit 130 on the front end surface of the gate column 103, and a pair of Y-axis guide rails 151 along the Y-axis direction of the Y-axis moving mechanism 150 are arranged at a large distance from each other vertically, so that it is necessary to thicken the horizontal beam portion 103B of the gate column 103. In this way, if the beam portion 103B of the gate column 103 is thickened, the center of gravity of the entire gate column 103 becomes higher, so that the cutting unit 130 vibrates due to the movement of the chuck table 110 in the X-axis direction, and the cutting position of the wafer W may be shifted. In addition, there is a problem that an alignment error may occur due to the rotational vibration of the cutting unit 130 when aligning the wafer W.

[0010] The present invention has been made in consideration of the above problems, and its object is to provide a processing device that can keep the center of gravity of the gantry column low and prevent processing defects and alignment errors of the workpiece caused by deviations in the processing position. [Means for solving the problem]

[0011] In order to achieve the above-mentioned object, the present invention provides a machining apparatus comprising: a chuck table for holding a workpiece; an X-axis moving mechanism for moving the chuck table in the X-axis direction which is the machining feed direction of the workpiece; a base on which the X-axis moving mechanism is disposed; a portal column disposed on the base and straddling the X-axis moving mechanism; a machining mechanism for machining the workpiece held on the chuck table; and a Y-axis moving mechanism disposed on the portal column for moving the machining mechanism in the Y-axis direction which is the indexing feed direction of the workpiece, wherein the Y-axis moving mechanism comprises a guide rail disposed on an upper surface of the portal column and extending in the Y-axis direction; a power unit disposed in parallel to the guide rail for moving the machining mechanism in the Y-axis direction; and a Y-axis base which straddles the guide rail, is connected to the machining mechanism, and moves in the Y-axis direction along the guide rail. Effect of the Invention

[0012] According to the present invention, since the guide rail of the Y-axis movement mechanism is disposed on the upper surface of the gate column, it is not necessary to dispose the guide rails at a large distance above and below in the vertical direction as in the past. This allows the thickness of the beam portion of the gate column to be thinned, and as a result, the center of gravity of the entire gate column can be lowered. As a result, the machining position of the workpiece is not shifted due to vibration of the machining mechanism accompanying movement of the chuck table in the X-axis direction, and machining defects can be effectively prevented. In addition, alignment errors caused by rotational vibration of the machining mechanism when aligning the workpiece can be prevented. [Brief description of the drawings]

[0013] [Figure 1] 1 is a perspective view of a cutting device according to a first embodiment of the present invention. [Diagram 2] FIG. [Diagram 3] 2 is a cross-sectional view taken along line AA in FIG. 1. [Figure 4] 4 is a view taken along the arrow B in FIG. 3. [Diagram 5] FIG. 5 is a perspective view of a cutting device according to a second embodiment of the present invention. [Figure 6]FIG. 1 is a perspective view of a conventional cutting device. [Figure 7] 7 is a cross-sectional view taken along line CC in FIG. 6. [Figure 8] 8 is a view taken along the arrow D in FIG. 7. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. Note that the following describes a cutting device as one embodiment of a processing device according to the present invention.

[0015] First Embodiment First, the configuration of a cutting device 1 according to a first embodiment of the present invention will be described. In the following description, the front-rear direction in Fig. 1 is defined as the X-axis direction (cutting feed direction), the left-right direction is defined as the Y-axis direction (indexing feed direction), and the up-down direction is defined as the Z-axis direction (cutting feed direction).

[0016] [Cutting equipment configuration] 1 is a perspective view of a cutting device 1. The illustrated cutting device 1 is called a dicer and is equipped with a base 2 that supports each component, and a gate-shaped column 3 that is long in the Y-axis direction is vertically installed on the inner end (-X-axis direction end) of this base 2. Here, the gate-shaped column 3 is composed of left and right support parts 3A that are installed vertically and a horizontal beam part 3B that is installed between the upper ends of these support parts 3A, and has a rectangular opening part 3a in the center.

[0017] The cutting device 1 has as its main components a chuck table 10 that holds and rotates the workpiece, a wafer W, an X-axis moving mechanism 20 that moves the chuck table 10 back and forth along the X-axis direction together with the wafer W, a cutting unit 30 that is a processing mechanism that cuts the wafer W held on the holding surface of the chuck table 10, a Z-axis moving mechanism 40 that moves the cutting unit 30 up and down along the Z-axis direction, and a Y-axis moving mechanism 50 that moves the cutting unit 30 back and forth along the Y-axis direction.

[0018] The configurations of the main components of the cutting device 1, that is, the chuck table 10, the X-axis movement mechanism 20, the cutting unit 30, the Z-axis movement mechanism 40, and the Y-axis movement mechanism 50, will be described below.

[0019] (Chuck table) The chuck table 10 is a disk-shaped member rotatably disposed in the approximate center of the base 2, and its upper surface constitutes a holding surface for holding the wafer W together with a ring frame F (see FIG. 2). Four clamps 11 for fixing the ring frame F from all four sides are disposed around the periphery of the chuck table 10 at equal angular pitches (90° pitches) in the circumferential direction.

[0020] In addition, the chuck table 10 is rotatably supported on an X-axis base 22 (described later) of an X-axis moving mechanism 20 via a rotation mechanism 12 arranged below the chuck table 10, and is rotated around a vertical axis by the rotation mechanism 12, and can be moved back and forth along the X-axis direction by the X-axis moving mechanism 20 arranged below the chuck table 10.

[0021] Here, the wafer W, which is the workpiece, is, for example, a thin disk-shaped member made of single crystal silicon (Si), and as shown in Fig. 2, its surface (upper surface in Fig. 2) is divided into a plurality of rectangular regions by mutually orthogonal lattice-shaped division lines (streets) L1, L2, and devices D such as ICs and LSIs are formed in each rectangular region. The wafer W with a large number of devices D formed on its surface is supported by a ring frame F via a dicing tape T attached to its back surface (lower surface in Fig. 2) and the lower surface of the ring frame F, and the wafer W, ring frame F, and dicing tape T are integrated as a work set WS. Note that, as the material of the wafer W, silicon carbide (SiC), glass, ceramics, sapphire, etc. are used in addition to silicon (Si).

[0022] (X-axis movement mechanism) The X-axis moving mechanism 20 is a mechanism for reciprocating the chuck table 10 together with the wafer W along the X-axis direction, and is configured to include a pair of left and right X-axis guide rails 21 arranged parallel to each other along the X-axis direction on the base 2, a rectangular plate-shaped X-axis base 22 installed slidably in the X-axis direction along these X-axis guide rails 21, a forward / reversible X-axis ball screw 23 arranged along the X-axis direction between the pair of X-axis guide rails 21, and an X-axis servo motor 24 that is a rotation drive source for forward / reverse rotating the X-axis ball screw 23. The chuck table 10 is supported on the X-axis base 22 via the rotation mechanism 12 so as to be rotatable around a vertical central axis. Although not shown, a nut member is provided to protrude downward from the center of the width direction of the lower surface of the X-axis base 22, and the X-axis ball screw 23 is screwed and inserted into the nut member. The gate-shaped column 3 is vertically erected on the base 2 across the X-axis moving mechanism 20.

[0023] Therefore, when the X-axis servo motor 24 is started to rotate the X-axis ball screw 23 forward or backward, the X-axis base 22, from which a nut member (not shown) that screws into the X-axis ball screw 23 is protruded, slides in the X-axis direction along a pair of left and right X-axis guide rails 21, and the chuck table 10 moves back and forth in the X-axis direction together with the X-axis base 22 and the rotation mechanism 12.

[0024] (Cutting unit) The cutting unit 30 is attached to the lower part of a Z-axis base 42 of the Z-axis moving mechanism 40, which will be described later. The cutting unit 30 includes a rectangular block-shaped spindle housing 31 arranged horizontally along the Y-axis direction, a spindle motor (not shown) that is a rotation drive source housed in the spindle housing 31, a spindle 32 (see FIG. 4) that is rotated by the spindle motor, and a thin disk-shaped cutting blade 33 attached to the tip of the spindle 32. Here, the cutting blade 33 is configured by forming a cutting edge on the outer periphery of a circular base, and the cutting edge is formed by fixing diamond abrasive grains or the like with a resin bond, a metal bond, a vitrified bond, or the like.

[0025] (Z-axis movement mechanism) The Z-axis moving mechanism 40 is a mechanism for moving the cutting unit 30 up and down along the Z-axis direction, and is configured to include a pair of Z-axis guide rails 41 arranged parallel to each other vertically on the left and right sides of a rectangular plate-shaped Y-axis base 52, a Z-axis base 42 that can move up and down along these Z-axis guide rails 41, a rotatable Z-axis ball screw 43 arranged vertically between the pair of Z-axis guide rails 41, and a Z-axis servo motor 44 that can rotate forward and backward and drives the Z-axis ball screw 43. The cutting unit 30 is attached to the lower part of the Z-axis base 42. A nut member (not shown) is provided on the back surface of the Z-axis base 42, and the Z-axis ball screw 43 is screwed into and inserted into the nut member.

[0026] In the Z-axis moving mechanism 40 configured as described above, when the Z-axis servo motor 44 is started and the Z-axis ball screw 43 rotates forward and backward, the Z-axis base 42, which has a protruding nut member (not shown) that screws into the Z-axis ball screw 43, moves up and down along a pair of Z-axis guide rails 41, and the cutting unit 30 attached to the Z-axis base 42 also moves up and down along the Z-axis direction.

[0027] (Y-axis movement mechanism) The Y-axis moving mechanism 50 is a mechanism for reciprocating the cutting unit 30 along the Y-axis direction, and in this embodiment, is disposed on the beam 3B of the gate column 3. Specifically, the Y-axis moving mechanism 50 includes a pair of Y-axis guide rails 51 arranged parallel to each other along the Y-axis direction on the upper surface of the beam 3B of the gate column 3, and a Y-axis base 52 that can move in the Y-axis direction along these Y-axis guide rails 51. Here, the Y-axis base 52 is disposed across the pair of Y-axis guide rails 51, and is composed of a rectangular support plate 52A that stands vertically along one end face (the front side of FIG. 1) of the beam 3B of the gate column 3, and a U-shaped slide member 52B that extends from the support plate 52A and is disposed so as to surround a part of the gate column 3 from the periphery (see FIG. 3). The Z-axis moving mechanism 40 is attached to the support plate 52A of the Y-axis base 52, and therefore the Y-axis base 52 is connected to the cutting unit 30 via the Z-axis moving mechanism 40.

[0028] 3, the slide member 52B of the Y-axis base 52 is composed of a horizontal section 52a extending horizontally from the support plate 52A above the gate column 3, a vertical section 52b bending at a right angle from the extending end of the horizontal section 52a and extending downward, and a horizontal arm section 52c bending at a right angle from the lower end of the vertical section 52b and extending to the opening 3a of the gate column 3, and a camera 53 serving as an imaging means is attached to the tip of the arm section 52c. In this way, the cutting unit 30 is disposed via the Z-axis moving mechanism 40 on one tip side of the Y-axis base 52, and the camera 53 is disposed on the other tip.

[0029] 1, in the Y-axis movement mechanism 50, as described above, a pair of Y-axis guide rails 51 are arranged along the Y-axis direction on the upper surface of the beam portion 3B of the gate-shaped column 3, and a Y-axis ball screw 54 that can rotate forward and backward is arranged along the Y-axis direction between these Y-axis guide rails 51. Note that this Y-axis ball screw 54 is screwed into a nut member (not shown) that protrudes from the Y-axis base 52.

[0030] One axial end (the left end in FIG. 1) of the Y-axis ball screw 54 is connected to a Y-axis servo motor 55 which is a rotation drive source, and the other axial end of the Y-axis ball screw 54 is rotatably supported by the gate column 3 via a bearing (not shown). Here, the Y-axis ball screw 54 and the Y-axis servo motor 55 constitute a power unit which reciprocates the Y-axis base 52 in the Y-axis direction along the pair of Y-axis guide rails 51.

[0031] Therefore, in the Y-axis movement mechanism 50, when the Y-axis servo motor 55 is started to rotate the Y-axis ball screw 54 forward and backward, the Y-axis base 52, from which a nut member (not shown) that screws onto the Y-axis ball screw 54 is protruding, can move along the Y-axis guide rail 51 together with the Z-axis base 42 of the Z-axis movement mechanism 40 in the Y-axis direction. Therefore, the cutting unit 30 attached to the Z-axis base 42 of the Z-axis movement mechanism 40 can move along the Y-axis guide rail 51 in the Y-axis direction.

[0032] In the cutting device 1 shown in FIG. 1, the chuck table 10 and the wafer W (work set WS) held thereon are movable along the X-axis direction, and the cutting unit 30 is movable along the Y-axis direction and the Z-axis direction, respectively.

[0033] In the cutting device 1 according to this embodiment, as shown in FIG. 1, a waste oil groove 3b (only one of which is shown in FIG. 1) having a semicircular cross section is provided vertically along the up-down direction on the left and right side end faces (the -Y axis direction end face and the +Y axis direction end face) of the portal column 3.

[0034] [Action of cutting device] Next, the operation of the cutting device 1 configured as above will be described.

[0035] When the wafer W, which is a workpiece, is cut by the cutting device 1, the wafer W is placed on the holding surface of the chuck table 10 shown in Fig. 1 together with the ring frame F that holds it, and the ring frame F is fixed on the holding surface of the chuck table 10 together with the wafer W by four clamps 11. From this state, the chuck table 10 is moved along the X-axis direction by the X-axis moving mechanism 20 and positioned below the cutting unit 30, and the surface of the wafer W is imaged by the camera 53. When an image is obtained by imaging the surface of the wafer W by the camera 53, a planned division line L1 (see Fig. 2) to be cut is detected by image processing such as pattern matching based on the image.

[0036] As described above, when the planned dividing line L1 of the wafer W is detected, the Y-axis position of the cutting blade 33 (see Figure 3) of the cutting unit 30 is determined by the Y-axis moving mechanism 50, and the Y-axis position of the cutting blade 33 is aligned with the position of the planned dividing line L1 to be cut.

[0037] Then, while the cutting blade 33 of the cutting unit 30 is rotated at high speed from the above state, the cutting blade 33 is lowered by a predetermined cutting depth by the Z-axis moving mechanism 40, and the chuck table 10 and the wafer W held thereon are moved in the X-axis direction by the X-axis moving mechanism 20. Then, the wafer W is cut along the division lines L1 by the cutting blade 33 of the cutting unit 30, and when such an operation is performed for all the division lines L1 in one direction, the chuck table 10 and the wafer W held thereon are rotated by 90° by the rotation mechanism 12, and the wafer W is similarly cut along the division lines L2 (see FIG. 2) in the other direction perpendicular to the division lines L1 where cutting has been completed. In addition, in the cutting process of the wafer W by the cutting blade 33, cutting water (pure water) is sprayed toward the cutting blade 33.

[0038] As described above, in the cutting device 1 according to this embodiment, the pair of Y-axis guide rails 51 of the Y-axis moving mechanism 50 are disposed on the upper surface of the beam portion 3B of the gate column 3, so there is no need to dispose the Y-axis guide rails 51 above and below at a large distance in the vertical direction as in the past. This allows the thickness of the beam portion 3B of the gate column 3 to be thin, and as a result, the center of gravity of the entire gate column 3 can be lowered. As a result, the cutting position of the wafer W is not shifted due to vibration of the cutting unit 30 accompanying the movement of the chuck table 10 in the X-axis direction, and the occurrence of poor cutting can be effectively prevented. Furthermore, by placing the cutting unit 30 on one end of the Y-axis base 52 and the camera 53 on the other end, the rotational vibration of the cutting blade 33 of the cutting unit 30 during alignment of the wafer W is prevented from being transmitted to the camera 53 by the Z-axis moving mechanism 40, the pair of Y-axis guide rails 51 supporting the Y-axis base 52, and the beam portion 3B of the gate-shaped column 3 on which the pair of Y-axis guide rails 51 are positioned, thereby preventing the occurrence of alignment errors.

[0039] Furthermore, in this embodiment, as shown in FIG. 1, a semicircular cross-sectional drain oil groove 3b (only one side is shown in FIG. 1) is vertically provided in the up-down direction on the left and right side end faces (the -Y axis direction end face and the +Y axis direction end face) of the gate-type column 3. Therefore, even if oil leaks from the Y axis guide rail 51, the leaked oil falls along the drain oil groove 3b and is collected, preventing contamination of the surrounding area by the oil.

[0040] In addition, since it is now possible to access the Y-axis moving mechanism 50 from above the cutting device 1, maintenance work such as replacing the Y-axis guide rail 51, the Y-axis ball screw 54, and the Y-axis servo motor 55, and greasing the Y-axis guide rail 51 and the Y-axis ball screw 54 has become easier.

[0041] Here, in this embodiment, since the pair of Y-axis guide rails 51 of the Y-axis moving mechanism 50 are disposed on the upper surface of the beam portion 3B of the gate column 3, the entire weight of the Y-axis moving mechanism 50, the Z-axis moving mechanism 40, and the cutting unit 30 is supported by the beam portion 3B of the gate column 3. Specifically, as shown in Fig. 3, when the total weight P of the Y-axis moving mechanism 50, the Z-axis moving mechanism 40, and the cutting unit 30 acts on the center of gravity G, if the upward reaction forces that the Y-axis moving mechanism 50, the Z-axis moving mechanism 40, and the cutting unit 30 receive from the pair of Y-axis guide rails 51 are R1 and R2, the following equation is established between these total weight P and the reaction forces R1 and R2. P = R1 + R2 … (1) Furthermore, if the distances in the X-axis direction from the center of gravity G to the points on which the reaction forces R1 and R2 act are x1 and x2, respectively, the following equation holds due to moment balance. R1 x1 = R2 x2 … (2) Therefore, the following relationship holds between reaction forces R1 and R2 from equation (2). R1 = R2 (x2 / x1) <R2…(3) That is, the upper surface of the gate column 3 receives downward loads (resistance forces) N1, N2 from the pair of Y-axis guide rails 51 that are equal in magnitude to and opposite in direction to the reaction forces R1, R2.

[0042] Therefore, since the gate column 3 receives downward loads (resistance forces) N1, N2 from a pair of Y-axis guide rails 51 arranged on the upper surface of the beam portion 3B, no load or moment acts on the gate column 3 tending to tilt it.

[0043] <Second embodiment> Next, a cutting device according to a second embodiment of the present invention will be described below with reference to Fig. 5. In Fig. 5, the same elements as those shown in Fig. 1 are denoted by the same reference numerals, and the repeated description of those elements will be omitted below.

[0044] The cutting device 1A according to this embodiment is a so-called dual dicer, and is configured by arranging a first cutting unit (first processing mechanism) 30A and a second cutting unit (second processing mechanism) 30B to face each other in the Y-axis direction with a chuck table 10 sandwiched therebetween. Two Y-axis ball screws 54A, 54B are arranged parallel to each other along the Y-axis direction between a pair of Y-axis guide rails 51 arranged parallel to each other along the Y-axis direction on the upper surface of the beam portion 3B of the gate-shaped column 3.

[0045] Moreover, a Y-axis servo motor 55A, which is a rotation drive source, is connected to one axial end (left end in FIG. 5) of one Y-axis ball screw 54A, and a Y-axis servo motor (not shown), which is a rotation drive source, is connected to one axial end (right end in FIG. 5) of the other Y-axis ball screw 54B. Here, one Y-axis ball screw 54A and the Y-axis servo motor 55A constitute a first power section that moves the first cutting unit 30A in the Y-axis direction along the pair of Y-axis guide rails 51, and the other Y-axis ball screw 54B and the Y-axis servo motor (not shown) constitute a second power section that moves the second cutting unit 30B in the Y-axis direction along the pair of Y-axis guide rails 51.

[0046] Thus, in the cutting device 1A according to this embodiment, like the cutting device 1 according to the first embodiment (see FIG. 1), the wafer W, which is the workpiece, can be cut along the intended dividing lines L1, L2 (see FIG. 2), but since the first cutting unit 30A and the second cutting unit 30B can cut the wafer W simultaneously in parallel, the cutting efficiency is doubled and the cutting time can be reduced to 1 / 2. In addition, the cutting device 1A according to this embodiment also provides the same effects as those obtained in the cutting device 1 according to the first embodiment.

[0047] Although the present invention has been described above as being applied to a cutting device, the present invention can be similarly applied to any other processing devices such as grinding devices and polishing devices other than cutting devices.

[0048] Furthermore, in the above embodiment, the case where the workpiece is a wafer has been described, but the processing apparatus according to the present invention may be adapted to process any workpiece other than a wafer.

[0049] In addition, the present invention is not limited to the application of the embodiments described above, and various modifications are possible within the scope of the claims and the technical ideas described in the specification and drawings. [Explanation of symbols]

[0050] 1, 1A: cutting device (processing device), 2: base, 3: gate-type column, 3A: support part of the gate-type column, 3B: beam part of the gate-type column, 3a: opening part of the gate-type column, 3b: Waste oil groove, 10: Chuck table, 11: Clamp, 12: Rotation mechanism, 20: X-axis movement mechanism, 21: X-axis guide rail, 22: X-axis base, 23: X-axis ball screw, 24: X-axis servo motor, 30: cutting unit (machining mechanism), 30A: first cutting unit (first machining mechanism), 30B: second cutting unit (second machining mechanism), 31: spindle housing, 32: spindle, 33: cutting blade, 40: Z-axis movement mechanism, 41: Z-axis guide rail, 42: Z-axis base, 43: Z-axis ball screw, 44: Z-axis servo motor, 50: Y-axis movement mechanism, 51: Y-axis guide rail, 52: Y-axis base, 52A: support plate, 52B: slide member, 52a: horizontal part of slide member, 52b: vertical part of slide member, 52c: arm part of slide member, 53: camera, 54, 54A, 54B: Y-axis ball screw (power section), 55, 55A: Y-axis servo motor (power unit), D: device, F: ring frame, L1, L2: planned division lines, T: dicing tape, W: wafer (workpiece), WS: Workset

Claims

1. A processing device comprising: a chuck table for holding a workpiece; an X-axis movement mechanism for moving the chuck table in an X-axis direction which is a processing feed direction of the workpiece; a base on which the X-axis movement mechanism is disposed; a portal column disposed on the base and spanning the X-axis movement mechanism; a processing mechanism for processing the workpiece held on the chuck table; and a Y-axis movement mechanism disposed on the portal column for moving the processing mechanism in a Y-axis direction which is an indexing feed direction of the workpiece, The Y-axis moving mechanism includes: A guide rail is disposed on an upper surface of the gate-shaped column and extends in the Y-axis direction; a power unit disposed in parallel with the guide rail and configured to move the processing mechanism in a Y-axis direction; a Y-axis base that straddles the guide rail, is connected to the processing mechanism, and moves in the Y-axis direction along the guide rail; A processing apparatus comprising:

2. The processing mechanism includes a first processing mechanism and a second processing mechanism, 2. The processing device according to claim 1, wherein the power unit includes a first power unit that moves the first processing mechanism in the Y-axis direction, and a second power unit that moves the second processing mechanism in the Y-axis direction.

Images