Prober, performance board, probe card, and substrate inspection apparatus

Abstract

To provide a prober which can realize a preferable interface, and to provide a performance board, a probe card, and a substrate inspection apparatus.SOLUTION: A prober includes a stage configured to hold a substrate set as an inspection object. The prober further includes a housing which holds a probe card that can be electrically connected to the substrate, and a performance board that can be electrically connected to the probe card. Moreover, the housing includes a connection path which functions as a ground line and electrically connects the probe card with the performance board.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] FIELD OF THE DISCLOSURE The present invention relates to a prober, a performance board, a probe card, and a substrate inspection apparatus. [Background technology]

[0002] In substrate inspection equipment used to inspect substrates such as wafers, the number of pins (e.g., pogo pins) used as interfaces between parts becomes a bottleneck, limiting improvements in the performance of the substrate inspection equipment. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. WO2007 / 057944 [Patent Document 2] JP 2018-067603 A [Patent Document 3] JP 2020-064914 A Summary of the Invention [Problem to be solved by the invention]

[0004] A prober, a performance board, a probe card, and a substrate inspection device capable of realizing a suitable interface are provided. [Means for solving the problem]

[0005] According to one embodiment, a prober includes a stage for holding a substrate to be inspected. The prober further includes a housing for holding a probe card electrically connectable to the substrate and a performance board electrically connectable to the probe card. The housing further includes a connection path that functions as a ground wiring and electrically connects the probe card and the performance board. [Brief description of the drawings]

[0006] [Figure 1] 1 is a cross-sectional view showing a structure of a substrate inspection device according to a first embodiment. [Diagram 2] 4 is another cross-sectional view showing the structure of the substrate inspection apparatus of the first embodiment. FIG. [Diagram 3] 4 is another cross-sectional view showing the structure of the substrate inspection apparatus of the first embodiment. FIG. [Figure 4] FIG. 1 is a plan view showing a structure of a substrate inspection device according to a first embodiment. [Diagram 5] FIG. 4 is a cross-sectional view showing a structure of a substrate inspection device according to a first modified example of the first embodiment. [Figure 6] FIG. 11 is a cross-sectional view showing a structure of a substrate inspection device according to a second modified example of the first embodiment. [Figure 7] FIG. 11 is a cross-sectional view showing the structure of a substrate inspection device according to a third modified example of the first embodiment. [Figure 8] FIG. 11 is a cross-sectional view showing the structure of a substrate inspection device according to a second embodiment. [Figure 9] 11 is another cross-sectional view showing the structure of the substrate inspection apparatus according to the second embodiment. FIG. [Figure 10] FIG. 11 is a plan view showing the structure of a substrate inspection device according to a second embodiment. [Figure 11] FIG. 11 is a cross-sectional view showing details of the structure of a substrate inspection device according to a second embodiment. [Figure 12] FIG. 11 is a cross-sectional view showing the structure of a substrate inspection device according to a modified example of the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In Fig. 1 to Fig. 12, the same components are denoted by the same reference numerals, and duplicated descriptions will be omitted.

[0008] (First embodiment) FIG. 1 is a cross-sectional view showing the structure of a substrate inspection device according to a first embodiment.

[0009] The substrate inspection device of this embodiment is a device that inspects a substrate W. Specifically, the substrate inspection device of this embodiment inspects the substrate W in a wafer state. After this inspection, the wafer is divided into a plurality of chips (semiconductor devices) by dicing, for example. This inspection is also called a wafer test.

[0010] The substrate inspection apparatus of this embodiment includes a prober 1, a tester 2, and a probe card 3. The prober 1 includes a prober housing 1a and a wafer stage 1b. The tester 2 includes a tester body 2a, a test head 2b, and a performance board 2c.

[0011] 1 shows mutually perpendicular X, Y, and Z directions. In this specification, the +Z direction is treated as the upward direction, and the -Z direction is treated as the downward direction. The -Z direction may or may not coincide with the direction of gravity.

[0012] The prober 1 holds the substrate W to be inspected and various parts for inspection. Specifically, the prober housing 1a holds the test head 2b, the performance board 2c, and the probe card 3. In this embodiment, the test head 2b, the performance board 2c, and the probe card 3 are placed on the prober housing 1a and are supported by the prober housing 1a. This will be described in detail later. Meanwhile, the wafer stage 1b holds the substrate W. In this embodiment, the substrate W is placed on the wafer stage 1b and is supported by the wafer stage 1b. The prober 1 can move the substrate W supported by the wafer stage 1b in the up-down direction (±Z direction) as shown by the arrow in FIG. 1. The prober housing 1a and the wafer stage 1b are examples of a housing and a stage, respectively.

[0013] The tester 2 inspects the substrate W held by the prober 1. Specifically, the tester main body 2a generates an inspection signal for inspecting the substrate W, and outputs the inspection signal to the test head 2b via the cable C. The test head 2b receives the inspection signal from the tester main body 2a via the cable C, and outputs the inspection signal to the performance board 2c. The performance board 2c receives the inspection signal from the test head 2b, and outputs the inspection signal to the probe card 3. In FIG. 1, the performance board 2c is detachably attached to the test head 2b.

[0014] The performance board 2c is electrically connected to the probe card 3 by a plurality of pins P1. The test signals output from the test head 2b are input to the probe card 3 via these pins P1. These pins P1 are, for example, pogo pins. These pins P1 may be held by the performance board 2c, may be held by the probe card 3, or may be held by the prober housing 1a.

[0015] The probe card 3 is a tool for electrically connecting the performance board 2c to the substrate W. The probe card 3 receives an inspection signal from the performance board 2c and outputs the inspection signal to the substrate W.

[0016] The probe card 3 is electrically connected to the substrate W by a plurality of pins P2. An inspection signal output from the probe card 3 is input to the substrate W via these pins P2. These pins P2 are, for example, probe needles. These pins P2 are, for example, held by the probe card 3.

[0017] FIG. 2 is another cross-sectional view showing the structure of the substrate inspection apparatus of the first embodiment.

[0018] 2 shows the shape of the prober housing 1a of this embodiment in detail. The prober housing 1a of this embodiment has an upper surface S1, an upper surface S2 provided at a position lower than the upper surface S1, and an upper surface S3 provided at a position lower than the upper surface S2. As shown in FIG. 2, the test head 2b is placed on the upper surface S1, the performance board 2c is placed on the upper surface S2, and the probe card 3 is placed on the upper surface S3. In this embodiment, the test head 2b, the performance board 2c, and the probe card 3 can be removed from the prober housing 1a by lifting the test head 2b, the performance board 2c, and the probe card 3 from the prober housing 1a.

[0019] Fig. 3 is another cross-sectional view showing the structure of the substrate inspection apparatus of the first embodiment. Fig. 3 shows the structure of the ground wiring (GND wiring) in the substrate inspection apparatus of the present embodiment.

[0020] 3, the prober housing 1a includes a ground wiring 11, a bump 12, and a bump 13. The performance board 2c includes a ground wiring 21 and a pad 22. The probe card 3 includes a ground wiring 31 and a pad 32.

[0021] The ground wiring 11, the bump 12, and the bump 13 form a connection path that electrically connects the performance board 2c and the probe card 3. The ground wiring 11, the bump 12, and the bump 13 function as ground wiring in the prober housing 1a. In FIG. 3, the bump 12 is provided at one end of the ground wiring 11, and the bump 13 is provided at the other end of the ground wiring 11. The bumps 12 and 13 are used as connection terminals of the ground wiring in the prober housing 1a. The bumps 12 and 13 are formed by precipitation, for example, by electroless nickel plating, and have high hardness, wear resistance, and low resistance. The ground wiring 11, the bump 12, and the bump 13 are formed of a conductive material such as a metal.

[0022] The bumps 12 form a part of the upper surface S2 of the prober housing 1a. The performance board 2c of this embodiment is placed on the bumps 12, and is thereby electrically connected to the bumps 12. The bumps 12 function as a support portion that supports the performance board 2c, and also function as a connection portion that electrically connects the performance board 2c to the ground wiring 11. The bumps 12 are an example of a first connection portion and a first support portion.

[0023] The bumps 13 form a part of the upper surface S3 of the prober housing 1a. The probe card 3 of this embodiment is placed on the bumps 13, and is thereby electrically connected to the bumps 13. The bumps 13 function as a support portion that supports the probe card 3, and also function as a connection portion that electrically connects the probe card 3 to the ground wiring 11. The bumps 13 are an example of a second connection portion and a second support portion.

[0024] The ground wiring 11 forms a path that electrically connects the bumps 12 and 13 inside the prober housing 1a. According to this embodiment, by placing the performance board 2c on the bumps 12 and placing the probe card 3 on the bumps 13, for example, it becomes possible to electrically connect the substrate W to the ground wirings 11, 21, and 31.

[0025] The ground wiring 21 and the pad 22 function as the ground wiring in the performance board 2c. In Fig. 3, the pad 22 is provided at one end of the ground wiring 21. The pad 22 is used as a connection terminal of the ground wiring in the performance board 2c. The ground wiring 21 and the pad 22 are formed of a conductive material such as a metal.

[0026] 3, the pads 22 form part of the lower surface of the performance board 2c. In this embodiment, the pads 22 are placed on the bumps 12, and are thereby electrically connected to the bumps 12. The pads 22 function as a support portion supported by the bumps 12, and also function as a connection portion that electrically connects the bumps 12 to the ground wiring 21. The pads 22 are an example of a first wiring connection portion and a first supported portion.

[0027] The ground wiring 21 is laid inside the performance board 2c. The ground wiring 21 is electrically connected to, for example, the ground wiring inside the test head 2b and the ground wiring inside the tester main body 2a. The ground wiring 21 is an example of a first wiring.

[0028] The ground wiring 31 and the pad 32 function as a ground wiring in the probe card 3. In Fig. 3, the pad 32 is provided at one end of the ground wiring 31. The pad 32 is used as a connection terminal of the ground wiring in the probe card 3. The ground wiring 31 and the pad 32 are formed of a conductive material such as a metal.

[0029] 3, the pad 32 forms a part of the lower surface of the probe card 3. The pad 32 in this embodiment is placed on the bump 13, and is thereby electrically connected to the bump 13. The pad 32 functions as a support portion supported by the bump 13, and also functions as a connection portion that electrically connects the bump 13 to the ground wiring 31. The pad 32 is an example of a second wiring connection portion and a second supported portion.

[0030] The ground wiring 31 is laid inside the probe card 3. The ground wiring 31 can be electrically connected to a ground wiring inside the substrate W via, for example, a pin P2. The ground wiring 31 is an example of a second wiring.

[0031] Next, still referring to FIG. 3, the details of the ground wiring in the circuit board inspection device of this embodiment will be described.

[0032] In this embodiment, the ground wiring 21 in the performance board 2c and the ground wiring 31 in the probe card 3 are electrically connected by the ground wiring 11 in the prober housing 1a, not by the pin P1. When the ground wiring 21 and the ground wiring 31 are electrically connected by the pin P1, the following problems arise.

[0033] In recent years, there has been a trend toward increasing the number of pins P1 between the performance board 2c and the probe card 3. However, there is an upper limit to the number of pins P1 that can be arranged between the performance board 2c and the probe card 3. Therefore, the number of pins P1 becomes a bottleneck, restricting improvement in the performance of the board inspection device.

[0034] For example, the upper limit on the number of pins P1 becomes a bottleneck in satisfying the demand to increase the number of chips that can be simultaneously inspected, and as a result, it becomes difficult to increase the number of pins P1 and improve the inspection efficiency of the substrate W.

[0035] In addition, the upper limit on the number of pins P1 becomes a bottleneck in satisfying the demand to increase the number of power supply wiring, ground wiring, and signal wiring of each chip, and as a result, it becomes difficult to increase these wirings while improving the inspection efficiency of the substrate W at the same time.

[0036] In addition, the upper limit on the number of pins P1 becomes a bottleneck in meeting the demand to increase the current consumption of each chip during testing. The reason is that test items that consume large currents are emerging. However, if the current consumption is increased, it is necessary to increase the number and cross-sectional area of ​​the ground wiring to release the large consumed current. As a result, it becomes difficult to increase the current consumption and improve the inspection efficiency of the board W at the same time.

[0037] To address these issues, it is conceivable to make the pin P1 thinner or to narrow the interval between the pins P1. However, making the pin P1 thinner may increase the electrical resistance of the pin P1. Also, narrowing the interval between the pins P1 may cause crosstalk between the pins P1.

[0038] On the other hand, in this embodiment, the ground wiring 21 in the performance board 2c and the ground wiring 31 in the probe card 3 are electrically connected by the ground wiring 11 in the prober housing 1a, not by the pin P1. Therefore, according to this embodiment, the pin P1 for grounding is not necessary, and it is possible to reduce the number of pins P1 between the performance board 2c and the probe card 3.

[0039] Although it is difficult to increase the number and cross-sectional area of ​​the pins P1, it is easy to increase the number and cross-sectional area of ​​the ground wiring 11 in the prober housing 1a. This is because there is ample space in the prober housing 1a. Therefore, according to this embodiment, it is possible to deal with the problem of the large current by increasing the number and cross-sectional area of ​​the ground wiring 11 in the prober housing 1a.

[0040] The bumps 12 and 13 may be replaced with other connection parts. The pads 22 and 32 may be replaced with other connection parts. For example, the bumps 12 and 13 may be replaced with pads, and the pads 22 and 32 may be replaced with bumps. The prober housing 1a and the performance board 2c may be electrically connected by pogo pins similar to the pins P1, instead of the bumps 12 and the pads 22. Similarly, the prober housing 1a and the probe card 3 may be electrically connected by pogo pins similar to the pins P1, instead of the bumps 13 and the pads 32.

[0041] The prober housing 1a may hold the performance board 2c and the probe card 3 in a manner different from the above-mentioned "placement" and "support". For example, the performance board 2c and the probe card 3 may be held by vacuum suction in the substrate inspection device. In this case, the prober housing 1a holds the performance board 2c by contacting the performance board 2c, and indirectly holds the probe card 3 by holding the performance board 2c that is adsorbed by vacuum suction. In addition, it is preferable that the prober housing 1a, the performance board 2c, and the probe card 3 in this case have connecting parts that can ensure airtightness for vacuum suction instead of the bumps 12, 13 and the pads 22, 32. An example of such a connecting part is an anisotropic rubber contactor. The vacuum suction may be performed by the prober housing 1a or by another component in the substrate inspection device. For example, the prober housing 1a may hold the performance board 2c and the probe card 3 by adsorbing the performance board 2c and the probe card 3 by vacuum suction and supporting the performance board 2c.

[0042] FIG. 4 is a plan view showing the structure of the substrate inspection apparatus of the first embodiment.

[0043] Fig. 4 shows upper surfaces S2 and S3 of the prober housing 1a, a plurality of bumps 12 forming a part of the upper surface S2, and a plurality of bumps 13 forming a part of the upper surface S3. The bump 12 shown in Fig. 3 is one of these bumps 12, and the bump 13 shown in Fig. 3 is one of these bumps 13. In Fig. 4, the upper surface S2 other than the bumps 12 and the upper surface S3 other than the bumps 13 are shown by dot hatching.

[0044] The top surface S3 of this embodiment has an annular shape in a plan view, and has circular inner and outer peripheries. The bumps 13 on the top surface S3 are arranged in an annular shape along the inner and outer peripheries. The top surface S2 of this embodiment has a circular inner periphery in a plan view. The bumps 12 on the top surface S2 are arranged in an annular shape along the inner periphery.

[0045] The prober housing 1a may have only one bump 12, or may have multiple bumps 12. However, if there is only one bump 12, there is a risk that the performance board 2c on the bump 12 may tilt, or the electrical resistance of the bump 12 may become high. For this reason, it is preferable that the prober housing 1a has multiple bumps 12. The same applies to the bumps 13.

[0046] FIG. 5 is a cross-sectional view showing the structure of a substrate inspection device according to a first modified example of the first embodiment.

[0047] The substrate inspection device of this modified example has a structure similar to that shown in Fig. 3. However, most of the prober housing 1a of this modified example is formed of a conductive material 14, which functions as a ground wiring within the prober housing 1a. The conductive material 14 forms a path that electrically connects the bumps 12 and 13.

[0048] FIG. 6 is a sectional view showing the structure of a substrate inspection device according to a second modified example of the first embodiment.

[0049] The substrate inspection device of this modified example has a structure similar to that shown in Fig. 5. However, the prober housing 1a of this modified example includes the above-mentioned conductive material 14 and an insulating material 15 provided on the surface of the conductive material 14. This makes it possible to prevent the conductive material 14 from causing an unintended short circuit.

[0050] FIG. 7 is a sectional view showing the structure of a substrate inspection device according to a third modified example of the first embodiment.

[0051] The substrate inspection device of this modified example includes multiple sets of a prober 1, a tester 2, and a probe card 3. Each set of the prober 1, the tester 2, and the probe card 3 generally has the same structure as the prober 1, the tester 2, and the probe card 3 of the first embodiment (FIGS. 1 to 4). This makes it possible to inspect multiple substrates W simultaneously.

[0052] The substrate inspection apparatus of this modified example further includes a ground plate 4 disposed near the prober 1. The ground plate 4 is made of a conductive material and functions as a ground wiring. The ground plate 4 is an example of a ground member.

[0053] The substrate inspection apparatus of this modified example further includes a plurality of filters 5 provided between these probers 1 and the ground plate 4 or between these probers 1. In the former case, each filter 5 is electrically connected to the prober housing 1a of one prober 1 and the ground plate 4. In the latter case, each filter 5 is electrically connected to the prober housing 1a of one prober 1 and the prober housing 1a of another prober 1. In the former case, each filter 5 is an example of a first filter, and in the latter case, each filter 5 is an example of a second filter.

[0054] Each of these filters 5 has a predetermined mutual inductance. This makes it possible to remove the influence of EMI (Electro Magnetic Interference) noise from each prober 1 and to suppress the influence of EMI noise between the probers 1. Furthermore, according to this modification, by providing a ground plate 4 for countermeasures against EMI noise and a filter 4 electrically connected to the ground plate 4, it becomes possible to reduce the influence of EMI noise from the external environment on each prober 1.

[0055] As described above, in this embodiment, the ground wiring 21 in the performance board 2c and the ground wiring 31 in the probe card 3 are electrically connected by the ground wiring 11 in the prober housing 1a. Therefore, according to this embodiment, it is possible to reduce the number of pins P1 used as an interface between the performance board 2c and the probe card 3, and it is possible to realize a suitable interface.

[0056] Second embodiment FIG. 8 is a cross-sectional view showing the structure of a substrate inspection device according to the second embodiment.

[0057] The substrate inspection apparatus of this embodiment has a structure similar to that of the substrate inspection apparatus of the first embodiment (FIGS. 1 to 4). However, the prober housing 1a of this embodiment includes a frame 41 and a plurality of blocks .

[0058] The frame 41 has a plate-like shape extending in the X and Y directions, and has a plurality of openings in a plan view. Each block 42 is held by the frame 41 by being fitted into one of these openings. Each block 42 in this embodiment holds a plurality of pins P1 for electrically connecting the performance board 2c and the probe card 3. These pins P1 are, for example, pogo pins. Each pin P1 is an example of a connecting member.

[0059] The frame 41 is formed of a conductive material such as metal. Each block 42 is formed of an insulating material such as resin. The performance board 2c and the probe card 3 of this embodiment are held by vacuum suction in the substrate inspection device. The performance board 2c of this embodiment is placed on the frame 41, and is thereby held by the prober housing 1a.

[0060] FIG. 9 is another cross-sectional view showing the structure of the substrate inspection apparatus according to the second embodiment.

[0061] 9 shows an enlarged view of the frame 41 and the blocks 42 of this embodiment. As shown in FIG. 9, the frame 41 of this embodiment is in contact with the lower surface of the performance board 2c and is in contact with the upper surface of the probe card 3. This makes it possible for the frame 41 to ensure the horizontality of the performance board 2c and the probe card 3. Each block 42 is fitted into one of a plurality of openings of the frame 41.

[0062] FIG. 10 is a plan view showing the structure of a substrate inspection apparatus according to the second embodiment.

[0063] In Fig. 10, the frame 41 is shown with dense dot hatching, and the prober housing 1a other than the frame 41 and the blocks 42 is shown with sparse dot hatching. As shown in Fig. 10, the frame 41 has a number of openings, and each block 42 fits into one of these openings.

[0064] FIG. 11 is a cross-sectional view showing the details of the structure of the substrate inspection device of the second embodiment.

[0065] The substrate inspection apparatus of the first embodiment has the structure shown in Fig. 3, whereas the substrate inspection apparatus of the present embodiment has the structure shown in Fig. 11. The performance board 2c and the probe card 3 of the present embodiment have the same structures as the performance board 2c and the probe card 3 of the first embodiment. However, in the present embodiment, the pads 22 form a part of the lower surface of the performance board 2c above the frame 41, and the pads 32 form a part of the upper surface of the probe card 3 below the frame 41.

[0066] In addition, the ground wiring 11, the bump 12, and the bump 13 in this embodiment form a connection path that electrically connects the performance board 2c and the probe card 3 within the frame 41. In FIG. 11, the bump 12 is provided at the upper end of the ground wiring 11, and the bump 13 is provided at the lower end of the ground wiring 11.

[0067] The bumps 12 in this embodiment form the upper end of the frame 41. The performance board 2c (pads 22) in this embodiment comes into contact with the bumps 12, and is thereby electrically connected to the bumps 12. The bumps 12 in this embodiment function as connection parts that electrically connect the performance board 2c to the ground wiring 11. Also, the bumps 12 in this embodiment function as support parts that support the performance board 2c.

[0068] The bumps 13 in this embodiment form the lower end of the frame 41. The probe card 3 (pads 32) in this embodiment comes into contact with the bumps 13, and is thereby electrically connected to the bumps 13. The bumps 13 in this embodiment function as connection parts that electrically connect the probe card 3 to the ground wiring 11.

[0069] The ground wiring 11 of this embodiment forms a path that electrically connects the bumps 12 and 13 within the frame 41. According to this embodiment, by bringing the bumps 12 into contact with the performance board 2c and bringing the bumps 13 into contact with the probe card 3, for example, it becomes possible to electrically connect the substrate W to the ground wirings 11, 21, and 31.

[0070] In addition, in this embodiment, the ground wiring 11, the bump 12, and the bump 13 are part of the frame 41, but part of the ground wiring 11, the bump 12, and the bump 13 in this embodiment may be part of the prober housing 1a other than the frame 41.

[0071] In this embodiment, the entire frame 41 except for the bumps 12 and 13 may be used as the ground wiring 11. In this case, the entire frame 41 except for the bumps 12 and 13 is made of a conductive material, the bump 12 is formed on the upper surface of this conductive material, and the bump 13 is formed on the lower surface of this conductive material. This makes it possible to use this conductive material in the same manner as the conductive material 14 shown in Fig. 5, and to realize a structure similar to the ground wiring of the prober housing 1a shown in Fig. 5.

[0072] FIG. 12 is a cross-sectional view showing the structure of a substrate inspection device according to a modified example of the second embodiment.

[0073] The substrate inspection apparatus of this modification has a structure shown in FIG. 11, instead of the structure shown in FIG. 2 (first embodiment). The prober housing 1a of this modification has an upper surface S1 for supporting the test head 2b and an upper surface S2 for supporting the performance board 2c, but does not have an upper surface S3 for supporting the probe card 3. In this modification, the performance board 2c and the probe card 3 are held by vacuum suction in the substrate inspection apparatus, so the prober housing 1a does not have an upper surface S3. Moreover, the upper surface S2 may be provided only on the frame 41, or may be provided on the prober housing 1a other than the frame 41.

[0074] As described above, in this embodiment, the ground wiring 21 in the performance board 2c and the ground wiring 31 in the probe card 3 are electrically connected by the ground wiring 11 in the frame 41. Therefore, according to this embodiment, as in the first embodiment, it is possible to reduce the number of pins P1 used as an interface between the performance board 2c and the probe card 3, and it is possible to realize a suitable interface.

[0075] In the description of this embodiment, the bumps 12 and 13 are treated as components within the frame 41, i.e., as parts of the frame 41, but they may be treated as components outside the frame 41. This is the same in the case where the prober housing 1a has connection parts other than the bumps 12 and 13.

[0076] Although several embodiments have been described above, these embodiments are presented only as examples and are not intended to limit the scope of the invention. The novel prober, board, card, and device described in this specification can be embodied in various other forms. In addition, various omissions, substitutions, and modifications can be made to the forms of the prober, board, card, and device described in this specification without departing from the gist of the invention. The appended claims and their equivalents are intended to include such forms and modifications that fall within the scope and gist of the invention. [Explanation of symbols]

[0077] 1: prober, 1a: prober housing, 1b: wafer stage, 2: tester, 2a: tester body, 2b: test head, 2c: performance board, 3: probe card, 4: ground plate, 5: filter, 11: ground wiring, 12: bump, 13: bump, 14: conductive material, 15: insulating material, 21: ground wiring, 22: pad, 31: ground wiring, 32: pad, 41: Frame, 42: Block

Claims

1. a stage for holding a substrate to be inspected; a housing for holding a probe card electrically connectable to the substrate and a performance board electrically connectable to the probe card; The prober, wherein the housing functions as a ground wiring and includes a connection path that electrically connects the probe card and the performance board.

2. The connection path is a first connection portion that electrically connects the connection path to the performance board; a second connection portion that electrically connects the connection path to the probe card; a path electrically connecting the first connection portion and the second connection portion, 2. The prober of claim 1.

3. the first connection portion is a first support portion that supports the performance board so as to be electrically connected to the performance board; The second connection portion is a second support portion that supports the probe card so as to be electrically connected to the probe card.

3. The prober according to claim 2.

4. the first support portion is a bump that supports the performance board, The second support portion is a bump that supports the probe card.

4. The prober according to claim 3.

5. The performance board is A first wiring that functions as a ground wiring; a first wiring connection portion that electrically connects the first wiring to the connection path, The probe card comprises: A second wiring that functions as a ground wiring; a second wiring connection portion that electrically connects the second wiring to the connection path; 2. The prober of claim 1.

6. the first wiring connection portion is a first supported portion that is supported by the housing so as to be electrically connected to the connection path, the second wiring connection portion is a second supported portion that is supported by the housing so as to be electrically connected to the connection path; 6. The prober according to claim 5.

7. 7. The prober according to claim 6, wherein each of the first supported portion and the second supported portion is a pad supported by the housing.

8. The housing includes a frame that holds a plurality of blocks; Each of the blocks holds a connection member that electrically connects the probe card and the performance board.

2. The prober of claim 1.

9. 9. The prober according to claim 8, wherein at least a portion of the connection path is provided within the frame.

10. The connection path is a first connection portion that electrically connects the connection path to the performance board; a second connection portion that electrically connects the connection path to the probe card; a path provided within the frame and electrically connecting the first connection portion and the second connection portion; 9. The prober according to claim 8.

11. the first connection portion is a bump that contacts the performance board; The second connection portion is a bump that contacts the probe card. The prober of claim 10.

12. The performance board is A first wiring that functions as a ground wiring; a first wiring connection portion that electrically connects the first wiring to the connection path, The probe card comprises: A second wiring that functions as a ground wiring; a second wiring connection portion that electrically connects the second wiring to the connection path; 9. The prober according to claim 8.

13. The prober according to claim 12 , wherein each of the first wiring connection portion and the second wiring connection portion is a pad that contacts the housing.

14. A performance board that can be electrically connected to a substrate to be tested via a probe card, A first wiring that functions as a ground wiring; a first wiring connection portion that electrically connects the first wiring to a housing of a prober that holds the substrate; A performance board equipped with

15. The performance board according to claim 14 , wherein the first wiring connection portion is a first supported portion that is supported by the housing so as to be electrically connected to the housing.

16. A probe card that can be electrically connected to a substrate to be tested, A second wiring that functions as a ground wiring; a second wiring connection portion that electrically connects the second wiring to a housing of a prober that holds the substrate; A probe card comprising:

17. The probe card according to claim 16 , wherein the second wiring connection portion is a second supported portion supported by the housing so as to be electrically connected to the housing.

18. a probe card that can be electrically connected to a substrate to be inspected; a tester including a performance board electrically connectable to the probe card; a prober including a stage for holding the substrate and a housing for holding the probe card and the performance board; Equipped with The substrate inspection device, wherein the housing functions as a ground wiring and includes a connection path that electrically connects the probe card and the performance board.

19. a grounding member provided near the prober and functioning as a ground wiring; a first filter provided between the prober and the ground member and having a predetermined mutual inductance; The substrate inspection apparatus of claim 18 further comprising:

20. 20. The substrate inspection apparatus according to claim 18, further comprising a second filter provided between the prober and another prober in the substrate inspection apparatus, the second filter having a predetermined mutual inductance.

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