Semiconductor manufacturing apparatus

Abstract

To provide a technique that can improve accuracy in bending a terminal, in manufacturing products with different sizes, in a semiconductor manufacturing apparatus.SOLUTION: A semiconductor manufacturing apparatus 100 is provided with: a plurality of pairs of dies 5 and 6 that can be switched between a first fixing position and a first retreating position; a plurality of pairs of punches 7 and 8 that can be switched between a second fixing position and a second retreating position; a pair of terminal bending parts that bend terminals 2b by contacting portions, which are not fixed by the plurality of pairs of dies 5 and 6 and the plurality of pairs of punches 7 and 8, in the terminals 2b; and a control part 30 that controls switching of the plurality of pairs of dies 5 and 6 and switching of the plurality of pairs of punches 7 and 8. When fixing the terminals 2b, one pair of dies of the plurality of pairs of dies 5 and 6 is switched into the first fixing position, and one pair of punches of the plurality of pairs of punches 7 and 8 is switched into the second fixing position, which enables the pair of terminal bending parts to move in a horizontal direction.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to semiconductor manufacturing equipment. [Background technology]

[0002] Semiconductor devices that are mounted by inserting terminals into a control board are available in a variety of sizes, large and small, depending on the application. For example, Patent Document 1 discloses a device in which a die having a punch and a die is installed, and a gull-wing shape of the terminal is formed between the punch and the die. The technology described in Patent Document 1 can accommodate products of different sizes by moving the positions of the punch and die according to the product size. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2004-214497 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, with the technology described in Patent Document 1, when manufacturing products of different sizes, it is necessary to move the entire mold to a precise position in order to move the positions of the punch and die, which makes it difficult to bend terminals with high precision.

[0005] Therefore, an object of the present disclosure is to provide a technique capable of improving the bending accuracy of terminals when manufacturing products of different sizes in a semiconductor manufacturing device. [Means for solving the problem]

[0006] The semiconductor manufacturing apparatus according to the present disclosure comprises multiple pairs of dies switchable between a first fixing position in which the semiconductor device is fixed in contact with terminals protruding from a pair of opposing sides of the semiconductor device from below, and a first retracted position in which the semiconductor device is retracted from the terminals; multiple pairs of punches switchable between a second fixing position in which the semiconductor device is fixed in contact with the terminals from above, and a second retracted position in which the semiconductor device is retracted from the terminals; a pair of terminal bending units that bend the terminals by contacting portions of the terminals that are not fixed by the multiple pairs of dies and the multiple pairs of punches; and a control unit that controls the switching of the multiple pairs of dies and the multiple pairs of punches, wherein when the terminals are fixed, one pair of the dies of the multiple pairs of dies is switched to the first fixing position, and one pair of the punches of the multiple pairs of punches is switched to the second fixing position, and the pair of terminal bending units are movable horizontally. Effect of the Invention

[0007] According to the present disclosure, when manufacturing products of different sizes, the pair of dies are switched to the first fixed position, the pair of punches are switched to the second fixed position, and the pair of terminal bending parts are moved horizontally in accordance with the product size, so that the pair of terminal bending parts can be arranged at the bending position. In this way, the pair of terminal bending parts can be arranged at the bending position by moving the pair of terminal bending parts individually in the horizontal direction without moving the entire die, so that the bending accuracy of the terminals can be improved when manufacturing products of different sizes. [Brief description of the drawings]

[0008] [Figure 1] 2 is a side view showing a state in which one die and punch are switched in the semiconductor manufacturing apparatus according to the first embodiment. FIG. [Diagram 2] 11 is a side view showing a state in which the semiconductor manufacturing apparatus according to the first embodiment has been switched to the other die and punch. FIG. [Diagram 3] 4 is a side view showing a terminal bending process of the semiconductor manufacturing apparatus according to the first embodiment. FIG. [Figure 4] FIG. 2 is a side view showing different sizes of semiconductor devices. [Diagram 5] FIG. 11 is a side view of a semiconductor manufacturing apparatus according to a second embodiment. [Figure 6] FIG. 11 is a top view of a semiconductor manufacturing apparatus according to a second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] <Embodiment 1> <Overall composition> The first embodiment will be described below with reference to the drawings. Fig. 1 is a side view showing a state in which one die 5 and punch 7 are switched to in the semiconductor manufacturing apparatus 100 according to the first embodiment. Fig. 2 is a side view showing a state in which the other die 6 and punch 8 are switched to in the semiconductor manufacturing apparatus 100 according to the first embodiment.

[0010] As shown in FIGS. 1 and 2, a semiconductor manufacturing apparatus 100 is an apparatus for performing a terminal bending process for bending terminals 2b of a semiconductor device 1 upward.

[0011] First, the semiconductor device 1 will be briefly described with reference to Figures 3(a) and (b) and Figures 4(a) and (b). Figure 3(a) is a side view showing the semiconductor device 1 before the terminal bending process, and Figure 3(b) is a side view showing the semiconductor device 1 after the terminal bending process. Figure 4(a) is a side view showing the semiconductor device 1 having a width w1 of the package resin 2a, and Figure 4(b) is a side view showing the semiconductor device 1 having a width w2 of the package resin 2a. Here, w1 <w2とする。

[0012] As shown in Figures 3(a) and 3(b) and Figures 4(a) and 4(b), the semiconductor device 1 includes a package resin 2a and terminals 2b. Although not shown, a semiconductor element mounted on an insulating substrate is sealed in the package resin 2a. The terminals 2b protrude from a pair of opposing sides of the package resin 2a and are electrically connected to the semiconductor element in the package resin 2a.

[0013] As shown in Fig. 3(a), before the terminal bending process, the terminals 2b extend linearly in the horizontal direction (the left-right direction in Fig. 3(a)). As shown in Fig. 3(b), in the terminal bending process, the terminals 2b are bent upward. In the first embodiment, as shown in Figs. 4(a) and 4(b), a case will be described in which the terminal bending process is performed on two types of semiconductor devices 1 having package resins 2a with widths w1 and w2.

[0014] Returning to the description of the semiconductor manufacturing apparatus 100, as shown in Fig. 1 and Fig. 2, the semiconductor manufacturing apparatus 100 includes a plurality of pairs (e.g., two pairs) of dies 5 and 6, a plurality of pairs (e.g., two pairs) of punches 7 and 8, a pair of rollers 3 serving as a pair of terminal bending units, and a control unit 30.

[0015] The two pairs of dies 5, 6 are arranged below the semiconductor device 1 and can be switched between a first fixing position where the semiconductor device 1 is fixed in contact with the terminals 2b from below and a first retracted position where the semiconductor device 1 is retracted from the terminals 2b. The pair of dies 6 are arranged outside the pair of dies 5 in a side view. The pair of dies 5 is used for a semiconductor device 1 having a width w1, and the pair of dies 6 is used for a semiconductor device 1 having a width w2. The first fixing position is located directly below the base of the terminals 2 protruding from the side of the package resin 2a and is in contact with the base of the terminals 2 from below. The first retracted position is located below the first fixing position and is not in contact with the terminals 2b.

[0016] The two pairs of punches 7, 8 are arranged on the upper side of the semiconductor device 1, and can be switched between a second fixing position where the semiconductor device 1 is fixed in contact with the terminal 2b from above, and a second retracted position where the semiconductor device 1 is retracted from the terminal 2b. The pair of punches 7 are arranged at a position facing the pair of dies 5 so that the terminal 2b can be fixed by the pair of dies 5. The pair of punches 8 are arranged at a position facing the pair of dies 6 so that the terminal 2b can be fixed by the pair of dies 6. That is, the pair of punches 8 are arranged outside the pair of punches 7 in a side view. The pair of punches 7 are used for a semiconductor device 1 having a width w1, and the pair of punches 8 are used for a semiconductor device 1 having a width w2. The second fixing position is a position located directly above the base of the terminal 2b and contacts the base of the terminal 2b from above. The second retracted position is a position located above the second fixing position and does not contact the terminal 2b.

[0017] When the terminal 2b is fixed, one pair of dies 5 (or one pair of dies 6) of the two pairs of dies 5, 6 is switched to a first fixed position and the remaining pair of dies 6 (or one pair of dies 5) is switched to a first retracted position in accordance with the size of the semiconductor device 1. In addition, one pair of punches 7 (or one pair of punches 8) of the two pairs of punches 7, 8 is switched to a second fixed position and the remaining pair of punches 8 (or one pair of punches 7) is switched to a second retracted position.

[0018] Here, the number of pairs of the die and punch is not limited to two, and may be three or more. In this case, the die and punch must be disposed in positions facing each other via the terminal 2b. The size of the semiconductor device 1 is the width of the package resin 2a.

[0019] The pair of rollers 3 is supported by a pair of roller support parts 3a, and the pair of roller support parts 3a is held by a slide mechanism (not shown) so as to be movable in the horizontal direction (left and right direction in FIG. 1). The pair of rollers 3 is disposed on the outer sides of the two pairs of dies 5, 6 in a side view. The pair of rollers 3 bends the terminal 2b by contacting a portion of the terminal 2b that is not fixed by the two pairs of dies 5, 6 and the two pairs of punches 7, 8, specifically, a portion of the terminal 2b that is fixed by the pair of dies 5 (or the pair of dies 6) and the pair of punches 7 (or the pair of punches 8). Here, the tip side of the terminal 2b is opposite to the package resin 2a side of the terminal 2b.

[0020] The two pairs of dies 5, 6 and the two pairs of punches 7, 8 are held so as to be movable up and down, for example, by a slide mechanism (not shown). In the terminal bending process, the terminal 2b is fixed by the pair of dies and the pair of punches, and then the pair of dies and the pair of punches are lowered and the pair of rollers 3 come into contact with the terminal 2b from below, thereby bending the tip side of the terminal 2b upward. Specifically, with the pair of rollers 3 in contact with the terminal 2b from below, the pair of dies and the pair of punches are further lowered, thereby bending the tip side of the terminal 2b upward.

[0021] The control unit 30 controls each part of the semiconductor manufacturing apparatus 100 based on a control program for the terminal bending process stored in its own memory. The control unit 30 is, for example, a processor. Specifically, the control unit 30 controls switching between the two pairs of dies 5, 6 and the two pairs of punches 7, 8, and driving of the slide mechanism. The control unit 30 determines which pair of the two pairs of dies 5, 6 and the two pairs of punches 7, 8 to use based on information about the size of the semiconductor device 1. The information about the size of the semiconductor device 1 may be input by the manufacturer from an external input device, or may be read from the memory of the control unit 30.

[0022] <Operation> Next, the operation of the semiconductor manufacturing apparatus 100 will be described. As shown in Fig. 1, first, the base of the terminal 2b is fixed by a pair of dies 5 and a pair of punches 7. Alternatively, as shown in Fig. 2, the base of the terminal 2b is fixed by a pair of dies 6 and a pair of punches 8. At this time, the control unit 30 determines which pair of the two pairs of dies 5, 6 and the two pairs of punches 7, 8 to use, based on information regarding the size of the semiconductor device 1.

[0023] The lower parts of the two pairs of dies 5, 6 are supported by springs (not shown), and after the terminal 2b is fixed, the punch 7 (or punch 8) and die 5 (or die 6) descend to bring the terminal 2b into contact with the pair of rollers 3. With the pair of rollers 3 in contact with the terminal 2b from below, the pair of dies and the pair of punches further descend, bending the tip side of the terminal 2b upward.

[0024] The two pairs of dies 5, 6 and the two pairs of punches 7, 8 are fixed so as not to move horizontally, but the pair of rollers 3 are made movable horizontally, making it possible to bend terminals of various sizes in the semiconductor manufacturing equipment 100.

[0025] <Effects> As described above, the semiconductor manufacturing apparatus 100 according to the first embodiment includes a plurality of pairs of dies 5, 6 that can be switched between a first fixing position where the semiconductor device 1 is fixed in a state where the dies 5, 6 are in contact with the terminals 2b protruding from a pair of opposing side portions of the semiconductor device 1 from below, and a first retracted position where the dies 5, 6 are retracted from the terminals 2b, a plurality of pairs of punches 7, 8 that can be switched between a second fixing position where the semiconductor device 1 is fixed in a state where the dies 5, 6 are in contact with the terminals 2b from above, and a second retracted position where the dies 7, 8 are retracted from the terminals 2b, a pair of terminal bending units that bend the terminals 2b by contacting a portion of the terminals 2b that is not fixed by the plurality of pairs of dies 5, 6 and the plurality of pairs of punches 7, 8, and a control unit 30 that controls the switching of the plurality of pairs of dies 5, 6 and the plurality of pairs of punches 7, 8. When the terminals 2b are fixed, a pair of dies among the plurality of pairs of dies 5, 6 is switched to the first fixing position, and a pair of punches among the plurality of pairs of punches 7, 8 is switched to the second fixing position, and the pair of terminal bending units is movable in the horizontal direction.

[0026] Therefore, when manufacturing products of different sizes, the pair of dies is switched to the first fixed position, the pair of punches is switched to the second fixed position, and the pair of terminal bending parts is moved horizontally according to the product size, so that the pair of terminal bending parts can be arranged at the bending position. In this way, the pair of terminal bending parts can be arranged at the bending position by moving the pair of terminal bending parts individually in the horizontal direction without moving the entire die, so that the bending accuracy of the terminals 2b can be improved when manufacturing products of different sizes.

[0027] Furthermore, since the pair of terminal bending portions are rollers 3, damage to terminal 2b can be prevented when the terminal bending portions come into contact with terminal 2b.

[0028] <Modification of the first embodiment> Next, a modified example of the first embodiment will be described. The control unit 30 does not necessarily need to perform control based on information input by the manufacturer, and may automatically control by identifying the size of the semiconductor device 1. For example, the semiconductor manufacturing equipment 100 may further include a sensor (not shown) that detects the size of the semiconductor device 1 and transmits the detection result to the control unit 30. The control unit 30 performs control based on the detection result. As the sensor, an optical sensor or a load sensor that detects weight is adopted. This allows the size of the semiconductor device 1 to be automatically set in the control unit 30.

[0029] Furthermore, the pair of terminal bending units is not limited to the rollers 3, but may be a press machine.

[0030] <Embodiment 2> Next, a semiconductor manufacturing apparatus 100A according to a second embodiment will be described. Fig. 5 is a side view of the semiconductor manufacturing apparatus 100A according to the second embodiment. Fig. 6 is a top view of the semiconductor manufacturing apparatus 100A according to the second embodiment. Note that in the second embodiment, the same components as those described in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted.

[0031] <Overall composition> As shown in Figures 5 and 6, in embodiment 2, semiconductor manufacturing equipment 100A includes a pair of conveyor rails 11, a pair of receiving tables 10, a pair of rollers 3 as a pair of terminal bending sections, a pair of slide bases 12, a servo motor 13, a connecting section 14, two shafts 15, and a base 16.

[0032] The pair of slide bases 12 are disposed on a base 16. The pair of slide bases 12 are connected to both ends of a connecting portion 14, respectively. In addition, both ends of two shafts 15 are inserted into the pair of slide bases 12, respectively. The pair of slide bases 12 are configured to be movable in a horizontal direction (left-right direction in FIG. 5) relative to the two shafts 15. The connecting portion 14 is connected to a rotating shaft (not shown) of a servo motor 13, and the pair of slide bases 12 are moved in a horizontal direction (left-right direction in FIG. 6) along the two shafts 15 by driving the servo motor 13. The distance between the pair of slide bases 12 can be changed by moving the pair of slide bases 12 in the horizontal direction.

[0033] The pair of transport rails 11 are disposed on a pair of slide bases 12 below the terminals 2b of the semiconductor device 1 with a gap between them, and fix the semiconductor device 1 in contact with the undersides of the terminals 2b. As described above, the servo motor 13 is driven to operate the connecting portion 14, so that the distance between the pair of slide bases 12 can be changed, and the distance between the pair of transport rails 11 disposed on the pair of slide bases 12 can also be changed.

[0034] The pair of receiving tables 10 are disposed above the semiconductor device 1, and fix the semiconductor device 1 in a state of contacting the terminals 2b from above. The pair of receiving tables 10 are disposed at positions facing the pair of transport rails 11 so that the terminals 2b can be fixed by the pair of transport rails 11. The distance between the pair of receiving tables 10 is changed to match the distance between the pair of transport rails 11, for example, by a slide mechanism (not shown). Specifically, the distance between the pair of receiving tables 10 is changed based on information regarding the size of the semiconductor device 1.

[0035] The pair of rollers 3 is supported by a pair of roller support parts 3a, and the pair of roller support parts 3a is held by a pair of slide bases 12 so as to be movable in the horizontal direction (left and right direction in FIG. 5). The pair of rollers 3 is disposed outside the pair of transport rails 11 in a side view. The pair of rollers 3 bend the terminal 2b by contacting a portion of the terminal 2b that is not fixed by the pair of transport rails 11 and the pair of receiving bases 10, specifically, a portion of the terminal 2b that is closer to the tip side than the portion of the terminal 2b that is fixed by the pair of transport rails 11 and the pair of receiving bases 10.

[0036] The pair of rollers 3 are held by, for example, a slide mechanism (not shown) so as to be movable up and down. In the terminal bending process, after the terminal 2b is fixed by the pair of conveyor rails 11 and the pair of receiving tables 10, the pair of rollers 3 rise and contact the terminal 2b from below, thereby bending the tip side of the terminal 2b upward. Specifically, in a state in which the pair of rollers 3 contact the terminal 2b from below, the pair of rollers 3 further rises, thereby bending the tip side of the terminal 2b upward.

[0037] Alternatively, instead of the pair of rollers 3, a pair of conveyor rails 11 and a pair of receiving tables 10 may be held so as to be vertically movable, for example, by a slide mechanism (not shown). In this case, in the terminal bending process, after the terminal 2b is fixed by the pair of conveyor rails 11 and the pair of receiving tables 10, the pair of conveyor rails 11 and the pair of receiving tables 10 are lowered and the pair of rollers 3 contact the terminal 2b from below, thereby bending the tip side of the terminal 2b upward. Specifically, with the pair of rollers 3 contacting the terminal 2b from below, the pair of conveyor rails 11 and the pair of receiving tables 10 are further lowered, thereby bending the tip side of the terminal 2b upward.

[0038] Although not shown, a control unit is also provided that controls each part of semiconductor manufacturing equipment 100A based on a control program related to the terminal bending process stored in its own memory.

[0039] <Operation> Next, the operation of the semiconductor manufacturing apparatus 100A will be described. As shown in Fig. 5, first, the pair of transport rails 11 is moved horizontally by the drive of the servo motor 13 to change the distance between the pair of transport rails 11 in accordance with the size of the semiconductor device 1. At this time, a control unit (not shown) changes the distance between the pair of transport rails 11 based on information relating to the size of the semiconductor device 1. Here, the information relating to the size of the semiconductor device 1 is input in the same manner as in the case of the first embodiment or the modified example of the first embodiment.

[0040] Next, the interval between the pair of receiving tables 10 is changed by a slide mechanism (not shown) to match the interval between the pair of transport rails 11. With the above change, the bases of the terminals 2b are fixed by the pair of transport rails 11 and the pair of receiving tables 10. Note that the pair of receiving tables 10 and the servo motor 13 may be connected to each other so that the interval between the pair of receiving tables 10 can also be changed in conjunction with the driving of the servo motor 13.

[0041] After the terminal 2b is fixed, the pair of rollers 3 rises to bring the terminal 2b into contact with the pair of rollers 3. With the pair of rollers 3 in contact with the terminal 2b from below, the pair of rollers 3 rises further, thereby bending the tip side of the terminal 2b upward.

[0042] <Effects> As described above, the semiconductor manufacturing apparatus 100A according to the second embodiment includes a pair of transport rails 11 that are arranged at intervals below the terminals 2b protruding from a pair of opposing side portions of the semiconductor device 1 and fix the semiconductor device 1 in contact with the undersides of the terminals 2b, a pair of receiving pedestals 10 that fix the semiconductor device 1 in contact with the terminals 2b from above, and a pair of terminal bending units that bend the terminals by contacting portions of the terminals 2b that are not fixed by the pair of transport rails 11 and the pair of receiving pedestals 10. The pair of terminal bending units are movable in the horizontal direction, and the distance between the pair of transport rails 11 is changeable.

[0043] Therefore, when manufacturing products of different sizes, the interval between the pair of conveyor rails 11 and the interval between the pair of receiving tables 10 can be changed in accordance with the product size, and the pair of terminal bending parts can be moved horizontally to place the pair of terminal bending parts at the bending position. In this way, the pair of terminal bending parts can be moved horizontally individually without moving the entire mold, so that the pair of terminal bending parts can be placed at the bending position, thereby improving the bending accuracy of the terminals 2b when manufacturing products of different sizes.

[0044] Furthermore, by simply changing the distance between the pair of conveying rails 11 and the pair of receiving tables 10 and moving the pair of terminal bending portions horizontally, it is possible to accommodate products of various sizes, thereby making it possible to reduce the manufacturing cost of the semiconductor device 1 more than in the case of embodiment 1.

[0045] Furthermore, since the pair of terminal bending portions are rollers 3, damage to terminal 2b can be prevented when the terminal bending portions come into contact with terminal 2b.

[0046] Moreover, the semiconductor manufacturing apparatus 100A further includes a servo motor 13 that moves the pair of transport rails 11 and the pair of terminal bending units in the horizontal direction. Therefore, the pair of transport rails 11 and the pair of terminal bending units can be automatically controlled.

[0047] In addition, the pair of terminal bending parts or the pair of conveyor rails 11 can move up and down, and after the terminals 2b are fixed by the pair of conveyor rails 11 and the pair of receiving tables 10, the pair of terminal bending parts rises or the pair of conveyor rails 11 falls to bend the terminals 2b. Therefore, expensive dies are not required, and the automation of the changeover becomes possible.

[0048] It should be noted that the embodiments can be freely combined, and each embodiment can be modified or omitted as appropriate.

[0049] Various aspects of the present disclosure are summarized below as appendices.

[0050] (Appendix 1) a plurality of pairs of dies that are switchable between a first fixing position in which the semiconductor device is fixed in a state of being in contact with terminals protruding from a pair of opposing side portions of the semiconductor device from below, and a first retracted position in which the dies are retracted from the terminals; a plurality of pairs of punches switchable between a second fixing position in which the punches fix the semiconductor device while contacting the terminals from above and a second retracted position in which the punches retract from the terminals; a pair of terminal bending sections that bend the terminals by contacting portions of the terminals that are not fixed by the pairs of dies and the pairs of punches; A control unit that controls switching between the multiple pairs of dies and the multiple pairs of punches, When the terminal is fixed, one pair of the dies among the plurality of pairs of the dies is switched to the first fixing position, and one pair of the punches among the plurality of pairs of the punches is switched to the second fixing position; The pair of terminal bending units are movable in a horizontal direction.

[0051] (Appendix 2) 2. The semiconductor manufacturing apparatus of claim 1, wherein the pair of terminal bending units are rollers.

[0052] (Appendix 3) a sensor for detecting a size of the semiconductor device and transmitting the detection result to the control unit; 3. The semiconductor manufacturing apparatus according to claim 1, wherein the control unit controls switching of the pairs of dies and the pairs of punches based on the detection result.

[0053] (Appendix 4) 4. The semiconductor manufacturing apparatus according to claim 3, wherein the sensor is an optical sensor or a load sensor.

[0054] (Appendix 5) a pair of transport rails arranged at intervals from each other below terminals protruding from a pair of opposing side portions of the semiconductor device, the transport rails being in contact with the undersides of the terminals to fix the semiconductor device; a pair of receiving pedestals for fixing the semiconductor device in a state of contacting the terminals from above; a pair of terminal bending sections that bend the terminal by contacting a portion of the terminal that is not fixed by the pair of transport rails and the pair of receiving bases, The pair of terminal bending portions are movable in a horizontal direction, The semiconductor manufacturing apparatus, wherein the distance between the pair of transport rails is variable.

[0055] (Appendix 6) 6. The semiconductor manufacturing apparatus according to claim 5, wherein the pair of terminal bending units are rollers.

[0056] (Appendix 7) 7. The semiconductor manufacturing apparatus according to claim 5, further comprising a servo motor for horizontally moving the pair of conveyor rails and the pair of terminal bending units.

[0057] (Appendix 8) The pair of terminal bending portions or the pair of conveyor rails are vertically movable, 8. The semiconductor manufacturing apparatus according to claim 5, wherein after the terminals are fixed between the pair of transport rails and the pair of receiving tables, the pair of terminal bending units are raised or the pair of transport rails are lowered to bend the terminals. [Explanation of symbols]

[0058] 1 semiconductor device, 2b terminal, 3 roller, 5, 6 die, 7, 8 punch, 10 receiving stand, 11 conveyor rail, 13 servo motor, 30 control unit, 100, 100A semiconductor manufacturing apparatus.

Claims

1. a plurality of pairs of dies that are switchable between a first fixing position in which the semiconductor device is fixed in a state of being in contact with terminals protruding from a pair of opposing side portions of the semiconductor device from below, and a first retracted position in which the dies are retracted from the terminals; a plurality of pairs of punches switchable between a second fixing position in which the punches fix the semiconductor device while contacting the terminals from above and a second retracted position in which the punches retract from the terminals; a pair of terminal bending sections that bend the terminals by contacting portions of the terminals that are not fixed by the pairs of dies and the pairs of punches; A control unit that controls switching between the multiple pairs of dies and the multiple pairs of punches, When the terminal is fixed, one pair of the dies among the plurality of pairs of the dies is switched to the first fixing position, and one pair of the punches among the plurality of pairs of the punches is switched to the second fixing position; The pair of terminal bending units are movable in a horizontal direction.

2. The semiconductor manufacturing apparatus according to claim 1 , wherein the pair of terminal bending units are rollers.

3. a sensor for detecting a size of the semiconductor device and transmitting the detection result to the control unit; The semiconductor manufacturing apparatus according to claim 1 , wherein the control unit controls switching of the pairs of dies and the pairs of punches based on the detection result.

4. 4. The semiconductor manufacturing apparatus according to claim 3, wherein the sensor is an optical sensor or a load sensor.

5. a pair of transport rails arranged at intervals from each other below terminals protruding from a pair of opposing side portions of the semiconductor device, the transport rails being in contact with the undersides of the terminals to fix the semiconductor device; a pair of receiving pedestals for fixing the semiconductor device in a state of contacting the terminals from above; a pair of terminal bending sections that bend the terminal by contacting a portion of the terminal that is not fixed by the pair of transport rails and the pair of receiving bases, The pair of terminal bending portions are movable in a horizontal direction, The semiconductor manufacturing apparatus, wherein the distance between the pair of transport rails is variable.

6. 6. The semiconductor manufacturing apparatus according to claim 5, wherein the pair of terminal bending portions are rollers.

7. 6. The semiconductor manufacturing apparatus according to claim 5, further comprising a servo motor for horizontally moving the pair of transport rails and the pair of terminal bending units.

8. The pair of terminal bending portions or the pair of conveyor rails are vertically movable, 6. The semiconductor manufacturing apparatus according to claim 5, wherein after the terminals are fixed by the pair of transport rails and the pair of receiving pedestals, the pair of terminal bending units are raised or the pair of transport rails are lowered to bend the terminals.

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