Substrate cleaning apparatus and substrate cleaning method

Abstract

To improve substrate quality.SOLUTION: A substrate cleaning apparatus includes a cleaning liquid supply unit for supplying cleaning liquid to a rotating substrate, a first cleaning head for cleaning one side surface of the substrate by bringing a brush into contact with at least the one side surface of the rotating substrate, a second cleaning head for cleaning the one side surface of the substrate by bringing a brush into contact with the one side surface of the substrate, a rotating arm for rotating the first cleaning head and the second cleaning head, a rotating mechanism, and a control unit for controlling the cleaning liquid supply unit and the rotating arm. The control unit controls the rotating arm such that in a cleaning operation of cleaning a surface of the substrate while the brush of the cleaning head of one of the first cleaning head and the second cleaning head is brought into contact with the surface of the substrate, the brush of the other cleaning head of the first cleaning head and the second cleaning head is located outside the substrate.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] SUMMARY OF THE PRESENT EMBODIMENT An embodiment of the present invention relates to a substrate cleaning apparatus and a substrate cleaning method. [Background technology]

[0002] Substrate processing equipment is used in the manufacturing process of semiconductors, liquid crystal panels, etc. to process the surface of a substrate (e.g., a wafer or liquid crystal substrate) with a chemical solution, rinse the substrate with a rinsing solution after the chemical solution processing, and dry the substrate after rinsing. In this type of substrate processing equipment, a single-wafer method is used to process substrates one by one in terms of uniformity and reproducibility.

[0003] In a single-wafer processing apparatus, a substrate is placed on a turntable, and a processing liquid such as a chemical liquid is supplied to the substrate on the rotating turntable, and the substrate is processed with the processing liquid. After the substrate processing process using the processing liquid, the substrate is cleaned to maintain a high level of cleanliness of the substrate. When multiple substrate processing processes using multiple types of processing liquids are performed, substrate cleaning may be performed after each process to maintain a high level of cleanliness of the substrate.

[0004] A method of cleaning substrates is scrubbing with a brush, in which the brush is stopped or rotated while the substrate is rotating, and moved horizontally while in contact with the surface of the substrate to remove impurities (metals, organic matter, particles, etc.) from the substrate. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 7-283180 Summary of the Invention [Problem to be solved by the invention]

[0006] In recent years, due to the demand for higher quality associated with the miniaturization of semiconductor devices, there is a demand for scrubbing cleaning to process substrates with a higher degree of cleanliness. For example, if the cleanliness of the brush is low, impurities adhering to the brush may contaminate the substrate, resulting in a decrease in substrate quality.

[0007] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a substrate cleaning apparatus and a substrate cleaning method capable of improving substrate quality. [Means for solving the problem]

[0008] In order to solve the above-mentioned problems and achieve the object, a substrate cleaning apparatus according to one aspect of the present invention includes a rotation mechanism that holds and rotates a substrate, a cleaning liquid supply unit that supplies a cleaning liquid to the substrate rotated by the rotation mechanism, a first cleaning head that cleans at least one side of the substrate rotated by the rotation mechanism by bringing a brush into contact with the one side of the substrate, a second cleaning head that cleans the one side of the substrate by bringing a brush into contact with the one side of the substrate, and a cleaning device having the first cleaning head attached to one end. the second cleaning head is attached to the other end of the first cleaning head; and a pivot arm that rotates the first cleaning head and the second cleaning head; and a control unit that controls the rotation mechanism, the cleaning liquid supply unit, and the pivot arm, wherein the control unit controls the pivot arm so that, during cleaning in which a brush of one of the first cleaning head and the second cleaning head is brought into contact with the surface of the substrate to perform cleaning, the brush of the other of the first cleaning head and the second cleaning head is positioned outward from the substrate.

[0009] In order to solve the above-mentioned problems and achieve the object, a substrate cleaning method according to one embodiment of the present invention is a substrate cleaning method performed by a substrate cleaning apparatus comprising: a first cleaning head that cleans at least one side of a rotating substrate by contacting a brush against the one side of the substrate; a second cleaning head that cleans the one side of the substrate by contacting a brush against the one side of the substrate; and a rotating arm having the first cleaning head attached to one end and the second cleaning head attached to the other end and rotating the first cleaning head and the second cleaning head, the method including the steps of: rotating a substrate while holding the substrate; supplying a cleaning liquid to the rotated substrate; and controlling the rotating arm during cleaning in which the brush of one of the first cleaning head and the second cleaning head is brought into contact with a surface of the substrate to clean the substrate, so that the brush of the other of the first cleaning head and the second cleaning head is positioned outward from the substrate. Effect of the Invention

[0010] According to one aspect of the present invention, it is possible to provide a substrate cleaning apparatus and a substrate cleaning method capable of improving substrate quality. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a plan view showing an example of the configuration of a substrate processing apparatus according to an embodiment. [Diagram 2] FIG. 2 is a side view showing an example of a schematic configuration of the substrate processing apparatus according to the embodiment. [Diagram 3] FIG. 3 is a diagram illustrating an example of a schematic configuration of a first self-cleaning stage according to an embodiment. [Figure 4] FIG. 4 is a view for explaining a case where the first cleaning head and the second cleaning head according to the embodiment swing. [Diagram 5] FIG. 5 is a flowchart showing a flow of an example of a process executed by the substrate processing apparatus according to the embodiment. [Figure 6]FIG. 6 is a diagram showing an example of the operation of the substrate processing apparatus in step S107 according to the embodiment. [Figure 7] FIG. 7 is a diagram showing an example of a state after the operation of the substrate processing apparatus in step S107 according to the embodiment. [Figure 8] FIG. 8 is a diagram showing an example of the operation of the substrate processing apparatus in step S114 according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] (Embodiment) Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing an example of a schematic configuration of a substrate processing apparatus 1 according to an embodiment. FIG. 2 is a side view showing an example of a schematic configuration of a substrate processing apparatus 1 according to an embodiment. The substrate processing apparatus 1 according to this embodiment performs a substrate cleaning process in which the substrate W is held and rotated while being cleaned with a cleaning liquid and a brush. The substrate W is typically a semiconductor wafer, but may also be a liquid crystal substrate for a display device. Note that FIG. 1 shows the substrate processing apparatus 1 before the substrate W is carried in, and FIG. 2 shows the substrate processing apparatus 1 after the substrate W is carried in and during the substrate cleaning process.

[0013] For example, the substrate processing apparatus 1 according to the present embodiment is a single-wafer type substrate processing apparatus. The substrate processing apparatus 1 performs a substrate cleaning process on the substrate W that is carried in, and performs a brush cleaning process (also referred to as a self-cleaning process) to clean a brush during and after the substrate cleaning process. The substrate processing apparatus 1 also performs a rinse process to rinse the substrate W after the substrate cleaning process with a rinse liquid. After the rinse process, the substrate processing apparatus 1 carries out the substrate W that has been subjected to the rinse process. When the next substrate W is carried in, the substrate processing apparatus 1 performs the above-mentioned various processes. That is, the substrate processing apparatus 1 performs the above-mentioned various processes on the substrate W that is carried in every time the substrate W is carried in. In this way, the substrate processing apparatus 1 is an example of a substrate cleaning apparatus since it performs substrate cleaning. Hereinafter, the configuration of the substrate processing apparatus 1 and the substrate cleaning process and brush cleaning process performed by the substrate processing apparatus 1 will be described in detail.

[0014] 1 and 2, the substrate processing apparatus 1 includes a rotation mechanism 10, a first cleaning mechanism 20, a second cleaning mechanism 30, a drive mechanism 40, a brush cleaning unit 50, a control device 60, and a processing chamber 70. Of these, the rotation mechanism 10, the first cleaning mechanism 20, the second cleaning mechanism 30, the drive mechanism 40, and the brush cleaning unit 50, other than the control device 60, are provided in the processing chamber 70.

[0015] The rotation mechanism 10 rotates the substrate W while holding it. The rotation mechanism 10 has a first holding unit 11, a second holding unit 12, a first rotation drive unit (not shown), and a second rotation drive unit (not shown). The first holding unit 11 and the second holding unit 12 are disposed at positions facing each other with the substrate W interposed therebetween. Note that the first holding unit 11 and the second holding unit 12 are not shown in FIG. 2.

[0016] Each of the first holding unit 11 and the second holding unit 12 has a pair of rollers 10a. The rollers 10a are provided rotatably about an axis perpendicular to the surface direction of the substrate W. Each of the rollers 10a in the first holding unit 11 and the second holding unit 12 has a large diameter portion and a small diameter portion provided on the upper surface of the large diameter portion, and the side surfaces of the large diameter portion and the small diameter portion are tapered so that the boundary where they contact each other reduces in diameter. The boundary portion between the large diameter portion and the small diameter portion of each roller 10a contacts the substrate W to hold the peripheral portion of the substrate W.

[0017] The first rotation drive unit supports the first holding unit 11, and the second rotation drive unit supports the second holding unit 12. Each of the first rotation drive unit and the second rotation drive unit rotates the roller 10a around the axis (drive axis) of the roller 10a and moves the roller 10a in a direction in which the roller 10a approaches or moves away from the substrate W. A rotation mechanism (not shown) that drives the roller 10a is housed inside the first rotation drive unit and the second rotation drive unit.

[0018] The rotation mechanism is, for example, a belt drive mechanism. That is, a timing belt is stretched between the drive shaft of a motor serving as a drive source and a pulley provided on the drive shaft of one roller 10a, and between pulleys provided on the drive shafts of the pair of rollers 10a, so that the pair of rollers 10a can be rotated by the drive source. Note that the rotation mechanism is not limited to this, and for example, each roller 10a may be configured to rotate by a motor provided on each roller 10a.

[0019] Further, each of the first rotation drive unit and the second rotation drive unit is provided with a drive mechanism (not shown) that moves each of the first holding unit 11 and the second holding unit 12 in a direction in which the rollers 10a approach and move away from the substrate W. The drive mechanism has a rotary cylinder that moves a drive shaft provided at the lower end of the first rotation drive unit and a drive shaft provided at the lower end of the second rotation drive unit in opposite directions to each other along a direction parallel to the surface of the substrate W.

[0020] The drive mechanism moves the first holding unit 11 and the second holding unit 12 in directions away from each other, causing the rollers 10a to move away from the substrate W and releasing the substrate W. The drive mechanism moves the first holding unit 11 and the second holding unit 12 in directions toward each other, causing the rollers 10a to come into contact with the substrate W and hold the substrate W. With the substrate W held by the multiple rollers 10a, the rollers 10a rotate, causing the substrate W to rotate.

[0021] The first cleaning mechanism 20 is a mechanism for cleaning a first surface (the upper surface in this embodiment) of the substrate W held by the multiple rollers 10a. The first cleaning mechanism 20 has cleaning heads 21a and 21b, a first rotating arm 22, a first joint mechanism 23, a first swinging arm 24, and a cleaning liquid supply unit 25.

[0022] The cleaning heads 21a and 21b clean the first surface of the substrate W by bringing the rotating brushes 21a3 and 21b3 into contact with the first surface of the rotating substrate W. The contact here includes a case where the brushes 21a3 and 21b3 come into direct contact with the substrate W and a case where the brushes come into contact with the substrate W via a cleaning liquid.

[0023] The cleaning head 21a includes a support 21a1, a holder 21a2, and a brush 21a3. The support 21a1 is a cylindrical container that houses a motor therein. The motor is a drive source that rotates the brush 21a3, and is, for example, a hollow motor with a cylindrical drive shaft.

[0024] The holder 21a2 is a disk-shaped member attached to a drive shaft of a motor housed in the support 21a1. The holder 21a2 is provided rotatable independently of the support 21a1. The brush 21a3 is fixed to the holder 21a2.

[0025] The brush 21a3 is a cylindrical member made of a material having flexibility and elasticity. For example, the brush 21a3 is made of a sponge-like resin such as PVA (nylon resin) or PTFE (fluorine resin). A bristle brush made of a similar resin may be used as the brush 21a3. That is, the brush 21a3 of this embodiment includes a sponge-like mass and a large number of densely packed hairs. The number of brushes 21a3 provided on the holder 21a2 may be one or more. In this embodiment, one brush 21a3 is provided for the holder 21a2.

[0026] The cleaning head 21b includes a support 21b1, a holder 21b2, and a brush 21b3. The configuration of the cleaning head 21b is similar to that of the cleaning head 21a, and therefore a description thereof will be omitted.

[0027] The first rotating arm 22 rotates the cleaning heads 21a, 21b in a direction parallel to the first surface of the substrate W. The first rotating arm 22 is a member extending linearly, and the cleaning head 21a is attached to one end of the first rotating arm 22, and the cleaning head 21b is attached to the other end. The length from one end to the other end of the first rotating arm 22 is longer than the radius of the substrate W, for example.

[0028] The first joint mechanism 23 connects the first rotating arm 22 and the first swinging arm 24. For example, one end (lower end) of the first joint mechanism 23 in the up-down direction is connected to a central portion in the direction in which the first rotating arm 22 extends. One end of the first joint mechanism 23 is fixed to the first rotating arm 22. On the other hand, the other end of the first joint mechanism 23 is supported by the first swinging arm 24 but is not fixed to the first swinging arm 24. In this way, the first joint mechanism 23 is supported by the first swinging arm 24 so as to be rotatable.

[0029] The first swing arm 24 swings the cleaning heads 21a, 21b by reciprocating the cleaning heads 21a, 21b attached to the first swing arm 22 in a circular arc trajectory in a direction parallel to the first surface of the substrate W via the first joint mechanism 23 and the first rotating arm 22. The first swing arm 24 is a member extending linearly, and is supported by the swing mechanism 42a so as to be parallel to the first surface of the substrate W. One end side portion of the first swing arm 24 rotatably supports the first joint mechanism 23.

[0030] The cleaning liquid supply unit 25 supplies a cleaning liquid to the first surface of the substrate W. The cleaning liquid is ozone water, pure water, or SC-1 (a mixture of ammonia water and hydrogen peroxide). For example, when the substrate W is cleaned with pure water, a brush made of, for example, PVA is used as the brush 21a3. When ozone water or SC-1 is used as the cleaning liquid, a brush made of, for example, PTFE is used as the brush 21a3. PTFE is resistant to chemicals, and therefore can be used in combination with cleaning liquids such as ozone water and SC-1.

[0031] The cleaning liquid supply unit 25 is connected to a cleaning liquid supply device (not shown). The supply device has a liquid sending device, a valve, and the like connected to a pure water production device (pure water storage tank), an ozone water production device (ozone water storage tank), and an SC-1 supply device, and can supply the cleaning liquid supply unit 25 with any one of pure water, ozone water, and SC-1 by switching between them.

[0032] The second cleaning mechanism 30 is a mechanism for cleaning a second surface (the lower surface in this embodiment) of the substrate W held by the multiple rollers 10a. The second cleaning mechanism 30 has cleaning heads 31a, 31b, a second rotating arm 32, a second joint mechanism 33, a second swinging arm 34, and a cleaning liquid supply unit 35. The second cleaning mechanism 30 has a configuration similar to that of the first cleaning mechanism 20, and is provided upside down compared to the first cleaning mechanism 20.

[0033] The cleaning heads 31a and 31b clean the second surface of the substrate W by bringing the rotating brushes 31a3 and 31b3 into contact with the second surface of the rotating substrate W. The contact here includes a case where the brushes 31a3 and 31b3 come into direct contact with the substrate W and a case where the brushes come into contact with the substrate W via a cleaning liquid.

[0034] The cleaning head 31a has a support 31a1, a holder 31a2, and a brush 31a3. The cleaning head 31b has a support 31b1, a holder 31b2, and a brush 31b3. The configurations of the cleaning heads 31a and 31b are similar to that of the cleaning head 21a, and therefore will not be described.

[0035] The second rotating arm 32 rotates the cleaning heads 31a, 31b in a direction parallel to the second surface of the substrate W. The second joint mechanism 33 connects the second rotating arm 32 to a second swinging arm 34. The second swinging arm 34 swings the cleaning heads 31a, 31b attached to the second rotating arm 32 by reciprocating the cleaning heads 31a, 31b in a circular arc trajectory in a direction parallel to the second surface of the substrate W via the second joint mechanism 33 and the second rotating arm 32. The cleaning liquid supply unit 35 supplies the cleaning liquid to the second surface of the substrate W. The configurations of the second rotating arm 32, the second joint mechanism 33, the second oscillating arm 34 and the cleaning liquid supply unit 35 are similar to the configurations of the first rotating arm 22, the first joint mechanism 23, the first oscillating arm 24 and the cleaning liquid supply unit 25, respectively, and therefore their explanations are omitted.

[0036] The cleaning heads 21a, 21b, the first rotating arm 22, the first joint mechanism 23, the first swinging arm 24, and the cleaning liquid supply unit 25 as described above are provided on the first surface side of the substrate W, and the cleaning heads 31a, 31b, the second rotating arm 32, the second joint mechanism 33, the second swinging arm 34, and the cleaning liquid supply unit 35 are provided on the second surface side of the substrate W. This makes it possible to clean the first surface and the second surface of the substrate W.

[0037] In this embodiment, the cleaning head 21a and the cleaning head 31a are controlled to be in the same horizontal position. Similarly, the cleaning head 21b and the cleaning head 31b are controlled to be in the same horizontal position. In the following description, the cleaning head 21a and the cleaning head 31a may be collectively referred to as the first cleaning head, and the cleaning head 21b and the cleaning head 31b may be collectively referred to as the second cleaning head.

[0038] The drive mechanism 40 includes lifting mechanisms 41a and 41b, swinging mechanisms 42a and 42b, and rotating mechanisms 43a and 43b.

[0039] The lifting mechanism 41a moves the first swing arm 24 in the vertical direction. The lifting mechanism 41b moves the second swing arm 34 in the vertical direction. That is, the lifting mechanisms 41a and 41b lift and lower the first swing arm 24 and the second swing arm 34. In this manner, the lifting mechanisms 41a and 41b move the cleaning head 21a and the cleaning head 31a in the vertical direction so as to move toward and away from each other, and also move the cleaning head 21b and the cleaning head 31b in the vertical direction so as to move toward and away from each other. As the lifting mechanisms 41a and 41b, a ball screw mechanism, a cylinder, or the like that lifts and lowers the respective support shafts of the first swing arm 24 and the second swing arm 34 may be used.

[0040] The swing mechanism 42a reciprocates the first swing arm 24 in a direction parallel to the first surface of the substrate W along a circular arc trajectory with the end of the first swing arm 24 opposite to the end where the first joint mechanism 23 is provided as an axis. The swing mechanism 42a has a support shaft (not shown) extending in a direction perpendicular to the first surface direction of the substrate W, and a motor (not shown) which is a drive source for rotating the support shaft. The first swing arm 24 is attached to the support shaft. When the support shaft is rotated by the motor, the cleaning heads 21a and 21b attached to the first rotating arm 22 via the first swing arm 24, the first joint mechanism 23, and the first rotating arm 22 are reciprocated in a direction parallel to the first surface of the substrate W along the above-mentioned circular arc trajectory. The swing mechanism 42b reciprocates the second swing arm 34 in a direction parallel to the second surface of the substrate W along a circular arc trajectory whose axis is the end of the second swing arm 34 opposite to the end where the second joint mechanism 33 is provided. The configuration of the swing mechanism 42b is similar to that of the swing mechanism 42a, and therefore a description thereof will be omitted.

[0041] When the first cleaning head and the second cleaning head do not clean the substrate W, the first cleaning head is controlled to be located at a predetermined standby position P1 or a predetermined standby position P2 outside the area where the substrate W is held, and the second cleaning head is controlled to be located at the standby position P2 or the standby position P1. The example of FIG. 1 shows a case where the first cleaning head (e.g., the center of gravity position of the first cleaning head) is located at the standby position P1, and the second cleaning head (e.g., the center of gravity position of the second cleaning head) is located at the standby position P2. Note that the standby position P1 is a position where the brush of the cleaning head can be cleaned by a first self-cleaning stage 51 described later when the cleaning head is located at the standby position P1. Similarly, the standby position P2 is a position where the brush of the cleaning head can be cleaned by a second self-cleaning stage 52 described later when the cleaning head is located at the standby position P2.

[0042] The rotating mechanism 43a rotates the first rotating arm 22 around the first joint mechanism 23 as an axis, thereby rotating the cleaning heads 21a, 21b in a direction parallel to the first surface of the substrate W. The rotating mechanism 43a is, for example, a belt drive mechanism. That is, a timing belt is stretched between a drive shaft of a motor serving as a drive source and a pulley provided on a drive shaft (a rotating shaft extending in the vertical direction) of the first joint mechanism 23, so that the first joint mechanism 23 is rotatable by the drive source. Note that the rotating mechanism 43a is not limited thereto, and may be configured to rotate the first joint mechanism 23 by a motor provided in the first joint mechanism 23, for example.

[0043] The rotating mechanism 43b rotates the second rotating arm 32 about the second joint mechanism 33 as an axis to rotate the cleaning heads 31a, 31b in a direction parallel to the second surface of the substrate W. The configuration of the rotating mechanism 43b is similar to that of the rotating mechanism 43a, and therefore a description thereof will be omitted.

[0044] The brush cleaning unit 50 cleans the brushes 21a3, 21b3, 31a3, and 31b3. The brush cleaning unit 50 includes a first self-cleaning stage 51, a second self-cleaning stage 52, a self-cleaning substrate 53, and cleaning liquid supply units (nozzles) 54 and 55.

[0045] The first self-cleaning stage 51 cleans the brush of the cleaning head located at the standby position P1. For example, when the first cleaning head is located at the standby position P1, the first self-cleaning stage 51 cleans the brushes 21a3 and 31a3. When the second cleaning head is located at the standby position P1, the first self-cleaning stage 51 cleans the brushes 21b3 and 31b3. Note that the first self-cleaning stage 51 and the second self-cleaning stage 52 are not shown in FIG. 2.

[0046] FIG. 3 is a diagram showing an example of a schematic configuration of a first self-cleaning stage 51 according to an embodiment. Note that the example of FIG. 3 shows a case where the first self-cleaning stage 51 cleans the brushes 21b3 and 31b3. As shown in FIG. 3, the first self-cleaning stage 51 includes a supply pipe 51a and a cleaning member 51b. The supply pipe 51a is connected to a tank in which cleaning liquid is stored. The first self-cleaning stage 51 supplies the cleaning liquid in the tank to the upper surface (an example of an outer surface) and the lower surface of the cleaning member 51b to form a liquid film w1 of the cleaning liquid on the upper surface and a liquid film w2 of the cleaning liquid on the lower surface. Then, the liquid film w1 of the cleaning liquid is brought into contact with the rotating brush (brush 21a3 or brush 21b3) and the liquid film w2 of the cleaning liquid is brought into contact with the rotating brush (brush 31a3 or brush 31b3), thereby cleaning these two brushes without contacting the cleaning member 51b with the two rotating brushes. In this way, the first self-cleaning stage 51 cleans the brush in a non-contact manner. The liquid films w1 and w2 have a thickness of about several millimeters.

[0047] The cleaning member 51b holds a liquid film w1 of cleaning liquid on its upper surface and a liquid film w2 of cleaning liquid on its lower surface, and cleans the brush with the liquid films w1 and w2 of cleaning liquid. The brush rotates at all times, including during substrate cleaning and brush cleaning. The distance between the upper surface of the cleaning member 51b and the lower surface of the brush of the first cleaning mechanism 20 located at the standby position P1 is preset. The distance between the lower surface of the cleaning member 51b and the upper surface of the brush of the second cleaning mechanism 30 located at the standby position P1 is preset. A through hole 51b1 is formed inside the cleaning member 51b. This through hole 51b1 functions as a flow path through which the cleaning liquid for brush cleaning flows. The through hole 51b1 opens on the side surface of the cleaning member 51b, branches at the center of the cleaning member 51b so as to extend vertically, and opens at the center of the upper surface of the cleaning member 51b and the center of the lower surface of the cleaning member 51b. A supply pipe 51a is connected to an opening on the side surface of the cleaning member 51b. The cleaning liquid that flows into the through hole 51b1 of the cleaning member 51b via the supply pipe 51a is discharged from an opening on the upper surface of the cleaning member 51b. The cleaning liquid that flows into the through hole 51b1 of the cleaning member 51b via the supply pipe 51a is discharged from an opening on the lower surface of the cleaning member 51b. For example, a resin member having insulating properties (for example, polyvinyl chloride) is used as the cleaning member 51b.

[0048] Here, the cleaning liquid supplied to the upper and lower surfaces of the cleaning member 51b flows down from the outer periphery of the cleaning member 51b and is drained from a drain pipe (not shown) provided at the bottom of the processing chamber 70. The cleaning liquid is constantly supplied to the upper and lower surfaces of the cleaning member 51b during substrate processing. Therefore, the cleaning liquid constantly flows over the upper and lower surfaces of the cleaning member 51b during substrate processing. By keeping the processing liquid constantly flowing, the upper and lower surfaces of the cleaning member 51b can be kept clean. This is because even if particles fall from the brush onto the cleaning member 51b, the flow of the cleaning liquid allows the particles to be quickly discharged from the cleaning member 51b together with the cleaning liquid. Furthermore, the flow of the cleaning liquid prevents the upper and lower surfaces of the cleaning member 51b (surfaces facing the brush) from drying, so that the cleaning liquid can be prevented from drying and the particles from adhering to the surfaces.

[0049] The second self-cleaning stage 52 cleans the brushes of the cleaning head located at the standby position P2. For example, when the first cleaning head is located at the standby position P2, the second self-cleaning stage 52 cleans the brushes 21a3 and 31a3. When the second cleaning head is located at the standby position P2, the second self-cleaning stage 52 cleans the brushes 21b3 and 31b3. The configuration of the second self-cleaning stage 52 is similar to that of the first self-cleaning stage 51, and therefore a description thereof will be omitted.

[0050] The first self-cleaning stage 51 and the second self-cleaning stage 52 are arranged outside the area where the substrate W is held by the multiple rollers 10a, at a distance corresponding to the distance between the two brushes 21a3 and 21b3 provided on the second pivot arm 32 (the distance between the two brushes 31a3 and 31b3 provided on the pivot arm 42) in a planar view.

[0051] The self-cleaning substrate 53 is provided outside the area where the substrate W is held by the multiple rollers 10a, in an area (second position) where the brush of either the first or second cleaning head is located when the brush of the other cleaning head is in a position (first position) where it comes into contact with and cleans the substrate W. For example, Fig. 2 shows a case where the brush of the first cleaning head is located at the first position, and the brush of the second cleaning head is located at the second position.

[0052] The cleaning liquid supply unit 54 supplies the cleaning liquid to a first surface (the upper surface in this embodiment) of the self-cleaning substrate 53, and the cleaning liquid supply unit 55 supplies the cleaning liquid to a second surface (the lower surface in this embodiment) of the self-cleaning substrate 53. The cleaning liquid supplied by the cleaning liquid supply units 54 and 55 to the self-cleaning substrate 53 is, for example, pure water. The configurations of the cleaning liquid supply units 54 and 55 are similar to that of the cleaning liquid supply unit 25, and therefore description thereof will be omitted.

[0053] The self-cleaning substrate 53 has an upper surface brought into contact with a brush (brush 21a3 or brush 21b3) located at the second position and oscillating by the oscillating mechanism 42a, thereby cleaning the brush with the cleaning liquid supplied by the cleaning liquid supply unit 54. That is, the brush is cleaned by moving while contacting the upper surface of the self-cleaning substrate 53 to which the cleaning liquid has been supplied.

[0054] Furthermore, the underside of the self-cleaning substrate 53 is brought into contact with a brush (brush 31a3 or brush 31b3) located at the second position and oscillated by the oscillating mechanism 42b, thereby cleaning the brush with the cleaning liquid supplied by the cleaning liquid supply unit 55. That is, the brush is cleaned by moving while contacting the underside of the self-cleaning substrate 53 to which the cleaning liquid has been supplied. The self-cleaning substrate 53 is a plate-like body made of silicon, quartz, or the like and having the same thickness as the substrate W.

[0055] 4 is a diagram for explaining a case where the first cleaning head and the second cleaning head according to the embodiment swing. The example of Fig. 4 shows a case where the brush of the first cleaning head is located at a first position and the brush of the second cleaning head is located at a second position.

[0056] 4, the first swing arm 24 swings about a swing mechanism 42a as an axis, and the second swing arm 34 (see FIG. 2) similarly swings about a swing mechanism 42b as an axis, thereby swinging the first cleaning head and the second cleaning head. In the example of FIG. 4, the first cleaning head cleans both sides (the first side and the second side) of the substrate W, while the brush of the second cleaning head is cleaned (self-cleaned) by the self-cleaning substrate 53 and cleaning liquid supply units 54, 55.

[0057] The control device 60 controls each part of the substrate processing apparatus 1. The control device 60 has a processor that executes a program to realize various functions of the substrate processing apparatus 1, a memory that stores various information such as the programs and operating conditions, and a drive circuit that drives each element. The control device 60 controls the rotation mechanism 10, the first cleaning mechanism 20, the second cleaning mechanism 30, the drive mechanism 40, and the brush cleaning unit 50. The control device 60 is, for example, an example of a control unit.

[0058] The control device 60 controls each part of the substrate processing apparatus 1, whereby the substrate processing apparatus 1 performs each process of a substrate cleaning process, a brush cleaning process, and a rinsing process. In this embodiment, the substrate processing apparatus 1 performs a first brush cleaning process during the substrate cleaning process, and performs a second brush cleaning process after the substrate cleaning process.

[0059] Fig. 5 is a flowchart showing a flow of an example of a process performed by the substrate processing apparatus 1 according to the embodiment. A case will be described in which the process shown in Fig. 5 is started when the first cleaning head is located at the standby position P1 and the second cleaning head is located at the standby position P2 as shown in Fig. 1.

[0060] As shown in FIG. 5, first, the first self-cleaning stage 51 cleans the brush of the first cleaning head, and the second self-cleaning stage 52 cleans the brush of the second cleaning head (step S101).

[0061] Then, when the substrate W is loaded, the rotation mechanism 10 holds and rotates the loaded substrate W (step S102).

[0062] Then, the cleaning liquid supplying units 25, 35 start supplying the cleaning liquid to both sides of the substrate W (step S103).

[0063] Then, the swinging mechanisms 42a and 42b move the first cleaning head to the first cleaning start position and move the second cleaning head to the second cleaning start position (step S104). Here, the first cleaning start position is the position of the cleaning head when two brushes of the cleaning head (either the first cleaning head or the second cleaning head) come into contact with both sides of the substrate W to clean both sides of the substrate W, and is the position of the cleaning head when cleaning of the substrate W is started by the cleaning head. Also, the second cleaning start position is the position of the cleaning head when two brushes of the cleaning head (the other of the first cleaning head or the second cleaning head) come into contact with both sides of the self-cleaning substrate 53 to self-clean the two brushes, and is the position of the cleaning head when cleaning of the cleaning head is started by the self-cleaning substrate 53.

[0064] Then, the first cleaning head performs a substrate cleaning process for cleaning both sides of the substrate W by rotating the brush and swinging the first cleaning head from the outer periphery of the substrate W through the center to the outer periphery on the opposite side, and the self-cleaning substrate 53 performs a first brush cleaning process for cleaning the two brushes of the second cleaning head (step S105). That is, the substrate processing apparatus 1 performs the first brush cleaning process during the substrate cleaning process.

[0065] When the substrate cleaning process is completed, the cleaning liquid supply units 25, 35 stop supplying the cleaning liquid to both sides of the substrate W (step S106).

[0066] Then, the control device 60 controls each mechanism so that the second cleaning head is located at the standby position P1 and the first cleaning head is located at the standby position P2 (step S107). FIG. 6 is a diagram showing an example of the operation of the substrate processing apparatus 1 in step S107 according to the embodiment. FIG. 7 is a diagram showing an example of a state after the operation of the substrate processing apparatus 1 in step S107 according to the embodiment. First, the lifting mechanism 41a lifts the first swing arm 24, and the lifting mechanism 41b lowers the second swing arm 34. As a result, the two brushes of the first cleaning head are separated from both sides of the substrate W. Also, the two brushes of the second cleaning head are separated from both sides of the self-cleaning substrate 53. In this state, the second cleaning head is moved to be located at the standby position P1, and the first cleaning head is moved to be located at the standby position P2. That is, as shown in Fig. 6, the swing mechanisms 42a, 42b swing the first swing arm 24 and the second swing arm 34, while the rotation mechanisms 43a, 43b rotate the first rotation arm 22 and the second rotation arm 32. As a result, as shown in Fig. 7, the second cleaning head is located at the standby position P1, and the first cleaning head is located at the standby position P2.

[0067] Then, the first self-cleaning stage 51 cleans the brushes of the second cleaning head, and the second self-cleaning stage 52 cleans the brushes of the first cleaning head, thereby performing a second brush cleaning process (step S108). That is, the substrate processing apparatus 1 performs the second brush cleaning process (step S108) after the substrate cleaning process (step S105).

[0068] Then, the rotating mechanism 10 stops the rotation of the substrate W and releases the substrate W (step S109). In step S109, the released substrate W is carried out.

[0069] Then, the control device 60 judges whether or not to end the process (step S110). For example, if there is a next substrate W to be processed (a newly loaded substrate), the control device 60 judges not to end the process. On the other hand, if there is no next substrate W to be processed, the control device 60 judges to end the process. If the control device 60 judges to end the process, it ends the process shown in FIG. On the other hand, if the control device 60 judges not to end the process, it proceeds to step S111.

[0070] Then, when the next substrate W to be processed is loaded, the rotation mechanism 10 holds and rotates the loaded substrate W (step S111).

[0071] Then, the cleaning liquid supplying units 25, 35 start supplying the cleaning liquid to both sides of the substrate W (step S112).

[0072] Then, the swinging mechanisms 42a and 42b move the second cleaning head to the first cleaning start position, and move the first cleaning head to the second cleaning start position (step S113).

[0073] 8 is a diagram showing an example of the operation of the substrate processing apparatus 1 in step S114 according to the embodiment. As shown in FIG. 8, the second cleaning head performs a substrate cleaning process for cleaning both sides of the substrate W by rotating the brush and swinging the brush from the outer periphery of the substrate W through the center to the outer periphery on the opposite side, and the self-cleaning substrate 53 performs a first brush cleaning process for cleaning the two brushes of the cleaning head (first cleaning head) (step S114). That is, the substrate processing apparatus 1 performs the first brush cleaning process during the substrate cleaning process. Also, the substrate processing apparatus 1 switches the cleaning head used in the substrate cleaning process for each substrate W. Also, the substrate processing apparatus 1 switches the cleaning head used in the first brush cleaning process for each substrate W.

[0074] When the substrate cleaning process is completed, the cleaning liquid supply units 25, 35 stop supplying the cleaning liquid to both sides of the substrate W (step S115).

[0075] Then, the swing mechanisms 42a, 42b swing the first swing arm 24 and the second swing arm 34 while the rotation mechanisms 43a, 43b rotate the first rotation arm 22 and the second rotation arm 32 so that the first cleaning head is located at the standby position P1 and the second cleaning head is located at the standby position P2 (step S116). As a result, the first cleaning head is located at the standby position P1 and the second cleaning head is located at the standby position P2.

[0076] Then, the first self-cleaning stage 51 cleans the brushes of the first cleaning head, and the second self-cleaning stage 52 cleans the brushes of the second cleaning head, thereby performing a second brush cleaning process (step S117). That is, the substrate processing apparatus 1 performs the second brush cleaning process (step S117) after the substrate cleaning process (step S114).

[0077] Then, the rotating mechanism 10 stops the rotation of the substrate W and releases the substrate W (step S118). In step S118, the released substrate W is carried out.

[0078] Then, the control device 60 determines whether or not to end the process, similarly to the determination in step S110 (step S119). If the control device 60 determines to end the process, it ends the process shown in FIG.

[0079] On the other hand, when the control device 60 determines not to end the processing, the process returns to step S102, and the substrate processing apparatus 1 executes each process from step S102 onwards again on the next substrate W to be processed. Therefore, the rotation mechanism 10 rotates the substrate W while holding it every time a substrate W is loaded in. Then, the control device 60 switches the cleaning head for cleaning the surface of the substrate W every time a predetermined number of substrates (one substrate W in this embodiment) are cleaned. The control device 60 switches the cleaning head for cleaning the surface of the substrate W by controlling the rotation mechanisms 43a, 43b to rotate the rotation arms 22, 32.

[0080] The substrate processing apparatus 1 according to the embodiment has been described above. The substrate processing apparatus 1 includes the rotation mechanism 10, the cleaning liquid supply units 25, 35, the first cleaning head, the second cleaning head, the rotating arms 22, 32, and the control device 60. The rotation mechanism 10 rotates the substrate W while holding it. The cleaning liquid supply units 25, 35 supply the cleaning liquid to the substrate W rotated by the rotation mechanism 10. The first cleaning head cleans both sides of the substrate W by bringing a brush into contact with both sides of the substrate rotated by the rotation mechanism 10. The second cleaning head cleans both sides of the substrate W by bringing a brush into contact with both sides of the substrate rotated by the rotation mechanism 10. The rotating arms 22, 32 have the first cleaning head attached to one end and the second cleaning head attached to the other end, and rotate the first cleaning head and the second cleaning head. The control device 60 controls the rotation mechanism 10, the cleaning liquid supply units 25, 35, and the pivoting arms 22, 32. During cleaning in which the brush of one of the first and second cleaning heads is brought into contact with the surface of the substrate W to perform cleaning, the control device 60 controls the pivoting arms 22, 32 so that the brush of the other of the first and second cleaning heads is positioned outward from the substrate W.

[0081] With this configuration, the substrate processing apparatus 1 can clean the surface of the substrate W by switching between the brushes of the first cleaning head and the brushes of the second cleaning head. This makes it possible to extend the time until cleaning or replacement of each brush is required. In other words, the time during which the substrate W can be cleaned using brushes with less adhesion and accumulation of contaminants can be extended, thereby improving the substrate quality.

[0082] Furthermore, after cleaning of the substrate W by the brush of one of the cleaning heads is completed, the control device 60 moves the first cleaning head and the second cleaning head to the standby positions P1, P2. That is, the control device 60 controls the swinging mechanisms 42a, 42b to swing the first swinging arm 24 and the second swinging arm 34. The first self-cleaning stage 51 and the second self-cleaning stage 52 clean (self-clean) the brushes of both the first cleaning head and the second cleaning head located at the standby positions P1, P2. The first self-cleaning stage 51 and the second self-cleaning stage 52 are, for example, an example of a cleaning unit.

[0083] This configuration can increase the time for the brush to self-clean after cleaning a substrate W and before cleaning the next substrate W. Focusing on the brush 21a3 of the first cleaning head as an example, self-cleaning can be performed during the period from cleaning the first substrate W by the brush 21a3 to the next cleaning of a substrate W by the brush 21a3, during the period from cleaning the first substrate W to starting cleaning the second substrate W, and during the period from cleaning the second substrate W by the brush 21b3 to starting cleaning the third substrate W (cleaning by the brush 21a3).

[0084] During cleaning in which the brush of one cleaning head is in contact with the surface of the substrate W to clean the substrate W, the self-cleaning substrate 53 cleans the brush of the other cleaning head that is positioned outward from the substrate W. The self-cleaning substrate 53 is, for example, an example of a cleaning unit.

[0085] According to this configuration, the brush of one cleaning head can be cleaned (self-cleaning) while the brush of the other cleaning head is cleaning the substrate W. By performing self-cleaning of the brush, the substrate W can be cleaned using a clean brush.

[0086] Further, the cleaning liquid supply units 54, 55 supply cleaning liquid to the brush of one cleaning head during cleaning in which the brush of the other cleaning head is in contact with the surface of the substrate W. In this embodiment, the cleaning liquid supply units 54, 55 supply cleaning liquid to the self-cleaning substrate 53. The cleaning liquid supplied to the self-cleaning substrate 53 is supplied to the brush of the other cleaning head. That is, the cleaning liquid supply units 54, 55 supply cleaning liquid to the brush of the other cleaning head via the self-cleaning substrate 53. This can prevent the brush at the second position from drying. If particles or the like adhere to the brush and dry, the particles may become stuck and become difficult to discharge outside the brush. According to this embodiment, the brush can be kept wet, so that even if particles or the like adhere to the brush, the particles or the like can be discharged well outside the brush during substrate cleaning or self-cleaning.

[0087] A first cleaning head is provided at one end of the pivot arms 22, 32, and a second cleaning head is provided at the other end. The swing arms 24, 34 rotatably support the pivot arms 22, 32, and swing in a direction along the surface of the substrate W. The swing arms 24, 34 swing, thereby moving the first cleaning head and the second cleaning head.

[0088] This allows the brushes of the first cleaning head and the brushes of the second cleaning head to move (oscillate) in the same trajectory relative to the substrate W and the nozzle (cleaning liquid supply units 25, 35). If two arms with a brush attached to the tip are provided and the brushes attached to each arm are alternately used to clean the substrate W, the trajectory of the brushes may change relative to the rotation direction of the substrate W or the ejection direction of the cleaning liquid from the nozzle. On the other hand, according to this embodiment, the two brushes can be moved in the same trajectory, which prevents differences in cleaning performance between the two brushes. Therefore, cleaning processing can be performed uniformly between multiple substrates.

[0089] Furthermore, according to this embodiment, since the number of swing mechanisms is smaller than the number of cleaning heads, the footprint of the substrate processing apparatus 1 can be made small.

[0090] Furthermore, during cleaning in which the brush of one cleaning head is in contact with the surface of the substrate W for cleaning, the self-cleaning substrate 53 comes into contact with the brush of the other cleaning head for cleaning. After cleaning of the substrate W with the brush of one cleaning head is completed, the first self-cleaning stage 51 and the second self-cleaning stage 52 clean the brushes of both the first cleaning head and the second cleaning head that have moved to the standby position without contacting the brushes. Here, the first self-cleaning stage 51 and the second self-cleaning stage 52 are, for example, an example of a first cleaning section, and clean the brushes of both the first cleaning head and the second cleaning head without contacting the brushes.

[0091] In this way, by performing both non-contact cleaning and contact cleaning, it is possible to effectively remove particles, etc., that have adhered to the brush surface and particles, etc. that have penetrated inside the brush.

[0092] (Modification) Next, various modified examples of the above-mentioned embodiment will be described. For example, cleaning (self-cleaning) of the brush at the standby positions P1, P2 is not limited to cleaning by the first self-cleaning stage 51 and the second self-cleaning stage 52 as described above. In addition, in the first self-cleaning stage 51, the brush may be brought into contact with the upper and lower surfaces of the cleaning member 51b, or in the second self-cleaning stage 52, the brush may be brought into contact with the upper and lower surfaces of the cleaning member 51b.

[0093] In the self-cleaning substrate 53 and the first and second self-cleaning stages 51 and 52, the cleaning liquid supplied to the brush is not limited to pure water. For example, SC-1 or an acid-based chemical liquid (hydrofluoric acid, nitric acid, hydrochloric acid, etc.) may be used. In addition, a plurality of types of cleaning liquid may be supplied by switching between them.

[0094] In the cleaning member 51b of the first self-cleaning stage 51 and the second self-cleaning stage 52, the through-hole 51b1 through which the cleaning liquid flows is open at the center of the upper surface of the cleaning member 51b and at the center of the lower surface of the cleaning member 51b, but this is not limited to the above. The upper surface of the cleaning member 51b may have a plurality of openings communicating with the through-hole 51b1. By having a plurality of openings, not just one at the center of the upper surface of the cleaning member 51b, the cleaning liquid can be efficiently supplied to the entire brush. Similarly, the lower surface of the cleaning member 51b may have a plurality of openings.

[0095] When cleaning the substrate W, the cleaning head may be rotated (moved) by rotating the rotating arms 22 and 32 about the rotation axis, thereby moving the brush on the substrate W. That is, when cleaning the surface of the substrate W, the control device 60 controls the rotating mechanisms 43a and 43b to rotate the rotating arms 22 and 32 so that the cleaning head rotates while the brush of the cleaning head is in contact with the surface of the substrate W. In this case, the self-cleaning substrate 53 may be provided only on a part of the trajectory of the brush at the second position, or may be provided so as to correspond to the entire trajectory. When the self-cleaning substrate 53 is provided so as to correspond to the entire trajectory of the brush at the second position, it is sufficient to form the self-cleaning substrate 53 in an arc shape that follows the outer periphery of the substrate W.

[0096] Furthermore, the surface of the substrate W may be cleaned by moving the brushes by swinging the swing arms 24, 34 using the swing mechanisms 42a, 42b and rotating the rotating arms 22, 32 using the rotating mechanisms 43a, 43b.

[0097] In order to prevent cleaning liquid from scattering from the self-cleaning substrate 53 and the brushes on the self-cleaning substrate 53 during self-cleaning and from adhering to the substrate W, a partition wall may be provided that covers the periphery of the self-cleaning substrate 53.

[0098] Furthermore, the self-cleaning substrate 53 does not necessarily have to be provided.

[0099] The first cleaning head (brushes 21a3 and 31a3) and the second cleaning head (brushes 21b3 and 31b3) may be able to move up and down separately with respect to the rotating arms 22 and 32. In this case, instead of the self-cleaning substrate 53 and the cleaning liquid supply units 54 and 55 that supply cleaning liquid to the self-cleaning substrate 53, a self-cleaning stage having a configuration similar to that of the first self-cleaning stage 51 and the second self-cleaning stage 52 may be provided so that non-contact self-cleaning can be performed even at the second position.

[0100] Further, although an example in which two self-cleaning stages, the first self-cleaning stage 51 and the second self-cleaning stage 52, are provided has been described, one self-cleaning stage may be provided, and in the standby position, the brush of one cleaning head is located at the self-cleaning stage, and the brush of the other cleaning head is located at a position where it contacts the self-cleaning substrate 53. That is, the self-cleaning stage is provided at a position spaced from the self-cleaning substrate 53 by a distance corresponding to the distance between the two brushes 21a3 and 21b3 provided on the second rotating arm 32 in a plan view. An example of a specific operation of the substrate processing apparatus 1 in this case will be described. After cleaning of the substrate W by the brush of one cleaning head is completed, the control device 60 controls the swinging mechanisms 42a, 42b and the rotating mechanisms 43a, 43b to move either the first cleaning head or the second cleaning head to the standby position (self-cleaning stage). The control device 60 controls the self-cleaning stage to clean the brush of one cleaning head located at the standby position. The control device 60 controls the self-cleaning stage to clean the brush of the cleaning head located at the standby position by the self-cleaning stage, while the self-cleaning stage cleans the brush of the other cleaning head by the self-cleaning substrate 53. The self-cleaning stage is, for example, an example of a first cleaning unit. The self-cleaning substrate 53 and the cleaning liquid supply units 54, 55 are, for example, an example of a second cleaning unit.

[0101] When the cleaning head is located at the standby position P1 or the standby position P2 (when the cleaning head is located at a position where it can be cleaned by the first self-cleaning stage 51 or the second self-cleaning stage 52), the cleaning liquid may be continuously supplied from the cleaning liquid supply units 54, 55 to the self-cleaning substrate 53, or the supply of the cleaning liquid from the cleaning liquid supply units 54, 55 may be stopped. In addition, after the brush is retracted from the standby position P1 or the standby position P2, the cleaning liquid may be continuously supplied from the cleaning liquid supply units 54, 55 to the self-cleaning substrate 53 for a predetermined time, and the supply may then be stopped.

[0102] When the first cleaning head and the second cleaning head are located at the standby positions P1 and P2, the self-cleaning substrate 53 is supplied with a cleaning liquid, so that the self-cleaning substrate 53 can be washed and cleaned. This makes it possible to prevent the brush from being contaminated by particles or the like attached to the self-cleaning substrate 53 when the next substrate W is carried in and the brush is self-cleaned. An example of a specific operation of the substrate processing apparatus 1 in this case will be described. The cleaning unit includes the self-cleaning substrate 53 and cleaning liquid supply units 54 and 55 that supply the cleaning liquid to the self-cleaning substrate 53, and cleans the brush of the other cleaning head using the cleaning liquid supplied to the self-cleaning substrate 53. The control device 60 controls the cleaning liquid supply units 54 and 55 to supply the cleaning liquid to the self-cleaning substrate 53 even after cleaning of the brush of the other cleaning head is completed.

[0103] In the above description, the substrate processing apparatus 1 has a brush for cleaning the first surface of the substrate W and a brush for cleaning the second surface of the substrate W, and cleans both surfaces of the substrate W. However, the substrate processing apparatus 1 may have a brush for cleaning either the first surface or the second surface of the substrate W. That is, in the substrate processing apparatus 1, it is sufficient that the brush cleans at least one surface of the substrate W. Therefore, it is sufficient that the substrate processing apparatus 1 has at least either the first cleaning mechanism 20 or the second cleaning mechanism 30.

[0104] Although the substrate processing apparatus 1 has been described as switching the brush for cleaning the substrate W every time one substrate W is processed, the brush may be switched every time a plurality of substrates W are processed.

[0105] Although several embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, modifications, and combinations can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, and are included in the scope of the invention and its equivalents described in the claims. [Explanation of symbols]

[0106] 1. Substrate Processing Equipment 10 Rotation mechanism 20 First cleaning mechanism 30 Second cleaning mechanism 21a, 21b, 31a, 31b Cleaning head 21a3, 21b3, 31a3, 31b3 Brush 22,32 Rotating arm 25,35 Cleaning fluid supply unit 40 Drive mechanism 50 Brush cleaning section 51 First self-cleaning stage 52 Second self-cleaning stage 53 Self-cleaning substrate 54,55 Cleaning fluid supply section 60 Control device

Claims

1. a rotation mechanism that rotates the substrate while holding it; a cleaning liquid supply unit that supplies a cleaning liquid to the substrate rotated by the rotation mechanism; a first cleaning head that cleans at least one surface of the substrate by bringing a brush into contact with the one surface of the substrate rotated by the rotation mechanism; a second cleaning head that cleans the one surface of the substrate by bringing a brush into contact with the one surface of the substrate; a rotating arm having one end to which the first cleaning head is attached and the other end to which the second cleaning head is attached, the rotating arm rotating the first cleaning head and the second cleaning head; a control unit that controls the rotation mechanism, the cleaning liquid supply unit, and the pivot arm; Equipped with The control unit is A substrate cleaning apparatus which, during cleaning in which a brush of one of the first cleaning head and the second cleaning head is brought into contact with a surface of the substrate to clean the substrate, controls the pivot arm so that the brush of the other of the first cleaning head and the second cleaning head is positioned outward from the substrate.

2. The substrate cleaning apparatus according to claim 1 , wherein the control unit rotates the rotary arm so as to switch the cleaning head for cleaning the surface of the substrate every time a predetermined number of the substrates are cleaned.

3. the control unit moves the first cleaning head and the second cleaning head to a standby position after cleaning of the substrate by the brush of the one cleaning head is completed; The substrate cleaning apparatus according to claim 1 , further comprising a cleaning unit configured to clean brushes of both the first cleaning head and the second cleaning head positioned at the standby position.

4. 2. The substrate cleaning apparatus according to claim 1, further comprising a cleaning unit that cleans the brush of the one cleaning head located outwardly of the substrate during cleaning in which the brush of the other cleaning head is in contact with the surface of the substrate to clean the substrate.

5. 2. The substrate cleaning apparatus according to claim 1, further comprising a supply unit that supplies a cleaning liquid to the brush of the one cleaning head during cleaning in which the brush of the other cleaning head is in contact with the surface of the substrate.

6. a first cleaning unit that cleans the brushes of both the first cleaning head and the second cleaning head that have moved to a standby position without contacting the brushes after cleaning of the substrate by the brushes of the one cleaning head is completed; a second cleaning unit that contacts and cleans the brush of the other cleaning head during cleaning in which the brush of the one cleaning head is in contact with the surface of the substrate; The substrate cleaning apparatus of claim 1 .

7. a swing arm that rotatably supports the swing arm and swings in a direction along the one surface of the substrate; Equipped with The substrate cleaning apparatus according to claim 1 , wherein the first cleaning head and the second cleaning head are moved by swinging the swing arm.

8. a first cleaning unit configured to clean a brush of one of the first cleaning head and the second cleaning head that is positioned at a standby position; a second cleaning unit that cleans the brush of the one cleaning head during cleaning in which the brush of the other cleaning head is in contact with the surface of the substrate; Equipped with The control unit is after cleaning of the substrate by the brush of the one cleaning head is completed, control the first cleaning unit to move one of the first cleaning head and the second cleaning head to the standby position and clean the brush of the cleaning head located at the standby position; During cleaning of the brush of the cleaning head located at the standby position by the first cleaning unit, the second cleaning unit is controlled to clean the brush of one of the first cleaning head and the second cleaning head, the brush of which is not being cleaned by the first cleaning unit. The substrate cleaning apparatus according to claim 1 .

9. the cleaning unit includes a self-cleaning substrate and a supply unit that supplies a cleaning liquid to the self-cleaning substrate, and cleans the brush of the other cleaning head using the cleaning liquid supplied to the self-cleaning substrate; The substrate cleaning apparatus according to claim 4 , wherein the control unit controls the supply unit to supply the cleaning liquid to the self-cleaning substrate even after cleaning of the brush of the other cleaning head is completed.

10. A substrate cleaning method performed by a substrate cleaning apparatus including: a first cleaning head that cleans at least one side of a rotating substrate by bringing a brush into contact with the one side of the substrate; a second cleaning head that cleans the one side of the substrate by bringing a brush into contact with the one side of the substrate; and a rotating arm having one end to which the first cleaning head is attached and the second cleaning head attached to the other end, the rotating arm rotating the first cleaning head and the second cleaning head, the method comprising: holding and rotating the substrate; applying a cleaning solution to the rotated substrate; controlling the pivot arm so that, during cleaning in which a brush of one of the first cleaning head and the second cleaning head is brought into contact with a surface of the substrate, the brush of the other of the first cleaning head and the second cleaning head is positioned outward from the substrate; A method for cleaning a substrate comprising:

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